Workpiece processing apparatus and workpiece processing method

Abstract

To provide a workpiece processing device that removes generated static electricity when processing a workpiece while the workpiece is being supported using a Bernoulli chuck.SOLUTION: A workpiece processing device 1 includes a workpiece support device 10 for supporting a workpiece W, and a processing head 20 for processing the surface of the workpiece W. The workpiece support device 10 includes a fluid supply line 15 for flowing fluid, and a Bernoulli chuck 12 connected to the fluid supply line 15. The Bernoulli chuck 12 is configured to spouts the fluid so as to suck the surface of the workpiece W, and at least a part of the Bernoulli chuck 12 is made of a conductive material and grounded.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a workpiece processing apparatus and method for processing workpieces such as wafers, substrates, panels, etc. [Background technology]

[0002] In recent years, devices such as memory circuits, logic circuits, and image sensors (e.g., CMOS sensors) have become increasingly highly integrated. During the processes used to fabricate these devices, foreign particles such as particles and dust can adhere to the devices. Such foreign particles can cause short circuits between wiring and circuit malfunctions. Therefore, to improve device reliability, it is necessary to clean the workpieces on which the devices are formed and remove any foreign particles from the workpieces.

[0003] Foreign matter such as the fine particles and dust particles mentioned above can also adhere to the back surface (non-device surface) of the workpiece. If such foreign matter adheres to the back surface of the workpiece, the workpiece may move away from the stage reference surface of the exposure tool, or the workpiece surface may tilt relative to the stage reference surface, resulting in patterning deviations and focal length deviations. To prevent such problems, it is necessary to prevent foreign matter from adhering to the back surface of the workpiece.

[0004] Bernoulli chucks have traditionally been used as a mechanism for supporting workpieces such as wafers, substrates, panels, etc. A Bernoulli chuck is a chuck that generates suction force by ejecting a fluid, utilizing Bernoulli's theorem, and supports the workpiece in a non-contact manner via the fluid. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 2019-77003 Summary of the Invention [Problem to be solved by the invention]

[0006] FIG. 9 is a schematic diagram showing how the workpiece W is supported by the Bernoulli chuck 112. The Bernoulli chuck 112 supports the first surface 102a of the workpiece W in a non-contact manner by ejecting fluid supplied from a fluid supply line 115. However, when the fluid is ejected from the Bernoulli chuck 112, friction between the fluid and the Bernoulli chuck 112 causes the Bernoulli chuck 112 to become electrically charged. When foreign matter such as polishing debris is generated near the Bernoulli chuck 112 during processing such as polishing the workpiece W, the foreign matter is attracted to and adheres to the Bernoulli chuck 112. This foreign matter can contaminate the workpiece W. Similarly, the workpiece W can become electrically charged due to friction between the fluid and the first surface 102a of the workpiece W, causing a similar problem.

[0007] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a workpiece processing apparatus that can remove static electricity generated in a Bernoulli chuck when the Bernoulli chuck is used to support and process a workpiece. [Means for solving the problem]

[0008] one Reference example A workpiece processing apparatus for processing a surface of a workpiece includes a workpiece support device for supporting the workpiece, and a The aforementioned The workpiece support device includes a processing head for processing a surface, the processing head having a fluid supply line for supplying a fluid thereto, and a Bernoulli chuck connected to the fluid supply line, the Bernoulli chuck ejecting the fluid to the workpiece. The aforementioned A workpiece handling device is provided that is configured to attract a surface, and wherein at least a portion of the Bernoulli chuck is constructed from an electrically conductive material and is grounded. one Reference exampleIn the Bernoulli chuck, the Bernoulli chuck has an upward suction surface, a fluid outlet located around the suction surface, and an inclined surface located around the fluid outlet and inclined radially outward toward the top, and the Bernoulli chuck is configured so that the fluid flows from the fluid outlet along the inclined surface and then spreads outward from the suction surface. one Reference example In the Bernoulli chuck, the Bernoulli chuck has an upwardly facing suction surface and fluid jets located around the periphery of the suction surface, the fluid jets being located below the suction surface and facing radially outward. one Reference example In the above, the fluid is a gas, and the workpiece support device further includes an ionizer that ionizes the gas flowing through the fluid supply line, and the ionizer is provided in the fluid supply line. one Reference example In the example, the fluid is carbonated water, the workpiece supporting device further includes a carbonated water supply source, and the fluid supply line is connected to the carbonated water supply source.

[0009] one Reference example In the above, the workpiece support device further includes a roller that contacts an end of the workpiece, and at least a portion of the roller is made of a conductive material and is grounded. one Reference example In the above, the conductive material is a conductive resin or a conductive ceramic.

[0010] In one aspect, a workpiece processing apparatus for processing a surface of a workpiece includes: a workpiece support device for supporting the workpiece; The aforementioned The workpiece support device includes a processing head for processing a surface, a fluid supply line for supplying gas, an ionizer for ionizing the gas flowing through the fluid supply line, and an ionizer connected to the fluid supply line for spraying the ionized gas to ionize the surface of the workpiece. The aforementionedA workpiece processing device is provided, which includes a Bernoulli chuck that sucks a surface, a liquid discharge member that is arranged to surround the Bernoulli chuck and discharges carbonated water around the Bernoulli chuck, and a carbonated water supply source that supplies the carbonated water to the liquid discharge member.

[0011] In one embodiment, at least a portion of the Bernoulli chuck and / or the liquid discharge member is made of a conductive material and is grounded. In one embodiment, the workpiece support device further includes a roller that contacts an edge of the workpiece, at least a portion of the roller being made of a conductive material and grounded. In one embodiment, the conductive material is a conductive resin or a conductive ceramic.

[0012] one Reference example A method for processing a workpiece surface includes ejecting a fluid from a Bernoulli chuck to cause the Bernoulli chuck to eject a fluid from the Bernoulli chuck. The aforementioned A method for processing a workpiece is provided, comprising the steps of attracting a surface and processing the surface of the workpiece attracted by the Bernoulli chuck with a processing head, wherein at least a portion of the Bernoulli chuck is constructed of a conductive material and is grounded. one Reference example In the Bernoulli chuck, the Bernoulli chuck has an upward suction surface, a fluid outlet located around the suction surface, and an inclined surface located around the fluid outlet and inclined radially outward toward the top, and the fluid flows from the fluid outlet along the inclined surface and then spreads outward from the suction surface. one Reference example In the Bernoulli chuck, the Bernoulli chuck has an upwardly facing suction surface and fluid jets located around the periphery of the suction surface, the fluid jets being located below the suction surface and facing radially outward. one Reference exampleIn the above, the fluid ejected from the Bernoulli chuck is gas ionized by an ionizer connected to the Bernoulli chuck and provided in a fluid supply line for supplying the fluid. one Reference example In the example, the fluid ejected from the Bernoulli chuck is carbonated water. one Reference example The method further includes the step of supporting the workpiece by bringing a roller into contact with an end of the workpiece, at least a portion of the roller being made of a conductive material and grounded.

[0013] In one aspect, a method for processing a surface of a workpiece includes ejecting ionized gas from a Bernoulli chuck to eject ionized gas from the Bernoulli chuck. The aforementioned A workpiece processing method is provided in which carbonated water is released onto the surface of the workpiece from a liquid discharge member arranged to surround the Bernoulli chuck while the surface is being sucked, and the surface of the workpiece being sucked by the Bernoulli chuck is processed by a processing head. In one embodiment, at least a portion of the Bernoulli chuck and / or the liquid discharge member is made of a conductive material and is grounded. In one embodiment, the method further includes the step of supporting the workpiece by contacting a roller with an end of the workpiece, at least a portion of the roller being made of a conductive material and grounded. [Effects of the Invention]

[0014] According to the present invention, at least a part of the Bernoulli chuck is made of a conductive material and is grounded, so that static electricity generated in the Bernoulli chuck can be removed. Furthermore, according to the present invention, static electricity generated in the Bernoulli chuck can be removed by flowing ionized gas and / or carbonated water through the Bernoulli chuck. Furthermore, according to the present invention, at least a part of the roller is made of a conductive material and is grounded, so that static electricity generated on the workpiece can be removed. [Brief explanation of the drawings]

[0015] [Figure 1] FIG. 1 is a schematic diagram illustrating an embodiment of a polishing apparatus. [Figure 2] FIG. 2 is a plan view showing a state in which a workpiece is supported by a workpiece support device. [Figure 3] FIG. 2 is a schematic diagram illustrating an embodiment of a workpiece support device. [Figure 4] FIG. 4 is a schematic diagram showing a state in which a workpiece is being polished while being supported by the workpiece supporting device shown in FIG. 3. [Figure 5] FIG. 10 is a schematic diagram showing another embodiment of the workpiece supporting device. [Figure 6] FIG. 10 is a schematic diagram showing yet another embodiment of the workpiece supporting device. [Figure 7] FIG. 7(a) is a plan view showing still another embodiment of the workpiece supporting device, and FIG. 7(b) is a cross-sectional view taken along line AA in FIG. 7(a). [Figure 8] FIG. 8 is a schematic diagram showing a state in which a workpiece is being polished while being supported by the workpiece supporting device shown in FIG. 7. [Figure 9] FIG. 1 is a schematic diagram showing a state in which a workpiece is supported by a Bernoulli chuck. DETAILED DESCRIPTION OF THE INVENTION

[0016] Hereinafter, embodiments of the present invention will be described with reference to the drawings. The same or corresponding components will be designated by the same reference numerals and redundant description will be omitted. FIG. 1 is a schematic diagram illustrating one embodiment of a polishing apparatus 1. The polishing apparatus 1 shown in FIG. 1 is an example of a workpiece processing apparatus for processing a workpiece W, such as a wafer, a substrate, or a panel. The polishing apparatus 1 includes a workpiece support device 10 that supports the workpiece W, a polishing head 20 that polishes the first surface 2a of the workpiece W by bringing a polishing tape 3 as a processing tool into sliding contact with the first surface 2a of the workpiece W, and a polishing tape supply mechanism 30 that supplies the polishing tape 3 to the polishing head 20. The polishing head 20 is an example of a processing head that processes the surface of the workpiece W. In this embodiment, there are four polishing heads 20, but the number of polishing heads 20 is not limited to this embodiment. For example, one, two, three, five or more polishing heads 20 may be provided.

[0017] The workpiece support device 10 includes a plurality of rollers 11 that can contact the peripheral edge of the workpiece W, and a plurality of Bernoulli chucks 12 that support the first surface (lower surface) 2a of the workpiece W with a fluid. The workpiece support device 10 includes a roller rotation mechanism (not shown) for rotating each roller 11 about its axis. The Bernoulli chuck 12 supports the first surface 2a of the workpiece W by suction using a fluid flow and without contact. In this specification, the Bernoulli chuck 12 is defined as a chuck that generates a suction force by ejecting a fluid, utilizing Bernoulli's principle.

[0018] In this embodiment, the first surface 2a of the workpiece W is the back surface of the workpiece W on which no devices have been formed or are not intended to be formed, i.e., the non-device surface. The second surface 2b of the workpiece W opposite the first surface 2a is the surface on which devices have been formed or are intended to be formed, i.e., the device surface. In this embodiment, the workpiece W is supported horizontally by the workpiece support apparatus 10 with its first surface 2a facing downward.

[0019] The polishing head 20 is disposed below the workpiece W supported by the workpiece support device 10. The polishing head 20 includes a pressing member 21 that presses the polishing tape 3 against the first surface 2a of the workpiece W, and a pressure mechanism 22 that pushes the pressing member 21 upward. The pressure mechanism 22 pushes the pressing member 21 upward, and the pressing member 21 polishes the first surface 2a of the workpiece W by sliding the polishing tape 3 against the first surface 2a of the workpiece W from the back side.

[0020] The polishing tape supply mechanism 30 includes a tape supply reel 31 that supplies the polishing tape 3 and a tape take-up reel 32 that collects the polishing tape 3. The tape supply reel 31 and the tape take-up reel 32 are connected to tension motors 31a and 32a, respectively. The tension motors 31a and 32a are fixed to a reel base 33. By rotating the tape take-up reel 32 in the direction indicated by the arrow, the polishing tape 3 is fed from the tape supply reel 31 through the polishing head 20 in the direction indicated by the arrow on the tape take-up reel 32. A plurality of guide rollers 34 guide the polishing tape 3 so that the polishing tape 3 advances in a direction parallel to the first surface 2a of the workpiece W. The plurality of guide rollers 34 are fixed to a holding member (not shown).

[0021] The tension motor 31a can apply tension to the polishing tape 3 by applying a predetermined torque to the tape supply reel 31. The tension motor 32a is controlled to feed the polishing tape 3 at a constant speed. The speed at which the polishing tape 3 is fed can be changed by changing the rotation speed of the tape take-up reel 32. In one embodiment, the direction in which the polishing tape 3 is fed may be the opposite direction to the direction indicated by the arrow in FIG. 1 (the positions of the tape supply reel 31 and the tape take-up reel 32 may be interchanged). A tape feeding device may be provided separately from the tape take-up reel 32. In this case, the tension motor 32a connected to the tape take-up reel 32 can apply tension to the polishing tape 3 by applying a predetermined torque to the tape take-up reel 32.

[0022] The polishing apparatus 1 may further include a rinse liquid supply nozzle (not shown) and a protection liquid supply nozzle (not shown). The rinse liquid supply nozzle is disposed below the workpiece W to supply a rinse liquid (e.g., pure water or an alkaline chemical solution) to the first surface 2a of the workpiece W. The rinse liquid supplied to the processing point on the first surface 2a can remove polishing debris from the first surface 2a of the workpiece W. Furthermore, the rinse liquid supplied to a point other than the processing point can prevent the workpiece W from drying out. The protection liquid supply nozzle is disposed above the workpiece W to supply a protection liquid (e.g., pure water) to the second surface 2b of the workpiece W. The protection liquid spreads over the second surface 2b of the workpiece W due to centrifugal force, preventing the rinse liquid containing polishing debris and foreign matter generated during polishing of the workpiece W from flowing over and adhering to the second surface 2b of the workpiece W.

[0023] The operation of the polishing apparatus 1 is controlled by an operation control unit 50. The operation control unit 50 is electrically connected to the rollers 11 of the workpiece support device 10, the polishing head 20, and the polishing tape supply mechanism 30. The operation of the rollers 11 of the workpiece support device 10, the polishing head 20, and the polishing tape supply mechanism 30 is controlled by the operation control unit 50. The operation control unit 50 is composed of at least one computer.

[0024] FIG. 2 is a plan view showing how a workpiece W is supported by a workpiece support device 10. The peripheral edge of the workpiece W is held by four rollers 11, and the first surface 2a of the workpiece W is supported by six Bernoulli chucks 12. The four rollers 11 are arranged around a reference center point O of the workpiece support device 10. A roller rotation mechanism (not shown) is configured to rotate the four rollers 11 in the same direction at the same speed. During polishing of the first surface 2a of the workpiece W, the peripheral edge of the workpiece W is gripped by the rollers 11. The workpiece W is held horizontally, and the rotation of the rollers 11 rotates the workpiece W about its axis. During polishing of the first surface 2a of the workpiece W, the four rollers 11 rotate about their respective axis, but the positions of the rollers 11 themselves are fixed. Although the number of rollers 11 is four in this embodiment, the number of rollers is not limited to this embodiment; for example, five or more rollers may be provided. In one embodiment, the workpiece W may be held by a plurality of rollers 11 so as to be tilted relative to the horizontal.

[0025] The workpiece W is further supported by a plurality of Bernoulli chucks 12. These Bernoulli chucks 12 are arranged on both sides of the polishing tape 3 and the pressing member 21. Three Bernoulli chucks 12 are arranged on one side of the polishing tape 3 supported by the pressing member 21, and are aligned along the polishing tape 3. Similarly, three Bernoulli chucks 12 are arranged on the other side of the polishing tape 3 supported by the pressing member 21, and are aligned along the polishing tape 3. The six Bernoulli chucks 12 are each spaced apart from but close to the polishing tape 3 and the pressing member 21. In this embodiment, there are six workpiece support devices 12, but the number and positions of the Bernoulli chucks 12 are not limited to this embodiment. For example, only one Bernoulli chuck 12 may be provided.

[0026] FIG. 3 is a schematic diagram illustrating one embodiment of a workpiece support device 10. While FIG. 3 shows only one roller 11 and one Bernoulli chuck 12 as part of the configuration of the workpiece support device 10, the rollers 11 and Bernoulli chucks 12 of the workpiece support device 10 described with reference to FIGS. 1 and 2 all have similar configurations. The Bernoulli chuck 12 is shown in cross section. The Bernoulli chuck 12 has an upward-facing suction surface 12a, which faces the first surface (lower surface) 2a of the workpiece W. The Bernoulli chuck 12 has fluid outlets 12b located around the suction surface 12a and fluid flow paths 12c communicating with the fluid outlets 12b. The fluid flow paths 12c communicate with a fluid supply line 15 that supplies a fluid. The fluid may be a gas (e.g., dry air, an inert gas, etc.) or a liquid (e.g., pure water, etc.). The fluid supply line 15 is connected to a fluid supply source (not shown). A fluid supply valve 16 is attached to the fluid supply line 15, and the fluid supply valve 16 is electrically connected to the operation control unit 50. The operation of the fluid supply valve 16 is controlled by the operation control unit 50. Examples of the fluid supply valve 16 include actuator-type driven valves such as electric valves and solenoid valves.

[0027] When the operation control unit 50 opens the fluid supply valve 16, fluid is supplied to the Bernoulli chuck 12 through the fluid supply line 15. The fluid supplied to the Bernoulli chuck 12 passes through the fluid flow path 12c and is sprayed outward from the fluid outlet 12b. The fluid flow spreading outward from the suction surface 12a creates a negative pressure in the space between the center of the suction surface 12a and the first surface 2a of the workpiece W. This causes the Bernoulli chuck 12 to generate a suction force at the center of the suction surface 12a and suck the workpiece W. A fluid flow is created in the space between the outer periphery of the Bernoulli chuck 12 and the first surface 2a of the workpiece W, and this fluid flow supports the first surface 2a of the workpiece W. In this way, the Bernoulli chuck 12 can support the workpiece W without contact while suctioning it. Therefore, the rollers 11 can rotate the workpiece W while the Bernoulli chuck 12 supports it.

[0028] The Bernoulli chuck 12 of this embodiment is configured so that fluid is jetted from the fluid jetting ports 12b radially outward from the Bernoulli chuck 12, but the Bernoulli chuck 12 is not limited to this embodiment as long as the first surface 2a of the workpiece W can be sucked by the flow of fluid and supported in a non-contact manner. For example, a cyclone-type Bernoulli chuck may be used, which sucks the first surface 2a of the workpiece W and supports it in a non-contact manner by forming a swirling flow and flowing a fluid outward from the Bernoulli chuck 12.

[0029] At least a portion of the Bernoulli chuck 12 is made of a conductive material and is grounded. In particular, the portion of the Bernoulli chuck 12 facing the first surface 2a of the workpiece W, including the suction surface 12a and the fluid outlet 12b, is made of a conductive material and is grounded. Similarly, at least a portion of the roller 11 is made of a conductive material and is grounded. In particular, the portion of the roller 11 that contacts the workpiece W is made of a conductive material and is grounded. Examples of conductive materials that make up the Bernoulli chuck 12 and the roller 11 include conductive resin and conductive ceramic. The conductive resin may be, for example, a resin such as PEEK (polyether ether ketone), PPS (polyphenylene sulfide), or PVC (polyvinyl chloride) blended with a conductive filler.

[0030] FIG. 4 is a schematic diagram showing a state in which a workpiece W is being polished while being supported by the workpiece support device 10 shown in FIG. 3 . The workpiece W is supported by the workpiece support device 10. The polishing head 20 polishes the first surface 2 a of the workpiece W by sliding a polishing tape 3, which is a processing tool, against the first surface 2 a of the workpiece W. When a fluid is ejected from the Bernoulli chuck 12, the Bernoulli chuck 12 becomes charged due to friction between the fluid and the Bernoulli chuck 12. Similarly, the workpiece W becomes charged due to friction between the fluid and the first surface 2 a of the workpiece W and friction between the polishing tape 3 and the workpiece W. Foreign matter such as polishing debris is attracted to and adheres to the charged Bernoulli chuck 12 and the workpiece W, which can cause contamination of the workpiece W.

[0031] Therefore, the Bernoulli chuck 12 of this embodiment is made of a conductive material and is grounded. Static electricity generated at a portion S1 of the Bernoulli chuck 12 can be removed from the Bernoulli chuck 12 as shown by the dashed arrow. Furthermore, the roller 11 of this embodiment is made of a conductive material and is grounded. Static electricity generated at portions S2 and S3 of the workpiece W can be removed from the workpiece W via the roller 11 as shown by the dashed arrow.

[0032] Figure 5 is a schematic diagram showing another embodiment of the workpiece support device 10. The configuration of this embodiment not specifically described is the same as the embodiment described above with reference to Figures 3 and 4, so duplicated explanations will be omitted. Gas is supplied to the Bernoulli chuck 12 shown in Figure 5 from a fluid supply line 15. The fluid supply line 15 is connected to a gas supply source (not shown). Therefore, the fluid outlet 12b (see Figure 3) of this embodiment is a gas outlet.

[0033] The workpiece support device 10 is equipped with an ionizer 40 that ionizes the gas flowing through the fluid supply line 15. The ionizer 40 is provided downstream of the fluid supply valve 16 in the flow direction of the gas flowing through the fluid supply line 15. In one embodiment, the ionizer 40 may be provided upstream of the fluid supply valve 16 in the flow direction of the gas flowing through the fluid supply line 15. The ionized gas contains positively and negatively charged ions. The piping of the fluid supply line 15 is made of a conductive material such as a conductive resin to maintain the ions in the gas flowing through the fluid supply line 15.

[0034] The ionized gas flows into the Bernoulli chuck 12, passes through the Bernoulli chuck 12, and is ejected from the Bernoulli chuck 12. The ionized gas ejected from the Bernoulli chuck 12 spreads along the first surface 2a of the workpiece W. In FIG. 5, the ionized gas ejected from the Bernoulli chuck 12 is indicated by solid arrows. The ionized gas can neutralize the charge of the charged portion and remove static electricity. Therefore, the Bernoulli chuck 12 of this embodiment can remove static electricity from the charged portions indicated by S1 and S2. Furthermore, the ionized gas spreads along the first surface 2a of the workpiece W and reaches the charged portion indicated by S3, thereby removing static electricity from the charged portion S3.

[0035] FIG. 6 is a schematic diagram showing yet another embodiment of the workpiece support device 10. The configuration of this embodiment, which is not specifically described, is the same as that of the embodiment described above with reference to FIGS. 3 and 4, and therefore redundant description will be omitted. Carbonated water is supplied to the Bernoulli chuck 12 shown in FIG. 6 from a fluid supply line 15. The workpiece support device 10 has a carbonated water supply source 41, and the fluid supply line 15 is connected to the carbonated water supply source 41. Therefore, the fluid outlet 12b (see FIG. 3) of this embodiment is a carbonated water outlet. In this embodiment, the carbonated water supply source 41 includes a pure water line 41A through which pure water flows and a carbon dioxide gas line 41B through which carbon dioxide gas flows. The pure water line 41A and the carbon dioxide gas line 41B are connected, and the pure water and the carbon dioxide gas are mixed to produce carbonated water. In one embodiment, the carbonated water supply source 41 may be a carbonated water tank that stores carbonated water. Carbonated water contains positively charged hydrogen ions and negatively charged carbonate ions and bicarbonate ions. The piping of the fluid supply line 15 is made of a conductive material such as a conductive resin in order to maintain the ions in the carbonated water flowing through the fluid supply line 15 .

[0036] The carbonated water flows into the Bernoulli chuck 12, passes through the Bernoulli chuck 12, and is ejected from the Bernoulli chuck 12. The carbonated water ejected from the Bernoulli chuck 12 spreads along the first surface 2a of the workpiece W. In FIG. 6, the carbonated water ejected from the Bernoulli chuck 12 is indicated by solid arrows. The carbonated water can neutralize the charge of the charged portion and remove static electricity. Therefore, the Bernoulli chuck 12 of this embodiment can remove static electricity from the charged portions indicated by S1 and S2. Furthermore, the carbonated water spreads along the first surface 2a of the workpiece W and reaches the charged portion S3 of the workpiece W, thereby removing static electricity from the charged portion S3.

[0037] FIG. 7(a) is a plan view showing yet another embodiment of the workpiece support device, and FIG. 7(b) is a cross-sectional view taken along line AA in FIG. 7(a). The configuration of this embodiment, which is not specifically described, is the same as the embodiment described above with reference to FIG. 5, and therefore, redundant description will be omitted. In FIG. 7, the rollers 11 of the workpiece support device 10 are omitted. Ionized gas is supplied to the Bernoulli chuck 12 from a fluid supply line 15. The configuration of the Bernoulli chuck 12 is the same as the embodiment described with reference to FIG. 5. Therefore, the fluid outlet 12b of this embodiment is a gas outlet.

[0038] The workpiece support device 10 of this embodiment includes a liquid discharge member 13 arranged to surround the Bernoulli chuck 12. The liquid discharge member 13 is connected to a carbonated water supply line 17, and carbonated water is supplied to the liquid discharge member 13 from the carbonated water supply line 17. The workpiece support device 10 includes a carbonated water supply source 41, and the carbonated water supply line 17 is connected to the carbonated water supply source 41. Although the carbonated water supply source 41 is illustrated schematically in FIG. 7(b), the configuration of the carbonated water supply source 41 may be the same as in the embodiment described with reference to FIG. 6, or the carbonated water supply source 41 may be a carbonated water tank that stores carbonated water.

[0039] The liquid discharge member 13 has a plurality of liquid discharge ports 13a, a plurality of liquid flow paths 13b, a side wall 13c surrounding the Bernoulli chuck 12, and a bottom 13d connected to the side wall 13c. The inner diameter of the side wall 13c is larger than the outer diameter of the Bernoulli chuck 12, and the Bernoulli chuck 12 is disposed within the liquid discharge member 13.

[0040] The liquid discharge ports 13a are a plurality of holes formed in the upper surface of the liquid discharge member 13, and these liquid discharge ports 13a are positioned at equal intervals on the same circumference when viewed from above the liquid discharge member 13. The liquid discharge ports 13a are formed in the upper surface of the side wall 13c, and are arranged so as to surround the Bernoulli chuck 12.

[0041] Liquid flow path 13b extends downward from liquid discharge port 13a through side wall 13c toward bottom 13d, and further extends within bottom 13d to merge at the center of bottom 13d. Liquid flow path 13b communicates with carbonated water supply line 17 that supplies carbonated water to liquid discharge member 13. Carbonated water supply valve 18 is attached to carbonated water supply line 17, and carbonated water supply valve 18 is electrically connected to operation control unit 50. Operation of carbonated water supply valve 18 is controlled by operation control unit 50. Examples of carbonated water supply valve 18 include actuator-type driven valves such as electric valves and solenoid valves.

[0042] As shown in Figure 7(a), fluid outlets 12b, which are gas outlets, are positioned at equal intervals on the same circumference when viewed from above the Bernoulli chuck 12. Liquid outlets 13a of the liquid discharge member 13 are positioned on multiple straight lines extending from the center Q of the Bernoulli chuck 12 through the fluid outlets 12b when viewed from above the liquid discharge member 13. In this embodiment, twelve fluid outlets 12b and six liquid outlets 13a are provided, but the number, shape, and positions of the fluid outlets 12b and liquid outlets 13a shown in Figures 7(a) and 7(b) are merely examples and are not particularly limited.

[0043] The Bernoulli chuck 12 of this embodiment is configured so that ionized gas is jetted radially from the fluid jetting ports 12b toward the outside of the Bernoulli chuck 12, but the Bernoulli chuck 12 is not limited to this embodiment as long as the flow of ionized gas can attract and support the first surface 2a of the workpiece W in a non-contact manner. For example, a cyclone-type Bernoulli chuck may be applied, in which a swirling flow is formed by flowing ionized gas outside the Bernoulli chuck 12 to attract and support the first surface 2a of the workpiece W in a non-contact manner.

[0044] Although the liquid discharge member 13 of this embodiment has a side wall 13c surrounding the Bernoulli chuck 12, the liquid discharge member 13 is not limited to this embodiment as long as it is configured to be able to discharge carbonated water around the Bernoulli chuck 12. For example, the liquid discharge port 13a of the liquid discharge member 13 may be annular along the outer periphery of the bottom 13d when viewed from above the liquid discharge member 13. Furthermore, the liquid discharge member 13 may not have the side wall 13c, and instead may be provided with a plurality of liquid nozzles that discharge carbonated water around the Bernoulli chuck 12.

[0045] When the operation control unit 50 opens the fluid supply valve 16 and the carbonated water supply valve 18, the ionized gas is supplied to the Bernoulli chuck 12 and the carbonated water is supplied to the liquid discharge member 13. The ionized gas supplied to the Bernoulli chuck 12 passes through the fluid flow path 12c and is sprayed radially from the plurality of fluid outlets 12b toward the outside of the Bernoulli chuck 12. The carbonated water supplied to the liquid discharge member 13 passes through the liquid flow path 13b and is discharged from the plurality of liquid outlets 13a toward the outside of the liquid discharge member 13. In Figures 7(a) and 7(b), the arrows shown by dashed lines represent the flow of the ionized gas, and the arrows shown by solid lines represent the flow of the carbonated water.

[0046] FIG. 8 is a schematic diagram showing a workpiece W being polished while being supported by the workpiece support device 10 shown in FIG. 7. In FIG. 8, the ionized gas is indicated by dashed arrows, and the carbonated water is indicated by solid arrows. The ionized gas is ejected from the Bernoulli chuck 12 and spreads along the first surface 2a of the workpiece W. The carbonated water is ejected from the liquid ejection member 13 and spreads along the first surface 2a of the workpiece W. The ionized gas and carbonated water can neutralize the charge of the charged portion and remove static electricity. Therefore, the Bernoulli chuck 12 and liquid ejection member 13 of this embodiment can remove static electricity from the charged portions indicated by S1 and S2. Furthermore, the ionized gas and carbonated water spread along the first surface 2a of the workpiece W and reach the charged portion indicated by S3 of the workpiece W, thereby removing static electricity from the charged portion S3.

[0047] At least a portion of the Bernoulli chuck 12 and / or the liquid discharge member 13 in the embodiment shown in Figures 7 and 8 may be made of a conductive material and grounded. In particular, the portion of the Bernoulli chuck 12 facing the first surface 2a of the workpiece W and / or the portion of the liquid discharge member 13 facing the first surface 2a of the workpiece W may be made of a conductive material and grounded. Similarly, the roller 11 may be made of a conductive material and grounded. As a result, static electricity generated in the portion indicated by S1 can be removed via the Bernoulli chuck 12 and / or the liquid discharge member 13. Furthermore, static electricity generated in the portions indicated by S2 and S3 can be removed via the roller 11.

[0048] The above-described embodiments have been described for the purpose of enabling a person of ordinary skill in the art to practice the present invention. Various modifications of the above-described embodiments would be obvious to a person skilled in the art, and the technical concept of the present invention may be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments, but is to be interpreted in the broadest scope in accordance with the technical concept defined by the claims. [Explanation of symbols]

[0049] 1. Polishing equipment (workpiece processing equipment) 2a First side 2b Second side 3 Polishing tape (processing tool) 10 Workpiece support device 11 Roller 12 Bernoulli Chuck 12a Suction surface 12b Fluid outlet 12c Fluid flow path 13 Liquid discharge member 13a Liquid outlet 13b Liquid flow path 13c side wall 13d bottom 15 Fluid supply line 16 Fluid supply valve 17 Carbonated water supply line 18 Carbonated water supply valve 20 Polishing head (processing head) 21 Pressing member 22 Pressure mechanism 30 Polishing tape supply mechanism 31 Tape unwinding reel 32 Tape take-up reel 33 Reelbase 34 Guide roller 40 Ionizer 41 Carbonated Water Source 41A Pure water line 41B Carbon dioxide line 50 Operation control section

Claims

1. 1. A workpiece processing apparatus for processing a surface of a workpiece, comprising: a workpiece support device for supporting the workpiece; a processing head for processing the surface of the workpiece; The workpiece support device is a fluid supply line for flowing gas; an ionizer that ionizes the gas flowing through the fluid supply line; a Bernoulli chuck connected to the fluid supply line and configured to suck the surface of the workpiece by ejecting the ionized gas; a liquid discharge member disposed so as to surround the Bernoulli chuck and discharging carbonated water around the Bernoulli chuck; A workpiece processing apparatus comprising a carbonated water supply source for supplying the carbonated water to the liquid discharge member.

2. The workpiece processing apparatus of claim 1 , wherein at least a portion of the Bernoulli chuck and / or the liquid discharge member is made of a conductive material and is grounded.

3. the workpiece support device further includes a roller that contacts an edge of the workpiece; 3. The workpiece processing apparatus according to claim 1, wherein at least a portion of the roller is made of a conductive material and is grounded.

4. 4. The workpiece processing apparatus according to claim 2, wherein the conductive material is a conductive resin or a conductive ceramic.

5. 1. A method for treating a workpiece by treating a surface of the workpiece, comprising: While the surface of the workpiece is sucked by the Bernoulli chuck by ejecting ionized gas from the Bernoulli chuck, carbonated water is ejected onto the surface of the workpiece from a liquid ejection member disposed so as to surround the Bernoulli chuck; A workpiece processing method includes processing the surface of the workpiece, which is held by the Bernoulli chuck, with a processing head.

6. 6. The method of claim 5, wherein at least a portion of the Bernoulli chuck and / or the liquid delivery member is made of a conductive material and is grounded.

7. further comprising contacting a roller with an end of the workpiece to support the workpiece; 7. The method for processing a workpiece according to claim 5, wherein at least a portion of the roller is made of a conductive material and is grounded.

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