Power module with semiconductor module components and alignment portion, and method of forming the power module

Abstract

A power module (100) is provided, comprising a semiconductor module component (10) and an alignment portion (20), the alignment portion (20) being fixed to a side upper surface (10T) of the semiconductor module component (10) and comprising at least one recess (20R). The semiconductor module component (10) comprises at least one terminal (12, 13) oriented at least in places perpendicular to the side upper surface (10T) of the semiconductor module component (10) and at least partially positioned within the at least one recess (20R) for the purpose of aligning along a lateral direction. Along the vertical direction, the at least one terminal (12, 13) protrudes beyond the at least one recess (20R). At least one recess (20R) is located on a side (20S) of the alignment portion (20), and at least one recess (20R) is a vertical slot that is a recess that opens into the side (20S) of the alignment portion (20), and the slot is not a through hole that is completely surrounded in the lateral direction by the inner wall (20W) of the at least one recess (20R). Additionally, a method for forming a power module (100) comprising the semiconductor module component (10) is provided.

Description

[Technical Field]

[0001] explanation The present disclosure relates to a power module including semiconductor module components and an alignment portion, and a method of forming such a power module. [Background technology]

[0002] When implementing a power module, e.g., a power semiconductor module, in various applications, the power module must be mechanically and electrically connected to control electronics, such as gate drivers and other integrated circuits configured to control the power module. The control electronics may be arranged on an assembly substrate, such as on a control board, which may be a printed circuit board. Such an assembly board may be arranged on top of the power module. The power semiconductor module and the assembly substrate may be electrically connected by power module terminals, e.g., main terminals in the form of power terminals and / or auxiliary terminals in the form of control terminals.

[0003] Therefore, to facilitate the process of mechanically and electrically interconnecting the power module to the assembly substrate, it is necessary to accurately locate the power module relative to its position on the assembly substrate. Furthermore, when the terminals are inserted or press-fit into the contact holes in the assembly substrate, it is desirable to provide sufficient mechanical support for the terminals so that they can be safely and efficiently inserted into the contact holes. The use of integrated alignment features can help to provide an efficient and simplified method for accurately locating the power module relative to its position on the assembly substrate, for example, to accurately locate the terminals of the power module, e.g., in the form of main terminals and / or auxiliary terminals, relative to the positions of the contact holes in the assembly substrate.

[0004] U.S. Patent Application Publication No. 2021 / 358869 describes a semiconductor device including a semiconductor module, a printed circuit board, and a positioning member. The semiconductor module includes a case for housing components, and electrode terminals, control terminals (external terminals), and reference pins are formed on the surface of the case. The printed circuit board has terminal holes and is electrically connected to the control terminals attached through the terminal holes. Each of the four reference pins of the semiconductor module penetrates a corresponding one of the four corners of the printed circuit board. A positioning element of the positioning member also penetrates the printed circuit board. The positioning member is installed between the semiconductor module and the printed circuit board. The positioning member has a surface, and the positioning element is formed on this surface of the positioning member. The control terminals and reference pins of the semiconductor module penetrate the positioning member. Summary of the Invention [Means for solving the problem]

[0005] Embodiments of the present disclosure, e.g., as claimed in the independent claims, address in whole or in part the above-mentioned shortcomings in the art. Further embodiments of this power module and a method for forming a power module with an integrated alignment portion, as well as a method for interconnecting the power module to an assembly substrate, e.g., a control substrate, are the subject of further claims.

[0006] According to one embodiment of the power module, it comprises a semiconductor module component and an alignment portion. The alignment portion is fixed to a lateral upper surface of the semiconductor module component. The alignment portion comprises at least one recess. The semiconductor module component comprises at least one terminal. The terminal is oriented at least in places perpendicular to the lateral upper surface of the semiconductor module component. For the purpose of alignment along the lateral direction, the terminal is at least partially located within the at least one recess. Along the vertical direction, the at least one terminal protrudes beyond the at least one recess.

[0007] Because the alignment portion is fixed to the semiconductor module component, the alignment portion is an integral part of the power module. When the power module is mechanically and electrically connected to the assembly substrate, the alignment portion is located, for example, between the semiconductor module component and the assembly substrate. The alignment portion can be used to accurately adjust the lateral positions of the terminals, for example, to the lateral positions of the contact holes in the assembly substrate. Furthermore, the alignment portion may provide mechanical support to the terminals so that the terminals can be inserted or press-fit into the contact holes in the assembly substrate in a safe and simple manner. This aspect ensures proper alignment of one or more terminals, for example, pin-shaped terminals, of the power module with one or more contact holes in the assembly substrate, for example, the control board. This prevents some terminals from bending or displacing and not fitting into the contact holes in the assembly substrate.

[0008] For clarity and brevity, herein and hereinafter, features of the power module and method may be described with respect to only one recess or only one terminal. However, it should be understood that such features may also apply to multiple recesses and / or multiple terminals, respectively. Different recesses may be formed identically or differently. Terminals may be formed identically or differently. A power module may include two or more module components, e.g., two or more semiconductor module components. An alignment portion may be disposed on a single module component or several module components. For example, an alignment portion may be disposed on several module components disposed laterally to form, e.g., a Sixpack module, and the module components, e.g., three module components, are disposed in a row above a cooler.

[0009] Therefore, the alignment portion may have a plurality of recesses including the at least one recess described above. The recesses may be spaced apart from one another along a lateral direction, for example, along a horizontal direction. The semiconductor module component may have a plurality of terminals including the at least one terminal described above. The terminals may be spaced apart from one another along a lateral direction, for example, along a horizontal direction.

[0010] The vertical direction is understood to mean a direction oriented perpendicular to the top surface of the semiconductor module component. The lateral direction is understood to mean a direction oriented parallel to the top surface of the semiconductor module component. The vertical direction and the lateral direction are mutually orthogonal. The top surface of the semiconductor module component is a side surface that can be defined by two vectors pointing, for example, to the horizontal and longitudinal directions. The horizontal direction may be a lateral direction in which the recesses of the alignment portions or terminals of the semiconductor module component or power module are spaced apart from each other. The longitudinal direction may be another lateral direction in which the terminals protrude beyond the side surface of the semiconductor module component. The recesses may extend along the longitudinal direction.

[0011] At least one terminal or a plurality of terminals may be located laterally from a side of the semiconductor module component along a lateral direction perpendicular to the horizontal, i.e., along the longitudinal direction. The terminals may also extend vertically from the body of the module component. Each of the plurality of terminals may be located at least partially within one of the recesses for lateral alignment and vertical mechanical support.

[0012] According to a further embodiment of the power module, at least one recess or a plurality of recesses are located on a side surface of the alignment portion. In a plan view of the upper side surface of the semiconductor module component, the at least one recess and the at least one terminal may be located outside the upper side surface of the semiconductor module component, for example, outside a periphery of the upper side surface of the semiconductor module component.

[0013] According to a further embodiment of the power module, at least one recess is formed as a slot extending vertically through the alignment section. The slot is, for example, an opening in the side of the alignment section. The slot may extend vertically partially or completely through the alignment section. However, the slot is not a through-hole completely surrounded by the inner wall of the recess in the lateral direction. The slot is rather an open recess in the side of the alignment section. The slot may have a retaining or support structure for supporting and aligning the terminals in the vertical direction. For example, the support structure does not extend over the entire bottom of the slot. The support structure may have, but is not limited to, a step shape. Furthermore, the bottom of the terminal may have an expansion structure. After the terminals are aligned, the retaining or support structure is located below the terminals, for example, in the case of the bottom surface. If the retaining or support structure has the form of a step in the side wall of the slot, a lateral expansion structure, for example, a crossbar of the terminal, is arranged on the surface of the step.

[0014] According to a further embodiment of the power module, at least one recess includes a retaining structure configured to mechanically support at least one terminal when the at least one terminal is pressed or inserted forward, e.g., vertically toward the direction of the terminal's tip. The retaining structure can thus vertically align the at least one terminal. For example, the terminal is held or carried entirely or at least partially by the retaining structure in the recess. Alignment of the at least one terminal can be achieved by both moving a module component having the terminal toward the fixed assembly substrate and by moving the assembly substrate toward the fixed module component having the terminal.

[0015] According to a further embodiment of the power module, the retaining structure is provided by a stepped structure on the inner wall of at least one recess. At least one terminal may have a laterally extending structure, for example in the form of a bar or crossbar, which is arranged on a stepped surface of the stepped structure. Additionally or alternatively, the retaining structure may be provided by a bottom region of at least one recess. A lower portion of at least one terminal may be arranged in the bottom region of at least one recess. For inserting the at least one terminal, the bottom region of the retaining structure or the lower portion does not extend over the entire cross section of the recess. The lower portion of the at least one terminal is, for example, a horizontal portion which may have an extension for contacting the retaining structure or the bottom region of the lower portion of the recess.

[0016] According to a further embodiment of the power module, the alignment portion is electrically insulating. For example, the alignment portion is made from an electrically insulating material. The alignment portion can comprise a body made from an electrically insulating material.

[0017] According to a further embodiment of the power module, it comprises a shielding layer configured to protect the semiconductor module components from electromagnetic interference and / or to protect the assembly substrate from electromagnetic interference with the power module, for example, during high voltage application. The shielding layer may be embedded within the alignment portion. The shielding layer may be made of a conductive material. However, since the shielding layer is not configured to be assigned to any electrical polarity of the power module, even if the shielding layer is embedded within the alignment portion, the alignment portion remains electrically insulated. For example, when the shielding layer is embedded within the alignment portion, the shielding layer does not have any externally accessible portion. In other words, the shielding layer is completely embedded within the alignment portion. The shielding layer may also be disposed on the top or bottom surface of the alignment portion. However, it is conceivable that the shielding layer does not completely cover the top and / or bottom surfaces of the alignment portion in a top view. In general, the shielding layer should not come into contact with other electrical components other than the ground contacts.

[0018] According to a further embodiment of the power module, the alignment portion is mechanically connected to the semiconductor module component by a bonding layer, for example after the alignment procedure. The bonding layer may be an adhesive layer, a pressure-sensitive adhesive layer, etc. Additionally or alternatively, the alignment portion may be mechanically connected to the semiconductor module component by a snap-fit ​​connection or a clamp connection. Also additionally or further alternatively, the alignment portion may be mechanically connected to the semiconductor module component by a pin-to-hole connection or a screw.

[0019] According to a further embodiment of the power module, at least one terminal is a pin-like terminal or a press-fit terminal, which may be inserted or pressed into a contact hole of the assembly substrate without using additional connection means, or may be mechanically fixed to the contact hole of the assembly substrate.

[0020] According to a further embodiment of the power module, the alignment portion comprises a plurality of recesses, each of which includes at least one recess. The semiconductor module component may comprise a plurality of terminals, each of which includes at least one terminal. The terminals may be main terminals and / or auxiliary terminals. Each of the plurality of terminals may be at least partially located in one of the recesses for the purpose of alignment along the lateral direction and for the purpose of mechanical support along the vertical direction. The plurality of terminals may belong to a single module component or to several module components. Thus, each module component may be fixed to only one alignment portion, or several module components may be fixed to one common alignment portion.

[0021] According to one embodiment of a method for fixing an alignment portion, e.g., an electrically insulating alignment portion, having at least one recess to a semiconductor module component having at least one terminal, the method includes positioning the alignment portion in an inclined orientation relative to the upper lateral surface of the semiconductor module component so as to insert at least one terminal, which is oriented perpendicular to the upper lateral surface of the semiconductor module component at least in some places, into at least one recess of the alignment portion, the recess being located in an edge region of the alignment portion.

[0022] The method further includes moving the alignment portion toward the upper lateral surface of the semiconductor module component so that the alignment portion reaches horizontally relative to the upper lateral surface of the semiconductor module component, and the at least one terminal protrudes beyond the at least one recess along the vertical direction, and the at least one recess is configured to align the at least one terminal laterally and further mechanically support the at least one terminal along the vertical direction. Therefore, vertical alignment can also be achieved. Furthermore, the method further includes fixing the alignment portion to the semiconductor module component to form a power module including the alignment portion and the semiconductor module component.

[0023] To prevent misalignment or undesired bending of the terminals, the alignment section and / or the module component may have additional alignment structures to support proper alignment between the module component and the alignment section. The alignment section may be aligned with the power module or module component using pin-to-holes in the terminal or mold body, or vice versa. The alignment section may also be aligned on the side of the mold body or elsewhere. Furthermore, bedstop or guide structures may be used in the alignment section or module component to align the alignment section with the power module or module component, for example, between the alignment section and the mold body of the module component. A combined alignment and fastening method using snap-fit ​​and / or threaded connections is also possible. Regarding vertical alignment, it should be noted that vertical alignment is possible when the terminals are low and positioned vertically. If the terminals are too high, the alignment tool presses the assembly board toward the terminals while still functioning as a support.

[0024] According to a further embodiment of the method, to electrically connect the power module to the assembly substrate, the method includes positioning the power module and the assembly substrate one above the other along a vertical direction, the assembly substrate having at least one contact hole for receiving at least one terminal of the semiconductor module component. Furthermore, the at least one terminal is inserted into the at least one contact hole, and the at least one recess of the alignment part comprises a holding structure that carries and mechanically supports the at least one terminal when the at least one terminal is press-fitted into the at least one contact hole. Here, the alignment of the at least one terminal can be achieved in both situations, i.e., by moving the module component having the terminal toward the fixed assembly substrate and by moving the assembly substrate toward the fixed module component having the terminal.

[0025] Accordingly, there is provided an apparatus including a power module according to any example or embodiment described herein and an assembly substrate, the power module and the assembly substrate being arranged one above the other along a vertical direction, the assembly substrate having at least one contact hole or a plurality of contact holes into which at least one terminal of a plurality of terminals of a semiconductor module component is inserted.

[0026] The present disclosure, based on its embodiments and examples, comprises several aspects of a power module including at least one semiconductor module component and an alignment portion, as well as a method for forming such a power module. All features described with respect to one aspect are also disclosed herein with respect to the other aspects, even if each feature is not explicitly mentioned in the context of a particular aspect. For example, the method described in the present disclosure relates to a method for forming the power module described herein. Thus, features and advantages described in connection with the method can be used for the power module, and vice versa.

[0027] While the present disclosure is susceptible to various modifications and alternative forms, specifics thereof have been shown by way of example in the drawings and will be described in detail. It should be understood, however, that the intention is not to limit the disclosure to the particular described embodiments and examples. On the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the scope of the present disclosure as defined by the appended claims.

[0028] The accompanying drawings are included to provide a further understanding. In the drawings, elements of the same structure and / or function may be assigned the same reference numerals. It should be understood that the examples shown in the figures are illustrative representations and are not necessarily drawn to scale. [Brief explanation of the drawings]

[0029] [Figure 1A] 1 is a cross-sectional view illustrating a general concept of a power module according to an example of the present disclosure. [Figure 1B] FIG. 10 is a top view illustrating a terminal within a recess in an alignment portion according to an example of the present disclosure. [Figure 2A] FIG. 10 shows a further example of a power module. [Figure 2B] FIG. 10 shows a further example of a power module. [Figure 3] FIG. 2 is a diagram showing an example of a semiconductor module component of a power module. [Figure 4A] 10A and 10B are diagrams showing examples of terminals positioned in recesses of an alignment portion when the terminals are inserted into contact holes of an assembly substrate; [Figure 4B] 10A and 10B are diagrams showing examples of terminals positioned in recesses of an alignment portion when the terminals are inserted into contact holes of an assembly substrate; [Figure 4C] 10A-10C show some example layouts of recesses in the alignment portion. [Figure 4D] 10A-10C show some example layouts of recesses in the alignment portion. [Figure 5] 1A-1C illustrate some examples of power modules interconnected to an assembly substrate. [Figure 6] 1A-1C illustrate some examples of power modules interconnected to an assembly substrate. [Figure 7A] 10A-10C illustrate several method steps for fixing an alignment portion to the top surface of a semiconductor module component. [Figure 7B] 10A-10C illustrate several method steps for fixing an alignment portion to the top surface of a semiconductor module component. [Figure 7C] 10A-10C illustrate several method steps for fixing an alignment portion to the top surface of a semiconductor module component. [Figure 7D] 10A-10C illustrate several method steps for fixing an alignment portion to the top surface of a semiconductor module component. [Figure 8A] 10A-10C illustrate several method steps for fixing an alignment portion to the top surface of a semiconductor module component. [Figure 8B] 10A-10C illustrate several method steps for fixing an alignment portion to the top surface of a semiconductor module component. [Figure 8C]10A-10C illustrate several method steps for fixing an alignment portion to the top surface of a semiconductor module component. DETAILED DESCRIPTION OF THE INVENTION

[0030] 1A shows a cross-sectional view of a power module 100 according to one embodiment. The power module 100 comprises at least one module component 10, such as a semiconductor module component 10. The module component 10 may be or comprise a discrete device such as, but not limited to, an electronic chip, a semiconductor chip, such as a sensor for measuring temperature or movement, a switching element such as an IGBT, a power MOSFET made of silicon, silicon carbide, gallium nitride or other semiconductor material, a diode, a resistor, a capacitor, an inductive component or a transistor.

[0031] The power module 100 further includes an alignment portion 20. The alignment portion 20 is disposed on at least one semiconductor module component 10. For example, the alignment portion 20 is mechanically fixed to a top surface 10T of the module component 10. The mechanical fixing of the alignment portion 20 to the module component 10 can be achieved, for example, but not limited to, by adhesive bonding, screwing, riveting, or by forming a snap-fit ​​or clamp connection between the alignment portion 20 and the module component 10.

[0032] The alignment portion 20 may be electrically insulating. For example, the alignment portion 20 is formed from an electrically insulating material. The alignment portion 20 can be manufactured by a molding process, for example, plastic injection molding. The alignment portion 20 includes at least one recess 20R. The recess 20R is formed, for example, in a side surface 20S of the alignment portion 20. The recess 20R may be a vertical slot. The vertical slot is, for example, a depression on the side surface 20S of the alignment portion 20. For example, the recess 20R is formed as a vertical slot extending vertically across the entire alignment portion 20.

[0033] As shown in FIG. 1A, the recess 20R is formed at the end of the alignment section 20. In a plan view of the upper surface 10T of the module component 10, the recess 20R does not have to overlap with the upper surface 10T of the module component 10. Therefore, the alignment section 20 is fixed to the module component 10 so that the recess 20R is located laterally from the upper surface 10T of the module component 10 in a top view. Apart from FIG. 1A, it is also conceivable that the recess 20R overlaps with the upper surface 10T of the module component 10 so that the recess 20R is located on the upper surface 10T of the module component 10 in a top view.

[0034] The module component 10 includes at least one terminal 12 or multiple terminals 12. The terminal 12 may be, for example, a control terminal or an auxiliary terminal connected to a control board. The terminal 12 may also be a power terminal or a main terminal. The terminal 12 may have a side portion and a vertical portion, which can be formed by bending the terminal 12, i.e., by bending a portion of the side portion so that the bent portion of the side portion becomes the vertical portion.

[0035] The vertical portions may also have press-fit connectors at their vertical ends. As shown in FIG. 1A , the side portions of the terminals 12 are parallel to the top surface 10T of the module component 10 and protrude laterally beyond the side surface 10S of the module component 10. Thus, the side portions are oriented perpendicular to the side surface 10S of the module component 10. The vertical portions of the terminals 12 are perpendicular to the top surface 10T of the module component 10. Thus, the terminals 12 are oriented perpendicular to the top lateral surface 10T of the semiconductor module component 10, at least in some places.

[0036] For the purpose of aligning along the lateral direction, the terminals 12 or vertical portions of the terminals 12 are at least partially positioned within at least one recess 20R. The recess 20R may have a side opening for receiving the terminals 12. When the terminals 12 are positioned within the recess 20R, lateral displacement of the terminals 12 is restricted, and the terminals 12 are aligned. Along the vertical direction, the terminals 12, for example, the tips of the vertical portions of the terminals 12, protrude beyond the recess 20R and are freely accessible. In a plan view of the side top surface 10T of the semiconductor module component 10, the recess 20R and the terminals 12 are positioned outside the side top surface 10T of the semiconductor module component 10.

[0037] The power module 100 shown in FIG. 2A is essentially the same as the power module 100 shown in FIG. 1A, except that FIG. 2A shows a bonding layer 40 disposed between the alignment portion 20 and the module component 10. The bonding layer 40 may be an adhesive or glue layer used to mechanically connect the alignment portion 20 to the module component 10. Alternatively, snap-fit ​​connections or screws can be used to mechanically connect the alignment portion 20 to the module component 10. This is shown, for example, in FIGS. 5 and 6.

[0038] Another difference between FIGS. 1 and 2 is that, according to FIG. 2A, the power module 100 comprises a shielding layer 50 configured to protect the module components 10 from electromagnetic interference or to protect the assembly substrate 30 from interference with the power module 100. The shielding layer 50 may be embedded in the alignment section 20. The shielding layer 50 may be made of a conductive material. For example, a metal sheet or a partially conductive plastic material may be embedded in the alignment section 20. Alternatively, the assembly substrate 30 may be attached on top of the power module 100, as shown in FIGS. 5 and 6, for example. The assembly substrate 30 may be a printed circuit board comprising control electronics.

[0039] The power module 100 shown in Fig. 2B is basically the same as the power module 100 shown in Fig. 2A, except that the shielding layer 50 is disposed on the top surface of the alignment section 20. Apart from Fig. 2B, the shielding layer 50 can also be disposed on the bottom surface of the alignment section 20. In the latter case, the shielding layer 50 is disposed between the alignment section 20 and the module component 10.

[0040] 3 shows an example of a module component 10 of a power module 100 to be interconnected to an assembly substrate 30, such as that shown in FIGS. 4A and 4B. For simplicity, the alignment portion 20 on the top surface 10T of the module component 10 is not shown.

[0041] The modular component 10 has a plurality of terminals 12, e.g., auxiliary terminals 12, on its side surface 10S. For example, the terminals 12 are pin-like terminals. The terminals 12 have vertical portions oriented in the vertical Z direction. The modular component 10 further includes additional terminals 13, e.g., main terminals 13, extending laterally and configured to electrically connect the modular components 10. Apart from the illustrations in this disclosure, the main terminals 13 may have lateral portions and vertical portions similar to the terminals 12. Thus, the main terminals 13 may be bent. The main terminals 13 may be aligned using alignment portions 20.

[0042] At least one of the main terminals 13 may have an opening 13H that may be configured to receive a snap-fit ​​portion 20H of the alignment portion 20 to form a snap-fit ​​connection between the alignment portion 20 and the module component 10. This is shown, for example, in Figures 5 and 7A.

[0043] When the alignment portion 20 is attached to the top surface 10T of the module component 10, each of the terminals 12 is positioned within a corresponding one of the recesses 20R of the alignment portion 20. Therefore, the terminals 12 can be positioned and aligned in the lateral horizontal X direction and the lateral longitudinal Y direction relative to the positions of the recesses 20R of the alignment portion 20.

[0044] The alignment portion 20 can mechanically support the terminal 12 when the terminal 12 is inserted into the contact hole 30H of the assembly substrate 30, as shown in Figures 4A and 4B. It should be noted that in conjunction with the laterally extending structure 12B in the form of the crossbar 12B of the auxiliary terminal 12 as shown in Figure 4A, or the horizontal portion of the terminal 12 as shown in Figure 4B, a considerable mechanical force is required to insert the press-fit terminal 12. The assembly substrate 30 may be, for example, a control board realized as a printed circuit board.

[0045] As shown schematically in Figures 4A and 4B, the assembly substrate 30 may be placed in a vertical position on top of the power module 100. The presence of the alignment features 20 allows the terminals 12, or vertical portions of the terminals, to be positioned and aligned in the lateral X and Y directions with the contact holes 30H of the assembly substrate 30. To electrically interconnect the power module 100 with the assembly substrate, the terminals 12, for example formed as press-fit terminals 12 as shown in Figures 4A and 4B, are inserted or press-fit into the contact holes 30H of the assembly substrate 30.

[0046] The terminals 12 are formed from a conductive material or have an outer metallization. As shown in Figures 4A and 4B, inside and partially outside the contact holes 30H, the assembly substrate 30 may be provided with a contact layer 30C for making electrical contact with the terminals 12. The contact layer 30C may be, for example, a metallization made of copper with an optional coating.

[0047] The terminal 12 or the vertical portion of the terminal 12 includes an upper portion 12A and a lower portion 12L. Only the upper portion 12A protrudes beyond the recess 20R of the alignment portion 23 and is inserted into the contact hole 30C. The lower portion 12L of the terminal 12 is located inside the recess 20R, for example, completely inside the recess 20R.

[0048] As shown in FIGS. 4A and 4B , the terminal 12 includes a laterally extending structure 12B, e.g., in the form of a crossbar 12B. The crossbar 12B may have a larger lateral cross section or extension than the upper portion 12A and / or lower portion 12L of the terminal 12. For example, the crossbar 12B has the largest lateral cross section or extension of the terminal 12 or the vertical portion of the terminal 12. The crossbar 12B is configured to mechanically support and / or secure the terminal 12 to the alignment portion 20, where the alignment portion 20 has a corresponding support or retention structure for receiving the crossbar 12B. Apart from FIGS. 4A and 4B , the laterally extending structure 12B can have another shape, e.g., formed as a one-sided bar.

[0049] The recesses 20R of the alignment portion 20 may include retention structures 20M configured to hold and mechanically support the terminals 12, for example, when the terminals 12 are pressed forward along a vertical direction, for example, toward the assembly substrate 30. Alternatively, the assembly substrate 30 can be pressed toward the terminals 12.

[0050] As shown in FIG. 4A , the retaining structure 20M is provided by a stair-like structure on the inner wall 20W of the recess 20R. The stair-like structure may form a receiving portion for receiving and holding the terminal 12. In this case, the crossbar 12B of the terminal 12 can be disposed on or hang down from the step surface 20Z of the stair-like structure. Therefore, the recess 20R or the alignment portion 20 mechanically supports the terminal 12, for example, when the alignment portion 20 is pressed along the vertical Z direction to insert, for example, the press-fit portion of the terminal into the contact hole 30H of the assembly substrate 30, as shown on the right side of FIG. 4A , or vice versa. Therefore, the recess 20R aligns the terminal 12 in the Z direction.

[0051] 4B, the retaining structure 20M may be provided by the bottom region 20B of the recess 20R. In this case, the lower horizontal portion 12L of the terminal 12 can be placed in the bottom region 20B of the recess 20R and is mechanically supported by the bottom region 20B.

[0052] It should be noted here that if the terminal 12 is a flexible auxiliary terminal 12, in order to avoid the risk of the flexible auxiliary terminal 12 being deformed while inserting and / or pressing it into the contact hole 30H, it is supported vertically by a laterally extending structure 12B, for example a crossbar 12B close to the press-fit area, for example a stepped surface 20Z of the inner wall 20W as shown in Figure 4A. A support on the bottom area 20B as shown in Figure 4B can be used for standard pin terminals or mechanically stable terminals, for example main terminals 13 or thicker terminals.

[0053] 4C and 4D show some exemplary layouts of the cross section of the recess 20R in the XY plane. The recess 20R may be formed as a slot having a rectangular shape with straight walls as shown in FIG. 4C or as a slot having a trapezoidal shape as shown in FIG. 4D. However, the layout of the cross section of the recess 20R is not limited to the layouts shown in FIGS. 4C and 4D. The recess 20R may also be formed as a slot having curved walls or a V-shape, for example.

[0054] Thus, as shown in Figures 4A-4D, recess 20R, formed, for example, as a vertical slot, may be used to position or align terminal 12 in the lateral X and Y directions, as well as to mechanically support and align terminal 12 in the vertical Z direction. Side and end walls of recess 20R provide for positioning and alignment of terminal 12 in the lateral X and Y directions. Receptors, also referred to as bosses, formed, for example, as step-like structures in bottom region 20B and / or inner walls of recess 20R, for example, provide for mechanical support of terminal 12 in the vertical Z direction. As shown in Figure 4A, the receivers are configured to receive laterally extending structures 12B, for example, in the form of crossbars 12B of terminal 12.

[0055] FIG. 5 shows a snap-fit ​​connection between the modular component 10 and the alignment portion 20. The snap-fit ​​connection can be formed by a snap-fit ​​portion 20H of the alignment portion 20 and a snap-fit ​​opening of the main terminal 13. The snap-fit ​​portion 20H is, for example, a button-like protrusion on the alignment portion 20. The snap-fit ​​portion 20H may be inserted into the snap-fit ​​opening 13H of the main terminal 13. For example, the snap-fit ​​portion 20H is made of an elastic material and has a cross-section that is larger in some places than the snap-fit ​​opening 13H of the main terminal 13. The snap-fit ​​portion 20H may be temporarily deformed when inserted into the snap-fit ​​opening 13H of the main terminal 13. In a plan view of the top surface 10T of the modular component 10, the snap-fit ​​connection is realized on the outside of the top surface 10T. Such a snap-fit ​​connection also ensures correct alignment of the alignment portion 20 with respect to the modular component 10.

[0056] The power module 100 can also be mechanically fastened to the assembly substrate 30 by a screw, for example, a first screw 41 as shown in Figure 5. The first screw 41 extends vertically across the assembly substrate 30 into the alignment section 20. However, the first screw 41 does not extend across the entire alignment section 20.

[0057] 5, the module component 10 is disposed on a carrier 11. The carrier 11 may be, but is not limited to, a base plate, a cooler, or a heat sink.

[0058] 6 shows another configuration of a power module 100 connected to an assembly board 30, the power module 100 comprising at least one module component 10 and an alignment section 20. The power module 100 further comprises a printed circuit board 14 and a carrier 11, the printed circuit board 14 being disposed between the carrier 11 and the module component 10. For additional fastening, an additional screw, for example a second screw 42, may be used to secure the assembly board 30 not only to the alignment section 20 but also to the module component 10 and the printed circuit board 14. Thus, along the vertical direction, the common second screw 42 extends into the printed circuit board 14 across the assembly board 30, the alignment section 20, and the module component 10.

[0059] It is also possible to fasten the alignment portion 20 to the module part 10 (to the module body or main terminals as well as to a snap-fit ​​connection) by means of a screw. As in Figure 6, the screw may extend under the power module 100 to the carrier 11 so that the complete setting is fixed by the screw. Other possibilities for fastening and / or aligning the alignment portion 20 to the power module 100 or module part 10 include, for example, a clamp connection, a pin-to-hole connection, a snap-fit ​​connection, the use of a bedstop structure, and / or the use of a guide structure such as a guide rail.

[0060] 1 to 6 , the alignment portion 20 may include multiple recesses 20R for receiving multiple terminals 12. Each of the multiple terminals 12 may be disposed in one of the recesses 20R for alignment along the horizontal X and Y directions and mechanical support along the vertical Z direction. A single alignment portion 20 may be fixed to two or more module components 10, such as three module components 10 arranged in a row, to form a so-called Sixpack module, which may include three module components 10 mounted on a carrier 11, which is a cooler. Before and after mounting the power module 100 on the assembly substrate 30, the alignment portion 20 remains on top of the module component 10. For example, the alignment portion 20 may be located between the assembly substrate 30 and the module component 10, or between the assembly substrate 30 and the module housing of the power module 100 or the module component 10.

[0061] Figures 7A, 7B, 7C and 7D show some method steps for fastening the alignment portion 20 to the modular component 10 using a snap-fit ​​connection. Apart from a snap-fit ​​connection, further screws can also be used, for example a third screw 43 as shown in Figure 8C or a bonding layer 40 as shown in Figure 2A or 2B. It is also possible to use screws between the alignment portion 20 and the terminals 12 / 13.

[0062] As shown in Figures 7A and 7B, the alignment portion 20 moves laterally toward the terminals 12 or toward a row of terminals 12 in an inclined orientation, so that the terminals 12, for example, press-fit terminals 12, can be inserted into the recesses 20R of the alignment portion 20. The recesses 20R are aligned in a direction perpendicular to the orientation of the terminals 12. Subsequently, as shown in Figures 7C and 7D, the alignment portion 20 moves horizontally. Thus, the possible laterally extending structures 12B of the terminals 12 can be inserted into the receiving portions of the recesses 20R and positioned on the corresponding bosses or notches of the receiving portions. 7C shows, in top view, several different positions of the terminals 12 relative to the recesses 20R of the alignment portion 20. The different positions of the terminals 12 relative to the recesses 20R of the alignment portion 20 shown in FIG. 7C may correspond to the different positions of the terminals 12 relative to the alignment portion 20 shown in FIG. 7B.

[0063] Terminal 12 has a laterally extending structure 12B in the form of a crossbar. Recess 20R has a stepped surface 20Z for receiving and supporting laterally extending structure 12B. When laterally extending structure 12B is placed on stepped surface 20Z, terminal 12 is aligned not only laterally but also vertically.

[0064] 7D, when the alignment portion 20 reaches the horizontal direction, the terminal 12 is properly aligned in the direction parallel to the orientation of the terminal 12 and in the vertical direction. Finally, the alignment portion 12, which also serves as a support portion for the terminal 12, is mechanically fixed to the main terminal 13 by using a snap fit, which can be formed as a snap fit opening 13H of the main terminal 13 or as a power terminal in a hole formed in the side of the main terminal 13. Thereafter, the assembly board 30 can be attached to the power module 100.

[0065] Figures 8A, 8B, and 8C illustrate several method steps for securing alignment portion 20 to modular component 10 using screws 43. The method steps described in Figures 8A and 8B are substantially identical to the method steps shown in Figures 7A and 7B, except that alignment portion 20 does not have snap-fit ​​portion 20H.

[0066] 8C, the fixing can be performed by a screw connection with the module component 10, for example, with the encapsulation or with the main terminal 13 of the module component 10. A screw, here the third screw 43, extends into the module component 10 along a vertical direction across the entire alignment portion 20. Further or additional methods for fixing the alignment portion 20 are also possible, for example, gluing the alignment portion 20 to the module component 10 or using any type of clamp fit of the alignment portion 20 to the module component 10. These fixing methods can also be applied to further mounting of the alignment substrate 20.

[0067] The embodiments shown in the above figures represent exemplary embodiments of power modules and methods for securing an alignment portion to at least one module component or connecting a power module to an assembly substrate. Therefore, they do not constitute an exhaustive list of all embodiments with improved configurations of the power module or method. The actual configuration of the power module or method may differ from the exemplary embodiments described above.

[0068] This application claims priority from European Patent Application No. 22194844.1, the disclosure of which is incorporated herein by reference. [Explanation of symbols]

[0069] Reference sign 100 Power Module 10 Semiconductor module parts 10S Semiconductor module component side Top surface of 10T semiconductor module component 11. Career 12 Terminals of semiconductor module components Top of 12A terminal 12B Terminal Lateral Extension Structure or Crossbar 12L terminal bottom 13 Main terminals of semiconductor module components 13H Snap-fit ​​openings for main terminals of semiconductor module components 14 Circuit Board 20 Alignment section 20H Alignment snap fitting 20R Alignment recess 20S Side of alignment section 20B Bottom region of recess 20M Retaining structure for the alignment recess 20W Inner wall of recess 20Z Inner wall step surface 30 Assembly Board 30C Assembly Board Contact Layer 30H assembly board contact holes 40 Bonding layer 41 First Screw 42 Second screw 43 Third Screw 50 shielding layers X Lateral / Horizontal Y Horizontal / Longitudinal Z vertical direction.

Claims

1. A power module (100) comprising a semiconductor module component (10) and an alignment section (20), The alignment portion (20) is fixed to the upper surface (10T) of the semiconductor module component (10) and has at least one recess (20R), the semiconductor module component (10) comprises at least one terminal (12, 13), the at least one terminal (12, 13) having a vertical portion perpendicular to the top surface (10T) of the semiconductor module component (10) and thereby oriented perpendicular to the top surface (10T) of the semiconductor module component (10), the at least one terminal (12, 13) being at least partially located within the at least one recess (20R) for the purpose of aligning it along a lateral direction parallel to the top surface (10T) of the semiconductor module component (10) and for further mechanically supporting the at least one terminal (12, 13) along the vertical direction; the at least one terminal (12, 13) protrudes beyond the at least one recess (20R) along the vertical direction perpendicular to the top surface (10T) of the semiconductor module component (10); The at least one recess (20R) is located on a side surface (20S) of the alignment portion (20), In a plan view of the top surface (10T) of the semiconductor module component (10), the at least one recess (20R) and the at least one terminal (12, 13) are located outside the top surface (10T) of the semiconductor module component (10), the at least one recess (20R) is formed as a slot extending along the vertical direction through the alignment portion (20); The slot is a recess that opens to the side surface (20S) of the alignment portion (20), A power module (100) in which the slot is not a through hole that is completely surrounded by an inner wall (20W) of the at least one recess (20R) in the lateral direction.

2. The alignment portion (20) is electrically insulating. The power module (100) of claim 1.

3. The terminal (12) further comprises a side portion; The side portions are parallel to the top surface (10T) of the semiconductor module component (10) and protrude laterally beyond the side surfaces (10S) of the semiconductor module component (10), and are therefore oriented perpendicular to the side surfaces (10S) of the semiconductor module component (10). A power module (100) according to claim 1 or 2.

4. the at least one recess (20R) includes a retaining structure (20M) configured to mechanically support the at least one terminal (12, 13) when the at least one terminal (12, 13) is pushed or inserted forward along the vertical direction; A power module (100) according to claim 1 or 2.

5. the retaining structure (20M) is provided by a stepped structure of the inner wall (20W) of the at least one recess (20R), The at least one terminal (12, 13) has a lateral extension structure (12B) disposed on a step surface (20Z) of the stair-like structure. The power module (100) of claim 4.

6. the retaining structure (20M) is provided by a bottom region (20B) of the at least one recess (20R), a lower portion (12L) of the at least one terminal (12, 13) is disposed in the bottom region (20B) of the at least one recess (20R); The power module (100) of claim 4.

7. 3. The power module (100) according to claim 1 or 2, comprising a shielding layer (50) configured to protect the semiconductor module components (10) from electromagnetic interference, the shielding layer (50) being embedded in the alignment portion (20) or disposed on the top or bottom surface of the alignment portion (20).

8. The alignment portion (20) is mechanically connected to the semiconductor module component (10) by a bonding layer (40). A power module (100) according to claim 1 or 2.

9. 3. The power module (100) according to claim 1 or 2, wherein the alignment portion (20) is mechanically connected to the semiconductor module component (10) by a snap-fit ​​or clamp connection, or by a pin-to-hole connection or screws (42, 43).

10. 3. The power module (100) according to claim 1 or 2, wherein the at least one terminal (12, 13) is a pin-type terminal or a press-fit terminal.

11. the alignment portion (20) has a plurality of recesses (20R) including the at least one recess (20R), the semiconductor module component (10) has a plurality of terminals (12, 13) including the at least one terminal (12, 13); each of the plurality of terminals (12, 13) at least partially located within one of the recesses (20R) for alignment along the lateral direction and for mechanical support along the vertical direction; A power module (100) according to claim 1 or 2.

12. A device comprising a power module (100) according to claim 1 or 2 and an assembly substrate (30), The power module (100) and the assembly substrate (30) are arranged one above the other along the vertical direction, The assembly substrate (30) has at least one contact hole (30H) into which the at least one terminal (12, 13) of the semiconductor module component (10) is inserted.

13. A method for fixing an alignment part (20) having at least one recess (20R) to a semiconductor module part (10) having at least one terminal (12, 13), comprising: the alignment portion (20) has a vertical portion perpendicular to the upper surface (10T) of the semiconductor module component (10), thereby positioning the alignment portion (20) in an inclined orientation with respect to the upper surface (10T) of the semiconductor module component (10) so that the at least one terminal (12, 13) oriented perpendicular to the upper surface (10T) of the semiconductor module component (10) is at least partially inserted into the at least one recess (20R) of the alignment portion (20); The at least one recess (20R) is located on a side surface (20S) of the alignment portion (20), In a plan view of the top surface (10T) of the semiconductor module component (10), the at least one recess (20R) and the at least one terminal (12, 13) are located outside the top surface (10T) of the semiconductor module component (10), The at least one recess (20R) is formed as a slot extending vertically through the alignment portion (20); The slot is a recess that opens to the side surface (20S) of the alignment portion (20), The slot is not a through hole completely surrounded in the transverse direction by the inner wall (20W) of the at least one recess (20R), the vertical direction is perpendicular to the top surface (10T) of the semiconductor module component (10); the alignment portion (20) is moved toward the upper surface (10T) of the semiconductor module component (10) so that the alignment portion (20) reaches the upper surface (10T) of the semiconductor module component (10) in a horizontal direction, and the at least one terminal (12, 13) protrudes beyond the at least one recess (20R) along the vertical direction, and the at least one recess (20R) is configured to align the at least one terminal (12, 13) in a horizontal direction parallel to the upper surface (10T) of the semiconductor module component (10) and to further mechanically support the at least one terminal (12, 13) along the vertical direction; The method includes securing the alignment portion (20) to the semiconductor module component (10) to form a power module (100) comprising the alignment portion (20) and the semiconductor module component (10).

14. Furthermore, to electrically connect the power module (100) to the assembly substrate (30), positioning the power module (100) and the assembly substrate (30) vertically along the vertical direction, the assembly substrate (30) having at least one contact hole (30H) for receiving the at least one terminal (12, 13) of the semiconductor module component (10); inserting the at least one terminal (12, 13) into the at least one contact hole (30H), wherein the at least one recess (20R) of the alignment portion (20) comprises a holding structure (20M) that carries and mechanically supports the at least one terminal (12) when the at least one terminal (12, 13) is inserted or press-fit into the at least one contact hole (30H); 14. The method of claim 13, comprising:

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