Optimized low energy / high productivity deposition system

Abstract

To provide a mechanical type indexer that transfers a substrate in a substrate processing system processing module.SOLUTION: In a processing module, a mechanical type indexer for a substrate processing tool, comprises first and second arms 208 and 212 each having first and second end effectors. The first arm is configured to rotate on a first spindle 240 to selectively position the first end effector 216 of the first arm at a plurality of processing stations of the substrate processing tool and selectively position the second end effector 220 of the first arm at the plurality of processing stations of the substrate processing tool. The second arm is configured to rotate on a second spindle 244 to selectively position the first end effector 224 of the second arm at the plurality of processing stations of the substrate processing tool and to selectively position the second end effector 228 of the second arm at the plurality of processing stations of the substrate processing tool. The first arm is configured to rotate independently of the second arm.SELECTED DRAWING: Figure 2D

Description

[Technical Field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims the benefit of U.S. Provisional Application No. 62 / 449,325, filed January 23, 2017. The entire disclosure of the above application is incorporated herein by reference.

[0002] FIELD OF THE DISCLOSURE The present disclosure relates to the transfer of substrates within a substrate processing system process module. [Background technology]

[0003] The background art provided herein is intended to provide a general background to the present disclosure, and the work of the inventors named herein, to the extent described in this background art, along with aspects of the description that would not normally be considered prior art at the time of filing, are not admitted expressly or impliedly as prior art to the present disclosure.

[0004] Substrate processing systems may be utilized to perform deposition, etching, and / or other processing of substrates, such as semiconductor wafers. During processing, a substrate is positioned on a substrate support within a processing chamber of the substrate processing system. A gas mixture including one or more precursors may be introduced into the processing chamber, and a plasma may be ignited to activate a chemical reaction. The substrate processing system may include multiple substrate processing tools disposed within a fabrication chamber. Each of the substrate processing tools may include multiple processing modules.

[0005] Referring now to FIG. 1 , a top view of an example substrate processing tool 100 is shown. The substrate processing tool 100 may include multiple process modules 104. Each of the process modules 104 may be configured to perform one or more respective processes on a substrate. A substrate to be processed may be loaded into the substrate processing tool 100 via a load station port in an equipment front-end module (EFEM) 108 and then transferred to one or more of the process modules 104. For example, a substrate may be transferred from the EFEM 108 to a load lock 112 via one or more EFEM robots 116. A vacuum transfer module (VTM) 120 includes one or more VTM robots 124 configured to transfer substrates into and out of the process modules 104. For example, substrates may be loaded into each of the process modules 104 sequentially.

[0006] In one example, the process module 104 corresponds to a quad station process module (QSM). The QSM may include four process stations 128 within a single chamber (i.e., within the process chamber 132 of the process module 104). The substrate 136 is loaded into the process module 104 via a load station 140. For example, the substrate 136 is transferred between the VTM 120 and the load station 140 via respective slots 144 between the VTM 120 and the process module 104. A mechanical indexer 148 (i.e., indexing mechanism) sequentially rotates the substrate 136 among the process stations 128. As shown, the mechanical indexer 148 corresponds to a cross-shaped spindle. For example, a substrate 136 may be transferred from the VTM 120 to the processing station 128 corresponding to load station 140 (labeled "1"), rotated sequentially between processing stations 140 labeled "2," "3," and "4," and then returned to load station 140 for removal from the processing module 104. A system controller 152 may control various operations of the tool, including, but not limited to, operation of the robots 116 and 124, rotation of the indexer 148, etc. Summary of the Invention

[0007] A mechanical indexer for a substrate processing tool includes first and second arms each having a first and second end effector. The first arm is configured to rotate on a first spindle to selectively position the first end effector of the first arm at a plurality of processing stations of the substrate processing tool and to selectively position the second end effector of the first arm at a plurality of processing stations of the substrate processing tool. The second arm is configured to rotate on a second spindle to selectively position the first end effector of the second arm at a plurality of processing stations of the substrate processing tool and to selectively position the second end effector of the second arm at a plurality of processing stations of the substrate processing tool. At least one of the plurality of processing stations corresponds to a load station of the substrate processing tool. The first arm is configured to rotate independently of the second arm such that the first or second end effector of the first arm is positioned at the load station while the first or second end effector of the second arm is positioned at the load station.

[0008] In another feature, the first spindle and the second spindle are coaxial. Each of the first arm and the second arm is configured to be raised and lowered relative to a plurality of processing stations of the substrate processing tool. The second spindle is disposed within the first spindle.

[0009] In another feature, the first arm and the second arm are rotatable to a first configuration, in which the first and second end effectors of the first arm are disposed at first and third processing stations, respectively, of the plurality of processing stations, and the first and second end effectors of the second arm are disposed at second and fourth processing stations, respectively, of the plurality of processing stations. The first arm and the second arm are rotatable to a second configuration, in which the first and second end effectors of the first arm are disposed at first and third processing stations, respectively, of the plurality of processing stations, and the first and second end effectors of the second arm are disposed at third and first processing stations, respectively, of the plurality of processing stations.

[0010] In another feature, the first processing station corresponds to a load station of a substrate processing tool, the first and third processing stations are located at opposite corners of the substrate processing tool, and the second and fourth processing stations are located at opposite corners of the substrate processing tool.

[0011] In another feature, the first arm and the second arm are rotatable to a first configuration, in which the first and second end effectors of the first arm are disposed at first and fourth processing stations, respectively, of the plurality of processing stations, and the first and second end effectors of the second arm are disposed at second and third processing stations, respectively, of the plurality of processing stations. The first arm and the second arm are rotatable to a second configuration, in which the first and second end effectors of the first arm are disposed at first and fourth processing stations, respectively, of the plurality of processing stations, and the first and second end effectors of the second arm are disposed at fourth and first processing stations, respectively, of the plurality of processing stations.

[0012] In another feature, the first and fourth processing stations are disposed on a first side of the substrate processing tool, and the second and third processing stations are disposed on a second side of the substrate processing tool opposite the first side, and the first and fourth processing stations correspond to load stations of the substrate processing tool.

[0013] In another feature, a substrate processing tool comprises a vacuum transfer module and a plurality of process modules coupled to the vacuum transfer module, at least one of the plurality of process modules comprising a mechanical indexer, the plurality of process modules including first and second process modules coupled to a first side of the vacuum transfer module and third and fourth process modules coupled to a second side of the vacuum transfer module.

[0014] In another feature, an adapter plate is disposed between the first side and the first and second processing modules, the adapter plate having a flat side configured to connect with the first side of the vacuum transfer module and an angled side configured to connect with the first and second processing modules.

[0015] In another feature, the first and second sides of the vacuum transfer module are chamfered. An adapter plate is disposed between the first side and the first and second processing modules. The adapter plate has an angled side configured to connect with the first side of the vacuum transfer module and a flat side configured to connect with the first and second processing modules.

[0016] Further areas of applicability of the present disclosure will become apparent from the detailed description, claims, and drawings. The detailed description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the present disclosure. [Brief explanation of the drawings]

[0017] The present disclosure will become more fully understood from the detailed description and accompanying drawings set forth below.

[0018] [Figure 1] FIG. 1 illustrates an example of a substrate processing tool.

[0019] [Figure 2A] FIG. 1 shows a first example of a processing module with a mechanical indexer in an X-configuration.

[0020] [Figure 2B] FIG. 10 shows a first example of a processing module with a mechanical indexer in a second configuration.

[0021] [Figure 2C] FIG. 2 is a side view showing a first example of a processing module.

[0022] [Figure 2D] FIG.

[0023] [Figure 3A] FIG. 10 illustrates a second example of a processing module with a mechanical indexer in an X-configuration.

[0024] [Figure 3B] FIG. 10 illustrates a second example of a processing module with a mechanical indexer in a second configuration.

[0025] [Figure 3C] FIG. 10 is a side view showing a second example of a processing module.

[0026] [Figure 3D] FIG. 1 illustrates a mechanical indexer in an X-configuration.

[0027] [Figure 3E] FIG. 10 shows a second configuration of a mechanical indexer.

[0028] [Figure 4A] FIG. 1 illustrates a first example of a substrate processing tool.

[0029] [Figure 4B] FIG. 10 shows a second example of a substrate processing tool.

[0030] [Figure 4C] FIG. 2 is a diagram showing an example of a transfer robot.

[0031] [Figure 4D] 1 illustrates an example of an adapter plate for a substrate processing tool.

[0032] [Figure 4E] FIG. 10 is a diagram showing a third example of a substrate processing tool.

[0033] [Figure 5] 1A-1C illustrate steps of a first example method for operating a mechanical indexer of a substrate processing tool.

[0034] [Figure 6] 10A-10C illustrate steps of a second example method for operating a mechanical indexer of a substrate processing tool.

[0035] In the drawings, the same numbers may be used to identify similar and / or identical elements. DETAILED DESCRIPTION OF THE INVENTION

[0036] A process module within a substrate processing tool may be operated in a multi-station sequential processing mode, for example, only a portion of the overall process may be performed on a substrate at each of multiple processing stations within the process module, as the processing time at each station becomes shorter and / or Processing Module The more processes a substrate undergoes, the greater the portion of the total time each substrate spends in a processing module that is accounted for by the delay associated with rotating and transporting the substrate by the mechanical indexer. In one example, multiple substrates are sequentially transported to processing stations corresponding to a load station. The indexer is rotated after each transport until a substrate is positioned on the indexer at each of the four processing stations. A process may then be performed on each of the substrates.

[0037] Substrate processing / transfer systems and methods according to the principles of the present disclosure implement a transfer module (e.g., a vacuum transfer module or VTM), a processing module, and a mechanical indexer configured to reduce substrate transfer time. For example, the VTM is configured to load two or more (e.g., four) substrates into the processing module and retrieve two or more substrates from the processing module per transfer.

[0038] In one example, a mechanical indexer includes two independently rotatable arms, each having a first and second end (e.g., an end effector). The indexer may be selectively arranged in a first X-shaped configuration. In the X-shaped configuration, each end may be aligned with a respective processing station in a processing module. For example, the first and second ends of a first arm may be aligned with diagonally opposite processing stations 1 and 3 (or 2 and 4), and the first and second ends of a second arm may be aligned with diagonally opposite processing stations 2 and 4 (or 1 and 3). In the second configuration, one of the arms is lifted and rotated so that the first and second arms are aligned. In the second configuration, the first and second ends of each of the arms are aligned with stations 1 and 3 or 2 and 4. In other words, in the second configuration, each end of both arms may be vertically stacked at any one of the processing stations. In particular, the respective ends of both arms may be aligned with the load station.

[0039] Thus, in this example, two substrates may be transferred to and / or from a processing module (e.g., using a VTM robot having a vertical stacking end effector configured to transfer two substrates simultaneously). To transfer two additional substrates to and / or from a processing module, both arms may be rotated so that opposite ends of each of the arms are aligned with a load station. The mechanical indexer may then be arranged in an X-shaped first configuration so that each of the four substrates is aligned with a different processing station.

[0040] In another example, the processing module may include two load stations. For example, the load stations may correspond to processing stations adjacent to the VTM. In this example, the mechanical indexer includes first and second V-shaped arms. The indexer may be arranged in a first X-shaped configuration. In the X-shaped configuration, the first and second ends of the first V-shaped arm may be aligned with processing stations 1 and 4 (or processing stations 2 and 1, 3 and 2, or 4 and 3), and the first and second ends of the second V-shaped arm may be aligned with processing stations 2 and 3 (or processing stations 3 and 4, 4 and 1, or 1 and 2). In the second configuration, one of the arms is lifted and rotated so that the first and second arms are aligned. In the second configuration, the first and second ends of each of the arms are aligned with stations 1 and 4, for example, which may correspond to the load stations. In other words, in the second configuration, the respective ends of both arms may be stacked vertically within the load station.

[0041] Thus, in this example, four substrates may be transferred to and / or from a processing module (e.g., using two VTM robots each having a vertical stacking end effector configured to transfer two substrates simultaneously), and the mechanical indexer may then be arranged in an X-shaped first configuration such that each of the four substrates is aligned to a different processing station.

[0042] As described in more detail below, substrate processing / transport systems and methods according to the present disclosure may reduce energy consumption, reduce overhead time associated with substrate processing, improve processing throughput, increase the number of processing modules per tool, etc. Although described with respect to a processing module having four processing stations, the principles of the present disclosure may be implemented in processing modules having other numbers of processing stations (e.g., 2, 3, 5, 6, 7, 8, etc.).

[0043] 2A, 2B, 2C, and 2D, an example of a processing module 200 including a mechanical indexer 204 according to the principles of the present disclosure is shown. In this example, the mechanical indexer 204 includes two independently rotatable arms 208 and 212, each having a first and second end (e.g., end effectors 216, 220, 224, and 228). The indexer 204 is arranged in a first X-shaped configuration in FIG. 2A and a second configuration in FIG. 2B. In the X-shaped configuration, the end effectors 216 and 220 of the first arm 208 are positioned above processing stations 1 and 3, respectively, and the end effectors 224 and 228 are positioned above processing stations 2 and 4, respectively. Processing station 1 may correspond to or communicate with a load station 232 accessible via a slot 236.

[0044] In the second configuration, the second arm 212 may be raised and rotated such that the first arm 208 and the second arm 212 are aligned. For example, as shown in FIG. 2D , the first arm 208 may be coupled to a first spindle 240, and the second arm 212 may be coupled to a second spindle 244. The second spindle 244 is housed within the first spindle 240 and is configured to be selectively raised and lowered within the first spindle 240. Thus, raising the second spindle 244 raises the second arm 212 relative to the first arm 208, allowing the second arm 212 to be rotated independently of the first arm 208. In this manner, the end effectors 216, 220, 224, and 228 and their respective substrates 248 may be positioned above / below one another within the load station 232 or within any one of the processing stations 1-4.

[0045] For example, the second arm 212 may be rotated such that the first arm 208 and the second arm 212 are disposed in the second configuration shown in FIG. 2B . In the second configuration, the end effectors 216 and 228 are each disposed within the load station 232. In other words, in the second configuration, the end effectors 216 and 228 are stacked vertically within the load station 232. At this time, the substrates 248 disposed on the end effectors 216 and 228 may be retrieved from the processing module 200, and / or new (i.e., unprocessed) substrates may be loaded onto the end effectors 216 and 228 via the slot 236.

[0046] In one example of a transfer sequence, each of the first arm 208 and the second arm 212 is raised to a first height to lift a substrate 248 from each of the processing stations 1-4. For example, the end effectors 216, 220, 224, and 228 may be positioned at processing stations 1, 2, 3, and 4, respectively. The second arm 212 may then be further raised to a second height higher than the first height. The second arm 212 may then be rotated (e.g., approximately 90° clockwise as shown in FIG. 2B ) so that the end effector 228 is positioned at processing station 1 (i.e., load station 332). A VTM robot external to the processing module 200 may then retrieve the substrates 248 positioned on each of the end effectors 216 and 228. In some examples, the VTM robot replaces the processed substrates 248 with unprocessed substrates.

[0047] Following unloading of substrate 248 and / or loading of an unprocessed substrate onto end effectors 216 and 228, the entire indexer 204 (i.e., both first arm 208 and second arm 212) may be rotated approximately 180 degrees while maintaining the first and second heights of first arm 208 and second arm 212, respectively. Thus, indexer 204 is rotated so that end effectors 220 and 224 are located at load station 232. The VTM robot may then retrieve the processed substrate 248 from end effectors 220 and 224 and / or load an unprocessed substrate onto end effectors 220 and 224. Second arm 212 may then be rotated (e.g., approximately 90° clockwise) relative to arm 208 to position end effectors 224 and 228 at processing stations 2 and 4, respectively, while end effectors 216 and 220 remain at processing stations 3 and 1, respectively. First arm 208 and second arm 212 may then each be lowered to place an unprocessed substrate at a respective processing station 1-4. Other example transfer sequences may also be performed.

[0048] 3A, 3B, 3C, 3D, and 3E, another example of a processing module 300 including a mechanical indexer 304 according to the principles of the present disclosure is shown. In one example, processing module 300 includes two load stations 308 and 312 and corresponding slots 316 and 320. Indexer 304 includes first and second V-shaped arms 324 and 328, each having first and second ends (e.g., end effectors 332, 336, 340, and 344). Indexer 304 is arranged in a first X-shaped configuration in FIGS. 3A and 3D and a second configuration in FIGS. 3B and 3E. In the X-shaped configuration, end effectors 332 and 336 are positioned above processing stations 1 and 4, respectively, and end effectors 340 and 344 are positioned above processing stations 2 and 3, respectively. Processing stations 1 and 4 correspond to or communicate with load stations 308 and 320, respectively.

[0049] In the second configuration, second arm 328 may be raised and rotated such that first arm 324 and second arm 328 are aligned. For example, first arm 324 and second arm 328 may be coupled to independently rotatable spindles 348 and 352 configured to operate similarly to first and second spindles 240 and 244, as described in FIG. 2D . Thus, second arm 328 may be rotated such that first arm 324 and second arm 328 are positioned in the second configuration shown in FIG. 3B . In the second configuration, end effectors 332 and 344 are each positioned in load station 308, and end effectors 336 and 340 are each positioned in load station 312. For example, end effectors 332 and 344 and corresponding substrates 356 positioned thereon are stacked vertically within load station 308. Conversely, end effectors 336 and 340 and corresponding substrates 356 disposed thereon are stacked vertically within load station 312. Thus, substrates 356 may be retrieved from processing modules 300 and / or new (i.e., unprocessed) substrates may be loaded onto end effectors 332, 344 and 336, 340 via slots 316 and 320, respectively.

[0050] In one example of a transfer sequence, each of the first arm 324 and the second arm 328 may be raised to a first height to lift a substrate 356 from each of the processing stations 1-4. For example, the end effectors 332, 340, 344, and 336 may be positioned at processing stations 1, 2, 3, and 4, respectively. The second arm 328 may then be further raised to a second height higher than the first height. The second arm 328 may then be rotated (e.g., approximately 180° as shown in FIG. 3B ) so that the end effectors 344 and 340 are positioned at processing stations 1 and 2 (i.e., load stations 308 and 312), respectively. A VTM robot external to the processing module 300 may then retrieve the substrate 356 positioned on each of the end effectors 332, 340, 344, and 336. In some examples, the VTM robot replaces the processed substrate 356 with an unprocessed substrate.

[0051] Following unloading of substrate 356 and / or loading of an unprocessed substrate onto end effectors 332, 340, 344, and 336, second arm 328 is rotated approximately 180° to return indexer 304 to the X-configuration while maintaining the first and second heights of first arm 324 and second arm 328, respectively. Thus, end effectors 332, 340, 344, and 336 are positioned at stations 1, 2, 3, and 4, respectively. First arm 324 and second arm 328 may then be lowered onto their respective processing stations 1-4. Other example transfer sequences may be implemented.

[0052] 4A, 4B, and 4C, top views of example substrate processing tools 400 and 404 having example transfer robots 408-1, 408-2, and 408-3 (collectively referred to as transfer robots 408) are shown. Processing tools 400 and 404 are shown without mechanical indexers for illustrative purposes. For example, respective processing modules 412 of each of tools 400 and 404 may include either mechanical indexer 204 or mechanical indexer 304, as described above.

[0053] The vacuum transfer module (VTM) 416 and the front-end equipment module (EFEM) 420 may each include one of the transfer robots 408. The transfer robots 408-1 and 408-2 may have the same or different configurations. By way of example only, the transfer robot 408-1 includes a single arm with two vertically stacked end effectors. Conversely, the transfer robot 408-2 is illustrated as having two arms, each with two vertically stacked end effectors, as shown in FIG. 4C . The robot 408 of the VTM 416 selectively transfers substrates to and from load locks 424 and between the processing modules 412. The robot 408-3 of the EFEM 420 transfers substrates in and out of the EFEM 420 and to and from the load lock 424. By way of example only, robot 408-3 may include two arms, each with a single end effector or two vertically stacked end effectors.

[0054] Tool 400 is configured to interact with, for example, four processing modules 412, each having a single load station accessible via respective slots 428. Conversely, tool 404 is configured to interact with four processing modules 412, each having a single load station accessible via respective slots 432 and 436. accessibleIt is configured to interact with three processing modules 412, each having two load stations. As shown, the sides 440 of the VTM 416 may be angled (e.g., chamfered) to facilitate coupling with processing modules 412 of different configurations (e.g., different numbers, spacing, etc.).

[0055] For example, as shown in FIG. 4A , the VTM is coupled to two process modules 412 per side 440. Conversely, the shape of the VTM 416 also allows for the connection of process modules 412 having two load stations. For example, an adapter plate 444 having two slots 432 and 436 may be provided to accommodate a single process module 412 having two load stations, as shown in FIG. 4B . As shown, the adapter plate 444 has an angled first side configured to interface with the angled side 440 of the VTM 416 and a non-angled (i.e., straight or flat) second side configured to interface with the process module 412. Thus, the VTM 416 provides the flexibility to enable the connection of a greater number of process modules 412 having a single load station (i.e., to increase the number of process stations per unit area of the tool 400), while also providing the flexibility to use process modules 412 having only one load station, as shown in FIG. 4A , or two load stations, as shown in FIG. 4B . In other examples, the sides of the VTM 416 may not be angled (i.e., they may be straight or flat). In these examples, the tool 400 may include an adapter plate 446, as shown in FIG. 4D , configured to connect with two processing modules 412, each having a single load station. In other words, instead of converting the angled sides 440 of the VTM 416 to non-angled sides, the adapter plate 446 converts the non-angled sides of the VTM 416 to angled sides.

[0056] Robot 408-2 of VTM 416 includes two arms 448 and 452, each with two vertically stacked end effectors 456, for a total of four end effectors 456. Thus, each of arms 448 and 452 is configured to simultaneously transfer two substrates to and / or from a respective one of processing modules 412, load lock 424, etc. In the example shown in FIG. 4A , robot 408-1 may retrieve two substrates from and load two substrates into processing module 412 in a given transfer. Conversely, robot 408-2 may retrieve four substrates from and load four substrates into processing module 412 in a given transfer.

[0057] A system controller 460 may control various operations of the substrate processing tools 400 and 404, including, but not limited to, operation of the robot 408, rotation of the indexers of each of the processing modules 412 (e.g., corresponding to the indexers 204 and 304 in Figures 2 and 3), etc.

[0058] 4E, a substrate processing tool 464 includes transfer robots 468-1 and 468-2 (collectively referred to as transfer robot 468). The processing tool 464 is shown without a mechanical indexer for illustrative purposes. For example, each processing module 472 of the tool 464 may include either the mechanical indexer 204 or the mechanical indexer 304, as described above.

[0059] VTM476 and EFEM480 are transfer robots, respectively. 4684C , the transfer robots 468-1 and 468-2 may have one of the following configurations: a single end effector, a vertically stacked end effector, and a vertically stacked end effector. By way of example only, the transfer robot 468-1 is shown having two arms, each having two vertically stacked end effectors, as shown in FIG. 4C . The robot 468-1 of the VTM 476 selectively transfers substrates to and from the EFEM 480 and between the processing modules 472. The robot 468-2 of the EFEM 480 transfers substrates into and out of the EFEM 480. By way of example only, the robot 468-2 may have two arms, each having a single end effector or two vertically stacked end effectors.

[0060] The tool 464 is configured to interface with, for example, four processing modules 472, each having a single load station accessible via a respective slot 484. In this example, the sides 488 of the VTM 476 are not angled (i.e., the sides 488 are substantially straight or planar). In this manner, two of the processing modules 472, each having a single load station, may be coupled to each of the sides 488 of the VTM 476. Accordingly, the EFEM 480 may be positioned at least partially between two of the processing modules 472 to reduce the footprint of the tool 464.

[0061] Referring now to FIG. 5, a first example of a method 500 for operating a mechanical indexer of a substrate processing tool begins at step 504 (e.g., the mechanical indexer 204 shown in FIGS. 2A, 2B, 2C, and 2D). By way of example only, operation of the mechanical indexer may be controlled by a controller such as the system controller 460. At step 508, the mechanical indexer is positioned in a first X-configuration, where the first and second ends of the first arm are positioned at the first and third processing stations and the first and second ends of the second arm are positioned at the second and fourth processing stations (e.g., as shown in FIG. 2A). Each of the ends of the first and second arms may be positioned to retrieve a respective processed substrate. At step 512, the first and second arms are raised on their respective spindles to lift the substrate from the processing stations. In step 516, the second arm is rotated (e.g., 90° clockwise as shown in FIG. 2B) so that the second end of the second arm is positioned at a first processing station that may correspond to or communicate with the load station. In step 520, the robot retrieves the processed substrate from the first end of the first arm and the second end of the second arm that are positioned at the first processing station.

[0062] In step 524, the robot transfers the unprocessed substrate to the first end of the first arm and the second end of the second arm, which are located at the first processing station. In step 528, the first arm and the second arm are rotated (e.g., 180°) so that the second end of the first arm and the first end of the second arm are each located at the first processing station. In step 532, the robot retrieves the processed substrate from the first end of the first arm and the second end of the second arm. In step 536, the robot transfers the unprocessed substrate to the second end of the first arm and the first end of the second arm, which are located at the first processing station. In step 540, the second arm is rotated (e.g., 90° clockwise) so that the first and second ends of the second arm are located at the second and fourth processing stations (i.e., the mechanical indexer is returned to the first X-shaped configuration). In step 544, the first and second arms are lowered to place the unprocessed substrate on their respective processing stations. The method 500 ends at step 548.

[0063] 6, a second example of a method 600 for operating a mechanical indexer of a substrate processing tool begins at step 604 (e.g., the mechanical indexer 304 shown in FIGS. 3A, 3B, 3C, 3D, and 3E). By way of example only, operation of the mechanical indexer may be controlled by a controller such as the system controller 460. At step 608, the mechanical indexer is positioned in a first X-configuration, where the first and second ends of the first arm are positioned at the first and fourth processing stations and the first and second ends of the second arm are positioned at the second and third processing stations (e.g., as shown in FIG. 3A). Each of the ends of the first and second arms may be positioned to retrieve a respective processed substrate. At step 612, the first and second arms are raised on their respective spindles to lift the substrate from the processing stations. In step 616, the second arm is rotated (e.g., 180° clockwise as shown in FIG. 3B) so that the first and second ends of the second arm are positioned at the first and fourth processing stations, which may each correspond to or communicate with a load station. In step 620, one or more robots retrieve processed substrates from the first and second ends of the first arm and the first and second ends of the second arm positioned at the first and fourth processing stations.

[0064] In step 624, the robot transfers the unprocessed substrate to the first and second ends of the first arm and the first and second ends of the second arm, which are located at the first and fourth processing stations. In step 628, the second arm is rotated (e.g., 180°) so that the first and second ends of the second arm are located at the second and third processing stations (i.e., the mechanical indexer is returned to the first X-configuration). In step 632, the first and second arms are lowered to place the unprocessed substrate on the respective processing stations. Method 600 ends in step 636.

[0065] The foregoing description is merely exemplary in nature and is not intended to limit the disclosure, its applications, or uses. The broad teachings of the present disclosure may be embodied in a variety of forms. Accordingly, while the present disclosure includes specific examples, the true scope of the disclosure is not limited to those examples, as other variations will become apparent from a study of the drawings, the specification, and the following claims. It should be understood that one or more steps within a method may be performed in a different order (or simultaneously) without altering the principles of the present disclosure. Furthermore, although each embodiment is described as having particular features, any one or more of the features described with respect to any embodiment of the present disclosure can be implemented in any of the other embodiments and / or combined with any of the features of the other embodiments, even if the combination is not expressly described. In other words, the above-described embodiments are not mutually exclusive, and substituting one or more embodiments for one another is within the scope of the present disclosure.

[0066] Spatial and functional relationships between elements (e.g., between modules, circuit elements, semiconductor layers) are described using various terms, such as "connected," "engaged," "coupled," "adjacent," "adjacent," "on top of," "above," "below," and "disposed." When describing a relationship between first and second elements in this disclosure, unless expressly stated as "direct," the relationship may be a direct relationship where no other intervening elements exist between the first and second elements, or an indirect relationship where one or more intervening elements exist (spatially or functionally) between the first and second elements. As used herein, the phrase "at least one of A, B, and C" should be interpreted to mean the logical (A or B or C) using a non-exclusive logical OR, and not to mean "at least one of A, at least one of B, and at least one of C."

[0067] In some embodiments, the controller is part of a system, which may be part of the examples described above. Such systems may include semiconductor processing equipment, such as one or more processing tools, one or more chambers, one or more platforms for processing, and / or specific processing components (e.g., wafer pedestals, gas flow systems, etc.). These systems may be integrated with electronics for controlling the operation of the system before, during, and after processing of semiconductor wafers or substrates. The electronics may be referred to as a "controller" and may control various components or subcomponents of the system. Depending on the processing requirements and / or type of system, the controller may be programmed to control any of the processes disclosed herein, such as supply of process gases, temperature settings (e.g., heating and / or cooling), pressure settings, vacuum settings, power settings, radio frequency (RF) generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid supply settings, position and motion settings, and wafer movement in and out of tools and other transfer tools and / or load locks connected or coupled to the specific system.

[0068] Generally, a controller may be defined as an electronic device having various integrated circuits, logic, memory, and / or software that receive instructions, issue instructions, control operations, enable cleaning operations, enable endpoint measurements, etc. Integrated circuits may include chips in the form of firmware that store program instructions, digital signal processors (DSPs), chips defined as application-specific integrated circuits (ASICs), and / or one or more microprocessors or microcontrollers that execute program instructions (e.g., software). Program instructions may be communicated to the controller in the form of various individual settings (or program files) that define operational parameters for performing a particular process on or for a semiconductor wafer, or instructions for the system. The operational parameters, in some embodiments, may be part of a recipe defined by a process engineer to accomplish one or more process steps during processing of one or more layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or dies of a wafer.

[0069] In some embodiments, the controller may be part of or connected to a computer that is integrated with, connected to, or otherwise networked with the system, or a combination thereof. For example, the controller may be in the “cloud” or may be all or part of a fab host computer system that can enable remote access to wafer processing. The computer may enable remote access to the system to monitor the current progress of a manufacturing operation, examine the history of past manufacturing operations, or examine trends or performance indicators from multiple manufacturing operations, to change parameters of a current process, configure processing steps according to a current process, or initiate a new process. In some examples, a remote computer (e.g., a server) may provide process recipes to the system over a network (which may include a local network or the Internet). The remote computer may include a user interface that enables entry or programming of parameters and / or settings, which are communicated to the system from the remote computer. In some examples, the controller receives instructions in the form of data, where the instructions specify parameters for each of the processing steps to be performed during one or more operations. It should be understood that the parameters may be specific to the type of process being performed as well as the type of tool the controller is configured to interface with or control. Thus, as described above, the controller may be distributed, such as by having one or more separate controllers that are networked and operate toward a common purpose (such as the process and control described herein). One example of a distributed controller for such purposes is one or more integrated circuits on the chamber that communicate with one or more remotely located integrated circuits (e.g., at the platform level or located as part of a remote computer) that cooperate to control the process in the chamber.

[0070] Without limitation, example systems may include a plasma etch chamber or module, a deposition chamber or module, a spin rinse chamber or module, a metal plating chamber or module, a cleaning chamber or module, a bevel edge etch chamber or module, a physical vapor deposition (PVD) chamber or module, a chemical vapor deposition (CVD) chamber or module, an atomic layer deposition (ALD) chamber or module, an atomic layer etch (ALE) chamber or module, an ion implantation chamber or module, a track chamber or module, and any other semiconductor processing system that may be associated with or utilized in the fabrication and / or manufacturing of semiconductor wafers.

[0071] As described above, depending on the processing step or steps being performed by the tool, the controller may communicate with one or more of other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, nearby tools, tools located throughout the factory, a main computer, another controller, or tools used in material transport to carry containers of wafers to or from tool locations and / or load ports within a semiconductor fabrication factory. The present disclosure can also be configured as the following application examples. <Application example 1> 1. A mechanical indexer for a substrate processing tool, comprising: a first arm having a first end effector and a second end effector, the first arm configured to rotate on a first spindle to (i) selectively position the first end effector of the first arm at a plurality of processing stations of the substrate processing tool and (ii) selectively position the second end effector of the first arm at the plurality of processing stations of the substrate processing tool; a second arm having a first end effector and a second end effector, the second arm configured to rotate on a second spindle to (i) selectively position the first end effector of the second arm at the plurality of processing stations of the substrate processing tool and (ii) selectively position the second end effector of the second arm at the plurality of processing stations of the substrate processing tool; Equipped with at least one of the plurality of processing stations corresponds to a load station of the substrate processing tool; a mechanical indexer, wherein the first arm is configured to rotate independently of the second arm such that the first end effector or the second end effector of the first arm is positioned at the load station at the same time that the first end effector or the second end effector of the second arm is positioned at the load station. <Application example 2> The mechanical indexer according to Application Example 1, wherein the first spindle and the second spindle are coaxial. <Application example 3> A mechanical indexer according to Application Example 1, wherein each of the first arm and the second arm is configured to be raised and lowered relative to the plurality of processing stations of the substrate processing tool. <Application Example 4> A mechanical indexer according to Application Example 1, wherein the second spindle is disposed within the first spindle. <Application example 5> The mechanical indexer according to Application Example 1, the first arm and the second arm are rotatable to a first configuration; In the first configuration, (i) the first end effector and the second end effector of the first arm are positioned at a first processing station and a third processing station, respectively, among the plurality of processing stations, and (ii) the first end effector and the second end effector of the second arm are positioned at a second processing station and a fourth processing station, respectively, among the plurality of processing stations. <Application Example 6> The mechanical indexer according to Application Example 5, the first arm and the second arm are rotatable to a second configuration; In the second configuration, (i) the first end effector and the second end effector of the first arm are positioned at the first processing station and the third processing station, respectively, of the plurality of processing stations, and (ii) the first end effector and the second end effector of the second arm are positioned at the third processing station and the first processing station, respectively, of the plurality of processing stations. <Application Example 7> A mechanical indexer according to Application Example 6, wherein the first processing station corresponds to the load station of the substrate processing tool. <Application Example 8> A mechanical indexer as described in Application Example 6, wherein (i) the first processing station and the third processing station are positioned at opposite corners of the substrate processing tool, and (ii) the second processing station and the fourth processing station are positioned at opposite corners of the substrate processing tool. <Application Example 9> The mechanical indexer according to Application Example 1, the first arm and the second arm are rotatable to a first configuration; A mechanical indexer, wherein in the first configuration, (i) the first end effector and the second end effector of the first arm are positioned at a first processing station and a fourth processing station, respectively, among the plurality of processing stations, and (ii) the first end effector and the second end effector of the second arm are positioned at a second processing station and a third processing station, respectively, among the plurality of processing stations. <Application Example 10> The mechanical indexer according to Application Example 9, the first arm and the second arm are rotatable to a second configuration; In the second configuration, (i) the first end effector and the second end effector of the first arm are positioned at the first processing station and the fourth processing station, respectively, of the plurality of processing stations, and (ii) the first end effector and the second end effector of the second arm are positioned at the fourth processing station and the first processing station, respectively, of the plurality of processing stations. <Application Example 11> A mechanical indexer as described in Application Example 10, wherein (i) the first processing station and the fourth processing station are arranged on a first side of the substrate processing tool, and (ii) the second processing station and the third processing station are arranged on a second side of the substrate processing tool opposite the first side. <Application Example 12> A mechanical indexer according to Application Example 10, wherein the first processing station and the fourth processing station correspond to load stations of the substrate processing tool. <Application Example 13> 1. A substrate processing tool comprising: a vacuum transfer module; a plurality of processing modules connected to the vacuum transfer module, at least one of the processing modules including the mechanical indexer of Application Example 1; A substrate processing tool comprising: <Application Example 14> A substrate processing tool as described in Application Example 13, wherein the plurality of processing modules include first and second processing modules connected to a first side of the vacuum transfer module, and third and fourth processing modules connected to a second side of the vacuum transfer module. <Application Example 15> The substrate processing tool of Application Example 14, further comprising: (i) an adapter plate disposed between the first side surface and (ii) the first and second processing modules; 10. A substrate processing tool, comprising: a substrate transfer module configured to connect to the first side of the substrate transfer module; and an adapter plate configured to connect to the first and second processing modules. <Application Example 16> A substrate processing tool according to Application Example 14, wherein the first side and the second side of the vacuum transfer module are chamfered. <Application Example 17> A substrate processing tool as described in Application Example 16, further comprising an adapter plate disposed between (i) the first side and (ii) the first and second processing modules, wherein the adapter plate has an angled side configured to connect with the first side of the vacuum transfer module and a flat side configured to connect with the first and second processing modules.

Claims

1. 1. A process module for a substrate processing tool, comprising: a plurality of processing stations each configured to perform a process on a substrate; a mechanical indexer disposed within the processing module, the mechanical indexer comprising a plurality of end effectors including at least a first end effector, a second end effector, and a third end effector; each of the plurality of end effectors extends outward from an axis of the mechanical indexer and is configured to rotate about the axis within the processing module; the mechanical indexer is configured to position each of the plurality of end effectors at one of the plurality of processing stations within the processing module; The processing module, wherein the mechanical indexer is configured to simultaneously position the first end effector, the second end effector, and the third end effector at the same processing station among the plurality of processing stations.

2. 10. The processing module of claim 1, The process module, wherein the mechanical indexer is configured to simultaneously position each of the plurality of end effectors in a load station of the process module.

3. 10. The processing module of claim 1, At least one of the plurality of processing stations is a load station for the processing module.

4. 4. The processing module of claim 3, further comprising: A process module comprising a first slot aligned with the load station and providing access to the load station from a vacuum transfer module external to the process module.

5. 5. A processing module according to claim 4, The processing module, wherein the mechanical indexer is configured to simultaneously receive at least two substrates through the first slot.

6. 4. A processing module according to claim 3, Two of the plurality of processing stations are two load stations of the processing module, the processing module further comprising: a first slot aligned with a first of the two load stations, the first slot providing access to the first load station from a vacuum transfer module external to the process module; a second slot aligned with a second of the two load stations, the second slot providing access to the second load station from the vacuum transfer module; A processing module comprising:

7. 7. A processing module according to claim 6, The processing module, wherein the mechanical indexer is configured to simultaneously receive two substrates through the first slot and two substrates through the second slot.

8. A process module for a substrate processing tool, comprising: a plurality of processing stations each configured to perform a process on a substrate; a mechanical indexer disposed within the processing module, the mechanical indexer comprising a plurality of end effectors including at least a first end effector, a second end effector, and a third end effector; each of the plurality of end effectors extends outward from an axis of the mechanical indexer and is configured to rotate about the axis within the processing module; the mechanical indexer is configured to position each of the plurality of end effectors at one of the plurality of processing stations within the processing module; the mechanical indexer is configured to simultaneously position two or more end effectors of the plurality of end effectors at the same one of the plurality of processing stations; the mechanical indexer comprises a first arm including the first end effector and the second end effector; the mechanical indexer comprises a second arm including the third end effector and a fourth end effector; The mechanical indexer comprises: rotating the first arm and the second arm into an X-shaped configuration such that each of the first end effector, the second end effector, the third end effector, and the fourth end effector is positioned at a different processing station of the plurality of processing stations; rotating the first arm and the second arm such that at least two of the first end effector, the second end effector, the third end effector, and the fourth end effector are vertically stacked at the same one of the plurality of processing stations; A processing module configured to:

9. 9. A processing module according to claim 8, A processing module, wherein the same one of the plurality of processing stations is a load station that aligns with a slot that provides access to the load station from a vacuum transfer module external to the processing module.

10. 9. A processing module according to claim 8, each of the first arm and the second arm is V-shaped; two of the plurality of processing stations are load stations, the two load stations being aligned with respective slots providing access to the load stations from a vacuum transfer module external to the processing module; A processing module, wherein the mechanical indexer is configured to simultaneously rotate the first arm and the second arm such that (i) each of the first end effector and the third end effector is positioned at a first load station of the two load stations, and (ii) each of the second end effector and the fourth end effector is positioned at a second load station of the two load stations.

11. 10. The processing module of claim 1, A processing module, wherein the number of the plurality of end effectors is the same as the number of the plurality of processing stations of the processing module.

12. 10. The processing module of claim 1, The processing module, wherein the plurality of end effectors comprises the first end effector, the second end effector, the third end effector, and a fourth end effector, and the plurality of processing stations comprises four processing stations.

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