Non-contact information media

Abstract

To provide a non-contact information medium in which capacitance of a capacitor or inductance of an inductor can be easily adjusted.SOLUTION: A non-contact information medium comprises: a board having a first surface and a second surface; a coil antenna arranged on the first surface or the second surface; a capacitor which includes a first electrode arranged on the first surface and a second electrode arranged on the second surface and facing the first surface and is electrically connected to the coil antenna; and a first cover member which has a first concave part covering the first electrode and forms a first cavity between the first concave part and the first electrode.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] An embodiment of the present invention relates to a contactless information medium. [Background technology]

[0002] A contactless information medium communication system allows contactless communication between a contactless information medium and a reader / writer, is highly convenient, and demand for the system is increasing.

[0003] In a contactless information medium communication system, a contactless information medium and a reader / writer communicate wirelessly using each other's antennas to transmit and receive information to each other. The contactless information medium has a coil antenna that receives radio waves, an IC chip that processes the information contained in the radio waves, a capacitor, and an inductor, and operates using power generated by electromagnetic induction using the radio waves received from the reader / writer. For example, by adjusting the capacitance of the capacitor, the contactless information medium can efficiently receive radio waves (see Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2007-233703 Summary of the Invention [Problem to be solved by the invention]

[0005] The method of adjusting the capacitance of a capacitor to efficiently receive radio waves involves, for example, cutting the capacitor (see Patent Document 1), selecting and mounting the capacitor, etc., and the adjustment is not easy. Furthermore, there is a risk that the non-contact information medium may be damaged due to the cutting, selection and mounting of the capacitor.

[0006] An object of an embodiment of the present invention is to provide a contactless information medium in which the capacitance of a capacitor or the inductance of an inductor can be easily adjusted, and a contactless information medium communication system having the contactless information medium. Another object of an embodiment of the present invention is to provide a contactless information medium in which damage can be suppressed when adjusting the capacitance of a capacitor or the inductance of an inductor, and a contactless information medium communication system having the contactless information medium. [Means for solving the problem]

[0007] A non-contact information medium according to one embodiment of the present invention comprises a substrate having a first surface and a second surface, a coil antenna arranged on the first surface or the second surface, a capacitor including a first electrode arranged on the first surface and a second electrode arranged on the second surface facing the first surface, and electrically connected to the coil antenna, and a first cover member having a first recess covering the first electrode and forming a first gap between the first recess and the first electrode.

[0008] The contactless information medium may have a protection member that covers the first cover member, and the protection member may be a member different from the first cover member.

[0009] The non-contact information medium may include an inductor disposed on the first surface and electrically connected to the coil antenna and the first electrode, and a second cover member having a second recess covering the inductor and forming a second gap between the second recess and the inductor, and the protective member may be in contact with the substrate between the first cover member and the second cover member.

[0010] A material having a different dielectric constant from that of the first upper cover member may be disposed in the first gap.

[0011] A material having a different magnetic permeability than the second upper cover member may be disposed in the second gap.

[0012] A first distance between the first electrode and the first cover member may be different from a second distance between the inductor and the second cover member.

[0013] The coil antenna may have one turn.

[0014] The antenna may further include an IC chip disposed on the first surface and electrically connected to the coil antenna, the capacitor, and the inductor.

[0015] The non-contact information medium may have an inductor arranged on the first surface and electrically connected to the first electrode and the coil antenna, and the first cover member may have a second recess covering the inductor, forming a second gap between the second recess and the inductor.

[0016] The non-contact information medium may have a third recess that covers the second electrode, and may have a second cover member that forms a third gap between the third recess and the second electrode.

[0017] A material having a different dielectric constant from that of the second cover member may be disposed in the third gap.

[0018] A third distance between the third recess and the second electrode may be different from a first distance between the first electrode and the first cover member or a second distance between the inductor and the first cover member.

[0019] The first cover member may include an assembly portion at a peripheral edge of the first cover member, the assembly portion being in contact with a peripheral edge of the second cover member.

[0020] The non-contact information medium may have a metal ring with a slit, the first cover member may include an assembly portion at the peripheral portion of the first cover member, the assembly portion may contact the peripheral portion of the second cover member, and the metal ring may contact the peripheral portion of the first cover member and the peripheral portion of the second cover member.

[0021] In a plan view, the slit may be located on an extension line connecting a position where the IC chip is disposed and a position where the capacitor is disposed, and on the opposite side of the IC chip from the position where the capacitor is disposed.

[0022] The contactless information medium may have a protective member disposed to cover the first cover member, the second cover member, and the metal ring.

[0023] The first cover member may have a fourth recess, cover the IC chip with the fourth recess, and be disposed so as to include a fourth gap between the fourth recess and the IC chip. [Effects of the Invention]

[0024] According to one embodiment of the present invention, it is possible to provide a contactless information medium in which the capacitance of a capacitor or the inductance of an inductor can be easily adjusted, and a contactless information medium communication system having the contactless information medium. Also, according to one embodiment of the present invention, it is possible to provide a contactless information medium in which damage can be suppressed when adjusting the capacitance of a capacitor or the inductance of an inductor, and a contactless information medium communication system having the contactless information medium. [Brief explanation of the drawings]

[0025] [Figure 1] 1 is a plan view showing an outline of a non-contact information medium according to a first embodiment. [Figure 2]2(A) is an end cross-sectional view of the cross-sectional structure along the A1-A2 line shown in FIG. 1, FIG. 2(B) is a plan view showing the first recess shown in FIG. 1, FIG. 2(C) is a plan view showing the third recess shown in FIG. 1, FIG. 2(D) is a plan view showing the second recess shown in FIG. 1, FIG. 2(E) is an enlarged view of the first recess and the third recess in FIG. 2(A), and FIG. 2(F) is an enlarged view of the second recess in FIG. 2(A). [Figure 3] 1 is a block diagram showing the configuration of an IC chip of a contactless information medium according to a first embodiment. [Figure 4] 4(A) and 4(B) are circuit diagrams of the contactless information medium according to the first embodiment. [Figure 5] 1 is a plan view showing an outline of a non-contact information medium according to a first embodiment. [Figure 6] 6 is a cross-sectional view of an end portion of a cross-sectional structure taken along line B1-B2 shown in FIG. 5. [Figure 7] 1 is a plan view showing an outline of a non-contact information medium according to a first embodiment. [Figure 8] 8(A) is an end cross-sectional view showing a cross-sectional structure for explaining a manufacturing method for arranging a cover member, and FIG. 8(B) is an end cross-sectional view showing a cross-sectional structure along line C1-C2 shown in FIG. [Figure 9] 4 is a flowchart showing a method for manufacturing a non-contact information medium according to the first embodiment. [Figure 10] 1 is a block diagram showing a configuration of a contactless information medium communication system according to a first embodiment. [Figure 11] FIG. 10 is a plan view showing an outline of a non-contact information medium according to a second embodiment. [Figure 12] 12(A) is an end cross-sectional view of the cross-sectional structure along line D1-D2 shown in FIG. 11, FIG. 12(B) is a plan view showing the fourth recess shown in FIG. 11, and FIG. 12(C) is an enlarged view of the fourth recess shown in FIG. 12(A). [Figure 13] FIG. 10 is a plan view showing an outline of a non-contact information medium according to a second embodiment. [Figure 14] 14 is a cross-sectional view of an end portion of the cross-sectional structure taken along line E1-E2 shown in FIG. 13. [Figure 15] FIG. 10 is a plan view showing an outline of a non-contact information medium according to a second embodiment. [Figure 16] 16(A) is an end cross-sectional view showing a cross-sectional structure for explaining a manufacturing method for arranging a cover member, and FIG. 16(B) is an end cross-sectional view of a cross-sectional structure taken along line F1-F2 shown in FIG. 15. [Figure 17] FIG. 10 is a plan view showing an outline of a non-contact information medium according to a second embodiment. [Figure 18] 18(A) is an end cross-sectional view showing the cross-sectional structure shown in FIG. 14 and the cross-sectional structure of the metal ring, and FIG. 18(B) is an end cross-sectional view of the cross-sectional structure along line G1-G2 shown in FIG. 17. [Figure 19] 10 is a flowchart showing a method for manufacturing a non-contact information medium according to a second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0026] Hereinafter, various embodiments of the present invention will be described with reference to the drawings. However, the present invention can be embodied in various forms without departing from the spirit of the present invention, and the present invention should not be construed as being limited to the description of the embodiments exemplified below.

[0027] In order to clarify the description, the drawings may show the width, thickness, shape, etc. of each part schematically compared to the actual embodiment, but these are merely examples and do not limit the interpretation of the present invention. Furthermore, in this specification and each drawing, elements having the same functions as those explained with reference to the previous drawings may be assigned the same reference numerals, and duplicate explanations may be omitted.

[0028] In this specification and drawings, when multiple identical or similar components are collectively referred to, they may be referred to by the same reference numeral or the same reference numeral with an uppercase alphabet. When multiple parts of a single component are to be distinguished from one another, the same reference numeral may be used, and a hyphen and a natural number may also be used.

[0029] In this specification, the letters "first," "second," or "third" attached to each component are convenient labels used to distinguish each component, and have no other meaning unless otherwise specified.

[0030] In this specification, the surface of the substrate included in the non-contact information medium on which the IC chip is provided will be referred to as the "top surface," and the surface of the substrate opposite the top surface will be referred to as the "bottom surface." Furthermore, the surfaces that intersect with the top and bottom surfaces will be referred to as "side surfaces."

[0031] In this specification, "close to" includes not only a case where multiple non-contact information media are close to each other with a gap between them, but also a case where multiple non-contact information media are in direct contact with each other. Also, "close to" includes a state where multiple non-contact information media are overlapping each other.

[0032] 1. First embodiment 1-1. Configuration of the non-contact information medium 10 FIG. 1 is a plan view showing an outline of a non-contact information medium 10, and FIG. 2(A) is an end cross-sectional view of the cross-sectional structure of the non-contact information medium 10 taken along line A1-A2 shown in FIG. 1. The configuration of the non-contact information medium 10 will be described with reference to FIG. 1 or FIG. 2(A). As shown in FIG. 1 or FIG. 2(A), the non-contact information medium 10 includes a substrate 20 and a protective member 90. The substrate 20 is located inside the non-contact information medium 10 and is covered by the protective member 90.

[0033] The protective member 90 forms the external shape of the non-contact information medium 10. The protective member 90 also protects the substrate 20 from external impacts. In the non-contact information medium 10, it is preferable that the substrate 20 is completely covered by the protective member 90. The protective member 90 is a member made of resin. The resin is, for example, a thermosetting resin or a thermoplastic resin. Specifically, the resin is acrylonitrile butadiene styrene, polycarbonate, polyphthalamide, polyoxymethylene, polymethyl methacrylate, polyethylene, polypropylene, polybutylene terephthalate, or polyvinyl chloride.

[0034] In a plan view, the shape of the non-contact information medium 10 is a circular flat plate, but the shape of the non-contact information medium 10 is not limited to the shape shown in Fig. 1. The shape of the non-contact information medium 10 may be, for example, an elliptical flat plate or a polygonal flat plate.

[0035] The contactless information medium 10 is, for example, a chip (coin or token) used in a casino or an amusement facility, but the use of the contactless information medium 10 is not limited to the example shown here. The contactless information medium 10 may also be used, for example, as a tag for managing goods.

[0036] As shown in FIG. 1 , the substrate 20 has a top surface 22 and a bottom surface 24. The substrate 20 has a coil antenna 30, an IC chip 40, a first capacitor 50, a first inductor 60, a first cover member 70, a second cover member 80, and connection portions 102 and 104 arranged thereon. The substrate 20 is a base material that supports the coil antenna 30, the IC chip 40, the first capacitor 50, the first inductor 60, the first cover member 70, the second cover member 80, and the connection portions 102 and 104. The substrate 20 may be, for example, a paper phenolic substrate, a paper epoxy substrate, a glass epoxy substrate, a composite substrate epoxy substrate, a glass composite substrate, a glass polyimide substrate, a BT substrate, a Teflon (registered trademark) substrate, or a PPO substrate. The top surface 22 may be referred to as the first surface, and the bottom surface 24 may be referred to as the second surface. The top surface 22 may also be referred to as the second surface, and the bottom surface 24 may also be referred to as the first surface.

[0037] The coil antenna 30 is disposed on the top surface 22 of the substrate 20 (see FIG. 2(A)), and is also disposed outside the IC chip 40. One end of the coil antenna 30 is electrically connected to the connecting portion 102, and the other end of the coil antenna 30 is electrically connected to the first inductor 60. The coil antenna 30 transmits and receives radio waves via wireless communication with an antenna (see FIG. 10) included in a reader / writer 202 (see FIG. 10). The radio waves include, for example, electrical signals, and the electrical signals include information. The information includes, for example, a request from the reader / writer 202, identification information unique to the contactless information medium 10, etc. The coil antenna 30 may be disposed on the bottom surface 24 of the substrate 20. A through-hole (not shown) is formed in the substrate 20, penetrating the substrate 20 and connecting the top surface 22 and the bottom surface 24. A conductive film (not shown) is formed in the through-hole. In the first embodiment, the coil antenna 30 arranged on the upper surface 22 is electrically connected to a component arranged on the bottom surface 24, and the coil antenna 30 arranged on the bottom surface 24 is electrically connected to a component arranged on the upper surface 22, using a conductive film formed in the through hole.

[0038] In the first embodiment, the number of turns of the coil of the coil antenna 30 is preferably 1 to 3, and particularly preferably 2. As an example, in the non-contact information medium 10 shown in FIG. 1, the number of turns of the coil of the coil antenna 30 is 1. Compared to conventional coil antennas, the number of turns of the coil of the coil antenna 30 is significantly less. Furthermore, the coil antenna 30 is formed to have a predetermined shape on the substrate 20, for example, by using printing, coating, or etching. The material from which the coil antenna 30 is formed is a conductive material. The conductive material is, for example, copper, aluminum, etc.

[0039] Although details will be described later, the IC chip 40 is disposed on the upper surface 22 of the substrate 20 (see FIG. 2(A)), and is electrically connected in parallel to the first capacitor 50 between the connection portion 102 and the connection portion 104. As with the coil antenna 30, the IC chip 40 may be disposed on the bottom surface 24 of the substrate 20, and the IC chip 40 disposed on the upper surface 22 is electrically connected to the members disposed on the bottom surface 24, and the IC chip 40 disposed on the bottom surface 24 is electrically connected to the members disposed on the upper surface 22, using a conductive film formed in a through-hole connecting the upper surface 22 and the bottom surface 24.

[0040] The first capacitor 50 is configured using a first electrode 56A disposed on the top surface 22 of the substrate 20, a second electrode 56B disposed on the bottom surface 24 of the substrate 20, and the substrate 20 sandwiched between the first electrode 56A and the second electrode 56B (see FIG. 2(A)). In the non-contact information medium 10, for example, the first electrode 56A is formed on the same layer as the coil antenna 30 using the same material and the same method, and the second electrode 56B is formed from the same material and using the same method in a different process so as to face the first electrode 56A. As with the coil antenna 30, the first electrode 56A may be arranged on the bottom surface 24 of the substrate 20 and the second electrode 56B may be arranged on the top surface 22 of the substrate 20, and using a conductive film formed in the through hole connecting the top surface 22 and the bottom surface 24, the first electrode 56A arranged on the top surface 22 is electrically connected to a member arranged on the bottom surface 24 and the second electrode 56B arranged on the bottom surface 24 is electrically connected to a member arranged on the top surface 22, and the first electrode 56A arranged on the bottom surface 24 is electrically connected to a member arranged on the top surface 22 and the second electrode 56B arranged on the top surface 22 is electrically connected to a member arranged on the bottom surface 24.

[0041] The first electrode 56A is electrically connected to, for example, the connection portion 102. The substrate 20 has, for example, a through-hole (not shown) formed therein, which penetrates the substrate 20 and connects the top surface 22 and the bottom surface 24. The second electrode 56B is electrically connected to the connection portion 104, for example, using a conductive film formed in the through-hole connecting the top surface 22 and the bottom surface 24. Note that the first electrode 56A and the second electrode 56B may be interchanged.

[0042] The first inductor 60 is disposed on the upper surface 22 of the substrate 20 (see FIG. 2(A)), and is electrically connected in series with the coil antenna 30. One end of the first inductor 60 is electrically connected to the other end of the coil antenna 30, and the other end of the first inductor 60 is electrically connected to the connecting portion 104. The first inductor 60 is in a form (chip inductor) that can be mounted on the substrate 20. Note that, similar to the coil antenna 30, the first inductor 60 may be disposed on the bottom surface 24 of the substrate 20, and the first inductor 60 disposed on the upper surface 22 is electrically connected to the components disposed on the bottom surface 24, and the first inductor 60 disposed on the bottom surface 24 is electrically connected to the components disposed on the upper surface 22, using a conductive film formed in a through-hole connecting the upper surface 22 and the bottom surface 24.

[0043] The connecting portions 102 and 104 are formed in the same layer as the coil antenna 30 and the first electrode 56A, using the same material and method.

[0044] The first cover member 70 includes a first upper cover member 72 (see FIG. 2(A)) disposed on the top surface 22, and a first lower cover member 74 (see FIG. 2(A)) disposed on the bottom surface 24. A first recess 59 (see FIG. 2(A)) of the first upper cover member 72 and a third recess 58 (see FIG. 2(A)) of the first lower cover member 74 sandwich the first capacitor 50. As will be described in detail later, the first cover member 70 has a function of adjusting the capacitance of the non-contact information medium 10, and constitutes a second capacitor 52 (see FIG. 4(A)) whose capacitance is adjusted for the non-contact information medium 10. The capacitance of the first capacitor 50 is capacitance Ca, and the capacitance of the second capacitor 52 is capacitance Cb. The first cover member 70 also has a function of protecting the first capacitor 50 from the outside.

[0045] The first upper cover member 72 is, for example, quadrilateral in shape, having a first recess 59 (see FIG. 2(A)) in the center, and having recesses smaller than the first recess 59 near each of the four corners. The first lower cover member 74 is, for example, quadrilateral in shape, having a third recess (see FIG. 2(A)) in the center, and having protrusions near each of the four corners. The protrusions at the four corners of the first lower cover member 74 correspond one-to-one to the recesses at the four corners of the first upper cover member 72. The protrusions at the four corners of the first lower cover member 74 are inserted into first through-holes 54 (see FIG. 2(A)) formed in the substrate 20, and are also inserted into the corresponding recesses of the first upper cover member 72. The first upper cover member 72 may be disposed on the bottom surface 24, and the first lower cover member 74 may be disposed on the top surface 22. That is, the first upper cover member 72 and the first lower cover member 74 may be interchangeable.

[0046] The second cover member 80 includes a second upper cover member 82 (see FIG. 2(A)) disposed on the top surface 22, and a second lower cover member 84 (see FIG. 2(A)) disposed on the bottom surface 24. The second recess 69 (see FIG. 2(A)) of the second upper cover member 82 and the second lower cover member 84 sandwich the first inductor 60. As will be described in detail later, the second cover member 80 has a function of adjusting the inductance of the non-contact information medium 10, and constitutes a second inductor 62 (see FIG. 4(A)) whose inductance of the non-contact information medium 10 is adjusted. The inductance of the first inductor 60 is inductance La, and the inductance of the second inductor 62 is inductance Lb. The second cover member 80 also has a function of protecting the first inductor 60 from the outside.

[0047] The second upper cover member 82 and the second lower cover member 84 have the same shape as the first upper cover member 72 and the first lower cover member 74. The second upper cover member 82 is quadrilateral in shape and has a second recess 69 (see FIG. 2(A)) in the center and recesses near each of the four corners, while the second lower cover member 84 is quadrilateral in shape and has protrusions near each of the four corners. The protrusions at the four corners of the second lower cover member 84 correspond one-to-one to the recesses at the four corners of the second upper cover member 82. The protrusions at the four corners of the second lower cover member 84 are inserted into second through-holes 64 (see FIG. 2(A)) formed in the substrate 20 and are also inserted into the corresponding recesses of the second upper cover member 82.

[0048] The shapes of the first upper cover member 72, the first lower cover member 74, the second upper cover member 82, and the second lower cover member 84 are formed by injection molding using the same material as the protective member 90, for example.

[0049] The first upper cover member 72, the first lower cover member 74, the second upper cover member 82, and the second lower cover member 84 are not limited to the configurations described in the first embodiment. The first cover member 70 (the first upper cover member 72 and the first lower cover member 74) only needs to be configured to have the function of adjusting the capacitance Cb of the second capacitor 52 and the function of protecting the first capacitor 50 from the outside. For example, the first upper cover member 72 and the first lower cover member 74 may be circular and may have at least two or more recessed or protruding portions inside the circular periphery, and the first upper cover member 72 and the first lower cover member 74 may be configured to be attachable to each other using the recessed or protruding portions. Furthermore, the second upper cover member 82 and the second lower cover member 84 may be configured to have the function of adjusting the inductance Lb of the second inductor 62 and the function of protecting the first inductor 60 from the outside, and may be configured to be able to be assembled to each other using a configuration similar to that of the first upper cover member 72 and the first lower cover member 74.

[0050] 1-2.Configuration of IC chip 40 Fig. 3 is a block diagram showing the configuration of the IC chip 40 of the contactless information medium 10. The configuration of the IC chip 40 will be described with reference to Fig. 3. In the configuration of the IC chip 40, the description of the same or similar configuration as in Fig. 1 and Fig. 2(A) may be omitted.

[0051] As shown in FIG. 3, the IC chip 40 includes a control unit 42, a communication unit 44, and a storage unit 46. The communication unit 44 processes radio waves received from the reader / writer 202 (see FIG. 10) via the coil antenna 30. The control unit 42 controls the operations of the communication unit 44 and the storage unit 46. For example, the control unit 42 receives information contained in the processed electrical signal from the communication unit 44 and extracts the information contained in the processed electrical signal from the storage unit 46. The control unit 42 also generates an electrical signal corresponding to the extracted information and transmits the generated electrical signal to the communication unit 44. The communication unit 44 then transmits the generated electrical signal via radio waves to the reader / writer 202 via the coil antenna 30. The storage unit 46 stores various types of information. As described above, the various types of information include, for example, a request from the reader / writer 202 and identification information unique to the contactless information medium 10 for identifying the contactless information medium 10.

[0052] Although details will be described later, in the contactless information medium 10, a resonant circuit 100 (see FIG. 4(A)) is configured using a second capacitor 52 and a second inductor 62. The resonant circuit 100 generates power through electromagnetic induction using radio waves received from the reader / writer 202. When the power generated using the resonant circuit 100 is equal to or greater than a threshold voltage value (operable voltage value), the IC chip 40 starts operating.

[0053] 1-3. Electrical characteristics of the non-contact information medium 10 FIG. 2(B) is a plan view showing the first recess 59 shown in FIG. 1, FIG. 2(C) is a plan view showing the third recess 58 shown in FIG. 1, FIG. 2(D) is a plan view showing the second recess 69 shown in FIG. 1, FIG. 2(E) is an enlarged view of the first recess 59 and the third recess 58 shown in FIG. 2(A), and FIG. 2(F) is an enlarged view of the second recess 69 shown in FIG. 2(A). FIG. 4(A) is an equivalent circuit diagram of the non-contact information medium 10 after adjusting the capacitance and inductance, and FIG. 4(B) is an equivalent circuit diagram of the non-contact information medium 12 before adjusting the capacitance and inductance. The non-contact information medium 10 before adjusting the capacitance and inductance is referred to as the non-contact information medium 12. The electrical characteristics of the non-contact information medium 10 will be described with reference to FIGS. 2(A) to 2(F), 4(A), and 4(B). Regarding the electrical characteristics of the non-contact information medium 10, a description of the same or similar configurations as those in FIGS. 1 and 3 may be omitted.

[0054] 4(A), in the contactless information medium 10, the second inductor 62 is electrically connected in series between the connecting portion 104 and the connecting portion 102, and the IC chip 40 and the second capacitor 52 are electrically connected in parallel between the connecting portion 104 and the connecting portion 102, and the second capacitor 52 and the second inductor 62 form a closed circuit. The closed circuit formed using the second inductor 62 and the second capacitor 52 is a so-called resonant circuit 100. The second capacitor 52 includes the first capacitor 50, and the second inductor 62 includes the coil antenna 30 and the first inductor 60.

[0055] 4(B), in the non-contact information medium 12, the coil antenna 30 and the first inductor 60 are electrically connected in series between the connecting portion 104 and the connecting portion 102, and the IC chip 40 and the second capacitor 52 are electrically connected in parallel between the connecting portion 104 and the connecting portion 102, and the coil antenna 30, the first capacitor 50, and the first inductor 60 form a closed circuit. The closed circuit formed using the coil antenna 30, the first capacitor 50, and the first inductor 60 is a resonant circuit 100A.

[0056] The second capacitor 52 will be described using Figures 2(A), 2(B), 2(C), 2(E), and 4(A). As described above, the second capacitor 52 is a capacitor in which the capacitance of the non-contact information medium 10 is adjusted. The second capacitor 52 is configured using at least a first cover member 70 (a first upper cover member 72 and a first lower cover member 74) and the first capacitor 50. The first capacitor 50 is sandwiched and covered by a first recess 59 and a third recess 58. A portion of the first upper cover member 72 that faces the top surface 22 is in contact with the top surface 22, except for at least the small recesses at the four corners and the first recess 59. A portion of the first lower cover member 74 that faces the bottom surface 24 is in contact with the bottom surface 24, except for at least the protrusions at the four corners and the third recess 58.

[0057] In the first embodiment, the space surrounded by the first recess 59, the first electrode 56A, and the upper surface 22 except where the first electrode 56A and the upper surface 22 contact forms a first gap 51, and the distance between the first recess 59 and the upper surface of the first electrode 56A is referred to as a first distance H1. The first distance H1 may be, for example, the distance (length) between the upper surface of the first electrode 56A and the first recess 59 at their closest points, or may be the distance (length) extending vertically from the substrate 20 at their closest points. For example, if the thickness of the first electrode 56A is thinner than the substrate 20 and the first distance H1, the size of the first gap 51 can be approximated using the first distance H1 and the size (width W1 × width W2) of the first recess 59 in a top view.

[0058] 2(E), the first gap 51 may contain air, and a first member 55 may be disposed therein. The first member 55 may be formed using a material having the same dielectric constant as the first upper cover member 72, or may be formed using a material having a dielectric constant different from that of the first upper cover member 72.

[0059] As with the first void 51, in the first embodiment, the space surrounded by the third recess 58, the second electrode 56B, and the bottom surface 24 except for the portion where the second electrode 56B and the bottom surface 24 contact forms the third void 53, and the distance between the third recess 58 and the upper surface of the second electrode 56B is referred to as the third distance H3. The third distance H3 may be, for example, the distance (length) between the upper surface of the second electrode 56B and the third recess 58 at the closest point, or may be the distance (length) between the top surface of the second electrode 56B and the third recess 58 at the closest point extending vertically from the substrate 20. For example, if the thickness of the second electrode 56B is thinner than the substrate 20 and the third distance H3, the size of the third void 53 can be approximated using the third distance H3 and the size of the third recess 58 in a top view (width W3 × width W4). In the first embodiment, the widths W1, W2, W3, and W4 are the same or approximately the same, but the widths W1, W2, W3, and W4 do not have to be the same or approximately the same. Also, the first interval H1 may be the same or approximately the same as the third interval H3, or may be different.

[0060] 2(E), the third gap 53 may contain air, and a third member 57 may be disposed therein. The third member 57 may be formed using a material having the same dielectric constant as the first lower cover member 74, or may be formed using a material having a dielectric constant different from that of the first lower cover member 74.

[0061] As described above, for example, the capacitance of the first capacitor 50 is capacitance Ca, and the capacitance of the second capacitor 52 is capacitance Cb. The capacitance Cb includes the capacitance Ca. The capacitance Cb can be adjusted by changing the size of the first void 51 and the size of the third void 53. Furthermore, the capacitance Cb can be adjusted by changing the material disposed in the first void 51 and the material disposed in the third void 53.

[0062] Next, the second inductor 62 will be described with reference to FIG. 2(D) and FIG. 4(A). As described above, the second inductor 62 is an inductor whose inductance is adjusted for the non-contact information medium 10. The second inductor 62 is configured using at least the coil antenna 30, the second cover member 80 (the second upper cover member 82 and the second lower cover member 84), and the first inductor 60. The first inductor 60 is sandwiched and covered by the second recess 69 and the second lower cover member 84. A portion of the second upper cover member 82 that faces the upper surface 22, excluding at least the second recess 69, is in contact with the upper surface 22, and the second lower cover member 84 is in contact with the bottom surface 24.

[0063] In the first embodiment, the space surrounded by the second recess 69 and the upper surface 22 other than where the first inductor 60 and the upper surface 22 contact forms a second void 61, and the distance between the second recess 69 and the upper surface of the first inductor 60 is referred to as a second distance H2. The second distance H2 may be, for example, the distance (length) between the upper surface of the first inductor 60 and the second recess 69 at the closest point, or the distance (length) extending vertically from the substrate 20 at the closest point. For example, if the thickness of the first inductor 60 is thinner than the substrate 20 and the second distance H2, the size of the second void 61 can be approximated using the second distance H2 and the size of the second recess 69 in a top view (width W5 × width W6). Note that, although the widths W5 and W6 are the same or approximately the same in the first embodiment, the widths W5 and W6 do not have to be the same or approximately the same. Furthermore, the second interval H1 may be the same as or approximately the same as the first interval H1 or the third interval H3, or may be different.

[0064] 2(F), the second gap 61 may contain air, and a second member 63 may be disposed therein. The second member 63 may be formed using a material having the same magnetic permeability as the second upper cover member 82, or may be formed using a material having a different magnetic permeability from the second upper cover member 82.

[0065] In the first embodiment, as an example, the first recess 59, the second recess 69, and the third recess 58 have rectangular concave shapes facing the upper surface 22 of the substrate 20. The shapes of the first recess 59, the second recess 69, and the third recess 58 are not limited to the shapes shown here. The shapes of the first recess 59, the second recess 69, and the third recess 58 may be, for example, concave shapes that are curved surfaces facing the upper surface 22 of the substrate 20.

[0066] As described above, for example, the inductance of the first inductor 60 is inductance La, and the inductance of the second inductor 62 is inductance Lb. The inductance of the coil antenna 30 is inductance Lc. The inductance Lb includes the inductance Lc and the inductance La. The second inductance Lb can be adjusted, for example, by changing the size of the second air gap 61. The second inductance Lb can be adjusted, for example, by changing the material disposed in the second air gap 61.

[0067] The resonant frequency fr of the resonant circuit 100 configured using the second capacitor 52 and the second inductor 62 is expressed by the following equation (1) using the capacitance Cb of the second capacitor 52 and the inductance Lb of the second inductor 62.

[0068]

number

[0069] When the resonant frequency fr of the resonant circuit 100 matches the frequency (predetermined frequency) fc of the radio waves transmitted from the reader / writer 202 (Figure 10), the resonant circuit 100 can generate the largest power through electromagnetic induction using the radio waves of frequency fc received from the reader / writer 202.

[0070] In the first embodiment, the resonant frequency fra of the non-contact information medium 10 before adjusting the capacitance and inductance thereof can be determined using the non-contact information medium 12. That is, the resonant frequency fra of the non-contact information medium 12 can be determined using the non-contact information medium 12 in a state before the first cover member 70 and the second cover member 80 are placed on the substrate 20. The non-contact information medium 12 includes, for example, a resonant circuit 100A as shown in FIG. 4(B). The resonant frequency fra is expressed by the following equation (2) using the capacitance Ca of the first capacitor 50, the inductance La of the first inductor 60, and the inductance Lc of the coil antenna 30.

[0071]

number

[0072] In the first embodiment, the capacitance Cb of the second capacitor 52 or the inductance Lb of the second inductor 62 can be adjusted so that the resonant frequency fr matches or approximately matches the frequency fc of the radio waves transmitted from the reader / writer 202.

[0073] For example, in the first cover member 70, at least one of the first interval H1, the width W1, the width W2, the third interval H3, the width W3, and the width W4 is adjusted. This makes it possible to adjust the capacitance Cb of the second capacitor 52 so that it matches or approximately matches the frequency fc of the radio waves transmitted from the reader / writer 202. In the non-contact information medium 10, by using the first cover member 70 and the second cover member 80, it is possible to adjust the capacitance Cb of the second capacitor 52 so as to suppress variations in the characteristics or performance of the first capacitor 50.

[0074] Furthermore, in the second cover member 80, at least one of the second gap H2, the width W5, and the width W6 may be adjusted to adjust the inductance Lb of the second inductor 62 so that it matches or approximately matches the frequency fc of the radio waves transmitted from the reader / writer 202. In the non-contact information medium 10, by using the second cover member 80, the inductance Lb of the second inductor 62 can be adjusted so as to suppress variations in the characteristics or performance of the first inductor 60 or the coil antenna 30. Note that in the non-contact information medium 10, both the capacitance Cb and the inductance Lb may be adjusted.

[0075] For example, to adjust the resonance frequency fr, a plurality of first cover members 70 adjusted to different capacitances Cb and a plurality of second cover members 80 adjusted to different inductances Lb are prepared in advance. One first cover member 70 and one second cover member 80 are selected from the plurality of first cover members 70 and the plurality of second cover members 80 so that the resonance frequency fr matches or nearly matches the frequency fc of the radio waves transmitted from the reader / writer 202. In the first embodiment, by mounting the selected first cover member 70 and second cover member 80 on the non-contact information medium 12, the resonance frequency fr matches or nearly matches the frequency fc of the radio waves transmitted from the reader / writer 202, and an optimal non-contact information medium 10 can be formed.

[0076] As described above, the first inductor 60 is a chip inductor. Therefore, the size of the first inductor 60 is sufficiently smaller than that of the coil antenna 30, and the first inductor 60 can also be called a lumped-constant inductor that can be made into a lumped-constant inductor. In the non-contact information medium 10, the number of turns of the coil of the coil antenna 30 is smaller than that of conventional non-contact information media, and the inductance Lc of the coil antenna 30 is smaller than the inductance La of the first inductor 60. In the non-contact information medium 10, the inductance La of the first inductor 60 is increased to increase the inductance of the resonant circuit 100, and the inductance Lb of the second inductor 62 can be adjusted using the second cover member 80.

[0077] Furthermore, in the non-contact information medium 10, even if the inductance Lc of the coil antenna 30 is small during the design stage, the inductance Lb of the first inductor 60, which is a chip inductor, can be increased after the design stage. Since the resonant frequency fr can be adjusted by adjusting the inductance Lb of the first inductor 60 after the design stage, there is no need to increase the capacitance Ca of the first capacitor 50 more than necessary during the design stage. Therefore, the capacitance Ca of the first capacitor 50 can be made the same or approximately the same as the conventional capacitance. Furthermore, in the non-contact information medium 10, the capacitance Cb of the second capacitor 52 can be adjusted independently using the first cover member 70, and the inductance Lb of the second inductor 62 can be adjusted independently using the second cover member 80.

[0078] Therefore, the non-contact information medium 10 can be miniaturized without increasing the size of the first capacitor 50, and the resonant frequency fr can be adjusted. Furthermore, since the non-contact information medium 10 does not need to increase the capacitance Ca of the first capacitor 50, there is no need to charge or discharge a large capacitance. Therefore, the non-contact information medium 10 reduces the load of charging and discharging the capacitance Ca of the first capacitor 50, and can make the resonant frequency fr closely match or approximately match the frequency fc of the radio waves transmitted from the reader / writer 202. This allows the large power generated by the resonant circuit 100 to be sufficiently supplied to the IC chip 40. As a result, the non-contact information medium 10 can prevent malfunction of the IC chip 40 due to insufficient power. Therefore, the non-contact information medium 10 can perform stable wireless communication with the reader / writer 202.

[0079] 1-4. Manufacturing method of non-contact information medium 10 FIG. 5 is a plan view showing an outline of the non-contact information medium 10. FIG. 6 is an end cross-sectional view of the cross-sectional structure of the non-contact information medium 10 shown in FIG. 5, taken along line B1-B2. FIG. 7 is a plan view showing an outline of the non-contact information medium 10, for explaining a manufacturing method of the non-contact information medium 10. FIG. 8(A) is an end cross-sectional view showing the cross-sectional structure, for explaining a manufacturing method for arranging the first upper cover member 72, the first lower cover member 74, the second upper cover member 82, and the second lower cover member 84, and FIG. 8(B) is an end cross-sectional view showing the cross-sectional structure of the non-contact information medium 10 shown in FIG. 7, taken along line C1-C2. FIG. 9 is a flowchart showing a manufacturing method of the non-contact information medium 10.

[0080] A method for manufacturing the non-contact information medium 10 will be described with reference to Fig. 1 and Fig. 5 to Fig. 9. In the method for manufacturing the non-contact information medium 10, explanations of configurations that are the same as or similar to those in Figs. 2(A) to 2(D), 3, 4(A) and 4(B) may be omitted. The non-contact information medium 10 is manufactured by a manufacturing method of steps S30 to S34 shown in Fig. 9. The method for manufacturing the non-contact information medium 10 is not limited to the manufacturing method shown in Fig. 9, and may include other steps.

[0081] First, step S30 shown in Fig. 9 will be described with reference to Figs. 5 and 6. In step S30, an IC chip 40 and a first inductor 60 are mounted on a substrate 20 on which a coil antenna 30 having a predetermined shape, connecting portions 102 and 104, and a first capacitor 50 are formed. In step S30, the first inductor 60 is electrically connected between the coil antenna 30 and the connecting portion 104, and the IC chip 40 is electrically connected between the connecting portion 102 and the connecting portion 104. As a result, the coil antenna 30, connecting portions 102 and 104, first capacitor 50, first inductor 60, and IC chip 40 are electrically connected, and the non-contact information medium 12 is formed in a state before the first cover member 70 and the second cover member 80 are placed on the substrate 20. In addition, a closed circuit is formed using the coil antenna 30, the first capacitor 50, the first inductor 60, and the IC chip 40, and the coil antenna 30, the first capacitor 50, and the first inductor 60 form a resonant circuit 100A (Figure 4(B)).

[0082] Next, in step S31 shown in FIG. 9 , the resonant frequency is adjusted using the contactless information medium 12. For example, information such as the communication distance, the resonant frequency, the capacitance Ca of the first capacitor 50, and the inductance La of the first inductor 60 is acquired in advance using the reader / writer 202 and multiple contactless information media 12, and a table linking the communication distance, the resonant frequency, the capacitance Ca of the first capacitor 50, and the inductance La of the first inductor 60 is prepared. The formed contactless information medium 12 is wirelessly communicated with the reader / writer 202 to measure the communication distance. Using the measured communication distance and the table, for example, the resonant frequency is calculated. Using the calculated resonant frequency, one first cover member 70 and one second cover member 80 are selected from the multiple first cover members 70 and the multiple second cover members 80 so that the frequency matches or approximately matches the frequency fc of the radio waves transmitted from the reader / writer 202.

[0083] Next, step S32 shown in Fig. 9 will be described with reference to Fig. 7, Fig. 8(A), and Fig. 8(B). In step S32, the first cover member 70 and the second cover member 80 selected in step S31 are mounted on the non-contact information medium 12.

[0084] Specifically, each of the protrusions of the first lower cover member 74 is inserted into the first through-holes 54 and also into the corresponding recesses of the first upper cover member 72. As a result, the first capacitor 50 is sandwiched between the first recess 59 of the first upper cover member 72 and the third recess 58 of the first lower cover member 74, and is covered by the first recess 59 of the first upper cover member 72 and the third recess 58 of the first lower cover member 74.

[0085] Furthermore, the protrusions at the four corners of the second lower cover member 84 are inserted into the second through-holes 64 and also into the corresponding recesses of the second upper cover member 82. As a result, the first inductor 60 is sandwiched between the second recess 69 of the second upper cover member 82 and the second lower cover member 84, and is covered by the second recess 69 of the second upper cover member 82 and the second lower cover member 84.

[0086] As a result, in step S32, the second capacitor 52 and the second inductor 62 are formed, and the second capacitor 52 and the second inductor 62 are used to configure the resonant circuit 100 (FIG. 4(A)).

[0087] 9, a protective member 90 is formed using injection molding to cover the coil antenna 30, IC chip 40, first capacitor 50, first inductor 60, first cover member 70, and second cover member 80 arranged on the substrate 20. Specifically, resin is injected onto the substrate 20 arranged in a mold, and the resin is molded under a predetermined temperature and pressure to form the protective member 90 to cover the coil antenna 30, IC chip 40, first capacitor 50, first inductor 60, first cover member 70, and second cover member 80 arranged on the substrate 20. At this time, the protective member 90 comes into contact with the substrate 20 between the coil antenna 30 and the IC chip 40, between the coil antenna 30 and the first cover member 70, between the coil antenna 30 and the second cover member 80, between the IC chip 40 and the first cover member 70, between the IC chip 40 and the second cover member 80, and between the first cover member 70 and the second cover member 80. In addition, for example, the material forming the protective member 90 is different from the material forming the first cover member 70 and the material forming the second cover member 80.

[0088] The non-contact information medium 10 is manufactured using the manufacturing method described above. In the non-contact information medium 10, the capacitor and inductor are protected using the protective member 90, the first cover member 70, and the second cover member 80. Therefore, in the non-contact information medium 10, the capacitance of the capacitor and the inductance of the inductor can be easily adjusted without damaging the capacitor and the inductor. In addition, the non-contact information medium 10 is protected by the protective member 90, the first cover member 70, and the second cover member 80, and has high impact resistance.

[0089] 1-5. Configuration of non-contact information medium communication system 200 Fig. 10 is a block diagram showing the configuration of the non-contact information medium communication system 200. The non-contact information medium communication system 200 will be described using Fig. 10. In the non-contact information medium communication system 200, descriptions of configurations that are the same as or similar to those in Figs. 1 to 9 may be omitted.

[0090] 10 , a contactless information medium communication system 200 includes a contactless information medium group 120 including a plurality of contactless information media 10, and a reader / writer 202. In the first embodiment, wireless communication between the contactless information medium group 120 and the reader / writer 202 will be described, but one contactless information medium 10 in the contactless information medium group 120 may also communicate wirelessly with the reader / writer 202.

[0091] The reader / writer 202 includes an input unit 204, a processing unit 206, an output unit 208, and an antenna 210. The antenna 210 has a function of supplying power to the contactless information medium 10 and transmitting and receiving electrical signals containing information to and from the contactless information medium 10, for example, via radio waves of a predetermined frequency. The input unit 204 has a function of inputting instruction information that instructs the reader / writer 202 to operate. The processing unit 206 has a function of processing radio waves received from the contactless information medium 10 via the antenna 210, and operating the reader / writer 202 using information contained in the processed electrical signals. The output unit 208 has a function of outputting an electrical signal containing information processed by the processing unit 206. The reader / writer 202 has an anti-collision function and can receive information from each of the multiple contactless information media 10 in the contactless information medium group 120.

[0092] As explained in "1-3. Electrical characteristics of the non-contact information medium 10," the non-contact information medium 10 is adjusted so that the resonant frequency fr of the resonant circuit 100 formed using the second capacitor 52 and the second inductor 62 matches or nearly matches the frequency fc of the radio waves transmitted from the reader / writer 202.

[0093] Here, a conventional contactless information medium that does not have the second inductor 62 will be described. In conventional contactless information media that do not have the second inductor 62, for example, the resonant frequency fr is adjusted by increasing the number of turns of the antenna coil to increase the inductance of the antenna. When antennas with a large number of turns of the coil are placed close to each other, mutual interference occurs between the coils, and in a group of contactless information media including the conventional contactless information medium, the resonant frequency of the resonant circuit formed using an antenna, a capacitor, and an inductor changes. As a result, the power generated by electromagnetic induction using the resonant circuit changes, and the group of contactless information media including the conventional contactless information medium is not supplied with sufficient power, making it difficult to perform accurate wireless communication between a group of contactless information media including the conventional contactless information medium and a reader / writer.

[0094] Furthermore, the shape of the coil also affects the mutual interference between the coils. For example, in a group of non-contact information media, including conventional non-contact information media, the larger the coil shape, the greater the area where the coils overlap. As a result, mutual interference between the coils is more likely to occur.

[0095] On the other hand, as described above, in the non-contact information medium 10, by using the first cover member 70 and the second cover member 80, it is possible to adjust the capacitance Cb of the second capacitor 52 so as to suppress variations in the characteristics or performance of the first capacitor 50. Furthermore, in the non-contact information medium 10, by using the second cover member 80, it is possible to adjust the inductance Lb of the second inductor 62 so as to suppress variations in the characteristics or performance of the first inductor 60 or the coil antenna 30.

[0096] Furthermore, in the non-contact information medium 10, the coil antenna 30 has one turn, which is significantly less than the number of turns in the coil of an antenna of a conventional non-contact information medium. Therefore, even if a non-contact information medium group 120 including a plurality of non-contact information media 10 is close to each other, mutual interference between the coils of the coil antenna 30 is unlikely to occur.

[0097] Therefore, in the non-contact information medium communication system 200, even if a non-contact information medium group 120 including multiple non-contact information media 10 is close to each other, mutual interference between the coils due to the second inductor 62 including the first inductor 60 is unlikely to occur.

[0098] Therefore, in the contactless information medium communication system 200, mutual interference between coils in the contactless information medium group 120 including a plurality of contactless information media 10 is suppressed. As a result, in the contactless information medium communication system 200, even if the contactless information medium group 120 including a plurality of contactless information media 10 are close to each other, each of the plurality of contactless information media 10 is efficiently supplied with the power required for operation, and therefore can smoothly start operation. Therefore, in the contactless information medium communication system 200, accurate wireless communication can be performed between the contactless information medium group 120 including a plurality of contactless information media 10 and the reader / writer 202.

[0099] 2. Second embodiment The non-contact information medium 10A according to the second embodiment differs from the non-contact information medium 10 according to the first embodiment in that the second capacitor 52 and the second inductor 62 are formed using a first cover member 78, which integrates a first upper cover member 72 and a second upper cover member 82, and a second cover member 88, which integrates a first lower cover member 74 and a second lower cover member 84, and in that the non-contact information medium 10A has a metal ring. The non-contact information medium 10A also differs from the non-contact information medium 10 in that the substrate 20 is sandwiched between the first cover member 78 and the second cover member 88, and then a metal ring is attached, and the substrate 20 is covered with a protective member in this state. The non-contact information medium 10A is otherwise similar in configuration to the non-contact information medium 10, and therefore the explanation of the non-contact information medium 10A will mainly focus on the differences from the non-contact information medium 10.

[0100] 2-1. Configuration of the non-contact information medium 10A Fig. 11 is a plan view showing an outline of the non-contact information medium 10A. Fig. 12(A) is an end cross-sectional view of the cross-sectional structure of the non-contact information medium 10A shown in Fig. 11 taken along line D1-D2, Fig. 12(B) is a plan view showing the fourth recess 49 shown in Fig. 11, and Fig. 12(C) is an enlarged view of the fourth recess 49 shown in Fig. 12(A). The configuration of the non-contact information medium 10A will be described with reference to Fig. 11 and Figs. 12(A) to 12(C). In the configuration of the non-contact information medium 10A, descriptions of configurations that are the same as or similar to those in Figs. 1 to 10 may be omitted.

[0101] 11 or 12(A), the non-contact information medium 10A includes a substrate 20, a metal ring 110, and a protective member 90. The shape and use of the non-contact information medium 10A are similar to those of the non-contact information medium 10.

[0102] The substrate 20 has arranged thereon a coil antenna 30, an IC chip 40, a first capacitor 50, a first inductor 60, and connecting portions 102 and 104, which are similar to those of the non-contact information medium 10. In addition, a first cover member 78 and a second cover member 88 are arranged on the substrate 20. The substrate 20 is a base material that supports the coil antenna 30, the IC chip 40, the first capacitor 50, the first inductor 60, the first cover member 78, the second cover member 88, and the connecting portions 102 and 104.

[0103] The protective member 90 covers the substrate 20, the first cover member 78, the second cover member 88, and the metal ring 110, and forms the outer shape of the non-contact information medium 10A. The protective member 90 also protects the substrate 20, the first cover member 78, the second cover member 88, and the metal ring 110 from external impacts. In the non-contact information medium 10A, it is preferable that the substrate 20, the first cover member 78, the second cover member 88, and the metal ring 110 are completely covered by the protective member 90. The protective member 90 of the non-contact information medium 10A is formed using the same material as the protective member 90 of the non-contact information medium 10.

[0104] In the non-contact information medium 10A, the configurations of the coil antenna 30, IC chip 40, first capacitor 50, first inductor 60, and connecting portions 102 and 104 are the same as those of the non-contact information medium 10, and therefore will not be described here. Here, the first cover member 78 and the second cover member 88 will mainly be described.

[0105] The first cover member 78 integrates the first upper cover member 72 and the second upper cover member 82, and includes a first recess 59 and a second recess 69. The first cover member 78 also includes a fourth recess 49. The surface of the first cover member 78, excluding the first recess 59, the second recess 69, and the fourth recess 49, that faces the upper surface 22 of the substrate 20 is in contact with the upper surface 22 of the substrate 20. The first recess 59 covers the first electrode 56A of the first capacitor 50, the second recess 69 covers the first inductor 60, and the fourth recess 49 covers the IC chip 40.

[0106] In addition, in a plan view, the shape of the first cover member 78 is a circular flat plate, similar to the non-contact information medium 10A, as shown in Fig. 11. Furthermore, in a plan view, the diameter of the first cover member 78 is larger than the diameter of the substrate 20, and in a cross-sectional view, the peripheral edge portion 76 of the first cover member 78 is located outside the side surface of the substrate 20 (see Fig. 12(A)).

[0107] Furthermore, the first cover member 78 (first recess 59) has the function of adjusting the capacitance of the non-contact information medium 10A, and together with the second cover member 88 (third recess 58), constitutes a second capacitor 52 in which the capacitance of the non-contact information medium 10A is adjusted. Also, the first cover member 78 (second recess 69) has the function of adjusting the inductance of the non-contact information medium 10A, and constitutes a second inductor 62 in which the inductance of the non-contact information medium 10A is adjusted.

[0108] Furthermore, the space surrounded by the fourth recess 49 of the first cover member 78, the IC chip 40, and the upper surface 22 except where the IC chip 40 and the upper surface 22 are in contact forms a fourth void 41, and the distance between the fourth recess 49 and the upper surface of the IC chip 40 is referred to as a fourth distance H4 (see FIG. 12(A)). The fourth distance H4 may be, for example, the distance (length) between the top surface of the IC chip 40 and the fourth recess 49 at the closest point, or may be the distance (length) extending vertically from the substrate 20 at the closest point. For example, if the thickness of the IC chip 40 is thinner than the substrate 20 and the fourth distance H4, the volume of the fourth void 41 can be approximated using the fourth distance H4 and the size (width W7 × width W8) of the fourth recess 49 in a top view (see FIGS. 12(A) to 12(C)).

[0109] 12(C), the fourth gap 41 may be filled with air, and a fourth member 47 may be disposed therein. The fourth member 47 may be formed using a material having the same dielectric constant as the first cover member 78, or may be formed using a material having a different dielectric constant than the first upper cover member 72. The fourth member 47 may be formed using a material having the same magnetic permeability as the first cover member 78, or may be formed using a material having a different magnetic permeability than the first upper cover member 72.

[0110] In the second embodiment, as an example, the shapes of the first recess 59, the second recess 69, and the fourth recess 49 are rectangular concave shapes facing the top surface 22 of the substrate 20, and the shape of the third recess 58 is rectangular concave shape facing the bottom surface 24 of the substrate 20. As in the first embodiment, the shapes of the first recess 59, the second recess 69, and the third recess 58 are not limited to the shapes shown here. Furthermore, the shape of the fourth recess 49 is not limited to the shape shown here. The shapes of the first recess 59, the second recess 69, the third recess 58, and the fourth recess 49 may be, for example, concave shapes that are curved surfaces facing the top surface 22 of the substrate 20.

[0111] As described above, the first cover member 78 covers the IC chip 40, the first capacitor 50, and the first inductor 60, and has the function of protecting the IC chip 40, the first capacitor 50, and the first inductor 60 from the outside.

[0112] The second cover member 88 integrates the first lower cover member 74 and the second lower cover member 84, and includes the third recess 58. The surface of the second cover member 88, excluding the third recess 58, that faces the bottom surface 24 of the substrate 20 is in contact with the bottom surface 24. The third recess 58 covers the second electrode 56B of the first capacitor 50.

[0113] In addition, in a plan view, the shape of the second cover member 88 is a circular flat plate, similar to the non-contact information medium 10 A. Furthermore, in a plan view, the diameter of the second cover member 88 is larger than the diameter of the substrate 20 and is the same as or approximately the same as the diameter of the first cover member 78.

[0114] Furthermore, the second cover member 88, like the first cover member 78, has the function of adjusting the capacitance of the non-contact information medium 10A, constitutes the second capacitor 52, and has the function of protecting the first capacitor 50 from the outside. Furthermore, the second cover member 88, like the first cover member 78, has the function of adjusting the inductance of the non-contact information medium 10A, and constitutes the second inductor 62.

[0115] 12(A), in a cross-sectional view, a peripheral edge 86 of the second cover member 88 is located outside the side surface of the substrate 20. The first through holes 54 and the second through holes 64 according to the first embodiment are not formed in the substrate 20, and the substrate 20 overlaps the second cover member 88 and the first cover member 78 in a cross-sectional view. The second cover member 88 and the first cover member 78 are attached to the substrate 20 at the peripheral edge 86 of the second cover member 88 and the peripheral edge 76 of the first cover member 78 using the attachment portion 79 of the first cover member 78, and sandwich the substrate 20 between them. As a result, the second cover member 88 and the first cover member 78 cover the substrate 20 and function to protect the substrate 20 from the outside.

[0116] Similar to the shapes of the first upper cover member 72, the first lower cover member 74, the second upper cover member 82, and the second lower cover member 84 in the first embodiment, the first cover member 78 and the second cover member 88 are formed, for example, by injection molding using the same material as the protective member 90.

[0117] The first cover member 78 and the second cover member 88 are not limited to the configuration described in the second embodiment. The first cover member 78 and the second cover member 88 only need to be configured to have the function of adjusting the capacitance and inductance of the non-contact information medium 10 and to have the function of protecting the IC chip 40, the first capacitor 50, and the first inductor 60 from the outside.

[0118] As described above, the second capacitor 52 according to the second embodiment is configured using at least the first cover member 78 (first recess 59) and the second cover member 88 (third recess 58). Furthermore, the second inductor 62 according to the second embodiment is configured using at least the first cover member 78 (second recess 69). The second capacitor 52 and the second inductor 62 according to the second embodiment have the same configuration as the second capacitor 52 and the second inductor 62 according to the first embodiment described in "1-3. Electrical characteristics of the non-contact information medium 10." Therefore, a description of the second capacitor 52 and the second inductor 62 according to the second embodiment will be omitted here.

[0119] Furthermore, in the non-contact information medium 10A, a resonant circuit 100 (see FIG. 4(A)) is configured using a second capacitor 52 and a second inductor 62. The resonant circuit 100 of the non-contact information medium 10A has the same configuration as the resonant circuit 100 of the non-contact information medium 10 described in "1-3. Electrical characteristics of the non-contact information medium 10". Therefore, a description of the resonant circuit 100 of the non-contact information medium 10A will be omitted here.

[0120] The metal ring 110 is inscribed in the peripheral edge portion 76 of the first cover member 78 and the peripheral edge portion 86 of the second cover member 88, and serves to seal the portion where the first cover member 78 and the second cover member 88 are attached to the substrate 20 using the attachment portion 79 (the connection portion between the first cover member 78 and the second cover member 88), and can also function as a weight member that adds weight to the non-contact information medium 10. The metal ring 110 can be formed from a material such as brass or aluminum. The metal ring 110 has an annular or approximately annular shape and includes a slit 112 formed by cutting a portion of the metal ring 110 (see FIG. 11 ). In other words, the shape of the metal ring 110 is a C-shape including the slit 112. By including the slit 112 in the metal ring 110, it is possible to suppress the generation of eddy currents due to radio waves transmitted from the reader / writer 202. As a result, the non-contact information medium 10 includes the metal ring 110 including the slit 112, so that the power loss due to eddy currents can be suppressed and stable wireless communication with the reader / writer 202 can be performed.

[0121] The inner diameter of the metal ring 110 is the same or approximately the same as the diameters of the first cover member 78 and the second cover member 88. In a plan view, the slit 112 is located on an extension line 114 connecting the position where the IC chip 40 is located and the position where the second capacitor 52 is located, and is located on the opposite side of the IC chip 40 from the position where the second capacitor 52 is located. With this configuration, the slit 112 is located away from the IC chip 40 and the second capacitor, and a portion of the metal ring 110 without the slit 112 is located near the IC chip 40 and the second capacitor, so the IC chip 40 and the second capacitor are protected by the side of the metal ring 110. As a result, even if the non-contact information medium 10A is subjected to an external impact, the impact is absorbed by the metal ring 110, thereby reducing the impact transmitted to the IC chip 40 and the second capacitor. Note that the first inductor 60 is located near the IC chip 40 and the second capacitor, so the first inductor 60 is also protected by the metal ring 110.

[0122] As described above, in the non-contact information medium 10A, both the capacitance Cb of the second capacitor 52 and the inductance Lb of the second inductor 62 can be adjusted at the same time using adjustable members (the first cover member 78 and the second cover member 88). Therefore, in the non-contact information medium 10A, the capacitance and inductance can be adjusted more easily. As a result, in the non-contact information medium 10A, by using the first cover member 78 and the second cover member 88, the capacitance Cb and the inductance Lb can be adjusted so as to suppress variations in the characteristics or performance of both the first capacitor 50 and the first inductor 60.

[0123] Furthermore, in the non-contact information medium 10A, the top surface 22 of the substrate 20, except for the portions where the first recess 59, the second recess 69, and the fourth recess 49 are located, is in contact with and covered by the first cover member 78. The bottom surface 24 of the substrate 20, except for the portion where the third recess 58 is located, is in contact with and covered by the second cover member 88. Thus, the first cover member 78 and the second cover member 88 can protect and reinforce the substrate 20. The peripheries of the first cover member 78 and the second cover member 88 are also protected by the metal ring 110. As a result, the strength of the non-contact information medium 10A is increased, and the non-contact information medium 10A has higher impact resistance.

[0124] 2-2. Manufacturing method of the non-contact information medium 10A A method for manufacturing the non-contact information medium 10A will be described with reference to Figure 11 and Figures 13 to 19. In the method for manufacturing the non-contact information medium 10A, the description of the same or similar configurations as those in Figures 1 to 10 may be omitted.

[0125] 19 is a flowchart showing a method for manufacturing the non-contact information medium 10A. The non-contact information medium 10A is manufactured by a manufacturing method shown in steps S40 to S44. The manufacturing method for the non-contact information medium 10A is not limited to the manufacturing method shown in FIG. 19, and may include other steps.

[0126] First, step S40 shown in Fig. 19 will be described with reference to Fig. 13 and Fig. 14. Step S40 is a manufacturing method similar to step S30 shown in Fig. 9, so a detailed description thereof will be omitted here. In the second embodiment, step S40 forms the non-contact information medium 12A in a state before the first cover member 78 and the second cover member 88 are placed on the substrate 20.

[0127] Next, in step S41 shown in Fig. 19, the resonant frequency is adjusted using the non-contact information medium 12A. Step S41 is a manufacturing method similar to step S31 shown in Fig. 9, so a detailed description thereof will be omitted here. In the second embodiment, one first cover member 78 and one second cover member 88 are selected from the plurality of first cover members 78 and the plurality of second cover members 88 using the resonant frequency determined in step S41 so that the frequency matches or approximately matches the frequency fc of the radio waves transmitted from the reader / writer 202.

[0128] Next, step S42 shown in Fig. 19 will be described with reference to Fig. 17, Fig. 16(A), and Fig. 16(B). In step S42, the first cover member 78 and the second cover member 88 selected in step S41 are mounted on the non-contact information medium 12A. Specifically, the second cover member 88 and the first cover member 78 are assembled to the substrate 20 at the peripheral edge 86 of the second cover member 88 and the peripheral edge 76 of the first cover member 78 using the assembly portion 79 of the first cover member 78, and sandwich the substrate 20.

[0129] The first capacitor 50 is sandwiched between the first recess 59 of the first cover member 78 and the third recess 58 of the second cover member 88, and is covered by the first recess 59 of the first cover member 78 and the third recess 58 of the first cover member 78. The first inductor 60 is sandwiched between the second recess 69 of the first cover member 78 and the second cover member 88, and is covered by the first cover member 78. The IC chip 40 is sandwiched between the fourth recess 49 of the first cover member 78 and the second cover member 88, and is covered by the first cover member 78.

[0130] As a result, in step S42, the second capacitor 52 and the second inductor 62 are formed, and the resonant circuit 100 (FIG. 4(A)) is configured using the second capacitor 52 and the second inductor 62. In addition, the second cover member 88 and the first cover member 78 cover the substrate 20, so that the substrate 20 is protected from the outside and the IC chip 40 is also protected.

[0131] Next, step S43 shown in Fig. 19 will be described with reference to Fig. 17, Fig. 18(A), and Fig. 18(B). In step S43, a metal ring 110 is mounted. Specifically, the metal ring 110 is arranged so as to be inscribed in the peripheral edge portion 76 of the first cover member 78 and the peripheral edge portion 86 of the second cover member 88. At this time, a slit 112 is arranged on an extension line 114 connecting the position where the IC chip 40 is arranged and the position where the first capacitor 50 is arranged.

[0132] 19, injection molding is used to form the first cover member 78 and the second cover member 88 arranged on the substrate 20, and the protective member 90 that covers the metal ring 110. Specifically, resin is injected onto the first cover member 78 and the second cover member 88 arranged on the substrate 20, which are placed in a mold, and the metal ring 110, and the resin is molded under a predetermined temperature and pressure to form the protective member 90 that covers the first cover member 78 and the second cover member 88 arranged on the substrate 20, and the metal ring 110.

[0133] At this time, since the parts (the connection parts of the first cover member 78 and the second cover member 88) that are assembled to the substrate 20 using the assembly part 79 are covered by the metal ring 110, parts or elements such as the coil antenna 30, the first capacitor 50 and the first inductor 60, the first cover member 78 and the second cover member 88 are protected from the pressure of the resin during injection molding.

[0134] The non-contact information medium 10A is manufactured using the manufacturing method described above. As described above, in the non-contact information medium 10A, the capacitor and inductor are protected using the protective member 90, the first cover member 78, and the second cover member 88. Therefore, in the non-contact information medium 10A, the capacitance of the capacitor and the inductance of the inductor can be easily adjusted without damaging the capacitor and the inductor. Furthermore, the non-contact information medium 10A has a higher impact resistance due to the inclusion of the metal ring 110.

[0135] The non-contact information medium, the method for manufacturing the non-contact information medium, and the non-contact information medium communication system described above as embodiments of the present invention can be combined as appropriate as long as they are not mutually contradictory. Furthermore, even if a person skilled in the art adds, deletes, or modifies components as appropriate based on each embodiment, the scope of the present invention also includes those embodiments as long as they include the gist of the present invention.

[0136] Furthermore, even if there are other effects and advantages different from those brought about by the above-mentioned embodiments, those that are clear from the description in this specification or that can be easily predicted by a person skilled in the art are naturally understood to be brought about by the present invention. [Explanation of symbols]

[0137] 10: non-contact information medium, 10A: non-contact information medium, 12: non-contact information medium, 12A: non-contact information medium, 20: substrate, 22: top surface, 24: bottom surface, 30: coil antenna, 40: IC chip, 41: fourth gap, 42: control unit, 44: communication unit, 46: memory unit, 47: fourth member, 49: fourth recess, 50: first capacitor, 51: first gap, 52: second capacitor, 53: third gap, 55: first member, 56A: first electrode, 54: first through hole, 56B: second electrode, 57: third member, 58: third recess, 59: first recess, 60: first inductor, 61: second gap, 62: second inductor, 63: second member, 64: second through hole, 69: second recess, 70: first cover member, 72: first upper cover member, 74: first lower cover member, 76: peripheral portion, 78: first cover member, 79: assembly portion, 80: second cover member, 82: second upper cover member, 84: second lower cover member, 86: peripheral portion, 88: second cover member, 90: protective member, 100: resonant circuit, 100A: resonant circuit, 102, 104: connection portion, 110: metal ring, 112: slit, 114: extension wire, 120: non-contact information medium group, 200: non-contact information medium communication system, 202: reader / writer, 204: input portion, 206: processing portion, 208: output portion, 210 antenna

Claims

1. a substrate having a first surface and a second surface; a coil antenna disposed on the first surface or the second surface; a capacitor including a first electrode disposed on the first surface and a second electrode disposed on the second surface facing the first surface, the capacitor being electrically connected to the coil antenna; a first cover member having a first recess that covers the first electrode and forms a first gap between the first recess and the first electrode; A non-contact information medium having:

2. a protection member that covers the first cover member; the protection member is a member different from the first cover member; The non-contact information medium according to claim 1 .

3. an inductor disposed on the first surface and electrically connected to the coil antenna and the first electrode; a second cover member having a second recess that covers the inductor and forms a second gap between the second recess and the inductor; and the protection member contacts the substrate between the first cover member and the second cover member; The non-contact information medium according to claim 2 .

4. a material having a dielectric constant different from that of the first cover member is disposed in the first gap; The non-contact information medium according to claim 1 .

5. A material having a magnetic permeability different from that of the second cover member is disposed in the second gap. The non-contact information medium according to claim 3 .

6. a first distance between the first electrode and the first cover member is different from a second distance between the inductor and the second cover member; The non-contact information medium according to claim 3 .

7. The number of turns of the coil antenna is 1. The non-contact information medium according to claim 6 .

8. an IC chip disposed on the first surface and electrically connected to the coil antenna, the capacitor, and the inductor; The non-contact information medium according to claim 3 .

9. an inductor disposed on the first surface and electrically connected to the first electrode and the coil antenna; the first cover member has a second recess that covers the inductor, and a second gap is formed between the second recess and the inductor. The non-contact information medium according to claim 1 .

10. a second cover member having a third recess that covers the second electrode and forming a third gap between the third recess and the second electrode; The non-contact information medium according to claim 9.

11. a material having a dielectric constant different from that of the first cover member is disposed in the first gap; The non-contact information medium according to claim 9.

12. A material having a magnetic permeability different from that of the first cover member is disposed in the second gap. The non-contact information medium according to claim 9.

13. a material having a dielectric constant different from that of the second cover member is disposed in the third gap; The non-contact information medium according to claim 10.

14. a third distance between the third recess and the second electrode is different from a first distance between the first electrode and the first cover member or a second distance between the inductor and the first cover member; The non-contact information medium according to claim 10.

15. The number of turns of the coil antenna is 1. The non-contact information medium according to claim 14.

16. an IC chip disposed on the first surface and electrically connected to the coil antenna, the capacitor, and the inductor; The non-contact information medium according to claim 14.

17. a metal ring having a slit; the first cover member includes an assembly portion at a peripheral edge portion of the first cover member, the assembly portion contacts a peripheral edge portion of the second cover member, the metal ring contacts a peripheral edge portion of the first cover member and a peripheral edge portion of the second cover member; The contactless information medium according to claim 16.

18. In a plan view, the slit is located on an extension line connecting a position where the IC chip is disposed and a position where the capacitor is disposed, and is located on an opposite side of the IC chip from the position where the capacitor is disposed.

18. The contactless information medium according to claim 17.

19. 20. The contactless information medium according to claim 18, further comprising a protective member disposed to cover the first cover member, the second cover member, and the metal ring.

20. the first cover member has a fourth recess, and a fourth gap is formed between the fourth recess and the IC chip; 20. The contactless information medium according to claim 19.

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