SUBSTRATE PROCESSING APPARATUS AND MAINTENANCE METHOD FOR SUBSTRATE PROCESSING APPARATUS

Abstract

To provide a technology capable of easily carrying out maintenance of an inner wall member of a substrate processing device.SOLUTION: A substrate processing device comprises a chamber, a substrate support unit, a support member, an inner wall member, a contact member, and an actuator. The substrate support unit is provided in the chamber. The support member is provided above the substrate support unit. The inner wall member includes a top part that can be arranged above the substrate support unit and below the support member. The contact member is attached to one member of the support member and the inner wall member. The contact member is configured to exhibit a horizontal spring reaction force to the other member of the support member and the inner wall member to detachably fix the inner wall member to the support member. The actuator is configured to move the inner wall member downward so as to release the fixing of the inner wall member to the support member.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] SUMMARY OF THE DISCLOSURE Exemplary embodiments of the present disclosure relate to a substrate processing apparatus and a method for maintaining the substrate processing apparatus. [Background technology]

[0002] Substrate processing apparatuses are used to process substrates. The substrate processing apparatus includes a chamber and a substrate support. The substrate support supports a substrate in the chamber. The substrate is processed in the chamber. In a plasma processing apparatus, which is one type of substrate processing apparatus, the substrate is processed by chemical species from plasma generated from a processing gas in the chamber. Patent Document 1 listed below discloses such a plasma processing apparatus. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2019-197849 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a technique that enables easy maintenance of an inner wall member of a substrate processing apparatus. [Means for solving the problem]

[0005] In one exemplary embodiment, a substrate processing apparatus is provided. The substrate processing apparatus includes a chamber, a substrate support, a support member, an inner wall member, a contact member, and an actuator. The chamber includes a sidewall defining an opening. The substrate support is disposed within the chamber. The support member is disposed above the substrate support. The inner wall member includes a ceiling portion that can be positioned above the substrate support and below the support member. The contact member is attached to one of the support member and the inner wall member. The contact member is configured to exert a horizontal spring reaction force on the other of the support member and the inner wall member, thereby releasably securing the inner wall member to the support member. The actuator is configured to move the inner wall member downward to release the inner wall member from the support member. [Effects of the Invention]

[0006] According to one exemplary embodiment, it becomes possible to easily perform maintenance on the inner wall member of the substrate processing apparatus. [Brief explanation of the drawings]

[0007] [Figure 1] 1 illustrates a substrate processing system according to an exemplary embodiment. [Figure 2] 1 is a diagram illustrating a substrate processing apparatus according to an exemplary embodiment; [Figure 3] 1 is a partially enlarged cross-sectional view of a substrate processing apparatus according to an exemplary embodiment; [Figure 4] 1 is a partially enlarged cross-sectional view of a substrate processing apparatus according to an exemplary embodiment; [Figure 5] FIG. 2 is a plan view illustrating an example of a contact member in a substrate processing apparatus according to an exemplary embodiment. [Figure 6] FIG. 10 is a plan view showing another example of a contact member in the substrate processing apparatus according to an exemplary embodiment. [Figure 7] 1 is a diagram showing a state of a substrate processing apparatus when a maintenance method according to an exemplary embodiment is being performed; [Figure 8]1 is a diagram showing a state of a substrate processing apparatus when a maintenance method according to an exemplary embodiment is being performed; [Figure 9] 1 is a diagram showing a state of a substrate processing apparatus when a maintenance method according to an exemplary embodiment is being performed; [Figure 10] 1 is a diagram showing a state of a substrate processing apparatus when a maintenance method according to an exemplary embodiment is being performed; [Figure 11] 1 is a diagram showing a state of a substrate processing apparatus when a maintenance method according to an exemplary embodiment is being performed; [Figure 12] 1 is a diagram showing a state of a substrate processing apparatus when a maintenance method according to an exemplary embodiment is being performed; [Figure 13] FIG. 10 is a partial enlarged cross-sectional view of a support member, an inner wall member, and a contact member according to another exemplary embodiment. [Figure 14] FIG. 10 is a partial enlarged cross-sectional view of a support member, an inner wall member, and a contact member according to yet another exemplary embodiment. [Figure 15] FIG. 10 is a partial enlarged cross-sectional view of a support member, an inner wall member, and a contact member according to yet another exemplary embodiment. [Figure 16] FIG. 10 is a diagram illustrating a schematic view of a substrate processing apparatus according to another exemplary embodiment. [Figure 17] FIG. 10 is a schematic diagram of a substrate processing apparatus according to yet another exemplary embodiment. [Figure 18] 18(a) and 18(b) are enlarged plan views showing a part of a contact mechanism in a substrate processing apparatus according to yet another exemplary embodiment. [Figure 19] FIG. 10 is a schematic diagram of a substrate processing apparatus according to yet another exemplary embodiment. [Figure 20] FIG. 10 is a partial enlarged cross-sectional view of a contact mechanism in a substrate processing apparatus according to yet another exemplary embodiment. [Figure 21] FIG. 10 is a schematic diagram of a substrate processing apparatus according to yet another exemplary embodiment. [Figure 22]FIG. 10 is an enlarged perspective view showing a part of a contact mechanism in a substrate processing apparatus according to yet another exemplary embodiment. [Figure 23] FIG. 10 is a schematic diagram of a substrate processing apparatus according to yet another exemplary embodiment. [Figure 24] FIG. 10 is a partial enlarged cross-sectional view of a contact mechanism in a substrate processing apparatus according to yet another exemplary embodiment. [Figure 25] FIG. 10 is an enlarged partial cross-sectional view of a contact mechanism according to yet another exemplary embodiment. [Figure 26] FIG. 10 is a schematic diagram of a substrate processing apparatus according to yet another exemplary embodiment. [Figure 27] Each of (a) of FIG. 27 and (b) of FIG. 27 is an enlarged partial cross-sectional view of a contact mechanism in a substrate processing apparatus according to yet another exemplary embodiment. [Figure 28] FIG. 10 is a schematic diagram of a substrate processing apparatus according to yet another exemplary embodiment. [Figure 29] FIG. 10 is a partial enlarged cross-sectional view of a substrate processing apparatus according to yet another exemplary embodiment. [Figure 30] FIG. 10 is a partial enlarged cross-sectional view of a substrate processing apparatus according to yet another exemplary embodiment. [Figure 31] FIG. 10 is a partial enlarged cross-sectional view of a substrate processing apparatus according to yet another exemplary embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0008] Various exemplary embodiments will be described in detail below with reference to the drawings, in which the same or equivalent parts are designated by the same reference numerals.

[0009] 1 is a diagram showing a substrate processing system according to an exemplary embodiment, The substrate processing system PS shown in Fig. 1 includes process modules PM1 to PM6, a transfer module CTM, and a controller MC.

[0010] The substrate processing system PS may further include stages 2a-2d, containers 4a-4d, an aligner AN, load lock modules LL1 and LL2, and a transfer module TM. The number of stages, containers, and load lock modules in the substrate processing system PS may be any number greater than or equal to one. The number of process modules in the substrate processing system PS may be any number greater than or equal to one.

[0011] The stages 2a to 2d are arranged along one edge of the loader module LM. The containers 4a to 4d are mounted on the stages 2a to 2d, respectively. Each of the containers 4a to 4d is, for example, a container called a FOUP (Front Opening Unified Pod). Each of the containers 4a to 4d is configured to accommodate a substrate W therein.

[0012] The loader module LM has a chamber. The pressure in the chamber of the loader module LM is set to atmospheric pressure. The loader module LM has a transport device TU1. The transport device TU1 is, for example, a transport robot, and is controlled by the controller MC. The transport device TU1 is configured to transport a substrate W through the chamber of the loader module LM. The transport device TU1 can transport the substrate W between each of the containers 4a to 4d and the aligner AN, between the aligner AN and each of the load lock modules LL1 and LL2, and between each of the load lock modules LL1 and LL2 and each of the containers 4a to 4d. The aligner AN is connected to the loader module LM. The aligner AN is configured to adjust the position of the substrate W (calibrate the position).

[0013] Each of the load lock modules LL1 and LL2 is provided between the loader module LM and the transfer module TM. Each of the load lock modules LL1 and LL2 serves as a preliminary decompression chamber. Each of the load lock modules LL1 and LL2 is connected to the loader module LM via a gate valve. Furthermore, each of the load lock modules LL1 and LL2 is connected to the transfer module TM via a gate valve.

[0014] The transfer module TM has a transfer chamber TC that can be decompressed. The transfer module TM has a transfer apparatus TU2. The transfer apparatus TU2 is, for example, a transfer robot, and is controlled by a controller MC. The transfer apparatus TU2 is configured to transfer a substrate W via the transfer chamber TC. The transfer apparatus TU2 can transfer the substrate W between each of the load lock modules LL1, LL2 and each of the process modules PM1 to PM6, and between any two of the process modules PM1 to PM6.

[0015] Each of the process modules PM1 to PM6 is connected to the transfer module TM via a gate valve. Each of the process modules PM1 to PM6 is an apparatus configured to perform dedicated substrate processing. At least one of the process modules PM1 to PM6 is a substrate processing apparatus according to an exemplary embodiment described below.

[0016] The transfer module CTM has a chamber and a transfer device. The transfer module CTM is controlled by a controller MC. The transfer module CTM is configured to be movable so as to connect to a chamber of a substrate processing apparatus. The transfer module CTM is also configured to connect the internal space of the chamber of the substrate processing apparatus and the internal space of the chamber of the transfer module CTM with each other while the internal spaces are depressurized. The transfer device of the transfer module CTM has a transfer arm CA (see FIG. 7). The transfer arm CA is configured to transfer an inner wall member of the substrate processing apparatus between the internal space of the chamber of the substrate processing apparatus and the outside (for example, the internal space of the chamber of the transfer module CTM).

[0017] The controller MC is configured to control each part of the substrate processing system PS. The controller MC may be a computer including a processor, a storage device, an input device, a display device, etc. The controller MC executes a control program stored in the storage device and controls each part of the substrate processing system PS based on recipe data stored in the storage device. A maintenance method according to an exemplary embodiment described below can be performed in the substrate processing system PS by the controller MC controlling each part of the substrate processing system PS.

[0018] Hereinafter, a substrate processing apparatus according to an exemplary embodiment will be described with reference to Figures 2 to 4. Figure 2 is a diagram schematically illustrating a substrate processing apparatus according to an exemplary embodiment. Figures 3 and 4 are each an enlarged cross-sectional view of a portion of the substrate processing apparatus according to an exemplary embodiment. The substrate processing apparatus 1 shown in Figures 2 to 4 can be used as one or more process modules of a substrate processing system PS.

[0019] The substrate processing apparatus 1 is a capacitively coupled plasma processing apparatus and includes a chamber 10, a substrate support 12, a support member 14, an inner wall member 16, one or more contact members 18, and an actuator 20.

[0020] The chamber 10 provides an internal space therein. The chamber 10 is made of a metal such as aluminum. The chamber 10 is electrically grounded. A corrosion-resistant film may be formed on the surface of the chamber 10. The corrosion-resistant film may be made of a material such as aluminum oxide or yttrium oxide.

[0021] The chamber 10 includes a sidewall 10s. The sidewall 10s has a substantially cylindrical shape. The central axis of the sidewall 10s extends vertically and is shown as an axis AX in FIG. 2. The sidewall 10s provides a passage 10p. The internal space of the chamber 10 is connected to the internal space of a transfer chamber TC of the transfer module TM via the passage 10p. The passage 10p can be opened and closed by a gate valve 10g. The substrate W passes through the passage 10p when being transferred between the internal space of the chamber 10 and the outside of the chamber 10 (i.e., the internal space of the transfer chamber TC).

[0022] The side wall 10s further provides an opening 10o. The opening 10o has a size that allows the inner wall member 16 to pass through. The internal space of the chamber 10 can be connected to the internal space of a chamber of the transfer module CTM through the opening 10o. The opening 10o can be opened and closed by a gate valve 10v.

[0023] The chamber 10 may further include an upper portion 10u. The upper portion 10u extends from the upper end of the side wall 10s in a direction intersecting the axis line AX. The upper portion 10u provides an opening in a region intersecting the axis line AX.

[0024] The substrate processing apparatus 1 further includes an exhaust device 11. The exhaust device 11 includes a pressure regulator such as an automatic pressure control valve and a decompression pump such as a turbomolecular pump. The exhaust device 11 is connected to the interior space of the chamber 10 through the bottom of the chamber 10.

[0025] The substrate support 12 is provided in the chamber 10. The substrate support 12 is configured to support a substrate W placed thereon. The substrate support 12 may include a base 22 and an electrostatic chuck 24. The base 22 has a substantially disk shape. The central axis of the base 22 substantially coincides with the axis AX. The base 22 is formed from a conductor such as aluminum. The base 22 provides a flow path 22f therein. The flow path 22f extends, for example, in a spiral shape. The flow path 22f is connected to a chiller unit 23. The chiller unit 23 is provided outside the chamber 10. The chiller unit 23 supplies a heat medium (e.g., a refrigerant) to the flow path 22f. The heat medium supplied to the flow path 22f flows through the flow path 22f and is returned to the chiller unit 23.

[0026] The electrostatic chuck 24 is provided on the base 22. The electrostatic chuck 24 includes a main body and a chuck electrode. The main body of the electrostatic chuck 24 has a substantially disc shape. The central axis of the electrostatic chuck 24 substantially coincides with the axis AX. The main body of the electrostatic chuck 24 is formed from ceramic. The substrate W is placed on the upper surface of the main body of the electrostatic chuck 24. The chuck electrode is a film formed from a conductor. The chuck electrode is provided within the main body of the electrostatic chuck 24. The chuck electrode is connected to a DC power supply via a switch. When a voltage from the DC power supply is applied to the chuck electrode, an electrostatic attractive force is generated between the electrostatic chuck 24 and the substrate W. The generated electrostatic attractive force attracts the substrate W to the electrostatic chuck 24, whereby the substrate W is held by the electrostatic chuck 24. The substrate processing apparatus 1 may be provided with a gas line for supplying a heat transfer gas (e.g., helium gas) to a gap between the electrostatic chuck 24 and the backside of the substrate W.

[0027] The substrate support 12 may further support an edge ring ER disposed thereon. The substrate W is placed on the electrostatic chuck 24 within a region surrounded by the edge ring ER. The edge ring ER is made of, for example, silicon, quartz, or silicon carbide.

[0028] The substrate processing apparatus 1 may further include an insulating portion 26. The insulating portion 26 is made of an insulator such as quartz. The insulating portion 26 may have a generally cylindrical shape. The insulating portion 26 extends along the outer periphery of the base 22 and the outer periphery of the electrostatic chuck 24.

[0029] The substrate processing apparatus 1 may further include a conductor 28. The conductor 28 is made of a conductor such as aluminum. The conductor 28 may have a generally cylindrical shape. The conductor 28 extends along the outer circumferential surface of the insulating portion 26. The conductor 28 extends in the circumferential direction radially outside the insulating portion 26. Note that the radial direction and the circumferential direction are directions based on the axis AX. The conductor 28 is connected to ground. In one example, the conductor 28 is connected to ground via the chamber 10. The conductor 28 may be part of the chamber 10.

[0030] The substrate processing apparatus 1 may further include a high-frequency power supply 31 and a bias power supply 32. The high-frequency power supply 31 is a power supply that generates source high-frequency power. The source high-frequency power has a frequency suitable for generating plasma. The frequency of the source high-frequency power is, for example, 27 MHz or higher. The high-frequency power supply 31 is electrically connected to an electrode in the substrate support 12 via a matching device 31m. The high-frequency power supply 31 may be electrically connected to the base 22. The matching device 31m has a matching circuit for matching the impedance on the load side of the high-frequency power supply 31 to the output impedance of the high-frequency power supply 31. The high-frequency power supply 31 may be electrically connected to another electrode in the substrate support 12. Alternatively, the high-frequency power supply 31 may be connected to an upper electrode via the matching device 31m.

[0031] The bias power supply 32 is a power supply that generates electric bias energy. The electric bias energy is supplied to an electrode of the substrate support 12 to attract ions from the plasma to the substrate W. The electric bias energy may be bias high-frequency power. The waveform of the bias high-frequency power is a sine wave having a bias frequency. The bias frequency is, for example, 13.56 MHz or less. In this case, the bias power supply 32 is electrically connected to the electrode of the substrate support 12 via a matching device 32m. The bias power supply 32 may be electrically connected to the base 22. The matching device 32m has a matching circuit for matching the impedance on the load side of the bias power supply 32 to the output impedance of the bias power supply 32. The bias power supply 32 may also be electrically connected to another electrode within the substrate support 12.

[0032] Alternatively, the electrical bias energy may be a voltage pulse generated periodically at a time interval equal to the reciprocal of the bias frequency. The voltage pulse may have a negative polarity. The voltage pulse may be generated from a negative DC voltage.

[0033] The support member 14 is provided above the substrate support 12. The support member 14 is provided below the upper portion 10u of the chamber 10 and inside the side wall 10s. The support member 14 is configured to be movable upward and downward within the chamber 10.

[0034] The substrate processing apparatus 1 may further include a lift mechanism 34. The lift mechanism 34 is configured to move the support member 14 upward and downward. The lift mechanism 34 includes a drive device (e.g., a motor) that generates power for moving the support member 14. The lift mechanism 34 may be provided outside the chamber 10 and on or above the upper portion 10u.

[0035] The substrate processing apparatus 1 may further include a bellows 36. The bellows 36 is provided between the support member 14 and the upper portion 10u. The bellows 36 separates the internal space of the chamber 10 from the outside of the chamber 10. The lower end of the bellows 36 is fixed to the support member 14. The upper end of the bellows 36 is fixed to the upper portion 10u.

[0036] The support member 14 has a substantially disk shape. The central axis of the support member 14 is the axis AX. The support member 14 is formed of a conductor such as aluminum. In one embodiment, the support member 14 may constitute an upper electrode in a capacitively coupled plasma processing apparatus. The support member 14 may be grounded when the high frequency power supply 31 is electrically connected to an electrode in the substrate support 12. In this case, the support member 14 may be in contact with the inner wall surface of the chamber 10 via a connection member 37.

[0037] In one embodiment, the support member 14 may form a showerhead together with a ceiling portion of the inner wall member 16, which will be described later. The showerhead is configured to supply gas into the chamber 10 (or into the processing space S, which will be described later). In this embodiment, the support member 14 provides a gas diffusion chamber 14d and a plurality of gas holes 14h.

[0038] The gas diffusion chamber 14d is provided in the support member 14. A gas supply unit 38 is connected to the gas diffusion chamber 14d. The gas supply unit 38 is provided outside the chamber 10. The gas supply unit 38 includes one or more gas sources used in the substrate processing apparatus 1, one or more flow rate controllers, and one or more valves. Each of the one or more gas sources is connected to the gas diffusion chamber 14d via a corresponding flow rate controller and a corresponding valve. A plurality of gas holes 14h extend downward from the gas diffusion chamber 14d.

[0039] In one embodiment, the support member 14 may have a flow path 14f therein. The flow path 14f is connected to a chiller unit 40. The chiller unit 40 is provided outside the chamber 10. The chiller unit 40 supplies a heat medium (e.g., a refrigerant) to the flow path 14f. The heat medium supplied to the flow path 14f flows through the flow path 14f and is returned to the chiller unit 40.

[0040] The inner wall member 16 is configured to be transportable between the inside and outside of the chamber 10. The inner wall member 16 may be transported between the inside and outside of the chamber 10 via the opening 10o by a transport arm CA.

[0041] The inner wall member 16 is made of silicon, silicon carbide, or a metal such as aluminum. A corrosion-resistant film may be formed on the surface of the inner wall member 16. The corrosion-resistant film may be made of a material such as aluminum oxide or yttrium oxide.

[0042] The inner wall member 16 includes a top portion 16c that can be positioned above the substrate support 12 and below the support member 14. The top portion 16c is plate-like and has a substantially disk shape. The top portion 16c is positioned within the chamber 10 so that its central axis is aligned with the axis AX. The top portion 16c may be positioned directly below the support member 14 within the chamber 10. Alternatively, the heat transfer sheet 42 may be sandwiched between the lower surface of the support member 14 and the top portion 16c of the inner wall member 16, as shown in FIG. 3 .

[0043] As described above, the ceiling portion 16c may provide a showerhead together with the support member 14. In this case, the ceiling portion 16c provides a plurality of gas holes 16h. The plurality of gas holes 16h penetrate the ceiling portion 16c. The ceiling portion 16c is disposed in the chamber 10 so that the plurality of gas holes 16h communicate with the plurality of gas holes 14h, respectively. Gas from the gas supply unit 38 described above is supplied into the chamber 10 (or the processing space S) via the gas diffusion chamber 14d, the plurality of gas holes 14h, and the plurality of gas holes 16h.

[0044] In one embodiment, the inner wall member 16 may further include a side wall portion 16s. The side wall portion 16s has a generally cylindrical shape and extends downward from the peripheral edge of the ceiling portion 16c. The side wall portion 16s is disposed in the chamber 10 so that its central axis is aligned with the axis line AX. The inner wall member 16, together with the substrate support 12, may form a processing space S in which a substrate W placed on the substrate support 12 is processed. In this case, the lower end of the side wall portion 16s may be configured to contact the conductor portion 28.

[0045] The sidewall 16s may have a plurality of through-holes that communicate the processing space S with the space outside the sidewall 16s. Gas in the processing space S is exhausted by the exhaust device 11 through the through-holes in the sidewall 16s and the space outside the sidewall 16s.

[0046] 5 and 6 will be referred to below in addition to FIGS. 2 to 4. FIG. 5 is a plan view showing an example of a contact member in a substrate processing apparatus according to an exemplary embodiment. FIG. 6 is a plan view showing another example of a contact member in a substrate processing apparatus according to an exemplary embodiment. The substrate processing apparatus 1 may include a plurality of contact members 18 as the one or more contact members.

[0047] The plurality of contact members 18 may be formed from a conductor such as metal. The plurality of contact members 18 are attached to one of the support member 14 and the inner wall member 16. When the other of the support member 14 and the inner wall member 16 is combined with one of the members, each of the plurality of contact members 18 is deformed horizontally by the other member and exerts a horizontal spring reaction force against the other member. In this way, the plurality of contact members 18 detachably fix the inner wall member 16 to the support member 14.

[0048] 2 to 4, the plurality of contact members 18 are attached to the support member 14. When the inner wall member 16 is combined with the support member 14, the plurality of contact members 18 are deformed in the horizontal direction by the inner wall member 16, and exert a horizontal spring reaction force on the inner wall member 16. In this way, the plurality of contact members 18 detachably fix the inner wall member 16 to the support member 14.

[0049] In one embodiment, the lower surface 14b of the support member 14 may provide a plurality of recesses 14r. The recesses 14r open downward. Furthermore, the upper surface 16t of the top portion 16c may provide a plurality of recesses 16r. The recesses 16r open upward. Each of the plurality of contact members 18 may include a first portion 181 and a second portion 182. The first portion 181 is fitted into a corresponding recess 14r of the support member 14. The second portion 182 extends downward from the first portion 181 and has a spring. The spring of the second portion 182 is fitted into a corresponding recess 16r of the top portion 16c, thereby exerting a spring reaction force.

[0050] In one embodiment, the plurality of contact members 18 may be configured to be detachable from the support member 14. The first portion 181 has elasticity such that the contact members 18 can be removed from the corresponding recesses 14r by horizontal deformation when the contact members 18 are removed from the support member 14. In one embodiment, each of the plurality of recesses 14r of the support member 14 may be narrowed at its lower end opening.

[0051] In one embodiment, the first portion 181 may be arc-shaped in any cross section including the axis line AX, and may be hollow inside. The first portion 181 may also be open at its lower end. Such first portion 181 has elasticity in the horizontal direction. The first portion 181 passes through the lower end opening of each of the multiple recesses 14r in a horizontally contracted state and is removed from the corresponding recess 14r.

[0052] In one embodiment, the second portion 182 extends downward from the lower end of the first portion 181 and may extend obliquely upward from the lower end to provide a leaf spring. The second portion 182 may have an opening at its lower end. When the second portion 182 is fitted into the corresponding recess 16r in the top portion 16c, it is horizontally contracted by the wall surface defining the recess 16r and exerts a spring reaction force against the wall surface. In this way, the multiple contact members 18 detachably secure the inner wall member 16 to the support member 14.

[0053] 5, the contact members 18 may have a ring shape extending in the circumferential direction. In this embodiment, the recesses 14r and the recesses 16r also each have a ring shape extending in the circumferential direction. Note that in this embodiment, when the inner wall member 16 is fixed to the support member 14 in the chamber 10, the contact members 18, the recesses 14r, and the recesses 16r extend in the circumferential direction around the axis AX.

[0054] In another embodiment, the multiple contact members 18 may be arranged along one circle or multiple concentric circles, as shown in Fig. 6. In this embodiment, the multiple recesses 14r and the multiple recesses 16r are also arranged along one circle or multiple concentric circles. Note that in this embodiment, when the inner wall member 16 is fixed to the support member 14 within the chamber 10, the multiple contact members 18, the multiple recesses 14r, and the multiple recesses 16r are arranged along the circumferential direction around the axis AX.

[0055] 2 to 4 again. The actuator 20 is configured to move the inner wall member 16 downward to release the inner wall member 16 from the support member 14. In one embodiment, the actuator 20 includes a drive device 20d. The actuator 20 may include a plurality of rods 20r.

[0056] The drive unit 20d is provided outside the chamber 10. The drive unit 20d generates power to move the drive shaft 20m up and down. The drive unit 20d may include a power cylinder such as an air cylinder or a motor. The drive unit 20d is fixed to a support member 44 outside the chamber 10.

[0057] The rods 20r are coupled to the drive shaft 20m. The rods 20r extend downward from the drive shaft 20m. The rods 20r are arranged in a circumferential direction around the axis AX. The rods 20r may be arranged at equal intervals.

[0058] The support member 14 has a plurality of through holes extending vertically. The plurality of through holes penetrate the support member 14 from the upper surface thereof through the gas diffusion chamber 14d to the lower surface thereof. The plurality of rods 20r are inserted into the plurality of through holes of the support member 14. Sealing members 48 such as O-rings are provided between the support member 14 and each of the plurality of rods 20r. Furthermore, the plurality of rods 20r pass through the inner hole of a tubular member 46 within the gas diffusion chamber 14d.

[0059] The multiple rods 20r are moved up and down by a driving device 20d. When the inner wall member 16 is fixed to the support member 14, the multiple rods 20r are arranged so that their lower ends are at the same horizontal level as or higher than the upper surface 16t of the top portion 16c of the inner wall member 16. When the inner wall member 16 is to be removed from the support member 14, the multiple rods 20r are moved by the driving device 20d so as to move the inner wall member 16 downward with their lower ends in contact with the upper surface 16t of the top portion 16c of the inner wall member 16.

[0060] In the substrate processing apparatus 1, the contact members 18 are deformed by the inner wall member 16, thereby exerting a spring reaction force on the inner wall member 16 in the horizontal direction. This fixes the inner wall member 16 to the support member 14. Furthermore, by moving the inner wall member 16 downward with the actuator 20 against the spring reaction force of the contact members 18, the fixation of the inner wall member 16 to the support member 14 is easily released. The inner wall member 16, which has been released from its fixation to the support member 14, can be carried out from the inside of the chamber 10 to the outside through the opening 10o in the side wall 10s of the chamber 10. Therefore, the substrate processing apparatus 1 allows for easy maintenance of the inner wall member 16.

[0061] The substrate processing apparatus 1 may include a single contact member 18. In this case, the number of each of the recesses 14r and 16r is one.

[0062] A maintenance method for a substrate processing apparatus according to one exemplary embodiment will be described below with reference to Figures 7 to 12. Each of Figures 7 to 12 shows the state of the substrate processing apparatus when a maintenance method according to one exemplary embodiment is being performed. In the maintenance method, each part of the substrate processing system PS is controlled by a controller MC.

[0063] In the maintenance method, a plurality of contact members 18 are attached to one of the support member 14 and the inner wall member 16. When the maintenance method is applied to the substrate processing apparatus 1, the plurality of contact members 18 are attached to the support member 14. Specifically, as shown in FIG. 7 , a base 50 is carried into the chamber 10 from outside the chamber 10 by a transfer arm CA. The base 50 has a plurality of recesses on its upper surface. Second portions 182 of the plurality of contact members 18 are fitted into the plurality of recesses of the base 50. The base 50 is carried into the chamber 10 so that the plurality of contact members 18 are respectively positioned below the plurality of recesses 14r of the support member 14.

[0064] Next, the transfer arm CA is moved upward, or the lift mechanism 34 moves the support member 14 downward. As a result, as shown in Fig. 8, the first portions 181 of the multiple contact members 18 are fitted into the multiple recesses 14r of the support member 14, and the multiple contact members 18 are attached to the support member 14. Thereafter, the transfer arm CA is retracted from the inside of the chamber 10 to the outside.

[0065] Next, the inner wall member 16 is carried into the chamber 10 from outside the chamber 10 through the opening 10o by the transfer arm CA. Next, the support member 14 or the inner wall member 16 is moved vertically. That is, the support member 14 is moved downward by the lift mechanism 34, or the inner wall member 16 is moved upward by the transfer arm CA. As a result, the inner wall member 16 is detachably fixed to the support member 14, as shown in FIG.

[0066] The plurality of contact members 18 are deformed in the horizontal direction by the other of the support member 14 and the inner wall member 16, and exert a spring reaction force against the other member. In the substrate processing apparatus 1, the other member is the inner wall member 16. Specifically, the second portion 182 of each of the plurality of contact members 18 is fitted into the corresponding recess 16r and contracts in the horizontal direction, exerting a spring reaction force against the wall surface that defines the corresponding recess 16r. This fixes the inner wall member 16 to the support member 14. After the inner wall member 16 is fixed to the support member 14, the transfer arm CA retreats from the inside of the chamber 10 to the outside.

[0067] In the maintenance method, for maintenance (e.g., replacement) of the inner wall member 16, the inner wall member 16 is carried out from inside the chamber 10 to outside the chamber 10. To do this, the transfer arm CA enters the inside of the chamber 10 from outside the chamber 10 through the opening 10o.

[0068] Next, the actuator 20 moves the inner wall member 16 downward against the spring reaction force of the plurality of contact members 18. This releases the fixation of the inner wall member 16 by the plurality of contact members 18. The inner wall member 16 that has been moved downward is transferred to the transfer arm CA, as shown in FIG. 10. Next, the inner wall member 16 is carried out from the inside of the chamber 10 to the outside of the chamber 10 through the opening 10o by the transfer arm CA.

[0069] In the maintenance method, the plurality of contact members 18 may be removed for their maintenance (e.g., their replacement). To this end, as shown in FIG. 11 , the base 54 is carried by the transfer arm CA from the outside of the chamber 10 into the interior of the chamber 10 through the opening 10o. The base 54 provides a plurality of recesses 54r on its upper surface. Each of the plurality of recesses 54r is narrowed by a protrusion 54p at its upper end opening. The base 54 is positioned so that the plurality of recesses 54r are located below the plurality of contact members 18.

[0070] Next, the transfer arm CA is moved upward, or the lift mechanism 34 is used to move the support member 14 downward. As a result, the second portions 182 of each of the plurality of contact members 18 are fitted into the corresponding recesses 54r. After passing through the upper end openings of the corresponding recesses 54r, the second portions 182 of each of the plurality of contact members 18 expand to have a width greater than the width of the upper end openings. Next, the transfer arm CA is moved downward, or the lift mechanism 34 is used to move the support member 14 upward. As a result, as shown in FIG. 12 , the plurality of contact members 18 are removed from the support member 14 and transferred to the base 54. Thereafter, the plurality of contact members 18 are carried out of the chamber 10 by the transfer arm CA.

[0071] A support member, an inner wall member, and a contact member according to another exemplary embodiment will be described below with reference to Fig. 13. Fig. 13 is a partially enlarged cross-sectional view of the support member, the inner wall member, and the contact member according to another exemplary embodiment. The support member, the inner wall member, and the contact member of the embodiment shown in Fig. 13 can be used in the substrate processing apparatus 1.

[0072] In the embodiment shown in Fig. 13, the upper surface 16t of the top portion 16c provides a plurality of protrusions 16p. The plurality of protrusions 16p protrude upward relative to other portions of the upper surface 16t of the top portion 16c. Also, in the embodiment shown in Fig. 13, the lower surface 14b of the support member 14 provides a plurality of recesses 14r. The plurality of recesses 14r open downward.

[0073] In the embodiment shown in FIG. 13 , the plurality of contact members 18 may be formed from a conductor such as a metal. The plurality of contact members 18 are fixed within the plurality of recesses 14r. The wall surface of the support member 14 defining each of the plurality of recesses 14r may be provided with an internal thread. The outer circumferential surface of each of the plurality of contact members 18 may be provided with an external thread. Each of the plurality of contact members 18 is fixed within the corresponding recess 14r by being threaded onto the internal thread within the corresponding recess 14r.

[0074] Each of the plurality of contact members 18 provides a recess 18r that opens downward. Each of the plurality of contact members 18 includes a spring 183. The spring 183 is disposed within the recess 18r. The lower end of the spring 183 is fixed directly or indirectly to a wall surface that defines the recess 18r so that the spring 183 is horizontally deformable. When the corresponding protrusion 16p is fitted into the recess 18r, the spring 183 deforms horizontally and exerts a spring reaction force horizontally against the protrusion 16p. This fixes the inner wall member 16 to the support member 14. In the embodiment shown in FIG. 13 , when the inner wall member 16 is moved downward by the actuator 20, the fixation of the inner wall member 16 to the support member 14 is easily released.

[0075] 13, the spring 183 may be fixed to the wall surface that defines the recess 18r by a floating mechanism 184. The floating mechanism 184 absorbs any misalignment of the protrusion 16p in the horizontal direction.

[0076] A support member, an inner wall member, and a contact member according to another exemplary embodiment will be described below with reference to Fig. 14. Fig. 14 is a partially enlarged cross-sectional view of a support member, an inner wall member, and a contact member according to yet another exemplary embodiment. The support member, the inner wall member, and the contact member of the embodiment shown in Fig. 14 can be employed in the substrate processing apparatus 1.

[0077] In the embodiment shown in FIG. 14, the lower surface 14b of the support member 14 provides a plurality of recesses 14r. The recesses 14r are open downward. In the embodiment shown in FIG. 14, the upper surface of the top portion 16c provides a plurality of protrusions 16p. The plurality of protrusions 16p may include an upper portion 161 and a lower portion 162. The upper portion 161 is provided on the lower portion 162. The width of the upper portion 161 may be greater than the width of the lower portion 162.

[0078] In the embodiment shown in FIG. 14 , the multiple contact members 18 may be formed from a conductor such as metal. Each of the multiple contact members 18 is fixed to the top portion 16c so as to cover the corresponding protrusion 16p. Each of the multiple contact members 18 includes a cover portion 185. The cover portion 185 provides a cavity that is open at its lower end. The cover portion 185 covers the corresponding protrusion 16p housed in the cavity. The wall surfaces of the cover portion 185 that define the cavity contact the outer surfaces of the upper portion 161 and lower portion 162 of the corresponding protrusion 16p. When the cover portion 185 is attached to the corresponding protrusion 16p, it is placed over the corresponding protrusion 16p with the opening at its lower end enlarged.

[0079] Each of the plurality of contact members 18 further includes a spring 186. The spring 186 is provided on a side of the cover portion 185. The lower end of the spring 186 is fixed to the lower end of the cover portion 185. The spring 186 extends upward from the lower end of the cover portion 185 so as to be horizontally deformable. When each of the plurality of contact members 18 and the corresponding protrusion 16p are fitted into the corresponding recess 14r, the spring 186 deforms horizontally and exerts a spring reaction force in the horizontal direction against the support member 14. This fixes the inner wall member 16 to the support member 14. In the embodiment shown in FIG. 14 , when the inner wall member 16 is moved downward by the actuator 20, the fixation of the inner wall member 16 to the support member 14 is easily released.

[0080] A support member, an inner wall member, and a contact member according to another exemplary embodiment will be described below with reference to Fig. 15. Fig. 15 is a partially enlarged cross-sectional view of a support member, an inner wall member, and a contact member according to yet another exemplary embodiment. The support member, the inner wall member, and the contact member of the embodiment shown in Fig. 15 can be employed in the substrate processing apparatus 1.

[0081] In the embodiment shown in Fig. 15, the lower surface 14b of the support member 14 provides a single recess. The recess provided by the lower surface 14b of the support member 14 is approximately circular in plan view. In the embodiment shown in Fig. 15, the upper surface 16t of the top portion 16c provides a single protrusion. The protrusion provided by the upper surface 16t of the top portion 16c is approximately circular in plan view.

[0082] In the embodiment shown in FIG. 15 , the contact member 18 is a spiral spring gasket. In the embodiment shown in FIG. 15 , the contact member 18 may be formed from a conductor such as metal. The contact member 18 is provided to extend circumferentially along the inner wall surface defining the recess of the support member 14. The convex portion of the top portion 16 c of the contact member 18 is fitted into the recess of the support member 14, and the contact member 18, i.e., the spiral spring gasket, is sandwiched between the outer peripheral surface of the convex portion of the top portion 16 c and the inner wall surface defining the recess of the support member 14. This causes the contact member 18 to deform in the horizontal direction and exert a spring reaction force against the inner wall member 16, i.e., the outer peripheral surface of the convex portion of the top portion 16 c. This fixes the inner wall member 16 to the support member 14. In the embodiment shown in FIG. 15 , the fixation of the inner wall member 16 to the support member 14 is easily released by moving the inner wall member 16 downward using the actuator 20.

[0083] Hereinafter, a substrate processing apparatus according to another exemplary embodiment will be described with reference to FIG. 16. FIG. 16 is a diagram schematically illustrating a substrate processing apparatus according to another exemplary embodiment. The substrate processing apparatus 1B shown in FIG. 16 differs from the substrate processing apparatus 1 in that it includes an inner wall member 16B instead of the inner wall member 16. The inner wall member 16B has a ceiling portion 16c like the inner wall member 16, but does not have a side wall portion 16s. The other configurations of the substrate processing apparatus 1B are the same as the corresponding configurations of the substrate processing apparatus 1.

[0084] Substrate processing apparatuses according to several further exemplary embodiments will be described below. Each of the exemplary embodiments described below includes a contact mechanism that electrically connects the inner wall member 16 to a grounded conductor portion 28. The inner wall member 16 is formed from a conductive material. The conductor portion 28 has a cylindrical shape and extends along the outer periphery of the substrate support 12. The contact mechanism electrically connects a lower end 16e of a side wall portion 16s of the inner wall member 16 to the conductor portion 28.

[0085] Please refer to FIGS. 17, 18(a), and 18(b). FIG. 17 is a diagram schematically illustrating a substrate processing apparatus according to yet another exemplary embodiment. FIGS. 18(a) and 18(b) are each an enlarged plan view illustrating a portion of a contact mechanism in a substrate processing apparatus according to yet another exemplary embodiment. The substrate processing apparatus 1C illustrated in FIG. 17 differs from the substrate processing apparatus 1 in that it includes a contact mechanism 60C. As illustrated in FIGS. 17, 18(a), and 18(b), the contact mechanism 60C includes a cylindrical body 61, a pressing body 62, and a driving unit 63.

[0086] The cylindrical body 61 is made of a conductive material such as aluminum. The cylindrical body 61 is electrically connected to the conductor portion 28 and extends along the outer periphery of the conductor portion 28. The pressing body 62 is made of a conductive material such as aluminum. The pressing body 62 is disposed between the substrate support 12 and the cylindrical body 61. The driving unit 63 is configured to rotate the cylindrical body 61 in the circumferential direction. The driving unit 63 includes, for example, a motor. The contact mechanism 60C presses the pressing body 62 against the outer circumferential surface of the lower end 16e of the side wall portion 16s by rotating the cylindrical body 61 in the circumferential direction. In this way, the contact mechanism 60C electrically connects the inner wall member 16 to the conductor portion 28 via the pressing body 62 and the cylindrical body 61.

[0087] In one example, the conductor portion 28 includes a plurality of guides 28p protruding in the radial direction. The plurality of guides 28p are arranged in the circumferential direction. The contact mechanism 60C also includes a plurality of pressing bodies 62. The plurality of pressing bodies 62 are arranged in the circumferential direction. Each of the plurality of pressing bodies 62 provides a hole 62h into which a corresponding one of the plurality of guides 28p is inserted. Each of the plurality of pressing bodies 62 is movable in the radial direction by the corresponding guide inserted in the hole 62h. Each of the plurality of pressing bodies 62 further includes a protrusion 62p protruding radially outward. In the illustrated example, each of the plurality of pressing bodies 62 has a pair of rib-shaped protrusions 62p on both sides of the hole 62h. The cylindrical body 61 includes a plurality of protrusions 61p protruding radially inward. The plurality of protrusions 61p are arranged in the circumferential direction.

[0088] As shown in FIG. 18(a), when the protrusions 62p of the pressing bodies 62 are not in contact with the corresponding protrusions among the plurality of protrusions 61p, the pressing bodies 62 do not contact the lower end 16e of the side wall portion 16s. When the cylindrical body 61 is rotated so that the corresponding protrusions among the plurality of protrusions 61p are in contact with the protrusions 62p of the pressing bodies 62, as shown in FIG. 18(b), the pressing bodies 62 are pressed against the outer peripheral surface of the lower end 16e of the side wall portion 16s. As a result, the inner wall member 16 is electrically connected to the conductor portion 28 via the pressing bodies 62 and the cylindrical body 61. In the state shown in FIG. 18(b), the lower end 16e of the side wall portion 16s can be sandwiched between each of the pressing bodies 62 and the insulating portion 26.

[0089] Reference will now be made to Figures 19 and 20. Figure 19 is a diagram schematically illustrating a substrate processing apparatus according to yet another illustrative embodiment. Figure 20 is a partially enlarged cross-sectional view of a contact mechanism in the substrate processing apparatus according to yet another illustrative embodiment. The substrate processing apparatus 1D shown in Figure 19 differs from the substrate processing apparatus 1 in that it includes a contact mechanism 60D.

[0090] As shown in FIGS. 19 and 20 , in the substrate processing apparatus 1D, the conductor 28 has a recess 28r extending circumferentially at its upper end. The contact mechanism 60D includes a contact member 64. The contact member 64 is a resilient conductive member, such as a spiral spring gasket. The contact member 64 extends circumferentially within the recess 28r and is electrically connected to the conductor 28. In the contact mechanism 60D, the contact member 64 resiliently contacts the lower end 16e of the side wall 16s disposed within the recess 28r. This allows the contact mechanism 60D to electrically connect the inner wall member 16 to the conductor 28 via the contact member 64. Note that, as shown in the drawings, a pair of contact members 64 may sandwich the lower end 16e of the side wall 16s within the recess 28r.

[0091] Reference will now be made to Figures 21 and 22. Figure 21 is a diagram schematically illustrating a substrate processing apparatus according to yet another exemplary embodiment. Figure 22 is a perspective view illustrating an enlarged view of a portion of a contact mechanism in the substrate processing apparatus according to yet another exemplary embodiment. The substrate processing apparatus 1E shown in Figure 21 differs from the substrate processing apparatus 1 in that it includes a contact mechanism 60E.

[0092] As shown in FIGS. 21 and 22 , the contact mechanism 60E includes a plurality of male connectors 601E and a plurality of female connectors 602E. The plurality of male connectors 601E are attached to the lower end 16e of the side wall portion 16s and are arranged in a circumferential direction. The plurality of female connectors 602E are attached to the upper end of the conductor portion 28 and are arranged in a circumferential direction. The contact mechanism 60E electrically connects the inner wall member 16 to the conductor portion 28 by coupling each of the plurality of male connectors 601E to a corresponding female connector among the plurality of female connectors 602E. Note that the plurality of male connectors 601E may be attached to the upper end of the conductor portion 28, and the plurality of female connectors 602E may be attached to the lower end 16e of the side wall portion 16s.

[0093] Reference will now be made to Figures 23 and 24. Figure 23 is a diagram schematically illustrating a substrate processing apparatus according to yet another illustrative embodiment. Figure 24 is a partially enlarged cross-sectional view of a contact mechanism in the substrate processing apparatus according to yet another illustrative embodiment. The substrate processing apparatus 1F shown in Figure 23 differs from the substrate processing apparatus 1 in that it includes a contact mechanism 60F.

[0094] The contact mechanism 60F includes a contact member 65. The contact member 65 is a flexible thin film made of a conductive material. The contact member 65 is provided in a recess defined by the conductor portion 28. The contact member 65 is supported by the conductor portion 28 and electrically connected to the conductor portion 28. The contact member 65 is also provided so as to be able to abut against a lower surface defined by the lower end 16e of the side wall portion 16s. The contact mechanism 60F electrically connects the inner wall member 16 to the conductor portion 28 via the contact member 65 by pressing the contact member 65 against the lower surface of the side wall portion 16s. The lower surface of the lower end 16e of the side wall portion 16s may be provided by a film 16f on the lower end 16e. The film 16f may be made of a conductive film or carbon nanotubes.

[0095] In one example, the contact mechanism 60F may press the contact member 64 against the lower surface of the side wall portion 16s by the pressure of a fluid (e.g., gas). In this example, the contact mechanism 60F may further include a pressing pin 66. The pressing pin 66 is arranged so that the contact member 65 is located between its tip and the lower surface of the side wall portion 16s. The pressing pin 66 presses the contact member 65 against the lower surface of the side wall portion 16s by the pressure of gas supplied from a gas supplier 67. A spring 66s may be connected to the pressing pin 66 to bias the pressing pin 66 in a direction away from the contact member 65.

[0096] Reference is now made to FIG. 25 , which is a partially enlarged cross-sectional view of a contact mechanism according to yet another exemplary embodiment. The contact mechanism shown in FIG. 25 includes a piezoelectric element 68. The piezoelectric element 68 is supported by the insulating portion 2 and is provided below the lower end 16 e of the side wall portion 16 s. The piezoelectric element 68 includes a piezoelectric ceramic portion 68 a and a pair of electrodes 68 b, 68 c. The piezoelectric ceramic portion 68 a is provided between the pair of electrodes 68 b, 68 c. A conductor 69 is fixed to the upper surface of the piezoelectric element 68. The conductor 69 is electrically connected to the conductor portion 28. When a voltage from a power source 68 p is applied to the electrode 68 c, the piezoelectric element 68 extends toward the lower end 16 e of the side wall portion 16 s. This presses the conductor 69 against the lower surface of the lower end 16 e of the side wall portion 16 s. As a result, the inner wall member 16 is electrically connected to the conductor portion 28.

[0097] Reference will now be made to Figures 26, 27(a), and 27(b). Figure 26 is a diagram schematically illustrating a substrate processing apparatus according to yet another illustrative embodiment. Figures 27(a) and 27(b) are partially enlarged cross-sectional views of a contact mechanism in the substrate processing apparatus according to yet another illustrative embodiment. The substrate processing apparatus 1G shown in Figure 26 differs from the substrate processing apparatus 1 in that it includes a contact mechanism 60G.

[0098] In the substrate processing apparatus 1G, the conductor 28 has a generally cylindrical shape. The conductor 28 provides a cavity 28h that extends circumferentially about its central axis (i.e., axis AX). The conductor 28 also provides a plurality of openings 28o that extend between the cavity 28h and the space outside the conductor 28. The plurality of openings 28o may be arranged circumferentially. The plurality of openings 28o may also be arranged at equal intervals.

[0099] The contact mechanism 60G includes an inflatable seal 71, a plurality of pressing bodies 72, one or more elastic bodies 73, and an air supply unit 74. The inflatable seal 71 is provided in the cavity 28h. The inflatable seal 71 may have an annular shape and may extend circumferentially within the cavity 28h. The air supply unit 74 is configured to supply air to the inflatable seal 71. The inflatable seal 71 is configured to expand radially with air from the air supply unit 74.

[0100] Each of the multiple pressing bodies 72 is formed from a conductive material such as metal (e.g., aluminum). Each of the multiple pressing bodies 72 includes a first portion 721 and a second portion 722. The first portion 721 is provided between the inflatable seal 71 and a wall 28w of the conductor portion 28, which defines the multiple openings 28o. The second portion 722 extends from the first portion 721 into a corresponding one of the multiple openings 28o. In one embodiment, a tip 723 (radial tip) of the second portion 722 may be formed from a contact band.

[0101] Each of the one or more elastic bodies 73 is formed of a conductive material. The one or more elastic bodies 73 are provided between the first portion 721 and the wall 28w. Each of the one or more elastic bodies 73 may have a ring shape and may extend circumferentially within the cavity 28h. Each of the one or more elastic bodies 73 may be, for example, a canted coil spring. In the illustrated example, one of the two elastic bodies 73 is provided above the second portion 722, and the other of the two elastic bodies 73 is provided below the second portion 722.

[0102] 27(a), when the inflatable seal 71 is not inflated, the second portion 722 of each of the multiple pressing bodies 72 does not contact the inner circumferential surface of the lower end 12e of the inner wall member 16. On the other hand, as shown in FIG. 27(b), when the inflatable seal 71 expands radially, each of the multiple pressing bodies 72 clamps one or more elastic bodies 73 between the first portion 721 and the wall 28w, causing the tip 723 of the second portion 722 to abut against the inner circumferential surface of the lower end 12e.

[0103] The contact mechanism 60G electrically connects the inner wall member 16 to the conductor 28 via the multiple pressing bodies 72 and one or more elastic bodies 73 by radially moving each of the multiple pressing bodies 72 to bring the tip 723 of the second portion 722 into contact with the inner circumferential surface of the lower end 12e. Therefore, it is possible to electrically connect the inner wall member 16 to the conductor 28 without generating friction between the members of the contact mechanism 60G and the inner wall member 16. Therefore, the contact mechanism 60G can suppress the generation of particles due to friction. Note that in the substrate processing apparatus 1G, the number of pressing bodies 72 and the number of openings 28o may each be one.

[0104] Reference will now be made to Figures 28 and 29. Figure 28 is a diagram schematically illustrating a substrate processing apparatus according to yet another exemplary embodiment. Figure 29 is a partially enlarged cross-sectional view of the substrate processing apparatus according to yet another exemplary embodiment. Differences between the substrate processing apparatus 1H shown in Figure 28 and the substrate processing apparatus 1 will be described below.

[0105] In the substrate processing apparatus 1H, the conductor 28 has a generally cylindrical shape. The conductor 28 is provided above the bottom of the chamber 10 so as to be slidable in any horizontal direction. In one embodiment, the substrate processing apparatus 1H may further include a thrust bearing 77. The thrust bearing 77 is disposed between the bottom of the chamber 10 and the head of a bolt 78 threaded into the bottom. The conductor 28 is slidably supported above the bottom of the chamber 10 via the thrust bearing 77. In one embodiment, the conductor 28 has a reduced-diameter portion 28s at its lower end. The reduced-diameter portion 28s is disposed between the thrust bearing 77 and the head of the bolt 78. In the illustrated example, two thrust bearings 77 are provided between the bottom of the chamber 10 and the head of the bolt 78. One of the two thrust bearings 77 is disposed between the bottom of the chamber 10 and the reduced-diameter portion 28s. The other of the two thrust bearings 77 is disposed between the reduced-diameter portion 28s and the head of the bolt 78. A washer 79 is disposed between the other of the two thrust bearings 77 and the head of the bolt 78 .

[0106] The conductor 28 has a generally cylindrical shape, and the outer peripheral surface 28t of its top portion 28u is tapered. The inner peripheral surface 16i of the lower end 16e of the side wall portion 16s of the inner wall member 16 is tapered to correspond to the outer peripheral surface 28t. The outer peripheral surface 28t and the inner peripheral surface 16i are in direct or indirect contact with each other. This electrically connects the inner wall member 16 to the conductor 28. In one embodiment, a contact band 28b is provided on the outer peripheral surface 28t. The outer peripheral surface 28t and the inner peripheral surface 16i are in indirect contact with each other via the contact band 28b. The lower end of the conductor 28 and the bottom of the chamber 10 may also be electrically connected via a connecting member 76. The connecting member 76 is an elastic and conductive member fixed to the bottom of the chamber 10. The connecting member 76 is, for example, a contact band or a conductive spiral.

[0107] In the substrate processing apparatus 1H, even if there is a misalignment between the central axis of the inner wall member 16 and the central axis of the conductor 28, the horizontal movement of the conductor 28 ensures uniform electrical contact in the circumferential direction between the lower end 16e of the inner wall member 16 and the top end 28u of the conductor 28. Furthermore, since there is little friction between the lower end 16e of the inner wall member 16 and the top end 28u of the conductor 28 (or the contact band 28b), the generation of particles is suppressed.

[0108] Reference will now be made to FIG. 30 , which is a partially enlarged cross-sectional view of a substrate processing apparatus according to yet another illustrative embodiment. Differences between the structure shown in FIG. 30 and the structures of the substrate processing apparatus shown in FIGS. 28 and 29 will be described below. As shown in FIG. 30 , the bolt 78 may be threaded into a thrust nut 78 n provided below the reduced diameter portion 28 s, and the reduced diameter portion 28 s may be sandwiched between the head of the bolt 78 and the thrust nut 78 n. Furthermore, the thrust bearing 77 may be provided in a cavity within the bottom of the chamber 10, and may be disposed between an upper wall defining the cavity and the thrust nut 78 n.

[0109] Reference will now be made to Fig. 31, which is a partially enlarged cross-sectional view of a substrate processing apparatus according to yet another exemplary embodiment. In the various exemplary embodiments described above, as shown in Fig. 31, an inflatable seal 80 may be used instead of the actuator 20 to release the fixation of the inner wall member 16 from the support member 14.

[0110] Specifically, the inflatable seal 80 is provided in a recess provided by the lower surface 14b of the support member 14. The inflatable seal 80 is inflated downward by air supplied from an air supplier 81. The downward expansion of the inflatable seal 80 moves the inner wall member 16 downward, and the fixation of the inner wall member 16 to the support member 14 is released.

[0111] Although various exemplary embodiments have been described above, the present invention is not limited to the above-described exemplary embodiments, and various additions, omissions, substitutions, and modifications may be made. Furthermore, elements in different embodiments may be combined to form other embodiments.

[0112] The transfer module CTM may not be movable, but may be fixedly connected to the chamber of the substrate processing apparatus according to the various exemplary embodiments described above. Alternatively, instead of the transfer module CTM, the transfer module TM may be used as a module for transferring the inner wall member 16 between the inside and outside of the chamber 10.

[0113] Various exemplary embodiments included in the present disclosure are now described in [E1] to [E31] below.

[0114] [E1] a chamber including a sidewall providing an opening; a substrate support disposed within the chamber; a support member provided above the substrate support; an inner wall member including a ceiling portion positionable above the substrate support and below the support member; a contact member attached to one of the support member and the inner wall member, the contact member configured to exert a horizontal spring reaction force on the other of the support member and the inner wall member, thereby detachably fixing the inner wall member to the support member; an actuator configured to move the inner wall member downward to release the inner wall member from the support member; A substrate processing apparatus comprising:

[0115] In the substrate processing apparatus of the embodiment [E1], the contact member is deformed by the other of the support member and the inner wall member, thereby exerting a horizontal spring reaction force on the other member. This fixes the inner wall member to the support member. Furthermore, the fixation of the inner wall member to the support member is easily released by moving the inner wall member downward with an actuator against the spring reaction force of the contact member. The inner wall member, whose fixation to the support member has been released, can be transported from the inside of the chamber to the outside through an opening in the side wall of the chamber. Therefore, according to the embodiment [E1], the inner wall member can be easily maintained.

[0116] [E2] a lower surface of the support member providing a recess; an upper surface of the top portion provides a recess; The contact member is a first portion fitted into the recess of the support member; a second portion extending downward from the first portion and having a spring that exerts the spring reaction force by being fitted into the recess of the top portion; Including, [E1] The substrate processing apparatus according to the present invention.

[0117] [E3] The contact member is configured to be detachable from the support member, the first portion has elasticity such that the first portion can be removed from the recess of the support member by deformation in a horizontal direction when the contact member is removed from the support member. [E2] The substrate processing apparatus according to the present invention.

[0118] [E4] The substrate processing apparatus according to [E3], wherein the recess of the support member is narrowed at a lower end opening of the recess of the support member.

[0119] [E5] The top surface of the top portion provides a convex portion, the contact member is fixed in a recess provided in a lower surface of the support member, the recess being open downward; the contact member includes a spring disposed within the recess of the contact member; The spring of the contact member exerts the spring reaction force when the convex portion of the top portion is fitted into the concave portion of the contact member. [E1] The substrate processing apparatus according to the present invention.

[0120] [E6] The substrate processing apparatus according to [E5], wherein the contact member further includes a floating mechanism that supports the spring.

[0121] [E7] the lower surface of the support member presents internal threads; The outer peripheral surface of the contact member provides a male thread that is screwed into the female thread. The substrate processing apparatus according to [E5] or [E6].

[0122] [E8] a lower surface of the support member providing a recess; The top surface of the top portion provides a convex portion, the contact member is fixed to the top portion so as to cover the protrusion, and has a spring that exerts the spring reaction force when the protrusion and the contact member are fitted into the recess of the support member. [E1] The substrate processing apparatus according to the present invention.

[0123] [E9] a lower surface of the support member providing a recess; The top surface of the top portion provides a convex portion, the contact member is a spiral spring gasket provided along an inner wall surface that defines the recess, The spiral spring gasket exerts the spring reaction force by fitting the convex portion into the concave portion. [E1] The substrate processing apparatus according to the present invention.

[0124] [E10] The substrate processing apparatus according to any one of [E1] to [E9], wherein the inner wall member is configured to be transportable between the inside and outside of the chamber via the opening by a transport arm.

[0125] [E11] The substrate processing apparatus according to any one of [E1] to [E10], further comprising a heat transfer sheet sandwiched between the support member and the ceiling portion.

[0126] [E12] The substrate processing apparatus according to any one of [E1] to [E11], wherein the support member and the ceiling portion form a shower head configured to supply gas into the chamber.

[0127] [E13] The substrate processing apparatus according to any one of [E1] to [E12], wherein the support member provides a flow path through which a heat medium flows.

[0128] [E14] A substrate processing apparatus described in any one of [E1] to [E13], wherein the inner wall member further includes a side wall portion extending downward from the peripheral portion of the ceiling portion, and together with the substrate support forms a processing space in which a substrate placed on the substrate support is processed.

[0129] [E15] The substrate processing apparatus according to [E14], wherein the substrate processing apparatus is a plasma processing apparatus.

[0130] [E16] a conductor portion having a cylindrical shape, extending along the outer periphery of the substrate support, and being grounded; a contact mechanism electrically connecting a lower end of the side wall portion to the conductor portion, thereby electrically connecting the inner wall member to the conductor portion; The substrate processing apparatus according to [E15], further comprising:

[0131] [E17] The contact mechanism includes: a cylindrical body made of a conductive material, electrically connected to the conductor portion, and extending along an outer periphery of the conductor portion; a pressing body made of a conductive material and disposed between the substrate support and the cylindrical body; a drive unit configured to rotate the cylindrical body in a circumferential direction; Including, the contact mechanism is configured to press the pressing body against the outer peripheral surface of the lower end of the side wall portion by rotating the cylindrical body in the circumferential direction, thereby electrically connecting the inner wall member to the conductor portion via the pressing body and the cylindrical body. The substrate processing apparatus according to [E16].

[0132] [E18] an upper end of the conductor portion provides a circumferentially extending recess; the contact mechanism includes another elastic contact member; the other contact member extends circumferentially within the recess of the conductor portion and is electrically connected to the conductor portion; the other contact member is configured to elastically contact the lower end of the side wall portion within the recess, thereby electrically connecting the inner wall member to the conductor portion via the other contact member. The substrate processing apparatus according to [E16].

[0133] [E19] The contact mechanism includes: a plurality of male connectors attached to one of the lower end of the side wall portion and the upper end of the conductor portion; a plurality of female connectors attached to the other of the lower end of the side wall portion and the upper end of the conductor portion; Including, The substrate processing apparatus described in [E16], wherein the contact mechanism is configured to electrically connect the inner wall member to the conductor portion by coupling each of the plurality of male connectors with a corresponding female connector among the plurality of female connectors.

[0134] [E20] the contact mechanism includes another contact member provided so as to be able to come into contact with a lower surface provided by the lower end of the side wall portion, The substrate processing apparatus described in [E16], wherein the contact mechanism is configured to electrically connect the inner wall member to the conductor portion via the other contact member by pressing the other contact member against the lower surface of the side wall portion.

[0135] [E21] The substrate processing apparatus according to [E20], wherein the contact mechanism is configured to press the other contact member against the lower surface of the side wall portion by a pressure of a fluid.

[0136] [E22] The substrate processing apparatus according to [E20], wherein the contact mechanism further includes a piezoelectric element configured to press the other contact member against the lower surface of the side wall portion.

[0137] [E23] The substrate processing apparatus according to any one of [E1] to [E22], wherein the support member constitutes an upper electrode of a capacitively coupled plasma processing apparatus.

[0138] [E24] the conductor portion has a cavity extending therein along a circumferential direction relative to a central axis of the conductor portion, and an opening extending between the cavity and a space outside the conductor portion; The contact mechanism includes: an inflatable seal disposed within the cavity; a pressing body made of a conductive material, the pressing body including a first portion disposed in the cavity between the expandable seal and a wall of the conductor portion that defines the opening, and a second portion extending from the first portion into the opening; an elastic body made of a conductive material and disposed between the first portion and the wall of the conductor portion; an air supply configured to supply air to the inflatable seal; Including, The pressing body is configured such that, when the inflatable seal is inflated by the air from the air supply section, the elastic body is sandwiched between the first portion and the wall of the conductor section, and the tip of the second portion is brought into contact with the inner circumferential surface of the lower end of the side wall section. The substrate processing apparatus according to [E16].

[0139] [E25] The substrate processing apparatus according to [E24], wherein the tip of the second portion is formed from a contact band.

[0140] [E26] The substrate processing apparatus according to [E24] or [E25], wherein the elastic body is an obliquely wound coil spring.

[0141] [E27] a grounded conductor having a cylindrical shape, extending along an outer periphery of the substrate support, the conductor being horizontally slidably disposed above a bottom of the chamber; the outer peripheral surface of the top of the conductor portion is a tapered surface, an inner peripheral surface of a lower end of the side wall portion is a tapered surface corresponding to an outer peripheral surface of a top portion of the conductor portion; The outer peripheral surface of the top of the conductor portion and the inner peripheral surface of the lower end of the side wall portion are configured to be in direct or indirect contact with each other. The substrate processing apparatus according to [E15].

[0142] [E28] The substrate processing apparatus according to [E27], further comprising a contact band provided on the outer peripheral surface of the top of the conductor portion.

[0143] [E29] a thrust bearing disposed between the bottom of the chamber and a head of a bolt threadedly engaged with the bottom; the conductor portion is slidably supported above the bottom of the chamber via a thrust bearing; The substrate processing apparatus according to [E27] or [E28].

[0144] [E30] a process of loading an inner wall member into a chamber of a substrate processing apparatus from the outside of the chamber to the inside of the chamber through an opening provided in a sidewall of the chamber by a transport arm, the substrate processing apparatus including the chamber, a substrate support provided in the chamber, and a support member provided above the substrate support, the inner wall member including a ceiling portion that can be positioned above the substrate support and below the support member; a step of detachably fixing the inner wall member to the support member by moving one of the support member and the inner wall member along a vertical direction, wherein a contact member attached to one of the support member and the inner wall member exerts a horizontal spring reaction force on the other of the support member and the inner wall member, thereby fixing the inner wall member to the support member; A maintenance method for a substrate processing apparatus comprising:

[0145] [E31] a process of inserting a transport arm from the outside of a chamber of a substrate processing apparatus into the inside of the chamber through an opening provided in a sidewall of the chamber, the substrate processing apparatus comprising: the chamber; a substrate support provided in the chamber; a support member provided above the substrate support; an inner wall member including a ceiling portion located above the substrate support and below the support member; and a contact member attached to one of the support member and the inner wall member, the contact member being configured to exert a horizontal spring reaction force on the other of the support member and the inner wall member, thereby detachably fixing the inner wall member to the support member; a step of transferring the inner wall member to the transfer arm by moving the inner wall member downward using an actuator to release the inner wall member from being fixed by the contact member; carrying the inner wall member from inside the chamber to outside the chamber through the opening; A maintenance method for a substrate processing apparatus comprising:

[0146] From the foregoing, it will be understood that various embodiments of the present disclosure have been described herein for purposes of illustration, and that various modifications may be made without departing from the scope and spirit of the present disclosure. Accordingly, the various embodiments disclosed herein are not intended to be limiting, with the true scope and spirit being indicated by the appended claims. [Explanation of symbols]

[0147] 1...substrate processing apparatus, 10...chamber, 12...substrate support, 14...support member, 16...inner wall member, 16c...ceiling portion, 18...contact member, 20...actuator

Claims

1. a chamber including a sidewall providing an opening; a substrate support disposed within the chamber; a support member provided above the substrate support; an inner wall member including a ceiling portion positionable above the substrate support and below the support member; a contact member attached to one of the support member and the inner wall member, the contact member configured to exert a horizontal spring reaction force on the other of the support member and the inner wall member, thereby detachably fixing the inner wall member to the support member; an actuator configured to move the inner wall member downward to release the inner wall member from the support member; A substrate processing apparatus comprising:

2. a lower surface of the support member providing a recess; an upper surface of the top portion provides a recess; The contact member is a first portion fitted into the recess of the support member; a second portion extending downward from the first portion and having a spring that exerts the spring reaction force by being fitted into the recess of the top portion; Including, The substrate processing apparatus according to claim 1 .

3. The contact member is configured to be detachable from the support member, the first portion has elasticity such that the first portion can be removed from the recess of the support member by deformation in a horizontal direction when the contact member is removed from the support member; The substrate processing apparatus according to claim 2 .

4. The substrate processing apparatus according to claim 3 , wherein the recess of the support member is narrowed at a lower end opening of the recess of the support member.

5. The top surface of the top portion provides a convex portion, the contact member is fixed in a recess provided in a lower surface of the support member, the recess being open downward; the contact member includes a spring disposed within the recess of the contact member; The spring of the contact member exerts the spring reaction force when the convex portion of the top portion is fitted into the concave portion of the contact member. The substrate processing apparatus according to claim 1 .

6. The substrate processing apparatus according to claim 5 , wherein the contact member further includes a floating mechanism that supports the spring.

7. the lower surface of the support member presents internal threads; The outer peripheral surface of the contact member provides a male thread that is screwed into the female thread. The substrate processing apparatus according to claim 5 .

8. a lower surface of the support member providing a recess; The top surface of the top portion provides a convex portion, the contact member is fixed to the top portion so as to cover the protrusion, and has a spring that exerts the spring reaction force when the protrusion and the contact member are fitted into the recess of the support member. The substrate processing apparatus according to claim 1 .

9. a lower surface of the support member providing a recess; The top surface of the top portion provides a convex portion, the contact member is a spiral spring gasket provided along an inner wall surface that defines the recess, The spiral spring gasket exerts the spring reaction force by fitting the convex portion into the concave portion. The substrate processing apparatus according to claim 1 .

10. 10. The substrate processing apparatus according to claim 1, wherein the inner wall member is configured to be transportable between the inside and outside of the chamber via the opening by a transport arm.

11. 10. The substrate processing apparatus according to claim 1, further comprising a heat transfer sheet sandwiched between the support member and the ceiling portion.

12. 10. The substrate processing apparatus according to claim 1, wherein the support member and the ceiling portion form a shower head configured to supply gas into the chamber.

13. 10. The substrate processing apparatus according to claim 1, wherein the support member provides a flow path through which a heat transfer medium flows.

14. The substrate processing apparatus according to any one of claims 1 to 9, wherein the inner wall member further includes a side wall portion extending downward from a peripheral edge portion of the ceiling portion, and together with the substrate support, forms a processing space in which a substrate placed on the substrate support is processed.

15. The substrate processing apparatus according to claim 14, wherein the substrate processing apparatus is a plasma processing apparatus.

16. a conductor portion having a cylindrical shape, extending along the outer periphery of the substrate support, and being grounded; a contact mechanism electrically connecting a lower end of the side wall portion to the conductor portion, thereby electrically connecting the inner wall member to the conductor portion; The substrate processing apparatus of claim 15 further comprising:

17. The contact mechanism includes: a cylindrical body made of a conductive material, electrically connected to the conductor portion, and extending along an outer periphery of the conductor portion; a pressing body made of a conductive material and disposed between the substrate support and the cylindrical body; a drive unit configured to rotate the cylindrical body in a circumferential direction; Including, the contact mechanism is configured to press the pressing body against the outer peripheral surface of the lower end of the side wall portion by rotating the cylindrical body in the circumferential direction, thereby electrically connecting the inner wall member to the conductor portion via the pressing body and the cylindrical body. The substrate processing apparatus of claim 16 .

18. an upper end of the conductor portion provides a circumferentially extending recess; the contact mechanism includes another elastic contact member; the other contact member extends circumferentially within the recess of the conductor portion and is electrically connected to the conductor portion; the other contact member is configured to elastically contact the lower end of the side wall portion within the recess, thereby electrically connecting the inner wall member to the conductor portion via the other contact member. The substrate processing apparatus of claim 16 .

19. The contact mechanism includes: a plurality of male connectors attached to one of the lower end of the side wall portion and the upper end of the conductor portion; a plurality of female connectors attached to the other of the lower end of the side wall portion and the upper end of the conductor portion; Including, The substrate processing apparatus according to claim 16, wherein the contact mechanism is configured to electrically connect the inner wall member to the conductor portion by coupling each of the plurality of male connectors with a corresponding one of the plurality of female connectors.

20. the contact mechanism includes another contact member provided so as to be able to come into contact with a lower surface provided by the lower end of the side wall portion, The substrate processing apparatus according to claim 16, wherein the contact mechanism is configured to electrically connect the inner wall member to the conductor portion via the other contact member by pressing the other contact member against the lower surface of the side wall portion.

21. The substrate processing apparatus according to claim 20 , wherein the contact mechanism is configured to press the other contact member against the lower surface of the sidewall portion by a pressure of a fluid.

22. The substrate processing apparatus of claim 20 , wherein the contact mechanism further includes a piezoelectric element configured to press the other contact member against the lower surface of the sidewall portion.

23. 10. The substrate processing apparatus according to claim 1, wherein the support member constitutes an upper electrode of a capacitively coupled plasma processing apparatus.

24. the conductor portion has a cavity extending therein along a circumferential direction relative to a central axis of the conductor portion, and an opening extending between the cavity and a space outside the conductor portion; The contact mechanism includes: an inflatable seal disposed within the cavity; a pressing body made of a conductive material, the pressing body including a first portion disposed in the cavity between the expandable seal and a wall of the conductor portion that defines the opening, and a second portion extending from the first portion into the opening; an elastic body made of a conductive material and disposed between the first portion and the wall of the conductor portion; an air supply configured to supply air to the inflatable seal; Including, The pressing body is configured such that, when the expandable seal is expanded by the air from the air supply section, the elastic body is sandwiched between the first portion and the wall of the conductor section, and a tip of the second portion is brought into contact with an inner circumferential surface of the lower end of the side wall section. The substrate processing apparatus of claim 16 .

25. The substrate processing apparatus of claim 24 , wherein the tip of the second portion is formed from a contact band.

26. The substrate processing apparatus according to claim 24, wherein the elastic body is an obliquely wound coil spring.

27. a grounded conductor having a cylindrical shape, extending along an outer periphery of the substrate support, the conductor being slidably disposed in a horizontal direction above a bottom of the chamber; the outer peripheral surface of the top of the conductor portion is a tapered surface, an inner peripheral surface of a lower end of the side wall portion is a tapered surface corresponding to an outer peripheral surface of a top portion of the conductor portion; The outer peripheral surface of the top of the conductor portion and the inner peripheral surface of the lower end of the side wall portion are configured to be in direct or indirect contact with each other. The substrate processing apparatus according to claim 15 .

28. The substrate processing apparatus of claim 27 , further comprising a contact band provided on the outer circumferential surface of the top of the conductor portion.

29. a thrust bearing disposed between the bottom of the chamber and a head of a bolt threadedly engaged with the bottom; the conductor portion is slidably supported above the bottom of the chamber via a thrust bearing; The substrate processing apparatus of claim 27.

30. a process of loading an inner wall member into a chamber of a substrate processing apparatus from the outside of the chamber to the inside of the chamber through an opening provided in a sidewall of the chamber by a transport arm, the substrate processing apparatus including the chamber, a substrate support provided in the chamber, and a support member provided above the substrate support, the inner wall member including a ceiling portion that can be positioned above the substrate support and below the support member; a step of detachably fixing the inner wall member to the support member by moving one of the support member and the inner wall member along a vertical direction, wherein a contact member attached to one of the support member and the inner wall member exerts a horizontal spring reaction force on the other of the support member and the inner wall member, thereby fixing the inner wall member to the support member; A maintenance method for a substrate processing apparatus comprising:

31. a process of inserting a transport arm from the outside of a chamber of a substrate processing apparatus into the inside of the chamber through an opening provided in a sidewall of the chamber, the substrate processing apparatus comprising: the chamber; a substrate support provided in the chamber; a support member provided above the substrate support; an inner wall member including a ceiling portion located above the substrate support and below the support member; and a contact member attached to one of the support member and the inner wall member, the contact member being configured to exert a horizontal spring reaction force on the other of the support member and the inner wall member, thereby detachably fixing the inner wall member to the support member; a step of transferring the inner wall member to the transfer arm by moving the inner wall member downward using an actuator to release the inner wall member from being fixed by the contact member; carrying the inner wall member from inside the chamber to outside the chamber through the opening; A maintenance method for a substrate processing apparatus comprising:

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