Processing device and manufacturing method of processed product

Abstract

To simplify a processing apparatus and improve productivity by imaging and inspecting the processed object after processing while the processing table is adsorbing the object after the processing.SOLUTION: A processing apparatus has a processing table 2A, 2B provided with a plurality of suction holes 2h on one side that can suction a sealed substrate W, a processing mechanism 4 that processes a sealed substrate W suctioned on the processing tables 2A, 2B, and a first camera 131 that captures images of the sealed substrate W processed by the processing mechanism 4, the processing tables 2A and 2B have a plurality of through-openings 2T that penetrate from one side 2X to the other side 2Y, the processing mechanism 4 processes the sealed substrate W at the through-openings 2T, and the first camera 131 captures images of the processed sealed substrate W absorbed on the processing tables 2A and 2B.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a processing device and a method for manufacturing a processed product. [Background technology]

[0002] Conventionally, as shown in Patent Document 1, in a substrate cutting device, a molded substrate (package) cut from a cutting table is transferred to an inverted locking plate by a first package fastening mechanism, and the package adsorbed to the inverted locking plate is photographed with a camera for inspection. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2009-130342 Summary of the Invention [Problem to be solved by the invention]

[0004] However, the above-mentioned cutting device requires an inverted inspection plate for inspecting the packages and a transport mechanism (first package engaging mechanism) for transferring the packages from the cutting table to the inverted locking plate, which makes the cutting device configuration complicated. In addition, the transport time required from the cutting table to the inverted locking plate limits productivity improvements.

[0005] The present invention has been made to solve the above problems, and its main objective is to simplify the processing equipment and improve productivity by imaging and inspecting the processed workpiece while it is adsorbed onto the processing table. [Means for solving the problem]

[0006] In other words, the processing apparatus of the present invention comprises a processing table having a plurality of suction holes on one side that can adsorb the workpiece, a processing mechanism that processes the workpiece adsorbed to the processing table, and a first camera that images the workpiece processed by the processing mechanism, wherein the processing table has a plurality of through openings that extend from one side to the other side, the processing mechanism processes the workpiece in the through openings, and the first camera images the workpiece adsorbed to the processing table after processing. [Effects of the Invention]

[0007] According to the present invention configured in this manner, the processed workpiece can be imaged and inspected while it is adsorbed onto the processing table, thereby simplifying the processing device and improving productivity. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 2 is a plan view showing an example of an object to be processed (sealed substrate). [Figure 2] 1 is a diagram showing a schematic configuration of a cutting device (tray storage) according to an embodiment of the present invention. [Figure 3] FIG. 2 is a perspective view showing a cutting table and a table inverting mechanism of the embodiment. [Figure 4] 4 is a cross-sectional view taken along a suction hole in the cutting table and the table inverting mechanism of the embodiment. FIG. [Figure 5] 10 is a plan view showing the positional relationship between the opening through-portion, the suction hole, and the suction flow path of the embodiment. FIG. [Figure 6] FIG. 2 is an exploded perspective view showing an enlarged portion of the cutting table according to the embodiment. [Figure 7] 3A is a partially enlarged cross-sectional view of the cutting table of the embodiment, perpendicular to the scanning direction of the laser beam, and FIG. 3B is a partially enlarged cross-sectional view along the scanning direction of the laser beam. [Figure 8] 5A to 5C are schematic diagrams showing the procedure of laser cutting and processing chip removal in the same embodiment. [Figure 9] 3 is a schematic diagram showing the imaging direction of the first camera of the embodiment. FIG. [Figure 10] 10A and 10B are schematic diagrams showing the procedure of imaging by the first camera and re-removal of processing debris in the embodiment. [Figure 11] 5A to 5C are schematic diagrams showing a procedure for transferring a product from the cutting table to the second holding mechanism in the embodiment. [Figure 12] 10 is a diagram schematically illustrating the configuration of a cutting device (tube housing) according to a modified embodiment. FIG. [Figure 13] 1A and 1B are a perspective view and a cross-sectional view, respectively, schematically illustrating the configuration of a cylindrical container. [Figure 14] 10 is a diagram schematically illustrating the configuration of a cutting device (ring storage) according to a modified embodiment. FIG. [Figure 15] 1A is a plan view, FIG. 1B is a cross-sectional view, and FIG. 1C is a partially enlarged cross-sectional view, each showing a schematic configuration of an attachment member. DETAILED DESCRIPTION OF THE INVENTION

[0009] The present invention will now be described in more detail with reference to examples, although the present invention is not limited to the following description.

[0010] As described above, the processing apparatus of the present invention comprises a processing table having a plurality of suction holes on one side that can adsorb the workpiece, a processing mechanism that processes the workpiece adsorbed to the processing table, and a first camera that images the workpiece processed by the processing mechanism, wherein the processing table has a plurality of through openings that extend from one side to the other side, the processing mechanism processes the workpiece in the through openings, and the first camera images the workpiece adsorbed to the processing table after processing. With this processing device, the first camera captures an image of the processed workpiece adsorbed to the processing table, eliminating the need to transfer it to a separate inspection table, thereby simplifying the processing device with the function of inspecting the processed workpiece and improving productivity. Also, by performing inspection while moving the first camera relative to the processing table, the number of stops and acceleration / deceleration of the processing table can be reduced, shortening the inspection time. Furthermore, by simplifying the processing device, the footprint can be reduced.

[0011] It is desirable that the apparatus further include a movement mechanism that moves the first camera and the processing table relatively so that the first camera can capture an image of the object sucked onto the processing table after processing. With this configuration, it is possible to inspect the processed object at a position that does not interfere with the processing operation of the processing mechanism. In other words, the first camera does not interfere with the processing operation of the processing mechanism.

[0012] In order to make it easier to image the part (kerf) that is removed by processing by the processing mechanism and improve the accuracy of the inspection, it is desirable that the moving mechanism moves the first camera and the processing table relatively along the processing direction by the processing mechanism.

[0013] It is desirable that the apparatus further include a backside illumination unit that is provided on the opposite side of the processing table from the first camera and generates transmitted light that passes through the through opening. With this configuration, by capturing an image of the transmitted light passing through the through opening, it is possible to easily check for the presence or absence of processing debris remaining between the workpieces after processing, and also to accurately measure the minimum width of the kerf between the workpieces after processing.

[0014] In order to accurately inspect the appearance shape of the surface side of the workpiece after processing, for example, the kerf shape such as the kerf width, it is desirable that the processing device of the present invention further includes a surface side illumination unit that is provided on the same side of the processing table as the first camera and illuminates the workpiece after processing. In this configuration, in order to efficiently inspect the kerf shape, such as the kerf width between the workpieces after processing, from both the front side and the back side, it is desirable to alternately turn on the front side illumination unit and the back side illumination unit and capture an image of the workpieces after processing with the first camera.

[0015] The processing apparatus of the present invention preferably further comprises a processing debris removal mechanism that removes processing debris remaining on the workpiece after processing. With this configuration, if machining debris is detected by the imaging inspection using the first camera, the remaining machining debris can be removed by the machining debris removal mechanism. Also, after the remaining machining debris is removed by the machining debris removal mechanism, an imaging inspection using the first camera may be performed as confirmation.

[0016] It is desirable that the processing apparatus of the present invention further includes a transport mechanism that transports the processed object by adsorbing the surface opposite to the surface to be adsorbed by the processing table, and a second camera that images the adsorbed surface of the processed object transported by the transport mechanism. With this configuration, the adsorbed surface (rear surface) of the processed workpiece, which cannot be sufficiently inspected with the first camera, can be inspected while the processed workpiece is being transported from the processing table. Furthermore, since the inspection is performed while the workpiece is being transported, the simplification and productivity of the processing device are not hindered.

[0017] As a specific embodiment of the processing mechanism, it is desirable that the object to be processed is cut by irradiating it with a laser beam.

[0018] It is desirable that the processing table be reversible, and that the processing table holding the workpiece by suction be turned over, and that laser light be irradiated onto both sides of the workpiece to cut it. With this configuration, the processing table holding the workpiece can be turned over and the workpiece can be cut from both sides, thereby reducing processing time and improving productivity. In addition, the processing table is turned upside down (upside down) while the workpiece is held in place. , Canada If the amount of position shift when the machining table is turned over is measured once in advance, the position after turning over can be corrected by calculation, eliminating the need to readjust the alignment (position adjustment) each time the table is turned over. Therefore, the alignment (position adjustment) of the laser light irradiation unit with respect to the workpiece only needs to be performed once after the workpiece is adsorbed, which also shortens the machining time and improves productivity. Furthermore, when a laser beam is irradiated onto a workpiece to cut it, the laser beam passes through the through-opening, preventing it from hitting the processing table. As a result, damage to the processing table due to laser beam irradiation and the resulting adhesion of contaminants (impurities, foreign matter) to the workpiece can be suppressed, and the restrictions on laser processing conditions to prevent damage to the processing table can be reduced. By reducing the restrictions on laser processing conditions, higher pulse energy and average power can be used, shortening processing time and improving productivity. Furthermore, since the laser light passes through the through opening, the laser light is prevented from being reflected by the processing table and irradiated onto the workpiece, and damage to the workpiece caused by laser light reflected by the processing table is also suppressed.

[0019] Another aspect of the present invention is a method for manufacturing a processed product using the above processing device.

[0020] A specific embodiment of the method for manufacturing a processed product preferably includes a cutting step in which the processing table holding the workpiece is turned over and laser light is irradiated onto both sides of the workpiece to cut the workpiece, and an inspection step in which the workpiece after processing and adsorbed onto the processing table is photographed with the first camera and inspected. In this way, the processing table is turned over and the workpiece is cut by irradiating both sides with laser light. This eliminates the need to transfer the workpiece when it is turned over, shortening processing time and improving productivity. Processing from both sides also reduces the processing depth from one side, thereby reducing the required kerf width. As a result, the number of laser scanning rows can be reduced, improving productivity. Furthermore, the pitch between packages on the workpiece can be narrowed, allowing for a layout that adds more packages, increasing the number of packages per frame and improving productivity. Furthermore, processing from both sides reduces the tapered shape created by laser processing, improving quality.

[0021] <One embodiment of the present invention> An embodiment of a processing apparatus according to the present invention will be described below with reference to the drawings. Note that, for ease of understanding, all of the drawings shown below are drawn in a schematic manner with appropriate omissions or exaggerations. Identical components are designated by the same reference numerals, and their description will be omitted where appropriate.

[0022] <Overall configuration of the processing equipment> The processing apparatus 100 of this embodiment is a cutting apparatus that cuts an encapsulated substrate W, which is an object to be cut, to separate it into a plurality of products P, which are cut pieces.

[0023] Here, the encapsulated substrate W is a substrate formed by resin molding so as to encapsulate at least electronic elements such as semiconductor chips, resistor elements, and capacitor elements in a support on which the electronic elements are fixed. The support may be a substrate such as a lead frame or a printed wiring board, and other substrates such as semiconductor substrates (including semiconductor wafers such as silicon wafers), metal substrates, ceramic substrates, glass substrates, and resin substrates. Furthermore, the substrate that constitutes the encapsulated substrate W may or may not be provided with wiring.

[0024] In addition, one surface of the sealed substrate W and the product P in this embodiment is a mounting surface on which mounting will be performed later. In the description of this embodiment, the surface on which mounting will be performed later is referred to as the "mounting surface," and the opposite surface is referred to as the "mark surface."

[0025] As shown in FIG. 1, the sealed substrate W has a plurality of divided elements W1 and W2 connected by connecting portions W3, and the cutting lines CL1 and CL2 within adjacent divided elements W1 and W2 are set on different lines. Each divided element W1 and W2 is a row of multiple packages in which electronic elements are encapsulated by resin molding. Leads are provided corresponding to each package (electronic element). The divided elements W1 and W2 are connected at both ends by connecting portions W3. Specifically, the leads of the odd-numbered divided elements W1 and the even-numbered divided elements W2 are staggered. As a result, the cutting lines CL1 of the odd-numbered divided elements W1 are aligned on the same line, and the cutting lines CL2 of the even-numbered divided elements W2 are aligned on the same line. The cutting lines CL1 of the odd-numbered divided elements W1 and the cutting lines CL2 of the even-numbered divided elements W2 are aligned on different lines. It should be noted that the cutting lines CL1 and CL2 shown in FIG. 1 are imaginary lines along which cutting is planned, and are not shown on the actual sealed substrate W.

[0026] 2, the cutting device 100 includes two cutting tables 2A and 2B that hold the sealed substrate W, a first holding mechanism 3 that holds the sealed substrate W in order to transport the sealed substrate W to the cutting tables 2A and 2B, a cutting mechanism 4 that cuts the sealed substrate W held on the cutting tables 2A and 2B, a transfer table 5 to which a plurality of products P are transferred, a second holding mechanism 6 that holds the plurality of products P in order to transport the plurality of products P from the cutting tables 2A and 2B to the transfer table 5, and a transport moving mechanism 7 that moves the first holding mechanism 3 and the second holding mechanism 6. The first holding mechanism 3 and the transport moving mechanism 7 form a transport mechanism (loader) that transports the sealed substrate W, and the second holding mechanism 6 and the transport moving mechanism 7 form a transport mechanism (unloader) that transports the plurality of products P.

[0027] In the following description, directions perpendicular to each other in a plane (horizontal plane) along the upper surfaces of the cutting tables 2A and 2B are referred to as the X and Y directions, respectively, and the vertical direction perpendicular to the X and Y directions is referred to as the Z direction. Specifically, the left-right direction in Fig. 2 is referred to as the X direction (first direction), and the up-down direction is referred to as the Y direction (second direction).

[0028] <Cutting tables 2A and 2B> The two cutting tables 2A, 2B adsorb and hold the sealed substrate W, and are provided so as to be movable at least in the Y direction. The cutting table 2A can be moved in the Y direction by a cutting movement mechanism 8A, and can be rotated in the θ direction by a rotation mechanism 9A. The cutting table 2B can be moved in the Y direction by a cutting movement mechanism 8B, and can be rotated in the θ direction by a rotation mechanism 9B. The specific configurations of the cutting tables 2A, 2B will be described later.

[0029] <First holding mechanism 3> 2, the first holding mechanism 3 holds the sealed substrate W in order to transport the sealed substrate W from the substrate supply mechanism 10 to the cutting tables 2A and 2B. The first holding mechanism 3 has a plurality of suction portions (not shown) for suction-holding the sealed substrate W. The first holding mechanism 3 is moved to a desired position by a transport moving mechanism 7 (described later) or the like, thereby transporting the sealed substrate W from the substrate supply mechanism 10 to the cutting tables 2A and 2B.

[0030] As shown in Figure 2, the substrate supply mechanism 10 has a substrate accommodating section 10a in which multiple sealed substrates W are accommodated from the outside, and a substrate supplying section 10b that moves the sealed substrates W accommodated in the substrate accommodating section 10a to a holding position RP where they are adsorbed and held by the first holding mechanism 3.

[0031] <Cutting mechanism 4> As shown in FIG. 2, the cutting mechanism 4 irradiates laser light onto the sealed substrate W adsorbed on the cutting tables 2A and 2B to cut the sealed substrate W, and has two laser light irradiation units 41A and 41B.

[0032] The two laser light irradiation units 41A, 41B are provided along the Y direction and are configured so that each can independently irradiate laser light. Each laser light irradiation unit 41A, 41B has a laser oscillator, a laser light scanning unit such as a galvanometer scanner that linearly scans the laser from the laser oscillator, and a condensing lens that condenses the laser light. In each laser light irradiation unit 41A, 41B, the laser light is condensed by the condensing lens onto the sealed substrate W adsorbed on the cutting tables 2A, 2B, and linearly scanned across the sealed substrate W adsorbed on the cutting tables 2A, 2B by the laser light scanning unit.

[0033] In this embodiment, the two laser light emitting units 41A, 41B are provided on a single processing head 40, and the processing head 40 is movable between the two cutting tables 2A, 2B in the X direction by a processing head moving mechanism 11. The processing head moving mechanism 11 can also move the processing head 40 in the Y and Z directions. Alternatively, the two laser light emitting units 41A, 41B may be configured to be movable at least in the X or Y direction relative to the processing head 40. The two laser light emitting units 41A, 41B may be configured to be movable independently between the two cutting tables 2A, 2B.

[0034] The cutting at the cutting table 2A involves moving the cutting table 2A and the two laser light irradiators 41A and 41B relative to each other and scanning the laser light, thereby cutting and dividing the sealed substrate W into individual pieces. The cutting at the cutting table 2B involves moving the cutting table 2B and the two laser light irradiators 41A and 41B relative to each other and scanning the laser light, thereby cutting and dividing the sealed substrate W into individual pieces. The cutting process at the cutting table 2A and the cutting process at the cutting table 2B can be performed alternately.

[0035] <Transfer Table 5> 2, the transfer table 5 of this embodiment is a table onto which a plurality of products P inspected by the first inspection unit 13 and the second inspection unit 14 are transferred. The specific configurations of the first inspection unit 13 and the second inspection unit 14 will be described later.

[0036] This transfer table 5 is what is called an index table, on which multiple products P are temporarily placed before being sorted and stored in various trays T. Furthermore, the transfer table 5 is provided so as to be movable back and forth along the Y direction. The transfer table 5 is moved by the transfer movement mechanism 12 between a transfer position X1 where multiple products P are placed by the second holding mechanism 6, and a take-out position X2 where multiple products P are transported by the sorting mechanism 15a.

[0037] The multiple products P placed on the transfer table 5 are sorted into various trays T by the sorting mechanism 15a according to the inspection results (good products, defective products, etc.) by the first inspection unit 13 and the second inspection unit 14. The various trays T are transported by the tray moving mechanism 15b from the tray storage unit 15c to the desired removal position X2, and the products P to be sorted by the sorting mechanism 15a are placed on the trays. After being sorted, the various trays T are stored in the tray storage unit 15c by the tray moving mechanism 15b. In this embodiment, the tray storage unit 15c is configured to store three types of trays T: trays T before storing products P, trays T storing good products P, and trays T storing defective products P that require rework.

[0038] <Second holding mechanism 6> 2, the second holding mechanism 6 holds the multiple products P in order to transport the multiple products P from the cutting tables 2A and 2B to the transfer table 5. The second holding mechanism 6 adsorbs the surface (mounting surface) opposite to the surface to be adsorbed by the cutting tables 2A and 2B, and has multiple adsorption units (not shown) for adsorbing and holding the multiple products P. The second holding mechanism 6 is moved to a desired position by a transfer mechanism 7 (described later) or the like, thereby transporting the multiple products P from the cutting tables 2A and 2B to the transfer table 5.

[0039] <Transportation moving mechanism 7> As shown in FIG. 2, the transport moving mechanism 7 moves the first holding mechanism 3 at least between the substrate supply mechanism 10 and the cutting tables 2A, 2B, and moves the second holding mechanism 6 at least between the cutting tables 2A, 2B and the transfer table 5.

[0040] 2, the transport movement mechanism 7 extends in a straight line along the arrangement direction (X direction) of the two cutting tables 2A, 2B and the transfer table 5, and has a common transfer shaft 71 for moving the first holding mechanism 3 and the second holding mechanism 6. This transfer shaft 71 is provided within a range that allows the first holding mechanism 3 to move above the substrate supply unit 10b of the substrate supply mechanism 10, and allows the second holding mechanism 6 to move above the transfer table 5 (see FIG. 2). Note that the transfer shaft 71 may be provided individually for the first holding mechanism 3 and the second holding mechanism 6.

[0041] Furthermore, the transfer movement mechanism 7 is configured to be able to move the first holding mechanism 3 and the second holding mechanism 6 in the X direction and the Z direction relative to the transfer shaft 71. The movement mechanism in each direction may be, for example, one that uses a rack and pinion mechanism, one that uses a ball screw mechanism, one that uses an air cylinder, or one that uses a linear motor.

[0042] <Specific Configuration of Cutting Tables 2A and 2B> Next, the specific configuration of the cutting tables 2A and 2B will be described with reference to FIGS.

[0043] <Adsorption function of cutting tables 2A and 2B> 3 and 4, each of the cutting tables 2A and 2B has a plurality of suction holes 2h on one surface 2x that can suck the sealed substrate W. The plurality of suction holes 2h are connected to a suction flow path 2R formed inside the cutting tables 2A and 2B. The suction flow path 2R is connected to a vacuum pump (not shown).

[0044] Specifically, as shown in Fig. 5, the cutting tables 2A and 2B are generally rectangular in plan view, and as shown in Figs. 6 and 7, each includes a base plate 201 having a groove 201M on its upper surface that forms the suction channel 2R, a cover plate 202 provided on the upper surface of the base plate 201 to cover the groove 201M and having suction through-holes 202h that communicate with the groove 201M, and a resin suction rubber 203 bonded to the upper surface of the cover plate 202 and having suction holes 2h that communicate with the suction through-holes 202h. The suction rubber 203 ensures that the sealed substrate W is securely fixed without damage or leakage when it is suctioned. The upper surface of the suction rubber 203 constitutes one surface 2x of the cutting tables 2A and 2B, and the lower surface of the base plate 201 constitutes the other surface 2y of the cutting tables 2A and 2B.

[0045] <Cutting tables 2A and 2B reversal function> 3 and 4, each of the cutting tables 2A, 2B is configured to be reversible by a table reversal mechanism 16. As a result, the cutting tables 2A, 2B are configured to be switchable between a state in which one surface 2x faces upward (laser light irradiation units 41A, 41B) (see FIG. 8(a)) and a state in which the other surface 2y faces upward (laser light irradiation units 41A, 41B) (see FIG. 8(b)).

[0046] 3 and 4, the table inversion mechanism 16 rotatably supports both opposing side portions of the cutting tables 2A, 2B, and in this case, rotatably supports both longitudinal end portions of the cutting tables 2A, 2B. This makes it possible to reduce the area through which the cutting tables 2A, 2B pass when the cutting tables 2A, 2B are inverted. In addition, the cutting tables 2A, 2B are configured to be detachable from the table inversion mechanism 16, and can be changed to dedicated cutting tables 2A, 2B depending on the shape of the sealed substrate W.

[0047] Specifically, the table inversion mechanism 16 includes two rotation shafts 161a and 161b provided at both ends of the cutting tables 2A and 2B in the longitudinal direction, a base member 162 that rotatably supports the rotation shafts 161a and 161b via bearings such as rolling bearings, and a base member 162 that supports one of the rotation shafts 161a The base member 162 has a rotation drive unit 163 such as a motor or a rotary cylinder that turns the cutting tables 2A and 2B upside down. 161a, 161b and a bottom wall 162c on which the two support walls 162a, 162b are provided. In this embodiment, one of the rotation shaft portions 161a is rotatably supported by the support wall 162a via a rotation drive portion 163.

[0048] Furthermore, the two rotating shafts 161a, 161b are provided at the center of each of both ends of the cutting tables 2A, 2B in the longitudinal direction when viewed from above. The two rotating shafts 161a, 161b have their rotation centers aligned on the same straight line and extend horizontally. These two rotating shafts 161a, 161b extend in the longitudinal direction of the cutting tables 2A, 2B. In addition, as shown in FIG. 4, at least one of the two rotating shafts 161a, 161b has an internal flow path 161R formed therein that communicates with a suction flow path 2R formed inside the cutting tables 2A, 2B, and this internal flow path 161R is connected to a vacuum pump (not shown).

[0049] The rotation center of the rotation shaft portions 161a and 161b may be configured to coincide with the center of the cutting tables 2A and 2B or the center of the sealed substrate W sucked onto the cutting tables 2A and 2B. With this configuration, it is possible to reduce the change in the height position of the sealed substrate W before and after the front-to-back inversion, and it is possible to eliminate or simplify adjustment of the relative position with the laser light irradiation portions 41A and 41B.

[0050] <Through-opening 2T of cutting tables 2A and 2B> 3 to 8, the cutting tables 2A and 2B have a plurality of through openings 2T that allow laser light to pass through, penetrating from one surface 2x on which the suction holes 2h are provided to the other surface 2y, which is the surface behind the one surface 2x. The sealed substrate W is cut through the through openings 2T by laser light from the laser light irradiation units 41A and 41B of the cutting mechanism 4.

[0051] As shown in FIG. 5, these multiple through openings 2T are formed at positions that do not overlap with the multiple suction holes 2h and the suction flow paths 2R (specifically, the grooves 201M of the base plate 201) that communicate with the multiple suction holes 2h when viewed in a plan view of the cutting tables 2A and 2B, that is, when viewed from one surface 2x of the cutting tables 2A and 2B.

[0052] The plurality of through openings 2T are formed at positions corresponding to the cutting lines CL1, CL2 (see FIG. 1) of the sealed substrate W, and are formed to include the cutting lines CL1, CL2 in a plan view of the cutting tables 2A, 2B. Specifically, each through opening 2T is longer than the length of each cutting line CL1, CL2 in the cutting direction (processing direction) and has a width greater than the width of the kerf to be removed between the packages. The through opening 2T has an opening size that does not allow it to be hit by the laser light irradiated from the laser light irradiating units 41A, 41B.

[0053] In this embodiment, as shown in FIG. 2, the sealing substrate W has the cutting lines CL1 of the odd-numbered dividing elements W1 and the cutting lines CL2 of the even-numbered dividing elements W2 positioned on different straight lines, and therefore the multiple through openings 2T formed on the cutting tables 2A and 2B are similarly such that the through openings 2T corresponding to the cutting lines CL1 of the odd-numbered dividing elements W1 and the through openings 2T corresponding to the cutting lines CL2 of the even-numbered dividing elements W2 are positioned on different straight lines (see FIG. 5).

[0054] 7 and 8, the through opening 2T has a shape that gradually widens from one surface 2x on which the suction holes 2h are provided toward the other surface 2y. Specifically, the through opening 2T has a shape that widens from one surface 2x toward the other surface 2y in a cross section perpendicular to the scanning direction of the laser light. Note that the through opening 2T may have a uniform cross-sectional shape as long as it is not irradiated by the laser light, or may have a shape that widens gradually from one surface 2x toward the other surface 2y.

[0055] 8, when the cutting tables 2A, 2B are turned over, the height position of the sealed substrate W changes, and therefore a position change mechanism 17 is further provided to change the relative positions of the cutting tables 2A, 2B and the laser light irradiation units 41A, 41B before and after the cutting tables 2A, 2B are turned over. The position change mechanism 17 changes the relative positions of the cutting tables 2A, 2B and the laser light irradiation units 41A, 41B to adjust the focal position of the laser light on the sealed substrate W.

[0056] This position change mechanism 17 can be provided in the processing head moving mechanism 11 that moves the processing head 40 (see FIG. 2), and can change the height position of the processing head 40 (laser light irradiation units 41A, 41B) before and after turning the cutting tables 2A, 2B over. The position change mechanism 17 can also be configured by the processing head moving mechanism 11. Note that the height positions of the cutting tables 2A, 2B may be changed so that the height positions are the same before and after turning the tables over.

[0057] <Processing waste storage section 18> 3, 4, and 8(c), the cutting apparatus 100 of this embodiment further includes a processing debris storage unit 18 that stores processing debris S, such as scraps, generated by cutting the sealed substrate W. This processing debris storage unit 18 is provided below the cutting tables 2A and 2B. Specifically, the processing debris storage unit 18 is provided between two support walls 162a and 162b on a base member 162 that supports the cutting tables 2A and 2B. The processing debris storage unit 18 is configured to be detachable from the base member 162, and can be removed from the base member 162 to discard the processing debris S outside the cutting apparatus 100.

[0058] It should be noted that when the distance between the processing head 40 and the processing debris storage unit 18 is short, the energy density of the laser light that has passed through the through-opening 2T is high, and therefore there is a possibility that the laser light will be scattered at the bottom surface of the processing debris storage unit 18. To prevent this, the bottom surface of the processing debris storage unit 18 may be subjected to a surface treatment with good absorbency, or an absorbent material may be provided at the bottom surface of the processing debris storage unit 18.

[0059] <Machining waste removal mechanism 19> Furthermore, as shown in FIG. 8(c), the cutting device 100 of this embodiment further includes a processing debris removal mechanism 19 that removes processing debris S such as scraps remaining on the sealed substrate W cut by the laser light.

[0060] The processing debris removal mechanism 19 has a gas injection unit 191 that blows gas such as compressed air toward the sealed substrate W, and removes processing debris S with the gas injected by the gas injection unit 191. The gas injection unit 191 is provided above the cutting tables 2A and 2B, and is configured to blow gas from above onto the inverted cutting tables 2A and 2B to remove processing debris S. With this configuration, the gas injected from the gas injection unit 191 passes through the through opening 2T and is blown onto the remaining processing debris S. Here, the gas is narrowed by the through opening 2T, so the gas flow rate can be increased and the gas can be concentrated on the processing debris S. The removed processing debris S is stored in a processing debris storage unit 18 provided below the cutting tables 2A and 2B. Note that a configuration in which gas is blown from above onto the cutting tables 2A and 2B that are not inverted may also be used to remove processing debris S.

[0061] Furthermore, the chip removal mechanism 19 may be configured to blow gas at the remaining chips S as described above, or may be configured to physically contact and push down the remaining chips S. In this case, the chip removal mechanism 19 has a push-down member such as a pin that pushes down the chips S, and the push-down member is raised and lowered relative to the cutting tables 2A, 2B to push down the chips S toward the chip storage section 18.

[0062] <First Inspection Department 13> In this embodiment, as shown in FIG. 2, a first inspection unit 13 is provided that inspects the plurality of products P cut by the cutting mechanism 4 by taking an image from the front side.

[0063] The first inspection unit 13 captures images of the surfaces of the multiple products P from above the cutting tables 2A and 2B. When the products P are inspected by the first inspection unit 13, the cutting tables 2A and 2B are not turned upside down.

[0064] Specifically, the first inspection unit 13 has a first camera 131 having an optical system for capturing images of the surfaces of the multiple products P sucked onto the cutting tables 2A and 2B. The first camera 131 is provided between the transfer shaft 71 and the cutting mechanism 4 so as to be movable in the X direction by a camera movement mechanism 132. Here, it is desirable that the first camera 131 has a fast shutter speed and a short exposure time.

[0065] The camera moving mechanism 132 of this embodiment enables the first camera 131 to move between the two cutting tables 2A and 2B. When capturing images of multiple products P adsorbed to one cutting table 2A, the camera moving mechanism 132 moves the first camera 131 above the cutting table 2A. Here, the cutting table 2A has been moved in the Y direction by the cutting moving mechanism 8A to a predetermined inspection position. When capturing images of multiple products P adsorbed to the other cutting table 2B, the camera moving mechanism 132 moves the first camera 131 above the cutting table 2B. Here, the cutting table 2B has been moved in the Y direction by the cutting moving mechanism 8B to a predetermined inspection position.

[0066] Then, the camera moving mechanism 132 moves the first camera 131 in the X direction above the cutting tables 2A and 2B, and an image of the surface (mounting surface) of the product P sucked onto the cutting tables 2A and 2B is captured.

[0067] 9, the camera moving mechanism 132 moves the first camera 131 relative to the cutting tables 2A, 2B along the cutting direction (extending direction of the kerf) cut by the cutting mechanism 4. At this time, the cutting tables 2A, 2B are rotated by the rotation mechanisms 9A, 9B so that the cutting direction (extending direction of the kerf) cut by the cutting mechanism 4 is parallel to the X direction.

[0068] In addition, in this embodiment, as shown in FIG. 10, a front side lighting unit 133 is provided on the same side as the first camera 131 with respect to the cutting tables 2A and 2B, and illuminates the front side of the plurality of products P, and a back side lighting unit 134 is provided on the opposite side of the cutting tables 2A and 2B from the first camera 131, and generates transmitted light that passes through the through opening 2T and illuminates the back side of the plurality of products P through the through opening 2T.

[0069] The front-side illumination unit 133 and the back-side illumination unit 134 are each an illumination device that emits a strobe light, and in this case, are configured using, for example, a xenon lamp. The front-side illumination unit 133 may be provided integrally with the first camera 131, or may be provided separately. The back-side illumination unit 134 is provided movably below the cutting tables 2A and 2B that are at predetermined inspection positions.

[0070] 9, the front-side illumination unit 133 and the back-side illumination unit 134 are alternately turned on while the first camera 131 is moved relative to the cutting tables 2A and 2B, and the first camera 131 captures images of the multiple products P sucked onto the cutting tables 2A and 2B each time the front-side illumination unit 133 and the back-side illumination unit 134 are turned on. As a result, the first camera 131 successively captures images of the multiple products P illuminated from the front side and images of the multiple products P illuminated from the back side.

[0071] Each image obtained by the first camera 131 is processed by an image processing unit configured by the control unit CTL, and the appearance of the kerf width between the products P and other aspects are measured and inspected to determine whether the product P is good or defective. Here, the image obtained by illuminating the product P from the front side is used, for example, to inspect the appearance of the front surface (mounting surface) of the product P, or to measure the dimensions of the edge portion on the front side of the kerf formed between the products P. Furthermore, the image obtained by illuminating the product P from the back side is used, for example, to inspect the presence or absence of processing waste such as scrap material remaining between the products P, or to measure the minimum width of the kerf formed between the products P.

[0072] <Second Inspection Department 14> 2, the cutting device 100 of this embodiment has a second inspection unit 14 that inspects the back surfaces (marked surfaces) of the multiple products P held and transported by the second holding mechanism 6. This second inspection unit 14 has a second camera 141 with an optical system for capturing images of the back surfaces (marked surfaces) that are the surfaces to be attracted of the multiple products P. Each image obtained by this second camera 141 is processed in an image processing unit configured by the control unit COM, and the marked surfaces of the products P are inspected to determine whether the products P are good or defective.

[0073] <Example of operation of cutting device 100> Next, we will explain an example of the operation of the cutting apparatus 100. In this embodiment, all operations and controls of the cutting apparatus 100, such as transporting the sealed substrate W, laser cutting the sealed substrate W, removing processing waste S, inspecting the product P, and storing the product P in a tray, are performed by the control unit CTL (see FIG. 2).

[0074] The substrate supply unit 10b of the substrate supply mechanism 10 moves the sealed substrate W accommodated in the substrate accommodation unit 10a toward the holding position RP where the sealed substrate W is held by the first holding mechanism 3.

[0075] Next, the transfer movement mechanism 7 moves the first holding mechanism 3 to the holding position RP, and the first holding mechanism 3 suction-holds the sealed substrate W. Thereafter, the transfer movement mechanism 7 moves the first holding mechanism 3 holding the sealed substrate W to the cutting tables 2A and 2B, and the first holding mechanism 3 releases the suction-holding and places the sealed substrate W on the cutting tables 2A and 2B. Then, the cutting tables 2A and 2B suction-hold the sealed substrate W.

[0076] In this state, the cutting movement mechanisms 8A and 8B move the cutting tables 2A and 2B to a predetermined cutting position (the rear side of the transfer shaft 71). At this cutting position, the cutting tables 2A and 2B and the two laser light irradiation units 41A and 41B are moved relatively in the X and Y directions by the cutting movement mechanisms 8A and 8B and the processing head movement mechanism 11, thereby cutting the sealed substrate W into individual pieces. Note that the cutting tables 2A and 2B are rotated by the rotation mechanisms 9A and 9B as needed.

[0077] Here, a specific cutting method will be described. First, the sealed substrate W is sucked and held on the cutting tables 2A and 2B, and then alignment (position adjustment) is performed between the sealed substrate W and the laser light irradiation units 41A and 41B. Here, an image of the alignment mark on the sealed substrate W is captured by the alignment camera 20, and alignment is performed using the captured image data.

[0078] Then, as shown in Fig. 8(a), without inverting the cutting tables 2A and 2B by the table inversion mechanism 16, laser light is irradiated from the laser light irradiation units 41A and 41B onto the surface of the sealed substrate W to cut a part of it and create a groove (half cut). Fig. 8(a) shows an example in which two grooves are created between the packages to match the kerf width when cutting with a blade.

[0079] After the groove processing, as shown in FIG. 8(b), the cutting tables 2A and 2B are inverted by the table inversion mechanism 16. After the inversion, no alignment (position adjustment) is performed, and the image data before inversion is used, which is inverted based on the rotation axes of the rotation shafts 161a and 161b. If the height position of the sealed substrate W changes when the cutting tables 2A and 2B are inverted, the position change mechanism 17 changes the relative positions of the cutting tables 2A and 2B and the laser light irradiation units 41A and 41B to adjust the focal position of the laser light to the sealed substrate W. Then, laser light is irradiated onto the back surface of the sealed substrate W from the laser light irradiation units 41A and 41B through the through-opening 2T to cut the grooved portion by the half cut, thereby completely cutting (full cut). Processing waste S, such as scraps, generated by this full cut falls into the processing waste storage unit 18 and is stored therein.

[0080] In the above-described half cut and full cut, when the laser light irradiation units 41A and 41B are moved to different cutting lines CL1 and CL2, the irradiation of laser light by the laser light irradiation units 41A and 41B is stopped. Furthermore, the reversal by the table reversal mechanism 16 may be repeated multiple times depending on the type of the sealed substrate W, the cutting process, etc.

[0081] After the above cutting, as shown in Fig. 8(c), the gas injection unit 191 of the chip removal mechanism 19 is moved above the cutting tables 2A, 2B, and gas is blown from above onto the inverted cutting tables 2A, 2B to remove the chips S. The chips S removed by this chip removal mechanism 19 fall into and are stored in the chip storage unit 18. Note that before moving the chip removal mechanism 19 above the cutting tables 2A, 2B, the laser light irradiation units 41A, 41B may be retracted to a position where they will not get in the way by the processing head moving mechanism 11.

[0082] After removing the processing waste S, the cutting movement mechanisms 8A and 8B move the cutting tables 2A and 2B to predetermined inspection positions. Here, the cutting tables 2A and 2B are in a state where they are not inverted by the table inversion mechanism 16. Then, the first camera 131 of the first inspection unit 13 is moved in the X direction by the camera movement mechanism 132 to capture images of the multiple products P sucked onto the cutting tables 2A and 2B. Here, as shown in FIGS. 9 and 10 , the camera movement mechanism 132 alternately turns on the front-side illumination unit 133 and the back-side illumination unit 134 while moving the first camera in the X direction, and captures images of the multiple products P when each illumination unit 133 and 134 is turned on. Then, each image captured by the first camera 131 is sent to the image processing unit of the control unit CTL, where the products P are judged to be good or bad. If this first inspection unit 13 detects that processing debris S remains between the products P, the processing debris S can be removed again by the gas injection unit 191 of the processing debris removal mechanism 19 described above (see Figure 10(c)).

[0083] After removing the processing waste S and inspecting the surface of the product P, the cutting movement mechanisms 8A and 8B move the cutting tables 2A and 2B to a predetermined transfer position (on the front side of the transfer shaft 71).

[0084] Next, the transport movement mechanism 7 moves the second holding mechanism 6 to the cutting tables 2A and 2B after cutting, and the second holding mechanism 6 sucks and holds the multiple products P.

[0085] Here, when transferring multiple products P from the cutting tables 2A, 2B to the second holding mechanism 6, the products P may adhere to the cutting tables 2A, 2B, making it impossible to transfer the products P reliably to the second holding mechanism 6. For this reason, as shown in FIG. 11, a push-up member 21 such as a pin that pushes up the back surface of the product P through the through opening 2T of the cutting tables 2A, 2B may be used. The push-up member 21 pushes up the multiple products P toward the second holding mechanism 6 through the through opening 2T when the second holding mechanism 6 is in contact with or close to the multiple products P sucked onto the cutting tables 2A, 2B (see FIG. 11(b)). This ensures that the products P are transferred reliably from the cutting tables 2A, 2B to the second holding mechanism 6 (see FIG. 11(c)).

[0086] Thereafter, the transport movement mechanism 7 moves the second holding mechanism 6 holding the multiple products P to the transfer table 5. During transport to the transfer table 5, the multiple products P held by the second holding mechanism 6 have their undersides (marked surfaces) inspected by the second camera 141 of the second inspection unit 14.

[0087] After this inspection, the transport moving mechanism 7 delivers the multiple products P to the transfer table 5. The transfer table 5 on which the products P are placed is moved to the removal position X2 by the transfer moving mechanism 12. Then, the multiple products P placed on the transfer table 5 are sorted into various trays T by the sorting mechanism 15a according to the inspection results (good products, defective products, etc.) by the first inspection unit 13 and the second inspection unit 14.

[0088] <Effects of this embodiment> According to the cutting device 100 of this embodiment, the first camera 131 captures images of the multiple products P sucked onto the cutting tables 2A, 2B, eliminating the need to transport them to a separate inspection table, thereby simplifying the cutting device 100 and improving productivity. Also, by inspecting while moving the first camera 131 relative to the cutting tables 2A, 2B, the number of stops and acceleration / deceleration of the cutting tables 2A, 2B can be reduced, thereby shortening the inspection time. Furthermore, by simplifying the cutting device 100, the footprint can be reduced.

[0089] Furthermore, the cutting tables 2A and 2B holding the sealed substrate W by suction can be turned over to cut the sealed substrate W from both sides, thereby shortening the cutting time and improving productivity.

[0090] moreover , cut If the shift amount of the positions when the cutting tables 2A and 2B are turned over is measured once in advance, the positions after the turning over can be corrected by calculation, and there is no need to readjust the alignment (position adjustment) each time the tables are turned over. Therefore, the alignment (position adjustment) of the laser light irradiation units 41A and 41B with respect to the sealed substrate W only needs to be performed once after the sealed substrate W is adsorbed. This also reduces the processing time and improves productivity.

[0091] Furthermore, since the cutting tables 2A, 2B are provided with a plurality of through openings 2T through which laser light can pass, when laser light is irradiated onto the sealed substrate W in the portions corresponding to the through openings 2T to cut it, the laser light passes through the through openings 2T and does not hit the cutting tables 2A, 2B. As a result, damage to the cutting tables 2A, 2B due to laser light irradiation and the resulting adhesion of contaminants (impurities, foreign matter) to the sealed substrate W are suppressed, and restrictions on the laser processing conditions for preventing damage to the cutting tables 2A, 2B can be reduced. By reducing restrictions on the laser processing conditions, higher pulse energy and average power can be used, thereby shortening processing time and improving productivity.

[0092] In addition, since the laser light passes through the through opening 2T, the laser light is prevented from being reflected by the cutting tables 2A and 2B and being irradiated onto the sealed substrate W, and damage to the sealed substrate W caused by the laser light reflected by the cutting tables 2A and 2B can also be suppressed.

[0093] In addition, since the through opening 2T widens toward the other surface 2y, the laser light is irradiated from one surface 2x and passes through the sealed substrate W. , Kan The laser beam does not strike the inner surface of the through opening 2T. Furthermore, even when the cutting tables 2A, 2B are turned over and the laser beam is irradiated from the other surface 2y, the laser beam does not strike the inner surface of the through opening 2T. This not only suppresses damage caused by the laser beam striking the cutting tables 2A, 2B, but also prevents the reflected laser beam from striking an unintended area of ​​the sealed substrate W, thereby preventing the quality of the sealed substrate W from being damaged.

[0094] <Other Modified Embodiments> The present invention is not limited to the above-described embodiment.

[0095] Although the above embodiment is a cutting device that accommodates trays, the present invention is not limited to tray accommodation and may be configured to accommodate the following.

[0096] 12, the cutting device 100 is configured to accommodate a plurality of products P in a cylindrical container 101 (also called "tube accommodation"). The cylindrical container 101 may also be called a tube, a magazine stick, a stick magazine, a stick, etc.

[0097] Specifically, as shown in FIG. 13 , the cylindrical container 101 accommodates a plurality of products P aligned in a row. Specifically, the cylindrical container 101 has a linear shape and has a space therein for accommodating the products P. The cross-sectional shape of the cylindrical container 101 perpendicular to the longitudinal direction corresponds to the cross-sectional shape of the products P. The products P are inserted from one end opening 101x of the cylindrical container 101 by a transport / accommodation mechanism 102. While the cylindrical container 101 shown in FIG. 13 has a configuration in which a portion of the side wall extending along the longitudinal direction is open, the side wall may be closed. Furthermore, the cylindrical container 101 may accommodate a plurality of products P aligned in a row, or may accommodate a plurality of products P aligned in multiple rows. Furthermore, the cylindrical container 101 may be made of resin or metal. Although FIG. 13 shows a configuration in which the products P have leads, they may also be non-leaded types such as QFN.

[0098] In this case, the transfer table 5 is a table on which the plurality of products P are temporarily placed before the plurality of products P are accommodated in the cylindrical container 101. The transfer table 5 is also provided with a transfer moving mechanism. 12 , the product holder 102 moves between a transfer position X1 where the second holding mechanism 6 places the multiple products P and a take-out position X2 where the multiple products P are transported by the transport and storage mechanism 102.

[0099] The multiple products P placed on the transfer table 5 are stored in cylindrical containers 101 by a transport and storage mechanism 102 according to the inspection results (good products, defective products, etc.) by the first inspection unit 13 and the second inspection unit 14. The cylindrical containers 101 are placed on a container installation unit 103. The container installation unit 103 in FIG. 12 includes a section for storing empty cylindrical containers 101, a section for arranging the empty cylindrical containers 101 into which the products P are inserted from one end opening 101x, and a section for storing cylindrical containers 101 that are fully loaded with products P or that contain a desired number of products P. The transport and storage mechanism 102 transports the multiple products P from the transfer table 5 located at the take-out position X2 to the intermediate table 102a, and then transports the products P from the intermediate table 102a into the cylindrical containers 101 and stores them therein.

[0100] For example, as shown in FIG. 14, the cutting device 100 may store a plurality of products P by adhering them to an attachment member 104 having an adhesive surface 104x (also called "ring storage").

[0101] Specifically, as shown in Fig. 15, the attachment member includes a frame-shaped member 104a having, for example, a circular or rectangular shape, and a resin sheet 104b having an adhesive surface 104x arranged inside the frame-shaped member 104a. The frame-shaped member 104a is made of a metal such as stainless steel. The resin sheet 104b includes, for example, a resin sheet-shaped base material 104b1 and an adhesive layer (adhesive layer) 104b2 made of an adhesive applied to the upper surface of the sheet-shaped base material 104b1. The upper surface of the adhesive layer (adhesive layer) 104b2 becomes the adhesive surface 104x.

[0102] In this case, the transfer table 5 is a table on which the plurality of products P are temporarily placed before the plurality of products P are attached to the attaching member 104. The transfer table 5 is also provided with a transfer movement mechanism 12 , the conveyor mechanism 105 moves between a transfer position X1 where the plurality of products P are placed by the second holding mechanism 6 and a take-out position X2 where the plurality of products P are conveyed by the conveyor mechanism 105 for application.

[0103] The multiple products P placed on the transfer table 5 are attached to affixing members 104 by the affixing transport mechanism 105 according to the inspection results (good, defective, etc.) by the first inspection unit 13 and the second inspection unit 14. The affixing members 104 are placed on a mounting table 106. As shown in FIG. 14 , the mounting table 106 is provided so as to be movable along the Y direction. The mounting table 106 is moved by the mounting movement mechanism 107 between an affixing member transport position X3 where the affixing member 104 is transported by the affixing member transport mechanism 108 and an affixing position X4 where the multiple products P are transported by the affixing member transport mechanism 105. The affixing member transport mechanism 108 transports the affixing member 104 between the mounting table 106 at the affixing member transport position X3 and an affixing member storage unit 109 that stores the affixing member 104. The affixing member transport mechanism 108 holds the frame-shaped member 104 a of the affixing member 104 by suction.

[0104] In the above embodiment, the configuration includes the second inspection unit 14, but the configuration may also be such that the second inspection unit 14 is not included. In this case, the first inspection unit 13 performs an inspection to determine whether the multiple products P are good or defective, and the products are then stored in trays, tubes, or rings.

[0105] In the above embodiment, the camera moving mechanism 132 moves the first camera 131 in the cutting direction (X direction) to capture images of the multiple products P adsorbed to the cutting tables 2A, 2B, but the cutting tables 2A, 2B may be moved in the Y direction by the cutting movement mechanisms 8A, 8B to move them in the cutting direction to capture images of the multiple products P adsorbed to the cutting tables. Furthermore, the multiple products P adsorbed to the cutting tables 2A, 2B may be captured while the cutting tables 2A, 2B are moved by the cutting movement mechanisms 8A, 8B while the first camera 131 is moved by the camera moving mechanism 132.

[0106] Furthermore, in the above embodiment, the first camera 131 is common to the two cutting tables 2A and 2B, but it may be provided for each of the cutting tables 2A and 2B.

[0107] In addition, in the above embodiment, the cutting tables 2A, 2B are moved from the cutting position to the inspection position to inspect the product P, but the inspection may be performed at the cutting position. In this case, after cutting by the laser light irradiation units 41A, 41B of the cutting mechanism 4 is completed, the laser light irradiation units 41A, 41B may be retracted and the first camera 131 may be moved above the cutting tables 2A, 2B.

[0108] In the above embodiment, the cutting tables 2A, 2B are not turned upside down when the product P is imaged by the first camera 131, but the cutting tables 2A, 2B may be turned upside down. Also, the product P may be imaged before and after the cutting tables 2A, 2B are turned upside down.

[0109] In the above embodiment, the two cutting tables 2A, 2B have the multiple through openings 2T formed in the same position, but the multiple cutting tables 2A, 2B may have the multiple through openings 2T formed in different positions from each other. In this configuration, after laser processing is performed on one cutting table 2A, the sealed substrate W can be transferred to the other cutting table 2B and laser processing can be performed on another position of the sealed substrate W. Also, two types of sealed substrates having different product layouts can be laser processed on two cutting tables, respectively.

[0110] The two cutting tables 2A and 2B in the above embodiment may be replaced by three or more cutting tables in order to balance the time required for each process.

[0111] Also, the rotation mechanism for the cutting tables 2A, 2B may be eliminated, and the processing position may be rotated on the laser light irradiation unit side. In this case, when the first camera 131 is moved relatively to the cutting tables 2A, 2B for inspection, the cutting tables 2A, 2B do not need to be rotated, and the cutting direction (the direction in which the kerf extends) cut by the cutting mechanism 4 may remain parallel to the Y direction.

[0112] The cutting device 100 in the above embodiment cuts the sealed substrate W by turning the cutting tables 2A and 2B over, but depending on the type of sealed substrate W, the sealed substrate W may be cut only from the front side without turning the cutting tables 2A and 2B over, or the cutting tables 2A and 2B may be turned over and the sealed substrate W may be cut only from the back side.

[0113] In the sealed substrate W of the above embodiment, the cutting lines CL1 and CL2 in the adjacent dividing elements W1 and W2 are set on different straight lines, but the cutting lines CL1 and CL2 may be set on the same straight line. In this case, the multiple through openings 2T provided in the cutting tables 2A and 2B are provided on the same straight line corresponding to the cutting lines CL1 and CL2. Here, the multiple through openings 2T provided on the same straight line may be combined into a single through opening.

[0114] The cutting mechanism 4 in the above embodiment is configured to cut using a laser beam, but may be configured to cut using a blade.

[0115] In the above embodiment, a cutting device of a twin-cut table type having two cutting tables and a twin-laser configuration having two laser light irradiation units has been described, but the invention is not limited to this and may also be a cutting device of a single-cut table type having one cutting table and a single-laser configuration having one laser light irradiation unit, or a cutting device of a single-cut table type having one cutting table and a twin-laser configuration having two laser light irradiation units.

[0116] 7 and 8 of the embodiment show a configuration in which the through opening 2T has a shape that widens from one surface 2x to the other surface 2y throughout the entire cutting table (processing table) 2A, 2B. However, this is not limiting, and it is sufficient if at least a portion of the through opening 2T has a shape that widens from one surface 2x to the other surface 2y. For example, the through opening 2T may have a shape that widens from one surface to the other only in the base plate 201 that is located at the lowest position before the cutting tables 2A, 2B are turned over.

[0117] Furthermore, in the above embodiment, the processing in which half cutting and full cutting are performed has been described, but the processing conditions may be switched and laser marking may also be performed.

[0118] Furthermore, the cutting device of the present invention may be one that performs processing other than cutting, for example, one that performs other mechanical processing such as cutting or grinding.

[0119] Furthermore, the present invention is not limited to the above-described embodiment, and it goes without saying that various modifications are possible without departing from the spirit of the present invention. [Explanation of symbols]

[0120] 100...Cutting equipment (processing equipment) W···Sealed substrate (object to be processed) P...Product (processed product) 2A, 2B... Cutting table (processing table) 2h...Adsorption hole 2x...one side 2y...the other side 3. First holding mechanism (transport mechanism) 41A, 41B: Laser light irradiation unit 7. Transfer mechanism (transfer mechanism) 17. Position change mechanism 18. Processing waste collection section 19... Processing waste removal mechanism

Claims

1. a processing table having a plurality of suction holes on one surface thereof that can suck the workpiece; a processing mechanism that processes the object sucked onto the processing table; a first camera that captures an image of the object processed by the processing mechanism; a moving mechanism that moves the first camera and the processing table relatively so that the first camera can capture an image of the processed object adsorbed on the processing table; and Equipped with the processing table has a plurality of through openings penetrating from the one surface to the other surface, the processing mechanism processes the object to be processed in the through opening, the first camera captures an image of the object sucked onto the processing table after processing; The movement mechanism moves the first camera and the processing table relatively along a processing direction by the processing mechanism.

2. A processing table having a plurality of suction holes on one surface thereof that can adsorb the workpiece; a processing mechanism that processes the object sucked onto the processing table; a first camera that captures an image of the object processed by the processing mechanism, the processing table has a plurality of through openings penetrating from the one surface to the other surface, the processing mechanism processes the object to be processed in the through opening, the first camera captures an image of the object sucked onto the processing table after processing; The processing apparatus further includes a backside illumination unit that is provided on the opposite side of the processing table from the first camera and generates transmitted light that passes through the through-opening.

3. a front surface side illumination unit that is provided on the same side as the first camera with respect to the processing table and that illuminates the object after processing, The processing device according to claim 2 , wherein the first camera captures an image of the processed object while the front-side illumination unit and the back-side illumination unit are alternately turned on.

4. A processing table having a plurality of suction holes on one surface thereof that can adsorb the workpiece; a processing mechanism that processes the object sucked onto the processing table; a first camera that captures an image of the object processed by the processing mechanism; a conveying mechanism that conveys the object after processing by sucking a surface opposite to a surface to be sucked by the processing table; a second camera that captures an image of the attracted surface of the processed object transported by the transport mechanism, the processing table has a plurality of through openings penetrating from the one surface to the other surface, the processing mechanism processes the object to be processed in the through opening, The first camera captures an image of the object to be processed that has been sucked onto the processing table and has been processed.

5. A processing table having a plurality of suction holes on one side thereof that can adsorb the workpiece; a processing mechanism that processes the object sucked onto the processing table; a first camera that captures an image of the object processed by the processing mechanism, the processing table has a plurality of through openings penetrating from the one surface to the other surface, the processing mechanism processes the object to be processed in the through opening, the first camera captures an image of the object sucked onto the processing table after processing; the processing mechanism irradiates the object with laser light to cut it; The processing table is reversible, The processing device turns the processing table holding the workpiece over, and cuts the workpiece by irradiating both surfaces of the workpiece with laser light.

6. The processing apparatus according to claim 1 , further comprising a processing debris removal mechanism that removes processing debris remaining on the workpiece after processing.

7. A method for manufacturing a processed product, comprising the steps of: manufacturing a processed product using the processing device according to any one of claims 1 to 6;

8. A processing table having a plurality of suction holes on one surface that can adsorb the workpiece; a processing mechanism that processes the object sucked onto the processing table; a first camera that captures an image of the object processed by the processing mechanism, the processing table has a plurality of through openings penetrating from the one surface to the other surface, the processing mechanism processes the object to be processed in the through opening, a processing device for processing a processed product, the processing device including: a processing table for capturing an image of the object to be processed after being sucked onto the processing table; a cutting step of turning the processing table holding the object upside down and irradiating both surfaces of the object with laser light to cut the object; and an inspection step of photographing and inspecting the object to be processed that has been sucked onto the processing table and has been processed using the first camera.

Images