Systems and methods for curing thermoset composites
The system for curing thermoset composites using a mold, pressure medium bag, and mechanical press with smart susceptors and induction heating addresses inefficiencies in existing methods, achieving rapid and uniform curing without autoclaves, thus enhancing production efficiency and reducing costs.
Patent Information
- Application Number
- JP2021082205
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2020-05-29
- Filing Date
- 2021-05-14
- Publication Date
- 2025-09-05
- Estimated Expiration
- 2041-05-14
AI Technical Summary
Existing methods for curing thermoset composites, such as autoclave, oven, and matched-die curing, are inefficient in terms of cure cycle time, require significant energy and infrastructure, and often result in non-uniform pressure application, leading to incomplete curing and increased costs.
A system comprising a mold, a pressure medium bag, and a mechanical press is used to apply heat and pressure uniformly to uncured thermoset composite parts, utilizing smart susceptors and induction heating to achieve rapid heating and consistent pressure distribution, including pressures greater than 1 bar.
This system significantly reduces cure cycle time, ensures uniform pressure application, and eliminates the need for autoclaves, thereby improving production efficiency and reducing costs.
Smart Images

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Abstract
Description
[Technical Field]
[0001] The present disclosure relates generally to the manufacture of thermoset composites, and more particularly to systems and methods for curing thermoset composites with heat and pressure. [Background technology]
[0002] Polymer composites are strong, lightweight materials created by combining two or more functional materials, such as reinforcing fibers in a polymer resin matrix. The production of thermoset composite parts typically requires the application of both pressure and heat to complete the curing and consolidation process. For example, various pressure and temperature profiles, i.e., changes as a function of time, can be used to process uncured thermoset composite parts or preforms.
[0003] Typically, curing of uncured thermoset composite parts is carried out in a pressurized autoclave, where a heat source, such as a resistive heating element, supplies heat to the uncured thermoset composite part by convection before or during which consolidation pressure is applied. The time required to bring the autoclave to a given temperature and heat the uncured thermoset composite part before applying consolidation pressure during the overall cure cycle time significantly impacts production rates. Furthermore, the use of autoclaves can increase the cost of thermoset composite manufacturing due to the additional space and infrastructure required, as well as the significant energy and consumable consumption associated with using an autoclave.
[0004] Alternatives to autoclave curing of composites include oven curing and heated matched-die curing. However, the pressure in oven curing is limited to a vacuum, which often does not eliminate all porosity; oven curing also requires a heated mold. Also, in matched-die molds, pressure differences can occur due to local thickness variations. For example, matched-die mold faces that are (nearly) perpendicular to the direction of pressure application may not receive enough pressure to properly cure the composite.
[0005] Therefore, there is a need to reduce the cure cycle time of uncured thermoset composite parts by providing a more efficient system and method for processing uncured thermoset composite parts, a system and method that can efficiently apply heat and pressure to uncured thermoset composite parts, and particularly a system and method that can achieve rapid heating of the mold without the need for an autoclave, and that can apply more uniform pressure, including pressures greater than 1 bar, to all sides of the uncured thermoset composite part during cure. Summary of the Invention
[0006] This summary is intended only to provide a brief summary of some aspects of one or more embodiments of the present disclosure. This summary is not an exhaustive overview and is not intended to identify key elements or delineate the scope of the disclosure. Rather, its purpose is merely to present one or more concepts in a simplified form as a prelude to the more detailed description that follows.
[0007] The above and / or other aspects and advantages embodied in the present disclosure may be achieved by providing a system for curing thermosetting composites, the system including: a mold configured to receive and support an uncured thermosetting composite part and to heat the uncured thermosetting composite part; a pressure medium bag containing a pressure medium configured to be placed on the uncured thermosetting composite part disposed in the mold; and a mechanical press configured to apply a consolidation pressure to the uncured thermosetting composite part disposed in the mold, the pressure medium bag configured to distribute the consolidation pressure applied by the mechanical press to the uncured thermosetting composite part disposed in the mold.
[0008] The mold may include a heated surface configured to contact at least a portion of the uncured thermoset composite part supported by the mold and heat at least a portion of the uncured thermoset composite part to a predetermined temperature.
[0009] The heated surface of the mold may include, for example, a smart susceptor, which may have a Curie temperature corresponding to the predetermined temperature.
[0010] The pressure medium bag may include a heating surface configured to contact at least a portion of the uncured thermoset composite component and heat the at least a portion of the uncured thermoset composite component to a predetermined temperature.
[0011] The heating surface of the pressure medium bag may include, for example, a smart susceptor, which may have a Curie temperature corresponding to the predetermined temperature.
[0012] The pressure medium bag is configured to hold the pressure medium, for example, the pressure medium bag comprises a flexible material configured to withstand and distribute the consolidation pressure applied by the mechanical press.
[0013] The pressure medium bag may include, for example, one or more vacuum ports, and may be configured to function as a vacuum bag when placed over the uncured thermoset composite part and the mold.
[0014] The pressure medium may include a plurality of pressure media.
[0015] The pressure medium may have an average particle size of about 0.5 mm to about 5 mm.
[0016] The pressure medium may include a thermally insulating material.
[0017] The pressure medium may include a gel medium.
[0018] The pressure medium may include one or more of sand, glass, and a ceramic material.
[0019] The pressure medium bag may comprise a flexible material configured to withstand and distribute the consolidation pressure applied by the mechanical press.
[0020] The pressure medium bag may, for example, include one or more compartments configured to restrict movement of the pressure medium and thereby maintain the consolidation pressure within the one or more compartments.
[0021] The system may further include a compressor having a shape corresponding to a shape of at least one of the mold and the uncured thermoset composite part, the compressor being configured to distribute the consolidation pressure applied by the mechanical press to the pressure medium bag and the uncured thermoset composite part.
[0022] The above and / or other aspects and advantages embodied in the present disclosure can be achieved by providing a method for curing a thermoset composite, the method comprising: placing an uncured thermoset composite part in a mold; placing a pressure medium bag on the uncured thermoset composite part placed in the mold, the pressure medium bag containing a pressure medium, heating the uncured thermoset composite part to a predetermined temperature, applying a consolidation pressure to the uncured thermoset composite part, and dissipating the consolidation pressure applied to the uncured thermoset composite part placed in the mold through the pressure medium bag.
[0023] The method further includes placing a compressor over the pressure medium bag, the compressor further dispersing the consolidation pressure applied to the pressure medium bag and the uncured thermoset composite part disposed in the mold.
[0024] At least one of the mold and the pressure medium bag includes a heated surface, and the uncured thermoset composite part can be heated to the predetermined temperature by at least one of the heated surface of the mold and the heated surface of the pressure medium bag.
[0025] At least one of the heated surface of the mold and the heated surface of the pressure medium bag may include, for example, a smart susceptor, which may have a Curie temperature corresponding to the predetermined temperature.
[0026] The pressure medium has an average particle size of, for example, about 0.5 mm to about 5 mm, and the pressure medium includes a heat insulating material.
[0027] Further areas of applicability will become apparent from the detailed description provided hereinafter. It is to be understood that the detailed description and specific examples, while indicating preferred embodiments of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention. [Brief explanation of the drawings]
[0028] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the disclosure, although some of the details of the drawings have been simplified and are drawn to facilitate understanding of the disclosure rather than to maintain strict structural accuracy, detail, or scale.
[0029] [Figure 1-2] FIG. 1 illustrates a system for curing a thermoset composite, according to an embodiment of the present disclosure. [Figure 3] FIG. 1 illustrates induction heating using a smart susceptor, according to an embodiment. [Figure 4] FIG. 1 illustrates a system for curing a thermoset composite, according to an embodiment. [Figure 5] FIG. 1 illustrates a system for curing a thermoset composite, according to an embodiment. [Figure 6] FIG. 1 illustrates a method for curing a thermosetting composite, according to an embodiment. [Figure 7] 1 is a flowchart of an aircraft manufacturing and service method. [Figure 8] FIG. 1 is a block diagram of an aircraft. DETAILED DESCRIPTION OF THE INVENTION
[0030] Reference will now be made in detail to the exemplary embodiments of the present disclosure, which are illustrated in the accompanying drawings, wherein like reference numerals are generally used to refer to like parts throughout.
[0031] Uncured thermoset composite parts, also known as "preforms," are typically cured by applying a combination of heat and pressure according to a predetermined cure schedule that specifies the pressure, temperature, and time the pressure and temperature are maintained. These scheduled temperatures and pressures are sometimes referred to as the cure temperature profile and consolidation pressure profile.
[0032] As used herein, an "uncured thermoset composite part" or "preform" refers to one or more layers of composite material impregnated with resin. For example, an uncured thermoset composite part is a fiber-reinforced uncured thermoset polymer composite part.
[0033] With respect to fiber-reinforced thermoset polymer composite parts, curing generally refers to the application of heat and / or pressure to crosslink and consolidate the fibers of the fiber-reinforced thermoset polymer composite part. While it is possible to partially cure (i.e., crosslink) a thermoset without the application of pressure, this often results in an underconsolidated part. Thus, as used herein, the terms "cure" and "curing" include both the application of heat (to cure / crosslink) and pressure (to consolidate) to a fiber-reinforced thermoset polymer composite part, such as the thermoset composite parts of the present disclosure.
[0034] In another example, the uncured thermoset composite part may be a prepreg. As used herein, "prepreg" refers to a stack of pre-impregnated composite plies, such as epoxy-impregnated unidirectional composite tape. Prepregs are flexible until cured, which is often accomplished by heat and pressure curing or curing in an autoclave.
[0035] Aspects of systems and methods for curing thermoset composites that require the application of both heat and pressure are described below. While the systems and methods are described below in the context of uncured thermoset composite parts, the disclosure is not limited thereto. The systems and methods described below are also applicable to other materials that require the application of heat and pressure for curing, such as curing adhesives for structural bonding or consolidating thermoplastic fiber-reinforced composites.
[0036] 1-2 illustrate a system for curing a thermosetting composite according to an embodiment of the present disclosure. As shown in FIGS. 1-2, the system 10 for curing an uncured thermosetting composite part 100 includes a tooling die 200, a pressure media bag 300, and a mechanical press 400. While the system 10 is shown as further including a controller 260, a sensor 262, and a power source 264, these components are not required in all embodiments. Other embodiments may include additional components. For example, FIG. 4 illustrates a system for curing a thermosetting composite according to another embodiment. As shown in FIG. 4 and described below, in some embodiments, the system 10 also includes a compactor 500.
[0037] The uncured thermoset composite part 100 may be, for example, a preform. The uncured thermoset composite part 100 may include an uncured fiber-reinforced thermoset polymer composite. For example, the uncured thermoset composite part 100 may include a laminate of a fiber-reinforced polymer resin, such as a carbon fiber / epoxy resin, or other thermoset resin that requires heating to a predetermined temperature to cause curing.
[0038] In other embodiments, the uncured thermoset composite part 100 includes interwoven wire fabrics (IWWF), fiber metal laminates, and / or a honeycomb or foam core surrounded by composite materials.
[0039] Mold 200 is configured to receive the uncured thermoset composite component 100. For example, mold 200 can be configured to receive and support the uncured thermoset composite component 100 during the curing process. Mold 200 can include a receiving surface 211 shaped to substantially match the shape of the uncured thermoset composite component 100. For example, mold 200 includes a receiving surface 211 shaped to substantially match the bottom surface 102 of the uncured thermoset composite component 100 to be cured.
[0040] In some embodiments, the mold 200 is configured to receive and support the pressure medium bag 300. For example, the mold 200 may include a wall 220 configured to hold the pressure medium bag 300 in a constrained position above the uncured thermoset composite part 100, limiting movement of the pressure medium bag 300. In other embodiments, the mold 200 is configured to seal against the pressure medium bag 300, and the pressure medium bag 300 is configured to act as a vacuum bag.
[0041] Mold 200 can be configured to heat uncured thermoset composite component 100. Mold 200 can employ any of a variety of heating techniques to generate the heat necessary to heat uncured thermoset composite component 100 to a predetermined temperature, such as a cure temperature or a cure temperature profile. For example, mold 200 can include a heated surface 214 configured to heat uncured thermoset composite component 100 to a predetermined temperature. Heating surface 214 can be positioned on, for example, receiving surface 211 and cover at least a portion of receiving surface 211. In other embodiments, receiving surface 211 includes heating surface 214. Heating surface 214 can be configured to contact, for example, at least a portion of uncured thermoset composite component 100 supported by mold 200.
[0042] The mold 200 generates heat, for example, by electrical induction, and the generated heat is transferred to at least a portion of the uncured thermoset composite component 100. For example, as shown in FIGS. 1-3, heat is generated by utilizing the magnetic properties of a magnetic material in combination with the application of high-frequency alternating current (AC) power. As described below, the mold 200 can include induction heating and smart susceptors for heating the uncured thermoset composite component 100. For example, the heating surface 214 includes one or more induction heating elements 252, each of which includes a coaxially arranged electrical conductor 254 and a surrounding smart susceptor sleeve 256 with a predetermined Curie temperature. The heating surface 214 is configured to heat at least a portion of the uncured thermoset composite component 100 to a predetermined temperature, such as a cure temperature or a cure temperature profile.
[0043] Thus, in one embodiment, mold 200 includes a heated surface 214 configured to contact uncured thermoset composite part 100 and heat at least a portion of uncured thermoset composite part 100 to a predetermined temperature. Heating surface 214 can include, for example, a smart susceptor, which can have a Curie temperature corresponding to the predetermined temperature.
[0044] In one embodiment, the predetermined temperature or temperature profile is from just above room temperature (80°F) to about 820°F. The predetermined temperature or temperature profile may vary depending on the composition of the uncured thermoset composite component 100 and / or the curing requirements of the resin or composite layers forming the uncured thermoset composite component 100. For example, the predetermined temperature or temperature profile may be from just above room temperature (80°F) to about 350°F.
[0045] As shown in FIG. 3, the heating surface 214 includes an upper facesheet 246 and a lower facesheet 248 that are filled with a thermally conductive material 250 on the inside.
[0046] The upper and lower facesheets 246, 248 comprise a rigid layer of a suitable resin, such as, for example, an epoxy resin or bismaleimide (BMI), which may contain one or more induction heating elements 252. The rigid layer of resin forms the upper facesheet 246 of the heating surface 214, which may be configured to conform to the lower surface 102 of the uncured thermoset composite part 100 placed in the mold 200. In other embodiments, other resins may be used to fabricate the upper and lower facesheets 246, 248, including, but not limited to, polybenzoxazine (BXA). In some embodiments, the heating surface 214 forms a permanent, inflexible shape to conform to a particular application or the uncured thermoset composite part 100. For example, the heating surface 214 and / or the upper and lower facesheets 246, 248 may comprise a metal.
[0047] As described above, the induction heating element 252 may be embedded within the material 250. The induction heating element 252 may include a coaxially arranged conductor 254 and a surrounding susceptor sleeve 256. The conductor 254 may include, for example, but is not limited to, a Litz wire, with a helical tape susceptor wrapped around it. The susceptor sleeve 256 extends substantially the entire length of the conductor 254. An axially extending space between the conductor 254 and the susceptor sleeve 256 electrically insulates the susceptor sleeve 256 from the conductor 254. The susceptor sleeve 256 is inductively heated by an alternating current flowing through the conductor 254. The inductively heated susceptor sleeve 256 transfers heat to the material 250, which in turn transfers heat to the uncured thermoset composite part 100 through the heating surface 214.
[0048] Material 250 may include ferromagnetic or superparamagnetic particles (not shown) to aid in heating material 250. When ferromagnetic particles are used, material 250 heats substantially below the Curie temperature of the particles due to hysteresis heating of the ferromagnetic particles. When superparamagnetic particles are incorporated into material 250, heat conducted through material 250 is generated by relaxation heating of the superparamagnetic particles over a Curie temperature range related to the size or diameter of the superparamagnetic particles.
[0049] As shown in FIG. 1 , suitable wiring 258 connects one or more heating elements 252 in heating surface 214 to an AC power source 264, for example, either a portable or stationary power source. Power source 264 is connected to a power source, such as, but not limited to, a conventional 60 Hz, 110 volt, or 220 volt outlet (not shown). Power source 264 preferably provides AC current to electrical conductors 254 in the range of about 1,000 Hz to about 300,000 Hz, although higher frequencies are possible. To facilitate adjustment of the magnitude or frequency of the AC current provided to electrical conductors 254, one or more temperature sensors 262 may be disposed on heating surface 214 to monitor the temperature of heating surface 214. Power source 264 can be controlled by a suitable controller 260 based on the temperature measured by temperature sensor 262.
[0050] As shown in Figures 1 to 3, the susceptor sleeve 256 is formed of a magnetic material having a Curie temperature. The susceptor sleeve 256 can be formed as a cylindrically arranged solid or single part. The susceptor sleeve 256 can be implemented as a smart susceptor sleeve 256.
[0051] An alternating current is passed through the conductors 254, creating a magnetic field 268 around the susceptor sleeve 256. Exposure to the magnetic field 268 generates eddy currents 270 within the conductors 254, which in turn induce heating of the susceptor sleeve 256. Heat from the susceptor sleeve 256 is then conducted through the material 250 and through the heating surface 214 to the uncured thermoset composite part 100. The magnetic material forming the susceptor sleeve 256 preferably has high magnetic permeability and a Curie temperature corresponding to the target heating temperature of the uncured thermoset composite part 100 by the mold 200, i.e., the curing temperature of the uncured thermoset composite part 100. The susceptor sleeve 256 and the conductors 254 are preferably sized and configured such that their magnetic permeability concentrates the magnetic field 268 at temperatures below the Curie temperature of the susceptor sleeve 256.
[0052] Heating of the susceptor sleeve 256 continues while the AC current is applied until the magnetic material forming the susceptor sleeve 256 reaches its Curie temperature. Once the Curie temperature is reached, the susceptor sleeve 256 becomes non-magnetic, at which point the magnetic field 268 is no longer focused on the susceptor sleeve 256. The induced eddy currents 270 and associated resistive heating are reduced to a level sufficient to maintain the temperature of the susceptor sleeve 256 at the Curie temperature, so that the uncured thermoset composite part 100 and / or mold 200 continue to be heated to the desired cure temperature for the duration of the cure cycle, at which point the AC current is removed from the electrical conductor 254.
[0053] Although some embodiments use induction heating for mold 200, the disclosure is not limited thereto and other heating methods may be used to heat mold 200, such as resistive heating, forced air, heated oil, etc.
[0054] The pressure medium bag 300 is configured to be placed on top of the uncured thermoset composite component 100 placed in the mold 200 and contains a pressure medium 320. The pressure medium bag 300 includes a receiving surface 311, and the pressure medium bag is configured to substantially conform to the shape of the uncured thermoset composite component 100. For example, the pressure medium bag 300 substantially conforms to the top surface 103 of the uncured thermoset composite component 100 to be cured.
[0055] The pressure medium bag 300 is configured to distribute the consolidation pressure applied by the mechanical press 400 to the uncured thermoset composite component 100 placed in the mold 200. As used herein, distributing the consolidation pressure means ensuring that the consolidation pressure is substantially the same at all points on the uncured thermoset composite component 100. That is, as shown in Figures 2 and 4, the consolidation pressure from the mechanical press 400 is uniformly distributed by the pressure medium bag 300 so that substantially the same degree of consolidation pressure is applied to all surfaces of the uncured thermoset composite component 100 that are in contact with the pressure medium bag 300.
[0056] In contrast, conventional methods of applying consolidation pressure using a mechanical press without the pressure medium bag 300 can result in non-uniform application of consolidation pressure depending on the geometry of the mold or mechanical press. This occurs particularly when the thermoset composite part has a complex shape or contour. As shown in FIGS. 2 and 4 , the pressure medium bag 300 enhances the distribution of the pressure applied by the mechanical press 400 in planes perpendicular to and at angles to the mechanical press 400, as indicated by arrows 388. The pressure medium bag 300 also compensates for thickness variations in the uncured thermoset composite part 100 and for geometric inconsistencies between the uncured thermoset composite part 100 and the mechanical press 400, which can result in pressure concentrations or areas of underpressure, ensuring that substantially the same level of consolidation pressure is applied to the uncured thermoset composite part 100.
[0057] The pressure medium bag 300 is configured to contain a pressure medium 320 .
[0058] The pressure medium bag 300 may include a flexible material configured to withstand and distribute the consolidation pressure from the mechanical press 400 onto the uncured thermoset composite component 100. The flexible material of the pressure medium bag 300 may be compatible with the uncured thermoset composite component 100. For example, the pressure medium bag 300 may include silicone, reinforced rubber, polyurethane, or other suitable elastomer that provides dimensional stability to the pressure medium bag 300 while maintaining sufficient flexibility to allow the pressure medium 320 to distribute the consolidation pressure.
[0059] The pressure medium bag 300 can be embodied as one or more pressure medium bags 300. The pressure medium bag 300 can have a divided or compartmented interior space. For example, in some embodiments, the pressure medium bag 300 includes one or more partitions 335 that define one or more compartments 340, the one or more compartments 340 being configured to restrict at least one movement of the pressure medium 320, thereby maintaining and / or distributing a consolidation pressure within the one or more compartments 340. In some embodiments, the one or more partitions 335 that define the one or more compartments 340 are configured to maintain the shape of the pressure medium bag 300.
[0060] In some embodiments, the pressure medium bag 300 includes one or more caul sheets 333. The caul sheets may be embodied, for example, as metal strips adhered to the surface of the pressure medium bag 300 and may be configured to add or remove texture from the uncured thermoset composite component 100 during the curing process. In other embodiments, the one or more caul sheets 333 are disposed between the pressure medium bag 300 and the uncured thermoset composite component 100. The one or more caul sheets 333 may, for example, be thermally conductive and may readily transfer heat from the mold 200 and / or the pressure medium bag 300.
[0061] The pressure medium 320 may include a plurality of pressure media 320. For example, the pressure medium 320 may include at least one of solid particles, a gel-like substance, and a liquid.
[0062] The pressure medium 320 may include a gel medium such as a silicone gel. The pressure medium 320 may include a liquid. The pressure medium 320 may include a plurality of solid particles. For example, the pressure medium 320 may include one or more of sand, glass, Styrofoam, silica aerogel, rubber, metal, and ceramic particles. The pressure medium 320 may have an average particle size of about 0.5 mm to about 5 mm. For example, the pressure medium 320 may have an average particle size of about 4 mm or less, 3 mm or less, 2 mm or less, or 1 mm or less.
[0063] In some embodiments, pressure medium 320 includes an insulating material. For example, pressure medium 320 can be configured to reduce the amount of heat loss by insulating uncured thermoset composite component 100. Pressure medium 320 can have a thermal conductivity of 1 W / mK or less.
[0064] The pressure medium bag 300 can be configured to heat the uncured thermoset composite component 100. The pressure medium bag 300 can employ any of a variety of heating techniques to generate the heat necessary to heat the uncured thermoset composite component 100 to a predetermined temperature, such as a cure temperature or a cure temperature profile. For example, the pressure medium bag 300 can include a heating surface 314 configured to heat the uncured thermoset composite component 100 to a predetermined temperature. In some embodiments, the heating surface 314 includes similar elements and operates according to similar principles as the heating surface 214 described above with respect to the mold 200.
[0065] Heating surface 314 is, for example, disposed on receiving surface 311 and covers at least a portion of receiving surface 311. In other embodiments, receiving surface 311 includes heating surface 314. Heating surface 314 is, for example, configured to contact at least a portion, such as top surface 103, of uncured thermoset composite component 100 supported by mold 200. Thus, pressure medium bag 300 can include heating surface 314 configured to contact at least a portion of uncured thermoset composite component 100 and heat the at least a portion of uncured thermoset composite component 100 to a predetermined temperature.
[0066] The pressure medium bag 300 generates heat, for example, by electrical induction, and the generated heat is transferred to at least a portion of the uncured thermoset composite part 100. For example, the heating surface 314 may include a smart susceptor, which may have a Curie temperature corresponding to the predetermined temperature.
[0067] 1-3, the pressure medium bag 300 includes induction heating and a smart susceptor for heating the uncured thermoset composite part 100. For example, the heating surface 314 includes one or more coaxially arranged induction heating elements 352 each including an electrical conductor 354 and a surrounding smart susceptor sleeve 356 having a predetermined Curie temperature. The heating surface 314 includes an upper face sheet 346 and a lower face sheet 348, the interior of which are filled with a thermally conductive material 350.
[0068] The heated surface 314 can be configured to heat at least a portion of the uncured thermoset composite part 100 to a predetermined temperature, such as a cure temperature or a cure temperature profile.
[0069] The upper and lower face sheets 346, 348 can be formed from a flexible, resilient material having relatively high thermal conductivity and relatively low electrical conductivity. For example, the upper and lower face sheets 346, 348 can include silicone, rubber, polyurethane, or other suitable elastomers that provide dimensional stability to the heating surface 314 while maintaining flexibility that allows the pressure medium bag 300 to conform to at least a portion of the surface of the uncured thermoset composite component 100, including uneven or contoured surfaces. In one embodiment, the material 350 includes an elastomer formed around the induction heating element 352. The smart susceptor sleeve 356 can include a braided material sleeved around the electrical conductor 354 to improve the flexibility of the heating surface 314 and / or the pressure medium bag 300.
[0070] 1, suitable wiring 258 connects one or more heating elements 352 in the heating surface 314 to a power supply 264. To facilitate adjustment of the magnitude or frequency of the alternating current supplied to the electrical conductors 354, one or more temperature sensors 262 may be disposed on the heating surface 314 for monitoring the temperature of the heating surface 314. The power supply 264 may be controlled by a suitable controller 260 based on the temperature measured by the temperature sensor 262.
[0071] In some embodiments, the system 10 heats the uncured thermoset composite part 100 disposed in the mold 200 from both sides. For example, the system 10 includes both the heated surface 214 disposed in the mold 200 and the heated surface 314 disposed in the pressure medium bag 300, and both heated surfaces 214 and 314 apply heat to the uncured thermoset composite part 100. In other embodiments, the system 10 heats the uncured thermoset composite part 100 disposed in the mold 200 from one side. For example, the system 10 includes only the heated surface 214 disposed in the mold 200 or only the heated surface 314 disposed in the pressure medium bag 300, and only one of the heated surfaces 214 and 314 applies heat to the uncured thermoset composite part 100. In another example, the system 10 includes both a heated surface 214 on the mold 200 and a heated surface 314 on the pressure media bag 300, but only one of the heated surfaces 214 and 314 applies heat to the uncured thermoset composite part 100.
[0072] Generally, consolidation pressure is applied during curing of the uncured thermoset composite part 100 to remove trapped air and volatiles resulting from the cross-linking reaction of the thermoset resin, and also helps ensure intimate contact between the reinforcing fibers and the resin within the final cured thermoset composite part.
[0073] Thus, in some embodiments, the mechanical press 400 applies a predetermined pressure to the uncured thermoset composite component 100. For example, the mechanical press 400 is configured to apply a consolidation pressure to the pressure media bag 300 and the uncured thermoset composite component 100 disposed in the mold 200.
[0074] The mechanical press 400 is configured to apply a consolidation pressure to the uncured thermoset composite component 100 for a predetermined period of time. This predetermined period of application of consolidation pressure may begin only after the uncured thermoset composite component 100 has been heated to a predetermined temperature, such as a curing temperature. In other embodiments, this predetermined period of application of consolidation pressure begins before the uncured thermoset composite component 100 has been heated to the predetermined temperature. In some embodiments, the consolidation pressure is increased or decreased as a function of time and temperature according to a temperature profile and a pressure profile.
[0075] In one embodiment, the mechanical press 400 applies a consolidation pressure (or load) of about 1 to about 8 bar. For example, the mechanical press 400 can apply a consolidation pressure of up to about 8 bar, up to about 7 bar, up to about 6 bar, up to about 5 bar, up to about 4 bar, up to about 3 bar, up to about 2 bar, or up to about 1 bar.
[0076] 3 , in some embodiments, the system 10 further includes a compactor 500. The compactor 500 may have a shape corresponding to the shape of the mold 200 and / or the uncured thermoset composite component 100. The compactor 500 is configured to further distribute the consolidation pressure applied by the mechanical press 400 to the pressure medium bag 300 and the uncured thermoset composite component 100.
[0077] The compressor 500 may be, for example, thermally insulated, i.e., configured to prevent heat loss from the uncured thermoset composite part 100 during the curing operation. The compressor 500 may include typical mold materials such as steel, Invar, and fiber-reinforced composites.
[0078] The system 10 may include a vacuum bag assembly 600 (not shown). In some embodiments, the vacuum bag assembly 600 is placed over the uncured thermoset composite component 100 disposed in the mold 200. For example, the vacuum bag assembly 600 includes a bagging film that covers the uncured thermoset composite component 100, and the bagging film is sealed to the mold 200 and / or the top surface of the uncured thermoset composite component 100, e.g., with a sealant. In some embodiments, a negative pressure is applied by pulling a vacuum on the vacuum bag assembly 600 to evacuate volatiles and other gases generated during the curing process of the uncured thermoset composite component 100. In other embodiments, the vacuum bag assembly 600 is placed and sealed over the uncured thermoset composite component 100 to compress the uncured thermoset composite component 100 against the mold 200 during the curing process.
[0079] In other embodiments, the pressure medium bag 300 is configured to act as a vacuum bag. FIG. 5 illustrates a system for curing a thermosetting composite, according to an embodiment. As shown in FIG. 5, the system 10 includes one or more seals 380 configured to seal the pressure medium bag 300 to the mold 200. The one or more seals 380 may be integrally formed with at least one of the pressure medium bag 300 and the mold 200. For example, the one or more seals 380 may form an airtight seal when the pressure medium bag is positioned over the uncured thermoset composite part 100 and the mold 200. In some embodiments, pressure applied by a mechanical press 400 further strengthens the airtight seal formed by the one or more seals 380.
[0080] 5, the pressure medium bag includes one or more vacuum ports 390 configured to evacuate air and apply a negative pressure through the one or more vacuum ports 390 when the pressure medium bag is positioned over the uncured thermoset composite part 100 and mold 200. Thus, the pressure medium bag 300 may include one or more vacuum ports 390 and may be configured to function as a vacuum bag when placed over the uncured thermoset composite part 100 and mold 200.
[0081] Figure 6 illustrates a method for curing a thermosetting composite, according to an embodiment. Figure 6 illustrates an example of a method that may be used with system 10, for example, as described above and shown in Figures 1-5. For this reason, the following description will refer to various components shown in Figures 1-5.
[0082] 6 , a method 800 for curing an uncured thermoset composite part 100 begins in step 810 by placing the uncured thermoset composite part 100 in a mold 200. In some embodiments, the mold 200 includes a heated surface 214, and at least a portion of the uncured thermoset composite part 100 is positioned on the heated surface 214 of the mold 200.
[0083] Step 820 includes placing a pressure media bag 300 over the uncured thermoset composite component 100 placed in the mold 200. In some embodiments, the pressure media bag 300 includes a heated surface 314, and at least a portion of the uncured thermoset composite component 100 contacts the heated surface 314 of the pressure media bag 300. In some embodiments, a vacuum bag assembly 600 is placed over the uncured thermoset composite component 100 placed in the mold 200, and the pressure media bag 300 is placed over the vacuum bag assembly 600. Step 820 may further include applying a vacuum to the uncured thermoset composite component 100. For example, the pressure medium bag 300 may include one or more vacuum ports 390, and the pressure medium bag 300 may be configured to function as a vacuum bag when placed over the uncured thermosetting composite part 100 and mold 200, with negative pressure applied through the one or more vacuum ports 390.
[0084] Step 830 includes heating the uncured thermoset composite component 100 to a predetermined temperature. The predetermined temperature may be, for example, a cure temperature depending on the composition of the uncured thermoset composite component 100. In other embodiments, the predetermined temperature corresponds to a temperature along a cure temperature profile for the uncured thermoset composite component 100. The mold 200 may include a heated surface 214, and the pressure medium bag 300 may include a heated surface 314, where one or both of the heated surface 214 and the heated surface 314 can heat the uncured thermoset composite component 100 to the predetermined temperature. For example, at least one of the mold 200 and the pressure medium bag 300 may include a heated surface (214 or 314), where at least one of the heated surface 214 of the mold 200 and the heated surface 314 of the pressure medium bag 300 can heat the uncured thermoset composite component 100 to the predetermined temperature.
[0085] In some embodiments, at least one of the heated surface 214 of the mold 200 and the heated surface 314 of the pressure media bag 300 includes a smart susceptor, which may have a Curie temperature corresponding to the predetermined temperature.
[0086] Step 840 includes applying a consolidation pressure to the uncured thermoset composite component 100. The mechanical consolidation pressure can be applied by a mechanical press 400. In some embodiments, the consolidation pressure is applied once the uncured thermoset composite component 100 reaches a predetermined temperature. In other embodiments, the consolidation pressure is applied before the uncured thermoset composite component 100 reaches a predetermined temperature.
[0087] Step 850 includes distributing the consolidation pressure applied to the uncured thermoset composite part 100 placed in the mold 200 via the pressure medium bag 300. For example, the pressure medium bag 300 distributes the consolidation pressure applied to the uncured thermoset composite part 100 placed in the mold 200. In one embodiment, the pressure medium bag 300 distributes the consolidation pressure applied by the mechanical press 400 to the uncured thermoset composite part 100 placed in the mold 200.
[0088] The pressure medium bag 300 is configured to hold a pressure medium 320. The pressure medium 320 may have an average particle size of, for example, about 1 mm or less, and the pressure medium 320 may include a thermally insulating material.
[0089] In another embodiment, the system 10 further includes a compressor 500. The method 800 further includes placing the compressor 500 over the pressure medium bag 300, where the compressor 500 further distributes the consolidation pressure to the pressure medium bag 300 and the uncured thermoset composite component 100 disposed in the mold 200. For example, the compressor 500 distributes the consolidation pressure applied by the mechanical press 400 to the pressure medium bag 300 and the uncured thermoset composite component 100 disposed in the mold 200.
[0090] Embodiments of the present disclosure may be used in a variety of applications, particularly in the transportation industries, such as aerospace, marine, and automotive, and other applications where curing of thermoset composites occurs. Accordingly, with reference to FIGS. 7 and 8 , embodiments of the present disclosure may be used in connection with an aircraft manufacturing and service method 1000, as shown in FIG. 7 , and an aircraft 2000, as shown in FIG. 8 . Prior to the start of production, the exemplary method 1000 includes specification and design 1102 and material procurement 1104 of the aircraft 2000. During production, component and subassembly manufacturing 1106 and system integration 1108 of the aircraft 2000 occurs. The aircraft 2000 then undergoes certification and delivery 1110 and enters service 1112. While in customer service, the aircraft 2000 undergoes a schedule of routine maintenance and service 1114, which may include modifications, reconfigurations, refurbishments, and the like.
[0091] Each step of method 1000 may be performed or implemented by a system integrator, a third party, and / or an operator (e.g., a customer). The system integrator may include any number of aircraft manufacturers and major system subcontractors. The third party may include any number of vendors, subcontractors, and suppliers. The operator may be, for example, an airline, a leasing company, a military entity, a service organization, etc.
[0092] 8 , aircraft 2000 produced by example method 1000 may include an airframe 2115 having a number of systems 2118 and an interior 2120. Examples of systems 2118 include one or more of a propulsion system 2122, an electrical system 2124, a hydraulic system 2126, and an environmental system 2128. Any number of other systems may also be included. Also, while an aerospace example has been described, the principles of the present disclosure may be applied to other industries, such as the marine and automotive industries.
[0093] The systems and methods illustrated herein may be employed at any one or more stages in aircraft manufacturing and service method 1000. For example, the components and subassemblies produced at manufacturing stage 1106 may be similar to the components and subassemblies produced during the in-service life of aircraft 2000. Furthermore, employing one or more apparatus embodiments, method embodiments, or a combination thereof during manufacturing stages 1106 and 1108 may, for example, substantially increase the speed or reduce the cost of assembly of aircraft 2000. Similarly, one or more apparatus embodiments, method embodiments, or a combination thereof may be employed during the in-service life of aircraft 2000, for example, but not limited to, maintenance and service 1114.
[0094] 7 and 8 illustrate the present disclosure in the context of aircraft and aircraft manufacturing and service, but the present disclosure is not limited thereto. Systems and methods for curing thermosetting composites according to the present disclosure can be used in spacecraft, satellites, submarines, surface ships, automobiles, tanks, trucks, power plants, and any other suitable type of object.
[0095] In the specification and claims, the following terms take the meanings expressly associated therewith herein, unless the context clearly dictates otherwise. As used herein, phrases such as "in an embodiment," "in one embodiment," and "in some embodiments" may, but do not necessarily, refer to the same embodiment. Also, as used herein, phrases such as "in another embodiment," "in some other embodiments," and the like may, but do not necessarily, refer to different embodiments. As explained below, various embodiments can be readily combined without departing from the scope or spirit of the present disclosure.
[0096] As used herein, the term "or" is an inclusive operator and is equivalent to the term "and / or" unless the context clearly dictates otherwise. Additionally, the term "based on" is not exclusive and contemplates additional, unlisted elements unless the context clearly dictates otherwise. As used herein, the phrase "at least one of A, B, and C" includes embodiments that include A, B, or C, multiple instances of A, B, or C, or combinations such as A / B, A / C, B / C, A / B / B / , B / B / C, and A / B / C. Furthermore, throughout the specification, singular terms indicating indefinite or specific objects may also refer to the plural. Additionally, the meaning of "in" includes "within" and "on." Similarly, embodiments of the present disclosure may suitably include, consist of, or consist essentially of elements A, B, C, etc.
[0097] Although various elements may be described using terms such as "first," "second," etc., these terms should not be used to limit the elements. These terms are merely used to distinguish one element from another. For example, a first object, component, or step could be referred to as a second object, component, or step, and similarly, a second object, component, or step could be referred to as the first object, component, or step, without departing from the scope of the present invention. A first object, component, or step and a second object, component, or step are both objects, components, or steps, respectively, but are not considered to be the same object, component, or step.
[0098] All physical properties defined below are measured at 20-25 degrees Celsius unless otherwise specified.
[0099] When any numerical range is referred to herein, it should be understood that such range includes all numbers and / or fractions between the minimum and maximum values of the stated range, as well as the endpoints. For example, a range of 0.5% to 6% would expressly include all intermediate values, e.g., 0.6%, 0.7%, 0.9%, etc., up to and including 5.95%, 5.97%, 5.99%, etc. The same is true for all ranges of other numerical properties and / or elements set forth herein, unless the context clearly dictates otherwise.
[0100] Furthermore, all numerical values are "about" or "approximately" that value, taking into account experimental error and variations that one of ordinary skill in the art can expect. It should be noted that all numerical values and numerical ranges described herein are approximate values and ranges. Furthermore, when the terms "about," "substantial," "substantially," or "approximately" are used in connection with a quantity or measurement, these terms imply that the stated characteristic, parameter, or value need not necessarily be achieved exactly. Rather, deviations and variations based on, for example, tolerances, measurement errors, limits of measurement accuracy, and other factors known to those of ordinary skill in the art may occur to a degree that does not eliminate the effect of the characteristic.
[0101] Unless otherwise specified, all percentages and amounts set forth herein or elsewhere herein should be understood to mean percentages by weight. The percentages and amounts set forth are based on the active weight of the material. For example, in the case of an active ingredient provided as a solution, the weight set forth is based on the amount of active ingredient not including the amount of solvent, which may be determined by weight loss after evaporation of the solvent.
[0102] With respect to processes, methods, techniques, and workflows according to some embodiments, some steps of the processes, methods, techniques, and workflows disclosed herein may be combined or the order of some steps may be changed.
[0103] The present disclosure includes exemplary embodiments and implementations according to the following notes.
[0104] Clause 1. A system (10) for curing a thermosetting composite, comprising: a mold (200) configured to receive and support an uncured thermoset composite part (100) and to heat the uncured thermoset composite part (100); a pressure medium bag (300) containing a pressure medium (320) configured to be placed on the uncured thermoset composite part (100) placed in the mold (200); a mechanical press (400) configured to apply a consolidation pressure to the uncured thermoset composite part (100) disposed in the mold (200); The pressure medium bag (300) is configured to distribute the consolidation pressure applied by the mechanical press (400) to the uncured thermoset composite part (100) placed in the mold (200).
[0105] Appendix 2. The system of Appendix 1, wherein the mold (200) includes a heated surface (214) configured to contact at least a portion of the uncured thermosetting composite part (100) supported by the mold (200) and heat at least a portion of the uncured thermosetting composite part (100) to a predetermined temperature.
[0106] Clause 3. The system of clause 2, wherein the heated surface (214) of the mold (200) includes a smart susceptor, the smart susceptor having a Curie temperature corresponding to the predetermined temperature.
[0107] Appendix 4. The system of any one of Appendixes 1 to 3, wherein the pressure medium bag (300) includes a heating surface (314) configured to contact at least a portion of the uncured thermosetting composite component (100) and heat at least the portion of the uncured thermosetting composite component (100) to a predetermined temperature.
[0108] Clause 5. The system of clause 4, wherein the heating surface (314) of the pressure medium bag (300) includes a smart susceptor, the smart susceptor having a Curie temperature corresponding to the predetermined temperature.
[0109] Note 6. The pressure medium bag includes a medium bag (310) configured to hold the pressure medium (320); 6. The system of any one of claims 1 to 5, wherein the media bag (310) comprises a flexible material configured to withstand and distribute the consolidation pressure applied by the mechanical press (400).
[0110] Appendix 7. The system of Appendix 6, wherein the pressure medium bag (300) includes one or more vacuum ports (390), and the pressure medium bag (300) is configured to function as a vacuum bag when placed over the uncured thermoset composite part (100) and the mold (200).
[0111] Clause 8. The system of clause 6 or clause 7, wherein the pressure medium (320) comprises a plurality of pressure media (320).
[0112] Appendix 9. The system of Appendix 8, wherein the pressure medium (320) has an average particle size of about 0.5 mm to about 5 mm.
[0113] Clause 10. The system of clause 8, wherein the pressure medium (320) comprises a thermal insulating material.
[0114] Clause 11. The system of clause 8, wherein the pressure medium (320) comprises a gel medium.
[0115] Clause 12. The system of clause 8, wherein the pressure medium (320) comprises one or more of sand, glass, and ceramic material.
[0116] Appendix 13. The system of any one of Appendixes 1 to 12, wherein the pressure medium bag (300) comprises one or more pressure medium bags (300).
[0117] Note 14. The pressure medium bag (300) comprises one or more compartments (340); 9. The system of claim 8, wherein the one or more compartments (340) are configured to maintain the consolidation pressure within the one or more compartments (340) by restricting movement of at least one of the pressure medium (320).
[0118] Appendix 15. The system of any one of Appendixes 1 to 14, further comprising a compressor (500), the compressor (500) having a shape corresponding to the shape of at least one of the mold (200) and the uncured thermosetting composite part (100), the compressor (500) being configured to distribute the consolidation pressure applied by the mechanical press (400) to the pressure medium bag (300) and the uncured thermosetting composite part (100).
[0119] Appendix 16. A method (900) for curing a thermosetting composite, comprising: placing an uncured thermoset composite part (100) in a mold (200); a pressure medium bag (300) is placed on the uncured thermosetting composite part (100) placed in the mold (200), the pressure medium bag (300) containing a pressure medium (320); heating the uncured thermoset composite part (100) to a predetermined temperature; applying a consolidation pressure to the uncured thermoset composite part (100); The method comprises distributing the consolidation pressure applied to the uncured thermoset composite part (100) placed in the mold (200) through the pressure medium bag (300).
[0120] Appendix 17. The method of Appendix 16, further comprising placing a compressor (500) on the pressure medium bag (300), the compressor (500) further dispersing the consolidation pressure applied to the pressure medium bag (300) and the uncured thermoset composite part (100) disposed in the mold (200).
[0121] Appendix 18. The method of Appendix 17, wherein at least one of the mold (200) and the pressure medium bag (300) includes a heated surface (214 / 314), and the uncured thermoset composite part (100) is heated to the predetermined temperature by at least one of the heated surface (214) of the mold (200) and the heated surface (314) of the pressure medium bag (300).
[0122] Appendix 19. The method of Appendix 18, wherein at least one of the heated surface (214) of the mold (200) and the heated surface (314) of the pressure medium bag (300) includes a smart susceptor, the smart susceptor having a Curie temperature corresponding to the predetermined temperature.
[0123] Appendix 20. The method of any one of Appendixes 16 to 19, wherein the pressure medium (320) has an average particle size of about 0.5 mm to about 5 mm, and the pressure medium (320) includes a thermal insulating material.
[0124] This disclosure has been described with reference to exemplary embodiments and implementations. While several implementations have been shown and described, it will be apparent to those skilled in the art that modifications can be made to these implementations without departing from the principles and spirit of the above detailed description. Insofar as such modifications and variations come within the scope of the appended claims or equivalents thereof, it is intended that the present disclosure be construed as including all such modifications and variations.
Claims
1. 1. A system for curing a thermoset composite, comprising: a mold configured to receive and support an uncured thermoset composite part and to heat the uncured thermoset composite part; a pressure medium bag containing a pressure medium configured to be placed on the uncured thermoset composite part disposed in the mold; and a mechanical press configured to apply a consolidation pressure to the uncured thermoset composite part disposed in the mold; the pressure medium bag is configured to distribute the consolidation pressure applied by the mechanical press to the uncured thermoset composite part disposed in the mold; the mold includes a heated surface member; the heated surface member includes an upper face sheet, a lower face sheet, and a thermally conductive material filled between the upper and lower face sheets; The thermally conductive material includes ferromagnetic or superparamagnetic particles and includes an inductively heatable smart susceptor.
2. 10. The system of claim 1, wherein the heated face member of the mold is configured to contact at least a portion of the uncured thermoset composite part supported by the mold to heat at least a portion of the uncured thermoset composite part to a predetermined temperature.
3. The system described in claim 2, wherein the smart susceptor has a Curie temperature corresponding to the predetermined temperature.
4. 4. The system of claim 1, wherein the pressure medium bag includes a heating surface configured to contact at least a portion of the uncured thermoset composite component and heat the at least a portion of the uncured thermoset composite component to a predetermined temperature.
5. 5. The system of claim 4, wherein the heated surface of the pressure media bag includes a smart susceptor, the smart susceptor having a Curie temperature corresponding to the predetermined temperature.
6. the pressure medium bag comprises a medium bag configured to hold the pressure medium; The system of any of claims 1 to 5, wherein the media bag comprises a flexible material configured to withstand and distribute the consolidation pressure exerted by the mechanical press.
7. 7. The system of claim 6, wherein the pressure media bag includes one or more vacuum ports, the pressure media bag configured to function as a vacuum bag when placed over the uncured thermoset composite part and the mold.
8. The system of claim 6 or 7, wherein the pressure medium comprises a plurality of pressure media.
9. The system of claim 8, wherein the pressure medium has an average particle size of 0.5 mm to 5 mm.
10. A system for curing a thermosetting composite, comprising: a mold configured to receive and support an uncured thermoset composite part and to heat the uncured thermoset composite part; a pressure medium bag containing a pressure medium configured to be placed on the uncured thermoset composite part disposed in the mold; and a mechanical press configured to apply a consolidation pressure to the uncured thermoset composite part disposed in the mold; the pressure medium bag is configured to distribute the consolidation pressure applied by the mechanical press to the uncured thermoset composite part disposed in the mold; the pressure medium bag comprises a medium bag configured to hold the pressure medium; the media bag comprises a flexible material configured to withstand and distribute the consolidation pressure applied by the mechanical press; the pressure medium includes a plurality of pressure media; The system, wherein the pressure medium comprises an insulating material.
11. A system for curing a thermosetting composite, comprising: a mold configured to receive and support an uncured thermoset composite part and to heat the uncured thermoset composite part; a pressure medium bag containing a pressure medium configured to be placed on the uncured thermoset composite part disposed in the mold; and a mechanical press configured to apply a consolidation pressure to the uncured thermoset composite part disposed in the mold; the pressure medium bag is configured to distribute the consolidation pressure applied by the mechanical press to the uncured thermoset composite part disposed in the mold; the pressure medium bag comprises a medium bag configured to hold the pressure medium; the media bag comprises a flexible material configured to withstand and distribute the consolidation pressure applied by the mechanical press; the pressure medium includes a plurality of pressure media; The system, wherein the pressure medium comprises a gel medium.
12. A system for curing a thermosetting composite, comprising: a mold configured to receive and support an uncured thermoset composite part and to heat the uncured thermoset composite part; a pressure medium bag containing a pressure medium configured to be placed on the uncured thermoset composite part disposed in the mold; and a mechanical press configured to apply a consolidation pressure to the uncured thermoset composite part disposed in the mold; the pressure medium bag is configured to distribute the consolidation pressure applied by the mechanical press to the uncured thermoset composite part disposed in the mold; the pressure medium bag comprises a medium bag configured to hold the pressure medium; the media bag comprises a flexible material configured to withstand and distribute the consolidation pressure applied by the mechanical press; the pressure medium includes a plurality of pressure media; The system, wherein the pressure medium comprises one or more of sand, glass, and a ceramic material.
13. The system according to any one of claims 1 to 12, wherein the pressure medium bag comprises one or more pressure medium bags.
14. A system for curing a thermosetting composite, comprising: a mold configured to receive and support an uncured thermoset composite part and to heat the uncured thermoset composite part; a pressure medium bag containing a pressure medium configured to be placed on the uncured thermoset composite part disposed in the mold; and a mechanical press configured to apply a consolidation pressure to the uncured thermoset composite part disposed in the mold; the pressure medium bag is configured to distribute the consolidation pressure applied by the mechanical press to the uncured thermoset composite part disposed in the mold; the pressure medium bag comprises a medium bag configured to hold the pressure medium; the media bag comprises a flexible material configured to withstand and distribute the consolidation pressure applied by the mechanical press; the pressure medium includes a plurality of pressure media; the pressure medium bag comprises one or more compartments, the one or more compartments are configured to maintain the consolidation pressure within the one or more compartments by restricting movement of at least one of the pressure media.
15. 15. The system of any one of claims 1 to 14, further comprising a compressor having a shape corresponding to a shape of at least one of the mold and the uncured thermoset composite part, the compressor configured to distribute the consolidation pressure applied by the mechanical press to the pressure medium bag and the uncured thermoset composite part.
16. 1. A method for curing a thermosetting composite, comprising: placing an uncured thermoset composite part in a mold; placing a pressure medium bag on the uncured thermosetting composite part placed in the mold, the pressure medium bag containing a pressure medium containing a thermal insulating material; heating the uncured thermoset composite part to a predetermined temperature; applying a consolidation pressure to the uncured thermoset composite part; The method further comprising distributing the consolidation pressure applied to the uncured thermoset composite part disposed in the mold through the pressure medium bag.
17. 17. The method of claim 16, further comprising: disposing a compressor over the pressure media bag; the compressor further dispersing the consolidation pressure applied to the pressure media bag and the uncured thermoset composite part disposed in the mold.
18. 18. The method of claim 17, wherein at least one of the mold and the pressure media bag includes a heated surface, and the uncured thermoset composite part is heated to the predetermined temperature by at least one of the heated surface of the mold and the heated surface of the pressure media bag.
19. 20. The method of claim 18, wherein at least one of the heated surface of the mold and the heated surface of the pressure media bag includes a smart susceptor, the smart susceptor having a Curie temperature corresponding to the predetermined temperature.
20. The method according to any one of claims 16 to 19, wherein the pressure medium has an average particle size of 0.5 mm to 5 mm.
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