laser processing machine

Abstract

To suppress rattling of a workpiece with an inexpensive configuration.SOLUTION: A laser beam machine 10 includes: a palette 50 for mounting a workpiece W; a processing head 30 for irradiating the workpiece with a laser beam, and subjecting the workpiece to laser processing; a dust collection chamber 60 which is provided so as to surround a space below the palette 50, and collects powder dust accompanying the laser processing; a dust collection duct 61 for sucking air in the dust collection chamber 60; a processing table 80 which is formed into a size smaller than the palette 50 and is arranged in a predetermined section in the palette 50; a suction table 81 provided so as to surround a space below the processing table 80; a suction duct 85 for sucking air in the suction table 81; and a switching device 70 for switching a flow of air drawn by a dust collection device between the dust collection duct 61 and the suction duct 85.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a laser processing machine. [Background technology]

[0002] Laser processing machines, which use a laser beam to perform cutting on plate-shaped workpieces such as sheet metal, are known. Laser processing machines cut the workpiece using thermal energy by irradiating the workpiece with a laser beam. Laser processing machines cut parts from the workpiece by moving a processing head that irradiates the laser beam along the in-plane direction of the workpiece.

[0003] When performing micromachining to cut out tiny parts from a thin workpiece, the cut-out tiny parts can fall. Therefore, when performing micromachining, a processing table with a mesh structure with small gaps is installed on the pallet of the laser processing machine, and the workpiece is placed on this processing table and laser processing is performed.

[0004] When performing laser processing, if the workpiece flutters due to the gas pressure of the assist gas injected during processing, processing defects may occur. As a method for preventing the workpiece from flapping, a method of sucking air from below the processing table is known (for example, Patent Document 1). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-203244 Summary of the Invention [Problem to be solved by the invention]

[0006] However, in order to suck the workpiece on the processing table, it is necessary to provide a separate suction means, and if the control function for that is also included, this leads to an increase in costs. [Means for solving the problem]

[0007] A laser processing machine according to one embodiment of the present invention comprises a pallet for placing a workpiece thereon, a processing head disposed above the pallet and irradiating a laser beam toward the workpiece to perform laser processing, a dust collection chamber disposed to surround the space below the pallet and collecting dust generated during laser processing, a dust collection duct connected to the dust collection chamber and using the air flow drawn in by the dust collection device to suck in air from within the dust collection chamber, a processing table formed to be smaller than the pallet and disposed in a predetermined section within the pallet and on which the workpiece is placed, a suction table disposed to surround the space below the processing table, a suction duct connected to the suction table and using the air flow drawn in by the dust collection device to suck in air from within the suction table, and a switching device connected to the dust collection duct and suction duct, which switches the air flow drawn in by the dust collection device between the dust collection duct and the suction duct.

[0008] According to one aspect of the laser processing machine of the present invention, air in the dust collection chamber is sucked through the dust collection duct by the air flow drawn in by the dust collector. The air flow drawn in by the dust collector can be switched from the dust collection duct to the suction duct by a switching device. By switching the air flow to the suction duct, air can be sucked from within the suction table placed within the pallet. This allows for limited suction within the range of the processing table placed in a predetermined section within the pallet, allowing the workpiece to be suctioned and fixed to the processing table. Furthermore, because the air flow drawn in by the dust collector that sucks in air from the dust collection chamber is used, there is no need to provide a dedicated suction means for sucking in the suction table. [Effects of the Invention]

[0009] According to one aspect of the present invention, flapping of a workpiece can be suppressed with an inexpensive configuration. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a perspective view schematically showing a laser processing machine on which a processing table and a suction table are installed. [Figure 2] FIG. 2 is a perspective view showing a schematic basic structure of a laser processing machine. [Figure 3] FIG. 3 is a diagram illustrating a pallet mounted on the laser processing machine shown in FIG. [Figure 4] FIG. 4 is a diagram illustrating a pallet mounted on the laser processing machine shown in FIG. [Figure 5] FIG. 5 is a diagram illustrating a suction table installed on a pallet. [Figure 6] FIG. 6 is a diagram illustrating a switching device. [Figure 7] FIG. 7 is a diagram illustrating the installation operation of the suction table and the processing table. [Figure 8] FIG. 8 is a diagram illustrating the installation operation of the suction table and the processing table. [Figure 9] FIG. 9 is a diagram illustrating the installation operation of the suction table and the processing table. [Figure 10] FIG. 10 is a diagram illustrating the installation operation of the suction table and the processing table. DETAILED DESCRIPTION OF THE INVENTION

[0011] The laser processing machine according to this embodiment will be described below with reference to the drawings: Fig. 1 is a perspective view showing a schematic view of the laser processing machine on which a processing table and a suction table are installed.

[0012] First, an overview of a laser processing machine 10 will be described with reference to FIG. The laser processing machine 10 includes a pallet 50 for placing the workpiece W thereon, a processing head 30 that is disposed above the pallet 50 and that performs laser processing by irradiating a laser beam toward the workpiece W, a dust collection chamber 60 that is disposed so as to surround the space below the pallet 50 and that collects dust generated during laser processing, a dust collection duct 61 that is connected to the dust collection chamber 60 and that sucks in air from within the dust collection chamber 60 with the flow of air drawn in by the dust collection device, a processing table 80 that is formed smaller than the pallet 50 and that is disposed in a predetermined section within the pallet 50 and on which the workpiece W is placed, a suction table 81 that is disposed so as to surround the space below the processing table 80, a suction duct 85 that is connected to the suction table 81 and that sucks in air from within the suction table 81 with the flow of air drawn in by the dust collection device, and a switching device 70 that connects the dust collection duct 61 and the suction duct 85 and that switches the flow of air drawn in by the dust collection device between the dust collection duct 61 and the suction duct 85.

[0013] 2 is a perspective view showing a schematic diagram of the basic structure of a laser processing machine. Next, the basic structure of the laser processing machine 10 according to this embodiment will be described. In this specification, directions are defined as the left-right direction and the front-rear direction, which are orthogonal to the horizontal direction, and the up-down direction, which are orthogonal to the left-right direction and the front-rear direction, respectively. The left-right direction and the front-rear direction are parallel to the in-plane direction of the workpiece W placed on the pallet 50, and the up-down direction corresponds to the direction perpendicular to the plane of the workpiece W placed on the pallet 50.

[0014] As shown in FIG. 2, the laser processing machine 10 includes a main body 11, a head driving mechanism 15, a processing head 30, a pallet 50, a control device 100, and a laser oscillator 110.

[0015] The main body 11 is formed in a roughly rectangular parallelepiped shape and is placed on an installation surface such as a floor. Side frames 12 are disposed on the front and rear edges of the main body 11. The side frames 12 on the front and rear edges are disposed parallel to each other.

[0016] The head driving mechanism 15 moves the processing head 30 in the front-rear and left-right directions. The head driving mechanism 15 includes an X-axis carriage 16 and a Y-axis carriage 17.

[0017] The X-axis carriage 16 has a gate-like shape. The X-axis carriage 16 is supported by a pair of side frames 12 and is configured to be movable along the side frames 12. The X-axis carriage 16 is driven by an X-axis drive unit (not shown) provided on the side frames 12 and moves in the left-right direction.

[0018] The Y-axis carriage 17 is supported by the X-axis carriage 16 and is configured to be movable along the X-axis carriage 16. The Y-axis carriage 17 is driven by a Y-axis drive unit (not shown) provided on the X-axis carriage 16 and moves in the front-to-rear direction.

[0019] The processing head 30 irradiates a laser beam from above the workpiece W to perform laser processing on the workpiece W. A laser beam emitted from a laser oscillator 110 is transmitted to the processing head 30 via a process fiber (not shown). The laser beam is irradiated onto the workpiece W from an opening provided at the tip of the processing head 30.

[0020] The machining head 30 is disposed on a Y-axis carriage 17. By driving the X-axis drive unit and the Y-axis drive unit to move the X-axis carriage 16 and the Y-axis carriage 17, the machining head 30 can be moved left and right and forward and backward, respectively. In addition, the head drive mechanism 15 is equipped with a Z-axis drive unit (not shown), and the machining head 30 is driven by the Z-axis drive unit to move up and down.

[0021] The processing head 30 can perform laser processing within a predetermined processing range by moving it left and right and forward and backward using the head drive mechanism 15. The laser processing machine 10 of this embodiment is designed for small-sized workpieces W, and the processing range is set to a range that can process a workpiece W of up to 4' x 4' (1219 mm x 1219 mm) in size.

[0022] The pallet 50 is supported horizontally by a pair of side frames 12. A workpiece W is placed on the pallet 50. The pallet 50 has a square shape and can accommodate workpieces W of the same size as the processing area or smaller. The structure of the pallet 50 and the associated laser processing machine 10 will be described later.

[0023] The pallet 50 is supported so as to be movable in the left-right direction via guide members (not shown) fixed to the side frames 12. The guide members slidably support rails provided on the pallet 50, thereby guiding the linear movement of the pallet 50.

[0024] A handle (not shown) is provided on the left end of the pallet 50, which the worker grasps in order to move the pallet 50. The worker can move the pallet 50 between the regular position and the pulled-out position by grasping the handle and moving the pallet 50 left and right.

[0025] When the pallet 50 is in the normal position, it is housed in the main body 11 (as shown in FIG. 2). At this time, almost the entire area of ​​the pallet 50 is included in the processing range of the processing head 30. When the pallet 50 in the normal position is pulled out to the left, the pallet 50 moves to the pulled-out position. When the pallet 50 is in the pulled-out position, a portion of the pallet 50 is pulled out from the main body 11.

[0026] The control device 100 is composed of a box-shaped housing and a circuit board housed inside the housing. The control device 100 is disposed at the lower right end of the main body 11 and is fixed to the main body 11. The control device 100 controls the operation of each part of the laser processing machine 10, such as the head drive mechanism 15 and the laser oscillator 110.

[0027] The laser oscillator 110 generates a laser beam and supplies the laser beam to the processing head 30. The laser oscillator 110 is composed of a box-shaped housing and electronic and electrical components housed inside the housing. The laser oscillator 110 is disposed at the upper right end of the main body 11 and is fixed to the main body 11.

[0028] Fig. 3 is a diagram illustrating a pallet mounted on the laser processing machine shown in Fig. 2. Fig. 4 is a diagram illustrating a pallet mounted on the laser processing machine shown in Fig. 1. Fig. 5 is a diagram illustrating a suction table installed on the pallet. Fig. 6 is a diagram illustrating a switching device. Below, with reference to Figs. 3 to 6 in addition to Figs. 1 and 2, the structure of the pallet 50 and the structure of the laser processing machine 10 related to the pallet 50 will be described in detail.

[0029] As shown in FIGS. 2 and 3, the pallet 50 includes a frame 51 and a plurality of skids 52.

[0030] The frame body 51 is a frame member having a square shape when viewed from above the pallet 50. A partition plate 51a extending in the left-right direction is provided at the center of the frame body 51 in the front-rear direction.

[0031] The multiple skids 52 are workpiece support members that support the workpiece W when laser processing is performed on the workpiece W. The multiple skids 52 are plate-shaped members that extend in the front-to-rear direction and are arranged at intervals in the left-to-right direction. The multiple skids 52 are respectively arranged in a front region of the pallet 50 located forward of the partition plate 51a and in a rear region of the pallet 50 located rearward of the partition plate 51a. Both ends of the skids 52 are supported by the frame members that constitute the frame body 51 and the partition plate 51a, and the skids 52 can be attached and detached as necessary. The skids 52 are made of a metal material such as steel, for example, mild steel.

[0032] The skid 52 stands upright and parallel to the vertical direction. The upper edge of the skid 52 has multiple protrusions that each protrude upward. The multiple protrusions are spaced apart in the front-to-rear direction. Each protrusion is formed vertically long in the vertical direction and has a mountain shape that narrows toward the top. The workpiece W is supported at the upper edge of the skid 52, i.e., at the apex of each protrusion.

[0033] The multiple skids 52 are arranged at large intervals in the left-right direction, and are therefore primarily used when placing large workpieces W having large parts to be cut out.

[0034] As shown in Figures 1 and 4, a processing table 80 can be installed on the pallet 50 to place a small workpiece W, such as a thin plate, on which fine processing is performed. The processing table 80 is formed to be smaller than the pallet 50 and is placed in a predetermined compartment within the pallet 50. For example, by removing the skid 52 attached to the front region of the pallet 50, it is possible to secure a predetermined compartment for installing the processing table 80. The processing table 80 is detachably installed on a suction table 81, which will be described later.

[0035] The processing table 80 has a constant height in the vertical direction, and the workpiece W can be placed on its upper surface. The processing table 80 has a mesh structure with spacing smaller than the spacing between the skids 52 arranged on the pallet 50, and each has a plurality of through-holes that penetrate in the vertical direction. The mesh structure may be a honeycomb shape with a hexagonal cross section in the horizontal direction, or a lattice shape with a quadrangular cross section in the horizontal direction.

[0036] As shown in FIG. 1, the laser processing machine 10 further includes a dust collection chamber 60, a dust collection duct 61, a suction table 81, a suction duct 85, and a switching device .

[0037] The dust collection chamber 60 is provided to surround the space below the pallet 50 when it is in the normal position, and is a space for collecting dust generated around the pallet 50 during laser processing. This dust includes fumes and spatter (molten metal). The dust generated during laser processing is guided into the dust collection chamber 60 by the assist gas sprayed from the processing head 30 and the flow of air drawn into the dust collection duct 61.

[0038] The dust collection duct 61 sucks in air from within the dust collection chamber 60. One end of the dust collection duct 61 is connected to the dust collection chamber 60, and the other end of the dust collection duct 61 is connected to the switching device 70. The dust collection duct 61 sucks in air from within the dust collection chamber 60 by the flow of air drawn in by a dust collection device, which will be described later. By sucking in the air from within the dust collection chamber 60, dust generated during laser processing can be collected.

[0039] As shown in Figures 1, 4 and 5, the suction table 81 is a table used when placing the processing table 80 on the pallet 50, and is configured to be detachable from the pallet 50. The suction table 81 is a rectangular box with an open top, and is formed to be the same size as the processing table 80. As shown in Figure 5, a plurality of skids 82 for supporting the processing table 80 are provided inside the suction table 81, and the processing table 80 can be detachably placed above the suction table 81. In this way, the suction table 81 is provided relative to the processing table 80 so as to surround the space below the processing table 80.

[0040] The suction duct 85 sucks air from inside the suction table 81. One end of the suction duct 85 is connected to the connection joint 83 of the suction table 81, and the other end of the suction duct 85 is connected to the switching device 70. The suction duct 85 sucks air from inside the suction table 81 by the flow of air drawn in by the dust collector. By sucking air from inside the suction table 81, negative pressure is created on the underside of the processing table 80. Due to the action of this negative pressure, the workpiece W placed on the upper surface of the processing table 80 is sucked in, and the workpiece W can be fixed to the processing table 80.

[0041] The suction duct 85 is composed of a first duct portion 85a and a second duct portion 85b, and can be divided into two elements. A communication portion 53 that communicates the inside and outside of the frame body 51 is provided in the frame body 51 of the pallet 50. The first duct portion 85a connects the suction table 81 (connection joint 83) installed on the pallet 50 to the communication portion 53. The second duct portion 85b connects the communication portion 53 to the switching device 70. The first duct portion 85a and the second duct portion 85b are connected to each other via the communication portion 53 of the pallet 50.

[0042] Since the peripheral edge of the upper surface of the suction table 81 becomes the contact surface that comes into contact with the peripheral edge of the lower surface of the processing table 80, a sealing member may be provided to fill the gap between the suction table 81 and the processing table 80. An example of the sealing member is a sponge. Furthermore, a protrusion or a notch may be formed on the peripheral edge of the upper surface of the suction table 81 to determine the position of the processing table 80 when it is installed.

[0043] As shown in Figures 1, 2, and 6, the switching device 70 is connected to the dust collection duct 61 and the suction duct 85. Also, as shown in Figure 6, the switching device 70 is connected to a collecting duct 75 that leads to a dust collector. The dust collector is equipped with an exhaust fan that is rotated by a power mechanism such as a motor. When the exhaust fan rotates, negative pressure is created inside the dust collector, and air in the collecting duct 75 is drawn into the dust collector.

[0044] The switching device 70 is a rectangular box, and the air sucked by the dust collection duct 61 and the air sucked by the suction duct 85 flows through the switching device 70 to the collecting duct 75. The switching device 70 can switch the flow of air drawn into the dust collector between the dust collection duct 61 and the suction duct 85.

[0045] As shown in FIG. 6, the switching device 70 includes an opening / closing door 71, a collision plate 72, a tray 73, and a flow rate adjusting valve 74.

[0046] The opening / closing door 71 is a door that opens and closes the suction duct 85. The collision plate 72 is arranged at a position where air flows in from the suction duct 85 so as to intersect with the air flow inside the suction duct 85. The collision plate 72 has the function of removing spatter by causing spatter contained in the air that flows in from the suction duct 85 to collide with the collision plate 72. The tray 73 is a retractable tray that is arranged at the bottom of the switching device 70. The tray 73 can be used to collect spatter that collides with the collision plate 72 and falls. The flow rate adjustment valve 74 is a valve body that adjusts the flow rate of air flowing through the dust collection duct 61.

[0047] When the opening / closing door 71 is closed and the flow rate adjustment valve 74 is opened, the air drawn into the dust collecting device flows through the dust collecting duct 61 and the collecting duct 75. As a result, the air in the dust collecting chamber 60 is taken into the dust collecting device via the dust collecting duct 61 and the collecting duct 75.

[0048] On the other hand, when the opening / closing door 71 is opened and the flow rate adjusting valve 74 is closed, the air drawn into the dust collector flows through the suction duct 85 and the collecting duct 75. As a result, the air inside the suction table 81 is taken into the dust collector through the suction duct 85 and the collecting duct 75.

[0049] 7 to 10 are diagrams illustrating the installation operation of the suction table and the processing table. The installation operation of the suction table and the processing table will be explained below with reference to Figs. 7 to 10. First, in the initial state, as shown in Fig. 2, it is assumed that the skids 52 are attached to the entire area of ​​the pallet 50.

[0050] 7, the worker pulls out the pallet 50 from the normal position and moves the pallet 50 to the pulled-out position. The worker then removes the skid 52, which is attached forward of the partition plate 51a, to open the front area of ​​the pallet 50.

[0051] As shown in Fig. 8, the worker attaches the suction table 81 to the front region of the pallet 50. The worker also connects the connection joint 83 of the suction table 81 to the communication section 53 of the pallet 50 with the first duct section 85a. As shown in Fig. 9, the worker installs the processing table 80 above the suction table 81. This completes the setting of the processing table 80 and the suction table 81 on the pallet 50.

[0052] As shown in Fig. 10, the operator pushes the pallet 50, which is in the pulled-out position, to the right to move the pallet 50 to the normal position. When the pallet 50 reaches the normal position, the communication portion 53 of the pallet 50 connects to the second duct portion 85b, which is held immobile. This connects the suction table 81 and the switching device 70 via the suction duct 85. Then, as shown in Fig. 1, by placing the workpiece W on the processing table 80, laser processing can be performed on the workpiece W.

[0053] When laser processing is performed on a workpiece W placed on the processing table 80, as shown in FIG. 6, the operator opens the opening / closing door 71, closes the flow rate control valve 74, and operates the dust collector. When the dust collector sucks in air, the air inside the suction table 81 is taken into the dust collector via the suction duct 85 and the collecting duct 75. As a result, the workpiece W on the processing table 80 is suction-fixed to the upper surface of the processing table 80. Therefore, even if assist gas is sprayed during laser processing, flapping of the workpiece W can be suppressed.

[0054] Furthermore, by adjusting the opening of the flow rate adjustment valve 74 from the closed state to the open state, the air flow generated by the dust collector also flows into the dust collection duct 61 and the collecting duct 75. The flow rate of the air flowing through the suction duct 85 and the collecting duct 75 is reduced, so that the flow rate can be controlled. This makes it possible to adjust the force of suction on the workpiece W according to the workpiece W to be processed, such as the thickness of the workpiece W.

[0055] As described above, according to the laser processing machine 10 of this embodiment, air in the dust collection chamber 60 is sucked through the dust collection duct 61 by the air flow drawn in by the dust collector. The air flow drawn in by the dust collector can be switched from the dust collection duct 61 to the suction duct 85 by the switching device 70. By switching the air flow to the suction duct 85, air in the suction table 81 arranged in the pallet 50 can be sucked. As a result, the processing table 80 arranged in a predetermined section in the pallet 50 can be sucked in in a limited manner. This provides the suction force necessary to suck the workpiece W, thereby enabling the workpiece W to be securely fixed to the processing table 80. Furthermore, because the air flow drawn in by the dust collection chamber 60 is used, there is no need to provide a dedicated suction means for sucking the suction table 81. As a result, flapping of the workpiece W can be suppressed with an inexpensive configuration.

[0056] The suction on the processing table 80 not only secures the workpiece W, but also functions to suck up swarf (residue) generated during processing. In micromachining, swarf from small holes processed tends to remain on the workpiece, and this swarf can interfere with processing. With the swarf suction function, if the swarf is small, it is sucked in through the gaps (mesh-like through-holes) in the processing table 80, and if the swarf is large, it is adsorbed to the processing table 80. This prevents the swarf from rising up, known as swarf lift, and allows for stable processing.

[0057] Furthermore, suction of the processing table 80 also functions to suppress malfunctions in the tracing operation that moves the processing head 30 up and down along the surface of the workpiece W. If the processing head 30 traces the debris that has risen due to laser cutting, it may not only result in poor cutting, but also cause the processing head 30 to suddenly change direction in the vertical direction or crash into the processing table 80. However, the debris suction function can suppress the rising of the debris, thereby suppressing damage to the processing head 30, the sensors in the processing head 30, and the workpiece W, as well as financial and time losses.

[0058] Furthermore, when machining a workpiece W on the machining table 80, it is mostly thin workpieces W that are machined. Therefore, in such cases, the gas pressure of the assist gas can be lowered. Applying high gas pressure can result in the generation of dross due to excessive cooling, but lowering the gas pressure allows for good cutting. In addition, the cost of assist gas can be reduced. For example, even when machining workpieces W made of the same material, the laser machining machine 10 may be operated such that the gas pressure of the assist gas is set relatively lower when machining the workpiece W on the machining table 80 compared to when machining the workpiece W on the skid 52.

[0059] In the embodiment described above, the processing table 80 on which the workpiece W is placed and the suction table 81 from which air is sucked by the suction duct 85 are configured as separate bodies. However, the processing table 80 and the suction table 81 may be formed as an integrated structure. However, if the processing table 80 and the suction table 81 are configured as separate bodies, the suction table 81 also functions as a table for attaching and detaching the processing table 80. Therefore, the processing table 80 can be easily replaced with various types of processing tables 80 that differ in height, material, and shape.

[0060] In this embodiment, the pallet 50 includes a plurality of skids 52 arranged at intervals from one another to support the workpiece W. Then, by removing some of the plurality of skids 52 from the pallet 50, a predetermined section for arranging the processing table 80 is formed.

[0061] With this configuration, it is possible to switch between a configuration in which the skid 52 is arranged over the entire surface of the pallet 50 and a configuration in which the processing table 80 is arranged on a portion of the pallet 50. This allows for a variety of processing modes to be selected, such as processing the workpiece W using the entire surface of the pallet 50 or processing the workpiece W using the processing table 80. As a result, it is possible to provide a laser processing machine 10 that is easy for the user to use.

[0062] Furthermore, since the processing table 80 can be installed by removing a portion of the skid 52, the processing table 80 can be easily attached to the pallet 50. This means that even if the need for fine processing arises later, it can be met with just a simple reassembly, without requiring major changes to the specifications of the laser processing machine 10.

[0063] Furthermore, the processing table 80 is placed in a section within the pallet 50. Therefore, within the pallet 50, there is an area where the processing table 80 is installed and an area where the skids 52 are arranged, coexisting. This makes it possible to perform continuous operation, such as processing a thick plate in the area where the skids 52 are arranged, and then processing a thin plate directly on the processing table 80 after this processing. This allows processing to be performed continuously without changing the setup, thereby improving work efficiency.

[0064] In the example shown in FIG. 4, the processing table 80 is installed on the pallet 50 in the left corner of the front area of ​​the pallet 50. However, the processing table 80 may be installed in any section within the pallet 50, and may be installed in the center or right corner of the front area of ​​the pallet 50. Furthermore, the processing table 80 may be installed in the rear area of ​​the pallet 50 as long as it can be connected to the suction duct 85. In this way, a high degree of freedom is allowed for the placement of the processing table 80, allowing the worker to select a placement that is convenient for use depending on the environment in which the worker is using the table.

[0065] In this embodiment, the processing table 80 has a mesh structure with intervals smaller than the intervals between the plurality of skids 52 , and is configured to be detachable from the suction table 81 .

[0066] According to this configuration, the processing table 80 can be attached and detached to the suction table 81. Therefore, for a workpiece W that would cause significant wear on the processing table 80, such as a thick workpiece W, the skid 52 can be replaced with a normal skid 52. This makes it possible to suppress wear on the processing table 80, allowing the processing table 80 to be used for a long period of time.

[0067] In this embodiment, the laser processing machine 10 further has a main body 11 that movably supports the pallet 50. The pallet 50 moves between a regular position where the pallet 50 is housed in the main body 11 and a drawn-out position where a portion of the pallet 50 is drawn out from the main body 11. The suction table 81 is attached to and detached from the pallet 50 when the pallet 50 is drawn out to the drawn-out position.

[0068] According to this configuration, by pulling out the pallet 50 to the pulled-out position, a portion of the pallet 50 is pulled out from the main body 11, so that the suction table 81 can be easily attached to and detached from the pallet 50. This makes it possible to provide a laser processing machine 10 that is easy for the user to use.

[0069] In this embodiment, the suction duct 85 includes a first duct portion 85a that connects the suction table 81 installed on the pallet 50 to the communication portion 53 that communicates between the inside and outside of the pallet 50, and a second duct portion 85b that connects the communication portion 53 and the switching device 70. The second duct portion 85b is connected to the communication portion 53 when the pallet 50 is moved to the normal position, and is separated from the communication portion 53 when the pallet 50 is pulled out from the normal position towards the pulled-out position.

[0070] According to this configuration, by moving the pallet 50 in conjunction with attaching or detaching the suction table 81, it is possible to separate or connect the second duct portion 85b and the communication portion 53 of the pallet 50. This reduces the workload of the worker.

[0071] The switching device 70 includes an opening / closing door 71 for opening and closing the suction duct 85 , and a flow rate adjusting valve 74 for adjusting the flow rate of air flowing through the dust collection duct 61 .

[0072] With this configuration, the air flow can be switched between the suction duct 85 and the dust collection duct 61. In addition, a flow rate adjustment valve 74 that adjusts the air flow rate is provided on the dust collection duct 61 side. By controlling the flow rate with the flow rate adjustment valve 74 while the opening / closing door 71 is open, the flow rate of air flowing through the suction duct 85 can be relatively changed. This makes it possible to adjust the suction force of the suction duct 85.

[0073] The switching device 70 includes an impingement plate 72 disposed at a position where air flows in from the suction duct 85 so as to intersect with the flow of air in the suction duct 85 .

[0074] According to this configuration, spatter contained in the air flowing through the suction duct 85 can be caused to collide with the collision plate 72. This makes it possible to prevent the spatter from flowing downstream to the dust collector.

[0075] Although the embodiments of the present invention have been described above, the descriptions and drawings that form part of this disclosure should not be understood to limit the present invention. Various alternative embodiments, examples, and operating techniques will become apparent to those skilled in the art from this disclosure. [Explanation of symbols]

[0076] 10 Laser processing machine 11 Main body 12 Side frame 15 Head drive mechanism 16 X-axis carriage 17 Y-axis carriage 30 Processing head 50 pallets 51 Frame 51a Partition 52 Skid 53 Communication part 60 Dust collection chamber 61 Dust collection duct 70 Switching Device 71 Opening and closing doors 72 Collision plate 73 Tray 74 Flow control valve 75 Collecting duct 80 Processing table 81 Suction Table 82 Skid 83 Connection joint 85 Suction duct 85a First duct section 85b Second duct section 100 control device 110 Laser Oscillator double work

Claims

1. a pallet for placing the workpiece; a processing head disposed above the pallet and configured to perform laser processing by irradiating a laser beam toward the workpiece; a dust collection chamber that is provided to surround the space below the pallet and collects dust generated by the laser processing; a dust collection duct connected to the dust collection chamber, which draws air from the dust collection chamber by the flow of air drawn in by the dust collection device; a processing table formed to be smaller than the pallet, arranged in a predetermined section within the pallet, and on which the workpiece is placed; a suction table provided to surround a space below the processing table; a suction duct connected to the suction table, which sucks air from within the suction table by the flow of air drawn in by the dust collecting device; a switching device connected to the dust collection duct and the suction duct, and switching the flow of air drawn by the dust collector between the dust collection duct and the suction duct; A laser processing machine equipped with:

2. The pallet is The workpiece support device includes a plurality of plate-like members arranged at intervals from one another, The predetermined section for arranging the processing table is formed by removing some of the plurality of plate-shaped members from the pallet.

2. The laser processing machine according to claim 1.

3. The processing table has a mesh structure with a smaller spacing than the spacing between the plurality of plate-like members, and is configured to be detachable from the suction table.

3. The laser processing machine according to claim 2.

4. The pallet further includes a main body that movably supports the pallet, The pallet is The pallet moves between a normal position where the pallet is housed in the main body and a drawn-out position where a part of the pallet is drawn out from the main body, The suction table is The pallet is attached to and detached from the pallet in a state where the pallet is pulled out to the pulled-out position.

4. The laser processing machine according to claim 2 or 3.

5. The suction duct is a first duct portion that connects the suction table attached to the pallet and a communication portion that communicates between the inside and outside of the pallet; a second duct portion connecting the communication portion and the switching device, The second duct portion is When the pallet is moved to the normal position, it is connected to the communication portion, When the pallet is pulled out from the normal position to the pulled-out position, it is separated from the communication portion.

5. The laser processing machine according to claim 4.

6. The switching device an opening / closing door for opening and closing the suction duct; a flow rate adjusting valve for adjusting the flow rate of air flowing through the dust collection duct.

6. The laser processing machine according to claim 1.

7. The switching device An impingement plate is provided at a position where air flows in from the suction duct so as to intersect with the flow of air in the suction duct.

7. The laser processing machine according to claim 1.

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