Multilayer capacitor and manufacturing method thereof

Abstract

To provide a multilayer capacitor with improved moisture resistance reliability, and a manufacturing method for the same.SOLUTION: A multilayer capacitor includes: a main body 110 including a multilayer structure where a plurality of dielectric layers 111 are stacked and a plurality of internal electrodes 121 and 122 stacked with the dielectric layers held therebetween; external electrodes 131 and 132 disposed outside the main body and connected to the internal electrode; and an insulating layer 112 covering a surface of the main body. The external electrode includes a metal layer 31 connected to the insulating layer. The insulating layer includes oxide of a metal component of the metal layer.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a multilayer capacitor and a method for manufacturing the same. [Background technology]

[0002] A capacitor is an element that can store electricity, and generally works on the principle that electricity accumulates in each electrode when a voltage is applied to two opposing electrodes. When a DC voltage is applied, electricity is stored and current flows inside the capacitor, but once the storage is complete, the current stops. On the other hand, when an AC voltage is applied, the polarity of the electrodes is reversed and an AC current flows.

[0003] Such capacitors can be classified into various types depending on the type of insulator provided between the electrodes, such as aluminum electrolytic capacitors in which the electrodes are made of aluminum and a thin oxide film is provided between the aluminum electrodes; tantalum capacitors that use tantalum as the electrode material; ceramic capacitors that use a high dielectric constant dielectric such as barium titanate between the electrodes; multi-layer ceramic capacitors (MLCCs) that use a multi-layer structure of high dielectric constant ceramic as the dielectric provided between the electrodes; and film capacitors that use a polystyrene film as the dielectric between the electrodes.

[0004] Among these, multilayer ceramic capacitors have the advantages of excellent temperature and frequency characteristics and being small in size, and have therefore been widely applied in various fields in recent years, such as high-frequency circuits. In recent years, attempts have been made to form thinner dielectric layers and internal electrodes in order to further reduce the size of multilayer ceramic capacitors.

[0005] Recently, in the field of multilayer capacitors, many attempts have been made to improve moisture resistance reliability by reducing defects caused by the penetration of moisture, plating solutions, etc. One method involves thickening the cover layer of the capacitor body or the external electrodes, but this increases the size of the component, resulting in a problem of reduced capacitance for the same size. Summary of the Invention [Problem to be solved by the invention]

[0006] SUMMARY OF THE INVENTION An object of the present invention is to provide a multilayer capacitor having improved moisture resistance reliability and a method for manufacturing the same. [Means for solving the problem]

[0007] To solve the above-mentioned problems, the present invention proposes a new structure of a multilayer capacitor, as an example. Specifically, the multilayer capacitor includes a body including a laminated structure in which a plurality of dielectric layers are stacked, a plurality of internal electrodes stacked with the dielectric layers sandwiched therebetween, external electrodes disposed outside the body and connected to the internal electrodes, and an insulating layer covering a surface of the body, the external electrodes including metal layers connected to the insulating layer, and the insulating layer including an oxide of a metal component of the metal layer.

[0008] In one embodiment, the metal layer covers the surface of the body, and the side surface thereof may be connected to the side surface of the insulating layer.

[0009] In an embodiment, the external electrode may further include an electrode layer covering the metal layer.

[0010] In one embodiment, the metal component of the metal layer and the metal component of the electrode layer can form an intermetallic compound layer.

[0011] In one embodiment, the electrode layer may include a fired electrode.

[0012] In one embodiment, the electrode layer may include a conductive resin electrode.

[0013] In one embodiment, the metal layer and the insulating layer may have the same thickness.

[0014] In one embodiment, the insulating layer may have a thickness of 5 nm to 1 μm.

[0015] In one embodiment, the external electrode may further include an electrode layer disposed between the metal layer and the body.

[0016] In one embodiment, the electrode layer may be thicker than the insulating layer.

[0017] In one embodiment, a portion of the metal layer may be disposed between the side surface of the electrode layer and the insulating layer.

[0018] In an embodiment, the metal layer may cover a surface of the electrode layer and be bent along the surface of the electrode layer to be connected to the insulating layer.

[0019] In one embodiment, the external electrode may further include an additional electrode layer covering the metal layer.

[0020] In one embodiment, the additional electrode layer may include a fired electrode.

[0021] In one embodiment, the additional electrode layer may include a conductive resin electrode.

[0022] In one embodiment, the metal layer may include a material selected from the group consisting of Ti, Al, V, Y, Zr, Nb, Hf, Ta, and Ti.

[0023] In one embodiment, the insulating layer may also be disposed in a groove in the body.

[0024] Another aspect of the present invention provides a multilayer capacitor including: a main body including a laminated structure in which a plurality of dielectric layers are laminated, and a plurality of internal electrodes laminated with the dielectric layers sandwiched therebetween; external electrodes disposed outside the main body and connected to the internal electrodes; and an insulating layer covering a surface of the main body, wherein the external electrodes include metal layers, and the insulating layer includes an oxide of a metal component of the metal layers.

[0025] In one embodiment, the external electrode further includes an electrode layer covering the metal layer, and the insulating layer may be exposed from the electrode layer.

[0026] In one embodiment, the body may be in contact with the metal layer and the insulating layer.

[0027] In one embodiment, the metal component of the metal layer and the metal component of the electrode layer may form an intermetallic compound layer.

[0028] In one embodiment, the electrode layer may include at least one of a fired electrode and a conductive resin electrode.

[0029] In one embodiment, the external electrode may further include an electrode layer disposed between the metal layer and the body.

[0030] In one embodiment, the external electrode may further include an additional electrode layer covering the metal layer.

[0031] In an embodiment, the additional electrode layer may include at least one of a fired electrode and a conductive resin electrode.

[0032] In one embodiment, the metal layer may include a material selected from the group consisting of Ti, Al, V, Y, Zr, Nb, Hf, Ta, and Ti.

[0033] Another aspect of the present invention provides a method for manufacturing a multilayer capacitor, the method including: forming a body including a laminated structure in which a plurality of dielectric layers are stacked, and a plurality of internal electrodes stacked with the dielectric layers sandwiched therebetween; forming a metal layer covering a surface of the body; forming an electrode layer on a portion of the metal layer to cover at least one of the plurality of internal electrodes; and oxidizing a region of the metal layer that is exposed from the electrode layer to form an insulating layer.

[0034] In one embodiment, the metal layer may be formed by an atomic layer deposition (ALD) process.

[0035] In one embodiment, the area of ​​the metal layer exposed from the electrode layer can contact the main body.

[0036] In one embodiment, the area of ​​the metal layer covered by the electrode layer may contact the body.

[0037] In one embodiment, the method further includes forming an underlayer to connect to at least one of the plurality of internal electrodes before forming the metal layer, and an area of ​​the metal layer that is covered by the electrode layer may be disposed between the underlayer and the electrode layer.

[0038] In one embodiment, the metal layer may include a material selected from the group consisting of Ti, Al, V, Y, Zr, Nb, Hf, Ta, and Ti. [Effects of the Invention]

[0039] In the case of a multilayer capacitor according to an embodiment of the present invention, moisture resistance reliability can be improved, and when an insulating layer is used to improve moisture resistance reliability, an increase in the size of the component can be minimized. [Brief explanation of the drawings]

[0040] [Figure 1]1 is a perspective view schematically illustrating an appearance of a multilayer capacitor according to an embodiment of the present invention; [Figure 2] FIG. 2 is a cross-sectional view taken along line II' in the multilayer capacitor of FIG. [Figure 3] FIG. 2 is a cross-sectional view taken along line II-II' in the multilayer capacitor of FIG. [Figure 4] 2 shows an example of a method for manufacturing the multilayer capacitor of FIG. 1. [Figure 5] 2 shows an example of a method for manufacturing the multilayer capacitor of FIG. 1. [Figure 6] 2 shows an example of a method for manufacturing the multilayer capacitor of FIG. 1. [Figure 7] 2 shows an example of a method for manufacturing the multilayer capacitor of FIG. 1. [Figure 8] FIG. 10 is a cross-sectional view showing a multilayer capacitor according to a modified embodiment. [Figure 9] 9 shows an example of a method for manufacturing the multilayer capacitor of FIG. 8. [Figure 10] 9 shows an example of a method for manufacturing the multilayer capacitor of FIG. 8. DETAILED DESCRIPTION OF THE INVENTION

[0041] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention may be modified into several other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, the embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for clearer explanation, and elements designated by the same reference numerals in the drawings are the same elements.

[0042] In the drawings, parts not relevant to the description are omitted in order to clearly explain the present invention, thicknesses are exaggerated to clearly depict multiple layers and regions, and components having the same function within the same concept are referred to by the same reference numerals. Furthermore, throughout the specification, when a part "comprises" a certain element, it does not mean that it excludes other elements, but that it may further include other elements, unless otherwise specified.

[0043] Fig. 1 is a perspective view schematically illustrating the appearance of a multilayer capacitor according to an embodiment of the present invention. Fig. 2 is a cross-sectional view taken along line II-II' of the multilayer capacitor shown in Fig. 1. Fig. 3 is a cross-sectional view taken along line II-II' of the multilayer capacitor shown in Fig. 1.

[0044] 1 to 3, a multilayer capacitor 100 according to an embodiment of the present invention includes a body 110 including a dielectric layer 111 and a plurality of internal electrodes 121 and 122 stacked on either side of the dielectric layer 111, external electrodes 131 and 132, and an insulating layer 112 covering the surface of the body 110. The insulating layer 112 is used to protect the inside of the body 110, particularly the internal electrodes 121 and 122, from plating solution, moisture, etc. The insulating layer 112 includes an oxide of a metal component of a metal layer 31 included in the external electrodes 131 and 132.

[0045] The body 110 includes a plurality of dielectric layers 111 and may be obtained by, for example, stacking a plurality of green sheets and then sintering them. The sintering process may result in an integrated configuration of the plurality of dielectric layers 111. As shown in FIG. 1, the body 110 may have a shape similar to a rectangular parallelepiped. The dielectric layers 111 included in the body 110 may include a ceramic material having a high dielectric constant, such as a BT-based, i.e., barium titanate (BaTiO3)-based ceramic. However, other materials known in the art may be used as long as sufficient capacitance is obtained. In addition to the ceramic material as the main component, the dielectric layers 111 may further include additives, organic solvents, plasticizers, binders, dispersants, and the like, if necessary. The additives may be added in the form of metal oxides during the manufacturing process. Examples of such metal oxide additives include at least one of MnO2, Dy2O3, BaO, MgO, Al2O3, SiO2, Cr2O3, and CaCO3.

[0046] The internal electrodes 121 and 122 may be obtained by printing a paste containing a conductive metal to a predetermined thickness on one surface of a ceramic green sheet and then sintering the printed paste. In this case, the internal electrodes 121 and 122 may include first and second internal electrodes 121 and 122 exposed in opposing directions (Z direction in the drawing) of the body 110. The first and second internal electrodes 121 and 122 may be connected to different external electrodes 131 and 132 and have different polarities when driven, and may be electrically isolated from each other by a dielectric layer 111 disposed therebetween. However, the number of external electrodes 131 and 132 and the connection method between the internal electrodes 121 and 122 may vary depending on the embodiment. Examples of main constituent materials of the internal electrodes 121 and 122 include Ni, Pd, Ag, and Cu, and alloys thereof may also be used.

[0047] The external electrodes 131 and 132 may be formed outside the body 110 and may include first and second external electrodes 131 and 132 connected to the first and second internal electrodes 121 and 122, respectively. The external electrodes 131 and 132 include a metal layer 31, which is connected to the insulating layer 112 as shown in the figure. More specifically, the metal layer 31 may cover the surface of the body 110, and its side may be connected to the insulating layer 112. The metal layer 31 may include a metal element such as Ti, Al, V, Y, Zr, Nb, Hf, or Ta, and an oxide of such a metal element may be included in the insulating layer 112. The connection structure between the metal layer 31 and the insulating layer 112 and the inclusion of the metal oxide of the metal layer 31 in the insulating layer 112 may be obtained by forming the metal layer 31 on the entire surface of the body 110 and then oxidizing a portion of the metal layer 31 to form a thin and dense insulating layer 112, as described below. From this perspective, the metal component of the metal layer 31 is determined in consideration of not only electrical conductivity but also ease of oxidation, feasibility of forming a thin film when forming an oxide film, density, stability, etc., and Ti is a representative example of a valve metal. When the metal layer 31 contains Ti, the insulating layer 112 may contain TiO.

[0048] The metal layer 31 and the insulating layer 121 may be relatively thin and dense. The insulating layer 121, in which the metal component of the metal layer 31 is oxidized, as in this embodiment, has a dense structure even at a very thin thickness. This provides excellent moisture resistance and minimizes the increase in component size when forming a protective structure for improving moisture resistance reliability. For example, the thickness t1 of the insulating layer 121 may be 5 nm to 1 μm, more preferably 5 to 100 nm. In this case, the thickness t1 of the insulating layer 121 may be an average thickness, which may be obtained by averaging values ​​measured at multiple points (e.g., 10 points) selected at regular intervals. If it is difficult to obtain the average thickness, the thickness measured at the center or the maximum thickness of the insulating layer 121 may be determined as the thickness t1 of the insulating layer 121. The thickness t1 of the insulating layer 121 may be measured at a cross section of the main body 110 (e.g., a cross section corresponding to the region shown in FIG. 2 or FIG. 3). As an example, the cross section may be a central cross section of the body 110 at the middle of the Y direction in the XZ cross section, or as another example, a central cross section of the body 110 at the middle of the Z direction in the XY cross section. However, the location of the cross section is not limited to these examples, and a cross section may be selected in another region. In addition, an optical microscope, a scanning electron microscope (SEM), or other methods or devices known in the art may be used to measure the thickness.

[0049] When the metal layer 31 and the insulating layer 121 are realized in the above manner, the metal layer 31 and the insulating layer 121 may have the same thickness. Here, the thickness of the metal layer 31 may refer to either the thickness t2 measured in the first direction (X direction) or the thickness t3 measured in the third direction (Z direction), or may refer to both t2 and t3. The thicknesses t2 and t3 of the metal layer 31 may be average thicknesses and may be measured in the same manner as the insulating layer 121.

[0050] In this embodiment, the metal layer 31 is formed relatively thin, and therefore the insulating layer 112 can also be formed thin. Atomic layer deposition can be used to form the metal layer 31 thin and dense. When the metal layer 31 is formed using an ALD process or the like, the metal layer 31 and the insulating layer 121 can be formed along grooves present on the surface of the body 110, which will be described in more detail with reference to the process diagram of FIG. 5.

[0051] The external electrodes 131, 132 may further include an electrode layer 32 covering the metal layer 31 in addition to the metal layer 31. The electrode layer 32 may be a fired electrode, specifically, formed by preparing a paste containing a conductive metal and then coating the paste on the metal layer 31. Examples of the conductive metal include Ni, Cu, Pd, Au, or alloys thereof. In this case, the metal components of the metal layer 31 and the electrode layer 32 may form an intermetallic compound layer (I in the process diagram of FIG. 6 ), such as a Cu-Ti compound. While such a fired electrode has traditionally been used as a base electrode, in this embodiment, the metal layer 31 is first formed in a thin film form using an ALD process or the like, and the electrode layer 32 is then formed to cover the metal layer 31. As will be described later, the electrode layer 32 functions as a protection layer by preventing the metal layer 31 from being oxidized when the insulating layer 112 is selectively oxidized. When the insulating layer 112 is formed by such selective oxidation, a structure in which the interface 112 between the metal layer 31 and the insulating layer is connected to one side of the electrode layer 32 can be obtained, as shown in FIG.

[0052] In the above-described embodiment, the electrode layer 32 is a fired electrode obtained by firing Cu or the like. However, the electrode layer 32 may be a conductive resin electrode. When the electrode layer 32 is realized in the form of a conductive resin electrode, mounting stability can be improved when the multilayer capacitor 100 is mounted on a substrate or the like. The electrode layer 32 may include both a fired electrode and a conductive resin electrode. Meanwhile, as an additional component of the external electrodes 131 and 132, a plating layer 33 may be disposed on the electrode layer 32. For example, the plating layer 33 may be realized as a multilayer structure including Ni, Sn, or the like.

[0053] The process for manufacturing the multilayer capacitor having the above-described configuration will be described below, focusing on the external electrode formation process. The structural features will be more clearly understood from the following process description. The process diagrams of Figures 4 to 7 are created based on the I-I' cross-sectional view of Figure 2.

[0054] As shown in FIG. 4, a metal layer 140 is formed on a body 110. The body 110 can be obtained as a ceramic laminate by stacking a dielectric layer 111 and internal electrodes 121 and 122. The dielectric layer 111 is in a ceramic green sheet state before firing. The ceramic green sheet can be produced by mixing ceramic powder, a binder, a solvent, and the like to form a slurry, which can then be formed into a sheet having a thickness of several micrometers using a doctor blade method. The ceramic green sheet can then be sintered to form the dielectric layer 111. A conductive paste for the internal electrodes can be applied to the ceramic green sheet to form patterned internal electrodes 121 and 122. In this case, the internal electrode 121 can be formed by screen printing or gravure printing. The conductive paste for the internal electrodes includes a conductive metal and an additive, which can be at least one of a nonmetal and a metal oxide. The conductive metal can include nickel. The additive can include barium titanate or strontium titanate as a metal oxide.

[0055] The metal layer 140 may be formed of a valve metal, such as Ti, Al, V, Y, Zr, Nb, Hf, or Ta, which is a metal component that is easily oxidized and can form a dense oxide film when oxidized. The metal layer 140 may be formed by an ALD process and may cover the entire surface of the body 110. In this case, the metal layer 140 may be formed thin and dense, and may be formed along the grooves in the surface of the body 110, conforming to the groove surfaces, as shown in FIG. 5 . If a portion of the metal layer 140 is oxidized to form the insulating layer 112 in a subsequent process, the insulating layer 112 may also be formed to conform to the groove surfaces. This is the same for the remaining region of the metal layer 140, i.e., the metal layer 31. The grooves in the body 110 can serve as penetration paths for plating solutions, moisture, and the like. However, the insulating layer 112 conformally coats the grooves, as in the present embodiment, thereby effectively reducing such external influences.

[0056] Next, as shown in FIG. 6 , electrode layer 31 is formed to partially cover and partially expose metal layer 140, and thus a conductive paste can be partially applied to metal layer 140. An intermetallic compound layer I may be formed at the interface between metal layer 140 and electrode layer 31 by the metal component (e.g., Ti) of metal layer 140 and the metal component (e.g., Cu) of electrode layer 31. Intermetallic compound layer I may be formed immediately after applying electrode layer 31 or during a subsequent firing or curing process. While FIG. 6 shows intermetallic compound layer I formed within metal layer 140, intermetallic compound layer I may also be formed on electrode layer 32. Although intermetallic compound layer I is not depicted in subsequent drawings, it may remain in the final structure of stacked capacitor 100.

[0057] In a subsequent process, a portion of the metal layer 140, i.e., an exposed portion not covered by the electrode layer 32, is oxidized to form the insulating layer 112. FIG. 7 shows the metal layer 140 separated into the insulating layer 112 and the remaining unoxidized metal layer 31. As a result, the interface between the metal layer 31 and the insulating layer 112 may be connected to one side of the electrode layer 32. The insulating layer 112 may be formed by natural oxidation of the metal layer 140 or through an appropriate oxidation process. Alternatively, a portion of the metal layer 140 may be oxidized by a separate anodization process. In this case, it is not necessary to oxidize all of the exposed portion of the metal layer 140 not covered by the electrode layer 32. Furthermore, regardless of the oxidation method selected, it is not necessary to oxidize all of the exposed portion of the metal layer 140. Therefore, unoxidized metal components may remain in some portions of the insulating layer 112, and these metal components may exist in the form of islands within the insulating layer 112. Furthermore, the metal layer 32 may have at least a partial oxidized region.

[0058] A modified multilayer capacitor will be described with reference to Figure 8, and only the differences in the external electrodes from the above embodiment will be described. In this modified example, the external electrodes 131', 132' further include an electrode layer 34 disposed between the metal layer 31 and the body 110. Here, the electrode layer 34 may be formed by applying a conductive paste containing Ni, Cu, Pd, Au, etc. as a base layer for the external electrodes 131', 132' and then firing the paste. The electrode layer 34 may be formed thicker than the insulating layer 112.

[0059] Unlike the above-described embodiment, the metal layer 31 may be formed on the electrode layer 34 and connected to the insulating layer 112. This can be achieved by selectively oxidizing the insulating layer 112 after it is integrally formed with the metal layer 31, as in the above-described method. In this case, as shown in the figure, a portion of the metal layer 31 may be disposed between the side of the electrode layer 34 and the insulating layer 112. The metal layer 31 may cover the surface of the electrode layer 34 and be bent along the surface of the electrode layer 34 to be connected to the insulating layer 112. The external electrodes 131' and 132' may further include an additional electrode layer 35 covering the metal layer 31. The additional electrode layer 35 may be a sintered electrode or a conductive resin electrode. The additional electrode layer 35 may be either a sintered electrode or a conductive resin electrode. For the above-described reasons, an intermetallic compound layer may be formed at the interface between the metal layer 31 and the electrode layer 34 and at the interface between the metal layer 31 and the additional electrode layer 35.

[0060] A process for manufacturing the multilayer capacitor having the structure of FIG. 8 will be described with reference to FIGS. 9 and 10. Referring to FIG. 9, the electrode layer 34 is first formed to cover the body 110, and then the metal layer 150 is formed to entirely cover the body 110 and the electrode layer 34. The metal layer 150 is formed in the form of a thin film, and may be formed to conform to the surface of the electrode layer 34 and the surface of the body 110. Therefore, similar to the above-described embodiment, the metal layer 150 may be formed by an ALD process. In this case, an intermetallic compound layer may be formed in the region of the metal layer 150 connected to the electrode layer 34 due to the metal components therebetween.

[0061] 10 shows a configuration in which a portion of the metal layer 150 is oxidized and separated into the metal layer 31 and the insulating layer 112, which can be performed without the electrode layer 35. This is because, as described above, the region of the metal layer 150 connected to the electrode layer 34 forms an intermetallic compound layer (e.g., a Cu-Ti compound layer) between the metal components, and therefore does not substantially oxidize. In contrast, the region of the metal layer 150 that does not contact the electrode layer 34 can become the insulating layer 112 through natural oxidation or a subsequent oxidation process. However, unlike the configuration shown in FIG. 10, this oxidation process may be performed after the electrode layer 35 is formed on the metal layer 150.

[0062] The present invention is not limited by the above-described embodiments and the accompanying drawings, but is limited by the scope of the accompanying claims. Therefore, it is obvious to those skilled in the art that various substitutions, modifications, and changes can be made without departing from the technical idea of ​​the present invention as set forth in the claims, and these also belong to the technical idea as set forth in the claims. [Explanation of symbols]

[0063] 100: Multilayer capacitor 110:Main body 111: Dielectric layer 112: Insulating layer 121, 122: Internal electrode 131, 132: External electrode 31, 140, 150: Metal layer 34, 35: Electrode layer

Claims

1. a main body including a laminated structure in which a plurality of dielectric layers are laminated, and a plurality of internal electrodes laminated with the plurality of dielectric layers sandwiched therebetween; an external electrode disposed outside the body and connected to the plurality of internal electrodes; an insulating layer covering a surface of the main body; the external electrode includes a metal layer connected to the insulating layer and a second electrode layer disposed between the metal layer and the body; The multilayer capacitor, wherein the insulating layer contains an oxide of a metal component of the metal layer.

2. The multilayer capacitor according to claim 1 , wherein the metal layer covers a surface of the body and has a side surface connected to a side surface of the insulating layer.

3. The multilayer capacitor according to claim 1 , wherein the external electrodes further include a first electrode layer covering the metal layer.

4. 4. The multilayer capacitor according to claim 3, wherein the metal component of said metal layer and the metal component of said first electrode layer form an intermetallic compound layer.

5. The multilayer capacitor according to claim 3 or 4, wherein the first electrode layer comprises a fired electrode.

6. The multilayer capacitor according to claim 3 , wherein the first electrode layer includes a conductive resin electrode.

7. The multilayer capacitor according to claim 1 , wherein the metal layer and the insulating layer have the same thickness.

8. 8. The multilayer capacitor according to claim 1, wherein the insulating layer has a thickness of 5 nm to 1 μm.

9. The multilayer capacitor according to claim 1 , wherein the second electrode layer is thicker than the insulating layer.

10. The multilayer capacitor according to claim 1 , wherein a part of the metal layer is disposed between the side surface of the second electrode layer and the insulating layer.

11. The multilayer capacitor according to claim 1 , wherein the metal layer covers a surface of the second electrode layer and is bent along the surface of the second electrode layer to be connected to the insulating layer.

12. The multilayer capacitor according to claim 1 , wherein the external electrodes further comprise an additional electrode layer covering the metal layer.

13. The stacked capacitor of claim 12 , wherein the additional electrode layer comprises a fired electrode.

14. The multilayer capacitor according to claim 12 or 13, wherein the additional electrode layer comprises a conductive resin electrode.

15. 15. The multilayer capacitor of claim 12, wherein the second electrode layer comprises a fired electrode.

16. 16. The multilayer capacitor according to claim 1, wherein the metal layer comprises a material selected from the group consisting of Ti, Al, V, Y, Zr, Nb, Hf, Ta, and Ti.

17. 17. The stacked capacitor of claim 1, wherein the insulating layer is also disposed in a groove in the body.

18. a main body including a laminated structure in which a plurality of dielectric layers are laminated, and a plurality of internal electrodes laminated with the plurality of dielectric layers sandwiched therebetween; an external electrode disposed outside the body and connected to the plurality of internal electrodes; an insulating layer covering a surface of the main body; the external electrode includes a metal layer and a second electrode layer disposed between the metal layer and the body; The multilayer capacitor, wherein the insulating layer comprises an oxide of a metal component of the metal layer.

19. the external electrode further includes a first electrode layer covering the metal layer; 20. The stacked capacitor of claim 18, wherein the insulating layer is exposed from the first electrode layer.

20. 20. The stacked capacitor of claim 19, wherein the body contacts the metal layer and the insulating layer.

21. 21. The multilayer capacitor according to claim 19, wherein the metal component of the metal layer and the metal component of the first electrode layer form an intermetallic compound layer.

22. 22. The multilayer capacitor according to claim 19, wherein the first electrode layer comprises at least one of a fired electrode and a conductive resin electrode.

23. 23. The multilayer capacitor according to claim 18, wherein the external electrodes further comprise an additional electrode layer covering the metal layer.

24. The multilayer capacitor of claim 23 , wherein the additional electrode layer comprises at least one of a fired electrode and a conductive resin electrode.

25. 25. The multilayer capacitor according to claim 18, wherein the metal layer comprises a material selected from the group consisting of Ti, Al, V, Y, Zr, Nb, Hf, Ta, and Ti.

26. forming a body including a laminated structure in which a plurality of dielectric layers are laminated, and a plurality of internal electrodes laminated with the plurality of dielectric layers sandwiched therebetween; forming a base layer to be connected to at least one of the plurality of internal electrodes; forming a metal layer covering a surface of the body; forming an electrode layer on a portion of the metal layer to cover at least one of the plurality of internal electrodes; forming an insulating layer by oxidizing a region of the metal layer exposed from the electrode layer; Including, A method for manufacturing a multilayer capacitor, wherein the area of ​​the metal layer that is covered by the electrode layer is disposed between the base layer and the electrode layer.

27. The method of claim 26, wherein the metal layer is formed by an atomic layer deposition (ALD) process.

28. The method of claim 27 , wherein the metal layer has an exposed region from the electrode layer in contact with the body.

29. The method of claim 28 , wherein the area of ​​the metal layer covered by the electrode layer contacts the body.

30. 30. The method of claim 26, wherein the metal layer comprises a material selected from the group consisting of Ti, Al, V, Y, Zr, Nb, Hf, Ta, and Ti.

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