Additive manufacturing methods and systems for detecting and extracting impurities and producing compositions

Abstract

To solve the problem in which: currently, operators use microscopes to check additive powder samples for foreign object debris (FOD) or contaminants, a manual process is time consuming, an amount of FOD tends to be underestimated and, when UV light is used for FOD detection, operator's safety is threatened.SOLUTION: An additive manufacturing system for extracting impurity in additive manufacturing material includes an additive manufacturing equipment for producing component using additive manufacturing material. The system may further include a conductive plate adjacent to the additive manufacturing material. The system may further include an energy source to distribute a charge through the conductive plate adjacent to the additive manufacturing material. The distribution of charge through the conductive plate can attract the impurities from the additive manufacturing material to the conductive plate.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates generally to methods and systems for detecting and extracting impurities in additively manufactured materials, and more particularly to utilizing conductive plates to attract and extract impurities from additively manufactured samples. Additionally, the present disclosure relates generally to methods and systems for manufacturing compositions in additively manufactured material samples. [Background technology]

[0002] The quality of the powder used in additive manufacturing (AM) processes can affect the quality of the parts built from the powder. Particle size factors influence the flowability and thickness of each powder layer in the build box. For high-performance applications, it can be important to identify additional factors, such as the type, number, and size of particulate contaminants that may be present in the powder. Contaminants can be introduced during powder production, handling, or during the build process itself. Contaminants contained within a powder batch can be introduced into the part as they are incorporated into the powder, either as individual particles or as unfused interfaces that act as stress concentrations.

[0003] The presence of contaminants can increase the likelihood of fatigue cracks and reduce the life of the component. Summary of the Invention [Problem to be solved by the invention]

[0004] Currently, human operators use microscopes to check additive manufacturing powder samples for foreign object debris (FOD) or contaminants. The human operator uses their judgment to determine the quantitative total number of FOD in the powder sample. This manual process is time-consuming, tedious, and prone to underestimating the amount of FOD in additive manufacturing powder samples. Furthermore, the use of ultraviolet light to detect FOD poses a risk to the safety of the human operator. [Means for solving the problem]

[0005] In one example, an additive manufacturing system for extracting impurities includes an additive manufacturing apparatus for manufacturing a part using additively manufactured material, a conductive plate adjacent to the additively manufactured material, and an energy source for distributing an electric charge through the conductive plate adjacent to the additively manufactured material, wherein distributing the electric charge through the conductive plate attracts the impurities from the additively manufactured material to the conductive plate.

[0006] In another example, a method of extracting impurities in an additively manufactured material, the method comprising generating an electric charge through a conductive plate adjacent to the additively manufactured material, and attracting the impurities from the additively manufactured material to the conductive plate while generating the electric charge through the conductive plate.

[0007] In yet another example, a method of manufacturing a composition with additively manufactured material includes spreading a layer of additively manufactured material with a roller, the layer of additively manufactured material including elongated fibers. The method also includes generating an electric field across the layer of additively manufactured material and aligning the elongated fibers within the layer while generating the electric field across the layer of additively manufactured material. The method further includes solidifying the layer of additively manufactured material and the aligned elongated fibers with an energy source.

[0008] In yet another example, an additive manufacturing system includes an additive manufacturing apparatus for manufacturing a part using additively manufactured material and a roller for spreading a layer of additively manufactured material. The layer of additively manufactured material includes elongated fibers. The additive manufacturing apparatus also includes an electric field generator for generating an electric field across the layer of additively manufactured material to align the elongated fibers in the layer. The system further includes an energy source for solidifying the additively manufactured material and the layer of aligned elongated fibers.

[0009] The described features, functions, and advantages can be achieved independently in various examples or may be combined in still other examples. Further details of the examples can be found by reference to the following description and drawings.

[0010] The novel features believed characteristic of the illustrative embodiments are set forth in the appended claims. However, the illustrative embodiments, together with their preferred modes of use, further objects and explanations, will best be understood by reference to the following detailed description of illustrative embodiments of the present disclosure when read in conjunction with the accompanying drawings. [Brief explanation of the drawings]

[0011] [Figure 1] 1 illustrates a system for detecting impurities in additive manufacturing materials, according to an illustrative embodiment. [Figure 2] 1 illustrates a plate and a mirror according to an exemplary embodiment. [Figure 3] 1 illustrates a conductive plate according to an exemplary embodiment. [Figure 4] 1 illustrates a waveguide on a conductive plate, according to an exemplary embodiment. [Figure 5] 1 illustrates a flowchart of an example method for detecting and extracting impurities in additive manufacturing materials, according to an illustrative embodiment. [Figure 6] 1 illustrates a system for manufacturing a composition with additive manufacturing materials, according to an exemplary embodiment. [Figure 7] 1 illustrates a flowchart of an example method for manufacturing a composition in additive manufacturing, according to an illustrative embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0012] Disclosed embodiments will now be described in more detail below with reference to the accompanying drawings, in which some, but not all, of the disclosed embodiments are shown. Indeed, several different embodiments may be described, and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0013] A. Detection and Extraction of Impurities in Additive Manufacturing Materials Within the scope of the examples, a method is described for the detection and extraction of impurities in additively manufactured materials, including generating an electric charge via a conductive plate adjacent to the additively manufactured material and attracting the impurities from the additively manufactured material to the conductive plate.

[0014] The methods described herein can be used to enable automated extraction and detection of contaminants, such as impurities, and / or foreign debris in additively manufactured materials via electrostatic techniques. A conductive plate is utilized to electrostatically attract and extract the impurities from a sample of additively manufactured material.

[0015] The exemplary methods and systems described herein can eliminate the need for a human operator to check additive manufacturing powder for contaminants or foreign debris and allow for more accurate identification and quantification of foreign debris. The amount of foreign debris in an additive manufacturing material sample affects the quality and mechanical properties (e.g., fatigue life and tensile strength) of the finished additive manufacturing part. Therefore, determining the amount of contaminants can be useful in determining whether to replace the additive manufacturing material.

[0016] An exemplary method for detecting impurities in an additively manufactured material can be used, for example, in an additive manufacturing system. The exemplary additive manufacturing system can include an additive manufacturing apparatus for manufacturing a part using the additively manufactured material and a conductive plate adjacent to the additively manufactured material. The exemplary system further includes an energy source for distributing an electric charge through the conductive plate adjacent to the additively manufactured material. Distributing the electric charge through the conductive plate attracts impurities from the additively manufactured material to the conductive plate.

[0017] Referring now to the drawings, Figure 1 illustrates a system 100 for extracting and detecting impurities in additively manufactured materials, according to an illustrative embodiment. The system 100 includes an additive manufacturing apparatus 102 for manufacturing a part using an additively manufactured material 104 and a conductive plate 106 adjacent to the additively manufactured material 104. The system 100 further includes an energy source 110 for distributing an electric charge through the conductive plate 106 adjacent to the additively manufactured material 104. Distributing the electric charge through the conductive plate 106 attracts impurities 112 from a top layer 116 of the additively manufactured material 104 to the conductive plate 106.

[0018] The additive manufacturing material 104 may be contained within the container 126 and may include many types of materials, such as, for example, polymers (e.g., polycarbonate, nylon, epoxy resin), ceramics (silica or glass), and metals (steel, titanium alloys, aluminum alloys, etc.). The additive manufacturing material 104 may be in many forms, such as a powder, a liquid, or a combination.

[0019] The conductive plate 106 may be transparent or translucent. In some examples, the conductive plate 106 may include a conductive glass or polymer plate, such as indium tin oxide, or a conductive polymer, such as poly(3,4-ethylenedioxythiophene)-tetramethacrylate (PEDOT-TMA), poly(3,4-ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS), or poly(3,4-ethylenedioxythiophene) (PEDOT). The conductive plate 106 is coupled to the energy source 110 such that the energy source 110 can distribute an electric charge across the conductive plate 106. The impurities 112 may be, for example, fibers light enough to be attracted to the static electricity generated by the energy source 110 and distributed across the conductive plate 106, lifting them from the additive manufacturing material 104 to the conductive plate 106. The additive manufacturing material 104 may not be attracted to the electrostatic charge and may remain in the container 126.

[0020] The conductive plate 106 may be mounted above a reservoir 126 of the additively manufactured material 104. Further, the additively manufactured material 104 may include a top layer 116 of the additively manufactured material 104, such that, for example, the conductive plate 106 attracts the impurities 112 on the top layer 116. For example, upon exposure to the conductive plate 106, the impurities 112 are lifted from the reservoir 126 to the conductive plate 106.

[0021] Within the scope of example, the system 100 may further include a light source 118 for illuminating the conductive plate 106 and a camera 122 for capturing image data of the conductive plate 106 and / or the impurities. The light source 118 and the camera 122 may be mounted to illuminate the conductive plate 106 and acquire image data, and thus the light source 118 and the camera 122 may be mounted above the container of additive manufacturing material 104. Furthermore, in some examples, the camera 122 may be coupled to a computing device 124 having one or more processors configured to execute instructions stored in a memory 130 for processing image data to determine the amount of impurities on the conductive plate 106. Furthermore, as data from a large number of samples over time can be accumulated in the memory 130, machine learning can be used to improve identification of FOD.

[0022] In some examples, the light source 118 and the camera 122 are communicatively coupled to the computing device 124. For example, the light source 118 and the camera 122 may be in wired or wireless communication with the computing device 124. The computing device 124 can send instructions to the light source 118 and the camera 122 to control their operation, and the light source 118 and the camera 122 can provide output to the computing device 124.

[0023] The light source 118 may generate a collimated light beam 120. A collimated light beam 120 has parallel or substantially parallel rays, thereby minimizing divergence as it propagates.

[0024] In instances where impurities 112 are present on the conductive plate 106, the impurities 112 on the conductive plate 106 reflect a portion of the light from the light source 118 rather than transmitting through the transparent or translucent conductive plate 106. In other words, the conductive plate 106 may be configured to reflect scattered light where the impurities 112 are present, while allowing the remaining direct light from the light source 118 to pass through the conductive plate 106. This allows the impurities 112 to be detected and identified.

[0025] The camera 122 may be a high-resolution camera for capturing an image. In one example, the camera 122 captures (or collects or acquires) image data including pixels or voxels. The camera 122 (or the computing device 124) may then generate or create an image based on the captured image data. For example, a representation of the impurity 112 on the conductive plate 106 is included in the image.

[0026] Computing device 124 receives image data from camera 122 and processes the image data to determine the amount of impurities 112 on conductive plate 106. To perform the functions described above, computing device 124 includes a processor 128 and memory 130. Computing device 124 may also include hardware to enable communication within computing device 124 and between computing device 124 and other devices (not shown). The hardware may include, for example, transmitters, receivers, and antennas.

[0027] Memory 130 may take the form of a non-transitory computer-readable medium, e.g., one or more computer-readable storage media that can be read or accessed by one or more processors 128. The computer-readable storage medium may include volatile and / or non-volatile storage components, such as optical, magnetic, organic, or other memory or disk storage, which may be integrated in whole or in part with one or more processors 128. Thus, memory 130 may be considered a non-transitory computer-readable medium. In some examples, memory 130 may be implemented using a single physical device (e.g., one optical, magnetic, organic, or other memory or disk storage unit), while in other examples, memory 130 may be implemented using two or more physical devices. Thus, memory 130 is a computer-readable medium on which instructions are stored. The instructions include computer-executable code.

[0028] The one or more processors 128 may be general-purpose processors or special-purpose processors (e.g., digital signal processors, application-specific integrated circuits, etc.). The one or more processors 128 may be configured to execute executable instructions (e.g., computer-readable program instructions) stored in memory 130 and to provide the functionality of computing device 124 described herein.

[0029] The computing device 124 and / or the processor 128 may output data indicative of the amount of impurities 112 on the conductive plate 106. Moreover, this data may further include information regarding the size, shape, or location of the impurities 112 on the conductive plate 106. As described above, this information may be determined based on the amount of light scattered or reflected from the light source 118.

[0030] Within the scope of the example, in operation, when the instructions are executed by one or more processors 128 of the computing device 124, the one or more processors 128 perform the function of receiving image data from the camera 122 and processing the image data to determine the amount of impurities on the conductive plate 106.

[0031] Referring now to FIG. 2 , a conductive plate 106 including a plate 212 and a mirror 214 is shown, according to an exemplary embodiment. In some examples, the mirror 214 is thin enough to allow light to pass through (e.g., semi-transparent). The mirror 214 may also be semi-transparent or reflective on one side and transparent on the other side (e.g., a one-way mirror). The plate 212 may be semi-transparent or transparent to allow light from the light source 118 to pass through. The plate 212 and / or mirror 214 are conductive, and the charge generated by the energy source 110 distributes throughout the plate 212 and / or mirror, attracting impurities 112 from the additive manufacturing material 104. In some examples, the conductive plate 106 may simply include the mirror 214.

[0032] If no impurities are present on the conductive plate 106, a portion 204 of the collimated light beam 120 that illuminates the conductive plate 106 passes through the plate and mirror 214, and a portion 206 of the light beam 120 may be reflected. In contrast, when the collimated light beam 120 is illuminated at a location where an impurity 112 is present, a scattered light site 208 is generated. The scattered light site 208 can be detected by the camera 122 and identified by the computing device 124 (shown in FIG. 1 ). The computing device 124 can identify information regarding the size, shape, or location of the impurity 112 on the conductive plate 106, as described above.

[0033] 3, a conductive plate 106 including waveguides is shown in accordance with an exemplary embodiment. Within the scope of the example, the conductive plate 106 may include a first set of waveguides 302 and a second set of waveguides 304 on a surface of the conductive plate 106. The first set of waveguides 302 and the second set of waveguides 304 may intersect at an intersection region 314.

[0034] Within the scope of the example, the conductive plate 106 may include a first optical emitter 306 at a first end of the first set of waveguides 302 and a first optical receiver 312 at a second end of the first set of waveguides 302. The first optical emitter 306 may emit light through the first set of waveguides 302. The first optical receiver 312 may measure light received from the first optical emitter 306 that has passed through the first set of waveguides 302.

[0035] Additionally, the conductive plate 106 may include a second optical emitter 308 at a first end of the second set of waveguides 304 and a second optical receiver 310 at a second end of the second set of waveguides 304. The second optical emitter 308 may emit light through the second set of waveguides 304. The second optical receiver 310 may measure light received from the second optical emitter 308 that has passed through the second set of waveguides 304.

[0036] The first optical emitter 306, the first optical receiver 312, the second optical emitter 308, and / or the second optical receiver 310 may be coupled to a computing device (such as the computing device 124 shown in FIG. 1 ) having one or more processors (such as the computing device 124 shown in FIG. 1 ) configured to execute instructions stored in a processing memory (such as the memory 130 shown in FIG. 1 ). Further, in some examples, the first optical emitter 306 and the second optical emitter 308 and the first optical receiver 312 and the second optical receiver 310 are communicatively coupled to the computing device 124. For example, the first optical emitter 306 and the second optical emitter 308 and the first optical receiver 312 and the second optical receiver 310 may communicate with the computing device 124 via wired or wireless communication. The computing device 124 can send instructions to and control the operation of the first and second optical emitters 306, 308 and the first and second optical receivers 312, 310, and the first and second optical emitters 306, 308 and the first and second optical receivers 312, 310 can provide output to the computing device 124.

[0037] The one or more processors 128 can determine information and data about the impurities 112, such as their size, shape, or location on the conductive plate 106, based on the light received by the first optical receiver 312 and / or the second optical receiver 310. For example, the longer the length of the impurity 112, the more waveguides the impurity 112 will interfere with, affecting the light detected by, for example, the first optical receiver 312. Furthermore, the intersection region 314 allows the detected interference to be compared to determine the location and size of the impurity 112. For example, the computing device 124 may reconstruct a grid of intersection regions 314 using data on the light detected by each of the first optical receiver 312 and the second optical receiver 310.

[0038] In some examples utilizing a waveguide for locating and identifying impurities, the additive manufacturing system may not include the light source 118 and / or the camera 122, as the first and second light emitters 306, 308 and the first and second light receivers 312, 310 may be able to determine information about the impurities 112 without the light source 118 and / or the camera 122.

[0039] Referring now to Figure 4, a cross-sectional view of a waveguide is shown in accordance with an exemplary embodiment. The waveguide shown in Figure 4 represents either or both of a first set of waveguides 302 and / or a second set of waveguides 304. As shown in Figure 4, the first and / or second sets of waveguides 302, 304 may include a waveguide 402 within a substrate such as glass. Within the scope of the example, the waveguide 402 may be fused silica.

[0040] FIG. 5 illustrates a flowchart of an example method 500 for extraction and detection of impurities in additive manufacturing materials, according to an illustrative embodiment. The method 500 illustrated in FIG. 5 illustrates an example method that can be used, for example, with the system 100 illustrated in FIG. 1 and the conductive plate 106 illustrated in FIGS. 2 and 3 . Furthermore, a device or system may be used or configured to perform the logical functions illustrated in FIG. 5 . In some cases, device and / or system components may be configured to perform a function such that the components are actually configured and structured (using hardware and / or software) to enable such performance. In other examples, device and / or system components may be adapted to perform a function, capable of performing a function, or configured to be suitable for performing a function, such as when operating in a particular manner. The method 500 may include one or more operations, functions, or actions, as illustrated by one or more of blocks 502-504. While the blocks are illustrated in sequential order, these blocks may also be performed in parallel and / or in an order different from that described herein. Additionally, various blocks may be combined into fewer blocks, divided into additional blocks, and / or eliminated based on the desired implementation.

[0041] For this and other processes and methods disclosed herein, it should be understood that the flowchart illustrates the functionality and operation of one possible embodiment of this example. In this regard, each block or portion of each block may represent a module, segment, or portion of program code, including one or more instructions executable by a processor to implement specific logical functions or steps within the process. The program code may be stored in any type of computer-readable medium or data storage device, such as a storage device including a disk or hard drive. Furthermore, the program code may be encoded on a computer-readable storage medium in a machine-readable format, or other non-transitory medium or product. The computer-readable medium may include non-transitory computer-readable media or memory, such as, for example, register memory, processor cache, and computer-readable media that store short-term data, such as random access memory (RAM). The computer-readable medium may also include non-transitory media, such as, for example, secondary or permanent long-term storage, such as read-only memory (ROM), optical or magnetic disks, compact disc read-only memory (CD-ROM), etc. The computer-readable medium may also be any other volatile or non-volatile storage system. The computer readable medium can be considered, for example, a tangible computer readable storage medium.

[0042] Additionally, each block, or portion of each block, in Figure 5 may represent circuitry hardwired to perform specific logical functions within processes and methods disclosed herein. The scope of the embodiments of the present disclosure includes alternative embodiments that may perform functions in an order different from that shown or discussed, including substantially simultaneously or in reverse order, depending on the functionality involved, as will be understood by those skilled in the art.

[0043] The method 500 includes, at block 502, generating an electric charge via a conductive plate adjacent to the additive manufacturing material.

[0044] The method 500 includes, at block 504, attracting impurities from the additive manufacturing material to the conductive plate while generating an electric charge through the conductive plate.

[0045] In another example, the method 500 can further include determining an amount of impurities on the conductive plate. The determining the amount of impurities can further include illuminating the conductive plate with light by a light source, acquiring image data of the conductive plate with a camera, and processing the image data to determine the amount of impurities on the conductive plate.

[0046] In further examples, detecting the amount of impurities on the conductive plate may include detecting the number of scattered light sites. In these examples, distributing the charge through the conductive plate may include distributing the charge through a glass plate and a mirror coupled to the glass plate. The mirror can reflect the scattered light sites where the impurities are present.

[0047] In another example, the method 500 may further include: an optical emitter adjacent to a first end of the waveguide emitting light along the waveguide on the conductive plate; an optical receiver measuring the light received at a second end of the waveguide; and determining with a processor at least one of a size, shape, or location of the impurity on the conductive plate based on the light emitted by the optical emitter compared to the light received by the optical receiver.

[0048] Additionally, the light emitter can be a first light emitter, the waveguides can be a first set of waveguides, and the light receiver can be a first light receiver. Method 500 can further include a second light emitter emitting light along a second set of waveguides on the conductive plate, the second light emitter adjacent to first ends of the second set of waveguides, and the second set of waveguides intersecting the first set of waveguides. Method 500 can further include measuring light received at the second ends of the waveguides with a second light receiver, and determining, by a processor, at least one of a size, shape, or location of the impurity based on the light emitted by the second light emitter compared to the light received by the second light receiver.

[0049] Additionally, manufacturers employing powder-based additive manufacturing can utilize the example methods and systems described herein to define a stable and reproducible process used to extract and detect impurities from additively manufactured materials.

[0050] B. Manufacturing Compositions with Additive Manufacturing Materials Within the scope of the examples, a method for producing a composition of additively manufactured material includes spreading a layer of additively manufactured material with a roller, the layer including elongated fibers. The example method further includes generating an electric field across the layer of additively manufactured material to align the elongated fibers within the layer. The example method can further include solidifying the layer of additively manufactured material and aligned elongated fibers with an energy source.

[0051] Additive manufacturing machines generally operate by building multiple layers of material layer by layer to produce parts. In additive manufacturing, liquid or powdered materials are applied to a work area, followed by a combination of sintering, curing, melting, and / or cutting to form layers. This process is repeated up to thousands of times to build the desired finished part or device. Depending on the type of manufacturing used, additive manufacturing machines may include components such as print heads or printer nozzles, control mechanisms (e.g., computing devices), and molds. Additive manufacturing includes a variety of processes applied in industry, including direct metal deposition, electron beam melting, fused filament fabrication (FFF), fused deposition modeling (FDM), polymer processes such as solid-state grinding (SGC), and thin film manufacturing (LOM), as well as selective laser sintering (SLS) or selective laser melting (SLM). Additive manufacturing machines may include components specific to any of these processes, or in some instances, they may include hybrid machine tools for combining additive manufacturing with subtractive machining. Additionally, additive manufacturing devices may include laser metal powder beds where a laser melts metal powder in layers of material (e.g., direct metal laser sintering, selective laser melting).

[0052] Parts produced using additive manufacturing are constructed by adding material layer by layer onto a build platform, a process that produces properties similar to those of castings.

[0053] The exemplary methods and systems described herein allow for the alignment of fibers within a layer of additively manufactured material, which may then provide enhanced isotropic or anisotropic structural, electronic, and / or thermal properties in the additively manufactured material and the resulting manufactured part or device.

[0054] The exemplary method for producing a composition of additively manufactured material can be used, for example, in an additive manufacturing system. The exemplary additive manufacturing system can include an additive manufacturing device for producing a part using the additively manufactured material and a roller for spreading a layer of additively manufactured material, the additively manufactured material comprising elongated fibers. The exemplary system further includes an electric field generator for generating an electric field across the layer of additively manufactured material to align the elongated fibers in the layer, and an energy source for solidifying the layer of additively manufactured material and the aligned elongated fibers.

[0055] Referring now to Figure 6, an additive manufacturing system for producing an additively manufactured material composition is shown. The system 600 includes an additive manufacturing apparatus 640 for producing a part using the additively manufactured material, and a roller 606 for spreading a layer 624 of additively manufactured material, the layer 624 of additively manufactured material including elongated fibers 604. The system 600 further includes electric field generators 612, 614 for generating an electric field 610 across the layer 624 of additively manufactured material to align the elongated fibers 604 within the layer 624. The system 600 also includes an energy source 622 for solidifying the layer 624 of additively manufactured material and the aligned elongated fibers 604.

[0056] The elongated fibers 604 can be added to the additive manufacturing material powder 608 in the bin 630. Within the scope of example, the elongated fibers 604 may include silicon fibers, zinc oxide fibers, polyethylene fibers, or carbon fibers. In some exemplary embodiments, the elongated fibers 604 may be all material (e.g., silicon fibers). In alternative examples, the elongated fibers 604 may include a combination of materials (e.g., silicon fibers and carbon fibers). Furthermore, in some examples, the elongated fibers 604 may include wires, microwires, nanowires, fibers, microfibers, or nanofibers.

[0057] In practice, roller 606 may collect the top surface 602 of additive manufacturing material powder 608 and elongated fibers 604 and spread it within bin 626 to align and solidify the layers of additive manufacturing material powder 608 and elongated fibers 604. This process may be repeated, for example, as bin floor 632 rises upward and roller 606 moves from bin 630 to bin 626 to create article 638. Article 638 may include multiple layers of solidified powder and elongated fibers 604.

[0058] Within the scope of the example, the electric field generators 612, 614 can be, for example, Van de Graaff generators, among other examples. The electric field generators 612, 614 can be mounted above the bin 626. Within the scope of the example, the electric field 610 aligns the elongated fibers 604 in the direction of the electric field 610. This results in alignment of the elongated fibers 604 within the layer 624 of additively manufactured material. The alignment of the elongated fibers 604 within the layer 624 can produce a composition having anisotropic mechanical, thermal, and / or optical properties. For example, the layer 624 of additively manufactured material may conduct heat in some directions but not in other directions. Furthermore, within the scope of the example, the electric field generators 612, 614 can be mounted such that they can rotate around the bin 626, thereby generating an electric field in all directions.

[0059] Within the scope of the examples, the energy source 622 can emit a beam 618, which can be, for example, a laser beam or an electron beam. In either example, the energy source 622 is configured to solidify the additive manufacturing material and the layer 624 of aligned elongated fibers 604. It is desirable to solidify the elongated fibers 604 to retain the alignment created by the electric field 610 and the desired properties of the resulting material (e.g., conducting heat in some directions but not others).

[0060] This process may be repeated multiple times for multiple layers. The floor 636 of the bin 626 may be lowered to spread more layers of additively manufactured material powder 608. In these examples, the second layer of additively manufactured material (e.g., second layer 628) includes a second set of elongated fibers 604. The electric field generators 612, 614 are configured to generate a second electric field across the second layer of additively manufactured material 628 to align the second set of elongated fibers 604 in the direction of the electric field 610, as described above. The energy source 622 is then configured to solidify the second layer of additively manufactured material 628 and the second set of elongated fibers.

[0061] Furthermore, within the scope of the example, the alignment of the elongated fibers 604 within each layer may vary. For example, the electric field generator may align the elongated fibers 604 within layer 624, which for purposes of illustration can be considered a first layer, in a first direction based on the direction of the electric field 610. The electric field generators 612, 614 may rotate to align the elongated fibers 604 of the second layer 628 in a second direction different from the first direction. Thus, the elongated fibers 604 are aligned in different directions in each layer (e.g., the electric field generators 612, 614 may rotate gradually as new layers of additive manufacturing material powder spread, align, and solidify), resulting in a twisted, chiral, spiral, or helical structure. Alternatively, the orientation of the elongated fibers 604 may be aligned within multiple layers (i.e., the elongated fibers 604 are aligned with each other across multiple layers). This may be desirable, for example, to increase the torsional stiffness of the solidified material.

[0062] FIG. 7 shows a flowchart of an example method 700 for producing a composition of additive manufacturing material, according to an illustrative embodiment. The method 700 shown in FIG. 7 illustrates an example method that can be used in conjunction with the system 600 shown in FIG. 6. Furthermore, a device or system may be used or configured to perform the logical functions presented in FIG. 7. In some cases, device and / or system components may be configured to perform a function such that the components are actually configured and structured (using hardware and / or software) to enable such performance. In other examples, device and / or system components may be adapted to perform a function, capable of performing a function, or configured as suitable for performing a function, such as when operating in a particular manner. The method 700 may include one or more operations, functions, or actions, as illustrated by one or more of blocks 702-708. While the blocks are shown in sequential order, these blocks may also be performed in parallel and / or in a different order than described herein. Additionally, various blocks may be combined into fewer blocks, divided into additional blocks, and / or eliminated based on the desired implementation.

[0063] For this and other processes and methods disclosed herein, it should be understood that the flowchart illustrates the functionality and operation of one possible embodiment of this example. In this regard, each block or portion of each block may represent a module, segment, or portion of program code, including one or more instructions executable by a processor to implement specific logical functions or steps within the process. The program code may be stored in any type of computer-readable medium or data storage device, such as a storage device including a disk or hard drive. Furthermore, the program code may be encoded on a computer-readable storage medium in a machine-readable format, or other non-transitory medium or product. The computer-readable medium may include non-transitory computer-readable media or memory, such as, for example, register memory, processor cache, and computer-readable media that store short-term data, such as random access memory (RAM). The computer-readable medium may also include non-transitory media, such as, for example, secondary or permanent long-term storage, such as read-only memory (ROM), optical or magnetic disks, compact disc read-only memory (CD-ROM), etc. The computer-readable medium may also be any other volatile or non-volatile storage system. The computer readable medium can be considered, for example, a tangible computer readable storage medium.

[0064] 7 may represent circuitry hardwired to perform specific logical functions within other processes and methods disclosed herein. The scope of the embodiments of the present disclosure includes alternative embodiments that may perform functions out of the order shown or discussed, including substantially simultaneously or in reverse order, depending on the functionality involved, as will be appreciated by those skilled in the art.

[0065] The method 700 includes, at block 702, spreading a layer of additively manufactured material with a roller, the layer of additively manufactured material including elongated fibers.

[0066] The method 700 includes, at block 704, generating an electric field across a layer of additive manufacturing material.

[0067] The method 700 includes aligning elongated fibers within the layer of additive manufacturing material while generating an electric field across the layer at block 706. Within the scope of the example, block 706 may further include:

[0068] The method 700 includes, at block 708, solidifying the additive manufacturing material and the layer of aligned elongated fibers with an energy source.

[0069] Within the scope of the examples, the layer of additively manufactured material is a first layer of additively manufactured material, the electric field is a first electric field, and the elongated fibers are a first set of elongated fibers. In these examples, method 700 includes spreading a second layer of additively manufactured material with a roller, the second layer of additively manufactured material including a second set of elongated fibers. Method 700 may then include aligning the first set of elongated fibers in a first direction, where aligning the second set of elongated fibers includes aligning the second set of elongated fibers in a second direction different from the first direction.

[0070] As used herein, the terms "substantially" and "about" mean that the recited property, parameter, or value need not be achieved exactly, but that deviations or variations, including, for example, tolerances, measurement errors, measurement accuracy limits, and other factors known to those skilled in the art, may occur in an amount that does not eliminate the effect that the property was intended to provide.

[0071] Different embodiments of the systems, devices, and methods disclosed herein include a variety of components, forms, and functions. It should be understood that the various embodiments of the systems, devices, and methods disclosed herein can include any of the components, forms, and functions of any of the other embodiments of the systems, devices, and methods disclosed herein, in any combination or subcombination, and all such possibilities are intended to be within the scope of the present disclosure.

[0072] Additionally, the present disclosure includes embodiments according to the following clauses:

[0073] Clause 1. An additive manufacturing system (100) for extracting impurities (112) in an additively manufactured material (104), comprising: an additive manufacturing apparatus (102) for manufacturing a part using the additively manufactured material (104); a conductive plate (106) adjacent to the additively manufactured material (104); and an energy supply source (110) for distributing an electric charge through the conductive plate (106) adjacent to the additively manufactured material (104), wherein distributing the electric charge through the conductive plate (106) attracts impurities (112) from the additively manufactured material (104) to the conductive plate (106).

[0074] Clause 2. The additive manufacturing system (100) described in clause 1, further comprising a light source (118) for irradiating the conductive plate (106) with light, and a camera (122) for capturing image data of the conductive plate (106).

[0075] Clause 3. An additive manufacturing system (100) as described in clause 2, further comprising a computing device (124) having one or more processors (128) that execute instructions stored in a memory (130) for processing image data to determine the amount of impurities (112) on the conductive plate (106).

[0076] Clause 4. An additive manufacturing system (100) as described in clause 2, wherein the conductive plate (106) comprises a glass plate (212) and a mirror (214) coupled to the glass plate (212), the mirror (214) being configured to reflect the scattered light site (208) where the impurity (112) is present.

[0077] Clause 5. The additive manufacturing system (100) of clause 1, wherein the conductive plate (106) comprises a conductive glass or a conductive polymer.

[0078] Clause 6. The additive manufacturing system (100) described in clause 1, further comprising: a waveguide (302) on the conductive plate (106); an optical emitter (306) at a first end of the waveguide (302) for emitting light through the waveguide (302); an optical receiver (312) at a second end of the waveguide (302) for measuring light received from the optical emitter (306); and a processor (128) for determining at least one of the size, shape, or position of the impurity (112) on the conductive plate (106) based on the light emitted by the optical emitter (306) compared to the light received by the optical receiver (312).

[0079] Clause 7. The waveguides are a first set of waveguides (302), the light emitters (306) are first light emitters (306), the light receivers are first light receivers (312), and the additive manufacturing system (100) includes a second set of waveguides (304) on the conductive plate (106), the second set of waveguides (304) intersecting the first set of waveguides (302), a second light emitter (308) at a first end of the second set of waveguides (304) for emitting light through the second set of waveguides (304), and a second light emitter (308) for measuring light from the second light emitter (308). and a second optical receiver (310) at a second end of the second set of waveguides (304) for determining a size, shape, or position of the impurity (112) on the conductive plate (106), wherein the processor (128) is configured to determine at least one of the size, shape, or position of the impurity (112) on the conductive plate (106) based on light received by the first optical receiver (312) compared to light emitted by the first optical emitter (306) and light received by the second optical receiver (310) compared to light emitted by the second optical emitter (308).

[0080] Clause 8. A method (500) for extracting impurities (112) in an additively manufactured material (104), the method comprising: generating an electric charge through the conductive plate (106) adjacent to the additively manufactured material (104); and attracting the impurities (112) from the additively manufactured material (104) to the conductive plate (106) while generating the electric charge through the conductive plate (106).

[0081] Clause 9. The method (500) according to clause 8, further comprising a step of determining the amount of the impurities (112) on the conductive plate (106), wherein the step of determining the amount of the impurities (112) further comprises a step of irradiating the conductive plate (106) with light by a light source (118), a step of acquiring image data of the conductive plate (106) by a camera (122) while irradiating the conductive plate (106) with the light, and a step of processing the image data to determine the amount of the impurities (112) on the conductive plate (106).

[0082] Clause 10. The method (500) of clause 9, wherein determining the amount of the impurities (112) on the conductive plate (106) comprises detecting a number of scattered light sites (208).

[0083] Clause 11. The method (500) of clause 9, wherein the step of distributing charge through the conductive plate (106) includes distributing charge through a glass plate and a mirror coupled to the glass plate (212), the mirror (214) being configured to reflect scattered light sites (208) where the impurities (112) are present.

[0084] Clause 12. The method (500) of clause 8, further comprising the steps of: emitting light along a waveguide (302) on the conductive plate (106) by an optical emitter (306), the optical emitter (306 being adjacent to a first end of the waveguide (302); measuring light received at a second end of the waveguide (302) by an optical receiver; and determining, by a processor (128), at least one of the size, shape, or position of the impurity on the conductive plate (106) based on the light emitted by the optical emitter (306) compared to the light received by the optical receiver (312).

[0085] Clause 13. The optical emitter (306) is a first optical emitter (306), the waveguide (302) is a first set of waveguides (302), and the optical receiver (312) is a first optical receiver (312), and the method comprises emitting light along a second set of waveguides (304) on a conductive plate (106) by a second optical emitter (308), the second optical emitter (308) being adjacent to a first end of the second set of waveguides (304) and a front 13. The method of claim 12, further comprising: intersecting the second set of waveguides (304) with the first set of waveguides (302); measuring light received at a second end of the waveguides with an optical receiver (310); and determining, by the processor (128), at least one of the size, shape, or location of the impurity based on the light received by the optical receiver (310) compared to light emitted by the second optical emitter (308).

[0086] Clause 14. The method (500) of clause 8, wherein distributing the charge through the conductive plate (106) comprises distributing the charge through a conductive glass plate.

[0087] Clause 15. A method (700) for producing a composition using an additively manufactured material (608), comprising the steps of spreading a layer (624) of the additively manufactured material (608) with a roller (606), the layer (624) of the additively manufactured material (608) including elongated fibers (604); generating an electric field (610) across the layer (624) of the additively manufactured material (608); aligning the elongated fibers (604) within the layer (624) while generating the electric field (610) across the layer (624) of the additively manufactured material (608); and solidifying the additively manufactured material (608) and the layer (624) of aligned elongated fibers (604) with an energy source (622).

[0088] Clause 16. The layer (624) of the additively manufactured material (608) is a first layer (624) of the additively manufactured material (608), the electric field (610) is a first electric field (610), the elongated fibers (604) are a first set of elongated fibers (604), and the method (700) comprises the steps of spreading a second layer (628) of the additively manufactured material (608) by a roller (606), the second layer (628) of the additively manufactured material (608) comprising a second set of elongated fibers (604); 16. The method (700) of claim 15, comprising generating a second electric field (610) across the second layer (628) of the additive manufacturing material (608), aligning the second set of elongated fibers (604) within the second layer (628) while generating the electric field (610) across the second layer (628) of the additive manufacturing material (608), and solidifying the second layer (628) of the additive manufacturing material (608) and the aligned second set of elongated fibers (604) using the energy source (622).

[0089] Clause 17. The method (700) of clause 16, wherein the step of aligning the first set of elongated fibers (604) includes the step of aligning the first set of elongated fibers (604) in a first direction, and the step of aligning the second set of elongated fibers (604) includes the step of aligning the second set of elongated fibers (604) in a second direction different from the first direction.

[0090] Clause 18. The method (700) of clause 15, wherein aligning the elongated fibers (604) within the layer includes aligning at least one of silicon fibers, zinc oxide fibers, polyethylene fibers, or carbon fibers.

[0091] Clause 19. The method (700) of clause 15, wherein the step of solidifying the layer of additive manufacturing material (608) and aligned elongate fibers (604) by the energy source (622) includes the step of solidifying the layer of additive manufacturing material (608) and aligned elongate fibers (604) by a laser.

[0092] Clause 20. The method (700) described in Clause 15, wherein the step of solidifying the layer of additive manufacturing material and aligned elongated fibers (604) by the energy source (622) includes the step of solidifying the layer of additive manufacturing material (608) and aligned elongated fibers (604) by an electron beam (616).

[0093] Clause 21. An additive manufacturing system (600), comprising: an additive manufacturing apparatus (640) for manufacturing a part using additive manufacturing material (608); a roller (606) for spreading a layer of additive manufacturing material (608), the layer of additive manufacturing material (608) comprising elongated fibers (604); an electric field generator (614) for generating an electric field (610) across the layer of additive manufacturing material (608) to align the elongated fibers (604) within the layer; and an energy source (622) for solidifying the layer of additive manufacturing material (608) and the aligned elongated fibers (604).

[0094] Clause 22. The layer (624) of the additively manufactured material (608) is a first layer (624) of the additively manufactured material (608), the electric field (610) is a first electric field (610), the elongated fibers (604) are a first set of elongated fibers (604), and the system further includes a second layer (628) of the additively manufactured material (608), the second layer (628) of the additively manufactured material (608) including a second set of elongated fibers (604). The additive manufacturing system (600) described in clause 21, wherein the electric field generator (614) is configured to generate a second electric field (610) across the second layer (628) of additive manufacturing material (608) to align the second set of elongated fibers (604), and the energy supply source (622) is configured to solidify the additive manufacturing material (608) and the second layer (628) of the second set of elongated fibers (604).

[0095] Clause 23. An additive manufacturing system (600) as described in clause 22, wherein the first set of elongated fibers (604) are aligned in a first direction and the second set of elongated fibers (604) are aligned in a second direction different from the first direction.

[0096] Clause 24. An additive manufacturing system (600) as described in clause 21, wherein the elongated fibers (604) in the layer (624) of additive manufacturing material (608) comprise at least one of silicon fibers, zinc oxide fibers, polyethylene fibers, or carbon fibers.

[0097] Clause 25. The additive manufacturing system (600) of clause 21, wherein the energy source (622) comprises at least one of a laser or an electron beam (616).

[0098] Clause 26. An article (638) manufactured using an additive manufacturing process, the article (638) comprising: a first layer (624) of solidified powder comprising an additively manufactured material (608), a first set of elongated fibers (604) aligned in a first direction, and a second layer (628) of solidified powder comprising the additively manufactured material (608) and a second set of elongated fibers (604) aligned in a second direction.

[0099] Clause 27. The article (638) of clause 26, wherein the elongated fibers (604) comprise wires, microwires, nanowires, fibers, microfibers, or nanofibers.

[0100] Clause 28. The article (638) of clause 26, wherein said article (638) comprises anisotropic mechanical, electronic, magnetic, optical, or thermal properties.

[0101] Clause 29. The article (638) of clause 26, wherein the first direction is different from the second direction.

[0102] Clause 30. The article (638) according to clause 26, wherein said first direction coincides with said second direction.

[0103] The description of different advantageous configurations is presented for purposes of illustration and description and is not intended to be exhaustive or limited to the disclosed examples. Many modifications and variations will be apparent to those skilled in the art. Furthermore, different advantageous embodiments may exhibit different advantages over other advantageous embodiments. The selected embodiment or embodiments have been chosen and described to best explain the principles, practical applications, and enable those skilled in the art to understand the disclosure of the various embodiments with various modifications suited to the particular use contemplated. [Explanation of symbols]

[0104] 100 systems 102 Additive Manufacturing Machine 104 Additive Manufacturing Materials 106 Conductive Plate 110 Energy Sources 112 Impurities 116 Top Floor 118 Light source 120 Light Beam 122 Camera 124 Computing Devices 126 Container 128 processors 130 memory 204 Part of the light beam 120 206 Part of the light beam 120 208 Scattered Light Site 212 Plate 214 Mirror 302 first set of waveguides 304 Second set of waveguides 306 First Light Emitter 308 Second Light Emitter 310 Second Optical Receiver 312 first optical receiver 314 Intersection Area 402 Waveguide 500 ways 600 System 602 top surface of additive manufacturing material powder 608 604 Long and thin fibers 606 Roller 608 Additive Manufacturing Material Powder 610 Electric field 612 Electric field generator 614 Electric Field Generator 616 Electron Beam 618 Beam 622 Energy Sources 624 layers 626 Bottle 628 Second Layer 630 bottles 632 beds 636 beds 638 Goods 640 Additive Manufacturing Equipment 700 methods

Claims

1. 1. An additive manufacturing system (100) for extracting impurities (112) in an additively manufactured material (104), comprising: an additive manufacturing device (102) for manufacturing a part using the additive manufacturing material (104); a conductive plate (106) adjacent to the additive manufacturing material (104); an energy supply (110) for distributing an electric charge through the conductive plate (106) adjacent to the additively manufactured material (104), wherein distributing the electric charge through the conductive plate (106) attracts impurities (112) from the additively manufactured material (104) to the conductive plate (106); a light source (118) for irradiating the conductive plate (106) with light; a camera (122) for capturing image data of the conductive plate (106); An additive manufacturing system (100) comprising:

2. a computing device (124) having one or more processors (128) that execute instructions stored in an image data processing memory (130) to determine the amount of impurities (112) on the conductive plate (106); The additive manufacturing system (100) of claim 1.

3. The conductive plate (106) a glass plate (212); a mirror (214) coupled to the glass plate (212), the mirror (214) configured to reflect scattered light sites (208) where the impurities (112) are present; The additive manufacturing system (100) of claim 1.

4. 10. The additive manufacturing system of claim 1, wherein the conductive plate comprises a conductive glass or a conductive polymer.

5. a waveguide (302) on the conductive plate (106); a light emitter (306) at a first end of the waveguide (302) for emitting light through the waveguide (302); an optical receiver (312) at the second end of the waveguide (302) for measuring light received from the optical emitter (306); a processor (128) for determining at least one of the size, shape, or location of the impurity (112) on the conductive plate (106) based on the light emitted by the light emitter (306) compared to the light received by the light receiver (312); The additive manufacturing system (100) of claim 1, further comprising:

6. the waveguides are a first set of waveguides (302), the light emitter (306) is a first light emitter (306), the light receiver is a first light receiver (312), and the additive manufacturing system (100) is a second set of waveguides (304) on the conductive plate (106), the second set of waveguides (304) intersecting the first set of waveguides (302); a second light emitter (308) at a first end of the second set of waveguides (304) for emitting light through the second set of waveguides (304); a second optical receiver (310) at a second end of the second set of waveguides (304) for measuring light from the second optical emitter (308); the processor (128) is configured to determine at least one of the size, shape, or location of the impurity (112) on the conductive plate (106) based on light emitted by the first light emitter (306) compared to light received by the first light receiver (312) and light emitted by the second light emitter (308) compared to light received by the second light receiver (310). The additive manufacturing system (100) of claim 5.

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