Contact module for contacting optoelectronic chips

Abstract

The present invention relates to a contact module and a method for assembling a contact module, which includes an optical module (1) including an optical block (1.1) made of glass and an electronic module (2), the optical block (1.2) being connected to the electronic module (2) via an adhesive connection, or the optical module (1) having a mounting plate (1.2) mounted on the electronic module (2) and which is releasably mounted therefrom on the electronic module (2) and connected to the optical block (1.1) via an adhesive connection. The adhesive connection is made by at least three cylindrical pins (5), each of which abuts the optical block (1.1) with a first end face (5.1) by means of adhesive (9) and is guided in a through-hole (7) in the carrier plate (2.1) or the mounting plate (1.2).

Description

[Technical Field]

[0001] The present invention, as is generally known from US Pat. No. 5,649,999, relates to a contact module for testing optoelectronic chips.

[0002] The present invention relates to the field of inspecting and testing, at wafer level, chips with optoelectronic integrated circuits, known as PICs (Photoelectronic Integrated Circuits). In contrast to conventional chips with purely electrical integrated circuits, so-called ICs (Integrated Circuits), PICs integrate optical functions and electrical circuits. [Background technology]

[0003] In the manufacture of ICs, for example, using CMOS technology, inspections and measurements are performed at various manufacturing steps to monitor the process and perform quality control. A well-established inspection is electrical wafer-level inspection after wafer completion. Here, functional and non-functional chips (known good dies (KGDs)) are identified and recorded in a wafer map, thereby determining the yield. When dividing the wafer into individual chips, non-functional chips are rejected. The inspection equipment required for wafer-level inspection is available in the form of wafer probers and wafer testers with associated contact modules (probe cards). The contact modules connect the equipment interfaces (inputs and outputs) of the wafer tester to the individual interfaces (inputs and outputs) of the chips on the wafer fixed to the wafer prober. Typically, the contact module is configured to contact only one chip, but it can also be configured to contact several chips simultaneously. It is not necessary for the contacting chips to remain within the wafer compound. In order to contact several chips of a wafer simultaneously or one after the other, the chips simply need to have fixed, defined positions relative to each other. This margin is given for the contact module of the prior art and for the contact module according to the invention.

[0004] Test equipment for testing purely electronic chips (semiconductor chips with ICs) has been optimized and diversified over decades and is capable of testing the most diverse ICs in large quantities with high productivity for cost optimization.

[0005] PICs are usually manufactured using the same established semiconductor processes, e.g., CMOS technology. Initially, as a result of the very low production volumes of PICs compared to IC manufacturing, only testing for process characterization was typically performed in semiconductor fabs, not functional testing of PICs. Functional characterization was the responsibility of the end customer and was often performed on cut chips. For the test equipment used, separate electrical and optical contact modules were used.

[0006] Inspecting PICs at wafer level requires coupling and decoupling light to the PIC level, usually by means of grating couplers integrated as coupling points, which can be functional components in the chips or sacrificial structures on the wafer, e.g., in scribed lanes or on adjacent chips.

[0007] The aforementioned Patent Document 2 discloses a contact plate (probe substrate) and a redistribution plate (redistribution substrate), electricity and light The present invention discloses an optoelectronic contact module for testing chips having inputs and outputs (devices under test - DUT). The contact module forms an interface between a test device (automated test equipment - ATE) and the DUT, and is designed with electrical contacts (electrical probes), optical terminals (optical probes), optical elements, and combinations thereof, to conduct signals from and to the DUT and redistribute these signals to the test device for interfacing.

[0008] The division into a contact plate and a redistribution plate results in a modular design of the contact module, which has the advantage that if the electrical contacts are damaged, the contact plate can be replaced, while the redistribution plate continues to be used with the relatively expensive electrical and optical distribution network.

[0009] lightRegarding inputs and outputs (optical interfaces), it is disclosed that these are created via optical elements located on the contact plate and / or redistribution plate, and are adapted to various coupling mechanisms, e.g., free-radiation, quasi-free-radiation, or waveguides. Suitable optical elements mentioned above include diffractive and refractive elements. Photodetectors or light sources may also be located directly at the interface with the DUT, with the optical elements located on the contact plate. light It is also described that the inputs and outputs can be configured.

[0010] According to an exemplary embodiment of the aforementioned Patent Document 2, light and electricity Signal line ( light and electricity The optical signal distribution network is implemented in a separate redistribution plate. It is proposed to guide the electrical signals from the DUT to the edge region of the contact plate, so that in a first redistribution plate on the contact plate the electrical signals are coupled on the edge region. This makes it possible to form openings in the first redistribution plate, in which only electrical signals are redistributed, and through which optical signals are guided to a separate second redistribution plate above the first redistribution plate.

[0011] In summary, the aforementioned Patent Document 2 presents several ideas on how a contact module divided into a contact plate and a redistribution plate can be additionally equipped with optical signal lines for some reason, such as wear of the mechanical contacts for electrical signal transmission. electricity The tolerances available for input and output mechanical contacts are light It ignores the inability to transfer to input and output.

[0012] electricity While continuous electrical signal transmission through the interface requires mechanical contact of needles present on a contact module with contact plates (contact pads) present on the DUT, which can be guaranteed within a relatively large positional tolerance of a few μm in all three spatial directions, the quality of optical signal transmission is already affected by much smaller deviations, in the submicron range, from its target position.

[0013] A contact module that is insensitive to positional tolerances of the optical interface is known from DE 10 200 04 133 A1. Like the contact module according to the invention and like contact modules known from the prior art, the contact module described therein is arranged between a wafer platform, e.g. a wafer prober, on which a wafer with optoelectronic chips under test is fixed, and a test device that generates and evaluates optical and electrical signals. The contact module is arranged to detect the individual positions of the optoelectronic chips under test. light and electricity Interfaces and related equipment for testing equipment light and electricity Establishes signal-related connections between the interfaces. electricity or light input and output, from or those to Electrical or optical signals are input or output, respectively, and transmitted to or from the optoelectronic chip under test via electrical or optical signal lines, respectively.

[0014] On Contact Module 1 electricity Each interface is formed by the tip of a contact needle, and each contact needle transmits an electrical signal, thereby connecting one of the photoelectric chips under test. electricity The interface is mechanically contacted, each of which is formed by an electrical contact pad. As detailed in prior art specifications, the tolerance limits required for reliable electrical contact are greater than those required for optical contact.

[0015] From the aforementioned Patent Document 1, the contact module is electricity It is also known to include an electronic module in which the interface is arranged and an optical module in which the optical interface is arranged, the optical module being attached to the electronic module in a defined manner via a mechanical interface; electricity Interface arrangement is the optical interface arrangement has a relative position defined with respect to

[0016] The advantage over monolithic contact modules is in particular that the electrical and optical signal lines can be manufactured independently of one another in different manufacturing processes and in or on substrates made of different materials. light or electricity Equally, the optical block is adjusted and fixed relative to the electronic block to ensure that all interfaces form a common arrangement that can be adjusted to the optoelectronic chip under test.

[0017] In an advantageous embodiment of the contact module, the optical block is advantageously embodied in such a way that its dimensions and shape include breakthroughs and / or openings, so that all contact needles present on the electronic module can pass through the optical block and contact the chip 2 around it and / or possibly through openings formed therein.

[0018] In one example embodiment of the contact module described in the aforementioned patent document 1, the electronic module corresponds in its technical design purely to conventional contact modules for electronic chips. It comprises a printed circuit board, an arrangement of contact needles, embodied here as cantilever needles, and a carrier plate on which the mechanical interface with the testing device is mounted. The electrical contacts are made via the electrical contact pads of the chip. and This is established through the electronic module by physical contact of the contact needle.

[0019] Each optical module is a waveguide and an integral mirror disposed in front of each waveguide.The optical block comprises an optical block having a V-groove, a fiber holder having a V-groove, and a glass fiber and a monofiber or multifiber connector. The waveguide is manufactured by a direct laser writing method, and the mirror is manufactured by a laser etching method. Thus, the waveguide is formed by the input of laser energy through a locally confined modified substrate material, which is characterized in particular by a localized refractive index modification compared to the refractive index of the substrate material. The mirror is formed by the interface of an etched recess in the substrate material. The substrate material of the optical block is glass, preferably borate float glass, with a thickness ranging from several hundred micrometers to several millimeters, preferably 0.5 to 1 mm. Optical contact occurs over the distance between the chip and the contact module without direct contact with the chip. The method used to manufacture the mirror and waveguide allows for high precision manufacturing of the optical interfaces, particularly relative to each other and to the mechanical interfaces on the optical block. Furthermore, free positioning of the mirror and waveguide within the substrate material is possible.

[0020] Preferably, the optical module is connected to the electronic module by gluing it to a carrier plate (support plate) of the electronic module, for example, via three fixed positions. For example, when manufacturing an electronic module with cantilevered needles as contact needles, the Z-height of the needles usually refers to the clamping position of the contact module, which has fixed references relative to the wafer platform. Using a metal frame as the carrier plate, these reference points are located on the metal frame, on which the fixed positions for the optical module are integrated with high precision. Therefore, the optical module can be precisely installed in a plane parallel to the reference plane of the tip of the contact needle by positionally accurate gluing to the fixed positions in the Z direction. The plane-parallel installation of the optical module relative to the electronic module also prevents the optical module from contacting the chip during operation due to the small working distance. As an alternative to fixing to a carrier plate, the optical block can also be directly attached to a printed circuit board.

[0021] The aforementioned Patent Document 1 only discloses and proposes connecting the mechanical interface between the optical block and the electronic module via adhesive, and does not provide further details as to why it is obvious that adhesive is inserted between the flat mechanical interfaces. [Prior art documents] [Patent documents]

[0022] [Patent Document 1] WO2019 / 029765A1 [Patent Document 2] US2006 / 0109015A1 Summary of the Invention [Problem to be solved by the invention]

[0023] The object of the present invention is to provide a contact module having a novel and cost-effective design of the mechanical interface between the optical block and the electronic module, or between the optical block and a mounting plate connected to the electronic block, whereby the optical block can be freely positioned in all six degrees of freedom relative to the electronic module in an adjusted position and can thus be accurately and permanently fixed in this adjusted position.

[0024] It is a further object of the present invention to provide a method for mounting an optical block that is adjustable in all six degrees of freedom to an electronic module or to a mounting plate connected to the electronic block, which allows the optical block to be fixed in the adjusted position with high precision and ease. [Means for solving the problem]

[0025] Regarding the contact module, the objective is to arrangement an optical module including an optical block made of glass having an electrical interface in an electrical interface plane; arrangementand an electronic module including a carrier plate, a printed circuit board, and a needle carrier having an arrangement of contact needles with needle tips, forming an optical interface. arrangement and electrical interface arrangement has a defined adjustment position relative to each other with respect to all six degrees of freedom of the Cartesian coordinate system. It is essential for the present invention that, according to a first option, the optical block is permanently connected to the carrier plate via at least three cylindrical pins, or, according to a second option, the optical module has a mounting plate to which the optical block is permanently connected via at least three cylindrical pins. Each cylindrical pin contacts the optical block at a first end face via adhesive. The carrier plate or the mounting plate has a plurality of through-holes arranged parallel to one another, in which each cylindrical pin is connected to the carrier plate or the mounting plate via adhesive.

[0026] Advantageous embodiments are set out in the following dependent claims 2 to 6.

[0027] Regarding the method, the object is to provide a method for detecting the optical interface in the optical interface plane. arrangement an optical module including an optical block made of glass having an electrical interface in an electrical interface plane; arrangement and an electronic module including a needle carrier having an arrangement of contact needles with needle tips, the arrangement forming a carrier plate, a printed circuit board, and an optical interface, arrangement and electrical interface arrangement This is achieved by the way the optical module and the electronic module are arranged relative to each other so that they have a defined adjustment position relative to each other.

[0028] According to the first option, first, the optical interface arrangement is the electrical interface arrangement, and the optical block is then permanently connected to the carrier plate by an adhesive connection according to the invention.

[0029] According to a second option, the mounting plate is first connected to the carrier plate via a removable connection in a repeatable relative position, and then the optical interface arrangement is the electrical interface arrangement , and the optical block is then permanently connected to the mounting plate by an adhesive connection according to the invention.

[0030] It is essential for the present invention that the adhesive connection for both of the above options is created by first making at least three through-holes parallel to one another in the carrier plate or in the mounting plate and then inserting each of the at least three through-holes through one of the through-holes until it comes into contact with the optical block. First, adhesive is applied to the first end faces of the cylindrical pins facing the optical block, so that they adhere the optical block. The cylindrical pins are glued to the carrier plate or mounting plate during or after passing through the through-holes.

[0031] The invention will be explained in more detail below with reference to exemplary embodiments and drawings. [Brief explanation of the drawings]

[0032] [Figure 1a] 1 shows a contact module according to a first option in which the optical block of the optical module is connected to the carrier plate of the electronic module via an adhesive connection (plan view); [Figure 1b] 1 shows a contact module according to a first option in which the optical block of the optical module is connected to the carrier plate of the electronic module via an adhesive connection (cross section); [Figure 2a] 10 shows a contact module according to a second option in which the optical block is connected to the mounting plate of the optical module via an adhesive connection (top view); FIG. [Figure 2b] 10 shows a contact module according to a second option in which the optical block is connected to the mounting plate of the optical module via an adhesive connection (cross section). [Figure 3a] 1 shows a first embodiment of an adhesive connection according to the invention; [Figure 3b] FIG. 2 shows a second embodiment of an adhesive connection according to the invention. [Figure 4a] 1 shows a contact module according to a second option with a first embodiment of a detachable connection; [Figure 4b] 1 shows a contact module according to a second option with a first embodiment of a detachable connection; DETAILED DESCRIPTION OF THE INVENTION

[0033] As shown in FIGS. 1a and 1b, the contact module according to the invention has an optical interface plane E opt Optical interface S opt of arrangement an optical module 1 including an optical block 1.1 made of glass, and an electrical interface plane E ele Electrical interface ele of arrangement The optical interface S comprises an electronic module 2 including a carrier plate 2.1, a printed circuit board 2.2 and a needle carrier 2.3 with an arrangement of contact needles 2.3.1 with needle tips, forming a opt of arrangement and electrical interface S ele of arrangementThe optical module 1 and the electronic module 2 are arranged relative to each other so that they have a defined adjustment position relative to each other with respect to all six degrees of freedom of the Cartesian coordinate system. The optical block 1.1 is fixed in the adjustment position via an adhesive connection. According to a first option of the contact module according to the invention, the adjustment layer can be fixed by an adhesive connection according to the invention directly between the optical block 1.1 and the electronic module 2, on which the carrier plate 2.1 forms the mechanical basis (see FIGS. 1a and 1b), or according to a second option, it can be fixed indirectly between the optical block 1.1 and a mounting plate 1.2, which may be included by the optical module 1, via an adhesive connection according to the invention, which adhesive connection is connected to the electronic module 2, more precisely to the carrier plate 2.1, via a reproducible, detachable connection (see FIGS. 2a and 2b).

[0034] It is essential to the invention that the adhesive connection between the optical block 1.1 and the mounting plate 1.2 or between the optical block 1.1 and the carrier plate 2.1 is made indirectly via at least three cylindrical pins 5. As can be seen more clearly in Figures 3a and 3b, the cylindrical pins 5 each have a first end face 5.1 that contacts the optical block 1.1 via adhesive 9. The carrier plate 2.1 or the mounting plate 1.2 has a plurality of through holes 7 into which the cylindrical pins 5 are fixed via adhesive 9 to the carrier plate 2.1 or the mounting plate 1.2, respectively.

[0035] In one embodiment, the cylindrical pins 5 and the through holes 7 are dimensioned to fit together so that their respective second end faces 5.2 protrude beyond the through holes 7, so that they can be held in place until they abut the optical block 1.1 during assembly. In this case, adhesive 9 is applied to the protruding circumferential surface of each of the cylindrical pins 5 (see Figure 3a).

[0036] In another embodiment shown in FIG. 3b, the second end face 5.2 of each of the cylindrical pins 5 is located inside one of the through holes 7, and any free volume remaining above it in the through hole 7 is filled with adhesive 9.

[0037] If, according to the invention, the optical block 1.1 is glued to the mounting plate 1.2, the mounting plate 1.2 is advantageously connected to the carrier plate 2.1 via a reversibly detachable connection. The detachable connection is connected to the electrical interface S ele of arrangement Optical Interfaces opt of arrangement This ensures the repeatability of the adjustment position.

[0038] A first embodiment of a detachable connection is shown in Figures 4a and 4b, but the adhesive connection according to the invention is not shown here. On one end face 1.2.1 of the mounting plate there are three projections 1.2.1.1 which define a mounting plane and abut against the mounting face 2.1.1 of the carrier plate 2.1. The relative position of the mounting plate 1.2 in the z direction around the x and y directions of the Cartesian coordinate system with respect to the carrier plate 2.1 is fixed. Three dowel pins aligned parallel to the mounting plane 1.2.2.1 The mounting plate 1.2.2 has two dowel pins on its outer periphery. These two are aligned at right angles to each other and each has a corresponding stop pin on the carrier plate 2.1. 2.1.2 This determines the relative position of the mounting plate 1.2 to the carrier plate 2.1 in the x and y directions. 1.2.2.1 is another stopper pin present on the carrier plate 2.1 2.1.2 The stop pins abut against the carrier plate 2.1, thus fixing the relative position of the mounting plate 1.2 to the carrier plate 2.1 around the z-direction. If the mounting plate 1.2 is repeatedly mounted on the carrier plate 2.1, the mounting plate 1.2 will occupy the same relative position to the carrier plate 2.1. 2.1.2 Align the pin 1.2.2.1 For example, a contact pressure unit 8 can be temporarily positioned on the carrier plate 2.1 in order to position it relative to the mounting plate 1.2. To fix the relative position, the mounting plate 1.2 is connected to the carrier plate 2.1 via at least one screw connection 2.1.3.

[0039] A second embodiment of a detachable connection is shown in Figures 2a and 2b.

[0040] Here, too, the relative position of the mounting plate 1.2 to the carrier plate 2.1 in the x- and y-directions and around the z-direction is determined by a three-point support, as in the first embodiment. Unlike the first embodiment, the mounting plate 1.2 has two flexure structures 4 formed, for example, by electrolytic corrosion, penetrating the mounting plate 1.2. Two clamping pins 3 are mounted on the carrier plate 2.1, aligned perpendicular to the mounting surface 2.1.1, and firmly connected to the carrier plate 2.1. These pins can be directly or indirectly connected to the carrier plate, for example, by needle carriers 2.3, preferably made of ceramic. For detachable connection of the mounting plate 1.2 to the carrier plate 2.1, each of the two clamping pins 3 is clamped to one of the flexure structures 4. The first of the two clamping pins 3 is clamped around the periphery of the first of the two flexure structures 4 across its lateral surface, thereby fixing the relative position of the mounting plate 1.2 to the carrier plate 2.1 in the x- and y-directions. Advantageously, the first of the two bending structures 4 has the shape of a pipe clamp. In the second of the two bending structures 4, the second of the two clamping pins 3 is clamped tangentially via its lateral surface, thus fixing the relative position of the mounting plate 1.2 to the carrier plate 2.1 around the z-direction. To clamp each bending structure 4 to one of the clamping pins 3, they can be dimensioned so that, without stress, they have an opening smaller than the cross-section of the clamping pin 3, so that they are clamped before or by insertion of the clamping pin 3 and clamp the clamping pin 3.

[0041] Advantageously, the flexure structures 4 are dimensioned so that they have an opening larger than the cross section of the clamping pin 3. Only after the clamping pin 3 has been inserted are the flexure structures 4 tensioned to clamp the clamping pin 3. This can advantageously be done via a set screw 6 as shown.

[0042] Advantageously, to ensure a fixed relative position, the mounting plate 1.2 is connected to the carrier plate 2.1 via at least one screw connection 2.1.3.

[0043] The method according to the invention for assembling the contact module according to the invention is explained in more detail below. As in the prior art, at the end of the adjustment and assembly, the optical interface S opt of arrangement and electrical interface S ele of arrangement The optical module 1 and the electronic module 2 are arranged relative to each other so that they have defined adjustment positions relative to each other in all six degrees of freedom.

[0044] The method according to the invention is used to assemble a contact module comprising an optical module 1 and an electronic module 2. The optical module 1 comprises an optical block 1.1 made of glass, which has an optical interface plane E opt In the optical interface S opt of arrangement The electronic module 2 comprises a carrier plate 2.1, a printed circuit board 2.2 and a needle carrier 2.3 with an arrangement of contact needles 2.3.1 with needle tips. They are connected to the electrical interface plane E ele Electrical interface S ele of arrangement Optical interface S opt of arrangement and electrical interface S ele of arrangement The optical module 1 and the electronic module 2 are arranged relative to each other so that they have a defined adjustment position relative to each other.

[0045] The method can alternatively be used in the first option of the assembly of the contact module described above, in which the optical module 1 is fixedly connected to the electronic module 2 via an adhesive connection, or in the second option of the assembly of the contact module described above, in which the optical module 1 is repeatedly removably connected to the electronic module 2. In the second option, the optical module 1 further comprises a mounting plate 1.2, on which an optical block 1.1 is arranged that is firmly connected thereto by an adhesive connection, and the mounting plate 1.2, and therefore the optical module 1, is removably connected to the electronic module 2.

[0046] For the first option, optical interface S opt of arrangement is the electrical interface ele of arrangement , and the optical block 1.1 is then permanently connected to the carrier plate 2.1 by means of an adhesive connection.

[0047] In the case of the second option, the mounting plate 1.2 of the optical module 1 is first connected to the carrier plate 2.1 of the electronic module 2 via a detachable connection in a repeatably estab- lishable relative position. opt of arrangement is the electrical interface ele of arrangement , and the optical block 1.1 is then permanently connected to the carrier plate 2.1 by means of an adhesive connection.

[0048] The adhesive connection embodiment is essential to the invention.

[0049] To create the adhesive connection according to the invention, at least three parallel through-holes 7 are first made in the carrier plate 2.1 or in the mounting plate 1.2. In the case of just three through-holes 7, these are arranged in a triangular arrangement with respect to one another. The through-holes 7 are used to later accommodate cylindrical pins 5, through which the adhesive connection is made as an indirect adhesive connection.

[0050] Before the adhesive connection between the optical block 1.1 and the carrier plate 2.1 or the mounting plate 1.2 is made, the optical interface S opt of arrangement Electrical interface S ele of arrangement This creates a relative position of the optical block 1.1 to the carrier plate 2.1 or mounting plate 1.2, which is fixed in all six degrees of freedom by adhesive connections.

[0051] At least three cylindrical pins 5 are each guided through one of the through holes 7, after which they each come into contact with the optical block 1.1. An adhesive 9 has previously been applied to the first end face 5.1 of each cylindrical pin 5 facing the optical block 1.1, thereby bonding the cylindrical pins 5 to the optical block 1.1. The cylindrical pins 5 are bonded to the carrier plate 2.1 or to the mounting plate 1.2 during or after passing through the through holes 7.

[0052] In order to bond the cylindrical pins 5 when they are guided through the through holes 7, adhesive 9 is applied beforehand to their circumferential surface facing the second end face 5.2 or to the through holes 7.

[0053] A defined joining surface for the cylindrical pin 5 is advantageously obtained by dimensioning the cylindrical pin 5 and the through-hole 7 so that the second end face 5.1 is located within the through-hole 7. The remaining free volume within the through-hole 7 is filled with adhesive 9.

[0054] When the optical block 1.1 and the carrier plate 2.1 or the mounting plate 1.2 are aligned parallel to one another in the relative position to be adjusted, all cylindrical pins 5 are glued to the same depth in the through-holes 7. This does not change for different relative positions in the x-, y-, or z-direction or around the z-direction. Any tilt around the x- or y-direction is compensated for by placing the cylindrical pins 5 more or less deep in the through-holes arranged in the optical block. Unlike many adhesive connections known from the prior art, the tilt does not have to be compensated for by the amount of adhesive 9. An equal amount of adhesive at all positions where the connection is formed has the advantage that the behavior of the adhesive 9, for example, shrinkage during solidification, is the same everywhere, and therefore the relative position to be adjusted can be fixed with high precision. [Explanation of symbols]

[0055] 1 Optical Module 1.1 Optical block 1.2 Installation board 1.2.1 End face of installation plate 1.2.1.1 Protrusion 1.2.2 Around the installation plate 2.1.2Stopper pin 2 Electronic Module 2.1 Carrier plate 2.1.1 Installation surface 1.2.2.1 Dowel pin 2.2 Printed Circuit Boards 2.3 Needle Carrier 2.3.1. Contact needle 3 clamping pins 4 Bent structure 5 cylindrical pins 5.1 First end face of cylindrical pin 5.2 Second end face of cylindrical pin 6 Set screws 7 Through holes 8 Contact pressure unit 9. Adhesive S opt Optical Interface S ele Electrical Interface E opt Optical interface plane (of contact module) E ele Electrical Interface Plane (of the Contact Module)

Claims

1. An optical interface plane (E) parallel to the xy plane in a Cartesian coordinate system ｏｐｔ ) and an optical interface (S ｏｐｔ ) each having an optical signal line in the form of a waveguide and an integral mirror arranged in front of each waveguide, and an electrical interface plane (E opt ) located below the optical interface plane (E opt ) in the z direction, parallel to the xy plane in the Cartesian coordinate system. ｅｌｅ ) and an electrical interface (S ｅｌｅ ) forming an arrangement of a carrier plate (2.1), a printed circuit board (2.2) arranged on the carrier plate (2.1), and an electronic module (2) including a needle carrier (2.3) arranged on the printed circuit board (2.2) and having an arrangement of contact needles (2.3.1) with needle tips, an optical signal is inputted or outputted from the optical input or the optical output, respectively, and transmitted to or from the optoelectronic chip under test via the optical signal line, respectively; an electrical signal is inputted or outputted from the electrical input or output, respectively, and transmitted to or from the photoelectric chip under test via the contact needles (2.3.1) and electrical signal lines, respectively; The optical interface (S ｏｐｔ ) and the electrical interface (S ｅｌｅ 1. A contact module, in which the optical module (1) and the electronic module (2) are arranged relative to each other so that the arrangement of the optical module (1) and the electronic module (2) has a defined adjustment position relative to each other with respect to all six degrees of freedom of a Cartesian coordinate system, the optical block (1.1) is connected to the carrier plate (2.1) by at least three cylindrical pins (5) extending in the z-direction, or the optical module (1) has a mounting plate (1.2) to which the optical block (1.1) is connected by at least three cylindrical pins (5) extending in the z-direction, 1. A contact module according to claim 1, wherein each of said cylindrical pins (5) contacts the upper surface in the z-direction of said optical block (1.1) with a first end face (5.1) of said cylindrical pin via an adhesive (9), and wherein said carrier plate (2.1) or said mounting plate (1.2) has through holes (7) extending in the z-direction and arranged parallel to one another, in which said cylindrical pins (5) are connected to said carrier plate (2.1) or said mounting plate (1.2) respectively via an adhesive (9).

2. 2. A contact module according to claim 1, characterized in that the second end face (5.2) of the cylindrical pin is located inside one of the through holes (7), and any free volume remaining above it in the through hole (7) is filled with adhesive (9).

3. The mounting plate (1.2) is connected to the carrier plate (2.1) via a releasable connection, which is connected to the electrical interface (S ｅｌｅ ) with respect to the arrangement of the optical interface (S ｏｐｔ 3. A contact module according to claim 1, characterized in that it ensures the repeated creation of an adjustment position of the arrangement of the contacts.

4. On one end face (1.2.1) of the mounting plate there are three projections (1.2.1.1) that define a mounting plane parallel to the xy plane and that protrude in the z direction, and these projections abut in the z direction against the mounting surface (2.1.1) of the carrier plate (2.1) that is parallel to the xy plane, so that the relative position of the mounting plate (1.2) to the carrier plate (2.1) in the z direction, around the x direction and around the y direction of the Cartesian coordinate system, is fixed; and on the periphery of the mounting plate (1.2.2) there are three dowel pins (1.2.2.1) that are aligned parallel to the mounting plane, and the first dowel pin (1.2.2.1) and 4. A contact module according to claim 3, characterized in that two of the dowel pins (1.2.2.1) are aligned at right angles to one another and abut against respective stop pins (2.1.2) provided on the carrier plate (2.1), thereby determining the relative position of the mounting plate (1.2) to the carrier plate (2.1) in the x-direction and in the y-direction, and the third dowel pin (1.2.2.1) abuts against another stop pin (2.1.2) present on the carrier plate (2.1), thereby fixing the relative position of the mounting plate (1.2) to the carrier plate (2.1) around the z-direction.

5. On one end face (1.2.1) of the mounting plate, there are three protrusions (1.2.1.1) that define a mounting plane parallel to the xy plane and protrude in the z direction, and these protrusions abut in the z direction against the mounting surface (2.1.1) of the carrier plate (2.1), and the relative position of the mounting plate (1.2) to the carrier plate (2.1) in the z direction, around the x direction and the y direction of the Cartesian coordinate system, is fixed, and the mounting plate (1.2) has two bending structures (4) that penetrate the mounting plate (1.2) in the z direction, and the first bending structure of the two bending structures (4) 4. A contact module according to claim 3, characterized in that in the first bending structure of the bending structure (4), a first clamping pin (3) attached to the carrier plate (2.1) is clamped circumferentially over its lateral surface, thus fixing the relative position of the mounting plate (1.2) in the x- and y-direction, and in the second bending structure of the bending structure (4), a second clamping pin (3) attached to the carrier plate (2.1) is clamped tangentially via its lateral surface, thus fixing the relative position of the mounting plate (1.2) to the carrier plate (2.1) around the z-direction.

6. Contact module according to claim 5, characterized in that the first bending structure (4) has the shape of a pipe clamp onto which the first clamping pin (3) is clamped in a self-centering manner.

7. The optical interface plane (E) is parallel to the x-y plane in the Cartesian coordinate system. ｏｐｔ ) and an optical interface (S ｏｐｔ ) each having an optical signal line in the form of a waveguide and an integral mirror arranged in front of each waveguide, and an optical module (1.1) made of glass, and an optical interface plane (E ｏｐｔ ) in the z direction. ｅｌｅ ) and an electrical interface (S ｅｌｅ ) forming an arrangement of a carrier plate (2.1), a printed circuit board (2.2) arranged on the carrier plate (2.1), and an electronic module (2) including a needle carrier (2.3) arranged on the printed circuit board (2.2) and having an arrangement of contact needles (2.3.1) with needle tips, an optical signal is inputted or outputted from the optical input or the optical output, respectively, and transmitted to or from the optoelectronic chip under test via the optical signal line, respectively; an electrical signal is inputted or outputted from the electrical input or output, respectively, and transmitted to or from the photoelectric chip under test via the contact needles (2.3.1) and electrical signal lines, respectively; A method for assembling a contact module, in which the optical module (1) and the electronic module (2) are arranged relative to each other so that the optical interface arrangement and the electrical interface arrangement have defined adjustment positions relative to each other, First, the optical interface (S ｏｐｔ ) is arranged in the electrical interface (S ｅｌｅ ) and then said optical block (1.1) is connected to said carrier plate (2.1) by adhesive connection, Alternatively, the installation plate (1.2) is first connected to the carrier plate (2.1) via a detachable connection in a repeatably estab- lishable relative position, and then the optical interface (S ｏｐｔ ) is arranged in the electrical interface (S ｅｌｅ ) and then said optical block (1.1) is connected to said mounting plate (1.2) by adhesive connection, The adhesive connection for both of the above options is created by making at least three parallel through-holes (7) extending in the z-direction in the carrier plate (2.1) or in the mounting plate (1.2), 1. An assembly method characterized in that at least three cylindrical pins (5) extending in the z-direction are each guided through one of the through holes (7) until they come into contact with the optical block (1.1), and adhesive (9) is applied in advance to a first end face (5.1) of each cylindrical pin facing the optical block (1.1), and the cylindrical pins (5) are glued during or after passing through the through holes (7).

Images