Coil components and coil modules

Abstract

To improve a coil component including a coil pattern provided on a substrate and a magnetic material layer covering the substrate.SOLUTION: A coil component 1 includes a substrate 10, a coil pattern 30 provided on one surface 11 of the substrate 10, and a magnetic material layer 20 covering the other surface 12 of the substrate 10. A laminated body S of the substrate 10 and the magnetic material layer 20 has a through-hole 40 provided on an open area 31a of the coil pattern 30. On this same basis, even if electronic components such as IC modules are arranged in the through-hole 40, there is no interference between the electronic components and the substrate 10.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a coil component and a coil module. [Background technology]

[0002] Patent Document 1 discloses a coil component including a coil pattern provided on one and the other surfaces of a substrate and a magnetic sheet covering the other surface of the substrate. The coil component described in Patent Document 1 has an opening provided in the magnetic sheet at a portion overlapping with the IC module to enable magnetic coupling with the IC module. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2020-195050 Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the present disclosure is to provide an improved coil component that includes a coil pattern provided on a substrate and a magnetic layer covering the substrate. [Means for solving the problem]

[0005] A coil component according to one embodiment of the present disclosure comprises a substrate, a coil pattern provided on one surface of the substrate, and a magnetic layer covering the other surface of the substrate, and the laminate of the substrate and the magnetic layer has a through hole provided in an opening region of the coil pattern. [Effects of the Invention]

[0006] According to the present disclosure, it is possible to provide an improved coil component that includes a coil pattern provided on a substrate and a magnetic layer that covers the substrate. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a schematic plan view showing the appearance of a coil device 1 according to a first embodiment of the present disclosure. [Figure 2] 2(a) is a schematic cross-sectional view taken along line AA shown in FIG. 1, and FIG. 2(b) is a schematic cross-sectional view taken along line BB shown in FIG. [Figure 3] FIG. 3 is a schematic plan view showing the structure of the other surface 12 of the substrate 10 in the coil device 1. As shown in FIG. [Figure 4] FIG. 4 is a schematic diagram illustrating a coil module including the coil component 1. As shown in FIG. [Figure 5] FIG. 5 is a schematic perspective view for explaining the structure of the IC module 52. As shown in FIG. [Figure 6] FIG. 6 is a schematic partial cross-sectional view of the coil device 1 mounted on a circuit board 50. As shown in FIG. [Figure 7] FIG. 7 is a schematic plan view showing the appearance of a coil device 2 according to the second embodiment of the present disclosure. [Figure 8] FIG. 8 is a schematic plan view showing the structure of the other surface 12 side of the substrate 10 in the coil device 2. As shown in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0008] Preferred embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings.

[0009] Fig. 1 is a schematic plan view showing the appearance of a coil device 1 according to a first embodiment of the present disclosure, Fig. 2(a) is a schematic cross-sectional view taken along line AA shown in Fig. 1, and Fig. 2(b) is a schematic cross-sectional view taken along line BB shown in Fig. 1.

[0010] As shown in Figures 1 and 2, the coil component 1 according to this embodiment includes a rectangular substrate 10, a coil pattern 30 provided on one surface 11 of the substrate 10, and a magnetic layer 20 covering the other surface 12 of the substrate 10. Figure 3 shows the structure of the other surface 12 of the substrate 10, i.e., the structure when the magnetic layer 20 is removed. The substrate 10 is a film made of an insulating resin material such as PET, and the coil pattern 30 is formed on both sides of the substrate 10. The thickness of the substrate 10 is not particularly limited, but can be about 20 to 30 µm.

[0011] The coil pattern 30 has a first pattern 31 and a second pattern 32 each consisting of multiple turns and provided on one surface 11 of the substrate 10, a first capacitor electrode pattern 33 provided on one surface 11 of the substrate 10, and a second capacitor electrode pattern 34 and a wiring pattern 35 provided on the other surface 12 of the substrate 10. The first pattern 31 is a section that wraps around the outer circumferential edge of the substrate 10 from the outer circumferential end of the coil pattern 30 over multiple turns. The second pattern 32 is a section that wraps around the inner circumferential end of the coil pattern 30 over multiple turns. Therefore, the second pattern 32 is disposed within an opening region 31a surrounded by the first pattern 31. The first capacitor electrode pattern 33, connected to the inner circumferential end of the coil pattern 30, is disposed within an opening region 32a surrounded by the second pattern 32.

[0012] The outer peripheral edge of the coil pattern 30 is connected to a wiring pattern 35 provided on the other surface 12 of the substrate 10 via a through-hole conductor 36 provided to penetrate the substrate 10. The wiring pattern 35 is a pattern that connects the through-hole conductor 36 and the second capacitor electrode pattern 34. As shown in FIG. 2(b), the first capacitor electrode pattern 33 and the second capacitor electrode pattern 34 overlap in the z-direction via the substrate 10, thereby forming a capacitor. In this way, the coil pattern 30 does not have an external terminal for DC connection and is a completely closed circuit in terms of DC. In the example shown in FIGS. 1 to 3, three first and second capacitor electrode patterns 33 and 34 are provided, but the number and shape of the first and second capacitor electrode patterns 33 and 34 are not particularly limited.

[0013] In this embodiment, most of the coil pattern 30 is provided on one surface 11 of the substrate 10, and only the second capacitor electrode pattern 34 and the wiring pattern 35 are provided on the other surface 12 of the substrate 10. The other surface 12 of the substrate 10 is covered with a magnetic layer 20. No magnetic layer is provided on the one surface 11 side of the substrate 10.

[0014] The magnetic layer 20 is made of a composite magnetic material that is a mixture of magnetic powder made of ferrite, metallic magnetic material, or the like, and resin, and can be formed by applying it to the other surface 12 of the substrate 10. Here, assuming that the thickness of the substrate 10 is T1, the thickness of the magnetic layer 20 is T2, and the pattern width of the coil pattern 30 is W, T1 <T2<W This is because the inductance of the coil pattern 30 can be sufficiently increased by making the thickness T2 of the magnetic layer 20 larger than the thickness T1 of the base material 10, and the flexibility of the laminate S made up of the base material 10 and the magnetic layer 20 can be sufficiently ensured by making the thickness T2 of the magnetic layer 20 smaller than the pattern width W of the coil pattern 30.

[0015] Here, since the second capacitor electrode pattern 34 and the wiring pattern 35 are provided on the other surface 12 of the substrate 10, a portion of the magnetic layer 20 is located on the second capacitor electrode pattern 34. That is, the magnetic layer 20 has a first region 21 that covers the other surface 12 of the substrate 10 without the second capacitor electrode pattern 34 therebetween, and a second region 22 that is located on the second capacitor electrode pattern 34. In this embodiment, the surfaces of the first region 21 and the second region 22 of the magnetic layer 20 are not flush with each other, and the surface of the second region 22 protrudes in the thickness direction more than the surface of the first region 21. This ensures that the magnetic layer 20 is sufficiently thick in the second region 22 as well, thereby ensuring sufficient inductance compared to when the surfaces of the first region 21 and the second region 22 are flush with each other. However, it is preferable that the thickness of the magnetic layer 20 be thicker in the first region 21 than in the second region 22. That is, when the thickness of the magnetic layer 20 in the first region 21 is T2 and the thickness of the magnetic layer 20 in the second region 22 is T2a, T2>T2a It is preferable that the thickness T2 be equal to or less than the thickness T3 of the second capacitor electrode pattern 34. This makes it possible to reduce the overall thickness. In this case, the difference between the thicknesses T2 and T2a (=T2-T2a) is preferably smaller than the thickness T3 of the second capacitor electrode pattern 34. This reduces in-plane variations in the thickness of the magnetic layer 20, thereby reducing in-plane variations in the magnetic properties. In this embodiment, since the magnetic layer 20 is applied to the other surface 12 of the base material 10, the other surface 12 of the base material 10 and the magnetic layer 20 share a boundary in the first region 21.

[0016] In this embodiment, a through hole 40 is provided in a laminate S made up of a substrate 10 and a magnetic layer 20. The through hole 40 is located within the opening region 31a of the first pattern 31 but outside the opening region 32a of the second pattern 32. By providing the through hole 40 within the opening region 31a defined by the first pattern 31 in this manner, it is possible to magnetically couple the first pattern 31 with an electronic component such as an IC module placed in the through hole 40. Furthermore, by locating the through hole 40 outside the opening region 32a of the second pattern 32, it is possible to ensure a sufficient area for the through hole 40 even when the second pattern 32 has a large number of turns. The method for forming the through hole 40 is not particularly limited, but it is preferable to apply the magnetic layer 20 to the entire other surface 12 of the substrate 10 and then remove a portion of the laminate S made up of the substrate 10 and the magnetic layer 20 by punching. This allows the through hole 40 to be formed in a simple manner, and also prevents misalignment between the portion of the through hole 40 where the base material 10 has been removed and the portion where the magnetic layer 20 has been removed.

[0017] FIG. 4 is a schematic diagram illustrating a coil module including the coil component 1 according to this embodiment.

[0018] 4, the coil component 1 according to this embodiment functions as an antenna coil on the circuit board 50 by being placed on the surface 51 of the circuit board 50. In this way, by making the coil component 1 including the coil pattern 30 a separate component from the circuit board 50 rather than forming the coil pattern 30 on the circuit board 50, design changes and the like become easier. An IC module 52 is mounted on the surface 51 of the circuit board 50, and when the coil component 1 is mounted in the mounting area 1a, the IC module 52 is disposed within the through-hole 40. This enables the IC module 52 to communicate with an external antenna such as a reader / writer via the coil component 1.

[0019] FIG. 5 is a schematic perspective view for explaining the structure of the IC module 52. As shown in FIG.

[0020] As shown in FIG. 5 , the IC module 52 includes an IC chip 54 mounted on or built into a module substrate 53, and a coupling coil 55 connected to the IC chip 54. When the IC module 52 is placed in the through hole 40 of the coil device 1, electromagnetic field coupling occurs between the coupling coil 55 and the first pattern 31 of the coil pattern 30 (the second pattern 62 of the coil pattern 60 in the second embodiment, which will be described later). This allows the IC module 52 and the coil device 1 to be connected to each other in an alternating current manner without directly connecting them using terminal electrodes. Here, when the IC module 52 is mounted on the circuit substrate 50, the IC chip 54 and the coupling coil 55 may be mounted directly on the circuit substrate 50. Furthermore, when the coil device 1 and the IC module 52 are mounted on an IC card, the module substrate 53 on which the IC chip 54 and the coupling coil 55 connected to the IC chip 54 are mounted or built may be mounted on a metal plate that constitutes part of the housing of the IC card, and the coil device 1 may be mounted between this metal plate and a cover that constitutes part of the housing of the IC card.

[0021] FIG. 6 is a schematic partial cross-sectional view of the coil device 1 mounted on a circuit board 50. As shown in FIG.

[0022] As shown in FIG. 6 , when the coil component 1 is mounted on the surface 51 of the circuit board 50, the IC module 52 is disposed within the through-hole 40. Because the magnetic layer 20 is removed within the through-hole 40, the first pattern 31 and the IC module 52 are magnetically coupled without being obstructed by the magnetic layer 20. Furthermore, because the base material 10 is also removed within the through-hole 40, the IC module 52 and the base material 10 do not interfere with each other even if the height H of the IC module 52 is greater than the thickness T2 of the magnetic layer 20. In other words, magnetic coupling is possible with IC modules 52 of any height. Furthermore, by using an IC module 52 whose height H is greater than the sum (T1 + T2) of the thickness T1 of the base material 10 and the thickness T2 of the magnetic layer 20, the difference in height between the first pattern 31 and the IC module 52 in the z direction becomes smaller, thereby enabling stronger magnetic coupling. Note that the above-described effect can also be achieved when the coil component 1 and the IC module 52 are mounted on an IC card by disposing the IC module 52 within the through-hole 40.

[0023] As described above, the coil component 1 according to this embodiment has the through-holes 40 formed in the laminate S of the substrate 10 and the magnetic layer 20, and therefore, when mounted on the circuit board 50, it is possible to prevent interference between the substrate 10 and the IC module 52 on the circuit board 50. Moreover, since the magnetic layer 20 is provided on the other surface 12 of the substrate 10 and the magnetic layer 20 is not provided on the surface 11 on which the first and second patterns 31, 32 are formed, it is possible to prevent an increase in stray capacitance between the first and second patterns 31, 32 and to prevent short-circuit defects between the patterns via the magnetic layer 20.

[0024] Fig. 7 is a schematic plan view showing the appearance of a coil device 2 according to a second embodiment of the present disclosure, and Fig. 8 is a schematic plan view showing the structure of the other surface 12 of the substrate 10 in the coil device 2.

[0025] 7 and 8, the coil device 2 according to the second embodiment differs from the coil device 1 according to the first embodiment in that the coil pattern 30 is replaced with a coil pattern 60. Since the other basic configurations are substantially the same as those of the coil device 1 according to the first embodiment, the same elements are denoted by the same reference numerals and redundant explanations will be omitted.

[0026] The coil pattern 60 includes a first pattern 61 and a second pattern 62 each consisting of multiple turns and provided on one surface 11 of the substrate 10, a first capacitor electrode pattern 63 provided on one surface 11 of the substrate 10, and a second capacitor electrode pattern 64 and wiring patterns 65 to 67 provided on the other surface 12 of the substrate 10. The first pattern 61 is a section that wraps around the outer peripheral edge of the substrate 10 in multiple turns. The second pattern 62 is disposed within an opening region 61a surrounded by the first pattern 61 and is a section that wraps around the periphery of the through hole 40 in multiple turns. That is, in this embodiment, the through hole 40 is located within the opening region 62a surrounded by the second pattern 62. The first capacitor electrode pattern 63, connected to the inner peripheral end of the first pattern 61, is disposed within the opening region 61a surrounded by the first pattern 61.

[0027] The outer peripheral edge of the first pattern 61 is connected to a wiring pattern 65 provided on the other surface 12 of the substrate 10 via a through-hole conductor 71 provided to penetrate the substrate 10. The wiring pattern 65 is a pattern that connects the through-hole conductor 71 and the second capacitor electrode pattern 64. The second capacitor electrode pattern 64 overlaps with the first capacitor electrode pattern 63 in the z direction via the substrate 10. In the examples shown in FIGS. 7 and 8, two first and two second capacitor electrode patterns 63, 64 are provided, but the numbers and shapes of the first and second capacitor electrode patterns 63, 64 are not particularly limited.

[0028] As shown in FIG. 7 , first pattern 61 is divided midway through a turn, with one end of the division connected to through-hole conductor 72 and the other end connected to through-hole conductor 73. Through-hole conductor 72 is connected to through-hole conductor 74 via wiring pattern 66 provided on the other surface 12 of substrate 10. Through-hole conductor 74 is connected to the inner peripheral end of second pattern 62. The outer peripheral end of second pattern 62 is connected to one end of wiring pattern 67 provided on the other surface 12 of substrate 10 via through-hole conductor 75. The other end of wiring pattern 67 is connected to through-hole conductor 73. As a result, second pattern 62 is inserted midway through a turn of first pattern 61.

[0029] As described above, in the coil device 2 according to the present embodiment, the second pattern 62 wraps around the periphery of the through hole 40, which makes it possible to enhance the magnetic coupling between the second pattern 62 and an electronic component such as an IC module placed in the through hole 40. Moreover, because an external antenna such as a reader / writer is magnetically coupled to the first pattern 61, and an electronic component such as an IC module placed in the through hole 40 is magnetically coupled to the second pattern 62, it becomes easy to change the design and adjust the characteristics.

[0030] The above describes preferred embodiments of the present disclosure, but the present disclosure is not limited to the above embodiments, and various modifications are possible within the scope of the present disclosure, and it goes without saying that these modifications are also included within the scope of the present disclosure.

[0031] The technology according to the present disclosure includes, but is not limited to, the following configuration examples.

[0032] The coil component according to the present disclosure includes a substrate, a coil pattern provided on one surface of the substrate, and a magnetic layer covering the other surface of the substrate, and the laminate of the substrate and the magnetic layer has a through hole provided in an opening region of the coil pattern. This prevents interference between the electronic component and the substrate, even if an electronic component such as an IC module is placed inside the through hole.

[0033] The coil pattern includes a first pattern that defines an opening region and a second pattern that is provided in the opening region, and the through-hole may be located outside the opening region of the second pattern. This makes it possible to ensure a sufficient area for the through-hole even when the second pattern has a large number of turns.

[0034] The coil pattern may include a first pattern that defines the opening area and a second pattern that is provided in the opening area and wraps around the periphery of the through hole, thereby enhancing magnetic coupling between the second pattern and an electronic component such as an IC module placed inside the through hole.

[0035] The thickness of the magnetic layer may be greater than the thickness of the substrate and smaller than the pattern width of the coil pattern, which makes it possible to ensure sufficient inductance of the coil pattern while also ensuring sufficient flexibility of the laminate consisting of the substrate and the magnetic layer.

[0036] The coil component according to the present disclosure further includes a first capacitor electrode pattern provided on one surface of the substrate and arranged in the opening region, and a second capacitor electrode pattern provided on the other surface of the substrate and overlapping the first capacitor electrode pattern, and the first and second capacitor electrode patterns may be connected to the coil pattern. This makes it possible to configure an LC resonant circuit by the capacitor formed by the first and second capacitor electrode patterns and the coil pattern.

[0037] The surface of the magnetic layer may have a second region located on the second capacitor electrode pattern that protrudes in the thickness direction more than a first region that covers the other surface of the base without the second capacitor electrode pattern, thereby ensuring a sufficient thickness of the magnetic layer in the second region.

[0038] The thickness of the magnetic layer may be greater in the first region than in the second region, which allows the overall thickness to be reduced.

[0039] The difference in thickness between the first and second regions of the magnetic layer may be smaller than the thickness of the second capacitor electrode pattern, thereby suppressing variations in the magnetic properties within the surface of the magnetic layer.

[0040] The coil module according to the present disclosure includes the coil component and an IC module disposed in the through hole. By accommodating the IC module in the through hole, the component size can be reduced, and magnetic coupling between the coil pattern and the electronic component, such as the IC module, disposed in the through hole can be ensured. [Explanation of symbols]

[0041] 1,2 Coil parts 1a Loading area 10 Base material 11 One surface of the substrate 12 Other surface of the substrate 20 Magnetic layer 30 coil patterns 31 First Pattern 32 Second Pattern 31a,32a Opening area 33 First capacitor electrode pattern 34 Second capacitor electrode pattern 35 Wiring Pattern 36 through-hole conductor 40 through holes 50 Circuit Board 51 Circuit board surface 52 IC modules 53 Module Board 54 IC chip 55 Coupling coil 60 coil patterns 61 First Pattern 62 Second Pattern 61a,62a Opening area 63 First capacitor electrode pattern 64 Second capacitor electrode pattern 65~67 Wiring pattern 71~75 Through-hole conductors S laminate

Claims

1. A substrate; a coil pattern provided on one surface of the substrate; a magnetic layer covering the other surface of the substrate; a first capacitor electrode pattern provided on the one surface of the base material and arranged within an opening region of the coil pattern; a second capacitor electrode pattern provided on the other surface of the base material and overlapping the first capacitor electrode pattern; the laminate of the substrate and the magnetic layer has a through hole provided in the opening region, the first and second capacitor electrode patterns are connected to the coil pattern; a coil component in which a second region located on the second capacitor electrode pattern protrudes in the thickness direction of the surface of the magnetic layer more than a first region covering the other surface of the substrate without the second capacitor electrode pattern therebetween.

2. the coil pattern includes a first pattern that defines the opening region and a second pattern that is provided in the opening region; The coil component according to claim 1 , wherein the through hole is located outside an opening area of ​​the second pattern.

3. The coil component according to claim 1 , wherein the coil pattern includes a first pattern that defines the opening region, and a second pattern that is provided in the opening region and that wraps around the periphery of the through hole.

4. The coil component according to claim 1 , wherein the thickness of the magnetic layer is greater than the thickness of the base material and smaller than the pattern width of the coil pattern.

5. The coil component according to claim 1 , wherein the magnetic layer is thicker in the first region than in the second region.

6. The coil component according to claim 5 , wherein a difference in thickness between the first region and the second region of the magnetic layer is smaller than a thickness of the second capacitor electrode pattern.

7. The coil component according to any one of claims 1 to 6, an IC module disposed in the through hole.

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