Multilayer capacitor

Abstract

To provide a multilayer capacitor.SOLUTION: In one embodiment of the present invention, a multilayer capacitor includes a main body including a multilayer structure including a plurality of dielectric layers and a plurality of internal electrodes stacked with the dielectric layers interposed therebetween, and external electrodes formed outside the main body and connected to the internal electrodes. The main body includes a first surface and a second surface facing each other in a first direction with the internal electrodes exposed, a third surface and a fourth surface facing each other in a second direction corresponding to a direction where the dielectric layers are stacked, and a fifth surface and a sixth surface facing each other in a third direction perpendicular to the first and second directions. In at least a part of the internal electrodes, the length in the third direction of an intermediate region of the main body in the first direction is larger than the length of the first surface or the second surface in the third direction, and a bottle neck structure is formed between the intermediate region and at least one of the first surface and the second surface. The bottle neck structure has a shape that is depressed to the inside of the main body in the third direction.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a multilayer capacitor. [Background technology]

[0002] A capacitor is a device that can store electricity. Generally, when two electrodes are placed facing each other and a voltage is applied, electricity accumulates in each electrode. When a DC voltage is applied, current flows inside the capacitor as electricity is stored, but once the storage is complete, the current stops flowing. On the other hand, when an AC voltage is applied, the polarity of the electrodes alternates, resulting in an AC current flow.

[0003] Such capacitors can be classified into various types depending on the type of insulator provided between the electrodes, such as aluminum electrolytic capacitors in which the electrodes are made of aluminum and a thin oxide film is provided between the aluminum electrodes, tantalum capacitors that use tantalum as the electrode material, ceramic capacitors that use a high dielectric constant dielectric such as barium titanate between the electrodes, multi-layer ceramic capacitors (MLCCs) that use a multi-layer structure of high dielectric constant ceramic as the dielectric provided between the electrodes, and film capacitors that use a polystyrene film as the dielectric between the electrodes.

[0004] Among these, multilayer ceramic capacitors have been widely used in various fields, such as high-frequency circuits, due to their excellent temperature and frequency characteristics and their compact size. In recent years, efforts have been made to form thinner dielectric layers and internal electrodes to further reduce the size of multilayer ceramic capacitors. However, as components become more compact, there is a limit to how many layers of internal electrodes can be stacked, making it difficult to achieve the desired level of capacitance. Summary of the Invention [Problem to be solved by the invention]

[0005] SUMMARY OF THE INVENTION An object of the present invention is to provide a multilayer capacitor capable of improving capacitance by additionally securing an effective area of an internal electrode. [Means for solving the problem]

[0006] To solve the above-mentioned problems, the present invention provides a novel structure of a multilayer capacitor, as an example. Specifically, the multilayer capacitor includes a body including a stacked structure of a plurality of dielectric layers and a plurality of internal electrodes stacked with the dielectric layers sandwiched therebetween, and external electrodes formed outside the body and connected to the internal electrodes, wherein the body has first and second sides on which the internal electrodes are exposed and facing each other in a first direction, third and fourth sides facing each other in a second direction which is a stacking direction of the dielectric layers, and fifth and sixth sides facing each other in a third direction perpendicular to the first and second directions, at least some of the internal electrodes have a length in the third direction in a middle region of the body in the first direction that is longer than the length of either the first or second side of the body in the third direction, and a bottleneck structure formed between the middle region and at least one of the first and second sides, the bottleneck structure having a shape recessed inward of the body in the third direction.

[0007] In an embodiment, the bottleneck structure may be formed in all areas of the internal electrode adjacent to the first and second surfaces.

[0008] In one embodiment, the bottleneck structure may have a curved shape.

[0009] In one embodiment, the bottleneck structure may have a step structure.

[0010] In one embodiment, the external electrodes include an underlayer and a plating layer covering the underlayer, and the outer surfaces of at least some of the internal electrodes may be positioned further outward than the underlayer in the third direction.

[0011] In an embodiment, outer surfaces of at least some of the internal electrodes may be disposed further outward than the plating layer in the third direction.

[0012] In an embodiment, at least some of the internal electrodes may have flat portions whose lengths in the third direction are constant.

[0013] In one embodiment, the flat portion is connected to the bottleneck structure and can be located at a position that includes the intermediate region.

[0014] In one embodiment, when the length of the main body in the first direction is L1 and the length of the flat portion in the first direction is L2, the percentage of L2 / L1 may be 30 to 55%.

[0015] In one embodiment, the main body has a shape in which the length of the intermediate region in the third direction is greater than the lengths of the first and second surfaces in the third direction, and can include a first recess connecting the first surface to the fifth and sixth surfaces, respectively, and a second recess connecting the second surface to the fifth and sixth surfaces, respectively.

[0016] In one embodiment, the external electrodes may include a first external electrode covering the first surface and the first recess, and a second external electrode covering the second surface and the second recess.

[0017] In one embodiment, at least some of the internal electrodes have flat portions having a constant length in the third direction, and the flat portions may be disposed between the first and second external electrodes with respect to the first direction.

[0018] In an embodiment, an outer surface of a region of the first external electrode that covers the first recess may be located further outward in the third direction than the fifth or sixth surface.

[0019] In an embodiment, an outer surface of a region of the first external electrode that covers the first recess may be coplanar with the fifth or sixth surface.

[0020] In an embodiment, an outer surface of a region of the first external electrode that covers the first recess may be located further inward in the third direction than the fifth or sixth surface.

[0021] In one embodiment, at least some of the internal electrodes have an area that overlaps in the first direction with the area of the first external electrode that is formed in the first recess, and when the length of the main body in the third direction is W1 and the length of the overlapping area of at least some of the internal electrodes in the third direction is W2, the percentage of W2 / W1 may be 5 to 10%.

[0022] In one embodiment, at least some of the internal electrodes may have an additional bottleneck structure formed in a region connected to the external electrode.

[0023] Another aspect of the present invention provides a multilayer capacitor including: a main body including a laminated structure of a plurality of dielectric layers and a plurality of internal electrodes laminated with the dielectric layers sandwiched therebetween; and external electrodes formed outside the main body, connected to the internal electrodes, and including an underlayer and a plating layer covering the underlayer, wherein the main body includes first and second sides on which the internal electrodes are exposed and facing each other in a first direction, third and fourth sides facing each other in a second direction which is a stacking direction of the dielectric layers, and fifth and sixth sides facing each other in a third direction perpendicular to the first and second directions, and at least some of the internal electrodes have outer surfaces disposed further outward than the underlayer in the third direction.

[0024] In an embodiment, outer surfaces of at least some of the internal electrodes may be disposed further outward than the plating layer in the third direction. [Effects of the Invention]

[0025] The multilayer capacitor according to an embodiment of the present invention can have improved capacitance compared to a conventional multilayer capacitor having the same size. [Brief explanation of the drawings]

[0026] [Figure 1] 1 is a perspective view schematically illustrating an appearance of a multilayer capacitor according to an embodiment of the present invention; [Figure 2] FIG. 2 is a cross-sectional view taken along line II' in the multilayer capacitor of FIG. [Figure 3] FIG. 2 is a cross-sectional view taken along line II-II′ in the multilayer capacitor of FIG. [Figure 4] FIG. 4 is an enlarged view of region A in FIG. [Figure 5] FIG. 2 is a cross-sectional view taken along line II-II′ of the multilayer capacitor of FIG. 1, showing a modified example. [Figure 6] FIG. 2 is a cross-sectional view taken along line II-II′ of the multilayer capacitor of FIG. 1, showing a modified example. [Figure 7] FIG. 2 is a cross-sectional view taken along line II-II′ of the multilayer capacitor of FIG. 1, showing a modified example. [Figure 8] FIG. 2 is a cross-sectional view taken along line II-II′ of the multilayer capacitor of FIG. 1, showing a modified example. [Figure 9] 1 illustrates a part of a process for manufacturing a multilayer capacitor according to an embodiment of the present invention. [Figure 10] 1 illustrates a part of a process for manufacturing a multilayer capacitor according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0027] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention may be modified into several other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, the embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for clearer explanation, and elements designated by the same reference numerals in the drawings are the same elements.

[0028] In the drawings, parts not relevant to the description are omitted in order to clearly explain the present invention, thicknesses are exaggerated to clearly depict multiple layers and regions, and components having the same function within the same concept are referred to by the same reference numerals. Furthermore, throughout the specification, when a part "comprises" a certain element, it does not mean that it excludes other elements, but that it may further include other elements, unless otherwise specified.

[0029] Fig. 1 is a perspective view schematically illustrating the appearance of a multilayer capacitor according to one embodiment of the present invention. Fig. 2 is a cross-sectional view taken along line II-II' of the multilayer capacitor of Fig. 1. Fig. 3 is a cross-sectional view taken along line II-II' of the multilayer capacitor of Fig. 1, and Fig. 4 is an enlarged view of region A in Fig. 3. Figs. 5 to 8 are cross-sectional views taken along line II-II' of the multilayer capacitor of Fig. 1, showing modified examples.

[0030] 1 to 4, a multilayer capacitor 100 according to an embodiment of the present invention includes a body 110 including a dielectric layer 111 and a plurality of internal electrodes 121 and 122 stacked on either side of the dielectric layer 111, and external electrodes 131 and 132, at least some of the internal electrodes 121 and 122 having bottleneck structures 151 and 152. Here, the bottleneck structures 151 and 152 are recessed inward from the body 110 in one direction (the Y direction in FIG. 3).

[0031] The body 110 has a laminated structure in which a plurality of dielectric layers 111 are stacked, and may be obtained by, for example, stacking a plurality of green sheets and then sintering them. The sintering process may result in the plurality of dielectric layers 111 being integrated into one body. The shape and dimensions of the body 110 and the number of laminated dielectric layers 111 are not limited to those shown in the drawings of this embodiment. For example, as shown in FIG. 1, the body 110 may have a shape similar to a rectangular parallelepiped. The body 110 includes a first surface S1 and a second surface S2, on which the internal electrodes 121 and 122 are exposed, facing each other in a first direction (X direction), a third surface S3 and a fourth surface S4 facing each other in a second direction (Z direction) that is the stacking direction of the plurality of dielectric layers 111, and a fifth surface S5 and a sixth surface S6 facing each other in a third direction (Y direction) perpendicular to the first and second directions.

[0032] The dielectric layer 111 included in the body 110 may include a ceramic material having a high dielectric constant, such as a BT-based, i.e., barium titanate (BaTiO3)-based ceramic. However, other materials known in the art may be used as long as sufficient capacitance is obtained. In addition to the ceramic material as the main component, the dielectric layer 111 may further include additives, organic solvents, plasticizers, binders, dispersants, etc., as needed. The additives may include metal components, which may be added in the form of metal oxides during the manufacturing process. Examples of such metal oxide additives include at least one of MnO2, Dy2O3, BaO, MgO, Al2O3, SiO2, Cr2O3, and CaCO3.

[0033] The plurality of internal electrodes 121, 122 are obtained by printing a paste containing a conductive metal to a predetermined thickness on one surface of a ceramic green sheet and then sintering the printed paste. In this case, the plurality of internal electrodes 121, 122 may include first and second internal electrodes 121, 122 exposed on the first and second surfaces S1, S2 of the body 110, which face each other, as shown in FIG. 2. The first and second internal electrodes 121, 122 may have different polarities when connected to different external electrodes 131, 132 and are electrically isolated from each other by a dielectric layer 111 disposed therebetween. However, the number of external electrodes 131, 132 and the connection method between the internal electrodes 121, 122 may vary depending on the embodiment. Examples of main components of the internal electrodes 121, 122 include nickel (Ni), copper (Cu), palladium (Pd), and silver (Ag), and alloys thereof may also be used.

[0034] The external electrodes 131 and 132 are formed outside the main body 110 and may include first and second external electrodes 131 and 132 connected to the first and second internal electrodes 121 and 122, respectively. In this case, as shown in FIG. 4, the external electrodes 131 and 132 may have a multi-layer structure and may include an underlayer 131a and a plating layer 131b covering the underlayer 131a. The underlayer 131a may be formed by preparing a material containing a conductive metal as a paste and then applying the paste to the main body 110. Examples of conductive metals include nickel (Ni), copper (Cu), palladium (Pd), gold (Au), or alloys thereof. The plating layer 131b may include Ni, Sn, or the like and may be realized as a multi-layer structure.

[0035] 3, in this embodiment, at least some of the internal electrodes 121 and 122 are expanded in one direction, thereby increasing the overlapping area of the internal electrodes 121 and 122 and improving the capacitance. Specifically, the first internal electrode 121 has a length W3 in the third direction (Y direction) in a central region of the body 110 in the first direction (X direction) that is greater than the length W4 in the third direction (Y direction) of the first surface S1 or the second surface S2 of the body 110, and has bottleneck structures 151 and 152 formed between the central region and at least one of the first surface S1 and the second surface S2. In this embodiment, the bottleneck structures 151 and 152 are formed on both sides of the first surface S1 and the second surface S2 of the internal electrode 121, but may be formed on only one of them.

[0036] The bottleneck structures 151 and 152 are recessed inward from the body 110 in the third direction (Y direction), which means that the areas of the first internal electrode 121 that form the bottleneck structures 151 and 152 are not protruding outward from the body 110. The bottleneck structures 151 and 152 recessed inward from the body 110 are advantageous for miniaturizing the multilayer capacitor 100, and the first internal electrode 121 has an expanded area compared to conventional multilayer capacitors, thereby improving the capacitance of the multilayer capacitor 100. In addition, the bottleneck structures 151 and 152 help ensure reliability against external influences, such as penetration of a plating solution, when forming the external electrodes 131 and 132.

[0037] Since the first internal electrode 121 needs to be sufficiently extended in the third direction (Y direction) to increase the capacitance, the outer surface of the first internal electrode 121 may be extended in the third direction (Y direction) to reach the base layer 131a of the external electrodes 131 and 132, as shown in FIG. 4(a). Furthermore, as shown in FIG. 4(b), the outer surface of the first internal electrode 121 may be extended in the third direction (Y direction) further outward than the base layer 131a of the external electrodes 131 and 132, to reach the plating layer 131b. When the first internal electrode 121 is extended further outward than the base layer 131a, the first internal electrode 121 does not necessarily need to have bottleneck structures 151 and 152; a first internal electrode 121 including such an extended structure without bottleneck structures 151 and 152 is also included in the present invention. Meanwhile, the bottleneck structures 151 and 152 of the above-described type may also be formed in the second internal electrode 122, and the following description may also be applied to the second internal electrode 122.

[0038] As shown in Fig. 3, the bottleneck structures 151 and 152 may have a curved shape, thereby maximizing the overlapping area of the internal electrodes 121 and 122. However, the shape of the bottleneck structures 151 and 152 may be modified as long as the intended function of the present invention can be achieved. For example, as shown in Fig. 5, the bottleneck structures 151 and 152 may have a step structure. In such a step structure, a portion of the internal electrodes 121 and 122 is recessed inward of the body 110 in the third direction (Y direction).

[0039] 3, the first internal electrode 121 having the bottleneck structures 151 and 152 may have a flat portion P having a constant length W3 in the third direction (Y direction). In this case, the flat portion P is connected to the bottleneck structures 151 and 152 and may be disposed at a position including the middle region of the body 110.

[0040] The body 110 may include a first recess 153 and a second recess 154. Specifically, the body 110 has a shape in which the length W1 of the middle region in the third direction (Y direction) is greater than the length W3 of the first surface S1 and the second surface S3 in the third direction (Y direction). Here, the first recess 153 connects the first surface S1 to the fifth surface S5 and the sixth surface S6, respectively, and the second recess 154 connects the first surface S2 to the fifth surface S5 and the sixth surface S6, respectively. The body 110 having such a recessed structure may further miniaturize the multilayer capacitor 100. As will be described later, the recessed structure of the body 110 may be formed during a firing process by the internal electrodes 121 and 122 having the bottleneck structures 151 and 152. Alternatively, the recessed structure of the body 110 may be formed separately, regardless of the shape of the internal electrodes 121 and 122.

[0041] Meanwhile, when the length of the main body 110 in the first direction (X direction) is L1 and the length of the flat portion P in the first direction (X direction) is L2, the percentage of L2 / L1 may be 30 to 55%. The first internal electrode 121 including the bottleneck structures 151 and 152 has a region that overlaps in the first direction (X direction) with the region of the first external electrode 131 formed in the first recess 153. In this case, when the length of the main body 110 in the third direction (Y direction) is W1 and the length of the overlapping region of the first internal electrode 121 in the third direction (Y direction) is W2, the percentage of W2 / W1 may be 5 to 10%. This length condition is derived to reduce the possibility of connection between the external electrodes 131 and 132 while ensuring a sufficient overlapping region between the first and second internal electrodes 121 and 122.

[0042] As shown in the figure, the first external electrode 131 may cover the first surface S1 and the first recess 153, and the second external electrode 132 may cover the second surface S2 and the second recess 154. In this case, the flat portion P may be disposed between the first and second external electrodes 131 and 132 based on the first direction (X direction). The outer surface of the region of the first external electrode 131 covering the first recess 153 may be located further outward in the third direction (Y direction) than the fifth surface S5 or the sixth surface S6.

[0043] The shapes of the external electrodes 131 and 132 may be modified. As shown in Fig. 6, the region of the first external electrode 131 that covers the first recess 153 may have an outer surface that is coplanar with the fifth surface S5 or the sixth surface S6. Similarly, the region of the second external electrode 132 that covers the second recess 154 may have an outer surface that is coplanar with the fifth surface S5 or the sixth surface S6.

[0044] 7, the sizes of the external electrodes 131 and 132 may be further reduced. The region of the first external electrode 131 that covers the first recess 153 may have an outer surface located further inward in the third direction (Y direction) than the fifth surface S5 or the sixth surface S6, where "inward" refers to the inside of the body. Similarly, the region of the second external electrode 132 that covers the second recess 154 may have an outer surface located further inward in the third direction (Y direction) than the fifth surface S5 or the sixth surface S6. In this case, the outer surface of the first internal electrode 121 may be located further outward in the third direction (Y direction) than the outermost layer (e.g., plating layer) of the first external electrode 131.

[0045] 8, the first internal electrode 121 having the bottleneck structures 151, 152 may have an additional bottleneck structure 161 formed in a region connected to the first external electrode 131. In this case, the additional bottleneck structure 161 may be recessed inward of the body 110 in the third direction (Y direction). Such an additional bottleneck structure 161 may also be applied to the second internal electrode 122. The additional bottleneck structure 161 helps ensure reliability against external influences, such as penetration of a plating solution, when forming the external electrodes 131, 132.

[0046] 9 and 10 illustrate the formation of recesses in the body as part of a process for fabricating a stacked capacitor according to one embodiment of the present invention.

[0047] To form the body 110, a ceramic laminate is formed by laminating the dielectric layer 111 and the internal electrodes 121 and 122. Here, the dielectric layer 111 is in a ceramic green sheet state before firing. The ceramic green sheet can be formed by mixing ceramic powder, a binder, a solvent, etc. to form a slurry, which can then be formed into a sheet shape with a thickness of several microns using a doctor blade method. The ceramic green sheet can then be sintered to form the dielectric layer 111.

[0048] A conductive paste for the internal electrodes may be applied to the ceramic green sheets to form patterned internal electrodes 121. In this case, the internal electrodes 121 may be formed by screen printing or gravure printing. The conductive paste for the internal electrodes includes a conductive metal and an additive, and the additive may be at least one of a non-metal and a metal oxide. The conductive metal may include nickel. The additive may include barium titanate or strontium titanate as a metal oxide. In this embodiment, the internal electrodes 121 are formed to have a bottleneck structure.

[0049] Thereafter, the ceramic green sheet laminate is fired, and after firing, recesses 153 and 154 may be formed in the body 110 due to the bottleneck structure of the internal electrodes 121. Thereafter, external electrodes may be formed to be connected to the internal electrodes 121, thereby completing the multilayer capacitor.

[0050] The process example of FIG. 10 shows a state in which the side of the internal electrode 121 is exposed. This is achieved by cutting the internal electrode pattern into individual elements while it is connected and not separated, which can further increase the area of the internal electrode 121. Side margin portions 112 are formed to cover the exposed side of the internal electrode 121, and the side margin portions 112 may be formed of the same ceramic material as the dielectric layer 111. However, the side margin portions 112 may also be formed of a different material from the dielectric layer 111. The side margin portions 112 may also be formed using ceramic particles with a different particle size distribution from the dielectric layer 111. For example, particles with a smaller D50 than the dielectric layer 111 may be used. If the dielectric layer 111 and the side margin portions 112 are formed of different materials or particles with different particle size distributions, an interface (the last dotted line in FIG. 10) may be formed between them after firing.

[0051] The present invention is not limited by the above-described embodiments and the accompanying drawings, but is limited by the scope of the accompanying claims. Therefore, it is obvious to those skilled in the art that various substitutions, modifications, and changes can be made without departing from the technical idea of the present invention as set forth in the claims, and these also belong to the technical idea as set forth in the claims. [Explanation of symbols]

[0052] 100: Multilayer capacitor 110:Main body 111: Dielectric layer 112: Side margin 121, 122: Internal electrode 131, 132: External electrode 151, 152: Bottleneck structure 161: Additional bottleneck structures

Claims

1. a main body including a laminated structure of a plurality of dielectric layers and a plurality of internal electrodes laminated with the plurality of dielectric layers sandwiched therebetween; an external electrode formed on the outside of the body and connected to the plurality of internal electrodes; the body includes a first surface and a second surface on which the plurality of internal electrodes are exposed and which face each other in a first direction, a third surface and a fourth surface which face each other in a second direction which is a stacking direction of the plurality of dielectric layers, and a fifth surface and a sixth surface which face each other in a third direction perpendicular to the first and second directions, At least some of the internal electrodes have a bottleneck structure formed between an intermediate region of the body in the first direction, the intermediate region having a length in the third direction that is greater than a length in the third direction of a first surface or a second surface of the body, and the intermediate region and at least one of the first surface and the second surface; the bottleneck structure has a shape recessed inwardly of the body in the third direction, the main body has a shape in which the length of the intermediate region in the third direction is greater than the lengths of the first surface and the second surface in the third direction, a first recess connecting the first surface to the fifth surface and the sixth surface, respectively; and second recesses connecting the second surface to the fifth surface and the sixth surface, respectively. Stacked capacitor.

2. The multilayer capacitor according to claim 1 , wherein the bottleneck structure has a curved shape.

3. The multilayer capacitor according to claim 1 , wherein the bottleneck structure has a step structure.

4. The external electrode includes an underlayer and a plating layer covering the underlayer, The multilayer capacitor according to claim 1 , wherein outer surfaces of at least some of the internal electrodes are disposed further outward than the base layer in the third direction.

5. The multilayer capacitor according to claim 4 , wherein outer surfaces of at least some of the internal electrodes are disposed further outward than the plating layers in the third direction.

6. The multilayer capacitor according to claim 1 , wherein at least some of the internal electrodes have flat portions whose lengths in the third direction are constant.

7. The multilayer capacitor according to claim 6 , wherein the flat portion is connected to the bottleneck structure and is disposed at a position including the intermediate region.

8. 8. The multilayer capacitor of claim 6, wherein a percentage of L2 / L1 is 30 to 55%, where L1 is the length of the body in the first direction and L2 is the length of the flat portion in the first direction.

9. 2. The multilayer capacitor according to claim 1, wherein the external electrodes include a first external electrode covering the first surface and the first recess, and a second external electrode covering the second surface and the second recess.

10. At least some of the internal electrodes have flat portions whose lengths in the third direction are constant, The multilayer capacitor of claim 9 , wherein the flat portion is disposed between the first and second external electrodes with respect to the first direction.

11. 11. The multilayer capacitor according to claim 9, wherein an outer surface of the region of the first external electrode covering the first recess is positioned further outward in the third direction than the fifth or sixth surface.

12. The multilayer capacitor according to claim 9 , wherein an outer surface of the region of the first external electrode that covers the first recess is coplanar with the fifth or sixth surface.

13. 13. The multilayer capacitor according to claim 9, wherein an outer surface of a region of the first external electrode covering the first recess is located further inward in the third direction than the fifth or sixth surface.

14. the at least some of the internal electrodes have a region of the first external electrode that is formed in the first recess and that overlaps with the region in the first direction; 14. The multilayer capacitor according to claim 9, wherein a percentage of W2 / W1 is 5 to 10%, where W1 is a length of the body in the third direction and W2 is a length of the overlapping region of the at least some of the internal electrodes in the third direction.

15. The multilayer capacitor according to claim 1 , wherein at least some of the internal electrodes have an additional bottleneck structure formed in a region connected to the external electrode.

16. a main body including a laminated structure of a plurality of dielectric layers and a plurality of internal electrodes laminated with the plurality of dielectric layers sandwiched therebetween; an external electrode formed on the outside of the body, electrically connected to the plurality of internal electrodes, and including an underlayer and a plating layer covering the underlayer; the body includes a first surface and a second surface on which the plurality of internal electrodes are exposed and which face each other in a first direction, a third surface and a fourth surface which face each other in a second direction which is a stacking direction of the plurality of dielectric layers, and a fifth surface and a sixth surface which face each other in a third direction perpendicular to the first and second directions, At least some of the plurality of internal electrodes have outer surfaces disposed further outward than the base layer in the third direction, the main body has a shape in which a length in the third direction of an intermediate region of the main body in the first direction is greater than lengths in the third direction of the first surface and the second surface, a first recess connecting the first surface to the fifth surface and the sixth surface, respectively; and second recesses connecting the second surface to the fifth surface and the sixth surface, respectively. Stacked capacitor.

17. The multilayer capacitor according to claim 16 , wherein outer surfaces of at least some of the internal electrodes are disposed further outward than the plating layers in the third direction.

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