Substrate Processing Equipment

Abstract

An embodiment of the present invention provides a substrate processing apparatus having a chemical processing apparatus. The chemical processing apparatus includes a first chemical processing section, a second chemical processing section stacked with the first chemical processing section, a heat processing section arranged opposite to the first chemical processing section and the second chemical processing section, and a substrate transport section arranged between the first chemical processing section, the second chemical processing section, and the heat processing section. The substrate transport section includes at least two first robots, at least one second robot, and at least one third robot arranged in parallel layers, and at least one set of first buffer units arranged between two adjacent first robots and provided for mounting and dismounting via at least one second robot. The at least two first robots are configured to transport substrates between the first chemical processing section and the heat processing section, and the at least one third robot is configured to transport substrates between the second chemical processing section and the heat processing section.

Description

[Technical Field]

[0001] The present invention relates to a substrate processing apparatus, and more particularly to an in-line chemical processing apparatus capable of applying a chemical to a substrate and performing a development process, and a substrate processing apparatus including the same. [Background technology]

[0002] Generally, a method for forming a photoresist pattern on a substrate such as a semiconductor wafer includes a coating process in which a photoresist solution is applied to a substrate using a coating device to form a photoresist film, an exposure process in which a predetermined pattern of light is irradiated onto the photoresist film using an exposure device, and a development process in which a developer is applied to the photoresist film using a development device to form a photoresist pattern.

[0003] Inline chemical processing equipment, in which an exposure device is connected to a coating device and a developing device, is becoming increasingly popular, and a heating device is provided within the chemical processing equipment to heat the substrate before and after the photoresist solution and developing solution are supplied to the substrate.

[0004] In recent years, chemical processing equipment capable of chemical coating and development has been required to be able to process a large number of substrates at once, which has resulted in an increase in the number of heating modules, coating modules, and developing modules.In order to reduce the area occupied by the coating modules and developing modules that make up the chemical processing equipment, the coating modules and developing modules are stacked vertically.

[0005] To perform the coating and developing processes on the substrates, the chemical processing apparatus further includes multiple processing robots that transport the substrates between the heating module, the coating module, and the developing module. Currently, to improve the throughput of chemical processing apparatuses, existing manufacturers simply increase the number of heating modules, coating modules, and developing modules or the number of stacked modules. In this case, the processing robots become overwhelmed and throughput cannot be significantly improved. The transport efficiency of the processing robots limits throughput. Simply increasing the number of heating modules, coating modules, and developing modules or the number of stacked modules without optimizing other components of the chemical processing apparatus makes it difficult to improve throughput. Summary of the Invention

[0006] Embodiments provide a substrate processing apparatus that can provide expansion options to increase productivity.

[0007] The embodiments provide a substrate processing apparatus capable of improving the efficiency of substrate transport so as to improve throughput.

[0008] In one embodiment of the present invention, a substrate processing apparatus includes a chemical processing apparatus configured to process a substrate. The chemical processing apparatus includes a first chemical processing section that supplies a first chemical liquid to a substrate to perform a first chemical processing on the substrate; a second chemical processing section stacked with the first chemical processing section and that supplies a second chemical liquid to the substrate to perform a second chemical processing on the substrate; a heating processing section that is positioned opposite the first and second chemical processing sections and that heats the substrate before or after the first or second chemical processing on the substrate; and a substrate transport section located between the first and second chemical processing sections and the heating processing section. The substrate transport section includes at least two first robots, at least one second robot, and at least one third robot arranged in parallel layers, and at least one first buffer unit that is positioned between two adjacent first robots and is provided for loading and unloading the substrate via the at least one second robot. The at least two first robots are configured to transport substrates between the first chemical liquid processing unit and the heat processing unit, and the at least one third robot is configured to transport substrates between the second chemical liquid processing unit and the heat processing unit.

[0009] An embodiment provides a chemical processing apparatus capable of automatically adjusting at least one nozzle to align with the center of a substrate placed in a processing unit.

[0010] In one embodiment of the present invention, a chemical solution treatment apparatus includes at least one nozzle device, at least one treatment unit, and a control unit. The nozzle device includes a support arm, a drive actuator disposed on the support arm, a nozzle holder connected to the drive actuator and driven to move by the drive actuator, at least one nozzle fixed to the nozzle holder, a support shaft fixed to the support arm, a vertical drive device connected to the support shaft and driving the support shaft to raise and lower it, and a rotation drive device connected to the support shaft and driving the support shaft to rotate it. The control unit is connected to the drive actuator, the lift drive device, and the rotation drive device.

[0011] In one embodiment of the present disclosure, a method for adjusting at least one nozzle to be aligned with the center of a substrate placed in a processing unit includes setting polar coordinates in a control unit connected to a rotational drive device that drives at least one nozzle to rotate, a vertical drive device that drives the at least one nozzle to raise and lower, and a drive actuator that drives the at least one nozzle to move back and forth, obtaining a polar point at which the at least one nozzle is aligned with the center of a substrate in a processing unit, storing the polar point of the at least one nozzle in the control unit, and the control unit sending instructions to the rotational drive device and the drive actuator based on the polar point of the at least one nozzle stored in the control unit to cause the at least one nozzle to reach the polar point so that the at least one nozzle is aligned with the center of a substrate in the processing unit. [Brief explanation of the drawings]

[0012] The above and other aspects, features, and advantages of the presently disclosed subject matter will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings. [Figure 1] FIG. 1 is a perspective view of a substrate processing apparatus according to one embodiment of the present invention. [Figure 2]FIG. 2 is a front perspective view of a substrate processing apparatus according to an embodiment of the present invention. [Figure 3] FIG. 3 is a rear perspective view of a substrate processing apparatus according to an embodiment of the present invention. [Figure 4] FIG. 4 is a top view of a developing module of a substrate processing apparatus according to one embodiment of the present invention. [Figure 5] FIG. 5 is a top view of a coating module of a substrate processing apparatus according to one embodiment of the present invention. [Figure 6] FIG. 6 is a perspective view of a processing block of a substrate processing apparatus according to one embodiment of the present invention. [Figure 7] FIG. 7 is a perspective view of a processing block with the develop and coat modules hidden, in accordance with one embodiment of the present invention. [Figure 8] FIG. 8 is a perspective view of a processing block with the heating module hidden, according to one embodiment of the present invention. [Figure 9] FIG. 9 is a perspective view of a processing block with the heating module hidden, according to another embodiment of the present invention. [Figure 10] FIG. 10 is a perspective view of a processing block with the heating module hidden in accordance with yet another embodiment of the present invention. [Figure 11] FIG. 11 is a perspective view of a processing block with the heating modules hidden, according to another embodiment of the present invention. [Figure 12] FIG. 12 is a perspective view of a substrate processing apparatus according to another embodiment of the present invention. [Figure 13] FIG. 13 is a front perspective view of a substrate processing apparatus according to another embodiment of the present invention. [Figure 14] FIG. 14 is a rear perspective view of a substrate processing apparatus according to another embodiment of the present invention. [Figure 15] FIG. 15 is a top view of a developing module of a substrate processing apparatus according to another embodiment of the present invention. [Figure 16] FIG. 16 is a top view of a coating module of a substrate processing apparatus according to another embodiment of the present invention. [Figure 17] FIG. 17 is a perspective view of a processing block of a substrate processing apparatus according to another embodiment of the present invention. [Figure 18] FIG. 18 is a perspective view of a processing block with the develop and coat modules hidden in accordance with another embodiment of the present invention. [Figure 19] FIG. 19 is a perspective view of a processing block with the heating modules hidden, according to another embodiment of the present invention. [Figure 20] FIG. 20 is a perspective view of a processing block with the develop and coat modules hidden in accordance with yet another embodiment of the present invention. [Figure 21] FIG. 21 is a perspective view of a processing block with the develop and coat modules hidden in accordance with yet another embodiment of the present invention. [Figure 22] FIG. 22 is a perspective view of a substrate processing apparatus according to yet another embodiment of the present invention. [Figure 23] FIG. 23 is a diagram for explaining a procedure for controlling the temperature of a substrate in a heating module according to one embodiment of the present invention. [Figure 24] FIG. 24 is a perspective view of a coating module in a chemical solution treatment device according to one embodiment of the present invention. [Figure 25] FIG. 25 is a top view of a coating module in a chemical solution treatment device according to another embodiment of the present invention. [Figure 26] FIG. 26 is a block diagram illustrating the control of aligning a coat or develop nozzle with the center of a substrate in a coat or develop unit in one embodiment of the present invention. [Figure 27] FIG. 27 is a diagram for explaining an example of a method for aligning a coating nozzle or a developing nozzle with the center of a substrate in a coating unit or a developing unit in a chemical solution treatment apparatus according to one embodiment of the present invention. [Figure 28] FIG. 28 is a perspective view of a developing module in a chemical treatment apparatus according to one embodiment of the present invention. [Figure 29] FIG. 29 is a perspective view of a coating module in a chemical solution treatment device according to another embodiment of the present invention. [Figure 30] FIG. 30 is a perspective view of a coating module with multiple chemical nozzles hidden according to another embodiment of the present invention. [Figure 31] FIG. 31 is a perspective view of a chemical nozzle of a coating module pulled out and rotated to the center of a substrate placed in a coating unit according to one embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0013] In order to understand the configuration and effects of the present invention, the embodiments of the present invention will be described in more detail below with reference to the accompanying drawings showing the embodiments of the present invention. However, the specific structural and functional details are merely representative for illustrating the embodiments. Therefore, the present invention can be embodied in many alternative forms and should not be construed as being limited to only the exemplary embodiments described herein. The exemplary embodiments cover all modifications, equivalents, and alternatives within the scope of the concept of the present invention.

[0014] Although terms such as first, second, etc. are used herein to describe various elements, it is understood that these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, a first element can be referred to as a second element, and similarly, a second element can be referred to as the first element, without departing from the scope of the exemplary embodiments. As used herein, the term "and / or" includes any and all combinations of one or more of the listed items.

[0015] Spatially relative terms such as "below," "below," "belower," "above," and the like may be used to describe the relationship of one element or feature to another element or feature illustrated in the figures. For example, if a device in the figures were turned over, an element described as "below" or "below" another element or feature would change to "above" that other element or feature. Thus, for example, the term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or viewed or referenced from another direction) and the spatially relative descriptions should be interpreted accordingly.

[0016] The terms used herein are for the purpose of describing particular embodiments only and are not intended to limit the concepts of the present invention. As used herein, the singular forms "a," "an," and "the" include the plural forms unless the context clearly dictates otherwise. It is further understood that as used herein, the words "comprise" and / or "have" specify the presence of stated features, values, steps, operations, elements, components, and / or groups thereof, but do not exclude the presence of one or more additional distinct features, values, steps, operations, elements, components, and / or groups thereof.

[0017] 1 to 8, a substrate processing apparatus according to an exemplary embodiment of the present invention is shown. The substrate processing apparatus 100 includes a first transfer block 110, a processing block 120, a second transfer block 130, and a connecting block 140.

[0018] The first transfer block 110 is configured to load and unload substrates into and from the processing block 120 via a first transfer unit 114 provided in the first transfer block 110. The first transfer block 110 has a plurality of cassette mounting sections 111 provided with a plurality of cassettes 112 in which a certain number of substrates (e.g., 25 wafers) are sealed and stored. A plurality of opening / closing sections 113 are arranged in front of the first transfer block 110 and correspond to the plurality of cassette placement sections 111 along the substrate transfer direction, and substrates stored in the cassettes 112 are transferred to the first transfer block 110 through the opening / closing sections 113.

[0019] The processing block 120 is disposed on one side of the first transport block 110 and performs chemical processing, heat processing, and the like. A chemical processing device, which will be described later, is disposed within the processing block 120. The second transport block 130, which connects the processing block 120 and the connecting block 140, is disposed on one side of the processing block 120, and the connecting block 140, which performs in-line operations with external devices such as a developing device (not shown), is disposed on one side of the second transport block 130. The second transport block 130 transports substrates that have been coated in the processing block 120 to the connecting block 140 via the second transport unit 131, and transports substrates that have been exposed in the exposure device to the processing device 120. The connecting block 140 transports substrates that have been exposed in the exposure device to the processing block 120 via the third transport unit 141, and transports substrates that have been coated in the processing block 120 to the exposure device.

[0020] Although the substrate processing apparatus 100 is divided into four blocks in the example shown, the present invention is not limited to this. The present invention can be applied to any apparatus in which the processing block 120, which is provided with a chemical processing device that performs coating and development processes, is connected to an external device in an in-line format.

[0021] The processing block 120 according to the embodiment of the present invention includes a chemical processing device that performs chemical processing and heat treatment on a substrate. The chemical processing device includes a first chemical processing unit 1210, a second chemical processing unit 1220, a heat processing unit 1230, and a substrate transport unit 1240. The first chemical processing unit 1210 supplies a first chemical to a substrate to perform the first chemical processing. The second chemical processing unit 1220 is stacked on the first chemical processing unit 1210 and supplies a second chemical to a substrate to perform the second chemical processing. The heat processing unit 1230 is positioned opposite the first and second chemical processing units 1210 and 1220 and performs heat treatment on the substrate before or after the first or second chemical processing. The substrate transport unit 1240 is positioned between the first and second chemical processing units 1210 and 1220 and the heat processing unit 1230. The substrate transport section 1240 includes at least two first robots 1241 and 1242, at least one second robot 1243, at least one third robot 1244, and at least one set of first buffer units 1251 and 1252. The at least two first robots 1241 and 1242, the at least one second robot 1243, and the at least one third robot 1244 are arranged in parallel layers. The at least two first robots 1241 and 1242 transport substrates between the first chemical solution processor 1210 and the heat processor 1230. The at least one third robot 1244 transports substrates between the second chemical solution processor 1220 and the heat processor 1230. At least one pair of first buffer units 1251 and 1252 is disposed between two adjacent first robots 1241 and 1242 and is provided for loading and unloading of substrates via at least a second robot 1243 .

[0022] According to one embodiment of the present invention, the first chemical processing unit 1210 is disposed at the lower side of the processing block 120 and performs a coating process on substrates transported through the first transfer block 110. The first chemical processing unit 1210 has a plurality of first processing modules 1211. The plurality of first processing modules 1211 are arranged in a plurality of rows, each row having one or more layers. For example, in one embodiment, the first chemical processing unit 1210 has four first processing modules 1211, which are arranged in two rows, each row having two layers. Each first processing module 1211 is a coating device that applies a photoresist solution to a substrate to form a photoresist film for forming a pattern on the substrate. The second chemical processing unit 1220 is disposed at the upper side of the processing block 120 and performs a development process on substrates that have been exposed in an exposure device and transported into the processing block 120 through the second transfer block 130. The second chemical processing unit 1220 has a plurality of second processing modules. The second processing modules 1221 are arranged in multiple rows, each row having one or more layers. For example, in one embodiment, the second chemical processing unit 1220 has four second processing modules 1221, which are arranged in two rows, each row having two layers. Each second processing module 1221 is a developing device that supplies a developer to the substrate.

[0023] The heating processing unit 1230 has a plurality of heating modules 1231. The plurality of heating modules 1231 are arranged in a plurality of rows, and each row has a plurality of layers. Each heating module 1231 is a heating device that heats a substrate to a required temperature before or after the first chemical liquid processing on the substrate or the second chemical liquid processing on the substrate.

[0024] Referring to FIG. 23 , in one embodiment of the present invention, the multiple layers in each row of heating modules 1231 are configured in a wafer cassette format, and the spacing between the heating modules 1231 is adjustable. A method for controlling the temperature of a substrate is illustrated in FIG. 23 . The heating plates in each heating module 1231 may be heated to different temperatures. For example, the heating plate set to the lowest temperature may be located in the heating module 1231 located in the bottom layer, and the heating plate set to the highest temperature may be located in the heating module 1231 located in the top layer. This is because the heating plate with the lowest temperature is located in the bottom layer and is therefore less susceptible to the heat generated by the heating plate with the highest temperature located in the top layer. Five examples are described below. In these examples, there are four heating modules 1231 configured in a wafer cassette format.

[0025] First, in the basic case, the temperatures of the four heating plates are different from each other, for example, 200°C, 180°C, 150°C, and 120°C (see a1), and the four heating modules are arranged at the same intervals (for example, 30 mm) regardless of the temperature differences (see a2).

[0026] In the first case, Case 1, the four heating plates have the same temperature, for example, 120°C (see b1), and the four heating modules 1231 are arranged at the same intervals, for example, with no gaps (0 mm) (see b2). In this case, the heating plate in the topmost heating module 1231 may be arranged at a fixed interval from the top surface of the heating module 1231.

[0027] In the second case, Case 2, the temperatures of the four heating plates are 200°C, 200°C, 120°C and 120°C (see c1), and the four heating modules 1231 are arranged with only heating plates of different temperatures spaced apart at regular intervals; for example, adjacent heating modules 1231 with heating plates of 200°C and 120°C are spaced apart at a regular interval (e.g., 90 mm) (see c2).

[0028] In the third case, Case 3, the temperatures of the four heating plates are 180°C, 150°C, 150°C, and 120°C (see d1), and the four heating modules 1231 having heating plates of different temperatures are arranged at different intervals. For example, adjacent heating modules 1231 having heating plates of 180°C and 150°C are arranged at a fixed interval (e.g., 60 mm) between them, and adjacent heating modules 1231 having heating plates of 150°C and 120°C are arranged at a fixed interval (e.g., 30 mm) between them (see d2). At this time, the temperature difference between adjacent heating plates is the same (30°C) as the temperature difference between another adjacent heating plate, but the four heating modules 1231 are arranged at different intervals between an adjacent heating module 1231 having a 180°C heating plate and a heating module 1231 having a 150°C heating plate, and between another adjacent heating module 1231 having a 150°C heating plate and a heating module 1231 having a 120°C heating plate.

[0029] In the fourth case, Case 4, the temperatures of the four heating plates are 200°C, 150°C, 150°C, and 120°C (see e1), and only the heating modules having heating plates of different temperatures are arranged at equal intervals among the four heating modules 1231. For example, adjacent heating module 231 having a 200°C heating plate and heating module 1231 having a 150°C heating plate are arranged at a fixed interval (e.g., 60 mm), and adjacent heating module 1231 having a 150°C heating plate and heating module 1231 having a 120°C heating plate are arranged at a fixed interval (e.g., 60 mm) (see e2). In this case, the temperature difference between adjacent heating plates (50°C) is different from the temperature difference between another adjacent heating plate (30°C), but the four heating modules are arranged with the same spacing between adjacent heating module 231 having a 200°C heating plate and heating module 1231 having a 150°C heating plate as between adjacent heating module 1231 having a 150°C heating plate and heating module 1231 having a 120°C heating plate.

[0030] A non-limiting example of a method for controlling the temperature of the substrate is shown in FIG. 23, and the temperature of the substrate may be controlled by adjusting the spacing between the heating modules 1231 in a variety of ways.

[0031] From the above description, it can be seen that the temperature difference between the heating plates can be controlled by adjusting the spacing between the heating modules 1231, and therefore the heating plates can be controlled to different temperatures. Furthermore, the heating modules 1231 may be configured in a wafer cassette format, with multiple heating modules 1231 arranged in internal slots of the wafer cassette format, allowing the spacing between the heating plates to be freely adjusted and controlled. Therefore, the influence of the heat around the heating plates is minimized, and the gap between the heating plates can be easily changed according to this heat influence.

[0032] The substrate transport section 1240 includes at least two first robots 1241 and 1242 and at least one second robot 1243. The first robots 1241 and 1242 transport substrates between the first chemical solution processing section 1210 and the heat processing section 1230. The first robot 1241 places the substrates processed in the first chemical solution processing section 1210 and the heat processing section 1230 in the first buffer unit 1251. The second robot 1243 removes the substrates from the first buffer unit 1251 and transports the substrates to be processed in the exposure tool via the second transport block 130 and the connecting block 140. The second robot 1243 also receives substrates transported from the first transport block 110 and attaches the substrates to another first buffer unit 1252. Another first robot 1242 receives substrates from another first buffer unit 1252 and transports the substrates to be processed in the first chemical solution processing unit 1210 and the heating processing unit 1230. The second robot 1243 has an end effector 12431 for transporting multiple (e.g., five) substrates. The second robot 1243 moves along guide rails 12432 arranged in the substrate transport unit 1240. To supply clean gas, a first fan filter unit (FFU) 1261 is located above the two first robots 1241, 1242, and a second fan filter unit (FFU) is located above the second robot 1243.

[0033] In one embodiment, the second robot 1243 is disposed below the two first robots 1241, 1242 and is disposed parallel to the two first robots 1241, 1242. A guide rail 12432 is disposed horizontally at the bottom of the substrate transport section 1240.

[0034] The substrate transport section 1240 includes at least one pair of first buffer units 1251, 1252 arranged between two adjacent first robots 1241, 1242. Referring to FIGS. 7 and 8, a first embodiment of the first buffer units 1251, 1252 is disclosed. In this embodiment, the two first buffer units 1251, 1252 are arranged side by side parallel to a guide rail 12432. The two first buffer units 1251, 1252 are configured to be liftable and lowerable. For example, the two first buffer units 1251, 1252 may be liftable and lowerable along corresponding frames. To perform processing on a substrate, the first robot 1241 retrieves the substrate to be coated from the first transport block 110 and transports the substrate to the first processing module 1211 and the heating module 1231. During this time, the first buffer unit 1252 descends, and the second robot 1243 retrieves the substrate to be coated from the first transport block 110 and transports the substrate to the first buffer unit 1252. The first buffer unit 1252 ascends, and the first robot 1242 retrieves the substrate from the first buffer unit 1252 and transports it to the first processing module 1211 and the heating module 1231. After the substrate has been processed in the first processing module 1211 and the heating module 1231, the first robot 1241 transports the substrate to the first buffer unit 1251. The first buffer unit 1251 descends, and the second robot 1243 retrieves the substrate from the first buffer unit 1251 and transports it to the second transport block 130. After the substrate has been processed in the first processing module 1211 and the heating module 1231, the first robot 1242 transports the substrate to the second transport block 130.

[0035] Referring to FIG. 9 , a second embodiment of the first buffer units 1251 and 1252 is disclosed. In this embodiment, the two first buffer units 1251 and 1252 are stacked and can be raised and lowered. For example, the two first buffer units 1251 and 1252 may be raised and lowered together along a support frame. To process a substrate, the first robot 1241 retrieves the substrate to be coated from the first transfer block 110 and transports the substrate to the first processing module 1211 and the heating module 1231. During this process, the first buffer units 1251 and 1252 descend, and the second robot 1243 retrieves the substrate to be coated from the first transfer block 110 and transports the substrate to the first buffer unit 1252. The first buffer units 1251, 1252 are raised, and the first robot retrieves the substrate from the first buffer unit 1252 and transfers it to the first processing module 1211 and the heating module 1231. After the substrate has been processed in the first processing module 1211 and the heating module 1231, the first robot 1241 transfers it to the first buffer unit 1251. The first buffer units 1251, 1252 are lowered, and the second robot 1243 retrieves the substrate from the first buffer unit 1251 and transfers it to the second transfer block 130. After the substrate has been processed in the first processing module 1211 and the heating module 1231, the first robot 1242 transfers it to the second transfer block 130. Compared with the first embodiment of the first buffer units 1251, 1252, this embodiment can save more space.

[0036] Referring to FIG. 10 , a third embodiment of the first buffer units 1251 and 1252 is disclosed. In this embodiment, the two first buffer units 1251 and 1252 are arranged side by side perpendicular to the guide rail 12432. The two first buffer units 1251 and 1252 are configured to be liftable and lowerable. For example, the two first buffer units 1251 and 1252 may be lifted and lowered together along a support frame. To process a substrate, the first robot 1241 retrieves the substrate to be coated from the first transport block 110 and transports the substrate to the first processing module 1211 and the heating module 1231. During this process, the first buffer units 1251 and 1252 descend, and the second robot 1243 retrieves the substrate to be coated from the first transport block 110 and transports the substrate to the first buffer unit 1252. The first buffer units 1251, 1252 are raised, and the first robot retrieves the substrate from the first buffer unit 1252 and transfers it to the first processing module 1211 and the heating module 1231. After the substrate has been processed in the first processing module 1211 and the heating module 1231, the first robot 1241 transfers the substrate to the first buffer unit 1251. The first buffer units 1251, 1252 are lowered, and the second robot 1243 retrieves the substrate from the first buffer unit 1251 and transfers it to the second transfer block 130. After the substrate has been processed in the first processing module 1211 and the heating module 1231, the first robot 1242 transfers the substrate to the second transfer block 130.

[0037] Referring to FIG. 11 , a fourth embodiment of the first buffer units 1251 and 1252 is disclosed. In this embodiment, two first buffer units 1251 and 1252 are stacked, with the upper first buffer unit 1251 fixed and the lower first buffer unit 1252 movable. For example, the first buffer unit 1252 may be moved up and down along a support frame. To process a substrate, the first robot 1241 retrieves the substrate to be coated from the first transfer block 110 and transports it to the first processing module 1211 and the heating module 1231. During this process, the first buffer unit 1252 descends, and the second robot 1243 retrieves the substrate to be coated from the first transfer block 110 and transports it to the first buffer unit 1252. The first buffer unit 1252 rises, and the first robot 1242 retrieves the substrate from the first buffer unit 1252 and transfers the substrate to the first processing module 1211 and the heating module 1231. After the substrate has been processed in the first processing module 1211 and the heating module 1231, the first robot 1241 transfers the substrate to the first buffer unit 1251. The first robot 1242 retrieves the substrate from the first buffer unit 1251 and transfers the substrate to the second transport block 130. After the substrate has been processed in the first processing module 1211 and the heating module 1231, the first robot 1242 transfers the substrate to the second transport block 130.

[0038] The substrate transport section 1240 includes at least one third robot 1244 that transports substrates between the second chemical solution processing section 1220 and the heat processing section 1230. The third robot 1244 retrieves the substrate to be developed from the second transport block 130 and transports the substrate to the second processing device 1221 and the heat processing device 1231. After the substrate is processed in the second processing module 1221 and the heat processing section 131, the third robot 1244 transports the substrate to the first transport block 110. A third fan filter unit (FFU) 1263 is disposed above the third robot 1244 to supply clean gas. The two first robots 1241 and 1242, the second robot 1243, and the third robot 1244 are disposed in parallel layers in the substrate transport section 1240.

[0039] In an exemplary embodiment of the present invention, the processing block 120 further includes a set of second buffer units 1253 and 1254, a set of third buffer units 1255 and 1256, and at least one set of fourth buffer units 1257 and 1258. One second buffer unit 1253 is configured to accommodate the first transport block 110 and the first robot 1241, while the other second buffer unit 1254 is configured to accommodate the other first transport robot 1242 and the second transport block 130. One third buffer unit 1255 is configured to accommodate the first transport block 110 and the second robot 1243, while the other third buffer unit 1256 is configured to accommodate the second transport robot 1243 and the second transport block 130. One fourth buffer unit 1257 is configured to accommodate the second transport block 130 and the third robot 1244, while the other fourth buffer unit 1258 is configured to accommodate the third transport robot 1244 and the first transport block 110.

[0040] In one embodiment, the second robot 1243 is located at the bottom of the substrate transport section 1240, and both of the two third buffer units 1255, 1256 are liftable to facilitate substrate transport.

[0041] The operation of the substrate processing apparatus 100 according to one embodiment of the present invention will now be described with reference to the drawings. It should be appreciated that the operation of the substrate processing apparatus 100 of the present invention may be modified according to the requirements of different processes.

[0042] A cassette 112 containing substrates is attached to a cassette attachment portion 111 of a first transport block 110. The substrates stored in the cassette 112 are attached to the first transport block 110 by a first transport unit 114 provided in the first transport block 110 through an opening / closing portion 113.

[0043] The third buffer unit 1255 moves up. The substrates attached to the first transport block 110 are transported to the second buffer unit 1253 and the third buffer unit 1255 for coating in the chemical treatment device. The first robot 1241 retrieves the substrate to be coated from the second buffer unit 1253 and transports the substrate to the first processing module 1211 and the heating module 1231. During this time, the first buffer unit 1252 and the third buffer unit 1255 move down, and the second robot 1243 retrieves the substrate to be coated from the third buffer unit 1255 and transports the substrate to the first buffer unit 1252. The first buffer unit 1252 moves up, and the first robot 1242 retrieves the substrate from the first buffer unit 1252 and transports the substrate to the first processing module 1211 and the heating module 1231. After the substrate has been processed in the first processing module 1211 and the heating module 1231, the first robot 1241 transports the substrate to the first buffer unit 1251. The first buffer unit 1251 and the third buffer unit 1256 are lowered, and the second robot 1243 retrieves the substrate from the first buffer unit 1251 and transports the substrate to the third buffer unit 1256. After the substrate has been processed in the first processing module 1221 and the heating module 1231, the first robot 1242 transports the substrate to the second buffer unit 1254. The coating processes of the ARC film and the photoresist film may be completed in the first chemical processing unit 1210.

[0044] The third buffer unit 1256 rises. The substrates transported to the second buffer unit 1254 and the third buffer unit 1256 are then transported to the second transport block 130, and then transported to the connecting block 140 via the second transport unit 131 and the third transport unit 141. The substrates transported to the connecting block 140 may be transported to an exposure apparatus (not shown) via the third transport unit 141 provided in the connecting block 140. The substrates for which the exposure process has been completed may be collected and transported to the second transport block 130.

[0045] The substrate transported to the second transport block 130 may be transported to the fourth buffer unit 1257. The third robot 1244 retrieves the substrate from the fourth buffer unit 1257 and transports the substrate to the second processing module 1221 and the heating module 1221 to perform development processing on the substrate. The substrate after the development processing may be transported to the fourth buffer unit 1258.

[0046] The substrates in the fourth buffer unit 1258 may be collected and transported to the slots of the first cassette 112 via the first transport unit 114 of the first transport block 110.

[0047] Because the time requirement (from the time a substrate is coated to the time it is exposed) is not too strict and the substrate coating time is shorter than the development time, one first robot can work in conjunction with the second robot to transport substrates to two rows of four coating units or three rows of six coating units, thereby reducing the burden on the first robot. Furthermore, the two first robots can transport substrates independently, and one first robot does not transport substrates to the other first robot, improving substrate transport efficiency and reducing particle contamination. Furthermore, because the substrate development time must be precisely controlled, substrates undergoing development are transported one by one via the third robot.

[0048] One notable advantage of the substrate processing apparatus 100 is that it provides expandability options. To increase productivity, the number of first processing modules 1211, second processing modules 1221, and heating modules 1231 can be increased. Furthermore, to improve the efficiency of substrate transfer, the number of first robots, second robots, and third robots can be increased. An example will be described below.

[0049] 12 to 19, a substrate processing apparatus 200 according to another exemplary embodiment of the present invention is shown. The substrate processing apparatus 200 includes a first transport block 110, a processing block 120', a second transport block 130, and a connecting block 140. The configurations of the first transport block 110, the third transport block 130, and the connecting block 140 are similar to those of the substrate processing apparatus 100. Therefore, repeated description of the first transport block 110, the third transport block 130, and the connecting block 140 will not be provided.

[0050] Compared with the processing block 120 of the substrate processing apparatus 100, the processing block 120' of the substrate processing apparatus 200 can be regarded as an extension based on the processing block 120, including a plurality of first processing modules 1211, a plurality of second processing modules 1221, and a plurality of heating modules 1231. In this embodiment, the processing block 120' has six first processing modules 1211 and six second processing modules 1221, both of which are arranged in three rows, with each row having two layers.

[0051] To improve substrate transport efficiency, the processing block 120′ further includes another first robot 2241 corresponding to the added first processing module 1211. Another set of first buffer units 2251, 2252 are added and arranged between two adjacent first robots 2241, 1242. The processing block 120′ further includes another third robot 2244 arranged parallel to the third robot 1244. Accordingly, another third fan filter unit (FFU) 2263 is arranged above the third robot 2244, and another set of fourth buffer units 2257, 2258 are configured to correspond to the third robot 2244. One fourth buffer unit 2257 corresponds to the second transport block 130 and the third robot 2244, and the other fourth buffer unit 2258 corresponds to the third robot 2244 and the first transport block 110. The third robot 1244 is disposed above the other third robot 2244 and is responsible for transporting substrates between the second processing module 122 on the upper layer and the heating module 1231. The other third robot 2244 is responsible for transporting substrates between the second processing module 1221 on the lower layer and the heating module 1231.

[0052] 20 shows a processing block with the first and second processing modules hidden according to another embodiment of the present invention. In this embodiment, processing block 120" is substantially the same as processing block 120, except that within processing block 120", a second robot 1243 is disposed above the two first robots 1241 and 1242. A guide rail 12432 of the second robot 1243 is disposed vertically on the side wall of the substrate transport section 1240. A set of third buffer units 1255 and 1256 corresponding to the second robot 1243 are disposed above a set of second buffer units 1253 and 1254 corresponding to the two first robots 1241 and 1242. Since the second robot 1243 is positioned relatively high, the second robot 1243 can simply receive the substrate to be processed from the third buffer unit 1255 and place it in the third buffer unit 1256, eliminating the need to raise and lower the pair of third buffer units 1255, 1256. In addition, the first robots 1241, 1242 and the second robot 1243 may share one fan filter unit (FFU) 1261 arranged above the second robot 1243, and the first fan filter unit (FFU) 1261 arranged above the first robots 1241, 1242 may be omitted.

[0053] Referring to FIG. 21 , a processing block with the first and second processing modules hidden is shown according to yet another embodiment of the present invention. In this embodiment, the processing block 120′″ is substantially the same as the processing block 120, except that the processing block 120′″ further includes another second robot 3243 and another fourth buffer unit 3258. The two second robots 1243, 3243 are arranged parallel to the first robots 1241, 1242 and are located on both sides of the first buffer units 1251, 1252. Specifically, the two second robots 1243, 3243 are arranged below the first robots 1241, 1242. The two second robots 1243, 3243 share the same guide rail. The first buffer units 1251, 1252 are arranged side by side, and the arrangement direction of the first buffer units 1251, 1252 is perpendicular to the guide rail. The first buffer units 1251 and 1252 are configured to be movable up and down. The first buffer units 1251 and 1252 are located between the two first robots 1241 and 1242. To process a substrate, the first robot 1241 receives the substrate to be coated from the second buffer unit 1253 and transports the substrate to the first processing module 1211 and the heating module 1231. Meanwhile, the first buffer unit 1252 descends, and the second robot 1243 receives the substrate to be coated from the third buffer unit 1255 and transports the substrate to the first buffer unit 1252. The first buffer unit 1252 ascends, and the first robot 1242 receives the substrate from the first buffer unit 1252 and transports the substrate to the first processing module 1211 and the heating module 1231. After the substrate has been processed in the first processing module 1211 and the heating module 1231, the first robot 1241 transfers the substrate to the first buffer unit 1251. The first buffer unit 1251 is lowered and the second robot 3243 receives the substrate from the first buffer unit 1251 and transfers the substrate to the third buffer unit 1256. After the substrate has been processed in the first processing module 1221 and the heating module 1231, the first robot 1242 transfers the substrate to the second buffer unit 1254.

[0054] The substrate processing apparatus of the present invention may perform both the coating process and the developing process. Alternatively, the substrate processing apparatus of the present invention may perform either the coating process or the developing process. For example, when only the developing process is performed, the third robot 1244 receives the substrate to be developed from the fourth buffer unit 1258 and transports the substrate to the second processing module 1221 and the heating module 1231. After the substrate is processed in the second processing module 1221 and the heating module 1231, the third robot 1244 transports the substrate to the other fourth buffer unit 3258, and the substrate in the fourth buffer unit 3258 is collected and transported to a slot of the first cassette 112 via the first transport unit 114 of the first transport block 110. It should be appreciated that the application of these buffer units may be adjusted according to the processing requirements to achieve different processing purposes.

[0055] 22 shows a substrate processing apparatus according to another embodiment of the present invention. The substrate processing apparatus 800 is substantially the same as the substrate processing apparatus 100, except that in the substrate processing apparatus 800, a first chemical processing unit 1210 having a plurality of first processing modules 1211 is located above a second chemical processing unit 1220 having a plurality of second processing modules 1221 inside a processing block 120, and correspondingly, at least two first robots and at least one second robot are arranged above at least one third robot.

[0056] 24, 26, and 27, the first processing module 1211 may be a coating module disposed in a chemical liquid treatment device. The coating module 1211 includes a support table 1212, two coating units 1213 arranged on the support table 1212, a coating nozzle device 1214 positioned in the middle between the two coating units 1213, two edge cleaning devices 1216, and a control unit 1215.

[0057] The application nozzle device 1214 includes a horizontally disposed support arm 12141, a drive actuator 12142 disposed on the support arm 12141, a nozzle holder 12144 connected to the drive actuator 12142 and driven by the drive actuator to move back and forth, at least one nozzle fixed to the nozzle holder 12144, a support shaft 12145 fixed to the support arm 12141, a vertical drive unit 12146 connected to the support shaft 12145 and driving the support shaft to raise and lower it, and a rotation drive unit 12147 connected to the support shaft 12145 and driving the support shaft 12145 to rotate it. In one embodiment, the drive actuator 12142 has a slide recess 12143. An end of the nozzle holder 12144 is disposed within the slide recess 12143 and is configured to be movable back and forth within the slide recess 12143 by being driven by the drive actuator 12142. The drive actuator 12142 may be a linear motor. The nozzle is a coating nozzle used to supply photoresist liquid to substrates located in two coating units 1213 arranged in the same row, and is located centrally between the two coating units 1213. The coating nozzle includes a solvent nozzle PW that supplies solvent to the substrate and multiple chemical nozzles PR, such as PR1, PR2, PR3, and PR4, that supply photoresist liquid to the substrate. The solvent nozzle PW is located centrally among the multiple chemical nozzles PR1, PR2, PR3, and PR4 and supplies solvent to the substrate, making the substrate surface hydrophilic before the photoresist liquid is supplied from the multiple chemical nozzles PR1, PR2, PR3, and PR4. Pipes connected to the solvent nozzle and the multiple chemical nozzles each pass through the support shaft 12145 and support arm 12141, and the support shaft 12145 and support arm 12141 provide space for the pipes to move.

[0058] 25, in another embodiment, a plurality of holes, for example five holes, for mounting a solvent nozzle PW and a plurality of chemical nozzles PR1, PR2, PR3, and PR4 are formed at the end of nozzle holder 12144′ to facilitate alignment of the coating nozzles with the centers of the substrates placed in each of two coating units 1213. The centers of the holes and the centers of the two coating units 1213 are on the same arc.

[0059] Each edge cleaning device 1216 corresponds to one coating unit 1213 and is configured to remove a photoresist film formed on the edge of a substrate placed in the coating unit 1213. Each edge cleaning device 1216 includes a dispenser holder 12161 and a dispenser 12162 attached to one end of the dispenser holder 12161 for supplying a cleaning liquid to the edge of the substrate to remove the photoresist film formed on the edge of the substrate. The other end of the dispenser holder 12161 is connected to a vertical drive actuator 12163. The vertical drive actuator 12163 is configured to drive the dispenser holder 12161 to move it vertically and adjust the distance between the dispenser 12162 and the substrate. The horizontal drive actuator 12164 drives the dispenser holder 12161 together with the vertical drive actuator 12163 to move the dispenser holder 12161 horizontally and adjust the removal width of the photoresist film formed on the edge of the substrate.

[0060] The control unit 1215 is connected to the drive actuator 12142, vertical drive device 12146, and rotation drive device 12147 of the coating nozzle device 1214, and can control the coating nozzle to be aligned with the center of the substrates placed in two coating units 1213 arranged in the same row. The control unit 1215 is connected to the vertical drive actuator 12163 and horizontal drive actuator 12164 of the edge cleaning device 1216, and can control the removal width of the photoresist film formed on the substrate edge.

[0061] 26 and 27, before using the coating nozzles to supply photoresist liquid to the substrates in the two coating units 1213, it is essential to adjust each nozzle to align it with the center of the substrate in the two coating units 1213. The adjustment method may include the following steps: Step 1: In the control unit 1215, a polar coordinate system is set in which the polar point O is on the axis of the support shaft 12145 and the polar axis OX is parallel to a line passing through the center points of the two coating units 1213 arranged in the same row. Step 2: The pole point of each nozzle is obtained and recorded in the control unit 1215. Here, the pole point of each nozzle is aligned with the center of the substrate in the coating unit 1213. Step 3: Based on the pole points of each nozzle recorded in the control unit 1215, the control unit 1215 sends a command to the rotary drive device 12147 and the drive actuator 12142 to make each nozzle reach its pole point so that it is aligned with the center of the substrate that needs to be processed in the coating unit 1213. For example, if the nozzle PR1 is used to supply photoresist liquid onto the substrate in the coating unit 1213, the control unit 1215 sends a command to the rotary drive device 12147 and the drive actuator 12142 to rotate and linearly move the nozzle holder 12144 to position the nozzle PR1 at the pole point P(r1, θ1) of the nozzle PR1 so that the nozzle PR1 is aligned with the center of the substrate.

[0062] In step 2, the method for obtaining the pole points of each nozzle further comprises: First, the standard sample W is placed in the coating unit 1213, the camera 1217 is placed at the center of the standard sample W and connected to the control unit 1215, and the center of the standard sample W is aligned with the center of a chuck for positioning and holding a substrate, which is placed in the coating unit 1213; Secondly, the rotary drive device 12147 drives the support shaft 12145 to rotate, and aligns the nozzle (for example, PR4) with the camera 1217. When the camera 1217 captures the nozzle PR4, the controller 1215 records the pole P(r4, θ4) of the nozzle PR4, with r4 being the distance L from the nozzle PR4 to the pole O and θ4 being the rotation angle of the nozzle PR4. When the camera 1217 does not capture the nozzle PR4, the controller 1215 records the pole P(r4, θ4) of the nozzle PR4. The method includes driving the nozzle holder 12144 to move it linearly, moving the nozzle PR4 forward or backward until the camera 1217 captures the nozzle PR4, and storing the pole P(r4, θ4) of the nozzle PR4 in the control unit 1215, where r4 is L±σ, +σ is the distance the drive actuator 12142 has moved the nozzle PR4 forward, -σ is the distance the drive actuator 12142 has moved the nozzle PR4 backward, and θ4 is the rotation angle of the nozzle PR4.

[0063] Similarly, the polar point P(r2, θ2) of nozzle PR2, the polar point P(r, θ) of nozzle PW, the polar point P(r1, θ1) of nozzle PR1, and the polar point P(r3, θ3) of nozzle PR3 can be obtained.

[0064] The present invention employs a swing-type coating nozzle device 1214 that can save space. The most difficult part of such a swing-type coating nozzle device 1214 is alignment. Therefore, the present invention connects the nozzle holder 12144 to a drive actuator 12142, which moves the nozzle forward and backward. This automatically adjusts the alignment of the coating nozzle before it supplies the chemical solution to the substrate. Furthermore, the solvent nozzle PW is positioned at the center of multiple chemical nozzles such as PR3, PR1, PR2, and PR4, reducing the nozzle travel distance and travel time, thereby improving processing efficiency.

[0065] 28, the second processing module 1221 may be a developing module disposed in a chemical treatment device. The developing module 1221 includes a support stand 1222, two developing units 1223 arranged on the support stand 1222, two developing nozzle devices 1224, two cleaning nozzle devices 1226, and a control unit. All of the developing nozzle devices 1224 and all of the cleaning nozzle devices 1226 correspond to one developing unit 1223.

[0066] The application nozzle device 1214 and the development nozzle device 1224 have substantially the same configuration, except for the type and number of nozzles. Each development nozzle device 1224 includes a horizontally arranged support arm 12241, a drive actuator 12242 arranged on the support arm 12241, a nozzle holder 12244 connected to the drive actuator 12242 and moved forward and backward by the drive actuator 1224, at least one nozzle fixed to the nozzle holder 12244, a support shaft 12245 fixed to the support arm 12241, a vertical drive device 12246 connected to the support shaft 12245 and driving the support shaft 12245 to raise and lower it, and a rotation drive device 12247 connected to the support shaft 12245 and driving the support shaft 12245 to rotate it. In one embodiment, the drive actuator 12242 has a slide recess 12243. One end of the nozzle holder 12244 is disposed within the slide recess 12243 and is configured to move forward and backward within the slide recess 12243 by driving the drive actuator 12242. The drive actuator 12242 may be a linear motor. The nozzle is a developing nozzle used to supply a developer to a substrate disposed within one developing unit 1223. The developing nozzle includes multiple chemical nozzles DV, such as DV1 and DV2, that supply the chemical to the substrate, and a gas nozzle N2N that supplies a non-reactive gas, such as an inert gas or N2 gas, to the substrate to prevent the developer from splashing onto the substrate, thereby preventing pattern defects and reducing particle contamination. Pipes connected to each of the multiple nozzles pass through the support shaft 12245 and the support arm 12241, and space is provided within the support shaft 12245 and the support arm 12241 for the pipes to move.

[0067] Similarly, in order to facilitate alignment of the development nozzle with the center of a substrate placed in the development unit 1223, it is preferable that one end of the nozzle holder 12244 has multiple holes to which the gas nozzle N2N and multiple chemical nozzles are attached. The centers of the multiple holes and the center of the development unit 1223 are on the same arc.

[0068] Each cleaning nozzle device 1226 includes a cleaning nozzle holder 12261, to which a cleaning nozzle 12262 is attached in order to spray a liquid to clean the substrate. The cleaning nozzle holder 12261 is fixed to one end of a support member 12263. The other end of the support member 12263 is connected to a vertical drive unit 12264 for driving the support member 12263 to raise and lower it, and a rotation drive unit 12265 for driving the support member 12263 to rotate it.

[0069] The control unit is connected to each of the drive actuator 12242, vertical drive unit 12246, and rotation drive unit 12247 of the developing nozzle device 1224, and is configured to be able to control the positioning of the developing nozzle to the center of a substrate placed in the developing unit 1223. The control unit is also connected to each of the vertical drive unit 12264 and rotation drive unit 12265 of the cleaning nozzle device 1226, and is configured to be able to control the movement of the cleaning nozzle 12262.

[0070] It is essential that each developer nozzle be adjusted to align with the center of the substrate before it is used to supply developer to a substrate in developer unit 1223. The adjustment method is the same as for the application nozzle, so a repeated explanation will be omitted here.

[0071] 29 to 31 show a coating module according to another exemplary embodiment of the present invention. The coating module 3211 includes a support table 3212, two coating units 3213 arranged on the support table 3212, a coating nozzle device 3214 disposed in the middle between the two coating units 3213, two edge cleaning devices 3216, and a control unit.

[0072] The coating nozzle device 3214 includes a horizontally disposed support arm 32141, a drive actuator 32142 disposed on the support arm 32141, a nozzle holder 32144 connected to the drive actuator 32142 and driven by the drive actuator 32142 to move forward or backward, a solvent nozzle PW fixed to the nozzle holder 32144 and supplying solvent to substrates disposed in the two coating units 3213, a support shaft 32145 fixed to the support arm 32141, a vertical drive unit 32146 connected to the support shaft 32145 and driving the support shaft 32145 to raise and lower it, and a rotation drive unit 32147 connected to the support shaft 32145 and driving the support shaft 32145 to rotate it. In one embodiment, the drive actuator 32242 has a slide recess 32143. One end of the nozzle holder 32144 is disposed within the slide recess 32143 and is driven by the drive actuator 32142 to move forward or backward within the slide recess 32143. The drive actuator 32142 may be a linear motor. The other end of the nozzle holder 32144 protrudes forward to form an insertion pin 321441. The coating nozzle device 3214 has multiple chemical liquid nozzles PR, such as PR1, PR2, PR3, and PR4, that supply photoresist liquid to substrates disposed in the two coating units 3213. Each chemical liquid nozzle PR is disposed within and penetrates the casing member 32148. A pinhole 32149 is formed in one side wall of the casing member 32148 facing the other end of the nozzle holder 32144. Multiple casing members 32148 are disposed within the groove 32140. The groove 32140 may be supported above the support base 3212 via a set of support pillars. The interior of the groove 32140 may be divided into multiple separate regions, and one casing member 32148 may be housed in every region.

[0073] 31, when chemical nozzle PR is used to supply photoresist liquid to substrates arranged in two coating units 3213, taking chemical nozzle PR3 as an example, insertion pin 321441 of nozzle holder 32144 is aligned with pinhole 32149 of casing member 32148 in which chemical nozzle PR3 is set by driving vertical drive device 32146 and rotation drive device 32147. Then, drive actuator 32142 drives nozzle holder 32144 forward so that insertion pin 321441 of nozzle holder 32144 is inserted into pinhole 32149 of casing member 32148 in which chemical nozzle PR3 is set. Vertical drive device 32146 drives support shaft 32145 to raise it, and moves casing member 32148, in which chemical nozzle PR3 is set, together with chemical nozzle PR3 away from groove 32140 and positions it above groove 32140. Rotation drive device 32147 drives support shaft 32145 to rotate it so that chemical nozzle PR3 is positioned above the substrate. The method of adjusting chemical nozzle PR3 to align it with the center of the substrate is the same as that for application nozzle 1211, so a repeated explanation will not be given here.

[0074] The edge cleaning device 3216 and the control unit have the same configuration as the edge cleaning device 1216 and the control unit 1215 of the coating module, and therefore a repeated description will be omitted here.

[0075] The exemplary embodiments and advantages described above are merely illustrative and should not be construed as limiting the present invention. The teachings of the present invention can be readily applied to other types of devices. Furthermore, the description of the exemplary embodiments of the present invention is for illustrative purposes only and does not limit the scope of the claims. Many alternatives, modifications, and variations will be readily apparent to those skilled in the art.

Claims

1. A substrate processing apparatus having a chemical solution processing apparatus for processing a substrate, The chemical solution treatment device includes: a first chemical processing unit that supplies a first chemical to the substrate to perform a first chemical processing on the substrate; a second chemical liquid processing unit stacked on the first chemical liquid processing unit, supplying a second chemical liquid to the substrate to perform a second chemical liquid processing on the substrate; a heat treatment unit that is disposed opposite the first chemical liquid treatment unit and the second chemical liquid treatment unit and that performs heat treatment on the substrate before or after the first chemical liquid treatment on the substrate or the second chemical liquid treatment on the substrate; a substrate transport unit disposed between the first chemical liquid processing unit, the second chemical liquid processing unit, and the heating processing unit, wherein the substrate transport unit at least two first robots, at least one second robot, and at least one third robot, which are arranged in parallel layers and transport the substrate between the first chemical liquid processing unit and the heat processing unit; and and at least one set of first buffer units disposed between two adjacent first robots and provided for loading and unloading the substrate via the at least one second robot.

2. 2. The substrate processing apparatus according to claim 1, wherein the first chemical processing section is configured to perform a coating process on the substrate, and the second chemical processing section is configured to perform a development process on the substrate.

3. 3. The substrate processing apparatus according to claim 2, wherein the first chemical processing section is disposed below the second chemical processing section, or the first chemical processing section is disposed above the second chemical processing section.

4. 2. The substrate processing apparatus according to claim 1, wherein the chemical liquid processing apparatus further comprises a plurality of fan filter units arranged above the at least two first robots, the at least one second robot, and the at least one third robot, respectively.

5. 2. The substrate processing apparatus according to claim 1, wherein the at least one set of first buffer units is configured to be able to move up and down.

6. 6. The substrate processing apparatus according to claim 5, wherein the set of buffer units is any one of: a) the two first buffer units are arranged adjacent to each other parallel to a moving direction of the second robot, and both of the two first buffer units are configured to be liftable and lowerable; b) the two first buffer units are stacked, and both of the two first buffer units are configured to be liftable and lowerable; c) the two first buffer units are arranged adjacent to each other so as to be perpendicular to the moving direction of the second robot, and both of the two first buffer units are configured to be liftable and lowerable; and d) the two first buffer units are stacked, and an upper first buffer unit is fixed, and a lower first buffer unit is configured to be liftable and lowerable.

7. a processing block in which the chemical solution processing unit is disposed; a first transport block configured to transport the substrates accommodated in a cassette to be processed in the processing block to the processing block or to transport the substrates processed in the processing block to the cassette; a second transport block for transporting substrates that have been processed in the processing block or that will be processed in the processing block; 2. The substrate processing apparatus according to claim 1, further comprising a connection block that connects the second transfer block to an external device.

8. The processing block further comprises: a set of second buffer units, one of which is provided to correspond to the first transport block and one of the first robots, and the other of which is configured to correspond to another of the first robots and the second transport block; a set of third buffer units, one of which is provided to correspond to the first transport block and the second robot, and the other of which is configured to correspond to the second robot and the second transport block; 8. The substrate processing apparatus according to claim 7, further comprising: at least one set of fourth buffer units, one of which is provided to correspond to the second transport block and the third robot, and the other of which is configured to correspond to the third robot and the first transport block.

9. 9. The substrate processing apparatus according to claim 8, wherein the set of third buffer units is configured to be able to move up and down.

10. 9. The substrate processing apparatus of claim 8, wherein the fourth buffer unit includes at least one fourth buffer unit configured to correspond to the second transport block and the third robot, and one or more fourth buffer units configured to correspond to the third robot and the first transport block.

11. 2. The substrate processing apparatus according to claim 1, wherein the second robot is disposed below the at least two first robots.

12. The substrate processing apparatus according to claim 1 , wherein the second robot is disposed above the at least two first robots.

13. 2. The substrate processing apparatus according to claim 1, wherein the two second robots are arranged on both sides of the set of first buffer units.

14. 2. The substrate processing apparatus according to claim 1, wherein the first chemical processing section includes a plurality of first processing modules, the plurality of first processing modules being arranged in a plurality of rows, each row having one or more layers.

15. 2. The substrate processing apparatus according to claim 1, wherein the substrate transport section has a plurality of first robots, and the set of buffer units is disposed between every two adjacent first robots.

16. 2. The substrate processing apparatus according to claim 1, wherein the second chemical processing section includes a plurality of second processing modules, the plurality of second processing modules being arranged in a plurality of rows, each row having one or more layers.

17. 17. The substrate processing apparatus of claim 16, wherein the substrate transport unit includes a plurality of third robots, and all the third robots correspond to one layer of the second processing module.

18. 2. The substrate processing apparatus of claim 1, wherein the heating processing section has a plurality of heating modules, the plurality of heating modules are arranged in a plurality of rows, each row having one or more layers, the plurality of heating modules in all rows are configured in a wafer cassette format, and the spacing between the heating modules is adjustable.

19. At least one nozzle device, at least one processing unit, and a control unit, wherein the nozzle device A support arm; a drive actuator disposed on the support arm; a nozzle holder connected to the drive actuator and driven to move by the drive actuator; at least two nozzles fixed to the nozzle holder; a support shaft fixed to the support arm; a vertical drive device connected to the support shaft and driving the support shaft to raise and lower it; a rotation drive device connected to the support shaft and driving the support shaft to rotate it; the at least two nozzles are arranged adjacent to each other in a first direction; the nozzle holder is configured to drive at least two nozzles to move along a second direction intersecting the first direction; the control unit is connected to the drive actuator, the vertical drive device, and the rotation drive device, A chemical solution treatment device characterized in that the drive actuator has a slide recess, one end of the nozzle holder is positioned within the slide recess, and is configured to be driven by the drive actuator to move back and forth within the slide recess.

20. 20. The chemical solution processing apparatus according to claim 19, wherein the nozzle is a coating nozzle for supplying a photoresist solution to substrates arranged in two processing units aligned in the same row, and the nozzle device is arranged in the center between the two processing units.

21. The application nozzle is a solvent nozzle for supplying a solvent to the substrate; 21. The chemical treatment apparatus according to claim 20, further comprising a plurality of chemical nozzles for supplying a photoresist solution to the substrate.

22. 22. The chemical solution processing apparatus of claim 21, wherein the solvent nozzle and the plurality of chemical solution nozzles are fixed to the nozzle holder, the solvent nozzle is positioned at the center of the plurality of chemical solution nozzles, and a solvent is supplied to the substrate so that the surface of the substrate is hydrophilic before the photoresist solution is supplied from the plurality of chemical solution nozzles.

23. 22. The chemical solution processing apparatus according to claim 21, wherein the tip of the nozzle holder protrudes to form an insertion pin, each chemical solution nozzle is set in a casing member, pinholes are provided in the side wall portions of all the casing members opposite the tip of the nozzle holder, and the insertion pin of the nozzle holder is inserted into the pinholes of all the casing members to retrieve the corresponding chemical solution nozzle for supplying photoresist solution to the substrate.

24. 24. The chemical solution treatment device according to claim 23, wherein the plurality of casing members are arranged in one groove.

25. 24. The chemical treatment apparatus according to claim 23, wherein the solvent nozzle is fixed to the nozzle holder.

26. 20. The chemical solution processing apparatus according to claim 19, wherein the nozzle is a developing nozzle that supplies a developing solution to a substrate placed in one of the processing units.

27. The developing nozzle is a plurality of chemical nozzles for supplying a developer to the substrate; 27. The chemical treatment apparatus according to claim 26, further comprising: a gas nozzle for supplying a non-reactive gas that prevents the developer from splashing back onto the substrate.

28. 20. The chemical solution treatment device according to claim 19, wherein the tip of the nozzle holder has at least one hole for attaching the at least one nozzle, and the center of the at least one hole and the center of the at least one treatment unit are located on the same arc.

29. 1. A method for aligning at least one nozzle with a center of a substrate disposed in a processing unit, comprising: polar coordinates are set in a control unit connected to a rotation drive device that drives and rotates at least one nozzle, a vertical drive device that moves the at least one nozzle up and down, and a drive actuator that drives and moves the at least one nozzle back and forth; acquiring a pole point of the at least one nozzle aligned with the center of the substrate in the processing unit, and causing the controller to record the pole point of the at least one nozzle; An adjustment method characterized in that the control unit sends instructions to the rotation drive device and the drive actuator based on the at least one pole point recorded in the control unit to cause the at least one nozzle to reach the pole point so that the at least one nozzle is aligned with the center of the substrate in the processing unit.

30. obtaining a pole point of the at least one nozzle further comprises: A standard sample is placed in the processing unit, and a camera is positioned at the center of the standard sample and connected to the control unit; 30. The adjustment method according to claim 29, wherein the rotational drive device drives and rotates the at least one nozzle to align the nozzle with a camera, and when the at least one nozzle is captured by the camera, stores a pole point P(r, θ) of the nozzle in the control unit, where r is a length L from the nozzle to the pole point and θ is a rotation angle of the nozzle, and when the nozzle cannot be captured by the camera, the drive actuator drives the nozzle holder to move the nozzle back and forth in a linear manner until the nozzle can be captured by the camera, and stores a pole point P(r, θ) of the nozzle in the control unit, where r is the length L±σ, +σ is a distance that the drive actuator has moved the nozzle forward, −σ is a distance that the drive actuator has moved the nozzle backward, and θ is a rotation angle of the nozzle.

Images