Display device with function of displaying laser processing status and processing control device including the same

Abstract

The present invention is a display device provided with a function for displaying a laser machining state based on the energy density per unit machining length, said display device being provided with: a machining data acquisition unit that acquires a laser output value and a radiation coordinate value for a machining laser beam performing laser machining; a calculation unit that calculates the energy density per unit machining length on a tool path of the machining laser beam on the basis of the acquired laser output value and radiation coordinate value; and a display unit that associates and displays the calculated energy density with a position on the tool path.

Description

[Technical Field]

[0001] The present invention relates to a display device and a processing control device including the same, and more particularly to a display device having a function of displaying a laser processing state based on an energy density per unit processing length. [Background technology]

[0002] Laser processing devices such as laser cutting machines and laser welding machines can perform a predetermined process by transmitting a laser beam output from a laser oscillator to irradiate a workpiece and moving the laser beam and the workpiece relative to each other. In particular, to obtain a good cut cross section in laser cutting or a stable weld bead in laser welding, it is desirable that the energy density per unit processing length along the processing path is uniform (within a predetermined range).

[0003] In such laser processing, if the processing path for the workpiece is simply a straight line, the energy density per unit processing length can be made uniform if the processing is performed at a constant processing speed and constant laser power. However, when a workpiece of an arbitrary shape is irradiated with laser light to process along a two-dimensional or three-dimensional processing path, the processing path may include curved sections or corners, and the processing speed will decrease at these curved sections or corners, so if processing is performed at a constant laser power, the energy density per unit processing length will become non-uniform.

[0004] As an example of a laser processing device intended to solve such problems, for example, Patent Document 1 discloses a processing path display device that displays a processing path in a laser processing machine, which includes a position information acquisition unit that acquires position information of at least one drive axis for each predetermined control period, a laser processing head coordinate calculation unit that calculates coordinate values of the laser processing head from the position information and information on the mechanical configuration of the laser processing machine, a laser output acquisition unit that acquires laser output values of the laser, a display format setting unit that sets a laser display format according to the acquired laser output values, and a display unit that displays the processing path based on the coordinate values of the laser processing head and the set display format.With this processing path display device, it is said that the relationship between the processing path and the laser output can be easily recognized. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2018-180780 Summary of the Invention [Problem to be solved by the invention]

[0006] As described above, when position information on a processing path of laser processing is displayed in association with laser output, only the laser output value input to each processing point on the processing path is displayed, and data per unit processing length that takes into account the influence of processing speed is not shown. Therefore, simply obtaining the relationship between position information on the processing path and laser output does not allow one to grasp the state of energy density on the processing path.

[0007] In view of these circumstances, there is a demand for a display device that can grasp the laser processing state by obtaining the energy density per unit processing length on the processing path, and a processing control device using the same. [Means for solving the problem]

[0008] According to one aspect of the present invention, a display device having a function of displaying a laser processing state based on an energy density per unit processing length includes a processing data acquisition unit that acquires a laser output value and an irradiation coordinate value of a processing laser beam for laser processing; Tatera The machining speed is calculated from the projection coordinate value, and the machining speed is and the laser output value and a display unit that displays the energy density in association with a position on the machining path.

[0009] According to one aspect of the present invention, a processing control device that controls a laser processing device based on a processing program includes a program analysis unit that analyzes the processing program, an oscillation command unit that outputs an oscillation command for a processing laser beam to a laser oscillator based on the analyzed processing program, an irradiation position command unit that outputs a relative movement command for the processing laser beam and a workpiece based on the analyzed processing program, and a display device having a function of displaying a laser processing state based on the energy density per unit processing length, the display device including a processing data acquisition unit that acquires a laser output value and irradiation coordinate values of the processing laser beam that performs laser processing, and a processing data acquisition unit that acquires the acquired laser output value and irradiation coordinate values of the processing laser beam. Tatera The machining speed is calculated from the projection coordinate value, and the machining speed is and the laser output value The present invention further includes a calculation unit that calculates the energy density per unit processing length on the processing path of the processing laser light based on the energy density per unit processing length on the processing path of the processing laser light, and a display unit that displays the energy density in association with a position on the processing path. [Effects of the Invention]

[0010] According to one aspect of the present invention, the calculation unit calculates the energy density per unit processing length on the processing path of the processing laser light based on the laser output value and irradiation coordinate value acquired by the processing data acquisition unit, and the display unit displays the calculated energy density in correspondence with the processing path.By using this configuration, the energy density per unit processing length on the processing path can be obtained, and the laser processing status can be grasped on the display device. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a schematic diagram showing the configuration of a laser processing device including a display device and a processing control device according to a first embodiment that is a typical example of the present invention. [Figure 2] 2 is a block diagram showing the relationship between the display device and the processing control device shown in FIG. 1. FIG. [Figure 3] FIG. 2 is a schematic diagram showing an example of a processing path of laser processing according to the first embodiment. [Figure 4A] 10 is an example of a display mode on a display unit of a display device. [Figure 4B] 10 is an example of a display mode on a display unit of a display device. [Figure 5] FIG. 10 is a block diagram showing the relationship between a display device and a processing control device according to a second embodiment of the present invention. [Figure 6] FIG. 10 is a block diagram showing the relationship between a display device and a processing control device according to a third embodiment of the present invention. [Figure 7A] 4B is an example of a display mode in which the energy density shown in FIG. 4A is displayed as a processing pattern. [Figure 7B] 4C is an example of a display mode in which the energy density shown in FIG. 4B is displayed as a processing pattern. [Figure 8] FIG. 10 is a schematic diagram showing the configuration of a laser processing device including a display device and a processing control device according to a fourth embodiment. [Figure 9] 9 is a block diagram showing the relationship between the display device and the processing control device shown in FIG. 8. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0012] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A display device having a function of displaying a laser processing state and a processing control device including the same according to a typical example of the present invention will be described below with reference to the drawings.

[0013] First Embodiment Fig. 1 is a schematic diagram showing the configuration of a laser processing device including a display device and a processing control device according to a first embodiment, which is a representative example of the present invention, and Fig. 2 is a block diagram showing the relationship between the display device and the processing control device shown in Fig. 1.

[0014] 1, the laser processing device 1 includes, for example, a laser oscillator 10 that oscillates processing laser light LB, a processing table 20 that holds a workpiece W, a processing head 30 that irradiates the processing laser light LB onto the workpiece W, a transport mechanism 40 that moves the processing head 30 relative to the processing table 20, and a processing control device 50 that controls a predetermined laser processing operation on the workpiece W. The processing control device 50 is also connected to a display device 100.

[0015] The laser processing device in this specification can be applied as any processing device that performs predetermined processing by irradiating a processing laser beam onto a workpiece W, such as laser welding, laser cutting, laser drilling (trepanning), laser marking, laser dicing, or laser annealing. In the following embodiments, the case of laser cutting among the above laser processing will be described as an example.

[0016] The laser oscillator 10 is a laser source with a wavelength that has high absorption efficiency depending on the material of the workpiece W to be processed. Examples of such a laser oscillator 10 include a YAG laser, a YVO4 laser, a fiber laser, a disk laser, or other lasers that are capable of fiber transmission. The processing laser light LB output from the laser oscillator 10 is transmitted to the processing head 30 via a transmission path 12 such as an optical fiber.

[0017] As an example, the processing table 20 is provided with a chuck mechanism (not shown) for mounting the workpiece W, and is configured to grip and fix the workpiece W. Furthermore, the processing table 20 may be provided with a rotation mechanism in addition to a mechanism for moving the workpiece W in the three axial directions of X, Y, and Z.

[0018] As an example, the processing head 30 introduces a processing laser beam LB from one end (upper end) side and emits it from a nozzle 32 on the other end (lower end) side toward the workpiece W. At this time, a focusing lens (not shown) arranged inside the processing head 30 focuses the processing laser beam LB to a predetermined beam diameter at a focusing point FP on the workpiece W.

[0019] In addition, high-pressure oxygen gas, compressed air, etc. are introduced into the processing head 30 and are sprayed coaxially together with the processing laser beam LB from the nozzle 32 as assist gas for the laser cutting process. Furthermore, the processing head 30 has a built-in output sensor (not shown) that measures the laser output value P of the processing laser beam LB, and also has the function of transmitting the detection signal to the processing control device 50.

[0020] Note that, instead of the configuration described above, the processing head 30 that irradiates the processing laser beam LB onto the focal point FP of the workpiece W may have a built-in scanning optical unit (not shown), such as a galvanometer mirror, and the scanning optical unit may scan the optical axis of the processing laser beam LB across the workpiece W. This allows the processing laser beam LB to be a so-called long-focus laser, thereby enabling higher-speed laser processing (remote processing).

[0021] As an example, the transport mechanism 40 is configured as a linear drive body that moves relatively in three mutually orthogonal axial directions of X, Y and Z, and has the processing head 30 attached to one end thereof. Note that the transport mechanism 40 may also be configured as a 6-axis or 7-axis industrial robot equipped with a robot arm having the processing head 30 attached to one end thereof.

[0022] 2, the machining control device 50 according to the first embodiment includes a main control unit 52 that controls the overall operation of the machining control device 50, a program analysis unit 54 that reads a machining program stored in a database or the like and analyzes the machining program, an irradiation position command unit 56 that transmits and receives signals between the machining table 20 and the transport mechanism 40 based on the analysis result of the machining program, and an oscillation command unit 58 that transmits and receives signals between the laser oscillator 10 based on the analysis result of the machining program. The machining control device 50 according to the first embodiment may further include an input interface (not shown), which will be described later, and may be configured to allow manual input of corrections to the machining program.

[0023] On the other hand, as shown in FIG. 2 as an example, the display device 100 according to the first embodiment includes a display control unit 110 that controls the overall operation of the display device 100, and a processing data acquisition unit that acquires the laser output value (P) and irradiation coordinate values (x, y, z) of the processing laser light LB that performs laser processing. 120 a calculation unit 130 that calculates an energy density J per unit processing length on a processing path (see symbols S1 to S6 in FIG. 3 described later) of the processing laser light LB based on the laser output value P and the irradiation coordinate values (x, y, z), and a display unit 140 that displays the calculated energy density J in association with the processing path. Such a display device 100 may be configured as a stationary device alongside the processing control device 50 as shown in FIG. 1, or may be configured as a portable device such as a tablet terminal.

[0024] The main control unit 52 of the processing control device 50 sends the control commands analyzed by the program analysis unit 54 (described later) to an irradiation position command unit 56 and an oscillation command unit 58 according to their contents, and is connected to various sensors (not shown) of the laser processing device 1 and receives detection signals from these sensors. As an example, the main control unit 52 receives a detection signal from an output sensor provided in the processing head 30 of the laser processing device 1 and transmits this to the processing data acquisition unit 120 of the display device 100 as a laser output value P of the processing laser light LB.

[0025] For example, the program analysis unit 54 reads and analyzes blocks of a machining program from an external storage device (not shown) such as a database, thereby determining what control commands are included in the machining program, and temporarily stores and saves the read blocks of the machining program.The program analysis unit 54 then sends the determined control commands of the machining program to the main control unit 52.

[0026] As an example, the irradiation position command unit 56 receives control commands including the optical axis and focal position of the processing laser beam LB and the movement position of the workpiece W based on the processing program from the main control unit 52, and outputs drive command signals individually to the processing table 20 and the transport mechanism 40. The irradiation position command unit 56 also has a function of calculating the irradiation coordinate values (x, y, z) of the focal point FP when the processing laser beam LB is irradiated onto the workpiece W based on the command position for the processing table 20 and the movement position for the transport mechanism 40, and sending the calculated coordinate values to the processing data acquisition unit 120 of the display device 100.

[0027] Here, when calculating the above-mentioned irradiation coordinate values (x, y, z), the irradiation position command unit 56 can use a method of calculating the intersection of the extension of the optical axis of the processing laser light LB and the upper surface of the workpiece W as the irradiation coordinate values (x, y, z) based on, for example, a representative position (movement position) after the workpiece W has been moved, which is commanded to the processing table 20, and the nozzle tip position of the processing head 30, which is commanded to the transport mechanism 40. Alternatively, the processing program may be configured to include the above-mentioned irradiation coordinate values (x, y, z), and to back-calculate movement command values for the processing table 20 and the transport mechanism 40 from the irradiation coordinate values.

[0028] As an example, the oscillation command unit 58 receives a control command from the main control unit 52, which includes an output value of the processing laser light LB corresponding to irradiation coordinate values (x, y, z) on the processing path based on the processing program, and outputs an oscillation command signal to the laser oscillator 10. Here, in this specification, the processing laser light LB may be either continuous oscillation or pulse oscillation, but in the first embodiment, the case where pulse oscillation with a duty ratio D is output at an output command value Cp will be exemplified below as the oscillation command signal.

[0029] As an example, the display control unit 110 of the display device 100 stores a display program therein, and based on the display program, outputs drive commands to the processing data acquisition unit 120, the calculation unit 130, and the display unit 140. Note that the display control unit 110 may be configured to selectively issue drive commands based on the display program at a timing determined by an external input from an operator.

[0030] The processing data acquisition unit 120 acquires the actual measurement value of the laser output value P of the processing laser light LB and the command values of the irradiation coordinate values (x, y, z) from the main control unit 52 or the irradiation position command unit 56 of the processing control device 50, and sends the acquired data of these values to the display control unit 110 and the calculation unit 130. The processing data acquisition unit 120 may also be configured to have a memory (not shown) for temporarily storing the acquired data and to have a function of temporarily storing data acquired in real time until processing is completed. The display control unit 110 can grasp the current processing position and processing state based on the data sent from the processing data acquisition unit 120.

[0031] The calculation unit 130 calculates the energy density J per unit processing length of the processing laser light LB on the processing path based on the data of the laser output value P and the irradiation coordinate values (x, y, z) sent from the processing data acquisition unit 120. Then, the calculation unit 130 sends the calculated data of the energy density J and each data from the processing data acquisition unit 120 to the display unit 140.

[0032] Here, the calculation of the energy density J per unit processing length executed by the calculation unit 130 is performed, for example, as follows: First, continuous displacement data with respect to time of the irradiation coordinate values (x, y, z) sent from the processing data acquisition unit 120 is substituted into the following formula 1 to calculate the processing speed F of the irradiation position (focus point FP) of the processing laser light LB on the processing path.

[0033]

number

[0034] Next, the energy density J per unit processing length on the processing path by the processing laser light LB is calculated by substituting the calculated processing speed F and the laser output value P for each irradiation coordinate value (x, y, z) sent from the processing data acquisition unit 120 into the following formula 2. Then, as described above, the calculation unit 130 sends the calculated processing speed F and energy density J to the display unit 140 as data associated with each other on the processing path.

[0035]

number

[0036] The display unit 140 displays each piece of data sent from the calculation unit 130 as characters or a diagram in association with the machining path based on a drive command from the display control unit 110. Examples of such a display unit 140 include known display means such as a liquid crystal display panel and an organic EL display. The display unit 140 may also be configured to use a touch panel display to allow input by the operator.

[0037] Next, a specific example of the operation of the display device according to the first embodiment will be described with reference to FIGS.

[0038] Fig. 3 is a schematic diagram showing an example of a processing path for laser processing according to the first embodiment. Also, Fig. 4A and Fig. 4B are examples of display modes on the display unit of the display device. Fig. 4A shows a case where an output command is issued at the same laser output value P at all positions on the processing paths S1 to S6 shown in Fig. 3, and Fig. 4B shows a case where an appropriate laser output value P is issued for each of the processing paths S1 to S6 so that the energy density J per unit processing length is constant.

[0039] As shown in FIG. 3, the machining paths S1 to S6 according to the first embodiment are formed from a machining start point P1 through intermediate passing points P2 to P6. P6By scanning the processing path with the processing laser light LB, the laser cutting process is performed to cut out the inner portion W1 from the workpiece W.

[0040] Furthermore, the processing paths S1 to S6 according to the first embodiment are made up of straight paths S1, S3, and S6 formed only with straight lines, a curved path S2 formed only with curved lines, and a refracted path S4+S5 where two straight lines intersect at a passing point P5. When controlling the scanning of the processing laser beam LB along such processing paths, the straight paths S1, S3, and S6 and the curved path S2 can be controlled at the same processing speed within each section, but the refracted path S4+S5 switches the moving direction of the optical axis of the processing laser beam LB, so it is necessary to decelerate and then re-accelerate near the passing point P5.

[0041] 4A, if the laser output value P is controlled to be the same at all positions on the machining path, for example, if the laser output value P at the machining speed F on the straight paths S1, S3, and S6, which are the standard for quality such as the properties of the cut surface, is an appropriate output, the machining speed F is slowed down on the curved path S2 or the bent path S4+S5, so the energy density J per unit machining length is greater on the curved path S2 and the bent path S4+S5 than on the straight paths S1, S3, and S6. Therefore, on these curved path S2 and the bent path S4+S5, the heat input by the machining laser light LB to the workpiece W becomes excessive, which is one cause of quality degradation such as the generation of dross on the cut surface.

[0042] 4B, when controlling so that the energy density J per unit processing length is constant at all positions on the processing paths S1 to S6, an oscillation command is issued to the laser oscillator 10 to increase or decrease the laser output value P in accordance with the processing speed F on each of the processing paths S1 to S6 (for example, a command is issued to increase the laser output value P as the processing speed F increases, and a command is issued to decrease the laser output value P as the processing speed F decreases). In this way, the energy density J per unit processing length is calculated based on the processing speed F calculated from the irradiation coordinate values (x, y, z) of the processing laser light LB and the laser output value P at those coordinate values, and this is displayed in correspondence with each position on the processing paths S1 to S6, thereby making it possible to grasp the heat input status for each processing path and to predict processing quality such as the properties of the cut surface.

[0043] In the above specific example, the processing data acquisition unit 120 of the display device 100 acquires the laser output value P and irradiation coordinate values (x, y, z) of the processing laser light LB in real time from the outside (the main control unit 52 and the irradiation position command unit 56 of the processing control device 50). However, as a modified example of the first embodiment, when the program analysis unit 54 of the processing control device 50 analyzes a processing program, if the processing program includes the laser output value P and irradiation coordinate values (x, y, z) of the processing laser light LB on the processing path, the processing data acquisition unit 120 can acquire these data directly from the main control unit 52, and displays such as those shown in Figures 4A and 4B can be produced without performing actual processing, making it possible to predict the laser processing state from the processing program.

[0044] Furthermore, as another modification of the first embodiment, the calculation unit 130 may be configured to issue a notification command to the display unit 140 to display that there is an abnormality in the laser processing state when the calculated energy density J is outside a predetermined range (for example, outside the range of the upper or lower limit of the energy density J that results in appropriate cut surface properties). This makes it possible to know whether there is an abnormality in the laser processing (such as a major processing defect) during or after the laser processing is performed.

[0045] By having the above-mentioned configuration, the display device according to the first embodiment has a configuration in which the calculation unit calculates the energy density per unit processing length on the processing path of the processing laser light based on the laser output value and irradiation coordinate value acquired by the processing data acquisition unit, and the display unit displays the calculated energy density in correspondence with the processing path, thereby obtaining the energy density per unit processing length on the processing path, and the laser processing state can be easily grasped on the display device.

[0046] <Second embodiment> Fig. 5 is a block diagram showing the relationship between the display device and the processing control device according to the second embodiment of the present invention. In the second embodiment, in the schematic diagrams shown in Figs. 1 to 4, components that can adopt the same or common configurations as those in the first embodiment are assigned the same reference numerals, and repeated explanations of these components will be omitted.

[0047] 5, the display device 100 according to the second embodiment differs in configuration from the display device 100 according to the first embodiment shown in Fig. 2 in that the processing data acquisition unit 120 acquires the actual measurement value of the laser output value P of the processing laser light LB and the command values of the irradiation coordinate values (x, y, z) from the irradiation position command unit 56 and the oscillation command unit 58 of the processing control device 50. That is, the display device 100 according to the second embodiment uses the output command value Cp to the laser oscillator 10 that oscillates the processing laser light LB as the acquired laser output value P.

[0048] That is, as described above, the oscillation command unit 58 of the processing control device 50 outputs an oscillation command signal to the laser oscillator 10 by pulse oscillation with an output command value Cp and a duty ratio D based on the analysis result of the processing program, and by substituting these output command values Cp and duty ratio D into the following formula 3, it is converted into a laser output value P for each irradiation coordinate value (x, y, z) of the processing laser light LB.

[0049]

number

[0050] Then, the energy density J per unit processing length on the processing path by the processing laser beam LB is calculated by substituting the laser output value P calculated by the above-mentioned formula 3 into formula 2 together with the processing speed F calculated separately by formula 1. In this way, the laser processing state can be predicted using the oscillation command signal sent to the laser oscillator 10 by the oscillation command unit 58, without actually measuring the laser output value P of the processing laser beam LB with an output sensor or the like.

[0051] By being configured as described above, the display device according to the second embodiment, in addition to the effects described in the first embodiment, can omit detection means such as an output sensor for actually measuring the laser output value during processing by converting the laser output value of the processing laser light using the output command value included in the oscillation command signal to the laser oscillator.

[0052] <Third embodiment> Fig. 6 is a block diagram showing the relationship between the display device and the processing control device according to the third embodiment of the present invention. In the third embodiment, in the schematic diagrams shown in Figs. 1 to 5, components that can adopt the same or common configurations as those in the first and second embodiments are assigned the same reference numerals, and repeated explanations of these components will be omitted.

[0053] 6, the display device 100 according to the third embodiment differs in configuration from the display device 100 according to the first embodiment shown in Fig. 2 in that it further includes a pattern creation unit 150 that creates a processing pattern along a processing path based on irradiation coordinate values (x, y, z) acquired by a processing data acquisition unit 120 and an energy density J calculated by a calculation unit 130. That is, the display device 100 according to the third embodiment reflects and displays data on the calculated energy density J in a processing pattern that imitates the processing path, rather than the graph shown in Fig. 4A or 4B of the first embodiment.

[0054] 7A and 7B are examples of display modes in which the energy densities shown in Fig. 4A and 4B, respectively, are displayed as processing patterns. As shown in Fig. 7A and 7B, when control is performed so that the same laser output value P is obtained at all positions on the processing path, the pattern creation unit 150 associates the irradiation coordinate values (x, y, z) on the processing paths S1 to S6 with the energy density J to create a planar processing pattern that imitates the processing path shown in Fig. 3. The display unit 140 then displays the created processing pattern.

[0055] At this time, the level of energy density J on the machining paths S1 to S6 is displayed by expressing the machining pattern in color or shading according to the value of the energy density J. For example, as shown in Fig. 7A, if the energy density J per unit machining length on the straight paths S1, S3, and S6 is within a "predetermined range" that results in an appropriate machining state, the curved path S2 and the bent paths S4+S5, where the machining speed F is low and the energy density J is high, are displayed with a gradation of shading according to the magnitude of the density.

[0056] 7A, in particular, the machining speed F gradually decreases toward the passing point P5 on the bending path S4+S5, and therefore the energy density J per unit machining length is displayed in a gradually darker shade so as to gradually increase from the region A2 toward the region A3. Display using such a machining pattern makes it possible to intuitively grasp which positions on the machining path are within the appropriate energy density range (conversely, it is possible to visually identify positions or regions on the machining path where the machining accuracy decreases).

[0057] On the other hand, as shown in Figure 7B, if the laser output value P is controlled so that the energy density J per unit processing length is constant at all positions on the processing path, the processing pattern showing the predetermined range will be displayed for all processing paths. This allows us to estimate that the laser processing state has also been completed properly.

[0058] 7A and 7B, the machining pattern is displayed as a two-dimensional plane, but the machining pattern may be displayed as a three-dimensional pattern depending on the shape of the workpiece and the machining path. Also, the energy density per unit machining length is displayed as a color or shade, but the energy density may be displayed as a function of the width of the machining pattern. These representations provide the operator with more intuitive visual information.

[0059] With the above-described configuration, the display device according to the third embodiment has the effects described in the first embodiment, and further includes a pattern creation unit that creates a processing pattern along the processing path, which makes it possible to intuitively visually recognize the distribution of energy density in the processing pattern. In particular, by displaying the energy density on the processing path in color or shade, it becomes possible to grasp at which position or area the processing accuracy decreases.

[0060] <Fourth embodiment> Fig. 8 is a schematic diagram showing the configuration of a laser processing device including a display device and a processing control device according to a fourth embodiment. Fig. 9 is a block diagram showing the relationship between the display device and the processing control device shown in Fig. 8. Fourth In this embodiment, in the schematic diagrams shown in Figures 1 to 7, components that can adopt the same or common configurations as those in the first to third embodiments are given the same reference numerals, and repeated explanations of these components will be omitted.

[0061] As shown in Fig. 8, the processing control device 50 of the laser processing device 1 according to the fourth embodiment differs in configuration from the processing control device 50 and the display device 100 according to the first embodiment shown in Fig. 1 in that the processing control device 50 is configured to be integrally incorporated with the display device 100. Note that Fig. 8 illustrates an example in which the display device 100 is incorporated in the same housing as the processing control device 50, but the processing control device 50 may also be incorporated into the display device 100 shown in Fig. 1.

[0062] 9, the machining control device 50 includes a main control unit 52 for controlling the overall operation of the machining control device 50, a program analysis unit 54 for reading a machining program stored in a database or the like and analyzing the machining program, an irradiation position command unit 56 for transmitting and receiving signals between the machining table 20 and the transport mechanism 40 based on the analysis result of the machining program, an oscillation command unit 58 for transmitting and receiving signals between the laser oscillator 10 based on the analysis result of the machining program, an input interface 60 for an operator to input various information, and an integrally incorporated display device 100. As in the first embodiment, the display device 100 includes a display control unit 110 for controlling the overall operation of the display device 100, a processing data acquisition unit 120 for acquiring the laser output value (P) and irradiation coordinate values (x, y, z) of the processing laser light LB for laser processing, and a processing data acquisition unit 130 for acquiring the laser output value (P) and irradiation coordinate values (x, y, z) of the processing laser light LB for processing. 120 The device is equipped with a calculation unit 130 that calculates the energy density J per unit processing length on the processing path of the processing laser light LB based on the laser output value P and the irradiation coordinate values (x, y, z), and a display unit 140 that displays the calculated energy density J in association with the processing path.

[0063] 9, in the processing control device 50 according to the fourth embodiment, the main control unit 52 is configured to exchange signals with the display control unit 110 of the display device 100, and can issue a command to display various information required for controlling the operation of the laser processing device 1 on the display unit 140. Note that, although Fig. 9 illustrates an example in which the main control unit 52 of the processing control device 50 and the display control unit 110 of the display device 100 are configured separately, they may also be configured as an integrated unit so that the main control unit 52 also performs the function of the display control unit 110.

[0064] The input interface 60 is configured as an information input terminal including, for example, input buttons, a numeric keypad, etc. This allows an operator, viewing the energy density J result displayed on the display unit 140 of the display device 100, to manually correct various parameters in the processing program, such as the processing speed F and the laser output value P (or the output command value Cp). Note that, although Figs. 8 and 9 show an example in which the input interface 60 and the display unit 140 of the display device 100 are configured separately, the two may be integrated by employing a panel display means that allows touch input as the display unit 140.

[0065] By being equipped with the above-described configuration, the processing control device according to the fourth embodiment has the effects described in the first embodiment, and by incorporating a display device into the processing control device, it is possible to integrate the internal configuration and make the overall size compact.

[0066] The present invention is not limited to the above-described embodiment, and can be appropriately modified without departing from the spirit and scope of the invention. Any of the components of the embodiment can be modified or omitted within the scope of the invention.

[0067] For example, the specific examples shown in the first to fourth embodiments may be applied by combining their respective features. For example, it is also possible to combine the display device shown in the second embodiment with the processing control device shown in the fourth embodiment. [Explanation of symbols]

[0068] 1. Laser processing equipment 10 Laser oscillator 12 Transmission Line 20 Processing table 30 Processing head 32 nozzles 40 Conveyor mechanism 50 Processing control device 52 Main control unit 54 Program Analysis Unit 56 Irradiation position command section 58 Oscillation command unit 60 input interfaces 100 display device 110 Display control unit 120 Processing data acquisition unit 130 Arithmetic section 140 Display section 150 Pattern Creation Department

Claims

1. A display device having a function of displaying a laser processing state based on an energy density per unit processing length, a processing data acquisition unit that acquires a laser output value of a processing laser beam for laser processing and an irradiation coordinate value of the processing laser beam; a calculation unit that calculates a processing speed from the irradiation coordinate value and calculates an energy density per unit processing length on the processing path of the processing laser light based on the processing speed and the laser output value; a display unit that displays the energy density in association with a position on the machining path; A display device comprising:

2. The processing data acquisition unit acquires the laser output value and the irradiation coordinate value of the processing laser light in real time during the laser processing. The display device according to claim 1 .

3. The processing data acquisition unit acquires the laser output value and the irradiation coordinate value of the processing laser light by analyzing a processing program that controls the laser processing. The display device according to claim 1 .

4. The laser output value is an output command value to a laser oscillator that oscillates the processing laser light. The display device according to any one of claims 1 to 3.

5. a pattern creating unit that creates a processing pattern along the processing path based on the irradiation coordinate values and the energy density, The display unit displays the energy density on the machining path by expressing the machining pattern in color or shading. The display device according to any one of claims 1 to 4.

6. When the calculated energy density is outside a predetermined range, the calculation unit issues a notification command to the display unit to display that an abnormality has occurred. The display device according to any one of claims 1 to 5.

7. A processing control device that controls a laser processing device based on a processing program, a program analysis unit that analyzes the machining program; an oscillation command unit that outputs an oscillation command for the processing laser beam to a laser oscillator based on the analyzed processing program; an irradiation position command unit that outputs a relative movement command between the processing laser light and the workpiece based on the analyzed processing program; a display device having a function of displaying the laser processing state based on the energy density per unit processing length; Equipped with The display device includes: a processing data acquisition unit that acquires a laser output value of a processing laser beam for laser processing and an irradiation coordinate value of the processing laser beam; a calculation unit that calculates a processing speed from the irradiation coordinate value and calculates an energy density per unit processing length on the processing path of the processing laser light based on the processing speed and the laser output value; a display unit that displays the energy density in association with a position on the machining path; The processing control device further comprises:

8. The processing data acquisition unit acquires the laser output value and the irradiation coordinate value of the processing laser light in real time during the laser processing. The machining control device according to claim 7 .

9. The processing data acquisition unit acquires the laser output value and the irradiation coordinate value of the processing laser light by analyzing a processing program that controls the laser processing. The machining control device according to claim 7 .

10. The laser output value is an output command value to a laser oscillator that oscillates the processing laser light. The machining control device according to any one of claims 7 to 9.

11. a pattern creating unit that creates a processing pattern along the processing path based on the irradiation coordinate values and the energy density, The display unit displays the energy density on the machining path by expressing the machining pattern in color or shading. The machining control device according to any one of claims 7 to 10.

12. When the calculated energy density is outside a predetermined range, the calculation unit issues a notification command to the display unit to display that an abnormality has occurred. The machining control device according to any one of claims 7 to 11.

13. and an input interface for modifying the machining program. The machining control device according to any one of claims 7 to 12.

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