Heating light source device, heating light source module, and optical heating system

Abstract

To provide a heating light source device, a heating light source module and an optical heating system, which can be used for heat treatment of a substrate to be treated having a various sizes and shapes, and in which uneven irradiation onto the irradiated surface of the substrate to be treated is suppressed.SOLUTION: There is provided a heating light source device in which a plurality of heating light source modules are arranged. Each of the heating light source modules includes a light-emitting element substrate, a plurality of light-emitting elements mounted on the light-emitting element substrate, and a cooling member in contact with a surface that is opposite to a surface on which the light emitting elements are mounted, of the surfaces of the light-emitting element substrate. The cooling member includes a cooling channel which is formed inside the cooling member and which communicates a cooling medium for cooling the light-emitting elements, an inlet port which introduces the cooling medium into the cooling channel, and an outlet port which discharges the cooling medium to the outside of the cooling member from the cooling channel. The cooling channel has a spiral shape moving gradually from a center portion side of the light-emitting element substrate to a circumferential edge portion side thereof as viewed from a direction orthogonal to a main surface of the cooling member.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to a light source device, and more particularly to a heating light source device for heating a substrate to be processed by irradiating it with light, and to a heating light source module and a light heating system mounted in the heating light source device. [Background technology]

[0002] In the semiconductor manufacturing process, various heat treatments such as film formation, oxidation / diffusion, modification, and annealing are performed on substrates to be processed, such as semiconductor wafers, and these treatments often employ heat treatment methods using light irradiation, which allows for non-contact treatment. For example, Patent Document 1 listed below describes a heat treatment device for heat-treating silicon wafers by irradiating the surface of the semiconductor wafer to be processed with heating light. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2016-58722 Summary of the Invention [Problem to be solved by the invention]

[0004] In recent years, there have been a variety of semiconductor manufacturing processes. However, introducing separate processing equipment for each process would require huge installation costs and a large amount of space to accommodate the equipment. For this reason, there is a demand for processing equipment that can handle multiple processes in a single unit, and there is also a desire for a single heat treatment equipment that can handle multiple processes.

[0005] One of the factors that determine the design of a heat treatment apparatus is the size of the substrate to be treated. For example, when the substrate to be treated is a silicon wafer, the size is generally φ200 mm or φ300 mm.

[0006] Conventional heat treatment apparatuses are configured with multiple light-emitting elements placed at predetermined positions on a single substrate so that a substrate of a specific size to be treated can be uniformly heated. Even with a heat treatment apparatus of this configuration, if the substrate to be treated is smaller than the target substrate, it can be heated because the heating light (hereinafter referred to as "heating light") emitted from the light-emitting elements can be irradiated onto the entire irradiated surface.

[0007] However, in general, heat treatment equipment is optimized in terms of the shape of the support members and the density of the light emitting elements so that it can heat only substrates of a specific size to be processed evenly. Therefore, when heat treatment is performed on substrates other than the specific size, there is a risk of uneven heating, making it difficult to repurpose the heat treatment equipment as is.

[0008] Therefore, Patent Document 1 describes a heat treatment apparatus in which a plurality of light-emitting element units, each sufficiently smaller than a silicon wafer, are mounted on a support plate that serves as a base of the same size as the silicon wafer. In this heat treatment apparatus, the arrangement pattern of the light-emitting element units on the support plate can be appropriately changed depending on the size of the silicon wafer so as to suppress unevenness in the heat treatment.

[0009] However, in the heat treatment device in which a plurality of light-emitting element units are simply combined, the cooling mechanism for cooling the light-emitting elements does not move or deform in response to the movement of the light-emitting element units, and therefore the light-emitting element units may not be cooled as expected when their positions are changed.

[0010] Semiconductor light-emitting elements such as LED elements have a tendency to decrease in brightness as their temperature increases. Therefore, for example, if there are differences in cooling performance between regions of a support plate on which light-emitting element units are arranged, some light-emitting element units will be sufficiently cooled and others will not, resulting in temperature differences between the light-emitting element units. Furthermore, temperature differences between the light-emitting element units will result in differences in brightness between the light-emitting element units, resulting in uneven illuminance of the heating light irradiated onto the irradiated surface of the substrate.

[0011] Therefore, it has been practically impossible to freely change the position of each light-emitting element unit mounted in the heat treatment apparatus.

[0012] The present invention has been made in consideration of the above-mentioned problems, and aims to provide a heating light source device, a heating light source module, and an optical heating system that can be used for heating substrates of various sizes and shapes, and that suppresses uneven irradiation of the irradiated surface of the substrate. [Means for solving the problem]

[0013] The heating light source device of the present invention comprises: A heating light source device in which a plurality of heating light source modules are arranged, Each of the plurality of heating light source modules includes: a light-emitting element substrate; a plurality of light-emitting elements mounted on the light-emitting element substrate; a cooling member in contact with a surface of the light-emitting element substrate opposite to a surface on which the plurality of light-emitting elements are mounted, The cooling member is a cooling flow path formed inside the cooling member through which a cooling medium for cooling the light emitting element flows; an inlet for introducing the cooling medium into the cooling flow path; an outlet for discharging the cooling medium from the cooling flow path to the outside of the cooling member, The cooling flow path is characterized in that, when viewed from a direction perpendicular to the main surface of the cooling member, it has a spiral shape that gradually extends from the center side of the light-emitting element substrate toward the peripheral end side.

[0014] In addition, in this specification, the expression "contact" between the light-emitting element substrate and the cooling substrate includes not only a case where the first main surface of the cooling member and the light-emitting element substrate are arranged so as to be in direct contact with each other, but also a case where they are arranged so as to be in thermal contact with each other via grease, a highly thermally conductive sheet, etc., to enhance thermal conductivity.

[0015] With the above configuration, when the heating light source module is moved to change its position, the light-emitting element substrate and the cooling member provided in the same heating light source module move together, so the light-emitting element substrate is always cooled by a specific cooling member. Therefore, no matter where the heating light source module is moved, the mounted light-emitting elements can obtain sufficient cooling performance and can be lit at the desired brightness. In other words, the heating light source device with the above configuration reduces the illuminance difference of the heating light irradiated onto the substrate to be processed, allowing the entire substrate to be uniformly heated.

[0016] In the heating light source device, The cooling member is a first main surface on which the light-emitting element substrate is mounted; a second main surface located opposite the first main surface; a notch or a through hole that connects the first main surface and the second main surface at one or more locations; The heating light source module may include a power supply line inserted through the notch or the through hole for supplying power to the plurality of light emitting elements.

[0017] The power supply line for supplying current to the light-emitting element is wired on the second main surface side, not the first main surface side, of the cooling member on which the light-emitting element is placed, so as not to block the heating light emitted from the light-emitting element and irradiated onto the substrate to be processed.

[0018] However, in order to connect a power supply line to the light-emitting element substrate placed on the first main surface of the cooling member, the power supply line must be drawn from the second main surface side to the first main surface side of the cooling member around the heating light source module on which the light-emitting element substrate to be connected is mounted.

[0019] Here, if a sufficient area for passing the power supply line is secured between adjacent heating light source modules mounted on the frame, the power supply line can be drawn through that area to the first main surface side of the cooling member. However, as described above, if the heating light source modules are arranged closely together, the gap between the heating light source modules is very narrow, and it may be difficult to secure an area for drawing the power supply line from the second main surface side to the first main surface side of the cooling member.

[0020] Therefore, by adopting the above configuration, the heating light source device can closely arrange the heating light source modules while ensuring an area around each heating light source element module for drawing out the power supply wire from the second main surface side to the first main surface side of the cooling member.

[0021] The notch or through-hole may be provided in only one location in the cooling member, and two power supply lines connected to the electrodes provided on one light-emitting element substrate at that location may be configured to pass through the same notch or through-hole. However, from the viewpoint of suppressing the occurrence of a short circuit or leakage current between the power supply line connected to the positive electrode and the power supply line connected to the negative electrode, it is preferable that the notch or through-hole be provided in two locations in the cooling member.

[0022] The cooling member may be provided with notches or through holes for other purposes in addition to the notches or through holes for drawing out the power supply lines.

[0023] The heating light source device is a frame on which the plurality of heating light source modules are mounted; An adjustment mechanism may be provided for adjusting at least one of the position of the light-emitting element substrate in a direction perpendicular to the main surface of the frame and the inclination angle of the main surface of the light-emitting element substrate relative to the main surface of the frame.

[0024] With the above configuration, the illuminance of the irradiated heating light can be adjusted appropriately for each region on the irradiated surface of the substrate to be processed, depending on the size and shape of the substrate to be processed.

[0025] In the heating light source device, The cooling member may be configured so that its shape when viewed in a direction perpendicular to the main surface of the cooling member is triangular, quadrangular, pentagonal, or hexagonal.

[0026] The above configuration makes it easier to arrange the heating light source modules more closely. It is assumed that the heating light source device and heating light source module of the present invention will be used primarily for the heating of silicon wafers. Therefore, when heating a substrate having a circular irradiated surface, such as a silicon wafer, it is preferable that the illuminance distribution of the heating light on the irradiated surface be concentric on the irradiated surface of the substrate.

[0027] In the above case, it is preferable that the heating light source device has the heating light source modules arranged concentrically when viewed from the surface of the light-emitting element substrate on which the light-emitting elements are mounted. From the viewpoint of realizing this arrangement and facilitating dense arrangement, it is preferable that the heating light source modules have a hexagonal shape that is closer to a circle than a triangular or rectangular shape when viewed from a direction perpendicular to the main surface of the cooling member.

[0028] In the heating light source device, The cooling member may have a reflective area formed on the surface on which the light-emitting element is mounted, at least in a portion other than the portion on which the light-emitting element substrate is mounted.

[0029] In addition, in the heating light source device, The reflective area may be formed of an inorganic particle layer.

[0030] With this configuration, a portion of the heating light reflected by the irradiated surface of the substrate toward the light source module is reflected back toward the substrate, thereby allowing at least a portion of the heating light reflected toward the light source module to be reused as heating light for heating the substrate, thereby improving heating efficiency.

[0031] In the heating light source device, The cooling flow path may be configured so that the entirety of the cooling flow path faces the light-emitting element substrate in a direction perpendicular to the main surface of the cooling member.

[0032] With the above configuration, the heat generated by each light-emitting element is less likely to diffuse in a direction parallel to the first main surface of the cooling member, and is instead absorbed by the cooling medium flowing sequentially through the cooling flow path, thereby further improving the cooling efficiency.

[0033] In the heating light source device, The flow path width of the cooling flow path when viewed from a direction perpendicular to the main surface of the cooling member may be configured to satisfy the following formula (1), where w is the flow path width, c is the average length of the long sides of the multiple light-emitting elements, and d is the distance between the main surface of the cooling member and the cooling flow path in the direction perpendicular to the main surface of the cooling member. 1mm≦w≦c+2d (1)

[0034] When a cooling flow path is formed so that the cooling medium flows around the center of the substrate, gradually from the central side toward the peripheral edge side, it is preferable that the cooling flow path be formed so as to circle around the center of the substrate along the arrangement pattern of the light-emitting elements in order to cool each of the light-emitting elements mounted on the substrate.

[0035] Even if the cooling flow path is configured to have a large surface area, if the cooling flow path is too far from the light emitting element, the influence of the thermal resistance of the cooling member increases, and the cooling performance decreases. For this reason, it is preferable to adjust the surface area of ​​the cooling flow path, and in particular the flow path width w of the cooling flow path, taking into account the distance d between the cooling flow path and the light emitting element.

[0036] The width over which the heat generated by the light-emitting element spreads inside the cooling member before it reaches the cooling channel is explained with reference to Figure 8B in the "Description of Embodiments," but assuming that the heat diffuses isotropically inside the cooling member, it is c + 2d. In other words, to average the temperature distribution in the light-emitting element region, it is preferable that the cooling channel width be c + 2d or less, and to improve cooling performance, it is particularly preferable that the cooling channel be formed directly below the light-emitting element.

[0037] However, when attempting to form a cooling member with a very narrow cooling channel width of less than 1 mm, processing equipment and techniques capable of high-precision processing are required, which increases manufacturing costs. Therefore, in order to reduce manufacturing costs and achieve efficient cooling, it is preferable that the width w of the cooling channel be in the range shown in the above formula (1).

[0038] The heating light source module of the present invention comprises: A heating light source module is mounted on the heating light source device.

[0039] The light heating system of the present invention comprises: a chamber for accommodating a substrate to be processed; a support member for supporting the substrate to be processed in the chamber; and a heating light source device arranged to emit heating light toward the irradiated surface of the substrate to be processed.

[0040] In the above-mentioned light heating system, The support member may be provided with a rotation mechanism for rotating the substrate to be processed that it supports around an axis that passes through the center of the support member in a direction perpendicular to the surface of the substrate to be processed.

[0041] With this configuration, the heating light emitted from each light-emitting element is irradiated onto the irradiated surface of the rotating substrate, thereby making the temperature distribution on the irradiated surface of the substrate uniform in the circumferential direction during the heat treatment. [Effects of the Invention]

[0042] According to the present invention, a heating light source device, a heating light source module, and an optical heating system are realized that can be used for heating substrates of various sizes and shapes, and that suppress uneven irradiation of the irradiated surface of the substrate. [Brief explanation of the drawings]

[0043] [Figure 1] 1 is a schematic cross-sectional view of an embodiment of a light heating system when viewed in the Y direction. [Figure 2] 2 is a view of the chamber of FIG. 1 as seen from the +Z side. [Figure 3] 2 is a diagram of the heating light source device of FIG. 1 as viewed from the -Z side. [Figure 4] 2 is a diagram of the heating light source device of FIG. 1 as viewed from the +Z side. [Figure 5] FIG. 2 is an overall perspective view of one heating light source module of FIG. 1. [Figure 6] 2 is a diagram of one heating light source module of FIG. 1 as viewed from the -Z side. [Figure 7] 2 is a diagram of one heating light source module of FIG. 1 as viewed from the +Z side. [Figure 8A] 10 is a cross-sectional view of the cooling member of the heating light source module when cut along the YZ plane passing through the inlet. FIG. [Figure 8B] FIG. 8B is an enlarged view of area A3 in FIG. 8A. [Figure 9] FIG. 10 is an overall perspective view schematically illustrating another embodiment of the heating light source module. [Figure 10A] 10 is a schematic diagram of the configuration of a heating light source device according to another embodiment, viewed from the -Z side. [Figure 10B] 10 is a schematic diagram of the configuration of a heating light source device according to another embodiment, viewed from the -Z side. [Figure 10C] 10 is a schematic diagram of the configuration of a heating light source device according to another embodiment, viewed from the -Z side. DETAILED DESCRIPTION OF THE INVENTION

[0044] The heating light source device, heating light source module, and optical heating system of the present invention will be described below with reference to the drawings. Note that the following drawings relating to the heating light source device, heating light source module, and optical heating system are all schematic illustrations, and the dimensional ratios and numbers in the drawings do not necessarily match the actual dimensional ratios and numbers.

[0045] (Light heating system 1) Fig. 1 is a schematic cross-sectional view of one embodiment of an optical heating system 1 as viewed in the Y direction, and Fig. 2 is a drawing of the chamber 2 in Fig. 1 as viewed from the +Z side. As shown in Fig. 1, the optical heating system 1 includes a heating light source device 10, a chamber 2 that accommodates a substrate W1 to be processed, a cooling mechanism 3, a first main flow path 3a, and a second main flow path 3b.

[0046] Fig. 3 is a diagram of the heating light source device 10 of Fig. 1 as viewed from the -Z side, and Fig. 4 is a diagram of the heating light source device 10 of Fig. 1 as viewed from the +Z side. As shown in Fig. 3, the heating light source device 10 of this embodiment includes a plurality of heating light source modules 20 and a frame 11. For the sake of explanation, Fig. 4 shows by dashed lines a portion of the outer edge of the heating light source modules 20 that are arranged on the -Z side of the frame 11 and are hidden by the frame 11.

[0047] Fig. 5 is an overall perspective view of one heating light source module 20 of Fig. 1, Fig. 6 is a drawing of one heating light source module 20 of Fig. 1 as viewed from the -Z side, and Fig. 7 is a drawing of one heating light source module 20 of Fig. 1 as viewed from the +Z side. As shown in Fig. 5, the heating light source module 20 of this embodiment includes a plurality of light-emitting elements 21, a light-emitting element substrate 22, and a cooling member 23. Note that, for the sake of explanation, Fig. 5 illustrates the light-emitting element substrate 22 and the cooling member 23 in a separated state. Furthermore, for the sake of explanation, Fig. 7 illustrates the light-emitting elements 21 and the light-emitting element substrate 22 mounted on the -Z side of the cooling member 23, which are not actually visible, by dashed lines.

[0048] 1, the direction in which the heating light source device 10 and the substrate W1 to be processed face each other is defined as the Z direction, and the plane perpendicular to the Z direction is defined as the XY plane. For ease of explanation, when describing the structure of the heating light source module 20 alone, the light emitting elements 21 are assumed to be arranged in the X and Y directions, and the direction in which electrodes 22b (described later) provided on the light emitting element substrate 22 face each other is defined as the X direction.

[0049] Also, when expressing a direction, if a distinction is made between positive and negative directions, the direction is written with a positive or negative sign, such as "+Z direction" and "-Z direction," and when a direction is expressed without distinguishing between positive and negative directions, it is simply written as "Z direction."

[0050] 1, the chamber 2 includes a light-transmitting window 2a for introducing the heating light H1 emitted from the heating light source device 10. The chamber 2 also includes a support member 2b for supporting the substrate W1 to be processed so that the heating light H1 introduced through the light-transmitting window 2a is irradiated onto the irradiation surface W1a of the substrate W1 to be processed, which is the irradiation target.

[0051] As shown in FIGS. 1 and 2, the support member 2b is provided with a plurality of protrusions 2c, and the substrate W1 to be processed is placed and supported on the tip of each of the protrusions 2c.

[0052] As shown in FIG. 1, the support member 2b of this embodiment is provided with a rotation mechanism using multiple rollers 2d, and when heat treatment is performed, as shown in FIG. 2, the substrate W1 to be processed is rotated on the XY plane around an axis z1 that passes through the center of the support member 2b in the Z direction.

[0053] As shown in Figure 1, the first main flow path 3a is a flow path for guiding the cooling medium C1 supplied from the cooling mechanism 3 to the cooling member 23 of each heating light source module 20, and the second main flow path 3b is a flow path for discharging the cooling medium C2 from the cooling member 23 after it has flowed through the cooling member 23 of each heating light source module 20.

[0054] (Heating light source device 10) Next, details of the heating light source device 10 included in the optical heating system 1 of this embodiment will be described. As shown in Fig. 1, the heating light source device 10 of this embodiment is arranged to emit heating light H1 toward the chamber 2 arranged on the -Z side. The heating light H1 emitted from the heating light source device 10 passes through the light-transmitting window 2a of the chamber 2 and is irradiated onto the irradiated surface W1a of the substrate W1 to be processed, which is supported by a support member 2b.

[0055] 3, the frame 11 in this embodiment is a disk-shaped member that is circular when viewed in the Z direction, and is made of aluminum. The frame 11 may be made of a material other than aluminum, such as stainless steel. Note that the frame 11 may have a shape other than a circle when viewed in the Z direction, such as an ellipse or a polygon.

[0056] As shown in FIG. 3, the frame 11 has an opening 11c formed therein that is smaller than the cooling member 23 as shown in FIG. 4 so that when the heating light source module 20 is placed on the main surface 11b, the heating light source module 20 does not fall off and does not block the inlet 23p or outlet 23q provided in the cooling member 23 provided in the heating light source module 20.

[0057] 4, the frame 11 in this embodiment has a hole 11d formed across the multiple openings 11c. As shown in FIG. 3, the hole 11d is provided so as to communicate with a through-hole region A1 formed by combining multiple notches 23d (described later) provided in the cooling member 23 of the heating light source module 20. The through-hole region A1 and the hole 11d can be used, for example, as an observation window for observing the temperature of the irradiated surface W1a of the substrate W1 from the +Z side of the heating light source device 10 using a non-contact thermometer such as a radiation thermometer, or as an inlet for a processing gas.

[0058] Furthermore, as shown in FIG. 1, the frame 11 of this embodiment is provided with an adjustment screw 11a that corresponds to an adjustment mechanism for adjusting the position of the light emitting element substrate 22 (see FIG. 3) of the heating light source module 20 in the Z direction.

[0059] In this embodiment, multiple adjustment screws 11a are provided for one heating light source module 20, and by individually adjusting the degree of screwing of each screw, the inclination angle between the main surface 22a of the light-emitting element substrate 22 of the heating light source module 20 and the main surface 11b (XY plane) of the frame 11 can be adjusted.

[0060] In this embodiment, the frame 11 is provided with a plurality of adjustment screws 11a for adjusting the position and tilt angle of the heating light source module 20 in the Z direction, but only one adjustment screw 11a may be provided on the frame 11. Also, the frame 11 may not be provided with the adjustment screw 11a and may simply be configured to hold the heating light source module 20.

[0061] (Heating light source module 20) Next, the heating light source module 20 included in the light heating system 1 of this embodiment will be described in detail.

[0062] (Light emitting element 21) The light emitting element 21 in this embodiment is a surface-mounted LED element that is square when viewed in the Z direction and is 1 mm square (mm square indicates the length of one side of the square; the same applies below). The light emitting element 21 typically emits light with a wavelength of 365 nm to 405 nm.

[0063] The light-emitting element 21 may be, for example, an LED element having a size of 1.4 mm square or 2 mm square, or may be an LED element having a rectangular shape when viewed in the Z direction. Furthermore, the light-emitting element 21 may be an LED element other than a surface-mount type, or an element other than an LED element, such as an LD element or a fluorescent element, as long as it is a light-emitting element that can be used in the heat treatment of the substrate W1 to be treated.

[0064] (light emitting element substrate 22) 1, the light emitting element substrate 22 is placed in contact with the first main surface 23a of the cooling member 23. In the heating light source module 20 of this embodiment, one light emitting element substrate 22 is placed on one cooling member 23, as shown in FIG.

[0065] 6, the light-emitting element substrate 22 has a plurality of light-emitting elements 21 arranged in the X and Y directions on the main surface 22a. The plurality of light-emitting elements 21 are connected by wiring 22c between a pair of electrodes (22b, 22b) so as to be in series and parallel. In this embodiment, the pitch of the light-emitting elements 21 mounted on the main surface 22a of the light-emitting element substrate 22 is 2 mm in both the X and Y directions.

[0066] In order to realize a high-output heating light source module 20 for heating the substrate W1 to be processed, the light emitting elements 21 must be arranged at a narrow pitch and high density. Specifically, it is preferable that the light emitting elements 21 are arranged at a pitch of 3 mm or less in the X and Y directions.

[0067] In this embodiment, a substrate made of aluminum nitride (AlN) is used as the light emitting element substrate 22. Materials other than aluminum nitride that may be used to form the light emitting element substrate 22 include, for example, silicon carbide (SiC).

[0068] (cooling member 23) Before the notches (23d, 23e) described below are formed, the cooling member 23 is configured so that its shape when viewed from the Z direction is hexagonal, as shown by the dotted lines in Figures 6 and 7.

[0069] In this embodiment, the material of the cooling member 23 is copper (Cu), which has a high thermal conductivity and a high heat resistance temperature. Note that, examples of materials other than copper that can be used for the cooling member 23 include aluminum, which has a high heat resistance temperature and a high thermal conductivity.

[0070] 5, the cooling member 23 in this embodiment has a first main surface 23a on which the light-emitting element substrate 22 is mounted, and a reflective region 23c (hatched region in FIG. 5) is formed at a location on the first main surface 23a other than the location where the light-emitting element substrate 22 is mounted. The reflective region 23c reflects the heating light H1 emitted from the light-emitting element 21 and reflected by the irradiated surface W1a of the substrate W1 to be processed, back toward the substrate W1. In this embodiment, the reflective region 23c is an inorganic particle layer formed by applying inorganic particles so as to be reflective to the heating light H1 emitted from the light-emitting element 21. Examples of materials that can be used to form the inorganic particle layer include zirconia (ZrO2) and alumina (Al2O3).

[0071] 5 to 7, the cooling member 23 in this embodiment is provided with a plurality of notches (23d, 23e) that connect the first main surface 23a and the second main surface 23b opposite to the first main surface 23a. The notches 23d are provided so as to form a through region A1 when the heating light source module 20 is placed on the frame 11, as shown in FIGS.

[0072] As shown in Figures 3 and 4, the cutout 23e is arranged to form an insertion area A2 for inserting the power supply wire 12 for supplying current to the light emitting element 21 on the light emitting element substrate 22 from the second main surface 23b side of the cooling member 23 to the first main surface 23a side on which the light emitting element substrate 22 is placed when the heating light source module 20 is placed on the frame 11.

[0073] Cooling flow paths 23r formed inside cooling member 23 are formed by cutting cooling member 23. Water is typically used as the cooling medium (C1, C2), but other fluorine-based inert liquids (Fluorinert (registered trademark), Galden (registered trademark)) and the like can also be used.

[0074] As a method other than cutting for creating the cooling member 23 having the cooling channels 23r, for example, there is a method in which 3D image data of the cooling member 23 having the cooling channels 23r formed therein is created and the cooling member 23 is created by 3D printing.

[0075] As shown in FIG. 1, the cooling flow paths 23r provided in the cooling member 23 of each heating light source module 20 are connected in parallel between the first main flow path 3a and the second main flow path 3b.

[0076] 7, the cooling flow path 23r has a spiral shape when viewed in the Z direction such that the cooling medium C1 supplied from the inlet 23p formed in the center of the second main surface 23b of the cooling member 23 gradually flows from the center to the peripheral edge of the light-emitting element substrate 22. Moreover, as shown in FIG. 6, the cooling flow path 23r is formed so that the entirety of the cooling flow path 23r overlaps with the light-emitting element substrate 22 when viewed in the Z direction.

[0077] Here, from the viewpoint of further improving cooling performance, a more preferable shape of the cooling flow path 23r will be considered in detail. Fig. 8A is a cross-sectional view of the cooling member 23 of the heating light source module 20 cut along the YZ plane passing through the inlet 23p, and Fig. 8B is an enlarged view of region A3 in Fig. 8A. When viewed in a direction perpendicular to the flow path cross section of the cooling flow path 23r shown in Fig. 8A (the X direction in Figs. 8A and 8B), the separation distance d between the first main surface 23a on which the light-emitting element substrate 22 is mounted and the cooling flow path 23r was set to 2 mm.

[0078] The larger the distance d between the first main surface 23a and the cooling channels 23r, the higher the thermal resistance, and the smaller the distance d, the more advanced the processing technology required for manufacturing, resulting in increased costs. Therefore, the distance d between the first main surface 23a and the cooling channels 23r is preferably 1 mm or more and 3 mm or less, and more preferably 1.5 mm or more and 2.5 mm or less.

[0079] 8B, the flow path width w of the cooling flow path 23r in this embodiment is set to 2 mm so as to satisfy the above formula (1) when the length of one side of the light emitting element 21 is c. Here, the above formula (1) is shown again. 1mm≦w≦c+2d (1)

[0080] The light emitting element 21 mounted on the heating light source device 10 of this embodiment has a square shape when viewed in the Z direction, but the mounted light emitting element 21 may also have a rectangular shape when viewed in the Z direction. In this case, the value of c corresponds to the length of the long side of the light emitting element 21. Note that when light emitting elements 21 of different sizes are mounted, the value of c is the average value of the lengths of the long sides of the light emitting elements 21.

[0081] As described above, when the arrangement positions of the heating light source modules 20 are changed on the main surface 11b of the frame 11 in accordance with the size and shape of the substrate W1 to be processed, the corresponding cooling members 23 also move together with the light-emitting element substrates 22. Therefore, even when the heating light source modules 20 are moved on the main surface 11b of the frame 11, the light-emitting elements 21 mounted on each heating light source module 20 are cooled by the cooling members 23 provided in the same heating light source module 20.

[0082] Therefore, the temperature of the light-emitting elements 21 mounted on the light-emitting element substrate 22 when turned on is less likely to change depending on the position of the heating light source module 20 on the main surface 11b of the frame 11, and the light can be turned on at the desired brightness at any position. In other words, the difference in illuminance of the heating light H1 irradiated onto the substrate W1 to be processed, which occurs depending on the arrangement of the heating light source module 20, is suppressed, and the entire substrate W1 to be processed can be uniformly heated.

[0083] The heating light source module 20 of this embodiment is formed so that the entire cooling flow path 23r overlaps with the light-emitting element substrate 22 when viewed in the Z direction, but the cooling flow path 23r and the light-emitting element substrate 22 may be configured so that only a portion of them overlap when viewed in the Z direction.

[0084] Furthermore, in the heating light source module 20 of this embodiment, one light emitting element substrate 22 is mounted on one cooling member 23, but multiple light emitting element substrates 22 may be mounted on one cooling member 23.

[0085] In the present embodiment, for example, when the temperature of the substrate W1 to be processed during heating is measured using a thermocouple or the like, there is no need to form the through-region A1, and therefore the cooling member 23 may not be provided with the notch 23d. Furthermore, the cooling member 23 may have a through-hole connecting the first main surface 23a and the second main surface 23b of the cooling member 23 formed therein, instead of the notch 23e, as a configuration for forming the insertion region A2.

[0086] Furthermore, as shown in FIG. 3, in the heating light source module 20 of this embodiment, in order to separately insert the two power supply lines (12, 12) connected to each of a pair of electrodes (22b, 22b), notches 23e are provided in two places in the cooling member 23 to form two insertion regions A2, but the notch 23e may be formed in only one place in the cooling member 23, and the two power supply lines (12, 12) may be inserted into one insertion region A2.

[0087] Furthermore, for example, if an area for passing the power supply line 12 can be secured between the heating light source modules 20 mounted on the frame 11, there is no need to form the insertion area A2, and therefore the notch 23d or through hole does not have to be provided.

[0088] Furthermore, in this embodiment, one cooling member 23 is formed with one inlet 23p, outlet 23q, and cooling flow path 23r, but one cooling member 23 may be formed with multiple inlets 23p, outlets 23q, and cooling flow paths 23r.

[0089] [Another embodiment] Another embodiment will be described below.

[0090] <1> Fig. 9 is an overall perspective view schematically illustrating another embodiment of the heating light source module 20. As shown in Fig. 9, the heating light source module 20 of this embodiment may have a reflective area 23c formed by attaching a detachable reflective member 30 to the cooling member 23 with fixing screws 31.

[0091] With the above configuration, for example, the reflecting member 30 can be partially removed or attached only to the heating light source module 20. This configuration allows the light reflected by the irradiated surface W1a of the substrate W1 to be processed toward the heating light source module 20 to be reflected back toward the irradiated surface W1a of the substrate W1, and the areas that do not reflect the light can be adjusted. Therefore, the light reflected by the irradiated surface W1a of the substrate W1 can be reflected and reused as heating light in areas that tend to become relatively cool, while the light is prevented from being irradiated back toward the substrate W1 in areas that tend to become relatively hot. This allows for fine adjustment of the temperature distribution of the entire substrate W1, resulting in a more uniform temperature distribution of the substrate W1 during heating processing.

[0092] 10A to 10C are schematic diagrams of the configuration of a heating light source device 10 according to another embodiment, as viewed from the -Z side. For ease of explanation, the power supply line 12, the electrode 22b, etc. are not shown in Figs. 10A to 10C, and the cooling member 23 is also shown in a schematic shape without the notches (23d, 23e).

[0093] Fig. 10A shows the configuration of a heating light source device 10 equipped with heating light source modules 20 that are all square (quadrilateral) when viewed in the Z direction. Fig. 10B shows the configuration of a heating light source device 10 equipped with a combination of heating light source modules 20 that are square (quadrilateral) or triangular when viewed in the Z direction. Fig. 10C shows the configuration of a heating light source device 10 equipped with a combination of heating light source modules 20 that are square, pentagonal, or hexagonal when viewed in the Z direction.

[0094] From the viewpoint of reducing the cost of manufacturing the heating light source device 10, it is preferable that all the heating light source modules 20 have the same shape rather than a configuration in which the heating light source modules 20 have different shapes.

[0095] 10C, by mounting a combination of heating light source modules 20 of different polygonal shapes to match the shape of the frame 11, the light emitting elements 21 can be arranged more densely, and heating light H1 with higher illuminance can be irradiated onto the irradiated surface W1a of the substrate W1 to be processed. Note that, although the arrangement patterns of heating light source modules 20 that are triangular, rectangular, pentagonal, and hexagonal when viewed in the Z direction have been described above, heating light source modules 20 of other polygonal shapes may also be mounted.

[0096] <3> The configurations of the optical heating system 1, the heating light source device 10, and the heating light source module 20 described above are merely examples, and the present invention is not limited to the illustrated configurations. [Explanation of symbols]

[0097] 1: Light heating system 2: Chamber 2a: Translucent window 2b: Support member 2c: Protrusion 2d: Laura 3: Cooling mechanism 3a: Primary channel 3b: Second main channel 10: Heating light source device 11: Frame 11a: Adjustment screw 11b: Main surface 11c: opening 11d: Hole 12: Power supply line 20: Heating light source module 21: Light-emitting element 22: Light emitting element substrate 22a: Main surface 22b : Electrode 22c: Wiring 23: Cooling material 23a: First principal surface 23b: Second principal surface 23c: Reflection area 23d, 23e: Notch 23p: Inlet 23q: Outlet 23r: Cooling channel 30: Reflective member 31: Fixing screw C1, C2: Cooling medium H1: Heating light W1: Substrate to be processed W1a: Irradiated surface

Claims

1. A heating light source device in which a plurality of heating light source modules are arranged, Each of the plurality of heating light source modules includes: a light-emitting element substrate; a plurality of light-emitting elements mounted on the light-emitting element substrate; a cooling member in contact with a surface of the light-emitting element substrate opposite to a surface on which the plurality of light-emitting elements are mounted, The cooling member is a cooling flow path formed inside the cooling member through which a cooling medium for cooling the light emitting element flows; an inlet for introducing the cooling medium into the cooling flow path; an outlet for discharging the cooling medium from the cooling flow path to the outside of the cooling member, the cooling flow path has a spiral shape extending gradually from a central portion of the light-emitting element substrate toward a peripheral end portion thereof when viewed from a direction perpendicular to a main surface of the cooling member; 1. A heating light source device, wherein an outlet of one light source module is not connected to an inlet of another light source module.

2. The cooling member is a first main surface on which the light-emitting element substrate is mounted; a second main surface located opposite the first main surface; a notch or a through hole that connects the first main surface and the second main surface at one or more locations; The heating light source device according to claim 1 , wherein the heating light source module includes a power supply line inserted through the notch or the through-hole for supplying power to the plurality of light-emitting elements.

3. a frame on which the plurality of heating light source modules are mounted; 3. The heating light source device according to claim 1, further comprising an adjustment mechanism for adjusting at least one of the position of the light-emitting element substrate in a direction perpendicular to the main surface of the frame and the inclination angle of the main surface of the light-emitting element substrate relative to the main surface of the frame.

4. 3. The heating light source device according to claim 1, wherein the cooling member has a triangular, quadrangular, pentagonal, or hexagonal shape when viewed from a direction perpendicular to a main surface of the cooling member.

5. The heating light source device described in claim 1 or 2, characterized in that the cooling member has a reflective area formed on the surface on which the light-emitting element is placed, at least in a portion other than the portion on which the light-emitting element substrate is placed.

6. 6. The heating light source device according to claim 5, wherein the reflective area is formed of an inorganic particle layer.

7. 3. The heating light source device according to claim 1, wherein the cooling flow path faces the light-emitting element substrate in its entirety in a direction perpendicular to the main surface of the cooling member.

8. 3. The heating light source device according to claim 1, wherein the width of the cooling flow path when viewed from a direction perpendicular to the main surface of the cooling member satisfies the following formula (1): w = w, c = c (average length of long sides of the plurality of light-emitting elements), and d = d (a distance between the main surface of the cooling member and the cooling flow path in the direction perpendicular to the main surface of the cooling member). 1mm≦w≦c+2d (1)

9. A heating light source module mounted in the heating light source device according to claim 1 or 2.

10. A heating light source module mounted in the heating light source device according to claim 5.

11. a chamber for accommodating a substrate to be processed; a support member for supporting the substrate to be processed in the chamber; An optical heating system comprising: the heating light source device according to claim 1 or 2, which is arranged to emit heating light toward the irradiated surface of the substrate to be processed.

12. The optical heating system of claim 11, wherein the support member is provided with a rotation mechanism for rotating the substrate being supported around an axis passing through the center of the support member in a direction perpendicular to the surface of the substrate.

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