Vibration device and device including vibration device

Abstract

To provide a vibration apparatus having flexibility.SOLUTION: A vibration apparatus includes: a vibration plate; a vibration generator disposed on the vibration plate and including a vibration structure; and a connection member between the vibration plate and the vibration generator. The connection member includes: a first connection member disposed between the vibration plate and the vibration structure and arranged to overlap the vibration structure; and a second connection member arranged to surround the first connection member. A modulus of the first connection member is greater than a modulus of the second connection member.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present specification relates to vibration devices and devices including the same. [Background technology]

[0002] The vibration device can vibrate and output sound using a coil system including a magnet and a coil, or a piezoelectric system using a piezoelectric element.

[0003] Piezoelectric vibration devices have the drawback of being easily damaged by external impacts due to the brittle characteristics of the piezoelectric element, resulting in low reliability in sound reproduction. Furthermore, piezoelectric vibration devices have the drawback of having lower sound pressure levels in the low frequency range compared to coil-type devices due to the low piezoelectric constant of the piezoelectric element, and also have the drawback of having a high sound pressure flatness, which is defined as the difference between the maximum and minimum sound pressure levels in the reproduction frequency band. Summary of the Invention [Problem to be solved by the invention]

[0004] Therefore, the inventors of the present specification have recognized the above-mentioned problems and have conducted various experiments to realize a vibration device having flexibility, and have further conducted various experiments to realize a vibration device that can improve acoustic characteristics and / or sound pressure characteristics while having flexibility.The inventors of the present specification have invented a new vibration device having flexibility through many experiments, and have invented a vibration device that can improve acoustic characteristics and / or sound pressure characteristics while having flexibility.

[0005] The problem solved by one embodiment of the present disclosure is to provide a flexible vibration device and an apparatus including the same.

[0006] An object of the present invention is to provide a vibration device and a device including the same that can improve acoustic characteristics and / or sound pressure characteristics while maintaining flexibility.

[0007] The problems to be solved by the examples of this specification are not limited to those mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0008] A vibration device according to one embodiment of the present specification includes a vibration plate, a vibration generator on the vibration plate and including a vibration structure, and a connecting member between the vibration plate and the vibration generator, the connecting member being arranged to overlap with the vibration structure and including a first connecting member between the vibration plate and the vibration structure, and a second connecting member being arranged to surround the first connecting member, the first connecting member having a greater elastic modulus than the second connecting member.

[0009] A vibration device according to an embodiment of the present disclosure includes a vibration plate, a vibration generator disposed on the vibration plate, and a connecting member between the vibration plate and the vibration generator, the connecting member including a metal material.

[0010] A vibration device according to one embodiment of the present specification includes a vibration plate, a vibration generator that vibrates the vibration plate, and a connecting member between the vibration plate and the vibration generator, and the vibration generator includes a vibration structure, a first electrode portion on a first surface of the vibration structure, and a second electrode portion on a second surface of the vibration structure opposite the first surface, and each of the first electrode portion and the second electrode portion includes silver (Ag) and glass frit.

[0011] A vibration device according to one embodiment of the present disclosure includes a vibration member and one or more vibration generators coupled to the vibration member, where the one or more vibration generators include the vibration devices described above.

[0012] Specific details of various examples of the present specification other than the means for solving the problems mentioned above are included in the following description and drawings. [Effects of the Invention]

[0013] The vibration device according to the present specification can generate sound by vibrating a diaphragm, and can output sound having improved sound pressure characteristics forward of the diaphragm.

[0014] The device according to the present disclosure can improve the mid-range, low-range, and / or mid-bass characteristics of the sound generated by the displacement of the diaphragm by increasing the amplitude displacement of the diaphragm.

[0015] The vibration device according to the present specification can improve the mid-range, low-range, and / or low-mid-range characteristics of the sound generated by the displacement of the diaphragm.

[0016] The problems to be solved, means for solving the problems, and effects mentioned above do not specify essential features of the claims, and therefore the scope of the claims is not limited by the matters described in the content of the invention. [Brief explanation of the drawings]

[0017] [Figure 1] 1 illustrates a vibration device according to an embodiment of the present disclosure. [Figure 2] 1 is a perspective view of a vibration device according to an embodiment of the present disclosure. [Figure 3A] FIG. 10 is a diagram showing the damping characteristics of the first connecting member. [Figure 3B] FIG. 10 is a diagram showing a second connection damping characteristic. [Figure 3C] FIG. 10 is a diagram showing the damping characteristics after the second connecting member is laminated. [Figure 4] 10A and 10B illustrate vibration devices according to other embodiments of the present disclosure. [Figure 5] 10A and 10B illustrate vibration devices according to other embodiments of the present disclosure. [Figure 6A] 1 is a scanning electron microscope photograph of the surface of an electrode part according to an example of the present specification. [Figure 6B] 1 is a scanning electron microscope photograph of a cross section of the boundary between an electrode portion and a vibration structure according to an embodiment of the present specification. [Figure 6C] 1 is a scanning electron microscope photograph of an electrode part according to an example of the present specification. [Figure 6D] 1 is a scanning electron microscope photograph of an electrode part according to an example of the present specification. [Figure 6E] 1 is a scanning electron microscope photograph of an electrode part according to an example of the present specification. [Figure 6F] 1 is a scanning electron microscope photograph of an electrode part according to an example of the present specification. [Figure 7A] 1 is a scanning electron microscope photograph of the surface of an electrode part according to an example of the present specification. [Figure 7B] 1 is a scanning electron microscope photograph of a cross section of the boundary between an electrode portion and a vibration structure according to an embodiment of the present specification. [Figure 7C] 1 is a scanning electron microscope photograph of an electrode part according to an example of the present specification. [Figure 7D] 1 is a scanning electron microscope photograph of an electrode part according to an example of the present specification. [Figure 7E] 1 is a scanning electron microscope photograph of an electrode part according to an example of the present specification. [Figure 7F] 1 is a scanning electron microscope photograph of an electrode part according to an example of the present specification. [Figure 8A] 1 is a scanning electron microscope photograph of the surface of an electrode part according to an example of the present specification. [Figure 8B] 1 is a scanning electron microscope photograph of a cross section of the boundary between an electrode portion and a vibration structure according to an embodiment of the present specification. [Figure 9A] 1 is a scanning electron microscope photograph of the surface of an electrode part according to an example of the present specification. [Figure 9B] 1 is a scanning electron microscope photograph of a cross section of the boundary between an electrode portion and a vibration structure according to an embodiment of the present specification. [Figure 10A] 1 is a scanning electron microscope photograph of the surface of an electrode part according to an example of the present specification. [Figure 10B] 1 is a scanning electron microscope photograph of a cross section of the boundary between an electrode portion and a vibration structure according to an embodiment of the present specification. [Figure 10C] 1 is a scanning electron microscope photograph of an electrode part according to an example of the present specification. [Figure 10D] 1 is a scanning electron microscope photograph of an electrode part according to an example of the present specification. [Figure 10E] 1 is a scanning electron microscope photograph of an electrode part according to an example of the present specification. [Figure 10F]1 is a scanning electron microscope photograph of an electrode part according to an example of the present specification. [Figure 11] 1 is a scanning electron microscope photograph of a cross section of the boundary between an electrode portion and a vibration structure according to Experimental Example 1. [Figure 12A] 10 is a scanning electron microscope photograph of the surface of an electrode part according to Experimental Example 2. [Figure 12B] 10 is a scanning electron microscope photograph of a cross section of the boundary between an electrode portion and a vibration structure according to Experimental Example 2. [Figure 13] 10A and 10B illustrate vibration devices according to other embodiments of the present disclosure. [Figure 14] FIG. 1 is a plan view of a vibration generator according to an embodiment of the present disclosure. [Figure 15] FIG. 15 is a cross-sectional view taken along line II' in FIG. [Figure 16] FIG. 10 illustrates a vibration generator according to another embodiment of the present disclosure. [Figure 17] FIG. 17 is a cross-sectional view taken along line II-II' in FIG. [Figure 18] FIG. 17 is a cross-sectional side view taken along line III-III' in FIG. 16. [Figure 19] FIG. 19 is a perspective view showing the piezoelectric vibrating part shown in FIG. [Figure 20A] FIG. 10 is a perspective view showing a piezoelectric vibrating portion of a vibrating element according to another embodiment of the present specification. [Figure 20B] FIG. 10 is a perspective view showing a piezoelectric vibrating portion of a vibrating element according to another embodiment of the present specification. [Figure 20C] FIG. 10 is a perspective view showing a piezoelectric vibrating portion of a vibrating element according to another embodiment of the present specification. [Figure 20D] FIG. 10 is a perspective view showing a piezoelectric vibrating portion of a vibrating element according to another embodiment of the present specification. [Figure 21] 10A and 10B illustrate vibration elements according to other embodiments of the present disclosure. [Figure 22] 22 is a cross-sectional view taken along line IV-IV' in FIG. 21. [Figure 23] 10A and 10B illustrate vibration elements according to other embodiments of the present disclosure. [Figure 24] 1 illustrates an apparatus according to an embodiment of the present disclosure. [Figure 25] FIG. 25 is a diagram showing the main cable and first to n-th signal cables shown in FIG. 24. [Figure 26] 24 is a waveform diagram showing an output signal of the acoustic data generating circuit unit shown in FIG. 23. [Figure 27] 10A and 10B illustrate vibration devices according to other embodiments of the present disclosure. [Figure 28] FIG. 28 is a diagram illustrating the vibration generator of FIG. 27. [Figure 29] FIG. 1 illustrates a vibration driver circuit according to an embodiment of the present disclosure. [Figure 30] FIG. 10 illustrates a displacement of a vibration generator according to an embodiment of the present disclosure. [Figure 31A] 1 is a cross-sectional view of a vibration device according to another embodiment of the present disclosure. [Figure 31B] 1 is a cross-sectional view of a vibration device according to another embodiment of the present disclosure. [Figure 32] FIG. 10 illustrates a vibration generator according to another embodiment of the present disclosure. [Figure 33] FIG. 33 is a diagram illustrating the vibrating structure shown in FIG. 32. [Figure 34] 33 is a cross-sectional view taken along line VV' in FIG. 32. [Figure 35] 10A and 10B illustrate vibration devices according to other embodiments of the present disclosure. [Figure 36] 10A and 10B illustrate vibration devices according to other embodiments of the present disclosure. [Figure 37] 10A and 10B illustrate vibration devices according to other embodiments of the present disclosure. [Figure 38] FIG. 38 is a cross-sectional view taken along line VI-VI′ in FIG. 37. [Figure 39] FIG. 1 illustrates an apparatus according to an embodiment of the present disclosure. [Figure 40] 7 is a cross-sectional view taken along line VII-VII' in FIG. 39. [Figure 41] 41 shows the vibration device of the device of FIG. 40 coupled to a display panel. [Figure 42] 41 shows the vibration device of the device of FIG. 40 coupled to a display panel. [Figure 43] FIG. 7 is another cross-sectional view taken along line VII-VII′ in FIG. 39. [Figure 44] 44 shows the vibration device of the device of FIG. 43 coupled to a display panel. FIG. [Figure 45] 7 is a cross-sectional view taken along line VII-VII' in FIG. 39. [Figure 46] 46 shows the vibration device of the device of FIG. 45 coupled to a display panel. FIG. [Figure 47] FIG. 10 illustrates an apparatus according to another embodiment of the present disclosure. [Figure 48] FIG. 8 is a cross-sectional view taken along line VIII-VIII′ in FIG. 47. DETAILED DESCRIPTION OF THE INVENTION

[0018] The advantages and features of the present specification and methods for achieving them will become more apparent with reference to various examples described below in detail with reference to the accompanying drawings. However, the present specification is not limited to the embodiment disclosed below, and may be embodied in various different forms. The embodiment etc. of the present specification are provided merely to complete the disclosure of the specification and to fully inform those skilled in the art of the technical idea of the specification, and the technical idea of the specification is only defined by the scope of the claims.

[0019] The shapes, sizes, ratios, angles, numbers, etc. disclosed in the drawings for illustrating an embodiment of this specification are illustrative only and the specification is not limited to the illustrated matters. The same reference symbols refer to the same components throughout this specification. Furthermore, in the description of this specification, if it is determined that a detailed description of related known technology may unnecessarily obscure the gist of this specification, such a detailed description will be omitted. When using words such as "include," "have," and "be," other parts may be added unless "only" is used. When a component is expressed in the singular, it also includes the plural unless otherwise explicitly stated.

[0020] When interpreting elements, the error range is interpreted as being included even if there is no separate explicit description of the error range.

[0021] When describing the positional relationship between two parts, for example, "on top of," "below," or "next to," one or more other parts may be located between the two parts, unless "directly" or "immediately" is used.

[0022] When describing temporal relationships, for example, when describing temporal precedence, such as "after," "following," "next to," or "before," non-consecutive cases can be included as long as "immediately" or "directly" is not used.

[0023] Although terms such as "first" and "second" are used to describe various components, these components are not limited to these terms. These terms are used only to distinguish one component from another. Therefore, a first component referred to below may also be a second component within the technical concept of this specification.

[0024] In describing components in this specification, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are merely used to distinguish a component from other components, and do not limit the nature, order, sequence, or number of the components. When a component is described as being "coupled," "coupled," or "connected" to another component, it should be understood that the component can be directly coupled or connected to the other component, but unless otherwise explicitly stated, other components can also be "intervened" between components that can be indirectly coupled or connected.

[0025] The term "at least one" should be understood to include all combinations of one or more. For example, the meaning of "at least one of the first, second, and third components" can be said to include not only the first, second, or third components individually, but also all combinations of two or more of the first, second, and third components.

[0026] In this specification, the term "display device" may include display devices such as liquid crystal modules (LCMs) and organic light emitting display modules (OLED modules) that include a display panel and a driver for driving the display panel. It may also include set electronic apparatuses or set devices or set apparatuses, such as notebook computers, televisions, computer monitors, automotive apparatuses or other forms of vehicles, which are complete or final products that include an LCM or OLED module, and mobile electronic apparatuses such as smartphones or electronic pads.

[0027] Therefore, the display device in this specification can include a display device itself such as an LCM, an OLED module, etc., as well as a set device that is an application product or a final consumer device that includes an LCM, an OLED module, etc.

[0028] In some cases, an LCM or OLED module including a display panel, a driver, etc. may be referred to as a "display device," and a completed electronic device including the LCM or OLED module may be referred to as a "set device." For example, a display device may include a liquid crystal or organic light emitting display panel and a source PCB that is a controller for driving the display panel. The set device may further include a set PCB that is a set controller electrically connected to the source PCB and drives the entire set device.

[0029] The display panel used in some embodiments of the present disclosure may be any type of display panel, such as a liquid crystal display panel, an organic light-emitting display panel, or an electroluminescent display panel, and embodiments are not limited thereto. For example, the display panel may be a display panel that can generate sound by being vibrated by a vibration generating device according to some embodiments of the present disclosure. The display panel used in the display device according to some embodiments of the present disclosure is not limited to any particular shape or size.

[0030] For example, if the display panel is a liquid crystal display panel, it may include a number of gate lines and data lines, and pixels formed at the intersections of the gate lines and the data lines, and may include an array substrate including thin film transistors as switching elements for adjusting the light transmittance of each pixel, an upper substrate including a color filter and / or a black matrix, and a liquid crystal layer formed between the array substrate and the upper substrate.

[0031] If the display panel is an organic light-emitting display panel, it may include a plurality of gate lines, data lines, and pixels formed at the intersections of the gate lines and data lines. It may also include an array substrate including thin film transistors (TFTs) that selectively apply voltage to each pixel, an organic light-emitting element layer on the array substrate, and an encapsulation substrate or encapsulation substrate disposed on the array substrate to cover the organic light-emitting element layer. The encapsulation substrate protects the TFTs and the organic light-emitting element layer from external impacts and prevents moisture and oxygen from penetrating into the organic light-emitting element layer. Layers formed on the array substrate may include an inorganic light-emitting layer, such as a nano-sized material layer and a quantum dot light-emitting layer. Another embodiment of the present specification may include a micro light-emitting diode.

[0032] The display panel may further include a backing, such as a metal plate, attached to the display panel, or may include other structures, for example, other structures made of other materials.

[0033] In this specification, a device including a vibration device is a user interface module such as a central control panel in an automobile, and can be applied to a vehicle. For example, a display panel can be implemented between two front seat occupants so that vibrations of the display panel are propagated toward the interior of the vehicle. Thus, the audio experience in the vehicle can be improved compared to a vehicle having speakers only on the interior sides.

[0034] The features of the various embodiments of this specification may be partially or fully combined or combined with each other, and various technical linkages and operations are possible, and each embodiment may be implemented independently of the others, or may be implemented together in a linked relationship.

[0035] Hereinafter, the present specification will be described with reference to the accompanying drawings and examples. The scales of the components shown in the drawings are different from the actual scales for the convenience of explanation, and are not limited to the scales shown in the drawings.

[0036] FIG. 1 is a diagram illustrating a vibration device according to an embodiment of the present specification, and FIG. 2 is an exploded view of a vibration device according to an embodiment of the present specification.

[0037] Referring to Figures 1 and 2, the device includes a vibration plate 10, a vibration generator 20 provided on the vibration plate 10 and including a vibration structure 21, and a connecting member 15 between the vibration plate 10 and the vibration generator 20, the connecting member 15 being arranged to overlap with the vibration structure 21 and including a first connecting member 15a provided between the vibration plate 10 and the vibration structure 21, and a second connecting member 15b arranged to surround the first connecting member 15a, the first connecting member 15a having a larger elastic modulus than the second connecting member 15b.

[0038] The vibration generator 20 can generate a displacement amount (or bending force) or amplitude displacement by contracting or expanding in a drive direction (or displacement direction) in response to an applied vibration drive signal. Therefore, the vibration generator 20 can increase (or maximize) the displacement amount (or bending force) or amplitude displacement of the diaphragm 10, thereby improving the acoustic characteristics and sound pressure characteristics of the sound generated by the vibration of the diaphragm 10. For example, the vibration generator 20 can be expressed by terms such as, but not limited to, a vibrating structure, a vibrator, a vibration generating element, a vibration element, a sounder, an acoustic element, an acoustic generating element, or an acoustic generator.

[0039] The vibration generator 20 according to an embodiment of the present specification may include a piezoelectric material (or electroactive material) having piezoelectric properties. The vibration generator 20 may vibrate (or displace) itself or may vibrate (or displace) a vibrating member (or diaphragm, or vibrating object) by vibration (or displacement) of the piezoelectric material due to an electric signal (or voice signal) applied to the piezoelectric material. For example, the vibration generator 20 may vibrate (or displace) by alternately repeating contraction and / or expansion due to the piezoelectric effect (or piezoelectric properties). For example, the vibration generator 20 may vibrate (or displace) in the vertical direction (or thickness direction) Z by alternately repeating contraction and / or expansion due to the inverse piezoelectric effect. The vibration generator 20 according to an embodiment of the present specification may be a piezoelectric vibration element. For example, the vibration generator 20 according to an embodiment of the present specification may be expressed by terms such as, but not limited to, a piezoelectric vibration structure, a piezoelectric vibrator, a piezoelectric vibration generating element, a piezoelectric vibration generator, a piezoelectric sound generator, a piezoelectric acoustic element, a piezoelectric sound generating element, a piezoelectric sound generator, a piezoelectric actuator, a piezoelectric exciter, or a piezoelectric transducer.

[0040] The vibration generator 20 according to an embodiment of the present disclosure may be configured to be flexible. For example, the vibration generator 20 may be configured to bend in a non-planar shape, including a curved surface. Therefore, the vibration generator 20 according to an embodiment of the present disclosure may be expressed by terms such as, but not limited to, a flexible vibrating structure, a flexible vibrator, a flexible vibration generating element, a flexible vibration generator, a flexible sound generator, a flexible acoustic element, a flexible sound generating element, a flexible sound generator, a flexible actuator, a flexible exciter, or a flexible transducer.

[0041] The diaphragm 10 may include a plate-like structure having a predetermined thickness. For example, the diaphragm 10 may be expressed by terms such as a vibrating member, a vibrating object, an acoustic output member, a vibrating panel, or an acoustic output panel, but is not limited to these.

[0042] The diaphragm 10 may include a metallic material or a non-metallic material (or a composite non-metallic material) having material properties suitable for outputting sound through vibration. The metallic material of the diaphragm 10 according to one embodiment may include, but is not limited to, one or more of stainless steel, aluminum (Al), aluminum (Al) alloy, magnesium (Mg), magnesium (Mg) alloy, and magnesium-lithium (Mg-Li) alloy. The non-metallic material (or composite non-metallic material) of the vibrating member may include, but is not limited to, one or more of glass, plastic, fiber, leather, wood, fabric, and paper.

[0043] The vibrating structure 21 may include a piezoelectric material (or piezoelectric element) having piezoelectric properties (or piezoelectric effect). For example, a piezoelectric material may have the property that a potential difference is generated by dielectric polarization due to a relative change in the position of positive (+) ions and negative (-) ions when pressure or torsion is applied to the crystalline structure due to an external force, and vibration is generated by an electric field due to an applied voltage. For example, the vibrating structure 21 may be expressed as, but is not limited to, a vibration generating structure, a sound generating structure, a vibration generating unit, a sound generating unit, a piezoelectric structure, or a displacement structure.

[0044] A vibrating structure 21 according to one embodiment of the present specification may include a vibrating portion 21a containing a piezoelectric material, a first electrode portion 21b arranged on a first surface of the vibrating portion 21a, and a second electrode portion 21c arranged on a second surface opposite to the first surface of the vibrating portion 21a or other than the first surface.

[0045] The vibrating unit 21a may include a piezoelectric material, and may be expressed by terms such as, but not limited to, a vibration layer, a piezoelectric layer, a piezoelectric material layer, an electroactive layer, a piezoelectric vibrating unit, a piezoelectric material unit, an electroactive unit, an inorganic material layer, or an inorganic material unit.

[0046] The vibrating portion 21a can be made of a transparent, semi-transparent, or opaque piezoelectric material, and therefore can be transparent, semi-transparent, or opaque.

[0047] The vibrating portion 21a may be made of a ceramic material capable of achieving relatively high vibration or a piezoelectric ceramic having a perovskite-based crystal structure. The perovskite crystal structure has piezoelectric and inverse piezoelectric effects and may be a bar-shaped structure with orientation. The perovskite crystal structure may be expressed by the chemical formula ABO3, where the A site is composed of a divalent metal element and the B site is composed of a tetravalent metal element. In one embodiment of the present specification, in the chemical formula ABO3, the A site and the B site may be cations, and O may be an anion. For example, the perovskite crystal structure may include at least one of PbTiO3, PbZrO3, PbZrTiO3, BaTiO3, and SrTiO3, but is not limited thereto.

[0048] The vibrating portion 21a according to one embodiment of the present specification may include, but is not limited to, one or more of lead (Pb), zirconium (Zr), titanium (Ti), zinc (Zn), nickel (Ni), and niobium (Nb).

[0049] In another embodiment of the present specification, the vibrating unit 21a may include, but is not limited to, a PZT (lead zirconate titanate)-based material containing lead (Pb), zirconium (Zr), and titanium (Ti), or a PZNN (lead zirconate nickel niobate)-based material containing lead (Pb), zirconium (Zr), nickel (Ni), and niobium (Nb). Alternatively, the vibrating unit 21a may include, but is not limited to, at least one of CaTiO3, BaTiO3, and SrTiO3, which do not contain lead (Pb).

[0050] In another embodiment of the present specification, the vibrating unit 21a may have a piezoelectric deformation coefficient (d33) of 1,000 pC / N or more in the thickness direction (Z). Having a high piezoelectric deformation coefficient (d33) allows for application to large display panels, and provides a vibrating device 1 with sufficient vibration or piezoelectric characteristics. For example, the vibrating unit 21a may be primarily composed of a PZT-based material (PbZrTiO3) and may include a softener dopant material doped in the A site (Pb) and a relaxor ferroelectric material doped in the B site (ZrTi).

[0051] The softener dopant material can improve the piezoelectric and dielectric properties of the vibrating part 21a, for example, by increasing the piezoelectric deformation coefficient (d33) of the vibrating part 21a. When the softener dopant material is composed of a +1 valent element, the piezoelectric and dielectric properties can be reduced. For example, when the softener dopant material is composed of potassium (K) and rubidium (Rb), the piezoelectric and dielectric properties can be reduced. Therefore, through numerous experiments, it has been recognized that the softener dopant material must be composed of +2 to +3 valent elements to improve the piezoelectric and dielectric properties. The softener dopant material according to the embodiments of this specification can include +2 to +3 valent elements. By incorporating a softener dopant material into a PZT-based material (PbZrTiO3), a morphotropic phase boundary (MPB) can be formed, thereby improving the piezoelectric and dielectric properties. For example, the softener dopant material may include strontium (Sr), barium (Ba), lanthanum (La), neodymium (Nd), calcium (Ca), yttrium (Y), erbium (Er), or ytterbium (Yb). For example, ions of the softener dopant material (Sr) doped into a PZT-based material (PbZrTiO3) may be used. 2+ , Ba 2+ , La 2+ , Nd 3+ , Ca 2+ , Y 3+ , Er3+ , Yb 3+ ) partially replaces lead (Pb) in PZT-based materials (PbZrTiO3), and the substitution amount can be 2 to 20 mol%. For example, if the substitution amount is less than 2 mol% or more than 20 mol%, the perovskite crystal structure is destroyed, which can reduce the electric coupling coefficient (kP) and piezoelectric deformation coefficient (d33). When a softener dopant material is substituted, a morphotropic phase boundary can be formed, and the morphotropic phase boundary can have high piezoelectric and dielectric properties, thereby realizing a vibrating device with high piezoelectric and dielectric properties.

[0052] According to an embodiment of the present disclosure, a relaxor ferroelectric material doped into a PZT-based material (PbZrTiO3) can improve the electrodeformation characteristics of the vibrating part 21a. The relaxor ferroelectric material according to an embodiment of the present disclosure may include, but is not limited to, a PMN (lead magnesium niobate)-based material or a PNN (lead nickel niobate)-based material. The PMN-based material may include lead (Pb), magnesium (Mg), and niobium (Nb), such as Pb(Mg,Nb)O3. The PNN-based material may include lead (Pb), nickel (Ni), and niobium (Nb), such as Pb(Ni,Nb)O3. For example, a relaxor ferroelectric material doped into a PZT-based material (PbZrTiO3) substitutes a portion of the zirconium (Zr) and titanium (Ti) in the PZT-based material (PbZrTiO3), with the substitution amount being 5 to 25 mol%. For example, if the substitution amount is less than 5 mol% or more than 25 mol%, the perovskite crystal structure is destroyed, and the electric coupling coefficient (kP) and piezoelectric deformation coefficient (d33) may decrease.

[0053] According to an embodiment of the present specification, the vibrating part 21a may further include a donor material doped into the B site (ZrTi) of the PZT-based material (PbZrTiO3) to further improve the piezoelectric coefficient. For example, the donor material doped into the B site (ZrTi) may include an element with a valence of +4 to +6. For example, the donor material doped into the B site (ZrTi) may include tellurium (Te), germanium (Ge), uranium (U), bismuth (Bi), niobium (Nb), tantalum (Ta), antimony (Sb), or tungsten (W).

[0054] The vibration section 21a according to one embodiment of this specification can be expressed by the following formula. [Formula 1] (Pb A-B C B )((Mg 1 / 3 Nb 2 / 3 ) a (Ni 1 / 3 Nb 2 / 3 ) b Zr c Ti d )O3

[0055] In Formula 1, C can be one of calcium (Ca), strontium (Sr), and barium (Ba). a+b+c+d=1, 0.02≦B≦0.20, 0.80≦AB≦0.98, 0.05≦a≦0.25, 0.05≦b≦0.25, 0.10≦c≦0.50, 0.10≦d≦0.50.

[0056] The vibrating section 21a according to an embodiment of the present specification can have a piezoelectric deformation coefficient (d33) in the thickness direction (Z) of 1,000 pC / N or more, thereby realizing a vibrating device with improved vibration characteristics. For example, a vibrating device with improved vibration characteristics can be realized as a large-area device.

[0057] The vibrating portion 21a according to an embodiment of the present disclosure may have a circular, elliptical, or polygonal shape, but is not limited thereto.

[0058] The first electrode unit 21b may be disposed on the first surface (or upper surface) of the vibrating unit 21a. For example, the first electrode unit 21b may be electrically connected to the first surface of the vibrating structure 21. For example, the first electrode unit 21b may have the shape of a single electrode (or a common electrode) disposed over the entire first surface of the vibrating structure 21. For example, the first electrode unit 21b may have the same shape as the vibrating unit 21a, but is not limited thereto. The first electrode unit 21b according to an embodiment of the present specification may be made of a transparent conductive material, a semi-transparent conductive material, or an opaque conductive material. For example, the transparent or semi-transparent conductive material may include, but is not limited to, indium tin oxide (ITO) or indium zinc oxide (IZO). The opaque conductive material may include, but is not limited to, aluminum (Al), copper (Cu), gold (Au), silver (Ag), molybdenum (Mo), magnesium (Mg), or an alloy thereof.

[0059] The second electrode unit 21c may be disposed on a second surface (or rear surface) opposite to or other than the first surface of the vibrating unit 21a. For example, the second electrode unit 21c may be electrically connected to the second surface of the vibrating unit 21a. For example, the second electrode unit 21c may have the shape of a single electrode (or a common electrode) disposed over the entire second surface of the vibrating unit 21a. For example, the second electrode unit 21c may have the same shape as the vibrating unit 21a, but is not limited thereto. According to one embodiment of the present specification, the second electrode unit 21c may be made of a transparent conductive material, a semi-transparent conductive material, or an opaque conductive material. For example, the second electrode unit 21c may be made of the same material as the first electrode unit 21b, but is not limited thereto. According to another embodiment of the present specification, the second electrode unit 21c may be made of a different material from the first electrode unit 21b.

[0060] The connecting member 15 is disposed between the diaphragm 10 and the vibration generator 20, thereby enabling the vibration generator 20 to be connected or coupled to one surface of the diaphragm 10. For example, the vibration generator 20 can be supported or disposed on the front or rear surface of the diaphragm 10 by being connected or coupled to the front or rear surface of the diaphragm 10 via the connecting member 15.

[0061] The connecting member 15 according to an embodiment of the present disclosure may be made of a material including an adhesive layer with excellent adhesion or bonding strength to one side of the diaphragm 10 and the vibration generator 20. For example, the connecting member 15 may include, but is not limited to, a foam pad, double-sided tape, or adhesive. For example, the adhesive layer of the connecting member 15 may include, but is not limited to, epoxy, acrylic, silicone, or urethane. For example, the adhesive layer of the connecting member 15 may include an acrylic-based material (or material) that has relatively excellent adhesion and high hardness among acrylics and urethanes. Therefore, vibrations of the vibration generator 20 can be efficiently transmitted to the diaphragm 10.

[0062] In the vibration generator 20, the first protective member 21e can be disposed on the first electrode portion 21b, and the first protective member 21e can protect the first electrode portion 21b. The second protective member 21f can be disposed on the second electrode portion 21c, and the second protective member 21f can protect the second electrode portion 21c. For example, each of the first protective member 21e and the second protective member 21f of the vibration generator 20 can be made of, but is not limited to, a plastic material, a fiber material, or wood. For example, in the vibration generator 20, the first protective member 21e can be made of the same or a different material as the second protective member 21f. One or more of the first protective member 21e and the second protective member 21f of the vibration generator 20 can be connected or coupled to one side of the diaphragm 10 via a connecting member 15.

[0063] In each of vibration generators 20, each of first and second protective members 21e, 21f can be, but is not limited to, a polyimide film or a polyethylene terephthalate film.

[0064] In the embodiment of the present specification, the vibration generator 20 may further include a first adhesive layer 21d and a second adhesive layer 21g.

[0065] In the vibration generator 20, the first adhesive layer 21d may be disposed between the vibrating structure 21 and the first protective member 21e. For example, the first adhesive layer 21d may be disposed between the first electrode portion 21b of the vibrating structure 21 and the first protective member 21e. The first protective member 21e may be disposed on the first surface (or the first electrode portion 21b) of the vibrating structure 21 via the first adhesive layer 21d. For example, the first protective member 21e may be bonded or connected to the first surface (or the first electrode portion 21b) of the vibrating structure 21 by a film laminating process via the first adhesive layer 21d.

[0066] In the vibration generator 20, the second adhesive layer 21g may be disposed between the vibrating structure 21 and the second protective member 21f. For example, the second adhesive layer 21g may be disposed between the second electrode portion 21c of the vibrating structure 21 and the second protective member 21f. The second protective member 21f may be disposed on the second surface (or the second electrode portion 21c) of the vibrating structure 21 via the second adhesive layer 21g. For example, the second protective member 21f may be bonded or connected to the second surface (or the second electrode portion 21c) of the vibrating structure 21 by a film laminating process via the second adhesive layer 21g.

[0067] In the vibration generator 20, the first and second adhesive layers 21d and 21g may include an electrically insulating material. For example, the electrically insulating material may be a material that has adhesive properties and is compressible and resilient. For example, one or more of the first and second adhesive layers 21d and 21g may include, but are not limited to, an epoxy resin, an acrylic resin, a silicone resin, or a urethane resin.

[0068] In the vibration generator 20, the first and second adhesive layers 21d, 21g may be connected or bonded to each other between the first protective member 21e and the second protective member 21f. For example, in the vibration generator 20, the first and second adhesive layers 21d, 21g may be connected or bonded to each other at the edge between the first protective member 21e and the second protective member 21f. Thus, in the vibration generator 20, the vibrating structure 21 may be surrounded by the first and second adhesive layers 21d, 21g. For example, the first and second adhesive layers 21d, 21g may completely surround the entire vibrating structure 21 of the vibration generator 20.

[0069] The adhesive layer of the connecting member 15 may further include an additive such as a tackifier, a wax component, or an antioxidant. The additive can prevent the connecting member 15 from being detached (or peeled) from the diaphragm 10 due to the vibration of the vibration generator 20. For example, the tackifier can be a rosin derivative, and the wax component can be paraffin wax. For example, the antioxidant can be a phenol-based antioxidant such as a thioester, but is not limited thereto.

[0070] According to another example, the connecting member 15 may further include a hollow portion provided between the diaphragm 10 and the vibration generator 20. The hollow portion of the connecting member 15 may have an air gap between the diaphragm 10 and the vibration generator 20. The air gap can minimize vibration loss due to the connecting member 15 by concentrating sound waves (or sound pressure) caused by the vibration of the vibration generator 20 on the diaphragm 10 without dispersing them through the connecting member 15, thereby increasing the sound pressure characteristics of the sound generated by the vibration of the diaphragm 10.

[0071] The connecting member 15 is arranged to overlap the vibrating structure 21 and can include a first connecting member 15a located between the diaphragm 10 and the vibrating structure 21 and a second connecting member 15b arranged to surround the first connecting member.

[0072] The first connecting member 15a may include a connecting member having a high elastic modulus to improve the performance of the vibration device, since it serves to transmit vibrations generated in the vibrating structure 21. For example, the first connecting member 15a may include an epoxy, hot melt adhesive, or silicone adhesive, and the second connecting member 15b may include an acrylic adhesive.

[0073] According to an embodiment of the present specification, the first connecting member 15a may have a higher elastic modulus than the second connecting member 15a. For example, if the first connecting member 15a is made of a silicone-based adhesive or an epoxy-based adhesive, the elastic modulus may range from 0.1 GPa to 1 GPa (Giga Pascal), and if the second connecting member is made of an acrylic-based adhesive, the elastic modulus may range from 0.01 to 0.1 MPa (Mega Pascal), but is not limited thereto.

[0074] FIG. 3A shows the damping characteristics of the first connecting member 15a, FIG. 3B shows the damping characteristics of the second connecting member 15b, and FIG. 3C shows the damping characteristics after the second connecting member is laminated. The damping characteristics of FIGS. 3A-3C were measured using a diaphragm made of two 0.5mm thick (0.5t) sheets of glass laminated together. A vibrating structure was placed approximately 20mm thick on the diaphragm, and the first connecting member 15a or second connecting member (each sample) was positioned between the vibrating structures. The damping characteristics were measured by calculating the damping ratio for a measurement frequency of 66kHz. The damping characteristics were measured at 80ms intervals for a one-cycle sine wave signal, at a position 0.5cm away from the vibrating structure and the first / second connecting member. Table 1 summarizes the damping measurement results of FIGS. 3A and 3C. Hereinafter, a high damping ratio means that the signal or vibration generated by the vibrating structure decays quickly, resulting in no reverberation.

[0075] [Table 1]

[0076] 3A-3C and Table 1, the measured damping ratios of the silicone adhesive for Samples A and B were 0.193% and 0.524%, respectively, showing low values with some variation between samples, while the measured damping ratio of the acrylic adhesive for Sample CE showed high values ranging from a minimum of 0.744% to a maximum of 0.939%. For Sample F, the same samples were laminated and measured, resulting in a damping ratio of 0.372%-0.398%.

[0077] Referring to the results of Figures 3A to 3C and Table 1 in relation to Figure 1, when a material with a high elastic coefficient is used for the first connecting member, the vibration generated in the vibrating structure 21 can be effectively transmitted to the diaphragm in the area overlapping with the vibrating structure 21, and when a material with a low elastic coefficient is used for the second connecting member, residual vibration caused by the vibration generated in the vibrating structure 21 in the outer shell can be quickly suppressed.

[0078] FIG. 4 shows a vibration device 2 according to another embodiment of the present disclosure.

[0079] Referring to FIG. 4, a vibration device 2 according to another embodiment of the present specification includes a vibration plate 10, a vibration generator 20 disposed on the vibration plate 10, and a connecting member 15 between the vibration plate 10 and the vibration generator 20, the connecting member 15 including a metal material.

[0080] Compared to the vibration device 1 described in Figures 1 to 3C, it is the same except for the use of a single connecting member 15, so the same drawing symbols are given to corresponding parts and redundant explanations thereof will be omitted.

[0081] 4, a connecting member according to an embodiment of the present disclosure may include a metal material and an adhesive layer. For example, the metal material may be metal particles such as aluminum, nickel, copper, or silver, and / or conductive carbon nanoparticles, carbon nanotubes, or carbon nanofibers. The adhesive layer may include, but is not limited to, epoxy, acrylic, silicone, or urethane.

[0082] The connecting member of the vibration device 2 according to another embodiment of the present specification may include a metal material having a high elastic modulus, thereby improving the elastic modulus and thereby increasing the vibration transmission force that transmits the vibration transmission force generated by the vibration generator to the diaphragm. Furthermore, the connecting member of the vibration device 2 according to another embodiment of the present specification may include a metal material having a high melting point, thereby exhibiting a small change in the elastic modulus due to temperature changes. Furthermore, the connecting member of the vibration device 2 according to another embodiment of the present specification may include a metal material, thereby increasing density and interfacial adhesive strength, thereby improving adhesion uniformity and minimizing the generation of bubbles.

[0083] FIG. 5 is a diagram illustrating a vibration device according to another embodiment of the present disclosure.

[0084] A vibration device 3 according to another embodiment of the present specification includes a vibration plate 10, a vibration generator 20 that vibrates the vibration plate 10, and a connecting member 15 between the vibration plate 10 and the vibration generator 20, and the vibration generator 20 may include a vibration structure 21, a first electrode portion 21b provided on a first surface of the vibration structure 21, and a second electrode portion 21b provided on a second surface opposite the first surface of the vibration structure 21.

[0085] The first electrode portion 21b and the second electrode portion 21c applied to the vibration device 3 must have excellent interfacial characteristics, thus excellent adhesive strength and surface coverage, and low resistivity, ensuring excellent electrical conductivity and reliability of the vibration device. Accordingly, numerous experiments were conducted on electrodes applicable to the vibration device 3, among aluminum (Al), copper (Cu), gold (Au), and silver (Ag). Through numerous experiments, the first electrode portion 21b and the second electrode portion 21c were constructed using silver (Ag) electrodes. However, silver (Ag) electrodes have the problem of deteriorating the vibration generator 20 in high-temperature, high-humidity environments and reducing their adhesive strength to the vibration generator 20. For example, it was recognized that when silver (Ag) electrodes, which can be fired at low temperatures, are used, they have poor contact characteristics with the interface of the vibration generator 20 (e.g., inorganic component), resulting in weak adhesive strength of the silver (Ag) electrodes, and the reduced surface area and low electrical conductivity of silver (Ag) can reduce the reliability of the vibration generator 20. Therefore, the inventors of the present specification have conducted various experiments to improve the adhesive strength and reliability of the electrode part. Through numerous experiments, they have developed an electrode part that can improve the reliability of the vibration generator 20 in a high-temperature and high-humidity environment and can improve the adhesive strength and reliability by high-temperature firing.

[0086] The first electrode unit 21b and the second electrode unit 21c may each include silver (Ag) and glass frit. For example, if the first electrode unit 21b and the second electrode unit 21c are made of silver (Ag) electrodes that can be fired at high temperatures and the glass frit content is lower than the silver (Ag), the surface coverage and adhesive strength of the silver (Ag) electrodes may be weak, the silver (Ag) content may increase, resulting in higher costs, and the reliability of the first electrode unit 21b and the second electrode unit 21c may be reduced during long-term operation. For example, if the first electrode unit 21b and the second electrode unit 21c are made of silver (Ag) electrodes that can be fired at high temperatures and the glass frit content is higher than the silver (Ag), the silver (Ag) has excellent surface coverage and adhesive strength, but the high glass frit content may reduce the conductivity and piezoelectric properties. Therefore, many experiments were carried out on the Ag content and glass frit content (e.g., changes in the glass frit content and silver (Ag) content) that can improve the reliability and adhesive strength of the vibration generator, which will be described in detail below.

[0087] 1 to 3C, the vibration device 3 in Fig. 5 is the same as the vibration device 1 described in Fig. 1 to 3C except for the configuration of the single connecting member 15 and the electrode units 21b and 21c, so the same reference numerals are used for corresponding parts and redundant description thereof will be omitted. The detailed configuration and features of the electrode units 21b and 21c will be described later with reference to Figs. 6 to 12.

[0088] For example, the first electrode unit 21b and the second electrode unit 21c can be prepared by forming or coating one or both surfaces of the vibrating unit 21a with a composition including silver (Ag), glass frit, a binder, a solvent, and a resin, and then firing the composition. The firing can be performed at a high temperature. During the firing of the first electrode unit 21b and the second electrode unit 21c, the solvent and the binder can all volatilize. Therefore, when the first electrode unit 21b and the second electrode unit 21c are prepared from silver (Ag), glass frit, a binder, a solvent, and a resin, the binder, the solvent, the resin, etc. volatilize, and the first electrode unit 21b and the second electrode unit 21c can be expressed by the following Equation 2. [Formula 2] Weight of silver or glass frit in electrode portion = (weight of silver or glass frit in composition) / (total weight of silver and glass frit in composition)

[0089] For example, silver (Ag) can be used with fine particles of 1 μm or less, and glass frit can be used with particles of 1 to 3 μm in size, but they are not limited to these. If the silver (Ag) or glass frit particles are too large, the electrode formation may become uneven during the firing process, and the firing time may also be longer.

[0090] For example, the glass frit may be, but is not limited to, a lead (Pb)-based glass frit or a bismuth (Bi)-based glass frit, and the glass transition temperature (Tg) of the glass frit may be 330 to 380°C.

[0091] According to one embodiment of the present specification, the electrode composition for forming the first electrode portion 21b and the second electrode portion 21c may contain 63 to 67 wt% silver (Ag) particles and 3 to 4 wt% glass frit. The glass frit may be lead (Pb)-based glass frit. The electrode composition thus prepared may be coated on one side of a vibrating structure to a thickness of approximately 7 to 8 μm and then fired at 650°C. Then, adhesive layers 21d and 21g and protective members 21e and 21f may be bonded to the electrode portions by a film laminating process, as in the structure of the vibrating device shown in FIG. 5. FIG. 6A is a scanning electron microscope image of the surface of an electrode prepared according to the above embodiment, and FIG. 6B is a scanning electron microscope image of a cross section of the boundary between the electrode portion and the vibrating structure. 6A and 6B, the electrode portion is generally formed with excellent surface coverage without voids, and the interface between the electrode portion and the vibration structure exhibits excellent adhesion, with the electrode portion and the vibration structure well bonded to each other without voids due to high adhesive properties, and the electrode portion has excellent film uniformity. In the electrode portion of the example prepared under the conditions of FIG. 6, silver (Ag) accounts for approximately 95.7 wt% and glass frit accounts for approximately 4.3 wt%.

[0092] The sound pressure characteristics were measured using a vibration device prepared under the conditions shown in Figure 6, and the measured value was set as the reference sound pressure value. After measuring the sound pressure, a reliability test was conducted by exposing the vibration device prepared under the conditions shown in Figure 6 to a high-temperature, high-humidity environment. The interface characteristics of the prepared electrode were analyzed based on whether the reference sound pressure value remained unchanged after the reliability test. The sound pressure of the vibration device was measured using a commercially available Audio Precision APX525 device. The input voltage was set to 5 Vrms, and a sine sweep was performed in the range of 150 Hz to 8 kHz. The signal was amplified and applied to the vibration device through an amplifier. The average sound pressure was measured using a microphone 30 cm away from the diaphragm 10, which is the vibration target, and the sound pressure measured using the Audio Precision APX525 was recorded. The measured sound pressure was corrected using 1 / 3 octave smoothing. The sine sweep may be a method for performing a sweep in a short time, but is not limited to this method.

[0093] Figure 6C is a scanning electron microscope photograph of the surface of the electrode part prepared in Figure 6A taken at 3,000 magnifications, Figure 6D is a photograph of silver (Ag) element mapping using an EDS analyzer, Figure 6E is a photograph of lead (Pb) element mapping using an EDS analyzer, and Figure 6F is a photograph of zinc (Zn) element mapping using an EDS analyzer.

[0094] Referring to Figures 6C to 6F, based on the image analysis results of the scanning electron microscope photographs and the silver (Ag) element mapping photographs, it was determined that silver (Ag) occupied approximately 83% of the area of the electrode. Furthermore, the sheet resistance of the prepared electrode was measured to be less than 0.01 Ω / sq (ohm / square). Fracture analysis revealed that the average thickness of the electrode was approximately 3.4 μm. Lead (Pb) and zinc (Zn) are components of the piezoelectric and glass frit contained in the vibrating part, respectively. Lead (Pb) and zinc (Zn) elements can be mapped to areas where silver (Ag) was not formed in the vibrating part. Furthermore, the glass frit migrated to the interface between the vibrating part and the electrode part during the firing process, allowing only a portion of it to be observed on the surface side. Therefore, lead (Pb) and zinc (Zn) elements can occupy approximately 17% of the area excluding the area occupied by silver (Ag).

[0095] According to another embodiment of the present specification, the electrode composition for forming the first electrode portion 21b and the second electrode portion 21c may contain approximately 50 wt% silver (Ag) particles and 5-12 wt% glass frit. The electrode composition thus prepared may be coated on one side of the vibrating structure to a thickness of approximately 7-8 μm and then fired at 650°C. Here, the glass frit may be lead (Pb)-based glass frit. The electrode composition thus prepared may be fired at 650°C. Then, adhesive layers 21d and 21g and protective members 21e and 21f may be bonded onto the electrode portions by a film laminating process, as in the vibrating device structure of FIG. 5.

[0096] Fig. 7A is a scanning electron micrograph of the surface of an electrode prepared according to an embodiment containing about 50 wt% silver (Ag) particles and about 12 wt% glass frit, Fig. 7B is a scanning electron micrograph of a cross section of the boundary between the electrode portion and the vibrating structure, Fig. 8A is a scanning electron micrograph of the surface of an electrode prepared according to an embodiment containing about 50 wt% silver (Ag) particles and about 8 wt% glass frit, Fig. 8B is a scanning electron micrograph of a cross section of the boundary between the electrode portion and the vibrating structure, Fig. 9A is a scanning electron micrograph of the surface of an electrode prepared according to an embodiment containing about 50 wt% silver (Ag) particles and about 5 wt% glass frit, Fig. 9B is a scanning electron micrograph of a cross section of the boundary between the electrode portion and the vibrating structure.

[0097] 7A to 9B, the electrode units were generally formed with excellent surface coverage without voids, and the interface between the electrode unit and the vibration structure exhibited excellent adhesion, with the electrode unit and the vibration structure well bonded to each other without voids due to their high adhesive properties, demonstrating excellent film uniformity. The vibration device prepared according to the embodiment of FIGS. 7 to 9 had initial sound pressure measurements that were approximately 100% of the sound pressure measurements in FIG. 6, and even after reliability tests in high-temperature, high-humidity environments, sound pressure values were measured at the same level as before the reliability tests. In the electrode units of the embodiment prepared under the conditions of FIGS. 7 to 9, silver (Ag) accounted for approximately 80.7 to 90.9 wt%, and glass frit accounted for approximately 9.9 to 19.4 wt%.

[0098] Figure 7C is a scanning electron microscope photograph of the surface of the electrode part prepared in Figure 7A taken at 3,000 magnifications, Figure 7D is a photograph of silver (Ag) element mapping using an EDS analyzer, Figure 7E is a photograph of lead (Pb) element mapping using an EDS analyzer, and Figure 7F is a photograph of zinc (Zn) element mapping using an EDS analyzer.

[0099] Referring to Figures 7C to 7F, scanning electron microscope photographs and image analysis results of the Ag element mapping reveal that Ag occupies approximately 75% of the electrode area. Furthermore, the sheet resistance of the prepared electrode was measured to be 0.015 Ω / sq (ohm / square). Fracture analysis revealed that the average thickness of the electrode was approximately 2.1 μm. Lead (Pb) and zinc (Zn) elements represent the components of the piezoelectric and glass frit contained in the vibrating part, respectively. Lead (Pb) and zinc (Zn) elements can be mapped to areas where Ag was not formed in the vibrating part. Furthermore, the glass frit migrated to the interface between the vibrating part and the electrode part during the firing process, and only a portion of it was observed on the surface. Therefore, lead (Pb) and zinc (Zn) elements can occupy approximately 25% of the area excluding the area occupied by Ag.

[0100] According to another embodiment of the present specification, the electrode composition for forming the first electrode portion 21b and the second electrode portion 21c may contain approximately 40 wt% silver (Ag) particles and approximately 4 wt% glass frit. Here, the glass frit may be bismuth (Bi)-based glass frit. The electrode composition thus prepared may be fired at 650°C. The electrode composition thus prepared may be coated on one side of a vibrating structure to a thickness of approximately 7 to 8 μm and then fired at 650°C. Thereafter, adhesive layers 21d and 21g and protective members 21e and 21f may be bonded to the electrode portion by a film laminating process, as in the structure of the vibrating device shown in FIG. 5. FIG. 10A is a scanning electron microscope image of the surface of an electrode prepared according to the above embodiment, and FIG. 10B is a scanning electron microscope image of a cross section of the boundary between the electrode portion and the vibrating structure. 10A and 10B, the electrode portion was formed with excellent surface coverage without voids. The interface between the electrode portion and the vibrating structure exhibited excellent adhesion, with the electrode portion and the vibrating structure well bonded to each other without voids due to their high adhesive properties. The electrode portion also exhibited excellent film uniformity. The vibration device prepared according to the embodiment shown in FIGS. 10A-10F had initial sound pressure measurements that were approximately 100% of those shown in FIGS. 6A-6F. Even after reliability tests in high-temperature, high-humidity environments, the sound pressure remained at the same level as before the reliability tests. In the electrode portion of the embodiment prepared under the conditions shown in FIGS. 10A-10F, silver (Ag) accounted for approximately 83.3 wt% and glass frit accounted for approximately 9.9-19.4 wt%.

[0101] Figure 10C is a scanning electron microscope photograph of the surface of the electrode part prepared in Figure 10A taken at 3,000 magnifications, Figure 10D is a photograph of silver (Ag) element mapping using an EDS analyzer, Figure 10E is a photograph of lead (Pb) element mapping using an EDS analyzer, and Figure 10F is a photograph of zinc (Zn) element mapping using an EDS analyzer.

[0102] Referring to Figures 10C to 10F, based on the image analysis results of the scanning electron microscope photographs and the photographs mapped for silver (Ag), it was determined that (Ag) occupied approximately 70% of the area of the electrode. Furthermore, the sheet resistance of the prepared electrode was measured to be 0.037 Ω / sq (ohm / square), and the average thickness was measured by fracture analysis, resulting in a thickness of approximately 1.8 μm. Lead (Pb) and zinc (Zn) elements represent the components of the piezoelectric and glass frit contained in the vibrating part, respectively. Lead (Pb) and zinc (Zn) elements can be mapped in areas where silver (Ag) was not formed in the vibrating part. Furthermore, the glass frit migrated to the interface between the vibrating part and the electrode part during the firing process, and only a portion of it was observed on the surface side. Therefore, lead (Pb) and zinc (Zn) elements can occupy approximately 30% of the area excluding the area occupied by silver (Ag).

[0103] According to Experimental Example 1, the first and second electrode units can be prepared from low-temperature fired Ag electrodes. The electrode units according to this experiment can be prepared, for example, by forming a silver (Ag) electrode paste on the vibrating unit using a printing process and then firing it at a low temperature at 150°C. Then, adhesive layers 21d and 21g and protective members 21e and 21f can be bonded to the electrode units using a film laminating process, as in the structure of the vibrating device shown in FIG. 5. FIG. 11 is a scanning electron microscope image of a cross section of the interface between the electrode unit and the vibrating structure prepared according to the experiment. As shown in FIG. 11, the silver (Ag) particles used in flake form have a small specific surface area, and the low adhesive strength between the electrode unit and the vibrating structure results in the formation of voids V at the interface, resulting in poor interfacial adhesion. The vibrating device prepared according to Experimental Example 1 shown in FIG. 11 failed to meet the required sound pressure values both in the initial sound pressure measurements and after reliability tests in a high-temperature, high-humidity environment. Here, the required sound pressure value may be a value that indicates a value between 100% and less than 97%. In the electrode part of Experimental Example 1 prepared under the conditions of Figure 11, silver (Ag) may account for about 98.0 wt% and glass frit may account for about 2.0 wt%.

[0104] According to Experimental Example 2, the electrode composition for forming the first electrode portion 21b and the second electrode portion 21c may contain approximately 40 wt% silver (Ag) particles and approximately 20 wt% glass frit. Alternatively, the silver (Ag) particles may be approximately 50 wt% and the glass frit may be approximately 1-3 wt%. Here, the glass frit may be lead (Pb)-based glass frit. The electrode composition prepared in this manner may be fired at 650°C. Thereafter, adhesive layers 21d and 21g and protective members 21e and 21f may be bonded to the electrode portions by a film laminating process, as in the structure of the vibration device shown in FIG. 5. FIG. 12A is a scanning electron microscope image of the surface of the electrode prepared according to the above-described experimental example, and FIG. 12B is a scanning electron microscope image of the cross section of the boundary between the electrode portion and the vibration structure. 12A and 12B, the electrode part has a large number of voids formed on its surface, resulting in low surface coverage. The electrode part and the vibration structure have a large number of voids V due to low adhesion, resulting in low adhesion between the electrode part and the vibration structure. The vibration device prepared according to Experimental Example 2 of FIG. 12 failed to meet the required sound pressure values in both the initial sound pressure measurement and the sound pressure measurement after reliability testing in a high-temperature, high-humidity environment. In the electrode part of Experimental Example 2 prepared under the conditions of FIG. 12, silver (Ag) accounted for approximately 94.3 wt% and glass frit accounted for approximately 5.7 wt%.

[0105] 5 to 12B, an electrode portion of a vibrating device according to an embodiment of the present specification may include 80 to 95 wt% silver (Ag) by weight percent (wt%) and 5 to 20 wt% lead (Pb)-based glass frit by weight percent. Furthermore, an electrode portion of a vibrating device according to an embodiment of the present specification may include 80 to 90 wt% silver (Ag) by weight percent and 10 to 20 wt% lead (Pb)-based glass frit by weight percent. Furthermore, an electrode portion of a vibrating device according to an embodiment of the present specification may include 80 to 90 wt% silver (Ag) by weight percent and 10 to 20 wt% bismuth (Bi)-based glass frit by weight percent. For example, in an electrode portion according to an embodiment of the present specification, the total content of silver (Ag) and glass frit may be at least 40 wt% by weight of the metal paste of the electrode portion, and the content of the glass frit may be at least 12 wt% by weight or less. Therefore, the piezoelectric characteristics and reliability of the electrode portion may be improved.

[0106] FIG. 13 is a diagram showing a vibration device according to another embodiment of the present specification, FIG. 14 is a plan view of the vibration generator, and FIG. 15 is a cross-sectional view taken along line II' in FIG.

[0107] 13 and 14 , a vibration device 4 according to another embodiment of the present specification may include a diaphragm 10, a vibration generator 20 that vibrates the diaphragm 10, and a connecting member 15 between the diaphragm 10 and the vibration generator 20. The vibration generator 20 may include a vibrating structure, a first electrode unit 21b provided on a first surface of the vibrating structure, and a second electrode unit 21c provided on a second surface of the vibrating structure opposite the first surface. The vibration generator 20 may further include a first cover member 21e provided on the first electrode unit 21b, a second cover member 21f provided on the second electrode unit 21c, a signal cable 30 electrically connected to the vibrating structure, and a signal generating circuit 40 mounted on the signal cable 30.

[0108] The signal generating circuit 40 may be mounted on the signal cable 30. For example, the signal generating circuit 40 may be mounted on an edge of the signal cable 30 adjacent to the pad portion 21p of the vibration generator. By integrating (or mounting) the signal generating circuit 40 on the signal cable 30, the signal generating circuit 40 and the signal cable 30 may be realized as a single component. For example, the signal generating circuit 40 may be, but is not limited to, an acoustic processing circuit or a vibration driving circuit.

[0109] The signal cable 30 may be made of, but is not limited to, a double-sided flexible printed circuit, a flexible printed circuit cable, a flexible flat cable, a single-sided flexible printed circuit, a single-sided flexible printed circuit board, a flexible multilayer printed circuit, or a flexible multilayer printed circuit board.

[0110] A signal cable 30 according to one embodiment of the present specification may include a wiring layer 31, a lower film 32 bonded to a first surface of the wiring layer via an adhesive 33, an upper film 34 bonded to a second surface of the wiring layer via an adhesive 35, and a plurality of contact pads and first and second terminals disposed on the upper film 34 and connected to the wiring layer 31.

[0111] The wiring layer 31 may include a base film and a plurality of signal lines, a first driving signal supply line, a second driving signal supply line, etc. formed on one or more of the front and bottom surfaces of the base film. For example, the plurality of signal lines, the first driving signal supply line, and the second driving signal supply line may be made of a conductive material including, but not limited to, copper (Cu), aluminum (Al), silver (Ag), or an alloy material of copper (Cu) and silver (Ag). For example, the wiring layer 31 may be expressed by terms such as line, wire line, wiring line, signal line, metal line, etc., but is not limited to these.

[0112] Each of the plurality of contact pads is disposed on one of the lower film and the upper film, and can be selectively connected to a plurality of signal lines, a first driving signal supply line, a second driving signal supply line, etc. through via holes.

[0113] The first and second terminals may be electrically coupled to first and second pad electrodes of the pad portion 21p formed on the vibration generator, respectively.

[0114] The signal generating circuit 40 may be mounted on the signal cable 30 and electrically connected to the contact pads. The signal generating circuit 40 may receive audio data (or digital audio data), a clock, an enable signal, various drive voltages, and the like, supplied from an external audio data generating circuit via some of the contact pads. The signal generating circuit 40 may generate first and second vibration drive signals based on the audio data and output the generated first and second vibration drive signals to the first and second terminals via the corresponding contact pads and corresponding drive signal supply lines. Thus, the vibration generator 20 may vibrate in response to the first and second vibration drive signals supplied from the signal generating circuit 40 mounted on the signal cable 30 via the signal line, the first and second terminals, the pad portion 21p, and the first and second power supply lines (or conductive lines) (PL1, PL2) of the signal cable 30.

[0115] The signal generating circuit 40 according to one embodiment of the present specification may include a decoding unit that receives acoustic data supplied from an external acoustic data generating circuit unit, an audio amplifier circuit that generates and outputs first and second vibration drive signals based on the acoustic data supplied from the decoding unit, a memory circuit that stores setting values of the audio amplifier circuit, a control circuit that controls the operations of the decoding unit, the audio amplifier circuit, and the memory circuit, and passive elements such as resistors.

[0116] The audio amplifier circuit may include, but is not limited to, a preamplifier circuit that generates first and second vibration drive signals based on acoustic data, and a power amplifier circuit that converts the voltage and / or current of each of the first and second vibration drive signals supplied from the preamplifier circuit to a level suitable for driving the vibration generator 20.

[0117] Each of the decoding section, audio amplifier circuit, memory circuit, and control circuit may be realized in the form of an integrated circuit and mounted on the signal cable 30 .

[0118] The vibration generator 20 according to another embodiment of this specification includes a signal generating circuit 40 mounted on the signal cable 30, thereby simplifying or simplifying the connection structure between the vibration generator 20, the signal generating circuit 40, the signal cable 30, and the acoustic data generating circuit unit, and since the signal generating circuit 40 is disposed adjacent to the vibration generator 20, a filter circuit including an inductor and a capacitor for preventing electromagnetic interference (EMI) and the like caused by the length of the signal cable 30 due to the distance between the signal generating circuit 40 and the vibration generator 20 can be omitted.

[0119] According to other embodiments of the present specification, in the vibration generator 20 according to other embodiments of the present specification, the signal cable 30 on which the signal generating circuit 40 is implemented or integrated is applicable to the vibration generator 20 described in one or more of Figures 1, 4, and 5. For example, although the signal cable 30 and the signal generating circuit 40 are not shown in Figures 1, 4, and 5, the vibration device of Figures 1, 4, and 5 can be configured such that the signal cable 30 of the vibration generator 20 described in Figure 13 includes the signal generating circuit 40.

[0120] Fig. 16 is a diagram showing a vibration generator according to another embodiment of the present specification, Fig. 17 is a cross-sectional view taken along line II-II' in Fig. 16, and Fig. 18 is a side cross-sectional view taken along line III-III' in Fig. 16. Fig. 19 is a perspective view showing the piezoelectric vibration part shown in Fig. 18. Fig. 16 shows a modified connection structure between the electrode part and the signal cable shown in Fig. 14.

[0121] 16 to 19, a vibration generator 20 according to another embodiment of the present specification may include a vibration generating unit and a signal cable 30.

[0122] The vibration structure may include a piezoelectric vibration part 21 a, a first electrode part 21 b, and a second electrode part 21 c. The vibration structure is substantially the same as the vibration structure 21 of the vibration generator 20 described with reference to FIG. 1, so the same reference numerals are used for corresponding parts and redundant description thereof will be omitted.

[0123] The signal cable 30 may be integrated with the vibrating structure by being electrically connected to the first and second electrodes 21b and 21c on one side of the vibration generator 20. For example, the signal cable 30 may be electrically connected directly to the first and second electrodes 21b and 21c.

[0124] A signal cable 30 according to an embodiment of the present disclosure may include first and second protruding lines 31a and 31b. For example, the first protruding line 31a may overlap at least a portion of the first electrode portion 21b and be electrically or directly connected to the first electrode portion 21b. The second protruding line 31b may overlap at least a portion of the second electrode portion 21c and be electrically or directly connected to the second electrode portion 21c. For example, the first and second protruding lines 31a and 31b may be bent toward the corresponding electrode portion 21b and 21c, but this is not intended to be limiting. For example, the first and second protruding lines 31a and 31b may be referred to as, but are not limited to, protruding electrodes, extension lines, finger lines, conductive lines, or finger electrodes.

[0125] The signal cable 30 according to one embodiment of the present disclosure may include a body portion, first and second protruding lines 31 a and 31 b, and a signal generating circuit 40 .

[0126] The body may be made of, but is not limited to, a flexible printed circuit cable, a flexible flat cable, a single-sided flexible printed circuit, a single-sided flexible printed circuit board, a flexible multi-layer printed circuit, or a flexible multi-layer printed circuit board.

[0127] The body portion according to one embodiment of the present specification may include a wiring layer 31, a lower film 32 bonded to a first surface of the wiring layer 31 via a first adhesive 33, an upper film 34 bonded to a second surface of the wiring layer 31 via a second adhesive 35, and a plurality of contact pads disposed on the upper film 34 and connected to the wiring layer 31.

[0128] The wiring layer 31 may include a base film, and a plurality of signal lines, a first driving signal supply line, a second driving signal supply line, etc. formed on one or more of the front and bottom surfaces of the base film. For example, the plurality of signal lines, the first driving signal supply line, the second driving signal supply line, etc. may be made of a conductive material including, but not limited to, copper (Cu), aluminum (Al), silver (Ag), or an alloy material of copper (Cu) and silver (Ag).

[0129] Each of the plurality of contact pads is disposed on one of the lower film and the upper film, and can be selectively connected to a plurality of signal lines, a first driving signal supply line, a second driving signal supply line, etc. through via holes.

[0130] The first and second protruding lines 31a and 31b may be electrically connected to the first and second drive signal supply lines, respectively, disposed on the wiring layer 31, or may extend or protrude from the first and second drive signal supply lines through the one side surface 30s of the body portion to the outside. Each of the first and second protruding lines 31a and 31b may protrude to a certain length from the one side surface 30s of the body portion. For example, each of the first and second protruding lines 31a and 31b may extend or protrude from the one side surface 30s of the body portion in the second direction (Y) to a length that overlaps at least a portion of each of the first and second electrode portions 21b and 21c.

[0131] The first protruding line 31a may bend over the first electrode unit 21b on one side surface 30s of the body (or one side of the vibration generator 20) and be electrically connected to at least a portion of the first electrode unit 21b. For example, the first protruding line 31a may be electrically connected directly to or in contact with at least a portion of the first electrode unit 21b. For example, the first protruding line 31a may be electrically connected to the first electrode unit 21b via a conductive member such as a conductive ball or conductive double-sided tape.

[0132] The second protruding line 31b may bend over the second electrode portion 21c on one side surface 30s of the body portion (or one side of the vibration generator 20) and be electrically connected to at least a portion of the second electrode portion 21c. For example, the second protruding line 31b may be electrically connected directly to or in contact with at least a portion of the second electrode portion 21c. For example, the second protruding line 31b may be electrically connected to the second electrode portion 21c via a conductive member such as a conductive ball or conductive double-sided tape.

[0133] The signal generating circuit 40 may be mounted on the signal cable 30 and electrically connected to the contact pads. The signal generating circuit 40 may receive acoustic data (or digital acoustic data), a clock, an enable signal, various drive voltages, and the like, supplied from an external acoustic data generating circuit via some of the contact pads. The signal generating circuit 40 may generate first and second vibration drive signals based on the acoustic data and output the generated first and second vibration drive signals to the first and second protruding lines 31a, 31b via the corresponding contact pads and corresponding drive signal supply lines. Thus, the vibration generator 20 may vibrate in response to the first and second vibration drive signals supplied from the signal generating circuit 40 mounted on the signal cable 30 via the signal line, the first and second drive signal supply lines, and the first and second protruding lines 31a, 31b of the signal cable 30.

[0134] The signal generating circuit 40 according to one embodiment of the present specification may include a decoding unit, an audio amplifier circuit, a memory circuit, a control circuit, and passive elements such as resistors, and is substantially the same as the signal generating circuit 40 described above, so the same reference numerals are used for corresponding parts and redundant description thereof will be omitted.

[0135] The signal cable 30 according to one embodiment of the present specification can directly supply a vibration drive signal to each of the first and second electrode portions 21b and 21c via the first and second protruding lines 31a and 31b, respectively, thereby reducing the voltage drop due to the surface resistance characteristics of each of the first and second electrode portions 21b and 21c, compensating for the electrical characteristics of each of the first and second electrode portions 21b and 21c, and increasing the freedom of selection of conductive materials used for the first and second electrode portions 21b and 21c.

[0136] A vibration generator 20 according to another embodiment of the present disclosure may further include a first cover member 21e and a second cover member 21f.

[0137] The first cover member 21e may be disposed on a first surface of the vibration generator 20. For example, the first cover member 21e may be configured to cover the first electrode portion 21b and the first protruding line 31a of the signal cable 30. Thus, the first cover member 21e can protect the first electrode portion 21b and the first protruding line 31a of the signal cable 30, and can electrically connect the first protruding line 31a of the signal cable 30 to the first electrode portion 21b or maintain an electrical connection between the first protruding line 31a of the signal cable 30 and the first electrode portion 21b.

[0138] The second cover member 21f may be disposed on the second surface of the vibration generator 20. For example, the second cover member 21f may be configured to cover the second electrode portion 21c and the second protruding line 31b of the signal cable 30. Thus, the second cover member 21f can protect the second electrode portion 21c and the second protruding line 31b of the signal cable 30, and can electrically connect the second protruding line 31b of the signal cable 30 to the second electrode portion 21c or maintain an electrical connection between the second protruding line 31b of the signal cable 30 and the second electrode portion 21c.

[0139] According to an embodiment of the present disclosure, each of the first and second cover members 21e and 21f may include, but is not limited to, one or more of plastic, fiber, and wood. For example, each of the first and second cover members 21e and 21f may include the same or different materials. For example, each of the first and second cover members 21e and 21f may be, but is not limited to, a polyimide film or a polyethylene terephthalate film.

[0140] The first cover member 21e according to one embodiment of the present specification may be connected or coupled to the first electrode portion 21b and the first protruding line 31a of the signal cable 30 via the first adhesive layer 21d. For example, the first cover member 21e may be connected or coupled to the first electrode portion 21b and the first protruding line 31a of the signal cable 30 by a film process via the first adhesive layer 21d. Thus, the first protruding line (or first finger line) 31a of the signal cable 30 may be disposed between the first electrode portion 21b and the first cover member 21e and integrated with the vibration generator 20.

[0141] According to an embodiment of the present specification, the second cover member 21f may be connected or joined to the second electrode portion 21c and the second protruding line 31b of the signal cable 30 via the second adhesive layer 21g. For example, the second cover member 21f may be connected or joined to the second electrode portion 21c and the second protruding line 31b of the signal cable 30 by a film laminating process via the second adhesive layer 21g. Thus, the second protruding line (or second finger line) 31b of the signal cable 30 may be disposed between the second electrode portion 21c and the second cover member 21f and integrated with the vibration generator 20.

[0142] Each of the first and second cover members 21e and 21f according to an embodiment of the present specification does not include or require a pad portion and a power supply line for receiving a vibration drive signal from the signal cable 30, and therefore may be a protective film or an insulating film for protecting the piezoelectric vibration portion 21a and the electrode portions 21b and 21c, etc. For example, each of the first and second cover members 21e and 21f may be a polyimide film or a polyethylene terephthalate film, but is not limited thereto.

[0143] According to other embodiments of the present specification, the first and second cover members 21e and 21f are electrically insulated from the electrode portions 21b and 21c by the adhesive layers 21d and 21g, respectively. Therefore, at least one of the first and second cover members 21e and 21f may include a metal film or metal plate made of a metal material. The first and second cover members 21e and 21f made of a metal material may compensate for the mass of the vibration generator 20 or the piezoelectric vibrating unit 21a, thereby reducing the resonant frequency of the vibrating structure due to the increased mass, thereby increasing the acoustic characteristics and / or sound pressure characteristics in the low-frequency range generated by the vibration of the vibration generator 20 or the piezoelectric vibrating unit 21a. For example, the first and second cover members 21e and 21f made of a metal material may be made of one or more of the following materials, but are not limited to: stainless steel, aluminum (Al), magnesium (Mg), magnesium (Mg) alloy, magnesium-lithium (Mg-Li) alloy, and aluminum (Al) alloy.

[0144] According to one embodiment of the present specification, each of the first and second adhesive layers 21d and 21g may include an electrically insulating material that is compressible and resilient while having adhesive properties. For example, each of the first and second adhesive layers 21d and 21g may include, but is not limited to, epoxy resin, acrylic resin, silicone resin, or urethane resin.

[0145] Optionally, at least a portion of the signal cable 30 may be disposed between or inserted between the first cover member 21e and the second cover member 21f. For example, one side surface 30s of the body portion of the signal cable 30 (or one side edge of the body portion) and each of the first and second protruding lines 31a, 31b may be disposed between the first cover member 21e and the second cover member 21f. For example, one side surface 30s of the body portion of the signal cable 30 and each of the first and second protruding lines 31a, 31b may be housed or inserted inside the vibration generator 20. Therefore, at least a portion of the signal cable 30 and each of the first and second protruding lines 31a, 31b are not exposed to the outside of the first cover member 21e and the second cover member 21f, respectively, thereby preventing breakage of the first and second protruding lines 31a, 31b due to stress such as movement or bending of the signal cable 30.

[0146] Vibration generator 20 according to another embodiment of the present specification may have a simplified structure and manufacturing process because the integrated structure between electrode portions 21b, 21c and signal cable 30 does not require a patterning process for forming power supply lines and pad portions on first and second cover members 21e, 21f, or a soldering process between the pad portions and signal cable 30. Furthermore, vibration generator 20 according to another embodiment of the present specification may complement the electrical characteristics of first and second electrode portions 21b, 21c by directly supplying a vibration drive signal to electrode portions 21b, 21c via first and second protruding lines 31a, 31b protruding from signal cable 30. Furthermore, the vibration generator 20 according to another embodiment of the present specification includes a signal generating circuit 40 mounted on the signal cable 30, thereby simplifying or simplifying the connection structure between the vibration generator 20, the signal generating circuit 40, the signal cable 30, and the acoustic data generating circuit unit, and by arranging the signal generating circuit 40 adjacent to the vibration generator 20, a filter circuit including an inductor and a capacitor for preventing electromagnetic interference (EMI) and the like caused by the length of the signal cable 30 due to the distance between the signal generating circuit 40 and the vibration generator 20 can be omitted.

[0147] Referring to Figures 18 and 19, the vibration element 21 according to one embodiment of the present specification may be expressed as a flexible vibration structure, flexible vibrator, flexible vibration generating element, flexible vibration generator, flexible sound generator, flexible sound element, flexible sound generating element, flexible sound generator, flexible actuator, flexible speaker, flexible piezoelectric speaker, film actuator, film type piezoelectric composite actuator, film speaker, film type piezoelectric speaker, or film type piezoelectric composite speaker, but is not limited to these.

[0148] The vibration element 21 according to an embodiment of the present specification can include a vibration generating section having a piezoelectric vibration section 21a, a first electrode section 21b, and a second electrode section 21c.

[0149] The piezoelectric vibrating unit 21a may include a piezoelectric material (or electroactive material) that exhibits a piezoelectric effect. For example, a piezoelectric material may have a characteristic in which, when pressure or torsion is applied to a crystal structure due to an external force, a potential difference is generated due to dielectric polarization caused by a change in the relative positions of positive (+) ions and negative (-) ions, and vibration is generated by an electric field caused by an oppositely applied voltage. The piezoelectric vibrating unit 21a may be expressed by other terms such as, but not limited to, a vibration layer, piezoelectric layer, piezoelectric material layer, electroactive layer, vibration unit, piezoelectric material unit, electroactive unit, piezoelectric structure, piezoelectric composite layer, piezoelectric composite, or piezoelectric ceramic composite. The piezoelectric vibrating unit 21a may be transparent, translucent, or opaque, being made of a transparent, translucent, or opaque piezoelectric material.

[0150] The piezoelectric vibrating unit 21a according to one embodiment of the present specification may include a plurality of first portions 21a1 and a plurality of second portions 21a2. For example, the plurality of first portions 21a1 and the plurality of second portions 21a2 may be alternately and repeatedly arranged along a first direction (X) (or a second direction (Y)). For example, the first direction (X) may be the horizontal direction of the piezoelectric vibrating unit 21a, and the second direction (Y) may be the vertical direction of the piezoelectric vibrating unit 21a that intersects with the first direction (X), but is not limited thereto. The first direction (X) may be the vertical direction of the piezoelectric vibrating unit 21a, and the second direction (Y) may be the horizontal direction of the piezoelectric vibrating unit 21a.

[0151] Each of the first portions 21a1 may be made of a ceramic material capable of achieving relatively high vibration or a piezoelectric ceramic having a perovskite-based crystal structure. The perovskite crystal structure has piezoelectric and inverse piezoelectric effects and may have an oriented plate-like structure. The perovskite crystal structure may be expressed by the chemical formula ABO3, where the A site is composed of a divalent metal element and the B site is composed of a tetravalent metal element. In one embodiment of the present specification, in the chemical formula ABO3, the A site and the B site may be cations, and O may be an anion. For example, each of the first portions 21a1 may include at least one of PbTiO3, PbZrO3, PbZrTiO3, BaTiO3, and SrTiO3, but is not limited thereto.

[0152] The piezoelectric vibrating part 21a according to an embodiment of the present specification may include, but is not limited to, a PZT (lead zirconate titanate)-based material containing lead (Pb), zirconium (Zr), and titanium (Ti), or a PZNN (lead zirconate nickel niobate)-based material containing lead (Pb), zirconium (Zr), nickel (Ni), and niobium (Nb). Alternatively, the piezoelectric vibrating part 21a may include, but is not limited to, at least one of CaTiO3, BaTiO3, and SrTiO3, which do not contain lead (Pb).

[0153] According to an embodiment of the present specification, each of the plurality of first portions 21a1 may be disposed between the plurality of second portions 21a2 and may have a first width (W1) in the first direction (X) (or the second direction (Y)) and a length in the second direction (Y) (or the first direction (X)). Each of the plurality of second portions 21a2 may have a second width (W2) in the first direction (X) (or the second direction (Y)) and a length in the second direction (Y) (or the first direction (X)). The first width (W1) may be the same as or different from the second width (W2). For example, the first width (W1) may be greater than the second width (W2). For example, the first portion 21a1 and the second portion 21a2 may have line or stripe shapes having the same or different sizes. Therefore, the piezoelectric vibrating part 21a can have a resonant frequency of 20 kHz or less by having a 2-2 composite structure with piezoelectric characteristics of the 2-2 vibration mode, but is not limited to this. For example, the resonant frequency of the piezoelectric vibrating part 21a can be changed by at least one of the shape, length, and thickness.

[0154] In the piezoelectric vibration unit 21a, the plurality of first portions 21a1 and the plurality of second portions 21a2 may be arranged (or arrayed) next to each other on the same plane (or the same layer). Each of the plurality of second portions 21a2 may be configured to fill the gap between two adjacent first portions 21a1, thereby being connected or adhered to the adjacent first portion 21a1. Therefore, the piezoelectric vibration unit 21a can be expanded to a desired size or length by side-coupling (or connecting) the first portions 21a1 and the second portions 21a2.

[0155] In the piezoelectric vibrating part 21a, the width (W2) of each of the plurality of second portions 21a2 may gradually decrease from the middle part of the piezoelectric vibrating part 21a or the vibrating element 21 toward both side edges (or both ends).

[0156] According to one embodiment of the present specification, the second portion 21a2 having the largest width (W2) among the plurality of second portions 21a2 may be located in a portion where the largest stress is concentrated when the piezoelectric vibrating portion 21a or the vibrating element 21 vibrates in the vertical direction (Z) (or thickness direction). The second portion 21a2 having the smallest width (W2) among the plurality of second portions 21a2 may be located in a portion where the smallest stress is generated when the piezoelectric vibrating portion 21a or the vibrating element 21 vibrates in the vertical direction (Z). For example, the second portion 21a2 having the largest width (W2) among the plurality of second portions 21a2 may be located in a central portion of the piezoelectric vibrating portion 21a, and the second portion 21a2 having the smallest width (W2) among the plurality of second portions 21a2 may be located on both side edges of the piezoelectric vibrating portion 21a. Therefore, when the piezoelectric vibration part 21a or the vibration element 21 vibrates in the vertical direction (Z), the interference of sound waves or the superposition of resonance frequencies occurring in the area where the maximum stress is concentrated can be minimized, thereby improving the sound pressure dip phenomenon occurring in the low frequency range and improving the flatness of the acoustic characteristics in the low frequency range.

[0157] In the piezoelectric vibrating part 21a, the plurality of first portions 21a1 may have different sizes (or areas). For example, the size (or area) of each of the plurality of first portions 21a1 may gradually decrease or increase from the middle portion of the piezoelectric vibrating part 21a or the vibrating element 21 toward both side edges (or both ends). In this case, the piezoelectric vibrating part 21a may have various natural vibration frequencies due to the vibration of each of the plurality of first portions 21a1 having different sizes, thereby improving the sound pressure characteristics of the sound and expanding the sound reproduction band.

[0158] Each of the plurality of second portions 21a2 may be disposed between the plurality of first portions 21a1. Therefore, the piezoelectric vibrating part 21a or the vibrating element 21 may have improved vibration characteristics and ensured piezoelectric characteristics and flexibility because the second portions 21a2 may increase vibration energy due to links within the unit lattice of the first portions 21a1, thereby increasing vibration characteristics and ensuring piezoelectric characteristics and flexibility. For example, the second portions 21a2 may be one or more of an epoxy-based polymer, an acrylic-based polymer, and a silicone-based polymer, but are not limited thereto.

[0159] According to an embodiment of the present disclosure, each of the plurality of second portions 21a2 may be made of an organic material portion. For example, the organic material portion may be disposed between the inorganic material portions to absorb impacts applied to the inorganic material portion (or the first portion) and release stress concentrated on the inorganic material portion, thereby improving the durability of the piezoelectric vibrating portion 21a or the vibrating element 21 and providing flexibility to the piezoelectric vibrating portion 21a or the vibrating element 21.

[0160] According to an embodiment of the present specification, the second portion 21a2 may have a lower modulus (or Young's modulus) and viscoelasticity than the first portion 21a1, thereby improving the reliability of the first portion 21a1, which is vulnerable to impact due to the brittle characteristics of the first portion 21a1. For example, the second portion 21a2 may be made of a material having a loss factor of 0.01 to 1 and a modulus of 0.1 to 10 Gpa (Giga Pascal).

[0161] The organic material portion of the second portion 21a2 may include an organic material, an organic polymer, an organic piezoelectric material, or an organic non-piezoelectric material having flexibility compared to the inorganic material portion of the first portion 21a1. For example, the second portion 21a2 may be expressed as a flexible adhesive portion, an elastic portion, a bending portion, a damping portion, or a soft portion, but is not limited thereto.

[0162] The piezoelectric vibrating portion 21a according to the embodiments of the present specification may have a single thin film shape by arranging (or connecting) a plurality of first portions 21a1 and second portions 21a2 on the same plane. For example, the piezoelectric vibrating portion 21a may have a structure in which a plurality of first portions 21a1 are connected to one side. For example, the plurality of first portions 21a1 may be connected across the entire piezoelectric vibrating portion 21a. For example, the piezoelectric vibrating portion 21a may vibrate vertically due to the first portions 21a1 having vibration characteristics, and may bend into a curved shape due to the second portions 21a2 having flexibility. Furthermore, in the piezoelectric vibrating portion 21a according to the embodiments of the present specification, the sizes of the first portions 21a1 and the second portions 21a2 may be set according to the piezoelectric characteristics and flexibility required for the piezoelectric vibrating portion 21a or the vibrating element 21. As an example of the present specification, in the case of a piezoelectric vibrating portion 21a that requires piezoelectric characteristics rather than flexibility, the size of the first portion 21a1 may be configured to be larger than the size of the second portion 21a2. In another embodiment of the present specification, in the case of piezoelectric vibrating part 21a that requires flexibility over piezoelectric characteristics, the size of second part 21a2 can be configured to be larger than the size of first part 21a1. Therefore, since the size of piezoelectric vibrating part 21a can be adjusted according to the required characteristics, there is an advantage that the design of piezoelectric vibrating part 21a is easy.

[0163] The first electrode portion 21b may be disposed on the first surface (or upper surface) of the piezoelectric vibrating portion 21a. The first electrode portion 21b may be commonly disposed on or coupled to the first surface of each of the plurality of first portions 21a1 and the first surface of each of the plurality of second portions 21a2, and may be electrically connected to the first surface of each of the plurality of first portions 21a1. For example, the first electrode portion 21b may have the shape of a single electrode (or a common electrode) disposed over the entire first surface of the piezoelectric vibrating portion 21a. For example, the first electrode portion 21b may have substantially the same shape as the piezoelectric vibrating portion 21a, but is not limited thereto.

[0164] According to an embodiment of the present specification, the first electrode unit 21b may be made of a transparent conductive material, a semi-transparent conductive material, or an opaque conductive material. For example, the transparent or semi-transparent conductive material may include, but is not limited to, indium tin oxide (ITO) or indium zinc oxide (IZO). The opaque conductive material may include, but is not limited to, aluminum (Al), copper (Cu), gold (Au), silver (Ag), molybdenum (Mo), magnesium (Mg), or an alloy thereof.

[0165] The second electrode unit 21c may be disposed on a second surface (or rear surface) different from (or opposite to) the first surface of the piezoelectric vibrating unit 21a. The second electrode unit 21c may be commonly disposed on or coupled to the second surface of each of the first portions 21a1 and the second surface of each of the second portions 21a2, and may be electrically connected to the second surface of each of the first portions 21a1. For example, the second electrode unit 21c may have the shape of a single electrode (or a common electrode) disposed over the entire second surface of the piezoelectric vibrating unit 21a. For example, the second electrode unit 21c may have the same shape as the piezoelectric vibrating unit 21a, but is not limited thereto. The second electrode unit 21c according to an embodiment of the present specification may be made of a transparent conductive material, a translucent conductive material, or an opaque conductive material. For example, the second electrode unit 21c may be made of the same material as the first electrode unit 21b, but is not limited thereto. In other embodiments herein, the second electrode portion 21c may be made of a different material than the first electrode portion 21b.

[0166] The piezoelectric vibrating part 21a can be polarized by a constant voltage applied to the first electrode part 21b and the second electrode part 21c in a constant temperature atmosphere or in a temperature atmosphere that changes from high temperature to room temperature, but is not limited to this. For example, the piezoelectric vibrating part 21a can vibrate by alternately repeating contraction and / or expansion due to the inverse piezoelectric effect caused by an acoustic signal (or voice signal) applied from the outside to the first electrode part 21b and the second electrode part 21c. For example, the piezoelectric vibrating part 21a can vibrate by vertical vibration and planar vibration due to the first electrode part 21b and the second electrode part 21c. The planar contraction and / or expansion of the piezoelectric vibrating part 21a can increase the displacement of the vibrating member (or diaphragm, or vibrating object), thereby further improving vibration.

[0167] The vibration element 21 according to an embodiment of the present specification may further include a first cover member 21e and a second cover member 21f.

[0168] The first cover member 21e can be disposed on a first surface of the vibration element 21. For example, the first cover member 21e can be configured to cover the first electrode portion 21b. Thus, the first cover member 21e can protect the first electrode portion 21b.

[0169] The second cover member 21f may be disposed on the second surface of the vibration element 21. For example, the second cover member 21f may be configured to cover the second electrode portion 21c. Thus, the second cover member 21f can protect the second electrode portion 21c.

[0170] According to an embodiment of the present specification, the first cover member 21e and the second cover member 21f may each include, but are not limited to, one or more materials selected from the group consisting of plastic, fiber, and wood. For example, the first cover member 21e and the second cover member 21f may each include the same or different materials. For example, the first cover member 21e and the second cover member 21f may each include, but are not limited to, a polyimide film or a polyethylene terephthalate film.

[0171] The first cover member 21e according to an embodiment of the present specification may be connected or bonded to the first electrode portion 21b via the first adhesive layer 21d. For example, the first cover member 21e may be connected or bonded to the first electrode portion 21b by a film laminating process via the first adhesive layer 21d.

[0172] The second cover member 21f according to an embodiment of the present specification may be connected or bonded to the second electrode portion 21c via the second adhesive layer 21g. For example, the second cover member 21f may be connected or bonded to the second electrode portion 21c by a film laminating process via the second adhesive layer 21g.

[0173] The first adhesive layer 21d may be disposed between the first electrode portion 21b and the first cover member 21e. The second adhesive layer 21g may be disposed between the second electrode portion 21c and the second cover member 21f. For example, the first adhesive layer 21d and the second adhesive layer 21g may be configured between the first cover member 21e and the second cover member 21f so as to completely surround the piezoelectric vibration portion 21a, the first electrode portion 21b, and the second electrode portion 21c. For example, the piezoelectric vibration portion 21a, the first electrode portion 21b, and the second electrode portion 21c may be embedded or built in between the first adhesive layer 21d and the second adhesive layer 21g.

[0174] According to an embodiment of the present specification, each of the first adhesive layer 21d and the second adhesive layer 21g may include an electrically insulating material that is adhesive and capable of being compressed and restored, such as, but not limited to, epoxy resin, acrylic resin, silicone resin, or urethane resin.

[0175] Either the first cover member 21e or the second cover member 21f can be attached or coupled to the vibrating member (or diaphragm, or vibrating object) via a connecting member.

[0176] According to one embodiment of the present specification, one of the first cover member 21e and the second cover member 21f may be attached to or coupled to the vibrating member (or the diaphragm, or the vibrating object) via a connecting member 15. For example, one of the first cover member 21e and the second cover member 21f may be attached to or coupled to the vibrating member (or the diaphragm, or the vibrating object) via a connecting member 15, as described with reference to Figures 1 to 8B or 1, 2, 4, 5, and 13.

[0177] 4, the vibration element 21 according to an embodiment of the present specification may include a piezoelectric vibration part 21a, a first electrode part 21b, and a second electrode part 21c. The vibration element 21 may further include a first power supply line (PL1) disposed on the first cover member 21e, a second power supply line (PL2) disposed on the second cover member 21f, and a pad part 21p electrically connected to the first power supply line (PL1) and the second power supply line (PL2).

[0178] The first power supply line (PL1) may be disposed between the first electrode portion 21b and the first cover member 21e and electrically connected to the first electrode portion 21b. The first power supply line (PL1) may extend longitudinally along the second direction (Y) and be electrically connected to a central portion of the first electrode portion 21b. In one embodiment, the first power supply line (PL1) may be electrically connected to the first electrode portion 21b via an anisotropic conductive film. In another embodiment of the present specification, the first power supply line (PL1) may be electrically connected to the first electrode portion 21b via a conductive material (or particles) included in the first adhesive layer 21d.

[0179] The second power supply line (PL2) may be disposed between the second electrode portion 21c and the second cover member 21f and electrically connected to the second electrode portion 21c. The second power supply line (PL2) may extend longitudinally along the second direction (Y) and be electrically connected to a central portion of the second electrode portion 21c. In one embodiment, the second power supply line (PL2) may be electrically connected to the second electrode portion 21c via an anisotropic conductive film. In another embodiment, the second power supply line (PL2) may be electrically connected to the second electrode portion 21c via a conductive material (or particles) included in the second adhesive layer 21g.

[0180] The pad portion 21p may be configured on one side edge of either the first cover member 21e or the second cover member 21f so as to be electrically connected to one side (or one end) of each of the first power supply line (PL1) and the second power supply line (PL2).

[0181] The pad part 21p according to one embodiment of the present specification may include a first pad electrode electrically connected to one end of the first power supply line (PL1) and a second pad electrode electrically connected to one end of the second power supply line (PL2).

[0182] The first pad electrode may be disposed on one side edge of either the first cover member 21e or the second cover member 21f and connected to one end of the first power supply line (PL1). For example, the first pad electrode may pass through either the first cover member 21e or the second cover member 21f and be electrically connected to one end of the first power supply line (PL1).

[0183] The second pad electrode may be arranged next to the first pad electrode and may be connected to one end of the second power supply line (PL2). For example, the second pad electrode may pass through one of the first cover member 21e and the second cover member 21f and be electrically connected to one end of the second power supply line (PL2).

[0184] According to an embodiment of the present specification, each of the first power supply line (PL1), the second power supply line (PL2), and the pad portion 21p may be configured to be transparent, semi-transparent, or opaque.

[0185] The pad portion 21 p according to an embodiment of the present disclosure may be electrically connected to a signal cable 30 .

[0186] The signal cable 30 is electrically connected to the pad portion 21p arranged on the vibration element 21 and can supply a vibration drive signal (or an acoustic signal) provided from the signal generating circuit to the vibration element 21. The signal cable 30 according to an embodiment of the present specification may include a first terminal electrically connected to a first pad electrode of the pad portion 21p and a second terminal electrically connected to a second pad electrode of the pad portion 21p. For example, the signal cable 30 may be made of, but is not limited to, a flexible printed circuit cable, a flexible flat cable, a single-sided flexible printed circuit, a single-sided flexible printed circuit board, a flexible multilayer printed circuit, or a flexible multilayer printed circuit board.

[0187] The oscillator 21 can generate AC vibration drive signals including a first vibration drive signal and a second vibration drive signal based on acoustic data provided from an external acoustic data generating circuit. The first vibration drive signal can be either a positive (+) vibration drive signal or a negative (-) vibration drive signal, and the second vibration drive signal can be either a positive (+) vibration drive signal or a negative (-) vibration drive signal. For example, the first vibration drive signal can be supplied to the first electrode 21b via a first terminal of the signal cable 30, a first pad electrode of the pad 21p, and a first power supply line (PL1). The second vibration drive signal can be supplied to the second electrode 21c via a second terminal of the signal cable 30, a second pad electrode of the pad 21p, and a second power supply line (PL2).

[0188] According to one embodiment of the present disclosure, the signal cable 30 may be configured to be transparent, translucent, or opaque.

[0189] The vibration element 21 according to an embodiment of the present specification can be realized in a thin film shape by alternately connecting first portions 21a1 having piezoelectric properties and second portions 21a2 having flexibility, and can therefore bend to a shape corresponding to the shape of a vibration member or a vibration target. For example, when the vibration element 21 is connected or coupled to a vibration member having various curved surfaces via a connecting member 15, it can bend in a curved shape along the shape of the curved surface of the vibration member, and even when bent in a curved shape, it does not suffer from damage or breakage or a decrease in reliability. Furthermore, the vibration element 21 according to an embodiment of the present specification has a larger elastic modulus than the connecting member 15, and can easily vibrate a vibration member having various curved surfaces, thereby improving the reliability of sound reproduction and the acoustic characteristics and / or sound pressure characteristics in the low-frequency range generated by the vibration of the vibration member.

[0190] 20A to 20D are perspective views showing piezoelectric vibrating portions according to other examples of a vibrating element according to an embodiment of the present specification.

[0191] Referring to Figure 20A, a piezoelectric vibration part 21a according to another embodiment of the present specification may include a plurality of first portions 21a1 spaced apart from each other along a first direction (X) and a second direction (Y), and a second portion 21a2 arranged between the plurality of first portions 21a1.

[0192] The plurality of first portions 21a1 may be arranged to be spaced apart from one another along the first direction (X) and the second direction (Y). For example, the plurality of first portions 21a1 may have a hexahedral shape of the same size and be arranged in a lattice pattern. Because each of the plurality of first portions 21a1 is made of substantially the same piezoelectric material as the first portion 21a1 described in FIG. 19, the same reference numerals are used for corresponding parts, and redundant description thereof will be omitted.

[0193] The second portion 21a2 may be disposed between the plurality of first portions 21a1 along each of the first direction (X) and the second direction (Y). The second portion 21a2 may be connected to or bonded to the adjacent first portions 21a1 by filling the gap between two adjacent first portions 21a1 or surrounding each of the plurality of first portions 21a1. According to one embodiment of the present specification, the width of the second portion 21a2 disposed between two adjacent first portions 21a1 along the first direction (X) may be the same as or different from the width of the first portions 21a1, and the width of the second portion 21a2 disposed between two adjacent first portions 21a1 along the second direction (Y) may be the same as or different from the width of the first portions 21a1. Since the second portion 21a2 is made of substantially the same organic material as the second portion 21a2 described with reference to FIG. 19, the same reference numerals are used for corresponding parts, and redundant description thereof will be omitted.

[0194] The piezoelectric vibrating unit 21a according to another embodiment of the present specification may have a resonant frequency of 30 MHz or less by including a 1-3 composite structure having piezoelectric characteristics of a 1-3 vibration mode, but is not limited thereto. For example, the resonant frequency of the piezoelectric vibrating unit 21a may be changed by at least one of the shape, length, and thickness.

[0195] Referring to Figure 20B, a piezoelectric vibration part 21a according to another embodiment of the present specification may include a plurality of first portions 21a1 spaced apart from each other along a first direction (X) and a second direction (Y), and a second portion 21a2 arranged between the plurality of first portions 21a1.

[0196] Each of the plurality of first portions 21a1 may have a circular planar structure. For example, each of the plurality of first portions 21a1 may have a disk shape, but is not limited to this. For example, each of the plurality of first portions 21a1 may have a dot shape, including an oval, polygonal, or donut shape. Since each of the plurality of first portions 21a1 is made of substantially the same piezoelectric material as the first portion 21a1 described with reference to FIG. 19, the same reference numerals are used for corresponding parts, and redundant description thereof will be omitted.

[0197] The second portion 21a2 may be disposed between the plurality of first portions 21a1 along each of the first direction (X) and the second direction (Y). The second portion 21a2 may be configured to surround each of the plurality of first portions 21a1, thereby being connected to or bonded to each side of the plurality of first portions 21a1. The plurality of first portions 21a1 and second portions 21a2 may be disposed (or arranged) side by side on the same plane (or the same layer). The second portion 21a2 is made of substantially the same organic material as the second portion 21a2 described with reference to FIG. 19, and therefore the same reference numerals are used for corresponding parts, and redundant description thereof will be omitted.

[0198] Referring to Figure 20C, in a vibration element 21 according to another embodiment of the present specification, the piezoelectric vibration portion 21a may include a plurality of first portions 21a1 spaced apart from each other along a first direction (X) and a second direction (Y), and a second portion 21a2 arranged between the plurality of first portions 21a1.

[0199] Each of the plurality of first portions 21a1 may have a triangular planar structure. For example, each of the plurality of first portions 21a1 may have a triangular plate shape. Since each of the plurality of first portions 21a1 is made of substantially the same piezoelectric material as the first portion 21a1 described with reference to FIG. 19, the same reference numerals are used to designate corresponding parts, and redundant description thereof will be omitted.

[0200] According to one embodiment of the present specification, four adjacent first portions 21a1 among the plurality of first portions 21a1 may be arranged adjacent to each other to form a rectangle (or square). Each vertex of the four adjacent first portions 21a1 forming the rectangle may be arranged adjacent to the center (or exact center) of the rectangle.

[0201] The second portion 21a2 may be disposed between the plurality of first portions 21a1 along each of the first direction (X) and the second direction (Y). The second portion 21a2 may be configured to surround each of the plurality of first portions 21a1, thereby being connected to or bonded to each side of the plurality of first portions 21a1. The plurality of first portions 21a1 and second portions 21a2 may be disposed (or arranged) side by side on the same plane (or the same layer). The second portion 21a2 is made of substantially the same organic material as the second portion 21a2 described with reference to FIG. 19, and therefore the same reference numerals are used for corresponding parts, and redundant description thereof will be omitted.

[0202] Referring to Figure 20D, in a vibration element 21 according to another embodiment of this specification, the piezoelectric vibration portion 21a may include a plurality of first portions 21a1 spaced apart from each other along a first direction (X) and a second direction (Y), and a second portion 21a2 arranged between the plurality of first portions 21a1.

[0203] According to one embodiment of the present specification, six adjacent first portions 21a1 among the plurality of first portions 21a1 may be arranged adjacent to each other to form a hexagon (or a regular hexagon). Each vertex of the six adjacent first portions 21a1 forming the hexagon may be arranged adjacent to the center (or the exact center) of the hexagon.

[0204] The second portion 21a2 may be disposed between the plurality of first portions 21a1 along each of the first direction (X) and the second direction (Y). The second portion 21a2 may be configured to surround each of the plurality of first portions 21a1, thereby being connected to or bonded to each side of the plurality of first portions 21a1. The plurality of first portions 21a1 and second portions 21a2 may be disposed (or arranged) side by side on the same plane (or the same layer). The second portion 21a2 is made of substantially the same organic material as the second portion 21a2 described with reference to FIG. 19, and therefore the same reference numerals are used for corresponding parts, and redundant description thereof will be omitted.

[0205] FIG. 21 is a diagram showing a vibration generator according to another embodiment of the present specification, and FIG. 22 is a cross-sectional view taken along line IV-IV' in FIG. 21. The cross-section taken along line II-II' in FIG. 21 is shown in FIG. 17. FIGS. 21 and 22 show a modification of the connection structure between the electrode unit and the signal cable shown in FIG. 17. Therefore, in the following description, the same reference numerals will be used to refer to the remaining components, excluding the electrode unit, the signal cable, and the components related thereto, and redundant description thereof will be omitted or will be brief.

[0206] 21 and 22, a vibration generator 20 according to another embodiment of the present specification may include first and second vibration generating units 21-1 and 21-2, a first signal cable 30a, and a second signal cable 30b.

[0207] The first and second vibration generating units 21-1 and 21-2 may be arranged apart from each other and electrically separated from each other along the first direction (X), and each of the first and second vibration generating units 21-1 and 21-2 may include a piezoelectric vibration unit 21 a, a first electrode unit 21 b, and a second electrode unit 21 c.

[0208] The first and second vibration generating units 21-1 and 21-2 may be arranged apart from each other and electrically isolated from each other along the first direction (X). Each of the first and second vibration generating units 21-1 and 21-2 may vibrate by alternately contracting and / or expanding due to the piezoelectric effect. For example, the first and second vibration generating units 21-1 and 21-2 may be arranged or tiled at a fixed interval (D1) along the first direction (X). Therefore, the vibration element 21 in which the first and second vibration generating units 21-1 and 21-2 are tiled may be a vibration array, a vibration array unit, a vibration module array unit, a vibration array structure, a tiling vibration array, a tiling array module, or a tiling vibration film.

[0209] According to an embodiment of the present specification, each of the first and second vibration generating units 21-1 and 21-2 may have a rectangular shape. For example, each of the first and second vibration generating units 21-1 and 21-2 may have a rectangular shape with a width of 5 cm or more. For example, each of the first and second vibration generating units 21-1 and 21-2 may have a square shape with a size of 5 cm x 5 cm or more, but is not limited to this.

[0210] The first and second vibration generating units 21-1, 21-2 are each arranged on the same plane or tiled, so that the vibration element 21 can be made larger in area by tiling the first and second vibration generating units 21-1, 21-2, which have relatively small sizes.

[0211] The first and second vibration generating units 21-1 and 21-2 may be arranged at regular intervals or tiled to form a single vibration device (or a single vibration device) that is not driven independently but is driven as a complete, integrated unit. According to one embodiment, a first separation distance (D1) between the first and second vibration generating units 21-1 and 21-2 in the first direction (X) may be, but is not limited to, 0.1 mm or more and less than 3 cm.

[0212] According to one embodiment of the present specification, the first and second vibration generating units 21-1 and 21-2 may be arranged or tiled to have a separation (or gap) (D1) of 0.1 mm or more and less than 3 cm, so that they can be driven as a single vibration device, and the reproduction band and sound pressure characteristics of the sound generated in conjunction with the single-body vibration of the first and second vibration generating units 21-1 and 21-2 may be increased. For example, in order to increase the reproduction band of the sound generated in conjunction with the single-body vibration of the first and second vibration generating units 21-1 and 21-2 and to increase the sound pressure characteristics of low-frequency sound, for example, below 500 Hz, the first and second vibration generating units 21-1 and 21-2 may be arranged with a gap (D1) of 0.1 mm or more and less than 5 mm.

[0213] According to one embodiment of the present specification, when the first and second vibration generating units 21-1, 21-2 are arranged with a gap (D1) of less than 0.1 mm or no gap (D1), the reliability of the first and second vibration generating units 21-1, 21-2 or the vibration element 21 may be reduced due to cracks or damage caused by physical contact between them when the first and second vibration generating units 21-1, 21-2 vibrate.

[0214] According to one embodiment of the present specification, when the first and second vibration generating units 21-1 and 21-2 are arranged with a distance (D1) of 3 cm or more, the first and second vibration generating units 21-1 and 21-2 do not vibrate as a single vibration device due to their independent vibrations. Therefore, the reproduction band and sound pressure characteristics of the sound generated by the vibration of the first and second vibration generating units 21-1 and 21-2 may be reduced. For example, when the first and second vibration generating units 21-1 and 21-2 are arranged with a distance (D1) of 3 cm or more, the acoustic characteristics and sound pressure characteristics in the low frequency range, for example, below 500 Hz, may be reduced.

[0215] According to one embodiment of the present specification, when the first and second vibration generating units 21-1, 21-2 are arranged at a distance (D1) of 5 mm, the first and second vibration generating units 21-1, 21-2 are not driven as a single vibration device, and therefore the acoustic characteristics and sound pressure characteristics can be reduced in the low frequency range, for example, below 200 Hz.

[0216] According to another example of the present specification, when the first and second vibration generating units 21-1 and 21-2 are arranged with a distance (D1) of 1 mm between them, the first and second vibration generating units 21-1 and 21-2 vibrate as a single vibration device, thereby expanding the sound reproduction band and improving the sound pressure characteristics in the low-frequency range, for example, at frequencies below 500 Hz. For example, when the first and second vibration generating units 21-1 and 21-2 are arranged with a distance (D1) of 1 mm between them, the vibration element 21 can be realized as a large-area vibrating body by optimizing the separation distance between the first and second vibration generating units 21-1 and 21-2. Therefore, the first and second vibration generating units 21-1 and 21-2 can be driven as a large-area vibrating body by single-body vibration, thereby increasing or improving the sound reproduction band and the acoustic characteristics and sound pressure characteristics in the low-frequency range generated in conjunction with the large-area vibration of the vibration element 21.

[0217] Therefore, in order to realize single-body vibration (or one vibration device) of the first and second vibration generating units 21-1, 21-2, the separation distance (D1) between the first and second vibration generating units 21-1, 21-2 can be set to 0.1 mm or more and less than 3 cm. Also, in order to realize single-body vibration (or one vibration device) of the first and second vibration generating units 21-1, 21-2 and increase the sound pressure characteristics of low-frequency sound, the separation distance (D1) between the first and second vibration generating units 21-1, 21-2 can be set to 0.1 mm or more and less than 5 mm.

[0218] Each of the first and second vibration generating units 21-1 and 21-2 according to an embodiment of the present specification may include a piezoelectric vibration unit 21a, a first electrode unit 21b, and a second electrode unit 21c.

[0219] The piezoelectric vibrating portion 21a of each of the first and second vibration generating portions 21-1 and 21-2 may include a piezoelectric material (or an electroactive material) having a piezoelectric effect. For example, the piezoelectric vibrating portion 21a of each of the first and second vibration generating portions 21-1 and 21-2 may have substantially the same configuration as any one of the vibrating portions 21a described with reference to FIG. 1, and therefore, a redundant description thereof will be omitted.

[0220] According to one embodiment of the present specification, each of the first and second vibration generating units 21-1, 21-2 may include any one of the piezoelectric vibration units 21a described with reference to FIG. 1 or may include different piezoelectric vibration units 21a.

[0221] The first signal cable 30a may be integrated with the first vibration generating unit 21-1 by being electrically connected to or directly connected to the first and second electrodes 21b, 21c of the first vibration generating unit 21-1 on one side of the vibration element 21. For example, the first signal cable 30a may be electrically connected to the first and second electrodes 21b, 21c of the first vibration generating unit 21-1 without passing through the power supply line and pads described with reference to FIG.

[0222] The second signal cable 30b may be integrated with the second vibration generating unit 21-2 by being electrically or directly connected to the first and second electrodes 21b, 21c of the second vibration generating unit 21-2 on one side of the vibration element 21. For example, the second signal cable 30b may be electrically connected to the first and second electrodes 21b, 21c of the second vibration generating unit 21-2 without passing through the power supply line and pads described with reference to FIG.

[0223] According to an embodiment of the present disclosure, the first and second signal cables 30a and 30b may each include a first and second protruding line 31a and 31b, respectively. For example, the first and second protruding lines 31a and 31b may each be expressed by terms such as, but not limited to, a protruding electrode, an extension line, an extension electrode, a finger line, or a finger electrode.

[0224] The first protruding line 31a (or the first upper protruding line 31a1) of the first signal cable 30a overlaps at least a portion of the first electrode 21b of the first vibration generating unit 21-1 and may be electrically connected to the first electrode 21b or may be electrically connected directly to the first electrode 21b. The second protruding line 31b (or the first lower protruding line 31b1) of the first signal cable 30a overlaps at least a portion of the second electrode 21c of the first vibration generating unit 21-1 and may be electrically connected to the second electrode 21c or may be electrically connected directly to the second electrode 21c. For example, the first and second protruding lines 31a, 31b of the first signal cable 30a may be bent toward the corresponding electrode 21b, 21c of the first vibration generating unit 21-1, but are not limited to this.

[0225] The first protruding line 31a (or the second upper protruding line 31a2) of the second signal cable 30b overlaps at least a portion of the first electrode 21b of the second vibration generating unit 21-2 and may be electrically connected to the first electrode 21b or may be electrically connected directly to the first electrode 21b. The second protruding line 31b (or the second lower protruding line 31b2) of the second signal cable 30b overlaps at least a portion of the second electrode 21c of the second vibration generating unit 21-2 and may be electrically connected to the second electrode 21c or may be electrically connected directly to the second electrode 21c. For example, the first and second protruding lines 31a, 31b of the second signal cable 30b may be bent toward the corresponding electrode 21b, 21c of the second vibration generating unit 21-2, but this is not limitative.

[0226] Each of the first and second signal cables 30a, 30b according to an embodiment of the present specification may include a body portion, first and second protruding lines 31a, 31b, and sound processing circuits 40a, 40b. Since each of the first and second signal cables 30a, 30b is substantially the same as the signal cable 30 described with reference to Figures 13 to 17, the same reference numerals are used for corresponding parts, and redundant descriptions thereof will be omitted or brief.

[0227] The acoustic processing circuit (or first acoustic processing circuit) 40a mounted on or integrated with the first signal cable 30a generates first and second vibration drive signals based on acoustic data supplied from an external acoustic data generating circuit and supplies the first and second vibration drive signals to the first and second electrode units 21b and 21c of the first vibration generating unit 21-1 via the first and second protruding lines 31a and 31b. The acoustic processing circuit 40a mounted on the first signal cable 30a may include a decoding unit, an audio amplifier circuit, a memory circuit, a control circuit, and passive elements such as resistors. Since this circuit is substantially the same as the signal generating circuit 40 described with reference to FIG. 14 or 16, the same reference numerals are used to designate corresponding parts, and redundant description thereof will be omitted. For example, the signal generating circuit 40 may be, but is not limited to, an acoustic processing circuit or a vibration drive circuit.

[0228] The acoustic processing circuit (or second acoustic processing circuit) 40b mounted on or integrated with the second signal cable 30b generates first and second vibration drive signals based on acoustic data supplied from an external acoustic data generating circuit, and supplies the first and second vibration drive signals to the first and second electrode units 21b, 21c of the second vibration generating unit 21-2 via the first and second protruding lines 31a, 31b. The acoustic processing circuit 40b mounted on the second signal cable 30b may include a decoding unit, an audio amplifier circuit, a memory circuit, a control circuit, and passive elements such as resistors. This circuit is substantially the same as the signal generating circuit 40 described with reference to FIG. 14 or 16, and therefore the same reference numerals are used for corresponding parts, and redundant description thereof will be omitted.

[0229] Vibration generator 20 according to other embodiments of the present specification may further include first cover member 21e and second cover member 21f. First and second cover members 21e and 21f are substantially the same as first and second cover members 21e and 21f described with reference to Figures 13 to 18, respectively, except that they are configured to cover first and second vibration generating units 21-1 and 21-2, respectively, and first and second protruding lines 31a and 31b of first and second signal cables 30a and 30b, respectively. Therefore, the same reference numerals are used for corresponding parts, and redundant descriptions thereof will be omitted or brief.

[0230] The first cover member 21e may be disposed on a first surface of the vibration element 21. For example, the first cover member 21e may be configured to cover the first electrode portions 21b of the first and second vibration generating portions 21-1 and 21-2 and the first protruding lines 31a of the first and second signal cables 30a and 30b.

[0231] The second cover member 21f may be disposed on a second surface of the vibration element 21. For example, the second cover member 21f may be configured to cover the second electrode portions 21c of the first and second vibration generating portions 21-1 and 21-2 and the second protruding lines 31b of the first and second signal cables 30a and 30b.

[0232] According to an embodiment of the present specification, the first cover member 21e may be connected or coupled to the first electrode portions 21b of the first and second vibration generating units 21-1 and 21-2 and the first protruding lines 31a of the first and second signal cables 30a and 30b via the first adhesive layer 21d. Therefore, the first protruding lines (or first finger lines) 31a of the first and second signal cables 30a and 30b may be disposed between the first electrode portions 21b of the first and second vibration generating units 21-1 and 21-2 and the first cover member 21e, and integrated with the vibration element 21.

[0233] According to an embodiment of the present specification, the second cover member 21f may be connected or coupled to the second electrode portions 21c of the first and second vibration generating units 21-1 and 21-2 and the second protruding lines 31b of the first and second signal cables 30a and 30b via the second adhesive layer 21g. Therefore, the second protruding lines (or second finger lines) 31b of the first and second signal cables 30a and 30b may be disposed between the second electrode portions 21c of the first and second vibration generating units 21-1 and 21-2 and the second cover member 21f, and may be integrated with the vibration element 21.

[0234] The first adhesive layer 21d may be disposed between the first and second vibration generating units 21-1 and 21-2 and on the first surfaces of the first and second vibration generating units 21-1 and 21-2. The second adhesive layer 21g may be disposed between the first and second vibration generating units 21-1 and 21-2 and on the second surfaces of the first and second vibration generating units 21-1 and 21-2. For example, the first and second adhesive layers 21d and 21g may be configured between the first cover member 21e and the second cover member 21f so as to completely surround each of the first and second vibration generating units 21-1 and 21-2. The first and second adhesive layers 21d and 21g may be connected or bonded to each other between the first and second vibration generating units 21-1 and 21-2.

[0235] Optionally, at least a portion of each of the first and second signal cables 30a, 30b can be positioned or inserted between the first cover member 21e and the second cover member 21f, thereby preventing breakage of the first and second protruding lines 31a, 31b due to stress such as movement or bending of the signal cable 30.

[0236] Such vibration generator 20 according to other embodiments of the present specification can be driven as a large-area vibrating body by single-body vibration. Furthermore, vibration generator 20 according to other embodiments of the present specification, like vibration generator 20 described with reference to Figures 16 to 19, can have a simplified structure and manufacturing process, can complement the electrical characteristics of electrode units 21b and 21c, can simplify or simplify the connection structure between first and second vibration generating units 21-1 and 21-2, acoustic processing circuits 40a and 40b, signal cables 30a and 30b, and acoustic data generating circuit units, and can omit a filter circuit including an inductor and a capacitor for preventing electromagnetic interference (EMI).

[0237] For example, in a vibration generator 20 according to another embodiment of the present specification, the first and second signal cables 30a, 30b may be changed or configured into a single signal cable 30. In a signal cable 30 according to an embodiment of the present specification, the first and second signal cables 30a, 30b may simply be configured into a single cable without any structural changes, and thus may have a width greater than the sum of the widths of the first and second signal cables 30a, 30b. In a signal cable 30 according to another embodiment of the present specification, one side edge of the body on which the first and second acoustic processing circuits 40a, 40b are mounted may have a relatively large width, and the remaining portion of the signal cable 30 excluding the side edge of the body may have the same width as either one of the first and second signal cables 30a, 30b.

[0238] FIG. 23 is a diagram showing a vibration generator according to another embodiment of the present specification. FIG. 23 shows the vibration generator shown in FIGS. 16 and 22 configured with four vibration generating units. Therefore, hereinafter, the same reference numerals will be used to denote the remaining components except for the four vibration generating units and related components, and redundant explanations thereof will be omitted or brief. A cross section taken along line II-II' in FIG. 23 is shown in FIG. 17, and a cross section taken along line IV-IV' in FIG. 23 is shown in FIG. 22.

[0239] Referring to Figure 23 in conjunction with Figures 17 and 22, a vibration generator 20 according to another embodiment of the present specification may include a plurality of vibration generating units 21-1, 21-2, 21-3, 21-4, a first signal cable 30a, and a second signal cable 30b.

[0240] The vibration generators 21-1, 21-2, 21-3, and 21-4 may be arranged in a first direction (X) and a second direction (Y) while being spaced apart and electrically isolated from one another. For example, the vibration generators 21-1, 21-2, 21-3, and 21-4 may be arranged in an i×j pattern or tiled. Each of the vibration generators 21-1, 21-2, 21-3, and 21-4 may include a piezoelectric vibration unit 21a, a first electrode unit 21b, and a second electrode unit 21c. Each of the vibration generators 21-1, 21-2, 21-3, and 21-4 is substantially the same as the vibration generators 21-1, 21-2, 21-3, and 21-4 of the vibration element 21 described with reference to FIG. 21 . Therefore, the same reference numerals are used for corresponding parts, and redundant description thereof will be omitted. In the following description, it is assumed that vibration generator 20 includes first to fourth vibration generating sections 21-1, 21-2, 21-3, and 21-4.

[0241] The first signal cable 30a may be electrically connected to the first and second electrodes 21b and 21c of the first and third vibration generating units 21-1 and 21-3, respectively, on one side of the vibration element 21, or may be electrically connected directly to the first and second electrodes 21b and 21c of the first and third vibration generating units 21-1 and 21-3, thereby being integrated with the first and third vibration generating units 21-1 and 21-3. For example, the first signal cable 30a may be electrically connected to the first and second electrodes 21b and 21c of the first and third vibration generating units 21-1 and 21-3, respectively, without passing through the power supply line and pad units described with reference to FIG. 21.

[0242] The second signal cable 30b may be electrically connected to the first and second electrodes 21b and 21c of the second and fourth vibration generating units 21-2 and 21-4, respectively, on one side of the vibration element 21, or may be electrically connected directly to the first and second electrodes 21b and 21c of the second and fourth vibration generating units 21-2 and 21-4, respectively. For example, the second signal cable 30b may be electrically connected to the first and second electrodes 21b and 21c of the second and fourth vibration generating units 21-2 and 21-4, respectively, without passing through the power supply line and pad unit described with reference to FIG. 21.

[0243] According to an embodiment of the present disclosure, the first and second signal cables 30a and 30b may each include a first and second protruding line 31a and 31b, respectively. For example, the first and second protruding lines 31a and 31b may each be expressed by terms such as, but not limited to, a protruding electrode, an extension line, an extension electrode, a finger line, or a finger electrode.

[0244] The first protruding line 31a (or the first upper protruding line 31a1) of the first signal cable 30a overlaps at least a portion of the first electrode portion 21b of each of the first and third vibration generating units 21-1 and 21-3 and may be electrically connected to the first electrode portion 21b or may be electrically connected directly to the first electrode portion 21b. The second protruding line 31b (or the first lower protruding line 31b1) of the first signal cable 30a overlaps at least a portion of the second electrode portion 21c of each of the first and third vibration generating units 21-1 and 21-3 and may be electrically connected to the second electrode portion 21c or may be electrically connected directly to the second electrode portion 21c. For example, the first and second protruding lines 31a and 31b of the first signal cable 30a may bend toward the corresponding electrode portion 21b and 21c of each of the first and third vibration generating units 21-1 and 21-3, but this is not limiting.

[0245] The first protruding line 31a (or the second upper protruding line 31a2) of the second signal cable 30b overlaps at least a portion of the first electrode portion 21b of each of the second and fourth vibration generating units 21-2 and 21-4 and may be electrically connected to the first electrode portion 21b or may be electrically connected directly to the first electrode portion 21b. The second protruding line 31b (or the second lower protruding line 31b2) of the second signal cable 30b overlaps at least a portion of the second electrode portion 21c of each of the second and fourth vibration generating units 21-2 and 21-4 and may be electrically connected to the second electrode portion 21c or may be electrically connected directly to the second electrode portion 21c. For example, the first and second protruding lines 31a and 31b of the second signal cable 30b may be bent toward the corresponding electrode portion 21b and 21c of each of the second and fourth vibration generating units 21-2 and 21-4, but this is not limiting.

[0246] Each of the first and second signal cables 30a, 30b according to an embodiment of the present specification may include a body portion, first and second protruding lines 31a, 31b, and sound processing circuits 40a, 40b. Since each of the first and second signal cables 30a, 30b is substantially the same as the signal cable 30 described with reference to Figures 14 to 20, the same reference numerals are used for corresponding parts, and redundant descriptions thereof will be omitted or brief.

[0247] The acoustic processing circuit (or first acoustic processing circuit) 40a mounted on or integrated with the first signal cable 30a generates first and second vibration drive signals based on acoustic data supplied from an external acoustic data generating circuit, and supplies the first and second vibration drive signals to the first and second electrode units 21b and 21c of the first and third vibration generating units 21-1 and 21-3, respectively, via the first and second protruding lines 31a and 31b. The acoustic processing circuit 40a mounted on the first signal cable 30a may include a decoding unit, an audio amplifier circuit, a memory circuit, a control circuit, and passive elements such as resistors, etc. This is substantially the same as the signal generating circuit 40 described with reference to Figures 13 to 17, so the same reference numerals will be used to refer to corresponding parts, and redundant description thereof will be omitted.

[0248] The acoustic processing circuit (or second acoustic processing circuit) 40b mounted on or integrated with the second signal cable 30b generates first and second vibration drive signals based on acoustic data supplied from an external acoustic data generating circuit, and supplies the first and second vibration drive signals to the first and second electrode units 21b and 21c of the second and fourth vibration generating units 21-2 and 21-4, respectively, via the first and second protruding lines 31a and 31b. The acoustic processing circuit 40b mounted on the second signal cable 30b may include a decoding unit, an audio amplifier circuit, a memory circuit, a control circuit, and passive elements such as resistors. This circuit is substantially the same as the signal generating circuit 40 described with reference to FIG. 14 or 16, and therefore the same reference numerals are used for corresponding parts, and redundant description thereof will be omitted.

[0249] Vibration generator 20 according to other embodiments of the present specification may further include first cover member 21e and second cover member 21f. First and second cover members 21e and 21f are substantially the same as first and second cover members 21e and 21f described with reference to Figures 13 to 22, respectively, except that they are configured to cover first to fourth vibration generating units 21-1, 21-2, 21-3, and 21-4, respectively, and first and second protruding lines 31a and 31b of first and second signal cables 30a and 30b, respectively. Therefore, the same reference numerals are used for corresponding parts, and redundant descriptions thereof will be omitted or brief.

[0250] The first cover member 21e may be disposed on a first surface of the vibration element 21. For example, the first cover member 21e may be configured to cover the first electrode portions 21b of the first to fourth vibration generating portions 21-1, 21-2, 21-3, and 21-4 and the first protruding lines 31a of the first and second signal cables 30a and 30b.

[0251] The second cover member 21f may be disposed on the second surface of the vibration element 21. For example, the second cover member 21f may be configured to cover the second electrode portions 21c of the first to fourth vibration generating portions 21-1, 21-2, 21-3, and 21-4 and the second protruding lines 31b of the first and second signal cables 30a and 30b.

[0252] The first cover member 21e according to one embodiment of the present specification may be connected or coupled to the first electrode portions 21b of the first to fourth vibration generating units 21-1, 21-2, 21-3, and 21-4 and the first protruding lines 31a of the first and second signal cables 30a and 30b via the first adhesive layer 21d. Thus, the first protruding lines (or first finger lines) 31a of the first and second signal cables 30a and 30b are disposed between the first electrode portions 21b of the first to fourth vibration generating units 21-1, 21-2, 21-3, and 21-4 and the first cover member 21e, and may be integrated with the vibration element 21.

[0253] According to an embodiment of the present specification, the second cover member 21f may be connected or coupled to the second electrode portions 21c of the first to fourth vibration generating units 21-1, 21-2, 21-3, and 21-4 and the second protruding lines 31b of the first and second signal cables 30a and 30b via the second adhesive layer 21g. Thus, the second protruding lines (or second finger lines) 31b of the first and second signal cables 30a and 30b are disposed between the second electrode portions 21c of the first to fourth vibration generating units 21-1, 21-2, 21-3, and 21-4 and the second cover member 21f, and may be integrated with the vibration element 21.

[0254] The first adhesive layer 21d may be disposed between the first to fourth vibration generating units 21-1, 21-2, 21-3, and 21-4 and on the first surfaces of the first to fourth vibration generating units 21-1, 21-2, 21-3, and 21-4. The second adhesive layer 21g may be disposed between the first to fourth vibration generating units 21-1, 21-2, 21-3, and 21-4 and on the second surfaces of the first to fourth vibration generating units 21-1, 21-2, 21-3, and 21-4. For example, the first and second adhesive layers 21d and 21g may be formed between the first cover member 21e and the second cover member 21f so as to completely surround each of the first to fourth vibration generating units 21-1, 21-2, 21-3, and 21-4. The first and second adhesive layers 21d, 21g may be connected or bonded to each other between the first to fourth vibration generating units 21-1, 21-2, 21-3, and 21-4.

[0255] At least a portion of each of the first and second signal cables 30a, 30b can be positioned or inserted between the first cover member 21e and the second cover member 21f, thereby preventing breakage of the first and second protruding lines 31a, 31b due to stress such as movement or bending of the signal cable 30.

[0256] Vibration generator 20 according to other embodiments of the present specification can be driven as a large-area vibrating body by single-body vibration of first to fourth vibration generating units 21-1, 21-2, 21-3, and 21-4, similar to vibration generator 20 described with reference to Fig. 23. Furthermore, vibration generator 20 according to other embodiments of the present specification, similar to vibration generator 20 described with reference to Figs. 14 to 20, can simplify the structure and manufacturing process, can complement the electrical characteristics of electrode units 21b and 21c, can simplify or simplify the connection structure between first to fourth vibration generating units 21-1, 21-2, 21-3, and 21-4, acoustic processing circuits 40a and 40b, signal cables 30a and 30b, and acoustic data generating circuit unit, and can omit a filter circuit including an inductor and a capacitor for preventing electromagnetic interference (EMI), etc.

[0257] For example, in a vibration generator 20 according to another embodiment of the present specification, the first and second signal cables 30a, 30b may be changed or configured into a single signal cable 30, as shown by the dotted line in FIG. 23. In one signal cable 30 according to an embodiment of the present specification, the first and second signal cables 30a, 30b may simply be combined into one without any structural changes, and thus the signal cable 30 may have a width greater than the sum of the widths of the first and second signal cables 30a, 30b. In one signal cable 30 according to another embodiment of the present specification, one side edge of the body on which the first and second acoustic processing circuits 40a, 40b are mounted may have a relatively large width, and the remaining portion excluding the side edge of the body may have the same width as either one of the first and second signal cables 30a, 30b.

[0258] FIG. 24 is a diagram showing an apparatus according to one embodiment of the present specification, FIG. 25 is a diagram showing the main cable and the first to nth signal cables shown in FIG. 24, and FIG. 26 is a waveform diagram showing the output signal of the acoustic data generation circuit unit shown in FIG. 23.

[0259] Referring to Figures 24 to 26, an apparatus according to one embodiment of the present specification may include first to nth vibration devices 20[1] to 20[n], an acoustic data generation circuit unit 50, a main cable 60, and first to nth signal cables 30[1] to 30[n].

[0260] Each of the first to nth vibration devices 20[1] to 20[n] can be any one of the vibration devices described with reference to Figures 1 to 23. For example, each of the first to nth vibration devices 20[1] to 20[n] can be the same as or different from one another. One or more of the first to nth vibration devices 20[1] to 20[n] can be different from one another. Therefore, a redundant description of each of the first to nth vibration devices 20[1] to 20[n] will be omitted.

[0261] Each of the first to nth vibration devices 20[1] to 20[n] may include any one of the vibration elements 21[1] to 21[n]. For example, the vibration elements 21[1] to 21[n] of each of the first to nth vibration devices 20[1] to 20[n] may be the same as or different from one another. One or more of the vibration elements 21[1] to 21[n] of the first to nth vibration devices 20[1] to 20[n] may be different from one another. Therefore, redundant explanations of the vibration elements 21[1] to 21[n] of each of the first to nth vibration devices 20[1] to 20[n] will be omitted.

[0262] The acoustic data generation circuit unit 50 (or sound card) generates acoustic data (Sdata) based on an acoustic source (or digital acoustic source). The acoustic data generation circuit unit 50 generates first to n-th enable signals (EN[1] to EN[n]) corresponding to the device's driving mode based on the acoustic source or acoustic data. The acoustic data generation circuit unit 50 encodes the reference clock CLK, the acoustic data Sdata, and the first to n-th enable signals (EN[1] to EN[n]) using a predetermined serial interface method (or digital serial interface method) and supplies the encoded data to the first to n-th vibration devices 20[1] to 20[n]. For example, the acoustic data generation circuit unit 50 can transmit the corresponding acoustic data Sdata to each of the first to n-th vibration devices 20[1] to 20[n] via a serial interface method based on the serial interface method. For example, the serial interface method can be, but is not limited to, I2S (Integrated Interchip Sound).

[0263] The main cable 60 may be connected to the acoustic data generating circuit unit 50. For example, the main cable 60 may have a length corresponding to the longest distance between each of the first to nth vibration devices 20[1] to 20[n] and the acoustic data generating circuit unit 50.

[0264] The main cable 60 according to an embodiment of the present specification may include first to n-th enable signal lines (ESL[1] to ESL[n]), a clock line (CL), and a data line (DL).

[0265] The acoustic data generation circuit unit 50 can supply corresponding enable signals EN[1] to EN[n] to the first to nth enable signal lines ESL[1] to ESL[n], respectively, supply a reference clock CLK to the clock line CL, and supply acoustic data Sdata to the data line DL.

[0266] The first to n-th signal cables 30[1] to 30[n] can be connected between the main cable 60 and the first to n-th vibration devices 20[1] to 20[n], respectively.

[0267] According to an embodiment of the present specification, each of the first to nth signal cables 30[1] to 30[n] may branch off or extend to a corresponding one of the first to nth vibration devices 20[1] to 20[n] from the main cable 60. For example, each of the first to nth signal cables 30[1] to 30[n] may branch off from the main cable 60 and be individually connected to the first to nth vibration devices 20[1] to 20[n].

[0268] Each of the first to nth signal cables 30[1] to 30[n] according to other embodiments of the present specification may be connected to the main cable 60 in a connector manner. For example, the main cable 60 may further include first to nth connectors 61[1] to 61[n].

[0269] The first to n-th connectors 61[1] to 61[n] may each include a first to a third connecting terminal. The first connecting terminal of each of the first to n-th connectors 61[1] to 61[n] may be electrically connected to a corresponding enable signal line among the first to n-th enable signal lines (ESL[1] to ESL[n]). The second connecting terminal of each of the first to n-th connectors 61[1] to 61[n] may be commonly connected to a clock line (CL). The third connecting terminal of each of the first to n-th connectors 61[1] to 61[n] may be commonly connected to a data line (DL).

[0270] According to one embodiment of the present specification, at least a portion of each of the first to nth signal cables 30[1] to 30[n] connected to the main cable 60 in a connector manner can be inserted (or housed) between the first and second cover members 21e, 21f of the vibration element 21, as described with reference to Figure 16, and redundant explanations thereof will be omitted.

[0271] Each of the first to n-th signal cables 30[1] to 30[n] according to an embodiment of the present specification may include a body portion, first and second protruding lines 31a, 31b, and a signal generating circuit .

[0272] As shown in FIG. 16, the body portion may include a wiring layer 31, a lower film 32 bonded to a first surface of the wiring layer 31 via a first adhesive 33, an upper film 34 bonded to a second surface of the wiring layer 31 via a second adhesive 35, and a plurality of contact pads disposed on the upper film 34 and connected to the wiring layer 31.

[0273] The wiring layer 31 can include first to third signal lines (SL1, SL2, SL3) and first and second drive signal supply lines (VLa, VLb).

[0274] The first to third signal lines (SL1, SL2, SL3) may be arranged next to each other.

[0275] The first signal line (SL1) of each of the first to nth signal cables 30[1] to 30[n] may be individually connected to a corresponding enable signal line among the first to nth enable signal lines (ESL[1] to ESL[n]) of the main cable 60. For example, the first signal line (SL1) of the first signal cable 30[1] may be electrically connected to the first enable signal line (ESL[1]) of the main cable 60, and the first signal line (SL1) of the nth signal cable 30[n] may be electrically connected to the nth enable signal line (ESL[n]) of the main cable 60.

[0276] The second signal lines (SL2) of the first to n-th signal cables 30[1] to 30[n] may be commonly connected to the clock line (CL) of the main cable 60.

[0277] The third signal lines SL3 of the first to n-th signal cables 30[1] to 30[n] may be commonly connected to the data line (DL) of the main cable 60.

[0278] The first and second drive signal supply lines (VLa, VLb) may be arranged next to each other at the ends of the corresponding signal cables 30[1] to 30[n].

[0279] Each of the first and second protruding lines 31a, 31b may be electrically connected to each of the first and second driving signal supply lines (VLa, VLb), or may extend or protrude from each of the first and second driving signal supply lines (VLa, VLb) to the outside through one side surface 30s of the body portion.

[0280] The first protruding line 31a may be electrically connected to a first electrode layer of the vibration element 21 of the corresponding vibration device, and the second protruding line 31b may be electrically connected to a second electrode layer of the vibration element 21 of the corresponding vibration device. This is the same as what has been described above, so a repeated description thereof will be omitted.

[0281] The signal generating circuit 40 can be mounted on each of the first to nth signal cables 30[1] to 30[n] and electrically connected to each of the first to third signal lines (SL1, SL2, SL3) and each of the first and second drive signal supply lines (VLa, VLb).

[0282] The signal generating circuit 40 decodes the enable signals (ES[1] to ES[n]), the reference clock (CLK), and the sound data (Sdata) supplied from the sound data generating circuit unit 50 via the first to third signal lines (SL1, SL2, SL3), and generates first and second vibration drive signals for vibrating each of the first to n-th vibrating devices 20[1] to 20[n] based on the decoded enable signals (ES[1] to ES[n]), the reference clock (CLK), and the sound data (Sdata), and outputs the generated signals to the first and second drive signal supply lines (VLa, VLb). Therefore, each of the first to n-th vibrating devices 20[1] to 20[n] vibrates in response to the first and second vibration drive signals supplied via the first and second drive signal supply lines (VLa, VLb) and the first and second protruding lines 31a, 31b of the corresponding signal cables 30[1] to 30[n], and can output sound corresponding to the sound data (Sdata). For example, the first to n-th vibration devices 20[1] to 20[n] can be driven sequentially or simultaneously based on the corresponding enable signals (ESL[1] to ESL[n]).

[0283] According to an embodiment of the present invention, the signal generating circuit 40 mounted on each of the first to n-th signal cables 30[1] to 30[n] can be enabled in response to an enable signal of a first logic level (LL1) supplied via a first signal line (SL1) of the corresponding signal cable to generate first and second vibration drive signals, and can be disabled in response to an enable signal of a second logic level (LL2). For example, the signal generating circuit 40 mounted on the first signal cable 30[1] can be enabled in response to a first enable signal (EN[1]) of a first logic level (LL1) supplied via the first signal line (SL1) of the first signal cable 30[1] to generate first and second vibration drive signals based on a reference clock (CLK) and acoustic data (Sdata), and output them to the first and second drive signal supply lines (VLa, VLb). Similarly, the signal generating circuit 40 implemented in the nth signal cable 30[n] is enabled in response to the nth enable signal (EN[n]) of the first logic level (LL1) supplied via the first signal line (SL1) of the nth signal cable 30[n], and can generate first and second vibration drive signals based on the reference clock (CLK) and acoustic data (Sdata) and output them to the first and second drive signal supply lines (VLa, VLb).

[0284] According to the vibration device according to one embodiment of the present specification, the acoustic data (Sdata) output from the acoustic data generating circuit unit 50 is transmitted to each of the first to nth vibration devices 20[1] to 20[n] via a serial interface using the main cable 60 and the first to nth signal cables 30[1] to 30[n], thereby simplifying the wiring structure between the acoustic data generating circuit unit 50 and the vibration devices 10[1] to 10[n] and improving assembly. Furthermore, by mounting the signal generating circuit 40 on each of the first to nth signal cables 30[1] to 30[n], the circuit configuration can be simplified, and a filter circuit including an inductor and a capacitor for preventing electromagnetic interference (EMI) and the like caused by the length of the main cable 60 and the signal cables 30[1] to 30[n] can be omitted.

[0285] FIG. 27 is a diagram illustrating a vibration device according to another example of the present specification, and FIG. 28 is a diagram illustrating the vibration generator of FIG.

[0286] 27 and 28 , a vibration device 5 according to another embodiment of the present specification includes a diaphragm 10, a vibration generator provided on the diaphragm 10, and a connecting member 15 between the diaphragm 10 and the vibration generator. The vibration generator may include a first vibrating structure having a first piezoelectric coefficient, a second vibrating structure having a second piezoelectric coefficient different from the first piezoelectric coefficient, and a connecting portion 25 provided between the first vibrating structure and the second vibrating structure. Here, the first vibrating structure and the second vibrating structure may face each other with the connecting portion 25 interposed therebetween and may have, for example, a stacked structure. Therefore, the first vibrating structure may be located on the first vibration generator 20a, and the second vibrating structure may be located on the second vibration generator 20b.

[0287] The connecting portion 25 may include, but is not limited to, an insulating foam pad, double-sided tape, adhesive, etc. For example, the adhesive layer of the connecting member 15 may include, but is not limited to, epoxy, acrylic, silicone, or urethane. The connecting portion may be expressed by terms such as, but is not limited to, an adhesive layer, a connecting member, a buffer layer, etc.

[0288] FIG. 29 is a diagram illustrating a vibration drive circuit according to an embodiment of the present disclosure, and FIG. 30 is a diagram illustrating the displacement of a vibration generator according to an embodiment of the present disclosure.

[0289] 29 and 30, a signal generating circuit 40 according to an embodiment of the present specification is electrically coupled to the vibration device 5 and can generate a vibration drive signal based on an acoustic source and supply it to the vibration device 5, thereby causing the vibration device 5 to vibrate or displace.

[0290] The signal generating circuit 40 according to the present specification may include a plurality of amplifiers 41, 42 coupled to each of the plurality of vibration generators 20a, 20b constituting the vibration device 5. For example, the signal generating circuit 40 may include first and second amplifiers 41, 42 individually coupled to each of the first and second vibration generators 20a, 20b constituting the vibration device 5.

[0291] The first amplifier 41 is capable of generating an alternating current (AC) type vibration drive signal including a first vibration drive signal and a second vibration drive signal based on an acoustic source.

[0292] A first amplifier 41 according to this specification may include a first output terminal T11 for outputting a first vibration drive signal, and a second output terminal T12 for outputting a second vibration drive signal.

[0293] In the first amplifier 41, the first output terminal T11 may be electrically connected to either the first electrode unit 21b or the second electrode unit 21c of the first vibration generator 20a. The second output terminal T12 may be electrically connected to the other of the first electrode unit 21b or the second electrode unit 21c of the first vibration generator 20a. For example, the first output terminal T11 of the first amplifier 41 may be electrically connected to the first electrode unit 21b of the first vibration generator 20a, and the second output terminal T12 of the first amplifier 41 may be electrically connected to the second electrode unit 21c of the first vibration generator 20a. For example, the first vibration drive signal output from the first output terminal T11 of the first amplifier 41 may be supplied to the first electrode unit 21b via the flexible cable 29, the pad unit 27, and the first power supply line (PL1) of the first vibration generator 20a. The second vibration drive signal output from the second output terminal T12 of the first amplifier 41 can be supplied to the second electrode portion 21c via the flexible cable 29 of the first vibration generator 20a, the pad portion 27, and the second power supply line (PL2).

[0294] A first amplifier 42 according to this specification may include a first output terminal T21 for outputting a first vibration drive signal, and a second output terminal T22 for outputting a second vibration drive signal.

[0295] The first and second output terminals T21, T22 of the first amplifier 42 may be respectively connected to the first electrode unit 21b and the second electrode unit 21c of the second vibration generator 20b so that the second vibration generator 20b can be displaced (or vibrated or driven) in the same direction as the displacement direction of the first vibration generator 20a. In the first amplifier 42, the first output terminal T21 may be electrically connected to either the first electrode unit 21b or the second electrode unit 21c of the second vibration generator 20b, and the second output terminal T22 may be electrically connected to the other of the first electrode unit 21b or the second electrode unit 21c of the second vibration generator 20b. For example, the first output terminal T21 of the first amplifier 42 may be electrically connected to the second electrode unit 21c of the second vibration generator 20b, and the second output terminal T22 of the first amplifier 42 may be electrically connected to the first electrode unit 21b of the second vibration generator 20b. For example, the first vibration drive signal output from the first output terminal T21 of the first amplifier 42 can be supplied to the second electrode unit 21c via the flexible cable 29, pad unit 27, and second power supply line (PL2) of the second vibration generator 20b. The second vibration drive signal output from the second output terminal T22 of the first amplifier 42 can be supplied to the first electrode unit 21b via the flexible cable 29, pad unit 27, and first power supply line (PL1) of the second vibration generator 20b.

[0296] 29 and the description referring to it, the signal generating circuit 40 according to the embodiment of the present specification has been described as including first and second amplifiers 41, 42, but is not limited to this. For example, the signal generating circuit 40 according to the embodiment of the present specification may include a plurality of amplifiers 41, 42 (e.g., three or more) corresponding to the number of vibration generators 20a, 20b included in the vibration device 5. Each of the three or more amplifiers 41, 42 can supply a vibration drive signal for displacing each of the three or more vibration generators 20a, 20b in the same direction. According to the present specification, the three or more vibration generators 20a, 20b include first and second groups, and the multiple amplifiers 41, 42 also include first and second amplifier groups so that the three or more vibration generators 20a, 20b can be displaced in the same direction.

[0297] Vibration generators 20a (e.g., odd-numbered vibration generators) of the first group are displaced in response to a vibration drive signal applied from amplifiers 41 (e.g., odd-numbered amplifiers) of the first amplifier group, and vibration generators 20b (e.g., even-numbered vibration generators) of the second group are displaced in response to a vibration drive signal applied from amplifiers 42 (e.g., even-numbered amplifiers) of the second amplifier group, so that three or more vibration generators 20a, 20b can be displaced in the same direction. For example, in amplifier 41 of the first amplifier group, first output terminal T11 may be electrically connected to first electrode portion 21b of vibration generator 20a of the first group, and second output terminal T12 may be electrically connected to second electrode portion 21c of vibration generator 20a of the first group. In the amplifier 42 of the second amplifier group, the first output terminal T21 can be electrically connected to the second electrode portion 21c of the vibration generator 20b of the second group, and the second output terminal T22 can be electrically connected to the first electrode portion 21b of the vibration generator 20b of the second group.

[0298] 30, the first and second vibration generators 20a, 20b according to the embodiments of the present specification can be displaced (or vibrated or driven) at a third amplitude DW3 in response to a vibration drive signal based on the thickness direction (Z) of the diaphragm 10. The first and second vibration generators 20a, 20b are displaced (or vibrated) in the same direction due to their stacked structure, so that a vibration device including the stacked first and second vibration generators 20a, 20b can be displaced (or vibrated or driven) at a relatively larger amplitude than a vibration device including a single or unitary vibration generator. For example, the vibration portion 21a of each of the first and second vibration generators 20a, 20b can include a first region (or first polarization region) adjacent to the first electrode portion 21b and a second region (or second polarization region) adjacent to the second electrode portion 21c. The vibrating section 21a of the first vibration generator 20a is displaced at a first amplitude DW1 by expanding a first region due to a positive (+) vibration drive signal and contracting a second region due to a negative (-) vibration drive signal. Simultaneously, the vibrating section 21a of the second vibration generator 20b is displaced at a second amplitude DW2 by contracting the first region due to a negative (-) vibration drive signal and expanding the second region due to a positive (+) vibration drive signal. Therefore, the diaphragm 10 is displaced (or vibrated or driven) at a third amplitude DW3 corresponding to the first amplitude DW1 of the first vibration generator 20a and the second amplitude DW2 of the second vibration generator 20b, thereby vibrating at a relatively large amplitude compared to vibrations produced by a vibration device including a single or monolithic vibration generator. For example, the vibration device 5 according to the present specification can align the driving direction of the vibration device compared to a vibration device including a single or monolithic vibration generator, thereby maximizing or improving the driving force of the vibration device 5. Therefore, the displacement amount (or bending force) or amplitude displacement of the diaphragm 10 can be increased (or maximized) by the displacement of the vibration device 5, thereby improving the acoustic characteristics in the mid-low frequency range and the sound pressure characteristics of the sound generated by the vibration of the diaphragm 10.

[0299] 31A and 31B are cross-sectional views of a vibration device according to another embodiment of the present disclosure.

[0300] 31A and 31B, in order to maximize or increase the displacement or amplitude of the vibration device 5, the vibrating portion 21a of the first vibrating structure and the vibrating portion 21a of the second vibrating structure may have different lamination numbers. For example, the vibrating portion 21a of the first vibrating structure may have a greater lamination number than the vibrating portion 21a of the second vibrating structure. According to another embodiment of the present specification, in order to maximize or increase the displacement or amplitude of the vibration device 5, the vibrating portion 21a of the first vibrating structure and the vibrating portion 21a of the second vibrating structure may have different thicknesses or volumes. For example, the thickness or volume of the vibrating portion 21a of the first vibrating structure may be greater than the thickness or volume of the vibrating portion 21a of the second vibrating structure. According to one embodiment of the present specification, the vibrating portion 21a of the first vibrating structure and the vibrating portion 21a of the second vibrating structure may have the same polarization direction.

[0301] Fig. 32 is a diagram showing a vibration generator according to another embodiment of the present specification. Fig. 33 is a diagram showing the vibrating structure shown in Fig. 32. Fig. 34 is a cross-sectional view taken along line V-V' in Fig. 32, which shows a modified vibrating structure of the vibrating device shown in Fig. 27. Therefore, in the following description, redundant descriptions of the remaining components excluding the vibrating structure and its related components will be omitted or will be brief.

[0302] Referring to Figures 32 to 34, in a vibration device 5 according to another embodiment of the present specification, the vibration structure 21 of each of the first and second vibration generators 20a, 20b may include a vibration portion 21a, a first electrode portion 21b, and a second electrode portion 21c.

[0303] The vibrating unit 21a may include a piezoelectric material, a composite piezoelectric material, or an electroactive material having a piezoelectric effect. The vibrating unit 21a may include inorganic and organic materials. For example, the vibrating unit 21a may include multiple inorganic material portions made of piezoelectric material and at least one organic material portion made of a soft material. For example, the vibrating unit 21a may be expressed as a piezoelectric vibrating unit, a piezoelectric composite layer, a piezoelectric composite, a piezoelectric ceramic composite, or the like, but is not limited thereto. The vibrating unit 21a may be made of a transparent, translucent, or opaque piezoelectric material, and thus may be transparent, translucent, or opaque. The vibrating structure 21 including the vibrating unit 21a or each of the first and second vibration generators 20a and 20b may be expressed as a flexible vibration generator, a flexible actuator, a flexible speaker, a flexible piezoelectric speaker, a film actuator, a film-type piezoelectric composite actuator, a film speaker, a film-type piezoelectric speaker, or a film-type piezoelectric composite speaker, but is not limited thereto.

[0304] The vibrating unit 21a according to this specification may include a plurality of first portions 21a1 and a plurality of second portions 21a2. For example, the plurality of first portions 21a1 and the plurality of second portions 21a2 may be alternately and repeatedly arranged along a first direction (X) (or a second direction (Y)). For example, the first direction (X) may be the horizontal direction of the vibrating unit 21a, and the second direction (Y) may be the vertical direction of the vibrating unit 21a that intersects with the first direction (X), but is not limited thereto. For example, the first direction (X) may be the vertical direction of the vibrating unit 21a, and the second direction (Y) may be the horizontal direction of the vibrating unit 21a.

[0305] Each of the first portions 21a1 may be made of an inorganic material. The inorganic material may include the materials described above. For example, each of the first portions 21a1 may be made of substantially the same material as the first portions 21a1 described in FIG. 18, and therefore, a redundant description thereof will be omitted.

[0306] Each of the multiple first portions 21a1 according to this specification may be disposed between the multiple second portions 21a2. The multiple second portions 21a2 may be disposed (or arranged) side by side with the multiple first portions 21a1 sandwiched between them. Each of the multiple first portions 21a1 may have a first width (W1) in the first direction (X) (or the second direction (Y)) and a length in the second direction (Y) (or the first direction (X)). Each of the multiple second portions 21a2 may have a second width (W2) in the first direction (X) (or the second direction (Y)) and a length in the second direction (Y) (or the first direction (X)). The first width (W1) may be the same as or different from the second width (W2). Each of the multiple second portions 21a2 may have the same size, for example, area, surface area, or volume. For example, each of the plurality of second portions 21a1 may have the same size, e.g., width, area, or volume, within the range of process error (or tolerance) that occurs in the manufacturing process. For example, the first width (W1) may be greater than the second width (W2). For example, the first portion 21a1 and the second portion 21a2 may have a line shape or a stripe shape having the same or different sizes. Therefore, the vibrating portion 21a may have a resonant frequency of 20 kHz or less by having a 2-2 complex, but is not limited to this. For example, the resonant frequency of the vibrating portion 21a may be changed by at least one of the shape, length, and thickness.

[0307] In the vibrating unit 21a, the plurality of first portions 21a1 and the plurality of second portions 21a2 may be arranged (or arrayed) next to each other on the same plane (or the same layer). Each of the plurality of second portions 21a2 may be configured to fill the gap between two adjacent first portions 21a1. Each of the plurality of second portions 21a2 may be connected or bonded to the adjacent first portion 21a1. Each of the plurality of second portions 21a2 may be configured to fill the gap between two adjacent first portions 21a1, thereby being connected or bonded to the adjacent first portion 21a1. Therefore, the vibrating unit 21a can be expanded to a desired size or length by side-coupling (or coupling) the first portions 21a1 and the second portions 21a2.

[0308] In the vibrating part 21a, the width (W2) of each of the plurality of second portions 21a2 may gradually decrease from the middle part of the vibrating part 21a toward both side edges (or both ends).

[0309] According to the present specification, the second portion 21a2 having the largest width (W2) among the plurality of second portions 21a2 may be located in a portion where maximum stress is concentrated when the vibrating portion 21a vibrates in the vertical direction (Z) (or thickness direction). The second portion 21a2 having the smallest width (W2) among the plurality of second portions 21a2 may be located in a portion where relatively minimum stress is generated when the vibrating portion 21a vibrates in the vertical direction (Z). For example, the second portion 21a2 having the largest width (W2) among the plurality of second portions 21a2 may be located in a central portion of the vibrating portion 21a, and the second portion 21a2 having the smallest width (W2) among the plurality of second portions 21a2 may be located at one or more of the side edges of the vibrating portion 21a. Therefore, when the vibrating portion 21a vibrates in the vertical direction (Z), interference of sound waves or superposition of resonant frequencies generated in the portion where maximum stress is concentrated may be minimized. Therefore, it is possible to improve the sound pressure dip that occurs in the low frequency range and improve the flatness of the acoustic characteristics in the low frequency range. For example, the flatness of the acoustic characteristics may be the magnitude of the deviation between the maximum sound pressure and the minimum sound pressure.

[0310] In the vibrating unit 21a, the plurality of first portions 21a1 may have different sizes (or areas). For example, the size (or area) of each of the plurality of first portions 21a1 may gradually decrease or increase from the middle portion of the vibrating unit 21a to both side edges (or both ends). The piezoelectric vibrating unit 21a may improve the sound pressure characteristics of the sound and expand the sound reproduction band due to various natural vibration frequencies caused by the vibration of each of the plurality of first portions 21a1 having different sizes.

[0311] Each of the plurality of second portions 21a2 may be disposed between the plurality of first portions 21a1. Therefore, the vibrational energy of the vibrating unit 21a due to the linkage within the unit cell of the first portion 21a1 may be increased by the second portion 21a2, thereby improving vibration characteristics and ensuring piezoelectric characteristics and flexibility. For example, the second portion 21a2 may be one or more of an epoxy-based polymer, an acrylic-based polymer, and a silicone-based polymer, but is not limited thereto.

[0312] According to the present specification, the second portion 21a2 may be made of an organic material portion. For example, the organic material portion may be disposed between the inorganic material portions to absorb impacts applied to the inorganic material portion (or the first portion) and release stress concentrated on the inorganic material portion, thereby improving the durability of the vibrating portion 21a and providing flexibility to the vibrating portion 21a.

[0313] The second portion 21a2 according to the present specification may have a lower modulus and viscoelasticity than the first portion 21a1, thereby improving the reliability of the first portion 21a1, which is vulnerable to impact due to the brittle characteristics of the first portion 21a1.

[0314] For example, the vibration device 5 for vibrating the diaphragm 10 can have the best vibration characteristics if it has impact resistance and high rigidity. To ensure that the vibration device 5 has impact resistance and high rigidity, each of the second portions 21a2 can be made of a material having a relatively high damping factor (tan δ) and relatively high stiffness. For example, each of the second portions 21a2 can be made of a material having a damping factor (tan δ) of 0.1 to 1 GPa (Giga Pascal) and a stiffness of 0 to 10 GPa (Giga Pascal). The damping factor (tan δ) and stiffness can be explained by the correlation between the loss factor and the modulus. For example, the second portion 21a2 can be made of a material having a loss factor of 0.01 to 1 and a modulus of 1 to 10 GPa (Giga Pascal).

[0315] The organic material portion of the second portion 21a2 may include an organic material, an organic polymer, an organic piezoelectric material, or an organic non-piezoelectric material having flexibility compared to the inorganic material portion of the first portion 21a1. For example, the second portion 21a2 may be expressed as a flexible adhesive portion, an elastic portion, a bending portion, a damping portion, or a soft portion, but is not limited thereto.

[0316] The organic material portion including the organic piezoelectric material can absorb impacts applied to the inorganic material portion (or the first portion), thereby improving the overall durability of the vibration device 5 and providing a certain level of piezoelectric characteristics. The organic piezoelectric material according to an embodiment of the present specification may be an organic material having electroactive properties. For example, the organic piezoelectric material may include at least one of PVDF (Polyvinylidene fluoride), beta PVDF (β-Polyvinylidene fluoride), and PVDF-TrFE (Polyvinylidene-trifluoroethylene), but is not limited thereto.

[0317] The organic material portion including the organic non-piezoelectric material is made of a curable resin composition and an adhesive including the curable resin composition, and is therefore able to absorb impacts applied to the inorganic material portion (or the first portion), thereby improving the overall durability of the vibration device 5. The organic non-piezoelectric material according to an embodiment of the present specification may include at least one of an epoxy-based polymer, an acrylic-based polymer, and a silicone-based polymer, but is not limited thereto.

[0318] For example, the organic material portion including the organic non-piezoelectric material may include an adhesion promoter for adhesion with the inorganic material portion and an epoxy resin to achieve the high rigidity required for the vibration device 5. For example, the adhesion promoter may be, but is not limited to, a phosphate-based material. The organic material portion may be cured by at least one of thermal curing and photocuring. To prevent a decrease in the thickness uniformity of the vibration device 5 due to shrinkage of the organic material portion caused by volatilization of the solvent during curing, a solvent-free epoxy resin may be used, but is not limited to this.

[0319] The organic material portion containing the organic non-piezoelectric material may further contain a reinforcing agent to enhance the damping properties in addition to the high rigidity of the vibration device 5. For example, the reinforcing agent may be a core-shell type MBS (Methylmethacrylate-Butadiene-Styrene), and its content may be 5 to 40 wt%. The reinforcing agent is a core-shell type elastic material, and the shell portion has a high bonding strength with an epoxy resin such as an acrylic polymer, thereby improving the impact resistance or damping properties of the vibration device 5.

[0320] The vibrating unit 21a according to the present specification may have a single thin film shape by arranging (or connecting) a plurality of first portions 21a1 and second portions 21a2 on the same plane. For example, the vibrating unit 21a may have a structure in which the plurality of first portions 21a1 are connected at one side. For example, the plurality of first portions 21a1 may be connected across the entire vibrating unit 21a. For example, the vibrating unit 21a may vibrate vertically due to the first portions 21a1 having vibration characteristics, and may bend into a curved shape due to the second portions 21a2 having flexibility. Furthermore, in the vibrating unit 21a according to the present specification, the sizes of the first portions 21a1 and the second portions 21a2 may be set according to the piezoelectric characteristics and flexibility required for the vibrating unit 21a. As an example of the present specification, in the case of a vibrating unit 21a that requires piezoelectric characteristics rather than flexibility, the size of the first portion 21a1 may be configured to be larger than the size of the second portion 21a2. In another embodiment of the present specification, in the case of vibrating part 21a that requires flexibility rather than piezoelectric characteristics, the size of second part 21a2 may be configured to be larger than the size of first part 21a1. This has the advantage that the size of vibrating part 21a can be adjusted depending on the required characteristics, making it easier to design piezoelectric vibrating part 21a.

[0321] The vibrating structure 21 of the first vibration generator 20a and the vibrating structure 21 of the second vibration generator 20b may have the same size and may overlap each other to maximize or increase the displacement amount or amplitude displacement of the vibration device 5. For example, the first portion (end or terminal or outer surface or corner) 20a1 of each of the vibrating structures 21 (or vibrating section 21a) of the first vibration generator 20a may be substantially aligned with or overlap with the second portion (end or terminal or outer surface or corner) 20b1 of each of the vibrating structures 21 (or vibrating section 21a) of the second vibration generator 20b without being misaligned with each other. For example, the first portion (end or terminal or outer surface or corner) 20a1 of each of the vibrating structure 21 (or vibrating portion 21a) of the first vibration generator 20a can be substantially aligned or overlapped with the second portion (end or terminal or outer surface or corner) 20b1 of each of the vibrating structure 21 (or vibrating portion 21a) of the second vibration generator 20b within a manufacturing process tolerance without being misaligned with each other. For example, the first portion (end or terminal or outer surface or corner) 20a1 of each of the vibrating structure 21 (or vibrating portion 21a) of the first vibration generator 20a can be aligned with or located on a virtual first extension line (VL1). The first portion (end or terminal or outer surface or corner) 20a1 of each of the vibrating structures 21 (or vibrating portions 21a) of the first vibration generator 20a may be precisely aligned with or precisely located on the imaginary first extension line (VL1). The second portion (end or terminal or outer surface or corner) 20b1 of each of the vibrating structures 21 (or vibrating portions 21a) of the second vibration generator 20b may be precisely aligned with or precisely located on the first extension line (VL1). For example, the second portion (end or terminal or outer surface or corner) 20b1 of each of the vibrating structures 21 (or vibrating portions 21a) of the second vibration generator 20b may be precisely aligned with or precisely located on the first extension line (VL1).

[0322] According to the present specification, the multiple first portions 21a1 of the first vibration generator 20a and the multiple first portions 21a1 of the second vibration generator 20b have the same size and can substantially overlap or lie on top of each other without misalignment. For example, the multiple first portions 21a1 of the first vibration generator 20a and the multiple first portions 21a1 of the second vibration generator 20b have the same size and can substantially overlap or lie on top of each other without misalignment within a manufacturing process tolerance. According to the present specification, each first portion of the multiple first portions 21a1 belonging to the first vibration generator 20a can substantially overlap or lie on top of each other without misalignment with each other within a manufacturing process tolerance. For example, each first portion of the multiple first portions 21a1 belonging to the first vibration generator 20a can substantially overlap or lie on top of each other without misalignment with each other within a manufacturing process tolerance. For example, the first portion of each of the plurality of first portions 21a1 belonging to the first vibration generator 20a may be aligned with or located on the second extension line (VL2) without being misaligned with the first portions of each of the plurality of first portions 21a1 belonging to the second vibration generator 20b. For example, the first portion of each of the plurality of first portions 21a1 belonging to the first vibration generator 20a may be accurately aligned with or located on the second extension line (VL2) within a manufacturing process error range without being misaligned with the first portions of each of the plurality of first portions 21a1 belonging to the second vibration generator 20b.

[0323] According to the present specification, the multiple second portions 21a2 of the first vibration generator 20a and the multiple second portions 21a2 of the second vibration generator 20b have the same size and can substantially overlap or lie on top of each other without any misalignment. For example, the multiple second portions 21a2 of the first vibration generator 20a and the multiple second portions 21a2 of the second vibration generator 20b can have the same size and can substantially overlap or lie on top of each other without any misalignment within a manufacturing process error range. According to the present specification, each of the multiple second portions 21a2 of the first vibration generator 20a can substantially overlap or lie on top of each of the multiple second portions 21a2 of the second vibration generator 20b without any misalignment. For example, each of the plurality of second portions 21a2 of the first vibration generator 20a may be aligned with or positioned on the second extension line (VL2) without being misaligned with each of the plurality of second portions 21a2 of the second vibration generator 20b. For example, each end (end or one side) of the plurality of second portions 21a2 of the first vibration generator 20a may be accurately aligned with or positioned on the second extension line (VL2) within a manufacturing process tolerance without being misaligned with each of the plurality of second portions 21a2 of the second vibration generator 20b. Therefore, in the vibration device 5 according to the present specification, the vibration part 21a of the first vibration generator 20a and the vibration part 21a of the second vibration generator 20b are displaced in the same direction, thereby maximizing or increasing the displacement amount or amplitude displacement, and thereby increasing (or maximizing) the displacement amount (or bending force) or amplitude displacement of the display diaphragm 10.

[0324] The first electrode unit 21b may be disposed on the first surface (or upper surface) of the vibrating unit 21a. The first electrode unit 21b may be commonly disposed on or coupled to the first surface of each of the first portions 21a1 and the first surface of each of the second portions 21a2. The first electrode unit 21b may be electrically connected to the first surface of each of the first portions 21a1. For example, the first electrode unit 21b may be disposed over the entire first surface of the vibrating unit 21a. The first electrode unit 21b may have a single electrode shape. For example, the first electrode unit 21b may have substantially the same shape as the vibrating unit 21a, but is not limited thereto. The first electrode unit 21b according to the present specification may be made of, but is not limited to, a transparent conductive material, a semi-transparent conductive material, or an opaque conductive material.

[0325] The second electrode unit 21c may be disposed on a second surface (or back surface) opposite to or different from the first surface of the vibrating unit 21a. The second electrode unit 21c may be commonly disposed on or coupled to the second surface of each of the first portions 21a1 and the second surface of each of the second portions 21a2. The second electrode unit 21c may be electrically connected to the second surface of each of the first portions 21a1. For example, the second electrode unit 21c may be disposed over the entire second surface of the vibrating unit 21a. The second electrode unit 21c may have a single electrode shape. For example, the second electrode unit 21c may have the same shape as the vibrating unit 21a, but is not limited thereto. The second electrode unit 21c according to the present specification may be made of, but is not limited to, a transparent conductive material, a semi-transparent conductive material, or an opaque conductive material.

[0326] The first electrode portion 21b may be covered by the above-mentioned first protective member 21e, and the second electrode portion 21c may be covered by the above-mentioned second protective member 21f.

[0327] The vibrating portion 21a of each of the first and second vibration generators 20a and 20b may be polarized by a constant voltage applied to the first electrode portion 21b and the second electrode portion 21c in a constant temperature environment or in a temperature environment that varies from high temperature to room temperature, but is not limited to this. For example, the vibrating portion 21a of each of the first and second vibration generators 20a and 20b may vibrate by alternately contracting and / or expanding due to the inverse piezoelectric effect caused by a vibration drive signal externally applied to the first electrode portion 21b and the second electrode portion 21c. For example, the vibrating portion 21a of each of the first and second vibration generators 20a and 20b may vibrate by vertical vibration and planar (or horizontal) vibration due to the first electrode portion 21b and the second electrode portion 21c. The planar contraction and / or expansion of the vibrating portion 21a may increase the displacement of the vibrating device 5 or the display panel, thereby further improving the vibration of the vibrating device 5 or the display panel.

[0328] 31 to 33 and the description referring thereto, the vibration device 5 according to another embodiment of the present specification has been described as including first and second vibration generators 20a, 20b, but is not limited thereto. For example, the vibration device 5 according to another embodiment of the present specification may include multiple (e.g., three or more) vibration generators. In this case, the multiple vibration generators may have the same size and may overlap each other to maximize or increase the displacement or amplitude displacement of the vibration device 5. According to the present specification, the first portion 21a1 of the vibration generator 20 arranged in the upper layer among the three or more vibration generators and the first portion 21a1 of the vibration generator arranged in the lower layer may substantially overlap or be superimposed on each other without being misaligned with each other. For example, the first portion 21a1 of the vibration generator 20 arranged in the upper layer among the three or more vibration generators and the first portion 21a1 of the vibration generator arranged in the lower layer may substantially overlap or be superimposed on each other without being misaligned with each other within the tolerance range of the manufacturing process. For example, the first portion 21a1 of the vibration generator arranged in the upper layer among the three or more vibration generators and the first portion 21a1 of the vibration generator arranged in the lower layer may be aligned with or located on the virtual extension line (VL). For example, the first portion 21a1 of the vibration generator arranged in the upper layer among the three or more vibration generators and the first portion 21a1 of the vibration generator arranged in the lower layer may be precisely aligned with or located on the virtual extension line (VL). Furthermore, the second portion 21a2 of the vibration generator arranged in the upper layer among the three or more vibration generators and the second portion 21a2 of the vibration generator arranged in the lower layer may substantially overlap or lie on each other without any misalignment. For example, the second portion 21a2 of the vibration generator arranged in the upper layer among the three or more vibration generators and the second portion 21a2 of the vibration generator arranged in the lower layer may substantially overlap or lie on each other without any misalignment within a manufacturing process tolerance. For example, among three or more vibration generators, the second portion 21a2 of the vibration generator arranged in the upper layer and the second portion 21a2 of the vibration generator arranged in the lower layer may be aligned with or located on the virtual extension line (VL).For example, among three or more vibration generators, the second part 21a2 of the vibration generator arranged in the upper layer and the second part 21a2 of the vibration generator arranged in the lower layer can be precisely aligned with or precisely located on the virtual extension line (VL).

[0329] Figure 35 shows a vibration device according to another embodiment of the present specification, which is a modification of the vibration unit described in Figures 32 to 34. Therefore, in the following explanation, redundant explanations of the remaining components excluding the vibration unit will be omitted or will be brief.

[0330] 27 and 35, in a vibration generator 20 of a vibration device 5 according to another embodiment of the present specification, the vibrating portion 21a of the vibrating structure 21 included in each of the first and second vibration generators 20a, 20b may include a plurality of first portions 21a1 and second portions 21a2 arranged between the plurality of first portions 21a1. The plurality of first portions 21a1 may be arranged spaced apart from each other along the first direction (X) and the second direction (Y).

[0331] The plurality of first portions 21a1 may be arranged to be spaced apart from one another along each of the first direction (X) and the second direction (Y). For example, the plurality of first portions 21a1 may have a hexahedral shape of the same size and be arranged in a lattice pattern. Since each of the plurality of first portions 21a1 is made of substantially the same material as the first portion 21a1 described in Figures 31 to 33, the same reference numerals are used for corresponding parts, and redundant description thereof will be omitted.

[0332] The second portion 21a2 may be disposed between the plurality of first portions 21a1 along each of the first direction (X) and the second direction (Y). The second portion 21a2 may be configured to fill the gap between two adjacent first portions 21a1 or surround each of the plurality of first portions 21a1, thereby being connected to or bonded to the adjacent first portions 21a1. According to the present specification, the width of the second portion 21a2 disposed between two adjacent first portions 21a1 along the first direction (X) may be the same as or different from the width of the first portions 21a1. The width of the second portion 21a2 disposed between two adjacent first portions 21a1 along the second direction (Y) may be the same as or different from the width of the first portions 21a1. Since the second portion 21a2 is made of substantially the same material as the second portion 21a2 described in FIGS. 31 to 33, the same reference numerals are used for corresponding parts, and redundant description thereof will be omitted.

[0333] 27 and 35 and the description referring thereto, the vibration device 5 according to another embodiment of the present specification has been described as including the first and second vibration generators 20a, 20b, but this is not limiting. For example, the vibration device 5 according to another embodiment of the present specification may include multiple (e.g., three or more) vibration generators. In this case, the multiple vibration generators may have the same size and may overlap each other to maximize or increase the displacement or amplitude of the vibration device 5. According to the present specification, the first portion 21a1 of the vibration generator arranged in the upper layer among the three or more vibration generators and the first portion 21a1 of the vibration generator arranged in the lower layer may substantially overlap or lie on top of each other without being misaligned with each other. For example, the first portion 21a1 of the vibration generator arranged in the upper layer among the three or more vibration generators and the first portion 21a1 of the vibration generator arranged in the lower layer may substantially overlap or lie on top of each other without being misaligned with each other within the tolerance range of the manufacturing process. Furthermore, the second portion 21a2 of the vibration generator arranged in an upper layer among the three or more vibration generators and the second portion 21a2 of the vibration generator arranged in a lower layer can substantially overlap or lie on top of each other without being misaligned with each other. For example, the second portion 21a2 of the vibration generator arranged in an upper layer among the three or more vibration generators and the second portion 21a2 of the vibration generator arranged in a lower layer can substantially overlap or lie on top of each other within a manufacturing process error range without being misaligned with each other.

[0334] Therefore, the vibration unit 21a of each of the first vibration generator 20a and the second vibration generator 20b according to the present specification can have a resonant frequency of 30 MHz or less by including a 1-3 composite, but is not limited to this. For example, the resonant frequency of the vibration unit 21a can be changed by at least one of the shape, length, and thickness.

[0335] Figure 36 is a diagram showing a vibration device according to another embodiment of the present specification, which is a modification of the vibration unit described in Figures 32 to 34. Therefore, in the following explanation, redundant explanations of the remaining configuration excluding the vibration unit will be omitted or will be brief.

[0336] Referring to Figures 27 and 36, in the vibration generator 20 of the vibration device 5 according to another embodiment of the present specification, the vibration part 21a of the piezoelectric structure included in each of the first and second vibration generators 20a, 20b may include a plurality of first portions 21a1 spaced apart from each other along the first direction (X) and the second direction (Y), and a second portion 21a2 arranged between the plurality of first portions 21a1.

[0337] Each of the plurality of first portions 21a1 according to the present specification may have a circular planar structure. For example, each of the plurality of first portions 21a1 may have a disk shape, but is not limited to this. For example, each of the plurality of first portions 21a1 may have a dot shape, including an oval, polygonal, or donut shape. Since each of the plurality of first portions 21a1 is made of substantially the same piezoelectric material as the first portion 21a1 described in FIG. 19, the same reference numerals are used for corresponding parts, and redundant description thereof will be omitted.

[0338] The second portion 21a2 may be disposed between the plurality of first portions 21a1 along each of the first direction (X) and the second direction (Y). The second portion 21a2 may be configured to surround each of the plurality of first portions 21a1, thereby being connected to or bonded to each side of the plurality of first portions 21a1. The plurality of first portions 21a1 and second portions 21a2 may be disposed (or arranged) side by side on the same plane (or the same layer). The second portion 21a2 is made of substantially the same organic material as the second portion 21a2 described in FIG. 19, and therefore the same reference numerals are used for corresponding parts, and redundant description thereof will be omitted.

[0339] In the vibrating unit 21a of the first vibration generator 20a according to another embodiment of the present specification, each of the plurality of first portions 21a1 may have a triangular planar structure instead of a circular planar structure. For example, each of the plurality of first portions 21a1 may have a triangular plate shape.

[0340] According to an embodiment of the present specification, four adjacent first portions 21a1 of the plurality of first portions 21a1 may be arranged adjacent to each other to form a rectangle (or square). Each vertex of the four adjacent first portions 21a1 forming the rectangle may be arranged adjacent to the center (or exact center) of the rectangle. According to another embodiment of the present specification, six adjacent first portions 21a1 of the plurality of first portions 21a1 may be arranged adjacent to each other to form a hexagon (or regular hexagon). Each vertex of the six adjacent first portions 21a1 forming the hexagon may be arranged adjacent to the center (or exact center) of the hexagon.

[0341] FIG. 37 shows a vibration device according to another embodiment of the present specification, and FIG. 38 is a cross-sectional view taken along line VI-VI' in FIG. 37, which is a modification of the vibration generator described in FIG. 34.

[0342] 27, 37, and 38, in a vibration generator 20 of a vibration device 5 according to another embodiment of the present specification, each of the first vibration generator 20a and the second vibration generator 20b can include at least one or more vibrating structures 200A, 200B, 200C, and 200D, or multiple vibrators 200A, 200B, 200C, and 200D. FIGS. 37 and 38 show an example including four vibrating structures. Each of the first vibration generator 20a and the second vibration generator 20b according to the embodiment of the present specification can be composed of two or more vibration modules.

[0343] The plurality of vibrating structures 200A, 200B, 200C, and 200D may be arranged to be spaced apart and electrically isolated from one another along the first direction (X) and the second direction (Y).

[0344] Each of the multiple vibrating structures 200A, 200B, 200C, and 200D can vibrate by alternately contracting and / or expanding due to the piezoelectric effect. For example, each of the multiple vibrating structures 200A, 200B, 200C, and 200D can be arranged at regular intervals along each of the first direction (X) and the second direction (Y), or can be tiled. Therefore, each of the first vibration generator 20a and the second vibration generator 20b, to which the multiple vibrating structures 200A, 200B, 200C, and 200D are tiled, can be a vibration module, a vibration array, a vibration array section, a vibration module array section, a vibration array structure, a tiling vibration array, a tiling array module, or a tiling vibration film, but is not limited to these terms.

[0345] Each of the plurality of vibrating structures 200A, 200B, 200C, and 200D according to embodiments of the present specification may have a rectangular shape. For example, each of the plurality of vibrating structures 200A, 200B, 200C, and 200D may have a rectangular shape with a width of 5 cm or more. For example, but not limited to, each of the plurality of vibrating structures 200A, 200B, 200C, and 200D may have a square shape with a size of 5 cm x 5 cm or more.

[0346] Each of the plurality of vibrating structures 200A, 200B, 200C, and 200D may be realized by a single vibrating device (or a single vibrating device) that is not driven independently but driven as a complete, single unit by being arranged at regular intervals or tiled. According to the present specification, a first separation distance (D1) between the plurality of vibrating structures 200A, 200B, 200C, and 200D in the first direction (X) may be, but is not limited to, 0.1 mm or more and less than 3 cm. Also, a second separation distance (D2) between the plurality of vibrating structures 200A, 200B, 200C, and 200D in the second direction (Y) may be, but is not limited to, 0.1 mm or more and less than 3 cm. For example, the first separation distance (D1) and the second separation distance (D2) may be the same. For example, the first distance D1 and the second distance D2 may be the same within a process tolerance range.

[0347] According to the present specification, the plurality of vibrating structures 200A, 200B, 200C, and 200D are arranged or tiled to have a separation distance (or interval) (D1, D2) of 0.1 mm or more and less than 3 cm, so that they can be driven as a single vibration device, and the reproduction band and sound pressure characteristics of the sound generated in conjunction with the single-body vibration of the plurality of vibrating structures 200A, 200B, 200C, and 200D can be increased. For example, in order to increase the reproduction band of the sound generated in conjunction with the single-body vibration of the plurality of vibrating structures 200A, 200B, 200C, and 200D and to increase the sound pressure characteristics of low-frequency sound, for example, at 500 Hz or less, the plurality of vibrating structures 200A, 200B, 200C, and 200D can be arranged at intervals of 0.1 mm or more and less than 5 mm.

[0348] According to one embodiment of the present specification, when multiple vibrating structures 200A, 200B, 200C, and 200D are arranged with a spacing (D1, D2) of less than 0.1 mm or no spacing (D1, D2), when each of the multiple vibrating structures 200A, 200B, 200C, and 200D vibrates, the reliability of each of the vibrating structures 200A, 200B, 200C, and 200D, or the first vibration generator 20a and the second vibration generator 20b, may be reduced due to cracks or damage caused by physical contact between the vibrating structures 200A, 200B, 200C, and 200D.

[0349] According to this specification, when the plurality of vibrating structures 200A, 200B, 200C, and 200D are arranged at intervals (D1, D2) of 3 cm or more, the plurality of vibrating structures 200A, 200B, 200C, and 200D may not be driven as a single vibrating device due to the independent vibration of each of the plurality of vibrating structures 200A, 200B, 200C, and 200D. Therefore, the reproduction band and sound pressure characteristics of the sound generated in conjunction with the vibration of the plurality of vibrating structures 200A, 200B, 200C, and 200D may be reduced. For example, when the plurality of vibrating structures 200A, 200B, 200C, and 200D are arranged at intervals (D1, D2) of 3 cm or more, the acoustic characteristics and / or sound pressure characteristics in the low frequency band, for example, below 500 Hz, may be reduced.

[0350] According to an embodiment of the present specification, when multiple vibrating structures 200A, 200B, 200C, and 200D are arranged at intervals of 5 mm, each of the multiple vibrating structures 200A, 200B, 200C, and 200D is not driven as a single vibrating device, and therefore the acoustic characteristics and / or sound pressure characteristics may be reduced in the low frequency band, for example, below 200 Hz.

[0351] According to another embodiment of the present specification, when the multiple vibrating structures 200A, 200B, 200C, and 200D are arranged at intervals of 1 mm, the multiple vibrating structures 200A, 200B, 200C, and 200D vibrate as a single vibrating device, thereby expanding the sound reproduction frequency band and improving the sound pressure characteristics of low-frequency sounds, for example, at frequencies below 500 Hz. For example, when the multiple vibrating structures 200A, 200B, 200C, and 200D are arranged at intervals of 1 mm, each of the first vibration generator 20a and the second vibration generator 20b can be realized as a large-area vibrating body by optimizing the separation distance between the multiple vibrating structures 200A, 200B, 200C, and 200D. Therefore, the multiple vibrating structures 200A, 200B, 200C, and 200D can be driven as a large-area vibrating body by single-body vibration. Therefore, the acoustic characteristics and / or sound pressure characteristics in the reproduction band and low frequency band of the sound generated in conjunction with the large-area vibration of each of the first vibration generator 20a and the second vibration generator 20b can be increased or improved.

[0352] Therefore, in order to realize single-body vibration of the plurality of vibrating structures 200A, 200B, 200C, and 200D (or one vibrating device), the separation distance between the plurality of vibrating structures 200A, 200B, 200C, and 200D may be set to 0.1 mm or more and less than 3 cm. Also, in order to increase the sound pressure characteristics of low-frequency sound while realizing single-body vibration of the plurality of vibrating structures 200A, 200B, 200C, and 200D (or one vibrating device), the separation distance between the plurality of vibrating structures 200A, 200B, 200C, and 200D may be set to 0.1 mm or more and less than 5 mm.

[0353] The first vibration generator 20a according to the present specification may include first to fourth vibrating structures 200A, 200B, 200C, and 200D that are spaced apart and electrically isolated from one another along a first direction (X) and a second direction (Y). For example, the first to fourth vibrating structures 200A, 200B, 200C, and 200D may be arranged or tiled in a 2x2 pattern.

[0354] According to this specification, the first and second vibrating structures 200A, 200B may be spaced apart from each other along a first direction (X). The third and fourth vibrating structures 200C, 200D may be spaced apart from each other along the first direction (X) and from the first and second vibrating structures 200A, 200B along a second direction (Y). The first and third vibrating structures 200A, 200C may face each other and be spaced apart from each other along the second direction (Y). The second and fourth vibrating structures 200B, 200D may face each other and be spaced apart from each other along the second direction (Y).

[0355] Each of the first to fourth vibrating structures 200A, 200B, 200C, and 200D according to an embodiment of the present specification may include a vibrating portion 21a, a first electrode portion 21b, and a second electrode portion 21c.

[0356] The vibrating part 21a may be made of a ceramic-based material capable of achieving relatively high vibration. For example, the vibrating part 21a may have a 1-3 composite having piezoelectric characteristics in a 1-3 vibration mode or a 2-2 composite having piezoelectric characteristics in a 2-2 vibration mode. For example, the vibrating part 21a may include a piezoelectric ceramic similar to the vibrating part 21a described in FIGS. 3A to 12B, or may include a first portion 21a1 and a second portion 21a2 similar to the vibrating part 21a described in any one of FIGS. 19 to 20D. Therefore, the same reference numerals are used for corresponding parts, and redundant description thereof will be omitted.

[0357] According to this specification, the vibrating portion 21a can be made of a transparent, semi-transparent, or opaque piezoelectric material, and therefore can be transparent, semi-transparent, or opaque.

[0358] The first electrode unit 21b may be disposed on a first surface of the vibrating unit 21a and electrically connected to the first surface of the vibrating unit 21a. This is the same as the first electrode unit 21b described in any one of Figures 2 to 14, so the same reference numerals are used for corresponding parts and redundant description thereof will be omitted.

[0359] The second electrode unit 21c is disposed on the second surface of the vibrating unit 21a and may be electrically connected to the second surface of the vibrating unit 21a. This is the same as the second electrode unit 21c described in any one of Figures 2 to 14, so the same reference numerals are used for corresponding parts and redundant description thereof will be omitted.

[0360] Each of the first vibration generator 20a and the second vibration generator 20b according to other embodiments of the present specification may further include a first protective member 21e and a second protective member 21f.

[0361] The first protective member 21e can be disposed on the first surfaces of the first vibration generator 20a and the second vibration generator 20b. For example, the first protective member 21e can cover the first electrode portions 21b disposed on the first surfaces of the plurality of vibrating structures 200A, 200B, 200C, and 200D, thereby being commonly connected to the first surfaces of the plurality of vibrating structures 200A, 200B, 200C, and 200D or commonly supporting the first surfaces of the plurality of vibrating structures 200A, 200B, 200C, and 200D. Thus, the first protective member 21e can protect the first surfaces or the first electrode portions 21b of the plurality of vibrating structures 200A, 200B, 200C, and 200D.

[0362] The first protective member 21e according to the present specification may be disposed on the first surface of each of the plurality of vibrating structures 200A, 200B, 200C, and 200D via the first adhesive layer 21d. For example, the first protective member 21e may be disposed on the first surface of each of the plurality of vibrating structures 200A, 200B, 200C, and 200D by a film laminating process via the first adhesive layer 21d. For example, the first protective member 21e may be disposed directly on the first surface of each of the plurality of vibrating structures 200A, 200B, 200C, and 200D by a film laminating process via the first adhesive layer 21d. Thus, each of the plurality of vibrating structures 200A, 200B, 200C, and 200D may be integrated with (or disposed on) or tiled with the first protective member 21e to have a certain interval (D1, D2).

[0363] The second protective member 21f can be disposed on the second surface of each of the first vibration generator 20a and the second vibration generator 20b. For example, the second protective member 21f can be commonly connected to the second surfaces of the multiple vibrating structures 200A, 200B, 200C, and 200D or commonly support the second surfaces of the multiple vibrating structures 200A, 200B, 200C, and 200D by covering the second electrode portions 21c disposed on the second surfaces of the multiple vibrating structures 200A, 200B, 200C, and 200D. Therefore, the second protective member 21f can protect the second surfaces or the second electrode portions 21c of the multiple vibrating structures 200A, 200B, 200C, and 200D.

[0364] The second protection member 21f according to the present specification may be disposed on the second surface of each of the plurality of vibrating structures 200A, 200B, 200C, and 200D via the second adhesive layer 21g. For example, the second protection member 21f may be disposed directly on the second surface of each of the plurality of vibrating structures 200A, 200B, 200C, and 200D by a film laminating process via the second adhesive layer 21g. Thus, each of the plurality of vibrating structures 200A, 200B, 200C, and 200D may be integrated with (or disposed on) or tiled with the second protection member 21f to have a certain interval (D1, D2).

[0365] Each of the first and second protective members 21e, 21f according to the present specification may be made of, but is not limited to, plastic, fiber, or wood. One of the first protective member 21e and the second protective member 21f may be attached or coupled to the diaphragm 10 via a connecting member (or a second connecting member).

[0366] The first adhesive layer 21d may be disposed on the first surfaces of the plurality of vibrating structures 200A, 200B, 200C, and 200D and between the plurality of vibrating structures 200A, 200B, 200C, and 200D. For example, the first adhesive layer 21d may be disposed on the back surface (or inner surface) of the first protective member 21e that faces the first surfaces of the first vibration generator 20a and the second vibration generator 20b. For example, the first adhesive layer 21d may be disposed on the first surfaces of the plurality of vibrating structures 200A, 200B, 200C, and 200D and filled between the plurality of vibrating structures 200A, 200B, 200C, and 200D.

[0367] The second adhesive layer 21g may be disposed on the second surface of each of the plurality of vibrating structures 200A, 200B, 200C, and 200D and between the plurality of vibrating structures 200A, 200B, 200C, and 200D. For example, the second adhesive layer 21g may be disposed on the front surface (or inner surface) of the second protective member 21f that faces the second surface of each of the first vibration generator 20a and the second vibration generator 20b. For example, the second adhesive layer 21g may be disposed on the second surface of each of the plurality of vibrating structures 200A, 200B, 200C, and 200D and filled between the plurality of vibrating structures 200A, 200B, 200C, and 200D.

[0368] The first and second adhesive layers 21d and 21g may be connected or bonded to each other between the multiple vibrating structures 200A, 200B, 200C, and 200D. Therefore, each of the multiple vibrating structures 200A, 200B, 200C, and 200D may be surrounded by the first and second adhesive layers 21d and 21g. For example, the first and second adhesive layers 21d and 21g may completely surround the entire multiple vibrating structures 200A, 200B, 200C, and 200D. For example, the first and second adhesive layers 21d and 21g may be expressed as, but are not limited to, cover members. When the first and second adhesive layers 21d and 21g are cover members, the first protective member 21e may be disposed on a first surface of the cover member, and the second protective member 21f may be disposed on a second surface of the cover member.

[0369] Each of the first and second adhesive layers 21d, 21g according to this specification may include an electrically insulating material that is compressible and resilient while maintaining adhesive properties. For example, each of the first and second adhesive layers 21d, 21g may include, but is not limited to, epoxy resin, acrylic resin, silicone resin, or urethane resin. For example, each of the first and second adhesive layers 21d, 21g may be configured to be transparent, translucent, or opaque.

[0370] According to other embodiments of the present specification, each of the first vibration generator 20a and the second vibration generator 20b may further include a first power supply line (PL1) arranged in the first protective member 21e, a second power supply line (PL2) arranged in the second protective member 21f, and a pad portion 27 electrically connected to the first power supply line (PL1) and the second power supply line (PL2).

[0371] The first power supply line (PL1) may be disposed on a rear surface of the first protective member 21e facing the first surfaces of the first vibration generator 20a and the second vibration generator 20b. The first power supply line (PL1) may be electrically connected to the first electrode portion 21b of each of the plurality of vibrating structures 200A, 200B, 200C, and 200D. For example, the first power supply line (PL1) may be electrically connected to the first electrode portion 21b of each of the plurality of vibrating structures 200A, 200B, 200C, and 200D. For example, the first power supply line (PL1) may be directly electrically connected to the first electrode portion 21b of each of the plurality of vibrating structures 200A, 200B, 200C, and 200D. In one embodiment of the present specification, the first power supply line (PL1) may be electrically connected to the first electrode portion 21b of each of the plurality of vibrating structures 200A, 200B, 200C, and 200D via an anisotropic conductive film. In another embodiment of the present specification, the first power supply line (PL1) may be electrically connected to the first electrode portion 21b of each of the plurality of vibrating structures 200A, 200B, 200C, and 200D via a conductive material (or particles) included in the first adhesive layer 21d.

[0372] The first power supply line (PL1) according to this specification may include the first-1 and first-2 power supply lines (PL11, PL12) arranged along the second direction (Y). For example, the first-1 power supply line (PL11) may be electrically connected to the first electrode portions 21b of the first and third vibrating structures 200A and 200C (or a first group) among the plurality of vibrating structures 200A, 200B, 200C, and 200D. For example, the first and third vibrating structures 200A and 200C may be arranged in a first row parallel to the second direction (Y) among the plurality of vibrating structures 200A, 200B, 200C, and 200D. The first-second power supply line (PL12) may be electrically connected to the first electrode portions 21b of the second and fourth vibrating structures 200B and 200D (or a second group) among the plurality of vibrating structures 200A, 200B, 200C, and 200D. For example, the second and fourth vibrating structures 200B and 200D may be arranged in a second row parallel to the second direction (Y) among the plurality of vibrating structures 200A, 200B, 200C, and 200D.

[0373] The second power supply line (PL2) may be disposed on a first surface of the second protective member 21f facing the second surfaces of the first vibration generator 20a and the second vibration generator 20b. For example, the first surface may be the bottom surface of the second protective member 21f. The second power supply line (PL2) may be electrically connected to the second electrode portion 21c of each of the plurality of vibrating structures 200A, 200B, 200C, and 200D. For example, the second power supply line (PL2) may be directly electrically connected to the second electrode portion 21c of each of the plurality of vibrating structures 200A, 200B, 200C, and 200D. In one embodiment of the present specification, the second power supply line (PL2) may be electrically connected to the second electrode portion 21c of each of the plurality of vibrating structures 200A, 200B, 200C, and 200D via an anisotropic conductive film. In another embodiment of the present specification, the second power supply line (PL2) may be electrically connected to each of the second electrode portions 21c of the plurality of vibration structures 200A, 200B, 200C, and 200D via a conductive material (or particles) contained in the second adhesive layer 21g.

[0374] The second power supply line (PL2) according to this specification may include second-1 and second-2 power supply lines (PL21, PL22) arranged along the first direction (X). For example, the second-1 power supply line (PL21) may be electrically connected to the second electrode portions 21c of the first and third vibrating structures 200A and 200C (or a first group) among the plurality of vibrating structures 200A, 200B, 200C, and 200D. For example, the first and third vibrating structures 200A and 200C may be arranged in a first row parallel to the second direction (Y) among the plurality of vibrating structures 200A, 200B, 200C, and 200D. The second-2 power supply line (PL22) may be electrically connected to the second electrode portions 21c of the second and fourth vibrating structures 200B and 200D (or a second group) among the plurality of vibrating structures 200A, 200B, 200C, and 200D. For example, the second and fourth vibrating structures 200B and 200D may be arranged in a second row parallel to the second direction (Y) among the plurality of vibrating structures 200A, 200B, 200C, and 200D.

[0375] The pad unit 27 may be disposed on each of the first vibration generator 20a and the second vibration generator 20b so as to be electrically connected to one side (or one end) of at least one of the first power supply line (PL1) and the second power supply line (PL2). The pad unit 27 according to the present specification may include a first pad electrode electrically connected to one side of the first power supply line (PL1) and a second pad electrode electrically connected to one side of the second power supply line (PL2).

[0376] The first pad electrode may be commonly connected to one side (or one end) of each of the 1-1 and 1-2 power supply lines (PL11, PL12) of the first power supply line (PL1). For example, one side (or one end) of each of the 1-1 and 1-2 power supply lines (PL11, PL12) may branch off from the first pad electrode.

[0377] The second pad electrode may be commonly connected to one side (or one end) of each of the 2-1 and 2-2 power supply lines (PL21, PL22) of the second power supply line (PL2). For example, one side (or one end) of each of the 2-1 and 2-2 power supply lines (PL21, PL22) may branch off from the second pad electrode.

[0378] According to the present specification, each of the first power supply line (PL1), the second power supply line (PL2), and the pad part 27 may be made of a transparent conductive material, a semi-transparent conductive material, or an opaque conductive material so as to be transparent, semi-transparent, or opaque.

[0379] Each of the first vibration generator 20 a and the second vibration generator 20 b according to other embodiments of the present disclosure may further include a flexible cable 29 .

[0380] The flexible cable 29 is electrically connected to the pad unit 27 arranged on each of the first vibration generator 20a and the second vibration generator 20b, and can supply a vibration drive signal provided from a vibration drive circuit to each of the first vibration generator 20a and the second vibration generator 20b. The flexible cable 29 according to one embodiment of the present specification may include a first terminal electrically connected to a first pad electrode of the pad unit 27 and a second terminal electrically connected to a second pad electrode of the pad unit 27. For example, the flexible cable 29 may be, but is not limited to, a flexible printed circuit cable or a flexible flat cable.

[0381] Therefore, in another embodiment of the present disclosure, the vibration device 5 includes multiple vibrating structures 200A, 200B, 200C, and 200D so that the first vibration generator 20a and the second vibration generator 20b are not driven independently but are realized as a single vibrating body. This allows the multiple vibrating structures 200A, 200B, 200C, and 200D to be driven as a large-area vibrating body through single-body vibration. For example, the multiple vibrating structures 200A, 200B, 200C, and 200D can be arranged (or tiled) at regular intervals (D1, D2) to form a single vibrating body. This allows the display panel to vibrate over a wide area or to vibrate over a large area itself, thereby increasing or improving the acoustic characteristics and sound pressure characteristics in the reproduction band and low-frequency band of the sound output from the display panel.

[0382] FIG. 39 is a diagram showing an apparatus according to an embodiment of the present disclosure, and FIG. 40 is a cross-sectional view taken along line VI-VI' in FIG.

[0383] Referring to Figures 39 and 40, a device according to an embodiment of the present specification may include a display panel 100 that displays an image, and a vibration device at the rear (or back) of the display panel 100 that vibrates the display panel 100.

[0384] The display panel 100 can display an image, such as an electronic image or a digital image. For example, the display panel 100 can display an image by outputting light. The display panel 100 can be any shape of display panel or a curved display panel, such as a liquid crystal display panel, an organic light-emitting display panel, a quantum dot light-emitting display panel, a micro light-emitting diode display panel, and an electrophoretic display panel. The display panel 100 can be a flexible display panel. For example, the display panel 100 can be, but is not limited to, a flexible light-emitting display panel, a flexible electrophoretic display panel, a flexible electrowetting display panel, a flexible micro light-emitting diode display panel, or a flexible quantum dot light-emitting display panel.

[0385] The display panel 100 according to the embodiment of the present specification may include a display area AA that displays an image by driving a plurality of pixels. The display panel 100 may further include, but is not limited to, a non-display area IA surrounding the display area AA.

[0386] The display panel 100 according to the embodiment of the present specification may display an image in a top emission mode, a bottom emission mode, a dual emission mode, or the like depending on the structure of a pixel array layer including an anode electrode, a cathode electrode, and a light emitting element and including a plurality of pixels. The top emission mode displays an image by emitting light generated in the pixel array layer to the front side (FD) of the base substrate, while the bottom emission mode displays an image by emitting light generated in the pixel array layer to the rear side (FD) of the base substrate.

[0387] The display panel 100 according to the embodiment of the present specification may include a pixel array section disposed on a display area of a substrate. The pixel array section may include a plurality of pixels that display images in response to signals supplied to signal lines. The signal lines may include, but are not limited to, gate lines, data lines, and pixel driving power lines.

[0388] The vibration device 200 can provide acoustic and / or haptic feedback to the user by vibrating the display panel 100 at the rear of the display panel 100. The vibration device 200 can be implemented at the rear of the display panel 100 so as to directly vibrate the display panel 100.

[0389] As one embodiment of the present specification, the vibration device 200 can vibrate the display panel 100 by vibrating in response to a vibration drive signal synchronized with an image displayed on the display panel 100. As another embodiment of the present specification, the vibration device 200 can vibrate in response to a haptic feedback signal (or tactile feedback signal) synchronized with a user's touch on a touch panel (or a touch sensor layer) disposed on or built into the display panel 100, thereby vibrating the display panel 100. Thus, the display panel 100 can vibrate in response to the vibration of the vibration device 200 to provide at least one of acoustic and haptic feedback to the user (or viewer).

[0390] The vibration device 200 according to an embodiment of the present specification may be sized to correspond to the display area (AA) of the display panel 100. The size of the vibration device 200 may be 0.9 to 1.1 times the size of the display area (AA), but is not limited thereto. For example, the size of the vibration device 200 may be the same as or smaller than the size of the display area (AA). For example, the size of the vibration device 200 may be the same as or approximately the same as the size of the display area (AA) of the display panel 100, thereby covering most of the area of the display panel 100. Since the vibration generated by the vibration device 200 can vibrate the entire display panel 100, the sense of sound localization can be enhanced, improving user satisfaction. Furthermore, since the contact area (or panel coverage) between the display panel 100 and the vibration device 200 increases, the vibration area of the display panel 100 can be increased, thereby improving the mid- and low-frequency sound generated by the vibration of the display panel 100. Furthermore, the vibration device 200 applied to a large display device can vibrate the entire large (or large-area) display panel 100, thereby achieving an acoustic effect with improved sound localization due to the vibration of the display panel 100. Therefore, the vibration device 200 according to the present specification is disposed on the rear surface of the display panel 100 and can sufficiently vibrate the display panel 100 in the up-down (or front-back) direction, thereby outputting desired sound to the front (FD) of the device or display device.

[0391] A vibration device including one vibration generator has a problem of being unable to output sufficient sound. For example, when a vibration device including one vibration generator is configured for a display device such as a TV, it is difficult to ensure sufficient sound. Therefore, when a vibration device realized by two vibration generators arranged side by side is applied to a display device, the attachment area between the display panel 100 and the vibration device becomes large. However, as the attachment area becomes larger, it is difficult to attach the vibration device to the back surface of the display panel 100 without air bubbles. For example, if the display panel 100 is a light-emitting display panel, it is difficult to attach the vibration device to the encapsulation substrate without air bubbles. Furthermore, a vibration device realized by two vibration generators arranged side by side has a problem of split vibration, in which adjacent vibration generators vibrate differently from each other, generating different vibrations. Therefore, it is difficult to output sound with improved acoustic flatness. Split vibration increases as the attachment area of the vibration device increases. A vibration device 200 according to an embodiment of the present specification may include multiple vibration generators 210 and 230 stacked on top of each other, as shown in FIGS. 45 and 46. The vibration device 200 may include at least one vibration generator that is overlapped or stacked so as to displace in the same direction. Here, the vibration generator is the same as the vibration generator 20 described in Figures 1 and 13, so a duplicated description will be omitted.

[0392] The one or more vibration devices 200 according to an embodiment of the present specification may include one or more of the vibration devices 1 to 5 described with reference to Figures 1 to 38. Therefore, a detailed description of the one or more vibration devices 200 will be omitted.

[0393] The device according to an embodiment of the present disclosure may further include a connecting member 150 disposed between the display panel 100 and the vibration device 200 (or the vibration generator 210). The connecting member 150 according to an embodiment of the present disclosure may be made of a material including an adhesive layer having excellent adhesion or bonding strength to the rear surface of the display panel 100 and the vibration device 200. For example, the connecting member 150 may include, but is not limited to, a foam pad, double-sided tape, or adhesive. For example, the adhesive layer of the connecting member 150 may include, but is not limited to, epoxy, acrylic, silicone, or urethane. For example, the adhesive layer of the connecting member 150 may be different from the adhesive layer of the adhesive member 250. For example, the adhesive layer of the connecting member 150 may include an acrylic-based material (or material) that has relatively excellent adhesion and high hardness among acrylic and urethane. Therefore, vibrations from the vibration device 200 may be efficiently transmitted to the display panel 100.

[0394] The device according to the embodiment of the present specification may further include a support member 300 disposed on the rear surface of the display panel 100 .

[0395] The support member 300 may cover the rear surface of the display panel 100. For example, the support member 300 may cover the entire rear surface of the display panel 100 with a gap space GS therebetween. For example, the support member 300 may include at least one material selected from the group consisting of glass, metal, and plastic. For example, the support member 300 may be a rear structure or a set structure. For example, the support member 300 may be expressed by other terms such as a cover bottom, plate bottom, back cover, base frame, metal frame, metal chassis, chassis base, or m-chassis. Therefore, the support member 300 may be realized as a frame or plate-like structure of any shape disposed on the rear surface of the display panel 100.

[0396] A support member 300 according to one embodiment of the present disclosure may include a first support member 310 and a second support member 330 .

[0397] The first support member 310 can cover the rear surface of the display panel 100. For example, the first support member 310 can be a plate-like member that covers the entire rear surface of the display panel 100. For example, the first support member 310 can be an inner plate that includes at least one of glass, metal, and plastic materials.

[0398] The first support member 310 may be separated from the rearmost surface of the display panel 100 or from the vibration device 200 via a gap space GS. For example, the gap space GS may be expressed as an air gap, a vibration space, an acoustic space, or the like, but is not limited to these terms.

[0399] The second support member 330 may be disposed on the rear surface of the first support member 310. The second support member 330 may be a plate-like member that covers the entire rear surface of the first support member 310. For example, the second support member 330 may include at least one of glass, metal, and plastic. For example, the second support member 330 may be an outer plate, rear plate, back plate, back cover, or rear cover, but is not limited to these terms.

[0400] The support member 300 according to an embodiment of the present disclosure may further include a coupling member 350 (or a third connecting member).

[0401] The connecting member 350 may be disposed between the first support member 310 and the second support member 330. For example, the first support member 310 and the second support member 330 may be connected or coupled to each other via the connecting member 350. For example, the connecting member 350 may be, but is not limited to, an adhesive resin, double-sided tape, or a double-sided adhesive foam pad. For example, the connecting member 350 may have elasticity for shock absorption, but is not limited to this. In one embodiment of the present disclosure, the connecting member 350 may be disposed over the entire area between the first support member 310 and the second support member 330. In another embodiment of the present disclosure, the connecting member 350 may be formed to have a mesh structure with an air gap between the first support member 310 and the second support member 330.

[0402] The device according to the embodiment of the present disclosure may further include a middle frame 400 .

[0403] The middle frame 400 may be disposed between the rear edge of the display panel 100 and the front edge of the support member 300. The middle frame 400 may support one or more edges of the display panel 100 and one or more edges of the support member 300, and may surround one or more sides of the display panel 100 and the support member 300. The middle frame 400 may provide a gap space GS between the display panel 100 and the support member 300. The middle frame 400 may be referred to as a middle cabinet, a middle cover, a middle chassis, or the like, but is not limited to these terms.

[0404] The middle frame 400 according to one embodiment of the present disclosure may include a first support portion 410 and a second support portion 430 .

[0405] The first support portion 410 is disposed between the rear edge of the display panel 100 and the front edge of the support member 300, thereby providing a gap space GS between the display panel 100 and the support member 300. The front surface of the first support portion 410 may be coupled or connected to the rear edge of the display panel 100 via a first frame connecting member 401. The rear surface of the first support portion 410 may be coupled or connected to the front edge of the support member 300 via a second frame connecting member 403. For example, the first support portion 410 may have a rectangular single frame structure or a frame structure having a plurality of divided bars.

[0406] The second support portion 430 may be vertically coupled to the outer surface of the first support portion 410, parallel to the thickness direction (Z) of the device. The second support portion 430 may surround one or more of the outer surfaces of the display panel 100 and the support member 300, thereby protecting the outer surfaces of the display panel 100 and the support member 300. The first support portion 410 may protrude from the inner surface of the second support portion 430 into the gap space GS between the display panel 100 and the support member 300.

[0407] An apparatus according to an embodiment of the present disclosure may include a panel connecting member in place of the middle frame 400 .

[0408] The panel connecting member is disposed between the rear edge of the display panel 100 and the front edge of the support member 300, thereby providing a gap space GS between the display panel 100 and the support member 300. The panel connecting member is disposed between the rear edge of the display panel 100 and the edge of the support member 300 to bond the display panel 100 to the support member 300. For example, the panel connecting member may be implemented using, but is not limited to, double-sided tape, single-sided tape, or a double-sided adhesive foam pad. For example, the adhesive layer of the panel connecting member may include, but is not limited to, epoxy, acrylic, silicone, or urethane. For example, the adhesive layer of the panel connecting member may include a urethane-based material (or material) that is relatively softer than acrylic, among acrylic and urethane. Therefore, vibrations of the display panel 100 transmitted to the support member 300 may be minimized.

[0409] In a device according to an embodiment of the present disclosure, when a panel connecting member is included instead of the middle frame 400, the support member 300 may include a bending sidewall bent from the end (end) of the second support member 350 to surround one or more of the outer surfaces (or outer walls) of the first support member 310, the panel connecting member, and the display panel 100. The bending sidewall according to an embodiment of the present disclosure may have a single sidewall structure or a hemming structure. A hemming structure may be a structure in which the end of a member is bent in a curved shape to overlap or be spaced apart from each other. For example, to improve the aesthetic appeal of the design, the bending sidewall may include a first bending sidewall bent from one side of the second support member 330 and a second bending sidewall bent from the first bending sidewall to between the first bending sidewall and the outer surface of the display panel 100. The second bending sidewall may be spaced apart from the inner surface of the first bending sidewall. Therefore, the second bending sidewall can prevent the outer surface of the display panel 100 from contacting the inner surface of the first bending sidewall or prevent external impact in the lateral direction from being transmitted to the outer surface of the display panel 100 .

[0410] 41 and 42 are diagrams showing the vibration device of the device of FIG. 40 coupled to a display panel.

[0411] 41, in an apparatus according to an embodiment of the present specification, the vibration generator 20 of the vibration device 1 described with reference to FIGS. 1 to 3C may be connected or coupled to a display panel 100. For example, the apparatus may include the display panel 100, a vibration generator 210 provided on the display panel 100 and including a vibrating structure 211, and a connecting member 150 between the display panel 100 and the vibration generator 210. The connecting member 150 may include a first connecting member 150a disposed to overlap the vibrating structure 211 and provided between the display panel 100 and the vibrating structure 211, and a second connecting member 150b disposed to surround the first connecting member 150a. The first connecting member 150a may have a greater elastic modulus than the second connecting member 150b.

[0412] A vibrating structure 211 according to an embodiment of the present specification may include a vibrating portion 210a including a piezoelectric material, a first electrode portion 211b disposed on a first surface of the vibrating portion 211a, and a second electrode portion 211c disposed on a second surface opposite to the first surface or different from the first surface of the vibrating portion 211a. A first protective member 213 may be disposed on the first electrode portion 211b and may protect the first electrode portion 211b, and a first adhesive layer 212 may be disposed between the vibrating structure 211 and the first protective member 213. A second protective member 215 may be disposed on the second electrode portion 211c and may protect the second electrode portion 211c, and a second adhesive layer 214 may be disposed between the vibrating structure 211 and the second protective member 215.

[0413] 42, in a device according to one embodiment of the present specification, the vibration generator 20 of the vibration device 2 or 3 described in FIGS. 4 to 12B may be connected or coupled to the display panel 100. For example, the device may include the display panel 100, a vibration generator 210 disposed on the display panel 100, and a connecting member 150 between the display panel 100 and the vibration generator 210, where the connecting member 150 may include a metal material. Also, according to another embodiment of the present specification, the vibration generator 210 may include a vibrating structure 211, a first electrode portion 211b provided on a first surface of the vibrating structure 211, and a second electrode portion 211c provided on a second surface opposite the first surface of the vibrating structure 211. Each of the first electrode portion 211b and the second electrode portion 211c may include silver (Ag) and glass frit.

[0414] 43 is a cross-sectional view taken along line VI-VI' in FIG. 39, and FIG. 44 is a diagram showing the vibration device of the device in FIG. 43 coupled to a display panel.

[0415] 43 and 44, in an apparatus according to an embodiment of the present specification, the vibration generator 210 of the vibration device 4 described in FIGS. 13 to 26 may be connected or coupled to the display panel 100. For example, the apparatus may include a display panel 100, a plurality of vibration generators 210 that vibrate the display panel 100, and a connecting member 150 between the display panel 100 and the vibration generators 210. The vibration generator 210 may further include a vibrating structure 211, a first electrode portion 211b on a first surface of the vibrating structure 211, and a second electrode portion 211c on a second surface of the vibrating structure 211 opposite the first surface. The apparatus may further include a first cover member 213 on the first electrode portion 211b, a second cover member 215 on the second electrode portion 211c, a signal cable 30 electrically connected to the vibrating structure 211, and a signal generating circuit 40 mounted on the signal cable 30.

[0416] 45 is a cross-sectional view taken along line VII-VII' in FIG. 39, and FIG. 46 is a diagram showing the vibration device of the device in FIG. 45 coupled to a display panel.

[0417] 45 and 46, in an apparatus according to an embodiment of the present specification, vibration generators 20a and 20b of the vibration device 5 described in FIGS. 27 to 38 may be connected or coupled to a display panel 100. For example, the apparatus may include a display panel 100 and vibration generators 210 and 230 that vibrate the display panel 100. The vibration generators 210 and 230 may include a first vibrating structure having a first piezoelectric coefficient, a second vibrating structure having a second piezoelectric coefficient different from the first piezoelectric coefficient, and a coupling unit 250 provided between the first vibrating structure and the second vibrating structure. The first vibrating structure and the second vibrating structure may be positioned opposite each other with the coupling unit 250 interposed therebetween, and may have, for example, a stacked structure. Therefore, the first vibrating structure may be positioned in the first vibration generator 210, and the second vibrating structure may be positioned in the second vibration generator 230.

[0418] FIG. 47 shows an apparatus according to another embodiment of the present disclosure, and FIG. 48 is a cross-sectional view taken along line VIII-VIII' in FIG.

[0419] 47 and 48, devices according to other embodiments of the present specification may be expressed as, but are not limited to, a display device or a display device for a vehicle. For example, devices according to embodiments of the present specification may be applied to realize an audio device, an audio output device, a sound bar, an audio system, an audio device for a vehicle, an audio output device for a vehicle, or a sound bar for a vehicle. For example, a vehicle may include one or more seats and one or more glass windows. For example, a vehicle may include a vehicle, a train, a ship, or an aircraft, and embodiments of the present specification are not limited thereto. In addition, devices according to embodiments of the present specification may realize analog signage or digital signage such as advertising billboards, posters, and information boards.

[0420] An apparatus according to other embodiments herein can include a vibrating member 110 and one or more vibration generating devices 120 .

[0421] The vibrating member 110 can be expressed by terms such as a vibrating object, an acoustic output member, a vibrating panel, or an acoustic output panel, but is not limited to these.

[0422] The vibrating member 110 according to an embodiment of the present specification may include a display panel for displaying an electronic image or a digital image. For example, the vibrating member 110 may be a display panel that displays an image by outputting light through a plurality of self-emitting pixels. Hereinafter, in the description of FIGS. 47 and 48, the vibrating member 110 will be referred to as a display panel 110 that displays an image by outputting light through pixels.

[0423] The display panel 110 according to one embodiment of the present disclosure may be any shape of display panel or a curved display panel, such as, but not limited to, an organic light-emitting display panel, a quantum dot light-emitting display panel, a micro light-emitting diode display panel, an electrophoretic display panel, or an electrowetting display panel. According to another embodiment of the present disclosure, the display panel 110 may be a transparent display panel or a flexible display panel. According to another embodiment of the present disclosure, the display panel 110 may be a touch panel-integrated display panel. For example, the touch panel-integrated display panel may include a touch panel attached on the display panel or a touch electrode layer disposed inside the display panel.

[0424] The one or more vibration generating devices 120 may be configured to vibrate the display panel 110. The one or more vibration generating devices 120 may be connected or coupled to the rear surface of the display panel 110. For example, the one or more vibration generating devices 120 may include one or more vibration generators 20 of the vibration devices 1 to 5 described with reference to FIGS. 1 to 38. Therefore, a description of the one or more vibration generating devices 120 will be omitted.

[0425] The one or more vibration generating devices 120 according to one embodiment of the present specification may include one or more vibration generators 20 of the vibration devices 1 to 5 shown in one or more of Figures 1 to 38, and the one or more vibration generators 20 of the vibration devices 1 to 5 may be connected or bonded to the rear surface of the display panel 110 after peeling off the connecting member 15 or via the connecting member 15.

[0426] According to one embodiment of the present disclosure, one or more vibration generating devices 120 may vibrate or directly vibrate the display panel 110 in response to a vibration drive signal provided from the audio processing circuit. For example, the one or more vibration generating devices 120 may vibrate or directly vibrate the display panel 110 in response to a vibration drive signal synchronized with an image displayed on the display panel 110. As another embodiment of the present disclosure, the one or more vibration generating devices 120 may vibrate or directly vibrate the display panel 110 in response to a vibration drive signal (or a haptic feedback signal) synchronized with a user's touch on a touch panel (or a touch sensor layer) connected to or built into the display panel 110. Thus, the display panel 110 may vibrate in response to the vibration of the one or more vibration generating devices 120 to provide at least one of audio and haptic feedback to the user (or viewer).

[0427] An apparatus according to other embodiments herein may further include a rear structure 130 and a panel connecting member 140. An apparatus may include one or more panel connecting members 140.

[0428] The rear structure 130 may be disposed on the rear surface of the display panel 110. For example, the rear structure 130 may cover the rear surface of the display panel 110. For example, the rear structure 130 may cover the entire rear surface of the display panel 110 with a gap space GS therebetween. For example, the rear structure 130 may be realized by a frame or plate-like structure of any shape disposed on the rear surface of the display panel 110.

[0429] The rear structure 130 according to an embodiment of the present disclosure may further cover the side surfaces of the display panel 110. For example, the rear structure 130 may include a rear cover (or rear portion) 131 that covers the rear surface of the display panel 110 across a gap space GS, and side covers (or side portions) 133 that are connected to ends of the rear cover 131 and cover the side surfaces of the display panel 110. In the rear structure 130, the rear cover 131 and the side covers 133 may be integrated into a single body, but the embodiment is not limited to this.

[0430] The panel connecting member 140 may be disposed between the display panel 110 and the rear structure 130. The panel connecting member 140 may be connected or coupled between the display panel 110 and the rear structure 130 so as to surround one or more vibration generating devices 120, thereby providing a gap space GS between the display panel 110 and the rear structure 130.

[0431] According to an embodiment of the present disclosure, when the panel connecting member 140 is disposed between the display panel 110 and the rear structure 130, the side cover 133 of the rear structure 130 can be omitted.

[0432] An apparatus according to other embodiments of the present disclosure may further include a partition 145. An apparatus may further include one or more partitions 145.

[0433] The partition 145 may be coupled or connected between the display panel 110 and the rear structure 130 to surround the one or more vibration generating devices 120. For example, the partition 145 may be coupled or connected to one or more of the display panel 110 and the rear structure 130 to surround the one or more vibration generating devices 120. For example, the partition 145 may have a circular, elliptical, or polygonal shape, but is not limited thereto.

[0434] The partition 145 according to an embodiment of the present specification can limit a vibration area generated by one or more vibration generators 120. For example, the partition 145 can be an air gap or a space in which sound is generated when each of the multiple vibration generators 120 vibrates. For example, the partition 145 can separate sounds or separate channels, and can prevent or reduce deterioration of sound characteristics due to sound interference. For example, the partition 145 can be expressed as a sound-blocking member, a sound-separating member, a space-separating member, a baffle, or the like, but is not limited to these terms.

[0435] According to another embodiment of the present specification, the device 100 according to another embodiment of the present specification may further include one or more pads. The one or more pads may be configured to protrude from one or more sides of the partition 145 toward the vibration generator 120. The one or more pads may be configured to trap reflected waves reflected by the partition 145, thereby preventing or minimizing a decrease in sound pressure characteristics due to standing waves generated by interference between the reflected waves and the traveling waves.

[0436] The vibration device according to the present specification and devices including the same can be described as follows.

[0437] A vibration device according to an embodiment of the present specification includes a vibration plate, a vibration generator on the vibration plate and including a vibration structure, and a connecting member between the vibration plate and the vibration generator, the connecting member being arranged to overlap with the vibration structure and including a first connecting member between the vibration plate and the vibration structure, and a second connecting member being arranged to surround the first connecting member, and the first connecting member may have a greater elastic modulus than the second connecting member.

[0438] According to some embodiments herein, the coupling member may include a metallic material.

[0439] According to some embodiments of the present specification, the vibrating structure may further include a first electrode portion on a first surface of the vibrating structure and a second electrode portion on a second surface of the vibrating structure opposite the first surface, and each of the first electrode portion and the second electrode portion may include silver (Ag) and glass frit.

[0440] According to some embodiments herein, the vibration device may further include a signal cable electrically coupled to the vibrating structure and a signal generating circuit mounted on the signal cable.

[0441] According to some embodiments of the present specification, the vibration generator may further include a first cover member covering the first electrode portion and a second cover member covering the second electrode portion, and the signal cable may include a first conductive line disposed between the first cover member and the first electrode portion and electrically connected to the first electrode portion, and a second conductive line disposed between the second cover member and the second electrode portion and electrically connected to the second electrode portion.

[0442] According to some embodiments of the present disclosure, the first cover member and the second cover member are or can be connected to one side of the diaphragm by a connecting member.

[0443] According to some embodiments of the present specification, the vibrating structure may further include a first vibrating structure having a first piezoelectric coefficient, a second vibrating structure having a second piezoelectric coefficient different from the first piezoelectric coefficient, and a coupling portion between the first vibrating structure and the second vibrating structure.

[0444] According to some embodiments of the present specification, the vibrating structure may further include a first vibrating structure having a first piezoelectric coefficient, a second vibrating structure having a second piezoelectric coefficient different from the first piezoelectric coefficient, and a coupling portion between the first vibrating structure and the second vibrating structure.

[0445] According to some embodiments of the present specification, a vibration generator includes a vibrating structure, a first electrode portion provided on a first surface of the vibrating structure, and a second electrode portion on a second surface of the vibrating structure opposite the first surface, and each of the first electrode portion and the second electrode portion may include silver (Ag) and glass frit.

[0446] According to some embodiments of the present disclosure, the vibration generator may further include a vibration portion located between the first electrode portion and the second electrode portion.

[0447] According to some embodiments herein, the device may further include a signal cable electrically coupled to the vibrating structure, and a signal generating circuit mounted on the signal cable.

[0448] According to some embodiments of the present specification, the vibrating structure further includes a first electrode portion on a first surface of the vibrating structure, a second electrode portion on a second surface opposite the first surface of the vibrating structure, a first cover member covering the first electrode portion, and a second cover member covering the second electrode portion, and the signal cable may include a first conductive line arranged between the first cover member and the first electrode portion and electrically connected to the first electrode portion, and a second conductive line arranged between the second cover member and the second electrode portion and electrically connected to the second electrode portion.

[0449] According to some embodiments of the present specification, the vibrating structure may further include a first vibrating structure having a first piezoelectric coefficient, a second vibrating structure having a second piezoelectric coefficient different from the first piezoelectric coefficient, and a coupling portion between the first vibrating structure and the second vibrating structure.

[0450] According to some embodiments of the present specification, the vibrating structure may further include a first vibrating structure having a first piezoelectric coefficient, a second vibrating structure having a second piezoelectric coefficient different from the first piezoelectric coefficient, and a coupling portion between the first vibrating structure and the second vibrating structure.

[0451] A vibration device according to an embodiment of the present specification includes a vibration plate, a vibration generator disposed on the vibration plate, and a connecting member between the vibration plate and the vibration generator, and the connecting member may include a metal material.

[0452] According to some embodiments of the present specification, the vibration generator may further include a first adhesive layer between the vibrating structure and the first cover member, and a second adhesive layer between the vibrating structure and the second cover member.

[0453] According to some embodiments of the present specification, a vibration generator includes a vibrating structure, a first electrode portion on a first surface of the vibrating structure, and a second electrode portion on a second surface of the vibrating structure opposite the first surface, and each of the first electrode portion and the second electrode portion may include silver (Ag) and glass frit.

[0454] According to some embodiments herein, the device may further include a signal cable electrically coupled to the vibrating structure, and a signal generating circuit mounted on the signal cable.

[0455] According to some embodiments of the present specification, the vibrating structure may further include a first cover member covering the first electrode portion and a second cover member covering the second electrode portion, and the signal cable may include a first conductive line disposed between the first cover member and the first electrode portion and electrically connected to the first electrode portion, and a second conductive line disposed between the second cover member and the second electrode portion and electrically connected to the second electrode portion.

[0456] According to some embodiments of the present specification, the vibrating structure may further include a first vibrating structure having a first piezoelectric coefficient, a second vibrating structure having a second piezoelectric coefficient different from the first piezoelectric coefficient, and a coupling portion between the first vibrating structure and the second vibrating structure.

[0457] According to some embodiments of the present specification, the vibrating structure may further include a first vibrating structure having a first piezoelectric coefficient, a second vibrating structure having a second piezoelectric coefficient different from the first piezoelectric coefficient, and a coupling portion between the first vibrating structure and the second vibrating structure.

[0458] According to some embodiments herein, the device may further include a signal cable electrically coupled to the vibration generator and a signal generating circuit mounted on the signal cable.

[0459] According to some embodiments of the present specification, a vibration generator includes a vibrating structure, the vibrating structure further including a first electrode portion on a first surface of the vibrating structure, a second electrode portion on a second surface opposite the first surface of the vibrating structure, a first cover member covering the first electrode portion, and a second cover member covering the second electrode portion, and the signal cable includes a first conductive line arranged between the first cover member and the first electrode portion and electrically connected to the first electrode portion, and a second conductive line arranged between the second cover member and the second electrode portion and electrically connected to the second electrode portion.

[0460] According to some embodiments of the present specification, the vibrating structure may further include a first vibrating structure having a first piezoelectric coefficient, a second vibrating structure having a second piezoelectric coefficient different from the first piezoelectric coefficient, and a coupling portion between the first vibrating structure and the second vibrating structure.

[0461] A vibration device according to an embodiment of the present specification includes a vibration plate, a vibration generator that vibrates the vibration plate, and a connecting member between the vibration plate and the vibration generator, and the vibration generator includes a vibration structure, a first electrode portion on a first surface of the vibration structure, and a second electrode portion on a second surface of the vibration structure opposite the first surface, and each of the first electrode portion and the second electrode portion includes silver (Ag) and glass frit.

[0462] According to some embodiments herein, the device may further include a signal cable electrically coupled to the vibrating structure, and a signal generating circuit mounted on the signal cable.

[0463] According to some embodiments of the present specification, the vibrating structure may further include a first cover member covering the first electrode portion and a second cover member covering the second electrode portion, and the signal cable may include a first conductive line disposed between the first cover member and the first electrode portion and electrically connected to the first electrode portion, and a second conductive line disposed between the second cover member and the second electrode portion and electrically connected to the second electrode portion.

[0464] According to some embodiments of the present specification, the vibrating structure may further include a first vibrating structure having a first piezoelectric coefficient, a second vibrating structure having a second piezoelectric coefficient different from the first piezoelectric coefficient, and a coupling portion between the first vibrating structure and the second vibrating structure.

[0465] According to some embodiments of the present specification, the vibrating structure may further include a first vibrating structure having a first piezoelectric coefficient, a second vibrating structure having a second piezoelectric coefficient different from the first piezoelectric coefficient, and a coupling portion between the first vibrating structure and the second vibrating structure.

[0466] According to some embodiments of the present specification, the area occupied by silver (Ag) in each of the first electrode portion and the second electrode portion may be 70 to 90%.

[0467] According to some embodiments of the present specification, the thickness of each of the first electrode portion and the second electrode portion may be 1 to 3 μm.

[0468] According to some embodiments of the present specification, the weight ratio of silver (Ag) may be 80-90, and the weight ratio of glass frit may be 10-20 in each of the first electrode part and the second electrode part.

[0469] A vibration device according to an embodiment of the present specification includes a vibration plate, a vibration generator that vibrates the vibration plate, and a connecting member between the vibration plate and the vibration generator, and the vibration generator further includes a vibration structure, a first electrode portion on a first surface of the vibration structure, a second electrode portion on a second surface of the vibration structure opposite the first surface, a signal cable electrically connected to the vibration structure, and a signal generating circuit mounted on the signal cable.

[0470] According to some embodiments of the present specification, the vibration generator may further include a first cover member covering the first electrode portion and a second cover member covering the second electrode portion, and the signal cable may include a first conductive line disposed between the first cover member and the first electrode portion and electrically connected to the first electrode portion, and a second conductive line disposed between the second cover member and the second electrode portion and electrically connected to the second electrode portion.

[0471] According to some embodiments of the present specification, the vibrating structure may further include a first vibrating structure having a first piezoelectric coefficient, a second vibrating structure having a second piezoelectric coefficient different from the first piezoelectric coefficient, and a coupling portion between the first vibrating structure and the second vibrating structure.

[0472] A vibration device according to an embodiment of the present specification includes a vibration plate, a vibration generator on the vibration plate, and a connecting member between the vibration plate and the vibration generator, and the vibration generator includes a first vibration structure having a first piezoelectric coefficient, a second vibration structure having a second piezoelectric coefficient different from the first piezoelectric coefficient, and a coupling portion between the first vibration structure and the second vibration structure.

[0473] According to some embodiments herein, the first piezoelectric coefficient can be greater than the second piezoelectric coefficient.

[0474] An apparatus according to embodiments herein includes a vibration member and one or more vibration generators coupled to the vibration member, the one or more vibration generators including the vibration devices described above.

[0475] According to some embodiments of the present specification, the vibrating member outputs sound by vibration of one or more vibration generating devices, and the vibrating member may include one or more materials of metal, non-metal, plastic, fiber, leather, wood, fabric, paper, and glass.

[0476] According to some embodiments of the present specification, the vibrating member may be any one of a display panel having pixels for displaying an image, a screen panel onto which an image is projected from a display device, a lighting panel, a signage panel, an interior material of a vehicle, an exterior material of a vehicle, a glass window of a vehicle, an interior ceiling of a building, and a glass window of a building.

[0477] The present specification described above is not limited to the above-mentioned embodiments and the accompanying drawings, and it will be apparent to those skilled in the art to which the present specification pertains that various substitutions, modifications, and alterations are possible within the scope of the technical idea of the present specification. Therefore, the scope of the present specification is determined by the claims set forth below, and all modifications and alterations derived from the meaning and scope of the claims and their equivalent concepts should be construed as being included in the scope of the present specification. [Explanation of symbols]

[0478] 1, 2, 3, 4, 5 Vibration device 10 diaphragm 15 Connecting member 20, 20a, 20b Vibration Generator 21 Vibrating structures 30 signal cable 40 Signal generation circuit 100 Display Panel 200 Vibration device 300 Support member 400 middle frame

Claims

1. A diaphragm and a vibration generator located on the diaphragm and including a vibrating structure; a connecting member between the vibration plate and the vibration generator; The connecting member is a first connecting member disposed so as to overlap the vibrating structure and located between the diaphragm and the vibrating structure; a second connecting member disposed so as to surround the first connecting member, the first connecting member has a greater modulus of elasticity than the second connecting member; The vibrating structure is a vibration layer including a piezoelectric material; a first electrode portion on a first surface of the vibration layer; a second electrode portion on a second surface of the vibration layer opposite to the first surface, Each of the first electrode portion and the second electrode portion includes silver (Ag) and glass frit. the first connecting member is disposed so as to overlap with the vibration layer, The second connecting member is arranged so as not to overlap with the vibration layer.

2. a signal cable electrically connected to the vibrating structure; The vibration device of claim 1 , further comprising a signal generating circuit mounted on the signal cable.

3. The vibration generator includes: a first cover member that covers the first electrode portion; a second cover member that covers the second electrode portion, The signal cable a first conductive line disposed between the first cover member and the first electrode portion and electrically connected to the first electrode portion; The vibration device according to claim 2 , further comprising: a second conductive line disposed between the second cover member and the second electrode portion and electrically connected to the second electrode portion.

4. The vibration device according to claim 3 , wherein the first cover member and the second cover member are connected to one surface of the vibration plate by the connecting member.

5. The vibrating structure is a first vibrating structure having a first piezoelectric coefficient; a second vibrating structure having a second piezoelectric coefficient different from the first piezoelectric coefficient; a coupling portion between the first vibrating structure and the second vibrating structure, The vibration device according to claim 2 , wherein the first vibration structure and the second vibration structure face each other across the connecting portion.

6. The vibrating structure is a first vibrating structure having a first piezoelectric coefficient; a second vibrating structure having a second piezoelectric coefficient different from the first piezoelectric coefficient; a coupling portion between the first vibrating structure and the second vibrating structure, The vibration device according to claim 1 , wherein the first vibration structure and the second vibration structure face each other across the connecting portion.

7. a signal cable electrically connected to the vibrating structure; The vibration device of claim 1 , further comprising a signal generating circuit mounted on the signal cable.

8. The vibration generator includes: a first cover member that covers the first electrode portion; a second cover member that covers the second electrode portion, The signal cable a first conductive line disposed between the first cover member and the first electrode portion and electrically connected to the first electrode portion; The vibration device according to claim 7 , further comprising: a second conductive line disposed between the second cover member and the second electrode portion and electrically connected to the second electrode portion.

9. The vibrating structure is a first vibrating structure having a first piezoelectric coefficient; a second vibrating structure having a second piezoelectric coefficient different from the first piezoelectric coefficient; a coupling portion between the first vibrating structure and the second vibrating structure, The vibration device according to claim 8 , wherein the first vibration structure and the second vibration structure face each other across the connecting portion.

10. The vibrating structure is a first vibrating structure having a first piezoelectric coefficient; a second vibrating structure having a second piezoelectric coefficient smaller than the first piezoelectric coefficient; a coupling portion between the first vibrating structure and the second vibrating structure, The vibration device according to claim 1 , wherein the first vibration structure and the second vibration structure face each other across the connecting portion.

11. the vibration generator further includes an adhesive layer disposed around the vibrating structure; The adhesive layer is a first adhesive layer between the vibrating structure and the first cover member; a second adhesive layer between the vibration structure and the second cover member; the signal cable further includes a body portion; each of the first conductive line and the second conductive line protruding from one side surface of the body; 10. The vibration device of claim 9, wherein a side edge of the body portion, including the one side surface of the body portion, and the first and second conductive lines are housed between the first cover member and the second cover member.

12. a vibrating member; one or more vibration generating devices coupled to the vibration member; The one or more vibration generating devices include a vibration device according to any one of claims 1 to 11.

13. the vibration member outputs sound by vibration of the one or more vibration generating devices; 13. The device of claim 12, wherein the vibrating member comprises one or more of the following materials: metal, non-metal, plastic, fiber, leather, wood, fabric, paper, and glass.

14. The device of claim 12, wherein the vibrating member is any one of a display panel having pixels for displaying an image, a screen panel onto which an image is projected from a display device, a lighting panel, a signage panel, an interior material of a vehicle, an exterior material of a vehicle, a glass window of a vehicle, an interior ceiling of a building, and a glass window of a building.

Images