Nozzle assembly, evaporation source, deposition system, and method for depositing evaporated material on a substrate

Abstract

A nozzle assembly for directing vaporized material to a substrate is described, the nozzle assembly including a plurality of nozzles, one or more of the plurality of nozzles including a first nozzle section having a first end and a second end, the first nozzle section including a vapor outlet at the second end, and an orifice at or adjacent to the vapor outlet, the orifice having an orifice diameter.

Description

[Technical Field]

[0001]

[0001] Embodiments of the present disclosure relate to coating substrates by thermal evaporation in a vacuum chamber. Embodiments of the present disclosure further relate to depositing one or more coating strips onto flexible substrates, such as flexible metal foils, via evaporation. In particular, embodiments relate to depositing lithium onto flexible foils, for example, for the production of Li batteries. Specifically, embodiments relate to a vapor deposition apparatus, a method for coating a substrate in a vacuum chamber, and a method for installing the vapor deposition apparatus. [Background technology]

[0002]

[0002] Various techniques for depositing on a substrate are known, such as chemical vapor deposition (CVD) and physical vapor deposition (PVD). For deposition at high deposition rates, thermal evaporation can be used as a PVD process. In thermal evaporation, a source material is heated to produce a vapor that can be deposited on the substrate, for example. Increasing the temperature of the heated source material increases the vapor concentration and can facilitate high deposition rates. The temperature to achieve high deposition rates depends on the physical properties of the source material, such as its vapor pressure as a function of temperature, and may be limited by the properties or physical limitations of the substrate, such as its melting point.

[0003] For example, the material to be deposited on the substrate can be heated in a crucible to generate a vapor at a high vapor pressure. The vapor can be transported from the crucible to a heated vapor distributor having multiple nozzles. The vapor can be directed by one or more nozzles onto the substrate in a coating area, for example, in a vacuum chamber.

[0004]

[0004] For the manufacture of batteries such as Li batteries, deposition of metals, such as lithium, by vapor deposition onto flexible substrates, such as copper substrates, can be used. For example, to manufacture a battery anode, a lithium layer can be deposited on a thin flexible substrate. After assembling the anode layer stack and the cathode layer stack, optionally with an electrolyte and / or separator therebetween, the manufactured layer arrangement can be rolled or otherwise stacked to manufacture a Li battery.

[0005]

[0005] In vapor deposition processes, especially at high deposition rates, the heat load on the substrate can be primarily supplied by the condensation energy of the material deposited on the substrate. In particular, for example, in a roll-to-roll process, the heat load on the substrate is a process parameter that should be well controlled. It is beneficial to have the heat load well controlled while increasing or maximizing the deposition rate.

[0006]

[0006] Therefore, it would be beneficial to have a vapor deposition apparatus and method for coating substrates in a vacuum chamber in which the heat load on the substrate can be improved, especially at high deposition rates. Furthermore, source material utilization is advantageously improved, which can reduce manufacturing costs and improve layer quality. Summary of the Invention

[0007]

[0007] In view of the foregoing, there are provided a nozzle assembly, evaporation source, deposition system, and method for coating a substrate in a vacuum chamber, and a method for depositing evaporated material onto a substrate. Further aspects, advantages, and features of the present disclosure will be apparent from the description and accompanying drawings.

[0008] According to one embodiment, a nozzle assembly for directing vaporized material to a substrate is provided, the nozzle assembly including a plurality of nozzles, one or more of the plurality of nozzles including a first nozzle section having a first end and a second end, the first nozzle section including a vapor outlet at the second end, and an orifice at or adjacent to the vapor outlet, the orifice having an orifice diameter.

[0009] According to one embodiment, there is provided an evaporation source for depositing evaporated material on a substrate, the evaporation source including a nozzle assembly including a plurality of nozzle rows extending in a column direction and arranged adjacent to one another, the plurality of nozzle rows being offset relative to one another in the column direction by a column offset.

[0010] According to one embodiment, an evaporation source for depositing evaporated material on a substrate is provided. The evaporation source includes a nozzle assembly including a plurality of nozzle rows extending in a column direction and arranged adjacent to one another, the plurality of nozzle rows being offset relative to one another in the column direction by a column offset. One or more of the plurality of nozzles includes a first nozzle section having a first end and a second end, the first nozzle section including a vapor outlet at the second end, and an orifice at or adjacent to the vapor outlet, the orifice having an orifice diameter.

[0011] According to one embodiment, a deposition system for depositing evaporated material onto a substrate is provided, the deposition system including one or more evaporation sources according to embodiments of the present disclosure and a transport device for transporting the substrate toward the one or more evaporation sources.

[0012] According to one embodiment, there is provided a method for depositing evaporated material on a substrate, the method including transporting the substrate to an evaporation source, the evaporation source including a nozzle assembly according to any embodiment described herein, and directing the evaporated material through multiple nozzles of the nozzle assembly to deposit a defocused plume of material on the substrate. [Brief explanation of the drawings]

[0013]

[0013] In order that the above-described features of the present disclosure may be understood in detail, the present disclosure summarized above will be more particularly described by reference to embodiments. The accompanying drawings relate to embodiments of the present disclosure and are described below.

[0014] [Figure 1] 1 is a schematic cross-sectional view illustrating a vapor deposition apparatus according to an embodiment of the present disclosure. [Figure 2A] FIG. 2 is a schematic cross-sectional view illustrating a nozzle of an evaporator according to an embodiment of the present disclosure. [Figure 2B] FIG. 2 is a schematic cross-sectional view illustrating a nozzle of an evaporator according to an embodiment of the present disclosure. [Figure 3] FIG. 1 is a schematic diagram illustrating a vapor deposition apparatus according to an embodiment of the present disclosure. [Figure 4] FIG. 2 is a schematic diagram illustrating a nozzle region of an evaporator according to an embodiment of the present disclosure. [Figure 5] 1 is a flow diagram illustrating a method for coating a substrate in a vacuum chamber according to embodiments described herein. [Figure 6] FIG. 1 is a flow diagram illustrating a method for depositing a layer, particularly a thick layer, more particularly a thick Li layer, on a thin substrate according to embodiments described herein. DETAILED DESCRIPTION OF THE INVENTION

[0015] Reference will now be made in detail to various embodiments of the present disclosure, one or more examples of which are illustrated in the figures. Within the following description of the drawings, like reference numerals refer to like components. Only the differences with respect to individual embodiments will be described. Each example is provided by way of explanation of the disclosure and not as a limitation thereof. Furthermore, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield still further embodiments. This specification is intended to include all such modifications and variations.

[0016]

[0015] In the following description of the drawings, the same reference numerals refer to the same or similar components. Generally, only the differences with respect to individual embodiments are described. Unless otherwise specified, the description of a part or aspect in one embodiment also applies to the corresponding part or aspect in other embodiments.

[0017]

[0016] Embodiments of the present disclosure relate to thin film coating by evaporation into a vacuum chamber. The material to be deposited on a substrate is heated to an evaporation temperature. The evaporation rate can be increased by increasing the temperature. According to some embodiments, which can be combined with other embodiments described herein, the evaporation temperature for a given coating rate can depend on the vapor pressure curve of the material. Vapors of the material to be deposited on the substrate condense on a substrate surface having a temperature lower than the vapor pressure-related temperature.

[0018]

[0017] When a material condenses, the vapor introduces condensation energy into the substrate, heating the substrate. Particularly for processes in a vacuum chamber according to embodiments of the present disclosure, the heat load on the substrate may be primarily due to condensation energy. For thin substrates, such as webs or foils, the heat load is advantageously well controlled. Embodiments of the present disclosure reduce or avoid temperature hot spots on the substrate.

[0019]

[0018] According to embodiments of the present disclosure, an apparatus and method for coating by evaporation in a vacuum chamber are provided. To deposit a source material on a substrate by evaporation, the source material can be heated within a vapor source, such as within a crucible of the vapor source, above the evaporation or sublimation temperature of the source material. Embodiments of the present disclosure can reduce condensation on surfaces other than the substrate surface, thereby reducing cleaning operations and material waste due to stray coating in the vacuum chamber. Furthermore, embodiments of the present disclosure provide well-defined, sharp coating layer edges on substrates, even when the substrate is flexible and / or curved during vapor deposition. Furthermore, embodiments disclosed herein can enable precise substrate edge masking, even when the substrate is coated while positioned on a moving substrate support, particularly the curved drum surface of a coating drum.

[0020] 1 is a schematic diagram of a vapor deposition apparatus 100 according to an embodiment described herein. The vapor deposition apparatus 100 includes a substrate support 110 for supporting a substrate 10 to be coated. The vapor deposition apparatus 100 further includes a vapor source 120 having a plurality of nozzles 121 for directing vapor 15 toward the substrate support 110 through a vapor propagation region 20. The vapor propagation region 20 can be understood as the region or space between the vapor source 120 and the substrate support into which the vapor is directed by the plurality of nozzles 121. It is beneficial for at least a majority of the vapor emitted by the plurality of nozzles 121 to be confined to the vapor propagation region 20, i.e., a defined region downstream of the plurality of nozzles 121, so that stray coating of other components inside the vacuum chamber but outside the vapor propagation region 20, such as the walls of the vacuum chamber, can be reduced or avoided.

[0021] In some embodiments described herein, the substrate support 110 is movable, allowing the substrate 10 to be moved past the vapor source 120 during vapor deposition. Precise masking of areas of the substrate 10 that should be kept free of coating material, particularly the substrate edge (also referred to herein as "edge exclusion"), can be provided.

[0022] In some implementations, the substrate support 110 is a rotatable drum having a curved drum surface 111, and the vapor deposition apparatus is configured to move the substrate 10 on the curved drum surface 111 in a circumferential direction T past the vapor source 120. For example, the substrate may be a flexible web or foil, and the vapor deposition system may be a roll-to-roll deposition system.

[0023] As used herein, the "circumferential direction T" may be understood as the direction along the circumference of the coating drum corresponding to the direction of movement of the curved drum surface 111 as the coating drum rotates about axis A, and the circumferential direction corresponds to the direction of substrate transport as the substrate is moved over the vapor source 120 on the curved drum surface A. In some embodiments, the coating drum may have a diameter ranging from 300 mm to 1400 mm or more.

[0024] The vapor deposition apparatus 100 may be a roll-to-roll deposition system for coating flexible substrates, such as foils. The substrate to be coated may have a thickness of 50 μm or less, particularly 20 μm or less, or even 6 μm or less. For example, a metal foil or a metal-coated flexible foil may be coated in the vapor deposition apparatus. In some implementations, the substrate 10 is a thin copper foil or a thin aluminum foil having a thickness of less than 30 μm, for example, 10 μm or less.

[0025]

[0024] In a roll-to-roll deposition system, the substrate 10 can be unwound from a storage spool and at least one or more layers of material can be deposited on the substrate while the substrate is guided onto the curved drum surface 111 of a coating drum, and the coated substrate can be wound onto a take-up spool after deposition and / or coated in a further deposition device.

[0026] According to embodiments described herein, the vapor deposition apparatus further includes a heatable shield 130 extending from the vapor source 120 toward the substrate support 110 and at least partially surrounding the vapor propagation region 20. In particular, the heatable shield 130 may be attached to the vapor source 120, for example, to the periphery of the vapor source 120 or to another stationary support in the vacuum chamber, and may extend from the vapor source 120 toward the substrate support 110. The heatable shield 130 may be stationarily attached to the vacuum chamber of the vapor deposition apparatus, i.e., the heatable shield does not move with the substrate support 110. The heatable shield 130 may be shaped such that the heatable shield 130 at least partially or entirely surrounds the vapor propagation region 20 and reduces or prevents propagation of the vapor 15 outside the vapor propagation region 20. In other words, the heatable shield 130 forms a sidewall of the vapor propagation region 20 and can confine the vapor 15, or at least a majority of it, within the vapor propagation region. Floating coatings on surfaces outside of the vapor transmission region 20 that are surrounded (at least partially or entirely) by the heatable shield can be reduced, making cleaning of the device easier.

[0027]

[0026] In particular, as shown schematically in the cross-sectional view of Figure 1, heatable shields 130 can be disposed on at least two opposing lateral sides of the vapor propagation region 20 to prevent vapor from exiting the vapor propagation region 20 toward the left and right sides in Figure 1, i.e., in a lateral direction L extending along the axis A of the coating drum. Furthermore, in some embodiments, heatable shields 130 can also be disposed on at least one of the substrate inlet side (defining the substrate inlet wall of the vapor propagation region 20) and the substrate outlet side (defining the substrate outlet wall of the vapor propagation region 20) of the vapor propagation region 20 (not shown in Figure 1). When two or more vapor sources are disposed adjacent to each other on the periphery of the coating drum (see Figure 3), the two or more vapor propagation regions of the two or more vapor sources do not have to be completely separated from each other by heatable shields, i.e., the heatable shields may have partially open sidewalls or no sidewalls at the interface between two adjacent vapor sources.

[0028] The heatable shield 130 is heatable, and when the heatable shield 130 is heated to an operating temperature, e.g., in some embodiments, an operating temperature of 500°C or higher, vapor condensation on the heatable shield 130 can be reduced or prevented. Preventing vapor condensation on the heatable shield 130 is beneficial because it can reduce cleaning operations. Furthermore, coating the heatable shield 130 can change the dimensions of the coating window provided by the heatable shield. In particular, when a gap in the range of only a few millimeters, e.g., about 1 millimeter or less, is provided between the heatable shield 130 and the substrate support 110, coating the heatable shield can lead to changes in the gap dimensions and, therefore, undesirable changes in the edge shape of the coating layer deposited on the substrate. Furthermore, preventing source material accumulation on the heatable shield can improve source material utilization. Specifically, when the heatable shield is heated to an operating temperature that can exceed the vapor condensation temperature, essentially all of the source material propagating within the vapor propagation region 20 can be used to coat the substrate surface.

[0029]

[0028] As used herein, the "vapor condensation temperature" can be understood as the threshold temperature of the heatable shield above which the vapor 15 no longer condenses on the heatable shield. The operating temperature of the heatable shield 130 may be the vapor condensation temperature or a temperature (slightly) higher than the vapor condensation temperature. For example, to avoid excessive heat radiation to the substrate support, the operating temperature of the heatable shield may be 5°C to 50°C higher than the vapor condensation temperature. It should be noted that the vapor condensation temperature depends on the vapor pressure. Since the vapor pressure downstream of the multiple nozzles 121 of the vapor propagation region 20 is lower than the vapor pressure inside the crucible 160 and / or distributor 161 of the vapor source 120, the vapor inside the crucible 160 and / or distributor 161 may already condense at a lower temperature than the vapor 15 in the vapor propagation region 20. As used herein, the "vapor condensation temperature" relates to the temperature of the heatable shield downstream of the multiple nozzles of the vapor propagation region 20, which avoids condensation of the vapor on the heatable shield. As used herein, "evaporation temperature" refers to the temperature inside the vapor source 120 upstream of the plurality of nozzles 121 where the source material is evaporated. The evaporation temperature inside the vapor source 120 is typically higher than the vapor condensation temperature inside the vapor propagation region 20. For example, the evaporation temperature inside the vapor source can be set to a temperature above 600°C, while the vapor condensation temperature downstream of the plurality of nozzles 121 can be less than 600°C, e.g., 500°C to 550°C, when lithium is evaporated. In embodiments described herein, the temperature inside the vapor source can be 600°C or higher, while the operating temperature of the heatable shield during vapor deposition can be set to less than 600°C, e.g., 500°C to 550°C.

[0030]

[0029] Vapors impinging on the heatable shield, provided for example at an operating temperature of 500° C. to 550° C., can be immediately re-evaporated or reflected from the heatable shield surface so that each vapor molecule ends up on the substrate surface rather than on the heatable shield surface. Material build-up on the heatable shield can be reduced or prevented, reducing cleaning efforts.

[0031] The "heatable shield" may also be referred to herein as a "temperature-controlled shield" because the temperature of the heatable shield can be set to a predetermined operating temperature during vapor deposition to reduce or prevent condensation of vapors on the heatable shield. In particular, the temperature of the heatable shield can be controlled to maintain it within a predetermined range. A controller and a respective heating arrangement controlled by the controller may be provided to control the temperature of the heatable shield during vapor deposition.

[0032] According to embodiments described herein, the heatable shield 130 can include an edge exclusion portion for masking areas of the substrate that should not be coated. In some embodiments, which can be combined with other embodiments described herein, the vapor source 120 can be configured to vaporize a metal, particularly a metal having a vaporization temperature of 500°C or greater, particularly 600°C or greater. In some implementations, the vapor source 120 can be configured to deposit a lithium layer on the substrate. The vapor source 120 can include a crucible 160 configured to be heated to a temperature of 600°C or greater, particularly 800°C or greater, and a distributor 161 configured to direct vapor from the crucible 160 to a plurality of nozzles 121, where an interior region of the distributor can be heated to a temperature of 600°C or greater, particularly 800°C or greater.

[0033]

[0032] The vapor deposition apparatus may further include a heating arrangement 140 for actively or passively heating the heatable shield 130 to an operating temperature above the vapor condensation temperature, in particular a temperature between 500°C and 600°C, in particular between 500°C and 550°C. If the temperature of the surface of the heatable shield 130 is below the vapor condensation temperature, the vapor 15 may condense on the surface of the heatable shield. Therefore, the operating temperature of the heatable shield may be controlled to exceed the vapor condensation temperature. Specifically, to avoid excessive heat load on the substrate, the operating temperature of the heatable shield may be slightly higher than the vapor condensation temperature, for example, 10°C to 50°C above the vapor condensation temperature.

[0034] In some embodiments, the vapor deposition apparatus includes a controller 141 connected to the heating arrangement 140, and the controller 141 is configured to control the temperature of the heatable shield 130 to be lower than the temperature inside the vapor source 120 and higher than the vapor condensation temperature. Therefore, the heatable shield may also be referred to herein as a "temperature-controlled shield." The operating temperature of the heatable shield is desirably as low as possible to reduce the heat load on the substrate, but desirably high enough to prevent vapor condensation on the heatable shield. Because the pressure inside the vapor source 120 is typically higher than the pressure inside the vapor propagation region 20 downstream of the multiple nozzles 121, the operating temperature of the heatable shield is typically lower than the evaporation temperature inside the vapor source 120, for example, inside the vapor source's crucible 160 or distributor 161.

[0035] According to an embodiment of the present disclosure, vapor is directed from a distributor 161 toward a substrate by a plurality of nozzles 121, e.g., a nozzle assembly. The vapor is directed from a crucible in a heated tube system to the distributor 161 and through the nozzles 121 into the coating chamber, e.g., toward a substrate to be coated.

[0036]

[0035] Embodiments of the present disclosure reduce temperature hot spots on a substrate by providing a uniform coating, which results in a uniform heat distribution due to condensation energy.

[0037] 2A illustrates an exemplary nozzle 121 of one or more nozzles provided in a nozzle assembly. A first nozzle section 230 has a first end 132 and a second end 134. Optionally, a second nozzle section 220 is provided. The second nozzle section includes a steam inlet 122. The steam inlet 122 faces a distributor 161. Steam travels from the steam inlet 122 through a nozzle to a steam outlet 136. The second nozzle section has a diameter D1. The first end 132 of the first nozzle section 230 faces the second nozzle section 220. The second end 134 includes the steam outlet 136.

[0038] According to an embodiment of the present disclosure, an orifice 138 is provided at or adjacent to the vapor outlet 136. The orifice may have a diameter D3. The orifice provides a region of reduced diameter. According to embodiments described herein, the nozzle shape is configured to provide a divergence. A focused evaporation plume is avoided or reduced. By avoiding or reducing a focused evaporation plume, an increase in deposition rate immediately in front of the nozzle, and thus a temperature hot spot, can be avoided or reduced. Particularly for irradiated deposition, since the thermal impact on the substrate is largely due to the condensation energy of the evaporated material on the substrate, defocusing the nozzle plume can reduce or prevent hot spots on the substrate.

[0039] According to some embodiments, which may be combined with other embodiments described herein, the diameter D2 of the first nozzle section may be 1 mm to 15 mm. According to some embodiments of the present disclosure, the diameter reduction of the orifice diameter may be 10% to 90%. For example, a 40% to 70% reduction in the orifice diameter widens the plume of material deposited on the substrate.

[0040] According to one embodiment, a nozzle assembly for directing vaporized material to a substrate is provided. The nozzle assembly can include a plurality of nozzles. One or more of the plurality of nozzles, nozzle 121, has a vapor inlet 122 and includes a first nozzle section 230 having a second diameter D1 and an optional second nozzle section 220. The first nozzle section has a first end 132 and a second end 134, and the first nozzle section includes a vapor outlet 136 at the second end. An orifice 138 having an orifice diameter D3, i.e., a reduced diameter, is provided at or adjacent to the vapor outlet 136.

[0041] According to some embodiments, which can be combined with other embodiments described herein, the first nozzle section 230 includes a first diameter D2 along the distance between the first end and the second end, where the first diameter D2 can be smaller than the second diameter D1 of the second nozzle section 220 and larger than the orifice diameter D3. Additionally or alternatively, as shown in FIG. 2A , the nozzle assembly includes a diverging portion 240 between the orifice 138 and the vapor outlet. For example, the diameter of the diverging portion increases from the orifice toward the vapor outlet. The diverging portion can reduce sharp edges at the nozzle and decrease the likelihood of condensation of material at the nozzle.

[0042]

[0041] Figure 2B illustrates a further exemplary nozzle 121 of one or more nozzles provided in a nozzle assembly. A first nozzle section 230 has a first end 132 and a second end 134 similar to the embodiment described with reference to Figure 2A. The second nozzle section shown in Figure 2A is omitted in this embodiment. The first end of the first nozzle section includes a steam inlet. The steam inlet faces the distributor 161. Steam travels from the steam inlet through the nozzle to the steam outlet 136. The second end 134 includes the steam outlet 136.

[0043] According to an embodiment of the present disclosure, an orifice 138 is provided at or adjacent to the vapor outlet 136. The orifice may have a diameter D3. The orifice provides a region of reduced diameter, as described with respect to FIG. 2A.

[0044] According to some embodiments, which may be combined with other embodiments described herein, the diameter D2 of the first nozzle section may be 1 mm to 15 mm. According to some embodiments of the present disclosure, the diameter reduction of the orifice diameter may be 10% to 90%. For example, a 40% to 70% reduction in the orifice diameter results in a wider plume of material being deposited on the substrate.

[0045] Additionally or alternatively, as shown in FIG. 2B, the nozzle assembly includes a diverging portion 240 between the orifice and the steam outlet. For example, the diameter of the diverging portion increases from the orifice toward the steam outlet. The diverging portion may reduce sharp edges at the nozzle and decrease the likelihood of condensation of material at the nozzle. According to another further embodiment, which can be combined with other embodiments described herein, the orifice may be provided with rounded edges and corners. The diverging portion may be provided by a rounded orifice having a radius of, for example, 0.2 mm or greater.

[0046] According to some embodiments, which can be combined with other embodiments described herein, the plurality of nozzles are configured to spread the plume of vaporized material from each nozzle, and in particular, the one or more nozzles are configured to uniformly distribute the heat of condensation over the substrate. For example, the first diameter D2 can be 1 mm to 15 mm. The dimension of the orifice diameter D3 can be 0.1 to 0.9 times the dimension of the first diameter D2.

[0047] As described above, a spread of the material plume can be provided for one or more nozzles of a nozzle assembly. A more uniform material distribution, and therefore a more uniform heat load, can be provided. According to embodiments of the present disclosure, in addition to or as an alternative to individual nozzle improvements for one or more nozzles of a nozzle assembly, the nozzle assembly geometry can be improved to provide a more uniform material distribution, and therefore a more uniform heat distribution.

[0048] FIG. 4 illustrates the arrangement of nozzles 121 in a vapor source 120. The nozzles 121 may be arranged in rows 421. For example, the rows 421 may extend in the horizontal direction L shown in FIG. 1. The rows 421 extend in a row direction 422. For example, FIG. 4 illustrates six rows 421. The rows 421 are offset 430 in the row direction 422. The offset 430 causes the nozzle positions of the nozzles 121 to be shifted along the row direction 422. A substrate passing over the vapor source 120 in a direction perpendicular to the row direction 422 is coated with material at different positions along the row direction 422. Therefore, the material is deposited on the substrate more uniformly. Correspondingly, the heat load on the substrate is more uniform.

[0049] 4, there are six rows 421. The rows are displaced by 1 / 6 of the nozzle-to-nozzle distance. According to some embodiments, which can be combined with other embodiments described herein, the displacement or offset D along the row direction 422 can be dy / No, where No is the number of rows and dy is the distance between nozzles in the row direction. The nozzle distribution results in a homogeneous distribution of the coating rate on the substrate and reduces hot spots due to condensation energy.

[0050] 4, an offset D is provided between adjacent columns 421. However, the offset D may be provided between any columns. In particular, each column is offset by the offset D relative to at least one other column.

[0051] According to one embodiment, an evaporation source for depositing evaporated material on a substrate is provided. The evaporation source includes a nozzle assembly having a plurality of nozzle rows 421 extending in a column direction 422 and arranged adjacent to one another. The nozzle rows are offset relative to one another in the column direction by a column offset D.

[0052]

[0051] According to some embodiments that can be combined with other embodiments described in this specification, the plurality of nozzle rows 421 includes a number of nozzle rows N, and the row offset D is represented by the formula dY / N, where dY is the distance between nozzles in the row direction.

[0053] According to yet another embodiment, which may be combined with other embodiments described herein, the rows 421 may be spaced apart by an inter-row distance. For example, a first inter-row distance 433 and a second inter-row distance 432 are shown in FIG. 4. According to some embodiments, which may be combined with other embodiments described herein, the first inter-row distance may be different from the second inter-row distance. In particular, the first inter-row distance 433 shown in FIG. 4 may be smaller than the second inter-row distance 432 shown in FIG. 4.

[0054] The nozzle assembly may include multiple nozzles arranged in a plane. Furthermore, as described with respect to FIGS. 1 and 3, the substrate may be provided on the curve of the curved drum surface 111. Therefore, the distance of the substrate to the nozzle rows at the outer portions of the nozzle assembly in a direction perpendicular to the row direction may be smaller than the distance of the substrate to the nozzle rows in, for example, a central portion or part of the nozzle assembly in a direction perpendicular to the row direction. Increasing the row density in areas where the substrate-to-nozzle distance is large can further improve the uniformity of the deposition rate and, therefore, the heat load. The row-to-row distance may be small between outer rows, i.e., between adjacent outer rows. The row-to-row distance may be large between inner rows, i.e., between adjacent inner rows. Different row-to-row distances can provide a more uniform coating rate for a planar evaporator in front of a curved substrate on a coating drum.

[0055] According to some embodiments, which can be combined with other embodiments described herein, each nozzle row includes a plurality of nozzles, the plurality of nozzles being spaced apart by a row-to-row distance dX in a direction different from the row direction of the plurality of nozzles of the further plurality of nozzle rows. The nozzle assembly includes at least two outer section rows and at least one inner section. For example, one or more of the two outer sections and the at least one inner section each include at least two nozzle rows of the plurality of nozzle rows. A first row-to-row distance 433 between the at least two nozzle rows of the at least two outer sections is smaller than a second row-to-row distance 432 between the at least two nozzle rows of the at least one inner section.

[0056] According to another further implementation that can be combined with other embodiments of the present disclosure, the nozzle assembly includes one or more shields, such as, for example, a heating shield or a temperature control shield, as described with respect to FIG. 1. The one or more shields are configured to shield the evaporation plume emitted from the plurality of nozzles. According to another further embodiment that can be combined with other embodiments described herein, the nozzle array described herein can include a nozzle according to any of the embodiments described herein, particularly with respect to FIG. 2A.

[0057] 3 is a schematic diagram illustrating a vapor deposition apparatus 200 according to embodiments described herein, viewed along the axis of rotation A of the substrate support 110 configured as a rotatable drum. The vapor deposition apparatus 200 may include some or all of the features of the vapor deposition apparatus 100 shown in FIGS. 1, 2, and 4, as reference may be made above, which will not be repeated here. A flexible substrate 10, such as a thin foil substrate, can be moved over the curved drum surface 111 and past the vapor source 120 of the vapor deposition apparatus 200.

[0058] The vapor source 120 includes a plurality of nozzles 121 for directing vapor through the vapor propagation region toward the curved drum surface 111. Six nozzles are shown in FIG. 3. Each nozzle is part of a row, as illustrated in FIG. 4. As shown in FIG. 3, the nozzles in the center of the vapor source 120 are closer to the substrate or curved drum surface, respectively, than the nozzles at the edges of the vapor source. Thus, as noted above, the distance between the outer rows may be smaller than the distance between the inner rows.

[0059] 3 illustrates a heatable shield 130. The heatable shield 130 extends from the vapor source 120 toward the curved drum surface 111 and at least partially surrounds the vapor propagation region. In some embodiments, the heatable shield 130 defines a coating window on the curved drum surface, i.e., an area on the curved drum surface where vapor molecules directed from the vapor source can impinge on a substrate supported on the curved drum surface. In some embodiments, the vapor source 120 is mounted and extends along the periphery of the rotatable drum such that multiple nozzles 121 of the vapor source 120 are directed toward the curved drum surface 111.

[0060] For example, the coating window defined by the heatable shield 130 associated with one vapor source 120 may extend over an angular range a of 10° to 45° of the curved drum surface 111 in the circumferential direction T, and two, three, or more vapor sources 120 may be arranged adjacent to one another in the circumferential direction, e.g., to deposit multiple layers of material on a substrate, or to deposit one thick layer of the same material on a substrate. In one embodiment, two, three, or more metal evaporation sources, in particular lithium sources, are arranged adjacent to one another in the circumferential direction T of a rotatable drum, such that a thick metal layer may be deposited on a substrate while the substrate is moving over the curved drum surface 111 of the rotatable drum.

[0061] The coating windows defined by the heatable shields 130 of adjacent vapor sources may be spaced apart (as shown diagrammatically in FIG. 3), or the coating windows defined by the heatable shields 130 of adjacent vapor sources may partially overlap. For example, the separation wall provided by the heatable shields associated with two adjacent vapor sources may be partially open.

[0062] According to one embodiment, a deposition system for depositing evaporated material on a substrate is provided. The deposition system includes one or more evaporation sources according to any embodiment described herein. Furthermore, the deposition system includes a transport device for transporting the substrate toward the one or more evaporation sources. The transport device may be a coating drum. According to some embodiments that can be combined with other embodiments described herein, the coating drum may be disposed in a vacuum chamber. Furthermore, the evaporation source may be disposed at least partially within the vacuum chamber. In particular, the distributor and nozzle assembly may be disposed in the vacuum chamber. According to yet another further embodiment that can be combined with other embodiments of the present disclosure, the nozzle of the nozzle assembly of the deposition system may be a nozzle according to an embodiment of the present disclosure, in particular a nozzle having an orifice. The nozzle is configured to produce a diverging vapor plume.

[0063] 5 is a flow diagram illustrating a method for depositing evaporated material on a substrate according to embodiments described herein. In box 701, a substrate is moved past an evaporation source, the evaporation source including a nozzle assembly according to any embodiment described herein and / or an evaporation source having a nozzle according to any embodiment described herein. The substrate may be moved or transported circumferentially on a curved drum surface of a rotatable drum.

[0064] In box 702, vapor is directed from a vapor source through a vapor propagation region toward a substrate supported, for example, on a curved drum surface, and a defocused and / or uniformly distributed plume of material is deposited on the substrate.

[0065] In some embodiments, the vapor source is a metal source, particularly a lithium source, and the vapor is a metal vapor, particularly lithium vapor. The operating temperature of the heatable shield may be greater than or equal to 500° C. and less than or equal to 600° C., particularly between 500° C. and 550° C. If the vapor source is a lithium source, the evaporation temperature inside the vapor source may be greater than or equal to 600° C. and less than or equal to 900° C.

[0066] The substrate may be a flexible foil, particularly a flexible metal foil, more particularly a copper foil or copper-carrying foil, for example a foil coated with copper on one or both sides. The substrate may have a thickness of 50 μm or less, particularly 20 μm or less, for example about 8 μm. Specifically, the substrate may be a thin copper foil having a thickness in the range of 20 μm or less.

[0067] In some embodiments, the source material evaporated in the crucible of the vapor source can include, for example, metals, particularly lithium, metal alloys, and other vaporizable materials that have a gas phase under certain conditions. According to yet further embodiments, the material can additionally or alternatively include magnesium (Mg), ytterbium (Yb), lithium fluoride (LiF), and the like. The evaporated material produced in the crucible can enter a distributor. The distributor can include, for example, channels or tubes that provide a transport system for distributing the evaporated material along the width and / or length of the deposition apparatus. The distributor can have a "showerhead reactor" design.

[0068] According to embodiments that can be combined with other embodiments described herein, the evaporated material may comprise or consist of lithium, Yb, or LiF. According to embodiments that can be combined with other embodiments described herein, the temperature of the evaporator and / or nozzle may be at least 600°C, or in particular 600°C to 1000°C, more particularly 600°C to 800°C. According to embodiments that can be combined with other embodiments described herein, the operating temperature of the heatable shield may be 450°C to 550°C, in particular 500°C to 550°C, with a deviation of ±10°C.

[0069]

[0068] According to an embodiment which can be combined with other embodiments described herein, the temperature of the heatable shield is, for example, at least 100°C lower than the temperature of the evaporator.

[0070]

[0069] Figure 6 is a flow diagram illustrating a method for fabricating a battery anode. According to some embodiments, the method for fabricating a battery anode may include depositing evaporated material on a substrate, as described with respect to Figure 5.

[0071] According to one embodiment, as shown in step 801, the method includes guiding a web or foil through a vapor deposition apparatus according to an embodiment of the present disclosure. The web or foil may include or consist of an anode layer for a battery, particularly a thin-film battery. A liquid lithium-containing material is provided to an evaporator of the vapor deposition apparatus. In step 802, the lithium-containing material or lithium is deposited on the web in the vapor deposition apparatus.

[0072]

[0071] According to some implementations, which can be combined with other implementations described herein, in a method for manufacturing a battery anode, the web includes or is made of copper. According to some implementations, the web can further include graphite and silicon and / or silicon oxide. For example, the layer including graphite and silicon and / or silicon oxide can be pre-lithiated with lithium.

[0073]

[0072] Embodiments of the present disclosure provide a more uniform substrate temperature and / or heat load on the substrate, particularly at high deposition rates where material of 2 μm or more, e.g., 10 μm or more, is deposited by one to four deposition sources positioned adjacent to one another. Particularly for thin substrates such as webs or foils, where heat load can be a limiting factor in deposition rate, flared nozzle geometries, column-wise displacement of nozzle rows, adaptation of inter-row distances, and combinations of two or more of these measures can reduce or prevent hot spots during deposition, particularly at high deposition rates. The substrate may be coated with less stress. Therefore, wrinkle formation in the foil or web may be reduced.

[0074]

[0073] While the foregoing is directed to embodiments, other and further embodiments of the present disclosure may be devised without departing from the basic scope thereof, as determined by the following claims.

Claims

1. a nozzle assembly for directing vaporized material to a substrate, the nozzle assembly comprising: Multiple nozzle rows Equipped with One or more nozzles (121) of the plurality of nozzle rows a first nozzle section (230) having a first end (132) and a second end (134), the first nozzle section (230) including a steam inlet at the first end and a steam outlet (136) at the second end; an orifice (138) at or adjacent to said steam outlet (136), said orifice having an orifice diameter D ３ an orifice (138) having Including, The first nozzle section has a first diameter D along the distance between the first end and the second end. ２ and the first diameter D ２ is the orifice diameter D ３ is larger than the nozzle assembly includes a diverging portion (140) between the orifice and the steam outlet, the diameter of the diverging portion increasing from the orifice toward the steam outlet; The nozzle assembly includes at least two outer sections and at least one inner section, one or more of the at least two outer sections and the at least one inner section including at least two nozzle rows of the plurality of nozzle rows, and a row-to-row distance dX 1 between the at least two nozzle rows of the at least two outer sections is smaller than a row-to-row distance dX 2 between the at least two nozzle rows of the at least one inner section.

2. The nozzle assembly of claim 1 , wherein the plurality of nozzle rows are configured to spread a plume of vaporized material.

3. The nozzle assembly of claim 2 , wherein the one or more nozzles are configured to uniformly distribute condensing energy onto the substrate.

4. The first diameter D ２ The nozzle assembly of claim 1 , wherein is between 1 mm and 15 mm.

5. The orifice diameter D ３ The dimension of the first diameter D ２ 2. The nozzle assembly of claim 1, wherein the dimension of the nozzle is 0.1 to 0.9 times the dimension of the nozzle.

6. 1. An evaporation source for depositing evaporated material on a substrate, comprising: a nozzle assembly including a plurality of nozzle rows extending in a column direction, arranged adjacent to one another, and offset relative to one another by a column offset in the column direction; Equipped with The plurality of nozzle rows includes a predetermined number N of nozzle rows, and the row offset is expressed by the formula dY / N, dY is the distance between nozzles in the column direction, The nozzle assembly includes at least two outer sections and at least one inner section, one or more of the at least two outer sections and the at least one inner section including at least two nozzle rows of the plurality of nozzle rows, and an inter-row distance dX between the at least two nozzle rows of the at least two outer sections. １ is the row-to-row distance dX between the at least two nozzle rows of the at least one inner section; ２ Smaller than the evaporation source.

7. 7. The evaporation source of claim 6, wherein each nozzle row of the plurality of nozzle rows includes a plurality of nozzles, the plurality of nozzles being spaced apart from a further plurality of nozzles of a further nozzle row by an inter-row distance dX in a direction different from the row direction.

8. The evaporation source of claim 7 , wherein the nozzle assembly includes one or more shields, the one or more shields configured to shield evaporation plumes emitted from the plurality of nozzles.

9. The evaporation source according to claim 6 , wherein the nozzle assembly is a nozzle assembly according to any one of claims 1 to 5 .

10. 1. A deposition system for depositing evaporated material onto a substrate, comprising: One or more evaporation sources according to any one of claims 6 to 9; a transport device for transporting the substrate toward the one or more evaporation sources; A deposition system comprising:

11. The deposition system of claim 10 , wherein the one or more evaporation sources comprise the nozzle assembly of claim 1 .

12. 1. A method for depositing evaporated material onto a substrate, comprising: Transporting the substrate to an evaporation source comprising the nozzle assembly of claim 1 ; directing the vaporized material through a plurality of nozzles of the nozzle assembly to deposit a defocused plume of material onto the substrate; A method comprising:

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