Submerged posture change device and substrate processing apparatus equipped with same

Abstract

To provide an in-liquid posture conversion device that can be reduced in size and can reduce a load on a rotation mechanism, and a substrate processing apparatus including the same.SOLUTION: In a substrate processing apparatus, a posture conversion tank 33 of a batch type processing apparatus causes a lifting mechanism 61 to raise an inversion chuck 43 to a reception height, causes a drive mechanism 63 to receive a plurality of substrates W on the inversion chuck 43 having a first interval, causes the drive mechanism 63 to adjust the inversion chuck 43 to have a second interval, and causes the lifting mechanism 61 to lower the inversion chuck 43 to an immersion height, and causes a rotation mechanism 65 to drive the inversion chuck 43 around an axis AX1.EFFECT: Since postures of the plurality of substrates W can be converted in an immersion tank DB, and the plurality of substrates W are held not by an in-tank carrier but by the inversion chuck 43, the immersion tank DB can be reduced in size, and since the plurality of substrates W and the inversion chuck 43 are only rotated around the axis AX1, a load on the rotation mechanism 65 can be reduced.SELECTED DRAWING: Figure 8

Description

[Technical Field]

[0001] The present invention relates to a submerged attitude changing device that changes the attitude of substrates such as semiconductor substrates, FPD (Flat Panel Display) substrates such as liquid crystal display and organic EL (Electroluminescence) display devices, glass substrates for photomasks, and substrates for optical disks, and a substrate processing apparatus equipped with the same. [Background technology]

[0002] Conventionally, this type of apparatus includes a batch module, a single-wafer module, and a posture conversion module (see, for example, Patent Document 1). A batch module processes multiple substrates at once. A single-wafer module processes substrates one by one. Generally, drying processing using a single-wafer module requires a smaller processing atmosphere space that affects the substrates, and has higher particle performance, compared to drying processing using a batch module. Therefore, it is easier to improve drying performance in a single-wafer module than in a batch module. Therefore, for example, after etching processing and rinsing processing are performed in a batch module, drying processing is performed in a single-wafer module.

[0003] In the batch-type module, multiple substrates are processed in a vertical position. On the other hand, in the single-wafer-processing module, substrates are processed in a horizontal position. Therefore, the substrates in a vertical position that have finished processing in the batch-type module are converted to a horizontal position by a position conversion module before being transferred to the single-wafer-processing module.

[0004] In recent years, the semiconductor industry has seen advances in the finer and finer patterns of three-dimensional structures. Therefore, there is a risk that the patterns on such substrates may collapse due to the influence of the gas-liquid interface when the substrate dries. Therefore, after processing in a batch-type module, the substrate is kept wet before processing in a single-wafer module to prevent it from drying out.

[0005] Specifically, multiple spray pipes are placed beside the orientation conversion module. The spray pipes spray pure water onto the substrates held in the orientation conversion module, keeping the substrates wet until they are placed in the single-wafer processing module.

[0006] In an apparatus with such a configuration, there are times when the entire substrate is not sufficiently wetted due to the positional relationship between the attitude of the substrate changed by the attitude conversion module and the position of the spray pipe. Also, even if pure water is sprayed from near the rotation mechanism, the presence of the rotation mechanism components makes it difficult to sufficiently wet the entire substrate.

[0007] Therefore, a submerged position change device has been proposed, which includes an immersion tank containing pure water, an in-tank carrier that can be raised and lowered between the interior of the immersion tank and above it and that stores multiple substrates, and a rotation mechanism that rotates the in-tank carrier. In this proposed device, multiple vertically oriented substrates are stored in the in-tank carrier, and the multiple substrates together with the in-tank carrier are immersed in the immersion tank. In this state, the rotation mechanism vertically rotates the in-tank carrier, thereby changing the position of the substrates in the pure water from vertical to horizontal. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Special Publication No. 2016-502275 Summary of the Invention [Problem to be solved by the invention]

[0009] However, the conventional example having such a configuration has the following problems. In other words, conventional equipment has the problem that the size of the immersion tank is large, especially in the vertical direction, because the entire tank carrier is rotated vertically, and there is also the problem that the load on the rotation mechanism is large because multiple substrates are converted to a horizontal position along with the entire tank carrier.

[0010] The present invention has been made in consideration of the above circumstances, and has an object to provide a posture changing device that can be made smaller and reduce the load on the rotation mechanism, and a substrate processing apparatus equipped with the same. [Means for solving the problem]

[0011] In order to achieve the above object, the present invention has the following configuration. That is, the invention described in claim 1 is a submerged posture change device that changes the posture of a plurality of substrates, comprising: an immersion tank that stores a processing liquid; an inversion chuck that holds a plurality of substrates; an opening / closing drive mechanism that drives the inversion chuck to an open position for transferring the plurality of substrates between the inversion chuck and the inversion chuck, and a holding position for holding the plurality of substrates by the inversion chuck; a rotation drive mechanism that drives the inversion chuck around a horizontal axis to change the posture of the plurality of substrates; and a lift drive mechanism that raises and lowers the inversion chuck between a transfer position above the immersion tank and a conversion position within the immersion tank, wherein, with the inversion chuck raised to the transfer position by the lift drive mechanism, the inversion chuck, which has been set to the open position by the open / close drive mechanism, receives the plurality of substrates, and after the inversion chuck is set to the holding position by the open / close drive mechanism, the inversion chuck is lowered to the conversion position by the lift drive mechanism, and the inversion chuck is driven around the horizontal axis by the rotation drive mechanism.

[0012] [Actions and Effects] According to the invention described in claim 1, the lifting drive mechanism raises the inversion chuck to the transfer position. The opening / closing drive mechanism causes the inversion chuck, which has been placed in the open position, to receive multiple substrates, and the opening / closing drive mechanism also places the inversion chuck in the holding position. The lifting drive mechanism lowers the inversion chuck to the conversion position. The rotation drive mechanism drives the inversion chuck around the horizontal axis. This allows the positions of multiple substrates to be changed within the immersion tank. Because multiple substrates are held by the inversion chuck rather than by an in-tank carrier, the immersion tank can be made smaller. Furthermore, because the multiple substrates and the inversion chuck only need to be rotated around the horizontal axis, the load on the rotation mechanism can be reduced.

[0013] In the present invention, the rotation drive mechanism includes a rotation shaft connected at one end to the outside of the reversing chuck, a motor, and a transmission mechanism for transmitting the rotational force of the motor to the rotation shaft, and a bottomed housing for accommodating the rotation shaft and the transmission mechanism. capacity The transmission mechanism further includes a container, and the lifting drive mechanism drives the collection device. capacity It is preferable that the container is raised and lowered together with the container (claim 2).

[0014] The transmission mechanism is housed in a bottomed container and is raised and lowered by a lifting drive mechanism. Therefore, the inversion chuck in the processing solution of the immersion bath can be rotated around a horizontal axis. Furthermore, because the transmission mechanism is housed in a container, even if particles are generated in the transmission mechanism, they can be prevented from getting mixed into the processing solution of the immersion bath and contaminating the substrate.

[0015] In addition, in the present invention, it is preferable that the transmission mechanism comprises a driven pulley provided on the other end side of the rotating shaft, a driving pulley attached to the motor, and a timing belt stretched between the driven pulley and the driving pulley (Claim 3).

[0016] The rotational force of the motor is transmitted to the reversing chuck by a timing belt stretched between the driving pulley and the driven pulley. This allows for a lightweight transmission mechanism, which in turn reduces the load on the lifting drive mechanism.

[0017] In addition, in the present invention, it is preferable that the transmission mechanism comprises a first bevel gear provided on the other end side of the rotating shaft, an extension shaft connected to the motor, and a second bevel gear provided on the lower end of the extension shaft and threadedly engaged with the first bevel gear (Claim 4).

[0018] The first bevel gear and the second bevel gear transmit the rotational force of the extension shaft connected to the motor to the reversing chuck. While a timing belt can cause transmission loss due to its expansion and contraction, transmitting the rotational force using gears reduces transmission loss.

[0019] In the present invention, the lifting Drive It is preferable that the mechanism includes a lifting frame that mounts the rotation drive mechanism and extends outside the immersion tank and the container, and the opening / closing drive mechanism is mounted on the lifting frame (claim 5).

[0020] When the lifting mechanism lifts or lowers the lifting frame, the opening / closing drive mechanism and the rotation drive mechanism can also be lifted or lowered at the same time, thereby simplifying the configuration.

[0021] In addition, in the present invention, capacity It is preferable that the inside of the vessel is pressurized with gas (claim 6).

[0022] Since the container is pressurized, the processing liquid in the immersion tank can be prevented from entering the container, thereby preventing malfunctions caused by the processing liquid entering the container.

[0023] The invention of claim 7 provides a substrate processing apparatus for processing substrates, comprising: a batch processing section for processing a plurality of substrates collectively in a vertical position; a single wafer processing section for processing a single substrate in a horizontal position; a submerged position conversion section for converting the plurality of substrates that have been processed in the batch processing section from a vertical position to a horizontal position in a processing liquid; a first transport section for transporting the plurality of substrates that have been processed in the batch processing section to the submerged position conversion section; and a second transport section for transporting the plurality of substrates that have been horizontally positioned in the submerged position conversion section to the single wafer processing section, wherein the submerged position conversion section comprises an immersion tank that stores a processing liquid; an inversion chuck that holds the plurality of substrates; an open position for transferring the plurality of substrates between the inversion chuck and the submerged position conversion section; and a holding position for holding the plurality of substrates by the inversion chuck. and a lifting drive mechanism for raising and lowering the inversion chuck between a transfer position above the immersion tank and a conversion position within the immersion tank. With the inversion chuck raised to the transfer position by the lifting drive mechanism, the inversion chuck is caused to receive the plurality of substrates when the inversion chuck is set to the open position by the open / close drive mechanism, and after the inversion chuck is set to the holding position by the open / close drive mechanism, the inversion chuck is lowered to the conversion position by the lifting drive mechanism. With the inversion chuck lowered to the conversion position by the lifting drive mechanism, the inversion chuck is driven around the horizontal axis by the rotation drive mechanism to convert the plurality of substrates from the vertical position to the horizontal position.

[0024] [Operation and Effect] According to the invention described in claim 7, the lifting drive mechanism of the submerged position conversion unit raises the inverting chuck to the transfer position. The open / close drive mechanism causes the inverting chuck, which is in the open position, to receive multiple substrates, and the open / close drive mechanism also sets the inverting chuck to the holding position. The lifting drive mechanism lowers the inverting chuck to the conversion position. The rotation drive mechanism drives the inverting chuck around the horizontal axis. This allows multiple substrates processed in the batch processing unit to be transported to the submerged position conversion unit by the first transport unit and converted from a vertical position to a horizontal position within the immersion tank. The substrates can then be transported to the single-wafer processing unit by the second transport unit. The submerged position conversion unit holds multiple substrates with the inverting chuck rather than with an in-tank carrier, thereby enabling the immersion tank to be made smaller. Furthermore, since the multiple substrates and the inverting chuck are simply rotated around the horizontal axis, the load on the rotation mechanism is reduced.

[0025] This specification also discloses an invention relating to the following submerged attitude change device.

[0026] In batch processing, a processing solution is stored in an immersion tank, and multiple substrates are immersed in the processing solution in a vertical position. The processing solution is supplied upward from the bottom of the immersion tank in an upflow manner, and the processing solution is discharged over the upper edge of the immersion tank. By maintaining this state for a predetermined time, multiple substrates are processed at the same time.

[0027] However, when multiple substrates are placed in a vertical position, the degree of processing progress may differ between the upper and lower portions. This means that it is difficult to perform processing uniformly across the substrate surface. In other words, it is difficult to improve the in-plane uniformity.

[0028] Another object of the present invention, which has been made in view of the above circumstances, is to provide an in-liquid attitude changing device that can improve in-plane uniformity by turning the substrate upside down during processing.

[0029] (1) A liquid attitude change device for changing the attitude of a plurality of substrates, an immersion tank for storing a processing liquid; an inversion chuck for holding a plurality of substrates; an opening / closing drive mechanism that drives the inversion chuck to an open position for transferring the plurality of substrates between the inversion chuck and the opening / closing drive mechanism and to a holding position for holding the plurality of substrates by the inversion chuck; a rotation drive mechanism that drives the inversion chuck around a horizontal axis to change the postures of the plurality of substrates; a lifting drive mechanism for lifting the inversion chuck between a transfer position above the immersion tank and a conversion position within the immersion tank; Equipped with a rotation drive mechanism for driving the inversion chuck around a horizontal axis to invert the substrates upside down, the rotation drive mechanism for driving the inversion chuck around a horizontal axis to invert the substrates upside down, and the inversion chuck is moved to the open position by the opening / closing drive mechanism and receives the substrates; the inversion chuck is moved to the holding position by the opening / closing drive mechanism and then moved to the conversion position by the opening / closing drive mechanism and then processed with the processing liquid; and the rotation drive mechanism for driving the inversion chuck around a horizontal axis to invert the substrates upside down, ...

[0030] According to the present invention, a plurality of substrates are processed with a processing solution in an immersion tank, and the rotation drive mechanism drives an inversion chuck around a horizontal axis to invert the plurality of substrates upside down. Therefore, the upper and lower portions of the substrates can be swapped. Therefore, even if the degree of processing progress differs between the upper and lower portions of the substrates, the degree of processing progress can be averaged by swapping them. As a result, in-plane uniformity can be improved.

[0031] (2) In (1), the inversion is performed after a predetermined time of treatment with the treatment liquid, and further treatment is performed in the inverted state for the same amount of time as the previous treatment with the treatment liquid.

[0032] The processing time with the processing liquid after the substrate is turned upside down is the same as the processing time with the processing liquid before the substrate is turned upside down. Therefore, the top and bottom of the substrate can be processed uniformly. As a result, the in-plane processing uniformity can be improved. [Effects of the Invention]

[0033] According to the submerged posture change device of the present invention, the lifting drive mechanism raises the inversion chuck to the transfer position. The opening / closing drive mechanism causes the inversion chuck, which has been placed in the open position, to receive multiple substrates, and the opening / closing drive mechanism also places the inversion chuck in the holding position. The lifting drive mechanism lowers the inversion chuck to the conversion position. The rotation drive mechanism drives the inversion chuck around the horizontal axis. This allows the postures of multiple substrates to be changed within the immersion tank. Because multiple substrates are held by the inversion chuck rather than by an in-tank carrier, the immersion tank can be made smaller. Furthermore, because the multiple substrates and the inversion chuck only need to be rotated around the horizontal axis, the load on the rotation mechanism can be reduced. [Brief explanation of the drawings]

[0034] [Figure 1] 1 is a plan view showing an overall configuration of a substrate processing apparatus according to an embodiment; [Figure 2] FIG. 2 is a cross-sectional view taken along the line AA in FIG. [Figure 3] FIG. 10 is a plan view showing the configuration of a 25-plate chuck and a reversing chuck. [Figure 4] FIG. 10 is a front view showing a state in which the reversing chuck is in an open position. [Figure 5] FIG. 10 is a front view showing a state in which the reversal chuck is in a holding position. [Figure 6] FIG. 10 is a front view showing the configuration of the posture changing tank, showing a state in which the substrate is held in a vertical posture. [Figure 7] FIG. 10 is a front view showing the configuration of the posture changing tank, showing a state in which the substrate is held in a horizontal posture. [Figure 8] FIG. 2 is a partially cutaway front view showing the detailed structure of the posture change tank. [Figure 9]FIG. 10 is a partially cutaway front view showing the detailed structure of another embodiment of the attitude changing tank. [Figure 10] 10A and 10B are front views illustrating other examples of operation of the posture change tank. [Figure 11] 10A and 10B are front views illustrating other examples of operation of the posture change tank. DETAILED DESCRIPTION OF THE INVENTION

[0035] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0036] Fig. 1 is a plan view showing the overall configuration of a substrate processing apparatus according to an embodiment, and Fig. 2 is a cross-sectional view taken along the line AA in Fig. 1.

[0037] <1. Overall structure>

[0038] The substrate processing apparatus 1 processes substrates W. For example, the substrate processing apparatus 1 performs chemical processing, cleaning processing, drying processing, etc. on the substrates W. The substrate processing apparatus 1 employs a processing method (a so-called hybrid method) that combines the batch and single-wafer processing methods. The batch method processes multiple substrates W in a vertical position all at once. The single-wafer method processes a single substrate W in a horizontal position.

[0039] The substrate processing apparatus 1 includes a batch processing apparatus 3 and a single wafer processing apparatus 5. In this embodiment, the single wafer processing apparatus 5 is disposed adjacent to the batch processing apparatus 3. The batch processing apparatus 3 and the single wafer processing apparatus 5 are disposed at a distance from each other. The batch processing apparatus 3 and the single wafer processing apparatus 5 are connected by a bridge section 7.

[0040] <2. Batch processing equipment>

[0041] The batch processing apparatus 3 collectively processes a plurality of substrates W. The batch processing apparatus 3 includes a carry-in block 9, a stocker block 11, a transfer block 13, a posture changing block 15, and a processing block 17.

[0042] For convenience, in this specification, the direction in which the loading block 9, stocker block 11, transfer block 13, and processing block 17 are aligned is referred to as the "front-rear direction X." The front-rear direction X is horizontal. Within the front-rear direction X, the direction from the stocker block 11 toward the loading block 9 is referred to as the "front." The direction opposite to the front is referred to as the "rear." The horizontal direction perpendicular to the front-rear direction X is referred to as the "width direction Y." One direction in the "width direction Y" is referred to as the "right" as appropriate. The direction opposite to the right is referred to as the "left." The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z." For reference, in each figure, front, back, right, left, top, and bottom are indicated as appropriate.

[0043] <3. Carry-in block>

[0044] The carry-in block 9 includes a loading section 19. The loading section 19 is arranged in the front X of the batch processing apparatus 3. The carrier C stores a plurality of (e.g., 25) substrates W in a horizontal position, stacked at regular intervals in the vertical direction Z. The carrier C has a plurality of grooves (not shown) formed therein, separating the surfaces of the substrates W and accommodating each substrate W. An example of the carrier C is a front-opening unify pod (FOUP). A FOUP is a sealed container. The carrier C may be an open container and may be of any type. The loading section 19 includes, for example, two mounting tables 21 on which the carriers C are placed. The two mounting tables 21 are arranged, for example, along the width direction Y. The loading section 19 is also called a load port.

[0045] <4. Stocker Block>

[0046] The stocker block 11 is disposed adjacent to the rear X of the carry-in block 9. The stocker block 11 includes a transporting and storing unit ACB. The transporting and storing unit ACB includes a transport mechanism 23 and shelves 25.

[0047] The transport mechanism 23 transports the carriers C. The transport storage unit ACB has a plurality of shelves 25. Some of the shelves 25 are simply where the carriers C are placed temporarily, and others are where the carriers C are placed for transfer to and from the first transport mechanism HTR. The transport storage unit ACB takes in the carriers C storing unprocessed substrates W from the input unit 19 and places them on the shelves 25. The transport storage unit ACB transports and places the carriers C on the delivery shelf 25 in accordance with a schedule that defines the processing order. The transport storage unit ACB transports and places the emptied carriers C that have been placed on the delivery shelf 25 on the shelf 25. The transport storage unit ACB unloads the empty carriers C placed on the shelf 25 onto the delivery table 21 in accordance with the availability of the table 21. The empty carriers C are transported to the single-wafer processing unit 5. In the empty carrier C transported to the single wafer processing section 5, for example, a substrate W that was stored in this carrier C before processing and has now been processed is stored in the single wafer processing section 5.

[0048] <5. Transfer block>

[0049] The transfer block 13 is disposed adjacent to the rear X of the stocker block 11. The transfer block 13 includes a transfer mechanism CTC. The transfer mechanism CTC includes a first transport mechanism HTR, a conversion mechanism HVC, a pusher PH, and a second transport mechanism WTR.

[0050] A first transport mechanism HTR is disposed on the right side Y of the rear X of the transport storage unit ACB. The first transport mechanism HTR transports multiple substrates W in a batch. In other words, the first transport mechanism HTR is equipped with multiple hands (not shown). Each hand supports one substrate W. The first transport mechanism HTR can also transport only one substrate W. The first transport mechanism HTR picks up multiple substrates W (e.g., 25 substrates) in a batch from a carrier C placed on a delivery shelf 25 in the transport storage unit ACB, and transports them in a horizontal position to the conversion mechanism HVC. At this time, the conversion mechanism HVC converts the position of the substrates W from a horizontal position to a vertical position.

[0051] To the left Y of the first transport mechanism HTR, a conversion mechanism HVC and a pusher PH are arranged in this order. The conversion mechanism HVC delivers multiple substrates W to the pusher PH. After receiving the multiple substrates W from the conversion mechanism HVC, the pusher PH moves in the width direction Y to the second transport mechanism WTR. At this time, the conversion mechanism HVC and the pusher PH assemble or disassemble a batch lot. The pusher PH delivers multiple substrates W to the second transport mechanism WTR.

[0052] The transfer mechanism CTC combines, for example, multiple substrates W constituting one lot removed from one carrier C with multiple substrates W constituting another lot removed from another carrier C into one batch lot. This is the assembly of the batch lot. A batch lot consists of twice the number of substrates W as one lot. In a batch lot, each substrate W from one lot is arranged adjacent to each substrate W from another lot. In other words, each substrate W from one lot is arranged odd-numbered, and each substrate W from the other lot is arranged even-numbered. Typically, the spacing between multiple substrates W removed from a carrier C is the same as that of the carrier C. This is called full pitch. In a batch lot, for example, the spacing between multiple substrates W is half the full pitch. This is called half pitch. As described above, a batch lot is combined with another lot. There are two types of combination methods: front-to-face (also called face-to-face) and back-to-back (also called back-to-face). The way the lots are combined is determined by the operation of the pusher PH. In the following description, a plurality of substrates W will be referred to as a lot, but when a description specific to a batch lot is required, a plurality of substrates W will be referred to as a batch lot.

[0053] The second transport mechanism WTR is disposed to the left Y of the transfer mechanism CTC. The second transport mechanism WTR is configured to be movable between the transfer block 13 and the processing block 17. The second transport mechanism WTR is configured to be movable in the front-rear direction X. The second transport mechanism WTR is equipped with a pair of hands 27 that transports a lot. The pair of hands 27 has, for example, a rotation axis facing the width direction Y. The pair of hands 27 swings around this rotation axis. The pair of hands 27 clamps the side end surfaces of the substrates W that constitute a lot, located in the front-rear direction X. The second transport mechanism WTR transfers the substrates W that constitute a lot between itself and the transfer mechanism CTC. The second transport mechanism WTR transfers the unprocessed substrates W that constitute a lot to the processing block 17. The second transport mechanism WTR transfers the substrates W that have been processed in the processing block 17 between itself and the attitude conversion block 15.

[0054] Here, the processing block 17 will be explained before the posture transformation block 15.

[0055] <6. Processing Block>

[0056] The processing block 17 includes, for example, a batch processing unit BPU. For example, the batch processing unit BPU includes six processing units. Specifically, the batch processing unit BPU includes a first batch processing unit BPU1, a second batch processing unit BPU2, a third batch processing unit BPU3, a fourth batch processing unit BPU4, a fifth batch processing unit BPU5, and a sixth batch processing unit BPU6. The number of batch processing units BPU is not limited to six. In other words, the number of batch processing units BPU may be less than six, or may be seven or more.

[0057] The first batch processing unit BPU1 to the sixth batch processing unit BPU6 are arranged in a row in the front-rear direction X. Each of the first batch processing unit BPU1 to the sixth batch processing unit BPU6 includes a processing bath BB and a lifter LF. The processing bath BB stores a processing liquid. The processing liquid is pure water or a chemical liquid. The chemical liquid is, for example, an organic solvent or an etching liquid. The organic solvent is, for example, IPA (isopropyl alcohol). The etching liquid is, for example, a phosphoric acid solution.

[0058] The lifter LF moves up and down between a processing position inside the processing bath BB and a transfer position above the liquid level in the processing bath BB. The lifter LF transfers a plurality of substrates W to and from the second transport mechanism WTR at the transfer position. The first batch processing unit BPU1 to the sixth batch processing unit BPU6 are associated with each other in pairs, for example. Specifically, the first batch processing unit BPU1 and the second batch processing unit BPU2 form one pair, the third batch processing unit BPU3 and the fourth batch processing unit BPU4 form one pair, and the fifth batch processing unit BPU5 and the second batch processing unit BPU6 form one pair. Each pair is assigned the role of, for example, chemical processing and cleaning processing. The first batch processing unit BPU1 to the sixth batch processing unit BPU6 can process, for example, up to 50 substrates W at a time. In other words, the first batch processing unit BPU1 to the sixth batch processing unit BPU6 can simultaneously process, for example, a maximum of one batch lot.

[0059] Each processing tank BB is supplied with processing liquid from below. The processing liquid is discharged over the upper edge of each processing tank BB. Each processing tank BB immerses multiple substrates W placed on a lifter LF in the processing liquid. Each lifter LF abuts and holds the lower edge of the substrate W. Each lifter LF transfers multiple substrates W between it and the second transport mechanism WTR.

[0060] <7. Posture change block>

[0061] 2, the posture changing block 15 includes a 25-piece chuck TFC, a standby tank 31, and a posture changing tank 33. In the drawings referring to the standby tank 31 and the posture changing tank 33, the liquid surface is not shown so that each component can be easily seen.

[0062] The standby tank 31 includes a processing tank BB0 and a lifter LF0. The processing tank BB0 has the same configuration as the processing tank BB included in the first batch processing unit BPU1 to the sixth batch processing unit BPU6 described above. The lifter LF0 moves up and down between a standby position inside the processing tank BB0 and a transfer position above the liquid level in the processing tank BB0. The standby tank BB0 stores a processing liquid. The processing liquid is, for example, pure water. At the standby position, the substrate W placed on the lifter LF0 is entirely submerged in the processing liquid.

[0063] Here, reference is made to Fig. 3. Fig. 3 is a plan view showing the configuration of the 25-plate chuck and the reversing chuck.

[0064] The 25-substrate chuck TFC moves horizontally as a whole only in the width direction Y. The 25-substrate chuck TFC does not move up and down in the vertical direction Z. The 25-substrate chuck TFC does not move horizontally in the front-to-rear direction X. However, the 25-substrate chuck TFC opens and closes the hand 35 between the holding position PC and the passing position PT. At the holding position PC, the 25-substrate chuck TFC holds multiple substrates W. At the passing position PT, the 25-substrate chuck TFC does not hold multiple substrates W. In other words, the passing position PT allows the lifter LF0 holding multiple substrates W to move between the transfer position and the standby position. The 25-substrate chuck TFC moves, for example, to three positions in the width direction Y: a first transfer position P1, a second transfer position P2, and a third transfer position P3.

[0065] The 25-substrate chuck TFC has locking portions 37. The locking portions 37 are provided inside the hand 35. The locking portions 37 are formed in the width direction Y at intervals of the full pitch described above. The first transfer position P1 and the second transfer position P2 differ in position in the width direction Y by a distance corresponding to the half pitch. The third transfer position P3 is a position where multiple substrates W are transferred to the posture change tank 33. The 25-substrate chuck TFC receives only one lot from the lifter LF0 at the first transfer position P1. Specifically, of the two lots that make up the batch, it receives only the multiple odd-numbered substrates W that make up the first lot. The 25-substrate chuck TFC receives only the other lot from the lifter LF0 at the second transfer position P2. Specifically, of the two lots that make up the batch, it receives only the multiple even-numbered substrates W that make up the next lot.

[0066] Here, in addition to Fig. 2 and Fig. 3, Fig. 4 to Fig. 7 will be referred to. Fig. 4 is a front view in a state where the inversion chuck is set to a first spacing. Fig. 5 is a front view in a state where the inversion chuck is set to a second spacing. Fig. 6 is a cross-sectional view in a state where the inversion chuck is set to the first spacing. Fig. 7 is a cross-sectional view in a state where the inversion chuck is set to the second spacing.

[0067] As shown in FIG. 2, the posture changing tank 33 includes a dipping tank DB and a posture changing unit 41.

[0068] First, the main parts will be described. The posture changing tank 33 uses the inversion chucks 43 to change the postures of multiple substrates W collectively in the immersion tank DB. Specifically, the inversion chucks 43 change the postures of multiple substrates W from a vertical posture to a horizontal posture. The inversion chucks 43 change the postures of, for example, half of the substrates W that make up a batch lot. The inversion chucks 43 change the postures of, for example, 25 substrates W. The inversion chucks 43 are arranged opposite each other in the radial direction of the substrates W and clamp the peripheral edges of the substrates W. The immersion tank DB stores a processing liquid. The processing liquid is, for example, pure water.

[0069] 4 and 5, the inversion chuck 43 includes a pair of chuck members 45. The length of the chuck members 45 in the vertical direction Z when receiving or holding a vertically oriented substrate W is shorter than the radius of the substrate W. As shown in FIGS. 3 and 7, the length of the chuck members 45 in the width direction Y when receiving or holding a vertically oriented substrate W is slightly longer than the length of the substrates W in the alignment direction in the lot.

[0070] 4 and 5, each chuck member 45 has a groove 47 on the opposing surface. When viewed from the width direction Y in a vertical position for receiving and holding a vertically oriented substrate W, the groove 47 has an arc-like shape. The arc-like shape of the groove 47 follows the outer edge of the substrate W.

[0071] The pair of chuck members 45 move in the front-rear direction X over a first distance WD1 and a second distance WD2. The pair of chuck members 45 can change the distance between the opposing grooves 47. The first distance WD1 is a distance for transferring substrates between the 25-plate chuck TFC and the bridging portion 7. The second distance WD2 is narrower in the front-rear direction X than the first distance WD1 and is a distance for clamping multiple substrates W.

[0072] Reference is now made to Figure 8, which is a partially cutaway front view showing the detailed structure of the posture change tank.

[0073] The immersion tank DB is equipped with a pair of supply pipes 50. Each supply pipe 50 is disposed at the bottom of the immersion tank DB. Each supply pipe 50 is disposed at a corner of the immersion tank DB in the front-rear direction X. Each supply pipe 50 extends in the width direction Y. Each supply pipe 50 sprays and supplies the treatment liquid toward above the center of the immersion tank DB in the front-rear direction X, i.e., diagonally upward. In other words, each spray pipe 50 sprays the treatment liquid toward the vicinity of the center of the substrate W when the substrate W is immersed in the immersion tank DB.

[0074] Alternatively, each supply pipe 50 may be configured to supply the processing liquid by spraying it toward the center of the bottom surface of the immersion tank DB. This allows the processing liquid to hit the bottom surface of the immersion tank DB once and then rise toward the center of the substrate W. Therefore, a strong flow of the processing liquid does not directly hit the substrate W. As a result, processing unevenness caused by the flow of the processing liquid can be suppressed, and in-plane uniformity can be further improved.

[0075] The posture changing tank 33 includes a lifting mechanism 61 , a driving mechanism 63 , and a rotation mechanism 65 .

[0076] The lifting mechanism 61 lifts and lowers the reversing chuck 43. The driving mechanism 63 opens and closes the reversing chuck 43. The rotating mechanism 65 rotates the reversing chuck 43.

[0077] The lifting mechanism 61 is disposed outside the immersion tank DB. In a plan view, the lifting mechanism 61 is disposed along the outer surfaces of two of the four side walls of the immersion tank DB that are located in the front-rear direction X. As shown in FIG. 6 , the lifting mechanism 61 raises and lowers the inverting chuck 43 among a receiving height HP1, a clamping height HP2, a locking height HP3, and an immersion height HP4. The receiving height HP1 is the height at which a vertically oriented substrate W is received by the inverting chuck 43. The clamping height HP2 is the height at which a vertically oriented substrate W is clamped by the inverting chuck 43. The locking height HP3 is the height at which a vertically oriented substrate W clamped by the inverting chuck 43 is locked. The immersion height HP4 is the height at which a vertically oriented substrate W locked by the inverting chuck 43 is immersed in the processing liquid in the immersion tank DB.

[0078] The lifting mechanism 61 includes a base member 61a, a screw shaft 61b, a motor 61c, a lifting member 61d, and a lifting frame 61e.

[0079] The base member 61a is fixed to the bottom of the posture change tank 33. The screw shaft 61b is erected from the base member 61a in the vertical direction Z. The screw shaft 61b extends in the vertical direction Z. The screw shaft 61b is arranged along the outer surface of the immersion tank DB. A motor 61c is attached to the upper part of the screw shaft 61b. The rotation shaft of the motor 61c faces downward. The rotation shaft of the motor 61c is connected to the screw shaft 61b. The lifting member 61d is threadedly engaged with the screw shaft 61b. The lifting member 61d rises and falls in the vertical direction Z by the rotation of the screw shaft 61b. The lifting frame 61e is connected to the lifting member 61d. The lower part of the lifting frame 61e is connected to the lifting member 61d. The lifting frame 61e is in an inverted L shape.

[0080] The drive mechanism 63 is mounted on the upper part of the lifting mechanism 61. The drive mechanism 63 includes an upper base member 63a, an air cylinder 63b, a moving piece 63c, a suspension arm 63d, and a linear guide 63e. The upper base member 61a is disposed above the motor 61c and the lifting frame 61e. The air cylinder 63b is attached to the upper base member 63a. The air cylinder 63b has an actuating axis directed in the front-to-rear direction X. The suspension arm 63d is in an inverted L shape. The horizontal part of the suspension arm 63d is attached to the upper part of the lifting frame 61e via the linear guide 63e. The suspension arm 63d is attached via the linear guide 63e so that it can move horizontally in the front-to-rear direction X. The suspension arm 63d can move horizontally relative to the lifting frame 61e. The drive mechanism 63 moves the suspension arm 63d in the front-to-rear direction X by operating the air cylinder 63b. The driving mechanism 63 operates the air cylinder 63b to move the chuck member 45 between the first distance WD1 and the second distance WD2.

[0081] For example, the air cylinder 63b has an operating shaft that contracts when not in operation. For example, the air cylinder 63b has an operating shaft that extends when in operation. That is, when the air cylinder 63b is not in operation, the chuck 43 has a first distance WD1. When the air cylinder 63b is in operation, the chuck 43 has a second distance WD2.

[0082] The rotation mechanism 65 includes a rotation shaft 65 a, a motor 65 b, and a transmission mechanism 67 .

[0083] One end of the rotating shaft 65a is connected to the outer surface of the chuck member 45. The motor 65b is attached to the upper part of the moving piece 63c. The motor 65b is arranged horizontally. The other end of the rotating shaft 65a is housed in a container 69. The rotating shaft 65a is attached to the container 69 via a seal member 65c. The seal member 65c supports the rotating shaft 65a in a liquid-tight manner. The rotating shaft 65a is attached to the suspension arm 63d via a bearing 65d. The bearing 65d supports the rotating shaft 65a rotatably around the axis AX1. The other end of the rotating shaft 65a protrudes in the front-to-rear direction X from the outer surface of the suspension arm 63d.

[0084] The sealing member 65c described above is preferably a mechanical seal or a VL seal. A mechanical seal is a seal that forms a liquid film on the sliding surface while acting as a lubricant with the liquid to be sealed. A VL seal is a seal that seals by tightening an L-shaped seal ring with an O-ring.

[0085] The container 69 has a bottom. The container 69 does not have a ceiling surface. In other words, the top surface of the container 69 is connected to the surrounding area. When the inverting chuck 43 is located at the immersion height HP4, the upper edge of the container 69 is located above the upper edge of the immersion tank DB. In other words, the container 69 is not submerged in the processing liquid in the immersion tank DB. The container 69 is raised and lowered in the vertical direction Z by the lifting mechanism 61 together with the suspension arm 63d.

[0086] The transmission mechanism 67 transmits the rotational force of the motor 65b to the rotation shaft 65a.

[0087] Specifically, the transmission mechanism 67 includes a driven pulley 67a, a driving pulley 67b, and a timing belt 67c. The driven pulley 67a is fixed to the other end of the rotating shaft 65a. The driving pulley 67b is attached to a motor 65a. The driving pulley 67b is driven to rotate by the motor 65a. The timing belt 67c is stretched between the driven pulley 67a and the driving pulley 67b. When the motor 65b rotates, the rotating shaft 65a is driven to rotate about the axis AX1 via the driving pulley 67b, the timing belt 67c, and the driven pulley 67d. This causes the reversing chuck 43 to rotate about the axis AX1.

[0088] The drive mechanism 63 and the rotation mechanism 65 are mounted on the lifting mechanism 61. Therefore, the drive mechanism 63 and the rotation mechanism 65 are raised and lowered in the vertical direction Z by the lifting mechanism 61. The rotation mechanism 65 is mounted on the drive mechanism 63. Therefore, the rotation mechanism 65 is moved in the front-to-rear direction X by the drive mechanism 63.

[0089] The transmission mechanism 67 transmits the rotational force of the motor 65b to the reversing chuck 43 via a timing belt 67c wound around a driving pulley 67b and a driven pulley 67a. This makes it possible to reduce the weight of the transmission mechanism 67. As a result, the load on the lifting mechanism 61 can be reduced.

[0090] The container 69 is raised and lowered together with the suspension arm 63d in the vertical direction Z by the lifting mechanism 61. Therefore, even if particles are generated in the rotation mechanism 65 or the transmission mechanism 67, the particles do not enter the processing liquid in the immersion tank DB. As a result, contamination of the substrate W during attitude change can be prevented.

[0091] Now, let us return to Figures 1 and 2.

[0092] <8. Bridging Section>

[0093] The bridge unit 7 connects the batch processing apparatus 3 and the single wafer processing apparatus 5. The bridge unit 7 is in communication only with the batch processing apparatus 3 and the single wafer processing apparatus 5. The bridge unit 7 is equipped with a bridge robot BR. The bridge robot BR is configured to be movable only in the width direction Y. The bridge robot BR does not move up and down in the vertical direction Z. The bridge robot BR is equipped with a hand 71. The hand 71 is configured to be rotatable within a horizontal plane including the front-to-rear direction X and the width direction Y. The hand 71 is configured to be extendable and retractable in the horizontal direction. The bridge robot BR moves the hand 71 forward and backward to receive a single horizontally oriented substrate from the orientation conversion block 15. The bridge robot BR delivers the single horizontally oriented substrate to the single wafer processing apparatus 5.

[0094] <9. Single-Wafer Processing Equipment>

[0095] The single wafer processing apparatus 5 includes an unloading block 81, an indexer block 83, and a processing block 85.

[0096] <10. Carry-out block>

[0097] The unloading block 81 includes an unloading section 87. The unloading section 87 is arranged in the front X of the single wafer processing apparatus 5. A carrier C is placed on the unloading section 87. The unloading block 81 includes, for example, four unloading sections 87. The four unloading sections 87 are arranged along the width direction Y. The unloading sections 87 are also called load ports.

[0098] <11. Indexer Block>

[0099] The indexer block 83 is equipped with an indexer robot IR. The indexer robot IR is equipped with, for example, an articulated arm 89 and a hand 91. The indexer robot IR does not move in the width direction Y or the front-rear direction X. The indexer robot IR bends the articulated arm 89 to move the hand 91. The indexer robot IR raises and lowers the hand 91 in the vertical direction Z. The indexer robot IR can access each of the cassettes C placed on the four unloading units 87. The indexer robot IR transports one substrate W with the hand 91. The indexer robot IR transports one substrate W from the processing block 85 to the unloading unit 87.

[0100] <12. Processing Block>

[0101] The processing block 85 includes four towers TW1 to TW4 and a center robot CR.

[0102] The tower TW1 is disposed behind the indexer block 83 in the X direction. The tower TW1 is disposed adjacent to the indexer block 83. The tower TW1 includes processing chambers-MPCs stacked in the vertical direction Z. The tower TW1 includes, for example, three processing chambers-MPCs. The processing chambers-MPCs process substrates W one by one. The processing chambers-MPCs in the vertical direction Z perform, for example, a drying process on the substrates W.

[0103] Tower TW2 is disposed behind tower TW1 at X. Tower TW2 is disposed adjacent to tower TW1. Tower TW2 has the same configuration as tower TW1. That is, tower TW2 has three processing chambers-MPC stacked in the vertical direction Z.

[0104] Tower TW3 is disposed to the left Y of tower TW2. Tower TW3 is disposed to the left Y of tower TW2, with the center robot CR in between. Tower TW3 has the same configuration as towers TW1 and TW2. In other words, tower TW3 has three processing chambers MPC stacked in the vertical direction Z.

[0105] Tower TW4 differs in part in configuration from towers TW1 to TW4. That is, tower TW4 is provided with processing chambers-MPC at the bottom and top in the vertical direction Z. Tower TW4 is provided with a transfer section 93 in the center in the vertical direction Z. A single substrate W is placed on the transfer section 93. The transfer section 93 is provided with lifting pins 93a. The lifting pins 93a are raised and lowered when receiving a substrate W from the bridge robot BR. A single substrate W is placed on the transfer section 93 from the bridge robot BR. The placed substrate W is received by the center robot CR at the transfer section 93.

[0106] The center robot CR is configured to be movable in the front-rear direction X. The center robot CR is equipped with a hand 95. The hand 95 moves up and down in the vertical direction Z. The hand 95 is configured to be rotatable within a plane including the front-rear direction X and the width direction Y. The hand 95 is moved so as to be able to access the processing chambers-MPC and the delivery part 93 of the towers TW1 to TW4. In other words, the center robot CR can freely move the hand 95 in the vertical direction Z, the front-rear direction X, and the width direction Y. The center robot CR delivers the processed substrate W to the indexer robot 83.

[0107] <13. Operation explanation>

[0108] An example of processing performed by the substrate processing apparatus 1 will be described with reference to FIGS.

[0109] First, the overall flow of processing will be roughly described.

[0110] <14. Batch Processing>

[0111] A carrier C containing a plurality of unprocessed substrates W is placed in the loading section 19. The transport mechanism 23 loads the carrier C into the stocker block 11. Two sets of substrates W are assembled into a batch lot by the first transport mechanism HTR and the transfer mechanism CTC. The substrates W constituting the batch lot are transported by the second transport mechanism WTR to the processing block 17. In the processing block 17, for example, a phosphoric acid etching process is performed in the second batch processing unit BPU2. The substrates W constituting the batch lot are then subjected to a pure water cleaning process in the first batch processing unit BPU1. Next, the substrates W constituting the batch lot are transported by the second transport mechanism WTR to the orientation conversion block 15. In the orientation conversion block 15, only one of the batch lots is transported to the orientation conversion bath 33. In the orientation conversion bath 33, the substrates W in only one of the batch lots are converted from a vertical orientation to a horizontal orientation in the liquid. Thereafter, the substrates W constituting one of the batch lots are transported one by one in sequence to the single-wafer processing apparatus 5. Thereafter, the other lot of the batch lot is similarly subjected to posture change and then transported to the single-wafer processing apparatus 5.

[0112] <15. Single-Wafer Processing>

[0113] The substrate W, which has been converted to a horizontal position, is transported to the single-wafer processing apparatus 5 by the bridge robot BR. Specifically, the substrate W is placed on the transfer section 93. The substrate W placed on the transfer section 93 is received by the center robot CR. The center robot CR loads the substrate W, for example, into a processing chamber MPC of the tower TW1. In the processing chamber MPC, for example, a drying process is performed on the substrate W. Specifically, for example, pure water is supplied to the substrate W while the substrate W is being rotated. Then, IPA is supplied to the substrate W to replace the pure water in the substrate W with IPA. The substrate W is then rotated at high speed to dry it. Furthermore, if necessary, a drying process using carbon dioxide as a supercritical fluid is preferably performed in another processing chamber MPC. The substrate W is subjected to a finish drying process by the drying process using the supercritical fluid. This completely dries the substrate W while preventing the collapse of the pattern formed on the substrate W.

[0114] The substrate W for which the drying process has been completed is carried out to the unloading section 87 by the center robot CR and the indexer robot IR. The indexer robot IR stores the substrate W in a carrier C placed in the unloading section 87. Subsequent substrates W that constitute the same lot to be processed are stored in the same carrier C.

[0115] <16. Posture conversion processing>

[0116] The above is a rough outline of the processing flow by the substrate processing apparatus 1. Next, the posture change will be described.

[0117] After batch processing, the plurality of substrates W constituting the batch lot are transferred by the second transport mechanism WTR to the lifter LF0 in the standby tank 31. The lifter LF0 moves the plurality of substrates W constituting the batch lot to a standby position inside the standby tank 31. Since the plurality of substrates W constituting the batch lot wait in this state, drying can be prevented. In other words, patterns formed on the substrates W after batch processing can be prevented from collapsing.

[0118] The 25-substrate chuck TFC is positioned at the first transfer position P1. The 25-substrate chuck TFC releases the hand 35. That is, the 25-substrate chuck TFC has the hand 35 at the passing position PT (see FIG. 3). The lifter LF0 is raised to the transfer position above the liquid level in the standby tank BB0. At this time, since the hand 35 of the 25-substrate chuck TFC is at the passing position PT, the multiple substrates W can pass between the 25-substrate chucks TFC and rise. At the same time, the posture changing unit 41 in the posture changing tank 33 raises the inverted chuck 43 to the receiving height HP1.

[0119] The 25-substrate chuck TFC closes the hand 35. That is, the hand 35 of the 25-substrate chuck TFC is set to the holding position PC (see FIG. 3). In this state, the lifter LF0 is lowered to the standby position. As a result, of the multiple substrates W of the batch lot placed on the lifter LF0, only the multiple odd-numbered substrates W constituting one lot are placed on the 25-substrate chuck TFC. Of the multiple substrates W of the batch lot placed on the lifter LF0, the multiple even-numbered substrates W constituting another lot are lowered together with the lifter LF0 into the standby tank BB0. As a result, the hand 35 of the 25-substrate chuck TFC is set to the second transfer position PT2, and the even-numbered substrates W can be held in a standby state prevented from drying until they are moved to the posture conversion tank 33. Therefore, pattern collapse due to drying of the multiple substrates W constituting the other lot can also be prevented.

[0120] The 25-substrate chuck TFC advances the hand 35 to the right Y up to the third transfer position P3. At this time, the reversing chuck 43 is positioned at the receiving height HP1, so that no interference with the substrate W occurs.

[0121] The inverting chuck 43 is set to the first distance WD1 by deactivating the air cylinder 63b of the drive mechanism 61 (see FIG. 4). In this state, the inverting chuck 43 is lowered toward the plurality of substrates W placed on the 25-substrate chuck TFC. Specifically, the inverting chuck 43 is lowered to a clamping height HP2. The plurality of substrates W are accommodated in the inverting chuck 43.

[0122] The air cylinder 63b of the drive mechanism 61 is operated to set the inverting chuck 43 to the second width WD2 (see FIG. 5). This causes the substrate W accommodated in the inverting chuck 43 to be clamped. Furthermore, as shown in FIG. 6, the inverting chuck 43 is raised to a locking height HP3. This causes the lower edge portion of the end face of the substrate W clamped by the inverting chuck 43, which is lower than the sides, to abut and be locked. Note that, with the inverting chuck 43 temporarily raised to the receiving height HP1, the 25-substrate chuck TFC is moved to a second transfer position P2. This makes the 25-substrate chuck TFC ready to receive the substrates W that make up another lot placed on the lifter LF0.

[0123] By driving the motor 61c of the lifting mechanism 61, the inverting chuck 43 is lowered to the immersion height HP4. As a result, the multiple substrates W held by the inverting chuck 43 are immersed in the processing solution in the immersion tank DB. The multiple substrates W are entirely submerged in the processing solution in the immersion tank DB. In the attitude changing block 15, the multiple substrates W that make up one lot are exposed from the solution for only a short period of time, from when they are raised from the standby tank BB0 until they are immersed in the immersion tank DB.

[0124] The motor 65b of the rotation mechanism 65 is operated to rotate the inversion chuck 43 by 90°. Specifically, in this example, it is rotated by 90° clockwise. The direction of rotation can be determined depending on the direction in which the processing surface (front surface) of the substrate W is positioned. In other words, the direction of rotation can be determined so that the processing surface of the substrate W faces upward. As a result, the multiple substrates W are converted into a horizontal position.

[0125] The motor 61b of the lifting mechanism 61 is operated to raise the inverting chuck 43. Specifically, the inverting chuck 43 is raised so that only the substrate W clamped in the uppermost groove 47 of the inverting chuck 43 is exposed from the liquid in the immersion tank DB. The height of the inverting chuck 43 is set to a height that allows the hand 71 of the bridge robot BR to enter a position slightly below the underside of the substrate W exposed from the liquid.

[0126] The hand 71 of the bridge robot BR is advanced into the posture changing section 41. The hand 71 advances to a position slightly below and spaced apart from the lower surface of the substrate W.

[0127] The inverting chuck 43 is moved downward. By the movement of the inverting chuck 43, the substrate W is transferred to the hand 71.

[0128] The bridge robot BR moves the hand 71 to the right Y and removes the uppermost substrate W from the inverting chuck 43 .

[0129] The bridge robot BR rotates the hand 71 to position the substrate W to the right Y. Specifically, the hand 71 rotates to move the substrate W toward the delivery section 93. Then, one substrate W is delivered to the delivery section 93.

[0130] By the operation of the posture changing block 15 described above, one substrate W is transported from the batch processing apparatus 3 to the single wafer processing apparatus 5 in a horizontal posture.

[0131] The correspondence between the present invention and the above-described embodiments is as follows:

[0132] The posture change tank 33 corresponds to the "submerged posture change device" and "submerged posture change section" in this invention. The batch processing apparatus 3 corresponds to the "batch processing section" in this invention. The single wafer processing apparatus 5 corresponds to the "single wafer processing section" in this invention. The 25-piece chuck TFC corresponds to the "first transport section" in this invention. The bridge robot BR corresponds to the "second transport section" in this invention. The drive mechanism 63 corresponds to the "opening / closing drive mechanism" in this invention. The rotation mechanism 65 corresponds to the "rotation drive mechanism" in this invention. The lifting mechanism 61 corresponds to the "lifting drive mechanism" in this invention. The first distance WD1 corresponds to the "open position" in this invention. The second distance WD2 corresponds to the "holding position" in this invention. The receiving height HP1 corresponds to the "transfer position" in this invention. The immersion height HP4 corresponds to the "conversion position" in this invention.

[0133] According to this embodiment, the lifting mechanism 61 raises the inverting chuck 43 to a receiving height HP1. The drive mechanism 63 causes the inverting chuck 43, which has been set to a first distance WD1, to receive multiple substrates W, and the drive mechanism 63 also sets the inverting chuck 43 to a second distance WD2. The lifting mechanism 61 lowers the inverting chuck 43 to an immersion height HP4. The rotation mechanism 65 drives the inverting chuck 43 around the axis AX1. This allows the orientation of multiple substrates W in the immersion tank DB to be changed. Because multiple substrates W are held by the inverting chuck 43 rather than by an in-tank carrier, the immersion tank DB can be made smaller. Furthermore, because the multiple substrates W and the inverting chuck 43 are simply rotated around the axis AX1, the load on the rotation mechanism 65 can be reduced.

[0134] 17. Modified posture change tank

[0135] Reference is now made to Figure 9. Figure 9 is a partially cutaway front view showing the detailed structure of another embodiment of the attitude changing tank.

[0136] This attitude change tank 33A differs from the attitude change tank 33 in the configuration of the attitude change unit 41A. Specifically, the attitude change unit 41A differs in a rotation mechanism 65A, a transmission mechanism 67A, and a container 69A.

[0137] The rotation mechanism 65A includes a rotation shaft 65a, a motor 65Ab, a seal member 65c, and a coupling 65Ad.

[0138] The transmission mechanism 67A includes a first bevel gear 67Ad, an extension shaft 67Ae, and a second bevel gear 67Af. The first bevel gear 67Ad is attached to the other end of the rotation shaft 65a.

[0139] In the rotation mechanism 65A, a motor 65Ab is disposed vertically above the drive mechanism 63. The motor 65Ab is coupled to one end of an extension shaft 67Ae via a coupling 65Ad. Because the extension shaft 67Ae and the motor 65Ab are coupled via the coupling 65Ad, the motor 65Ab can be easily replaced. A second bevel gear 67Af is attached to the other end of the extension shaft 67Ae. The second bevel gear 67Af is threadedly engaged with the first bevel gear 67Ad. The axes of the rotation shaft 65a and the extension shaft 67Ae are substantially perpendicular to each other. The first bevel gear 67Ad and the second bevel gear 67Af transmit the rotational force of the motor 65Ab in a direction substantially perpendicular to each other. According to this modification, the torque of the motor 65Ab is transmitted by the first bevel gear 67Ad and the second bevel gear 67Af, so that transmission loss of the torque can be reduced compared to the method using the timing belt 67c described above.

[0140] The container 69A hermetically houses the transmission mechanism 67A. The container 69A is preferably pressurized. Specifically, one end of a supply pipe 99 is connected to a pressurized source 97. The other end of the supply pipe 99 is connected to the container 69A. The pressurized source 97 supplies gas to the supply pipe 99. The gas is, for example, nitrogen gas or air. The gas is supplied so as to maintain a constant pressure. This prevents the processing liquid in the immersion tank DB from entering the container 69A. As a result, it is possible to prevent the transmission mechanism 67A from breaking down due to the processing liquid entering the container 69A.

[0141] <18.Other examples of posture change tank operation>

[0142] Other examples of operation of the above-mentioned posture change tank 33 will be described with reference to Figures 10 and 11. Figures 10 and 11 are front views illustrating other examples of operation of the posture change tank.

[0143] In the above-described embodiment, the posture changing tank 33 is used only to change the posture of the plurality of substrates W from a vertical posture to a horizontal posture. In other words, the posture changing tank 33 changes the posture of the plurality of substrates W by 90 degrees. However, the posture changing tank 33 may also be used to operate as follows.

[0144] That is, the attitude changing tank 33 can also be used as a batch processing unit BPU for simultaneously processing a plurality of substrates W. That is, the attitude changing tank 33 is used as a processing tank BB of the batch processing unit BPU.

[0145] For example, multiple substrates W are processed while a processing liquid is supplied from the supply pipe 50. The processing liquid is, for example, a chemical liquid, specifically, a phosphoric acid solution. The multiple substrates W are held in a vertical position by the inverting chuck 43 using the rotation mechanism 65. Then, the lifting mechanism 61 lowers the inverting chuck 43 to an immersion height HP4. This state is shown in FIG. 10. At this time, for example, the front surfaces (processing surfaces) of the multiple substrates W are facing one side in the width direction Y. This initiates processing of the multiple substrates W with the chemical liquid. Next, assuming that the processing time with the chemical liquid is T hours, for example, when it reaches T / 2 hours, the rotation mechanism 65 is operated. Then, the orientations of the multiple substrates W are changed by 180 degrees. That is, the multiple substrates W are placed in a vertical orientation with their tops and bottoms reversed. This causes the back surfaces (non-processing surfaces) to face one side in the width direction Y. The multiple substrates W are then rotated so that their upper portions are positioned at the bottom and their lower portions are positioned at the top. Then, for example, after the time T / 2 has elapsed, the wafer is moved to another processing tank BB for cleaning.

[0146] According to this operation example, multiple substrates W are processed with the processing liquid in the immersion tank DB, and the rotation mechanism 65 drives the inversion chuck 43 around the axis AX1 to invert the multiple substrates W upside down. This allows the upper and lower portions of the substrates W to be swapped. Therefore, even if the progress of processing differs between the upper and lower portions of the substrates W, the progress of processing can be averaged by swapping them. As a result, the in-plane uniformity of processing on the substrates W can be improved.

[0147] In the above-described operation example, the top and bottom are swapped every T / 2 hours out of the processing time of T hours. However, this is not limited to this, and the time can be allocated according to the variation in the progress of processing on the top and bottom. Also, the top and bottom may be flipped multiple times.

[0148] The present invention is not limited to the above-described embodiment, but can be modified as follows.

[0149] (1) In the above-described embodiment, the drive mechanism 63 is driven by the air cylinder 63b, but the present invention is not limited to this configuration. For example, an air-operated rotary actuator or a linear motor may be used instead of the air cylinder 63b.

[0150] (2) In the above-described embodiment, the transmission mechanisms 67, 67A are configured using the drive pulley 67b and the first bevel gear 67Ad, but the present invention is not limited to such a configuration. In other words, as long as the driving force of the motors 65b, 65Ab can be transmitted to the reversing chuck 43, the present invention is not limited to such a configuration.

[0151] (3) In the above-described embodiment, the lifting mechanism 63 includes the motor 61c and the threaded shaft 61b. However, the present invention is not limited to this configuration. For example, instead of the motor 61c and the threaded shaft 61b, a plurality of air cylinders or a multi-stage air cylinder may be used.

[0152] (4) In the above-described embodiment, the substrate processing apparatus 1 is configured such that the batch processing apparatus 3 and the single wafer processing apparatus 5 are connected by the bridge section 7. However, the present invention can also be applied to a single substrate processing apparatus 1 that includes the batch processing apparatus 3 and the single wafer processing apparatus 5 in the same housing. [Explanation of symbols]

[0153] 1... Substrate processing equipment W: Substrate 3... Batch processing equipment 5... Single wafer processing equipment 7 … Bridging Section 7 9... Loading block 11... Stocker block 13...Transfer block 15... Posture change block 17 ... Processing block 19 … Input section C...Career BPU: Batch processing unit BB: Treatment tank LF... Lifter TFC... 25-piece zipper 31 … Standby tank 33... Posture change tank BB0: Treatment tank LF0 ... Lifter DB … Immersion tank 41 ... Posture conversion unit 43... Reversing chuck WD1...first interval WD2: Second interval 45 ... Chuck member 47 ... Groove 50 … Supply pipe 61 ... Lifting mechanism 61a ... Base member 61b … Spiral shaft 61c...motor 61d ... Lifting member 61e ... Lifting frame 63 ... Drive mechanism 63a ... Upper base member 63b ... Air cylinder 63c … Moving piece 63d ... Arm pull-ups 63e ... Linear guide 65... Rotation mechanism 65a … Rotating axis 65b ... Motor 65c ... sealing material 67...Transmission mechanism 67a ... driven pulley 67b ... Drive pulley 67c ... timing belt 69 ... container AX1 … Axis core HP1 … Acceptance height HP2: Clamping height BR... Bridge Robot 81 ... Carry-out block 83 ... Indexer block 85 ... Processing block 87 ... Unloading section IR... Indexer robot TW1~TW4 ... Tower CR... Center robot 93 … Delivery department

Claims

1. In a liquid posture change device for changing the posture of a plurality of substrates, an immersion tank for storing a processing liquid; an inversion chuck for holding a plurality of substrates; an opening / closing drive mechanism that drives the inversion chuck to an open position for transferring the plurality of substrates between the inversion chuck and the opening / closing drive mechanism and to a holding position for holding the plurality of substrates by the inversion chuck; a rotation drive mechanism that drives the inversion chuck around a horizontal axis to change the postures of the plurality of substrates; a lifting drive mechanism for lifting the inversion chuck between a transfer position above the immersion tank and a conversion position within the immersion tank; Equipped with a rotation drive mechanism for driving the inverting chuck around a horizontal axis after the inverting chuck is lowered to the conversion position by the lifting drive mechanism after being raised to the transfer position by the lifting drive mechanism and then the inverting chuck is moved to the open position by the open / close drive mechanism to receive the plurality of substrates, and after the inverting chuck is moved to the holding position by the open / close drive mechanism, the rotation drive mechanism for driving the inverting chuck around a horizontal axis after the inverting chuck is lowered to the conversion position by the lifting drive mechanism.

2. 2. The submerged attitude change device according to claim 1, the rotation drive mechanism includes a rotation shaft having one end connected to the outside of the reversing chuck, a motor, and a transmission mechanism that transmits a rotational force of the motor to the rotation shaft; a container with a bottom that houses the rotating shaft and the transmission mechanism; The liquid attitude change device is characterized in that the transmission mechanism is raised and lowered together with the container by the elevation drive mechanism.

3. 3. The submerged attitude change device according to claim 2, The transmission mechanism comprises a driven pulley provided on the other end of the rotating shaft, a driving pulley attached to the motor, and a timing belt stretched between the driven pulley and the driving pulley.

4. 3. The submerged attitude change device according to claim 2, The transmission mechanism comprises a first bevel gear provided on the other end of the rotating shaft, an extension shaft connected to the motor, and a second bevel gear provided on the lower end of the extension shaft and threadedly engaged with the first bevel gear.

5. 5. The submerged attitude change device according to claim 2, the lifting drive mechanism includes a lifting frame on which the rotation drive mechanism is mounted and which extends outside the immersion tank and the container; The submerged attitude change device is characterized in that the opening and closing drive mechanism is mounted on the lifting frame.

6. 5. The submerged attitude change device according to claim 4, The liquid attitude change device is characterized in that the inside of the container is pressurized with gas.

7. In a substrate processing apparatus for processing a substrate, a batch processing unit that processes a plurality of substrates in a vertical position at once; a single-substrate processing unit that processes a single substrate in a horizontal position; a submerged position changing unit that changes the position of the plurality of substrates that have been processed in the batch processing unit from a vertical position to a horizontal position in the processing liquid; a first transfer unit that transfers the plurality of substrates that have been processed in the batch processing unit to the submerged posture changing unit; a second transfer unit that transfers the plurality of substrates that have been horizontally positioned by the submerged position conversion unit to the single-wafer processing unit; Equipped with The submerged attitude change unit is an immersion tank for storing a processing liquid; an inversion chuck for holding a plurality of substrates; an opening / closing drive mechanism that drives the inversion chuck to an open position for transferring the plurality of substrates between the inversion chuck and the opening / closing drive mechanism and to a holding position for holding the plurality of substrates by the inversion chuck; a rotation drive mechanism that drives the inversion chuck around a horizontal axis to convert the orientations of the plurality of substrates between a vertical orientation and a horizontal orientation; a lifting drive mechanism for lifting the inversion chuck between a transfer position above the immersion tank and a conversion position within the immersion tank; Equipped with a rotation drive mechanism for driving the inverting chuck around a horizontal axis to convert the substrates from a vertical position to a horizontal position, the ...

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