Processing method and dicing device

Abstract

To be able to suppress processing defects.SOLUTION: A method for processing a package substrate in which multiple intersecting division scheduled lines are set includes a contamination confirmation step 1001 of photographing, by a camera, a holding table in which relief grooves for a cutting blade are formed in areas corresponding to the division scheduled lines and suction holes for sucking in and holding the package substrate are formed in the areas defined by the relief grooves, and checking contamination on the holding table, a cleaning step 1003 of supplying a cleaning liquid to the holding table to clean the holding table when contamination is confirmed in the contamination confirmation step 1001, a holding step 1004 of holding the package substrate on the holding table, and a dicing step 1005 of cutting and dividing the package substrate held by the holding table along the division scheduled lines with the cutting blade.SELECTED DRAWING: Figure 10

Description

[Technical Field]

[0001] The present invention relates to a method for processing a package substrate on which a plurality of intersecting planned division lines are set, and a dicing apparatus for dicing the package substrate. [Background technology]

[0002] In dicing machines, tape is applied to the workpiece before dicing to facilitate handling of the workpiece after division, and the tape is discarded after the workpiece is picked up from the tape after dicing. On the other hand, in order to reduce tape costs, a dicing machine has been proposed that processes the package substrate by directly holding it by suction on a holding table without using tape (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2018-078253 Summary of the Invention [Problem to be solved by the invention]

[0004] In the dicing device described in Patent Document 1 and elsewhere, cutting chips generated when a package substrate is diced with a cutting blade are taken up in the cutting fluid, scattered within the dicing device, and adhere to the side walls, ceiling, cutting unit, etc. within the processing chamber of the dicing device.

[0005] In the dicing device described in Patent Document 1 and elsewhere, when cutting fluid containing cutting debris drips and accumulates on the holding table after the package substrate is removed, dirt gets trapped between the package substrate to be processed next and the holding surface of the holding table, creating a gap between the holding table and the held surface of the package substrate.

[0006] In the dicing device described in Patent Document 1 and elsewhere, negative pressure leaks from this gap, preventing the package substrate from being adequately suction-held, which can cause the package substrate to move during dicing, resulting in processing defects. Also, if dirt adheres to and accumulates in the suction holes in the holding table, this can lead to a decrease in suction force, causing similar problems.

[0007] Therefore, an object of the present invention is to provide a processing method and a dicing apparatus that can suppress processing defects. [Means for solving the problem]

[0008] In order to solve the above-mentioned problems and achieve the object, the processing method of the present invention is a method for processing a package substrate on which a plurality of intersecting planned division lines are set, and is characterized by comprising: a dirt confirmation step of using a camera to capture an image of a holding table on which a cutting blade escape groove is formed in an area corresponding to the planned division lines and suction holes for suction-holding the package substrate are formed in each area partitioned by the escape grooves, and checking for dirt on the holding table; a cleaning step of supplying a cleaning liquid to the holding table to clean the holding table if dirt is confirmed in the dirt confirmation step; a holding step of holding the package substrate on the holding table; and a dicing step of cutting the package substrate held on the holding table along the planned division lines with a cutting blade to divide it.

[0009] The processing method may further include a carrying-out step of carrying out the divided package substrates from the holding table after the dicing step is performed.

[0010] In the above processing method, the cleaning step may include spraying the cleaning liquid onto the holding table from a cleaning liquid supply nozzle disposed adjacent to the cutting blade to clean the holding table.

[0011] In the above processing method, the cleaning liquid may be a mixture of two fluids, water and air.

[0012] The dicing apparatus of the present invention is a dicing apparatus for dicing a package substrate on which a plurality of intersecting planned division lines are set, and comprises: a holding table in which relief grooves for a cutting blade are formed in areas of the package substrate to be diced corresponding to the planned division lines and in which suction holes for suction-holding the package substrate are formed in each of the areas partitioned by the relief grooves; a cutting blade for dicing the package substrate held by the holding table; a camera for imaging the holding table; a cleaning liquid supply nozzle for supplying cleaning liquid to the holding table; and a controller for controlling at least the cleaning liquid supply nozzle, wherein the controller checks for dirt on the holding table based on the image formed by imaging the holding table with the camera, and if dirt is confirmed, supplies the cleaning liquid to the holding table from the cleaning liquid supply nozzle. [Effects of the Invention]

[0013] The present invention has an effect of suppressing processing defects. [Brief explanation of the drawings]

[0014] [Figure 1] FIG. 1 is a perspective view showing an example of the configuration of a dicing device according to the first embodiment. [Figure 2] FIG. 2 is a plan view of a package substrate to be processed by the processing method and dicing device according to the first embodiment. [Figure 3] FIG. 3 is a side view of the package substrate shown in FIG. [Figure 4] FIG. 4 is a plan view of the back surface side of the package substrate shown in FIG. [Figure 5] 5 is a plan view of the holding table of the dicing apparatus shown in FIG. [Figure 6] FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. [Figure 7] 7 is an enlarged perspective view showing a main part of the holding table shown in FIG. [Figure 8]8 is a front view of the cutting unit of the dicing apparatus shown in FIG. [Figure 9] FIG. 9 is a diagram showing an example of a reference image stored in the storage unit of the controller of the dicing machine shown in FIG. [Figure 10] FIG. 10 is a flowchart showing the flow of the processing method according to the first embodiment. [Figure 11] FIG. 11 is a diagram illustrating a captured image formed in the stain checking step of the processing method shown in FIG. [Figure 12] FIG. 12 is a cross-sectional view showing an example of a cleaning step in the processing method shown in FIG. [Figure 13] FIG. 13 is a side view, partly in section, showing the holding step of the processing method shown in FIG. [Figure 14] FIG. 14 is a side view, partly in section, showing the dicing step of the processing method shown in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0015] Modes (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiment 1. Furthermore, the components described below include those that can be easily imagined by a person skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Furthermore, various omissions, substitutions, or modifications of the configuration can be made within the scope of the gist of the present invention.

[0016] [Embodiment 1] A dicing apparatus 1 according to a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing an example of the configuration of the dicing apparatus according to the first embodiment. FIG. 2 is a plan view of a package substrate that is an object to be processed by the processing method and dicing apparatus according to the first embodiment. FIG. 3 is a side view of the package substrate shown in FIG. 2. FIG. 4 is a plan view of the back side of the package substrate shown in FIG. 2. FIG. 5 is a plan view of a holding table of the dicing apparatus shown in FIG. 1. FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. 5. FIG. 7 is an enlarged perspective view of a main part of the holding table shown in FIG. 5. FIG. 8 is a front view of a cutting unit of the dicing apparatus shown in FIG. 1. FIG. 9 is a diagram showing an example of a reference image stored in a memory unit of a controller of the dicing apparatus shown in FIG. 1.

[0017] The dicing device shown in FIG. 1 according to the first embodiment is a processing device that dices (cuts) the package substrate 200 shown in FIGS.

[0018] (Package substrate) The package substrate 200 to be processed by the dicing apparatus 1 according to the first embodiment is formed in a rectangular, flat plate shape in plan view, as shown in Fig. 2. The package substrate 200 includes a rectangular, flat base substrate 202, and has a device region 204 on a surface 203 of the base substrate 202, and a peripheral excess region 205 surrounding the device region 204. The base substrate 202 is made of a metal such as a metal containing copper (i.e., a copper alloy).

[0019] The device region 204 has a plurality of dividing lines 206 that intersect with each other. One of the plurality of dividing lines 206 that intersect with each other extends in a direction parallel to the longitudinal direction of the base substrate 202, and the other dividing line 206 extends in a direction perpendicular to the longitudinal direction of the base substrate 202 and parallel to the width direction of the base substrate 202. Device chips 208 are arranged in regions 207 defined by the plurality of dividing lines 206 that intersect with each other. The dividing lines 206 penetrate the base substrate 202. The region 207 is formed by a portion of the base substrate 202, and the device chips 208 are arranged on a back surface 210 (shown in FIG. 4, etc.) behind the front surface 203. Electrodes 209 for connecting the package chip 201 to a wiring board or the like are provided on each dividing line 206.

[0020] The electrodes 209 are formed by parts of the base substrate 202, and in the first embodiment, are provided at the center of the width direction of the planned division lines 206, and are formed linearly in a direction perpendicular to the planned division lines 206. The electrodes 209 are connected to the device chip 208 by wires or the like (not shown).

[0021] In the first embodiment, a plurality of device regions 204 (three in the first embodiment) are arranged at intervals in the longitudinal direction of the base substrate 202. The peripheral surplus region 205 is an area in which no device chips 208 are arranged, and is formed by the base substrate 202, surrounding the entire periphery of each device region 204 and connecting adjacent device regions 204 together.

[0022] 3 and 4, the package substrate 200 includes a sealing resin 211 that seals (coats) the back surface 210 side of each device region 204. The sealing resin 211 is made of a thermoplastic resin, and seals (coats) the device chips 208 and wires arranged on the back surface 210 of the region 207 of the base substrate 202, and is also filled within the division lines 206. The sealing resin 211 seals (coats) the entire device regions 204 on the back surface 210 side of the base substrate 202. On the front surface 203 side of the base substrate 202, the sealing resin 211 seals the region 207 where the device chips 208 are arranged and the inside of the division lines 206, leaving the electrodes 209 exposed.

[0023] The package substrate 200 is cut at the center of the width of each division line 206 in each device region 204, dividing the electrodes 209 into two and separating them into individual package chips 201. As described above, the package substrate 200, which is the processing target of the processing method and dicing apparatus 1 according to the first embodiment, is a QFN substrate in which metal electrodes 209 are arranged along the division lines 206 cut by the cutting blade 21. Note that, in the first embodiment, the package substrate 200 is a QFN (Quad Flat Non-leaded Package) substrate in which the electrodes 209 are arranged along the division lines 206, but is not limited thereto and may also be a CSP (Chip Scale Packaging) substrate. Also, in the first embodiment, the package chips 201 separated from the package substrate 200 are small chips, with each side measuring approximately 1 mm × 1 mm.

[0024] 2, in the package substrate 200, alignment marks 212 indicating cutting positions of the division lines 206 during cutting are provided on both ends of the division lines 206 on the surface 203 of the base substrate 202. In the first embodiment, the alignment marks 212 are arranged at positions aligned with the centers of the respective division lines 206 in the width direction.

[0025] (dicing equipment) The dicing device 1 according to the first embodiment is a processing device that holds a package substrate 200 on a holding table 10 and performs dicing (cutting) along a plurality of planned division lines 206 to divide the package substrate 200 into individual package chips 201. In the first embodiment, the dicing device 1 is a processing device (a so-called jig dicer) that holds the package substrate 200, to which no dicing tape is attached, directly on the holding table 10 and performs a so-called full cut on the package substrate 200 to divide the package chips 201.

[0026] As shown in FIG. 1, the dicing device 1 includes a holding table 10 shown in FIG. 5 that holds the package substrate 200 by suction on a holding surface 11, a cutting unit 20 having a cutting blade 21 that dices the package substrate 200 held on the holding table 10, a camera 30 that photographs the holding table 10 and the package substrate 200 held on the holding table 10, and a controller 100.

[0027] 1, the dicing apparatus 1 includes a moving unit 40 that moves the holding table 10 and the cutting unit 20 relatively. The moving unit 40 includes an X-axis moving unit 41, a Y-axis moving unit 42, a Z-axis moving unit 43, and a rotational moving unit 44.

[0028] The X-axis movement unit 41 moves the holding table 10 and the rotational movement unit 44 in the X-axis direction, which is parallel to the horizontal direction, which is the processing feed direction, thereby moving the cutting unit 20 and the holding table 10 relatively along the X-axis direction. The X-axis movement unit 41 supports a table base 50 shown in Figures 1 and 6 on which the rotational movement unit 44 and the holding table 10 are mounted, and moves them in the X-axis direction.

[0029] The Y-axis movement unit 42 moves the cutting unit 20 in the Y-axis direction, which is parallel to the horizontal direction, which is the indexing feed direction, and perpendicular to the X-axis direction, thereby moving the cutting unit 20 and the holding table 10 relatively along the Y-axis direction. The Z-axis movement unit 43 moves the cutting unit 20 in the Z-axis direction, which is perpendicular to both the X-axis direction and the Y-axis direction, which are the cutting feed directions, thereby moving the cutting unit 20 and the holding table 10 relatively along the Z-axis direction.

[0030] The rotary movement unit 44 supports the table base 50, is supported by the X-axis movement unit 41, and is disposed so as to be movable in the X-axis direction together with the holding table 10 attached to the table base 50. The rotary movement unit 44 rotates the holding table 10 attached to the table base 50 around an axis parallel to the Z-axis direction.

[0031] The X-axis moving unit 41, the Y-axis moving unit 42, and the Z-axis moving unit 43 each include a well-known ball screw rotatably mounted about its axis, a well-known motor for rotating the ball screw about its axis, and a well-known guide rail for supporting the holding table 10 or the cutting unit 20 movably in the X-axis, Y-axis, or Z-axis direction. The rotational moving unit 44 also includes a motor for rotating the table base 50, on which the holding table 10 is mounted, about its axis.

[0032] The holding table 10 is attached to a table base 50 and holds the package substrate 200 by suction on a holding surface 11. The holding table 10 is attached to the table base 50 and rotated about an axis parallel to the Z-axis direction by a rotational movement unit 44. The holding table 10 is attached to the table base 50 and moved in the X-axis direction together with the rotational movement unit 44 by an X-axis movement unit 41.

[0033] The table base 50 is supported by the rotary movement unit 44 and, together with the rotary movement unit 44, is supported by the X-axis movement unit 41. The table base 50 is formed in a rectangular shape with an outer shape larger than that of the package substrate 200. As shown in FIG. 5 , a suction path 54 connected to a suction source 53 via an on-off valve 52 opens at the center of the upper surface 51 of the table base 50. The suction path 54 opens in an area corresponding to the device area 204 of the package substrate 200 held by the holding table 10 attached to the upper surface 51 and penetrates the table base 50. Note that in this specification, the corresponding area refers to an area overlapping in the thickness direction (in the Z-axis direction in the first embodiment). Furthermore, a holding table suction path 56 connected to the suction source 53 via an on-off valve 55 opens at the outer edge of the upper surface 51 of the table base 50. The holding table suction path 56 penetrates the table base 50.

[0034] The holding table 10 has a rectangular shape whose outer shape is larger than that of the package substrate 200 and has a constant thickness. In the first embodiment, the outer shape of the holding table 10 is the same as that of the table base 50. The holding table 10 is placed on the upper surface 51 of the table base 50, and the on-off valve 55 is opened and the holding table suction path 56 is sucked by the suction source 53, thereby fixing the holding table 10 to the upper surface 51 of the table base 50. The holding table 10 is attached to the table base 50 in this manner.

[0035] The holding table 10 suction-holds the package substrate 200 to be diced on the holding surface 11, which is the upper surface. As shown in Figures 5 and 6, the holding table 10 has formed on the holding surface 11 an escape groove 12 into which the cutting blade 21 enters during dicing, and suction holes 13 for sucking the package substrate 200 and package chips 201. The escape groove 12 is formed in an area corresponding to the planned division lines 206 of the package substrate 200 to be diced (i.e., an area overlapping in the thickness direction), and extends linearly from the escape groove 12 in a recessed manner along the planned division lines 206.

[0036] The suction holes 13 are formed in regions defined by the clearance grooves 12 of the holding surface 11, i.e., regions corresponding to the package chips 201 individually separated from the package substrate 200 (i.e., regions overlapping in the thickness direction), and penetrate the holding table 10 in the thickness direction. In the first embodiment, the suction holes 13 correspond one-to-one to the package chips 201. When the holding table 10 is mounted on the table base 50, the suction holes 13 are connected to a suction source 53 via a suction path 54 and an on-off valve 52.

[0037] 5, 6, and 7, the holding table 10 has recesses 14 formed around the suction holes 13 in each region defined by the relief grooves 12 on the holding surface 11. The recesses 14 are recessed from the holding surface 11 and are formed all around the periphery of the suction holes 13. The recesses 14 form steps 15 around the suction holes 13 in each region defined by the relief grooves 12 on the holding surface 11.

[0038] The sealing resin 211 side of the package substrate 200 is placed on the holding surface 11 of the holding table 10. The holding table 10 suction-holds the package substrate 200 and the package chip 201 on the holding surface 11 by opening the on-off valve 52 and suctioning the suction holes 13 with the suction source 53. The holding table 10 has steps 15 formed around the suction holes 13 in each region defined by the relief grooves 12 on the holding surface 11, so that the suction force from the suction source 53 increases the contact area with the package chip 201 compared to a state where there are no recesses 14, i.e., no steps 15. In the first embodiment, the holding table 10 is a so-called jig table that suction-holds the package substrate 200, to which no dicing tape is attached, directly on the holding surface 11.

[0039] The cutting unit 20 is a processing unit in which a cutting blade 21 is attached to a spindle 23 shown in FIG. 8 and which dices a package substrate 200 held on the holding table 10. When the cutting unit 20 dices the package substrate 200, cutting chips are generated. The cutting unit 20 is provided so as to be movable in the Y-axis direction by a Y-axis movement unit 42 and movable in the Z-axis direction by a Z-axis movement unit 43 relative to the package substrate 200 held on the holding table 10. As shown in FIG. 1, the cutting unit 20 is provided on a support frame 3 erected from the apparatus main body 2 via the Y-axis movement unit 42, the Z-axis movement unit 43, and the like. The cutting unit 20 can position the cutting blade 21 at any position on the holding surface 11 of the holding table 10 by the Y-axis movement unit 42 and the Z-axis movement unit 43.

[0040] The cutting unit 20 includes a cutting blade 21, a spindle housing 22 that is movable in the Y-axis and Z-axis directions by a Y-axis moving unit 42 and a Z-axis moving unit 43, a spindle 23 that is rotatable about its axis on the spindle housing 22 and has the cutting blade 21 attached to its tip, a spindle motor (not shown) that rotates the spindle 23 about its axis, a blade cover 24 that is attached to the tip surface of the spindle 23, and a cutting water nozzle 25 that supplies cutting water to the cutting blade 21.

[0041] The cutting blade 21 is an extremely thin cutting grindstone having a substantially ring shape. The cutting blade 21 is fixed to the tip of the spindle 23. In the first embodiment, as shown in FIG. 8, the cutting blade 21 is a so-called hub blade that includes an annular circular base and an annular cutting blade disposed on the outer periphery of the circular base and cutting the package substrate 200. The cutting blade is made of abrasive grains such as SiC, alumina, diamond, or CBN (Cubic Boron Nitride), and a bond (binding material) such as metal or resin that fixes the abrasive grains, and is formed to a predetermined thickness. Note that in the present invention, the cutting blade 21 may also be a so-called washer blade that is composed only of a cutting blade.

[0042] The cutting blade 21 is attached to the tip of the spindle 23, and is rotated around its axis by a spindle motor, thereby rotating the cutting blade 21. The spindle motor is provided with a rotor that is attached to the spindle 23 and rotates integrally with the spindle 23, and a stator that is disposed on the outer periphery of the rotor and in the spindle housing 22, and rotates the rotor when power is supplied from a power source. In the spindle motor, the stator rotates the rotor, causing the spindle 23 to rotate around its axis.

[0043] The blade cover 24 covers at least the upper part of the cutting blade 21. The blade cover 24 is fixed to the tip surface of the spindle housing 22.

[0044] The cutting water nozzle 25 supplies cutting water to the cutting blade 21 when the cutting blade 21 dices the package substrate 200 held by the holding surface 11 of the holding table 10. As shown in FIG. 8 , the cutting water nozzle 25 includes a shower nozzle 26 and a pair of blade nozzles 27.

[0045] The nozzles 26, 27 are attached to the blade cover 24, and cutting water is supplied from a cutting water supply source (not shown). The shower nozzle 26 has an injection port 261 that faces the cutting edge of the cutting blade 21 in the X-axis direction, and supplies cutting water from the injection port 261 to the cutting edge of the cutting blade 21 during cutting.

[0046] The blade nozzles 27 extend parallel to the X-axis direction and are spaced apart from one another in the Y-axis direction. The blade nozzles 27 position the lower ends of the cutting edges of the cutting blades 21 between them and are provided with injection ports 271 that face the lower ends of the cutting edges of the cutting blades 21. The blade nozzles 27 supply cutting water from the injection ports 271 to the lower ends of the cutting edges of the cutting blades 21 during cutting.

[0047] The camera 30 is fixed to the cutting unit 20 or the like so as to move integrally with the cutting unit 20. The camera 30 is equipped with an imaging element that captures an image of the region to be divided of the package substrate 200 held on the holding table 10 before cutting. The imaging element is, for example, a charge-coupled device (CCD) imaging element or a complementary metal-oxide semiconductor (CMOS) imaging element. The camera 30 captures an image of the package substrate 200 held on the holding table 10, forms an image for performing alignment between the package substrate 200 and the cutting blade 21, and outputs the formed image to the controller 100. The image captured and formed by the controller 100 is a grayscale image defined by multiple levels of brightness (for example, 256 levels). In this image, the brightness of each pixel is determined.

[0048] The dicing apparatus 1 also includes an X-axis position detection unit (not shown) for detecting the position of the holding table 10 in the X-axis direction, a Y-axis position detection unit (not shown) for detecting the position of the cutting unit 20 in the Y-axis direction, and a Z-axis position detection unit for detecting the position of the cutting unit 20 in the Z-axis direction. The X-axis position detection unit and the Y-axis position detection unit can be configured with a linear scale parallel to the X-axis direction or the Y-axis direction, and a reading head. The Z-axis position detection unit detects the position of the cutting unit 20 in the Z-axis direction using motor pulses. The X-axis position detection unit, the Y-axis position detection unit, and the Z-axis position detection unit output the position of the holding table 10 in the X-axis direction and the position of the lower end of the cutting blade of the cutting unit 20 in the Y-axis direction or the Z-axis direction to the controller 100.

[0049] In the first embodiment, the positions of the holding table 10 and cutting unit 20 of the dicing apparatus 1 in the X-axis direction, Y-axis direction, and Z-axis direction are determined based on predetermined reference positions (not shown).

[0050] In addition, in the first embodiment, the dicing apparatus 1 includes a cleaning liquid supply nozzle 60, as shown in FIG. 8. In the first embodiment, the cleaning liquid supply nozzle 60 is attached to the blade cover 24 and disposed adjacent to the cutting blade 21. In the first embodiment, the cleaning liquid supply nozzle 60 includes an ejection port 61 that can face the holding surface 11 of the holding table 10 along the Z-axis direction. The cleaning liquid supply nozzle 60 ejects cleaning liquid 63 supplied from a cleaning liquid supply source 62 from the ejection port 61, thereby supplying the cleaning liquid 63 to the holding surface 11 of the holding table 10. In the first embodiment, the cleaning liquid 63 is a two-fluid mixture of water and pressurized air, but the present invention is not limited to a two-fluid mixture.

[0051] 1, the dicing apparatus 1 also includes a carry-out unit 70. The carry-out unit 70 carries out a plurality of packaged chips 201, which have been individually separated from the package substrate 200, from the holding surface 11 of the holding table 10. A lower surface 71 of the carry-out unit 70, which is made of a porous material such as porous ceramics, is connected to a suction source (not shown), and the lower surface 71 is sucked by the suction source, thereby suction-holding the plurality of packaged chips 201 on the holding surface 11 of the holding table 10 to the lower surface 71. In the first embodiment, the carry-out unit 70 suction-holds all of the packaged chips 201 on the holding surface 11 of the holding table 10 to the lower surface 71, and carries them out from the holding surface 11 of the holding table 10.

[0052] The controller 100 controls each component of the dicing apparatus 1 to cause the dicing apparatus 1 to perform processing operations on the package substrate 200. That is, the controller 100 controls at least the cleaning liquid supply nozzle 60. The controller 100 is a computer having an arithmetic processing device with a microprocessor such as a central processing unit (CPU), a storage device with memory such as a read only memory (ROM) or a random access memory (RAM), and an input / output interface device. The arithmetic processing device of the controller 100 performs arithmetic processing in accordance with a computer program stored in the storage device and outputs control signals for controlling the dicing apparatus 1 to each component of the dicing apparatus 1 via the input / output interface device.

[0053] The controller 100 is connected to a display unit configured with a liquid crystal display device or the like that displays the status of the machining operation, images, etc., and an input unit that the operator uses to register machining content information, etc. The input unit is configured with a touch panel provided on the display unit.

[0054] 1, the controller 100 includes a control unit 101, a storage unit 102, and a determination cleaning unit 103. The control unit 101 controls each component of the dicing apparatus 1 to cause the dicing apparatus 1 to perform a processing operation on the package substrate 200.

[0055] The storage unit 102 stores a reference image 300, as shown in FIG. 9 . The reference image 300 is formed by the camera 30 capturing an image of the holding surface 11 of the holding table 10, where no foreign matter such as cutting chips is attached. For this purpose, the reference image 300 is a grayscale image defined by multiple levels of brightness (e.g., 256 levels). The brightness of each pixel in the reference image 300 is determined. In the example shown in FIG. 9 , the reference image 300 is an image formed by capturing an image of a portion of the holding surface 11. However, in the present invention, if the camera 30 can capture an image of the entire holding surface 11 at once, the image may be formed by capturing an image of the entire holding surface 11. In the first embodiment, the storage unit 102 stores multiple images formed by the camera 30 capturing an image of a portion of the holding surface 11, and stores an image of the entire holding surface 11 as multiple reference images 300. That is, in the first embodiment, the storage unit 102 stores the entire holding surface 11 divided into multiple reference images 300.

[0056] The determining cleaning unit 103 checks for dirt on the holding table 10 based on a captured image 301 (illustrated in FIG. 11 ) formed by the camera 30 capturing an image of the holding surface 11, and if dirt is detected, supplies cleaning liquid 63 from the cleaning liquid supply nozzle 60 to the holding surface 11. Note that, like the reference image 300, the captured image 301 is a grayscale image defined by multiple levels of brightness (for example, 256 levels), and the brightness of each pixel is set.

[0057] The determining cleaning unit 103 compares the reference image 300 with a captured image 301 formed by the camera 30 by capturing an image of the same position on the holding surface 11 as that of the reference image 300, and determines whether cutting debris is attached to the holding surface 11, thereby checking for dirt on the holding table 10. Specifically, the determining cleaning unit 103 calculates the difference in brightness of the same pixel between the reference image 300 and the captured image 301 formed by the camera 30 by capturing an image of the same position on the holding surface 11 as that of the reference image 300, and determines whether the calculated difference in brightness exceeds a predetermined value.

[0058] If the calculated brightness difference exceeds a predetermined value for even one pixel, the determining cleaning unit 103 determines that cutting debris is attached to the holding surface 11, i.e., that the holding table 10 is dirty. If the calculated brightness difference for all pixels is equal to or less than a predetermined value, the determining cleaning unit 103 determines that cutting debris is not attached to the holding surface 11, i.e., that the holding table 10 is not dirty. When the determining cleaning unit 103 determines that cutting debris is attached to the holding surface 11, i.e., that the holding table 10 is dirty, it controls the moving unit 40 to position the cleaning liquid supply nozzle 60 directly above the location on the holding surface 11 where the cutting debris is attached, i.e., the dirty location on the holding table 10, and supplies cleaning liquid 63 from the nozzle 61 of the cleaning liquid supply nozzle 60 to the holding surface 11, thereby removing the cutting debris from the holding surface 11 and the dirt from the holding table 10. The determining cleaning section 103 supplies cleaning liquid 63 only to the parts of the holding surface 11 where cutting chips are attached, i.e., only to the dirty parts of the holding table 10, and cleans only the parts of the holding surface 11 where cutting chips are attached, i.e., only to the dirty parts of the holding table 10.

[0059] The functions of the control unit 101 and the determination cleaning unit 103 are realized by the arithmetic processing device performing arithmetic processing in accordance with a computer program stored in the storage device. The function of the storage unit 102 is realized by the storage device.

[0060] (Processing method) Next, a processing method according to the first embodiment of the present invention will be described with reference to the drawings. Fig. 10 is a flowchart showing the flow of the processing method according to the first embodiment. The processing method according to the first embodiment is a processing method for dividing a package substrate 200 into individual package chips 201, and is also a processing operation of a dicing apparatus 1.

[0061] In the dicing apparatus 1, the holding table 10 is placed on the upper surface 51 of the table base 50, and the controller 100 receives and stores processing conditions input from an input unit or the like. When the controller 100 receives a processing start command from an operator or the like, the control unit 101 rotates the spindle 23 of the cutting unit 20, i.e., the cutting blade 21, about its axis, drives the suction source 53, opens the on-off valve 55, attaches the holding table 10 to the table base 50, and performs the processing operation, i.e., the processing method according to the first embodiment. As shown in FIG. 10 , the processing method according to the first embodiment includes a contamination checking step 1001, a holding step 1004, a dicing step 1005, and a carrying-out step 1006.

[0062] (Contamination check step) Fig. 11 is a diagram illustrating a captured image formed in the dirt checking step of the processing method shown in Fig. 10. Dirt checking step 1001 is a step of checking for dirt on the holding table 10. In dirt checking step 1001, the control unit 101 of the controller 100 controls the moving unit 40 to position the holding table 10 that is not holding a package substrate 200 below the camera 30, and captures images of the entire holding surface 11 in multiple parts with the camera 30, thereby forming, for example, the captured image 301 illustrated in Fig. 11.

[0063] In the dirt confirmation step 1001, the determination cleaning unit 103 of the controller 100 compares the reference image 300 with the captured image 301 to determine whether or not cutting debris is attached to the holding surface 11, thereby confirming dirt on the holding table 10. In the first embodiment, in the dirt confirmation step 1001, the determination cleaning unit 103 of the controller 100 compares the plurality of reference images 300 with the plurality of captured images 301 to determine whether or not there is a dirty portion on the holding surface 11 of the holding table 10, that is, whether or not dirt on the holding surface 11 has been confirmed (step 1002).

[0064] In the dirt confirmation step 1001, if the determination and cleaning unit 103 of the controller 100 determines that there is a dirty portion on the holding surface 11 of the holding table 10, that is, that dirt on the holding surface 11 has been confirmed (step 1002: Yes), the process proceeds to the cleaning step 1003. Also, in the dirt confirmation step 1001, if the determination and cleaning unit 103 of the controller 100 determines that there is no dirty portion on the holding surface 11 of the holding table 10, that is, that dirt on the holding surface 11 has not been confirmed (step 1002: No), the process proceeds to the holding step 1004.

[0065] 11 includes pixels whose difference in brightness from that of the reference image 300, which is shown shaded in the figure, exceeds a predetermined value. For this reason, when the captured image 301 illustrated in Fig. 11 is formed, the determination cleaning unit 103 of the controller 100 determines that there is a dirty portion on the holding surface 11 of the holding table 10, that is, that dirt on the holding surface 11 has been confirmed (step 1002: Yes).

[0066] (Washing step) Fig. 12 is a cross-sectional view showing an example of the cleaning step of the processing method shown in Fig. 10. Cleaning step 1003 is a step in which cleaning liquid 63 is supplied to holding table 10 to clean holding table 10 when contamination is confirmed in contamination confirmation step 1001.

[0067] In the cleaning step 1003, the cleaning determination unit 103 of the controller 100 controls the moving unit 40 to position the cleaning liquid supply nozzle 60 directly above the location on the holding surface 11 where cutting debris is attached, i.e., the dirty location on the holding table 10. In the cleaning step 1003, the cleaning determination unit 103 of the controller 100 supplies cleaning liquid 63 from the nozzle 61 of the cleaning liquid supply nozzle 60 to the dirty location on the holding surface 11 for a predetermined time, as shown in Fig. 12, to remove the dirt from the dirty location on the holding surface 11 and clean the dirty location on the holding surface 11. In this way, in the cleaning step 1003, the cleaning liquid 63 is sprayed onto the holding table 10 from the cleaning liquid supply nozzle 60 attached to the blade cover 24 and disposed adjacent to the cutting blade 21, thereby cleaning the holding table 10.

[0068] (holding step) 10. Holding step 1004 is a step of holding package substrate 200 on holding table 10. In holding step 1004, control unit 101 of controller 100 controls movement unit 40 to move holding table 10 away from below camera 30, i.e., cutting unit 20, and position holding table 10 at a position spaced apart from below camera 30, i.e., cutting unit 20.

[0069] In the holding step 1004, for example, an operator or the like places the sealing resin 211 of the package substrate 200 on the holding surface 11 of the holding table 10. In the holding step 1004, the control unit 101 of the controller 100 opens the on-off valve 52 to suction-hold the package substrate 200 on the holding surface 11, as shown in FIG.

[0070] (dicing step) Fig. 14 is a side view, partially in cross section, showing the dicing step of the processing method shown in Fig. 10. In the dicing step 1005, the package substrate 200 held by the holding table 10 is cut along the intended division lines 206 with the cutting blade 21 to divide the package substrate 200 into individual package chips 201.

[0071] In the dicing step 1005, the control unit 101 of the controller 100 controls the moving unit 40 to move the holding table 10 to below the camera 30, captures an image of the marks 212 on the package substrate 200 with the camera 30, and performs alignment to align the cutting blade 21 with the planned division lines 206. In the dicing step 1005, the control unit 101 of the controller 100 controls each component to relatively move the holding table 10 and the cutting blade 21 of the cutting unit 20 along the planned division lines 206, as shown in FIG. 14 , and cuts the cutting blade 21 into the package substrate 200 until it enters the relief grooves 12, thereby dicing the planned division lines 206. In the dicing step 1005, the dicing apparatus 1 dices all of the planned division lines 206 of the package substrate 200 held by suction on the holding table 10, and divides the package substrate 200 into individual package chips 201.

[0072] (Exit step) The carry-out step 1006 is a step of carrying out, after the dicing step 1005, the individually separated package chips 201 from the divided package substrate 200 from on the holding table 10. In the carry-out step 1006, the control unit 101 of the controller 100 controls the carry-out unit 70 to suction-hold the package chip 201 held on the holding surface 11 onto the lower surface 71 of the carry-out unit 70. In the carry-out step 1006, the control unit 101 of the controller 100 closes the on-off valve 52 to stop suction-holding of the package chip 201 on the holding surface 11. In the carry-out step 1006, the control unit 101 of the controller 100 controls the carry-out unit 70 to carry out the package chip 201 held on the lower surface 71 from the holding surface 11 of the holding table 10, thereby completing the processing operation of the dicing apparatus 1, i.e., the processing method.

[0073] As described above, the processing method according to embodiment 1 includes a dirt checking step 1001 for checking for dirt on the holding surface 11 of the holding table 10, and a cleaning step 1003 for supplying cleaning liquid 63 to the holding surface 11 of the holding table 10 to clean the holding table 10 if dirt is found in the dirt checking step 1001. Therefore, in the holding step 1004, the package substrate 200 is held by the cleaned holding table 10, and in the dicing step 1005, the package substrate 200 can be diced with the cutting blade 21.

[0074] Therefore, the processing method according to embodiment 1 can dicing by suction-holding the package substrate 200 on the holding table 10 from which dirt has been removed or reduced from the holding surface 11, and can suppress a decrease in the suction-holding force of the package substrate 200 on the holding table 10 during dicing, thereby suppressing misalignment of the package substrate 200 and package chip 201 during dicing.

[0075] As a result, the processing method according to the first embodiment can solve the problem caused by the adhesion of dirt to the holding table 10, and has the effect of suppressing processing defects.

[0076] Furthermore, the dicing apparatus 1 according to embodiment 1 performs the above-described processing method, thereby solving the problem caused by dirt adhering to the holding table 10 and achieving the effect of suppressing processing defects.

[0077] It should be noted that the present invention is not limited to the above-described embodiment 1. In other words, the present invention can be implemented in various modifications without departing from the gist of the present invention.

[0078] For example, in the present invention, after performing the cleaning step 1003, the dirt checking step 1001 may be performed again, and the cleaning step 1003 and the dirt checking step 1001 may be repeated until the dirt on the holding surface 11 can be completely removed.

[0079] In the present invention, in the contamination checking step 1001, the presence or absence of contamination on only a part of the holding surface 11 of the holding table 10 may be checked.

[0080] In the present invention, in the cleaning step 1003, the cleaning liquid 63 may be supplied to the entire holding surface 11 of the holding table 10, so that the entire holding surface 11 is cleaned. [Explanation of symbols]

[0081] 1 Dicing equipment 10 Holding table 12 Relief groove 13 Suction hole 21 Cutting blade 30 Camera 60 Cleaning liquid supply nozzle 63 Cleaning fluid 100 Controllers 200 package substrate 206 Planned division line 301 Captured images 1001 Dirt Check Step 1003 Washing Step 1004 Retention Step 1005 Dicing Step 1006 Carry-out step

Claims

1. A processing method for a package substrate on which a plurality of intersecting planned division lines are set, comprising: a dirt confirmation step of using a camera to capture an image of a holding table in which relief grooves for the cutting blade are formed in areas corresponding to the planned division lines and suction holes for suction-holding package substrates are formed in areas partitioned by the relief grooves, and checking for dirt on the holding table; a cleaning step of supplying a cleaning liquid to the holding table to clean the holding table when the dirt is confirmed in the dirt confirmation step; a holding step of holding the package substrate on the holding table; a dicing step of cutting and dividing the package substrate held by the holding table along the planned division lines with a cutting blade.

2. 2. The processing method according to claim 1, further comprising a carrying-out step of carrying out the divided package substrates from the holding table after the dicing step is performed.

3. 3. The machining method according to claim 1, wherein in the cleaning step, the cleaning liquid is sprayed onto the holding table from a cleaning liquid supply nozzle disposed adjacent to the cutting blade to clean the holding table.

4. 4. The processing method according to claim 1, wherein the cleaning liquid is a mixture of two fluids, water and air.

5. A dicing device for dicing a package substrate on which a plurality of intersecting planned division lines are set, a holding table in which relief grooves for a cutting blade are formed in areas of the package substrate to be diced corresponding to the planned dividing lines, and in which suction holes for suction-holding the package substrate are formed in the areas partitioned by the relief grooves; a cutting blade for dicing the package substrate held by the holding table; a camera for capturing an image of the holding table; a cleaning liquid supply nozzle for supplying a cleaning liquid to the holding table; a controller that controls at least the cleaning liquid supply nozzle, The controller checks for dirt on the holding table based on an image formed by capturing an image of the holding table with the camera, and supplies the cleaning liquid to the holding table from the cleaning liquid supply nozzle if dirt is detected.

Images