Electronic Devices

Abstract

An electronic device is provided, the device including a singulated carrier portion, a substrate molded onto the singulated carrier portion, and conductive traces disposed on the substrate. The substrate includes a polymer composition including an aromatic polymer and a conductive filler, the polymer composition having a density of about 1×10 determined according to ASTM D257-14. 12 ohm ~ approx. 1 x 10 18 Indicates surface resistivity in ohms.

Description

[Technical Field]

[0001] Cross-reference of related questions

[0001] This application claims the benefit of U.S. Provisional Patent Application No. 62 / 981,667, having a filing date of February 26, 2020, and U.S. Provisional Patent Application No. 63 / 057,345, having a filing date of July 28, 2020, which are incorporated by reference herein in their entireties. [Background technology]

[0002] Molded circuit devices (MIDs) are three-dimensional electromechanical devices that typically contain plastic components and electronic circuit traces. A plastic substrate or housing is created, and electrical circuits and devices are plated, laminated, or embedded into the plastic substrate. MIDs typically contain fewer components than traditionally produced devices, resulting in space and weight savings. Current methods for manufacturing MIDs include two-shot molding and laser direct structuring. Laser direct structuring involves, for example, injection molding, laser activation of the plastic material, and a subsequent metallization step. A laser etches a wiring pattern onto the component, preparing it for metallization. Despite the benefits of such devices, there remains a need for electronic component packages that can be used in smaller spaces and operate at higher speeds, while also using less power and being relatively inexpensive to manufacture. One technology developed to help solve these problems is known as "Application Specific Electronics Packaging" ("ASEP"). Such packaging systems rely on the use of plated plastic substrates that are molded onto singulated carrier portions, thereby enabling the production of products using reel-to-reel (continuous flow) manufacturing processes. Unfortunately, one of the limitations of these systems is that the polymeric materials used for the plastic substrates are not easily plated with conductive circuit traces, and the materials typically do not have the desired degree of heat resistance and mechanical strength. Summary of the Invention [Problem to be solved by the invention]

[0003]

[0003] Therefore, a current need exists for improved packaged electronic devices formed from plastic substrates having conductive circuit traces. [Means for solving the problem]

[0004] According to one embodiment of the present invention, an electronic device is disclosed that includes a singulated carrier portion, a substrate molded onto the singulated carrier portion, and conductive traces disposed on the substrate. The substrate includes a polymer composition including an aromatic polymer and a conductive filler, and the polymer composition has a molecular weight of about 1×10 determined in accordance with ASTM D257-14. 12 ohm ~ approx. 1 x 10 18 Indicates surface resistivity in ohms.

[0005]

[0005] Other features and aspects of the present invention are described in more detail below.

[0006] A full and enabling disclosure of the present invention, including the best mode thereof to one skilled in the art, is set forth more particularly in the remainder of the specification, including reference to the accompanying drawings, in which: [Brief explanation of the drawings]

[0006] [Figure 1]

[0007] FIG. 1 is a flow diagram of one embodiment of a manufacturing process that can be used to form the electronic device of the present invention. [Figure 2]

[0008] 2A-2C are perspective views of the manufacturing process shown in FIG. 1, showing the substrate on a carrier at various stages during the formation of an electronic device; [Figure 3]

[0009] 3 is a perspective view of the electronic device shown in FIG. 2 after separation from the carrier. [Figure 4]

[0010] 2 is a perspective view of one embodiment of a reel-to-reel carrier that can be used in the manufacturing process shown in FIG. 1. FIG. [Figure 5]

[0011] FIG. 1 is a schematic diagram of one embodiment for forming circuit traces on a substrate. [Figure 6]

[0012] FIG. 2 is a flow diagram illustrating additional steps that can be used in the manufacturing process of FIG. 1. [Figure 7]

[0013] 1 is a perspective view of one embodiment of an electronic device of the present invention in the form of an automobile light. [Figure 8]

[0014] FIG. 8 is an exploded perspective view of the electronic device shown in FIG. 7. DETAILED DESCRIPTION OF THE INVENTION

[0007]

[0015] It will be understood by those skilled in the art that this discussion is merely a description of exemplary embodiments and is not intended to limit the broader aspects of the invention.

[0016] Generally, the present invention relates to electronic devices such as printed circuit boards, flex circuits, connectors, thermal management features, EMI shielding, high current conductors, RFID devices, antennas, wireless power devices, sensors, MEMS devices, LED devices, microprocessors, memory devices, ASICs, passive devices, impedance control devices, electromechanical devices, or combinations thereof. The electronic devices contain substrates molded onto singulated carrier portions and having conductive traces disposed thereon. In particular, the substrates have a resulting surface resistivity within a particular range, for example, about 1×10 determined according to ASTM D257-14 (technically equivalent to IEC 62631-3-1). 12 ohm ~ approx. 1 x 10 18 ohms, in some embodiments, approximately 1×10 13 ohm ~ approx. 1 x 10 18 ohms, in some embodiments, approximately 1×10 14 ~Approx. 1×10 17 ohms, in some embodiments, approximately 1×10 15 ohm ~ approx. 1 x 10 17The composition also contains an aromatic polymer and a conductive filler in amounts such that the composition has a cross-sectional area of ​​about 1×10 ohms, as determined, for example, according to ASTM D257-14 (technically equivalent to IEC 62631-3-1). 10 ohm·m ~ approx. 1×10 16 ohm m, in some embodiments, approximately 1 x 10 11 ohm·m ~ approx. 1×10 16 ohm m, in some embodiments, approximately 1 x 10 12 ohm·m ~ approx. 1×10 15 ohm m, in some embodiments, approximately 1 x 10 13 ohm·m ~ approx. 1×10 15 It may exhibit a volume resistivity of ohm·m. In this manner, the substrate may generally be inherently antistatic so that no substantial amount of current flows through the components. While generally antistatic, the resulting substrate may nevertheless allow some static dissipation to facilitate plating and deposition of conductive traces thereon.

[0008]

[0017] It has traditionally been thought that compositions with such resistivity values ​​do not also possess good mechanical properties. However, contrary to conventional thinking, the compositions of the present invention have been found to have excellent strength properties. For example, the compositions have a resistivity of about 2 kJ / m2 as measured according to ISO Test No. 179-1:2010 at 23°C. 2 and in some embodiments, from about 4 to about 40 kJ / m 2 and in some embodiments, from about 6 to about 30 kJ / m 2The compositions may also exhibit unnotched and / or notched Charpy impact strengths of from about 20 to about 500 MPa, and in some embodiments, from about 50 to about 400 MPa, and in some embodiments, from about 60 to about 350 MPa; a tensile strain at break of at least about 0.5%, and in some embodiments, from about 0.8% to about 15%, and in some embodiments, from about 1% to about 10%; and / or a tensile modulus of from about 5,000 MPa to about 30,000 MPa, and in some embodiments, from about 7,000 MPa to about 25,000 MPa, and in some embodiments, from about 10,000 MPa to about 20,000 MPa. Tensile properties may be determined according to ISO Test No. 527:2019 at 23°C. The compositions may also exhibit a flexural strength of about 40 to about 500 MPa, in some embodiments about 50 to about 400 MPa, and in some embodiments about 100 to about 350 MPa; a flexural break strain of about 0.5% or greater, in some embodiments about 0.8% to about 15%, and in some embodiments about 1% to about 10%; and / or a flexural modulus of about 7,000 MPa or greater, in some embodiments about 9,000 MPa or greater, in some embodiments about 10,000 MPa to about 30,000 MPa, and in some embodiments about 12,000 MPa to about 25,000 MPa. Flexural properties may be determined according to ISO Test No. 178:2019 at 23°C. The compositions may also exhibit a deflection temperature under load (DTUL) of about 180°C or greater, and in some embodiments, from about 190°C to about 280°C, as measured according to ASTM D648-07 (technically equivalent to ISO Test No. 75-2:2013) at a specified load of 1.8 MPa.

[0009]

[0018] The polymer composition may also exhibit a high dielectric constant, as determined by split post resonance at a frequency of 2 GHz, of about 4 or greater, in some embodiments, about 5 or greater, in some embodiments, about 6 or greater, in some embodiments, about 8 to about 30, in some embodiments, about 10 to about 25, and in some embodiments, about 12 to about 24. Such a high dielectric constant may facilitate the ability to form thin substrates and further enable the use of multiple conductive elements (e.g., antennas) operating simultaneously with only minimal levels of electrical interference. The dissipation factor, a measure of the rate of energy loss, may also be relatively low, for example, about 0.3 or less, in some embodiments, about 0.2 or less, in some embodiments, about 0.1 or less, in some embodiments, about 0.06 or less, in some embodiments, about 0.04 or less, and in some embodiments, about 0.001 to about 0.03, as determined by split post resonance at a frequency of 2 GHz. The inventors have also discovered that the dielectric constant and dissipation factor can be maintained within the aforementioned ranges even when exposed to various temperatures, such as temperatures from about -30°C to about 100°C. For example, when subjected to the thermal cycling test described herein, the ratio of the dielectric constant to the initial dielectric constant after thermal cycling may be about 0.8 or greater, in some embodiments about 0.9 or greater, and in some embodiments, about 0.95 to about 1.1. Similarly, the ratio of the dielectric loss tangent after exposure to high temperatures to the initial dielectric loss tangent may be about 1.3 or less, in some embodiments about 1.2 or less, in some embodiments about 1.1 or less, in some embodiments about 1.0 or less, in some embodiments 0.95 or less, in some embodiments about 0.1 to about 0.95, and in some embodiments about 0.2 to about 0.9. The change in dielectric loss tangent (i.e., initial dielectric loss tangent minus dielectric loss tangent after thermal cycling) may also range from about -0.1 to about 0.1, in some embodiments about -0.05 to about 0.01, and in some embodiments about -0.001 to 0.

[0010]

[0019] Various embodiments of the invention will now be described in more detail. I. Polymer Composition A. Polymer matrix

[0020] The polymer matrix typically contains one or more aromatic polymers, generally in an amount of about 30 wt.% to about 80 wt.%, in some embodiments about 40 wt.% to about 75 wt.%, and in some embodiments about 50 wt.% to about 70 wt.% of the polymer composition. Aromatic polymers may be considered "high performance" polymers in that they have relatively high glass transition temperatures and / or high melting temperatures, depending on the specific properties of the polymer. Thus, such high performance polymers can impart a substantial degree of heat resistance to the resulting polymer composition. For example, aromatic polymers may have glass transition temperatures of about 100°C or higher, in some embodiments about 120°C or higher, in some embodiments about 140°C to about 350°C, and in some embodiments about 150°C to about 320°C. Aromatic polymers may also have melting temperatures of about 200°C or higher, in some embodiments about 220°C to about 350°C, and in some embodiments about 240°C to about 300°C. Glass transition temperatures and melting temperatures may be determined as known in the art using differential scanning calorimetry ("DSC"), for example, by ISO Test Nos. 11357-2:2020 (glass transition) and 11357-3:2018 (melting).

[0011]

[0021] Aromatic polymers can be substantially amorphous, semi-crystalline, or crystalline in nature. An example of a suitable semi-crystalline aromatic polymer is, for example, an aromatic or semi-aromatic polyamide. Aromatic polyamides typically contain repeating units held together by amide linkages (NH—CO) and are synthesized by polycondensation of dicarboxylic acids (e.g., aromatic dicarboxylic acids), diamines (e.g., aliphatic diamines), and the like. For example, aromatic polyamides may contain aromatic repeating units derived from aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, 2,6-naphthalenedicarboxylic acid, 2,7-naphthalenedicarboxylic acid, 1,4-naphthalenedicarboxylic acid, 1,4-phenylenedioxy-diacetic acid, 1,3-phenylenedioxy-diacetic acid, diphenic acid, 4,4′-oxydibenzoic acid, diphenylmethane-4,4′-dicarboxylic acid, diphenylsulfone-4,4′-dicarboxylic acid, 4,4′-biphenyldicarboxylic acid, and the like, and combinations thereof. Terephthalic acid is particularly suitable. Of course, it should be understood that other types of acid units may also be utilized, such as aliphatic dicarboxylic acid units, polyfunctional carboxylic acid units, etc. The aromatic polyamide may also contain aliphatic repeat units derived from aliphatic diamines typically having 4 to 14 carbon atoms. Examples of such diamines include linear aliphatic alkylenediamines such as 1,4-tetramethylenediamine, 1,6-hexanediamine, 1,7-heptanediamine, 1,8-octanediamine, 1,9-nonanediamine, 1,10-decanediamine, 1,11-undecanediamine, and 1,12-dodecanediamine; branched aliphatic alkylenediamines such as 2-methyl-1,5-pentanediamine, 3-methyl-1,5-pentanediamine, 2,2,4-trimethyl-1,6-hexanediamine, 2,4,4-trimethyl-1,6-hexanediamine, 2,4-dimethyl-1,6-hexanediamine, 2-methyl-1,8-octanediamine, and 5-methyl-1,9-nonanediamine; and combinations thereof. Repeating units derived from 1,9-nonanediamine and / or 2-methyl-1,8-octanediamine are particularly suitable. Of course, other diamine units such as alicyclic diamines, aromatic diamines, etc. may also be utilized.

[0012]

[0022] Particularly preferred polyamides include poly(nonamethylene terephthalamide) (PA9T), poly(nonamethylene terephthalamide / nonamethylenedecanediamide) (PA9T / 910), poly(nonamethylene terephthalamide / nonamethylenedodecanediamide) (PA9T / 912), poly(nonamethylene terephthalamide / 11-aminoundecanamide (PA9T / 11), poly(nonamethylene terephthalamide) ... Poly(decamethylene terephthalamide / 12-aminododecanamide) (PA9T / 12), Poly(decamethylene terephthalamide / 11-aminoundecanamide) (PA10T / 11), Poly(decamethylene terephthalamide / 12-aminododecanamide) (PA10T / 12), Poly(decamethylene terephthalamide / decamethylenedodecanediamide) (PA10T / 1010), Poly(decamethylene terephthalamide / decamethylenedodecanediamide) (PA10T / 1010), Poly(dodecamethylene terephthalamide) (PA10T / 1012), poly(decamethylene terephthalamide / tetramethylene hexanediamide) (PA10T / 46), poly(decamethylene terephthalamide / caprolactam) (PA10T / 6), poly(decamethylene terephthalamide / hexamethylene hexanediamide) (PA10T / 66), poly(dodecamethylene terephthalamide / dodecamethylene dodecanediamide) (PA12T / 1212), poly(dodecamethylene terephthalamide / caprolactam) (PA12T / 6), poly(dodecamethylene terephthalamide / hexamethylene hexanediamide) (PA12T / 66), and the like. Further examples of suitable aromatic polyamides are described in U.S. Pat. No. 8,324,307 to Harder et al.

[0013]

[0023] Another suitable semi-crystalline aromatic polymer that may be utilized is an aromatic polyester that is the condensation product of an aromatic dicarboxylic acid having 8 to 14 carbon atoms and at least one diol. Suitable diols include, for example, neopentyl glycol, cyclohexanedimethanol, 2,2-dimethyl-1,3-propanediol, and carboxylic acids of the formula HO(CH2). nOH (where n is an integer from 2 to 10). Suitable aromatic dicarboxylic acids include, for example, isophthalic acid, terephthalic acid, 1,2-di(p-carboxyphenyl)ethane, 4,4'-dicarboxydiphenyl ether, and the like, and combinations thereof. Fused rings may be present, as in 1,4-, 1,5-, or 2,6-naphthalenedicarboxylic acid. Specific examples of such aromatic polyesters include poly(ethylene terephthalate) (PET), poly(1,4-butylene terephthalate) (PBT), poly(1,3-propylene terephthalate) (PPT), poly(1,4-butylene 2,6-naphthalate) (PBN), poly(ethylene 2,6-naphthalate) (PEN), poly(1,4-cyclohexylene dimethylene terephthalate) (PCT), as well as copolymers, derivatives, and mixtures of the above.

[0014]

[0024] Additionally, modifications or copolymers of such aromatic polyesters may also be used. For example, in one embodiment, a modifying acid or a modifying diol may be used to produce modified polyethylene terephthalate polymers and / or modified polybutylene terephthalate polymers. As used herein, the terms "modifying acid" and "modifying diol" are intended to define compounds that can form part of the acid and diol repeat units of a polyester, respectively, and that can modify the polyester to reduce its crystallinity or render it amorphous. Of course, the polyester may be unmodified and contain no modifying acid or modifying diol. In either case, examples of modifying acid components may include, but are not limited to, isophthalic acid, phthalic acid, 1,3-cyclohexanedicarboxylic acid, 1,4-cyclohexanedicarboxylic acid, 2,6-naphthalenedicarboxylic acid, succinic acid, glutaric acid, adipic acid, sebacic acid, suberic acid, 1,12-dodecanedioic acid, and the like. In practice, it is often preferable to use functional acid derivatives of these acids, such as the dimethyl, diethyl, or dipropyl esters of the dicarboxylic acids. Where practical, the anhydrides or acid halides of these acids may also be utilized.Examples of the modified diol component include, but are not limited to, neopentyl glycol, 1,4-cyclohexanedimethanol, 1,2-propanediol, 1,3-propanediol, 2-methyl-1,3-propanediol, 1,4-butanediol, 1,6-hexanediol, 1,2-cyclohexanediol, 1,4-cyclohexanediol, 1,2-cyclohexanedimethanol, 1,3-cyclohexanedimethanol, 2,2,4,4-tetramethyl-1,3-cyclobutanediol, Z,8-bis(hydroxymethyltricyclo-[5.2.1.0]-decane (wherein Z represents 3, 4, or 5); 1,4-bis(2-hydroxyethoxy)benzyl ether; Examples of suitable diols include benzene, 4,4'-bis(2-hydroxyethoxy)diphenyl ether [bis-hydroxyethyl bisphenol A], 4,4'-bis(2-hydroxyethoxy)diphenyl sulfide [bis-hydroxyethyl bisphenol S], and diols containing one or more oxygen atoms in the chain, such as diethylene glycol, triethylene glycol, dipropylene glycol, and tripropylene glycol. Generally, these diols contain 2 to 18 carbon atoms, and in some embodiments, 2 to 8 carbon atoms. The alicyclic diols can be utilized in their cis or trans configurations, or as mixtures of both forms.

[0015]

[0025] Polyarylene sulfide is also a suitable semi-crystalline aromatic polymer.Polyarylene sulfide may be a homopolymer or copolymer.For example, by selectively combining dihaloaromatic compounds, polyarylene sulfide copolymers containing two or more different units can be produced.For example, when p-dichlorobenzene is used in combination with m-dichlorobenzene or 4,4'-dichlorodiphenyl sulfone, the polyarylene sulfide copolymers of the formula:

[0016] [ka]

[0017] and a segment having the structure of the formula:

[0018] [ka]

[0019] A segment having the structure, or formula:

[0020] [ka]

[0021] It is possible to form a polyarylene sulfide copolymer containing segments having the structure:

[0026] Polyarylene sulfides may be linear, semi-linear, branched, or crosslinked. Linear polyarylene sulfides typically contain 80 mol% or more of the repeating unit -(Ar-S)-. Such linear polymers may also contain a small amount of branching or crosslinking units, but the amount of branching or crosslinking units is typically less than about 1 mol% of the total monomer units of the polyarylene sulfide. Linear polyarylene sulfide polymers may be random copolymers or block copolymers containing the above repeating units. Semi-linear polyarylene sulfides may also have a crosslinked or branched structure in which a small amount of one or more monomers having three or more reactive functional groups are introduced into the polymer. For example, the monomer components used to form semi-linear polyarylene sulfides may include a certain amount of polyhaloaromatic compounds having two or more halogen substituents per molecule, which can be used to prepare branched polymers. Such monomers have the formula R'X nwherein each X is selected from chlorine, bromine, and iodine; n is an integer from 3 to 6; R' is a polyvalent aromatic group of valence n that may have up to about four methyl substituents; and the total number of carbon atoms in R' is in the range of 6 to about 16. Examples of some polyhaloaromatic compounds substituted with more than two halogens per molecule that can be used to form semi-linear polyarylene sulfides include 1,2,3-trichlorobenzene, 1,2,4-trichlorobenzene, 1,3-dichloro-5-bromobenzene, 1,2,4-triiodobenzene, 1,2,3,5-tetrabromobenzene, hexachlorobenzene, 1,3,5-trichloro-2,4,6-trimethylbenzene, 2,2',4,4'-tetrachlorobiphenyl, 2,2',5,5'-tetra-iodobiphenyl, 2,2',6,6'-tetrabromo-3,3',5,5'-tetramethylbiphenyl, 1,2,3,4-tetrachloronaphthalene, 1,2,4-tribromo-6-methylnaphthalene, and the like, and mixtures thereof.

[0022]

[0027] As noted above, substantially amorphous polymers lacking a distinct melting point temperature can also be utilized in the polymer composition. Suitable amorphous polymers include, for example, polyphenylene oxide ("PPO"), aromatic polycarbonates, aromatic polyetherimides, and the like. For example, aromatic polycarbonates typically have a glass transition temperature of about 130°C to about 160°C and contain aromatic repeating units derived from one or more aromatic diols. Particularly suitable aromatic diols are bisphenols, such as gem-bisphenols, in which two phenolic groups are bonded to one carbon atom of a divalent linking group. Examples of such bisphenols include, for example, 4,4'-isopropylidenediphenol ("bisphenol A"), 4,4'-ethylidenediphenol, 4,4'-(4-chloro-α-methylbenzylidene)diphenol, 4,4'-cyclohexylidene diphenol, 4,4(cyclohexylmethylene)diphenol, and the like, and combinations thereof. The aromatic diol can be reacted with phosgene. For example, phosgene may be carbonyl chloride, which has the formula C(O)Cl2. An alternative route to the synthesis of aromatic polycarbonates may involve the transesterification of aromatic diols (e.g., bisphenols) with diphenyl carbonate.

[0023]

[0028] In addition to the polymers mentioned above, crystalline polymers can also be used in the polymer composition. Particularly suitable are liquid crystal polymers with high crystallinity, which allows them to effectively fill the small spaces in the mold. Liquid crystal polymers generally have a rod-like structure and are classified as "thermotropic" as long as they can exhibit crystalline behavior in their molten state (e.g., thermotropic nematic state). Such polymers may be formed from one or more types of repeating units as known in the art. Liquid crystal polymers, for example, generally have the following formula (I):

[0024] [ka]

[0025] (In the formula, Ring B is a substituted or unsubstituted 6-membered aryl group (e.g., 1,4-phenylene or 1,3-phenylene), a substituted or unsubstituted 6-membered aryl group fused to a substituted or unsubstituted 5- or 6-membered aryl group (e.g., 2,6-naphthalene), or a substituted or unsubstituted 6-membered aryl group linked to a substituted or unsubstituted 5- or 6-membered aryl group (e.g., 4,4-biphenylene); Y1 and Y2 are independently O, C(O), NH, C(O)HN, or NHC(O). The aromatic ester may contain one or more aromatic ester repeat units represented by:

[0026]

[0029] Typically, at least one of Y1 and Y2 is C(O). Examples of such aromatic ester repeat units include, for example, aromatic dicarboxylic acid repeat units (in Formula I, Y1 and Y2 are C(O)), aromatic hydroxycarboxylic acid repeat units (in Formula I, Y1 is O and Y2 is C(O)), and various combinations thereof.

[0027]

[0030] For example, aromatic hydroxycarboxylic acid repeat units derived from aromatic hydroxycarboxylic acids such as 4-hydroxybenzoic acid, 4-hydroxy-4'-biphenylcarboxylic acid, 2-hydroxy-6-naphthoic acid, 2-hydroxy-5-naphthoic acid, 3-hydroxy-2-naphthoic acid, 2-hydroxy-3-naphthoic acid, 4'-hydroxyphenyl-4-benzoic acid, 3'-hydroxyphenyl-4-benzoic acid, 4'-hydroxyphenyl-3-benzoic acid, and the like, as well as alkyl, alkoxy, aryl, and halogen-substituted versions thereof, and combinations thereof, may be utilized. Particularly suitable aromatic hydroxycarboxylic acids are 4-hydroxybenzoic acid ("HBA") and 6-hydroxy-2-naphthoic acid (HNA). When utilized, repeat units derived from hydroxycarboxylic acids (e.g., HBA and / or HNA) typically comprise about 40 mol.% or more of the polymer, in some embodiments about 45 mol.% or more, and in some embodiments about 50 mol.% to 100 mol.%. In one embodiment, for example, the repeating units derived from HBA may comprise about 30 mol % to about 90 mol %, in some embodiments, about 40 mol % to about 85 mol %, and in some embodiments, about 50 mol % to about 80 mol % of the polymer. Similarly, the repeating units derived from HNA may comprise about 1 mol % to about 30 mol %, in some embodiments, about 2 mol % to about 25 mol %, and in some embodiments, about 3 mol % to about 15 mol % of the polymer.

[0028]

[0031] Also useful are aromatic dicarboxylic acid repeat units derived from aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, 2,6-naphthalenedicarboxylic acid, diphenyl ether-4,4'-dicarboxylic acid, 1,6-naphthalenedicarboxylic acid, 2,7-naphthalenedicarboxylic acid, 4,4'-dicarboxybiphenyl, bis(4-carboxyphenyl)ether, bis(4-carboxyphenyl)butane, bis(4-carboxyphenyl)ethane, bis(3-carboxyphenyl)ether, bis(3-carboxyphenyl)ethane, and the like, as well as alkyl-, alkoxy-, aryl-, and halogen-substituted versions thereof, and combinations thereof. Particularly suitable aromatic dicarboxylic acids include, for example, terephthalic acid ("TA"), isophthalic acid ("IA"), and 2,6-naphthalenedicarboxylic acid ("NDA"). When utilized, repeat units derived from aromatic dicarboxylic acids (e.g., IA, TA, and / or NDA) typically comprise from about 1 mol.% to about 50 mol.%, in some embodiments from about 2 mol.% to about 40 mol.%, and in some embodiments, from about 5 mol.% to about 30% of the polymer.

[0029]

[0032] Other repeat units can also be utilized in the polymer. For example, in certain embodiments, repeat units derived from aromatic diols such as hydroquinone, resorcinol, 2,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 4,4'-dihydroxybiphenyl (or 4,4'-biphenol), 3,3'-dihydroxybiphenyl, 3,4'-dihydroxybiphenyl, 4,4'-dihydroxybiphenyl ether, bis(4-hydroxyphenyl)ethane, and the like, as well as alkyl, alkoxy, aryl, and halogen-substituted versions thereof, and combinations thereof, may be utilized. Particularly suitable aromatic diols include, for example, hydroquinone ("HQ") and 4,4'-biphenol ("BP"). When utilized, repeat units derived from aromatic diols (e.g., HQ and / or BP) typically comprise from about 1 mol.% to about 30 mol.%, in some embodiments, from about 2 mol.% to about 25 mol.%, and in some embodiments, from about 5 mol.% to about 20% of the polymer. Repeat units such as those derived from aromatic amides (e.g., acetaminophen (“APAP”)) and / or aromatic amines (e.g., 4-aminophenol (“AP”), 3-aminophenol, 1,4-phenylenediamine, 1,3-phenylenediamine, etc.) may also be utilized. When utilized, repeat units derived from aromatic amides (e.g., APAP) and / or aromatic amines (e.g., AP) typically comprise from about 0.1 mol.% to about 20 mol.%, in some embodiments from about 0.5 mol.% to about 15 mol.%, and in some embodiments, from about 1 mol.% to about 10% of the polymer. It should also be understood that various other monomeric repeat units may be incorporated into the polymer. For example, in certain embodiments, the polymer may contain one or more repeat units derived from non-aromatic monomers, such as aliphatic or alicyclic hydroxycarboxylic acids, dicarboxylic acids, diols, amides, amines, and the like. Of course, in other embodiments, the polymer may be “fully aromatic” in that it does not include repeat units derived from non-aromatic (e.g., aliphatic or alicyclic) monomers.

[0030]

[0033] Although not required, the liquid crystal polymer may be a "low naphthene" polymer so long as it contains a relatively low content of repeat units derived from naphthenic hydroxycarboxylic acids and naphthenic dicarboxylic acids, such as naphthalene-2,6-dicarboxylic acid ("NDA"), 6-hydroxy-2-naphthoic acid ("HNA"), or combinations thereof. That is, the total amount of repeat units derived from naphthenic hydroxycarboxylic acids and / or dicarboxylic acids (e.g., NDA, HNA, or combinations of HNA and NDA) is typically about 15 mol.% or less, in some embodiments about 10 mol.% or less, and in some embodiments, from about 1 mol.% to about 8 mol.% of the polymer.

[0031]

[0034] In certain embodiments of the present invention, blends of aromatic polymers can also be utilized to help achieve desired properties of the polymer composition. For example, the polymer composition may contain a liquid crystalline polymer in combination with a semi-crystalline aromatic polyester, such as those described above. In one particular embodiment, for example, the aromatic polyester may be a polyalkylene terephthalate, such as poly(1,4-cyclohexylene dimethylene terephthalate) (PCT), and copolymers and derivatives thereof. When such blends are utilized, the liquid crystalline polymer may comprise from about 30 wt.% to about 85 wt.%, in some embodiments from about 40 wt.% to about 80 wt.%, and in some embodiments, from about 60 wt.% to about 75 wt.%, of the blend, while the semi-crystalline aromatic polyester may similarly comprise from about 15 wt.% to about 70 wt.%, in some embodiments from about 20 wt.% to about 60 wt.%, and in some embodiments, from about 25 wt.% to about 40 wt.% of the blend. The liquid crystalline polymer may, for example, comprise from about 15 wt.% to about 85 wt.%, in some embodiments from about 20 wt.% to about 75 wt.%, and in some embodiments, from about 30 wt.% to about 50 wt.% of the total polymer composition, while the semi-crystalline aromatic polyester may similarly comprise from about 1 wt.% to about 50 wt.%, in some embodiments, from about 5 wt.% to about 45 wt.%, and in some embodiments, from about 10 wt.% to about 40 wt.% of the total polymer composition.

[0032] B. Conductive filler

[0035] As noted above, conductive fillers can also be utilized in the polymer composition to achieve desired surface and / or volume resistivity values ​​for the polymer composition. This may be achieved by selecting a single material for the filler that has the desired resistivity, or by blending multiple materials together (e.g., insulating and conductive) so that the resulting filler has the desired resistivity. For example, in one particular embodiment, the resistivity is less than about 1 ohm-cm, in some embodiments less than about 0.1 ohm-cm, and in some embodiments less than about 1×10 ohm-cm, as determined at a temperature of about 20° C., e.g., according to ASTM D257-14 (technically equivalent to IEC 62631-3-1). -8 ~Approx. 1×10 -2 Conductive materials having a volume resistivity of ohm·cm may be utilized. Suitable conductive materials include carbon materials such as graphite, carbon black, carbon fiber, graphene, and carbon nanotubes. Other suitable conductive fillers include metals (e.g., metal particles, metal flakes, metal fibers, etc.), ionic liquids, and the like. Regardless of the material utilized, the conductive filler typically comprises from about 0.5 to about 20 parts by weight, in some embodiments from about 1 to about 15 parts by weight, and in some embodiments, from about 2 to about 8 parts by weight, per 100 parts by weight of the polymer matrix. For example, the conductive filler may comprise from about 0.1 wt.% to about 10 wt.%, in some embodiments, from about 0.2 wt.% to about 8 wt.%, and in some embodiments, from about 0.5 wt.% to about 4 wt.% of the polymer composition.

[0033] C. Mineral fillers

[0036] If desired, the polymer composition may contain one or more mineral fillers distributed throughout the polymer matrix. Such mineral fillers typically comprise from about 10 to about 80 parts, in some embodiments from about 20 to about 70 parts, and in some embodiments, from about 30 to about 60 parts per 100 parts by weight of the polymer matrix. The mineral filler may comprise, for example, from about 5 wt.% to about 60 wt.%, in some embodiments from about 10 wt.% to about 55 wt.%, and in some embodiments, from about 25 wt.% to about 40 wt.% of the polymer composition. Furthermore, the weight ratio of mineral filler to conductive filler may range from about 2 to about 500, in some embodiments from about 3 to about 150, in some embodiments from about 4 to about 75, and in some embodiments, from about 5 to about 15. By selectively adjusting the type and relative amount of mineral filler, the inventors have discovered that not only can the mechanical properties be improved, but also the thermal conductivity can be increased without significantly affecting the overall electrical conductivity of the polymer composition. This allows the composition to create a thermal path for heat transfer away from the resulting electronic device, enabling rapid elimination of "hot spots" and reduced overall temperature during use. The composition may, for example, exhibit an in-plane thermal conductivity of about 0.2 W / m·K or greater, in some embodiments about 0.5 W / m·K or greater, in some embodiments about 0.6 W / m·K or greater, in some embodiments about 0.8 W / m·K or greater, and in some embodiments, from about 1 to about 3.5 W / m·K, as determined in accordance with ASTM E 1461-13. The composition may also exhibit an in-plane thermal conductivity of about 0.3 W / m·K or greater, in some embodiments about 0.5 W / m·K or greater, in some embodiments about 0.40 W / m·K or greater, and in some embodiments, from about 0.7 to about 2 W / m·K, as determined in accordance with ASTM E 1461-13. Remarkably, it has been discovered that such thermal conductivities can be achieved without the use of conventional materials with high intrinsic thermal conductivities. For example, the polymer composition may be free of fillers that generally have an intrinsic thermal conductivity of 50 W / m·K or greater, in some embodiments 100 W / m·K or greater, and in some embodiments 150 W / m·K or greater.Examples of such high intrinsic thermal conductivity materials include, for example, boron nitride, aluminum nitride, magnesium silicon nitride, graphite (e.g., expanded graphite), silicon carbide, carbon nanotubes, zinc oxide, magnesium oxide, beryllium oxide, zirconium oxide, yttrium oxide, aluminum powder, and copper powder. While it is typically desirable to minimize the presence of such high intrinsic thermal conductivity materials, they may nevertheless be present in relatively low percentages, such as about 10 wt.% or less, in some embodiments about 5 wt.% or less, and in some embodiments, about 0.01 wt.% to about 2 wt.% of the polymer composition in certain embodiments.

[0034]

[0037] The nature of the mineral filler utilized in the polymer composition may vary, including mineral particles, mineral fibers (or "whiskers"), and blends thereof. Suitable mineral fibers include, for example, silicates, such as neosilicates, sorosilicates, inosilicates (e.g., calcium inosilicates such as wollastonite; calcium magnesium inosilicates such as tremolite; calcium magnesium iron inosilicates such as actinolite; magnesium iron inosilicates such as anthophilite), phyllosilicates (e.g., aluminum phyllosilicates such as palygorskite), tectosilicates, and the like; sulfates such as calcium sulfate (e.g., dehydrated or anhydrous gypsum); and mineral wool (e.g., rock or slag wool). Inosilicates, such as wollastonite fiber available from Nyco Minerals under the trade name NYGLOS® (e.g., NYGLOS® 4W or NYGLOS® 8), are particularly suitable. The mineral fibers may have a median diameter of about 1 to about 35 micrometers, in some embodiments, about 2 to about 20 micrometers, in some embodiments, about 3 to about 15 micrometers, and in some embodiments, about 7 to about 12 micrometers. The mineral fibers may also have a narrow size distribution. That is, at least about 60% by volume of the fibers, in some embodiments, at least about 70% by volume of the fibers, and in some embodiments, at least about 80% by volume of the fibers may have a size within the above range. While not intending to be limited by theory, it is believed that mineral fibers having the above size characteristics may move more easily through molding equipment, thereby improving their distribution within the polymer matrix and minimizing the creation of surface defects. In addition to having the above size characteristics, the mineral fibers may also have a relatively high aspect ratio (average length divided by median diameter), which helps further improve the mechanical properties and surface quality of the resulting polymer composition. For example, the mineral fibers may have an aspect ratio of about 2 to about 100, in some embodiments, about 2 to about 50, in some embodiments, about 3 to about 20, and in some embodiments, about 4 to about 15.The volume average length of such mineral fibers may range, for example, from about 1 to about 200 micrometers, in some embodiments from about 2 to about 150 micrometers, in some embodiments from about 5 to about 100 micrometers, and in some embodiments, from about 10 to about 50 micrometers.

[0035]

[0038] Other suitable mineral fibers are mineral particles. The average diameter of the particles may range, for example, from about 5 micrometers to about 200 micrometers, in some embodiments from about 8 micrometers to about 150 micrometers, and in some embodiments, from about 10 micrometers to about 100 micrometers. The shape of the particles may vary as desired, for example, granular, flake-shaped, and the like. Flake-shaped particles may be utilized having a relatively high aspect ratio (e.g., average diameter divided by average thickness), for example, about 4 or greater, in some embodiments, about 8 or greater, and in some embodiments, from about 10 to about 500. Similarly, the average thickness of such flake-shaped particles may be about 2 micrometers or less, in some embodiments, from about 5 nanometers to about 1 micrometer, and in some embodiments, from about 20 nanometers to about 500 nanometers. Regardless of their shape and size, the particles are typically formed from natural and / or synthetic silicate minerals, such as talc, mica, halloysite, kaolinite, illite, montmorillonite, vermiculite, palygorskite, pyrophyllite, calcium silicate, aluminum silicate, wollastonite, and the like. Talc and mica are particularly preferred. For example, muscovite (KAl2(AlSi3)O 10 (OH)2), biotite (K(Mg,Fe)3(AlSi3)O 10 (OH)2), phlogopite (KMg3(AlSi3)O 10 (OH)2), red mica (K(Li,Al) 2-3 (AlSi3)O 10 (OH)2), glauconite (K,Na)(Al,Mg,Fe)2(Si,Al)4O 10 Mica in any form, including but not limited to (OH)2), may generally be utilized. Muscovite-based mica is particularly suitable for use in polymer compositions.

[0036] D. Optional Ingredients A wide variety of additional additives may be included in the polymer composition, such as glass fibers, impact modifiers, lubricants, pigments (e.g., carbon black), antioxidants, stabilizers, surfactants, waxes, flame retardants, anti-sag additives, nucleating agents (e.g., boron nitride), and other materials added to improve properties and processability. For example, lubricants may be utilized in the polymer composition in amounts of about 0.05 wt.% to about 1.5 wt.%, and in some embodiments, about 0.1 wt.% to about 0.5 wt.% (by weight) of the polymer composition. Examples of such lubricants include fatty acid esters, their salts, esters, fatty acid amides, organophosphate esters, and hydrocarbon waxes of the type commonly used as lubricants in the processing of engineering plastic materials, including mixtures thereof. Suitable fatty acids typically have a backbone carbon chain of about 12 to about 60 carbon atoms, such as myristic acid, palmitic acid, stearic acid, arachidic acid, montanic acid, octadecynic acid, and paric acid. Suitable esters include fatty acid esters, fatty alcohol esters, wax esters, glycerol esters, glycol esters, and complex esters. Fatty acid amides include fatty primary amides, fatty secondary amides, methylene and ethylene bisamides, and alkanolamides such as palmitic acid amide, stearic acid amide, oleic acid amide, and N,N'-ethylenebisstearamide. Also suitable are metal salts of fatty acids such as calcium stearate, zinc stearate, and magnesium stearate; hydrocarbon waxes including paraffin wax, polyolefin and oxidized polyolefin wax, and microcrystalline wax. Particularly suitable lubricants are stearic acid, salts, or amides such as pentaerythritol tetrastearate, calcium stearate, or N,N'-ethylenebisstearamide. Yet another suitable lubricant may be a siloxane polymer, which helps improve internal lubrication and enhance the wear and friction properties of the composition when it encounters another surface. Such siloxane polymers typically comprise from about 0.2 to about 20 parts, in some embodiments from about 0.5 to about 10 parts, and in some embodiments from about 0.8 to about 5 parts per 100 parts of the polymer matrix utilized in the composition.Any of a variety of siloxane polymers may generally be utilized. Siloxane polymers include, for example, those having the formula: R r SiO (4-r / 2) (In the formula, R is independently hydrogen or a substituted or unsubstituted hydrocarbon group; r is 0, 1, 2, or 3) The term "siloxane" may include any polymer, copolymer or oligomer containing siloxane units in a backbone having the formula:

[0037]

[0039] Some examples of suitable groups R include, for example, optionally substituted alkyl, aryl, alkylaryl, alkenyl or alkynyl, or cycloalkyl groups, which may be interrupted by heteroatoms, i.e., may contain heteroatoms in the carbon chain or ring. Suitable alkyl groups include, for example, methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, tert-butyl, n-pentyl, isopentyl, neopentyl, and tert-pentyl groups, hexyl groups (e.g., n-hexyl), heptyl groups (e.g., n-heptyl), octyl groups (e.g., n-octyl), isooctyl groups (e.g., 2,2,4-trimethylpentyl), nonyl groups (e.g., n-nonyl), decyl groups (e.g., n-decyl), dodecyl groups (e.g., n-dodecyl), and octadecyl groups (e.g., n-octadecyl). Similarly, suitable cycloalkyl groups include cyclopentyl, cyclohexyl, cycloheptyl, methylcyclohexyl, etc., suitable aryl groups include phenyl, biphenyl, naphthyl, anthryl, and phenanthryl, suitable alkylaryl groups include o-, m-, or p-tolyl, xylyl, ethylphenyl, etc., and suitable alkenyl or alkynyl groups include vinyl, 1-propenyl, 1-butenyl, 1-pentenyl, 5-hexenyl, butadienyl, hexadienyl, cyclopentenyl, cyclopentadienyl, cyclohexenyl, ethynyl, propargyl, 1-propynyl, etc. Examples of substituted hydrocarbon groups are halogenated alkyl groups (e.g., 3-chloropropyl, 3,3,3-trifluoropropyl, and perfluorohexylethyl) and halogenated aryl groups (e.g., p-chlorophenyl and p-chlorobenzyl). In one particular embodiment, the siloxane polymer comprises alkyl groups (e.g., methyl groups) attached to at least 70 mol % of the Si atoms, and optionally vinyl and / or phenyl groups attached to 0.001 to 30 mol % of the Si atoms. The siloxane polymer is also preferably composed primarily of diorganosiloxane units.The terminal groups of the polyorganosiloxane may be trialkylsiloxy groups, particularly trimethylsiloxy groups, or dimethylvinylsiloxy groups. However, one or more of these alkyl groups may be substituted with hydroxy groups or alkoxy groups such as methoxy or ethoxy groups. Particularly suitable examples of siloxane polymers include, for example, dimethylpolysiloxane, phenylmethylpolysiloxane, vinylmethylpolysiloxane, and trifluoropropylpolysiloxane.

[0038]

[0040] The siloxane polymer may also contain reactive functional groups such as one or more of vinyl groups, hydroxyl groups, hydride, isocyanate groups, epoxy groups, acid groups, halogen atoms, alkoxy groups (e.g., methoxy, ethoxy, and propoxy), acyloxy groups (e.g., acetoxy and octanoyloxy), ketoximate groups (e.g., dimethylketoxime, methylketoxime, and methylethylketoxime), amino groups (e.g., dimethylamino, diethylamino, and butylamino), amide groups (e.g., N-methylacetamide and N-ethylacetamide), acid amide groups, amino-oxy groups, mercapto groups, alkenyloxy groups (e.g., vinyloxy, isopropenyloxy, and 1-ethyl-2-methylvinyloxy), alkoxyalkoxy groups (e.g., methoxyethoxy, ethoxyethoxy, and methoxypropoxy), aminoxy groups (e.g., dimethylaminooxy and diethylaminooxy), mercapto groups, and the like, on at least some of the siloxane monomer units of the polymer.

[0039]

[0041] Regardless of their specific structure, siloxane polymers typically have relatively high molecular weights, reducing their likelihood of migration or diffusion to the surface of the polymer composition, thereby further minimizing the possibility of phase separation. For example, siloxane polymers typically have a weight average molecular weight of about 100,000 grams per mole or greater, in some embodiments about 200,000 grams per mole or greater, and in some embodiments, from about 500,000 grams per mole to about 2,000,000 grams per mole. Siloxane polymers may also have relatively high kinematic viscosities, such as about 10,000 centistokes or greater, in some embodiments about 30,000 centistokes or greater, and in some embodiments, from about 50,000 to about 500,000 centistokes.

[0040]

[0042] If desired, silica particles (e.g., fumed silica) can also be utilized in combination with the siloxane polymer to help improve its ability to disperse in the composition. Such silica particles can range, for example, from about 5 nanometers to about 50 nanometers in particle size, and have a density of about 50 square meters per gram (m 2 / g) ~ approx. 600m 2 / g of surface area, and / or approximately 160 kilograms per cubic meter (kg / m 3 ) ~ approx. 190kg / m 3 The silica particles may have a density of about 100 to about 100 parts by weight, and in some embodiments, about 20 to about 60 parts by weight, per 100 parts by weight of the siloxane polymer. In one embodiment, the silica particles can be combined with the siloxane polymer and then added to the polymer composition. For example, a mixture comprising ultra-high molecular weight polydimethylsiloxane and fumed silica can be incorporated into the polymer composition. Such a preformed mixture is available as Genioplast® Pellet S from Wacker Chemie, AG.

[0041]

[0043] One benefit of the present invention is that polymer compositions can be readily plated without the use of conventional laser-activatable spinel crystals, which generally have the formula AB2O4, where A is a metal cation having a valence of 2 (e.g., cadmium, chromium, manganese, nickel, zinc, copper, cobalt, iron, magnesium, tin, or titanium) and B is a metal cation having a valence of 3 (e.g., chromium, iron, aluminum, nickel, manganese, or tin). Generally, A in the above formula provides the major cation component of the first metal oxide cluster, and B provides the major cation component of the second metal oxide cluster. For example, the first metal oxide cluster generally has a tetrahedral structure, and the second metal oxide cluster generally has an octahedral structure. Specific examples of such spinel crystals include, for example, MgAl2O4, ZnAl2O4, FeAl2O4, CuFe2O4, CuCr2O4, MnFe2O4, NiFe2O4, TiFe2O4, FeCr2O4, or MgCr2O4. The polymer composition may be free of such spinel crystals (i.e., 0 wt.%), or such crystals may be present in only trace concentrations, such as about 1 wt.% or less, in some embodiments about 0.5 wt.% or less, and in some embodiments, in an amount of about 0.001 wt.% to about 0.2 wt.%.

[0042] II. Formation

[0044] The components of the polymer composition (e.g., aromatic polymer, conductive filler, mineral filler, etc.) can be melt-processed or blended together. The components can be fed separately or in combination into an extruder that includes at least one screw rotatably mounted and housed within a barrel (e.g., a cylindrical barrel) and can define a feed section and a melt section downstream of the feed section along the length of the screw. The extruder can be a single-screw or twin-screw extruder. The screw speed can be selected to achieve the desired residence time, shear rate, melt-processing temperature, etc. For example, the screw speed can range from about 50 to about 800 revolutions per minute ("rpm"), in some embodiments from about 70 to about 150 rpm, and in some embodiments from about 80 to about 120 rpm. Additionally, the apparent shear rate during melt blending can be about 100 s -1 ~about 10,000 seconds -1 , in some embodiments, about 500 seconds -1 ~about 5000 seconds -1 , in some embodiments, about 800 seconds -1 ~about 1200 seconds -1 The apparent shear rate may be in the range of 4Q / πR 3 (where Q is the volumetric flow rate of the polymer melt (m 3 / sec"), where R is the radius ("m") of the capillary (e.g., extruder die) through which the molten polymer flows.

[0043]

[0045] Regardless of the particular method by which it is formed, the resulting polymer composition can have excellent thermal properties. For example, the melt viscosity of the polymer composition can be low enough so that the polymer composition can easily flow into a mold cavity having small dimensions. In one particular embodiment, the polymer composition can be melted at a temperature of 1000 s. -1The composition may have a melt viscosity of from about 10 to about 250 Pa·s, in some embodiments from about 15 to about 200 Pa·s, in some embodiments from about 20 to about 150 Pa·s, and in some embodiments from about 30 to about 100 Pa·s, determined at a shear rate of from about 10 to about 250 Pa·s, in some embodiments from about 15 to about 200 Pa·s, in some embodiments from about 20 to about 150 Pa·s, and in some embodiments from about 30 to about 100 Pa·s. The melt viscosity may be determined according to ISO Test No. 11443:2005 at a temperature 15°C above the melt temperature of the composition (e.g., about 340°C for a melt temperature of about 325°C).

[0044] III. Electronic Devices

[0046] As indicated above, the polymer composition of the present invention is applied to a substrate molded onto a "singulated" carrier portion and having conductive traces plated thereon. As used herein, the term "singulated" generally means that the carrier portion is separated from a larger carrier (e.g., bonded or continuous). The substrate may be formed using a variety of different techniques. Suitable techniques include, for example, injection molding, low-pressure injection molding, extrusion compression molding, gas injection molding, foam injection molding, low-pressure gas injection molding, low-pressure foam injection molding, gas extrusion compression molding, foam extrusion compression molding, extrusion molding, foam extrusion molding, compression molding, foam compression molding, gas compression molding, and the like. For example, an injection molding system may be used that includes a mold into which the polymer composition can be injected. The time in the injector can be controlled and optimized to prevent pre-solidification of the polymer matrix. Once the cycle time is reached and the barrel is full for ejection, a piston may be used to inject the composition into the mold cavity. Compression molding systems may also be used. Similar to injection molding, the polymer composition is also formed into the desired article in a mold. The composition may be placed in a compression mold using any known technique, such as by being picked up by an automated robotic arm. The temperature of the mold may be maintained above the solidification temperature of the polymer matrix for a desired time to allow solidification. The molded article may then be solidified by lowering the temperature below the melting point. The resulting article may be demolded. The cycle time of each molding process may be tailored to the polymer matrix to achieve sufficient bonding and improve overall process productivity.

[0045]

[0047] A flow diagram of an embodiment of a manufacturing process that can be used to form the electronic device of the present invention is shown in FIG. 1. As shown in step 1, a carrier 40 is provided that includes an outer region from which arms 56 extend to form a lead frame 54. As shown in FIG. 4, the carrier 40 may be unwound, for example, from a bulk source reel 68a and then collected on a secondary reel 68b. The carrier 40 is typically formed from a metal (e.g., copper or a copper alloy) or other suitable conductive material. If desired, the arms 56 may also include openings 58 formed therein. Carrier holes 52 may also be located on the outer portion of the carrier 40 to allow the carrier 40 to be continuously traversed along a manufacturing line. In step 2, a substrate 42, which may be formed from the polymer composition of the present invention, may then be molded (e.g., overmolded) onto the lead frame 54. Openings 60 corresponding to the openings 58 of the fingers 56 may be formed in the substrate 42.

[0046]

[0048] Once the substrate 42 is molded onto the lead frame 54, conductive circuit traces may then be formed. Such traces may be formed by various known metal deposition techniques, such as plating (e.g., electroplating, electroless plating, etc.), printing (e.g., digital printing, aerosol jet printing, etc.), etc. If desired, a seed layer may first be formed on the substrate to facilitate the metal deposition process. For example, in steps 3 and 3A of FIG. 1 , a seed layer 44 may first be deposited on the surface of the substrate 42, thereby electrically connecting the internal bus bars 43 formed by the carrier 40 to the seed layer 44. The seed layer 44 may then be deposited with a metal (e.g., copper, nickel, gold, silver, tin, lead, palladium, etc.) to form the portion 46 containing the electronic circuit traces 62 (step 4). In one embodiment, electroplating may be performed, for example, by applying an electric potential to the carrier 40 and then placing it in an electroplating bath. Vias may also be optionally molded into the surface of the substrate to create electrical paths between the traces and the internal layers of the circuitry. These traces create "electrical bus bars" on the carrier portion, allowing the traces to be plated after the application of the deposited conductive paste. If desired, the surface of the substrate may be roughened and then plated using various known techniques, such as laser ablation, plasma etching, ultraviolet treatment, or fluorination. Among other things, such roughening helps to facilitate plating in the desired interconnect pattern. For example, with reference to FIG. 5 , one embodiment of a process utilizing a laser for this purpose is shown in more detail. More specifically, as shown in step 9, a laser 70 may first be used to ablate the surface of substrate 42 to create channels 72 that will form interconnect pattern 66. In step 10, conductive paste 74 may then be placed within channels 72 by any known technique, such as an inkjet process, an aerosol process, or a screening process. Alternatively, a plating process (e.g., electroless plating) may be used instead of and / or in addition to the use of paste.However, if utilized, to help ensure that the paste 74 adheres adequately to the substrate 42, the deposited paste 74 may optionally be sintered via laser or flash heat 76, as illustrated in step 11. Once optionally sintered, the paste 74 is plated (e.g., electroplated) to form the electronic circuit traces 62, as shown in step 12.

[0047]

[0049] Referring again to FIG. 1 , after plating, an electrical device can be formed by connecting one or more electrical components 50 to the substrate 42 (step 6) using any of a variety of techniques, such as soldering or wire bonding. In certain embodiments, a solder mask 48 can optionally be applied (step 5) before connecting the components 50. The resulting electronic device can then be separated from the carrier 40. FIGS. 2-3 , for example, illustrate one embodiment of the electronic device 22 at various stages of formation. Step A, for example, illustrates the carrier 40 before molding. Step B illustrates the substrate 42 after it has been molded onto the carrier portion 40 and electronic circuit traces 62 have been applied. Steps C and D may add optional pin contacts and circuit metallization to form a completed electronic device (step E). The completed electronic device 22 can then be separated from the adjacent carrier 40, as shown in FIG. 3 , to form the electronic device 22 containing the singulated carrier portion 40. The resulting electronic devices may contain various types of electronic components, such as housings for light sources (e.g., light emitting diodes ("LEDs")) for lights, tunnel lights, headlamps, etc., or other electronic devices such as those used in computers, phones, electronic controllers, etc. Such products may be particularly useful in vehicles (e.g., cars, buses, motorcycles, boats, etc.), such as electric vehicles (EVs), hybrid electric vehicles (HEVs), plug-in hybrid electric vehicles (PHEVs), or other types of vehicles that use electric power for propulsion (collectively referred to as "electric vehicles").

[0048]

[0050] For example, referring to FIGS. 7-8 , one embodiment of an electronic product in the form of a light 20 for use in an automotive product is shown. The light 20 includes a housing 24, an electronic device 22 (see also FIG. 2 ), and a light pipe 28. The housing 24 may be formed of two pieces 24a and 24b, as shown in FIG. 8 . The housing 24 has a wall 32 forming a passageway 34 therethrough and an opening 36 extending through the wall 32 and communicating with the passageway 34. The opening 36 may be transverse to the passageway 34. The electronic device 22 may be mounted within the passageway 34 of the housing 30. The light pipe 28 extends through the opening 36 in the housing 30 and is mounted over a light-emitting diode (LED) 38, which may be formed as one or more of the electronic components 50 of the electronic device 22 as described herein. FIG. 6 illustrates an exemplary process for forming the light 20. Steps 7 and 8 illustrate, for example, the electronic device 22 being singulated from other devices and assembled with the housing 24 and light pipe 28. After device 22 is formed, it is mounted within passage 34 and parts 24a and 24b of housing 24 are assembled together, leaving pin contacts 64 exposed. Light pipe 28 is mounted through opening 36 in housing 24 and is positioned above LED 38.

[0049]

[0051] The present invention may be better understood with reference to the following examples. [Example]

[0050] Test Method

[0052] Melt viscosity: Melt viscosity (Pa s) was measured using a Dynisco LCR7001 capillary rheometer at a shear rate of 1,000 s -1 and 15°C above the melt temperature, may be determined in accordance with ISO Test No. 11443:2014. The rheometer orifice (die) had a diameter of 1 mm, a length of 20 mm, an L / D ratio of 20.1, and an entrance angle of 180°. The barrel diameter was 9.55 mm + 0.005 mm, and the rod length was 233.4 mm.

[0051]

[0053] Melting Temperature: The melting temperature ("Tm") may be determined by differential scanning calorimetry ("DSC") as known in the art. The melting temperature is the differential scanning calorimetry (DSC) peak melting temperature as determined by ISO Test No. 11357-2:2018. Based on the DSC procedure, samples were heated and cooled at 20°C per minute, as described in ISO Standard 10350, using DSC measurements performed on a TA Q2000 instrument.

[0052]

[0054] Deflection Temperature Under Load ("DTUL"): Deflection temperature under load may be determined according to ISO Test No. 75-2:2013 (technically equivalent to ASTM D648). More specifically, a specimen sample 80 mm long, 10 mm thick, and 4 mm wide may be subjected to an edgewise three-point bend test at a specified load (maximum external fiber stress) of 1.8 megapascals. The specimen is lowered into a silicone oil bath and the temperature is increased at 2°C per minute until the specimen deflects 0.25 mm (0.32 mm per ISO Test No. 75-2:2013).

[0053]

[0055] Tensile modulus, tensile stress, and tensile elongation: Tensile properties may be tested according to ISO Test No. 527:2019 (technically equivalent to ASTM D638). Modulus and strength measurements may be performed on the same specimen sample, 80 mm long, 10 mm thick, and 4 mm wide. The test temperature may be 23°C, and the test speed may be 1 or 5 mm / min.

[0054]

[0056] Flexural Modulus, Flexural Stress, and Flexural Elongation: Flexural properties may be tested according to ISO Test No. 178:2019 (technically equivalent to ASTM D790). This test may be performed on a 64 mm support span. Testing may be performed on the center of an uncut ISO 3167 multipurpose bar. The test temperature may be 23°C, and the test speed may be 2 mm / min.

[0055]

[0057] Unnotched and Notched Charpy Impact Strength: Charpy properties may be tested according to ISO Test No. ISO 179-1:2010 (technically equivalent to ASTM D256-10, Method B). This test may be performed using a Type 1 specimen size (80 mm length, 10 mm width, and 4 mm thickness). When testing notched impact strength, the notch may be a Type A notch (0.25 mm base radius). Specimens may be cut from the center of the multipurpose bar using a single-tooth milling machine. The test temperature may be 23°C.

[0056]

[0058] Dielectric constant ("Dk") and dissipation factor ("Df"): The dielectric constant (or relative static permittivity) and dissipation factor are determined by Baker-Jarvis et al., IEEE Trans. on Dielectric and Electrical Insulation, 5(4), 571 (1998) and Krupka et al., Proc. th It is determined using a known split-post dielectric resonance method, such as that described in International Conference on Dielectric Materials: Measurements and Applications, IEEE Conference Publication No. 430 (September 1996). More specifically, a plate-shaped sample measuring 80 mm x 90 mm x 3 mm was inserted between two fixed dielectric resonators. The resonators measured the dielectric constant components at the surface of the specimen. Five samples were tested, and the average value was recorded. The split-post resonator can be used to perform dielectric measurements in the low gigahertz range, e.g., from 2 GHz to 1 GHz.

[0057]

[0059] Thermal cycling test: The specimen is placed in a temperature-controlled chamber and heated / cooled within a temperature range of -30°C to 100°C. The specimen is first heated until it reaches a temperature of 100°C, at which point it is immediately cooled. When the temperature reaches -30°C, the specimen is immediately heated again until it reaches 100°C. 23 heating / cooling cycles may be performed over a 3-hour period.

[0058]

[0060] Surface / Volume Resistivity: Surface and volume resistivity values ​​can be determined according to IEC 62631-3-1:2016 or ASTM D257-14. According to this procedure, a standard specimen (e.g., a 1-meter cube) is placed between two electrodes. A voltage is applied for 60 seconds, and the resistance is measured. Surface resistivity is the quotient of the potential gradient (in V / m) and the current per unit electrode length (in A / m), and generally represents the resistance to leakage current along the surface of an insulating material. Because the four edges of the electrode define a square, the length is reduced in the quotient to report surface resistivity in ohms, although it is common to see the more descriptive unit ohms per square. Volume resistivity is also determined as the ratio of the potential gradient parallel to the current flow in the material to the current density. In SI units, volume resistivity is numerically equal to the DC resistance (ohm·m or ohm·cm) between the opposing faces of a 1-meter cube of that material.

[0059] Example 1

[0061] Samples 1-4 are formed from various percentages of liquid crystal polymers ("LCP1" and "LCP2"), wollastonite fiber (Nyglos™ 8), carbon black pigment, carbon fiber, and lubricant (Glycolube™ P). LCP1 is formed from 60 mol.% HBA, 5 mol.% HNA, 12 mol.% BP, 17.5 mol.% TA, and 5 mol.% APAP. LCP2 is formed from 73 mol.% HBA and 27 mol.% HNA. Compounding was performed using an 18 mm single screw extruder. Parts were injection molded and samples were cut into plaques (60 mm x 60 mm).

[0060] [Table 1]

[0061]

[0062] Samples 1-4 were tested for thermal and mechanical properties, and the results are listed in Table 2 below.

[0062] [Table 2]

[0063]

[0063] Samples 3 and 4 were also subjected to the thermal cycle test described above. After the test, the dielectric loss tangents obtained for the samples were determined to be 0.021 and 0.015, respectively. Therefore, the ratios of the dielectric loss tangents of Samples 3 and 4 after the thermal cycle test to the initial dielectric loss tangents were 1.24 and 0.86, respectively. After the test, the dielectric constants obtained for the samples were determined to be 12.9 and 12.6, respectively. Therefore, the ratios of the dielectric constants of Samples 3 and 4 after the thermal cycle test to the initial dielectric constants were 0.98 and 1.01, respectively.

[0064] Example 2 Samples 5-9 are formed from various percentages of liquid crystal polymers ("LCP1" and "LCP2"), Nyglos™ 8, carbon black pigment, graphite, and Glycolube™ P. Compounding was performed using an 18 mm single screw extruder. Parts were injection molded and samples were molded into plaques (60 mm x 60 mm).

[0065] [Table 3]

[0066]

[0065] Samples 5-9 were tested for thermal and mechanical properties, and the results are listed in Table 4 below.

[0067] [Table 4]

[0068]

[0066] Samples 5 to 7 were also subjected to the thermal cycle test described above. After the test, the dielectric loss tangents obtained for the samples were determined to be 0.0578, 0.0214, and 0.0098, respectively. Therefore, the ratios of the dielectric loss tangents after the thermal cycle test to the initial dielectric loss tangents of Samples 5, 6, and 7 were 1.17, 1.06, and 1.09, respectively. After the test, the dielectric constants obtained for the samples were determined to be 12.6, 8.9, and 6.3, respectively. Therefore, the ratios of the dielectric constants after the thermal cycle test to the initial dielectric constants of Samples 5, 6, and 7 were 1.0, 1.0, and 1.0, respectively.

[0069]

[0067] These and other modifications and variations of the present invention may be practiced by those skilled in the art without departing from the spirit and scope of the present invention. Moreover, it should be understood that aspects of the various embodiments are interchangeable, both in whole or in part. Moreover, those skilled in the art will appreciate that the foregoing description is merely illustrative and therefore does not limit the invention as further described in such appended claims. The claims as filed are as follows: [Claim 1] 1. An electronic device comprising: singulated carrier portions; a substrate molded onto the singulated carrier portion, the substrate comprising a polymer composition comprising an aromatic polymer and a conductive filler, the polymer composition having a molecular weight of about 1×10 determined in accordance with ASTM D257-14; 12 ohm ~ approx. 1 x 10 18 said substrate exhibiting a surface resistivity in ohms; and Conductive traces disposed on the substrate The electronic device comprising: [Claim 2] The polymer composition has a viscosity of 1×10 determined in accordance with ASTM D257-14 10 ohm·m ~ approx. 1×10 16 10. The electronic device of claim 1, exhibiting a volume resistivity of ohm·m. [Claim 3] The electronic device of claim 1 , wherein the polymer matrix comprises about 30 wt.% to about 80 wt.% of the polymer composition. [Claim 4] The electronic device of claim 1 , wherein the aromatic polymer has a melting temperature of about 200° C. or greater. [Claim 5] 10. The electronic device of claim 1, wherein the aromatic polymer is a polyamide, a polyester, a polyarylene sulfide, a polycarbonate, a polyphenylene oxide, a polyetherimide, a liquid crystal polymer, or a combination thereof. [Claim 6] The electronic device of claim 1 , wherein the aromatic polymer comprises a liquid crystal polymer. [Claim 7] 7. The electronic device of claim 6, wherein the liquid crystal polymer contains one or more repeat units derived from an aromatic hydroxycarboxylic acid, the hydroxycarboxylic acid repeat units comprising at least about 40 mol.% of the polymer. [Claim 8] 8. The electronic device of claim 7, wherein the liquid crystal polymer contains repeat units derived from 4-hydroxybenzoic acid, 6-hydroxy-2-naphthoic acid, or a combination thereof. [Claim 9] 8. The electronic device according to claim 7, wherein the liquid crystal polymer contains repeating units derived from 4-hydroxybenzoic acid in an amount of about 30 mol.% to about 90 mol.% of the polymer and repeating units derived from 6-hydroxy-2-naphthoic acid in an amount of about 1 mol.% to about 30 mol.% of the polymer. [Claim 10] 8. The electronic device of claim 7, wherein the liquid crystal polymer further contains repeat units derived from terephthalic acid, isophthalic acid, 2,6-naphthalenedicarboxylic acid, hydroquinone, 4,4'-biphenol, acetaminophen, 4-aminophenol, or combinations thereof. [Claim 11] The electronic device of claim 1 , wherein the conductive filler comprises a carbon material. [Claim 12] 12. The electronic device of claim 11, wherein the carbon material has a volume resistivity of less than about 0.1 ohm-cm. [Claim 13] 12. The electronic device of claim 11, wherein the carbon material comprises graphite, carbon black, carbon fiber, graphene, carbon nanotubes, or a combination thereof. [Claim 14] 10. The electronic device of claim 1, wherein the conductive filler is present in the polymer composition in an amount of about 0.5 to about 20 parts by weight per 100 parts by weight of the polymer matrix. [Claim 15] The electronic device of claim 1 , wherein the polymer composition further comprises a mineral filler. [Claim 16] 16. The electronic device of claim 15, wherein the mineral filler is present in the polymer composition in an amount of about 10 to about 80 parts by weight per 100 parts by weight of the polymer matrix. [Claim 17] 16. The electronic device of claim 15, wherein the weight ratio of the mineral filler to the conductive filler ranges from about 2 to about 500. [Claim 18] 16. The electronic device of claim 15, wherein the mineral filler comprises mineral particles, mineral fibers, or a combination thereof. [Claim 19] 20. The electronic device of claim 18, wherein the mineral particles comprise talc, mica, or a combination thereof. [Claim 20] 20. The electronic device of claim 18, wherein the mineral fibers comprise wollastonite. [Claim 21] 19. The electronic device of claim 18, wherein the mineral fibers have a median diameter of about 1 to about 35 micrometers. [Claim 22] 20. The electronic device of claim 18, wherein the mineral fibers have an aspect ratio of about 1 to about 50. [Claim 23] The polymer composition is -110. The electronic device of claim 1, wherein the composition has a melt viscosity of about 10 to about 250 Pa·s as determined according to ISO Test No. 11443:2014 at a shear rate of 100°C and a temperature 15°C above the melting temperature of the composition. [Claim 24] The electronic device of claim 1 , wherein the singulated carrier portion comprises a metal. [Claim 25] 10. The electronic device of claim 1, wherein the substrate contains a channel having a seed layer disposed therein, and further wherein circuit traces are disposed on the seed layer. [Claim 26] 26. The electronic device of claim 25, wherein the channel is formed by a laser. [Claim 27] 10. The electronic device of claim 1, wherein the polymer composition exhibits a dielectric constant of about 4 or greater and a dissipation factor of about 0.3 or less, determined at a frequency of 2 GHz. [Claim 28] 28. The electronic device of claim 27, wherein the composition exhibits a dielectric constant after exposure to a temperature cycle of about −30° C. to about 100° C., and the ratio of the dielectric constant after the temperature cycle to the dielectric constant before the thermal cycle is about 0.8 or more. [Claim 29] 28. The electronic device of claim 27, wherein the composition exhibits a dielectric loss tangent after exposure to a temperature cycle of about −30° C. to about 100° C., wherein the ratio of the dielectric loss tangent after the temperature cycle to the dielectric loss tangent before the thermal cycle is about 1.3 or less. [Claim 30] The polymer composition of claim 1 , wherein the polymer composition is free of spinel crystals. [Claim 31] molding the substrate onto a carrier; forming a seed layer on the substrate; and depositing metal onto the seed layer to form conductive traces; 10. A method for forming the electronic device of claim 1, comprising: [Claim 32] 32. The method of claim 31, further comprising electrically connecting a component to the conductive traces to form a device and separating the device from the carrier. [Claim 33] 32. The method of claim 31 , wherein the traces are formed by a process including ablating the substrate with a laser and then forming the seed layer. [Claim 34] 32. The method of claim 31 , wherein the seed layer comprises a conductive paste.

Claims

1. 1. An electronic device comprising: singulated carrier portions; a substrate molded onto the singulated carrier portion, the substrate being an aromatic polymer; and a conductive filler, wherein the polymer composition meets ASTM Approximately 4.2 x 10 determined in accordance with D257-14 １５ ohm to approximately 1 x 10 １８ Ohm's the substrate exhibiting a surface resistivity; and Conductive traces disposed on the substrate The electronic device comprising:

2. The polymer composition has a viscosity of 1×10 determined in accordance with ASTM D257-14 １０ O Room m to approximately 1 x 10 １６ 10. The electronic device of claim 1, which exhibits a volume resistivity of ohm-m. vinegar.

3. The polymer matrix comprises about 30 wt. % to about 80 wt. % of the polymer composition. The electronic device according to claim 1 .

4. 10. The electronic device of claim 1, wherein the aromatic polymer has a melting temperature of about 200°C or greater. Chair.

5. The aromatic polymer may be polyamide, polyester, polyarylene sulfide, poly Carbonate, polyphenylene oxide, polyetherimide, liquid crystal polymer, or The electronic device according to claim 1, which is a combination of the above.

6. The electronic device of claim 1 , wherein the aromatic polymer comprises a liquid crystal polymer.

7. The liquid crystal polymer is a polymer having one or more repeating units derived from an aromatic hydroxycarboxylic acid. units, and the hydroxycarboxylic acid repeating units constitute about 40 mol of the polymer.

7. The electronic device according to claim 6, wherein the SiO 2 content is 0.05% or more.

8. The liquid crystal polymer is 4-hydroxybenzoic acid, 6-hydroxy-2-naphthoic acid, or The electronic device according to claim 7, comprising repeating units derived from any one of the following: 。

9. The liquid crystal polymer contains a repeating unit derived from 4-hydroxybenzoic acid. 6-hydroxy-2-naphthoic acid in an amount of about 30 mol. % to about 90 mol. % The repeating units derived from the above are contained in an amount of about 1 mol. % to about 30 mol. % of the polymer. The electronic device according to claim 7 .

10. The liquid crystal polymer is a polymer of terephthalic acid, isophthalic acid, and 2,6-naphthalenedicarboxylic acid. , hydroquinone, 4,4'-biphenol, acetaminophen, 4-aminophenol or a combination thereof. Child devices.

11. The electronic device of claim 1 , wherein the conductive filler comprises a carbon material.

12. 12. The carbon material of claim 11, wherein the carbon material has a volume resistivity of less than about 0.1 ohm-cm. Electronic devices.

13. The carbon material may be graphite, carbon black, carbon fiber, graphene, or carbon 12. The electronic device of claim 11, comprising nanotubes or a combination thereof.

14. The conductive filler comprises from about 0.5 to about 20 parts by weight per 100 parts by weight of the polymer matrix. The electronic device of claim 1 , wherein the polymer composition is present in an amount of parts by weight.

15. The electronic device of claim 1 , wherein the polymer composition further comprises a mineral filler.

16. The mineral filler may comprise from about 10 to about 80 parts by weight of the mineral filler per 100 parts by weight of the polymer matrix.

16. The electronic device of claim 15, wherein the polymer composition is present in an amount of 0.1 parts.

17. The weight ratio of the mineral filler to the conductive filler is in the range of about 2 to about 500.

16. The electronic device of claim 15.

18. 16. The method of claim 15, wherein the mineral filler comprises mineral particles, mineral fibers, or a combination thereof.

2. The electronic device according to claim 1 .

19. 19. The electrode of claim 18, wherein the mineral particles comprise talc, mica, or a combination thereof. Child devices.

20. 20. The electronic device of claim 18, wherein the mineral fibers comprise wollastonite.

21. 19. The method of claim 18, wherein the mineral fibers have a median diameter of about 1 to about 35 micrometers. Electronic devices.

22. 19. The electronic device of claim 18, wherein the mineral fibers have an aspect ratio of about 1 to about 50. vinegar.

23. The polymer composition is －１ and the melt temperature of the composition Approximately 10°C as determined according to ISO Test No. 11443:2014 at a temperature 15°C above The electronic device of claim 1 having a melt viscosity of about 250 Pa·s.

24. The electronic device of claim 1 , wherein the singulated carrier portion comprises a metal.

25. The substrate includes a channel having a seed layer disposed therein and further includes a circuit trace disposed thereon. The electronic device of claim 1 disposed on the seed layer.

26. 26. The electronic device of claim 25, wherein the channel is formed by a laser.

27. The polymer composition has a dielectric constant of about 4 or greater, determined at a frequency of 2 GHz, and a dielectric constant of about 0 10. The electronic device of claim 1, exhibiting a dissipation factor of 0.3 or less.

28. The composition exhibits a dielectric constant after being exposed to a temperature cycle of about -30°C to about 100°C. and the ratio of the dielectric constant after the thermal cycle to the dielectric constant before the thermal cycle is about 0.8 or more.

28. The electronic device of claim 27, wherein:

29. The composition exhibits a dielectric loss tangent after exposure to a temperature cycle of about -30°C to about 100°C. and the ratio of the dielectric loss tangent after the thermal cycle to the dielectric loss tangent before the thermal cycle is about 1.3 or less.

28. The electronic device of claim 27, wherein:

30. The polymer composition of claim 1 , wherein the polymer composition is free of spinel crystals.

31. molding the substrate onto a carrier; forming a seed layer on the substrate; and depositing metal onto the seed layer to form conductive traces; 10. A method for forming the electronic device of claim 1, comprising:

32. Components are electrically connected to the conductive traces to form a device, and 32. The method of claim 31 further comprising isolating the device.

33. The traces are laser ablated into the substrate, followed by the formation of the seed layer.

32. The method of claim 31 , wherein the ion implantation step is performed by a process comprising the steps of:

34. 32. The method of claim 31 , wherein the seed layer comprises a conductive paste.

35. The electronic device of claim 9, wherein the liquid crystal polymer contains repeat units derived from 6-hydroxy-2-naphthoic acid in an amount of about 1 mol. % to about 8 mol. % of the polymer.

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