Mask jig, film formation method and film formation apparatus
The mask jig with inclined through holes addresses the issue of unstable film formation on the jig by reducing material deposition, enabling efficient and high-quality film production on the substrate.
Patent Information
- Application Number
- JP2023509267
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2021-03-24
- Filing Date
- 2022-03-23
- Publication Date
- 2025-09-09
- Estimated Expiration
- 2042-03-23
AI Technical Summary
The formation of films on the surface of a mask jig during thermal spraying methods leads to unstable film-forming conditions, making it difficult to efficiently produce high-quality films on the substrate, and requires frequent cleaning of the mask jig.
A mask jig with a main body featuring through holes that extend from a first surface to a second surface, where the second surface includes inclined surfaces with angles between 30° and 90°, reducing the deposition of film-forming material on the jig and stabilizing film-forming conditions.
The proposed mask jig allows for the efficient and stable formation of films on the substrate surface, extending the continuous use time and improving film quality by minimizing material deposition on the jig.
Smart Images

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Figure 0007736781000002 
Figure 0007736781000003
Abstract
Description
[Technical Field]
[0001] The present disclosure relates to a mask jig, a film forming method, and a film forming apparatus. [Background technology]
[0002] Cold spraying, a type of thermal spraying method, is known. In cold spraying, a film is formed on a substrate by spraying a film-forming material onto the substrate together with a carrier gas (see, for example, JP 2017-170369 A).
[0003] Furthermore, in thermal spraying methods such as the above-mentioned cold spray method, a mask jig is used that is placed on the surface of the substrate to define the film formation area (see, for example, JP 2002-361135 A). The film formation material is supplied to the surface of the substrate through through holes formed in the mask jig, thereby defining the planar shape of the film formation area. [Prior art documents] [Patent documents]
[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2017-170369 [Patent Document 2] Japanese Patent Application Laid-Open No. 2002-361135 Summary of the Invention [Problem to be solved by the invention]
[0005] When a mask jig is used in a thermal spraying method such as the cold spray method described above, a film made of the film-forming material is also formed on the surface of the mask jig. When a film is formed on the surface of the mask jig, the process conditions (film-forming conditions) when the film-forming material is supplied to the surface of the substrate through the through-holes in the mask jig may change from the conditions at the start of film formation. As a result, it becomes difficult to stably form a film on the surface of the substrate. Furthermore, to ensure the quality of the film formed on the surface of the substrate, it is necessary to perform a process such as removing the film formed on the surface of the mask jig at regular intervals. As a result, it has been difficult to efficiently form a film of stable quality on the surface of the substrate.
[0006] An object of the present disclosure is to provide a mask jig, a film forming method, and a film forming apparatus that are capable of efficiently forming a film of stable quality on the surface of a substrate. [Means for solving the problem]
[0007] A mask jig according to the present disclosure is a mask jig used in a thermal spraying method, and includes a main body. The main body includes a first surface and a second surface. The second surface is located on the opposite side of the first surface. A through hole is formed in the main body, extending from the first surface to the second surface. The second surface includes an inclined surface having an inclination angle with respect to the first surface of 30° or more and less than 90°. An open end of the through hole in the second surface is formed on the inclined surface.
[0008] The film formation method according to the present disclosure includes a step of placing the mask jig so that it faces the surface of the substrate. In the placing step, the mask jig is placed so that a first surface of the mask jig faces the surface of the substrate. The film formation method according to the present disclosure includes a step of spraying a powder serving as a film formation raw material onto the surface of the substrate by a cold spray method through the through-holes of the mask jig.
[0009] The film forming apparatus according to the present disclosure includes a spray gun including a nozzle, a powder supply unit, a gas supply unit, and the mask jig. The powder supply unit supplies powder, which is a film forming raw material, to the spray gun. The gas supply unit supplies an operating gas to the spray gun. The mask jig is disposed between the substrate and the spray gun. [Effects of the Invention]
[0010] According to the above, a film of stable quality can be efficiently formed on the surface of a substrate. [Brief explanation of the drawings]
[0011] [Figure 1] 1 is a schematic diagram showing a configuration of a film forming apparatus according to an embodiment of the present invention; [Figure 2] FIG. 1 is a schematic plan view showing a mask jig according to an embodiment of the present invention. [Figure 3] FIG. 3 is a schematic side view of the mask jig shown in FIG. 2. [Figure 4] FIG. 10 is a schematic plan view showing a first modified example of the mask jig according to the present embodiment. [Figure 5] FIG. 5 is a schematic side view of the mask jig shown in FIG. [Figure 6] FIG. 10 is a schematic plan view showing a second modified example of the mask jig according to the present embodiment. [Figure 7] FIG. 7 is a schematic side view of the mask jig shown in FIG. [Figure 8] 2 is a flowchart illustrating a film forming method according to the present embodiment. DETAILED DESCRIPTION OF THE INVENTION
[0012] Hereinafter, embodiments of the present disclosure will be described. Note that the same reference numerals are used to designate the same components, and the description thereof will not be repeated.
[0013] <Configuration of film formation equipment> 1 is a schematic diagram showing the configuration of a film formation apparatus 100 according to this embodiment. The film formation apparatus 100 shown in FIG. 1 mainly includes a spray gun 2 including a nozzle 2b, a powder supply unit 3, a gas supply unit 4, and a mask jig 1.
[0014] The spray gun 2 mainly includes a spray gun main body 2a, a nozzle 2b, a heater 2c, and a temperature sensor 9. The nozzle 2b is connected to a first end, which is the front end of the spray gun main body 2a. A pipe 6 is connected to a second end, which is the rear end of the spray gun main body 2a. The pipe 6 is connected to a gas supply unit 4 via a valve 7. The gas supply unit 4 supplies operating gas to the spray gun 2 via the pipe 6. The supply state of operating gas from the gas supply unit 4 to the spray gun 2 can be controlled by opening and closing the valve 7. A pressure sensor 8 is installed in the pipe 6. The pressure sensor 8 measures the pressure of the operating gas supplied to the pipe 6 from the gas supply unit 4.
[0015] The working gas supplied from the second end of the spray gun body 2a to the inside of the spray gun body 2a is heated by a heater 2c. The heater 2c is located on the second end side of the spray gun body 2a. The working gas flows inside the spray gun body 2a along the arrow 31. A temperature sensor 9 is connected to the connection between the nozzle 2b and the spray gun body 2a. The temperature sensor 9 measures the temperature of the working gas flowing inside the spray gun body 2a.
[0016] Nozzle 2b is connected to pipe 5. Pipe 5 is connected to powder supply unit 3. Powder supply unit 3 supplies powder, which is a film-forming raw material, to nozzle 2b of spray gun 2 via pipe 5.
[0017] The mask jig 1 is placed between the substrate 20 and the spray gun 2. A through hole 13 (see FIG. 2) is formed in the mask jig 1. The through hole 13 defines a film formation region on the surface of the substrate 20. The specific configuration of the mask jig 1 will be described later.
[0018] <Operation of the film formation device> In the film-forming apparatus 100 shown in FIG. 1, an operating gas is supplied from the gas supply unit 4 to the spray gun 2 through a pipe 6, as indicated by an arrow 30. Examples of the operating gas include nitrogen, helium, dry air, and a mixture thereof. The operating gas has a pressure of, for example, approximately 1 MPa. The flow rate of the operating gas is, for example, 300 L / min to 500 L / min. The operating gas supplied to the second end of the spray gun main body 2a is heated by a heater 2c. The heating temperature of the operating gas is set appropriately depending on the composition of the film-forming raw material, but can be, for example, 100°C to 500°C. The operating gas flows from the spray gun main body 2a to the nozzle 2b. Powder 10, which serves as the film-forming raw material, is supplied to the nozzle 2b from the powder supply unit 3 through a pipe 5, as indicated by an arrow 32. Examples of the powder 10 include nickel powder, tin powder, or a mixture of tin powder and zinc powder. The particle size of the powder 10 is, for example, 1 μm to 50 μm.
[0019] The powder 10 supplied to the nozzle 2b is sprayed together with the operating gas from the tip of the nozzle 2b toward the substrate 20. A mask jig 1 is placed on the surface of the substrate 20. The sprayed powder 10 reaches the surface of the substrate 20 through the through-holes 13 (see FIG. 2) of the mask jig 1. A film made of the sprayed powder 10 as a raw material is formed on the surface of the substrate 20.
[0020] <Mask jig configuration> Fig. 2 is a schematic plan view showing a mask jig according to the present embodiment, and Fig. 3 is a schematic side view of the mask jig shown in Fig. 2.
[0021] 2 and 3 is a mask jig 1 used in a cold spray method, which is an example of a thermal spray method, and includes a main body 11. The main body 11 includes a first surface 11a and a second surface 11b. The second surface 11b is located on the opposite side to the first surface 11a.
[0022] A groove 12 is formed in the second surface 11b. The inner surface of the groove 12 includes inclined surfaces 12a and 12b. The cross-sectional shape of the groove 12 in a plane perpendicular to the extension direction of the groove 12 is V-shaped as shown in FIG. 3. Within the groove 12, a through hole 13 is formed in the main body 11, extending from the first surface 11a to the second surface 11b. Two through holes 13 are formed spaced apart within each groove 12. The number of through holes 13 may be any number of three or more. The inclined surface 12a, which is a part of the inner surface of the groove 12, has an inclination angle θ1 with respect to the first surface 11a that is equal to or greater than 30° and less than 90°. The inclined surface 12b, which is a part of the inner surface of the groove 12, has an inclination angle θ2 with respect to the first surface 11a that is equal to or greater than 30° and less than 90°. The inclination angle θ1 of the inclined surface 12a and the inclination angle θ2 of the inclined surface 12b may be the same or different. Opening end 13a of through hole 13 in second surface 11b is formed on inclined surfaces 12a, 12b that are part of second surface 11b. From a different perspective, through hole 13 is formed on bottom 12c, which includes the region closest to first surface 11a, on the inner circumferential surface of groove 12. In other words, opening end 13a of through hole 13 is formed in a region that includes a corner where inclined surface 12a and inclined surface 12b are connected and parts of inclined surface 12a and inclined surface 12b that are adjacent to the corner.
[0023] The main body 11 of the mask jig 1 can be made of any material, including metals such as stainless steel, steel, and copper, and ceramics such as carbon and alumina.
[0024] <Action and effect> A mask jig 1 according to the present disclosure is a mask jig 1 used in a thermal spraying method and includes a main body 11. The main body 11 includes a first surface 11a and a second surface 11b. The second surface 11b is located opposite the first surface 11a. A through hole 13 is formed in the main body 11, extending from the first surface 11a to the second surface 11b. The second surface 11b includes inclined surfaces 12a and 12b, the inclination angles θ1 and θ2 of which relative to the first surface 11a are equal to or greater than 30° and less than 90°. An opening end 13a of the through hole 13 in the second surface 11b is formed on the inclined surfaces 12a and 12b.
[0025] In this way, the mask jig 1 is placed on the surface of the substrate 20, which is the material to be processed, with the first surface 11a facing the substrate 20, and particles of the film-forming raw material are supplied to the surface of the substrate 20 through the through-holes 13 of the mask jig 1 by a thermal spraying method to perform a film-forming process. At this time, the amount of film-forming raw material deposited on the second surface 11b of the mask jig 1 can be reduced compared to when the second surface 11b of the mask jig 1 is flat. As a result, the film-forming conditions when performing a film-forming process on the substrate 20 using the mask jig 1 can be stabilized for a long period of time, thereby improving the quality of the formed film. Furthermore, the time (continuous use time) during which film-forming processes can be performed continuously on the substrate 20 using the mask jig 1 can be extended.
[0026] Here, the upper limits of the tilt angles θ1 and θ2 are less than 90° and may be 80°, but the upper limit is preferably 60°. When the upper limits of the tilt angles θ1 and θ2 are the above values, the processing of the mask jig 1 is easy, and the manufacturing cost of the mask jig 1 can be suppressed while the amount of film-forming raw material adhering to the mask jig 1 can be reduced. The lower limits of the tilt angles θ1 and θ2 are 30°, and may be 40°, but the lower limit is preferably 45°. When the lower limits of the tilt angles θ1 and θ2 are the above values, the amount of film-forming raw material adhering to the mask jig 1 can be sufficiently reduced, and the continuous use time of the mask jig 1 can be extended.
[0027] In the mask jig 1, at least one groove 12 may be formed on the second surface 11b. The cross section of the groove 12 may be V-shaped. The inclined surfaces 12a and 12b may be the inner peripheral surfaces of the groove 12.
[0028] In this case, by forming the groove 12 on the second surface 11b and forming the through hole 13 inside the groove 12, the mask jig 1 described above can be easily realized.
[0029] In the mask jig 1, the through-hole 13 may be formed in the inner circumferential surface of the groove 12 at the bottom 12c including the area closest to the first surface 11a.
[0030] In this case, the depth of the through holes 13 can be made shallower than when the through holes 13 are formed in regions other than the bottom portion 12c of the mask jig 1. This allows for improved shape accuracy of the film formation region formed on the surface of the substrate 20 via the through holes 13.
[0031] The film forming apparatus 100 according to the present disclosure includes a spray gun 2 including a nozzle 2b, a powder supply unit 3, a gas supply unit 4, and the mask jig 1. The powder supply unit 3 supplies powder, which is a film forming raw material, to the spray gun 2. The gas supply unit 4 supplies an operating gas to the spray gun 2. The mask jig 1 is disposed between the substrate 20 and the spray gun 2.
[0032] In this case, by using the above-described mask jig 1, deposition of film-forming raw materials on the mask jig 1 can be suppressed, and the time during which the film-forming process using the mask jig 1 can be carried out continuously can be extended.
[0033] <Modification of mask jig> Fig. 4 is a schematic plan view showing a first modified example of the mask jig 1 according to the present embodiment. Fig. 5 is a schematic side view of the mask jig 1 shown in Fig. 4. Fig. 6 is a schematic plan view showing a second modified example of the mask jig 1 according to the present embodiment. Fig. 7 is a schematic side view of the mask jig 1 shown in Fig. 6.
[0034] The mask jig 1 shown in FIGS. 4 and 5 basically has the same configuration as the mask jig 1 shown in FIGS. 2 and 3, but differs from the mask jig 1 shown in FIGS. 2 and 3 in that a plurality of grooves 12 are formed in the second surface 11b and that each groove 12 has a through hole 13 formed therein. In the mask jig 1 shown in FIGS. 4 and 5, the plurality of grooves 12 are formed to extend along a first direction (the vertical direction in FIG. 4). The plurality of grooves 12 are arranged to be aligned along a second direction (the horizontal direction in FIG. 4) perpendicular to the first direction. Each of the plurality of grooves 12 has a through hole 13 formed therein. As shown in FIG. 4, each groove 12 has two through holes 13 formed therein, but the number of through holes 13 formed in each groove 12 may be any number equal to or greater than three. The through holes 13 are aligned in the horizontal direction (second direction) in FIG. 4, but the positions of adjacent through holes 13 in the horizontal direction may be offset in the vertical direction (first direction). The through holes 13 are formed in the bottom 12c of the groove 12. The sizes of the plurality of through holes 13 may be the same as shown in FIG. 4, or the plurality of through holes 13 may include through holes 13 of different sizes.
[0035] As shown in FIG. 5, the inclination angles θ1 and θ2 of the inclined surfaces 12a and 12b in each groove 12 may be the same for each groove 12 or may be different for each groove 12.
[0036] The mask jig 1 having such a configuration can also achieve the same effects as the mask jig 1 shown in Figures 2 and 3. Furthermore, in the mask jig 1 shown in Figures 4 and 5, by forming a plurality of grooves 12 on the second surface 11b, a plurality of through holes 13 can be easily formed. Therefore, a film can be formed at a plurality of locations on the surface of the substrate 20 by a single film formation process using the cold spray method.
[0037] The mask jig 1 shown in Figures 6 and 7 basically has the same configuration as the mask jig 1 shown in Figures 2 and 3, but differs from the mask jig 1 shown in Figures 2 and 3 in that multiple grooves 12 are formed in the second surface 11b, that through holes 13 are formed in each groove 12, and that the arrangement of the through holes 13 inside the grooves 12 is different. In the mask jig 1 shown in Figures 6 and 7, two grooves 12 are formed adjacent to each other. The through hole 13 located on the left side in Figure 6 is formed on one inclined surface 12a of the first groove 12 located on the left side. In other words, the open end of the through hole 13 is located within the inclined surface 12a.
[0038] The through hole 13 located in the center in FIG. 6 is formed in the boundary region between two grooves 12. Specifically, the through hole 13 is formed in a boundary region including the inclined surface 12b of the first groove 12 located on the left side, the inclined surface 12a of the second groove 12 located on the right side, and a part of the boundary between the first groove 12 and the second groove 12. The through hole 13 located on the right side in FIG. 6 is formed on one of the inclined surfaces 12b of the second groove 12 located on the right side. In other words, the open end of the through hole 13 is located within the inclined surface 12b. As shown in FIG. 6, the positions of the multiple through holes 13 in the first direction, which is the extension direction of the grooves 12, are different from each other.
[0039] The mask jig 1 having such a configuration can also provide the same effects as the mask jig 1 shown in FIGS.
[0040] In the above-described mask jig 1, a plurality of grooves 12 may be formed over the entire surface of the second surface 11b. Alternatively, as shown in Figures 4 to 7, flat portions where no grooves 12 are formed may be formed on both ends of the second surface 11b in a direction perpendicular to the extending direction of the grooves 12.
[0041] In the above-described mask jig 1, the inclined surfaces 12a, 12b on which the through holes 13 are formed may include partially curved surfaces. The inclined surfaces 12a, 12b may have constant inclination angles θ1, θ2 over the entire surface, or may include surfaces with locally different inclination angles θ1, θ2.
[0042] <Film formation method> Fig. 8 is a flowchart showing a film formation method according to the present embodiment. The film formation method shown in Fig. 8 is a film formation method carried out using the mask jig 1 and film formation apparatus 100 shown in Figs. 1 to 3, and mainly includes a preparation step (S10), a film formation step (S20), and a post-processing step (S30).
[0043] The preparation step (S10) includes a step of placing the mask jig 1 so as to face the surface of the substrate 20 as shown in Fig. 1. In the placing step, the mask jig 1 is placed so that the first surface 11a (see Fig. 3) of the mask jig 1 faces the surface of the substrate 20.
[0044] In the film formation step (S20), a powder of the film-forming raw material is sprayed onto the surface of the substrate 20 by a cold spray method using the film-forming device 100 through the through-holes 13 of the mask jig 1. As a result, a film made of the film-forming raw material is formed on the surface of the substrate 20.
[0045] In the post-treatment step (S30), the mask jig 1 is removed from the surface of the base material 20. Thereafter, necessary treatments such as processing are carried out on the base material 20. In this manner, a film can be formed on the surface of the base material 20.
[0046] In the above-described film formation method, since the mask jig 1 according to this embodiment is used, the amount of film-forming raw material attached to the mask jig 1 can be reduced, thereby extending the time for which the film formation step (S20) can be performed continuously. Alternatively, by using the mask jig 1, the number of times the mask jig 1 can be reused can be increased. [Example]
[0047] Below, an example will be described to confirm the effect of the mask jig according to the present disclosure. <Sample> Mask jig samples were prepared using the mask jigs shown in Figures 4 and 5, with different inclination angles θ1 and θ2 for each sample. Specifically, Samples 1, 2, and 3 were prepared with inclination angles θ1 and θ2 of 15°, 30°, and 45°, respectively. A flat mask jig without grooves was also prepared as Sample 4. Each sample was made of stainless steel SUS304. The planar shape of each sample was rectangular, measuring 42 mm wide x 30 mm long x 3 mm thick. The diameter of the through-hole was 3 mm.
[0048] In sample 1, two grooves were formed so as to extend along the vertical direction (short side direction) in plan view. In samples 2 and 3, three grooves were formed so as to extend along the vertical direction (short side direction) in plan view. Two through holes were formed at the bottom of each groove. In sample 4, three pairs of through holes were formed so as to be aligned along the vertical direction, as in sample 3.
[0049] <Film formation process> Using the above-mentioned samples 1 to 4, a film was formed on the surface of a substrate by cold spraying. The film-forming raw material used was aluminum powder. The aluminum powder was spherical with a diameter of 10 μm. The substrate material was alumina (Al2O3). The substrate was shaped like a rectangular plate in plan view. The size of the substrate was 42 mm wide x 30 mm long x 3 mm thick.
[0050] The film formation conditions were dry air as the operating gas, with a temperature of 270°C, a flow rate of 400 L / min, and a pressure of approximately 0.8 MPa. The width of the region where the film formation raw material was sprayed from the film formation device onto the surface of the mask jig was 5 mm. The speed (sweep speed) of the region where the film formation raw material was sprayed on the surface of the mask jig to include the region where the through-holes were formed was 5 mm / sec. The size of the film formation area (the region where the film formation raw material was sprayed) on the surface of the mask jig was 5 mm wide x 30 mm long. For each sample, the above-mentioned film formation area was set to include one pair of vertically aligned through-holes, forming Region 1, where the film formation raw material was sprayed only once within that film formation area. The above-mentioned film formation area was set to include another pair of through-holes, forming Region 2, where the film formation raw material was sprayed five times within that film formation area.
[0051] After forming a film on the surface of the substrate using each of Samples 1 to 4 under the above conditions, the weight (adhesion amount) of the film-forming raw material adhered to the surface was measured in Region 2 of each of Samples 1 to 4. In addition, the thickness of the film formed on the surface of the substrate was measured through Region 1 of each of Samples 1 to 4.
[0052] <Result> Deposition amount in area 2 of each sample: The deposition mass of Sample 1 was 142.9 mg, that of Sample 2 was 60.9 mg, that of Sample 3 was 35.4 mg, and that of Sample 4 was 141.9 mg. Thus, the deposition mass of Sample 1, with tilt angles θ1 and θ2 of 15°, was approximately equal to that of flat Sample 4 (with tilt angles θ1 and θ2 of 0°). On the other hand, the deposition masses of Samples 2 and 3, with tilt angles θ1 and θ2 of 30° and 45°, respectively, were significantly reduced compared to Samples 1 and 4. Furthermore, the deposition mass of Sample 3, whose tilt angles θ1 and θ2 were relatively larger than those of Sample 2, was less than that of Sample 2. These results demonstrate that the deposition mass of the film-forming raw material is reduced in the mask jig according to the present disclosure.
[0053] Film thickness formed on the surface of the substrate through region 1 of each sample: The film thickness of the substrate on which a film was formed using Sample 1 was 73 μm, the film thickness of the substrate on which a film was formed using Sample 2 was 76 μm, the film thickness of the substrate on which a film was formed using Sample 3 was 86 μm, and the film thickness of the substrate on which a film was formed using Sample 4 was 44 μm. Thus, it was demonstrated that when a film is formed on a substrate using the mask jig according to the present disclosure, the film thickness formed under similar conditions can be made thicker than conventional films.
[0054] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. Unless there is a contradiction, at least two of the embodiments disclosed herein may be combined. The basic scope of the present disclosure is defined by the claims, not the above description, and is intended to include all modifications within the meaning and scope of the claims. [Explanation of symbols]
[0055] 1 mask jig, 2 spray gun, 2a spray gun main body, 2b nozzle, 2c heater, 3 powder supply part, 4 gas supply part, 5, 6 piping, 7 valve, 8 pressure sensor, 9 temperature sensor, 10 powder, 11 main body, 11a first surface, 11b second surface, 12 groove, 12a, 12b inclined surface, 12c bottom, 13 through hole, 13a open end, 20 substrate, 30, 31, 32 arrows, 100 film formation device.
Claims
1. A mask jig used in a thermal spraying method, a main body including a first surface and a second surface opposite the first surface; a through hole extending from the first surface to the second surface is formed in the main body; the second surface includes an inclined surface having an inclination angle of 30° or more and less than 90° with respect to the first surface, At least one groove is formed in the second surface, The cross-sectional shape of the groove is V-shaped, the inclined surface is an inner circumferential surface of the groove, A mask jig, wherein an open end of the through hole in the second surface is formed inside the at least one groove.
2. The mask jig according to claim 1 , wherein a plurality of the grooves are formed on the second surface so as to extend in a first direction and are arranged in a line along a second direction perpendicular to the first direction.
3. 3. The mask jig according to claim 1, wherein the through hole is formed in a bottom portion of the inner circumferential surface of the groove, the bottom portion including a region closest to the first surface.
4. a step of placing the mask jig according to claim 1 so as to face a surface of a substrate, In the placing step, the mask jig is placed so that the first surface of the mask jig faces the front surface of the base material, and further A film forming method comprising a step of spraying a powder serving as a film forming raw material onto the surface of the substrate by a cold spray method through the through-holes of the mask jig.
5. a spray gun including a nozzle; a powder supply unit that supplies powder as a film-forming raw material to the spray gun; a gas supply unit that supplies operating gas to the spray gun; A film forming apparatus comprising: the mask jig according to claim 1, which is disposed between a substrate and the spray gun.
Citation Information
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