PCB structure for preventing thermal interaction of different function leds

Abstract

The utility model belongs to the field of car light, concretely relates to a PCB structure of preventing different function LED heat mutual influence, including low -power LED area, high -power LED area, copper layer, insulating layer and metal base plate, insulating layer and copper layer are sequentially arranged on the top of metal base plate, low -power LED area and high -power LED area are separately set up on copper layer, the middle embedding of metal base plate has insulating substrate and insulating substrate is located between low -power LED area and high -power LED area, the corresponding metal base plate inside embedding of high -power LED area has a plurality of heat dissipation columns. The utility model discloses through setting up insulating substrate, realized the heat isolation between different function LED.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the field of car light, concretely relates to a PCB structure of preventing different function LED heat mutual influence. BACKGROUND

[0002] The PCB board is the printed circuit board in the car light, installs multiple LED lamps on it, the LED lamp emits light and will heat, the different LED lamp power on the PCB board is not same, therefore the heat dissipation is different, therefore realizes the heat isolation between different function LED through digging the hole on the PCB board in the prior art, but this kind of mode heat isolation is limited, and it is difficult to accurately control the working temperature of each LED. The heat generated by high-power LED is easy to make small-power LED overtemperature, which affects the normal work of small-power LED, such as brightness reduction, color drift or even premature damage, etc. In the prior art, the area of the PCB or the heat sink is increased to avoid the performance degradation or damage of the LED caused by heat, but this way increases the area of the PCB and the heat sink, which requires increasing the cost and space, and it is difficult to apply in the car light. SUMMARY

[0003] To solve the above problems in the prior art, the utility model provides a PCB structure for preventing different function LED heat mutual influence, which realizes the heat isolation between different function LED.

[0004] To achieve the above object, the utility model provides the following technical scheme: a PCB structure for preventing different function LED heat mutual influence, including low-power LED area, high-power LED area, copper layer, insulating layer and metal substrate, the insulating layer and copper layer are sequentially arranged above the metal substrate, the low-power LED area and high-power LED area are separately arranged on the copper layer, the metal substrate is embedded with an insulating substrate in the middle and the insulating substrate is located between the low-power LED area and high-power LED area, and the high-power LED area corresponds to a plurality of heat dissipation columns embedded in the metal substrate.

[0005] Further, the copper layer corresponding to the high-power LED area is coated with a heat reflective coating.

[0006] Further, the material of the heat dissipation column is a composite of silicon carbide ceramic and copper.

[0007] Compared with the prior art, the utility model has the beneficial effects that:

[0008] 1、 the utility model of part metal substrate changes into insulating substrate, realized the heat isolation between different function LED, the heat generated by high-power LED is limited in its metal substrate area, will not be conducted to the area of small-power LED, guaranteed the working temperature stability of small-power LED, avoided the overtemperature phenomenon;

[0009] 2, the utility model discloses a metal substrate under the high power LED area inlaying silicon carbide ceramic and copper compound as high heat dissipation column of high heat conduction, improve the heat dissipation performance of high power LED area;

[0010] 3, the utility model discloses the copper layer under the high power LED area is coated with heat reflection coating, and the coating of different heat reflectivity is coated on the area corresponding to different functional areas, and the coating of high reflectivity is coated to the area vulnerable to high temperature, and the heat of outside is reflected back, and the risk of heat interference is further reduced;

[0011] The working temperature of each LED is effectively controlled, the risk of LED performance fluctuation and damage caused by excessively high temperature is reduced, and therefore the stability and reliability of the entire electronic system containing the LED are improved, and the service life of the system is prolonged. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 It is structure schematic of the utility model Figure 1 ;

[0013] Figure 2 It is structure schematic of the utility model Figure 2 ;

[0014] Figure 3 It is Figure 2 A-A section view in the utility model;

[0015] Figure 4 It is Figure 3 B enlarged view in the utility model. DETAILED DESCRIPTION

[0016] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Apparently, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative work belong to the protection scope of the utility model.

[0017] Please refer to Figures 1-4The utility model provides a technical scheme for preventing the heat of different function LED from influencing each other, which comprises a low-power LED area 1, a high-power LED area 2, a copper layer 7, an insulating layer 8 and a metal substrate 4. The insulating layer 8 and the copper layer 7 are sequentially arranged above the metal substrate 4. The low-power LED area 1 and the high-power LED area 2 are separately arranged on the copper layer 7. The copper layer 7 is a part of the PCB used for forming a conductive path of the circuit. The insulating layer 8 is a material usually composed of glass fiber and epoxy resin, which is used for isolating different copper layers 7 and preventing short circuit between circuits. The metal substrate 4 is embedded with an insulating substrate 5, which is located between the low-power LED area 1 and the high-power LED area 2. The insulating substrate 5 separates the areas of different function LED and prevents the mutual influence of different function LED, ensuring that the working temperature of each LED is within a normal range and avoiding the performance degradation or damage of LED caused by heat influence. The metal substrate 4 corresponding to the high-power LED area 2 is embedded with several heat dissipation columns 6. The material of the heat dissipation column 6 is a composite of silicon carbide ceramic and copper, which has high thermal conductivity to improve the heat dissipation performance of the high-power LED area 2, effectively reduce the temperature of the high-power LED area 2 and reduce the risk of performance fluctuation and damage of LED caused by high temperature. The working temperature of LED can also be effectively controlled.

[0018] Specifically, the copper layer 7 corresponding to the high-power LED area 2 is coated with a heat reflective coating 3. Different heat reflectivity coatings are coated on different functional areas in this area. For the area easily affected by high temperature, a high reflectivity coating is coated to reflect the heat from the outside back, further reducing the risk of heat interference.

[0019] In another embodiment of the utility model, the place where the insulating substrate 5 is embedded in the metal substrate 4 can be changed to perform insulation treatment on the metal substrate 4. High-quality insulating materials such as polyimide material can be coated to separate the low-power LED area 1 and the high-power LED area 2 and achieve thermal isolation between different function LED.

[0020] The working temperature of each LED can be effectively controlled. The specific steps are as follows: firstly, the heat dissipation area corresponding to each function is calculated, and then the part of the metal substrate 4 that needs to be replaced by the insulating substrate 5 is determined according to the area under the corresponding function to block the heat transmission of different function LED through the metal substrate 4, achieving the purpose of not influencing each other.

[0021] Finally, it should be noted that: the above is only the preferred embodiment of the utility model, and is not used to limit the utility model, although the utility model is described in detail with reference to the foregoing embodiments, for the person skilled in the art, it still can modify the technical scheme recorded in the foregoing each embodiment, or make equivalent replacement to part of the technical features. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the utility model should be included in the protection scope of the utility model.

Claims

1. A PCB structure for preventing thermal interaction of different function LEDs, comprising a low-power LED area (1), a high-power LED area (2), a copper layer (7), an insulating layer (8) and a metal substrate (4), the insulating layer (8) and the copper layer (7) being sequentially arranged above the metal substrate (4), the low-power LED area (1) and the high-power LED area (2) being separately arranged on the copper layer (7), characterized in that, The metal substrate (4) is embedded with an insulating substrate (5) between the low-power LED area (1) and the high-power LED area (2), and the high-power LED area (2) is embedded with several heat dissipation columns (6) in the corresponding metal substrate (4).

2. The PCB structure for preventing thermal interaction of LEDs with different functions according to claim 1, wherein The copper layer (7) corresponding to the high-power LED area (2) is coated with a heat reflective coating (3).

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