Bonding method and bonding device

Abstract

To make it possible to apply a tape in a normal sticking state using no electrostatic chuck.SOLUTION: A sticking method includes: a holding step 1002 for sucking and holding a wafer on a suction table; a positioning step 1001 for facing a tape to the wafer on the suction table and facing a tape sticking roller to the wafer by pinching the tape; a pressing step 1003 for pressing the tape against the wafer by the tape sticking roller and pressing the wafer on the suction table by the tape sticking roller; a pressure reduction step 1004 for bringing an inside of a vacuum chamber for storing the suction table and the sticking roller into a vacuum state in a state where the wafer is pressed by the tape sticking roller; and a sticking step 1005 for sticking the tape on the wafer by rolling the tape sticking roller on the tape from a state where the wafer is pressed by the tape sticking roller.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a bonding method and a bonding device. [Background technology]

[0002] Vacuum mounters are widely used as devices for attaching tape to wafers. Vacuum mounters include a vacuum chamber that accommodates the wafer and is maintained in a vacuum state inside (see, for example, Patent Document 1).

[0003] Vacuum mounters attach tape to wafers in a vacuum, which has the advantage of reducing the occurrence of problems such as air bubbles getting trapped between the wafer and the tape or wrinkles forming in the tape, which can prevent the tape from being properly attached. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-150109 Summary of the Invention [Problem to be solved by the invention]

[0005] If the wafer is not fixed when the tape is attached, the wafer may move and be damaged. Also, when attaching tape to a wafer that is attached so as to cover an opening in a frame, if the wafer moves during attachment, the wafer may not be attached in the correct position relative to the frame.

[0006] The vacuum chamber shown in Patent Document 1 uses an electrostatic chuck to fix the wafer inside. However, electrostatic chucks are generally expensive and require a high voltage source, so there is a demand for a method to fix the wafer inside the vacuum chamber without using an electrostatic chuck.

[0007] An object of the present invention is to provide a tape adhering method and an adhering device that can adhering tape in a normal adhering state without using an electrostatic chuck. [Means for solving the problem]

[0008] In order to solve the above-mentioned problems and achieve the object, a bonding method of the present invention is a bonding method for bonding a tape to a wafer, comprising: housed in a vacuum chamber On the suction table With the vacuum chamber open to the atmosphere A holding step of holding a wafer by suction, and before or after the holding step, With space between them a positioning step of positioning the tape facing the wafer and the tape application roller facing the wafer with the tape sandwiched therebetween; and after performing the holding step and the positioning step, The tape application roller is brought close to the wafer, The tape is applied by the tape application roller. Part of a pressing step in which the wafer is pressed against the suction table by the tape application roller and the wafer is pressed against the suction table by the tape application roller after the pressing step is performed, a depressurizing step in which the inside of a vacuum chamber that accommodates the suction table that suction-holds the wafer and the tape application roller is made into a vacuum state while the wafer is pressed against the tape application roller after the depressurizing step is performed, Moving the tape application roller along the surface of the wafer; and a bonding step of rolling the tape bonding roller over the tape to bond the tape to the wafer.

[0009] In the above-described adhering method, the pressing step may involve pressing the central region of the wafer via the tape with the tape adhering roller.

[0010] In the above-described adhering method, the pressing step may involve pressing the outer periphery of the wafer via the tape with the tape adhering roller.

[0011] In the above-described adhering method, the tape may not include an adhesive layer, and the adhering step may involve adhering the tape to the wafer while heating the wafer and the tape.

[0012] The bonding device of the present invention is a bonding device for bonding tape to a wafer, A suction table for holding a wafer by suction, and a wafer holder for holding the wafer on the suction table. With space between them The wafer holding apparatus includes a tape holding table that holds the tape by placing the tape opposite the table, a tape application roller that faces the wafer with the tape sandwiched between them and is movable along the surface of the wafer and in a direction that intersects the surface of the wafer, a vacuum chamber that houses the suction table, the tape holding table, and the tape application roller and whose interior can be depressurized, and a control unit that controls each of the components, the control unit comprising: With the vacuum chamber open to the atmosphere, the wafer is held by suction on the suction table, and the tape application roller is brought close to the wafer, The tape is applied by the tape application roller. Part of is pressed against the surface of the wafer and the wafer is pressed against the suction table by the tape application roller, the inside of the vacuum chamber is made into a vacuum state, and from the state where the wafer is pressed against the tape application roller, Moving the tape application roller along the surface of the wafer; The tape is adhered to the wafer by rolling the tape application roller on the tape. [Effects of the Invention]

[0013] The present invention has the effect of enabling tape to be stuck in a normal sticking state without using an electrostatic chuck. [Brief explanation of the drawings]

[0014] [Figure 1] FIG. 1 is an exploded perspective view showing an example of the configuration of a sticking device according to a first embodiment. [Figure 2] FIG. 2 is a cross-sectional view schematically illustrating an example of the configuration of the adhering device shown in FIG. [Figure 3] FIG. 3 is a flowchart showing the flow of the adhering method according to the first embodiment. [Figure 4] FIG. 4 is a cross-sectional view schematically showing the pressing step of the adhering method shown in FIG. [Figure 5]FIG. 5 is a cross-sectional view that schematically shows a state in which the tape application roller has been moved to one end in the Y-axis direction in the application step of the application method shown in FIG. [Figure 6] FIG. 6 is a cross-sectional view that schematically shows a state in which the tape application roller has been moved to above the other end in the Y-axis direction in the application step of the application method shown in FIG. [Figure 7] FIG. 7 is a cross-sectional view schematically showing a state in which the inside of the vacuum chamber is opened to the atmosphere in the adhering step of the adhering method shown in FIG. [Figure 8] FIG. 8 is a cross-sectional view schematically showing a pressing step of the adhering method according to the second embodiment. [Figure 9] FIG. 9 is a cross-sectional view schematically showing a state in which the tape application roller has been moved to one end in the Y-axis direction in the application step of the application method according to the second embodiment. [Figure 10] FIG. 10 is a cross-sectional view schematically showing a pressing step of the adhering method according to the third embodiment. [Figure 11] FIG. 11 is a cross-sectional view schematically showing a state in which the tape applying roller is moved over the central region in the Y-axis direction of the wafer in the pressing step of the applying method according to the third embodiment. [Figure 12] FIG. 12 is a cross-sectional view schematically showing a state in which the tape application roller has been moved to one end in the Y-axis direction in the application step of the application method according to the third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0015] Modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. Furthermore, the components described below include those that can be easily imagined by a person skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Furthermore, various omissions, substitutions, or modifications of the configuration can be made within the scope of the gist of the present invention.

[0016] [Embodiment 1] A sticking device and a sticking method according to a first embodiment of the present invention will be described with reference to the drawings. Fig. 1 is an exploded perspective view showing an example of the configuration of the sticking device according to the first embodiment. Fig. 2 is a cross-sectional view schematically showing the example of the configuration of the sticking device shown in Fig. 1.

[0017] The bonding apparatus 1 according to the first embodiment shown in Fig. 1 is an apparatus for bonding a tape 210 to a surface 203 of a wafer 200 shown in Fig. 2. The wafer 200 to which the tape 210 is bonded by the bonding apparatus 1 according to the first embodiment is a wafer such as a disk-shaped semiconductor wafer or an optical device wafer, with a substrate 201 made of silicon (Si), sapphire (Al2O3), gallium arsenide (GaAs), silicon carbide (SiC), or the like.

[0018] 1, a wafer 200 has a surface 203 divided by a plurality of intersecting planned dividing lines 202, and devices 204 are formed in each of the regions of the surface 203. The devices 204 are, for example, integrated circuits such as ICs (Integrated Circuits) or LSIs (Large Scale Integrations), image sensors such as CCDs (Charge Coupled Devices) or CMOSs ​​(Complementary Metal Oxide Semiconductors), or MEMS (Micro Electro Mechanical Systems).

[0019] In the first embodiment, a disk-shaped tape 210 having a diameter larger than that of the wafer 200 and an annular frame 211 attached to its outer edge is attached to a front surface 203 of the wafer 200, and the wafer 200 is supported within an opening inside the annular frame 211. The wafer 200 is divided into individual devices 204 along planned division lines 202.

[0020] The tape 210 is made of a thermoplastic resin and has a tape shape with a planar area larger than that of the wafer 200. The tape 210 is formed with flat surfaces on both the front and back sides. The tape 210 is made of a flexible and non-adhesive thermoplastic resin and does not include an adhesive layer made of an adhesive resin. In the first embodiment, the tape 210 is made of, for example, a polyolefin resin as a thermoplastic resin. In the first embodiment, the thickness of the tape 210 is 50 μm or more and 150 μm or less. In the present invention, the tape 210 may be a tape including an adhesive layer.

[0021] The bonding apparatus 1 according to the first embodiment is an apparatus that bonds a disk-shaped tape 210, which has a diameter larger than that of the wafer 200 and has an annular frame 211 attached to its outer edge, to a surface 203 of a wafer 200. As shown in FIGS. 1 and 2 , the bonding apparatus 1 includes a suction table 10, a tape holding table 20, a heating unit 30, a tape application roller 40, a roller moving unit 50, a vacuum chamber 60, a lifting unit 70, and a control unit 100.

[0022] The suction table 10 secures the wafer 200 on a holding surface 11 that is parallel to the horizontal direction. The suction table 10 is formed in a disk shape with an outer diameter equal to that of the wafer 200, and is made of porous ceramics or the like. The suction table 10 is connected to a suction source 14 such as an ejector via a suction path 13 provided with an on-off valve 12. The back surface 205 of the wafer 200 is placed on the holding surface 11 of the suction table 10. The suction source 14 suctions the holding surface 11, applying a negative pressure to the holding surface 11, thereby suction-holding the wafer 200 placed on the holding surface 11.

[0023] The tape holding table 20 holds the tape 210 by making the tape 210 face the wafer 200 on the suction table 10. In the first embodiment, the tape holding table 20 is formed in an annular shape with inner and outer diameters equal to the diameter of the annular frame 211, and the annular frame 211 attached to the outer edge of the tape 210 is placed on the placement surface 21 parallel to the horizontal direction, and the tape 210 is held via the annular frame 211.

[0024] Furthermore, the tape holding table 20 is disposed at a position coaxial with the suction table 10, and the placement surface 21 is disposed above the holding surface 11. The tape holding table has an annular frame 211 attached to the outer edge of the tape 210 placed on the placement surface 21 above the holding surface 11, thereby holding the tape 210 so that the tape 210 faces the wafer 200 on the suction table 10 along the Z-axis direction parallel to the vertical direction.

[0025] The heating unit 30 heats the tape 210 held by the tape holding table 20 and the suction table 10 by irradiating them with infrared rays, and also heats the wafer 200 via the suction table 10. The heating unit 30 is formed in a disk shape with a diameter larger than the inner diameter of the annular frame 211, and is disposed in a position coaxial with the suction table 10 and the tape holding table 20. The heating unit 30 is disposed below the suction table 10.

[0026] The tape application roller 40 faces the wafer 200 held on the suction table 10 along the Z-axis direction, sandwiching the tape 210 held on the tape holding table 20, and is movable in the Z-axis direction, which intersects the surface 203 of the wafer 200 (orthogonal in embodiment 1), and in the Y-axis direction, which runs along the surface 203 of the wafer 200 and is orthogonal to the axis of the tape application roller 40.

[0027] The tape application roller 40 is disposed above the tape 210 held on the tape holding table 20 by a support member 41 so as to be rotatable about an axis parallel to the horizontal direction, and the wafer 200 held on the suction table 10, and faces the wafer 200 held on the suction table 10 along the Z-axis direction, sandwiching the tape 210 held on the tape holding table 20. The axis of the tape application roller 40 is parallel to the horizontal direction and parallel to the X-axis direction, which is perpendicular to the Y-axis direction.

[0028] The tape application roller 40 is moved in the Y-axis direction along the surface 203 of the wafer 200 by the roller moving unit 50, and is also moved in the Z-axis direction by the lifting unit 70. When the tape application roller 40 is lowered by the lifting unit 70, it presses the tape 210 held on the tape holding table 20 toward the wafer 200 and the suction table 10, pressing the tape 210 against the wafer 200 and pressing the wafer 200 against the suction table 10.

[0029] In this way, when the tape application roller 40 is lowered by the lifting unit 70, it is positioned to press the tape 210 against the wafer 200 and press the wafer 200 against the suction table 10. Furthermore, when the tape application roller 40 is lowered by the lifting unit 70 and moved along the surface 203 of the wafer 200 by the roller moving unit 50, it presses the tape 210 held on the tape holding table 20 against the wafer 200 and presses the wafer 200 against the suction table 10, and rolls on the tape 210.

[0030] The roller moving unit 50 moves the tape application roller 40 in the Y-axis direction. The roller moving unit 50 includes a well-known ball screw 51 that is rotatable about an axis parallel to the Y-axis direction, a motor 52 that rotates the ball screw 51 about its axis to move the support member 41 in the Y-axis direction, and a well-known guide rail 53 that supports the support member 41 so that it can move in the Y-axis direction.

[0031] The vacuum chamber 60 is a container that houses the suction table 10, the tape holding table 20, the heating unit 30, the tape application roller 40, and the roller moving unit 50, and whose interior can be depressurized. The vacuum chamber 60 includes an upper housing 61 and a lower housing 62 that can move between a state in which their outer edges are in contact with each other and a state in which their outer edges are spaced apart, and a vacuum pump 64 connected to the lower housing 62 via an on-off valve 63.

[0032] The housings 61, 62 integrally include a disk portion 65 whose outer diameter is larger than that of the annular frame 211 and a cylindrical portion 66 standing upright from the outer edge of the disk portion 65. The disk portions of the housings 61, 62 have the same outer diameter. The housings 61, 62 are arranged so that the inner openings of the cylindrical portions 66 face each other along the Z-axis direction. The upper housing 61 is raised and lowered by the lifting unit 70.

[0033] In the vacuum chamber 60, when the upper housing 61 is lowered by the lifting unit 70, the outer edges of the cylindrical portions 66 of the housings 61 and 62 come into airtight contact with each other, isolating the interior from the outside and sealing the interior. The lower housing 62 houses and fixes the suction table 10, the tape holding table 20, and the heating unit 30. The upper housing 61 houses and fixes the guide rails 53 of the roller movement unit 50.

[0034] The control unit 100 controls each component of the adhering device 1, including the suction table 10, the tape holding table 20, the tape adhering roller 40, and the vacuum chamber 60, to cause the adhering device 1 to perform a tape adhering operation of adhering the tape 210 to the surface 203 of the wafer 200. The control unit 100 is a computer capable of executing computer programs, and includes an arithmetic processing device having a microprocessor such as a CPU (Central Processing Unit), a storage device having memory such as a ROM (Read Only Memory) or RAM (Random Access Memory), and an input / output interface device.

[0035] The arithmetic processing unit of the control unit 100 executes on the RAM a computer program stored in the ROM to generate control signals for controlling the bonding device 1. The arithmetic processing unit of the control unit 100 outputs the generated control signals to each component of the bonding device 1 via the input / output interface device.

[0036] The control unit 100 is also connected to a display unit configured with a liquid crystal display device or the like that displays the status of the machining operation, images, etc., and an input unit that the operator uses to register machining content information, etc. The input unit is configured with at least one of a touch panel provided on the display unit and a keyboard, etc.

[0037] Next, the tape application operation of the application device 1 having the above-described configuration, that is, the application method according to embodiment 1, will be described with reference to the drawings. Fig. 3 is a flowchart showing the flow of the application method according to embodiment 1.

[0038] The adhering method is a method by which the adhering apparatus 1 adheres the tape 210 to the wafer 200. In the adhering apparatus 1 configured as described above, the control unit 100 controls each component to perform the tape adhering operation, i.e., the adhering method. As shown in Fig. 3, the adhering method includes a positioning step 1001, a holding step 1002, a pressing step 1003, a decompression step 1004, and an adhering step 1005.

[0039] (Positioning step) The positioning step 1001 is a step of positioning the tape application roller 40 so that it faces the wafer 200 on the suction table 10 with the tape 210 sandwiched between them before the holding step 1002 is performed. In the positioning step 1001, the upper housing 61 of the bonding device 1 is raised, and with the inside of the vacuum chamber 60 open to the atmosphere, the back surface 205 of the wafer 200 is placed on the holding surface 11 of the suction table 10, and the annular frame 211 with the outer edge of the tape 210 attached is placed on the tape holding table 20, and the tape 210 is positioned so that it faces the wafer 200 on the suction table 10 with the tape 210 sandwiched between them.

[0040] (holding step) The holding step 1002 is a step of suction-holding the wafer 200 on the suction table 10. In the holding step 1002, when the control unit 100 receives an operation start instruction from the operator via an input unit or the like, the bonding apparatus 1 opens the on-off valve 12 with the inside of the vacuum chamber 60 open to the atmosphere, suction-holds the back surface 205 of the wafer 200 on the holding surface 11 of the suction table 10, and operates the heating unit 30 to heat and soften the tape 210 held on the tape holding table 20 and heat the wafer 200 held on the suction table 10.

[0041] (Pressing step) Fig. 4 is a cross-sectional view schematically showing the pressing step of the adhering method shown in Fig. 3. In the pressing step 1003, after the holding step 1002 and the positioning step 1001 are performed, the tape adhering roller 40 presses the tape 210 against the wafer 200 and also presses the wafer 200 against the suction table 10.

[0042] In the pressing step 1003, in the bonding apparatus 1, the control unit 100 controls the roller moving unit 50 to position the tape application roller 40 above the central region in the Y-axis direction of the holding surface 11 of the suction table 10, and controls the lifting unit 70 to lower the upper housing 61, so that the tape application roller 40 presses the central region in the Y-axis direction of the tape 210 against the central region of the wafer 200 and presses the wafer 200 against the suction table 10, as shown in Fig. 4. Thus, in the pressing step 1003 in embodiment 1, the tape application roller 40 presses the central region of the wafer 200 via the tape 210.

[0043] (Decompression step) The depressurizing step 1004 is a step in which, after the pressing step 1003 is performed, the inside of the vacuum chamber 60 that houses the suction table 10 that suction-holds the wafer 200 and the tape application roller 40 is evacuated while the wafer 200 is being pressed down by the tape application roller 40. In the first embodiment, in the depressurizing step 1004, the bonding apparatus 1 opens the on-off valve 63 and operates the vacuum pump 64 while the tape application roller 40 presses down the wafer 200 against the suction table 10 via the tape 210 and stops the movement of the tape application roller 40 by the roller movement unit 50, thereby depressurizing the inside of the vacuum chamber 60 and creating a vacuum state. Note that the vacuum state refers to a state in which the air pressure is lower than atmospheric pressure.

[0044] (Attachment step) Fig. 5 is a cross-sectional view schematically showing a state in which the tape application roller has been moved to one end in the Y-axis direction in the application step of the application method shown in Fig. 3. Fig. 6 is a cross-sectional view schematically showing a state in which the tape application roller has been moved to the other end in the Y-axis direction in the application step of the application method shown in Fig. 3. Fig. 7 is a cross-sectional view schematically showing a state in which the inside of the vacuum chamber has been opened to the atmosphere in the application step of the application method shown in Fig. 3.

[0045] In the adhering step 1005, after the depressurizing step 1004 is performed, the tape adhering roller 40 is pressed against the wafer 200 and then rolls on the tape 210 to adhere the tape 210 to the wafer 200. In the adhering step 1005, the adhering device 1 keeps the inside of the vacuum chamber 60 in a vacuum state, and the control unit 100 controls the roller moving unit 50 to move the tape adhering roller 40 toward one end of the wafer 200 in the Y-axis direction, with the wafer 200, which is suction-held on the suction table 10, pressed against the suction table 10 by the tape adhering roller 40.

[0046] In the bonding step 1005, the control unit 100 of the bonding device 1 controls the roller moving unit 50 to roll the tape application roller 40 on the tape 210, causing the tape application roller 40 to adhere the tape 210 to the surface 203 of the wafer 200, and moves the tape application roller 40 to one end of the wafer 200 in the Y-axis direction, as shown in Figure 5.

[0047] Here, the tape 210 is made of a thermoplastic resin, and is softened by being heated by the heating unit 30. Therefore, when the tape is brought into close contact with the surface 203 of the wafer 200 by the tape application roller 40, the tape is adhered to the surface 203 of the wafer 200, and as shown in Fig. 5, the tape remains in close contact with the surface 203 of the wafer 200 even after the tape application roller 40 has passed. Thus, in the first embodiment, in the adhering step 1005, the adhering apparatus 1 heats the wafer 200 and the tape 210, and adheres and bonds the tape 210 to the surface 203 of the wafer 200 from the central region to one end in the Y-axis direction, starting from the central region.

[0048] In the adhering step 1005, the control unit 100 of the adhering apparatus 1 controls the roller moving unit 50 to move the tape adhering roller 40 toward the other end of the wafer 200 in the Y-axis direction, roll the tape adhering roller 40 on the tape 210, and bring the tape 210 into close contact with the surface 203 of the wafer 200 with the tape adhering roller 40, and then move the tape adhering roller 40 to above the other end of the wafer 200 in the Y-axis direction, as shown in Fig. 6. Then, in the first embodiment, in the adhering step 1005, the adhering apparatus 1 heats the wafer 200 and the tape 210, and adheres and bonds the tape 210 to the surface 203 of the wafer 200 from the central region to the other end in the Y-axis direction, starting from the central region. Thus, in embodiment 1, in the bonding step 1005, the bonding device 1 adheres and bonds the tape 210 to the surface 203 of the wafer 200 from the central region to one end in the Y-axis direction of the surface 203 of the wafer 200, starting from the central region side, and then adheres and bonds the tape 210 to the surface 203 of the wafer 200 from the central region to the other end in the Y-axis direction of the surface 203 of the wafer 200, starting from the central region side.

[0049] In the bonding step 1005, the control unit 100 of the bonding apparatus 1 stops the vacuum pump 64, closes the on-off valve 63, and causes the lifting unit 70 to raise the upper housing 61, thereby opening the inside of the vacuum chamber 60 to the atmosphere as shown in Fig. 7, thereby completing the bonding operation, i.e., the bonding method. Then, the tape 210 is pressed by the atmosphere toward the surface 203 of the wafer 200, and deforms to follow the minute irregularities on the surface 203 of the wafer 200, thereby coming into close contact with the surface 203 of the wafer 200.

[0050] In this way, the control unit 100 of the adhering device 1 presses the tape 210 against the surface 203 of the wafer 200 with the tape adhering roller 40 and presses the wafer 200 against the suction table 10 with the tape adhering roller 40, creates a vacuum inside the vacuum chamber 60, and rolls the tape adhering roller 40 over the tape 210 while the tape adhering roller 40 is pressing down on the wafer 200, thereby adhering the tape 210 to the wafer 200.

[0051] The bonding method and bonding device 1 according to the first embodiment described above sucks and holds the wafer 200 on the suction table 10 with the inside of the vacuum chamber 60 open to the atmosphere, and in a pressing step 1003, the tape application roller 40 presses the wafer 200 onto the suction table 10 via the tape 210. Then, the bonding method and bonding device 1 according to the first embodiment creates a vacuum state inside the vacuum chamber 60 with the wafer 200 pressed onto the suction table 10 with the tape application roller 40. Next, the bonding method and bonding device 1 according to the first embodiment presses the wafer 200 with the tape application roller 40 and rolls the tape application roller 40 over the tape 210, thereby bonding the tape 210 to the wafer 200, while keeping the inside of the vacuum chamber 60 in a vacuum state.

[0052] For this reason, in the bonding method and bonding device 1 according to the first embodiment, even if the inside of the vacuum chamber 60 becomes a vacuum state and the suction holding force of the wafer 200 due to the negative pressure of the suction table 10 is lost, the wafer 200 is pressed by the tape application roller 40, so that the wafer 200 can be prevented from moving on the suction table 10 while the tape 210 is being applied. Therefore, the bonding method and bonding device 1 according to the first embodiment can apply the tape 210 normally without the inclusion of air bubbles or the occurrence of wrinkles, without using an electrostatic chuck. As a result, the bonding method and bonding device 1 according to the first embodiment achieve the effect of being able to apply the tape 210 in a normal application state without using an electrostatic chuck.

[0053] [Embodiment 2] An application device and application method according to a second embodiment of the present invention will be described with reference to the drawings. Fig. 8 is a cross-sectional view schematically showing the pressing step of the application method according to the second embodiment. Fig. 9 is a cross-sectional view schematically showing the state in which the tape application roller has been moved to one end in the Y-axis direction in the application step of the application method according to the second embodiment. In Figs. 8 and 9, the same parts as those in the first embodiment are designated by the same reference numerals and will not be described again. The second embodiment is the same as the first embodiment except that the application device 1 is the same as the first embodiment and the operations of the pressing step 1003 and the application step 1005 of the application method are different.

[0054] In the second embodiment, in the pressing step 1003, the control unit 100 of the bonding device 1 controls the roller moving unit 50 to position the tape application roller 40 above the other end in the Y-axis direction of the holding surface 11 of the suction table 10, and controls the lifting unit 70 to lower the upper housing 61, so that the tape application roller 40 presses the other end in the Y-axis direction of the tape 210 against the other end of the wafer 200 and presses the wafer 200 against the suction table 10, as shown in Fig. 8. Thus, in the second embodiment, in the pressing step 1003, the tape application roller 40 presses the other end on the outer periphery of the wafer 200 via the tape 210.

[0055] In the second embodiment, in the decompression step 1004, the bonding apparatus 1 decompresses the inside of the vacuum chamber 60 to create a vacuum state, similar to the first embodiment.

[0056] In the second embodiment, in the bonding step 1005, the bonding apparatus 1 keeps the inside of the vacuum chamber 60 in a vacuum state, and the control unit 100 controls the roller moving unit 50 to move the tape application roller 40 toward one end of the wafer 200 in the Y-axis direction, while the wafer 200, which is suction-held on the suction table 10 by the tape application roller 40, is pressed against the suction table 10. In the second embodiment, in the bonding step 1005, the bonding apparatus 1 rolls the tape application roller 40 on the tape 210, causing the tape application roller 40 to adhere and bond the tape 210 to the surface 203 of the wafer 200, and moves the tape application roller 40 to above one end of the wafer 200 in the Y-axis direction, as shown in FIG.

[0057] In the second embodiment, in the bonding step 1005, the bonding apparatus 1 heats the wafer 200 and the tape 210, and bonds and adheres the tape 210 to the surface 203 of the wafer 200 in the Y-axis direction from the other end to one end of the surface 203 of the wafer 200 in order from the other end side. In the second embodiment, in the bonding step 1005, the bonding apparatus 1 opens the inside of the vacuum chamber 60 to the atmosphere, as in the first embodiment.

[0058] As in the first embodiment, the bonding method and bonding device 1 according to the second embodiment holds the inside of the vacuum chamber 60 in a vacuum state while pressing down the wafer 200 with the tape application roller 40 and rolling the tape application roller 40 over the tape 210 to apply the tape 210 to the wafer 200. Therefore, even if the suction holding force of the wafer 200 due to the negative pressure of the suction table 10 is lost, the wafer 200 is pressed down with the tape application roller 40, so that the wafer 200 can be prevented from moving on the suction table 10 while the tape 210 is being applied. As a result, as in the first embodiment, the bonding method and bonding device 1 according to the second embodiment have the effect of being able to apply the tape 210 in a normal application state without using an electrostatic chuck.

[0059] [Embodiment 3] A bonding apparatus and a bonding method according to a third embodiment of the present invention will be described with reference to the drawings. FIG. 10 is a cross-sectional view schematically showing the pressing step of the bonding method according to the third embodiment. FIG. 11 is a cross-sectional view schematically showing the state in which the tape application roller has been moved over the central region in the Y-axis direction of the wafer in the pressing step of the bonding method according to the third embodiment. FIG. 12 is a cross-sectional view schematically showing the state in which the tape application roller has been moved to one end in the Y-axis direction in the bonding step of the bonding method according to the third embodiment. In FIGS. 10, 11, and 12, the same parts as those in the first embodiment are designated by the same reference numerals, and their description will be omitted. The third embodiment is the same as the first embodiment except that the bonding apparatus 1 is the same as the first embodiment, and the operations of the pressing step 1003 and the bonding step 1005 of the bonding method are different.

[0060] In the third embodiment, in the pressing step 1003, the control unit 100 of the bonding apparatus 1 controls the roller moving unit 50 to position the tape application roller 40 above the other end in the Y-axis direction of the holding surface 11 of the suction table 10, and controls the lifting unit 70 to lower the upper housing 61, so that the tape application roller 40 presses the other end in the Y-axis direction of the tape 210 against the other end of the wafer 200 and presses the wafer 200 against the suction table 10, as shown in Fig. 10. Thus, in the third embodiment, in the pressing step 1003, the tape application roller 40 presses the other end on the outer periphery of the wafer 200 via the tape 210.

[0061] In the third embodiment, in the pressing step 1003, the control unit 100 controls the roller moving unit 50 of the adhering device 1 to move the tape application roller 40 toward the central region in the Y-axis direction of the wafer 200 while the tape application roller 40 presses the wafer 200, which is suction-held on the suction table 10, against the suction table 10. In the third embodiment, in the adhering step 1005, the adhering device 1 rolls the tape application roller 40 on the tape 210, causing the tape application roller 40 to adhere and bond the tape 210 to the surface 203 of the wafer 200, and moves the tape application roller 40 to above the central region in the Y-axis direction of the wafer 200, as shown in FIG. In the third embodiment, in the pressing step 1003, the adhering apparatus 1 heats the wafer 200 and the tape 210, and adheres and bonds the tape 210 to the front surface 203 of the wafer 200 in order from the other end side across the other end and the central region in the Y-axis direction of the front surface 203 of the wafer 200. Thus, in the third embodiment, in the pressing step 1003, the tape adhering roller 40 presses the central region of the wafer 200 via the tape 210.

[0062] In the third embodiment, in the decompression step 1004, the bonding apparatus 1 decompresses the inside of the vacuum chamber 60 to create a vacuum state, similar to the first embodiment.

[0063] In the third embodiment, in the bonding step 1005, while the inside of the vacuum chamber 60 is kept in a vacuum state, the control unit 100 controls the roller moving unit 50 to move the tape application roller 40 from the central region in the Y-axis direction of the wafer 200 toward one end while the wafer 200, which is suction-held on the suction table 10 by the tape application roller 40, is pressed against the suction table 10. In the third embodiment, in the bonding step 1005, the bonding device 1 rolls the tape application roller 40 on the tape 210, causing the tape application roller 40 to adhere and bond the tape 210 to the surface 203 of the wafer 200, and moves the tape application roller 40 to above one end of the wafer 200 in the Y-axis direction, as shown in FIG.

[0064] In the third embodiment, in the bonding step 1005, the bonding apparatus 1 heats the wafer 200 and the tape 210, and bonds and adheres the tape 210 to the surface 203 of the wafer 200 from the central region side to one end portion in the Y-axis direction of the surface 203 of the wafer 200 in order from the central region side. In the third embodiment, in the bonding step 1005, the bonding apparatus 1 opens the inside of the vacuum chamber 60 to the atmosphere, as in the first embodiment.

[0065] As in the first embodiment, the bonding method and bonding device 1 according to the third embodiment holds the inside of the vacuum chamber 60 in a vacuum state, and applies the tape 210 to the wafer 200 by pressing the wafer 200 with the tape application roller 40 and rolling the tape application roller 40 over the tape 210, so that even if the suction holding force of the wafer 200 due to the negative pressure of the suction table 10 disappears, the wafer 200 is pressed by the tape application roller 40, preventing the wafer 200 from moving on the suction table 10 while the tape 210 is being applied. As a result, as in the first embodiment, the bonding method and bonding device 1 according to the third embodiment have the effect of applying the tape 210 in a normal application state without using an electrostatic chuck.

[0066] The present invention is not limited to the above-described embodiment. In other words, various modifications can be made without departing from the gist of the present invention. In the present invention, in the holding step 1002, the backside 205 of the wafer 200 is placed on the holding surface 11 of the suction table 10, and the bonding device 1 opens the on-off valve 12 to suction-hold the wafer 200 on the holding surface 11 of the suction table 10. In the positioning step 1001, after the holding step 1002 is performed, the annular frame 211 to which the outer edge of the tape 210 is attached is placed on the tape holding table 20, and the tape 210 is positioned so that it faces the wafer 200 on the suction table 10 and the tape application roller 40 faces the wafer 200 with the tape 210 sandwiched between them. [Explanation of symbols]

[0067] 1 Pasting device 10 Suction table 20 Tape holding table 40 Tape application roller 60 Vacuum Chamber 100 control unit 200 wafers 210 Tape 1001 Positioning Step 1002 Retention Steps 1003 Pressing step 1004 Decompression step 1005 Adhesion step

Claims

1. A method for attaching tape to a wafer, comprising: a holding step of suction-holding the wafer by a suction table accommodated in a vacuum chamber while the vacuum chamber is open to the atmosphere; a positioning step of positioning a tape facing the wafer on the suction table with a gap therebetween and a tape application roller facing the wafer with the tape sandwiched therebetween, before or after the holding step is performed; a pressing step of bringing the tape application roller close to the wafer after the holding step and the positioning step, and pressing a part of the tape against the wafer with the tape application roller and pressing the wafer against the suction table with the tape application roller; a depressurizing step of evacuating the inside of a vacuum chamber that accommodates the suction table that suction-holds the wafer and the tape application roller while the wafer is pressed by the tape application roller after the pressing step is performed; and a bonding step of, after carrying out the decompression step, moving the tape application roller along the surface of the wafer while the tape application roller is pressing down on the wafer, and rolling the tape application roller on the tape to bond the tape to the wafer.

2. 2. The method according to claim 1, wherein the pressing step presses the central region of the wafer through the tape with the tape application roller.

3. 2. The adhering method according to claim 1, wherein in the pressing step, the outer periphery of the wafer is pressed by the tape adhering roller through the tape.

4. 4. The method according to claim 1, wherein the tape does not include an adhesive layer, and the adhering step involves adhering the tape to the wafer while heating the wafer and the tape.

5. A tape adhering device for adhering a tape to a wafer, a suction table that holds the wafer by suction; a tape holding table that holds the tape by making the tape face the wafer on the suction table with a gap therebetween; a tape application roller that faces the wafer with the tape sandwiched therebetween and is movable in a direction intersecting the surface of the wafer and along the surface of the wafer; a vacuum chamber that accommodates the suction table, the tape holding table, and the tape application roller and whose interior can be depressurized; a control unit for controlling each component; The control unit holds the wafer by suction on the suction table with the vacuum chamber open to the atmosphere, brings the tape application roller close to the wafer, causes the tape application roller to press a portion of the tape against the surface of the wafer and presses the wafer against the suction table with the tape application roller, creates a vacuum inside the vacuum chamber, and moves the tape application roller along the surface of the wafer from the state in which the tape application roller is pressing down on the wafer, causing the tape application roller to roll on the tape to apply the tape to the wafer.

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