Sensor modules, measurement systems, electronic devices, and mobile devices

Abstract

To provide a sensor modules, etc. that can prevent degradation of angular velocity and acceleration detection accuracy caused by noise.SOLUTION: A sensor module 10 includes: an X-axis angular velocity sensor device 30X for outputting digital X-axis angular velocity data; a Y-axis angular velocity sensor device 30Y for outputting digital Y-axis angular velocity data; a Z-axis angular velocity sensor device 30Z for outputting digital Z-axis angular velocity data; an acceleration sensor device 40 for outputting digital X-axis, Y-axis, and Z-axis acceleration data; a microcontroller 80; a first digital interface bus BS1 for electrically connecting the X-axis angular velocity sensor device 30X, the Y-axis angular velocity sensor device 30Y, the Z-axis angular velocity sensor device 30Z, and a first digital interface 83; and a second digital interface bus BS2 for electrically connecting the acceleration sensor device 40 and a second digital interface 84.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a sensor module, a measurement system, an electronic device, a mobile object, and the like. [Background technology]

[0002] Prior art inertial measurement units (IMUs) having angular velocity sensor devices and acceleration sensor devices are disclosed in Patent Documents 1, 2, and 3. The IMU of Patent Document 1 includes a first board on which an A / D conversion circuit is mounted, a second board on which a microcontroller is mounted, and a third board on which an angular velocity sensor is mounted. An analog angular velocity signal from an analog angular velocity sensor mounted on the third board is converted into digital angular velocity data by an A / D conversion circuit mounted on the first board. The angular velocity data obtained by A / D conversion is then transmitted to the microcontroller mounted on the second board. The IMU of Patent Document 2 includes a sensor device and a board with a front surface, a back surface, and a side surface. The outer surface of the sensor device facing the board is positioned along the side surface of the board. That is, the sensor device is mounted vertically so as to be perpendicular to the front and back surfaces of the board. Patent Document 3 discloses an IMU in which a module equipped with an inertial sensor is joined to the bottom wall of an outer case housing the module via a joining member.

[0003] Previous inertial measurement units used analog sensor devices for the angular velocity sensor device and acceleration sensor device, which are inertial sensors. Analog angular velocity sensor devices do not have built-in A / D conversion circuits and output analog angular velocity signals as detection signals. Analog acceleration sensor devices do not have built-in A / D conversion circuits and output analog acceleration signals as detection signals. An external A / D conversion circuit then A / D converts the analog detection signals from the angular velocity sensor device and the acceleration sensor device, and outputs the resulting digital detection data to a microcontroller. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-251803 [Patent Document 2] Japanese Patent Application Laid-Open No. 2014-228489 [Patent Document 3] Japanese Patent Application Laid-Open No. 2017-20829 Summary of the Invention [Problem to be solved by the invention]

[0005] However, when using analog angular velocity sensor devices and acceleration sensor devices, the circuit board on which the angular velocity sensor devices and acceleration sensor devices are mounted must be wired to route analog detection signal lines, which can lead to noise interference and degradation of detection performance. [Means for solving the problem]

[0006] One aspect of the present invention relates to a sensor module including: an X-axis angular velocity sensor device that detects an angular velocity around an X-axis and outputs digital X-axis angular velocity data; a Y-axis angular velocity sensor device that detects an angular velocity around a Y-axis and outputs digital Y-axis angular velocity data; a Z-axis angular velocity sensor device that detects an angular velocity around a Z-axis and outputs digital Z-axis angular velocity data; an acceleration sensor device that detects acceleration in the X-axis direction, the Y-axis direction, and the Z-axis direction, and outputs digital X-axis acceleration data, Y-axis acceleration data, and Z-axis acceleration data; a microcontroller including a first digital interface and a second digital interface; a first digital interface bus that electrically connects the X-axis angular velocity sensor device, the Y-axis angular velocity sensor device, and the Z-axis angular velocity sensor device to the first digital interface of the microcontroller; and a second digital interface bus that electrically connects the acceleration sensor device to the second digital interface of the microcontroller.

[0007] In one aspect of the present invention, a second acceleration sensor device may be included, and the first acceleration sensor device and the second acceleration sensor device may be electrically connected to the second digital interface of the microcontroller via the second digital interface bus.

[0008] In one aspect of the present invention, the device may include a circuit board having a first surface and a second surface that are opposite surfaces to each other, and the first acceleration sensor device may be arranged on the first surface of the circuit board, and the second acceleration sensor device may be arranged on the second surface of the circuit board.

[0009] In one aspect of the present invention, one of the first acceleration sensor device and the second acceleration sensor device may be arranged so that the directions of its first detection axis, second detection axis, and third detection axis are aligned with the directions of the X-axis, Y-axis, and Z-axis, respectively, and the other acceleration sensor device different from the one may be arranged so that the directions of its first detection axis, second detection axis, and third detection axis are aligned with the directions of the Y-axis, X-axis, and Z-axis, respectively.

[0010] In one aspect of the present invention, the microcontroller may further include at least one sensor device selected from a second X-axis angular velocity sensor device, a second Y-axis angular velocity sensor device, and a second Z-axis angular velocity sensor device, and the at least one sensor device may be electrically connected to the first digital interface of the microcontroller via the first digital interface bus.

[0011] In one aspect of the present invention, the device may include a circuit board having a first surface and a second surface that are opposite surfaces to each other, and the X-axis angular velocity sensor device, the Y-axis angular velocity sensor device, the Z-axis angular velocity sensor device, and the acceleration sensor device may be arranged in the first region of the first region and the second region on the first surface of the circuit board, and the microcontroller may be arranged in a region on the second surface of the circuit board that corresponds to the second region.

[0012] In one aspect of the invention, a temperature sensor may be disposed in the first area, and the microcontroller may perform temperature correction processing based on a detection result of the temperature sensor.

[0013] In one aspect of the present invention, the microcontroller may include a host interface, which is a third digital interface connected to a host device.

[0014] In one aspect of the present invention, the sensor device may include a synchronization signal line for transmitting a synchronization signal, and the synchronization signal line may be electrically connected to the X-axis angular velocity sensor device, the Y-axis angular velocity sensor device, the Z-axis angular velocity sensor device, and the acceleration sensor device.

[0015] In one aspect of the present invention, the synchronization signal line may be electrically connected to the microcontroller.

[0016] Another aspect of the present invention includes an X-axis angular velocity sensor device that detects an angular velocity around an X-axis and outputs digital X-axis angular velocity data, a Y-axis angular velocity sensor device that detects an angular velocity around a Y-axis and outputs digital Y-axis angular velocity data, a Z-axis angular velocity sensor device that detects an angular velocity around a Z-axis and outputs digital Z-axis angular velocity data, a first acceleration sensor device that detects acceleration in the X-axis direction, acceleration in the Y-axis direction, and acceleration in the Z-axis direction, and outputs digital first X-axis acceleration data, first Y-axis acceleration data, and first Z-axis acceleration data, and a second acceleration sensor device that detects acceleration in the X-axis direction, acceleration in the Y-axis direction, and acceleration in the Z-axis direction, and outputs digital second Y-axis acceleration data. a second acceleration sensor device that outputs first X-axis acceleration data, second Y-axis acceleration data, and second Z-axis acceleration data; a microcontroller to which the X-axis angular velocity data, the Y-axis angular velocity data, the Z-axis angular velocity data, the first X-axis acceleration data, the first Y-axis acceleration data, the first Z-axis acceleration data, the second X-axis acceleration data, the second Y-axis acceleration data, and the second Z-axis acceleration data are input; and a circuit board having a first surface and a second surface that are opposite surfaces to each other, wherein the first acceleration sensor device is disposed on the first surface of the circuit board and the second acceleration sensor device is associated with a sensor module that is disposed on the second surface of the circuit board.

[0017] Another aspect of the present invention relates to a measurement system including the sensor module described above and a host device electrically connected to the sensor module.

[0018] Another aspect of the present invention relates to an electronic device including the sensor module described above and a processing unit that performs processing based on an output signal from the sensor module.

[0019] Another aspect of the present invention relates to an electronic device including the sensor module described above, a case in which the sensor module is housed, a processing unit housed in the case and performing processing based on an output signal from the sensor module, a display unit housed in the case, and a translucent cover covering an opening of the case.

[0020] Another aspect of the present invention relates to a moving body including the sensor module described above and a control device that controls the attitude of the moving body based on information about the attitude of the moving body obtained by processing based on the output signal of the sensor module.

[0021] Another aspect of the present invention includes the sensor module described above and a control device that controls at least one of acceleration, braking, and steering of the moving body based on information about the position and attitude of the moving body obtained by processing based on the output signal of the sensor module, and the control device is related to the moving body and switches whether or not to perform automatic driving of the moving body based on the monitoring results of the output signal of the sensor module. [Brief explanation of the drawings]

[0022] [Figure 1] 1 shows a first configuration example of a sensor module according to the present embodiment. [Figure 2] 10 shows a second configuration example of the sensor module of the present embodiment. [Figure 3] 10 shows a third configuration example of the sensor module of the present embodiment. [Figure 4] FIG. 4 is a diagram showing an example of a signal waveform on a first digital interface bus. [Figure 5] FIG. 10 is a diagram showing an example of a signal waveform on a second digital interface bus. [Figure 6]FIG. 4 is a diagram showing an example of a signal waveform on a first digital interface bus. [Figure 7] FIG. 10 is a diagram showing an example of a signal waveform on a second digital interface bus. [Figure 8] FIG. 3 is a plan view showing a first surface of a circuit board in a first arrangement configuration example. [Figure 9] FIG. 4 is a plan view showing a second surface of the circuit board in the first arrangement configuration example. [Figure 10] FIG. 10 is a plan view showing a first surface of a circuit board in the second arrangement configuration example. [Figure 11] FIG. 10 is a plan view showing a second surface of the circuit board in the second arrangement configuration example. [Figure 12] FIG. 10 is a plan view showing a first surface of a circuit board in a third arrangement configuration example. [Figure 13] FIG. 10 is a plan view showing the second surface of the circuit board in the third arrangement configuration example. [Figure 14] FIG. 10 is an explanatory diagram of a layout method when a plurality of acceleration sensor devices are provided. [Figure 15] FIG. 10 is an explanatory diagram of a layout method when a plurality of acceleration sensor devices are provided. [Figure 16] FIG. 10 is an explanatory diagram of temperature compensation processing using the temperature hysteresis characteristics of an acceleration sensor device. [Figure 17] 10 shows a fourth configuration example of the sensor module of the present embodiment. [Figure 18] FIG. 10 is an explanatory diagram of a sensor module in which a synchronization signal line is connected to a sensor device. [Figure 19] FIG. 4 is a signal waveform diagram illustrating the operation of the sensor module. [Figure 20] An example of a sensor device configuration. [Figure 21] An example of the configuration of a measurement system including a sensor module. [Figure 22] FIG. [Figure 23] An example of an angular velocity sensor device configuration. [Figure 24] FIG. 2 is a plan view showing a configuration example of an acceleration sensor element for the X-axis or Y-axis. [Figure 25] FIG. 2 is a plan view showing a configuration example of an acceleration sensor element for the Z axis. [Figure 26] FIG. 1 is a block diagram showing an example of the configuration of an electronic device according to an embodiment of the present invention. [Figure 27] FIG. 1 is a plan view of a wristwatch-type activity monitor that is a portable electronic device. [Figure 28] FIG. 1 is a block diagram showing an example of the configuration of a wristwatch-type activity monitor that is a portable electronic device. [Figure 29] 2 shows an example of a moving body according to the present embodiment. [Figure 30] FIG. 1 is a block diagram showing an example of the configuration of a moving body. DETAILED DESCRIPTION OF THE INVENTION

[0023] A preferred embodiment of the present invention will be described in detail below. Note that the embodiment described below does not unduly limit the content of the present invention as defined in the claims, and not all of the configurations described in the embodiment are necessarily essential as means for solving the problems of the present invention.

[0024] 1. Sensor module configuration example FIG. 1 shows a first configuration example of a sensor module 10 according to this embodiment. The sensor module 10 is a physical quantity detection module composed of multiple sensor devices, and this sensor module 10 can be used to realize a sensor system or a sensor unit. The sensor module 10 in FIG. 1 includes an X-axis angular velocity sensor device 30X, a Y-axis angular velocity sensor device 30Y, a Z-axis angular velocity sensor device 30Z, an acceleration sensor device 40, a microcontroller 80, a first digital interface bus BS1, and a second digital interface bus BS2. The sensor module 10 configured as shown in FIG. 1 can realize a six-axis inertial measurement unit (IMU). Using this inertial measurement unit, it is possible to detect the attitude and behavior, which is the inertial momentum, of a moving body such as an automobile or robot.

[0025] The X-axis angular velocity sensor device 30X detects angular velocity around the X-axis and outputs digital X-axis angular velocity data. The X-axis angular velocity data represents the angular velocity around the X-axis. The X-axis angular velocity sensor device 30X includes a sensor element that detects the angular velocity around the X-axis. The sensor element is a gyro sensor element composed of a piezoelectric oscillator such as a quartz crystal oscillator. However, the sensor element is not limited to this and may be a capacitive detection type Si-MEMS gyro sensor element formed on a silicon substrate or the like. For example, the sensor element may be a multi-connection of multiple Si-MEMS gyro sensor elements. The X-axis angular velocity sensor device 30X also includes an analog circuit that includes an amplifier circuit that amplifies the detection signal from the sensor element and a synchronous detection circuit that performs synchronous detection on the detection signal. The X-axis angular velocity sensor device 30X also includes an A / D conversion circuit that converts the analog signal from the analog circuit into digital data. The output data from this A / D conversion circuit, or data that has been corrected by temperature correction, offset correction, sensitivity correction, or other such corrections to the output data, becomes the X-axis angular velocity data.

[0026] The Y-axis angular velocity sensor device 30Y detects the angular velocity around the Y-axis and outputs digital Y-axis angular velocity data. The Y-axis angular velocity data is digital data representing the angular velocity around the Y-axis. The Y-axis angular velocity sensor device 30Y has a sensor element that detects the angular velocity around the Y-axis. As described above, various types of sensor elements can be used. The Y-axis angular velocity sensor device 30Y also includes an analog circuit that includes an amplifier circuit that amplifies the detection signal from the sensor element and a synchronous detection circuit, and an A / D conversion circuit that converts the analog signal from the analog circuit into digital data. The output data of this A / D conversion circuit, or data obtained by performing correction processing on the output data, becomes the Y-axis angular velocity data.

[0027] The Z-axis angular velocity sensor device 30Z detects the angular velocity around the Z-axis and outputs digital Z-axis angular velocity data. The Z-axis angular velocity data is digital data representing the angular velocity around the Z-axis. The Z-axis angular velocity sensor device 30Z has a sensor element that detects the angular velocity around the Z-axis. As described above, various types of sensor elements can be used. The Z-axis angular velocity sensor device 30Z also includes an analog circuit that includes an amplifier circuit that amplifies the detection signal from the sensor element and a synchronous detection circuit, and an A / D conversion circuit that converts the analog signal from the analog circuit into digital data. The output data of this A / D conversion circuit, or data obtained by performing correction processing on the output data, becomes the Z-axis angular velocity data.

[0028] The acceleration sensor device 40 detects acceleration in the X-axis direction, the Y-axis direction, and the Z-axis direction, and outputs digital X-axis acceleration data, Y-axis acceleration data, and Z-axis acceleration data. The X-axis acceleration data is digital data representing acceleration in the X-axis direction. Similarly, the Y-axis acceleration data and Z-axis acceleration data are digital data representing acceleration in the Y-axis direction and the Z-axis direction, respectively. The acceleration sensor device 40 is, for example, a capacitive Si-MEMS sensor device capable of detecting acceleration in the X-axis direction, the Y-axis direction, and the Z-axis direction in a single device. However, this embodiment is not limited to this. The acceleration sensor device 40 may also be a frequency-change quartz acceleration sensor, a piezoresistive acceleration sensor, or a thermal detection acceleration sensor. The acceleration sensor device 40 includes a sensor element for detecting X-axis acceleration, a sensor element for detecting Y-axis acceleration, and a sensor element for detecting Z-axis acceleration. Note that multiple sensor elements may be provided to detect acceleration along each axis. The acceleration sensor device 40 also includes an analog circuit having an amplifier circuit that amplifies the detection signals from the sensor elements for detecting acceleration along each axis, and an A / D conversion circuit that converts the analog signals from the analog circuit into digital data. The A / D conversion circuit converts, for example, an analog signal representing X-axis acceleration, an analog signal representing Y-axis acceleration, and an analog signal representing Z-axis acceleration into digital data in a time-division manner. The output data from this A / D conversion circuit, or data that has been subjected to temperature correction or other correction processing on the output data, becomes the X-axis acceleration data, Y-axis acceleration data, and Z-axis acceleration data.

[0029] The X-axis, Y-axis, and Z-axis here are the X-axis, Y-axis, and Z-axis that serve as the detection axes of the sensor module 10. The Z-axis is an axis that is perpendicular to the mounting surface of the object to be measured on which the sensor module 10 is mounted, for example. The mounting surface can also be referred to as the mounting surface on which the sensor module 10 is mounted. The thickness direction of the sensor module 10 in FIG. 22 (described later) can also be referred to as the Z-axis direction. The X-axis and Y-axis are perpendicular to each other and perpendicular to the Z-axis. The directions of the X-axis and Y-axis are arbitrary, but in FIG. 22, the axis along the first side of the rectangular shape of the sensor module 10 in a plan view can be referred to as the X-axis, and the axis along the second side perpendicular to the first side of the rectangular shape can be referred to as the Y-axis.

[0030] The microcontroller 80 is a master controller for the X-axis angular velocity sensor device 30X, the Y-axis angular velocity sensor device 30Y, the Z-axis angular velocity sensor device 30Z, and the acceleration sensor device 40. The microcontroller 80 is an integrated circuit device and can be implemented by a processor such as an MPU or CPU. Alternatively, the microcontroller 80 may be implemented by an ASIC using automatic placement and routing, such as a gate array. The microcontroller 80 includes a first digital interface 83 and a second digital interface 84. The first digital interface 83 and the second digital interface 84 are circuits that perform digital interface processing, such as sending and receiving serial data. The first digital interface 83 and the second digital interface 84 perform interface processing according to the SPI or I2C communication standard. Alternatively, they may perform interface processing according to a communication standard that is an extension of SPI or I2C, or a communication standard that is an improved or modified version of the SPI or I2C standard.

[0031] The first digital interface bus BS1 electrically connects the X-axis angular velocity sensor device 30X, the Y-axis angular velocity sensor device 30Y, and the Z-axis angular velocity sensor device 30Z to the first digital interface 83 of the microcontroller 80. X-axis angular velocity data from the X-axis angular velocity sensor device 30X, Y-axis angular velocity data from the Y-axis angular velocity sensor device 30Y, and Z-axis angular velocity data from the Z-axis angular velocity sensor device 30Z are input to the microcontroller 80 via this first digital interface bus BS1. The second digital interface bus BS2 electrically connects the acceleration sensor device 40 to the second digital interface 84 of the microcontroller 80. X-axis acceleration data, Y-axis acceleration data, and Z-axis acceleration data from the acceleration sensor device 40 are input to the microcontroller 80 via this second digital interface bus BS2. The first digital interface bus BS1 is a bus that complies with the communication standard for the interface processing performed by the first digital interface 83. The second digital interface bus BS2 is a bus that complies with the communication standard for the interface processing performed by the second digital interface 84. The first digital interface bus BS1 and the second digital interface bus BS2 include data signal lines and clock signal lines. They may also include chip select signals. The first digital interface bus BS1 and the second digital interface bus BS2 are wired to the circuit board 100 of the sensor module 10 shown in FIG. 22.

[0032] Note that "electrically connected" refers to a connection that allows electrical signals to be transmitted, i.e., a connection that allows information to be transmitted via electrical signals. In this embodiment, the X-axis angular velocity sensor device 30X, the Y-axis angular velocity sensor device 30Y, and the Z-axis angular velocity sensor device 30Z are collectively referred to as "angular velocity sensor devices," and the angular velocity sensor devices and acceleration sensor devices are collectively referred to as "sensor devices." Furthermore, the first digital interface bus BS1 and the second digital interface bus BS2 are collectively referred to as "digital interface buses," as appropriate.

[0033] As described above, the sensor module 10 of this embodiment uses digital sensor devices as the X-axis angular velocity sensor device 30X, the Y-axis angular velocity sensor device 30Y, the Z-axis angular velocity sensor device 30Z, and the acceleration sensor device 40. Specifically, these sensor devices incorporate A / D conversion circuits and output detection data, such as digital angular velocity data and acceleration data. Using digital sensor devices in this manner prevents noise from reducing the detection accuracy of the sensor module 10. Furthermore, the sensor module 10 of this embodiment includes a first digital interface 83 and a second digital interface 84 in the microcontroller 80, as well as a first digital interface bus BS1 for the angular velocity sensor device and a second digital interface bus BS2 for the acceleration sensor device. Thus, by providing separate buses for the angular velocity sensor device and the acceleration sensor device, this embodiment can accommodate different command systems and communication methods depending on the type of detection data.

[0034] For example, in a conventional analog sensor module that mounts multiple analog sensor devices on a circuit board, the circuit board is wired so that signal lines for analog detection signals from the sensor devices are routed around. For example, an analog angular velocity sensor device outputs a detection voltage as a detection signal, whose voltage level changes depending on the detected angular velocity. Similarly, an acceleration sensor device outputs a detection voltage as a detection signal, whose voltage level changes depending on the detected acceleration. Therefore, if wiring is used to route this detection voltage signal line, noise is superimposed on the detection voltage, causing the voltage level of the detection voltage to fluctuate due to the noise. This fluctuation in the voltage level of the detection voltage reduces the detection accuracy of the angular velocity and acceleration detected by the sensor module.

[0035] In conventional analog sensor modules, the sensor device does not have a built-in A / D conversion circuit. Instead, an A / D conversion IC, an integrated circuit device that performs A / D conversion, is installed externally to the sensor device. A detection voltage signal line is then wired between the sensor device and the A / D conversion IC, and the A / D conversion IC converts the detection voltage input from the sensor device via this signal line into digital detection data. However, because this signal line transmits an analog detection voltage, the detection voltage fluctuates due to the influence of ambient noise, resulting in the aforementioned problem of reduced detection accuracy. In particular, when such signal lines are routed, the signal lines become longer or coupling occurs with other signal lines, more noise is superimposed on the detection voltage, further reducing detection accuracy. Alternatively, instead of using a discrete A / D conversion IC, a method can be considered in which the A / D conversion circuit is built into the microcontroller. However, this method still requires wiring between the sensor device and the microcontroller via analog signal lines, and the aforementioned problem of adverse noise effects remains. Furthermore, if a sensor module is equipped with, say, four or more sensor devices to realize a six-axis inertial measurement unit, then the same number of signal lines as the number of sensor devices must be wired between the multiple sensor devices and the A / D conversion IC. Wiring such a large number of signal lines leads to problems of increased mounting area and costs. Furthermore, the A / D conversion IC must perform time-division A / D conversion of the detected voltages from the multiple signal lines, which requires a high-speed A / D conversion IC, leading to problems of larger size and higher costs for the A / D conversion IC.

[0036] In contrast, in this embodiment, all of the sensor devices, including the X-axis angular velocity sensor device 30X, the Y-axis angular velocity sensor device 30Y, the Z-axis angular velocity sensor device 30Z, and the acceleration sensor device 40, are digital sensor devices and have built-in A / D conversion circuits. Therefore, there is no need for an external A / D conversion IC, which prevents the problems of reduced detection accuracy caused by the wiring of analog signal lines and noise superposition, as described above. Specifically, because digital data signals are transmitted over the first digital interface bus BS1 and the second digital interface bus BS2, there is almost no problem of reduced detection accuracy caused by noise superposition. While noise can cause fluctuations in the voltage level of the detection voltage and reduce detection accuracy in analog signal lines, even if noise is superimposed on digital data signals, there is almost no chance of the detection data being erroneous. Furthermore, in the sensor module 10 of this embodiment, each sensor device has a built-in A / D conversion circuit, eliminating the need for a separate external A / D conversion IC. Therefore, there is no need for a high-speed A / D conversion IC, and there is no need to run a large number of analog signal lines, which solves the problems of increased mounting area and costs.

[0037] On the other hand, when transmitting signals digitally using a digital interface bus, there is a problem in that the command system and communication method differ depending on the type of detected data. For example, angular velocity sensor devices and acceleration sensor devices have different operation setting parameters and correction processing parameters, which results in different command types and command parameters. For this reason, it is difficult to transfer angular velocity data and acceleration data using a digital transfer method with the same command system. Furthermore, as will be explained in detail in Figures 4 to 7 below, the communication method, which is the transfer mode, differs between angular velocity data and acceleration data.

[0038] Therefore, in this embodiment, as shown in FIG. 1, a first digital interface bus BS1 for the angular velocity sensor device and a second digital interface bus BS2 for the acceleration sensor device are separately provided. In this way, even if the command systems and communication methods differ between angular velocity data and acceleration data, the angular velocity data can be digitally transferred using the first digital interface bus BS1 in the first command system and the first communication method. Furthermore, the acceleration data can be digitally transferred using the second digital interface bus BS2 in the second command system and the second communication method. This prevents a decrease in detection accuracy and addresses the problem of different command systems and communication methods depending on the type of detection data, making it possible to realize a compact, low-cost sensor module 10.

[0039] Fig. 2 shows a second configuration example of the sensor module 10 of this embodiment. The sensor module 10 of Fig. 2 is provided with a second acceleration sensor device 40B in addition to a first acceleration sensor device 40A, which is the acceleration sensor device 40 of Fig. 1. The first acceleration sensor device 40A and the second acceleration sensor device 40B are electrically connected to the second digital interface 84 of the microcontroller 80 via a second digital interface bus BS2.

[0040] The second acceleration sensor device 40B has a configuration similar to that of the first acceleration sensor device 40A, which is the acceleration sensor device 40 in FIG. 1. Specifically, the second acceleration sensor device 40B detects acceleration in the X-axis direction, the Y-axis direction, and the Z-axis direction and outputs digital X-axis acceleration data, Y-axis acceleration data, and Z-axis acceleration data. The second acceleration sensor device 40B is, for example, a capacitive Si-MEMS sensor device capable of detecting acceleration in the X-axis direction, the Y-axis direction, and the Z-axis direction in a single device. However, the second acceleration sensor device 40B may be an acceleration sensor of another type. The second acceleration sensor device 40B also includes a sensor element for detecting X-axis acceleration, a sensor element for detecting Y-axis acceleration, and a sensor element for detecting Z-axis acceleration. The second acceleration sensor device 40B also includes an analog circuit having an amplifier circuit and the like for amplifying the detection signals from the sensor elements for detecting acceleration along each axis, and an A / D conversion circuit for converting the analog signals from the analog circuit into digital data.

[0041] In a configuration with multiple acceleration sensor devices, as shown in FIG. 2, the microcontroller 80 calculates the average value, which is a statistical value of the acceleration data from these multiple acceleration sensor devices, thereby achieving high-precision acceleration data. For example, the microcontroller 80 averages the X-axis acceleration data from the first acceleration sensor device 40A and the X-axis acceleration data from the second acceleration sensor device 40B and outputs the average value as the final X-axis acceleration data to the host device 210. The microcontroller 80 also averages the Y-axis acceleration data from the first acceleration sensor device 40A and the Y-axis acceleration data from the second acceleration sensor device 40B and outputs the average value as the final Y-axis acceleration data. The microcontroller 80 also averages the Z-axis acceleration data from the first acceleration sensor device 40A and the Z-axis acceleration data from the second acceleration sensor device 40B and outputs the average value as the final Z-axis acceleration data. This improves the detection accuracy of acceleration data, and, for example, when using acceleration data from the sensor module 10 to obtain information such as the position information of a measurement target, the obtained position information can also be highly accurate.

[0042] 2, the microcontroller 80 also includes a host interface 96, which is a third digital interface connected to the host device 210. The host interface 96 is a circuit that performs digital interface processing, for example, transmitting and receiving serial data. The host interface 96 can be implemented using, for example, SPI or UART. This allows data to be transferred not only between the sensor devices but also between the host device 210 using digital interface processing. This makes it possible to efficiently transfer detection data acquired from multiple sensor devices to the host device 210.

[0043] 2, the sensor module 10 is provided with a temperature sensor 150. The microcontroller 80 then performs temperature compensation based on the detection results of the temperature sensor 150. For example, the microcontroller 80 performs temperature compensation to maintain constant values of detected data, such as angular velocity data or acceleration data, even when the temperature fluctuates. For example, the microcontroller 80 stores table data for temperature compensation in a memory or the like and performs temperature compensation using this table data. For example, angular velocity sensor devices and acceleration sensor devices also have built-in temperature sensors, but the temperature sensor 150 has a higher resolution than the built-in temperature sensor. For example, if the number of bits representing the resolution of the temperature detection data from the built-in temperature sensor in the sensor device is m1 and the number of bits representing the resolution of the temperature detection data from the temperature sensor 150 is m2, then m2 > m1. By performing temperature compensation using such a high-resolution temperature sensor 150, the microcontroller 80 can output temperature-compensated detection data with higher accuracy to the host device 210.

[0044] FIG. 3 shows a third configuration example of the sensor module 10 of this embodiment. In FIG. 3, the sensor module 10 further includes a second X-axis angular velocity sensor device 30XB, a second Y-axis angular velocity sensor device 30YB, and a second Z-axis angular velocity sensor device 30ZB. The second X-axis angular velocity sensor device 30XB, the second Y-axis angular velocity sensor device 30YB, and the second Z-axis angular velocity sensor device 30ZB are electrically connected to the first digital interface 83 of the microcontroller 80 via the first digital interface bus BS1. The sensor module 10 of this embodiment only needs to include at least one of the second X-axis angular velocity sensor device 30XB, the second Y-axis angular velocity sensor device 30YB, and the second Z-axis angular velocity sensor device 30ZB. In this case, the at least one sensor device is electrically connected to the first digital interface 83 of the microcontroller 80 via the first digital interface bus BS1.

[0045] For example, suppose a second Z-axis angular velocity sensor device 30ZB is provided as the at least one sensor device. In this case, the microcontroller 80 calculates the average value of the Z-axis angular velocity data from the Z-axis angular velocity sensor device 30Z and the Z-axis angular velocity data from the second Z-axis angular velocity sensor device 30ZB, and outputs the calculated average value to the host device 210 as the final Z-axis angular velocity data. This improves the accuracy of the Z-axis angular velocity data. Similarly, if a second X-axis angular velocity sensor device 30XB is provided in addition to the X-axis angular velocity sensor device 30X, the accuracy of the X-axis angular velocity data can be improved by calculating the average value of the X-axis angular velocity data from these angular velocity sensor devices. Furthermore, if a second Y-axis angular velocity sensor device 30YB is provided in addition to the Y-axis angular velocity sensor device 30Y, the accuracy of the Y-axis angular velocity data can be improved by calculating the average value of the Y-axis angular velocity data from these angular velocity sensor devices.

[0046] In moving objects such as automobiles, detecting yawing rotational motion corresponding to rotational motion around the Z-axis is important. Therefore, it is necessary to achieve high accuracy in detecting the Z-axis angular velocity, which is necessary for detecting yaw angular velocity and yaw angle. In this sense, it is desirable to provide a second Z-axis angular velocity sensor device 30ZB and calculate the average value of Z-axis angular velocity data from multiple angular velocity sensor devices. While FIG. 3 illustrates an example in which two angular velocity sensor devices are provided for the X-axis, Y-axis, and Z-axis, this embodiment is not limited to this. Three or more angular velocity sensor devices may be provided for the X-axis, Y-axis, or Z-axis. A configuration combining FIGS. 2 and 3 is also possible. For example, two or more angular velocity sensor devices may be provided for at least one of the X-axis, Y-axis, and Z-axis, and multiple acceleration sensor devices may be provided. A preferred embodiment is a configuration in which multiple Z-axis angular velocity sensor devices are provided and multiple acceleration sensor devices are provided.

[0047] Figure 4 shows an example of signal waveforms on the first digital interface bus BS1. The first digital interface bus BS1 includes signal lines for the chip select signal XCS, clock signal SCLK, data input signal SDI, and data output signal SDO. First, the negative logic chip select signal XCS goes low. This causes all of the X-axis angular velocity sensor device 30X, Y-axis angular velocity sensor device 30Y, and Z-axis angular velocity sensor device 30Z, which are commonly connected to the chip select signal XCS signal line, to be chip-selected. The first bit, R / W, of the data input signal SDI is a bit that indicates read / write. R / W=1 indicates a read, and R / W=0 indicates a write. The two bits A[1:0] after R / W specify an address. To specify a common address, A[1:0]=00. When specifying individual addresses for the X-axis angular velocity sensor device 30X, the Y-axis angular velocity sensor device 30Y, and the Z-axis angular velocity sensor device 30Z, A[1:0] = 01, 10, and 11, respectively. The four bits C[4:0] following A[1:0] indicate the command content and register address.

[0048] In Figure 4, R / W = 1 (as shown at F1), indicating a read command, and the microcontroller 80 issues a read command. Also, A[1:0] = 00 (as shown at F2), indicating a common address. F3 indicates the command content and register address. As a result, during period T1, the X-axis angular velocity sensor device 30X outputs X-axis angular velocity data. During the next period T2, the Y-axis angular velocity sensor device 30Y outputs Y-axis angular velocity data. During the next period T3, the Z-axis angular velocity sensor device 30Z outputs Z-axis angular velocity data. In this way, the first digital interface bus BS1 in Figure 4 enables continuous reading of angular velocity data from the X-axis angular velocity sensor device 30X, the Y-axis angular velocity sensor device 30Y, and the Z-axis angular velocity sensor device 30Z. This is achieved by each angular velocity sensor device storing its own transmission order, the number of connected angular velocity sensor devices, and the number of bits of transmitted data.

[0049] FIG. 5 shows an example of signal waveforms on the second digital interface bus BS2. The second digital interface bus BS2 also includes signal lines for the chip select signal XCS, the clock signal SCLK, the data input signal SDI, and the data output signal SDO. In FIG. 5, the chip select signal XCS goes low, chip-selecting the acceleration sensor device 40. Then, as shown in F4, the microcontroller 80 uses the data input signal SDI to set an address for the acceleration sensor device 40. The acceleration sensor device 40 then outputs X-axis acceleration data during period T1, Y-axis acceleration data during the next period T2, and Z-axis acceleration data during the next period T3. In this way, on the second digital interface bus BS2, one acceleration sensor device 40 specified by the address setting shown in F4 sequentially outputs X-axis acceleration data, Y-axis acceleration data, and Z-axis acceleration data.

[0050] 6 shows an example of signal waveforms illustrating the continuation of continuous readout on the first digital interface bus BS1. In FIG. 6, after the Z-axis angular velocity sensor device 30Z outputs Z-axis angular velocity data in a period T3, the X-axis angular velocity sensor device 30X outputs X-axis angular velocity data in the next period T4. Then, in the next period T5, the Y-axis angular velocity sensor device 30Y outputs Y-axis angular velocity data, and in the next period T6, the Z-axis angular velocity sensor device 30Z outputs Z-axis angular velocity data.

[0051] FIG. 7 shows an example of a signal waveform of the second digital interface bus BS2 when the first acceleration sensor device 40A and the second acceleration sensor device 40B are connected as shown in FIG. 2. The second digital interface bus BS2 does not allow continuous readout like the first digital interface bus BS1. Therefore, the microcontroller 80 specifies the address of the first acceleration sensor device 40A by setting the address F5. As a result, the first acceleration sensor device 40A outputs X-axis acceleration data during period TA1, Y-axis acceleration data during the next period TA2, and Z-axis acceleration data during the next period TA3. Next, the microcontroller 80 specifies the address of the second acceleration sensor device 40B by setting the address F6. As a result, the second acceleration sensor device 40B outputs X-axis acceleration data during period TB1, Y-axis acceleration data during the next period TB2, and Z-axis acceleration data during the next period TB3.

[0052] As described above, there is a problem in that angular velocity data and acceleration data require different command systems and communication methods. Therefore, in this embodiment, a first digital interface bus BS1 for the angular velocity sensor devices and a second digital interface bus BS2 for the acceleration sensor devices are separately provided. Angular velocity data is digitally transferred using the first digital interface bus BS1 in a first command system and a first communication method. Meanwhile, acceleration data is digitally transferred using the second digital interface bus BS2 in a second command system and a second communication method. For example, the first digital interface bus BS1 in FIG. 4 performs digital transfer using the first communication method. That is, in the first communication method, the angular velocity sensor devices for each axis output angular velocity data for that axis. That is, the X-axis angular velocity sensor device 30X outputs X-axis angular velocity data, the Y-axis angular velocity sensor device 30Y outputs Y-axis angular velocity data, and the Z-axis angular velocity sensor device 30Z outputs Z-axis angular velocity data. In contrast, the second digital interface bus BS2 in FIG. 5 performs digital transfer using the second communication method. That is, in the second communication method, one acceleration sensor device outputs acceleration data for multiple axes. That is, one acceleration sensor device 40 outputs X-axis acceleration data, Y-axis acceleration data, and Z-axis acceleration data. In this embodiment, data transfer is performed over the first digital interface bus BS1 using the first communication method, and data transfer is performed over the second digital interface bus BS2 using the second communication method, which is different from the first communication method.

[0053] The first communication method on the first digital interface bus BS1 allows continuous reading of angular velocity data from multiple angular velocity sensor devices. In contrast, the second communication method on the second digital interface bus BS2 does not allow continuous reading of acceleration data from multiple acceleration sensor devices. That is, as shown in FIG. 7, first, the address of the first acceleration sensor device 40A is specified to read the acceleration data for the X-, Y-, and Z-axes. Then, the address of the second acceleration sensor device 40B is specified to read the acceleration data for the X-, Y-, and Z-axes. In this respect, the first communication method on the first digital interface bus BS1 and the second communication method on the second digital interface bus BS2 are different. The second communication method on the second digital interface bus BS2 can also be modified to allow continuous reading of data from multiple acceleration sensor devices.

[0054] 2. Example of sensor device layout configuration Next, an example of the arrangement of sensor devices in the sensor module 10 will be described. FIGS. 8 and 9 show a first example of the arrangement of sensor devices. The sensor module 10 includes a circuit board 100. The circuit board 100 has a first surface SF1 and a second surface SF2, which are opposite surfaces to each other, and a first side surface SE1, a second side surface SE2, a third side surface SE3, and a fourth side surface SE4. FIG. 8 is a plan view showing the first surface SF1, and FIG. 9 is a plan view showing the second surface SF2. The circuit board 100 is a multilayer board with multiple through holes formed therein. In this embodiment, a glass epoxy board is used as the circuit board 100. Note that the circuit board 100 is not limited to a glass epoxy board, and any rigid board capable of mounting multiple sensor devices, electronic components, connectors, etc. may be used. For example, a composite board or a ceramic board may be used as the circuit board 100. Mounting holes 102, 103, and 104 are formed in the circuit board 100.

[0055] The first surface SF1 and the second surface SF2 of the circuit board 100 are main surfaces that are opposite each other. For example, if the first surface SF1 is the front surface, the second surface SF2 is the back surface. The first side surface SE1 to the fourth side surface SE4 of the circuit board 100 are surfaces that connect the first surface SF1 and the second surface SF2 and are perpendicular to the first surface SF1 and the second surface SF2. The first side surface SE1 and the third side surface SE3 are located opposite each other on the circuit board 100 and have normal directions opposite to each other. The second side surface SE2 and the fourth side surface SE4 are located opposite each other on the circuit board 100 and have normal directions opposite to each other. The first side surface SE1 and the third side surface SE3 are parallel to each other, and the second side surface SE2 and the fourth side surface SE4 are parallel to each other. The normal directions of the first side surface SE1 and the third side surface SE3 and the second side surface SE2 and the fourth side surface SE4 are perpendicular to each other.

[0056] The Z-axis, which is the detection axis of the sensor module 10, is an axis that is perpendicular to the circuit board 100. The X-axis and Y-axis, which are detection axes of the sensor module 10, are axes that are perpendicular to each other and are axes that are perpendicular to the Z-axis. The X-axis is an axis that is normal to the first side surface SE1, and the Y-axis is an axis that is normal to the second side surface SE2.

[0057] The X-axis angular velocity sensor device 30X is mounted on the first side surface SE1 of the circuit board 100. Specifically, the mounting surface is mounted on the first side surface SE1 so as to be perpendicular to the X-axis. For example, the X-axis angular velocity sensor device 30X is mounted so that its bottom surface, which is the mounting surface, is in contact with the first side surface SE1. In this mounted state, terminals H1 in FIG. 8 located on the first side SF1 of the X-axis angular velocity sensor device 30X are connected to signal lines and power lines formed on the first side SF1. In addition, in this mounted state, terminals H2 in FIG. 9 located on the second side SF2 of the X-axis angular velocity sensor device 30X are connected to signal lines and power lines formed on the second side SF2. Note that the signal lines and power lines include signal lines and power lines formed in through-holes.

[0058] The Y-axis angular velocity sensor device 30Y is mounted on the second side surface SE2 of the circuit board 100. Specifically, it is mounted on the second side surface SE2 so that the mounting surface is perpendicular to the Y-axis. For example, the Y-axis angular velocity sensor device 30Y is attached so that its bottom surface, which is the mounting surface, is in contact with the second side surface SE2. In this attached state, the terminals indicated by H3 located on the first surface SF1 side of the Y-axis angular velocity sensor device 30Y are connected to signal lines and power lines formed on the first surface SF1. In addition, in this attached state, the terminals indicated by H4 located on the second surface SF2 side of the Y-axis angular velocity sensor device 30Y are connected to signal lines and power lines formed on the second surface SF2.

[0059] The Z-axis angular velocity sensor device 30Z is mounted on the first surface SF1 of the circuit board 100. Specifically, the Z-axis angular velocity sensor device 30Z is mounted on the first surface SF1 so that its mounting surface is perpendicular to the Z axis, and is attached so that its bottom surface, which is the mounting surface, is in contact with the first surface SF1. Terminals of the Z-axis angular velocity sensor device 30Z are connected to signal lines and power lines formed on the first surface SF1.

[0060] The acceleration sensor device 40 is mounted on the first surface SF1 of the circuit board 100. Specifically, the acceleration sensor device 40 is mounted on the first surface SF1 so that its mounting surface is perpendicular to the Z axis, and is attached so that its bottom surface, which is the mounting surface, is in contact with the first surface SF1. Terminals of the acceleration sensor device 40 are connected to signal lines and power lines formed on the first surface SF1. Similarly, the temperature sensor 150 is also mounted on the first surface SF1, and its terminals are connected to signal lines and power lines formed on the first surface SF1.

[0061] A plug-type connector 110 is mounted on the first surface SF1 of the circuit board 100. This connector 110 has two rows of connection terminals arranged at equal intervals in the Y-axis direction. As shown in Fig. 9, a microcontroller 80 is mounted on the second surface SF2 of the circuit board 100. The microcontroller 80 is a grid array package such as a PGA, and in the plan view of Fig. 9, multiple terminals are arranged in a grid pattern on the surface below the microcontroller 80.

[0062] 8 and 9, the X-axis angular velocity sensor device 30X detects an angular velocity around a detection axis A1. The detection axis A1 corresponds to the z-axis in FIG. 23 (described later). The X-axis angular velocity sensor device 30X is disposed so that the direction of the detection axis A1 is aligned with the X-axis. Therefore, the X-axis angular velocity sensor device 30X can detect an angular velocity around the X-axis. The Y-axis angular velocity sensor device 30Y detects an angular velocity around a detection axis A2. The detection axis A2 corresponds to the z-axis in FIG. 23. The Y-axis angular velocity sensor device 30Y is disposed so that the direction of the detection axis A2 is aligned with the Y-axis. Therefore, the Y-axis angular velocity sensor device 30Y can detect an angular velocity around the Y-axis. The Z-axis angular velocity sensor device 30Z detects an angular velocity around a detection axis A3. The detection axis A3 corresponds to the z-axis in FIG. 23. The Z-axis angular velocity sensor device 30Z is disposed so that the direction of the detection axis A3 is aligned with the Z-axis. Therefore, the Z-axis angular velocity sensor device 30Z can detect angular velocity around the Z-axis. Meanwhile, the acceleration sensor device 40 is arranged so that the directions of the first detection axis x, second detection axis y, and third detection axis z are aligned with the X-axis, Y-axis, and Z-axis, respectively. Therefore, the acceleration sensor device 40 can detect acceleration in the directions of the X-axis, Y-axis, and Z-axis.

[0063] As shown in FIG. 8 , in this embodiment, the X-axis angular velocity sensor device 30X, the Y-axis angular velocity sensor device 30Y, the Z-axis angular velocity sensor device 30Z, and the acceleration sensor device 40 are arranged in the first region RG1 of the first region RG1 and the second region RG2 on the first surface SF1 of the circuit board 100. Meanwhile, the microcontroller 80 is arranged in a region on the second surface SF2 of the circuit board 100 corresponding to the second region RG2. For example, the X-axis angular velocity sensor device 30X, the Y-axis angular velocity sensor device 30Y, the Z-axis angular velocity sensor device 30Z, and the acceleration sensor device 40 are arranged on the first region RG1 side, and the microcontroller 80 is arranged on the second region RG2 side. Here, the first region RG1 is the region on the first side surface SE1 side of the region defined by the line LC in FIG. 8 , and the second region RG2 is the region on the third side surface SE3 side of the region defined by the line LC. The line LC is a line between the first side surface SE1 and the third side surface SE3 in the plan view of FIG. 8 , e.g., a center line. For example, the line LC is a line parallel to the first side surface SE1 and the third side surface SE3 in a plan view. The area on the second surface SF2 corresponding to the second region RG2 is, for example, an area on the back side of the second region RG2. However, it may also be an area on the first surface SF1 side.

[0064] With this arrangement, the sensor device group consisting of the X-axis angular velocity sensor device 30X, the Y-axis angular velocity sensor device 30Y, the Z-axis angular velocity sensor device 30Z, and the acceleration sensor device 40 can be concentrated in the first region RG1 of the circuit board 100. Meanwhile, the microcontroller 80 is arranged in the second region RG2, which is different from the first region RG1. The microcontroller 80 includes a large-scale digital circuit (e.g., a CPU core) that operates on a high-speed clock signal, and thus generates high-temperature heat during operation. According to the arrangement of this embodiment, the microcontroller 80, which serves as such a heat source, is arranged in the second region RG2, and the sensor device group is arranged in the first region RG1. This allows for a sufficient distance between the microcontroller 80, which serves as a heat source, and the sensor device group, which detects angular velocity and acceleration with high accuracy, thereby reducing the adverse effects of heat generated by the microcontroller 80 on the detection accuracy of the sensor device group.

[0065] For example, in conventional analog sensor modules, if the sensor devices and the microcontroller are placed far apart, the signal lines for the analog detection signals become long, resulting in a decrease in detection accuracy. In particular, when the detection voltage from the sensor devices is converted to digital using the microcontroller's built-in A / D conversion circuit, if the sensor devices and the microcontroller are placed far apart, the signal lines for the detection voltage become very long. This causes a lot of noise to be superimposed on the detection voltage, causing it to fluctuate greatly and significantly reducing detection accuracy. For this reason, it was necessary to place the microcontroller close to the sensor devices. However, if the microcontroller is placed close to the sensor devices, the heat generated by the microcontroller will be transferred to the sensor devices, reducing detection accuracy.

[0066] In this regard, according to the method of this embodiment, the sensor device group and the microcontroller 80 are connected by a digital interface bus, and detection data is transferred digitally. Therefore, even if the sensor device group and the microcontroller 80 are spaced apart, the problem of reduced detection accuracy due to the adverse effects of noise, as occurs with analog methods, does not occur. Furthermore, as shown in FIGS. 8 and 9 , by arranging the sensor device group in the first region RG1 and the microcontroller 80 in the second region RG2, the distance between the two can be increased, and the reduction in detection accuracy due to heat generation by the microcontroller 80 can also be suppressed. Therefore, compared to conventional analog methods, this method has the advantage of significantly improving the detection accuracy of the sensor module 10.

[0067] In this embodiment, when mounting the circuit board 100 in the inner case 120 of Fig. 22, the recess 121 of the inner case 120 is filled with a filling material to improve performance. In this sense, it is desirable to arrange the sensor device group intensively in the first region RG1 so that it is covered with the filling material. However, a variation is also possible in which some of the sensor devices in the sensor device group are arranged in a region other than the first region RG1.

[0068] In this embodiment, as shown in FIG. 8 , the temperature sensor 150 is disposed in the first region RG1 of the circuit board 100. As described with reference to FIG. 2 , the microcontroller 80 performs temperature correction processing based on the detection result of the temperature sensor 150. This allows the temperature sensor 150 to be disposed in the first region RG1 where the sensor device group is disposed. For example, in FIG. 8 , the temperature sensor 150 is disposed between the Z-axis angular velocity sensor device 30Z and the acceleration sensor device 40. This allows the temperature sensor 150 to detect temperatures close to the sensor device group. The highly accurate temperature sensor 150 disposed close to the sensor device group performs temperature detection, and temperature correction processing can be performed on the detection data of the sensor device group based on the detection results. This allows a temperature close to the actual temperature of the sensor device group to be detected and temperature correction processing can be performed to reduce the temperature dependency of the detection data, thereby further improving the detection accuracy of the sensor module 10.

[0069] 10 and 11 show a second example of the arrangement of sensor devices. FIGS. 10 and 11 are plan views showing the first and second surfaces SF1 and SF2, respectively, of an arrangement of sensor devices corresponding to the third example of FIG. 3. While one angular velocity sensor device is provided for each axis in FIGS. 8 and 9, two angular velocity sensor devices are provided for each axis in FIGS. 10 and 11. That is, in addition to the X-axis angular velocity sensor device 30X, a second X-axis angular velocity sensor device 30XB is provided, and in addition to the Y-axis angular velocity sensor device 30Y, a second Y-axis angular velocity sensor device 30YB is provided. Furthermore, in addition to the Z-axis angular velocity sensor device 30Z, a second Z-axis angular velocity sensor device 30ZB is provided, as shown in FIG. 11.

[0070] Specifically, the X-axis angular velocity sensor device 30X and the second X-axis angular velocity sensor device 30XB are mounted on the first side surface SE1. For example, the X-axis angular velocity sensor device 30X and the second X-axis angular velocity sensor device 30XB are mounted so that their respective detection axes A1A and A1B are aligned along the X-axis direction. As described above, this allows the final X-axis angular velocity data to be obtained by averaging the two X-axis angular velocity data from these X-axis angular velocity sensor devices, thereby obtaining more accurate X-axis angular velocity data. Furthermore, the Y-axis angular velocity sensor device 30Y and the second Y-axis angular velocity sensor device 30YB are mounted on the second side surface SE2 so that their respective detection axes A2A and A2B are aligned along the Y-axis direction. As described above, this allows the final Y-axis angular velocity data to be obtained by averaging the two Y-axis angular velocity data from these Y-axis angular velocity sensor devices, thereby obtaining more accurate Y-axis angular velocity data.

[0071] 10, Z-axis angular velocity sensor device 30Z is mounted on first surface SF1 of circuit board 100, and as shown in FIG. 11, second Z-axis angular velocity sensor device 30ZB is mounted on second surface SF2 of circuit board 100. As a result, detection axis A3A of Z-axis angular velocity sensor device 30Z is set to face the positive direction of the Z axis, and detection axis A3B of second Z-axis angular velocity sensor device 30ZB is set to face the negative direction of the Z axis. Therefore, after aligning the positive and negative directions of the Z-axis angular velocity data of Z-axis angular velocity sensor device 30Z and the Z-axis angular velocity data of second Z-axis angular velocity sensor device 30ZB, the average value of the Z-axis angular velocity data can be calculated to obtain final Z-axis angular velocity data, thereby enabling to obtain Z-axis angular velocity data with higher accuracy.

[0072] 10 and 11, a total of six angular velocity sensor devices, two for each axis, can be efficiently mounted using the limited layout area of the circuit board 100. Therefore, it is possible to achieve high accuracy by calculating the average value of the angular velocity data while maintaining the compact size of the sensor module 10.

[0073] 12 and 13 show a third example of the sensor device arrangement. FIGS. 12 and 13 are plan views showing the first and second surfaces SF1 and SF2, respectively, of an example of the sensor device arrangement corresponding to the second example of FIG. 2. For example, while one acceleration sensor device is provided in FIGS. 8 and 9, two acceleration sensor devices are provided in FIGS. 12 and 13. Specifically, as shown in FIG. 12, a first acceleration sensor device 40A is mounted on the first surface SF1 of the circuit board 100, and as shown in FIG. 13, a second acceleration sensor device 40B is mounted on the second surface SF2 of the circuit board 100. This allows the first X-axis acceleration data from the first acceleration sensor device 40A and the second X-axis acceleration data from the second acceleration sensor device 40B to be averaged, and the average value can be used as the final X-axis acceleration data. Similarly, the first Y-axis acceleration data and the first Z-axis acceleration data from the first acceleration sensor device 40A and the second Y-axis acceleration data and the second Z-axis acceleration data from the second acceleration sensor device 40B can be averaged to obtain the final Y-axis acceleration data and Z-axis acceleration data. In FIGS. 12 and 13, the first acceleration sensor device 40A is disposed on the first surface SF1 of the circuit board 100, and the second acceleration sensor device 40B is disposed in an empty space on the second surface SF2 of the circuit board 100. Therefore, the two acceleration sensor devices can be efficiently mounted using the limited area of the circuit board 100. Therefore, it is possible to achieve high accuracy by averaging the acceleration data while maintaining the compact size of the sensor module 10.

[0074] 12 and 13 , the sensor module 10 of this embodiment includes an X-axis angular velocity sensor device 30X, a Y-axis angular velocity sensor device 30Y, a Z-axis angular velocity sensor device 30Z, a first acceleration sensor device 40A, a second acceleration sensor device 40B, a microcontroller 80, and a circuit board 100. The microcontroller 80 receives inputs of X-axis angular velocity data from the X-axis angular velocity sensor device 30X, Y-axis angular velocity data from the Y-axis angular velocity sensor device 30Y, and Z-axis angular velocity data from the Z-axis angular velocity sensor device 30Z. The microcontroller 80 also receives inputs of first X-axis acceleration data, first Y-axis acceleration data, and first Z-axis acceleration data from the first acceleration sensor device 40A, and second X-axis acceleration data, second Y-axis acceleration data, and second Z-axis acceleration data from the second acceleration sensor device 40B. The first acceleration sensor device 40A is disposed on the first surface SF1 of the circuit board 100, and the second acceleration sensor device 40B is disposed on the second surface SF2 of the circuit board 100. Note that a second Z-axis angular velocity sensor device 30ZB may be further provided on the second surface SF2 of the circuit board 100 in Fig. 13 to achieve higher accuracy in detecting the yaw angular velocity and yaw angle.

[0075] More specifically, in this embodiment, the first acceleration sensor device 40A, which is one of the first acceleration sensor device 40A and the second acceleration sensor device 40B, is arranged so that the directions of its first detection axis x1, second detection axis y1, and third detection axis z1 are aligned along the X-axis, Y-axis, and Z-axis, respectively. Also, as shown in FIG. 13 , the second acceleration sensor device 40B, which is the other acceleration sensor device, is arranged so that the directions of its first detection axis x2, second detection axis y2, and third detection axis z2 are aligned along the Y-axis, X-axis, and Z-axis, respectively. Specifically, in FIG. 13 , the positive direction of the first detection axis x2 is the positive direction of the Y-axis, the positive direction of the second detection axis y2 is the negative direction of the X-axis, and the positive direction of the third detection axis z2 is the negative direction of the Z-axis. The second detection axis y2 and the X-axis are opposite in positive and negative directions, but the direction of the second detection axis y2 is aligned along the X-axis. 12 and 13 show an example in which one acceleration sensor device is the first acceleration sensor device 40A and the other acceleration sensor device is the second acceleration sensor device 40B, but this is not limiting. One acceleration sensor device may be the second acceleration sensor device 40B and the other acceleration sensor device may be the first acceleration sensor device 40A. Arranging two acceleration sensor devices as shown in FIGS. 12 and 13 enables temperature compensation using the temperature hysteresis characteristics of the acceleration sensor devices.

[0076] 14 and 15 show various exemplary layouts of the first acceleration sensor device 40A and the second acceleration sensor device 40B. In FIG. 14, the first acceleration sensor device 40A is arranged on the first surface SF1 of the circuit board 100, and the second acceleration sensor device 40B is arranged on the second surface SF2. As a result, the third detection axis z1 of the first acceleration sensor device 40A and the third detection axis z2 of the second acceleration sensor device 40B are aligned in the same direction but have opposite positive and negative polarities. Therefore, when performing temperature compensation using the temperature hysteresis characteristics described below, the acceleration values at z1 and z2 are aligned in the same direction before averaging. In B1 and B2 of FIG. 14, x1 and y2 are aligned in the same direction but have opposite positive and negative polarities. Also, y1 and x2 are aligned in the same direction but have opposite positive and negative polarities. These B1 and B2 correspond to the layouts shown in FIGS. 12 and 13. When performing temperature compensation using the temperature hysteresis characteristics described below, the acceleration value at x1 and the acceleration value at y2 are aligned in positive and negative directions before performing the averaging process, and the acceleration value at y1 and the acceleration value at x2 are aligned in positive and negative directions before performing the averaging process. This makes it possible to perform temperature compensation using acceleration values from different axes, and is expected to achieve more appropriate temperature compensation using the temperature hysteresis characteristics. It is also possible to perform temperature compensation by aligning the positive and negative directions using each combination of B1 and B3, B1 and B4, and B1 and B5 before performing the averaging process.

[0077] 15, the first acceleration sensor device 40A and the second acceleration sensor device 40B are arranged on the first surface SF1 of the circuit board 100. In this manner, in this embodiment, both the first acceleration sensor device 40A and the second acceleration sensor device 40B may be arranged on one of the first surface SF1 and the second surface SF2. As in FIG. 14, it is also possible to perform temperature compensation processing by averaging the positive and negative directions of the respective combinations of B6, B7, B8, and B9.

[0078] FIG. 16 is an explanatory diagram of temperature compensation processing using the temperature hysteresis characteristics of acceleration sensor devices. For example, G1 is an example of the temperature hysteresis characteristics of the first acceleration sensor device 40A mounted on the first surface SF1, and G2 is an example of the temperature hysteresis characteristics of the second acceleration sensor device 40B mounted on the second surface SF2. The temperature hysteresis characteristics of G1 exhibit temperature characteristics as shown in G3 when the temperature rises and as shown in G4 when the temperature falls. On the other hand, the temperature hysteresis characteristics of G2 exhibit temperature characteristics as shown in G5 when the temperature rises and as shown in G6 when the temperature falls. Therefore, when the temperature rises, the temperature fluctuation of the acceleration value can be offset by adding the acceleration value with the temperature characteristics of G3 and G5, for example. This reduces the fluctuation of the acceleration value with respect to temperature rise, as shown in G8 of the temperature hysteresis characteristics of G7, achieving good temperature characteristics. Furthermore, when the temperature drops, the temperature fluctuation of the acceleration value can be offset by adding the acceleration value with the temperature characteristics of G4 and G6, for example. This reduces the fluctuation of the acceleration value in response to a drop in temperature, as shown in G9 of the temperature hysteresis characteristics of G7, for example, and achieves good temperature characteristics.

[0079] For example, in FIG. 14, the first acceleration sensor device 40A is placed on the first surface SF1, and the second acceleration sensor device 40B is placed on the second surface SF2. As a result, the acceleration value at z1 has a temperature hysteresis characteristic of G1, and the acceleration value at z2 has a temperature hysteresis characteristic of G2, thereby realizing temperature compensation processing. At B1 and B2 in FIG. 14, the acceleration value at x1 has a temperature hysteresis characteristic of G1, and the acceleration value at y2 has a temperature hysteresis characteristic of G2, thereby realizing temperature compensation processing. The acceleration value at y1 has a temperature hysteresis characteristic of G1, and the acceleration value at x2 has a temperature hysteresis characteristic of G2, thereby realizing temperature compensation processing. The temperature compensation processing using the temperature hysteresis characteristics is performed by the microcontroller 80.

[0080] 3. Synchronization signal input FIG. 17 shows a fourth configuration example of the sensor module 10. The sensor module 10 of FIG. 17 includes a synchronization signal line LSY that transmits a synchronization signal SYC. The synchronization signal line LSY is electrically connected to the X-axis angular velocity sensor device 30X, the Y-axis angular velocity sensor device 30Y, the Z-axis angular velocity sensor device 30Z, and the acceleration sensor device 40. This allows the external synchronization signal EXSYC to be input as the synchronization signal SYC to these sensor devices. For example, each of these sensor devices is provided with a synchronization terminal, to which the synchronization signal line LSY is connected. The external synchronization signal EXSYC is then input as the synchronization signal SYC via the synchronization terminal and the synchronization signal line LSY. Thus, in FIG. 17, in addition to the first digital interface bus BS1 and the second digital interface bus BS2, a synchronization signal line LSY that transmits the synchronization signal SYC is provided. Specifically, the synchronization signal line LSY for the synchronization signal SYC is wired on the circuit board 100 of the sensor module 10. 2, the third configuration example of FIG. 3, or a combination thereof, the synchronization signal line LSY may be electrically connected to each sensor device to input the synchronization signal SYC. For example, in FIG. 2, the synchronization signal line LSY is also connected to the second acceleration sensor device 40B to input the synchronization signal SYC. In FIG. 3, the synchronization signal line LSY is also connected to the second X-axis angular velocity sensor device 30XB, the second Y-axis angular velocity sensor device 30YB, and the second Z-axis angular velocity sensor device 30ZB to input the synchronization signal SYC.

[0081] 18 is an explanatory diagram of a sensor module 10 in which a synchronization signal line is connected to each of a plurality of sensor devices. The first sensor device 20X is either an angular velocity sensor device or an acceleration sensor device, and the second sensor device 20Y is also either an angular velocity sensor device or an acceleration sensor device. For simplicity of explanation, FIG. 18 shows an example in which there are two sensor devices, but the number of sensor devices can be three or more, and the sensor module 10 can include a first sensor device to an n-th sensor device (n is an integer greater than or equal to 2).

[0082] The first sensor device 20X includes a first sensor element 50X, a first detection circuit 60X that receives a signal from the first sensor element 50X and performs detection processing, and a first interface 70X that outputs first detection data SD1 from the first detection circuit 60X. The first sensor device 20X is a device in which the first sensor element 50X and an integrated circuit device including the first detection circuit 60X and the first interface 70X are housed in a package. The integrated circuit device is an IC chip realized by a semiconductor. The second sensor device 20Y includes a second sensor element 50Y, a second detection circuit 60Y that receives a signal from the second sensor element 50Y and performs detection processing, and a second interface 70Y that outputs second detection data SD2 from the second detection circuit 60Y. The second sensor device 20Y is a device in which the second sensor element 50Y and an integrated circuit device including the second detection circuit 60Y and the second interface 70Y are housed in a package. In addition, when the number of sensor devices is three or more and an nth sensor device is provided, the nth sensor device can include an nth sensor element, an nth detection circuit that receives a signal from the nth sensor element and performs detection processing, and an nth interface that outputs nth detection data from the nth detection circuit.

[0083] The first sensor element 50X and the second sensor element 50Y are sensor elements that detect physical quantities and can also be called physical quantity transducers. The first sensor element 50X and the second sensor element 50Y are, for example, angular velocity sensor elements or acceleration sensor elements. The first detection circuit 60X and the second detection circuit 60Y can include an analog circuit and an A / D conversion circuit that converts analog signals from the analog circuit into digital data. The analog circuit can include an amplifier circuit that amplifies signals from the sensor elements, a detection circuit such as a synchronous detection circuit, a gain adjustment circuit, or an offset adjustment circuit. The A / D conversion circuit outputs digital detection data to an interface. The A / D conversion circuit can employ an A / D conversion method such as successive approximation, delta-sigma, flash, pipeline, or double integration. The first interface 70X and the second interface 70Y are circuits that perform digital interface processing, such as transmitting and receiving serial data. The first interface 70X and the second interface 70Y perform interface processing of the SPI or I2C communication standard, or a communication standard that has been developed or partially improved or modified, similar to the digital interface 82, first digital interface 83, and second digital interface 84 of the microcontroller 80. The digital interface 82 corresponds to the first digital interface 83 and the second digital interface 84.

[0084] The microcontroller 80 receives the first detection data SD1 from the first sensor device 20X and the second detection data SD2 from the second sensor device 20Y. The sensor module 10 includes a digital interface bus BS that electrically connects the first sensor device 20X and the second sensor device 20Y to the microcontroller 80. This digital interface bus BS corresponds to the first digital interface bus BS1 and the second digital interface bus BS2 described above.

[0085] In this embodiment, the first sensor device 20X has a first synchronization terminal TS1 to which a synchronization signal SYC is input via a synchronization signal line LSY. The first interface 70X outputs first detection data SD1 to the microcontroller 80 based on the synchronization signal SYC input to the first synchronization terminal TS1. The second sensor device 20Y includes a second synchronization terminal TS2 to which the synchronization signal SYC is input via the synchronization signal line LSY. The second interface 70Y outputs second detection data SD2 to the microcontroller 80 based on the synchronization signal SYC input to the second synchronization terminal TS2.

[0086] Here, the synchronization signal SYC is the external synchronization signal EXSYC or a signal based on the external synchronization signal EXSYC. The external synchronization signal EXSYC is a signal input to the sensor module 10 from an external device such as the host device 210, and is a signal that becomes active at each synchronization timing. For example, the external synchronization signal EXSYC is a signal that becomes active at regular intervals. Active means H level (high level) in the case of positive logic and L level (low level) in the case of negative logic. The synchronization signal SYC input to the first sensor device 20X and the second sensor device 20Y may be the external synchronization signal EXSYC itself or a signal based on the external synchronization signal EXSYC. A signal based on the external synchronization signal EXSYC is a signal generated using the external synchronization signal EXSYC. For example, a signal based on the external synchronization signal EXSYC is a signal generated by another circuit, such as the microcontroller 80, sampling the external synchronization signal EXSYC with a clock signal. The first synchronization terminal TS1 and the second synchronization terminal TS2 are terminals provided on the packages of the first sensor device 20X and the second sensor device 20Y, for example, and are terminals for external connection.

[0087] As described above, in the sensor module 10 of this embodiment, each sensor device has its own synchronization terminal, such that the first sensor device 20X includes a first synchronization terminal TS1 and the second sensor device 20Y includes a second synchronization terminal TS2. The first sensor device 20X outputs first detection data SD1 to the microcontroller 80 based on the synchronization signal SYC input to the first synchronization terminal TS1, and the second sensor device 20Y outputs second detection data SD2 to the microcontroller 80 based on the synchronization signal SYC input to the second synchronization terminal TS2. Therefore, each of the first sensor device 20X and the second sensor device 20Y can obtain detection data at appropriate timing using the synchronization signal SYC input to their synchronization terminals and output the data to the microcontroller 80. This allows for increased accuracy of information measured using the sensor module 10.

[0088] For example, in order to properly measure information such as posture information, movement distance information, or inertial information of the object to be measured based on detection data from the first sensor device 20X, the second sensor device 20Y, etc., it is desirable that each detection data is synchronized or that the time at which each detection data was acquired is clear.

[0089] In this regard, a first comparative example of this embodiment may be a method in which each sensor device outputs the detection data acquired immediately before the output period of the detection data to the microcontroller 80. For example, assume that the first sensor device 20X outputs the first detection data SD1 during a first output period, and the second sensor device 20Y outputs the second detection data SD2 during a second output period following the first output period. In this case, in the method of the first comparative example, the first sensor device 20X outputs the first detection data SD1 acquired from the first detection circuit 60X at a first timing immediately before the first output period to the microcontroller 80. The second sensor device 20Y outputs the second detection data SD2 acquired from the second detection circuit 60Y at a second timing immediately before the second output period to the microcontroller 80.

[0090] However, because the first and second timings are time-shifted, the timing at which the first detection data SD1 is acquired and the timing at which the second detection data SD2 is acquired are time-shifted, resulting in a synchronization of the detection data. For example, if the first sensor device 20X and the second sensor device 20Y are X-axis angular velocity sensor devices and Y-axis angular velocity sensor devices, respectively, the timing at which the X-axis angular velocity data is acquired and the timing at which the Y-axis angular velocity data is acquired are time-shifted. Therefore, when measuring the attitude information of a measurement target, such as a moving object, using the X-axis angular velocity data and the Y-axis angular velocity data, accurate attitude information cannot be measured.

[0091] In this regard, according to this embodiment, the first sensor device 20X and the second sensor device 20Y can output the first detection data SD1 and the second detection data SD2 acquired from the first detection circuit 60X and the second detection circuit 60Y to the microcontroller 80 using a common synchronization signal SYC. That is, the acquisition timing of the first detection data SD1 and the second detection data SD2 can be synchronized. Taking an angular velocity sensor device as an example, X-axis angular velocity data and Y-axis angular velocity data acquired at a common synchronization timing can be output to the microcontroller 80. Therefore, when measuring the attitude information of a measurement object using this X-axis angular velocity data and Y-axis angular velocity data, it is possible to measure the attitude information more accurately and with higher precision.

[0092] As a second comparative example of this embodiment, when the microcontroller 80 issues a command with multiple sensor devices as a common destination, a method is also possible in which detection data is acquired from each detection circuit at a common capture timing specified by the command issuance, and output to the microcontroller 80. For example, as a result of command interpretation, detection data is acquired from each detection circuit at a timing when it is determined that the command is with multiple sensor devices as a common destination, and output to the microcontroller 80.

[0093] However, the microcontroller 80 does not issue commands at regular intervals, but rather there is a temporal fluctuation in the timing of issuance. This causes a fluctuation in the timing of acquisition of detection data, which can lead to inaccurate and inappropriate information, such as posture information of the measurement target object, acquired using the sensor module 10. The microcontroller 80 not only issues commands to the sensor device but also performs various other processes. Therefore, if a high-priority interrupt request is received, that interrupt process is executed with priority, and the command issuance process to the sensor device is put on hold. Therefore, due to other interrupt requests, there is a temporal fluctuation in the timing of issuing commands to the sensor device, which in turn causes a temporal fluctuation in the timing of acquisition of detection data.

[0094] In this regard, according to this embodiment, the detection data can be acquired from the detection circuit using the synchronization signal SYC and output to the microcontroller 80, without depending on the processing being performed by the microcontroller 80. For example, even if the microcontroller 80 is performing a high-priority interrupt processing, the detection data can be acquired at the timing synchronized with the synchronization signal SYC, regardless of that. Therefore, it is possible to prevent the problem of temporal fluctuations occurring in the timing of acquiring the detection data as described above.

[0095] For example, in this embodiment, the first interface 70X outputs the first detection data SD1 acquired from the first detection circuit 60X at the synchronization timing of the synchronization signal SYC to the microcontroller 80. The second interface 70Y outputs the second detection data SD2 acquired from the second detection circuit 60Y at the synchronization timing of the synchronization signal SYC to the microcontroller 80.

[0096] In this manner, the first interface 70X can store the first detection data SD1 acquired at the synchronous timing in a register or the like. Then, when the microcontroller 80 issues a command to read the detection data, the first interface 70X can output the stored first detection data SD1 to the microcontroller 80. Therefore, the first detection data SD1 can be acquired from the first detection circuit 60X at the synchronous timing of the synchronization signal SYC, which is independent of the timing at which the microcontroller 80 issues a command, and output the acquired data to the microcontroller 80 when the command is issued. Similarly, the second interface 70Y can store the second detection data SD2 acquired at the synchronous timing in a register or the like. Then, when the microcontroller 80 issues a command to read the detection data, the stored second detection data SD2 can be output to the microcontroller 80. Therefore, the second detection data SD2 can be acquired from the second detection circuit 60Y at the synchronous timing, which is independent of the timing at which the command is issued, and output the acquired data to the microcontroller 80 when the command is issued. This prevents the problem of temporal fluctuations in the timing at which the detection data is acquired, which was a problem in the method of the second comparative example.

[0097] 18, the microcontroller 80 includes a digital interface 82, a processing circuit 90, a signal processing circuit 92, an interrupt controller 94, and a host interface 96. The digital interface 82 is a circuit that performs interface processing with the sensor device. That is, it performs interface processing as a master between the first interface 70X and the second interface 70Y. The digital interface 82 is connected to the digital interface bus BS via a terminal TM. Like the first interface 70X and the second interface 70Y, the digital interface 82 performs interface processing for the SPI or I2C communication standard, or a communication standard that has been developed or partially improved or modified.

[0098] The processing circuit 90 corresponds to the core CPU of the microcontroller 80 and performs various arithmetic and control processes. The processing circuit 90 includes a register unit 91 with various registers. The signal processing circuit 92 performs digital signal processing such as filtering and correction, and can be implemented using a DSP or similar. Specifically, the signal processing circuit 92 calculates a moving average of the most recent J pieces of detection data and then downsamples the data to a rate of 1 / K (J and K are integers greater than or equal to 2). The signal processing circuit 92 also performs corrections, such as temperature correction, on the filtered detection data. The processing circuit 90 then stores the corrected detection data in the register unit 91. The processing circuit 90 then generates a signal DRDY, which signals that detection data is ready, and outputs the signal DRDY to the host device 210 via the terminal TR. This signal DRDY indicates that digital signal processing by the signal processing circuit 92 has been completed.

[0099] The register unit 91 has multiple registers that can be accessed externally. For example, the host device 210 can access the data register of the register unit 91 via the host interface 96 and read out the detection data. The processing circuit 90 counts the number of updates to the data register of the detection data. The counted number of updates is then written to the update count register of the register unit 91. This allows the host device 210 to identify the ordinal number of the detection data read out from the microcontroller 80.

[0100] The interrupt controller 94 accepts various interrupt requests. It outputs signals indicating the interrupt request, interrupt level, and vector number to the processing circuit 90 according to the priority and interrupt level. The external synchronization signal EXSYC is input to the interrupt controller 94 via the synchronization terminal TS as one of the interrupt request signals. When the processing circuit 90 accepts an interrupt request via the external synchronization signal EXSYC, it executes the corresponding interrupt processing. Examples of interrupt requests include SPI and UART interrupt requests from the host interface 96, interrupt requests from various timers, and I2C interrupt requests. The host interface 96 is a circuit that performs digital interface processing with the host device 210. For example, the host interface 96 performs serial data communication via SPI, UART, etc. as host interface processing.

[0101] FIG. 19 is a signal waveform diagram illustrating the operation of the sensor module 10. As shown in FIG. 19, the external synchronization signal EXSYC becomes active at each synchronization timing. That is, it becomes active at predetermined time intervals. The external synchronization signal EXSYC is input as the synchronization signal SYC to the first synchronization terminal TS1 and the second synchronization terminal TS2 of the first sensor device 20X and the second sensor device 20Y. Then, at synchronization timing t1 when the synchronization signal SYC, which is the external synchronization signal EXSYC, becomes active (H level), the first detection data SSD1 of the first detection circuit 60X and the second detection data SSD2 of the second detection circuit 60Y are captured, as shown at E2 in FIG. 19. Specifically, they are captured in the register 67 in FIG. 20, which will be described later. Note that FIG. 19 also shows the nth detection data SSDn of the nth detection circuit.

[0102] In this embodiment, the first sensor device 20X and the second sensor device 20Y operate based on separate clock signals. For example, each sensor device operates based on a clock signal from an oscillator circuit built into the sensor device or a clock signal generated using an oscillator such as a quartz oscillator. Therefore, as shown at E2 in FIG. 19 , the detection circuits of the sensor devices output detection data asynchronously with each other. In this embodiment, these detection data are latched and captured using a synchronization signal SYC with the same synchronization timing. Then, as shown at E3, the captured detection data are output from the first sensor device 20X and the second sensor device 20Y to the microcontroller 80 as first detection data SD1 and second detection data SD2. In practice, the microcontroller 80 issues a read command, as described below, and the first detection data SD1 and second detection data SD2 are output based on this read command.

[0103] Meanwhile, in this embodiment, the external synchronization signal EXSYC is also input to the microcontroller 80 via the synchronization terminal TS. When the external synchronization signal EXSYC becomes active at E1 in FIG. 19, the interrupt controller 94 receives this signal, and interrupt processing begins via the signal SYCINT, as shown at E4. The detection data output at E3 is then imported into the microcontroller 80 via the digital interface 82 as detection data SDAT, as shown at E5. Next, digital signal processing begins by the signal processing circuit 92, as shown at E6. For example, filtering, such as moving average, is performed, followed by correction processing, such as temperature correction, to generate corrected detection data SDATC, as shown at E7. Digital signal processing is then completed, and a signal DRDY indicating that data is ready is output to the host device 210 via the terminal TR. The host device 210 then accesses the register unit 91 via the host interface 96, and detection data SDATQ is output to the host device 210, as shown at E9.

[0104] Similarly, when the external synchronization signal EXSYC goes active at the next synchronization timing t2 (as indicated by E11), detection data is captured from the detection circuit of each sensor device (as indicated by E12), and each sensor device outputs the detection data (as indicated by E13). Then, as indicated by E14, E15, E16, and E17, the microcontroller 80 performs interrupt processing and digital signal processing, and as indicated by E18 and E19, the signal DRDY is output and detection data SDATQ is output. Then, at the next synchronization timing t3 (as indicated by E21), the external synchronization signal EXSYC goes active, as indicated by E22 and E23, and each sensor device captures and outputs detection data (as indicated by E24), and the microcontroller 80 performs various processing. Similar processing occurs at E25, E26, E27, and E28 in Figure 19.

[0105] As described above, in this embodiment, as shown by E2, E12, E22, and E26, each of the multiple sensor devices acquires detection data from the detection circuit at the same synchronization timing based on the external synchronization signal EXSYC. This ensures that the detection data from the multiple sensor devices is acquired at the same synchronization timing. Taking a three-axis angular velocity sensor device as an example, it ensures that the X-axis angular velocity data, Y-axis angular velocity data, and Z-axis angular velocity data are acquired at the same synchronization timing. This means that when determining the posture information of a measurement target using the X-axis angular velocity data, Y-axis angular velocity data, and Z-axis angular velocity data, more appropriate and accurate posture information can be measured.

[0106] FIG. 20 shows an example configuration of a sensor device 20. The sensor device 20 (20X, 20Y) includes a sensor element 50 (50X, 50Y), a detection circuit 60 (60X, 60Y), a processing circuit 66, and an interface 70 (70X, 70Y). The detection circuit 60 includes an analog circuit 62 having an amplifier circuit 63 that amplifies the signal from the sensor element 50, and an A / D conversion circuit 64 that converts the analog signal from the analog circuit 62 into digital data. The processing circuit 66 includes a register 67. The interface 70 includes a parallel / serial conversion circuit 72, a serial / parallel conversion circuit 74, and a control circuit 76 that controls the interface. The digital interface 82 (83, 84) and host interface 96 of the microcontroller 80 have the same configuration as the interface 70.

[0107] The A / D conversion circuit 64 samples the analog detection signal from the analog circuit 62 based on a clock signal ADCK having a frequency f1 and performs A / D conversion. The detection data ADQ is output at an output sampling rate corresponding to the frequency f1. The register 67 then captures the detection data ADQ from the A / D conversion circuit 64 based on a synchronization signal SYC having a frequency f2. Specifically, as shown at E2, E12, E22, and E26 in FIG. 19, the register 67 latches and holds the detection data ADQ in synchronization with the synchronization signal SYC. If the A / D conversion resolution of the A / D conversion circuit 64 is k bits, the detection data ADQ is, for example, k-bit parallel data. The detection data ADQ held in the register 67 is then converted to serial data by a parallel-to-serial conversion circuit 72 in the interface 70 and output to the microcontroller 80 as a data output signal SDO. The serial data of the data input signal SDI from the microcontroller 80 is converted to parallel data by a serial-to-parallel conversion circuit 74.

[0108] Here, the frequency f2 of the synchronization signal SYC is, for example, 1 kHz or less, for example, about 100 Hz, which is sufficiently lower than the frequency f1 of the clock signal ADCK of the A / D conversion circuit 64. Therefore, from the detection data that is output in chronological order from the A / D conversion circuit 64 at the output sampling rate of frequency f1, the detection data that is properly synchronized based on the synchronization signal SYC can be latched and held in the register 67. As a result, even if a temporal fluctuation occurs in the timing of command issuance by the microcontroller 80 due to other interrupt processing, the detection data latched in the register 67 at the proper synchronized timing can be output as the data output signal SDO when the command is issued.

[0109] As described above, in this embodiment, the synchronization signal line LSY is electrically connected to the microcontroller 80, as shown in FIG. 18 . Specifically, the synchronization signal line LSY is electrically connected to the synchronization terminal TS of the microcontroller 80. By providing the synchronization terminal TS to which the synchronization signal line LSY is connected in this manner, the external synchronization signal EXSYC, which is the synchronization signal SYC, can be input not only to the sensor device 20 but also to the microcontroller 80. This allows the microcontroller 80 to execute a process of issuing a command to the sensor device 20 and a process of reading detection data from the sensor device 20, using the external synchronization signal EXSYC as a trigger.

[0110] Furthermore, in this embodiment, the microcontroller 80 includes an interrupt controller 94, to which the external synchronization signal EXSYC is input. In this manner, the microcontroller 80 can execute interrupt processing corresponding to the external synchronization signal EXSYC, using the external synchronization signal EXSYC as an interrupt cause. In other words, the microcontroller 80 can execute processing to issue commands to the sensor device 20 and processing to read detected data from the sensor device 20, using the external synchronization signal EXSYC as an interrupt request signal.

[0111] The microcontroller 80 also includes a processing circuit 90, which uses the external synchronization signal EXSYC as an interrupt trigger to issue commands to acquire the first detection data SD1 from the first sensor device 20X and the second detection data SD2 from the second sensor device 20Y. Specifically, the processing circuit 90 issues commands to read the first detection data SD1 and the second detection data SD2. This allows the processing circuit 90 to determine whether there are any other interrupt requests with higher priority, and if there are no such interrupt requests, it can issue commands to process the interrupt triggered by the external synchronization signal EXSYC. On the other hand, if there are any other interrupt requests with higher priority, it can process those interrupt requests before issuing commands to read the first detection data SD1 and the second detection data SD2. By processing high-priority interrupt requests in this manner, even if there is a time fluctuation in the command issuance timing, problems resulting from such time fluctuations do not occur because the detection data is acquired at the synchronized timing.

[0112] In this embodiment, the microcontroller 80 also includes a signal processing circuit 92 that performs digital signal processing on the first detection data SD1 from the first sensor device 20X and the second detection data SD2 from the second sensor device 20Y. The signal processing circuit 92 performs digital signal processing at each synchronization timing of the external synchronization signal EXSYC. For example, the digital signal processing includes filtering and correction. For example, when the external synchronization signal EXSYC becomes active as shown at E1 in FIG. 19 , the signal processing circuit 92 performs digital signal processing as shown at E6. Next, when the external synchronization signal EXSYC becomes active as shown at E11, the signal processing circuit 92 performs digital signal processing as shown at E16. That is, the signal processing circuit 92 performs digital signal processing at each synchronization timing of the external synchronization signal EXSYC shown at E1 and E11. In this manner, the signal processing circuit 92 can perform digital signal processing on the detection data acquired from the detection circuit 60 at the synchronization timing E1 at the timing E6 corresponding to the synchronization timing E1. Similarly, at the synchronization timing of E11, the signal processing circuit 92 can perform digital signal processing on the detection data acquired from the detection circuit 60 at the timing of E16, which corresponds to the synchronization timing of E11. Therefore, it becomes possible to perform digital signal processing on the detection data acquired at the appropriate synchronization timing at the timing corresponding to that synchronization timing.

[0113] In this embodiment, when multiple acceleration sensor devices are provided as shown in Figure 2, a common synchronization signal SYC is input to the multiple acceleration sensor devices. For example, in the method of the first comparative example described above, the timings at which the multiple acceleration data used to calculate the average value of the acceleration data are acquired are different, which causes a problem that an appropriate average value cannot be obtained. In this regard, according to this embodiment, when acceleration data about the same coordinate axis is detected using multiple acceleration sensor devices and the average value is calculated, the average value can be calculated using the multiple acceleration data acquired at the same synchronization timing using the synchronization signal SYC, making it possible to calculate an appropriate average value.

[0114] In this embodiment, when multiple angular velocity sensor devices are provided for the same coordinate axis as shown in Fig. 3, a common synchronization signal SYC is input to the multiple angular velocity sensor devices. In this way, when angular velocity data for the same coordinate axis is detected using the multiple angular velocity sensor devices and the average value is calculated, the average value can be calculated based on angular velocity data captured at the same synchronization timing by the synchronization signal SYC, making it possible to calculate an appropriate average value.

[0115] For example, the X-axis angular velocity data, Y-axis angular velocity data, and Z-axis angular velocity data shown in FIG. 4 are angular velocity data captured by the detection circuits of the angular velocity sensor devices at a common synchronization timing based on the synchronization signal SYC. The X-axis acceleration data, Y-axis acceleration data, and Z-axis acceleration data shown in FIG. 5 are acceleration data captured by the detection circuits of the acceleration sensor device 40 at a common synchronization timing based on the synchronization signal SYC. In FIG. 7, the X-axis acceleration data output by the first acceleration sensor device 40A during period TA1 and the X-axis acceleration data output by the second acceleration sensor device 40B during period TB1 are acceleration data captured by the detection circuits of the acceleration sensor devices at a common synchronization timing. The Y-axis acceleration data during period TA2 and the Y-axis acceleration data during period TB2 are also acceleration data captured at a common synchronization timing, and the Z-axis acceleration data during period TA3 and the Z-axis acceleration data during period TB3 are also acceleration data captured at a common synchronization timing. This common synchronization timing for capturing acceleration data is achieved by inputting a common synchronization signal SYC to the first acceleration sensor device 40A and the second acceleration sensor device 40B. This improves the accuracy of the average value when calculating the average of the X-axis acceleration data in period TA1 and the X-axis acceleration data in period TB1. Similarly, the accuracy of the average value when calculating the average of the Y-axis acceleration data in period TA2 and the Y-axis acceleration data in period TB2, or the average of the Z-axis acceleration data in period TA3 and the axial acceleration data in period TB3, can be improved.

[0116] 4. Measurement System FIG. 21 shows an example of the configuration of a measurement system 200 of this embodiment. The measurement system 200 includes a sensor module 10 and a host device 210 electrically connected to the sensor module 10. It can also include a GPS receiver 220, an antenna 222 for GPS reception, and an oscillator 230. In FIG. 21, the sensor module 10 is used as a six-axis inertial measurement unit (IMU). The host device 210 can be implemented by various processors such as an MPU. The host device 210 may also be implemented by an ASIC integrated circuit device. The host device 210 includes a DSP 212 (digital signal processor) that performs digital signal processing, and a clock signal generation circuit 213 that generates a clock signal.

[0117] The GPS receiver 220 receives signals from GPS satellites via the antenna 222. That is, it receives satellite signals with superimposed position information as GPS carrier waves. The GPS receiver 220 is a GPS receiver and can be implemented as an integrated circuit device including a GPS receiver circuit. The host device 210 detects GPS positioning data indicating the position, speed, and orientation of a measurement target, such as a moving object, based on the signals received by the GPS receiver 220. The position of the measurement target is represented by latitude, longitude, or altitude. This GPS positioning data also includes status data indicating the reception status and reception time. The host device 210 also receives acceleration data and angular velocity data from the sensor module 10 and performs inertial navigation calculations on these data to obtain inertial navigation positioning data. The inertial navigation positioning data includes acceleration data and attitude data of the measurement target. The host device 210 then calculates the position of the measurement target based on the obtained inertial navigation positioning data and GPS positioning data. If the object to be measured is a moving object such as an automobile, the position on the ground where the moving object is traveling is calculated. Note that such calculation processing of the position and orientation of the object to be measured can be realized by Kalman filter processing using the DSP212.

[0118] The oscillator 230 generates an oscillation clock signal using an oscillator such as a quartz crystal oscillator. The oscillator 230 is, for example, a temperature compensated oscillator (TCXO). Alternatively, an oven-controlled oscillator (OCXO) equipped with a thermostatic oven may be used as the oscillator 230. The clock signal generation circuit 213 generates various clock signals used in the host device 210 based on the oscillation clock signal from the oscillator 230. In this case, the clock signal generation circuit 213 generates the clock signal based on a time reference signal, which is a signal obtained from a satellite positioning system such as GPS. For example, the clock signal generation circuit 213 generates an external synchronization signal EXSYC as one of the clock signals.

[0119] The host device 210 can obtain accurate absolute time information based on the time information contained in the satellite signal received by the GPS receiver 220. The time information includes information such as the year, month, date, hour, minute, and second. The GPS receiver 220 outputs a PPS signal, which generates a pulse every second, as a time reference signal. The clock signal generation circuit 213 is configured with a PLL circuit that operates using an oscillation clock signal from the oscillator 230. The PPS signal is input to the PLL circuit as a reference signal for clock synchronization. The PLL circuit then generates a clock signal synchronized with the PPS signal, which is the time reference signal. In this way, the host device 210 outputs an external synchronization signal EXSYC synchronized with the time reference signal to the sensor module 10.

[0120] As described above, in this embodiment, the external synchronization signal EXSYC is a signal generated based on the time reference signal. This makes it possible to acquire detection data from the sensor device using the external synchronization signal EXSYC generated based on the time reference signal. In other words, by using the external synchronization signal EXSYC generated based on the time reference signal, it becomes possible to acquire detection data from the detection circuit of the sensor device at timing synchronized with accurate time. Therefore, detection data acquired at appropriate timing synchronized with accurate time can be output to the microcontroller 80, thereby improving the accuracy of information measured using the sensor module 10.

[0121] For example, the host device 210 can acquire accurate absolute time information by using satellite signals received by the GPS receiver 220. Therefore, the absolute time of each synchronization timing of the external synchronization signal EXSYC can also be determined. The sensor module 10 outputs detection data acquired at the synchronization timing of the external synchronization signal EXSYC. Furthermore, because the delay time between the acquisition of detection data by the sensor device and the input of that detection data to the host device 210 is a delay time due to digital processing, the host device 210 can determine the number of clocks representing the length of that delay time. Therefore, the host device 210 can determine the time at which the detection data, such as acceleration data and angular velocity data, input from the sensor module 10 was acquired. As described above, the host device 210 calculates the position, etc., of a measurement target based on GPS positioning data obtained based on satellite signals and inertial navigation positioning data obtained based on the detection data from the sensor module 10. Therefore, by determining the absolute time at which detection data, such as acceleration data and angular velocity data, is acquired, the host device 210 can accurately calculate the position, etc., of a measurement target.

[0122] In this embodiment, the time reference signal is, for example, a signal obtained from a satellite positioning system. For example, the time reference signal is a PPS signal obtained from the satellite positioning system. In this way, it is possible to obtain the time reference signal by effectively utilizing the satellite positioning system, and to obtain detection data from the sensor device using the external synchronization signal EXSYC generated based on the obtained time reference signal.

[0123] Although the above description has been given taking the case where the satellite positioning system is the Global Positioning System (GPS), other Global Navigation Satellite Systems (GNSS) may be used as the satellite positioning system. For example, one or more of satellite positioning systems such as the European Geostationary Navigation Overlay Service (EGNOS), the Quasi Zenith Satellite System (QZSS), the Global Navigation Satellite System (GLONASS), GALILEO, and the BeiDou Navigation Satellite System (BeiDou) may be used. Furthermore, at least one of the satellite positioning systems may be a Satellite Based Augmentation System (SBAS), such as the Wide Area Augmentation System (WAAS) or the European Geostationary Satellite Navigation Overlay Service (EGNOS). Furthermore, the time reference signal is not limited to a signal obtained from a satellite positioning system. For example, the time reference signal may be generated using a high-precision oscillator such as an atomic oscillator, or may be generated by acquiring absolute time via a network.

[0124] 5.Specific examples of sensor modules Fig. 22 is an exploded perspective view showing a specific example of the sensor module 10. The sensor module 10 in Fig. 22 includes a circuit board 100, an inner case 120, an annular cushioning material 130, and an outer case 140, which constitute a sensor unit. The sensor module 10 is configured such that the circuit board 100 is mounted inside the outer case 140, with the annular cushioning material 130 interposed therebetween. Sensor devices such as an angular velocity sensor device and an acceleration sensor device are mounted on the circuit board 100.

[0125] The sensor module 10 has a rectangular parallelepiped shape in plan view, and screw holes 142 and 144 are formed near two diagonal vertices of the rectangle as fixing portions. Two screws are passed through these screw holes 142 and 144 to fix the sensor module 10 to the mounting surface of a measurement target, such as a vehicle, when used. An opening 122 is formed on the surface of the sensor module 10 when viewed from above. A plug-type connector 110 is disposed inside the opening 122. The connector 110 has multiple pins arranged in an array. A socket-type connector is connected to this connector 110 to supply power to the sensor module 10 and transmit and receive electrical signals, such as outputting detection data detected by the sensor module 10. The outer case 140 is a base machined into a box shape from aluminum, for example. The outer shape of the outer case 140 is a rectangular parallelepiped shape in plan view, similar to the overall shape of the sensor module 10 described above. However, the planar shape of the outer shape of outer case 140 may be a polygon, such as a hexagon or octagon, and the corners of the vertices of the polygon may be chamfered, each side may be curved, or the outer shape may be circular.

[0126] 22, a recess 121 is provided on the bottom side of inner case 120. A sensor device group including an angular velocity sensor device and an acceleration sensor device is arranged in a region overlapping with recess 121 in a plan view seen from the thickness direction of circuit board 100 (plan view in the negative direction of the Z axis). A filling material is then filled into the space formed by circuit board 100 and recess 121 and solidified. As a result, part or all of circuit board 100 and the sensor device group are covered with the filling material, making it possible to, for example, shift the resonance frequency so as to be out of the band of external noise vibrations.

[0127] 6. Angular velocity sensor device FIG. 23 shows a detailed configuration example of the angular velocity sensor device 30. The angular velocity sensor device 30 includes a vibrator 56, a drive circuit 58, a detection circuit 60, a processing circuit 66, and an interface 70. The drive circuit 58 may include an amplifier circuit that receives a feedback signal DG from the vibrator 56 and amplifies the signal, an AGC circuit that performs automatic gain control, and an output circuit that outputs a drive signal DS to the vibrator 56. For example, the AGC circuit automatically adjusts the gain so that the amplitude of the feedback signal DG from the vibrator 56 remains constant. The output circuit outputs a square-wave drive signal DS to the vibrator 56. The detection circuit 60 may include an amplifier circuit, a synchronous detection circuit, an A / D conversion circuit, and the like. The amplifier circuit receives detection signals S1 and S2 from the vibrator 56 and performs charge-to-voltage conversion and signal amplification of the detection signals S1 and S2, which are differential signals. The synchronous detection circuit uses the synchronization signal from the drive circuit 58 to perform synchronous detection to extract a desired wave. The A / D conversion circuit converts the analog detection signal after synchronous detection into digital detection data and outputs it to the processing circuit 66. The processing circuit 66 performs various processes on the detection data, such as zero-point correction, sensitivity adjustment, filter processing, and temperature correction, and outputs the processed detection data to the interface 70.

[0128] In FIG. 23 , a vibrator with a double-T structure is used as vibrator 56. Alternatively, a tuning-fork or H-shaped vibrator may be used as vibrator 56. Vibrator 56 includes drive arms 38A, 38B, 38C, and 38D, detection arms 39A and 39B, a base 31, and connecting arms 32A and 32B. Detection arms 39A and 39B extend from rectangular base 31 in the +y-axis direction and the -y-axis direction. Connecting arms 32A and 32B extend from base 31 in the +x-axis direction and the -x-axis direction. Drive arms 38A and 38B extend from the tip of connecting arm 32A in the +y-axis direction and the -y-axis direction, respectively. Drive arms 38C and 38D extend from the tip of connecting arm 32B in the +y-axis direction and the -y-axis direction. Plumbs for adjusting the frequency are provided on the tip sides of drive arms 38A, 38B, 38C, and 38D and detection arms 39A and 39B. If the z-axis is the thickness direction of oscillator 56, oscillator 56 detects angular velocity around the z-axis.

[0129] Drive electrodes 33 are formed on the upper and lower surfaces of drive arms 38A and 38B, and drive electrodes 34 are formed on the right and left sides of drive arms 38A and 38B. Drive electrodes 34 are formed on the upper and lower surfaces of drive arms 38C and 38D, and drive electrodes 33 are formed on the right and left sides of drive arms 38C and 38D. A drive signal DS from drive circuit 58 is supplied to drive electrode 33, and a feedback signal DG from drive electrode 34 is input to drive circuit 58. A detection electrode 35 is formed on the upper and lower surfaces of detection arm 39A, and ground electrodes 37 are formed on the right and left sides of detection arm 39A. A detection electrode 36 is formed on the upper and lower surfaces of detection arm 39B, and ground electrodes 37 are formed on the right and left sides of detection arm 39B. Detection signals S1 and S2 from detection electrodes 35 and 36 are input to detection circuit 60.

[0130] Next, the operation of the angular velocity sensor device 30 will be described. When the drive circuit 58 applies a drive signal DS to the drive electrode 33, the drive arms 38A, 38B, 38C, and 38D undergo flexural vibration as indicated by arrow C1 in FIG. 23 due to the inverse piezoelectric effect. For example, the vibration modes indicated by the solid arrows and the dotted arrows are repeated at a predetermined frequency. That is, the tips of the drive arms 38A and 38C repeatedly approach and separate from each other, and the tips of the drive arms 38B and 38D also undergo flexural vibration in which they repeatedly approach and separate from each other. At this time, the drive arms 38A and 38B and the drive arms 38C and 38D vibrate symmetrically with respect to the x-axis passing through the center of gravity of the base 31. Therefore, the base 31, the connecting arms 32A and 32B, and the detection arms 39A and 39B hardly vibrate.

[0131] In this state, when an angular velocity about the z-axis is applied to oscillator 56, Coriolis force causes drive arms 38A, 38B, 38C, and 38D to vibrate as indicated by arrow C2. That is, a Coriolis force acting in the direction of arrow C2, which is perpendicular to the directions of arrows C1 and the z-axis, acts on drive arms 38A, 38B, 38C, and 38D, generating a vibration component in the direction of arrow C2. This vibration in the direction of arrow C2 is transmitted to base 31 via connecting arms 32A and 32B, causing detection arms 39A and 39B to flexurally vibrate in the direction of arrow C3. Charge signals generated by the piezoelectric effect due to the flexural vibration of detection arms 39A and 39B are input to detection circuit 60 as detection signals S1 and S2, allowing angular velocity about the z-axis to be detected.

[0132] 7. Accelerometer device FIG. 24 shows a configuration example of an acceleration sensor element 600 provided in the acceleration sensor device 40. The acceleration sensor element 600 is a sensor element used to detect acceleration in the X-axis or Y-axis direction, which is the detection axis direction of the sensor module 10. In FIG. 24, the acceleration sensor element 600 can detect acceleration Ax in the x-axis direction, which is the detection axis direction. The acceleration sensor element 600 has a base 602 and an element unit 603 provided on the base 602 and detecting acceleration Ax. The element unit 603 has a fixed electrode unit 640 attached to the base 602, a movable unit 652 displaceable in the x-axis direction (first direction), which is the detection axis direction of the acceleration sensor element 600, relative to the base 602, and a movable electrode unit 660 provided on the movable unit 652. The fixed electrode unit 640 also has a first fixed electrode unit 641 and a second fixed electrode unit 642 arranged side by side along the y-axis direction (second direction). First fixed electrode portion 641 has a first trunk portion 643 and a plurality of first fixed electrode fingers 644 provided on both sides of first trunk portion 643 in the y-axis direction and with their longitudinal directions aligned with the y-axis direction. Second fixed electrode portion 642 has a second trunk portion 645 and a plurality of second fixed electrode fingers 646 provided on both sides of second trunk portion 645 in the y-axis direction and with their longitudinal directions aligned with the y-axis direction. Furthermore, movable electrode portion 660 has first movable electrode portion 661 and second movable electrode portion 662 arranged side by side along the y-axis direction. At least a portion of first movable electrode portion 661 has a plurality of first movable electrode fingers 664 located on both sides of first trunk portion 643 in the y-axis direction and with their longitudinal directions aligned with the y-axis direction and facing first fixed electrode fingers 644 in the x-axis direction. Furthermore, at least a portion of second movable electrode portion 662 has a plurality of second movable electrode fingers 666 that are positioned on both sides of second trunk portion 645 in the y-axis direction, and whose longitudinal directions run along the y-axis direction, facing second fixed electrode finger 646 in the x-axis direction. With this configuration, first and second fixed electrode fingers 644, 646 and first and second movable electrode fingers 664, 666 can be shortened while maintaining a sufficiently large capacitance between first movable electrode finger 664 and first fixed electrode finger 644 and between second movable electrode finger 666 and second fixed electrode finger 646.Therefore, the first and second fixed electrode fingers 644, 646 and the first and second movable electrode fingers 664, 666 are less likely to be damaged, and the acceleration sensor element 600 has excellent impact resistance.

[0133] The acceleration sensor element 600 has a structure that is symmetrical with respect to the line LA in FIG. 24. The first trunk portion 643 is oriented along the line LA1, and the second trunk portion 645 is oriented along the line LA2. The first fixed electrode portion 641 and the second fixed electrode portion 642 are electrically connected to pads 674 and 675 via wiring 671 and 672, respectively. The movable electrode portion 660 is electrically connected to a pad 676 via a movable portion support portion 651 and wiring 673. In the acceleration sensor device 40, the acceleration sensor element 600 in FIG. 24 is disposed as a sensor element for detecting X-axis acceleration, with the x-axis direction aligned with the X-axis. In the acceleration sensor device 40, the acceleration sensor element 600 is disposed as a sensor element for detecting Y-axis acceleration, with the x-axis direction aligned with the Y-axis.

[0134] 25 shows a configuration example of an acceleration sensor element 700 for detecting Z-axis acceleration provided in the acceleration sensor device 40. The acceleration sensor element 700 can detect acceleration in the z-axis direction in FIG. 25, which is its detection axis. The acceleration sensor element 700 includes a movable body 720 supported by a support portion 730. The movable body 720 includes a first movable portion 720a located on one side of the support axis Q (the -x-axis direction side) in a plan view, and a second movable portion 720b located on the other side of the support axis Q (the +x-axis direction side) in a plan view.

[0135] When vertical acceleration such as gravitational acceleration is applied to the movable body 720, a rotational moment is generated in each of the first movable part 720a and the second movable part 720b. If the rotational moment of the first movable part 720a (e.g., counterclockwise rotational moment) and the rotational moment of the second movable part 720b (e.g., clockwise rotational moment) are balanced, the tilt of the movable body 720 does not change, and acceleration cannot be detected. Therefore, the movable body 720 is configured so that, when vertical acceleration is applied, the rotational moments of the first movable part 720a and the second movable part 720b are not balanced, causing a predetermined tilt in the movable body 720. In this acceleration sensor element 700, the support axis Q is positioned away from the center of gravity of the movable body 720, so that the first movable part 720a and the second movable part 720b have different masses. That is, the movable body 720 has different masses on the first movable part 720a side and the second movable part 720b side, with the support axis Q as the boundary. In the illustrated example, the distance from the support axis Q to the end face 723 of the first movable part 720a is greater than the distance from the support axis Q to the end face 724 of the second movable part 720b. The thickness of the first movable part 720a is equal to the thickness of the second movable part 720b. Therefore, the mass of the first movable part 720a is greater than the mass of the second movable part 720b. Since the first movable part 720a and the second movable part 720b have different masses, the rotational moment of the first movable part 720a and the rotational moment of the second movable part 720b can be prevented from being balanced when vertical acceleration is applied. Therefore, a predetermined tilt can be generated in the movable body 720 when vertical acceleration is applied.

[0136] The movable body 720 is provided at a distance from the substrate 710. The movable body 720 is provided above the recess 711. A gap is provided between the movable body 720 and the substrate 710. This allows the movable body 720 to oscillate. The movable body 720 has a first movable electrode 721 and a second movable electrode 722 provided on opposite sides of the support axis Q. The first movable electrode 721 is provided on the first movable portion 720a, and the second movable electrode 722 is provided on the second movable portion 720b. The first movable electrode 721 is a portion of the movable body 720 that overlaps with the first fixed electrode 750 in a planar view. The first movable electrode 721 forms a capacitance CB1 between itself and the first fixed electrode 750. The second movable electrode 722 is a portion of the movable body 720 that overlaps with the second fixed electrode 752 in a planar view. The second movable electrode 722 forms a capacitance CB2 with the second fixed electrode 752. In this acceleration sensor element 700, the movable body 720 is made of a conductive material such as silicon doped with impurities, and is provided with first and second movable electrodes 721, 722. That is, the first movable part 720a functions as the first movable electrode 721, and the second movable part 720b functions as the second movable electrode 722.

[0137] The capacitances CB1 and CB2 are configured to be equal when the movable body 720 is horizontal, for example. The positions of the first and second movable electrodes 721 and 722 change in response to the movement of the movable body 720. The capacitances CB1 and CB2 change in response to the positions of the first and second movable electrodes 721 and 722. A predetermined potential is applied to the movable body 720 via the support 730. The movable body 720 is also formed with a through-hole 725 penetrating the movable body 720. This reduces the influence of air when the movable body 720 oscillates. The movable body 720 is also formed with an opening 726 penetrating the movable body 720. The support 730 is provided on the substrate 710. The support 730 is positioned in the opening 726 and supports the movable body 720. The first fixed electrode 750 and the second fixed electrode 752 are electrically connected to pads 774 and 775 via wiring 771 and 772, respectively. The movable body 720 is electrically connected to a pad 776 via a wiring 773 .

[0138] 8.Electronic equipment 26 is a block diagram showing an example of the configuration of an electronic device 300 according to this embodiment. The electronic device 300 includes the sensor module 10 according to this embodiment and a processing unit 320 that performs processing based on an output signal from the sensor module 10. The electronic device 300 may also include a communication unit 310, an operation unit 330, a display unit 340, a storage unit 350, and an antenna 312.

[0139] The communication unit 310 is, for example, a wireless circuit, and receives and transmits data from and to the outside via the antenna 312. The processing unit 320 controls the electronic device 300 and performs various digital processes on data transmitted and received via the communication unit 310. The processing unit 320 also performs processing based on the output signal from the sensor module 10. Specifically, the processing unit 320 performs signal processing such as correction and filtering on output signals (output data) such as detection data from the sensor module 10, or performs various control processes for the electronic device 300 based on the output signals. The functions of the processing unit 320 can be realized by a processor such as an MPU or CPU. The operation unit 330 allows a user to perform input operations and can be realized by operation buttons, a touch panel display, or the like. The display unit 340 displays various information and can be realized by a display such as a liquid crystal display or organic electroluminescence display. The memory unit 350 stores data, and its function can be realized by semiconductor memory such as RAM or ROM.

[0140] The electronic device 300 of this embodiment can be applied to, for example, video-related devices such as digital still cameras or video cameras, in-vehicle devices, wearable devices such as head-mounted displays and watch-related devices, inkjet discharge devices, robots, personal computers, personal digital assistants, printing devices, and projectors. Examples of in-vehicle devices include car navigation systems and autonomous driving devices. Examples of watch-related devices include watches and smartwatches. Examples of inkjet discharge devices include inkjet printers. Examples of personal digital assistants include smartphones, mobile phones, portable game consoles, notebook PCs, and tablet devices. The electronic device 300 of this embodiment can also be applied to electronic organizers, electronic dictionaries, calculators, word processors, workstations, videophones, security TV monitors, electronic binoculars, POS terminals, medical devices, fish finders, measuring instruments, mobile terminal base station devices, instruments, flight simulators, network servers, and the like. Examples of medical devices include electronic thermometers, blood pressure monitors, blood glucose meters, electrocardiogram measuring devices, ultrasound diagnostic devices, and electronic endoscopes. The instruments are those used in vehicles, aircraft, ships, etc.

[0141] Fig. 27 is a plan view showing a wristwatch-type activity meter 400 that is a portable electronic device, and Fig. 28 is a block diagram showing an example configuration of activity meter 400. Activity meter 400 is worn on a part of the body such as the user's wrist by means of a band 401. Activity meter 400, which is an active tracker, has a digital display unit 402 and is capable of wireless communication via Bluetooth (registered trademark), Wi-Fi (registered trademark), etc.

[0142] As shown in FIGS. 27 and 28 , the activity meter 400 includes a case 403 that houses the sensor module 10 of this embodiment, a processing unit 410 that is housed in the case 403 and performs processing based on an output signal from the sensor module 10, a display unit 402 housed in the case 403, and a light-transmitting cover 404 that covers the opening of the case 403. A bezel 405 is provided on the outside of the light-transmitting cover 404, and a plurality of operation buttons 406 and 407 are provided on the side of the case 403. The sensor module 10 is provided with an acceleration sensor 414 that detects acceleration along three axes and an angular velocity sensor 415 that detects angular velocity along three axes as sensor devices. The sensor module 10 may also be provided with a geomagnetic sensor 412, a pressure sensor 413, a pulse sensor 416, a temperature sensor 417, or the like as sensor devices.

[0143] The display unit 402 displays, depending on various detection modes, location information and movement amount obtained using a GPS sensor 411 and a geomagnetic sensor 412, exercise information such as exercise amount obtained using an acceleration sensor 414 and an angular velocity sensor 415, biological information such as pulse rate obtained using a pulse sensor 416, and time information such as the current time. It can also display the ambient temperature obtained using a temperature sensor 417. The communication unit 422 communicates with an information terminal such as a user terminal. The processing unit 410, which is a processor, is realized by an MPU, a DSP, an ASIC, etc. The processing unit 410 executes various processes based on programs stored in the storage unit 420 and information input via an operation unit 418 such as operation buttons 406 and 407. The processing units 410 execute processes based on output signals from the GPS sensor 411, the geomagnetic sensor 412, the pressure sensor 413, the acceleration sensor 414, the angular velocity sensor 415, the pulse sensor 416, the temperature sensor 417, and the timer unit 419. The processing unit 410 can also perform display processing to display an image on the display unit 402, sound output processing to output sound from the sound output unit 421, communication processing to communicate with an information terminal via the communication unit 422, and power control processing to supply power from the battery 423 to each unit.

[0144] The activity meter 400 of this embodiment configured as described above can enjoy the effects of the sensor module 10 described above and exhibits high reliability. The activity meter 400 also includes a GPS sensor 411, which can measure the user's movement distance and movement trajectory, resulting in a highly convenient activity meter 400. The activity meter 400 can be widely applied to running watches, runner's watches, outdoor watches, GPS watches equipped with a GPS, and the like.

[0145] 9. Mobile FIG. 29 shows an example of a mobile object 500 in which the sensor module 10 of this embodiment can be used. FIG. 30 is a block diagram showing an example of the configuration of the mobile object 500. As shown in FIG. 29, the mobile object 500 has a body 502 and wheels 504. The mobile object 500 is equipped with a positioning device 510 and has a control device 570 therein that performs vehicle control and the like. As shown in FIG. 30, the mobile object 500 has a drive mechanism 580 such as an engine or a motor, a braking mechanism 582 such as a disc brake or a drum brake, and a steering mechanism 584 realized by a handlebar or a steering gearbox. Thus, the mobile object 500 is equipped with the drive mechanism 580, the braking mechanism 582, and the steering mechanism 584, and is a device or apparatus that moves on land, in the air, or on the sea. The mobile object 500 may be an automobile such as a four-wheeled automobile or a motorcycle, a bicycle, a train, an airplane, or a ship, but the present embodiment will be described using a four-wheeled automobile as an example.

[0146] The positioning device 510 is attached to a moving object 500 and performs positioning of the moving object 500. The positioning device 510 includes a sensor module 10, a GPS receiver 520, a GPS receiving antenna 522, and a host device 530. The host device 530 includes a position information acquisition unit 532, a position synthesis unit 534, a calculation processing unit 536, and a processing unit 538. The sensor module 10, which is an IMU, has a triaxial acceleration sensor and a triaxial angular velocity sensor. The calculation processing unit 536 receives acceleration data and angular velocity data from the acceleration sensor and angular velocity sensor, performs inertial navigation calculation processing on this data, and outputs inertial navigation positioning data. The inertial navigation positioning data is data representing the acceleration and attitude of the moving object 500.

[0147] The GPS receiver 520 receives signals from GPS satellites via the antenna 522. The position information acquisition unit 532 outputs GPS positioning data representing the position, speed, and direction of the mobile object 500 equipped with the positioning device 510, based on the signals received by the GPS receiver 520. The position synthesis unit 534 calculates the position on the ground at which the mobile object 500 is traveling, based on the inertial navigation positioning data output from the calculation processing unit 536 and the GPS positioning data output from the position information acquisition unit 532. For example, even if the position of the mobile object 500 included in the GPS positioning data is the same, if the attitude of the mobile object 500 is different due to the influence of the inclination (θ) of the ground, as shown in FIG. 29, the mobile object 500 will be traveling at a different position on the ground. Therefore, the accurate position of the mobile object 500 cannot be calculated using only the GPS positioning data. Therefore, the position synthesis unit 534 calculates the position on the ground at which the mobile body 500 is traveling, using data relating to the attitude of the mobile body 500, among the inertial navigation positioning data. The position data output from the position synthesis unit 534 is subjected to predetermined processing by the processing unit 538, and is displayed as a positioning result on the display unit 550. The position data may also be transmitted to an external device by the communication unit 560.

[0148] The control device 570 controls a drive mechanism 580, a braking mechanism 582, and a steering mechanism 584 of the moving body 500. The control device 570 is a controller for vehicle control, and can be realized by, for example, a plurality of control units. The control device 570 has a vehicle control unit 572 which is a control unit for controlling the vehicle, an automatic driving control unit 574 which is a control unit for controlling the automatic driving, and a storage unit 576 which is realized by a semiconductor memory or the like. The monitoring device 578 is a device that monitors objects such as obstacles around the moving body 500, and is realized by a periphery monitoring camera, millimeter wave radar, sonar, or the like.

[0149] As shown in FIG. 30 , the mobile body 500 of this embodiment includes a sensor module 10 and a control device 570. The control device 570 controls the attitude of the mobile body 500 based on information about the attitude of the mobile body 500 obtained by processing based on the output signal of the sensor module 10. For example, the host device 530 performs various processes as described above based on the output signal including detection data from the sensor module 10 to obtain information about the position and attitude of the mobile body 500. For example, the position information of the mobile body 500 can be obtained based on the GPS positioning data and the inertial navigation positioning data as described above. The attitude information of the mobile body 500 can be obtained based on, for example, angular velocity data included in the inertial navigation positioning data. The attitude information of the mobile body 500 is information about the rotational motion of, for example, rolling, pitching, and yawing, and can be expressed by a roll angle, pitch angle, yaw angle, etc. The control device 570 controls the attitude of the mobile body 500 based on the information about the attitude of the mobile body 500 obtained by processing by the host device 530, for example. This control is performed by, for example, the vehicle control unit 572. This attitude control can be achieved, for example, by the control device 570 controlling the steering mechanism 584. Alternatively, in control for stabilizing the attitude of the moving body 500, such as slip control, the control device 570 may control the drive mechanism 580 or the braking mechanism 582. According to this embodiment, attitude information obtained from the output signal of the sensor module 10 can be obtained with high accuracy, thereby achieving appropriate attitude control of the moving body 500.

[0150] In this embodiment, the control device 570 controls at least one of acceleration, braking, and steering of the mobile object 500 based on information about the position and attitude of the mobile object 500 obtained by processing based on the output signal of the sensor module 10. For example, the control device 570 controls at least one of the drive mechanism 580, the braking mechanism 582, and the steering mechanism 584 based on the information about the position and attitude of the mobile object 500. This allows, for example, automatic driving control of the mobile object 500 by the automatic driving control unit 574 to be realized. In this automatic driving control, in addition to the information about the position and attitude of the mobile object 500, monitoring results of surrounding objects by the monitoring device 578, map information and driving route information stored in the memory unit 576, and the like are used. The control device 570 then switches whether to perform automatic driving of the mobile object 500 based on the monitoring results of the output signal of the sensor module 10. For example, the host device 530 monitors output signals such as detection data from the sensor module 10. Then, for example, if a decrease in the detection accuracy or a sensing abnormality of the sensor module 10 is detected based on the monitoring results, the control device 570 switches from performing autonomous driving to not performing autonomous driving. For example, in autonomous driving, at least one of acceleration, braking, and steering of the mobile object 500 is automatically controlled. On the other hand, in not performing autonomous driving, such automatic control of acceleration, braking, and steering is not performed. This enables more reliable assistance for the traveling of the mobile object 500 performing autonomous driving. The automation level of autonomous driving may be switched based on the monitoring results of the output signal of the sensor module 10.

[0151] Although the present embodiment has been described in detail above, those skilled in the art will readily understand that many modifications are possible without substantially departing from the novel features and advantages of the present invention. Therefore, all such modifications are intended to be within the scope of the present invention. For example, a term described at least once in the specification or drawings with a different term having a broader or equivalent meaning may be replaced with that different term anywhere in the specification or drawings. Furthermore, all combinations of the present embodiment and modifications are also within the scope of the present invention. Furthermore, the configurations and operations of the sensor module, sensor device, angular velocity sensor device, acceleration sensor device, microcontroller, measurement system, electronic device, and mobile object are not limited to those described in the present embodiment, and various modifications are possible. [Explanation of symbols]

[0152] BS...digital interface bus, BS1...first digital interface bus, BS2: Second digital interface bus, EXSYC: External sync signal, SYC...synchronization signal, SD1...first detection data, SD2...second detection data, TS...synchronization terminal, TS1...first synchronization terminal, TS2...second synchronization terminal, LSY...synchronization signal line, SF1...first surface, SF2...second surface, SE1...first side surface, SE2...second side surface, SE3...3rd side, SE4...4th side, RG1...1st area, RG2...2nd area, 10...sensor module, 20...sensor device, 20X...first sensor device, 20Y...second sensor device, 30...angular velocity sensor device, 30X...X-axis angular velocity sensor device, 30XB...second X-axis angular velocity sensor device, 30Y...Y-axis angular velocity sensor device, 30YB...second Y-axis angular velocity sensor device, 30Z...Z-axis angular velocity sensor device, 30ZB...second Z-axis angular velocity sensor device, 31...base, 32A, 32B...connecting arms, 33, 34...drive electrodes, 35, 36...detection electrodes, 37...ground electrode, 38A, 38B, 38C, 38D...drive arms, 39A, 39B...detection arms, 40...acceleration sensor device, 40A...first acceleration sensor device, 40B...second acceleration sensor device, 50...sensor element, 50X...first sensor element, 50Y...second sensor element, 56... vibrator, 58... drive circuit, 60... detection circuit, 60X...first detection circuit, 60Y...second detection circuit, 62...analog circuit, 63...amplification circuit, 64...A / D conversion circuit, 66...processing circuit, 67...register, 70...interface, 70X...first interface, 70Y...second interface, 72...Parallel / serial conversion circuit, 74...Serial / parallel conversion circuit, 76...control circuit, 80...microcontroller, 82...digital interface, 83...first digital interface, 84...second digital interface, 88...synchronization signal output circuit, 90...processing circuit, 91...register unit, 92...signal processing circuit, 94...interrupt controller, 96...host interface, 100...circuit board, 110...connector, 120...inner case, 122...opening, 130...cushioning material, 140...outer case, 142, 144...screw holes, 150...temperature sensor, 200... measurement system, 210... host device, 213... clock signal generation circuit, 220...GPS receiver unit, 222...antenna, 230...oscillator, 300...electronic device, 310...communication unit, 312...antenna, 320...processing unit, 330...operation unit, 340...display unit, 350...storage unit, 400...activity meter, 401...band, 402...display unit, 403...case, 404...translucent cover, 405...bezel, 406, 407...operation buttons, 410...processing section, 411...GPS sensor, 412...geomagnetic sensor, 413...pressure sensor, 414...acceleration sensor, 415...angular velocity sensor, 416...pulse sensor, 417...temperature sensor, 418...operation unit, 419...timekeeping unit, 420...storage unit, 421...sound output unit, 422...communication unit, 423...battery, 500...mobile body, 502... vehicle body, 504... vehicle, 510... positioning device, 520... GPS receiving unit, 522...antenna, 530...host device, 532...location information acquisition unit, 534: position synthesis unit, 536: calculation processing unit, 538: processing unit, 550: display unit, 560... communication unit, 570... control device, 572... vehicle control unit, 574... automatic driving control unit, 576...Memory unit, 578...Monitoring device, 580...Drive mechanism, 582...Braking mechanism, 584...Steering mechanism

Claims

1. A circuit board; an X-axis angular velocity sensor device and a second X-axis angular velocity sensor device mounted on the circuit board so that their respective detection axes are aligned along the X-axis direction; a Y-axis angular velocity sensor device and a second Y-axis angular velocity sensor device mounted on the circuit board such that their respective detection axes are aligned along the Y-axis direction; a Z-axis angular velocity sensor device and a second Z-axis angular velocity sensor device mounted on the circuit board such that their respective detection axes are aligned along the Z-axis direction; a microcontroller that receives as input data of angular velocities around the X-axis detected by the X-axis angular velocity sensor device and the second X-axis angular velocity sensor device, calculates and outputs X-axis angular velocity data by averaging the data; receives as input data of angular velocities around the Y-axis detected by the Y-axis angular velocity sensor device and the second Y-axis angular velocity sensor device, calculates and outputs Y-axis angular velocity data by averaging the data; and receives as input data of angular velocities around the Z-axis detected by the Z-axis angular velocity sensor device and the second Z-axis angular velocity sensor device, calculates and outputs Z-axis angular velocity data by averaging the data; Including, the circuit board has a first side surface whose normal direction is the X-axis direction, a second side surface whose normal direction is the Y-axis direction, and a third side surface that is located on the circuit board opposite to the first side surface, the X-axis angular velocity sensor device and the second X-axis angular velocity sensor device are mounted on the first side surface of the circuit board such that their mounting surfaces are perpendicular to the X-axis direction; the Y-axis angular velocity sensor device and the second Y-axis angular velocity sensor device are mounted on the second side surface of the circuit board so that their mounting surfaces are perpendicular to the Y-axis direction; the circuit board has a first surface and a second surface that are opposite surfaces to each other; When an area defined by a center line between the first side surface and the third side surface in a plan view is defined as a first area on the side of the first side surface and a second area on the side of the third side surface, the X-axis angular velocity sensor device, the Y-axis angular velocity sensor device, and the Z-axis angular velocity sensor device are disposed in the first area on the first surface, and the microcontroller is disposed in an area on the second surface corresponding to the second area, The sensor module is characterized in that the microcontroller performs temperature correction processing on angular velocity data based on a temperature detection result of a temperature sensor arranged in the first area.

2. In claim 1, terminals on the first surface side of the X-axis angular velocity sensor device and the second X-axis angular velocity sensor device are connected to signal lines or power supply lines formed on the first surface, and terminals on the second surface side of the X-axis angular velocity sensor device and the second X-axis angular velocity sensor device are connected to signal lines or power supply lines formed on the second surface, A sensor module characterized in that the terminals on the first surface side of the Y-axis angular velocity sensor device and the second Y-axis angular velocity sensor device are connected to signal lines or power supply lines formed on the first surface, and the terminals on the second surface side of the Y-axis angular velocity sensor device and the second Y-axis angular velocity sensor device are connected to signal lines or power supply lines formed on the second surface.

3. In claim 1, the X-axis angular velocity sensor device and the second X-axis angular velocity sensor device are arranged side by side on the first side surface, The sensor module is characterized in that the Y-axis angular velocity sensor device and the second Y-axis angular velocity sensor device are arranged side by side on the second side surface.

4. In claim 1, the X-axis angular velocity sensor device includes a first analog circuit that processes an angular velocity detection signal about the X-axis, and a first A / D conversion circuit that converts a first analog signal from the first analog circuit into first digital data; the second X-axis angular velocity sensor device includes a second analog circuit that processes an angular velocity detection signal about the X-axis, and a second A / D conversion circuit that converts a second analog signal from the second analog circuit into second digital data; the Y-axis angular velocity sensor device includes a third analog circuit that processes an angular velocity detection signal about the Y-axis, and a third A / D conversion circuit that converts a third analog signal from the third analog circuit into third digital data; the second Y-axis angular velocity sensor device includes a fourth analog circuit that processes an angular velocity detection signal about the Y-axis, and a fourth A / D conversion circuit that converts a fourth analog signal from the fourth analog circuit into fourth digital data; the Z-axis angular velocity sensor device includes a fifth analog circuit that processes an angular velocity detection signal about the Z-axis, and a fifth A / D conversion circuit that converts a fifth analog signal from the fifth analog circuit into fifth digital data; the second Z-axis angular velocity sensor device includes a sixth analog circuit that processes an angular velocity detection signal about the Z-axis, and a sixth A / D conversion circuit that converts a sixth analog signal from the sixth analog circuit into sixth digital data; The microcontroller receives the first digital data from the X-axis angular velocity sensor device via a digital interface bus; the second digital data is input to the microcontroller from the second X-axis angular velocity sensor device via the digital interface bus; the microcontroller receives the third digital data from the Y-axis angular velocity sensor device via the digital interface bus; the fourth digital data is input to the microcontroller from the second Y-axis angular velocity sensor device via the digital interface bus; the fifth digital data is input to the microcontroller from the Z-axis angular velocity sensor device via the digital interface bus; The sixth digital data is input to the microcontroller from the second Z-axis angular velocity sensor device via the digital interface bus.

5. In claim 1, the Z-axis angular velocity sensor device is mounted on the first surface of the circuit board; The sensor module, wherein the second Z-axis angular velocity sensor device is mounted on the second surface of the circuit board.

6. In claim 1, Further provided with a connector for transmitting and receiving electrical signals; The sensor module, characterized in that the connector is mounted on the first surface of the circuit board.

7. In any one of claims 1 to 6, a case that houses the circuit board, the X-axis angular velocity sensor device and the second X-axis angular velocity sensor device, the Y-axis angular velocity sensor device and the second Y-axis angular velocity sensor device, and the Z-axis angular velocity sensor device and the second Z-axis angular velocity sensor device.

8. A sensor module according to any one of claims 1 to 7; a host device electrically connected to the sensor module; A measurement system comprising:

9. A sensor module according to any one of claims 1 to 7; a processing unit that performs processing based on the output signal of the sensor module; 1. An electronic device comprising:

10. A sensor module according to any one of claims 1 to 7; a control device that controls the attitude of the moving body based on information about the attitude of the moving body obtained by processing based on the output signal of the sensor module; A moving object comprising:

11. A sensor module according to any one of claims 1 to 7; a control device that controls at least one of acceleration, braking, and steering of the moving body based on information about the position and attitude of the moving body obtained by processing the output signal of the sensor module; Including, The control device A mobile body characterized in that the implementation or non-implementation of automatic driving of the mobile body is switched based on the monitoring results of the output signal of the sensor module.

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