Air knife, debris removal system and method

Abstract

To solve such a problem that, in a technique related to a system for removing debris from a substrate in an optical processor, ablation needs to be performed on a contact on the substrate.SOLUTION: A system for removing debris from a target area of a substrate having a specific topography includes first and second gas blowing devices disposed at an angle to each other at a fixed position to move debris in a target area by blowing gas along the surface of the target area of the substrate. The first and second gas blowing devices blow gas in first and second gas flow directions, respectively. The system further includes a suction device disposed at a fixed position with respect to the first and second gas blowing devices to collect the moved debris. A control circuit activates at least one of the first gas blowing device and the second gas blowing device according to the position of the debris with respect to the specific topography in the target area of the substrate.SELECTED DRAWING: Figure 2C

Description

[Technical Field]

[0001] The present invention relates to a system for removing debris from a target area of a substrate in an optical processing device, and more particularly to a system for removing debris by blowing compressed air or other suitable gas using at least two gas blowing devices, such as air knives. [Background technology]

[0002] Optical processing equipment is used during the manufacturing of electronic components such as printed circuit boards (PCBs) to, for example, ensure that all necessary connections are properly made and that there are no shorts on the PCB. Some such optical processing systems properly repair shorted circuits on PCBs by cutting away copper or other conductors that are unintentionally positioned between two other conductors, causing a short between them. An example of such a system is disclosed in commonly owned U.S. Patent Application Publication No. 2012 / 0123299, entitled "Automatic Repair Apparatus for Electrical Circuits," the contents of which are incorporated herein by reference. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] U.S. Patent No. 8,290,239 Summary of the Invention [Problem to be solved by the invention]

[0004] In systems that cut shorted circuit contacts, some of the cut material often solidifies in the air and falls back onto the substrate as debris, which is unaesthetic and can create new or additional short circuits.

[0005] Therefore, the art of systems for removing debris from substrates in optical processing equipment requires subsequent ablation of contacts on the substrate. [Means for solving the problem]

[0006] According to one aspect of the present invention, there is provided a debris removal system in an optical processing system for removing debris from a target area of a substrate having a particular topography, the system comprising: a first gas spraying device and a second gas spraying device that spray gas in a first gas flow direction and a second gas flow direction, respectively, and that are disposed at fixed positions and at angles to each other, and that spray gas along the surface of the target area of the substrate to move debris in the target area; a suction device that is disposed at a fixed position relative to the first gas spraying device and the second gas spraying device and moves to collect debris; and a control circuit configured to operate either or both of the first gas spray device and the second gas spray device depending on the location of the debris relative to the particular topography in the target area of the substrate.

[0007] In an embodiment, the first gas flow direction and the second gas flow direction are perpendicular to each other.

[0008] In an embodiment, at least one of the first gas blowing device and the second gas blowing device has an air knife. Similarly, in an embodiment, the longitudinal length of the air knife is within a range of 5 mm to 10 mm, or within a range of 7 mm to 8 mm. In an embodiment, the width of the air knife is within a range of 12 mm to 17 mm, or within a range of 15 mm to 16 mm. In an embodiment, the air flow rate of the air knife is set within a range of 160 to 180 liters per minute.

[0009] In an embodiment, at least one of the first gas spraying device and the second gas spraying device is controlled by a solenoid, and the control circuit operates the first gas spraying device or the second gas spraying device by controlling the operation of the solenoid.

[0010] In an embodiment, the suction device is positioned at an angle to the first gas flow direction and the second gas flow direction, and collects debris moved by either or both of the first gas spray device and the second gas spray device.

[0011] In an embodiment, the suction device includes a vacuum generator and a suction port, the suction port being functionally associated with the vacuum generator and positioned near the first gas spray device and the second gas spray device.

[0012] In an embodiment, the first gas-blowing device, the second gas-blowing device, and at least a part of the suction device are mounted on an optical head of the optical processing system.

[0013] In an embodiment, the debris removal system is movable relative to the substrate.

[0014] In an embodiment, the debris comprises copper particles resulting from laser ablation of copper depositing on the substrate.

[0015] According to another embodiment of the present invention, there is provided an optical processing system comprising: a chassis on which the substrate is disposed; an optical head having an ablation subsystem configured to remove excess material from the substrate when ablation creates debris in a target area on the substrate; and a debris removal system as described above configured to remove the debris from the target area of the substrate.

[0016] In an embodiment, at least part of the debris removal system is mounted on the optical head, and the optical head and chassis are movable relative to one another to direct the debris removal system to remove the debris from the target area of the substrate.

[0017] According to yet another embodiment of the present invention, there is provided an air knife comprising: a housing having a first end, a second end and a base surface; a hollow chamber disposed within the housing, the hollow chamber having at least an extension aligned along the axis and having a chamber width; a slot having a slot width between the first end and the second end; a tapered hollow portion communicating the hollow chamber with the slot; The slots are arranged at an acute angle to the axis of the extension.

[0018] In an embodiment, pressurized gas injected into the hollow chamber flows from the hollow chamber into the tapered hollow portion and through the slot on the exterior of the housing.

[0019] In an embodiment, the slot width is in the range of 0.1 mm to 0.3 mm.

[0020] In embodiments, the length of the housing is between 5 mm and 10 mm, or between 7 mm and In embodiments, the width of the housing is in the range of 12 mm to 17 mm, or 15 mm to 16 mm.

[0021] In an embodiment, the airflow rate through the slot is set to 160 to 180 liters per minute.

[0022] In an embodiment, the acute angle is in the range of 8 to 12 degrees.

[0023] In an embodiment, the ratio of the cavity width to the slot width is in the range of 20:1 to 15:1.

[0024] In an embodiment, the air knife is operatively associated with a compressed gas source that provides a gas flow within the hollow portion, and is also operatively associated with a solenoid that controls the operation of the air knife.

[0025] In embodiments, the base surface contour is curved to be continuous with the acute angle of the slot and substantially parallel to the axis. In embodiments, the contour is continuously curved to form a second acute angle between the contour and the axis. In embodiments, the second acute angle is in the range of 8 degrees to 12 degrees. In embodiments, the contour is configured such that airflow exiting the slot follows the contour and exits an air knife adjacent the base surface.

[0026] Additionally, embodiments of the present invention provide a debris removal system in an optical processing system for removing debris from a target area of a substrate having a particular topography, the debris removal system comprising: the first and second air knives, which blow air in a first air flow direction and a second air flow direction, respectively, and which are disposed at fixed positions and at an angle to each other, and which blow air along the surface of the target area of the substrate to move debris in the target area; a suction device disposed in a fixed position relative to the first air knife and the second air knife to collect displaced debris; and a control circuit configured to activate either or both of the first air knife and the second air knife depending on the location of the debris relative to the particular topography in the target area of the substrate.

[0027] In the embodiment, the first airflow direction and the second airflow direction are perpendicular to each other.

[0028] In an embodiment, the suction device is positioned at an angle to the first air flow direction and the second air flow direction and is configured to collect debris displaced by either or both of the first air knife and the second air knife.

[0029] In an embodiment, the suction device comprises a vacuum generator and a suction port operatively associated with the vacuum generator and positioned adjacent the first air knife and the second air knife.

[0030] In an embodiment, the first air knife, the second air knife and at least a portion of the suction device are mounted on an optical head of the optical processing system.

[0031] Another embodiment of the present invention provides a method for removing debris from a target area of a substrate having a particular topography using the debris removal system described above, comprising the steps of: aligning the target area of the substrate with the debris removal system; selecting, by the control circuit, either one or both of the first gas spray device and the second gas spray device to operate to remove debris based on the location of the debris relative to the particular topography; activating selected gas blowing devices from one or both of the first gas blowing device and the second gas blowing device to move debris in the target area; The suction device is activated to collect debris moved by a selected one or both of the first gas spray device and the second gas spray device.

[0032] In an embodiment, the operating time of the suction device at least partially overlaps with the operating time of a selected gas blowing device from one or both of the first gas blowing device and the second gas blowing device.

[0033] Yet another embodiment of the present invention provides a method for removing debris from a target area of a substrate having a particular topography using the debris removal system described above, comprising the steps of: aligning the target area of the substrate with the debris removal system; the control circuit selecting either one or both of the first air knife and the second air knife to operate to remove debris based on the location of the debris relative to the particular topography; activating selected air knives, one or both of the first air knife and the second air knife, to move debris in the target area; The suction device is activated to collect debris displaced by selected one or both of the first and second air knives.

[0034] In an embodiment, the operation time of the suction device at least partially overlaps with the operation time of selected one or both of the first air knife and the second air knife.

[0035] Yet another embodiment of the present invention provides a debris removal system in an optical processing system for removing debris from a target area of a substrate having a specific topography, comprising: at least two gas spraying devices that spray gas in at least two different directions, each disposed at a fixed position and angled relative to one another, and that spray gas along the surface of the target area of the substrate to move debris in the target area; a suction device disposed at a fixed position relative to the at least two gas spraying devices and configured to collect the displaced debris; and a control circuit configured to activate one or both of the at least two gas spray devices depending on the location of debris relative to the particular topography in the target area of the substrate.

[0036] In an embodiment, at least one of the at least two gas spraying devices comprises an air knife.

[0037] In this embodiment, all of the gas spraying devices are rotatable together with the suction devices.

[0038] In addition, in this embodiment, all of the gas spraying devices and the suction devices are mounted on a single chassis, and are therefore rotatable as a unit. [Brief explanation of the drawings]

[0039] The present invention will now be described, by way of example only, with reference to the accompanying drawings. With particular reference to the drawings in detail, it is emphasized that the items shown in the figures are shown by way of example only and for purposes of illustrating preferred embodiments of the invention. Furthermore, the items shown are provided as being most useful and readily apparent to those skilled in the art. In this regard, the structure of the invention has not been shown in detail, in favor of what is necessary for a fundamental understanding of the invention. It will be apparent to those skilled in the art that several forms of the invention can be implemented when understood in conjunction with the drawings. Like reference numerals are used throughout the figures to denote like elements. [Figure 1] 1 is a schematic perspective view of an optical processing system having a debris removal system according to an embodiment of the present invention; [Figure 2A] 2 is a schematic side view of an optical head in a state in which the debris removal system according to the embodiment of the present invention is mounted on the optical processing system shown in FIG. 1. FIG. [Figure 2B] 2B is a schematic side view of a debris removal system according to an embodiment of the present invention mounted on the optical head shown in FIG. 2A. [Figure 2C] 2B is a schematic bottom view of a debris removal system according to an embodiment of the present invention mounted on the optical head shown in FIG. 2A. FIG. [Figure 3A]3 is a perspective view of an air knife according to an embodiment of the present invention suitable for use in the debris removal system shown in FIG. 2; [Figure 3B] 3 is a side view of an air knife according to an embodiment of the present invention suitable for use in the debris removal system shown in FIG. 2; [Figure 4] FIG. 3C is an explanatory diagram showing the direction of air flow by the air knife shown in FIGS. 3A and 3B. [Figure 5A] FIG. 3 is a diagram illustrating the control of the air knife used in the debris removal system shown in FIG. 2. [Figure 5B] FIG. 3 is a diagram illustrating the control of the air knife used in the debris removal system shown in FIG. 2. [Figure 6] 3 is a flow chart illustrating a method for removing debris from a target area on a substrate according to an embodiment of the present invention, using the debris removal system shown in FIG. 2 as an example. DETAILED DESCRIPTION OF THE INVENTION

[0040] The present invention relates to a system for removing debris from a target area of a substrate in an optical processing system, and more particularly to a system that uses at least two gas blowing devices, such as air knives, to blow compressed air to remove debris.

[0041] The term "topography of a substrate surface" as used in the context of this application and the claims relates to a mapping of heights and height differences to specific locations on a target substrate, or a height profile of locations on the substrate.

[0042] As used in the context of this application and the claims, the terms "air" and "gas" may be used interchangeably and include atmospheric air or other suitable gases, such as oxygen, carbon dioxide, helium, hydrogen, nitrogen, or suitable mixtures thereof.

[0043] As used in the context of this application and the claims, the terms "substantially" and "approximately" refer to a deviation from a specified value of at most 10%, at most 8%, at most 5%, at most 3%, or at most 1%.

[0044] FIG. 1 shows a schematic perspective view of an optical processing system. The present invention includes a debris removal system according to an embodiment of the present invention.

[0045] As can be seen in FIG. 1 , the optical processing system 100 includes an optical head 102 mounted on a chassis 104. The optical processing system 100 preferably operates to perform optical deposition and / or ablation, substantially as described in Japanese Utility Model Registration No. 3210312, registered April 19, 2017, for an invention entitled "Optical Head and Chassis for Optical Processing System," which is incorporated herein by reference as if set forth in its entirety. Preferably, the chassis 104 includes a rear upstanding support member 106 to which the optical head 102 is mounted. The chassis 104 also includes a front table 108, which includes a vacuum plate 109 configured to position a target for deposition. Such targets typically take the form of a printed circuit board (PCB). However, it will be appreciated that system 100 can perform deposition and / or ablation on a variety of suitable targets.

[0046] The operation of optical system 100 will now be described. Optical head 102 preferably operates to form an image of a target mounted on table 108 in order to determine whether additional material deposition onto or excess material ablation from the target is required.

[0047] If deposition is determined to be necessary, the optical head 102 is preferably operable to perform the deposition process from the consumable donor element onto the target by laser deposition of material (e.g., laser-induced forward transfer (LIFT)), as described in Japanese Patent Application Publication No. 2015-144252, published August 6, 2015, and U.S. Patent Application Publication No. 2016 / 0233089, published August 11, 2016, both of which are incorporated by reference herein as if set forth in their entireties.

[0048] If ablation is determined to be necessary, optical head 102 is preferably operable to perform the ablation process by laser ablation as described in the aforementioned US Pat. No. 8,290,239.

[0049] According to an embodiment of the present invention, the optical head 102 is equipped with a debris removal system 110 that is operatively associated with a vacuum generator 112. Both the debris removal system 110 and the vacuum generator 112 are described in further detail below. The debris removal system 110 and the vacuum generator 112 are configured to remove debris resulting from the ablation process from the target surface, as will be described.

[0050] Reference is additionally made to Figure 2A, which is a schematic side view of the optical head 102 of the optical processing system 100. The optical processing system 100 is equipped with a system 110 for removing debris according to an embodiment of the present invention. Figures 2B and 2C are schematic side and bottom views, respectively, of the debris removal system 110 according to an embodiment of the present invention equipped with the optical head 102.

[0051] As can be seen in Figure 2A, optical head 102 preferably includes an illumination structure 202 that illuminates a target placed on vacuum table 108. Illumination structure 202 preferably provides illumination from multiple directions, and more preferably provides illumination from at least three directions. As an example, illumination structure 202 is shown here as an array 204 of light-emitting diodes (LEDs). However, illumination structure 202 may be any structure that can provide illumination from multiple directions. Light emitted from the target passes through a lens and reaches a camera. The lighting structure 202 may be movable relative to the camera using a Z-axis motor 212 connected to the lighting structure 202 to provide a vertical movement force.

[0052] Camera 208 may acquire images of the target to assess the accuracy of the deposition and / or ablation and determine the need for further deposition and / or ablation.

[0053] Details of the structure and operation of the optical head 102, particularly during operation of the optical system to deposit conductive material onto contacts of a target PCB and ablate excess conductive material from the target PCB, are described in Japanese Utility Model Registration No. 3210312, issued April 19, 2017. The optical head described herein is implemented by the applicant in the AOS product family, which is available in detail at https: / / www.orbotech.com / products / innovative-aos-solutions and includes, for example, the Precise® 800 and Perfix 200. Both products are commercially available from Orbotech Limited, Yavne 8110101, Sanhedrin, Israel.

[0054] Briefly, when excess material on a target is to be removed, laser 240 performs laser ablation on the excess material on the target. During this ablation process, laser output is emitted from laser 240, and the laser output is irradiated directly onto the target surface via optical elements including a scanning mirror. The spot size of the laser beam on the target during ablation is approximately in the range of 2 to 8 μm. The spot size of the laser output may be repeatedly adjusted during operation of laser 240. This adjustment can be performed, for example, by using a beam expander. A more detailed explanation of this point is provided in the aforementioned Japanese Utility Model Registration No. 3210312.

[0055] A control circuit 270 is preferably provided, for example, on first and second control boards to control the operation of the optical head 102. The control circuit may be mounted on a support case 276 that protrudes from a rear portion 278 of the optical head 102.

[0056] The optical head 102 further includes a movable stage 224 that is movable relative to the chassis 104 and the vacuum table 108. Details of this movable stage are described in detail in the aforementioned Japanese Utility Model Registration No. 3210312.

[0057] As can be seen from Figures 2B and 2C, in some embodiments, the debris removal system 110 is disposed in a hollow space formed by the optical arrangement 202 and is movable together with the optical arrangement 202 and the laser 240. The debris removal system 110 includes two (or more) gas blowing devices 290a, 290b. In some embodiments, the gas blowing device 290 comprises an air knife, for example, as described below with reference to Figures 3A to 4. The air knife is configured to blow a stream of compressed air that forms a thin profile. Air is blown from each air knife in an air blowing direction.

[0058] Although the embodiment described herein illustrates two such air knives, any suitable number of air knives (e.g., three) is contemplated as being within the scope of the present invention.

[0059] In this embodiment, the air knives 290a and 290b are disposed at fixed positions. 2C, in some embodiments, each air knife is fixed in place by a conduit 291. The conduit 291 is in communication with a compressed gas source (not shown), which provides compressed gas to the air knife via the conduit 291. Each of the air knives 290a, 290b injects compressed gas or compressed air in a first direction and a second direction that are angled relative to one another. The air knives are constructed and arranged to direct a stream of air along the surface of a target area on a substrate located below the optical head to displace debris in the target area.

[0060] In the context of this application, debris is considered to be in the target area if it is on the surface of the target area, or if it is in the air directly above the target area, for example, in the air between the illumination structure 202 and the target area of the substrate.

[0061] In one embodiment, the air knife may be activated during the ablation of excess conductive material to remove debris before it settles on the target surface. In other embodiments, the air knife may be activated to remove debris already on the target surface, for example, from a previous ablation process. In one embodiment, air knives 290a, 290b are positioned perpendicular to each other, such that the first and second spray directions are perpendicular to each other.

[0062] Suction device 292 is provided, for example, in association with vacuum generator 112, and is disposed in a fixed position relative to air knives 290a, 290b. The suction device includes a suction tube 294 that extends to an end 296 adjacent to first and second gas spray devices. Suction tube 294 is in fluid communication with vacuum generator 112 (FIG. 1A) and is configured to collect and remove particles, such as loose debris, from the suction area adjacent end 296.

[0063] In one embodiment, the tube 294 and end 296 of the suction device 292 are angled relative to the direction of gas flow from the air knives 290a and 290b.

[0064] In one embodiment, the air knives 290a, 290b are configured to rotate relative to the suction device 292 so as to simultaneously change the angle between the suction device 292 and the two air knives 290a, 290b.

[0065] In yet another embodiment, air knives 290a, 290b and suction device 292 are mounted on the same base so that they rotate together and maintain a constant angular relationship to one another.

[0066] Air knives 290a, 290b and suction device 292 are operatively associated with control circuitry 270. Control circuitry 270 is configured to activate either air knife 290a, air knife 290b, or both, depending on the location of the debris relative to the particular topography within the target area on the substrate, as will be explained below with reference to Figures 5A and 5B. In other words, control circuitry 270 determines which air knife to activate based on the location of the debris relative to the location of the conductors on the target substrate (PCB) and the "walls," i.e., airflow barriers, formed by the conductors.

[0067] In one embodiment, at least one of air knives 290a and 290b is operatively associated with a solenoid (not shown) configured to control gas flow through the air knife, and control circuit 270 controls operation of the solenoid to activate one or both air knives.

[0068] Figures 3A and 3B are perspective and cross-sectional views, respectively, of an air knife 300 according to an embodiment of the present invention, adapted for use as air knife 290a and / or air knife 290b in system 110 shown in Figure 2. Figure 4 is a schematic diagram illustrating the direction of air flow through air knife 300 shown in Figures 3A and 3B. The following description will be made with reference to these figures.

[0069] 3A and 3B, air knife 300 includes a housing 302 having a first end 304, a second end 306, and a base 308. In the illustrated embodiment, second end 306 forms part of a flap 310 that overlaps the wall of first end 304. Typically, housing 300 is made of metal.

[0070] The housing 300 may be of any suitable size, including width W and length L, as shown in Figure 3A. In some embodiments, the housing length L is in the range of 5 mm to 10 mm, in some embodiments, 7 mm to 9 mm, and in other embodiments, 8 mm. In some embodiments, the housing width W is in the range of 12 mm to 17 mm, and in some embodiments, 15 mm.

[0071] Housing 300 defines a hollow chamber 311, which is shown to include a cylindrical portion 312 and an extension portion 314. Hollow chamber 311 and each of its portions has a cross-sectional width, and in the illustrated embodiment, the cross-sectional width of cylindrical portion 312 is designated Wc, and the cross-sectional width of extension portion 314 is designated We.

[0072] A slot 316 is formed between the flap 310 at the second end 306 and the first end 304, and the slot has a slot width Ws. In some embodiments, the slot width Ws is in the range of 0.1 mm to 0.3 mm, and in other embodiments, the slot width Ws is 0.2 mm. In some embodiments, the ratio of the extension width We to the slot width Ws is in the range of 20:1 to 15:1, and in other embodiments, it is 16:1.

[0073] As can be seen in Figure 3B, the extension 314 of the hollow chamber 311 is formed with a sloped surface 318 to provide a tapered hollow portion 320. The tapered hollow portion 320 connects the hollow chamber 311, and more particularly the second portion 314 of the hollow chamber 311, with the slot 316.

[0074] A notable feature of the present invention is that the slot 316 is disposed at an acute angle relative to the axis 315 of the hollow chamber extension 314. In Figure 3B, this angle is designated α. In some embodiments, the acute angle α is in the range of 8 to 12 degrees, and in other embodiments, the acute angle α is 10 degrees.

[0075] Another notable feature of the present invention is that the bottom surface 308 is curved. The contour of the curved surface is continuous with the angle of the slot 316 relative to the axis 315 and is substantially parallel to the axis 315. In one embodiment, the curved surface is further curved, as indicated by angle β. The curvature of this curved surface is designed to direct the airflow toward the target area, as described in more detail below. In one embodiment, angle β is between 8 and 12 degrees, and in another embodiment, angle β is 10 degrees.

[0076] As shown in FIG. 4, in use, compressed or pressurized gas or air is supplied to a compressed or pressurized source (not shown) operatively associated with air knife 300. Air flows out of the housing 302 and is directed into hollow chamber 311, and from hollow chamber 311 through extension 314, tapered hollow section 320, and slot 316 to the exterior of housing 302. In one embodiment, a solenoid (not shown) is operatively associated with the compressed or pressurized source and / or air knife to control the operation of the air knife and the air flow through the air knife.

[0077] Due to the Coanda effect, as clearly shown in Figure 3B, air exiting slots 316 flows along the curved surface of base portion 308 and exits out the underside of base portion 308. Configured to operate in this manner, the orientation of base portion 308 determines the direction of air flow from air knife 300.

[0078] As configured above, when air knife 300 is positioned adjacent to the top of a target substrate, airflow exiting slots 316 along bottom portion 308 continues along the surface of the substrate, removing debris from the surface of the substrate as described herein.

[0079] In one embodiment, the airflow rate from slot 316 is in the range of 160 to 180 liters per minute, and in another embodiment, is approximately 170 liters per minute.

[0080] In one embodiment, the air knife or the pressurized air source that provides pressurized gas or air to the air knife is provided with a pressure adjusting member (not shown) to adjust the pressure according to the required air flow.

[0081] 5A and 5B are schematic diagrams illustrating the control of the air knives 290a, 290b of the debris removal system 110 shown in FIGS. 2A and 2B when removing debris from a substrate having a particular topology.

[0082] As can be seen, the target substrate is a portion of a PCB having multiple copper conductors with debris between them. As is known in the art, copper conductors on a PCB may be elevated above the surface of the PCB and therefore may act as a wall or barrier to the passage of airflow from the air knife of the debris removal system.

[0083] As such, a control circuit (270; FIG. 2A) activates different ones of the air knives 290a, 290b (shown schematically as rectangles containing pattern lines) depending on the topology of the PCB surface, and in particular the position and orientation of the contacts deposited on the PCB surface.

[0084] 5A, PCB area 500 has multiple contacts 502 arranged in one direction, i.e., vertically in the plane of the drawing. In this arrangement, air flow from air knife 290a is blocked by contacts 502. The control circuit activates only air knife 290b to remove debris 504 between contacts 502.

[0085] 5B, PCB region 510 has a plurality of contacts 512 arranged in a second direction, generally perpendicular to the first direction and oriented horizontally in the plane of the drawing. In this arrangement, air flow from air knife 290b is blocked by contacts 512. The control circuit activates only air knife 290a to remove debris 514 between contacts 512.

[0086] 6 is a flow chart illustrating a method of processing a substrate, including a method for removing debris from a target area of a substrate according to an embodiment of the present invention, using, for example, the debris removal system shown in FIG.

[0087] 6, a target area of a substrate is selected in step 600. The selected area is imaged in step 602, and the resulting image is analyzed in step 604 to determine whether the target area of the substrate has any errors in the layout of conductors that require correction, such as deposition of additional material or ablation of excess conductive material.

[0088] If contact ablation is determined necessary in step 606, the locations to be corrected and the locations where debris deposition is expected are identified in step 608. In particular, the topography of the target area and the placement of the contact thereon are identified. In step 610, the control circuit (270; FIG. 2) selects which or both gas spray devices (290a, 290b) to use in the correction process based on the identified locations to be corrected and the topography of the target area to prevent debris deposition and remove debris. In step 612, the control circuit activates the selected gas spray device while the suction device (292; FIG. 2B) is operating. In step 614, the necessary corrections are made while the gas spray devices are operating.

[0089] In one optical embodiment, following any necessary corrective actions, a new image of the target area is captured in step 616, and the image analyzed in step 604 is re-analyzed, if necessary, to determine that no further corrective actions are required.

[0090] If no corrective action is required in step 606, then step 600 may select another target area on the substrate, analyze another substrate, or end the process.

[0091] Certain features of the invention that are described for clarity as being present in multiple embodiments may also be present in a single embodiment in any combination of those features. Conversely, certain features that are described for brevity in the context of a single embodiment may also be present in multiple embodiments individually or in any subcombination, as appropriate.

[0092] While the present invention has been described with reference to specific embodiments, it will be apparent to those skilled in the art that numerous alternatives, modifications, and variations of the embodiments are possible. All such alternatives, modifications, and variations are within the spirit and scope of the present invention, and therefore, the claims should be broadly interpreted and within their scope. All literature, patents, and patent application publications mentioned in this specification, including Japanese Utility Model Registration No. 3210312, U.S. Patent No. 8,290,239, Japanese Patent Application Laid-Open No. 2015-144252, and U.S. Patent Application Publication No. 2016 / 0233089, are incorporated herein by reference in their entirety to the same extent as if fully set forth herein. Furthermore, the references and their identification herein are not to be construed as enabling them to be used as prior art against the present invention.

Claims

1. a housing having a first end, a second end and a base surface; a hollow chamber disposed within the housing, the hollow chamber having at least an extension aligned along the axis and having a chamber width; a slot having a slot width between the first end and the second end; a tapered hollow portion communicating the hollow chamber with the slot; The air knife of claim 1, wherein the slots are arranged at an acute angle to the axis of the extension.

2. 2. The air knife of claim 1, wherein pressurized gas injected into said hollow chamber flows from said hollow chamber into said tapered hollow portion and passes through said slot.

3. 3. An air knife according to claim 1, wherein the slot width is in the range of 0.1 mm to 0.3 mm.

4. 4. An air knife according to claim 1, wherein the length of the housing in a direction perpendicular to the axis of the extension and parallel to the axis of the hollow chamber is in the range of 5 mm to 10 mm, or 7 mm to 8 mm.

5. 5. An air knife according to claim 1, wherein the width of the housing in a direction parallel to the axis of the extension is in the range of 12 mm to 17 mm, or 15 mm to 16 mm.

6. 6. An air knife according to claim 1, wherein the air flow rate at the slot is between 160 and 180 liters per minute.

7. 7. An air knife according to claim 1, wherein the acute angle is in the range of 8 to 12 degrees.

8. 8. An air knife according to claim 1, wherein the ratio of the width of the tapered hollow to the width of the slot is in the range of 20:1 to 15:

1.

9. 9. An air knife as defined in any one of claims 1 to 8, operatively associated with a compressed gas source that provides gas flow within the tapered hollow and also operatively associated with a solenoid that controls operation of the air knife.

10. 10. An air knife according to claim 1, wherein the base surface is contiguous with the acute angled portion of the slot and curved to be substantially parallel to the axis.

11. 11. The air knife of claim 10, wherein said base surface continuously further curves to form a second acute angle between said base surface and said axis.

12. 12. The air knife of claim 11, wherein the second acute angle is in the range of 8 to 12 degrees.

13. 13. The air knife according to claim 10, wherein the base surface is configured so that the air flow flowing out of the slot flows out along a curved surface of the base surface.

14. 1. A debris removal system in an optical processing system for removing debris from a target area of a substrate having a specific topography, comprising: a first air knife and a second air knife, each configured as the air knife of any one of claims 1 to 13, that blow air in a first air flow direction and a second air flow direction, respectively, and that are disposed at fixed positions and at an angle to each other, and that blow air along the surface of the target area of the substrate to move debris in the target area; a suction device disposed in a fixed position relative to the first air knife and the second air knife to collect displaced debris; and a control circuit configured to activate either or both of the first air knife and the second air knife depending on the location of the debris relative to the particular topography in the target area of the substrate.

15. The debris removal system of claim 14, wherein the first airflow direction and the second airflow direction are perpendicular to each other.

16. 16. The debris removal system of claim 14 or 15, wherein the suction device is positioned at an angle to the first air flow direction and the second air flow direction and is configured to collect debris displaced by either or both of the first air knife and the second air knife.

17. 17. The debris removal system of any one of claims 14 to 16, wherein the suction device comprises a vacuum generator and a suction port, the suction port being operatively associated with the vacuum generator and positioned adjacent the first air knife and the second air knife.

18. 18. The debris removal system of claim 14, wherein the first air knife, the second air knife and at least part of the suction device are mounted on an optical head of the optical processing system.

19. 19. A method of removing debris from a target area of a substrate having a specific topography using a debris removal system according to any one of claims 14 to 18, comprising the steps of: aligning the target area of the substrate with the debris removal system; the control circuit selecting which of the first air knife and / or the second air knife to activate to remove debris based on the location of the debris relative to the particular topography; activating selected ones of the first air knife and the second air knife to move debris in the target area; and activating the suction device to collect debris displaced by selected one or both of the first air knife and the second air knife.

20. 20. The method of claim 19, wherein an operating time of the suction device at least partially overlaps with an operating time of selected one or both of the first air knife and the second air knife.

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