Circuit module and manufacturing method thereof

Abstract

To suppress damages to a conductive bonding material by using a reinforcement material while suppressing the occurrence of void inside the reinforcement material.SOLUTION: The circuit module includes: a first circuit component (11) having multiple electrode pads (12) on a specific surface (11a); and a second circuit component (21) having multiple electrode pads (22) on a specific surface (21a). The conductive bonding material bonds the respective electrode pads of the first circuit component to the corresponding electrode pads of the second circuit component. The first reinforcement bonding material is not in contact with the conductive bonding material but joins the specific surface of the first circuit component to the specific surface of the second circuit component. The second reinforcement bonding material covers the circumference of the conductive bonding material, is distributed in the area that contacts the first reinforcement bonding material and bonds the specific surface of the first circuit component to the specific surface of the second circuit component.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The technology disclosed in this specification relates to a circuit module and a manufacturing method thereof.

[0002] Patent Document 1 discloses a technique for manufacturing a circuit module by bonding chip components to a circuit board. In this technique, electrode pads provided on the chip components are bonded to electrode pads provided on the circuit board via a conductive bonding material (specifically, solder). An underfill resin is then applied around the conductive bonding material as a reinforcing material to protect the conductive bonding material. The circuit module is heated when the conductive bonding material is bonded to the electrode pads. As the temperature of the circuit module decreases after the conductive bonding material is bonded to the electrode pads, high thermal stress is applied to the conductive bonding material. In the technique of Patent Document 1, no underfill resin is applied at the stage of bonding the conductive bonding material to the electrode pads, and the thermal stress can damage the conductive bonding material.

[0003] Cited Document 2 discloses a pre-applied encapsulant as a reinforcing material used in a circuit module. The pre-applied encapsulant is applied around the conductive adhesive when the conductive adhesive is placed between the semiconductor chip and the circuit board. The circuit module is then heated to bond the conductive adhesive to the electrode pads. At this time, the encapsulant also hardens. When the temperature of the circuit module subsequently drops, thermal stress is applied to the conductive adhesive. However, because the semiconductor chip and the circuit board are connected not only by the conductive adhesive but also by the encapsulant, the thermal stress applied to the conductive adhesive is reduced. This prevents damage to the conductive adhesive. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-130961 [Patent Document 2] Japanese Patent Application Laid-Open No. 2017-143310 Summary of the Invention [Problem to be solved by the invention]

[0005] When a conductive bonding material is heated, outgassing occurs from the conductive bonding material. For example, if the conductive bonding material is a conductive paste (i.e., a mixture of a conductive material and a resin), heating causes the solvent to evaporate from the conductive paste, generating outgassing. Also, if the conductive bonding material is solder, heating causes the flux to evaporate and generate outgassing. In the technology of Patent Document 2, the conductive bonding material is heated while covered with a sealing material, and voids are formed inside the sealing material due to the outgassing from the conductive bonding material. As a result, the reliability of the circuit module is reduced. This specification proposes a technology for suppressing damage to the conductive bonding material in a circuit module using a reinforcing material and suppressing the generation of voids inside the reinforcing material. [Means for solving the problem]

[0006] The circuit module disclosed in this specification includes a first circuit component having a plurality of electrode pads on a specific surface, a second circuit component having a plurality of electrode pads on the specific surface, a conductive bonding material, a first reinforcing bonding material, and a second reinforcing bonding material made of a material different from the conductive bonding material and the first reinforcing bonding material. The first circuit component and the second circuit component are arranged so that the plurality of electrode pads of the first circuit component face the plurality of electrode pads of the second circuit component. The conductive bonding material bonds each of the electrode pads of the first circuit component to the corresponding electrode pad of the second circuit component. The first reinforcing bonding material is not in contact with the conductive bonding material, but bonds the specific surface of the first circuit component to the specific surface of the second circuit component. The second reinforcing bonding material surrounds the conductive bonding material, is distributed in a range that contacts the first reinforcing bonding material, and bonds the specific surface of the first circuit component to the specific surface of the second circuit component.

[0007] During manufacturing of this circuit module, the conductive bonding material and the first reinforcing bonding material are positioned so that the conductive bonding material contacts each electrode pad of the first circuit component and each electrode pad of the second circuit component, and the first reinforcing bonding material contacts a specific surface of the first circuit component and a specific surface of the second circuit component at a position where the conductive bonding material does not contact the conductive bonding material. Upon heating, the conductive bonding material adheres to each electrode pad of the first circuit component and each electrode pad of the second circuit component. Furthermore, the first reinforcing bonding material adheres to the specific surface of the first circuit component and the specific surface of the second circuit component. Although outgassing occurs from the conductive bonding material during heating, the first reinforcing bonding material does not contact the conductive bonding material, thereby suppressing the formation of voids in the first reinforcing bonding material. Subsequently, when the temperature of the laminate decreases, thermal stress is applied to the conductive bonding material. However, because the first reinforcing bonding material bonds the first circuit component and the second circuit component, the thermal stress applied to the conductive bonding material is reduced. This prevents damage to the conductive bonding material. Then, a second reinforcing bonding material is formed to cover the conductive bonding material, protecting the conductive bonding material and ensuring the reliability of the circuit module. Furthermore, since the second reinforcing bonding material is formed after the conductive bonding material has been bonded to each electrode pad, it is not affected by outgassing from the conductive bonding material. Therefore, the formation of voids in the second reinforcing bonding material is prevented. In this way, this circuit module can prevent damage to the conductive bonding material when the temperature drops after heating, and also prevent the formation of voids within the first reinforcing bonding material and the second reinforcing bonding material. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view of a circuit module according to a first embodiment. [Figure 2] 3 is a cross-sectional view of the circuit module taken along line II-II in FIG. 1 (line 16a in FIG. 3). [Figure 3] FIG. 1 is a plan view of a circuit module seen from above. [Figure 4] FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 3 . [Figure 5] Graph showing the relationship between distance L1 and shear stress S. [Figure 6] An explanatory diagram of distances L1 and L2. [Figure 7] An explanatory diagram of distances L1 and L2. [Figure 8] 10 is a graph showing the change in shear stress applied to the conductive bonding material with respect to the area ratio M when the reinforcing bonding material 41 is not present. [Figure 9] FIG. 10 is a plan view showing a circuit module according to a second embodiment. [Figure 10] FIG. 10 is a plan view showing a circuit module according to a third embodiment. [Figure 11] FIG. 10 is a plan view showing a circuit module according to a fourth embodiment. [Figure 12] FIG. 10 is a plan view showing a circuit module according to a fifth embodiment. [Figure 13] FIG. 13 is a plan view showing a circuit module according to a sixth embodiment. [Figure 14] FIG. 13 is a plan view showing a circuit module according to a seventh embodiment. [Figure 15] 13A to 13C are explanatory diagrams illustrating the manufacturing process of the circuit module according to the eighth embodiment. [Figure 16] 13A to 13C are explanatory diagrams illustrating the manufacturing process of the circuit module according to the eighth embodiment. [Figure 17] 13A to 13C are explanatory diagrams illustrating the manufacturing process of the circuit module according to the eighth embodiment. [Figure 18] 13A to 13C are explanatory diagrams illustrating the manufacturing process of the circuit module according to the ninth embodiment. [Figure 19] 13A to 13C are explanatory diagrams illustrating the manufacturing process of the circuit module according to the ninth embodiment. [Figure 20] 13A to 13C are explanatory diagrams illustrating the manufacturing process of the circuit module according to the ninth embodiment. [Figure 21] 13A to 13C are explanatory diagrams illustrating the manufacturing process of the circuit module according to the tenth embodiment. [Figure 22] 13A to 13C are explanatory diagrams illustrating the manufacturing process of the circuit module according to the tenth embodiment. [Figure 23] 13A to 13C are explanatory diagrams illustrating the manufacturing process of the circuit module according to the tenth embodiment. [Figure 24] FIG. 23 is a plan view of a circuit module according to an eleventh embodiment. [Figure 25] FIG. 23 is a plan view of a circuit module according to a twelfth embodiment. [Figure 26] FIG. 23 is a plan view of a circuit module according to a thirteenth embodiment. [Figure 27]FIG. 23 is an enlarged plan view of the periphery of the electrode pads of the circuit module according to the fourteenth embodiment. [Figure 28] FIG. 23 is an enlarged plan view of the periphery of the electrode pads of the circuit module according to the fifteenth embodiment. [Figure 29] FIG. 20 is an enlarged plan view of the periphery of the electrode pads of the circuit module according to the sixteenth embodiment. [Figure 30] FIG. 10 is an explanatory diagram of an example of a method for manufacturing the circuit modules of Examples 14 to 16. DETAILED DESCRIPTION OF THE INVENTION

[0009] In the circuit module disclosed in the present specification as an example, the conductive bonding material may be a mixture of a conductive material and a resin.

[0010] In this configuration, outgassing is likely to occur from the conductive bonding material, and therefore the effect of suppressing the occurrence of voids is more effective.

[0011] In one example circuit module disclosed in this specification, the plurality of electrode pads of the first circuit component may be arranged to form a linear row along a first direction on the specific surface of the first circuit component. The plurality of electrode pads of the second circuit component may be arranged linearly along the first direction at a position facing the row. The first reinforcing bonding material may be arranged at a position shifted from the row in a second direction intersecting the first direction. The first reinforcing bonding material may be distributed continuously in the first direction from one end of the row to the other end of the row.

[0012] This configuration effectively reduces the thermal stress applied to the conductive bonding material at the portions in contact with the electrode pads at both ends.

[0013] In one example circuit module disclosed in the present specification, the plurality of electrode pads of the first circuit component may be arranged to form a first row linearly arranged along a first direction on the specific surface of the first circuit component and a second row linearly arranged along the first direction at a position shifted from the first row in a second direction intersecting the first direction. The plurality of electrode pads of the second circuit component may be arranged to form a row linearly arranged along the first direction at a position opposite the first row and a row linearly arranged along the first direction at a position opposite the second row. The first reinforcing bonding material may be arranged between the first row and the second row in the second direction.

[0014] This configuration effectively reduces the thermal stress applied to the conductive bonding material at the portions in contact with the electrode pads.

[0015] In an example circuit module disclosed in the present specification, one of the first circuit component and the second circuit component may include a gate-type switching element, and the other of the first circuit component and the second circuit component may include a gate control circuit that controls a gate voltage of the switching element.

[0016] In the circuit module disclosed in the present specification, the second reinforcing bonding material may have a higher linear expansion coefficient than the conductive bonding material.

[0017] This configuration effectively reduces residual stress that occurs in the conductive bonding material after the second reinforcing bonding material is formed.

[0018] In the circuit module disclosed in the present specification, the linear expansion coefficient of the first reinforcing bonding material may be lower than the linear expansion coefficient of the conductive bonding material.

[0019] This configuration effectively reduces residual stress that occurs at the end of the second reinforcing bonding material after the second reinforcing bonding material is formed.

[0020] In the circuit module disclosed in the present specification, the linear expansion coefficient of the first reinforcing bonding material may be higher than half the linear expansion coefficient of the second reinforcing bonding material.

[0021] This configuration effectively reduces residual stress that occurs at the interface between the first and second reinforcing bonding materials after the second reinforcing bonding material is formed.

[0022] In the circuit module according to the present disclosure, the first reinforcing bonding material may be arranged to form a plurality of islands separated from one another, and the second reinforcing bonding material may cover the periphery of each of the islands.

[0023] In the circuit module according to the exemplary embodiment disclosed herein, at least one of the specific surface of the first circuit component and the specific surface of the second circuit component may have a recess, and the first reinforcing bonding material may be disposed in the recess.

[0024] This configuration can reduce variations in the bonding area of ​​the first reinforcing bonding material.

[0025] In one example circuit module disclosed in the present specification, at least one of the specific surface of the first circuit component and the specific surface of the second circuit component may have an annular groove. The first reinforcing bonding material may be disposed within an area surrounded by the groove. An outer periphery of the first reinforcing bonding material may be disposed within the groove.

[0026] This configuration can reduce variations in the bonding area of ​​the first reinforcing bonding material.

[0027] In one example circuit module disclosed in the present specification, at least one of the specific surface of the first circuit component and the specific surface of the second circuit component may have a first surface and a second surface having a surface roughness greater than that of the first surface, and the first reinforcing bonding material may be in contact with the first surface.

[0028] This configuration can reduce variations in the bonding area of ​​the first reinforcing bonding material.

[0029] In the circuit module disclosed in the present specification, the first reinforcing bonding material may be made of the same material as the conductive bonding material.

[0030] According to this configuration, the conductive bonding material and the first reinforcing bonding material can be applied at the same time.

[0031] In the circuit module disclosed in the present specification as an example, the proportion of the area of ​​the bonded range by the conductive bonding material in the opposing portion between the first circuit component and the second circuit component may be 15% or less.

[0032] This specification also proposes a method for manufacturing a circuit module. This manufacturing method includes first to fourth steps. The first step is a step of arranging a conductive bonding material and a first reinforcing bonding material between a first circuit component and a second circuit component. In the first step, the first circuit component, the second circuit component, the conductive bonding material, and the first reinforcing bonding material are arranged so that a plurality of electrode pads provided on a specific surface of the first circuit component face a plurality of electrode pads provided on a specific surface of the second circuit component, the conductive bonding material contacts each of the electrode pads of the first circuit component and each of the electrode pads of the second circuit component, and the first reinforcing bonding material contacts the specific surface of the first circuit component and the specific surface of the second circuit component at a position where the first reinforcing bonding material does not contact the conductive bonding material. In the second step, the laminate of the first circuit component and the second circuit component is heated to bond the conductive bonding material to the electrode pads of the first circuit component and the electrode pads of the second circuit component, and to bond the first reinforcing bonding material to the specific surface of the first circuit component and the specific surface of the second circuit component. In the third step, a second reinforcing bonding material, which is made of a material different from the conductive bonding material and the first reinforcing bonding material, is applied between the specific surface of the first circuit component and the specific surface of the second circuit component. In the third step, the second reinforcing bonding material is applied so that it covers the periphery of the conductive bonding material, is distributed in a range that contacts the first reinforcing bonding material, and is in contact with the specific surface of the first circuit component and the specific surface of the second circuit component. In the fourth step, the laminate is heated to bond the second reinforcing bonding material to the specific surface of the first circuit component and the specific surface of the second circuit component.

[0033] According to this manufacturing method, the reinforcing material can suppress breakage of the conductive bonding material, and can also suppress the occurrence of voids inside the reinforcing material.

[0034] In one example of the manufacturing method disclosed herein, the first reinforcing bonding material may be made of the same material as the conductive bonding material. The step of disposing the conductive bonding material and the first reinforcing bonding material between the first circuit component and the second circuit component may include the step of simultaneously applying the conductive bonding material and the first reinforcing bonding material to one of the specific surface of the first circuit component and the specific surface of the second circuit component.

[0035] According to this configuration, the conductive bonding material and the first reinforcing bonding material can be applied at the same time.

[0036] In one example of the manufacturing method disclosed herein, the first circuit component may have a through hole opening to the specific surface of the first circuit component, or the second circuit component may have a through hole opening to the specific surface of the second circuit component. The step of applying the second reinforcing bonding material may include injecting the second reinforcing bonding material through the through hole between the specific surface of the first circuit component and the specific surface of the second circuit component.

[0037] This configuration allows the second reinforcing bonding material to be suitably injected between the specific surface of the first circuit component and the specific surface of the second circuit component. [Example]

[0038] 1 includes a circuit component 11 and a circuit component 21. The circuit component 11 is joined to the circuit component 21. The circuit component 21 incorporates a gate-type switching element, which is a power semiconductor. The circuit component 11 incorporates a gate control circuit that controls the gate voltage of the switching element incorporated in the circuit component 21.

[0039] 2, a plurality of electrode pads 12 are provided on a surface 11a of the circuit component 11. The portion of the surface 11a other than the electrode pads 12 is made of insulating resin 13. Although not shown, a semiconductor chip, wiring, and the like that constitute a gate control circuit are provided inside the insulating resin 13.

[0040] A plurality of electrode pads 22 are provided on the surface 21a of the circuit component 21. The portion of the surface 21a other than the electrode pads 22 is made up of an insulating resin 23. Although not shown, semiconductor chips, wiring, and the like that constitute switching elements are provided inside the insulating resin 23.

[0041] The circuit component 11 is stacked on the circuit component 21 so that the surface 21a of the circuit component 21 faces the surface 11a of the circuit component 11. Each electrode pad 12 of the circuit component 11 faces each electrode pad 22 of the circuit component 21 in a one-to-one relationship. That is, each electrode pad 12 faces a corresponding one of the plurality of electrode pads 22.

[0042] FIG. 3 shows a plan view of the circuit components 11 and 21 as viewed from above along the stacking direction. Since each electrode pad 12 faces each electrode pad 22 in a one-to-one relationship, the electrode pads 12 and 22 are shown overlapping in FIG. 3. The outline of the circuit component 11 is indicated by a dashed line in FIG. 3. As shown in FIG. 3, the electrode pads 12 are arranged on the surface 11a of the circuit component 11 to form three columns 14a to 14c. In each of the columns 14a to 14c, the electrode pads 12 are arranged linearly at equal intervals along the x direction. The column 14c is aligned on the same line as the line 16a along which the column 14a extends. The column 14c is spaced apart from the column 14a in the x direction. The column 14b is offset from the columns 14a and 14c in the y direction (i.e., perpendicular to the x direction). That is, the straight line 16b on which the row 14b is arranged is shifted in the y direction from the straight line 16a on which the rows 14a and 14c are arranged. The row 14b is arranged between the rows 14a and 14c in the x direction. As described above, the electrode pads 22 of the circuit component 21 are arranged so as to overlap with the electrode pads 12 of the circuit component 11. Therefore, the electrode pads 22 are arranged on the surface 21a of the circuit component 21 to form rows 24a to 24c extending along the rows 14a to 14c. That is, in each of the rows 24a to 24c, a plurality of electrode pads 22 are linearly arranged at equal intervals along the x direction. The rows 24a and 24c are positioned opposite the rows 14a and 14c and are aligned on the same line as the straight line 16a. The row 24b is positioned opposite the row 14b and is aligned on the same line as the straight line 16b.

[0043] As shown in FIG. 2, a conductive bonding material 30 is disposed between the circuit component 11 and the circuit component 21. The conductive bonding material 30 is made of a mixture of a conductive material and a resin. However, the conductive bonding material 30 may also be made of solder. The conductive bonding material 30 is disposed between each pair of opposing electrode pads 12 and 22. The conductive bonding material 30 is fixed to the upper electrode pad 12 and the lower electrode pad 22. The conductive bonding material 30 bonds and electrically connects the electrode pad 12 to the lower electrode pad 22. In the portion where the circuit component 11 and the circuit component 21 face each other, the proportion of the area of ​​the bonding range by the conductive bonding material 30 is 15% or less.

[0044] 2 to 4, reinforcing bonding materials 41 and 42 are disposed between circuit component 11 and circuit component 21. Reinforcing bonding materials 41 and 42 are insulating bonding materials. Reinforcing bonding material 42 is made of a different material from reinforcing bonding material 41.

[0045] As shown in Fig. 3, the reinforcing bonding material 41 is disposed between the straight line 16a (i.e., the straight line along which the rows 14a and 14c extend) and the straight line 16b (i.e., the straight line along which the row 14b extends). The reinforcing bonding material 41 is not in contact with the conductive bonding material 30, the electrode pad 12, or the electrode pad 22. As shown in Fig. 4, the reinforcing bonding material 41 bonds the surface 11a of the circuit component 11 to the surface 21a of the circuit component 21. More specifically, the reinforcing bonding material 41 bonds the surface of the insulating resin 13 on the surface 11a to the surface of the insulating resin 23 on the surface 21a.

[0046] As shown in FIG. 3, the reinforcing bonding material 42 is disposed around the reinforcing bonding material 41. The reinforcing bonding material 42 contacts the entire outer circumferential surface of the reinforcing bonding material 41. The distribution range of the reinforcing bonding material 42 includes the electrode pads 12 and 22 (i.e., rows 14a to 14c and 24a to 24c). As shown in FIG. 2, the reinforcing bonding material 42 covers the periphery of the conductive bonding material 30 (i.e., each connection portion where the electrode pad 12 and the electrode pad 22 are connected by the conductive bonding material 30). The reinforcing bonding material 42 contacts the entire outer circumferential surface of each connection portion of the conductive bonding material 30. As shown in FIGS. 2 and 4, the reinforcing bonding material 42 bonds the surface 11a of the circuit component 11 to the surface 21a of the circuit component 21. More specifically, the reinforcing bonding material 42 bonds the surface of the insulating resin 13 on the surface 11a to the surface of the insulating resin 23 on the surface 21a.

[0047] As shown in FIG. 3 , the circuit component 21 has an end 21t-1 and an end 21t-2 in the x direction. The row 14a has an end 15a-1 close to the end 21t-1 and an end 15a-2 close to the end 21t-2 in the x direction. The row 14b has an end 15b-1 close to the end 21t-1 and an end 15b-2 close to the end 21t-2 in the x direction. The row 14c has an end 15c-1 close to the end 21t-1 and an end 15c-2 close to the end 21t-2 in the x direction. The reinforcing bonding material 41 extends from a position outside the end 15a-1 (i.e., a position closer to the end 21t-1 than the end 15a-1) to a position outside the end 15c-2 (i.e., a position closer to the end 21t-2 than the end 15c-2) in the x direction. Therefore, near row 14a, reinforcing bonding material 41 extends from a position outside end 15a-1 to a position outside end 15a-2. Near row 14b, reinforcing bonding material 41 extends from a position outside end 15b-1 to a position outside end 15b-2. Near row 14c, reinforcing bonding material 41 extends from a position outside end 15c-1 to a position outside end 15c-2.

[0048] The linear expansion coefficient K30 of the conductive bonding material 30, the linear expansion coefficient K41 of the reinforcing bonding material 41, and the linear expansion coefficient K42 of the reinforcing bonding material 42 satisfy the relationship of K42 / 2 < K41 < K30 < K42.

[0049] Next, a method for manufacturing the circuit module 10 will be described. The circuit module 10 is manufactured by joining the circuit component 11 and the circuit component 21.

[0050] (Coating step of the conductive bonding material 30 and the reinforcing bonding material 41) First, the conductive bonding material 30 and the reinforcing bonding material 41 are applied to the surface 21a of the circuit component 21. Here, the conductive bonding material 30 is applied to the surface of each electrode pad 22. The conductive bonding material 30 may be a conductive paste (that is, a paste in which a conductive material, a resin, and a solvent are mixed (for example, a silver paste)), or may be cream solder. Also, the conductive bonding material 30 may be preform solder (for example, solder balls, etc.). When the conductive bonding material 30 is preform solder, instead of application, the conductive bonding material 30 (that is, the preform solder) is placed on each electrode pad 22. Further, the reinforcing bonding material 41 is applied to the surface 21a in the range between the straight line 16a and the straight line 16b so as not to contact each electrode pad 22 and the conductive bonding material 30. Instead of applying the conductive bonding material 30 and the reinforcing bonding material 41 to the surface 21a of the circuit component 21, the conductive bonding material 30 and the reinforcing bonding material 41 may be applied to the surface la of the circuit component 11.

[0051] (Lamination step) Next, as shown in FIG. 2 , circuit component 11 is stacked on circuit component 21 so that surface 11a faces surface 21a (i.e., so that each electrode pad 12 faces the corresponding electrode pad 22). As a result, conductive bonding material 30 and reinforcing bonding material 41 are disposed between circuit component 11 and circuit component 21. Conductive bonding material 30 contacts both electrode pads 12 and 22, and reinforcing bonding material 41 contacts both surfaces 11a and 21a. Note that conductive bonding material 30 and reinforcing bonding material 41 spread laterally when pressure is applied between circuit component 11 and circuit component 21, but even in this state, reinforcing bonding material 41 does not contact conductive bonding material 30 or electrode pads 12 and 22.

[0052] (1st heating step) Next, the laminate of the circuit components 11 and 21 is heated. This bonds the conductive bonding material 30 to the electrode pads 12 and 22, and bonds the reinforcing bonding material 41 to the surfaces 11a and 21a. The reinforcing bonding material 41 hardens by heating and bonds to the surfaces 11a and 21a. If the conductive bonding material 30 is a conductive paste, the conductive bonding material 30 hardens by heating and bonds to the electrode pads 12 and 22. If the conductive bonding material 30 is solder, the conductive bonding material 30 melts by heating. Thereafter, as the temperature of the laminate decreases, the conductive bonding material 30 solidifies and bonds to the electrode pads 12 and 22. Note that when the conductive bonding material 30 is heated, outgassing occurs from the conductive bonding material 30. That is, if the conductive bonding material 30 is a conductive paste, the solvent contained in the conductive paste volatilizes by heating, generating outgassing. If the conductive bonding material 30 is solder, the flux contained in the solder volatilizes by heating, generating outgassing. Since the outer peripheral surface of the conductive bonding material 30 is exposed at each connection, outgassing generated in the conductive bonding material 30 is discharged to the outside of the laminate. Since the conductive bonding material 30 is not in contact with the reinforcing bonding material 41, the formation of voids inside the reinforcing bonding material 41 due to outgassing generated in the conductive bonding material 30 is prevented.

[0053] (Temperature reduction process) Once the conductive bonding material 30 and the reinforcing bonding material 41 are bonded to their respective objects, the laminate is cooled to room temperature. During the process of cooling the laminate, the circuit components 11 and 21 each contract. Because the linear expansion coefficients of the circuit components 11 and 21 differ, the amount of contraction differs between the circuit components 11 and 21. This causes shear stress to be applied to the conductive bonding material 30 at each connection. Furthermore, because the amount of contraction differs between the circuit components 11 and 21, warping occurs in the circuit components 11 and 21. This causes tensile stress to be applied to the conductive bonding material 30 at each connection. In this embodiment, during the temperature-lowering process, the circuit components 11 and 21 are bonded not only by the conductive bonding material 30 but also by the reinforcing bonding material 41. Because the reinforcing bonding material 41 suppresses deformation of the circuit components 11 and 21, the thermal stress applied to the conductive bonding material 30 during the temperature-lowering process is reduced. This prevents the conductive bonding material 30 from being damaged during the temperature lowering step.

[0054] (Filling process of reinforcing bonding material 42) Next, the gap between the surface 11a of the circuit component 11 and the surface 21a of the circuit component 21 (i.e., the space around the reinforcing bonding material 41) is filled with the reinforcing bonding material 42. The reinforcing bonding material 42 is filled so as to cover the outer peripheral surface of the conductive bonding material 30 at each connection portion, cover the outer peripheral surface of the reinforcing bonding material 41, and come into contact with the surface 11a and the surface 21a.

[0055] (Second heating step) Next, the laminate of circuit components 11 and 21 is heated. This hardens reinforcing bonding material 42 and bonds it to surfaces 11 a and 21 a. Reinforcing bonding material 42 also adheres closely to the outer periphery of conductive bonding material 30 at each connection, protecting conductive bonding material 30.

[0056] By performing the above steps, the circuit module 10 shown in FIGS. 1 to 4 is completed. As described above, in the first heating step, the outer peripheral surface of the conductive bonding material 30 is exposed, so that it is possible to prevent voids from being formed in the reinforcing bonding material 41 due to outgassing from the conductive bonding material 30. Furthermore, since the reinforcing bonding material 42 is formed after the first heating step, it is not affected by outgassing from the conductive bonding material 30. Therefore, it is possible to prevent voids from being formed in the reinforcing bonding material 42. In this way, according to this manufacturing method, it is possible to prevent voids from being formed in the reinforcing bonding materials 41, 42. Furthermore, in the first heating step, the reinforcing bonding material 41 reduces the thermal stress applied to the conductive bonding material 30, so that it is possible to prevent damage to the conductive bonding material 30.

[0057] In this embodiment, the reinforcing bonding material 41 is disposed between two straight lines 16a and 16b along which the rows of the electrode pads 12 and 22 extend. This configuration reduces the thermal stress applied to the conductive bonding material 30 at both the connection points on the straight line 16a and the connection points on the straight line 16b.

[0058] Furthermore, after the circuit module 10 is completed, thermal stress generated during the manufacturing process remains inside the circuit module 10. Experiments have shown that if the linear expansion coefficient K42 of the reinforcing bonding material 42 is smaller than the linear expansion coefficient K30 of the conductive bonding material 30, the residual stress in the conductive bonding material 30 increases. This is thought to be because if the amount of contraction of the reinforcing bonding material 42 is smaller than the amount of contraction of the conductive bonding material 30 during the process in which the temperature of the circuit module 10 decreases after the reinforcing bonding material 42 hardens, high tensile stress (i.e., stress acting in a direction that causes the conductive bonding material 30 to peel from the electrode pads 12, 22) occurs in the conductive bonding material 30. In this example, the linear expansion coefficient K42 of the reinforcing bonding material 42 is larger than the linear expansion coefficient K30 of the conductive bonding material 30, so the residual stress generated in the conductive bonding material 30 can be reduced.

[0059] Furthermore, experiments have revealed that if the linear expansion coefficient K41 of the reinforcing bonding material 41 is greater than the linear expansion coefficient K30 of the conductive bonding material 30, the residual stress generated at the outermost periphery of the reinforcing bonding material 42 increases. This is thought to be because if the reinforcing bonding material 41 shrinks significantly during the process in which the temperature of the circuit module 10 decreases after the reinforcing bonding material 42 hardens, the reinforcing bonding material 41 pulls the reinforcing bonding material 42 toward itself, generating high shear stress at the outermost periphery of the reinforcing bonding material 42. In this example, the linear expansion coefficient K41 of the reinforcing bonding material 41 is smaller than the linear expansion coefficient K30 of the conductive bonding material 30, so the residual stress generated at the outermost periphery of the reinforcing bonding material 42 can be reduced.

[0060] Furthermore, experiments have revealed that when there is a large difference between the linear expansion coefficient K41 of the reinforcing bonding material 41 and the linear expansion coefficient K42 of the reinforcing bonding material 42, high residual stress occurs at the interface between the reinforcing bonding material 41 and the reinforcing bonding material 42. In this example, the linear expansion coefficient K41 of the reinforcing bonding material 41 is greater than half the linear expansion coefficient K42 of the reinforcing bonding material 42 (i.e., the difference between the linear expansion coefficient K41 and the linear expansion coefficient K42 is small), so the residual stress occurring at the interface between the reinforcing bonding material 41 and the reinforcing bonding material 42 can be reduced.

[0061] FIG. 5 shows the experimental results of measuring the shear stress S applied to the conductive bonding material 30 at the connection portion including the end 15a-1 of the row 14a during the temperature reduction process while changing the distribution range of the reinforcing bonding material 41 near the end 15a-1 of the row 14a as shown in FIGS. 6 and 7. The distance L1 shown on the horizontal axis of FIG. 5 is the distance the reinforcing bonding material 41 protrudes from the end 15a-1 in the x direction as shown in FIG. 6. Note that when the reinforcing bonding material 41 does not reach the end 15a-1 in the x direction as shown in FIG. 7, the distance L1 is expressed as a negative value. The distance L2 shown in FIG. 5 is the distance between the reinforcing bonding material 41 and the row 14a as shown in FIGS. 6 and 7. When the reinforcing bonding material 41 was not provided, the shear stress S was 19.3 MPa. As shown in FIG. 5, regardless of the values ​​of the distances L1 and L2, providing the reinforcing bonding material 41 reduced the shear stress S to a value lower than 19.3 MPa. Furthermore, as shown in FIG. 5, regardless of the distance L2, when the distance L1 is a negative value, the shear stress S decreases as the distance L1 approaches 0. Furthermore, regardless of the distance L2, when the distance L1 is greater than 0, the shear stress S is approximately the same as when the distance L1 is 0. This result shows that by making the distance L1 greater than 0, the shear stress S at the end 15a-1 can be effectively reduced. In this embodiment, the reinforcing bonding material 41 extends continuously from the outside of one end to the outside of the other end of each of the rows 14a to 14c. That is, the distance L1 of the reinforcing bonding material 41 at each end of each row is greater than 0. Therefore, the thermal stress generated in the conductive bonding material 30 during the temperature reduction process can be efficiently reduced at each end of each row.

[0062] FIG. 8 shows experimental results of measuring the shear stress generated in the conductive bonding material during the temperature reduction process when no reinforcing bonding material is used. The horizontal axis of FIG. 8 represents the area ratio M of the bonding area of ​​the conductive bonding material to the opposing portion of two circuit components. As shown in FIG. 8, the smaller the area ratio M, the higher the shear stress generated in the conductive bonding material. The shear stress at which a typical silver paste breaks is 15 MPa. As shown in FIG. 8, when the area ratio M is 15% or less, the shear stress generated in the conductive bonding material exceeds 15 MPa. By using the reinforcing bonding material 41, the shear stress generated in the conductive bonding material during the temperature reduction process can be reduced compared to FIG. 8, and damage to the conductive bonding material can be suppressed even when the area ratio M is 15% or less. In other words, applying the technology disclosed in this specification when the area ratio M is 15% or less can achieve a greater effect in preventing damage to the conductive bonding material.

[0063] As shown in FIGS. 9 to 14, the reinforcing bonding material 41 may be formed to form multiple islands that are separated from one another. This configuration makes it easier to discharge outgassing from the reinforcing bonding material 41 itself to the outside of the laminate during the first heating step. This further reduces the generation of voids within the reinforcing bonding material 41. In this case, as shown in FIGS. 12 to 14, it is preferable that each island of the reinforcing bonding material 41 extends continuously from the outside of one end of each row 14a to the outside of the other end at a position adjacent to each row 14a to 14c. This configuration reduces the shear stress S generated in the conductive bonding material 30 at each end, as described above with reference to FIG. 5.

[0064] 15, a recess 50 may be provided in the area between the straight lines 16a and 16b on the surface 21a, and the reinforcing bonding material 41 may be applied within the recess 50 during the application process. The electrode pads 22 are positioned outside the recess 50. In this configuration, the reinforcing bonding material 41 spreads laterally within the recess 50 during the subsequent lamination process, as shown in FIG. 16. This configuration allows the thickness T1 of the reinforcing bonding material 41 to be greater than the distance C1 between the surface 11a of the circuit component 11 and the surface 21a of the circuit component 21. Therefore, even if the distance C1 varies, the proportion of the variation relative to the thickness T1 is small, thereby suppressing variation in the range over which the reinforcing bonding material 41 spreads during the lamination process. This more reliably prevents the reinforcing bonding material 41 from contacting the conductive bonding material 30. Furthermore, because the electrode pads 12 and 22 are positioned outside the recess 50, the thickness of the conductive bonding material 30 can be reduced, thereby reducing the electrical resistance of the conductive bonding material 30. 17, a reinforcing bonding material 42 can be formed around the reinforcing bonding material 41. The recess 50 may be provided on the surface 11a of the circuit component 11, or on both the surface 11a of the circuit component 11 and the surface 21a of the circuit component 21. These configurations also provide the same effects as the configurations of FIGS. 15 to 17.

[0065] 18, a groove 52 extending annularly may be provided in the area between the straight lines 16a and 16b on the surface 21a. In the application process, the reinforcing bonding material 41 may be applied within an area 53 surrounded by the groove 52. The electrode pad 22 is positioned outside the area surrounded by the groove 52. In this configuration, when the reinforcing bonding material 41 spreads laterally in the subsequent lamination process, excess reinforcing bonding material 41 flows into the groove 52, as shown in FIG. 19. This prevents the reinforcing bonding material 41 from spreading beyond the groove 52. This reduces variation in the area over which the reinforcing bonding material 41 spreads during the lamination process. This more reliably prevents the reinforcing bonding material 41 from coming into contact with the conductive bonding material 30. Then, as shown in FIG. 20, the reinforcing bonding material 42 can be formed around the reinforcing bonding material 41. The groove 52 may be provided on the surface 11a of the circuit component 11, or on both the surface 11a of the circuit component 11 and the surface 21a of the circuit component 21. These configurations also provide the same effects as the configurations in FIGS.

[0066] 21, a first surface 61 having a small surface roughness may be provided in the area between the straight lines 16a and 16b on the surface 21a, and a second surface 62 having a larger surface roughness than the first surface 61 may be provided around the first surface 61. The electrode pads 22 are provided on the second surface 62. In this case, the reinforcing bonding material 41 may be applied to the first surface 61 in the application process. In this configuration, when the reinforcing bonding material 41 spreads laterally in the subsequent lamination process, the reinforcing bonding material 41 flows easily on the smooth first surface 61 but does not flow easily on the rough second surface 62. Therefore, as shown in FIG. 22, the reinforcing bonding material 41 is prevented from spreading from the first surface 61 to the second surface 62. In other words, the spreading range of the reinforcing bonding material 41 is easily limited to the first surface 61. This reduces variation in the spreading range of the reinforcing bonding material 41 in the lamination process. Therefore, it is possible to more reliably prevent the reinforcing bonding material 41 from coming into contact with the conductive bonding material 30. Then, as shown in Fig. 23, the reinforcing bonding material 42 can be formed around the reinforcing bonding material 41. The first surface 61 and the second surface 62 may be provided on the surface 11a of the circuit component 11, or may be provided on both the surface 11a of the circuit component 11 and the surface 21a of the circuit component 21. With these configurations, the same effects as those of the configurations shown in Figs. 21 to 23 can be obtained.

[0067] Furthermore, the reinforcing bonding material 41 may be made of the same material as the conductive bonding material 30, rather than an insulating material. With this configuration, the conductive bonding material 30 and the reinforcing bonding material 41 can be applied to the surface 21a (or surface 11a) at the same time in the application process. For example, the conductive bonding material 30 and the reinforcing bonding material 41 can be applied simultaneously by screen printing. With this configuration, the circuit module 10 can be manufactured more efficiently. Furthermore, because the reinforcing bonding material 41 is not in contact with the conductive bonding material 30, a short circuit does not occur even if the reinforcing bonding material 41 is conductive.

[0068] The distribution of the electrode pads 12, 22 (i.e., the distribution of the connection portions of the conductive bonding material 30) can be freely changed. For example, the distributions shown in FIGS. 24 to 26 can be adopted. Even in this case, the reinforcing bonding material 41 can be disposed at a distance from the conductive bonding material 30, and the reinforcing bonding material 42 can be provided to cover the conductive bonding material 30. In this case, too, if the reinforcing bonding material 41 extends continuously from one end position to the other end position of each row of the electrode pads 12, 22 in the direction in which each row extends, the thermal stress applied to the conductive bonding material 30 at the ends of each row can be effectively suppressed.

[0069] 27 to 29, the electrode pads 12, 22 may be provided in an area sandwiched or surrounded by a reinforcing bonding material 41. In this case, the presence of hardened reinforcing bonding material 41 makes it difficult to apply the reinforcing bonding material 42 to the periphery of the electrode pads 12, 22 (i.e., the conductive bonding material 30) during the process of applying the reinforcing bonding material 42. Therefore, in this case, as shown in FIG. 30, a through hole 70 opening to the surface 11a may be provided in the circuit component 11, and the reinforcing bonding material 42 may be filled through the through hole 70 around the electrode pads 12, 22. The through hole 70 may also be provided in the circuit component 21.

[0070] The features of the circuit module and the manufacturing method thereof described in this specification are listed below. (Item 1) A circuit module comprising: a first circuit component (11) having a plurality of electrode pads (12) on a specific surface (11a); a second circuit component (21) having a plurality of electrode pads (22) on a specific surface (21a); A conductive bonding material (30); A first reinforcing joint material (41); a second reinforcing bonding material (42) made of a material different from the conductive bonding material and the first reinforcing bonding material; and the first circuit component and the second circuit component are arranged such that the plurality of electrode pads of the first circuit component face the plurality of electrode pads of the second circuit component; the conductive bonding material bonds each of the electrode pads of the first circuit component to a corresponding electrode pad of the second circuit component; the first reinforcing bonding material is not in contact with the conductive bonding material and bonds the specific surface of the first circuit component to the specific surface of the second circuit component; the second reinforcing bonding material covers the periphery of the conductive bonding material, is distributed in a range in contact with the first reinforcing bonding material, and bonds the specific surface of the first circuit component to the specific surface of the second circuit component. Circuit module. (Item 2) Item 2. The circuit module according to item 1, wherein the conductive bonding material is a mixture of a conductive material and a resin. (Item 3) the plurality of electrode pads of the first circuit component are arranged to form a line (14a) linearly arranged along a first direction on the specific surface of the first circuit component, the plurality of electrode pads of the second circuit component are linearly arranged along the first direction at positions facing the rows, the first reinforcing bonding material is disposed at a position offset from the row in a second direction intersecting the first direction, The first reinforcing bonding material is distributed continuously in the first direction from one end (15a-1) of the row to the other end (15a-2) of the row. Item 3. The circuit module according to item 1 or 2. (Item 4) the plurality of electrode pads of the first circuit component are arranged to form a first row (14a, 14c) linearly arranged along a first direction on the specific surface of the first circuit component, and a second row (14b) linearly arranged along the first direction at a position shifted from the first row in a second direction intersecting the first direction, the plurality of electrode pads of the second circuit component are arranged to form a row (24a, 24c) that is linearly arranged along the first direction at a position opposite to the first row, and a row (24b) that is linearly arranged along the first direction at a position opposite to the second row, The first reinforcing bonding material is disposed between the first row and the second row in the second direction. Item 3. The circuit module according to item 1 or 2. (Item 5) one of the first circuit component and the second circuit component has a gate-type switching element; the other of the first circuit component and the second circuit component has a gate control circuit that controls a gate voltage of the switching element. The circuit module according to any one of items 1 to 4. (Item 6) 6. The circuit module according to any one of items 1 to 5, wherein the second reinforcing bonding material has a higher linear expansion coefficient than the conductive bonding material. (Item 7) 7. The circuit module according to any one of items 1 to 6, wherein the linear expansion coefficient of the first reinforcing bonding material is lower than the linear expansion coefficient of the conductive bonding material. (Item 8) 8. The circuit module according to any one of items 1 to 7, wherein the linear expansion coefficient of the first reinforcing bonding material is higher than half the linear expansion coefficient of the second reinforcing bonding material. (Item 9) The first reinforcing bonding materials are arranged to form a plurality of islands separated from each other, The second reinforcing bonding material covers the periphery of each island. The circuit module according to any one of items 1 to 8. (Item 10) At least one of the specific surface of the first circuit component and the specific surface of the second circuit component has a recess (50); The first reinforcing bonding material is disposed within the recess. The circuit module according to any one of items 1 to 9. (Item 11) At least one of the specific surface of the first circuit component and the specific surface of the second circuit component has an annular groove (52); The first reinforcing bonding material is disposed within the area (53) surrounded by the groove, The outer periphery of the first reinforcing bonding material is disposed within the groove. The circuit module according to any one of items 1 to 9. (Item 12) At least one of the specific surface of the first circuit component and the specific surface of the second circuit component has a first surface (61) and a second surface (62) having a surface roughness greater than that of the first surface, The first reinforcing bonding material is in contact with the first surface. The circuit module according to any one of items 1 to 9. (Item 13) 13. The circuit module according to any one of items 1 to 12, wherein the first reinforcing bonding material is made of the same material as the conductive bonding material. (Item 14) 14. The circuit module according to any one of items 1 to 13, wherein the proportion of the area of ​​the bonded range by the conductive bonding material in the opposing portion between the first circuit component and the second circuit component is 15% or less. (Item 15) A method for manufacturing a circuit module, comprising: a step of arranging a conductive bonding material and a first reinforcing bonding material between a first circuit component and a second circuit component, wherein the first circuit component, the second circuit component, the conductive bonding material, and the first reinforcing bonding material are arranged so that a plurality of electrode pads provided on a specific surface of the first circuit component face a plurality of electrode pads provided on a specific surface of the second circuit component, the conductive bonding material contacts each of the electrode pads of the first circuit component and each of the electrode pads of the second circuit component, and the first reinforcing bonding material contacts the specific surface of the first circuit component and the specific surface of the second circuit component at a position where it does not contact the conductive bonding material; a step of heating a laminate of the first circuit component and the second circuit component to bond the conductive bonding material to the electrode pads of the first circuit component and the electrode pads of the second circuit component, and to bond the first reinforcing bonding material to the specific surface of the first circuit component and the specific surface of the second circuit component; a step of applying a second reinforcing bonding material, which is made of a material different from the conductive bonding material and the first reinforcing bonding material, between the specific surface of the first circuit component and the specific surface of the second circuit component, wherein the second reinforcing bonding material is applied so that the second reinforcing bonding material covers the periphery of the conductive bonding material, is distributed in a range that contacts the first reinforcing bonding material, and is in contact with the specific surface of the first circuit component and the specific surface of the second circuit component; a step of heating the laminate to bond the second reinforcing bonding material to the specific surface of the first circuit component and the specific surface of the second circuit component; A manufacturing method comprising the steps of: (Item 16) the first reinforcing bonding material is made of the same material as the conductive bonding material, the step of disposing the conductive bonding material and the first reinforcing bonding material between the first circuit component and the second circuit component includes a step of simultaneously applying the conductive bonding material and the first reinforcing bonding material to one of the specific surface of the first circuit component and the specific surface of the second circuit component. Item 15. The manufacturing method according to item 15. (Item 17) the first circuit component has a through hole (70) that opens to the specific surface of the first circuit component, or the second circuit component has a through hole (70) that opens to the specific surface of the second circuit component, Item 17. The manufacturing method according to item 15 or 16, wherein the step of applying the second reinforcing bonding material includes a step of injecting the second reinforcing bonding material between the specific surface of the first circuit component and the specific surface of the second circuit component through the through hole.

[0071] Although the embodiments have been described in detail above, these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and variations of the specific examples exemplified above. The technical elements described in this specification or drawings exhibit technical utility alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. Furthermore, the technology exemplified in this specification or drawings simultaneously achieves multiple objectives, and achieving one of these objectives itself has technical utility. [Explanation of symbols]

[0072] 10: circuit module, 11: circuit component, 11a: surface, 12: electrode pad, 21: circuit component, 21a: surface, 22: electrode pad, 30: conductive bonding material, 41: reinforcing bonding material, 42: reinforcing bonding material

Claims

1. A circuit module, a first circuit component (11) having a plurality of electrode pads (12) on a specific surface (11a); a second circuit component (21) having a plurality of electrode pads (22) on a specific surface (21a); A conductive bonding material (30), a first reinforcing bonding material (41); a second reinforcing bonding material (42) made of a material different from the conductive bonding material and the first reinforcing bonding material; and the first circuit component and the second circuit component are arranged such that the plurality of electrode pads of the first circuit component face the plurality of electrode pads of the second circuit component; the conductive bonding material bonds each of the electrode pads of the first circuit component to a corresponding electrode pad of the second circuit component; the first reinforcing bonding material is not in contact with the conductive bonding material and bonds the specific surface of the first circuit component to the specific surface of the second circuit component; the second reinforcing bonding material covers the periphery of the conductive bonding material, is distributed in a range in contact with the first reinforcing bonding material, and bonds the specific surface of the first circuit component to the specific surface of the second circuit component; the plurality of electrode pads of the first circuit component are arranged to form a line (14a) linearly arranged along a first direction on the specific surface of the first circuit component, the plurality of electrode pads of the second circuit component are linearly arranged along the first direction at positions facing the rows, the first reinforcing bonding material is disposed at a position offset from the row in a second direction intersecting the first direction, The first reinforcing bonding material is continuously distributed in the first direction from a position outside one end (15a-1) of the row to a position outside the other end (15a-2) of the row. Circuit module.

2. A circuit module, a first circuit component (11) having a plurality of electrode pads (12) on a specific surface (11a); a second circuit component (21) having a plurality of electrode pads (22) on a specific surface (21a); A conductive bonding material (30), a first reinforcing bonding material (41); a second reinforcing bonding material (42) made of a material different from the conductive bonding material and the first reinforcing bonding material; and the first circuit component and the second circuit component are arranged such that the plurality of electrode pads of the first circuit component face the plurality of electrode pads of the second circuit component; the conductive bonding material bonds each of the electrode pads of the first circuit component to a corresponding electrode pad of the second circuit component; the first reinforcing bonding material is not in contact with the conductive bonding material and bonds the specific surface of the first circuit component to the specific surface of the second circuit component; the second reinforcing bonding material covers the periphery of the conductive bonding material, is distributed in a range in contact with the first reinforcing bonding material, and bonds the specific surface of the first circuit component to the specific surface of the second circuit component; The linear expansion coefficient of the second reinforcing bonding material is higher than the linear expansion coefficient of the conductive bonding material. Circuit module.

3. A circuit module, a first circuit component (11) having a plurality of electrode pads (12) on a specific surface (11a); a second circuit component (21) having a plurality of electrode pads (22) on a specific surface (21a); A conductive bonding material (30), a first reinforcing bonding material (41); a second reinforcing bonding material (42) made of a material different from the conductive bonding material and the first reinforcing bonding material; and the first circuit component and the second circuit component are arranged such that the plurality of electrode pads of the first circuit component face the plurality of electrode pads of the second circuit component; the conductive bonding material bonds each of the electrode pads of the first circuit component to a corresponding electrode pad of the second circuit component; the first reinforcing bonding material is not in contact with the conductive bonding material and bonds the specific surface of the first circuit component to the specific surface of the second circuit component; the second reinforcing bonding material covers the periphery of the conductive bonding material, is distributed in a range in contact with the first reinforcing bonding material, and bonds the specific surface of the first circuit component to the specific surface of the second circuit component; The linear expansion coefficient of the first reinforcing bonding material is lower than the linear expansion coefficient of the conductive bonding material. Circuit module.

4. A circuit module, a first circuit component (11) having a plurality of electrode pads (12) on a specific surface (11a); a second circuit component (21) having a plurality of electrode pads (22) on a specific surface (21a); A conductive bonding material (30), a first reinforcing bonding material (41); a second reinforcing bonding material (42) made of a material different from the conductive bonding material and the first reinforcing bonding material; and the first circuit component and the second circuit component are arranged such that the plurality of electrode pads of the first circuit component face the plurality of electrode pads of the second circuit component; the conductive bonding material bonds each of the electrode pads of the first circuit component to a corresponding electrode pad of the second circuit component; the first reinforcing bonding material is not in contact with the conductive bonding material and bonds the specific surface of the first circuit component to the specific surface of the second circuit component; the second reinforcing bonding material covers the periphery of the conductive bonding material, is distributed in a range in contact with the first reinforcing bonding material, and bonds the specific surface of the first circuit component to the specific surface of the second circuit component; The first reinforcing bonding materials are arranged to form a plurality of islands separated from each other, The second reinforcing bonding material covers the periphery of each island. Circuit module.

5. A circuit module, a first circuit component (11) having a plurality of electrode pads (12) on a specific surface (11a); a second circuit component (21) having a plurality of electrode pads (22) on a specific surface (21a); A conductive bonding material (30), a first reinforcing bonding material (41); a second reinforcing bonding material (42) made of a material different from the conductive bonding material and the first reinforcing bonding material; and the first circuit component and the second circuit component are arranged such that the plurality of electrode pads of the first circuit component face the plurality of electrode pads of the second circuit component; the conductive bonding material bonds each of the electrode pads of the first circuit component to a corresponding electrode pad of the second circuit component; the first reinforcing bonding material is not in contact with the conductive bonding material and bonds the specific surface of the first circuit component to the specific surface of the second circuit component; the second reinforcing bonding material covers the periphery of the conductive bonding material, is distributed in a range in contact with the first reinforcing bonding material, and bonds the specific surface of the first circuit component to the specific surface of the second circuit component; The first reinforcing bonding material is made of the same material as the conductive bonding material. Circuit module.

6. A method for manufacturing a circuit module, comprising: a step of arranging a conductive bonding material and a first reinforcing bonding material between a first circuit component and a second circuit component, wherein the first circuit component, the second circuit component, the conductive bonding material, and the first reinforcing bonding material are arranged so that a plurality of electrode pads provided on a specific surface of the first circuit component face a plurality of electrode pads provided on a specific surface of the second circuit component, the conductive bonding material contacts each of the electrode pads of the first circuit component and each of the electrode pads of the second circuit component, and the first reinforcing bonding material contacts the specific surface of the first circuit component and the specific surface of the second circuit component at a position where it does not contact the conductive bonding material; a step of heating a laminate of the first circuit component and the second circuit component to bond the conductive bonding material to the electrode pads of the first circuit component and the electrode pads of the second circuit component, and to bond the first reinforcing bonding material to the specific surface of the first circuit component and the specific surface of the second circuit component; a step of applying a second reinforcing bonding material, which is made of a material different from the conductive bonding material and the first reinforcing bonding material, between the specific surface of the first circuit component and the specific surface of the second circuit component, wherein the second reinforcing bonding material is applied so that the second reinforcing bonding material covers the periphery of the conductive bonding material, is distributed in a range that contacts the first reinforcing bonding material, and is in contact with the specific surface of the first circuit component and the specific surface of the second circuit component; a step of heating the laminate to bond the second reinforcing bonding material to the specific surface of the first circuit component and the specific surface of the second circuit component; and the first reinforcing bonding material is made of the same material as the conductive bonding material, the step of disposing the conductive bonding material and the first reinforcing bonding material between the first circuit component and the second circuit component includes a step of simultaneously applying the conductive bonding material and the first reinforcing bonding material to one of the specific surface of the first circuit component and the specific surface of the second circuit component. Manufacturing method.

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