Optical Module

Abstract

To provide an optical module capable of increasing the degree of freedom of layout of each member including an optical element in the optical module, saving space for the layout of each member, and shortening the length of a wiring wire.SOLUTION: An optical module 1 according to the present disclosure includes a light receiving element 43, a first optical component 30 optically coupled with the light receiving element 43, second optical components 20 and 60 optically coupled with the first optical component 30, a receptacle to which an optical fiber that transmits incident light to the second optical components 20 and 60 is connected, a terminal portion 12 that electrically outputs an output signal of the light receiving element 43 to the outside, and a package 10 that houses the light receiving element 43 and the first and second optical components 30, 20, and 60, and includes the receptacle on the first surface, and the terminal portion 12 on the second surface facing the first surface, where a wiring 35 extending from the first surface side to the second surface side and electrically connecting the second optical component and the terminal portion is provided.SELECTED DRAWING: Figure 1A

Description

[Technical Field]

[0001] The present disclosure relates to optical modules. [Background technology]

[0002] In recent years, with the demand for faster communication speeds, optical modules used in optical transceivers and the like are required to support transmission speeds of 40 Gbps or 100 Gbps. Such high-speed transmission often uses wavelength-multiplexed light, which multiplexes multiple signal lights with different wavelengths. For example, the optical module disclosed in Patent Document 1 has various optical elements and a photodetector mounted within a package.

[0003] As shown in FIG. 8, the optical receiving module 80 of Patent Document 1 has a converging lens section 81, an optical branching section 82, a wavelength separation section 83, a condenser lens 84, and a light receiving section 85 provided on an optical base in a package. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2009-198958 Summary of the Invention [Problem to be solved by the invention]

[0005] When adding additional optical elements to the package to enhance the functionality of the optical receiving module, the optical receiving module described in Patent Document 1 faces the problem of layout constraints for the added optical elements and the need to route the wiring wires over a long distance. For example, when a mechanical vibration of several kHz is applied to an optical receiving module with a wire length exceeding 4 mm, the frequency of the mechanical vibration matches the natural frequency of the wire, causing problems such as wire breakage or short circuits due to resonance. For this reason, it is necessary to shorten the wire length to 4 mm or less.

[0006] The present disclosure has been made in consideration of these circumstances, and aims to provide an optical module that increases the degree of freedom in the layout of each component, including the optical elements, in the optical module, saves space in the layout of each component, and further shortens the length of the wiring wires. [Means for solving the problem]

[0007] The optical module according to the present disclosure includes an optical element, a first optical component optically coupled to the optical element, and a second optical component optically coupled to the first optical component; a support substrate on a back surface opposite to a main surface of which the first optical component is disposed; a wiring board on a main surface of the support substrate facing the back surface of the support substrate, the wiring board being provided with wiring; and a support portion that supports the support substrate and the wiring board; a receptacle to which an optical fiber that transmits incident light to the second optical component is connected; a terminal portion that electrically outputs an output signal of the optical element to the outside; and a package that accommodates the optical element, the first optical component, and the second optical component and has the receptacle on a first surface and the terminal portion on a second surface opposite to the first surface, and the wiring is The second surface side and electrically connects the second optical component and the terminal portion. The back surface of the wiring board opposite to the main surface has a hollow structure with a gap between it and the bottom surface of the package. . [Effects of the Invention]

[0008] According to the present disclosure, it is possible to increase the degree of freedom in the layout of each member including the optical elements in the optical module, to save space in the layout of each member, and further to shorten the length of the wiring wires. [Brief explanation of the drawings]

[0009] [Figure 1A] FIG. 1 is a perspective plan view of an optical module according to a first embodiment of the present disclosure. [Figure 1B] FIG. 1B is a perspective side view of the optical module shown in FIG. 1A. [Figure 1C] 1B is a cross-sectional view of the optical module shown in FIG. 1A along IC-IC. [Figure 2] FIG. 1B is a partially enlarged view of the optical module of FIG. 1A. [Figure 3A] FIG. 10 is a perspective plan view of an optical module according to a second embodiment of the present disclosure. [Figure 3B] FIG. 3B is a perspective side view of the optical module shown in FIG. 3A. [Figure 4A] FIG. 10 is a perspective plan view of an optical module according to a third embodiment of the present disclosure. [Figure 4B] FIG. 4B is a perspective side view of the optical module shown in FIG. 4A. [Figure 5A] FIG. 10 is a perspective plan view of an optical module according to a fourth embodiment of the present disclosure. [Figure 5B] FIG. 5B is a perspective side view of the optical module shown in FIG. 5A. [Figure 6A] FIG. 10 is a perspective plan view of an optical module according to a fifth embodiment of the present disclosure. [Figure 6B] FIG. 6B is a perspective side view of the optical module shown in FIG. 6A. [Figure 7A] FIG. 10 is a perspective plan view of an optical module according to a sixth embodiment of the present disclosure. [Figure 7B] FIG. 7B is a perspective side view of the optical module shown in FIG. 7A. [Figure 8] FIG. 1 is a diagram illustrating a conventional technique. DETAILED DESCRIPTION OF THE INVENTION

[0010] [Description of the embodiments of the present disclosure] First, embodiments of the present disclosure will be listed and described. (1) An optical module according to the present disclosure includes an optical element, a first optical component optically coupled to the optical element, and a second optical component optically coupled to the first optical component; a support substrate on a back surface opposite to a main surface of which the first optical component is disposed; a wiring board on a main surface of the support substrate facing the back surface of the support substrate, the wiring board being provided with wiring; and a support portion that supports the support substrate and the wiring board; a receptacle to which an optical fiber that transmits incident light to the second optical component is connected; a terminal portion that electrically outputs an output signal of the optical element to the outside; and a package that accommodates the optical element, the first optical component, and the second optical component and has the receptacle on a first surface and the terminal portion on a second surface opposite to the first surface, and the wiring is The second surface side and electrically connects the second optical component and the terminal portion. The back surface of the wiring board opposite to the main surface has a hollow structure with a gap between it and the bottom surface of the package.Here, the optical element may be a light receiving element or a light emitting element, for example, a VCSEL, which is a surface emitting element. If the optical element is a light receiving element, the first optical component may be, for example, an optical demultiplexer, and if the optical element is a light emitting element, for example, an optical multiplexer that multiplexes light output from multiple light emitting elements may be used.

[0011] This allows the second optical component and the terminal portion to be electrically connected using wiring that extends from the first surface side to the second surface side and electrically connects the second optical component and the terminal portion, making it possible to achieve a layout in which the first optical component is disposed between the second optical component and the terminal portion, and also to save space in the layout of each component. Furthermore, even with this layout, since the second optical component and the terminal portion are electrically connected using wiring, the length of the wiring wire can be shortened, specifically to 4 mm or less. By keeping the wire length 4 mm or less, the natural frequency of the wire is made different from the frequency of the mechanical vibration applied to the optical module, thereby preventing resonance of the wire and preventing wire breakage and short circuits in the wire. Furthermore, by providing a support portion on the side surface of the optical demultiplexer, the wiring board can be freely laid out in the space between the first optical component and the bottom surface of the package. For example, by laying out the wiring board in the space between the first optical component and the bottom surface of the package so as to have a hollow structure with a gap between it and the bottom surface of the package, the degree of freedom in the layout of each component can be further increased, the layout of each component can be space-saving, and the length of the wiring wires can be shortened.

[0012] (2) In the optical module disclosed herein, the optical element is a light-receiving element, and the first optical component includes an optical demultiplexer that demultiplexes the output light from the second optical component into multiple wavelengths. This allows for a layout in which an optical demultiplexer that demultiplexes the output light from the second optical component into multiple wavelengths is disposed between the second optical component and the terminal unit. Even with this layout, the length of the wiring wires can be shortened because the second optical component and the terminal unit are electrically connected using multiple wirings provided on the main surface of the wiring substrate. Furthermore, since multiple wirings are provided on the main surface of the wiring substrate, multiple electrical paths are formed between the second optical component and the terminal unit, which increases the flexibility of the layout of each component, saves space in the layout of each component, and shortens the length of the wiring wires.

[0014] (3)In the optical module according to the present disclosure, the second optical component is a semiconductor optical amplifier or an optical attenuator, which increases the degree of freedom in the layout of each component of the semiconductor optical amplifier or the optical attenuator, saves space in the layout of each component, and shortens the length of the wiring wires.

[0015] (4) The optical module according to the present disclosure further includes a third optical component provided between the optical fiber and the second optical component and optically coupled to the optical fiber and the second optical component. By disposing the third optical component optically coupled to the optical fiber and the second optical component between the optical fiber and the second optical component, the degree of freedom in the layout of each component can be increased, the layout of each component can be space-saving, and the length of the wiring wire can be shortened.

[0019] (5) The optical module of the present disclosure further includes a temperature control device that mounts the second optical component, and the wiring is provided in plurality, including a first wiring that supplies power to the temperature control device and a second wiring that is narrower than the first wiring and supplies power to the second optical component. As a result, while it is necessary to reduce the electrical resistance of the first wiring in order to minimize the power consumption of the temperature control device, by making the width of the second wiring narrower than the width of the first wiring, it is possible to adjust the electrical resistance of the wiring pattern in a limited space.

[0020] (6) The optical module of the present disclosure includes: The second surface side The wiring is connected via a wire between the wiring and the wiring, and the wiring is provided with another wiring that is provided by the wire so as to straddle the wiring. This makes it possible to greatly improve the degree of freedom in the wiring layout by using wiring having a specific wiring pattern while also using another wiring that is provided by the wire so as to straddle the wiring, and further makes it possible to shorten the length of the wiring wire.

[0021] [Details of the embodiment of the present invention] Specific examples of optical modules according to the present disclosure will be described below with reference to the drawings. The present invention is not limited to the following examples, but is defined by the claims, and is intended to include all modifications within the meaning and scope of the claims. Furthermore, as long as multiple embodiments can be combined, the present invention includes any combination of embodiments. In the following description, configurations with the same reference numerals in different drawings are considered to be similar, and their description may be omitted.

[0022] (Embodiment 1) In the following description, an optical module will be described as an example in which a multiplexed optical signal in which a plurality of optical signals having different wavelengths are multiplexed is received, and the optical signal is demultiplexed into individual optical signals by an optical demultiplexer 34, and then each optical signal is converted into an electrical signal. FIG. 1A is a perspective plan view of an optical module according to a first embodiment of the present disclosure, in which the top surface of a package 10 is made transparent to show the interior of the package 10. FIG. 1B is a perspective side view of the optical module shown in FIG. 1A, and FIG. 1C is an IC-IC cross-sectional view of the optical module shown in FIG. 1A.

[0023] The optical module 1 of this embodiment includes a package 10, an optical isolator section 13, an optical amplifier section 20, an optical demultiplexer section 30, a light receiving section 40, and a terminal section 12. A bushing 11 is provided on a first surface of the package 10, which is the surface on the light input side. A receptacle (not shown) for connecting an optical fiber via the bushing 11 is provided on the first surface of the package 10. A terminal section 12 is provided on a second surface opposite the first surface. The package 10 includes a ceramic electrical wiring board, a metal frame, a heat sink, a light transmitting window, and a bushing (sealing lid) 11.

[0024] The optical amplifier 20 is provided on the second surface side of the optical isolator 13. The optical amplifier 20 includes a semiconductor optical amplifier (hereinafter referred to as "SOA") 23, an SOA mounting portion 25 on which the SOA 23 is mounted, a thermistor 53 provided on the SOA mounting portion 25, an SOA lens mounting portion 24 on which the SOA mounting portion 25 is mounted, an SOA input lens 21 and an SOA output lens 22 mounted on the SOA lens mounting portion 24, a Peltier element 26 on whose upper surface the SOA lens mounting portion 24 is mounted (the upper surface of each component in a cross-sectional view such as FIG. 1B is referred to as the "upper surface"; the same applies hereinafter), and a Peltier element first terminal 27 and a Peltier element second terminal 28 provided on the Peltier element 26. The lower surface of the Peltier element 26 (the lower surface of each component in a cross-sectional view such as FIG. 1B is referred to as the "lower surface"; the same applies hereinafter) is fixed to the bottom surface of the package 10. The Peltier element 26 controls the temperature of the SOA 23 .

[0025] The optical demultiplexing unit 30 is provided on the second surface side of the optical amplifying unit 20. The optical demultiplexing unit 30 includes a support substrate 32 whose underside is supported by support posts 31, an optical demultiplexer 34 provided on the underside of the support substrate 32, a prism mirror 36 provided on the underside of the support substrate 32 on the optical output side of the optical demultiplexer 34, wiring 35 provided on the upper surface of the support substrate 32, support posts 31 with a U-shaped cross section that support the underside of the support substrate 32, and a base substrate 33 on which the support posts 31 are mounted. The underside of the base substrate 33 is fixed to the bottom surface of the package 10. Note that the base substrate 33 can be omitted, in which case the support posts 31 are fixed to the bottom surface of the package 10. The bottom side of the support posts 31 is fixed via insulating resin. A middle-stage substrate mounting portion 38 is provided on the upper surface of the bottom of the U-shaped cross section support posts 31, and a support post bottom surface 37 is provided on the lower surface of the bottom. For example, an ODMUX can be used as the optical demultiplexer 34. The ODMUX is made up of glass and thin film filters, and is compatible with the wavelengths of the LAN-WDM grid.

[0026] The wiring 35 is formed by providing a metal layer on the upper surface of the support substrate 32. The wiring 35 includes a first wiring 35a, a second wiring 35b, a third wiring 35c, a fourth wiring 35d, and a fifth wiring 35e as a plurality of wirings extending from the first surface side to the second surface side on the upper surface of the support substrate 32. While five wirings are illustrated as being linear in FIG. 1A, the wiring form is not limited to this, and for example, any number of wirings may be used as long as there is one or more, and the wiring may be curved or bent other than linear.

[0027] The resistance values ​​of the first wiring 35a, the second wiring 35b, the third wiring 35c, the fourth wiring 35d, and the fifth wiring 35e are set to be reduced to a predetermined resistance value (e.g., 0.1Ω) or less in order to reduce loss of electrical signals and reduce heat generation.

[0028] The light receiving unit 40 is provided on the second surface side of the optical demultiplexing unit 30. The light receiving unit 40 includes a lens array 41 provided at a position where it receives light from the prism mirror 36, a light receiving element 43 formed of, for example, a photodiode (Pin PD) provided on the lower surface of the lens array 41, and an amplifier IC 42 that amplifies the output signal of the light receiving element 43.

[0029] The terminal section 12 is provided on the second surface side of the light receiving section 40, and is configured to extract an electrical signal from the second surface side to the outside of the package 10. The terminal section 12 includes a DC terminal 12a and an RF terminal 12b provided on the outside of the package 10, and an end conductive pattern 12c and a side conductive pattern 12d provided on the inside of the package 10.

[0030] The optical amplifier 20 and the terminal unit 12 are electrically connected via wiring 35. The land or terminal of the optical amplifier 20 is connected to the first surface side of the wiring 35 by an input wire 51. The side conductive pattern 12d of the terminal unit 12 and the second surface side of the wiring 35 are connected by an output wire 52. The wiring of the optical amplifier 20 also includes a wire to an earth land 58.

[0031] Next, the operation of the optical module according to the first embodiment of the present disclosure will be described. A four-wave multiplexed optical signal from an optical fiber is converted into parallel light by a receptacle equipped with a collimating lens and input to the optical isolator unit 13. The optical isolator unit 13 may be, for example, a polarization-independent type that reduces ORL (Optical Return Loss) due to reflection from components within the package 10. The four-wave multiplexed optical signal input to the optical isolator unit 13 is condensed by the SOA input lens 21 and coupled to the waveguide of the SOA 23, and then amplified by the SOA 23. The divergent light output from the SOA 23 is converted back into parallel light by the SOA output lens 22 and then demultiplexed into optical signals of each wavelength by the optical demultiplexer 34. The optical signals of each wavelength demultiplexed by the optical demultiplexer 34 have their optical paths bent by 90 degrees by the prism mirror 36 and are then condensed onto the light-receiving element 43 by the lens array 41.

[0032] The light receiving element 43 includes, for example, four photodiodes corresponding to optical signals of each wavelength, and the optical signals of each wavelength are converted into electrical signals by the light receiving element 43. The electrical signals output from the light receiving element 43 are amplified by an amplifier IC 42, for example, a TIA, and output from the RF terminal 12b to the outside of the package 10 via the end conductive pattern 12c of the terminal portion 12.

[0033] (Modification of the first embodiment) A modified example of the first embodiment of the present disclosure will be described with reference to Fig. 2. Fig. 2 is a partially enlarged view of the optical module of Fig. 1A. While the wiring 35 is linear in Fig. 1A, Fig. 2 employs a pattern with varying widths and including bent portions.

[0034] The fourth wiring 35d and the fifth wiring 35e are the widest in the width direction, followed by the third wiring 35c, and the first wiring 35a and the second wiring 35b are the narrowest in the width direction.

[0035] The fourth wiring 35d and the fifth wiring 35e are connected to the Peltier element first terminal 27 and the Peltier element second terminal 28, respectively, and have a pattern that is wide enough in the width direction to transmit power for cooling by the Peltier element 26.

[0036] The SOA 23 is connected to the third wiring 35c via an SOA relay land 54. By using the SOA relay land 54, the input wire 51 is prevented from interfering with the SOA output lens 22, and the length of the input wire 51 can be made shorter.

[0037] The SOA ground terminal 55 is connected to a ground land 58 provided on the bottom surface of the package 10. In this embodiment, the second wiring 35b is not used, and no wires are connected to the second wiring 35b. The unused wiring can be selected arbitrarily; for example, in FIG. 1A, the third wiring 35c is not used.

[0038] The end conductive pattern 12c is provided with eight end lands 12e corresponding to, for example, four photodiodes. The side conductive pattern 12d is provided with six side lands 12f on each side of the light receiving section 40. The side lands 12f are connected to the DC terminal 12a, and the end conductive pattern 12c is connected to the RF terminal 12b. The DC terminal 12a and the RF terminal 12b are each made of a flexible substrate and are used for connection to a transceiver substrate (not shown).

[0039] A relay land mounting portion 57 is provided in the center of the top surface of the amplifier IC 42, and a first output-side relay land 57a, a second output-side relay land 57b, and a third output-side relay land 57c are provided on the relay land mounting portion 57. The third wiring 35c, the fourth wiring 35d, and the fifth wiring 35e are connected to the first output-side relay land 57a, the second output-side relay land 57b, and the third output-side relay land 57c, respectively, by output-side wires 52. The first output-side relay land 57a, the second output-side relay land 57b, and the third output-side relay land 57c are connected to the corresponding side lands 12f by terminal-side wires 56. By connecting the wires via the first output-side relay land 57a, the second output-side relay land 57b, and the third output-side relay land 57c in this manner, the misalignment of the lands in the vertical direction can be reduced, and the lengths of the output-side wire 52 and the terminal-side wire 56 can be further shortened. Furthermore, since the wiring 35 can be provided on the upper surface of the support substrate 32 of the optical demultiplexing unit 30, it is possible to save space in the layout of each component and increase the degree of freedom in the layout of each component. Furthermore, even with this layout, wiring can be performed using the wiring 35, so the length of the wiring wire can be shortened, specifically to 4 mm or less. By setting the wire length to 4 mm or less, the natural frequency of the wiring wire differs from the frequency of mechanical vibration applied to the optical module, preventing resonance of the wire and preventing wire breakage and short circuits.

[0040] The width and thickness dimensions of each wiring 35 are set according to the allowable resistance value. The allowable resistance value is determined by the overall resistance value from the optical amplifier unit 20 through each wiring 35 to the terminal unit 12. The overall resistance value of the fourth wiring 35d and fifth wiring 35e corresponding to the Peltier element 26 is set to 0.1 Ω or less. In FIG. 2, the input wire 51, the output wire 52, and the terminal wire 56 are shown as a single wire. However, in practice, it is desirable to use multiple wires for connecting the same lands to reduce the overall resistance value from the optical amplifier unit 20 through each wiring 35 to the terminal unit 12. Note that in this embodiment, heat inflow from the optical demultiplexing unit 30 is suppressed, thereby reducing the power consumption of the Peltier element 26. For this reason, the support posts 31 and support substrate 32 of the optical demultiplexing unit 30 are made of a material with good heat dissipation properties, such as alumina or aluminum nitride.

[0041] The dimensions of each wiring 35 can also be made different. For example, in FIG. 2, the fourth wiring 35d and the fifth wiring 35e, which have larger width dimensions, have width dimensions that are at least twice, preferably at least four times, the width dimensions of the first wiring 35a and the second wiring 35b, which have smaller width dimensions. The first wiring 35a corresponding to the thermistor 53 and the third wiring 35c corresponding to the SOA 23 can be set to have smaller width dimensions than the fourth wiring 35d and the fifth wiring 35e corresponding to the Peltier element 26. For example, the resistance value of the third wiring 35c corresponding to the SOA 23 is determined so as to allow a current of approximately 50 to 100 mA to be supplied to the SOA 23.

[0042] (Embodiment 2) An optical module 1A according to a second embodiment of the present disclosure will be described with reference to Figures 3A and 3B. Figure 3A is a perspective plan view of the optical module according to the second embodiment of the present disclosure, and Figure 3B is a perspective side view of the optical module shown in Figure 3A. This embodiment differs from the first embodiment in that a variable optical attenuator 60 is provided instead of using an optical amplifier 20.

[0043] The variable optical attenuator unit 60 includes a variable optical attenuator (hereinafter referred to as "VOA") 63, a VOA support 62 that supports the VOA 63, a VOA substrate 61 on which the VOA support 62 and the VOA 63 are mounted, a VOA input lens 64 provided on the VOA substrate 61 closer to the first surface than the VOA 63, and a VOA output lens 65 provided on the VOA substrate 61 closer to the second surface than the VOA 63. The VOA 63 can be, for example, a shutter-type VOA for collecting or collimating light.

[0044] The four-wave multiplexed optical signal incident on the optical isolator section 13 is condensed by the VOA input lens 64 and input to the VOA 63. The optical signal is attenuated by a predetermined amount by the VOA 63 and converted into convergent light. Thereafter, the optical signal diverged after passing through the VOA 63 is condensed by the VOA output lens 65 and input to the optical demultiplexer 34.

[0045] Two terminals of the VOA 63 provided on the VOA support part 62 are connected to the first surface sides of the first wiring 35a and the third wiring 35c by input wires 51. The second surface sides of the first wiring 35a and the third wiring 35c are connected to the corresponding side conductive patterns 12d by output wires 52. By electrically connecting the terminals of the VOA 63 and the terminal part 12 via the wiring 35 in this way, the lengths of the input wires 51 and the output wires 52 can be shortened. Furthermore, by changing the wiring mode (shape and dimensions), the degree of freedom in the layout of each component can be improved and the layout space of each member can be saved.

[0046] (Embodiment 3) An optical module 1B according to a third embodiment of the present disclosure will be described with reference to Figures 4A and 4B. Figure 4A is a perspective plan view of the optical module according to the third embodiment of the present disclosure, and Figure 4B is a perspective side view of the optical module shown in Figure 4A. This embodiment differs from the first and second embodiments in that it includes both a variable optical attenuator 60 and an optical amplifier 20.

[0047] In the optical module 1B according to the third embodiment, the VOA output lens 65 is omitted, and instead of providing the VOA substrate 61, a VOA 63 is placed on the top surface of the Peltier element 26 shared with the optical amplification section 20.

[0048] A four-wave multiplexed optical signal from an optical fiber is converted into parallel light by a receptacle equipped with a collimating lens and input into the optical isolator unit 13. The four-wave multiplexed optical signal input into the optical isolator unit 13 is condensed by the VOA input lens 64 and input into the VOA 63. The optical signal is attenuated by a predetermined amount by the VOA 63 and converted into convergent light. The optical signal then diverges after passing through the VOA 63, is condensed by the SOA input lens 21, coupled to the waveguide of the SOA 23, and then amplified by the SOA 23. The divergent light output from the SOA 23 is converted back into parallel light by the SOA output lens 22 and then demultiplexed into optical signals of each wavelength by the optical demultiplexer 34. The optical signals of each wavelength demultiplexed by the optical demultiplexer 34 have their optical paths bent by 90 degrees by the prism mirror 36 and are then condensed onto the photodetector 43 by the lens array 41. The subsequent operation is the same as in the first embodiment.

[0049] Next, the connection of the wiring 35 of this embodiment will be described. The first surface side of the third wiring 35c, which was not used in the first embodiment, is connected to one of the VOA terminals of the VOA support 62 by an input wire 51. The other end of the VOA terminal is connected to a common earth land provided on the SOA mounting unit 25 by the input wire 51, and the common earth land is further connected to an earth land 58 by the input wire 51. The second surface sides of the first wiring 35a, the second wiring 35b, the third wiring 35c, the fourth wiring 35d, and the fifth wiring 35e are connected to the corresponding side conductive patterns 12d by output wires 52. In this way, by electrically connecting the lands and terminals of the variable optical attenuator 60 and the optical amplifier 20 to the terminal unit 12 via the wiring 35, the lengths of the input wire 51 and the output wire 52 can be shortened. Furthermore, both the variable optical attenuator 60 and the optical amplifier 20 can be provided within the package 10, which has limited dimensions, and the use of the wiring 35 increases the degree of freedom in the layout of each component.

[0050] (Embodiment 4) An optical module 1C according to a fourth embodiment of the present disclosure will be described with reference to FIGS. 5A and 5B. FIG. 5A is a perspective plan view of the optical module according to the fourth embodiment of the present disclosure. FIG. 5A is a perspective view of the optical module according to the fourth embodiment of the present disclosure, showing the support substrate 32 and the optical demultiplexer 34 in a transparent manner so that the wiring is visible. FIG. 5B is a perspective side view of the optical module shown in FIG. 5A, including the support substrate 32 and the optical demultiplexer 34. This embodiment differs from the third embodiment in that wiring 70 is provided on the upper surface of the base substrate 33, facing the bottom surface 37 of the support post. As shown in FIG. 5A, the first wiring 70a, the second wiring 70b, the third wiring 70c, the fourth wiring 70d, and the fifth wiring 70e are patterned on the second surface side such that the land portions for connecting the output wires 52 are concentrated at either end in the width direction. This brings the land portions for connecting the output wires 52 closer to the side conductive pattern 12d, thereby shortening the length of the output wires 52.

[0051] In the optical module 1C according to the fourth embodiment, the wiring 70 is provided on the upper surface of the base substrate 33, facing the support post bottom surface 37 (see FIG. 1C). This allows the height position of the wiring to be adjusted by the thickness of the base substrate 33, thereby making it possible to shorten the length of the wire. Furthermore, by positioning the wiring in the height direction, the degree of freedom in the layout of each component is increased and the layout space of each component can be saved. Furthermore, since the wiring board can be placed on the bottom surface of the package 10, the width of the wiring board can be made wider.

[0052] (Embodiment 5) An optical module 1D according to a fifth embodiment of the present disclosure will be described with reference to FIGS. 6A and 6B. FIG. 6A is a perspective plan view of the optical module according to the fifth embodiment of the present disclosure, with the support substrate 32 and the optical demultiplexer 34 seen through so that the wiring is visible. FIG. 6B is a perspective side view of the optical module shown in FIG. 6A, including the support substrate 32 and the optical demultiplexer 34. This embodiment differs from the third embodiment in that wiring 72 is provided on the upper surface of a middle-stage substrate 71 mounted on the middle-stage substrate mounting portion 38 of the support post 31. As shown in FIG. 6A, the first wiring 72a, the second wiring 72b, the third wiring 72c, the fourth wiring 72d, and the fifth wiring 72e are patterned on the second surface side so that the land portions for connecting the output wires 52 are concentrated at either end in the width direction. This brings the land portions for connecting the output wires 52 closer to the side conductive pattern 12d, thereby shortening the length of the output wires 52.

[0053] In the optical module 1D of this embodiment, wiring 72 is provided on the upper surface of a middle-stage substrate 71 mounted on the middle-stage substrate mounting portion 38 (see FIG. 1C) of the support post 31. This allows the height position at which wires are drawn from wiring 72 to be closer to the height position at which wires are drawn from each component, thereby further shortening the length of the wires. Furthermore, by setting the height position of wiring 72, it is possible to save space in the layout of each component, shorten the length of the wiring wires, and further increase the layout freedom of the wiring substrate. Note that the middle-stage substrate 71 may be positioned so that a gap is provided between the middle-stage substrate 71 and the middle-stage substrate mounting portion 38.

[0054] (Embodiment 6) An optical module 1E according to a sixth embodiment of the present disclosure will be described with reference to Figures 7A and 7B. Figure 7B is a perspective side view of the optical module shown in Figure 7A, including the support substrate 32 and the optical demultiplexer 34. This embodiment differs from the optical module 1B of the third embodiment described with reference to Figures 4A and 4B in that the pattern of the wiring 35 is changed. The same configurations as those of the third embodiment are shown with the same drawings, and descriptions thereof will be omitted.

[0055] The optical module 1E of this embodiment is different from the optical module 1B of the third embodiment in the pattern of the wiring 90, and includes a first wiring 90a that connects to the thermistor 53, a second wiring 90b and a third wiring 90c that supply power to the variable optical attenuator 60 and each element of the optical amplifier 20 as second optical components, and a fourth wiring 90d and a fifth wiring 90e that serve as first wirings that supply power to the Peltier element 26 as a temperature control device. The first wiring 90a, the second wiring 90b, and the third wiring 90c that serve as second wirings have narrower wiring widths than the fourth wiring 90d and the fifth wiring 90e that serve as the first wirings.

[0056] In order to minimize the power consumption of the Peltier element 26, which is a temperature control device, it is necessary to reduce the electrical resistance of the fourth wiring 90d and the fifth wiring 90e, which are respectively connected to the Peltier element first terminal 27 and the Peltier element second terminal 28. Therefore, by making the width of the fourth wiring 90d and the fifth wiring 90e, which serve as the first wiring, wider than the first wiring 90a, the second wiring 90b, and the third wiring 90c, which serve as the second wiring, the electrical resistance of the first wiring is reduced within the limited installation space for the wiring 90.

[0057] The wiring wires connecting the wiring 90 and each element or between the wirings consist of an input wire 51 and an output wire 52. The output wire 52 consists of a one-side wire 52a, an other-side wire 52b, and an inter-wiring wire 52c. The provision of the inter-wiring wire 52c significantly improves the flexibility of the wiring layout and also shortens the length of the wiring wires. Even if the wiring 90 has a specific wiring pattern, i.e., a wiring commonly used in optical modules 1E with different specifications, the use of the inter-wiring wire 52c as a separate wiring that straddles the wiring can shorten the length of the wiring wire between the wiring 90 and both the land to which the one-side wire 52a is wired and the land to which the other-side wire 52b is wired.

[0058] The wiring 90 has a plurality of wiring land portions, and by using these wiring land portions, the wiring-to-wiring wire 52c can be connected so as to straddle other wirings, and can be connected to both the land where the one-side wire 52a is wired and the land where the other-side wire 52b is wired with a wiring wire of short wiring length. In the example of Fig. 7A, the positive terminal of the VOA 63 is connected to the second wiring 90b via the input wire 51, and further, wiring is performed from the second wiring 90b to the land where the one-side wire 52a is wired via the wiring-to-wiring wire 52c and a plurality of wiring land portions. In this way, even if the wiring pattern of the wiring 90 is such that the first wiring 90a, second wiring 90b, and third wiring 90c as second wirings that supply power to each element are positioned biased toward the land to which the other side surface side wire 52b is wired, by utilizing the inter-wiring wire 52c and multiple wiring land portions, it is possible to connect with a wiring wire of short wiring length to the land to which the one side surface side wire 52a, which is positioned on the opposite side surface, is wired.

[0059] (Embodiment 7) An optical module 1F according to a seventh embodiment of the present disclosure will be described. The optical module 1F of this embodiment differs from the first to sixth embodiments in that a light-emitting element 43a is used as the optical element instead of a light-receiving element 43. In the optical module 1F of this embodiment, a surface-emitting element, such as a VCSEL, is used as the light-emitting element 43a. Furthermore, the optical module 1F of this embodiment includes an optical multiplexing unit 30, instead of the optical demultiplexing unit 30, that includes an optical multiplexer that multiplexes light output from the multiple light-emitting elements 43a.

[0060] An example of this embodiment will be described in comparison with Embodiment 1 shown in FIGS. 1A to 1C. The light-emitting element control IC controls the light emission of the light-emitting elements 43a based on a signal from the terminal unit 12. The light output from the plurality of light-emitting elements 43a is multiplexed in the optical multiplexing unit 30, which serves as a first optical component, and sent to the optical amplifying unit 20, which serves as a second optical component, where it is amplified. The multiplexed and amplified light is output to an optical fiber via a receptacle connected to the bushing 11 via the output unit 13.

[0061] The wiring 35 provided on the upper surface of the support substrate 32 of the optical multiplexing unit 30 includes a first wiring 35a, a second wiring 35b, a third wiring 35c, a fourth wiring 35d, and a fifth wiring 35e, as in the first embodiment. Driving power or a control signal is supplied to each component of the optical amplifier 20 serving as the second optical component from the side conductive pattern 12d via the wiring 35. This allows the optical amplifier 20 serving as the second optical component to be electrically connected to the terminal 12 using wiring extending from the first surface side to the second surface side and electrically connecting the second optical component to the terminal 12. This allows for a layout in which the light-emitting element 43a serving as the first optical component is disposed between the second optical component and the terminal 12, while also enabling a space-saving layout of each component. Furthermore, even with this layout, the second optical component and the terminal 12 are electrically connected using wiring, so the length of the wiring wire can be shortened, specifically to 4 mm or less. By keeping the wire length to 4 mm or less, the natural frequency of the wire is made different from the frequency of the mechanical vibration applied to the optical module, which prevents the wire from resonating and prevents wire breakage and short circuits.

[0062] 1A given in embodiment 1, it is possible to adopt various arrangements and patterns of the wiring 35 described in embodiments 2 to 6. In this embodiment, an example in which the optical element is a light-emitting element 43a is described using FIGS. 1A to 1C, and therefore there are differences from other embodiments, such as the arrangement of the SOA input lens 22 and the SOA output lens 21, and other optical elements required for multiplexing and amplifying the light output from the light-emitting element 43a and outputting it to an optical fiber can also be provided.

[0063] From the above description of the embodiments of the present disclosure, it is clear that the effects of increasing the degree of freedom in the layout of each component, including the optical elements, in the optical module, saving space in the layout of each component, and shortening the length of the wiring wires can be obtained. Furthermore, the present disclosure is not limited to these embodiments, and also includes combinations of the embodiments, and embodiments in which the layout of each component is changed. [Explanation of symbols]

[0064] 1 Optical Module 10 packages 11 Bush 12 Terminal section 12a DC terminal 12b RF terminal 12c Edge conductive pattern 12d Side conductive pattern 12e End Land 12f side land 13 Optical isolator section 20 Optical amplifier 21 SOA input lens 22 SOA output lens 23 SOA 24 SOA lens mounting section 25 SOA mounting section 26 Peltier element 27 Peltier element first terminal 28 Peltier element second terminal 30 Optical demultiplexer 31 Support Post 32 Support substrate 33 Base board 34 Optical demultiplexer 35 Wiring 36 Prism Mirror 37 Bottom of support post 38 Middle board placement section 40 Light receiving section 41 Lens Array 42 Amplification IC 43 Photodetector 43a Light-emitting element 51 Input wire 52 Output wire 54 SOA relay land 55 SOA ground terminal 56 Terminal side wire 57 Relay land mounting section 58 Earth Land 60 Variable optical attenuator 61 VOA board 62 VOA support part 63 VOA 64 VOA input lens 65 VOA output lens 70 Wiring 71 Middle board 72 Wiring 80 Optical Modules 81 Optical Base 82 Optical demultiplexer 83 Wavelength separation section 84 Condenser Lens 85 Light receiving part

Claims

1. an optical element; a first optical component optically coupled to the optical element; a second optical component optically coupled to the first optical component; a support substrate having the first optical component disposed on a back surface opposite to a main surface thereof; a wiring board having wiring provided on a main surface of the support substrate opposite the back surface; a support portion that supports the support substrate and the wiring substrate; a receptacle to which an optical fiber that transmits incident light to the second optical component is connected; a terminal portion for electrically outputting an output signal of the optical element to the outside; a package that accommodates the optical element, the first optical component, and the second optical component, and has the receptacle on a first surface and the terminal portion on a second surface opposite to the first surface; Equipped with the wiring extends from the first surface side to the second surface side and electrically connects the second optical component and the terminal portion; An optical module, wherein a back surface of the wiring board opposite to the main surface has a hollow structure with a gap between it and the bottom surface of the package.

2. the optical element is a light receiving element, 2. The optical module according to claim 1, wherein the first optical component has an optical demultiplexer that demultiplexes the output light from the second optical component into a plurality of wavelengths.

3. 3. The optical module according to claim 1, wherein the second optical component is a semiconductor optical amplifier or an optical attenuator.

4. 4. The optical module according to claim 1, further comprising a third optical component provided between the optical fiber and the second optical component and optically coupled to the optical fiber and the second optical component.

5. a temperature control device that includes the second optical component; The wiring includes a first wiring that supplies power to the temperature control device; The optical module according to claim 1 , further comprising a second wiring that is narrower than the first wiring and that supplies power to the second optical component.

6. 6. The optical module according to claim 1, further comprising another wiring that is connected between the first surface side and the second surface side via a wire and that is provided so as to straddle the wiring with the wire.

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