Position detection device

Abstract

To provide a position detection device that can secure a formation area of a receiving coil.SOLUTION: A position detection device includes: a substrate 100; a transmitting coil 110 formed on the substrate; and a first receiving coil 120 and a second receiving coil 130 formed on the substrate and inductively coupled by electromagnetic induction caused by energizing the transmitting coil. The substrate is a multilayer substrate in which six or more wiring layers and insulating layers disposed between the respective six or more wiring layers are alternately stacked, and has a plurality of conductive penetration portions 140 that are formed through at least one of the insulating layers to connect the six or more wiring layers. The first receiving coil and the second receiving coil are wound multiple times around each of the wiring layers, except at least one of the six or more wiring layers, and are connected through the plurality of conductive penetration portions. At least one of the plurality of conductive penetration portions is disposed inside the first receiving coil and the second receiving coil.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present disclosure relates to a position detection device. [Background technology]

[0002] Conventionally, there is known an angular position sensor that detects the position of a rotatable detection object (see, for example, Patent Document 1). This angular position sensor has two excitation coils and two sensing coils. This angular position sensor generates a magnetic field between the detection object and the two excitation coils by passing current through the two excitation coils, and detects the rotation angle of the detection object based on a detection signal generated by a change in the magnetic field between the two sensing coils and the detection object.

[0003] Here, the two excitation coils and the two sensing coils are formed on a four-layer substrate. Specifically, one of the two excitation coils is formed on the first and second layers, and the other of the two excitation coils is formed on the third and fourth layers.

[0004] The two sensing coils are formed in series from the first layer through the second and third layers to the fourth layer. Each of the two sensing coils has a portion formed by being wound four times clockwise or counterclockwise in each layer, for a total of 16 turns. The portions of the two sensing coils wound clockwise or counterclockwise in each of the four layers are electrically connected via one of three vias formed through the first to fourth layers of the multilayer substrate. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] International Publication No. 2022 / 015363 Summary of the Invention [Problem to be solved by the invention]

[0006] The inventors have investigated a position detection device that uses a transmitter coil functioning as an excitation coil and a receiver coil functioning as a sensing coil, and that allows for an increase in the total number of turns of the receiver coil. The total number of turns of the receiver coil is the sum of all the turns of the receiver coil wound on each layer of a multilayer substrate. One method for increasing the total number of receiver coils is to increase the number of layers of the multilayer substrate and also to increase the number of turns of the receiver coil formed on each layer of the multilayer substrate with the increased number of layers.

[0007] However, according to the inventors' careful investigation, if a through-hole conductive part such as a via is formed penetrating all layers of a multilayer substrate, the through-hole conductive part reduces the area of the portion on each layer where the receiving coil can be formed, which limits the number of turns of the receiving coil on each layer, and there is a possibility that the total number of turns of the receiving coil cannot be increased to the desired number.

[0008] An object of the present disclosure is to provide a position detection device that can ensure an area for forming a receiving coil. [Means for solving the problem]

[0009] The invention described in claim 1 is A position detection device, A substrate (100); a transmitting coil (110) formed on the substrate; a first receiving coil (120) and a second receiving coil (130) formed on a substrate and inductively coupled by electromagnetic induction caused by energization of the transmitting coil; The substrate is a multilayer substrate in which ten wiring layers (102, 1001 to 1010) and insulating layers (101) arranged between each of the ten wiring layers are alternately stacked, and has a plurality of conductive through parts (140, 1401 to 1407) formed by penetrating at least one of the insulating layers and connecting the ten wiring layers; the first receiving coil and the second receiving coil are wound multiple times on each of the ten wiring layers except for at least one wiring layer, and are connected via multiple conductive through-holes; The plurality of conductive through portions include first conductive portions (1403, 1404, 1405) formed by penetrating five insulating layers and second conductive portions (1401, 1402, 1406, 1407) formed by penetrating one insulating layer; Three first conductive parts are formed on the substrate, and at least one of them is disposed inside the first receiving coil and the second receiving coil; Four second conductive portions are formed on the substrate, and at least one of them is disposed inside the first receiving coil and the second receiving coil. The invention described in claim 4 is as follows: A position detection device, A substrate (100); a transmitting coil (110) formed on the substrate; a first receiving coil (120) and a second receiving coil (130) formed on a substrate and inductively coupled by electromagnetic induction caused by energization of the transmitting coil; The board has eight wiring layers (102, 1001 to 1008 ) and insulating layers (101) disposed between each of the eight wiring layers are alternately stacked, and a plurality of conductive penetration parts (140, 1401 to 1405) are formed by penetrating at least one of the insulating layers and connecting the eight wiring layers. 1405 ) and the first receiving coil and the second receiving coil are wound multiple times on each of the eight wiring layers except for at least one wiring layer, and are connected via multiple conductive through-holes; The plurality of conductive through portions include a first conductive portion (1403) formed by penetrating three insulating layers and a second conductive portion (1401, 1402, 1404, 1405) formed by penetrating one insulating layer; the first conductive portion is formed on the substrate and is disposed inside the first receiving coil and the second receiving coil; Four second conductive portions are formed on the substrate, and at least one of them is disposed inside the first receiving coil and the second receiving coil. The invention described in claim 5 is as follows: A position detection device, A substrate (100); a transmitting coil (110) formed on the substrate; a first receiving coil (120) and a second receiving coil (130) formed on a substrate and inductively coupled by electromagnetic induction caused by energization of the transmitting coil; The board has six wiring layers (102, 1001 to 1006 ) and insulating layers (101) arranged between each of the six wiring layers are alternately stacked, and a plurality of conductive penetration parts (140, 1401 to 1405) are formed by penetrating at least one of the insulating layers and connecting the six wiring layers. 1403 ) and the first receiving coil and the second receiving coil are wound multiple times on each of the six wiring layers except for at least one wiring layer, and are connected via multiple conductive through-holes; The plurality of conductive through portions include a first conductive portion (1402) formed by penetrating three insulating layers and a second conductive portion (1401, 1403) formed by penetrating one insulating layer; the first conductive portion is formed on the substrate and is disposed inside the first receiving coil and the second receiving coil; Two second conductive portions are formed on the substrate, and at least one of them is disposed inside the first and second receiving coils. The invention described in claim 7 is as follows: A position detection device, A substrate (100); a transmitting coil (110) formed on the substrate; a first receiving coil (120) and a second receiving coil (130) formed on a substrate and inductively coupled by electromagnetic induction caused by energization of the transmitting coil; The board has eight wiring layers (102, 1001 to 1008) and insulating layers (101) disposed between each of the eight wiring layers are alternately stacked, and a plurality of conductive penetration parts (140, 1401 to 1405) are formed by penetrating at least one of the insulating layers and connecting the eight wiring layers. 1405 ) and the first receiving coil and the second receiving coil are wound multiple times on each of the eight wiring layers except for the two central wiring layers, and are connected via multiple conductive through-holes; At least one of the plurality of conductive through-portions is disposed inside the first and second receiving coils. The invention described in claim 8 is as follows: A position detection device, A substrate (100); a transmitting coil (110) formed on the substrate; a first receiving coil (120) and a second receiving coil (130) formed on a substrate and inductively coupled by electromagnetic induction caused by energization of the transmitting coil; The board has six wiring layers (102, 1001 to 1006 ) and insulating layers (101) arranged between each of the six wiring layers are alternately stacked, and a plurality of conductive penetration parts (140, 1401 to 1405) are formed by penetrating at least one of the insulating layers and connecting the six wiring layers. 1403 ) and the first receiving coil and the second receiving coil are wound multiple times on each of the six wiring layers except for the two central wiring layers, and are connected via multiple conductive through-holes; At least one of the plurality of conductive through-portions is disposed inside the first and second receiving coils. The invention described in claim 13 is as follows: A position detection device, A substrate (100); a transmitting coil (110) formed on the substrate; a first receiving coil (120) and a second receiving coil (130) formed on a substrate and inductively coupled by electromagnetic induction caused by energization of the transmitting coil; The substrate is a multilayer substrate in which six or more wiring layers (102, 1001 to 1010) and insulating layers (101) arranged between each of the six or more wiring layers are alternately stacked, and has a plurality of conductive through parts (140, 1401 to 1407) formed by penetrating at least one of the insulating layers and connecting the six or more wiring layers; The first and second receiving coils are wound multiple times on each of the six or more wiring layers except for at least one wiring layer, and are connected via multiple conductive through-holes, one of the first and second receiving coils includes a pattern shape that describes a sine curve, and the other of the first and second receiving coils includes a pattern shape that describes a cosine curve, At least one of the plurality of conductive through-portions is disposed inside the first and second receiving coils.

[0010] This reduces the number of conductive through-holes for connecting the first and second receiving coils compared to when the first and second receiving coils are formed on all six or more wiring layers, thereby increasing the area in which the first and second receiving coils can be formed on each wiring layer.

[0011] The reference symbols in parentheses attached to each component indicate an example of the correspondence between the component and the specific components described in the embodiments described below. [Brief explanation of the drawings]

[0012] [Figure 1] 1 is a block diagram of an electric motorization system configured using a position detection device according to a first embodiment. [Figure 2] FIG. 2 is a diagram illustrating the relationship between a position detection device and a drive unit. [Figure 3] FIG. 2 is a plan view of the rotating plate and the position detection device. [Figure 4] FIG. [Figure 5]5 is a cross-sectional view of the position detection device taken along line VV in FIG. 4. [Figure 6] 6 is a plan view of the printed circuit board according to the first embodiment as seen from the direction of the arrow indicated by VI in FIG. 5. [Figure 7] FIG. 2 is a block diagram of a position detection device. [Figure 8] 1 is a cross-sectional view of a printed circuit board according to a first embodiment. [Figure 9] 3A and 3B are diagrams for explaining the configuration of a wiring layer, a first receiving coil, and a via in the printed circuit board of the first embodiment. [Figure 10] 3A and 3B are diagrams for explaining connections of first receiving coils formed on each wiring layer in the printed circuit board of the first embodiment. [Figure 11] 10A and 10B are diagrams illustrating the configuration of a wiring layer, a first receiving coil, and a via in a printed circuit board of a comparative example. [Figure 12] 10A and 10B are diagrams for explaining an area in which a via can be formed in a printed circuit board of a comparative example. [Figure 13] 10 is a diagram for explaining the configuration of a wiring layer, a first receiving coil, and a via in a printed circuit board according to a second embodiment. FIG. [Figure 14] 7 is a view corresponding to FIG. 6 of a printed circuit board according to a second embodiment. [Figure 15] 10A and 10B are diagrams illustrating the configuration of a wiring layer, a first receiving coil, and a via in a printed circuit board according to a third embodiment. [Figure 16] FIG. 7 is a view corresponding to FIG. 6 of a printed circuit board according to a third embodiment. [Figure 17] FIG. 10 is a view corresponding to FIG. 6 of a printed circuit board according to a fourth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0013] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In the following embodiments, parts that are the same as or equivalent to those described in the preceding embodiments will be given the same reference numerals, and their description may be omitted. Furthermore, in the embodiments, when only some of the components are described, the components described in the preceding embodiments can be applied to the remaining components. The following embodiments can be partially combined with each other, even if not specifically stated, as long as there is no particular problem with the combination.

[0014] (First embodiment) This embodiment will be described with reference to Fig. 1 to Fig. 12. In this embodiment, a position detection device that detects the rotation of a detection body will be described as an example of the position detection device. Note that this embodiment will describe an example in which the position detection device is applied to an electrification system mounted on a vehicle.

[0015] [Electrification system] As shown in FIG. 1 , the electrification system includes an actuator 1, a gear 2, a drive unit 3, an ECU 4 (short for Electronic Control Unit), and a position detection device S1. The electrification system operates as follows: The actuator 1 is controlled by the ECU 4 and rotates the gear 2 under the control of the ECU 4. The drive unit 3 includes a detection body (described later) and is composed of components that operate in response to the rotation of the gear 2. The position detection device S1 detects the displacement of the detection body provided in the drive unit 3 and outputs a detection signal to the ECU 4. In this embodiment, the detection body is a rotating flat plate 30, as described later, and outputs the rotation angle of the rotating flat plate 30 to the ECU 4. The ECU 4 controls the actuator 1 taking into account the detection signal from the position detection device S1.

[0016] Next, a description will be given of the configuration of the drive unit 3 in which the position detection device S1 is disposed. In this embodiment, an example in which the position detection device S1 is disposed in a motor such as a main motor or an in-wheel motor will be described.

[0017] The driving unit 3 is assumed to be, for example, a rotor for a motor, and includes a shaft 10 as a rotation axis, a rotating plate 30, and a fixed base 40, as shown in Fig. 2. These components 10, 30, and 40 are arranged coaxially with the axial direction Da of the shaft 10 as the center. Hereinafter, the axial direction Da of the shaft 10 will be simply referred to as the axial direction Da. For ease of viewing, Fig. 2 shows simplified versions of a transmitting coil 110, a first receiving coil 120, and a second receiving coil 130, which will be described later and which constitute the position detection device S1.

[0018] The shaft 10 is, for example, a drive shaft, and is made up of a cylindrical member. The shaft 10 is provided with a tire on one end side, and is arranged so that the other end side opposite the one end side faces the vehicle body. For example, in FIG. 2, the upper side of the page is the one end side of the shaft 10, and the lower side of the page is the other end side of the shaft 10. Although details are omitted, the shaft 10 is equipped with, for example, a rotating wheel and bearing members (not shown), and the rotating wheel is supported by the bearing members in a rotatable state.

[0019] The rotating flat plate 30 is made of metal and has a circular ring shape with through holes 30a formed therein. As shown in FIG. 3 , the rotating flat plate 30 of this embodiment has a plurality of recesses 31 formed evenly in the circumferential direction on its outer edge. In other words, the rotating flat plate 30 has a plurality of protrusions 32 arranged along the circumferential direction on its outer edge. That is, the rotating flat plate 30 has a concave-convex structure 33 formed along the circumferential direction on its outer edge, the concave-convex structure 33 having recesses 31 and protrusions 32.

[0020] 2, the rotating flat plate 30 is fixed to the shaft 10 with one end of the shaft 10 inserted into the through hole 30a so as to rotate with the rotation of the shaft 10. In this embodiment, the rotating flat plate 30 corresponds to the detection body.

[0021] The fixed base 40 is plate-shaped with a through-hole 40a formed therein. The other end of the shaft 10 is inserted into the through-hole 40a of the fixed base 40, and a rotating wheel (not shown) is rotatably disposed thereon. The fixed base 40 is also provided with a position detector S1 so as to face the protrusion 32 of the rotating flat plate 30 in the axial direction Da. The position detector S1 is disposed so as to have a predetermined gap (i.e., distance) d between it and the rotating flat plate 30, as shown in FIG. 3 .

[0022] [Position detection device] Next, the configuration of the position detection device S1 of this embodiment will be described. As shown in FIGS. 4 and 5, the position detection device S1 of this embodiment has a printed circuit board 100 having one surface 100a and another surface 100b. The position detection device S1 is configured such that a circuit board 200 and terminals 400 are arranged on the one surface 100a of the printed circuit board 100, and these are integrally sealed by a sealing member 500. Hereinafter, the normal direction Ds to the surface direction of the printed circuit board 100 will be simply referred to as the normal direction Ds. Note that when the position detection device S1 is mounted on a fixed base 40, the normal direction Ds of the printed circuit board 100 coincides with the axial direction Da. Although not specifically shown, various electronic components such as capacitors and resistors are also appropriately arranged on the printed circuit board 100.

[0023] The printed circuit board 100 of this embodiment is an arc-shaped plate. More specifically, the printed circuit board 100 is configured to coincide with the arc of an imaginary circle whose center is the shaft 10. In other words, the printed circuit board 100 is shaped such that an imaginary circle whose arc is the printed circuit board 100 coincides with a circle whose center is the shaft 10.

[0024] 6, a transmitter coil 110, a first receiver coil 120, and a second receiver coil 130 are formed on the printed circuit board 100. Also, as shown in Fig. 7, connection wiring 150 is formed on the printed circuit board 100 to connect the circuit board 200 with the transmitter coil 110, the first receiver coil 120, and the second receiver coil 130. Note that Fig. 5 simply illustrates the transmitter coil 110, the first receiver coil 120, and the second receiver coil 130.

[0025] Specifically, as shown in FIG. 8 , the printed circuit board 100 of this embodiment is a multilayer board in which insulating layers 101 and wiring layers 102 are alternately stacked. The printed circuit board 100 of this embodiment has a six-layer through-hole board in which insulating layers 101 and wiring layers 102 are alternately stacked. The printed circuit board 100 is then configured as a ten-layer buildup board in which two insulating layers 101 and two wiring layers 102 are further stacked on each side of the through-hole board in the normal direction Ds. The six-layer through-hole board is also called a core layer. Furthermore, a layer formed on each side of the core layer in the normal direction Ds, each consisting of one insulating layer 101 and one wiring layer 102, is also called a build layer. The printed circuit board 100 of this embodiment is a ten-layer buildup board in which two build layers are arranged on each side of the six-layer core layer in the normal direction Ds. The insulating layer 101 is made of an insulating material, for example, epoxy resin. The wiring layer 102 is made of a conductive material, for example, copper.

[0026] The printed circuit board 100 of this embodiment has ten wiring layers 102, and a first receiver coil 120 and a second receiver coil 130 are formed on the wiring layers 102, excluding certain wiring layers 102. As shown in FIG. 6 , the first receiver coil 120 and the second receiver coil 130 are disposed inside the transmitter coil 110. The printed circuit board 100 of this embodiment also has vias 140 formed therein to connect the wiring layers 102. The transmitter coil 110, the first receiver coil 120, and the second receiver coil 130 formed on the wiring layers 102 are appropriately connected via the vias 140. The vias 140 function as conductive through holes that electrically connect the ten wiring layers 102. The shapes and connections of the first receiver coil 120 and the second receiver coil 130 formed on the wiring layers 102 will be described in detail later. The printed circuit board 100 also has a plurality of pads (not shown) formed therein. As shown in FIG. 5, one end of a rod-shaped terminal 400 is connected to the printed circuit board 100 so as to be connected to the pad portion.

[0027] The terminals 400 are provided with, for example, three terminals for power supply, ground, and output. For example, the output terminal 400 is connected to the ECU 4 and is used to output the rotation angle of the detection object to the ECU 4. The number of terminals 400 is not particularly limited, and the connection destinations can be changed appropriately depending on the number of terminals 400.

[0028] The circuit board 200 is disposed via a bonding member (not shown) in a portion of the printed circuit board 100 different from the portions where the transmitter coil 110, the first receiver coil 120, and the second receiver coil 130 are formed. The circuit board 200 is connected to the transmitter coil 110, the first receiver coil 120, and the second receiver coil 130 via connection wiring 150 formed on the printed circuit board 100.

[0029] The circuit board 200 includes a microcomputer or the like equipped with a CPU and storage units such as ROM, RAM, and nonvolatile RAM, and is connected to the transmitting coil 110, the first receiving coil 120, and the second receiving coil 130. The circuit board 200 realizes various control operations by the CPU reading and executing programs from the ROM or nonvolatile RAM. Note that the ROM or nonvolatile RAM stores various data (e.g., initial values, lookup tables, maps, etc.) used when executing the programs. The storage medium such as the ROM is a non-transitory tangible storage medium. CPU stands for Central Processing Unit, ROM stands for Read Only Memory, and RAM stands for Random Access Memory.

[0030] 7, the circuit board 200 includes a signal processing unit 210 that is connected to the transmitting coil 110, the first receiving coil 120, and the second receiving coil 130 and performs predetermined processing. The signal processing unit 210 includes, for example, an oscillator 220, a demodulator 230, an AD converter 240, an angle calculator 250, an output unit 260, and a power supply unit 300. Note that, although an example in which signals are converted into digital signals and processed will be described below as a representative example, when analog signals are processed, the signal processing unit 210 does not need to include the AD converter 240, etc.

[0031] As shown in FIGS. 4 and 5 , the sealing member 500 integrally seals the printed circuit board 100, the circuit board 200, and the terminals 400 such that one end of the terminals 400 connected to the printed circuit board 100 and the other end opposite the one end are exposed. Hereinafter, the sealing member 500 will be described as a main portion 510, which is an arc-shaped plate that conforms to the shape of the printed circuit board 100, and a connector portion 520, which seals the terminals 400 and connects them to an external connector. The main portion 510 is formed, for example, to conform to the shape of the printed circuit board 100, with at least its inner edge portion coinciding with the arc of an imaginary circle centered on the shaft 10. The connector portion 520 is, for example, substantially cylindrical and extends along the normal direction Ds, and has an opening 520a that exposes the other end of the terminals 400 on the side opposite the main portion 510. The sealing member 500 is made of, for example, a thermosetting resin or a thermoplastic resin.

[0032] The sealing member 500 has collar portions 530 formed in stepped portions at both circumferential ends of the arc-shaped main portion 510, through which fastening members are inserted to secure the sealing member 500 to the fixing base 40. The collar portion 530 is configured by disposing a metal collar 532 in a through hole 531 that penetrates the main portion 510 in the thickness direction. Note that the main portion 510 does not necessarily have to have stepped portions formed in the circumferential direction, and the shapes of both ends of the main portion 510 can be changed as appropriate to match the shape of the side to which it is fixed.

[0033] The above is the configuration of the position detector S1 in this embodiment. As shown in Fig. 2, the position detector S1 is disposed on the fixed base 40 so as to face the rotating flat plate 30 in the axial direction Da. Specifically, as shown in Figs. 2 and 3, the position detector S1 is disposed so that, when the rotating flat plate 30 rotates, the coils 110, 120, and 130 alternate between facing and not facing the protrusions 32 of the rotating flat plate 30 in the axial direction Da.

[0034] [Signal Processing Section] Next, the operation of the signal processing unit 210 in the circuit board 200 will be described.

[0035] 7, the oscillator 220 is connected to both ends of the transmitting coil 110 and applies an AC current of a predetermined frequency. Note that, for example, two capacitors 161 and 162 are connected in series between both ends of the transmitting coil 110 and the oscillator 220, and the part connecting the capacitors 161 and 162 is connected to ground. The transmitting coil 110 generates a magnetic field in the axial direction Da that passes through an area surrounded by the first receiving coil 120 and an area surrounded by the second receiving coil 130. However, the manner in which the transmitting coil 110 and the oscillator 220 are connected can be changed as appropriate; for example, one capacitor may be disposed between both ends of the transmitting coil 110 and the oscillator 220.

[0036] The demodulation unit 230 is connected to both ends of the first receiving coil 120 and both ends of the second receiving coil 130. The demodulation unit 230 generates a first demodulated signal by demodulating a first voltage value V1 (described later) of the first receiving coil 120, and generates a second demodulated signal by demodulating a second voltage value V2 (described later) of the second receiving coil 130.

[0037] The AD conversion unit 240 is connected to, for example, the demodulation unit 230 and the angle calculation unit 250. The AD conversion unit 240 outputs to the angle calculation unit 250 a first converted signal S obtained by AD converting the first demodulated signal and a second converted signal C obtained by AD converting the second demodulated signal.

[0038] The angle calculation section 250 calculates the rotation angle of the rotating flat plate 30 by, for example, calculating an arctangent function using the first converted signal S and the second converted signal C.

[0039] The output unit 260 outputs, for example, the rotation angle of the rotating flat plate 30 obtained by the calculation in the angle calculation unit 250 to an output terminal 400 .

[0040] The power supply unit 300 is connected to each of the units 220 to 260 of the signal processing unit 210, and supplies power to each of the units 220 to 260.

[0041] The basic configuration of the signal processing unit 210 has been described above.

[0042] Next, the first voltage value V1 of the first receiving coil 120 and the second voltage value V2 of the second receiving coil 130 when the rotating flat plate 30 rotates will be described.

[0043] First, an alternating current of a predetermined frequency is applied to the transmitting coil 110 from the oscillator 220. This generates electromagnetic induction in the transmitting coil 110. The resulting electromagnetic induction then inductively couples the transmitting coil 110 with the first receiving coil 120 and the second receiving coil 130. This generates a magnetic field in the axial direction Da that passes through the area surrounded by the first receiving coil 120 and the area surrounded by the second receiving coil 130. Furthermore, because the magnetic field changes due to the alternating current, the first voltage value V1, which is the induced electromotive force generated in the first receiving coil 120, and the second voltage value V2, which is the induced electromotive force generated in the second receiving coil 130, change due to electromagnetic induction.

[0044] When the convex portions 32 of the rotating flat plate 30 face the transmitter coil 110, the first receiver coil 120, and the second receiver coil 130, electromagnetic induction generates eddy currents, which are induced currents, in the convex portions 32, and a magnetic field is generated due to the eddy currents. Therefore, of the magnetic fields in the axial direction Da that pass through the areas surrounded by the first receiver coil 120 and the second receiver coil 130, the magnetic fields that pass through the portions facing the convex portions 32 are canceled out by the magnetic fields caused by the eddy currents. This causes a change in the first voltage value V1 generated in the first receiver coil 120 and the second voltage value V2 generated in the second receiver coil 130.

[0045] As described above, the convex portions 32 are arranged in a line at intervals in the circumferential direction, and concave portions 31 are formed between adjacent convex portions 32. As a result, the area facing the convex portions 32 changes as the rotating flat plate 30 rotates, and the size of the portion facing the convex portions 32 in the magnetic field in the axial direction Da that passes through the area surrounded by the first receiving coil 120 and the area surrounded by the second receiving coil 130 changes periodically. Therefore, as the rotating flat plate 30 rotates, the first voltage value V1 generated in the first receiving coil 120 and the second voltage value V2 generated in the second receiving coil 130 change periodically. In this way, the rotating flat plate 30 of this embodiment changes the first voltage value V1 generated in the first receiving coil 120 and the second voltage value V2 generated in the second receiving coil 130 depending on its own rotational position.

[0046] [Details of the first and second receiving coils] Next, the shapes and connections of the first receiver coil 120 and the second receiver coil 130 formed on the wiring layer 102 will be described in detail later. As described above, the printed circuit board 100 of this embodiment is configured as a 10-layer build-up board. The first receiver coil 120 and the second receiver coil 130 are formed on the wiring layers 102 excluding predetermined wiring layers 102 out of the 10 wiring layers 102.

[0047] As shown in Fig. 6, the first receiver coil 120 and the second receiver coil 130 of this embodiment are mainly spiral-shaped. The first receiver coil 120 has a first forward spiral portion 121 and a first counter-spiral portion 122. The first forward spiral portion 121 and the first counter-spiral portion 122 are portions of the first receiver coil 120 that form the spiral shape. The second receiver coil 130 of this embodiment has a second forward spiral portion 131 and a second counter-spiral portion 132. The second forward spiral portion 131 and the second counter-spiral portion 132 are portions of the second receiver coil 130 that form the spiral shape.

[0048] First forward spiral portion 121, first counter spiral portion 122, second forward spiral portion 131, and second counter spiral portion 132 are formed side by side at a predetermined interval along the circumferential direction of arc-shaped printed circuit board 100. Specifically, first forward spiral portion 121, second forward spiral portion 131, first counter spiral portion 122, and second counter spiral portion 132 are formed side by side in this order from one side to the other side in the circumferential direction of printed circuit board 100.

[0049] The first forward spiral portion 121 and the first counter spiral portion 122 have a spiral pattern shape formed to describe a rectangle with varying radii. The first forward spiral portion 121 and the first counter spiral portion 122 are each formed by winding a coil three times in the same direction in each of the ten wiring layers 102 except for the two central wiring layers 102. However, the first forward spiral portion 121 and the first counter spiral portion 122 have coil winding directions (i.e., spiral directions) opposite to each other. For example, the first forward spiral portion 121 has a clockwise coil winding direction when viewed from one side of the normal direction Ds. In contrast, the first counter spiral portion 122 has a counterclockwise coil winding direction when viewed from one side of the normal direction Ds.

[0050] Similar to the first forward spiral portion 121 and the first counter-spiral portion 122, the second forward spiral portion 131 and the second counter-spiral portion 132 have a spiral pattern formed to describe a rectangle with varying diameters. Similarly to the first forward spiral portion 121 and the first counter-spiral portion 122, the second forward spiral portion 131 and the second counter-spiral portion 132 are wound three times each on each of the ten wiring layers 102 except for the two central wiring layers 102. However, the second forward spiral portion 131 and the second counter-spiral portion 132 are wound in opposite directions. For example, the second forward spiral portion 131 is wound clockwise. In contrast, the second counter-spiral portion 132 is wound counterclockwise.

[0051] First forward spiral portion 121, first counter spiral portion 122, second forward spiral portion 131, and second counter spiral portion 132 are formed in a plurality of wiring layers 102 among the wiring layers 102 of the ten-layer buildup board. First forward spiral portion 121, first counter spiral portion 122, second forward spiral portion 131, and second counter spiral portion 132 are formed such that the spiral portions formed in each wiring layer 102 overlap in normal direction Ds.

[0052] For example, the first forward spiral portions 121 formed on the multiple wiring layers 102 are formed such that the first forward spiral portions 121 formed on each wiring layer 102 overlap in the normal direction Ds. The first counter spiral portions 122 formed on the multiple wiring layers 102 are formed such that the first counter spiral portions 122 formed on each wiring layer 102 overlap in the normal direction Ds. The second forward spiral portions 131 formed on the multiple wiring layers 102 are formed such that the second forward spiral portions 131 formed on each wiring layer 102 overlap in the normal direction Ds. The second counter spiral portions 132 formed on the multiple wiring layers 102 are formed such that the second counter spiral portions 132 formed on each wiring layer 102 overlap in the normal direction Ds.

[0053] Here, the ten wiring layers 102 are, as shown in Figure 8, arranged from one side to the other in the normal direction Ds as follows: first wiring layer 1001, second wiring layer 1002, third wiring layer 1003, fourth wiring layer 1004, fifth wiring layer 1005, sixth wiring layer 1006, seventh wiring layer 1007, eighth wiring layer 1008, ninth wiring layer 1009, and tenth wiring layer 1010.

[0054] In this embodiment, first forward spiral portion 121, first counter spiral portion 122, second forward spiral portion 131, and second counter spiral portion 132 are formed in the same wiring layer 102 out of ten wiring layers 102. Specifically, first forward spiral portion 121, first counter spiral portion 122, second forward spiral portion 131, and second counter spiral portion 132 are formed in first wiring layer 1001, second wiring layer 1002, third wiring layer 1003, fourth wiring layer 1004, seventh wiring layer 1007, eighth wiring layer 1008, ninth wiring layer 1009, and tenth wiring layer 1010. In other words, the first forward spiral portion 121, the first reverse spiral portion 122, the second forward spiral portion 131 and the second reverse spiral portion 132 are formed in the wiring layers 102, excluding the fifth wiring layer 1005 and the sixth wiring layer 1006, out of the ten wiring layers 102.

[0055] First forward spiral portion 121, first counter spiral portion 122, second forward spiral portion 131, and second counter spiral portion 132 are formed by winding the coil three times in each of first wiring layer 1001, second wiring layer 1002, third wiring layer 1003, fourth wiring layer 1004, seventh wiring layer 1007, eighth wiring layer 1008, ninth wiring layer 1009, and tenth wiring layer 1010. Therefore, the total number of turns of the coil in each of first forward spiral portion 121, first counter spiral portion 122, second forward spiral portion 131, and second counter spiral portion 132 in this embodiment is 24.

[0056] The first forward spiral portion 121, the first counter spiral portion 122, the second forward spiral portion 131 and the second counter spiral portion 132 formed in the first wiring layer 1001, the second wiring layer 1002, the third wiring layer 1003, the fourth wiring layer 1004, the seventh wiring layer 1007, the eighth wiring layer 1008, the ninth wiring layer 1009 and the tenth wiring layer 1010 are each connected by a via 140 formed in the printed circuit board 100.

[0057] Here, the method of connecting first forward spiral portion 121 formed in each of first wiring layer 1001, second wiring layer 1002, third wiring layer 1003, fourth wiring layer 1004, seventh wiring layer 1007, eighth wiring layer 1008, ninth wiring layer 1009, and tenth wiring layer 1010 is the same as the method of connecting first counter spiral portion 122, second forward spiral portion 131, and second counter spiral portion 132. For this reason, in this embodiment, only the method of connecting first forward spiral portion 121 will be described in detail with reference to Figures 9 and 10, and a detailed description of the method of connecting first counter spiral portion 122, second forward spiral portion 131, and second counter spiral portion 132 will be omitted.

[0058] First, the vias 140 connecting the first forward spiral portion 121 will be described. As shown in Fig. 9, seven vias 140 are formed in the printed circuit board 100 of this embodiment, connecting the first wiring layer 1001, the second wiring layer 1002, the third wiring layer 1003, the fourth wiring layer 1004, the fifth wiring layer 1005, the sixth wiring layer 1006, the seventh wiring layer 1007, the eighth wiring layer 1008, the ninth wiring layer 1009, and the tenth wiring layer 1010. Specifically, the printed circuit board 100 is formed with a first via 1401 connecting the first wiring layer 1001 and the second wiring layer 1002, and a second via 1402 connecting the second wiring layer 1002 and the third wiring layer 1003. The printed circuit board 100 also has a third via 1403, a fourth via 1404, and a fifth via 1405 formed therein, which connect the third wiring layer 1003, the fourth wiring layer 1004, the fifth wiring layer 1005, and the sixth wiring layer 1006. The printed circuit board 100 also has a sixth via 1406 formed therein, which connects the eighth wiring layer 1008 and the ninth wiring layer 1009, and a seventh via 1407 formed therein, which connects the ninth wiring layer 1009 and the tenth wiring layer 1010.

[0059] The first via 1401 is formed to penetrate one insulating layer 101 between the first wiring layer 1001 and the second wiring layer 1002 in the normal direction Ds. The second via 1402 is formed to penetrate one insulating layer 101 between the second wiring layer 1002 and the third wiring layer 1003 in the normal direction Ds. The third via 1403, the fourth via 1404, and the fifth via 1405 are formed to penetrate five insulating layers 101 between the third wiring layer 1003 and the eighth wiring layer 1008 in the normal direction Ds. The sixth via 1406 is formed to penetrate one insulating layer 101 between the eighth wiring layer 1008 and the ninth wiring layer 1009 in the normal direction Ds. The seventh via 1407 is formed to penetrate one insulating layer 101 between the ninth wiring layer 1009 and the tenth wiring layer 1010 in the normal direction Ds.

[0060] That is, via 140 includes a first via 1401, a second via 1402, a sixth via 1406, and a seventh via 1407 that are formed by penetrating one insulating layer 101. Furthermore, via 140 includes a third via 1403, a fourth via 1404, and a fifth via 1405 that are formed by penetrating five insulating layers 101. Third via 1403, fourth via 1404, and fifth via 1405 function as a first conductive portion that is formed by penetrating five insulating layers 101. First via 1401, second via 1402, sixth via 1406, and seventh via 1407 function as a second conductive portion that is formed by penetrating one insulating layer 101.

[0061] The first via 1401, the second via 1402, the sixth via 1406, and the seventh via 1407 are formed by copper plating holes formed in the insulating layer 101 of the build layer, for example, by a laser. The third via 1403, the fourth via 1404, and the fifth via 1405 are formed by copper plating through holes formed in the core layer, which is made up of six through-hole substrate layers, and which penetrate all of the wiring layers 102 and the insulating layers 101. Note that in FIG. 9, the insulating layers 101 between the wiring layers 102 are omitted to make the drawing easier to see.

[0062] 6 and 9, the first via 1401 and the seventh via 1407 are formed at positions where they overlap with each other in the normal direction Ds. The first via 1401 and the seventh via 1407 are formed at positions where they do not overlap with the second via 1402, the third via 1403, the fourth via 1404, the fifth via 1405, and the sixth via 1406 in the normal direction Ds.

[0063] The second via 1402 and the sixth via 1406 are formed at positions where they overlap each other in the normal direction Ds. The second via 1402 and the sixth via 1406 are formed at positions where they do not overlap with the third via 1403, the fourth via 1404, and the fifth via 1405 in the normal direction Ds.

[0064] The third via 1403, the fourth via 1404, and the fifth via 1405 are formed at positions that do not overlap with each other in the normal direction Ds.

[0065] 6, first via 1401, second via 1402, third via 1403, fourth via 1404, fifth via 1405, sixth via 1406, and seventh via 1407 are formed at positions that do not overlap first positive spiral portion 121 in normal direction Ds. Specifically, first via 1401, third via 1403, fifth via 1405, and seventh via 1407 are formed inside the spiral shape of first positive spiral portion 121. In contrast, second via 1402, fourth via 1404, and sixth via 1406 are formed outside the spiral shape of first positive spiral portion 121. That is, first vias 1401 to seventh vias 1407 are arranged alternately inside and outside first forward spiral portion 121, with vias 1401, 1403, 1405, and 1407 formed inside first forward spiral portion 121 and vias 1402, 1404, and 1406 formed outside.

[0066] In this embodiment, the first via 1401 corresponds to the inner 1st layer, 2nd layer conductive portion. The second via 1402 corresponds to the outer 2nd layer, 3rd layer conductive portion. The third via 1403 corresponds to the inner 3rd layer, 4th layer conductive portion. The fourth via 1404 corresponds to the outer 4th layer, 7th layer conductive portion. The fifth via 1405 corresponds to the inner 7th layer, 8th layer conductive portion. The sixth via 1406 corresponds to the outer 8th layer, 9th layer conductive portion. The seventh via 1407 corresponds to the inner 9th layer, 10th layer conductive portion.

[0067] Next, a method of connecting the first positive spiral portion 121 formed in each of the first wiring layer 1001, the second wiring layer 1002, the third wiring layer 1003, the fourth wiring layer 1004, the seventh wiring layer 1007, the eighth wiring layer 1008, the ninth wiring layer 1009 and the tenth wiring layer 1010 will be described. In the following description, the first positive spiral portion 121 formed in each of the first wiring layer 1001, the second wiring layer 1002, the third wiring layer 1003, the fourth wiring layer 1004, the seventh wiring layer 1007, the eighth wiring layer 1008, the ninth wiring layer 1009, and the tenth wiring layer 1010 will also be referred to as the first spiral portion 1201, the second spiral portion 1202, the third spiral portion 1203, the fourth spiral portion 1204, the seventh spiral portion 1207, the eighth spiral portion 1208, the ninth spiral portion 1209, and the tenth spiral portion 1210, respectively.

[0068] In first forward spiral portion 121, the portions formed in each wiring layer 102 are electrically connected to each other via first via 1401, second via 1402, third via 1403, fourth via 1404, fifth via 1405, sixth via 1406, and seventh via 1407. Specifically, as shown in FIG. 9 , first spiral portion 1201 and second spiral portion 1202 are connected to each other via first via 1401. Second spiral portion 1202 and third spiral portion 1203 are connected to each other via second via 1402. Third spiral portion 1203 and fourth spiral portion 1204 are connected to each other via third via 1403. Fourth spiral portion 1204 and seventh spiral portion 1207 are connected to each other via fourth via 1404. Seventh spiral portion 1207 and eighth spiral portion 1208 are connected to each other via fifth via 1405. The eighth spiral portion 1208 and the ninth spiral portion 1209 are connected via a sixth via 1406. The ninth spiral portion 1209 and the tenth spiral portion 1210 are connected via a seventh via 1407.

[0069] As described above, in this embodiment, the first spiral portion 1201, the second spiral portion 1202, the third spiral portion 1203, the fourth spiral portion 1204, the seventh spiral portion 1207, the eighth spiral portion 1208, the ninth spiral portion 1209 and the tenth spiral portion 1210 are electrically connected via the first via 1401, the second via 1402, the third via 1403, the fourth via 1404, the fifth via 1405, the sixth via 1406 and the seventh via 1407.

[0070] The first spiral portion 1201 and the second spiral portion 1202 are connected by a first via 1401 formed inside the first forward spiral portion 121. The second spiral portion 1202 and the third spiral portion 1203 are connected by a second via 1402 formed outside the first forward spiral portion 121. The third spiral portion 1203 and the fourth spiral portion 1204 are connected by a third via 1403 formed inside the first forward spiral portion 121. The fourth spiral portion 1204 and the seventh spiral portion 1207 are connected by a fourth via 1404 formed outside the first forward spiral portion 121. The seventh spiral portion 1207 and the eighth spiral portion 1208 are connected by a fifth via 1405 formed inside the first forward spiral portion 121. The eighth spiral portion 1208 and the ninth spiral portion 1209 are connected by a sixth via 1406 formed on the outside of the first forward spiral portion 121. The ninth spiral portion 1209 and the tenth spiral portion 1210 are connected by a seventh via 1407 formed on the inside of the first forward spiral portion 121.

[0071] In this way, first positive spiral portion 121 formed in each wiring layer 102 is electrically connected by first via 1401 to seventh via 1407 formed alternately inside and outside first positive spiral portion 121.

[0072] Furthermore, first counter-spiral portions 122 formed in each wiring layer 102 are electrically connected by first vias 1401 to seventh vias 1407 formed alternately inside and outside first counter-spiral portions 122. Second forward spiral portions 131 formed in each wiring layer 102 are electrically connected by first vias 1401 to seventh vias 1407 formed alternately inside and outside second forward spiral portions 131. Second counter-spiral portions 132 formed in each wiring layer 102 are electrically connected by first vias 1401 to seventh vias 1407 formed alternately inside and outside second counter-spiral portions 132.

[0073] The reason why first vias 1401 to seventh vias 1407 are alternately formed on the inside and outside of first forward spiral portion 121, first counter spiral portion 122, second forward spiral portion 131, and second counter spiral portion 132 will be explained using first forward spiral portion 121. As described above, the first spiral portion 1201, second spiral portion 1202, third spiral portion 1203, fourth spiral portion 1204, seventh spiral portion 1207, eighth spiral portion 1208, ninth spiral portion 1209, and tenth spiral portion 1210 have the same coil winding direction (clockwise in this embodiment). The first spiral portion 1201, the second spiral portion 1202, the third spiral portion 1203, the fourth spiral portion 1204, the seventh spiral portion 1207, the eighth spiral portion 1208, the ninth spiral portion 1209 and the tenth spiral portion 1210 are formed so as to overlap in the normal direction Ds.

[0074] Therefore, adjacent spiral sections among the first spiral section 1201, the second spiral section 1202, the third spiral section 1203, the fourth spiral section 1204, the seventh spiral section 1207, the eighth spiral section 1208, the ninth spiral section 1209 and the tenth spiral section 1210 are formed in a clockwise spiral direction, with the spiral direction alternating between the outside-to-inside direction and the inside-to-outside direction, as shown in Figure 10.

[0075] For example, first spiral portion 1201 is formed by winding a coil from the outside to the inside. In this case, second spiral portion 1202 formed in second wiring layer 1002 adjacent to first wiring layer 1001 on which first spiral portion 1201 is formed is formed by winding a coil from the inside to the outside. And third spiral portion 1203 formed in third wiring layer 1003 adjacent to second wiring layer 1002 on which second spiral portion 1202 is formed is formed by winding a coil from the outside to the inside.

[0076] In this embodiment, the first positive spiral portion 121 is formed in the first wiring layer 1001 to the tenth wiring layer 1010, excluding the fifth wiring layer 1005 and the sixth wiring layer 1006, that is, the first wiring layer 1001, the second wiring layer 1002, the third wiring layer 1003, the fourth wiring layer 1004, the seventh wiring layer 1007, the eighth wiring layer 1008, the ninth wiring layer 1009 and the tenth wiring layer 1010.

[0077] 9, to clearly show the electrical connection between each wiring layer 102 and first positive spiral portion 121, each wiring layer 102, first positive spiral portion 121, and via 140 are shown schematically. Wiring layers 102 on which first positive spiral portion 121 is formed are indicated by solid lines, and wiring layers 102 on which first positive spiral portion 121 is not formed are indicated by dashed lines. Electrical connections between first spiral portion 1201, second spiral portion 1202, third spiral portion 1203, fourth spiral portion 1204, seventh spiral portion 1207, eighth spiral portion 1208, ninth spiral portion 1209, and tenth spiral portion 1210 are indicated by bold lines.

[0078] 10, in each wiring layer 102 in which the first positive spiral portion 121 is formed, vias 140 that appear when viewed from one step back in the normal direction Ds are indicated by solid lines, and vias 140 that do not appear are indicated by dashed lines. Also, the electrical connections between the vias 140 are indicated by dashed lines.

[0079] Next, the reason why the first positive spiral portion 121 is not formed in the fifth wiring layer 1005 and the sixth wiring layer 1006 among the first wiring layer 1001 to the tenth wiring layer 1010 will be explained.

[0080] If the first positive spiral portion 121 is to be formed in the fifth wiring layer 1005 and the sixth wiring layer 1006, a via 140 must be added to the printed circuit board 100 to connect the first positive spiral portion 121 formed in the fifth wiring layer 1005 and the sixth wiring layer 1006.

[0081] Specifically, when first positive spiral portion 121 is formed on fifth wiring layer 1005 and sixth wiring layer 1006, printed circuit board 100 requires via 140 for connecting fourth spiral portion 1204 to first positive spiral portion 121 formed on fifth wiring layer 1005. Also, printed circuit board 100 requires via 140 for connecting first positive spiral portion 121 formed on fifth wiring layer 1005 to first positive spiral portion 121 formed on sixth wiring layer 1006. Furthermore, printed circuit board 100 requires via 140 for connecting first positive spiral portion 121 formed on sixth wiring layer 1006 to seventh spiral portion 1207.

[0082] 11 , a board having first positive spiral portion 121 formed on fifth wiring layer 1005 and sixth wiring layer 1006 is designated comparative printed circuit board 100A. In comparative printed circuit board 100A, first positive spiral portion 121 formed on fifth wiring layer 1005 is designated fifth spiral portion 1205, and first positive spiral portion 121 formed on sixth wiring layer 1006 is designated sixth spiral portion 1206. Also, via 140 connecting fourth spiral portion 1204 and fifth spiral portion 1205 is designated eighth via 1408, and via 140 connecting fifth spiral portion 1205 and sixth spiral portion 1206 is designated ninth via 1409. When eighth via 1408 and ninth via 1409 are formed, fourth via 1404 connects sixth spiral portion 1206 and seventh spiral portion 1207.

[0083] 11, eighth via 1408 connecting fourth spiral portion 1204 and fifth spiral portion 1205 is formed to penetrate the core layer made up of six layers of through-hole substrates, similar to third via 1403, fourth via 1404, and fifth via 1405. Furthermore, ninth via 1409 connecting fifth spiral portion 1205 and sixth spiral portion 1206 is also formed to penetrate the core layer made up of six layers of through-hole substrates, similar to third via 1403, fourth via 1404, and fifth via 1405.

[0084] Here, the first spiral portion 1201 to the tenth spiral portion 1210 need to be formed so as to overlap with each other in the normal direction Ds. The first via 1401 to the ninth via 1409 need to be formed at positions that do not overlap with the first forward spiral portion 121 in the normal direction Ds, as shown in FIG.

[0085] Furthermore, as described above, first via 1401 to ninth via 1409 need to be formed alternately inside and outside first forward spiral portion 121. For this reason, eighth via 1408, which is next to third via 1403 formed inside first forward spiral portion 121, is formed outside first forward spiral portion 121, as shown in Fig. 12. Furthermore, ninth via 1409, which is next to eighth via 1408 formed outside first forward spiral portion 121, is formed inside first forward spiral portion 121.

[0086] When forming first positive spiral portion 121 in all ten wiring layers 102 of comparative printed circuit board 100A, first positive spiral portion 121 needs to be formed at a position that does not overlap first via 1401 to ninth via 1409 in normal direction Ds. This limits the surface area of wiring layer 102 in which first positive spiral portion 121 can be formed. Specifically, adding ninth via 1409 to comparative printed circuit board 100A reduces the surface area in which a spiral coil can be formed inside first positive spiral portion 121 in wiring layer 102. In other words, compared to printed circuit board 100 of the present embodiment, comparative printed circuit board 100A has a smaller surface area in wiring layer 102 in which first positive spiral portion 121 can be formed.

[0087] As a result, in comparative printed circuit board 100A, compared to printed circuit board 100 of the present embodiment, the addition of ninth via 1409 inside first positive spiral portion 121 reduces the number of coil turns that can be formed inside first positive spiral portion 121. For example, by adding ninth via 1409, the number of coil turns that can be formed inside first positive spiral portion 121 is reduced from three to two. As a result, first positive spiral portion 121 in comparative printed circuit board 100A is formed by a coil wound 20 times. In other words, the total number of coil turns that make up first positive spiral portion 121 is 20.

[0088] Incidentally, as the rotating flat plate 30 rotates, the first voltage value V1 generated in the first receiving coil 120 and the second voltage value V2 generated in the second receiving coil 130 change depending on the total number of turns in the first receiving coil 120 and the second receiving coil 130. Specifically, the first voltage value V1 and the second voltage value V2 increase as the total number of turns in the first receiving coil 120 and the second receiving coil 130 increases.

[0089] Therefore, the comparative printed circuit board 100A, in which the total number of turns of the coil constituting the first positive spiral portion 121 is reduced compared to the printed circuit board 100 of this embodiment, has smaller first voltage value V1 and second voltage value V2 compared to the printed circuit board 100 of this embodiment.

[0090] In contrast, the position detection device S1 of this embodiment includes a printed circuit board 100, which is a multilayer board in which ten wiring layers 102 and insulating layers 101 arranged between each of the ten wiring layers 102 are alternately stacked. The ten wiring layers 102 are electrically connected by vias 140 formed to penetrate at least one of the insulating layers 101.

[0091] The first receiver coil 120 and the second receiver coil 130 are wound three times around each of the ten wiring layers 102, namely, the first wiring layer 1001, the second wiring layer 1002, the third wiring layer 1003, the fourth wiring layer 1004, the seventh wiring layer 1007, the eighth wiring layer 1008, the ninth wiring layer 1009, and the tenth wiring layer 1010, excluding the fifth wiring layer 1005 and the sixth wiring layer 1006. The first receiver coil 120 and the second receiver coil 130 formed on the first wiring layer 1001, the second wiring layer 1002, the third wiring layer 1003, the fourth wiring layer 1004, the seventh wiring layer 1007, the eighth wiring layer 1008, the ninth wiring layer 1009, and the tenth wiring layer 1010, respectively, are connected through vias 140.

[0092] This makes it possible to reduce the number of vias 140 for connecting the first receiver coil 120 and the second receiver coil 130 compared to when the first receiver coil 120 and the second receiver coil 130 are formed on all ten wiring layers 102. As a result, the surface area on which the first receiver coil 120 and the second receiver coil 130 can be formed can be increased on each wiring layer 102 on which the first receiver coil 120 and the second receiver coil 130 are formed.

[0093] Therefore, it is easy to increase the number of turns of the coils constituting the first receiver coil 120 and the second receiver coil 130 in each wiring layer 102 that forms the first receiver coil 120 and the second receiver coil 130. Increasing the number of turns of the coils constituting the first receiver coil 120 and the second receiver coil 130 also makes it possible to increase the total number of turns of the coils of the first receiver coil 120 and the second receiver coil 130 on the entire printed circuit board 100.

[0094] Furthermore, by increasing the total number of turns of each of the first receiving coil 120 and the second receiving coil 130, the first voltage value V1 generated in the first receiving coil 120 and the second voltage value V2 generated in the second receiving coil 130 can be increased.

[0095] (Second embodiment) Next, a second embodiment will be described with reference to Figures 13 and 14. In this embodiment, the configuration of the printed circuit board 100 is different from that of the first embodiment. Other than this, the second embodiment is similar to the first embodiment. Therefore, in this embodiment, differences from the first embodiment will be mainly described, and descriptions of similar parts to the first embodiment may be omitted.

[0096] The printed circuit board 100 of this embodiment has a four-layer through-hole board in which insulating layers 101 and wiring layers 102 are alternately stacked. The printed circuit board 100 is configured as an eight-layer buildup board in which two insulating layers 101 and two wiring layers 102 are further stacked on each side of the through-hole board in the normal direction Ds. The printed circuit board 100 of this embodiment is an eight-layer buildup board in which two build layers are arranged on each side of a four-layer core layer in the normal direction Ds. The printed circuit board 100 of this embodiment has a first wiring layer 1001 to an eighth wiring layer 1008, as shown in FIG. 13.

[0097] Furthermore, the first receiver coil 120 and the second receiver coil 130 are wound three times in the same direction on each of the eight wiring layers 102 of the printed circuit board 100, except for the two central wiring layers 102. That is, the first receiver coil 120 and the second receiver coil 130 are wound three times on the first wiring layer 1001, the second wiring layer 1002, the third wiring layer 1003, the sixth wiring layer 1006, the seventh wiring layer 1007, and the eighth wiring layer 1008, except for the fourth wiring layer 1004 and the fifth wiring layer 1005.

[0098] The printed circuit board 100 also has a first via 1401 that connects the first wiring layer 1001 and the second wiring layer 1002, and a second via 1402 that connects the second wiring layer 1002 and the third wiring layer 1003. The printed circuit board 100 also has a third via 1403 that connects the third wiring layer 1003, the fourth wiring layer 1004, the fifth wiring layer 1005, and the sixth wiring layer 1006. The printed circuit board 100 also has a fourth via 1404 that connects the sixth wiring layer 1006 and the seventh wiring layer 1007, and a fifth via 1405 that connects the seventh wiring layer 1007 and the eighth wiring layer 1008.

[0099] The first via 1401 is formed to penetrate one insulating layer 101 between the first wiring layer 1001 and the second wiring layer 1002 in the normal direction Ds. The second via 1402 is formed to penetrate one insulating layer 101 between the second wiring layer 1002 and the third wiring layer 1003 in the normal direction Ds. The third via 1403 is formed to penetrate three insulating layers 101 between the third wiring layer 1003 to the sixth wiring layer 1006 in the normal direction Ds. The fourth via 1404 is formed to penetrate one insulating layer 101 between the sixth wiring layer 1006 and the seventh wiring layer 1007 in the normal direction Ds. The fifth via 1405 is formed to penetrate one insulating layer 101 between the seventh wiring layer 1007 and the eighth wiring layer 1008 in the normal direction Ds.

[0100] That is, vias 140 include a first via 1401, a second via 1402, a fourth via 1404, and a fifth via 1405 formed to penetrate one insulating layer 101, and a third via 1403 formed to penetrate three insulating layers 101. Third via 1403 functions as a first conductive portion formed to penetrate the three insulating layers 101. First via 1401, second via 1402, fourth via 1404, and fifth via 1405 function as a second conductive portion formed to penetrate one insulating layer 101.

[0101] 13 and 14, the first via 1401 and the fifth via 1405 are formed at positions where they overlap with each other in the normal direction Ds. The first via 1401 and the fifth via 1405 are formed at positions where they do not overlap with the second via 1402, the third via 1403, and the fourth via 1404 in the normal direction Ds.

[0102] The second via 1402 is formed at a position that does not overlap with the third via 1403 and the fourth via 1404 in the normal direction Ds.

[0103] The third via 1403 and the fourth via 1404 are formed at positions where they do not overlap in the normal direction Ds.

[0104] 14, the first via 1401, the second via 1402, the third via 1403, the fourth via 1404, and the fifth via 1405 are formed at positions that do not overlap with the first receiving coil 120 and the second receiving coil 130 in the normal direction Ds. Specifically, the first via 1401, the third via 1403, and the fifth via 1405 are formed inside the spiral shape of the first receiving coil 120 and the second receiving coil 130. In contrast, the second via 1402 and the fourth via 1404 are formed outside the spiral shape of the first receiving coil 120 and the second receiving coil 130. The first to fifth vias 1401 to 1405 are arranged alternately on the inside and outside of the first and second receiver coils 120 and 130, with vias 1401, 1403, and 1405 formed inside the coils and vias 1402 and 1404 formed outside the coils.

[0105] The first receiver coil 120 formed in the first wiring layer 1001, the second wiring layer 1002, the third wiring layer 1003, the sixth wiring layer 1006, the seventh wiring layer 1007, and the eighth wiring layer 1008 is electrically connected by first vias 1401 to fifth vias 1405 formed alternately inside and outside the first receiver coil 120. The second receiver coil 130 formed in the first wiring layer 1001, the second wiring layer 1002, the third wiring layer 1003, the sixth wiring layer 1006, the seventh wiring layer 1007, and the eighth wiring layer 1008 is electrically connected by the first vias 1401 to fifth vias 1405 formed alternately inside and outside the second receiver coil 130.

[0106] For example, the first receiver coil 120 formed on the first wiring layer 1001 and the first receiver coil 120 formed on the second wiring layer 1002 are connected by a first via 1401 formed inside the first receiver coil 120. The first receiver coil 120 formed on the second wiring layer 1002 and the first receiver coil 120 formed on the third wiring layer 1003 are connected by a second via 1402 formed outside the first receiver coil 120. The first receiver coil 120 formed on the third wiring layer 1003 and the first receiver coil 120 formed on the sixth wiring layer 1006 are connected by a third via 1403 formed inside the first receiver coil 120. The first receiver coil 120 formed on the sixth wiring layer 1006 and the first receiver coil 120 formed on the seventh wiring layer 1007 are connected by a fourth via 1404 formed outside the first receiver coil 120. The first receiver coil 120 formed in the seventh wiring layer 1007 and the first receiver coil 120 formed in the eighth wiring layer 1008 are connected by a fifth via 1405 formed inside the first receiver coil 120.

[0107] This makes it possible to reduce the number of vias 140 for connecting the first receiver coil 120 and the second receiver coil 130 compared to when the first receiver coil 120 and the second receiver coil 130 are formed on all eight wiring layers 102. Therefore, it is possible to increase the surface area on which the first receiver coil 120 and the second receiver coil 130 can be formed, on each wiring layer 102 on which the first receiver coil 120 and the second receiver coil 130 are formed.

[0108] Therefore, it is easy to increase the number of turns of the coils constituting the first receiver coil 120 and the second receiver coil 130 in each wiring layer 102 that forms the first receiver coil 120 and the second receiver coil 130. Increasing the number of turns of the coils constituting the first receiver coil 120 and the second receiver coil 130 also makes it possible to increase the total number of turns of the coils of the first receiver coil 120 and the second receiver coil 130 on the entire printed circuit board 100.

[0109] Furthermore, by increasing the total number of turns of the coils that make up the first receiving coil 120 and the second receiving coil 130, the first voltage value V1 generated in the first receiving coil 120 and the second voltage value V2 generated in the second receiving coil 130 can be increased.

[0110] (Third embodiment) Next, a third embodiment will be described with reference to Figures 15 and 16. In this embodiment, the configuration of the printed circuit board 100 is different from that of the first embodiment. Other than this, the third embodiment is similar to the first embodiment. Therefore, in this embodiment, differences from the first embodiment will be mainly described, and descriptions of similar parts to the first embodiment may be omitted.

[0111] The printed circuit board 100 of this embodiment has a four-layer through-hole board in which insulating layers 101 and wiring layers 102 are alternately stacked. The printed circuit board 100 is configured as a six-layer build-up board in which one insulating layer 101 and one wiring layer 102 are further stacked on each of one side and the other side of the through-hole board in the normal direction Ds. The printed circuit board 100 of this embodiment has a first wiring layer 1001 to a sixth wiring layer 1006, as shown in FIG.

[0112] Furthermore, the first receiver coil 120 and the second receiver coil 130 are wound three times in the same direction on each of the six wiring layers 102 of the printed circuit board 100, except for the two central wiring layers 102. That is, the first receiver coil 120 and the second receiver coil 130 are wound three times on each of the first wiring layer 1001, the second wiring layer 1002, the fifth wiring layer 1005, and the sixth wiring layer 1006, except for the third wiring layer 1003 and the fourth wiring layer 1004.

[0113] The printed circuit board 100 also has a first via 1401 that connects the first wiring layer 1001 and the second wiring layer 1002, and a second via 1402 that connects the second wiring layer 1002, the third wiring layer 1003, the fourth wiring layer 1004, and the fifth wiring layer 1005. The printed circuit board 100 also has a third via 1403 that connects the fifth wiring layer 1005 and the sixth wiring layer 1006.

[0114] The first via 1401 is formed to penetrate one insulating layer 101 between the first wiring layer 1001 and the second wiring layer 1002 in the normal direction Ds. The second via 1402 is formed to penetrate three insulating layers 101 between the second wiring layer 1002 and the fifth wiring layer 1005 in the normal direction Ds. The third via 1403 is formed to penetrate one insulating layer 101 between the fifth wiring layer 1005 and the sixth wiring layer 1006 in the normal direction Ds.

[0115] That is, via 140 includes first via 1401 and third via 1403 formed to penetrate one insulating layer 101, and second via 1402 formed to penetrate three insulating layers 101. Second via 1402 functions as a first conductive portion formed to penetrate three insulating layers 101. First via 1401 and third via 1403 function as a second conductive portion formed to penetrate one insulating layer 101.

[0116] The first via 1401, the second via 1402, and the third via 1403 are formed at positions that do not overlap with each other in the normal direction Ds.

[0117] 16, the first via 1401, the second via 1402, and the third via 1403 are formed at positions that do not overlap the first receiving coil 120 and the second receiving coil 130 in the normal direction Ds. Specifically, the first via 1401 and the third via 1403 are formed inside the spiral shape of the first receiving coil 120 and the second receiving coil 130. In contrast, the second via 1402 is formed outside the spiral shape of the first receiving coil 120 and the second receiving coil 130. The first vias 1401 to the third vias 1403 are formed alternately inside and outside the first receiving coil 120, with the vias 1401 and 1403 formed inside the first receiving coil 120 and the via 1402 formed outside the first receiving coil 120.

[0118] The first receiving coil 120 and the second receiving coil 130 formed in the first wiring layer 1001, the second wiring layer 1002, the fifth wiring layer 1005 and the sixth wiring layer 1006 are electrically connected by the first vias 1401 to the third vias 1403 formed alternately inside and outside the first receiving coil 120.

[0119] For example, the first receiver coil 120 formed on the first wiring layer 1001 and the first receiver coil 120 formed on the second wiring layer 1002 are connected by a first via 1401 formed inside the first receiver coil 120. The first receiver coil 120 formed on the second wiring layer 1002 and the first receiver coil 120 formed on the fifth wiring layer 1005 are connected by a second via 1402 formed outside the first receiver coil 120. The first receiver coil 120 formed on the fifth wiring layer 1005 and the first receiver coil 120 formed on the sixth wiring layer 1006 are connected by a third via 1403 formed inside the first receiver coil 120.

[0120] This makes it possible to reduce the number of vias 140 for connecting the first receiver coil 120 and the second receiver coil 130 compared to when the first receiver coil 120 and the second receiver coil 130 are formed on all six wiring layers 102. Therefore, it is possible to increase the surface area on which the first receiver coil 120 and the second receiver coil 130 can be formed, on each wiring layer 102 on which the first receiver coil 120 and the second receiver coil 130 are formed.

[0121] Therefore, it is easy to increase the number of turns of the coils constituting the first receiver coil 120 and the second receiver coil 130 in each wiring layer 102 that forms the first receiver coil 120 and the second receiver coil 130. Increasing the number of turns of the coils constituting the first receiver coil 120 and the second receiver coil 130 also makes it possible to increase the total number of turns of the coils of the first receiver coil 120 and the second receiver coil 130 on the entire printed circuit board 100.

[0122] Furthermore, by increasing the total number of turns of the coils that make up the first receiving coil 120 and the second receiving coil 130, the first voltage value V1 generated in the first receiving coil 120 and the second voltage value V2 generated in the second receiving coil 130 can be increased.

[0123] (Fourth embodiment) Next, a fourth embodiment will be described with reference to FIG. 17. In this embodiment, the pattern shapes of the first receiving coil 120 and the second receiving coil 130 are different from those of the first embodiment. Other than this, the fourth embodiment is similar to the first embodiment. Therefore, in this embodiment, differences from the first embodiment will be mainly described, and descriptions of similar parts to the first embodiment may be omitted.

[0124] As shown in Figure 17, the first receiving coil 120 and the second receiving coil 130 of this embodiment are formed in an arc frame shape with the coil wound four times in the normal direction Ds and the longitudinal direction being in one direction (i.e., the circumferential direction of the printed circuit board 100).

[0125] The first receiver coil 120 and the second receiver coil 130 are disposed inside the transmitter coil 110 in the normal direction Ds. The first receiver coil 120 and the second receiver coil 130 are configured by appropriately connecting different wiring layers 102 through vias 140 so as not to interfere with each other (i.e., not to overlap in the same layer).

[0126] The first receiver coil 120 is formed in a pattern shape that describes a sine curve so as to form a closed-loop sine wave. The first receiver coil 120 is formed by winding the coil four times, and each winding is offset by a predetermined amount in the amplitude direction for each winding. The first receiver coil 120 is formed by winding the coil four times, and each winding is connected in series and is formed in a single stroke.

[0127] The second receiver coil 130 is formed in a pattern shape that describes a cosine curve so as to form a closed-loop cosine wave. The second receiver coil 130 is formed by winding the coil four times, and each winding is offset by a predetermined amount in the amplitude direction. The first receiver coil 120 is formed by winding the coil four times, and each winding is connected in series and formed in a single stroke.

[0128] The first and second receiver coils 120 and 130, which are formed by multiple turns, may be formed with a phase difference. The first receiver coil 120 may be formed in a pattern shape that describes a cosine curve so as to form a closed-loop cosine wave. In this case, the second receiver coil 130 is formed in a pattern shape that describes a sine curve so as to form a closed-loop sine wave.

[0129] The first receiver coil 120 and the second receiver coil 130 are formed on the first wiring layer 1001, the second wiring layer 1002, the third wiring layer 1003, the fourth wiring layer 1004, the seventh wiring layer 1007, the eighth wiring layer 1008, the ninth wiring layer 1009, and the tenth wiring layer 1010 of the ten wiring layers 102. In other words, the first receiver coil 120 and the second receiver coil 130 are formed on the wiring layers 102 excluding the fifth wiring layer 1005 and the sixth wiring layer 1006 of the ten wiring layers 102.

[0130] Among the ten wiring layers 102, the first receiving coil 120 and the second receiving coil 130 are formed on the adjacent wiring layers 102, and the adjacent wiring layers 102 are connected by vias 140.

[0131] For example, the first receiver coil 120 formed on the first wiring layer 1001 and the first receiver coil 120 formed on the second wiring layer 1002 are connected by a via 140 formed between the first wiring layer 1001 and the second wiring layer 1002. The first receiver coil 120 formed on the second wiring layer 1002 and the first receiver coil 120 formed on the third wiring layer 1003 are connected by a via 140 formed between the second wiring layer 1002 and the third wiring layer 1003. The first receiver coil 120 formed on the third wiring layer 1003 and the first receiver coil 120 formed on the fourth wiring layer 1004 are connected by a via 140 formed between the third wiring layer 1003 and the fourth wiring layer 1004.

[0132] The first receiving coil 120 formed in the fifth wiring layer 1005 and the first receiving coil 120 formed in the seventh wiring layer 1007 are connected by a via 140 formed through the fifth wiring layer 1005 to the seventh wiring layer 1007.

[0133] The first receiver coil 120 formed on the seventh wiring layer 1007 and the first receiver coil 120 formed on the eighth wiring layer 1008 are connected by a via 140 formed between the seventh wiring layer 1007 and the eighth wiring layer 1008. The first receiver coil 120 formed on the eighth wiring layer 1008 and the first receiver coil 120 formed on the ninth wiring layer 1009 are connected by a via 140 formed between the eighth wiring layer 1008 and the ninth wiring layer 1009. The first receiver coil 120 formed on the ninth wiring layer 1009 and the first receiver coil 120 formed on the tenth wiring layer 1010 are connected by a via 140 formed between the ninth wiring layer 1009 and the tenth wiring layer 1010.

[0134] In Figure 17, for ease of viewing, the first receiving coil 120 and the second receiving coil 130 formed on adjacent wiring layers 102 among the first wiring layer 1001 to the tenth wiring layer 1010 are shown using solid lines and dashed lines.

[0135] This makes it possible to reduce the number of vias 140 for connecting the first receiver coil 120 and the second receiver coil 130 compared to when the first receiver coil 120 and the second receiver coil 130 are formed on all ten wiring layers 102. In each wiring layer 102 on which the first receiver coil 120 and the second receiver coil 130 are formed, the surface area on which the first receiver coil 120 and the second receiver coil 130 can be formed can be increased.

[0136] Therefore, it is easy to increase the number of turns of the coils constituting the first receiver coil 120 and the second receiver coil 130 in each wiring layer 102 that forms the first receiver coil 120 and the second receiver coil 130. Increasing the number of turns of each of the first receiver coil 120 and the second receiver coil 130 also makes it possible to increase the total number of turns of each of the first receiver coil 120 and the second receiver coil 130 on the entire printed circuit board 100.

[0137] Furthermore, by increasing the total number of turns of the coils that make up the first receiving coil 120 and the second receiving coil 130, the first voltage value V1 generated in the first receiving coil 120 and the second voltage value V2 generated in the second receiving coil 130 can be increased.

[0138] (Other embodiments) Representative embodiments of the present disclosure have been described above, but the present disclosure is not limited to the above-described embodiments and can be modified in various ways, for example, as follows.

[0139] In the above embodiment, the position detection device S1 is applied to an electrification system mounted on a vehicle, but the present invention is not limited to this. For example, the position detection device S1 may be mounted on a device other than a vehicle.

[0140] In the above embodiment, the position detector S1 detects the rotation angle of a rotating detection object, but the present invention is not limited to this. For example, the position detector S1 may detect the displacement of a linearly moving detection object.

[0141] In the above-described embodiment, the first receiving coil 120 and the second receiving coil 130 are wound two or three times, but the present invention is not limited to this. For example, the first receiving coil 120 and the second receiving coil 130 may be wound four or more times.

[0142] In the above-described embodiment, the printed circuit board 100 is configured as a 6-layer, 8-layer, or 10-layer build-up board, but the number of layers of the printed circuit board 100 is not limited to this. The number of layers of the printed circuit board 100 can be changed as appropriate.

[0143] In the above-described embodiment, an example has been described in which the printed circuit board 100 is a six-layer, eight-layer, or ten-layer buildup board, and the first receiver coil 120 and the second receiver coil 130 are formed on wiring layers 102 other than the two central wiring layers 102. However, this is not limiting. For example, the first receiver coil 120 and the second receiver coil 130 may be configured not to be formed on wiring layers 102 other than the two central wiring layers 102 in a six-layer, eight-layer, or ten-layer buildup board. Furthermore, the first receiver coil 120 and the second receiver coil 130 may be configured not to be formed on one or three or more wiring layers 102 in a six-layer, eight-layer, or ten-layer buildup board.

[0144] In the above-described embodiments, it goes without saying that the elements constituting the embodiments are not necessarily essential unless they are specifically stated as essential or are clearly considered essential in principle.

[0145] In the above-described embodiments, when numerical values such as the number, values, amounts, ranges, etc. of components of the embodiments are mentioned, they are not limited to the specific numbers unless they are specifically stated as essential or are clearly limited to a specific number in principle.

[0146] In the above-described embodiments, when referring to the shapes, positional relationships, etc. of components, etc., the shapes, positional relationships, etc. are not limited to those unless otherwise specified or when they are fundamentally limited to specific shapes, positional relationships, etc.

[0147] The controller and method of the present disclosure may be implemented on a special-purpose computer by configuring a processor and memory programmed to perform one or more functions embodied in a computer program. The controller and method of the present disclosure may be implemented on a special-purpose computer by configuring a processor with one or more dedicated hardware logic circuits. The controller and method of the present disclosure may be implemented on one or more special-purpose computers configured with a processor and memory programmed to perform one or more functions in combination with a processor configured with one or more hardware logic circuits. The computer program may also be stored on a computer-readable non-transitory tangible storage medium as instructions executed by a computer.

[0148] (Features of the present invention) [Claim 1] A position detection device, A substrate (100); a transmitting coil (110) formed on the substrate; a first receiving coil (120) and a second receiving coil (130) formed on the substrate and inductively coupled by electromagnetic induction caused by energization of the transmitting coil; The substrate is a multilayer substrate in which six or more wiring layers (102, 1001 to 1010) and insulating layers (101) arranged between each of the six or more wiring layers are alternately stacked, and has a plurality of conductive through parts (140, 1401 to 1407) formed by penetrating at least one of the insulating layers and connecting the six or more wiring layers, the first receiving coil and the second receiving coil are wound a plurality of times on each of the wiring layers except for at least one wiring layer among the six or more wiring layers, and are connected via the plurality of conductive through parts; A position detection device in which at least one of the plurality of conductive through parts is disposed inside the first receiving coil and the second receiving coil.

[0149] [Claim 2] The substrate has 10 wiring layers; 2. The position detection device according to claim 1, wherein the first receiving coil and the second receiving coil are wound a plurality of times on each of the wiring layers except for at least one of the ten wiring layers.

[0150] [Claim 3] The plurality of conductive through portions include first conductive portions (1403, 1404, 1405) formed by penetrating five of the insulating layers, and second conductive portions (1401, 1402, 1406, 1407) formed by penetrating one of the insulating layers, three first conductive portions are formed on the substrate, and at least one of the first conductive portions is disposed inside the first receiving coil and the second receiving coil; 3. The position detection device according to claim 2, wherein four second conductive portions are formed on the substrate, and at least one of the second conductive portions is disposed inside the first receiving coil and the second receiving coil.

[0151] [Claim 4] When the ten wiring layers are a first wiring layer (1001), a second wiring layer (1002), a third wiring layer (1003), a fourth wiring layer (1004), a fifth wiring layer (1005), a sixth wiring layer (1006), a seventh wiring layer (1007), an eighth wiring layer (1008), a ninth wiring layer (1009), and a tenth wiring layer (1010), the first receiving coil and the second receiving coil are wound a plurality of times around each of the first wiring layer, the second wiring layer, the third wiring layer, the fourth wiring layer, the seventh wiring layer, the eighth wiring layer, the ninth wiring layer, and the tenth wiring layer, excluding the fifth wiring layer and the sixth wiring layer; The three first conductive portions formed on the substrate include an inner three-layer, four-layer conductive portion (1403) that connects the first and second receiver coils formed in the third and fourth wiring layers, respectively, and is arranged inside the first and second receiver coils, an outer four-layer, seven-layer conductive portion (1404) that connects the first and second receiver coils formed in the fourth and seventh wiring layers, respectively, and is arranged outside the first and second receiver coils, and an inner seven-layer, eight-layer conductive portion (1405) that connects the first and second receiver coils formed in the seventh and eighth wiring layers, respectively, and is arranged inside the first and second receiver coils, The position detection device of claim 3, wherein the four second conductive portions formed on the substrate include an inner 1-layer, 2-layer conductive portion (1401) that connects the first receiving coil and the second receiving coil formed in the first wiring layer and the second wiring layer, respectively, and is arranged inside the first receiving coil and the second receiving coil, an outer 2-layer, 3-layer conductive portion (1402) that connects the first receiving coil and the second receiving coil formed in the second wiring layer and the third wiring layer, respectively, and is arranged outside the first receiving coil and the second receiving coil, an outer 8-layer, 9-layer conductive portion (1406) that connects the first receiving coil and the second receiving coil formed in the eighth wiring layer and the ninth wiring layer, respectively, and is arranged outside the first receiving coil and the second receiving coil, and an inner 9-layer, 10-layer conductive portion (1407) that connects the first receiving coil and the second receiving coil formed in the ninth wiring layer and the tenth wiring layer, respectively, and is arranged inside the first receiving coil and the second receiving coil.

[0152] [Claim 5] the inner one-layer / two-layer conductive portion and the inner nine-layer / ten-layer conductive portion are arranged at overlapping positions in a normal direction Ds relative to a surface direction of the substrate, 5. The position detection device according to claim 4, wherein the outer two-layer / three-layer conductive portion and the outer eight-layer / nine-layer conductive portion are arranged in overlapping positions in the normal direction.

[0153] [Claim 6] The substrate has eight wiring layers; 2. The position detection device according to claim 1, wherein the first receiving coil and the second receiving coil are wound a plurality of times on each of the eight wiring layers except for at least one wiring layer.

[0154] [Claim 7] The plurality of conductive through portions include a first conductive portion (1403) formed by penetrating three of the insulating layers, and a second conductive portion (1401, 1402, 1404, 1405) formed by penetrating one of the insulating layers, the first conductive portion is formed on the substrate and is disposed inside the first receiving coil and the second receiving coil; 7. The position detection device according to claim 6, wherein four second conductive portions are formed on the substrate, and at least one of the second conductive portions is disposed inside the first receiving coil and the second receiving coil.

[0155] [Claim 8] The substrate has six wiring layers; 2. The position detection device according to claim 1, wherein the first receiving coil and the second receiving coil are wound a plurality of times on each of the wiring layers except for at least one of the six wiring layers.

[0156] [Claim 9] The plurality of conductive through portions include a first conductive portion (1402) formed by penetrating three of the insulating layers and a second conductive portion (1401, 1403) formed by penetrating one of the insulating layers, the first conductive portion is formed on the substrate and is disposed inside the first receiving coil and the second receiving coil; 9. The position detection device according to claim 8, wherein two second conductive portions are formed on the substrate, and at least one of the second conductive portions is disposed inside the first receiving coil and the second receiving coil.

[0157] [Claim 10] 10. A position detection device according to claim 6, wherein the first receiving coil and the second receiving coil are formed on each of the six or more wiring layers except for the two central wiring layers.

[0158] [Claim 11] 11. The position detection device according to claim 1, wherein the first receiving coil and the second receiving coil include a portion having a spiral pattern shape.

[0159] [Claim 12] 11. A position detection device as described in any one of claims 1 to 10, wherein one of the first receiving coil and the second receiving coil includes a pattern shape that describes a sine curve, and the other of the first receiving coil and the second receiving coil includes a pattern shape that describes a cosine curve.

[0160] [Claim 13] 10. A position detection device as described in any one of claims 1 to 9, comprising a detection unit (30) that generates an induced current by electromagnetic induction in response to the influence of the energized transmitting coil, and changes the induced electromotive force generated in the first receiving coil and the second receiving coil using the generated induced current.

[0161] [Claim 14] 14. The position detection device according to claim 13, further comprising a signal processing unit (210) that calculates the position of the detection unit based on the induced electromotive forces output by the first receiving coil and the second receiving coil. [Explanation of symbols]

[0162] 30 Detected object 100 boards 101 Insulating layer 102 wiring layer 110 Transmitting Coil 120 First receiving coil 130 Second receiving coil 140 Beer

Claims

1. A position detection device, a substrate (100); a transmitting coil (110) formed on the substrate; a first receiving coil (120) and a second receiving coil (130) formed on the substrate and inductively coupled by electromagnetic induction caused by energization of the transmitting coil; The substrate is a multilayer substrate in which ten wiring layers (102, 1001 to 1010) and insulating layers (101) arranged between each of the ten wiring layers are alternately stacked, and has a plurality of conductive penetration parts (140, 1401 to 1407) formed by penetrating at least one of the insulating layers and connecting the ten wiring layers; the first receiving coil and the second receiving coil are wound a plurality of times on each of the wiring layers except for at least one of the ten wiring layers, and are connected via the plurality of conductive through parts; The plurality of conductive through portions include first conductive portions (1403, 1404, 1405) formed by penetrating five of the insulating layers, and second conductive portions (1401, 1402, 1406, 1407) formed by penetrating one of the insulating layers, three first conductive portions are formed on the substrate, and at least one of the first conductive portions is disposed inside the first receiving coil and the second receiving coil; The position detection device includes four second conductive portions formed on the substrate, and at least one of the second conductive portions is disposed inside the first receiving coil and the second receiving coil.

2. When the ten wiring layers are, from one side to the other in the normal direction to the surface direction of the substrate, a first wiring layer (1001), a second wiring layer (1002), a third wiring layer (1003), a fourth wiring layer (1004), a fifth wiring layer (1005), a sixth wiring layer (1006), a seventh wiring layer (1007), an eighth wiring layer (1008), a ninth wiring layer (1009), and a tenth wiring layer (1010), the first receiving coil and the second receiving coil are wound a plurality of times around each of the first wiring layer, the second wiring layer, the third wiring layer, the fourth wiring layer, the seventh wiring layer, the eighth wiring layer, the ninth wiring layer, and the tenth wiring layer, excluding the fifth wiring layer and the sixth wiring layer; The three first conductive portions formed on the substrate include an inner three-layer, four-layer conductive portion (1403) that connects the first and second receiver coils formed in the third and fourth wiring layers, respectively, and is arranged inside the first and second receiver coils, an outer four-layer, seven-layer conductive portion (1404) that connects the first and second receiver coils formed in the fourth and seventh wiring layers, respectively, and is arranged outside the first and second receiver coils, and an inner seven-layer, eight-layer conductive portion (1405) that connects the first and second receiver coils formed in the seventh and eighth wiring layers, respectively, and is arranged inside the first and second receiver coils, the second conductive portions formed on the substrate include an inner 1-layer, 2-layer conductive portion (1401) that connects the first receiving coil and the second receiving coil formed in the first wiring layer and the second wiring layer, respectively, and is arranged inside the first receiving coil and the second receiving coil; an outer 2-layer, 3-layer conductive portion (1402) that connects the first receiving coil and the second receiving coil formed in the second wiring layer and the third wiring layer, respectively, and is arranged outside the first receiving coil and the second receiving coil; an outer 8-layer, 9-layer conductive portion (1406) that connects the first receiving coil and the second receiving coil formed in the eighth wiring layer and the ninth wiring layer, respectively, and is arranged outside the first receiving coil and the second receiving coil; and an inner 9-layer, 10-layer conductive portion (1407) that connects the first receiving coil and the second receiving coil formed in the ninth wiring layer and the tenth wiring layer, respectively, and is arranged inside the first receiving coil and the second receiving coil.

3. the inner one-layer / two-layer conductive portion and the inner nine-layer / ten-layer conductive portion are arranged at positions overlapping each other in the normal direction, The position detection device according to claim 2 , wherein the outer two-layer / three-layer conductive portion and the outer eight-layer / nine-layer conductive portion are arranged in overlapping positions in the normal direction.

4. A position detection device, a substrate (100); a transmitting coil (110) formed on the substrate; a first receiving coil (120) and a second receiving coil (130) formed on the substrate and inductively coupled by electromagnetic induction caused by energization of the transmitting coil; The substrate is a multilayer substrate in which eight wiring layers (102, 1001 to 1008) and insulating layers (101) arranged between the eight wiring layers are alternately stacked, and has a plurality of conductive penetration parts (140, 1401 to 1405) formed by penetrating at least one of the insulating layers and connecting the eight wiring layers, the first receiving coil and the second receiving coil are wound a plurality of times on each of the eight wiring layers except for at least one wiring layer, and are connected via the plurality of conductive through parts; The plurality of conductive through portions include a first conductive portion (1403) formed by penetrating three of the insulating layers, and a second conductive portion (1401, 1402, 1404, 1405) formed by penetrating one of the insulating layers, the first conductive portion is formed on the substrate and is disposed inside the first receiving coil and the second receiving coil, The position detection device includes four second conductive portions formed on the substrate, and at least one of the second conductive portions is disposed inside the first receiving coil and the second receiving coil.

5. A position detection device, a substrate (100); a transmitting coil (110) formed on the substrate; a first receiving coil (120) and a second receiving coil (130) formed on the substrate and inductively coupled by electromagnetic induction caused by energization of the transmitting coil; The substrate is a multilayer substrate in which six wiring layers (102, 1001 to 1006) and insulating layers (101) arranged between the six wiring layers are alternately stacked, and has a plurality of conductive penetration parts (140, 1401 to 1403) formed by penetrating at least one of the insulating layers and connecting the six wiring layers; the first receiving coil and the second receiving coil are wound a plurality of times on each of the six wiring layers except for at least one wiring layer, and are connected via the plurality of conductive through parts; The plurality of conductive through portions include a first conductive portion (1402) formed by penetrating three of the insulating layers and a second conductive portion (1401, 1403) formed by penetrating one of the insulating layers, the first conductive portion is formed on the substrate and is disposed inside the first receiving coil and the second receiving coil, The position detection device includes two second conductive portions formed on the substrate, and at least one of the second conductive portions is disposed inside the first receiving coil and the second receiving coil.

6. 6. The position detection device according to claim 4, wherein the first receiving coil and the second receiving coil are formed on each of the stacked wiring layers except for two central wiring layers.

7. A position detection device, a substrate (100); a transmitting coil (110) formed on the substrate; a first receiving coil (120) and a second receiving coil (130) formed on the substrate and inductively coupled by electromagnetic induction caused by energization of the transmitting coil; The substrate is a multilayer substrate in which eight wiring layers (102, 1001 to 1008) and insulating layers (101) arranged between the eight wiring layers are alternately stacked, and has a plurality of conductive penetration parts (140, 1401 to 1405) formed by penetrating at least one of the insulating layers and connecting the eight wiring layers, the first receiving coil and the second receiving coil are wound a plurality of times on each of the eight wiring layers except for two central wiring layers, and are connected via the plurality of conductive through parts; A position detection device in which at least one of the plurality of conductive through portions is arranged inside the first receiving coil and the second receiving coil.

8. A position detection device, a substrate (100); a transmitting coil (110) formed on the substrate; a first receiving coil (120) and a second receiving coil (130) formed on the substrate and inductively coupled by electromagnetic induction caused by energization of the transmitting coil; The substrate is a multilayer substrate in which six wiring layers (102, 1001 to 1006) and insulating layers (101) arranged between the six wiring layers are alternately stacked, and has a plurality of conductive penetration parts (140, 1401 to 1403) formed by penetrating at least one of the insulating layers and connecting the six wiring layers; The first receiving coil and the second receiving coil are wound a plurality of times on each of the six wiring layers except for two central wiring layers, and are connected via the plurality of conductive through parts, A position detection device in which at least one of the plurality of conductive through portions is arranged inside the first receiving coil and the second receiving coil.

9. 6. The position detection device according to claim 1, wherein the first receiving coil and the second receiving coil include a portion having a spiral pattern shape.

10. 5. A position detection device as described in any one of claims 1 to 4, wherein one of the first receiving coil and the second receiving coil includes a pattern shape that describes a sine curve, and the other of the first receiving coil and the second receiving coil includes a pattern shape that describes a cosine curve.

11. A position detection device as described in any one of claims 1 to 5, comprising a detection body (30) that generates an induced current by electromagnetic induction in response to the influence of the current-carrying transmitting coil, and changes the induced electromotive force generated in the first receiving coil and the second receiving coil using the generated induced current.

12. The position detection device according to claim 11, further comprising a signal processing unit (210) that calculates the position of the detection object based on the induced electromotive forces output by the first receiving coil and the second receiving coil.

13. A position detection device, a substrate (100); a transmitting coil (110) formed on the substrate; a first receiving coil (120) and a second receiving coil (130) formed on the substrate and inductively coupled by electromagnetic induction caused by energization of the transmitting coil; The substrate is a multilayer substrate in which six or more wiring layers (102, 1001 to 1010) and insulating layers (101) arranged between each of the six or more wiring layers are alternately stacked, and has a plurality of conductive penetration parts (140, 1401 to 1407) formed by penetrating at least one of the insulating layers and connecting the six or more wiring layers, the first receiving coil and the second receiving coil are wound a plurality of times on each of the six or more wiring layers except for at least one wiring layer, and are connected via the plurality of conductive through-holes; one of the first receiving coil and the second receiving coil includes a pattern shape that describes a sine curve, and the other of the first receiving coil and the second receiving coil includes a pattern shape that describes a cosine curve; A position detection device in which at least one of the plurality of conductive through portions is arranged inside the first receiving coil and the second receiving coil.

Images