How to create a production program

Abstract

Provided is a production program generation method for generating a production program for a production system that includes an array of multiple operating machines and in which a board is conveyed by each of a first conveyance lane and a second conveyance lane through the multiple operating machines from upstream to downstream and operations are sequentially performed by the multiple operating machines on the board being conveyed to produce the board. When the multiple operating machines include two or more first operating machines that perform mounting operations for mounting components on the board and a second operating machine that performs an operation different from the mounting operations on the board, this production program generation method includes a first generation step of generating a first production program according to a first method, a second generation step of generating a second production program according to a second method, a selection step of comparing an operation time of the first operating machines with an operation time of the second operating machine and thereby selecting one of the first production program and the second production program, and an output step of outputting the selected production program.

Description

[Technical Field]

[0001] The present invention relates to a production program creation method for creating a production program for a production system that produces boards. [Background technology]

[0002] The following Patent Document describes a production system that produces boards by having an arranged plurality of work machines perform work on boards transported by a first transport lane and a second transport lane, i.e., a dual-lane board production system. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2014 / 030255 Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the present specification is to appropriately create a production program for a dual-lane board production system. [Means for solving the problem]

[0005] In order to solve the above-mentioned problems, this specification discloses a production program creation method for creating a production program for a production system that produces boards, the system comprising a plurality of arranged work machines, and in which boards are transported by each of a first transport lane and a second transport lane from those located upstream of the plurality of work machines to those located downstream, with each of the plurality of work machines sequentially performing work on the transported boards, wherein, when the plurality of work machines include two or more first work machines that perform an attachment work to attach components to the boards, and a second work machine that performs an operation on the board that is different from the attachment work, the production program creation method includes: a first creation process for creating a first production program according to a first method; a second creation process for creating a second production program according to a second method; a selection process for comparing the work time by the first work machine with the work time by the second work machine to select one of the first production program and the second production program; and an output process for outputting the production program selected in the selection process. [Effects of the Invention]

[0006] In the present disclosure, a first dual-lane production program is created according to a first method, and a second dual-lane production program is created according to a second method. Then, the work time of a first work machine constituting the production system is compared with the work time of a second work machine constituting the production system, and one of the first production program and the second production program is selected. This allows the production program for the dual-lane board production system to be created appropriately. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 2 is a perspective view showing a substrate-related operation system. [Figure 2] FIG. [Figure 3] FIG. 2 is a block diagram showing a control device. [Figure 4] FIG. 1 is a block diagram illustrating an information processing apparatus. [Figure 5]10 is a graph showing the first lane placement time and second lane placement time for each placement machine when circuit boards are produced in accordance with a first production program. [Figure 6] 10 is a graph showing the first lane placement time and second lane placement time for each placement machine when circuit boards are produced in accordance with a second production program. DETAILED DESCRIPTION OF THE INVENTION

[0008] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings as modes for carrying out the present invention.

[0009] Fig. 1 shows a substrate-related processing system 10. The substrate-related processing system 10 shown in Fig. 1 is a system for producing circuit boards on which electronic components are mounted. The substrate-related processing system 10 is made up of four electronic component mounting devices (hereinafter sometimes abbreviated as "mounting devices") 12 arranged adjacent to one another, two solder printers 14 and 16, and a reflow furnace 18.

[0010] The placement device 12 is configured to include one system base 20 and two electronic component placement machines (hereinafter sometimes abbreviated as "placement machines") 22 arranged adjacent to each other on the system base 20. In other words, eight placement machines 22 are arranged in a row. When distinguishing between the eight placement machines 22, they may be referred to as first to eighth placement machines 22, from the placement machine 22 arranged most upstream to the placement machine 22 arranged most downstream.

[0011] Furthermore, two solder printers 14 and 16 are arranged upstream of the placement machine 22 arranged most upstream of the eight placement machines 22, i.e., the first placement machine 22. Furthermore, a reflow furnace 18 is arranged downstream of the placement machine 22 arranged most downstream of the eight placement machines 22, i.e., the eighth placement machine 22. In the following description, the direction in which the placement machines 22 are lined up is referred to as the X-axis direction, and the horizontal direction perpendicular to that direction is referred to as the Y-axis direction.

[0012] First, the placement device 12 will be described. Since the four placement devices 12 have substantially the same configuration, one of the four placement devices 12 will be described as a representative. As shown in Fig. 2, the placement device 12 has one system base 20 and two placement machines 22 adjacent to each other on the system base 20. Each placement machine 22 mainly includes a placement machine main body 24, a transport device 26, a placement head moving device (hereinafter sometimes abbreviated as "moving device") 28, a placement head 30, and a supply device 32.

[0013] The placement machine body 24 is composed of a frame 36 and a beam 38 suspended from the frame 36 .

[0014] The transport device 26 includes two conveyor devices 40, 42. The two conveyor devices 40, 42 are arranged on the frame 36 so as to be parallel to each other and extend in the X-axis direction. Each of the two conveyor devices 40, 42 transports a circuit board supported by the respective conveyor device 40, 42 in the X-axis direction by an electromagnetic motor (see FIG. 3) 44. The circuit board transported by each conveyor device 40, 42 is then held at a predetermined position by a board holding device (see FIG. 3) 46.

[0015] The moving device 28 is an XY robot type moving device. The moving device 28 is equipped with an electromagnetic motor (see FIG. 3) 52 that slides the slider 50 in the X-axis direction, and an electromagnetic motor (see FIG. 3) 54 that slides it in the Y-axis direction. The mounting head 30 is attached to the slider 50, and the mounting head 30 is moved to any position on the frame 36 by the operation of the two electromagnetic motors 52, 54.

[0016] The placement head 30 places electronic components on circuit boards. The placement head 30 has a suction nozzle 60 attached to its bottom surface. The suction nozzle 60 is connected to a positive / negative pressure supply device (see FIG. 3) 66 via negative pressure air and positive pressure air passages. The suction nozzle 60 sucks and holds electronic components using negative pressure, and releases the held electronic components using positive pressure. The placement head 30 also has a nozzle lifting device (see FIG. 3) 68 that raises and lowers the suction nozzle 60. The nozzle lifting device 68 allows the placement head 30 to change the vertical position of the electronic component it is holding. The suction nozzle 60 is detachable from the placement head 30 and can be replaced depending on the size of the electronic component, etc.

[0017] The supply device 32 is a feeder-type supply device and is disposed at an end of the frame 36. The supply device 32 has a plurality of tape feeders 70. The tape feeders 70 accommodate tape-formed components in a wound state. The tape-formed components are electronic components taped to a carrier tape. The tape feeders 70 then feed the tape-formed components using a feeding device (see FIG. 3) 76. As a result, the feeder-type supply device 32 supplies electronic components at the supply position by feeding the tape-formed components. The tape feeders 70 are detachable from the frame 36, allowing for the replacement of electronic components, etc.

[0018] The solder printers 14 and 16 print solder paste on the circuit boards. As shown in FIG. 1, the two solder printers 14 and 16 are arranged side by side in the Y-axis direction and are connected to the first placement machine 22, the placement machine 22 that is located most upstream of the eight placement machines 22. Each of the solder printers 14 and 16 is equipped with conveyor devices 80 and 82 (see FIG. 3) that have the same structure as the conveyor devices 40 and 42 of the placement machine 22. The conveyor device 80 of the solder printer 14 is connected to the conveyor device 40 of the first placement machine 22, and the conveyor device 82 of the solder printer 16 is connected to the conveyor device 42 of the first placement machine 22. Each of the solder printers 14 and 16 is equipped with printing devices 86 and 88 (see FIG. 3) that print solder paste on the circuit boards transported by the conveyor devices 80 and 82.

[0019] The reflow furnace 18 is a device that heats the circuit board on which electronic components are mounted to melt the cream solder and then fix the electronic components to the circuit board, and is connected to the placement machine 22 that is located most downstream of the eight placement machines 22, i.e., the eighth placement machine 22. The reflow furnace 18 is equipped with conveyor devices 90 and 92 that have the same structure as the conveyor devices 40 and 42 of the placement machine 22. The conveyor device 90 of the reflow furnace 18 is connected to the conveyor device 40 of the eighth placement machine 22, and the conveyor device 92 of the reflow furnace 18 is connected to the conveyor device 42 of the eighth placement machine 22. The reflow furnace 18 is also equipped with heaters 96 (see FIG. 3) that heat the circuit boards transported by the conveyor devices 90 and 92.

[0020] As shown in FIG. 3 , the substrate-related processing system 10 also includes a control device 100. The control device 100 includes a controller 102 and multiple drive circuits 104. The multiple drive circuits 104 are connected to the electromagnetic motors 44, 52, and 54, the substrate holding device 46, the positive / negative pressure supply device 66, the nozzle lifting device 68, the feed device 76, the conveyors 80 and 82, the printers 86 and 88, the conveyors 90 and 92, and the heater 96. The controller 102, which includes a CPU, ROM, RAM, and the like and is primarily a computer, is connected to the multiple drive circuits 104. The controller 102 controls the operation of the placement machine 22, the solder printers 14 and 16, and the reflow oven 18. The controller 102 stores a production program 110, which controls the operation of the placement machine 22, the solder printers 14 and 16, and the reflow oven 18 in accordance with the production program 110 to produce circuit boards.

[0021] Specifically, when a circuit board is first carried into the solder printers 14, 16, the controller 102 outputs commands in accordance with the production program 110, causing the conveyor devices 80, 82 of the solder printers 14, 16 to transport the circuit board to a work position and hold it in place at that work position. Next, the controller 102 issues commands in accordance with the production program 110 to cause the printers 86, 88 of the solder printers 14, 16 to print cream solder on the circuit board. Then, once the cream solder has been printed on the circuit board, the controller 102 issues commands in accordance with the production program 110 to cause the conveyor devices 80, 82 to transport the circuit board downstream. This allows the circuit board to be carried into the first placement machine 22.

[0022] When a circuit board is carried into the first placement machine 22, the controller 102 instructs the transport device 26 of the first placement machine 22 to transport the circuit board to a work position and hold it there. The tape feeder 70 also instructs the controller 102 instructs the production program 110 to feed tape-packaged components and supply electronic components at a supply position. The placement head 30 then instructs the controller 102 instructs the production program 110 to move to a position above the supply position of electronic components and suction-hold the electronic components with the suction nozzles 60. The placement head 30 then instructs the controller 102 instructs the production program 110 to move above the circuit board and mount the held electronic components onto the circuit board. After the placement of the electronic components on the circuit board is completed, the transport device 26 instructs the controller 102 instructs the production program 110 to transport the circuit board downstream. As a result, the circuit board is carried into the second placement machine 22.

[0023] Thereafter, the second to eighth placement machines sequentially perform the same operations as those performed by the first placement machine, thereby completing the placement of electronic components on the circuit board. Then, when the circuit board on which the placement operation has been completed is carried into the reflow furnace 18, the controller 102 instructs the conveyor devices 90 and 92 of the reflow furnace 18 to transport the circuit board to a work position and securely hold it there. Then, in response to a command from the controller 102 in response to the production program 110, the heater 96 heats the circuit board to melt the cream solder, thereby securing the electronic components to the circuit board. Then, in response to a command from the controller 102 in response to the production program 110, the conveyor devices 90 and 92 transport the circuit board downstream. This causes the circuit board to be removed from the reflow furnace 18, completing the production of the circuit board.

[0024] In this way, controller 102 produces circuit boards by controlling the operation of solder printers 14 and 16, placement machine 22, and reflow furnace 18 in accordance with production program 110. This production program 110 is created by information processing device 120 shown in FIG. 4. Substrate-related processing system 10 includes a transport lane made up of conveyor device 80 of solder printer 14, conveyor device 40 of placement machine 22, and conveyor device 90 of reflow furnace 18, and a transport lane made up of conveyor device 82 of solder printer 16, conveyor device 42 of placement machine 22, and conveyor device 92 of reflow furnace 18. In other words, substrate-related processing system 10 produces circuit boards using two transport lanes, or so-called dual lanes. Therefore, in the substrate-related work system 10, production work on one side of the circuit board is performed using one of the two conveying lanes, and production work on the other side of the circuit board is performed using the other of the two conveying lanes, thereby producing circuit boards with electronic components mounted on both sides.

[0025] That is, for example, first, a circuit board without electronic components mounted thereon is carried into solder printer 14. As a result, production work is performed on one side of the circuit board in a first transport lane formed by conveyor device 80 of solder printer 14, conveyor device 40 of placement machine 22, and conveyor device 90 of reflow furnace 18. Then, the circuit board for which production work has been completed in the first transport lane is inverted upside down and carried into solder printer 16. As a result, production work is performed on the other side of the circuit board in a second transport lane formed by conveyor device 82 of solder printer 16, conveyor device 42 of placement machine 22, and conveyor device 92 of reflow furnace 18. In this way, circuit boards with electronic components mounted on both sides are produced in substrate-related processing system 10.

[0026] For this reason, a production program 110 is created in an information processing device 120 for executing production work on one side of a circuit board in a first transport lane and for executing production work on the other side of the circuit board in a second transport lane. The information processing device 120 has a data receiving unit 122, a first production program creation unit 124, a second production program creation unit 126, an optimal program selection unit 128, and an optimal program output unit 130.

[0027] The data receiving unit 122 is a functional unit for receiving information for executing the production work of circuit boards (hereinafter referred to as "board production information"). The board production information is information indicating the type, number, and mounting position of electronic components to be mounted on a circuit board, and is input by an operator into the information processing device 120. The data receiving unit 122 then receives the board production information input by the operator into the information processing device 120. In addition to the board production information, the data receiving unit 122 also receives the printing work time, which is the time required to print solder paste using each of the solder printers 14 and 16. The printing work time is predetermined based on the performance of each of the solder printers 14 and 16, the type of mask used during solder paste printing, the dimensions of the circuit board to be printed, and other factors. The printing work time for each of the solder printers 14 and 16 is input by the operator into the information processing device 120. The data receiving unit 122 also receives the printing operation times for each of the solder printers 14 and 16 input into the information processing device 120 by the worker.

[0028] The first production program creation unit 124 is a functional unit for creating a first production program 110a based on the board production information received by the data receiving unit 122. As described above, the production program 110 is a program for executing production work on one side of a circuit board in the first transport lane and for executing production work on the other side of the circuit board in the second transport lane. In other words, the production program 110 is also a program for executing mounting work on one side of a circuit board in the first transport lane of the eight placement machines 22 that make up the board-related processing system 10, and for executing mounting work on the other side of the circuit board in the second transport lane. Therefore, the first production program creation unit 124 creates the first production program 110a so that the total time required for mounting work in the first transport lane and the total time required for mounting work in the second transport lane of each of the eight placement machines are equal. In other words, the first production program creation unit 124 creates the first production program 110a so that the time required for placement operations performed in the first and second transport lanes of each of the eight placement machines is equalized. By executing the first production program 110a created in this manner, the total time required for placement operations in the first transport lane and the second transport lane of each of the first through eight placement machines is approximately equalized, as shown in FIG. 5 . The time required for placement operations in the first transport lane of each of the eight placement machines is referred to as the first lane placement time, and the time required for placement operations in the second transport lane of each of the eight placement machines is referred to as the second lane placement time. The sum of the first lane placement time and the second lane placement time of each of the eight placement machines is referred to as the total placement time.

[0029] Furthermore, the second production program creation unit 126 is a functional unit for creating a second production program 110b based on the board production information received by the data receiving unit 122. As described above, the first production program creation unit 124 creates the first production program 110a so that the total placement time for each of the eight placement machines is equalized. On the other hand, the second production program creation unit 126 creates the second production program 110b so that the first lane placement time and the second lane placement time for each of the eight placement machines are equalized. By executing the second production program 110b created in this manner, the first lane placement time and the second lane placement time for each of the first to eighth placement machines become roughly equalized, as shown in FIG. 6.

[0030] The optimal program selection unit 128 is a functional unit for selecting the optimal program from the first production program 110a and the second production program 110b based on the printing operation time received by the data receiving unit 122. Specifically, the first production program 110a is created so that the total mounting time of each placement machine is equal. That is, as shown in FIG. 5, the first production program 110a is created so that the total mounting time of each placement machine is equal without considering the balance between the first lane mounting time and the second lane mounting time. On the other hand, the second production program 110b is created so that the first lane mounting time and the second lane mounting time of each placement machine are equal. That is, as shown in FIG. 6, the second production program 110b is created so that the first lane mounting time and the second lane mounting time of each placement machine are equal, taking into consideration the balance between the first lane mounting time and the second lane mounting time in all placement machines. For this reason, when the second production program 110b is created, there are more restrictions on the allocation of the number of electronic components to be placed on a circuit board to each placement machine than when the first production program 110a is created. As a result, as can be seen from Figures 5 and 6, the total placement time of each placement machine under the second production program 110b is longer than the total placement time of each placement machine under the first production program 110a. In other words, the cycle time of each placement machine under the first production program 110a is shorter than the cycle time of each placement machine under the second production program 110b. For this reason, by executing circuit board production work using the first production program 110a, the cycle time of the board-related processing system 10 can be shortened.

[0031] However, because the substrate-related processing system 10 produces circuit boards using two transport lanes, the cycle time of the substrate-related processing system 10 can sometimes be shortened by executing circuit board production operations using the second production program 110b. Specifically, for example, the second transport lane may be stopped due to component supply, an error, or the like, and mounting operations may be performed only using the first transport lane. In such a case, as shown in FIG. 5, with the first production program 110a, the difference between the shortest first lane mounting time (4.5 seconds) and the longest first lane mounting time (12.93 seconds) among the eight placement machines is 8.43 seconds. Therefore, when mounting operations are performed only using the first transport lane, the placement machine with the longest first lane mounting time (12.93 seconds) becomes a bottleneck, causing circuit boards to be held up for 8 seconds or more. On the other hand, with the second production program 110b, as shown in FIG. 6, the difference between the shortest first lane mounting time (9 seconds) and the longest first lane mounting time (9.34 seconds) among the eight placement machines is 0.34 seconds. Therefore, when mounting work is performed only on the first transport lane, there is almost no backlog of circuit boards. Therefore, when mounting work is performed only on one of the two transport lanes, the cycle time of the substrate-related processing system 10 can be shortened by performing the circuit board production work using the second production program 110b.

[0032] Furthermore, in the substrate-related processing system 10, as described above, production work on one side of the circuit board is performed in the first transport lane, and production work on the other side of the circuit board is performed in the second transport lane. Therefore, at the beginning and end of circuit board production, production work is performed in only one of the two transport lanes. Specifically, when the first circuit board is produced, the circuit board is transported to the first transport lane and production work is performed. Then, when the production work on the first circuit board is completed and the first circuit board is ejected from the first transport lane, the first circuit board is transported to the second transport lane and production work is performed. At this time, the second circuit board is transported to the first transport lane and production work is performed. In other words, when the first circuit board is produced, production work is performed only in the first transport lane, and when the second and subsequent circuit boards are produced, production work is performed in parallel in the two transport lanes. Furthermore, if the planned number of circuit boards to be produced is N, when the production work on the Nth circuit board is completed and the Nth circuit board is ejected from the first transport lane, the Nth circuit board is transported to the second transport lane, and production work is carried out. At this time, no new circuit boards are transported to the first transport lane. In other words, when producing the last circuit board to be produced, production work is carried out only on the second transport lane. In this way, at the beginning and end of circuit board production, production work is carried out on only one of the two transport lanes. Even taking this into consideration, the cycle time of the board-related work system 10 can sometimes be shortened by carrying out circuit board production work using the second production program 110b.

[0033] Therefore, the optimal program selection unit 128 selects the optimal program from the first production program 110a and the second production program 110b based on the printing operation time received by the data receiving unit 122. Specifically, since the placement machine performs placement on circuit boards after the solder printers 14 and 16 have completed printing, if the cycle time of the solder printers 14 and 16 is longer than the cycle time of the placement machine, the placement machine will wait until the printing operation is completed. Even if the cycle time of the solder printers 14 and 16 is shorter than the cycle time of the placement machine, if the difference in cycle times is small, even if a slight delay occurs in the solder printer, the placement machine will wait until the printing operation is completed. In other words, in such a case, even if the cycle time of the placement machine is shortened using the first production program 110a, the cycle time of the substrate-related processing system 10 will not be shortened due to the placement machine's wait time until the printing operation is completed. Therefore, considering that production work is performed on only one of the two transport lanes when parts are replenished, errors occur, and at the beginning and end of circuit board production, it is preferable to control the substrate-related work system 10 using the second production program 110b.

[0034] On the other hand, if the cycle time of the solder printers 14, 16 is shorter than the cycle time of the placement machine and the difference in cycle times exceeds a predetermined time, it is considered that the placement machine will not have to wait until the printing work is completed. If the placement machine does not have to wait until the printing work is completed, shortening the cycle time of the placement machine using the first production program 110a will shorten the cycle time of the substrate-related processing system 10. For this reason, if the cycle time of the solder printers 14, 16 is shorter than the cycle time of the placement machine and the difference in cycle times exceeds a predetermined time, it is preferable to control the substrate-related processing system 10 using the first production program 110a.

[0035] Therefore, the optimal program selection unit 128 calculates the average printing operation time (hereinafter referred to as the "average printing operation time") of the printing operation times of the two solder printers 14, 16 received by the data receiving unit 122. The optimal program selection unit 128 also extracts the longest total placement time (hereinafter referred to as the "longest total placement time") between the first production program 110a and the second production program. The average printing operation time can be considered the cycle time of the solder printer, and the longest total placement time can be considered the cycle time of the placement machine. Therefore, a condition is set that the average printing operation time is shorter than the longest total placement time, and the difference between the average printing operation time and the longest total placement time exceeds a threshold value. The optimal program selection unit 128 then determines whether the set condition is met. If the set condition is met, the optimal program selection unit 128 selects the first production program 110a as the optimal program for controlling the substrate-related processing system 10. On the other hand, if the set conditions are not met, the optimum program selection unit 128 selects the second production program 110b as the optimum program for controlling the substrate-related performing system 10.

[0036] The threshold value is set to, for example, 5 seconds. As can be seen from FIGS. 5 and 6, the longest total mounting time is 18.11 seconds. For this reason, if the average printing operation time is, for example, 13 seconds, the set condition is met, and the optimum program selection unit 128 selects the first production program 110a. On the other hand, if the average printing operation time is, for example, 15 seconds, the set condition is not met, and the optimum program selection unit 128 selects the second production program 110b.

[0037] The optimum program output unit 130 is a functional unit for outputting the production program 110 selected by the optimum program selection unit 128. In other words, the optimum program output unit 130 outputs the production program 110 selected by the optimum program selection unit 128 as the optimum program for controlling the substrate-related operating system 10.

[0038] In this way, the information processing device 120 creates a first production program 110a in which the total placement time of each placement machine is equalized, and a second production program 110b in which the first lane placement time and second lane placement time of each placement machine are equalized. Then, of the first production program 110a and the second production program 110b, the program that is most suitable for controlling the board-related processing system 10 is selected based on the cycle time of the solder printer. This makes it possible to carry out circuit board production work using the production program 110 that corresponds to the production status planned for the board-related processing system 10, thereby improving production efficiency.

[0039] The substrate-related work system 10 is an example of a production system. The solder printing machines 14 and 16 are an example of a second work machine. The placement machine is an example of a first work machine. The production program 110 is an example of a production program. The first production program 110a is an example of a first production program. The second production program 110b is an example of a second production program. Furthermore, the process executed by the first production program creation unit 124 is an example of a first production program creation process. The process executed by the second production program creation unit 126 is an example of a second production program creation process. The optimal program selection unit 128 is an example of a selection process. The optimal program output unit 130 is an example of an output process.

[0040] Furthermore, the present invention is not limited to the above-described embodiment, and various modifications and improvements can be made based on the knowledge of those skilled in the art to carry out various aspects of the present invention. Specifically, for example, in the above-described embodiment, the printing operation time of the solder printers 14 and 16 is input by the operator into the information processing device 120, but the information processing device 120 may calculate the time based on the type of circuit board to be produced, the performance of the solder printer, etc.

[0041] In the above embodiment, the first production program 110a is created according to a method for equalizing the total placement time of each placement machine, and the second production program 110b is created according to a method for equalizing the first lane placement time and the second lane placement time of each placement machine. However, the first production program 110a may be created according to the first method, and the second production program 110b may be created according to the second method. Any method can be used as the first method and the second method.

[0042] In the above embodiment, the optimal program from the first production program 110a and the second production program 110b is selected based on the printing operation time of the solder printer, i.e., the cycle time of the solder printer. Alternatively, the optimal program from the first production program 110a and the second production program 110b may be selected based on the cycle time of a work machine that performs a task other than printing. Specifically, for example, the reflow furnace 18 may be used as the work machine that performs a task other than printing. Furthermore, a device that inspects the accuracy of solder printing, a device that inspects electronic components mounted on a circuit board, or the like may also be used as the work machine that performs a task other than printing.

[0043] In the above embodiment, a production program is created for mounting electronic components on both sides of a circuit board. That is, a production program is created for mounting electronic components on one side of a circuit board in a first transport lane and mounting electronic components on the other side of the same circuit board in a second transport lane. Alternatively, a production program may be created for mounting electronic components on a circuit board in the first transport lane and mounting electronic components on a different circuit board in the second transport lane.

[0044] In the above embodiment, the optimal program from the first production program 110a and the second production program 110b is selected based on the conditions that the average printing operation time is shorter than the longest total installation time and the difference between the average printing operation time and the longest total installation time exceeds a threshold. However, the optimal program from the first production program 110a and the second production program 110b may also be selected based on various mathematical formulas that include the average printing operation time and the longest total installation time. [Explanation of symbols]

[0045] 10: Substrate work system (production system) 14: Solder printer (second work machine) 16: Solder printer (second work machine) 18: Reflow oven (second work machine) 22: Placement machine (first work machine) 110: Production program 110a: First production program 110b: Second production program 124: First production program creation unit (first production program creation process) 126: Second production program creation unit (second production program creation process) 128: Optimal program selection unit (selection process) 130: Optimal program output unit (output process)

Claims

1. a production program creation method for creating a production program for a production system that produces boards by having a plurality of arranged work machines, and transporting boards by a first transport lane and a second transport lane from those arranged upstream of the plurality of work machines to those arranged downstream of the plurality of work machines, and having each of the plurality of work machines sequentially perform work on the transported boards, the method comprising: When the plurality of work machines include two or more first work machines that perform a mounting operation to mount components on a board, and a second work machine that performs an operation on the board that is different from the mounting operation, a first creation step of creating a first production program according to a first technique; a second creation step of creating a second production program according to a second technique; a selection step of comparing a work time by the first work machine and a work time by the second work machine to select one of the first production program and the second production program; an output step of outputting the production program selected in the selection step; A production program creation method including:

2. The first preparation step includes: creating the first production program so that a total time of a work performed on a board transported on the first transport lane and a total time of a work performed on a board transported on the second transport lane by each of the two or more first work machines is equal; The second production step includes:

2. A production program creation method as described in claim 1, wherein the second production program is created so that the working time of each of the two or more first work machines for the boards transported on the first transport lane and the working time for the boards transported on the second transport lane are equal.

3. The selection step includes: A production program creation method as described in claim 1 or claim 2, wherein the first production program is selected when the condition that the work time by the first work machine is longer than the work time by the second work machine and the difference between the work time by the first work machine and the work time by the second work machine exceeds a threshold is met, and the second production program is selected when the condition is not met.

4. 4. The production program creating method according to claim 1, wherein the second operating machine is an operating machine that performs a printing operation of printing a viscous fluid on a substrate.

5. 4. The production program creating method according to claim 1, wherein the second operating machine is an operating machine that performs a heating operation to heat a substrate on which a viscous fluid is printed.

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