Transport System and Aligner Module

Abstract

To reduce installation area for a substrate processing system.SOLUTION: A substrate conveyance system includes: an atmospheric air conveyance module having a first side wall and a second side wall opposite to the first side wall; a load lock module attached to the first side wall; a load port attached to the second side wall; and a substrate conveyance robot provided in the atmospheric air conveyance module. The substrate conveyance robot includes a base, a substrate conveyance arm, and a rectification unit. The base reciprocates along the first side wall. The substrate conveyance arm is provided on the base. The rectification unit surrounds the base and, when the base moves, creates a flow of air in a lower oblique direction with respect to a direction opposite to the movement direction of the base.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] Various aspects and embodiments of the present disclosure relate to transport systems and aligner modules. [Background technology]

[0002] A semiconductor manufacturing apparatus is known that includes a load lock chamber and a transfer chamber connected to the load lock chamber for transferring substrates under atmospheric conditions, and that includes a transfer device provided within the transfer chamber (see, for example, Patent Document 1 below). The transfer device moves along the length of the transfer chamber and transfers substrates between the load lock chamber and the transfer chamber. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-18875 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a transport system and aligner module that can reduce the footprint of a substrate processing system. [Means for solving the problem]

[0005] One aspect of the present disclosure provides a substrate transfer system, including an atmospheric transfer module having a first sidewall and a second sidewall opposite the first sidewall, a load lock module attached to the first sidewall, a load port attached to the second sidewall, and a substrate transfer robot provided within the atmospheric transfer module. The substrate transfer robot has a base, a substrate transfer arm, and an airflow rectifier. The base reciprocates along the first sidewall. The substrate transfer arm is provided on the base. The airflow rectifier surrounds the base and, when the base moves, creates an air flow in a diagonally downward direction opposite to the movement direction of the base. [Effects of the Invention]

[0006] Various aspects and embodiments of the present disclosure may reduce the footprint of a substrate processing system. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a plan view showing an example of a substrate processing system according to the first embodiment. [Figure 2] FIG. 2 is a view showing an example of a cross section taken along line AA of the substrate processing system in FIG. [Figure 3] FIG. 3 is a view showing an example of a cross section taken along line BB of the atmospheric transfer module in FIG. [Figure 4] FIG. 4 is a plan view showing an example of the outer shape of a cover of a transport robot. [Figure 5] FIG. 5 is a side view showing an example of a transport robot. [Figure 6] FIG. 6 is a side view showing another example of the transport robot. [Figure 7] FIG. 7 is a side view showing an example of a transfer robot in which a plurality of blades are provided on a base. [Figure 8] FIG. 8 is a diagram illustrating an example of an end effector. [Figure 9] FIG. 9 is a diagram showing an example of the end effector when transporting an ER (edge ​​ring). [Figure 10] FIG. 10 is a diagram showing an example of the end effector when transporting a substrate. [Figure 11] FIG. 11 is a plan view showing an example of a substrate processing system according to the second embodiment. [Figure 12] FIG. 12 is a view showing an example of a cross section taken along line AA of the substrate processing system in FIG. [Figure 13] FIG. 13 is a side view showing an example of an aligner module. [Figure 14] FIG. 14 is a plan view showing an example of an aligner module. [Figure 15]FIG. 15 is a plan view showing an example of the positional relationship between the aligner module, the ER, and the end effector when the ER is carried into the aligner module. [Figure 16] FIG. 16 is a side view showing an example of the positional relationship between the aligner module and the ER when the ER is placed on lift pins. [Figure 17] FIG. 17 is a side view showing an example of the positional relationship between the aligner module and the ER when the ER is placed on the ER support pad. [Figure 18] FIG. 18 is a diagram showing an example of a change in the amount of received light accompanying the rotation of the ER. [Figure 19] FIG. 19 is a plan view showing an example of the positional relationship between the aligner module, the substrate, and the end effector when the substrate is carried into the aligner module. [Figure 20] FIG. 20 is a side view showing an example of the positional relationship between the aligner module and the substrate when the substrate is placed on the substrate support pad. [Figure 21] FIG. 21 is a diagram showing an example of a change in the amount of received light accompanying the rotation of the substrate. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, embodiments of a transfer system and an aligner module will be described in detail with reference to the drawings. Note that the disclosed transfer system and aligner module are not limited to the following embodiments.

[0009] Increasing the number of substrates that can be processed per unit time can be achieved by increasing the number of processing modules that perform processing on the substrates. Increasing the number of processing modules increases the size of the substrate processing system, which includes multiple processing modules, vacuum transfer modules, load lock modules, and atmospheric transfer modules. As the size of the substrate processing system increases, the installation area (footprint) of the substrate processing system in a facility such as a clean room increases, making it difficult to arrange multiple substrate processing systems. Therefore, there is a demand for reducing the installation area of ​​the substrate processing system.

[0010] Therefore, the present disclosure provides a technique that can reduce the installation area of ​​a substrate processing system.

[0011] (First embodiment) [Configuration of substrate processing system 1] Fig. 1 is a plan view showing an example of the configuration of a substrate processing system 1 in a first embodiment. Fig. 2 is a view showing an example of an AA cross section of the substrate processing system 1 in Fig. 1. Fig. 3 is a view showing an example of a BB cross section of an atmospheric transfer module 17 in Fig. 2. For convenience, Fig. 1 shows some internal components of the apparatus in a transparent manner. The substrate processing system 1 includes a main body 10 and a control device 100 that controls the main body 10.

[0012] The main body 10 includes a vacuum transfer module 11, multiple substrate processing modules 12, multiple load lock modules 13, multiple storage modules 14, and a substrate aligner module 15. The main body 10 also includes an ER (edge ​​ring) aligner module 16, an atmospheric transfer module 17, and multiple load ports 18. The multiple substrate processing modules 12 are connected to the vacuum transfer module 11 via corresponding gate valves G1. The gate valves G1 are attached to the side walls of the vacuum transfer module 11. The multiple storage modules 14, the substrate aligner modules 15, and the ER aligner module 16 are connected to the atmospheric transfer module 17 via corresponding openings. The openings are formed in a first side wall 172 of the atmospheric transfer module 17. FOUPs (Front Opening Unified Pods) arranged on the multiple load ports 18 can be connected to the atmospheric transfer module 17 through a second side wall 173 of the atmospheric transfer module 17. The plurality of load lock modules 13 are connected to the vacuum transfer module 11 via corresponding gate valves G2, and are connected to the atmospheric transfer module 17 via corresponding gate valves G3. The gate valves G2 are attached to a side wall of the vacuum transfer module 11, and the gate valves G3 are attached to a first side wall 172 of the atmospheric transfer module 17. That is, the plurality of load lock modules 13 are attached to the atmospheric transfer module 17 via corresponding gate valves G3.

[0013] A plurality of gate valves G1 are attached to the sidewall of the vacuum transfer module 11, and each gate valve G1 is attached to a substrate processing module 12. In the example of Fig. 1, four substrate processing modules 12 are connected to the vacuum transfer module 11, but the number of substrate processing modules 12 connected to the vacuum transfer module 11 may be three or less, or five or more.

[0014] Each substrate processing module 12 performs processes such as etching and film formation on a substrate W. In this embodiment, the substrate processing module 12 is a plasma processing module, and the plasma processing module performs plasma processes such as etching and film formation on a substrate W in a vacuum atmosphere. In this specification, "vacuum" means a pressure lower than atmospheric pressure, and may also be referred to as "reduced pressure" or "low pressure." Each substrate processing module 12 may be a module that performs the same process in a manufacturing process, or may be a module that performs different processes. Each substrate processing module 12 is provided with a stage on which the substrate W is placed, and an edge ring (hereinafter sometimes referred to as ER) is provided on the stage to surround the substrate W. The ER is consumed by plasma processes such as etching on the substrate W, and is replaced at predetermined intervals.

[0015] Furthermore, a plurality of load lock modules 13 are connected to the side wall of the vacuum transfer module 11 via gate valves G2. In the example of Fig. 1, two load lock modules 13 are connected to the vacuum transfer module 11, but the number of load lock modules 13 connected to the vacuum transfer module 11 may be one, or three or more.

[0016] A transfer robot 110 is provided within the vacuum transfer module 11. The transfer robot 110 functions as a substrate transfer robot that transfers a substrate W between the substrate processing module 12 and the load lock module 13. The transfer robot 110 also functions as an ER transfer robot that transfers an ER between the substrate processing module 12 and the load lock module 13. Therefore, the transfer robot 110 as a substrate transfer robot can also transfer an edge ring. A predetermined pressure (hereinafter, sometimes referred to as low pressure) lower than atmospheric pressure is maintained within the vacuum transfer module 11. In this embodiment, the vacuum transfer module 11 is configured to transfer a substrate or an edge ring in a vacuum atmosphere. In this embodiment, the substrate or the edge ring is transferred between the vacuum transfer module 11 and the substrate processing module 12 by the transfer robot 110 via the gate valve G1 in a vacuum atmosphere. In this embodiment, the substrate or the edge ring is transferred between the vacuum transfer module 11 and the load lock module 13 by the transfer robot 110 via the gate valve G2 in a vacuum atmosphere.

[0017] Each load lock module 13 is connected to the atmospheric transfer module 17 via a gate valve G3. When the substrate W or ER is transferred from the atmospheric transfer module 17 into the load lock module 13 via the gate valve G3, the gate valve G3 is closed and the pressure inside the load lock module 13 is reduced from atmospheric pressure to a low pressure. Then, the gate valve G2 is opened and the substrate W or ER inside the load lock module 13 is transferred into the vacuum transfer module 11.

[0018] Furthermore, when the substrate W or ER is transferred from the vacuum transfer module 11 into the load lock module 13 via the gate valve G2 while the pressure inside the load lock module 13 is low, the gate valve G2 is closed. Then, the pressure inside the load lock module 13 is increased from the low pressure to atmospheric pressure. Then, the gate valve G3 is opened, and the substrate W or ER inside the load lock module 13 is transferred into the atmospheric transfer module 17.

[0019] A plurality of load ports 18 are attached to a second side wall 173 opposite to the first side wall 172 to which the load lock modules 13 are attached. Therefore, the atmospheric transfer module 17 has a first side wall 172 and a second side wall 173 opposite to the first side wall 172. The plurality of load lock modules 13 are attached to the first side wall 172, and the plurality of load ports 18 are attached to the second side wall 173. A FOUP that accommodates a plurality of substrates W is connected to each load port 18. A FOUP that accommodates an ER is also connected to the load port 18.

[0020] A transfer robot 20 is provided within the atmospheric transfer module 17. The transfer robot 20 is an example of a substrate transfer robot. The transfer robot 20 functions as a substrate transfer robot that transfers a substrate W between a FOUP arranged on the load port 18, the load lock module 13, the storage module 14, and the substrate aligner module 15. The transfer robot 20 also functions as an ER transfer robot that transfers an ER between a FOUP arranged on the load port 18, the load lock module 13, and the ER aligner module 16. Therefore, the transfer robot 20 as a substrate transfer robot can also transfer an edge ring. In this embodiment, the atmospheric transfer module 17 is configured to transfer a substrate or an edge ring in an atmospheric pressure atmosphere. In this embodiment, the substrate or the edge ring is transferred by the transfer robot 20 between the FOUP, the load lock module 13, the storage module 14, and the substrate aligner module 15 in an atmospheric pressure atmosphere. A guide rail 170 is attached to a first side wall 172 of the atmospheric transfer module 17 on the load lock module 13 side. In this embodiment, as shown in FIG. 3 , the first side wall 172 has an upper portion 172a and a lower portion 172b. A thickness T2 of the lower portion 172b is smaller than a thickness T1 of the upper portion 172a. The load lock modules 13, the storage modules 14, the substrate aligner module 15, and the ER aligner module 16 are attached to the upper portion 172a. The guide rail 170 is attached to the lower portion 172b. The transfer robot 20 is mounted on a carrier 171, which moves back and forth in a movement direction M along the guide rail 170. As the carrier 171 moves back and forth in the movement direction M along the guide rail 170, the transfer robot 20 also moves back and forth within the atmospheric transfer module 17 in the movement direction M along the guide rail 170.

[0021] As described above, in this embodiment, the guide rails 170 are attached to the first sidewall 172 to which the load lock module 13 is attached, and the transfer robot 20 mounted on the carrier 171 reciprocates along the guide rails 170. This allows a drive mechanism for moving the carrier 171 to be disposed below the load lock module 13. In this embodiment, the distance D between the first sidewall 172 and the second sidewall 173 (e.g., the depth dimension shown in FIG. 3 ) is, for example, 700 mm or less. This allows the substrate processing system 1 to be miniaturized. Furthermore, by making the lower portion 172b of the first sidewall 172 thinner than the upper portion 172a, the guide rails 170 can be prevented from protruding into the atmospheric transfer module 17. This allows the depth dimension D of the atmospheric transfer module 17 to be further reduced. In other words, it is possible to maintain sufficient transfer space within the atmospheric transfer module 17 without increasing the depth dimension D of the atmospheric transfer module 17.

[0022] Furthermore, in this embodiment, the transfer robot 20 moves at a speed of 800 mm / s or more along the guide rails 170 within the atmospheric transfer module 17. This reduces the time required to transfer the substrates W and ER, and increases the number of substrates W that can be processed per unit time.

[0023] The substrate aligner module 15 is disposed between one load lock module 13 and one storage module 14. The ER aligner module 16 is disposed between the other load lock module 13 and the other storage module 14. In this embodiment, the storage module 14, the substrate aligner module 15, and the ER aligner module 16 are disposed on the side of the load lock module 13, between the substrate processing module 12 and the atmospheric transfer module 17. This allows the installation area of ​​the substrate processing system 1 to be reduced.

[0024] Each storage module 14 temporarily stores unprocessed and processed substrates W. The substrate aligner module 15 adjusts the orientation of the substrate W transferred into the substrate aligner module 15. The substrate W, whose orientation has been adjusted, is transferred from the substrate aligner module 15 into the atmospheric transfer module 17 by the transfer robot 20, and then transferred from the atmospheric transfer module 17 into the load lock module 13 via the gate valve G3. The ER aligner module 16 adjusts the orientation of the ER transferred into the ER aligner module 16. The ER, whose orientation has been adjusted, is transferred from the ER aligner module 16 into the atmospheric transfer module 17 by the transfer robot 20, and then transferred from the atmospheric transfer module 17 into the load lock module 13 via the gate valve G3.

[0025] An FFU (Fan Filter Unit) 175 is provided above the atmospheric transfer module 17. The FFU 175 supplies air from which particles and the like have been removed (hereinafter referred to as clean air) into the atmospheric transfer module 17 from above the atmospheric transfer module 17.

[0026] A perforated floor 176 is provided at the bottom of the atmospheric transfer module 17, and an exhaust device 177 that exhausts clean air from the atmospheric transfer module 17 is connected below the perforated floor 176. Clean air supplied from the FFU 175 is exhausted by the exhaust device 177 through the perforated floor 176, thereby forming a downflow of clean air within the atmospheric transfer module 17. This makes it possible to suppress the upflow of particles and the like within the atmospheric transfer module 17. Note that the exhaust device 177 preferably controls the pressure within the atmospheric transfer module 17 so that the pressure within the atmospheric transfer module 17 is positive. This makes it possible to suppress the intrusion of particles and the like into the atmospheric transfer module 17 from the outside.

[0027] As shown in FIG. 2 , the transfer robot 20 includes a base 21, a transfer arm 22, an end effector 23, and a cover 24. The base 21 is elongated and houses a drive mechanism, such as a motor, that drives the transfer arm 22. The base 21 is mounted on a carrier 171 and moves along a guide rail 170 as the carrier 171 moves. The transfer arm 22 moves the end effector 23 attached to its tip. The transfer arm 22 is an example of a substrate transfer arm. That is, the substrate transfer arm is capable of transporting a substrate W. In this embodiment, the transfer arm 22 as a substrate transfer arm is also capable of transporting an edge ring. The end effector 23 holds the substrate W and the ER. The cover 24 surrounds the base 21 and creates an airflow obliquely downward relative to the direction of movement of the base 21 when the base 21 moves along the guide rail 170. The cover 24 is an example of a rectifying unit. In the present embodiment, the cover 24 and the base 21 as the rectifying unit are described as separate, separable members, but the disclosed technology is not limited to this. In another embodiment, the rectifying unit and the base 21 may be integrated.

[0028] The control device 100 has a memory, a processor, and an input / output interface. Data such as recipes, programs, etc. are stored in the memory. The memory is, for example, a random access memory (RAM), a read-only memory (ROM), a hard disk drive (HDD), or a solid state drive (SSD). The processor executes a program read from the memory, thereby controlling each part of the main body 10 via the input / output interface based on data such as recipes stored in the memory. The processor is, for example, a central processing unit (CPU) or a digital signal processor (DSP).

[0029] [Cover 24 Details] FIG. 4 is a plan view showing an example of the outer shape of the cover 24 of the transfer robot 20. FIG. 4 illustrates an example of the outer shape of the cover 24 when viewed from above. In this embodiment, the cover 24 has an inclined side surface, which will be described later. The inclined side surface has a first portion and a second portion. The first portion is formed on the side of the movement direction M1 of the cover 24, and the second portion is formed on the side of the movement direction M2 of the cover 24. When viewed from above (in a plan view), the first portion has an outer shape that tapers toward the movement direction M1. In this embodiment, the first portion has a streamlined outer shape that tapers toward the movement direction M1 in a plan view. As a result, when the transfer robot 20 moves in the movement direction M1 along the guide rail 170, an air flow is created in a direction D1 that is oblique to the opposite direction to the movement direction M1.

[0030] In this embodiment, the second portion has an outer shape that tapers toward the movement direction M2 when viewed from above (in a plan view). In this embodiment, the second portion has a streamlined outer shape that tapers toward the movement direction M2 when viewed in a plan view. This creates an air flow in a direction D2 that is oblique to the opposite direction to the movement direction M2 when the transfer robot 20 moves along the guide rail 170 in the movement direction M2.

[0031] This makes it possible to suppress air turbulence caused by the movement of the transfer robot 20, even when the distance between the first sidewall 172 of the atmospheric transfer module 17 on the load lock module 13 side and the second sidewall 173 of the atmospheric transfer module 17 opposite the first sidewall 172 is short. This prevents particles and the like that are stirred up inside the atmospheric transfer module 17 by the movement of the transfer robot 20 from adhering to the substrate W or ER held by the end effector 23.

[0032] FIG. 5 is a side view showing an example of the transfer robot 20. For example, as shown in FIG. 5, in this embodiment, the cover 24 has an outer shape in which the cross-sectional area increases from the bottom to the top. In addition, in this embodiment, an inclined surface is provided at the front of the cover 24 in the movement direction, with a normal line extending diagonally downward relative to the movement direction. In this embodiment, the cover 24 has inclined side surfaces, a lower end, and an upper end, and the inclined side surfaces increase in width from the lower end to the upper end in a plan view. This creates an airflow directed diagonally downward.

[0033] In the example of Fig. 5, an inclined surface is formed in the front portion of the cover 24 in the movement direction M1, with the normal line being a straight line extending in a direction D3 diagonally downward with respect to the movement direction M1. Furthermore, an inclined surface is formed in the front portion of the cover 24 in the movement direction M2, with the normal line being a straight line extending in a direction D4 diagonally downward with respect to the movement direction M2. In this embodiment, the cover 24 has an outer shape that is, for example, a truncated cone. Note that in other embodiments, the cover 24 may have an outer shape that is, for example, a truncated pyramid.

[0034] As a result, when the transfer robot 20 moves in the movement direction M1, an air flow is created along the cover 24 in a direction D1 that is obliquely downward with respect to the direction opposite to the movement direction M1, as shown in Fig. 5, for example. Furthermore, when the transfer robot 20 moves in the movement direction M2, an air flow is created along the cover 24 in a direction D2 that is obliquely downward with respect to the direction opposite to the movement direction M2, as shown in Fig. 5, for example. This prevents particles and the like that are blown up in the atmospheric transfer module 17 by the movement of the transfer robot 20 from adhering to the substrate W or ER held by the end effector 23.

[0035] The outer shape of the cover 24 may be streamlined, as shown in Fig. 6, as long as it tapers in the direction of movement when viewed from above and has an outer shape in which the cross-sectional area increases from bottom to top. In this case, the first and second portions of the inclined side surface have streamlined protrusions (streamline noses). Fig. 6 is a side view showing another example of the transfer robot 20.

[0036] 7, for example, a plurality of blades 25a and 25b may be provided on the base 21 instead of the cover 24. FIG. 7 is a side view showing an example of a transfer robot 20 in which a plurality of blades 25 are provided on the base 21.

[0037] The blades 25a are provided on the outer wall of the base 21 so as to extend obliquely downward relative to the direction opposite to the movement direction M1. In the example shown in FIG. 7, the blades 25a are provided on the front side of the base 21, but they are also provided on the rear side of the base 21. As a result, when the transport robot 20 moves in the movement direction M1, an air flow is created along each blade 25a in a direction D1, which is obliquely downward relative to the direction opposite to the movement direction M1. The front blades 25a and the rear blades 25a, which are at the same height, may be connected or separated. That is, the first portion of the inclined side surface may have multiple mountain-shaped blades 25a arranged vertically and extending obliquely downward. The first portion of the inclined side surface may also have multiple pairs of left and right blades 25a arranged vertically and extending obliquely downward.

[0038] Furthermore, the multiple blades 25b are provided on the outer wall of the base 21 so as to extend diagonally downward relative to the direction opposite to the movement direction M2. In the example shown in FIG. 7, the multiple blades 25b are provided on the front side of the base 21, but they are also provided on the rear side of the base 21. As a result, when the transfer robot 20 moves in the movement direction M2, an air flow is created along each blade 25b in a direction D2, which is diagonally downward relative to the direction opposite to the movement direction M2. Furthermore, the front blades 25b and the rear blades 25b at the same height may be connected or separated. That is, the first portion of the inclined side surface may have multiple mountain-shaped blades 25b arranged vertically and extending diagonally downward. Furthermore, the first portion of the inclined side surface may have multiple pairs of left and right blades 25b arranged vertically and extending diagonally downward. Even with this configuration, particles and the like that are stirred up in the atmospheric transfer module 17 by the movement of the transfer robot 20 are prevented from adhering to the substrate W or ER held by the end effector 23. Note that a plurality of blades 25a and 25b illustrated in Fig. 7 may be provided on the outer wall of the cover 24 illustrated in Fig. 5 or 6.

[0039] [Configuration of end effector 23] 8 is a diagram showing an example of the end effector 23. The end effector 23 has a main body 230, a plurality of ER holding pads 231, and a plurality of substrate holding pads 232. The ER holding pads 231 are an example of an ER holding portion, and the substrate holding pads 232 are an example of a substrate holding portion.

[0040] The plurality of ER holding pads 231 hold the ERs, for example, as shown in Fig. 9. The plurality of substrate holding pads 232 hold the substrate W, for example, as shown in Fig. 10. The main body 230 may be provided with a suction mechanism for the ER that suction-holds the ERs, and a suction mechanism for the substrate W that suction-holds the substrate W. This allows the substrate W and the ER to be stably held even when the end effector 23 moves at high speed.

[0041] The first embodiment has been described above. As described above, the substrate processing system 1 in this embodiment includes an atmospheric transfer module 17 having a first sidewall 172 and a second sidewall 173 opposite the first sidewall 172, a load lock module 13 attached to the first sidewall 172, a load port 18 attached to the second sidewall 173, and a transfer robot 20 provided within the atmospheric transfer module 17. The transfer robot 20 includes a base 21, a transfer arm 22, and a cover 24. The base 21 reciprocates along the first sidewall 172. The transfer arm 22 is provided on the base 21. The cover 24 surrounds the base 21, and when the base 21 moves, creates an air flow in a diagonally downward direction opposite to the movement direction of the base 21. This makes it possible to suppress air turbulence caused by the reciprocating movement of the transfer robot 20, even when the distance between the first side wall 172 and the second side wall 173 is short. This makes it possible to reduce the size of the atmospheric transfer module 17 while suppressing particles and the like from being stirred up due to the movement of the transfer robot 20. Therefore, the installation area of ​​the substrate processing system 1 including the atmospheric transfer module 17 can be reduced.

[0042] In addition, in the first embodiment described above, the cover 24 has inclined sides, a lower end, and an upper end, and the inclined sides widen from the lower end to the upper end when viewed in a plane, thereby creating an air flow in a diagonally downward direction.

[0043] In the first embodiment described above, the inclined side surface of the cover 24 has a first portion in the movement direction and a second portion on the opposite side, and each of the first portion and the second portion has an outer shape that tapers toward the movement direction in a plan view. This allows an air flow to be created along the cover 24 in a diagonally downward direction opposite to the movement direction when the transfer robot 20 moves.

[0044] In the first embodiment described above, the airflow regulating section may be a blade 25 extending diagonally downward relative to the direction opposite to the movement direction. Even with this configuration, when the transport robot 20 moves, an airflow can be created along the cover 24 in a diagonally downward direction relative to the direction opposite to the movement direction.

[0045] The substrate processing system 1 in the first embodiment described above further includes guide rails 170 provided in the atmospheric transfer module 17 and attached to the first side wall 172. The base 21 reciprocates along the guide rails 170. This allows a drive mechanism for moving the carrier 171 and the like to be disposed below the load lock module 13. This allows the installation area of ​​the substrate processing system 1 to be reduced.

[0046] In the first embodiment described above, the first sidewall 172 has an upper portion and a lower portion, the load lock module 13 is attached to the upper portion, the guide rail 170 is attached to the lower portion, and the thickness of the lower portion is smaller than the thickness of the upper portion. This prevents the guide rail 170 from protruding into the atmospheric transfer module 17. This makes it possible to further reduce the depth dimension of the atmospheric transfer module 17. In other words, it is possible to maintain a sufficient transfer space within the atmospheric transfer module 17 without increasing the depth dimension of the atmospheric transfer module 17.

[0047] In the first embodiment described above, the distance between the first sidewall 172 and the second sidewall 173 is 700 mm or less, which allows the installation area of ​​the substrate processing system 1 to be reduced.

[0048] In the first embodiment described above, the movement speed of the transfer robot 20 is 800 mm / s or more, which makes it possible to increase the number of substrates W that can be processed per unit time.

[0049] Furthermore, the substrate processing system 1 in the first embodiment described above includes a substrate aligner module 15 attached to the first sidewall 172 to adjust the positional deviation of the substrate W. This allows the installation area of ​​the substrate processing system 1 to be reduced.

[0050] Furthermore, the substrate processing system 1 in the first embodiment described above includes an ER aligner module 16 attached to the first sidewall 172 to adjust the positional deviation of the ER, and the transfer arm 22 can further transfer the ER. This allows the installation area of ​​the substrate processing system 1 that automatically replaces the ER to be reduced.

[0051] In the first embodiment described above, the transport arm 22 has an end effector 23 having both the ER holding pad 231 and the substrate holding pad 232. This allows the transport robot 20 to transport the substrate W and the ER.

[0052] The atmospheric transfer module 17 in the first embodiment described above includes a first sidewall 172 and a second sidewall 173 opposite the first sidewall 172, and is equipped with a transfer robot 20. The transfer robot 20 includes a base 21, a transfer arm 22, and a cover 24. The base 21 reciprocates along the first sidewall 172. The transfer arm 22 is mounted on the base 21. The cover 24 surrounds the base 21 and, as the base 21 moves, creates an airflow diagonally downward relative to the direction of movement of the base 21. This suppresses air turbulence caused by the movement of the transfer robot 20, even when the distance between the first sidewall 172 and the second sidewall 173 is shortened. This suppresses particles and other particles from being stirred up during the movement of the transfer robot 20, while minimizing the size of the atmospheric transfer module 17. This reduces the installation area of ​​the substrate processing system 1 including the atmospheric transfer module 17.

[0053] (Second embodiment) The substrate processing system 1 in the first embodiment is provided with a separate substrate aligner module 15 and an ER aligner module 16. In contrast, the substrate processing system 1 in the present embodiment is provided with a single aligner module 30 that has the functions of the substrate aligner module 15 and the ER aligner module 16. This allows the installation area of ​​the substrate processing system 1 to be further reduced.

[0054] [Configuration of substrate processing system 1] FIG. 11 is a plan view showing an example of the configuration of a substrate processing system 1 in the second embodiment. FIG. 12 is a view showing an example of an AA cross section of the substrate processing system 1 in FIG. 11. In FIG. 11, for convenience, some of the internal components of the apparatus are illustrated as being transparent. The vacuum transfer module 11 includes a main body 10 and a control device 100 that controls the main body 10. Note that, except for the points described below, components in FIG. 11 that are assigned the same reference numerals as those in FIG. 1 have the same or similar functions as the components illustrated in FIG. 1, and therefore description thereof will be omitted.

[0055] The main body 10 includes a vacuum transfer module 11 , a plurality of substrate processing modules 12 , a plurality of load lock modules 13 , a plurality of storage modules 14 , an atmospheric transfer module 17 , a plurality of load ports 18 , and an aligner module 30 .

[0056] In this embodiment, a plurality of storage modules 14 are arranged on the side of one load lock module 13. In addition, an aligner module 30 is arranged between the other load lock module 13 and the other storage module 14.

[0057] The aligner module 30 adjusts the orientation of the substrate W carried into the aligner module 30. The substrate W whose orientation has been adjusted is carried out of the aligner module 30 by the transfer robot 20 and carried into the load lock module 13 via the gate valve G3. The aligner module 30 also adjusts the orientation of the ER carried into the aligner module 30. The ER whose orientation has been adjusted is carried out of the aligner module 30 by the transfer robot 20 and carried into the load lock module 13 via the gate valve G3.

[0058] [Structure of Aligner Module 30] Fig. 13 is a side view showing an example of an aligner module 30, and Fig. 14 is a plan view showing an example of the aligner module 30. The aligner module 30 includes a base 31, a rotating unit 32, a plurality of ER support pads 33, a plurality of substrate support pads 34, a plurality of lift pins 35, a light projecting unit 36, and a light receiving unit 37. The ER support pads 33 are an example of an ER support unit, and the substrate support pads 34 are an example of a substrate support unit. The light receiving unit 37 is an example of a detection unit.

[0059] The rotating unit 32 is provided on the pedestal 31. The plurality of ER support pads 33 and the plurality of substrate support pads 34 are provided on the rotating unit 32. The rotating unit 32 is rotated by a drive mechanism (not shown) provided in the pedestal 31. When the rotating unit 32 rotates, the plurality of ER support pads 33 and the plurality of substrate support pads 34 also rotate. The lift pins 35 are raised and lowered by a drive mechanism (not shown) provided in the pedestal 31. The rotating unit 32, each ER support pad 33, and each lift pin 35 are provided in positions that do not interfere with the end effector 23 when the end effector 23 on which the substrate W or ER is placed is inserted into the aligner module 30.

[0060] The light-projecting unit 36 ​​is a light source that emits light toward the light-receiving unit 37. The light-projecting unit 36 ​​is, for example, a light-emitting diode (LED) or a semiconductor laser. The light-receiving unit 37 detects the amount of light emitted from the light-projecting unit 36 ​​and outputs the detected amount of light to the control device 100. The light-receiving unit 37 is, for example, a line sensor such as a charge-coupled device (CCD) or a complementary metal oxide semiconductor (CMOS).

[0061] [Procedure for adjusting the position of the ER] Next, a procedure for adjusting the position of the ER in the aligner module 30 will be described with reference to FIGS.

[0062] 15, for example, with the lift pins 35 raised, the end effector 23 on which the ER is placed is inserted into the aligner module 30. The ER has an oriental flat (OF), which is a shape that serves as a reference for the position of the ER.

[0063] Next, the end effector 23 is lowered, and the ER mounted on the end effector 23 is placed on the lift pins 35, as shown in, for example, FIG.

[0064] Next, the lift pins 35 are lowered, and the ER is placed on the ER support pad 33, as shown in FIG. 17 . Then, the rotating unit 32 rotates, and the ER placed on the ER support pad 33 rotates. Then, light is irradiated from the light-projecting unit 36 ​​to the light-receiving unit 37, and the amount of light detected by the light-receiving unit 37 is output to the control device 100.

[0065] Here, if no OF is formed in the ER and the rotation axis of the rotating unit 32 is misaligned with the rotation axis of the ER, the amount of light detected by the light receiving unit 37 will fluctuate as the ER rotates, for example, as shown by curve L1 in Fig. 17. The amplitude of the fluctuation of curve L1 depends on the magnitude of the misalignment between the rotation axis of the rotating unit 32 and the rotation axis of the ER.

[0066] Furthermore, since an OF is formed in the ER, the amount of light detected by the light receiving unit 37 actually fluctuates, for example, as shown by curve L2 in Fig. 18. In curve L2, the portion surrounded by a dashed line represents the change in the amount of light when the OF passes between the light projecting unit 36 ​​and the light receiving unit 37. The control device 100 identifies the direction and magnitude of the deviation of the ER based on the amplitude of the change in the amount of light and the rotation angle of the ER when the OF passes.

[0067] Next, the lift pins 35 are raised, and the ER is placed on the lift pins 35. Then, the control device 100 controls the transfer robot 20 so that the end effector 23 is inserted into a position corresponding to the identified direction and magnitude of the deviation of the ER. Then, the end effector 23 is raised, and the ER is placed on the end effector 23. This makes it possible to adjust the deviation of the position of the ER.

[0068] [Adjustment procedure for misalignment of substrate W] Next, a procedure for adjusting the position of the substrate W in the aligner module 30 will be described with reference to FIGS.

[0069] 19, for example, with the lift pins 35 lowered, the end effector 23 on which the substrate W is placed is inserted into the aligner module 30. The substrate W has a notch (NC) formed therein, which is a shape that serves as a reference for the position of the substrate W.

[0070] Next, the end effector 23 is lowered, and the substrate W mounted on the end effector 23 is placed on the substrate support pad 34, as shown in Figure 20, for example. Then, the end effector 23 is retracted to the outside of the aligner module 30.

[0071] Next, the rotation of the rotating unit 32 rotates the substrate W placed on the substrate support pad 34. Then, light is irradiated from the light projecting unit 36 ​​to the light receiving unit 37, and the amount of light detected by the light receiving unit 37 is output to the control device 100.

[0072] Here, if no NC is formed on the substrate W and the rotation axis of the rotating unit 32 is misaligned with the rotation axis of the substrate W, the amount of light detected by the light receiving unit 37 will fluctuate as shown by curve L3 in Fig. 21 as the substrate W rotates. The amplitude of the fluctuation of curve L3 depends on the magnitude of the misalignment between the rotation axis of the rotating unit 32 and the rotation axis of the substrate W.

[0073] Furthermore, since an NC is formed on the substrate W, the amount of light detected by the light receiving unit 37 actually fluctuates, for example, as shown by the curve L4 in Fig. 21. In the curve L4, the portion surrounded by the dashed line represents the change in the amount of light when the NC passes between the light projecting unit 36 ​​and the light receiving unit 37. The control device 100 identifies the direction and magnitude of the deviation of the substrate W based on the amplitude of the fluctuation in the amount of light and the rotation angle of the substrate W when the NC passed.

[0074] Next, the control device 100 controls the transfer robot 20 so that the end effector 23 is inserted into a position corresponding to the identified direction and magnitude of the deviation of the substrate W. Then, the end effector 23 is raised, and the substrate W is placed on the end effector 23. This makes it possible to adjust the positional deviation of the substrate W.

[0075] The second embodiment has been described above. As described above, the substrate processing system 1 in this embodiment includes the aligner module 30 connected to the first side wall 172 of the atmospheric transfer module 17 on the load lock module 13 side. The aligner module 30 has a function of adjusting the positional deviation of the substrate W and a function of adjusting the positional deviation of the ER. The transfer arm 22 can also transfer the ER. This allows the installation area of ​​the substrate processing system 1 to be further reduced.

[0076] In the second embodiment described above, the aligner module 30 includes a rotation unit 32, an ER support pad 33, a substrate support pad 34, lift pins 35, and a light receiving unit 37. The lift pins 35 receive the ER from the transfer arm 22 serving as a substrate transfer arm. In other words, the transfer arm 22 serving as a substrate transfer arm transfers the ER from the atmospheric transfer module 17 to the aligner module 30, and places the ER on the transfer arm 22 on the lift pins 35. The ER support pad 33 receives the ER from the lift pins 35 and supports the ER. The substrate support pad 34 receives the substrate W from the transfer arm 22. In other words, the transfer arm 22 serving as a substrate transfer arm transfers the substrate W from the atmospheric transfer module 17 to the aligner module 30, and places the substrate W on the transfer arm 22 on the substrate support pad 34. The rotation unit 32 rotates the ER support pad 33 and the substrate support pad 34. This rotates the ER on the ER support pad 33 and the substrate W on the substrate support pad 34. The light receiving unit 37 detects the reference shape (notch) of the substrate W on the substrate support pad 34 while the substrate support pad 34 is being rotated by the rotation unit 32. The light receiving unit 37 also detects the reference shape (oriental flat) of the ER on the ER support pad 33 while the ER support pad 33 is being rotated by the rotation unit 32. This makes it possible to adjust the positional deviation of the substrate W and the ER.

[0077] It should be noted that the disclosed embodiments are illustrative in all respects and should not be considered limiting. Indeed, the above-described embodiments may be embodied in various forms. Furthermore, the above-described embodiments may be omitted, substituted, or modified in various forms without departing from the scope and spirit of the appended claims. [Explanation of symbols]

[0078] D1, D2 direction G Gate Valve L curve M Movement direction W substrate 1. Substrate Processing System 10 Main Unit 110 Transport Robot 11 Vacuum Transfer Module 12 Substrate Processing Module 13 Load Lock Module 14 Storage Module 15 Substrate Aligner Module 16 ER aligner modules 17 Atmospheric Transfer Module 170 guide rail 171 Career 172 First Side Wall 172a Upper part 172b lower part 173 Second Side Wall 175 FFU 176 Perforated floor 177 Exhaust system 18 Loading Port 100 control device 20 Transport robot 21 Foundation 22 Transfer arm 23 End Effector 230 Main Unit 231 ER Retention Pad 232 PCB holding pad 24 Cover 25 blades 30 Aligner Module 31 Pedestal 32 Rotating part 33 ER support pad 34 PCB support pad 35 Lift Pin 36 Light projector 37 Light receiving part

Claims

1. a load lock module; an atmospheric transfer module connected to the load lock module; a substrate transfer robot configured to transfer a substrate and an edge ring simultaneously or separately within the atmospheric transfer module; an aligner module connected to the atmospheric transfer module and configured to correct misalignment of the substrate and the edge ring; Equipped with The aligner module includes: a rotating section having a body having an upper surface that supports the substrate but does not support the edge ring, and a plurality of ring supports extending outward from the body, the ring supports supporting the edge ring but not supporting the substrate; a drive unit configured to rotate the rotating unit; A conveying system having:

2. The aligner module includes:

2. The transport system according to claim 1, further comprising a detection unit configured to detect a reference shape of the edge ring while the edge ring on the ring support is rotated by rotation of the rotation unit when the ring support supports the edge ring.

3. The transfer system according to claim 2 , wherein the detection unit is further configured to detect a reference shape of the substrate while the substrate on the upper surface of the main body is being rotated by rotation of the rotation unit when the upper surface of the main body supports the substrate.

4. the reference shape of the edge ring is an oriental flat; The transfer system according to claim 3 , wherein the reference shape of the substrate is a notch.

5. The detection unit a light projecting unit configured to project light in a vertical direction; a light receiving unit disposed above or below the light projecting unit and configured to receive the light emitted from the light projecting unit; The transport system of claim 4 , comprising:

6. a control device configured to determine a direction and magnitude of the edge ring displacement based on the rotation angle of the edge ring and the magnitude of the received light; The transport system of claim 5 further comprising:

7. The transfer system according to claim 6 , wherein the control device is further configured to determine a direction and a magnitude of the displacement of the substrate based on a rotation angle of the substrate and a magnitude of the received light.

8. The transfer system according to claim 1 , wherein the aligner module is disposed adjacent to the load lock module.

9. a vacuum transfer module connected to the load lock module; a substrate processing module connected to the vacuum transfer module; Furthermore, The transfer system of claim 1 , wherein the aligner module is disposed between the atmospheric transfer module and the substrate processing module.

10. a guide rail fixed to a side wall of the atmospheric transfer module; The transport system according to claim 1 , wherein the substrate transport robot is movable along the guide rail.

11. A rotating section having a main body whose upper surface supports a substrate but does not support an edge ring, and a plurality of ring support sections extending outward from said main body and supporting said edge ring but not supporting said substrate; a drive unit configured to rotate the rotating unit; and When the ring support portion supports the edge ring, detecting a reference shape of the edge ring while the edge ring on the ring support portion is rotating due to rotation of the rotating portion; a detection unit configured to detect a reference shape of the substrate while the substrate on the upper surface of the main body is being rotated by rotation of the rotation unit when the upper surface of the main body supports the substrate; When the reference shape of the edge ring is detected by the detection unit, a deviation of the edge ring is corrected based on a rotation angle of the edge ring; a control device configured to correct a misalignment of the substrate based on a rotation angle of the substrate when the reference shape of the substrate is detected by the detection unit; and An aligner module comprising:

12. The detection unit a light projecting unit configured to project light in a vertical direction; a light receiving unit disposed above or below the light projecting unit and configured to receive the light emitted from the light projecting unit; The aligner module of claim 11 , comprising:

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