Siphon radiator and its radiating fins

Abstract

This application discloses a siphon radiator and its heat dissipation fins, and according to the actual design requirements, the siphon radiator can only include heat dissipation fins, or the siphon radiator can include heat dissipation fins and heat dissipation fins at the same time. A compensation chamber with a Tesla valve structure is provided inside the fin chamber of the heat dissipation fins, and one or more fluid circuits are formed in the heat dissipation substrate and the chamber of the heat dissipation fins, so that the liquid working medium and the gas working medium can smoothly operate the fluid circuit, and the heat exchange efficiency is greatly improved, thereby solving the problem that the gas working medium in the chamber of the radiator is increased, the liquid working medium is decreased, the internal pressure is increased, and the gas working medium obstructs and occupies the space for the liquid working medium to circulate, so that the liquid working medium is affected by the gas working medium and the circulation resistance, which is unfavorable to the circulation of the liquid working medium, and affects the heat transfer and heat dissipation effect.

Description

[Technical Field]

[0001] This application claims priority from a Chinese patent application filed with the China Patent Office on November 15, 2022, bearing application number 202211429081.8 and entitled "Siphon Heat Dissipator and Its Heat Dissipation Fins," the entire contents of which are incorporated herein by reference.

[0002] The present application relates to the field of heat dissipation technology, and in particular to a siphon heat dissipator and its heat dissipation fins. [Background technology]

[0003] The inside of the chamber of the heat dissipation fin of a conventional siphon radiator mainly adopts a honeycomb structure such as a square, diamond, or regular hexagon to promote the circulation of the working medium inside the chamber. However, in the process of realizing this application, the inventor discovered that the prior art at least has the problem that, with the increase in heat source power consumption, when the above honeycomb structure is adopted, the phase change of the working medium causes the gas and liquid in the fin chamber to flow turbulently in multiple directions, the gas working medium obstructs and occupies the space through which the liquid working medium circulates, and the liquid working medium is affected by the gas working medium and the circulation resistance, which is unfavorable to the circulation of the liquid working medium and ultimately affects the heat dissipation effect. Summary of the Invention [Problem to be solved by the invention]

[0004] In view of the above, the present application proposes a siphon radiator and its heat dissipation fins that, by installing a one-way flow structure in the fin chamber, reduce the interference between the gas and liquid working mediums and allow them to flow orderly, significantly improving the heat exchange efficiency. [Means for solving the problem]

[0005] The present application provides a heat dissipation fin, comprising: a fin chamber; and a fluid port communicating with the fin chamber, the fluid port including a fluid inlet and a fluid outlet; the fin chamber including a guide chamber and a compensation chamber formed with at least one unidirectional flow structure, the guide chamber having a guide inlet and a guide outlet, the compensation chamber having a compensation chamber inlet and a compensation chamber outlet, the guide inlet communicating with the fluid inlet, the guide outlet communicating with the compensation chamber inlet, and the compensation chamber outlet communicating with the fluid outlet. [Brief explanation of the drawings]

[0006] [Figure 1] FIG. 2 is a front view of a siphon radiator according to an embodiment of the present application. [Figure 2] FIG. 2 is a plan view of the siphon radiator in FIG. 1. [Figure 3] FIG. 2 is a schematic diagram showing the internal configuration of the siphon radiator shown in FIG. [Figure 4] FIG. 2 is an exploded schematic view of the siphon radiator shown in FIG. 1. [Figure 5] FIG. 2 is an exploded schematic view of the heat dissipation fin in FIG. [Figure 6] FIG. 2 is a schematic diagram showing the internal configuration of the heat dissipation fin in FIG. [Figure 7] FIG. 2 is a partial exploded schematic view of the heat dissipation fin unit in FIG. [Figure 8] FIG. 2 is a side view of the heat dissipation fin unit in FIG. [Figure 9] FIG. 10 is a schematic diagram of the internal configuration of a siphon radiator according to another embodiment of the present application. [Figure 10] FIG. 10 is an exploded schematic view of the heat dissipation fins in FIG. [Figure 11] FIG. 10 is a schematic diagram showing the internal configuration of the heat dissipation fin in FIG. [Figure 12] 1 is a schematic diagram comparing the surface flow layers of the heat dissipation fin of the present application and the conventional heat dissipation fin. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0007] Before describing the embodiments in detail, it should be understood that the present application is not limited to the detailed structure or arrangement of elements set forth below in the present application or shown in the drawings. The present application may be embodied in other forms. Furthermore, it should be understood that the words and terms used herein are merely used for descriptive purposes and should not be construed as limiting. When used herein, the terms "comprise," "include," "have," and similar expressions are meant to include the items listed thereafter, equivalents thereof, and other additional items. In particular, when describing "a certain element," the present application does not limit the number of elements to one, but may include multiple elements.

[0008] All directional indications in the embodiments of the present application (e.g., up, down, left, right, front, back, etc.) are used only to interpret the relative positional relationships, movement conditions, etc. between each part in a certain specific posture (as shown in the attached drawings), and when the specific posture changes, the directional indications also change accordingly.

[0009] It should be noted that the horizontal and vertical directions used in this application refer to the arrangement direction of the siphon radiator and the heat dissipation fins. In other words, the horizontal and vertical directions used in this application are defined with reference to the ground, the vertical direction is the direction of gravity, and the horizontal direction is the direction perpendicular to the vertical direction.

[0010] 1 to 12, the present application provides a siphon heat sink 10, which includes a heat sink substrate 12, a heat sink fin group 16 consisting of several heat sink fins 14, and a heat sink fin group 20 consisting of several heat sink fins 18, and the heat sink fin group 20 can dissipate heat to the environment by forced air convection using a fan, thereby improving heat dissipation efficiency. In another embodiment, depending on the actual heat dissipation requirements, the siphon heat sink 10 can include only the heat sink substrate 12 and the heat sink fin group 16 consisting of several heat sink fins 14, so that the siphon heat sink 10 can be used in the case of natural convection.

[0011] Furthermore, the heat dissipation substrate 12 includes a substrate chamber 22 for storing a heat dissipation medium. The heat dissipation medium can be a two-phase phase change material, such as R134a or R1233zd, which has high heat exchange efficiency. This effectively solves problems such as incomplete heat dissipation and product burnout caused by excessive product power consumption and high heat flow density. In this embodiment, the heat dissipation substrate 12 has a rectangular structure and includes an opposing thermal end surface 24 and a connection surface 26. The thermal end surface 24 is used to connect to a heat source, such as a CPU. The thermal end surface 24 can be provided with several CPU heat source surfaces 28, for example, three CPU heat source surfaces 28, which are spaced apart along the longitudinal direction of the heat dissipation substrate 12. The heat dissipation fin group 16 is connected to the connection surface 26, and specifically, the connection surface 26 has connection grooves 30 that communicate with several substrate chambers 22, and the several connection grooves 30 all extend in the width direction of the heat dissipation substrate 12, and the several connection grooves 30 are arranged at equal intervals along the longitudinal direction of the heat dissipation substrate 12 and are parallel to each other.

[0012] In one option, the heat dissipation substrate 12 includes a base 32 and a cover plate 34 that are butt-connected together, the cover plate 34 and the base 32 are welded together, for example, by aluminum brazing, and the connecting groove 30 is provided in the cover plate 34, forming a substrate chamber 22 between the base 32 and the cover plate 34.

[0013] The heat dissipation fin 14 includes a fin chamber 36 and a fluid port 38 communicating with the fin chamber 36. In the illustrated embodiment, the heat dissipation fin 14 has a rectangular structure, and the fin chamber 36 includes several support columns extending in the thickness direction. The support columns can have a variety of shapes, and a chamber structure within the fin chamber 36 is formed between the several support columns. Furthermore, the fluid port 38 includes a fluid inlet 42 and a fluid outlet 44, and a fluid circuit communicating between the fluid inlet 42 and the fluid outlet 44 is formed within the fin chamber 36. More specifically, the fin chamber 36 includes a flow guide chamber 46 and a compensation chamber 48 formed with at least one unidirectional flow structure. The flow guide chamber 46 has a flow guide inlet 50 and a flow guide outlet 52, and the compensation chamber 48 has a compensation chamber inlet 54 and a compensation chamber outlet 56. The guide inlet 50 communicates with the fluid inlet 42, the guide outlet 52 communicates with the compensation chamber inlet 54, and the compensation chamber outlet 56 communicates with the fluid outlet 44, so that a smooth fluid circuit is formed within the fin chamber 36.

[0014] In the illustrated embodiment, the one-way flow structure is implemented as a Tesla valve 40. In other embodiments, the one-way flow structure may be implemented as other structures that allow for one-way fluid flow, similar in characteristics to the Tesla valve 40.

[0015] Preferably, the heat dissipation substrate 12 is provided with notches at locations on either side of the fluid port 38 to facilitate connection of the heat dissipation fins 14 to the heat dissipation substrate 12 .

[0016] One end of the heat dissipating fin 14, located at the fluid port 38, is connected to the connecting groove 30, thereby connecting the substrate chamber 22 and the fin chamber 36. After absorbing heat, the liquid heat dissipating medium in the substrate chamber 22 evaporates and enters the fin chamber 36 through the fluid port 38. Because the Tesla valve 40 has one-way flow guidance, the resistance to the evaporated gaseous heat dissipating medium flowing from the portion of the fluid port 38 corresponding to the Tesla valve 40 into the compensation chamber 48 and into the guiding chamber 46 is too great and unrealistic. Therefore, the evaporated gaseous heat dissipating medium can only enter the fin chamber 36 through the portion of the fluid port 38 corresponding to the guiding chamber 46, flow into the compensation chamber 48, and then flow through the fluid port 38 to return to the substrate chamber 22. Therefore, the present application divides the fluid port 38 into a fluid inlet 42 corresponding to the guiding chamber 46 and a fluid outlet 44 corresponding to the compensating chamber 48. The compensating chamber 48 utilizes the one-way flow guidance of the Tesla valve 40, significantly increasing the circulation speed and further enhancing heat exchange efficiency. Conventional heat dissipation fins do not have this characteristic simply by adopting a square, diamond, or regular hexagonal structure inside, and the gas and liquid inside tend to become turbulent, which affects the heat dissipation performance of the fins.

[0017] This application designs the chamber structure of the heat dissipating fin 14 to make the fluid circuit of the heat dissipating medium very smooth and improve the heat dissipation performance, thereby solving the problem that due to the phase change, the gaseous heat dissipating working medium in the radiator chamber increases, the liquid heat dissipating working medium decreases, and the internal pressure increases, causing the gaseous heat dissipating working medium to obstruct and occupy the space through which the liquid heat dissipating working medium circulates, and the liquid heat dissipating working medium is affected by the gaseous heat dissipating working medium and the circulation resistance, which is unfavorable to the circulation of the liquid heat dissipating working medium.

[0018] In one option, the heat dissipation fin 14 includes a fin base plate 58 and a fin cover plate 60 that are butt-connected together, and the fin base plate 58 and the fin cover plate 60 are welded together, for example, by an aluminum brazing process, to form a fin chamber 36 between the fin base plate 58 and the fin cover plate 60.

[0019] As one option, one end of the heat dissipation fin 14 at the fluid port 38 and the groove wall of the connecting groove 30 are welded using an aluminum brazing process, so that the substrate chamber 22 communicates with the fin chamber 36 to form a totally closed chamber.

[0020] The heat dissipation fin group 16 is welded to the connection surface 26 of the heat dissipation substrate 12. Specifically, the number of heat dissipation fins 14 is set to be the same as the number of connection grooves 30, and each heat dissipation fin 14 is connected to the corresponding connection groove 30 by welding.

[0021] In the illustrated embodiment, a capillary structure 62 is further provided in the substrate chamber 22, which can be used to absorb the circulating liquid heat-dissipating working medium, and the capillary structure 62 is, for example, attached to the inner wall of the base 32. The capillary structure 62 can adopt thermally conductive metal particles, which can enhance the boiling of the heat-dissipating working medium and the circulation of the heat-dissipating working medium, and further improve the heat dissipation efficiency.

[0022] In the present application, the siphon heat sink 10 includes at least one heat dissipation fin unit 64, which is disposed at a distance from the heat dissipation fins 14. In the illustrated embodiment, the siphon heat sink 10 includes a plurality of heat dissipation fin units 64 that constitute the heat dissipation fin group 20 described above.

[0023] More specifically, the heat dissipation fin group 20 includes a plurality of heat dissipation fin units 64, each of which is connected between two adjacent heat dissipation fins 14, and each of which is formed by engaging a plurality of heat dissipation fins 18.

[0024] In the illustrated embodiment, the heat dissipating fin 18 has a quadrangular structure and includes a fin base 66 and locking edges 68 formed extending from opposite ends of the fin base 66 to the same side, with the locking edges 68 being, for example, perpendicular to the fin base 66. Multiple heat dissipating fins 18 are stacked on top of each other and engaged with the locking edges 68 to form a heat dissipating fin unit 64, and the multiple heat dissipating fin units 64 constitute the heat dissipating fin group 20. The pitch between two adjacent heat dissipating fins 18, i.e., the length of the locking edges 68, can be adjusted according to actual design requirements. The heat dissipating fin 18 can be formed by pressing.

[0025] Preferably, the fin substrate 66 is provided with several uneven structures 70, and each uneven structure 70 has a structure in which one surface is convex and one surface is concave, and the uneven structures 70 can be provided over the entire fin substrate 66. In the illustrated embodiment, all of the uneven structures 70 are circular, and all of the uneven structures 70 are convex toward the heat dissipation substrate 12. In the present application, the fin substrate 66 of the heat dissipation fin 18 is provided with uneven structures 70, which act as spoilers to create turbulence and improve heat dissipation efficiency.

[0026] Furthermore, the diameter of the uneven structure 70 is 5 mm, and the depth of the depression formed by the uneven structure 70 is 0.25 mm. In another embodiment, the size of the uneven structure 70 may have other options, but this application is not limited thereto.

[0027] As shown in Figure 12, the provision of a concave-convex structure 70 on the fin substrate 66 increases the heat dissipation area of ​​the heat dissipation fin 18, and the design of the concave-convex structure 70 creates a spoiler effect on the surface of the fin substrate 66. When a fan is used to forcibly circulate air in the area of ​​the heat dissipation fin group 20, the airflow forms turbulent flow on the surface of the fin substrate 66. Compared to a typical heat dissipation fin with flat surfaces, the airflow forms laminar flow on this surface. Laminar flow is due to the interaction between molecules, while turbulent flow is mainly due to mixing between mass points. The heat transfer rate of turbulent flow is much greater than that of laminar flow, resulting in higher heat dissipation efficiency. Therefore, the design of the concave-convex structure 70 can significantly improve heat exchange efficiency.

[0028] The heat dissipation fin unit 64 is connected between two adjacent heat dissipation fins 14 by the locking edges 68 of each heat dissipation fin 18, for example, the locking edges 68 are welded to the heat dissipation fins 14 by an aluminum brazing process. For example, the fin substrate 66 is perpendicular to the heat dissipation fins 14.

[0029] 1 to 8 , the heat dissipation substrate 12 is vertically oriented so that the flow direction of the fluid port 38 is horizontal, and the fluid inlet 42 and fluid outlet 44 are vertically arranged. A solid portion 72 is further provided within the fin chamber 36, and the provision of the solid portion 72 forms an annular chamber within the fin chamber 36, and the fluid circuit is provided surrounding the solid portion 72. The fluid inlet 42 is located above the fluid outlet 44, and the Tesla valve 40 is provided in the bottom region of the fin chamber 36.

[0030] In this embodiment, the capillary structure 62 is provided on the inner wall of the substrate chamber 22 corresponding to the region of the Tesla valve 40 .

[0031] After the CPU heat source surface 28 is heated, the liquid heat dissipation working medium in the substrate chamber 22 absorbs heat and vaporizes, entering the fin chamber 36 for heat exchange while transferring the heat to the heat dissipation fins 18. When the heat in the heat dissipation fins 18 is forced to circulate by a fan, the heat is dissipated to the outside vertically and simultaneously exchanged horizontally. The liquid heat dissipation working medium flows into the substrate chamber 22 due to gravity and the action of the compensation chamber 48, where it circulates repeatedly and efficiently dissipates heat.

[0032] 9 to 11, the heat dissipation substrate 12 is placed horizontally so that the flow direction of the fluid ports 38 is vertical and the fluid inlets 42 and outlets 44 are horizontal. When the power of the device to be dissipated increases and the heat source positions increase, the length of the heat dissipation fins 14 can be increased, and multiple Tesla valves 40 can be provided, with the multiple Tesla valves 40 distributed at intervals along the horizontal direction, and the flow guide chambers 46 extend upward from between the multiple Tesla valves 40 and then extend in different directions along the horizontal direction to form a multiple circulation structure.

[0033] In this embodiment, two Tesla valves 40 are provided, one at the bottom of each side of the fin chamber 36. The evaporated gaseous heat-dissipating working medium flows upward along the guide chamber 46 between the two Tesla valves 40, then branches off to both sides and flows downward into the compensation chambers 48 on both sides, and finally circulates back into the substrate chamber 22, forming a double circulation structure.

[0034] Preferably, the pitch between the two Tesla valves 40 gradually decreases in the direction away from the fluid port 38, for example, the opposing side walls of the two Tesla valves 40 are both sloped, so that the evaporated gaseous heat-dissipating working medium can smoothly enter the compensating chamber 48 from the guiding chamber 46.

[0035] In this embodiment, the capillary structure 62 is provided on the inner wall corresponding to the region between the two Tesla valves 40 in the substrate chamber 22 .

[0036] After the CPU heat source surface 28 is heated, the liquid heat-dissipating working medium in the substrate chamber 22 absorbs heat and vaporizes, entering the fin chamber 36 for heat exchange while simultaneously transferring the heat to the heat-dissipating fins 18. The inclined structure of the compensation chamber 48 allows the evaporated gaseous heat-dissipating working medium to smoothly enter the compensation chamber 48 from the flow guide chamber 46. When the heat in the heat-dissipating fins 18 is forced to circulate by a fan, it is dissipated horizontally to the outside and simultaneously exchanged vertically. The liquid heat-dissipating working medium flows into the substrate chamber 22 due to gravity and the action of the compensation chamber 48, where it circulates repeatedly, efficiently dissipating heat.

[0037] The specific operating principle of the siphon radiator 10 of the present application is as follows: when the siphon radiator 10 starts operating, the liquid heat-dissipating working medium in the substrate chamber 22 of the heat-dissipating substrate 12 begins to evaporate and enters the fin chamber 36 through the fluid port 38. Due to the one-way flow-direction structure of the Tesla valve 40, the evaporated gaseous heat-dissipating working medium flows from the fluid inlet 42 through the flow-direction inlet 50 into the flow-direction chamber 46. Due to the downward direction of gravity and the existence of the solid portion 72 and the compensation chamber 48, the evaporated gaseous heat-dissipating working medium flows smoothly from the flow-direction outlet 52 through the compensation chamber inlet 54 into the compensation chamber 48. After being liquefied and cooled, the gaseous heat-dissipating working medium flows back into the substrate chamber 22 through the compensation chamber outlet 56 and the fluid outlet 44, in a circulating manner.

[0038] The siphon radiator 10 of the present application has advantages over traditional modular radiators when device space is limited and device power is increasing, effectively solving problems such as burnout that occur with traditional modular radiators. Furthermore, the provision of a compensation chamber 48 formed by a Tesla valve 40 inside the radiator fin 14 solves the problem of an increase in the gas working medium in the radiator chamber, a decrease in the liquid working medium, and increased internal pressure, which causes the gas working medium to obstruct and occupy the space through which the liquid working medium circulates. The liquid working medium is affected by the gas working medium and circulation resistance, which is unfavorable to the circulation of the liquid working medium and affects the heat transfer and heat dissipation effects. The uneven surface 70 on the radiator fin 18 acts as a spoiler, creating turbulence and improving heat dissipation efficiency.

[0039] The siphon heat sink 10, heat dissipation fins 14, and heat dissipation fins 18 of this application are all made of aluminum, and after all parts are assembled, they are brazed using a special brazing jig to form the product. The product can function normally after being brazed to the heat sink substrate and chamber structure in various situations. After the CPU heat source surface 28 is heated, the liquid heat dissipation working medium vaporizes in the substrate chamber 22 and enters the fin chamber 36, transferring heat to the heat dissipation fins 18 and dissipating it to the environment through forced convection. Furthermore, the use of mature brazing technology results in high reliability, a stable product structure, and good sealing.

[0040] In some embodiments, depending on actual design requirements, increasing the height of the fin chamber 36 and / or increasing the height of the substrate chamber 22 can provide more chamber volume and facilitate the flow of the heat-dissipating working medium.

[0041] In some embodiments, depending on the actual design requirements, the vertical position of the compensation chamber 48, i.e., the Tesla valve 40, can be changed to accommodate changes in the heat source position.

[0042] In some embodiments, the length, width, thickness of the heat dissipation fins 18 and the pitch between the heat dissipation fins 18 can be changed to adjust the impedance of the heat dissipation system of the siphon heat sink 10 according to actual design requirements.

[0043] As described above, the present application provides a siphon radiator and its radiating fins, which have a compensation chamber formed with a unidirectional flow structure inside the fin chamber of the radiating fin, and one or more fluid circuits formed within the radiating substrate and the chamber of the radiating fin. This allows the liquid working medium and gaseous working medium to operate smoothly through the fluid circuits, greatly improving the heat exchange efficiency. This solves the problem that the amount of gaseous working medium in the radiator chamber increases, the amount of liquid working medium decreases, the internal pressure increases, and the gaseous working medium obstructs and occupies the space through which the liquid working medium circulates, causing the liquid working medium to be affected by the gaseous working medium and the circulation resistance, which is unfavorable to the circulation of the liquid working medium and affects the heat transfer and heat dissipation effects.

[0044] The concepts described herein may be embodied in other forms without departing from their spirit and character. The specific embodiments disclosed should be considered illustrative, not limiting. Accordingly, the scope of the present application should be determined not by these foregoing descriptions, but by the appended claims. All changes within the literal meaning of the claims and their range of equivalency are to be embraced within the scope of these claims.

Claims

1. A heat dissipation fin, a fin chamber and a fluid port in communication with the fin chamber; the fluid port includes a fluid inlet and a fluid outlet; the fin chamber includes a guide chamber and a compensation chamber formed with at least one unidirectional flow structure, the guide chamber having a guide inlet and a guide outlet, the compensation chamber having a compensation chamber inlet and a compensation chamber outlet, the guide inlet communicating with the fluid inlet, the guide outlet communicating with the compensation chamber inlet, and the compensation chamber outlet communicating with the fluid outlet; When the heat dissipation fins are arranged in a horizontal direction so that the flow direction of the fluid port is along the direction of gravity, the fluid inlet and the fluid outlet are arranged in a horizontal direction, a plurality of the one-way flow structures are provided, the plurality of one-way flow structures are distributed at intervals along the horizontal direction, the flow guide chambers extend from between the plurality of one-way flow structures in a direction opposite to the direction of gravity and then extend in different directions along the horizontal direction, A heat dissipation fin, characterized in that the distance between opposing side walls of two adjacent unidirectional flow structures gradually decreases in a direction away from the fluid port.

2. 2. The heat dissipation fin according to claim 1, wherein the fin chamber further includes a solid portion, the fluid inlet, the flow guide chamber, the compensation chamber, and the fluid outlet are sequentially connected to form a fluid circuit, and the fluid circuit is disposed around the solid portion.

3. The heat dissipation fin of claim 1 or 2, wherein the one-way flow structure is a Tesla valve.

4. A siphon heat sink comprising a heat dissipation substrate and at least one heat dissipation fin according to any one of claims 1 to 3, wherein the heat dissipation substrate includes a substrate chamber for storing a heat dissipation medium, the heat dissipation substrate has a thermal end face connected to a heat source and a connection surface connected to the heat dissipation fin, the connection surface is provided with a connection groove communicating with the substrate chamber, and the fluid port is connected to the connection groove, thereby communicating the substrate chamber with the fin chamber.

5. The siphon heat sink according to claim 4, further comprising at least one heat dissipating fin, the heat dissipating fin being spaced apart from the heat dissipating fin.

6. The siphon heat sink according to claim 5, wherein the heat dissipation fin comprises a fin substrate having a number of concave-convex structures.

7. 7. The siphon heat sink according to claim 6, wherein locking edges are formed extending from opposite ends of the fin base plate to the same side.

Images