Adsorbents and methods for reducing contamination within wafer container microenvironments

Abstract

The sorbents can be structured for use within the wafer container microenvironment. The loading of these sorbents can be tailored to the particular contaminants to be removed from the wafer container microenvironment. The loading can include one or more contaminant sorbents, where the contaminants include acids, bases, condensable organic compounds, and / or volatile organic compounds. The sorbents can further include moisture removal materials such as molecular sieves. The contaminants to be removed can be determined by testing the cleaning or staging conditions of the wafer container and previous sorbents used in the process.

Description

[Technical Field]

[0001] The present disclosure is directed to adsorbents configured for use with wafer containers and methods for using such adsorbents to target and remove contaminants from wafer containers. [Background technology]

[0002] Semiconductor wafer processing requires very clean conditions, however, cleaning and / or staging of the wafer container, some process chemicals, and outgassing from the wafer container itself can introduce contaminants into the microenvironment within the wafer container. Summary of the Invention

[0003] The present disclosure is directed to adsorbents configured for use with wafer containers and methods for using such adsorbents to target and remove contaminants from wafer containers.

[0004] By incorporating a sorbent into the wafer container, for example, by providing a sorbent that can fit into a wafer slot or dedicated receptacle within the wafer container, contaminants can be removed from the wafer container microenvironment, thereby improving the cleanliness and purity of the wafer container microenvironment and, therefore, the accuracy and yield of processes performed within the wafer container microenvironment.

[0005] Potential contaminants within a wafer container can vary significantly from application to application based on the process chemistries, cleaning and / or staging conditions being used, and differences in the sensitivity of a particular process to different contaminants. By adjusting the sorbent loading based on the specific application, the sorbent loading can increase its effectiveness in removing the contaminant of interest.

[0006] In one embodiment, a method for reducing contamination within a wafer container microenvironment includes determining one or more contaminants to remove from the wafer container microenvironment. The method further includes selecting one or more components for the sorbent medium based on the one or more contaminants. The method also includes determining a loading amount of each of the one or more components based on the one or more contaminants. The method further includes providing a sorbent material including the determined loading amount of each of the one or more components. The sorbent material is configured to be disposed within the wafer container microenvironment when a wafer is present in the wafer container microenvironment.

[0007] In one embodiment, one or more components of the adsorption medium are selected from the group consisting of carbon materials, molecular sieves, ion exchange resins, and zeolites.

[0008] In one embodiment, determining the one or more contaminants includes testing a sample sorbent disposed within the test wafer container microenvironment to absorb the potential contaminants.

[0009] In one embodiment, determining the loading amount of each of the one or more components includes testing a sample sorbent disposed within the test wafer container microenvironment to absorb potential contaminants.

[0010] In one embodiment, determining the one or more contaminants is based on ambient conditions during staging of the wafer container, which defines the wafer container microenvironment.

[0011] In one embodiment, determining the loading amount of each of the one or more components is based on the ambient conditions during staging of the wafer container, which defines the wafer container microenvironment.

[0012] In one embodiment, determining the one or more contaminants is based on the material composition of the wafer container that defines the wafer container microenvironment.

[0013] In one embodiment, determining the loading amount of each of the one or more components is based on the material composition of the wafer container that defines the wafer container microenvironment.

[0014] In one embodiment, determining the one or more constituent components is based on one or more materials used in a process occurring within the wafer container microenvironment.

[0015] In one embodiment, determining the loading amount of each of the one or more components is based on one or more materials used in the process occurring within the wafer container microenvironment.

[0016] In one embodiment, the wafer container defining the wafer container microenvironment is a Front Opening Integrated Pod (FOUP).

[0017] In one embodiment, the one or more contaminants are selected from the group consisting of inorganic acids, bases, volatile organic compounds, and condensable organic compounds.

[0018] In one embodiment, the adsorbent material is shaped so that it can fit into a wafer slot of a wafer container microenvironment, hi one embodiment, the adsorbent material has the same shape and dimensions as a wafer configured to be placed within the wafer container microenvironment.

[0019] In one embodiment, the method further includes disposing an adsorbent material within the wafer container microenvironment, the adsorbent material adsorbing one or more contaminants when the contaminants are present within the microenvironment.

[0020] In one embodiment, the adsorbent material adsorbs one or more contaminants during wafer processing operations.In one embodiment, the adsorbent material adsorbs one or more contaminants during wafer storage operations.

[0021] In one embodiment, the sorbent material is disposed in a sorbent holder located within the wafer container microenvironment. [Brief explanation of the drawings]

[0022] [Figure 1] FIG. 1 illustrates an adsorbent used in a wafer container, according to one embodiment. [Figure 2] FIG. 1 illustrates a wafer container configured to contain a sorbent, according to one embodiment. [Figure 3] 1 is a flowchart illustrating a method for reducing certain contaminants in a wafer container, according to one embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0023] The present disclosure is directed to adsorbents configured for use with wafer containers and methods for using such adsorbents to target and remove contaminants from wafer containers.

[0024] 1 shows an exploded view of a sorbent for use in a wafer container, according to one embodiment. The sorbent 100 includes a sorbent body 102 containing a sorbent medium 104 and a cladding material 106 surrounding the sorbent medium. The cladding material 106 can be sealed at a perimeter 108.

[0025] The sorbent 100 is configured to be placed within a wafer container microenvironment. In one embodiment, the sorbent 100 is sized and shaped to fit within one of the container slots used to hold wafers. In one embodiment, the sorbent 100 is shaped and sized similarly or identically to a wafer to be housed within a wafer container, such as a 350 mm wafer, or any other size and shape of wafer that may be placed within a wafer container microenvironment. In one embodiment, the sorbent 100 is shaped and sized differently from a wafer to be housed within a wafer container, while still being capable of being inserted into and held within one of the wafer slots of the wafer container. For example, a wafer container configured to hold circular wafers may have a sorbent 100 that is square in shape but sized to fit within the wafer slot of the wafer container. While the adsorbent 100 shown in FIG. 1 is sized and shaped to be placed within a wafer slot, it is understood that adsorbents of similar composition and / or configuration can be made having a size and shape adapted for placement in an adsorbent holder provided within a wafer container, for example, as described below and shown in FIG. 2.

[0026] The sorbent body 102 is the main body of the sorbent 100. The sorbent body contains the sorbent media 104. In one embodiment, the sorbent body is a laminate containing a charge of the sorbent media 104. The sorbent body 102 can be shaped and sized, for example, by cutting a formed laminate containing the sorbent media 104 to a predetermined shape so that the resulting sorbent 100 can fit within a sorbent holder in a wafer container.

[0027] The adsorption medium 104 can include any one or more suitable adsorbents that remove one or more selected contaminants from the wafer container microenvironment. Non-limiting examples of contaminants include volatile organic compounds (VOCs), semi-condensable organic compounds, condensable organic compounds, acids, bases, ionic contaminants, etc. Adsorbents can include, but are not limited to, carbon materials, molecular sieves, ion exchange resins, zeolites, or any other suitable adsorbent or combination of the above that removes contaminants from the environment. The loading of the adsorption medium 104 can be a loading that takes into account the media selected to contain and the amount of such selected media selected to adsorb one or more specified target contaminants. The target contaminants can be determined according to any suitable method, such as those described herein and illustrated in FIG. 3. Adjusting the loading of the adsorption medium 104 can improve the efficiency of the adsorption medium 104, as unnecessary or less effective components can be omitted from the adsorption medium. The adsorbent body 102 can further include any suitable material that removes moisture from the wafer container microenvironment, such as, for example, one or more molecular sieves, desiccants, etc.

[0028] The adsorbent main body 102 may be surrounded by a covering material 106. The covering material 106 can be any suitable porous material that packages the adsorbent main body 102 while allowing gas to pass through so that contaminants can be captured by the adsorbent media 104 and removed from the wafer container microenvironment. In one embodiment, the covering material 106 can include a woven and / or nonwoven material. In one embodiment, the covering material 106 includes a polymeric material. In one embodiment, the covering material 106 can include a polyester nonwoven material. The covering material 106 can include two or more pieces of material joined together to surround the adsorbent main body. For example, the covering material 106 can include two pieces of material shaped similarly to the adsorbent main body 102 and sized slightly larger than the main body. The two pieces of material can be positioned on either side of the adsorbent main body and joined together around the periphery 108 of the pieces of material. The two or more pieces of material can be joined by any suitable method of joining pieces of material, such as using welding. In one embodiment, the welding is ultrasonic welding.

[0029] 2 shows a wafer container configured to house a sorbent, according to one embodiment. The wafer container 200 includes a container body 202 including an open end 204 and a door 206. The interior space defined by the container body 202 includes a wafer slot 208. Optionally, the wafer container 200 can include a sorbent holder 210.

[0030] The wafer container 200 is a container used for processing, transporting, and / or storing wafers, such as semiconductor wafers. The wafer container 200 can be, for example, a front-opening integrated pod (FOUP). A container body 202 defines an interior space within the wafer container 200, and an open end 204 is provided on one side of the container body 202. The open end 204 can allow wafers to be placed in and / or removed from the interior space defined by the container body 202. A door 206 can be used to close the open end 204. When the open end 204 is closed by the door 206, a seal can be formed such that the interior space within the wafer container 200 provides a microenvironment.

[0031] The interior surface of the container body 202 can include features that define wafer slots 208. Each wafer slot 208 can include one or more support structures for holding a wafer, such as flanges, tabs, beams, or any other suitable support structure. Each wafer slot 208 is configured to accommodate one wafer and suitably position the wafer within the wafer container 200 for processing, transport, and / or storage. In one embodiment, a sorbent, such as the sorbent 100 described above and shown in FIG. 1 , can be placed in at least one of the wafer slots 208 to adsorb target contaminants within the microenvironment within the wafer container 200.

[0032] Optionally, the wafer container 200 can include a sorbent holder 210. The sorbent holder 210 can be one or more structures separate from the wafer slots 208 configured to receive a sorbent. The sorbent holder 210 can include, for example, one or more clips, cages, pockets, etc. configured to hold a sorbent within the microenvironment provided within the wafer container 200. The sorbent holder 210 can be integrated into or attached to at least one of the wafer container body 202 and the door 206. In one embodiment, the sorbent holder 210 can be integrated into any other suitable component integrated into or attached to the wafer container body 202 or the door 206, such as a container license plate holder, a purge component, etc. Each sorbent holder 210 can be configured to allow gas to pass through the sorbent holder and interact with the sorbent contained therein, thereby allowing the sorbent to remove contaminants from the contents of the microenvironment defined within the wafer container 200.

[0033] 3 shows a flowchart illustrating a method for reducing specific contaminants in a wafer container, according to one embodiment. Method 300 includes determining 302 one or more contaminants to remove from the wafer container microenvironment. Method 300 further includes selecting 304 one or more components of an adsorption medium based on the contaminants and determining 306 a loading amount for each of the components based on the contaminants. Method 300 further includes preparing 308 a sorbent including the determined loading amounts of the components. Method 300 may optionally include placing 310 the sorbent in the wafer container and performing a wafer storage operation 312 or a wafer processing operation 314. In one embodiment, method 300 further includes testing 316 the sorbent after placing 310 the sorbent in the wafer container.

[0034] One or more contaminants to remove from the wafer container microenvironment can be determined in 302. The contaminants to be removed can be contaminants specific to the wafer container microenvironment or a particular process or activity within the microenvironment. The selection of contaminants can be based on the composition of the wafer container, the staging conditions of the wafer container, the process in which the wafer container is used, the impact of the presence and / or effects of the contaminants, or any other suitable criteria. The contaminants to be removed can be, for example, acids, bases, ionic contaminants, and / or organic compounds such as volatile organic compounds or condensable organic compounds. The contaminants to be removed can include, by way of non-limiting example, contaminants from the ambient environment, such as staging or handling conditions, process chemicals, outgassing components from the wafer container or its contents, moisture, or any other possible contaminant that may be present in the wafer container microenvironment.

[0035] In one embodiment, determining one or more contaminants in 302 can include testing a sorbent that has been used in a representative wafer container microenvironment. For example, a sample sorbent can be placed in a test wafer container and subsequently tested to determine the captured contaminants. In one embodiment, method 300 can be repeated by testing a sorbent prepared according to method 300, placing the sorbent in the microenvironment 310, and subsequently testing the sorbent 316. The contaminants to remove can be determined based on the results of such testing. The testing can be any suitable test capable of identifying the presence or concentration of a contaminant, such as, by way of non-limiting example, thermogravimetric analysis, evolved gas analysis, gas chromatography-mass spectrometry, proton transfer reaction-mass spectrometry, or a combination of the above. In one embodiment, the contaminants to remove can be determined based on selection from a list, for example, identifying the contaminants of greatest concern and determining them as the contaminants to remove from the microenvironment. The contaminants of interest may be determined based on the contaminant's impact on a particular process, any risk associated with a particular contaminant, the relative or absolute concentration of the contaminant, or any other suitable criteria.

[0036] In one embodiment, the one or more contaminants may be determined at 302 based on knowledge of ambient or microenvironment-specific conditions of the wafer container microenvironment. In one embodiment, determining the one or more contaminants is based on ambient conditions during staging of the wafer container that defines the wafer container microenvironment. In one embodiment, determining the one or more contaminants is based on one or more materials used in a process performed within the wafer container microenvironment. In one embodiment, the one or more contaminants may be determined based on knowledge of potential outgassing within the wafer container microenvironment, for example, by based on the material composition of the wafer container that defines the wafer container microenvironment.

[0037] The method 300 further includes selecting 304 one or more components for the adsorption medium based on the contaminants. The components can be selected based on knowledge of the properties of the components with respect to the one or more determined contaminants. Non-limiting examples of components for the adsorption medium include carbon materials, molecular sieves, ion exchange resins, zeolites, and combinations thereof. The method 300 further includes determining 306 a loading amount for each of the components. The loading amount includes the amount of each component, such as the mass of each component per area or volume of the adsorbent. The loading amount can be determined based on a relationship between the components and the one or more determined contaminants. In one embodiment, the loading amount can take into account interactions between the components, for example, any interactions that affect the effectiveness of the component's adsorption. In one embodiment, the loading amount is based on the relative amount of each contaminant to be absorbed. In one embodiment, the loading amount is based on the relative importance of contaminant removal, for example, due to the contaminant's impact on processes performed within the wafer container microenvironment. Determining the components and loadings allows for the preparation of adsorbents tailored to the specific needs of the wafer container microenvironment or the specific use of the wafer container and the microenvironment it defines.

[0038] Method 300 also includes preparing 308 a sorbent including the determined loading of the component. The sorbent can be prepared by any suitable method for preparing a sorbent. The sorbent can be, for example, sorbent 100 described above and shown in FIG. 1 . In one embodiment, preparing the sorbent at 308 can include providing a laminate including the determined loading of the component at 304, as determined at 306. Preparing the sorbent at 308 can further include surrounding the sorbent body with a coating, such as a porous coating, such as a woven or nonwoven material. The coating can be a polymeric material, such as a polymer. In one embodiment, the coating is a polyester nonwoven material. The coating can be fabricated to surround the sorbent body by providing multiple coating segments joined by welding, such as ultrasonic welding. Excess material outside the weld can optionally be removed to provide the sorbent.

[0039] The method 300 may optionally include placing 310 a sorbent into the wafer container. Placing the sorbent into the wafer container may be performed according to the size and shape of the sorbent and the configuration of the wafer container. In one embodiment, the sorbent may be placed in a wafer slot of the wafer container. In one embodiment, the sorbent may be placed in a holder located within an interior space defined by the wafer container. Once the sorbent is placed in the wafer container, the wafer container may be closed to define a microenvironment. The sorbent may adsorb contaminants by incorporating components contained in the sorbent, thereby removing the contaminants from the microenvironment. Once the wafer container is closed, the wafer container may be used, for example, by performing a wafer storage operation 312 or a wafer processing operation 314.

[0040] In one embodiment, method 300 further includes testing 316 the adsorbent after placing the adsorbent in the wafer container at 310. The testing can be, for example, a destructive test of the adsorbent medium. The testing at 316 can be used, for example, to determine the amount of contaminant captured by the adsorbent while it is in the wafer container at 310. The results of the testing at 316 can be used in iterations of method 300 to refine the contaminant determination at 302, the constituent determination at 304, and / or the loading of the constituent onto the adsorbent medium at 306.

[0041] Table 1 shows the results from chromatograms of samples obtained from within an existing front-opening integrated pod (FOUP). TIFF0007733210000001.tif20170

[0042] As shown in Table 1, the FOUP microenvironment contains a significant amount of both condensable and volatile organics. Some of these organics may be undesirable depending on what is stored or processed within the FOUP. In a non-limiting example, these chromatogram results can be used to identify one or more contaminants to remove from the FOUP microenvironment. For example, based on Table 1, adsorbent materials that specifically remove organics, especially volatile organics, can be selected for inclusion in the adsorbent loading to be used within the FOUP.

[0043] Table 2 shows the concentrations of total organics and total condensable organics obtained using chromatograms of samples taken from within a FOUP containing an adsorbent, according to one embodiment. In the chromatographic embodiment with results shown in Table 2, an adsorbent having components selected to remove toluene is placed within the FOUP microenvironment previously used in the generation of Table 1. TIFF0007733210000002.tif20170

[0044] As can be seen in Table 2, the results within the FOUP microenvironment containing the adsorbent demonstrate a significant reduction in the content of volatile and condensable organics within the FOUP microenvironment. Compared to Table 1, the addition of the adsorbent demonstrates an approximately 10-fold reduction in the presence of organic compounds, including condensable organics, within the FOUP microenvironment. Thus, the targeted adsorbent demonstrates the ability to dramatically reduce the presence of targeted contaminants within the FOUP microenvironment. Similar targeting can be used for any suitable contaminant or combination of contaminants, using an adsorbent loading appropriate for that contaminant or combination of contaminants.

[0045] Aspects Aspect 1. A method for reducing contamination within a wafer container microenvironment, comprising: determining one or more contaminants to remove from the wafer container microenvironment; selecting one or more components of the adsorption medium based on the one or more contaminants; determining a loading amount of each of the one or more components based on the one or more contaminants; providing a sorbent material including a determined loading of each of one or more components, the sorbent material configured to be disposed within the wafer container microenvironment when a wafer is present within the wafer container microenvironment; A method comprising:

[0046] Embodiment 2. The method of embodiment 1, wherein the one or more components of the adsorption medium are selected from the group consisting of carbon materials, molecular sieves, ion exchange resins, and zeolites.

[0047] Embodiment 3. The method of any one of embodiments 1-2, wherein determining the one or more contaminants comprises testing a sample sorbent disposed within the test wafer container microenvironment to absorb the potential contaminants.

[0048] Embodiment 4. The method of any one of embodiments 1-3, wherein determining the loading amount of each of the one or more components comprises testing a sample sorbent disposed within the test wafer container microenvironment to absorb the potential contaminant.

[0049] Embodiment 5. The method of any one of embodiments 1-4, wherein determining the one or more contaminants is based on ambient conditions during staging of the wafer container, which defines a wafer container microenvironment.

[0050] Embodiment 6. The method of any one of embodiments 1-5, wherein determining the loading amount of each of the one or more components is based on ambient conditions during staging of the wafer container, which define a wafer container microenvironment.

[0051] Embodiment 7. The method of any one of embodiments 1-6, wherein determining the one or more contaminants is based on a material composition of a wafer container that defines the wafer container microenvironment.

[0052] Embodiment 8. The method of any one of embodiments 1-7, wherein determining the loading amount of each of the one or more components is based on a material composition of a wafer container that defines a wafer container microenvironment.

[0053] Embodiment 9. The method of any one of embodiments 1-8, wherein determining the one or more constituents is based on one or more materials used in a process performed within the wafer container microenvironment.

[0054] Embodiment 10. The method of any one of embodiments 1-9, wherein determining the loading amount of each of the one or more components is based on one or more materials used in a process performed within the wafer container microenvironment.

[0055] Embodiment 11. The method of any one of embodiments 1-10, wherein the wafer container defining the wafer container microenvironment is a front-opening integrated pod (FOUP).

[0056] Embodiment 12. The method of any one of embodiments 1-11, wherein the one or more contaminants are selected from the group consisting of inorganic acids, bases, volatile organic compounds, and condensable organic compounds.

[0057] Embodiment 13. The method of any one of embodiments 1-12, wherein the adsorbent material is shaped so that it can fit into a wafer slot of a wafer container microenvironment.

[0058] Embodiment 14. The method of embodiment 13, wherein the adsorbent material has the same shape and dimensions as a wafer configured to be placed within the wafer container microenvironment.

[0059] Embodiment 15. The method of any one of embodiments 1-14, further comprising disposing an adsorbent material within the wafer container microenvironment, wherein the adsorbent material adsorbs the one or more contaminants when the contaminants are present in the microenvironment.

[0060] Embodiment 16. The method of embodiment 15, wherein the adsorbent material adsorbs one or more contaminants during wafer processing operations.

[0061] Embodiment 17. The method of any one of embodiments 15-16, wherein the adsorbent material adsorbs one or more contaminants during wafer storage operations.

[0062] Embodiment 18. The method of any one of embodiments 1-17, wherein the adsorbent material is disposed in a adsorbent holder located within the wafer container microenvironment.

[0063] The embodiments disclosed herein should be considered in all respects as illustrative and not restrictive. The scope of the present invention is indicated by the appended claims, rather than the foregoing description, and all changes that come within the meaning and range of equivalents of the claims are intended to be embraced.

Claims

1. 1. A method for reducing contamination within a wafer container microenvironment, comprising: determining one or more contaminants to remove from the wafer container microenvironment based on the staging conditions of the wafer container or the process in which the wafer container is used; selecting one or more components of an adsorption medium based on the one or more contaminants; determining a loading amount for each of the one or more components based on the one or more contaminants; after determining the one or more contaminants, selecting one or more components of the sorbent medium, and determining the loadings of the components, providing a sorbent material including the determined loadings of each of the one or more components, the sorbent material configured to be disposed within the wafer container microenvironment when a wafer is present within the wafer container microenvironment; testing the sorbent material after placing it within the wafer container microenvironment; Including, The method further comprises repeating the steps after determining at least the contaminants to be removed based on the results of the test.

2. The method described in claim 1, wherein the adsorbent material has the same shape and dimensions as the wafer.

3. The method of claim 1 , wherein determining the loading amount for each of the one or more components comprises determining a new loading amount based on the results of the testing.

4. The method of claim 1 , wherein determining the one or more contaminants is based on ambient conditions during wafer container staging that define the wafer container microenvironment.

5. 10. The method of claim 1, further comprising disposing the adsorbent material within the wafer container microenvironment, the adsorbent material adsorbing the one or more contaminants when present within the microenvironment.

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