Antenna structure and antenna array structure

Abstract

To provide an antenna structure which facilitates a miniaturization of an antenna device.SOLUTION: An antenna structure 21 comprises: an antenna substrate 1 having a first front surface and a second front surface; a plurality of patch antenna elements 2 that are arranged in the first front surface of the antenna substrate; a feeding substrate 3 that is formed on the second front surface of the antenna substrate, and is electrically connected to each of the plurality of patch antenna elements; an electric power source control substrate 6 that is arranged apart from the second front surface of the antenna substrate, extends to a direction crossing the second front surface of the antenna substrate, and includes a connection terminal 7; and a connection member 11 that is arranged between the antenna substrate and the electric power source control substrate, and electrically connects the feeding substrate and the electric power source control substrate to each other. The connection member includes: a main body portion 4 in which a concave portion concaved to a direction toward the antenna substrate from the electric power source control substrate is formed; an electrode portion 5 that is formed on a front surface of the main body portion; a first joining portion 8 that joins the electrode portion and the feeding substrate by metal joining; and a second joining portion 9 that joins the electrode and the connection terminal by the metal joining.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to antenna structures and antenna array structures. [Background technology]

[0002] In recent years, commercial services using fifth-generation (5G) mobile communication systems have been launched, and as a fundamental technology that supports industry and society, it is expected to further accelerate the advancement of multimedia services and provide new value.

[0003] 5G is a mobile communication system that uses high frequency bands, such as millimeter waves, exceeding 10 GHz. The transmitting and receiving antennas generally use patch antennas (microstrip antennas), a type of planar antenna, which consists of a dielectric substrate, a radiating element with wiring formed on both sides of the substrate, and a ground conductor plate.

[0004] Furthermore, in order to obtain a desired radiation directivity (radiation pattern), patch antennas are often used as multi-element antenna arrays, in which multiple patch antennas are regularly arranged in a linear or planar pattern. Multi-element antenna arrays enable high-capacity communications. Antenna elements such as patch antennas are connected to various signal processing circuits and power supply circuits to form an antenna structure (antenna module). These antennas are then housed in a housing such as a case or cover and used practically as a communications antenna unit.

[0005] For example, Patent Document 1 discloses an antenna structure and an antenna unit that are configured with an antenna element section and a circuit section that amplifies an electrical signal converted by the antenna element section.

[0006] In Patent Document 1, the antenna element section and the circuit section are configured as separate bodies, connected to each other by a cable, and arranged side by side and housed in an external case to form an antenna unit.

[0007] In recent years, antenna structures including a plurality of antenna elements have been used to support large-capacity communications, but since installation locations are limited, there is an increasing demand for smaller antenna structures.

[0008] Therefore, for example, Patent Document 2 discloses an antenna structure for realizing miniaturization of an antenna device. The antenna structure of Patent Document 2 is composed of a ground conductor, an antenna element section formed on the upper surface of the ground conductor via a first dielectric substrate, and a circuit section including a circuit pattern formed on the lower surface of the ground conductor via a second dielectric substrate, and mounted circuit components, etc. [Prior art documents] [Patent documents]

[0009] [Patent Document 1] Japanese Utility Model Application Publication No. 06-041220 [Patent Document 2] Japanese Patent Application Publication No. 06-152237 Summary of the Invention [Problem to be solved by the invention]

[0010] However, in the antenna structure of Patent Document 1, both the antenna element section and the circuit section are provided in a planar direction. In a configuration in which an area for providing both the antenna element section and the circuit section in a planar direction is secured, it is difficult to reduce the size of the device.

[0011] Furthermore, the overall size of the antenna structure is determined by the mounting area of ​​the circuit components mounted on the opposite side of the dielectric substrate to the side on which the antenna element is located. For this reason, with the antenna structure shown in Patent Document 2, even if the antenna element is miniaturized, it is difficult to realize a small antenna structure that is smaller than the mounting area of ​​the circuit components.

[0012] Furthermore, even when forming an antenna array structure by arranging multiple antenna elements, the spacing between the antenna elements is limited by the mounting area of ​​the circuit components mounted on the opposite side of the dielectric substrate from the side on which the antenna element section is located, making it difficult to realize an antenna array structure in which multiple small antenna elements are mounted closely together.

[0013] Therefore, an object of the present disclosure is to provide an antenna structure that facilitates miniaturization of an antenna device. [Means for solving the problem]

[0014] In order to achieve the above object, an antenna structure according to one embodiment of the present disclosure includes: an antenna substrate having a first surface and a second surface opposite to the first surface; a plurality of patch antenna elements arranged on the first surface of the antenna substrate; a feeding electrode formed on the second surface of the antenna substrate and electrically connected to each of the plurality of patch antenna elements; a power supply control substrate positioned away from the second surface of the antenna substrate and extending in a direction intersecting the second surface of the antenna substrate; and a connecting member positioned between the antenna substrate and the power supply control substrate and electrically connecting the feeding electrode and the power supply control substrate, wherein the power supply control substrate includes a connecting terminal, and the connecting member is insulating and includes: a main body portion formed with a recess recessed in a direction from the power supply control substrate toward the antenna substrate, an electrode portion formed on the surface of the main body portion, a first joint portion joining the electrode portion and the feeding electrode by metal bonding, and a second joint portion joining the electrode portion and the connecting terminal by metal bonding, and an end of the power supply control substrate is positioned in the recess of the main body portion. [Effects of the Invention]

[0015] According to an antenna structure according to an aspect of the present disclosure, it is possible to easily reduce the size of an antenna device. [Brief explanation of the drawings]

[0016] [Figure 1] 1 is an end view in an XZ plane showing an example of the configuration of an antenna structure according to a first embodiment. [Figure 2] 1 is a perspective view showing an example of the configuration of an antenna structure according to a first embodiment. [Figure 3] 1 is a front view in a YZ plane showing an example of the configuration of an antenna structure according to a first embodiment. [Figure 4] 1 showing an example of the configuration of a connecting member of the antenna structure according to the first embodiment. FIG. [Figure 5] 1 is an end view in the XZ plane showing an example of the configuration of the antenna array structure according to the first embodiment. FIG. [Figure 6] 1 is a perspective view showing an example of the configuration of an antenna array structure according to a first embodiment. [Figure 7] 1 is a plan view in an XY plane showing an example of the configuration of an antenna array structure according to a first embodiment. [Figure 8] 6 is a perspective view showing an example of the configuration of an antenna unit formed by assembling the antenna array structure of FIG. 5 and a housing. FIG. [Figure 9] 6 is a perspective view showing another example of the configuration of an antenna unit formed by assembling the antenna array structure of FIG. 5 and a housing. FIG. [Figure 10] 4 is a flowchart showing an example of a manufacturing process of the antenna structure according to the first embodiment. [Figure 11A] 5A to 5C are schematic diagrams illustrating an example of a manufacturing process for the antenna structure according to the first embodiment. [Figure 11B] 5A to 5C are schematic diagrams illustrating an example of a manufacturing process for the antenna structure according to the first embodiment. [Figure 11C] 5A to 5C are schematic diagrams illustrating an example of a manufacturing process for the antenna structure according to the first embodiment. [Figure 11D] 5A to 5C are schematic diagrams illustrating an example of a manufacturing process for the antenna structure according to the first embodiment. [Figure 11E] 5A to 5C are schematic diagrams illustrating an example of a manufacturing process for the antenna structure according to the first embodiment. [Figure 11F] 5A to 5C are schematic diagrams illustrating an example of a manufacturing process for the antenna structure according to the first embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0017] According to a first aspect of the present disclosure, there is provided an antenna structure comprising: an antenna substrate having a first surface and a second surface located opposite the first surface; a plurality of patch antenna elements arranged on the first surface of the antenna substrate; a feeding electrode formed on the second surface of the antenna substrate and electrically connected to each of the plurality of patch antenna elements; a power supply control substrate positioned away from the second surface of the antenna substrate and extending in a direction intersecting the second surface of the antenna substrate; and a connecting member positioned between the antenna substrate and the power supply control substrate and electrically connecting the feeding electrode and the power supply control substrate, wherein the power supply control substrate includes a connecting terminal, and the connecting member is insulating and includes: a main body portion formed with a recess that is recessed in a direction from the power supply control substrate toward the antenna substrate, an electrode portion formed on the surface of the main body portion, a first joint portion that joins the electrode portion and the feeding electrode by metal bonding, and a second joint portion that joins the electrode portion and the connecting terminal by metal bonding, and an end of the power supply control substrate is disposed in the recess of the main body portion.

[0018] According to this aspect, it is possible to provide an antenna structure that facilitates miniaturization of the antenna device.

[0019] According to a second aspect of the present disclosure, there is provided the antenna structure according to the first aspect, wherein the recess is formed along the direction in which the plurality of patch antenna elements are arranged.

[0020] According to a third aspect of the present disclosure, there is provided an antenna structure according to the first or second aspect, wherein the main body of the connecting member is made of a resin material, and the resin material includes any one of LCP, PPA, ABS, PEEK, and PC.

[0021] According to a fourth aspect of the present disclosure, there is provided the antenna structure according to the first or second aspect, wherein the first joint portion and the second joint portion have different compositions.

[0022] According to a fifth aspect of the present disclosure, there is provided an antenna array structure comprising a plurality of antenna structures according to the first or second aspect, wherein the plurality of patch antenna elements are arranged along a first direction on a first surface of an antenna substrate, and the plurality of antenna structures are arranged along a second direction perpendicular to the first direction.

[0023] According to a sixth aspect of the present disclosure, there is provided an antenna array structure according to the fifth aspect, wherein in the direction of arrangement of the plurality of antenna structures, the distance between adjacent end faces of adjacent antenna substrates is greater than 0 mm and not more than 10 mm.

[0024] Any of the above-described various embodiments may be combined appropriately to achieve the effects of each of them.

[0025] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. However, more detailed explanation than necessary may be omitted. For example, detailed explanation of well-known matters or redundant explanation of substantially the same configuration may be omitted. This is to avoid unnecessary redundancy in the following explanation and to facilitate understanding by those skilled in the art.

[0026] An antenna structure, an antenna array structure, and a manufacturing method thereof according to a first embodiment of the present invention will be described with reference to Figures 1 to 11F. The accompanying drawings and the following description are provided to enable those skilled in the art to fully understand the present disclosure, and are not intended to limit the subject matter described in the claims. In addition, in each drawing, each element is exaggerated for ease of explanation. Note that substantially identical components in the drawings are assigned the same reference numerals.

[0027] First Embodiment (Configuration of antenna structure) The overall configuration of an antenna structure according to a first embodiment of the present disclosure will be described with reference to Fig. 1 to Fig. 3. Fig. 1 is an end view in the XZ plane showing an example of the configuration of an antenna structure 21 according to the first embodiment. Fig. 2 is a perspective view showing an example of the configuration of the antenna structure 21 according to the first embodiment. Fig. 3 is a front view in the YZ plane showing an example of the configuration of the antenna structure 21 according to the first embodiment.

[0028] As shown in FIG. 1, an antenna structure 21 according to this embodiment includes an antenna substrate 1, a power supply control substrate 6, and a connecting member 11. In this embodiment, the antenna substrate 1 is disposed parallel to the XY plane, and the power supply control substrate 6 is disposed away from the upper surface of the antenna substrate 1 parallel to the XY plane (the surface on the +Z side in the figure), and can extend in a direction intersecting the upper surface of the antenna substrate 1. In the embodiment shown in FIG. 1-3, the power supply control substrate 6 extends parallel to the YZ plane perpendicular to the antenna substrate 1. The connecting member 11 is disposed between the antenna substrate 1 and the power supply control substrate 6 and connects the antenna substrate 1 and the power supply control substrate 6. The configuration of the connecting member 11 will be described in detail later. In this specification, the surface of the antenna substrate 1 on the -Z side in the figure, which is parallel to the XY plane, is referred to as the "lower surface" or "first surface," and the opposite surface (the surface on the +Z side in the figure) is referred to as the "upper surface" or "second surface."

[0029] In this embodiment, the antenna substrate 1 uses Panasonic's multilayer substrate material "MEGTRON7" as its base material. "MEGTRON7" is a multilayer substrate material with low transmission loss characteristics. Using this material, highly efficient antenna performance can be achieved and board design can be performed with a high degree of freedom. However, the antenna substrate 1 is not limited to "MEGTRON7" and may be made of other materials, such as glass epoxy or ceramic. The shape and dimensions of the antenna substrate 1 can be tailored to suit the application. In this embodiment, as shown in FIG. 2-3, the antenna substrate 1 has a rectangular shape in the XY plane, with a width of 3 mm in the X direction, a length of 22 mm in the Y direction, and a thickness of 0.8 mm in the Z direction.

[0030] As shown in Fig. 2, a plurality of patch antenna elements 2 are arranged on the lower surface (first surface) of the antenna substrate 1 along the Y direction in the figure. In this embodiment, the patch antenna elements 2 are made of copper foil with a thickness of 18 µm and have a rectangular shape with dimensions of 2 mm x 2 mm. Also, in this embodiment, as shown in Fig. 2, the antenna structure 21 includes seven rectangular patch antenna elements 2, which are arranged linearly at equal intervals of 1 mm along the Y direction in the figure. In this way, by arranging a plurality of patch antenna elements 2 linearly along the longitudinal direction (Y direction in the figure) of the rectangular antenna substrate 1, a compact antenna structure can be configured.

[0031] The present disclosure does not limit the shape, number, or spacing of the patch antenna elements included in the antenna structure. The patch antenna element 2 may have another shape, such as a circular shape, and the number of patch antenna elements constituting the antenna structure 21 may be determined depending on the intended use of the antenna structure. Furthermore, the multiple patch antenna elements 2 may be arranged at equal intervals or at different intervals.

[0032] As shown in FIGS. 1 and 3, a plurality of feeding electrodes 3 are arranged on the upper surface (second surface) of the antenna substrate 1, which is opposite to the surface on which the patch antenna elements 2 are arranged. The feeding electrode 3 is electrically connected to the plurality of patch antenna elements 2, for example, by through holes, and is used to feed power to the patch antenna elements 2. In this embodiment, as shown in FIG. 3, the feeding electrode 3 includes a plurality of electrodes arranged on the upper surface of the antenna substrate 1 along the Y direction in the figure, facing the arrangement of the patch antenna elements 2 on the lower surface. This allows the feeding electrode 3 to feed power separately to each of the plurality of patch antenna elements 2. Furthermore, by arranging the individual electrodes included in the feeding electrode 3 along the arrangement direction of the patch antenna elements 2, a more compact antenna structure can be configured.

[0033] The power supply control board 6 can be configured, for example, by mounting circuit components (not shown) that constitute signal circuits and power supply circuits on a double-sided printed circuit board. The power supply control board 6 has a connection terminal 7, and in this embodiment, the connection terminal 7 includes a plurality of terminals arranged along the Y direction in the figure. Each of the plurality of terminals is electrically connected to each patch antenna element 2 through an electrode portion 5 (described later) of the connection member 11 and the power supply electrode 3. This allows the power supply control board 6 to provide a predetermined excitation amplitude-phase distribution to each patch antenna element 2, thereby achieving a desired radiation directivity of the antenna structure 21. The power supply control board 6 can be arranged to extend in a direction intersecting with the upper surface of the antenna substrate 1. In this embodiment, the power supply control board 6 is arranged in the YZ plane, parallel to the arrangement direction of the patch antenna elements 2. This allows the antenna structure to be configured more compactly.

[0034] The shape and dimensions of the power supply control board 6 can be prepared according to the application. In this embodiment, as shown in the figure, the power supply control board 6 is arranged in the YZ plane parallel to the arrangement direction of the patch antenna elements 2, and has a rectangular shape in the YZ plane. In this embodiment, the power supply control board 6 is prepared so that it has a length of 22 mm in the Y direction, a length of 25 mm in the Z direction, and a thickness of 1.6 mm in the X direction.

[0035] The antenna substrate 1 and the power supply control substrate 6 are connected by a connecting member. The configuration of the connecting member will be described below with reference to Fig. 4 in addition to Fig. 1-3. Fig. 4 is an enlarged view of a portion A in Fig. 1 showing an example of the configuration of the connecting member 11 of the antenna structure 21 according to the first embodiment.

[0036] (Configuration of connecting members) The connecting member 11 is disposed between the antenna substrate 1 and the power supply control substrate 6, and is composed of an insulating main body 4, an electrode 5 formed on the surface of the main body 4, a first joint 8, and a second joint 9. The first joint 8 joins the electrode 5 to the power supply electrode 3, and the second joint 9 joins the electrode 5 to a connection terminal 7 of the power supply control substrate. The first joint 8 and the second joint 9 are both formed by metal bonding. In this way, the connecting member 11 electrically connects and mechanically joins the power supply control substrate 6 and the power supply electrode 3, thereby supporting the power supply control substrate 6, which extends in a direction intersecting with the upper surface of the antenna substrate 1.

[0037] The shape and dimensions of the connecting member 11 can be prepared according to the application. In this embodiment, as shown in Fig. 2, the connecting member 11 has a rectangular parallelepiped outer shape with its longitudinal direction extending in the Y direction, and is arranged parallel to the power supply control board 6 along the arrangement direction of the patch antenna elements 2. This allows for the configuration of a compact antenna structure 21.

[0038] In this embodiment, the main body 4 of the connection member 11 is fabricated to have a width Wc of 2.5 mm in the X direction, a height Hc of 3.0 mm in the Z direction, and a length Lc (shown in FIG. 3) of 22 mm in the Y direction. Note that in this embodiment, the power supply control board 6 and the main body 4 of the connection member 11 are fabricated to have approximately the same length in the Y direction, but the present disclosure is not limited to this. The power supply control board 6 and the main body 4 may have different lengths in the Y direction.

[0039] As shown in FIG. 4 , the main body 4 of the connection member 11 has a recess 10 recessed in a direction toward the antenna substrate 1 (in the illustrated −Z direction in this embodiment). At least a portion of the end 6 a of the power supply control substrate 6 closest to the antenna substrate 1 is disposed in the recess 10. Although not limited thereto, in this embodiment, connection terminals 7 are disposed near the end 6 a of the power supply control substrate 6, and as shown in the figure, the connection terminals 7 are provided on each of the surfaces 6A and 6B of the power supply control substrate 6 that are parallel to the YZ plane. The connection terminals 7 provided on the surfaces 6A and 6B on both sides of the power supply control substrate 6 are joined to the connection member 11 by second joints 9. This allows the power supply control substrate 6 to be stably held, resulting in an antenna structure 21 that is resistant to vibration and impact. The power supply control substrate 6 is not limited to a substrate having connection terminals 7 provided on both sides 6A and 6B and connected to the connection member 11. For example, the connection terminal 7 may be provided on any surface of the power supply control board 6 parallel to the YZ plane, and connected to the connection member 11 by the second joint portion 9.

[0040] The recess 10 can be formed along the arrangement direction of the patch antenna elements 2 on the lower surface of the antenna substrate 1. This allows the antenna structure to be configured more compactly. The shape and dimensions of the recess 10 can be made according to the application. In order to place the end 6a of the power supply control substrate 6 in the recess, the width L of the recess 10 in the illustrated X direction is at least larger than the thickness T of the power supply control substrate 6, and may be, for example, 1.7 mm or more and 2.0 mm or less. In this embodiment, the recess 10 is formed with a width L in the X direction of 1.7 mm and a depth D in the Z direction of 2.0 mm.

[0041] The end 6a of the power supply control board 6 may be disposed in contact with the bottom 10a inside the recess 10, or may be disposed a predetermined distance away from the bottom 10a. In this embodiment, as shown in FIG. 4, the end 6a of the power supply control board 6 is disposed a distance d away from the bottom 10a inside the recess 10. The distance d may be, for example, 0 mm or more and 1.5 mm or less. By disposing the power supply control board 6 away from the bottom 10a inside the recess 10, a path for air to flow between the power supply control board 6 and the connecting member 11 can be secured. This allows heat generated by electronic components mounted on the power supply control board 6 to be dissipated, and makes it possible to suppress temperature increases in the power supply control board 6 or the antenna board 1 due to heat generated by the electronic components.

[0042] The main body 4 of the connection member 11 is made of an insulating resin material. In this embodiment, the main body 4 uses LCP (liquid crystal polymer) with a dielectric constant of 4.3 and a dielectric dissipation factor of 0.015, but is not limited to this and may include any one of LCP (liquid crystal polymer), PPA (polyphthalamide), ABS (acrylonitrile-butadiene-styrene copolymer synthetic resin), PEEK (polyether ether ketone resin), and PC (polycarbonate resin).

[0043] The electrode section 5 can be formed on the entire surface or any part of the surface of the main body section 4. In the example shown in Fig. 4, the electrode section 5 is formed on the upper surface 4b of the main body section 4, part of the lower surface 4a, part of the inner surface 4A facing the power supply control board 6, and part of the outer surface 4B facing the opposite side of the power supply control board 6. However, the electrode section 5 is not limited to this, and may be formed in a form different from the example shown in Fig. 4 depending on the application.

[0044] In this embodiment, the electrode portion 5 is formed by plating copper (Cu) having a thickness of 10 μm, nickel (Ni) having a thickness of 0.2 μm, and gold (Au) having a thickness of 0.05 μm in that order. The electrode portion 5 is not limited to being formed by plating, and may be formed by other materials or methods such as printing or dispense coating of conductive resin.

[0045] The first joint 8, which joins the electrode unit 5 and the power supply electrode 3, and the second joint 9, which joins the electrode unit 5 and the connection terminal 7 of the power supply control board, are both formed by metal bonding. This allows the first joint 8 and the second joint 9 to have both electrical conductivity and mechanical strength. In this embodiment, the first joint 8 is formed using solder with a Sn-3.0Ag-0.5Cu composition, and the second joint 9 is formed using Sn-Bi solder. Note that the metal bonding material forming the first joint 8 and the second joint 9 is not limited to this. For example, conductive paste such as Ag or Cu, or other bonding materials may be used. Furthermore, the metal bonding material forming the first joint 8 and the metal bonding material forming the second joint 9 may have different compositions. This will be described in detail later.

[0046] In this way, the antenna structure 21 according to embodiment 1 of the present disclosure is constructed by connecting the antenna substrate 1 arranged parallel to the XY plane and the power supply control substrate 6 extending in a direction intersecting the upper surface of the antenna substrate 1 with a connecting member 11.

[0047] According to this configuration, the patch antenna element 2 and the power supply control board 6 on which the circuit components constituting the signal circuit and the power supply circuit are mounted are arranged in directions that intersect with each other, so that, for example, the arrangement of the antenna element is not restricted by the mounting area of ​​the circuit components constituting the signal circuit and the power supply circuit, and an antenna structure 21 can be provided that facilitates miniaturization of the antenna device.

[0048] Next, the configuration of the antenna array structure according to the first embodiment will be described with reference to FIGS.

[0049] (Configuration of antenna array structure) Fig. 5 is an end view in the XZ plane showing an example of the configuration of the antenna array structure according to the embodiment 1. Fig. 6 is a perspective view showing an example of the configuration of the antenna array structure according to the embodiment 1. Fig. 7 is a plan view in the XY plane showing an example of the configuration of the antenna array structure according to the embodiment 1.

[0050] As shown in Figures 5-7, the antenna array structure 22 is composed of a plurality of antenna structures 21. In this embodiment, the plurality of patch antenna elements 2 of each antenna structure 21 are arranged along the Y direction in the figure on the lower surface (first surface) of the antenna substrate. The plurality of antenna structures 21 are also arranged along a direction perpendicular to the direction of arrangement of the patch antenna elements 2, which in this embodiment is the X direction in the figure. In this way, the antenna array structure 22 is configured, which includes an array of patch antenna elements 2 arranged in a matrix.

[0051] The number of antenna structures 21 constituting the antenna array structure 22 can be provided depending on the application of the antenna array structure. In this embodiment, as shown in FIGS. 6-7 , the antenna array structure 22 includes six antenna structures 21, each of which is configured to include seven patch antenna elements 2. The antenna array structure 22 configured in this manner has 7×6 patch antenna elements 2. For example, if m antenna structures 21 are provided, and each antenna structure 21 includes n patch antenna elements 2, the antenna array structure 22 includes n×m patch antenna elements 2. By using an antenna array structure including a large number of patch antenna elements, high-capacity communication can be realized.

[0052] In the antenna array structure 22, the antenna structures 21 may be arranged at equal intervals or at different intervals. In this embodiment, as shown in FIGS. 5-7, the individual antenna substrates 1 are arranged at equal intervals in the X direction in which six antenna structures 21 are arranged. Although not limited thereto, in this embodiment, each of the antenna structures 21 constituting the antenna array structure 22 includes an antenna substrate 1 that is rectangular in the XY plane. In the direction in which the antenna structures 21 are arranged (the X direction in this embodiment), the distance S between adjacent end faces of adjacent antenna substrates 1 is set to 0.5 mm. By arranging the antenna substrates 1 at intervals, heat generated by circuit components mounted on the power supply control substrate 6 of each antenna structure 21 can be dissipated, thereby suppressing a temperature rise in the power supply control substrate 6 due to heat generated by the circuit components. In the direction in which the antenna structures 21 are arranged, the distance S between adjacent end faces of adjacent antenna substrates 1 may be, for example, greater than 0 mm and equal to or less than 10 mm.

[0053] According to the configuration of the antenna structure 21 of the present disclosure, the patch antenna elements 2 and the power supply control board 6 on which circuit components constituting the signal circuit and the power supply circuit are mounted are arranged in directions that intersect with each other. Therefore, when arranging a plurality of antenna structures 21 in the antenna array structure 22, the plurality of antenna structures 21 can be arranged without being restricted in spacing S by, for example, the power supply control board 6 or the circuit components mounted on the power supply control board 6. Therefore, it is possible to configure the antenna array structure 22 in which the patch antenna elements 2 of each antenna structure are arranged in a matrix in close proximity, thereby making it possible to provide a small-sized antenna array device.

[0054] The antenna array structure can be further assembled with a housing to form an antenna unit. The structure of the antenna unit will be described with reference to Figures 8 and 9.

[0055] (Antenna unit configuration) Fig. 8 is a perspective view showing an example 23a of the configuration of an antenna unit obtained by assembling the antenna array structure 22 and the housing 12a of Fig. 5. Fig. 9 is a perspective view showing another example 23b of the configuration of an antenna unit obtained by assembling the antenna array structure 22 and the housings 12a and 12b of Fig. 5.

[0056] The antenna unit 23a shown in Fig. 8 is configured by attaching to the housing 12a end portions 6b (upper end portions on the +Z side in the figure) opposite to the end portions 6a of the multiple power supply control boards 6 of the antenna array structure 22 that are close to the antenna board 1. The antenna unit 23b shown in Fig. 9 is configured by attaching to the housing 12a end portions 6b of the multiple power supply control boards 6 of the antenna array structure 22. Furthermore, one or both (not shown) of the portions 6c and 6d on both sides that connect the end portions 6a and 6b of the individual power supply control boards 6 along the arrangement direction of the antenna array structure 22 (the X direction in the figure) can be attached to the housing 12b.

[0057] The antenna unit is configured by assembling the antenna array structure and the housing, thereby ensuring the strength of the antenna array structure and improving assembly efficiency.

[0058] Next, a manufacturing process of the antenna structure will be described with reference to Fig. 10 to Fig. 11F. Fig. 10 is a flowchart showing an example of a manufacturing process of the antenna structure 21 according to the first embodiment. Figs. 11A to 11F are schematic diagrams showing an example of a manufacturing process of the antenna structure 21 according to the first embodiment. Note that, since conventionally known methods can be used to mount the patch antenna element 2 on the antenna substrate 1 and to fabricate the feeding electrode 3, a description of the manufacturing method will be omitted below.

[0059] (Method of manufacturing an antenna structure) 10, the method for manufacturing the antenna structure 21 can include steps S1 to S6. Each step will be described below with reference to the schematic diagrams shown in FIGS. 11A to 11F.

[0060] (Step S1) As shown in FIG. 11A, first cream solder 13 is applied onto the power supply electrode 3 of the antenna substrate 1. The first cream solder 13 can be applied using a screen printing method, for example, using a composition of Sn-3.0Ag-0.5Cu. The metal mask used for screen printing may be, for example, 80 μm thick. Note that the application of the first cream solder 13 is not limited to the screen printing method, and other methods such as a dispense method or an inkjet method may also be used.

[0061] (Step S2) 11B, a connection member 11 is placed on the antenna substrate 1 to which the first solder paste 13 has been applied in step S1. Here, the connection member 11, which has an electrode portion 5 including a recess 10 and a plurality of surface electrodes formed on the main body 4, is used to position and attach the connection member 11 to the antenna substrate 1 so that each of the surface electrodes of the electrode portion 5 corresponds to each of the power supply electrodes 3 formed on the antenna substrate 1. In the embodiment shown in FIG. 11B, the connection member 11 is arranged such that its longitudinal direction is along the Y direction in the figure.

[0062] (Step S3) 11C, a first joint 8 is formed to join the electrode portion 5 and the power supply electrode 3. Here, the antenna substrate 1 on which the connection member 11 is arranged, obtained in step S2, is subjected to a thermal reflow process, for example, at a peak temperature of 240°C, to melt and solidify the first cream solder 13, thereby forming the first joint 8, which joins the power supply electrode 3 of the antenna substrate 1 and the electrode portion 5 of the connection member 11, as a metal joint.

[0063] (Step S4) Next, the power supply control board 6 is positioned as shown in FIG. 11D. Here, a power supply control board 6 having a connection terminal 7 including a plurality of terminals can be used. In the embodiment shown in FIG. 11D, in the YZ plane in which the power supply control board 6 is arranged, the power supply control board 6 is positioned relative to the antenna board 1 obtained in step S3 so that each of the connection terminals of the power supply control board 6 corresponds to each of the surface electrodes of the electrode portion 5 of the connection member 11. Furthermore, in the XY plane in which the antenna board 1 is arranged, the power supply control board 6 is positioned so that at least a portion of the end portion 6a of the power supply control board 6 is located in the recess 10 of the connection member 11.

[0064] (Step S5) 11E, second cream solder 14 is applied to the contact points between each of the connection terminals 7 of the power supply control board 6 and each of the surface electrodes of the electrode portion 5 of the connection member 11. Here, the second cream solder 14 can be supplied, for example, by a dispensing method to the antenna board 1 on which the power supply control board 6 is positioned, obtained in step S4.

[0065] The second cream solder 14 forms the second joint 9 that joins the connection terminal 7 and the electrode portion 5 through a subsequent heating reflow process (step S6). During the subsequent heating reflow process, the first cream solder 13 that constitutes the first joint 8 may remelt due to heat conduction during the process. To prevent this, the composition of the metal joint material for the first joint and the composition of the metal joint material for the second joint can be different. For example, the second cream solder 14 has a lower melting point than the first cream solder 13. For example, a solder with a Sn-Bi composition can be used as the second cream solder 14. Note that the second cream solder 14 is not limited to a Sn-Bi based composition, and any composition with a lower melting point than the first cream solder 13 can be used.

[0066] Furthermore, the composition of the second cream solder 14 does not necessarily have to be one whose melting point is lower than that of the first cream solder 13. For example, if the manufacturing process does not cause the first cream solder 13 to remelt due to thermal conduction, the second cream solder 14 may be a material having the same melting point (composition) as the first cream solder 13.

[0067] (Step S6) 11F, a second joint is formed to join the connection terminal 7 and the electrode portion 5. Here, the antenna substrate 1 to which the second cream solder 14 obtained in step S5 has been applied is subjected to a heat reflow process, for example, at a peak temperature of 180°C, to melt and solidify the second cream solder 14, thereby forming a second joint 9 as a metal joint that joins the connection terminal 7 of the power supply control substrate 6 and the electrode portion 5 of the connection member 11.

[0068] The antenna structure 21 can be manufactured through the above steps. Note that the method for manufacturing the antenna structure 21 through steps S1 to S6 above is merely an example, and the manufacturing of the antenna structure 21 is not limited to this method. Furthermore, the materials and manufacturing conditions used in the manufacturing process of the antenna structure 21 are also examples, and are not limited to the above.

[0069] In the above embodiment, the antenna structure has been described in which patch antenna elements are arranged in a planar shape, but the present disclosure is not limited to this. For example, the antenna structure may be configured with patch antenna elements arranged in a curved shape.

[0070] In addition, although the above embodiment describes an antenna array structure composed of antenna structures having similar configurations, the present disclosure is not limited thereto. For example, the antenna array structure may include antenna structures having different configurations.

[0071] As described above, the accompanying drawings and detailed description have been provided to explain exemplary embodiments of the technology disclosed herein. Therefore, the components described in the accompanying drawings and detailed description may include not only components essential for solving the problem, but also components that are not essential for solving the problem in order to illustrate the technology. Therefore, the fact that these non-essential components are described in the accompanying drawings or detailed description should not be interpreted as immediately indicating that these non-essential components are essential.

[0072] Although the present disclosure has been fully described in connection with the preferred embodiments with reference to the accompanying drawings, various modifications are possible within the scope of the claims, and such modifications and embodiments obtained by appropriately combining the technical means disclosed in the different embodiments are also included in the technical scope of the present disclosure. [Industrial Applicability]

[0073] The present disclosure is applicable to antenna devices, including antenna structures and antenna array structures. [Explanation of symbols]

[0074] 1 Antenna board 2 patch antenna elements 3. Power supply electrode 4 Main body of connecting member 5 Electrode part of connecting member 6 Power control board 7 Connection terminal 8 1st joint 9 Second joint 10 recess 11 Connecting member 12a, 12b housing 13 First cream solder 14 Second cream solder 21 Antenna structure 22 Antenna array structure 23a, 23b Antenna unit

Claims

1. an antenna substrate having a first surface and a second surface opposite the first surface; a plurality of patch antenna elements arranged on the first surface of the antenna substrate; a feeding electrode formed on the second surface of the antenna substrate and electrically connected to each of the plurality of patch antenna elements; a power supply control board disposed apart from the second surface of the antenna board and extending in a direction intersecting the second surface of the antenna board; a connecting member disposed between the antenna substrate and the power supply control substrate, the connecting member electrically connecting the power supply electrode and the power supply control substrate; Equipped with the power supply control board includes a connection terminal; The connecting member is a main body portion having insulating properties and having a recess formed therein that is recessed in a direction from the power supply control board toward the antenna board; an electrode portion formed on a surface of the main body portion; a first joining portion that joins the electrode portion and the power supply electrode by metal joining; a second bonding portion that bonds the electrode portion and the connection terminal by metal bonding; Including, an end of the power supply control board is disposed in the recess of the main body; Antenna structure.

2. The recess is formed along the direction in which the plurality of patch antenna elements are arranged.

10. The antenna structure of claim 1.

3. The main body of the connection member is made of a resin material, The resin material includes any one of LCP, PPA, ABS, PEEK, and PC.

3. An antenna structure according to claim 1 or 2.

4. The composition of the first bonding portion is different from the composition of the second bonding portion.

3. An antenna structure according to claim 1 or 2.

5. A plurality of the antenna structures according to claim 1 or 2 are provided, the plurality of patch antenna elements are arranged along a first direction on the first surface of the antenna substrate; The plurality of antenna structures are arranged along a second direction perpendicular to the first direction. Antenna array structure.

6. In the plurality of antenna structures, the distance between adjacent end faces of the adjacent antenna substrates is greater than 0 mm and less than or equal to 10 mm.

6. The antenna array structure of claim 5.

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