Surface material for heat insulation board and heat insulation board

Abstract

To provide a surface material for an insulation board and an insulation board allowing a gas generated from a foamed insulation material during combustion to easily escape from the insulation board.SOLUTION: A surface material 10 for an insulation board comprises a metal layer 11 and a resin film 12 bonded to the metal layer 11. The surface material 10 for an insulation board is integrated with a foamed insulation material and has the function of allowing a gas emitted from the foamed insulation material to pass through when the foamed insulation material and the surface material 10 for the insulation board are set at a temperature of 150°C or higher.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present embodiment relates to a surface material for an insulating board and an insulating board. [Background technology]

[0002] In recent years, heat insulating materials have been used for the purpose of energy conservation in products, and foam heat insulating materials such as rigid urethane foam are widely used as heat insulating materials.

[0003] Since foam insulation materials such as rigid urethane foam are flammable, there is a demand for them to be flame-retardant. Proposed flame-retardant technologies include, for example, a technology for improving the flame retardancy of an insulation board having foam insulation material by attaching a metal surface material such as aluminum foil to the front or back of the foam insulation material, and a technology for improving the flame retardancy of the foam insulation material itself by adding a flame retardant to the foam insulation material (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2018-9120 Summary of the Invention [Problem to be solved by the invention]

[0005] However, because metal surface materials have the property of not allowing gas to pass through, gas generated during combustion of foam insulation may remain between the metal surface material and the foam insulation, causing the insulation board to expand. In particular, in recent years, efforts have been made to increase the thickness of insulation boards in order to further improve insulation performance. In this case, as the volume of the foam insulation increases, the gas generated from the foam insulation during combustion tests also increases, which may result in more significant expansion of the insulation board.

[0006] The present disclosure provides a surface material for an insulation board and an insulation board that can easily allow gases generated from a foam insulation material during combustion to escape from the insulation board. [Means for solving the problem]

[0007] The surface material for an insulating board according to this embodiment is a surface material for an insulating board, and comprises a metal layer and a resin film adhered to the metal layer. It is integrated with a foam insulating material, and has the function of allowing gas emitted from the foam insulating material to pass through when the foam insulating material and the surface material for an insulating board are heated to a temperature of 150°C or higher.

[0008] In the surface material for an insulating board according to this embodiment, the surface material may have a plurality of through holes that penetrate the metal layer and the resin film in the thickness direction, the diameter of each through hole being 0.2 mm or more and 0.8 mm or less, the pitch between each through hole being 35 mm or more and 50 mm or less, and the puncture strength of the surface material for an insulating board in the part where no through holes exist may be 10 N / φ1 mm or less.

[0009] In the surface material for an insulating board according to this embodiment, the resin film has a plurality of grooves that penetrate in the thickness direction, and each groove is not formed in the metal layer, and the thickness of the surface material for an insulating board may be 55 μm or less.

[0010] In the surface material for insulation board according to this embodiment, the tensile strength of the surface material for insulation board may be 20N / 15mm or more and 40N / 15mm or less, and the puncture strength of the surface material for insulation board may be 5N / φ1mm or more and 7N / φ1mm or less.

[0011] In the surface material for a thermal insulation board according to this embodiment, the surface of the resin film that comes into contact with the foamed thermal insulation material may have a wettability of 40 dyn or more.

[0012] The insulation board of this embodiment comprises a surface material for an insulation board of this embodiment and a foam insulation material integrated with the surface material for the insulation board, the foam insulation material being a foam whose main component is polyisocyanurate and having non-combustibility according to the ISO5660-1 2002 test method. [Effects of the Invention]

[0013] According to this embodiment, gas generated from the foam insulation material during combustion can be easily released from the insulation board. [Brief explanation of the drawings]

[0014] [Figure 1] 1 is a plan view showing a surface material for a heat insulating board according to a first embodiment. [Figure 2] 1 is a cross-sectional view showing the surface material for a heat insulating board according to the first embodiment (cross-sectional view taken along line II-II in FIG. 1). [Figure 3] 1 is a cross-sectional view showing a heat insulating board according to a first embodiment. [Figure 4] 1A to 1C are cross-sectional views showing a method for manufacturing a surface material for an insulating board and a method for manufacturing an insulating board according to a first embodiment. [Figure 5] FIG. 10 is a plan view showing a surface material for a heat insulating board according to a second embodiment. [Figure 6] 6 is a cross-sectional view showing the surface material for a heat insulating board according to the second embodiment (cross-sectional view taken along line VI-VI in FIG. 5). FIG. [Figure 7] FIG. 4 is a cross-sectional view showing a heat insulating board according to a second embodiment. [Figure 8] 10A to 10C are plan views showing various modified examples of the surface material for a heat insulating board according to the second embodiment. [Figure 9] 5A to 5C are cross-sectional views showing a method for manufacturing a surface material for an insulating board and a method for manufacturing an insulating board according to a second embodiment. [Figure 10] FIG. 10 is a plan view showing a surface material for a heat insulating board according to a third embodiment. [Figure 11]11 is a cross-sectional view showing the surface material for a heat insulating board according to the third embodiment (cross-sectional view taken along line XI-XI in FIG. 10). FIG. [Figure 12] FIG. 10 is a cross-sectional view showing a heat insulating board according to a third embodiment. [Figure 13] 10A to 10C are cross-sectional views showing a method for manufacturing a surface material for an insulating board and a method for manufacturing an insulating board according to a third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0015] Each embodiment will be described below with reference to the drawings. The figures shown below are schematic illustrations. Therefore, the size and shape of each part are appropriately exaggerated for ease of understanding. Furthermore, appropriate modifications can be made within the scope of the technical concept. In the figures shown below, identical parts are denoted by the same reference numerals, and some detailed descriptions may be omitted. Furthermore, the numerical values, such as dimensions, and material names of each component described in this specification are examples of embodiments and are not limited to these. They can be selected and used as appropriate. In this specification, terms specifying shapes or geometric conditions, such as parallel, orthogonal, and perpendicular, are intended to include not only their strict meanings but also substantially the same states.

[0016] In the following embodiments, the term "plan view" refers to a state when viewed from a normal direction perpendicular to the main surfaces of the insulation board surface material and the insulation board.

[0017] (First embodiment) The configuration of the surface material for a heat insulating board according to the first embodiment will be described with reference to FIGS.

[0018] As shown in Figures 1 and 2, the insulating board facing material 10 of this embodiment comprises a metal layer 11 and a resin film 12 adhered to the metal layer 11. The insulating board facing material 10 is integrated with a foam insulating material 20, and has the function of allowing gas emitted from the foam insulating material 20 to pass through when the foam insulating material 20 and the insulating board facing material 10 are heated to a high temperature (a temperature of 150°C or higher). This insulating board facing material 10 is placed on at least one side of the foam insulating material 20 and integrated with the foam insulating material 20 to form an insulating board 30 (see Figure 3). The insulating board 30 is non-combustible according to the ISO5660-1 2002 test method.

[0019] The shape of the surface material 10 for an insulating board in this embodiment in plan view is not particularly limited, and examples thereof include a rectangular shape, a polygonal shape, and a circular shape.

[0020] The insulating board facing material 10 according to this embodiment comprises a metal layer 11, an adhesive layer 13 located on a first surface 11a of the metal layer 11, and a resin film 12 located on the first surface 13a of the adhesive layer 13. When the insulating board 30 (see FIG. 3) is constructed, the metal layer 11 is located on the outer side of the insulating board 30. The second surface 11b of the metal layer 11 faces the outer side of the insulating board 30. The resin film 12 is located on the foam insulating material 20 side. The adhesive layer 13 is a layer that bonds the metal layer 11 and the resin film 12 to each other. In this case, the first surface 11a of the metal layer 11 is directly bonded to the second surface 13b of the adhesive layer 13. The first surface 12a of the resin film 12 is directly bonded to the foam insulating material 20. The second surface 12b of the resin film 12 is directly bonded to the first surface 13a of the adhesive layer 13.

[0021] As shown in Figures 1 and 2, the insulating board surface material 10 includes a plurality of through holes 14. Each of the plurality of through holes 14 penetrates the metal layer 11 and the resin film 12 in the thickness direction. The plurality of through holes 14 are arranged spaced apart from one another in the surface direction. The planar shape of each through hole 14 is a circular dot, but is not limited to this and may be a polygonal dot such as a triangle or a rectangle. The planar shape of each through hole 14 may also be linear, and in this case may be, for example, a straight line, a broken line, a curved line, a wavy line, or the like.

[0022] As shown in FIG. 1 , the diameter d1 of each through hole 14 is 0.2 mm or more, preferably 0.4 mm or more. By making the diameter d1 of each through hole 14 0.2 mm or more, gas generated from the foam insulation material 20 during combustion can be released to the outside of the insulation board 30 through the through hole 14, as described below. Furthermore, the diameter d1 of each through hole 14 is 0.8 mm or less, preferably 0.7 mm or less. By making the diameter d1 of each through hole 14 0.8 mm or less, leakage of the foam insulation material 20 material from each through hole 14 during manufacturing of the insulation board 30 can be suppressed. Here, the "diameter" is defined as the longest distance between two parallel lines bordering each through hole 14 from both sides in a plan view. When the planar shape of each through hole 14 is circular, the "diameter" corresponds to the diameter of each through hole 14.

[0023] The pitch P1 between the through holes 14 is 35 mm or more, preferably 40 mm or more. By setting the pitch P1 between the through holes 14 to 35 mm or more, heat transfer to the foam insulation material 20 during heat generation tests is suppressed, preventing the insulation board 30 from failing to meet required performance requirements. The pitch P1 between the through holes 14 is 50 mm or less, preferably 45 mm or less. Setting the pitch P1 between the through holes 14 to 50 mm or less allows gas generated from the foam insulation material 20 during combustion to escape to the outside of the insulation board 30 through the through holes 14, as described below. Here, "pitch" is defined as the distance between the centers of adjacent through holes 14 in a plan view. The multiple through holes 14 are arranged at a uniform pitch P1, but this is not limited thereto and may also be arranged at a non-uniform pitch P1. Even in this case, the multiple through holes 14 are preferably arranged at a non-uniform pitch P1 within the range of 35 mm or more and 50 mm or less.

[0024] Here, the diameter d1 and pitch P1 of the through holes 14 can be determined from a planar micrograph of the metal layer 11 observed using an optical microscope, a transmission electron microscope (TEM), a scanning electron microscope (SEM) or a scanning transmission electron microscope (STEM).

[0025] The multiple through holes 14 are arranged in a staggered (alternate) pattern in a planar view. However, the multiple through holes 14 are not limited to this, and may be arranged in an array with a predetermined regularity, such as a lattice pattern. Alternatively, the multiple through holes 14 may be arranged irregularly. Furthermore, the multiple through holes 14 are arranged with a uniform density within the surface of the insulation board facing material 10, but the multiple through holes 14 are not limited to this, and may be arranged with a non-uniform density within the surface of the insulation board facing material 10. For example, the multiple through holes 14 may be arranged with a higher density in some regions within the surface of the insulation board facing material 10 than in other regions.

[0026] Hereinafter, each component of the surface material 10 for a heat insulating board in this embodiment will be described.

[0027] The metal layer 11 is a layer disposed on the outer surface of the insulation board 30 and provides the insulation board 30 with a heat ray reflecting function. The thickness T1 of the metal layer 11 can be, for example, 1 μm or more, and preferably 5 μm or more. The thickness T1 of the metal layer 11 can be 100 μm or less, and preferably 50 μm or less. The thickness T1 of the metal layer 11 can be the average value of thicknesses measured at any 10 locations on a cross section of the insulation board surface material 10 in the thickness direction observed with a transmission electron microscope (TEM), a scanning electron microscope (SEM), or a scanning transmission electron microscope (STEM). The thicknesses of other layers included in the insulation board surface material 10 and the insulation board 30 can be measured in the same manner.

[0028] The metal layer 11 contains a metal material. The metal material may be a material that has heat ray reflectivity that reflects near-infrared rays or infrared rays, and for example, a material containing aluminum, magnesium, silver, copper, titanium, or stainless steel can be used. Among these, it is preferable to use aluminum or stainless steel because of its good corrosion resistance. In particular, it is preferable to use aluminum because it has high heat ray reflectivity, moisture resistance, and gas barrier properties, good processability, low cost, and light weight. For example, a metal foil can be used as the metal layer 11. Among these, it is preferable that the metal layer 11 is aluminum foil or stainless steel foil, and aluminum foil is more preferable.

[0029] The adhesive layer 13 is not particularly limited as long as it is a material that bonds the metal layer 11 and the resin film 12, and for example, an adhesive can be used. Examples of materials that can be used for such adhesive layers include conventionally known adhesives (e.g., pressure-sensitive adhesives, thermoplastic adhesives, and curable adhesives). The adhesive constituting the adhesive layer is typically a two-component curing adhesive containing a base agent and a curing agent, but is not limited to this. For example, the adhesive may be a one-component curing adhesive containing a base agent and a latent curing agent blocked by a known method so as not to react when mixed with the base agent, or a one-component curing adhesive containing a curing agent and a latent base agent blocked by a known method so as not to react when mixed with the curing agent. Examples of adhesives that can be used to form the adhesive layer include epoxy adhesives, polyvinyl acetate adhesives, polyacrylic ester adhesives, cyanoacrylate adhesives, ethylene copolymer adhesives, cellulose adhesives, polyester adhesives, polyamide adhesives, polyimide adhesives, amino resin adhesives, phenolic resin adhesives, polyurethane adhesives, reactive (meth)acrylic acid adhesives, inorganic rubber adhesives, silicone adhesives, and inorganic adhesives such as alkali metal silicates or low-melting-point glass. The thickness T2 of the adhesive layer 13 can be, for example, 1 μm or more, preferably 3 μm or more. The thickness T2 of the adhesive layer 13 can be, for example, 50 μm or less, preferably 20 μm or less. Examples of methods for forming the adhesive layer 13 include applying the adhesive to the first surface 11a of the metal layer 11 or the second surface 12b of the resin film 12. Typical application methods, such as gravure coating and roll coating, can be used.

[0030] The resin film 12 is a layer for bonding the insulating board facing material 10 to the foamed insulating material 20 when the insulating board facing material 10 is used for the insulating board 30. The resin film 12 is placed on the side of the insulating board facing material 10 that faces the foamed insulating material 20.

[0031] The resin film 12 can be made of a thermoplastic resin that can be bonded to the foam insulation material 20. The resin film 12 may be unstretched, or may be uniaxially or biaxially stretched. The resin substrate may or may not be transparent. The resin used for the resin substrate is not particularly limited, and examples thereof include polyolefin resins such as polyethylene and polypropylene, polyester resins such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polybutylene terephthalate (PBT), cyclic polyolefin resins, polystyrene resins, acrylonitrile-styrene copolymers (AS resins), acrylonitrile-butadiene-styrene copolymers (ABS resins), poly(meth)acrylic resins, polycarbonate resins, polyvinyl alcohol resins such as polyvinyl alcohol (PVA) and ethylene-vinyl alcohol copolymers (EVOH), ethylene-vinyl ester copolymers and saponified products thereof, polyamide resins such as various nylons, polyimide resins, polyurethane resins, acetal resins, and cellulose resins. Among these, the resin is preferably PET, PBT, polyethylene, polypropylene, nylon, PVA, or EVOH. By using polyethylene terephthalate (PET) or nylon as the resin film 12, it is possible to reduce costs and improve heat resistance and mechanical strength.

[0032] The resin film 12 may be disposed over the entire surface of the first surface 11a of the metal layer 11, or may be disposed partially over the first surface 11a of the metal layer 11. In particular, in order to ensure adhesion between the metal layer 11 and the foam insulation material 20, it is preferable that the resin film 12 be disposed over the entire surface of the first surface 11a of the metal layer 11.

[0033] The thickness T3 of the resin film 12 may be such that the insulation board surface material 10 can be adhered to the foam insulation material 20. The thickness T3 of the resin film 12 can be, for example, 1 μm or more, and preferably 5 μm or more. The thickness T3 of the resin film 12 can be 100 μm or less, and preferably 40 μm or less.

[0034] Furthermore, the wettability of the surface (first surface 12a) of resin film 12 that comes into contact with foamed thermal insulation 20 is preferably 40 dyn (mN / m) or more. By making the wettability of first surface 12a of resin film 12 40 dyn or more, it is possible to improve the adhesion between resin film 12 and foamed thermal insulation 20. The above wettability can be determined by applying a wetting reagent of 40 dyn (dyne number: wetting index) to the surface of a sample and determining whether separation occurs in the liquid film after 2 seconds.

[0035] The thickness T4 of the insulating board facing material 10 can be, for example, 3 μm or more, and preferably 15 μm or more. The thickness T4 of the insulating board facing material 10 can be 250 μm or less, and preferably 110 μm or less.

[0036] The tensile strength of the insulation board facing material 10 may be 10 N / 15 mm or more, preferably 20 N / 15 mm or more. The tensile strength of the insulation board facing material 10 may be 50 N / 15 mm or less, preferably 40 N / 15 mm or less. The tensile strength of the insulation board facing material 10 is measured in accordance with JIS K 7161-1:2014. An Instron 5565 (manufactured by Instron Japan) can be used as a tensile tester. The tensile speed may be 300 mm / min. In this embodiment, the tensile strength of the insulation board facing material 10 refers to a value measured in a region including the through-holes 14. Furthermore, the tensile strength of the insulation board facing material 10 is preferably within the above range in both the resin flow direction (MD) and the perpendicular direction (TD) of the resin film 12.

[0037] The puncture strength of the insulation board facing material 10 is 10 N / φ1 mm or less. The puncture strength of the insulation board facing material 10 is determined in accordance with JIS Z 1707, General Rules for Food Packaging Plastic Films, 7.4, Puncture Strength Test. Specifically, a 50 mm x 50 mm test piece is cut out from an integrated surface material and foam insulation (rigid urethane foam). The test piece is then fixed in place, and a semicircular needle with a diameter of 1.0 mm and a tip radius of 0.5 mm is pierced through the center at a rate of 50 ± 5 mm per minute. The maximum stress until the needle penetrates is measured to determine the puncture strength of the facing material. By maintaining the puncture strength of the insulation board facing material 10 at 10 N / φ1 mm or less, there is little risk of the hot needle 43 breaking or bending when forming the through holes 14 using the hot needle 43, as described below. In this embodiment, the puncture strength of the insulation board facing material 10 refers to a value measured in an area without through holes 14.

[0038] Next, the configuration of the heat insulating board according to this embodiment will be described with reference to FIG.

[0039] As shown in Figure 3, the insulation board 30 of this embodiment comprises a foam insulation material 20 having a first surface 20a and a second surface 20b, and an insulation board facing material 10 arranged on at least the second surface 20b side of the foam insulation material 20. Of these, the insulation board facing material 10 is the same as that shown in Figures 1 and 2. The insulation board facing material 10 needs to be arranged on at least one of the first surface 20a and the second surface 20b of the insulation board 30, and may, for example, be arranged on both the first surface 20a and the second surface 20b of the insulation board 30.

[0040] In this embodiment, the insulation board 30 has the insulation board surface material 10 described above, so that the insulation board 30 can be prevented from expanding due to gas generated from the foam insulation material 20 during combustion.

[0041] The foam insulation 20 is made of a rigid material having thermal insulation properties. Examples of the foam insulation 20 include foams containing polyisocyanurate as a main component. Foams containing polyisocyanurate as a main component can be formed by reacting, for example, a polyol compound containing a polyol, an isocyanate compound containing an aromatic polyisocyanate compound, and a blowing agent. The raw materials for the foam insulation 20 may contain, for example, a catalyst, an additive, a flame retardant, and the like. When the foam insulation 20 is a foam containing polyisocyanurate as a main component, an insulation board 30 having high flame retardancy can be obtained.

[0042] The thickness T5 of the foam insulation material 20 can be, for example, 5 mm or more, and preferably 20 mm or more. The thickness T5 of the foam insulation material 20 can be 495 mm or less, and preferably 100 mm or less. The shape of the foam insulation material 20 in a plan view is not particularly limited, and examples thereof include a rectangular shape, a polygonal shape, and a circular shape.

[0043] The planar shape of the heat insulating board 30 is not particularly limited and may be, for example, rectangular, polygonal, circular, etc. The thickness T6 of the heat insulating board 30 in this embodiment may be, for example, 10 mm or more, and preferably 25 mm or more. The thickness T6 of the heat insulating board 30 may be 500 mm or less, and preferably 200 mm or less.

[0044] The heat insulating board 30 according to this embodiment can be used for, for example, electrical equipment such as refrigerators, freezers, warmers, coolers, and vending machines; containers such as warm-insulating containers, cold-insulating containers, transport containers, containers, and storage containers; vehicles such as cars, aircraft, and ships; buildings such as houses and warehouses; and building materials such as wall materials and floor materials.

[0045] Next, a method for manufacturing the insulation board surface material 10 and the insulation board 30 according to this embodiment will be described with reference to FIGS. 4(a) to 4(d).

[0046] First, as shown in FIG. 4(a), a laminate 10A including a metal layer 11 and a resin film 12 bonded to the metal layer 11 is prepared.

[0047] Next, as shown in FIG. 4(b), the laminate 10A is placed on a pressing die 41. At this time, the metal layer 11 side of the laminate 10A is placed on the pressing die 41. The pressing die 41 has an opening 42 at a position corresponding to the through hole 14. Next, a hot needle 43 (heated needle) is used to form the through hole 14 that penetrates the laminate 10A in the thickness direction. Thereafter, the hot needle 43 is removed from the laminate 10A, thereby forming the through hole 14 in the laminate 10A.

[0048] The hot needles 43 are pierced into the laminate 10A above the openings 42 of the pressing die 41, so that they can reliably penetrate the laminate 10A. Furthermore, by forming the through holes 14 using the hot needles 43, the heat of the hot needles 43 can reduce the contact resistance between the hot needles 43 and the resin film 12. Furthermore, by using the pressing die 41, the deformation range of the laminate 10A located around the through holes 14 by the hot needles 43 can be limited, and the removal resistance when removing the hot needles 43 can be reduced.

[0049] In this way, as shown in Figure 4(c), a surface material 10 for an insulating board is obtained, which includes the metal layer 11 and the resin film 12 and includes a plurality of through holes 14. In this surface material 10 for an insulating board, burrs 14a are formed around the edges of the through holes 14 due to the resistance when the hot needles 43 are removed. These burrs 14a are formed on the side where the hot needles 43 are removed from the resin film 12 (the upper side in Figure 4(b)), and rise toward the first surface 12a of the resin film 12.

[0050] Next, as shown in Figure 4(d), raw materials for foam insulation material 20 are dispensed onto the surface of insulation board facing material 10 facing the resin film 12, and the raw materials are foamed and cured to form the foam insulation material 20. The foam insulation material 20 is bonded to the resin film 12 by the self-adhesive strength of the foam insulation material 20 itself. Thereafter, the insulation board facing material 10 and the foam insulation material 20 are cut to a predetermined size to obtain an insulation board 30 having the insulation board facing material 10 and the foam insulation material 20 integrated with the insulation board facing material 10.

[0051] The burrs 14a formed on the periphery of the foam insulation material 20 may extend into the foam insulation material 20. A portion of the foam insulation material 20 may be embedded inside the through-hole 14 (see the phantom line in FIG. 4(d)). For convenience, the burrs 14a and the foam insulation material 20 embedded inside the through-hole 14 are omitted from FIGS. 2 and 3.

[0052] Thus, according to this embodiment, the through holes 14 are formed in the insulation board facing material 10 before the foam insulation material 20 is formed. This prevents a portion of the foam insulation material 20 from being destroyed when the through holes 14 are formed using, for example, the hot needles 43. In contrast, if the through holes 14 were formed after the foam insulation material 20 was formed, it would be difficult to use the holding die 41. As a result, the pressure of the hot needles 43 deforms the metal layer 11 and the resin film 12 over a wide area, and the through holes 14 are opened after the resin film 12 reaches its yield point. In this case, there is a risk that the structure of the foam insulation material 20 will be destroyed.

[0053] In addition, the present invention is not limited to the above, and for example, the raw materials of the foam insulation material 20 may be foamed and hardened to produce a block-shaped foam insulation material 20, and then the insulating board surface material 10 may be adhered to the foam insulation material 20.

[0054] Next, the operation of this embodiment having the above-described configuration will be described.

[0055] In the case of the above-described insulation board 30, when combustion occurs, gas generated by the combustion of the foam insulation material 20 may accumulate between the foam insulation material 20 and the insulation board facing material 10. If the amount of this gas is large, there is a concern that the insulation board 30 may swell.

[0056] In contrast, in the present embodiment, the insulating board facing material 10 is integrated with the foam insulating material 20, and has the function of allowing gases emitted from the foam insulating material 20 to pass through when the foam insulating material 20 and the insulating board facing material 10 are heated to a high temperature (a temperature of 150°C or higher). More specifically, the insulating board facing material 10 has a plurality of through holes 14 that penetrate the metal layer 11 and the resin film 12 in the thickness direction. This allows gases generated from the foam insulating material 20 during combustion to escape to the outside of the insulating board 30 through the through holes 14 in the metal layer 11.

[0057] That is, because through-holes 14 penetrate metal layer 11 and resin film 12 in the thickness direction, gas generated from foam insulation material 20 during combustion is released to the outside of insulation board 30 through through-holes 14. As a result, gas generated by combustion of foam insulation material 20 is prevented from accumulating between foam insulation material 20 and metal layer 11, and expansion of insulation board 30 can be suppressed.

[0058] In particular, if the thickness of the foam insulation material 20 is increased to further improve thermal insulation, there is a risk that the amount of gas generated from the foam insulation material 20 during combustion may increase. According to this embodiment, even in such a case, expansion of the insulation board 30 can be suppressed. Therefore, in the event of a very small fire, such as a small fire, expansion and deformation of the insulation board 30 can be suppressed, thereby suppressing peeling of the metal layer 11 and reducing deterioration of the heat ray reflectivity, moisture resistance, gas barrier properties, etc., of the metal layer 11. Furthermore, the occurrence of poor appearance can be suppressed, and replacement of the insulation board 30 can be made unnecessary.

[0059] The heat insulating board 30 according to this embodiment satisfies the requirements for obtaining non-combustible certification in the heat generation test conforming to ISO5660-1 2002. The cone calorimeter2 Specifically, this device heats a sample using a cone-shaped heater (heat source) at approximately 700°C, ignites it with a spark igniter, and burns it, measuring the oxygen concentration in the generated gas. The cone calorimeter can evaluate flammability by measuring the total heat release, maximum heat release rate, combustion time from ignition to extinction, and weight retention (weight percentage after the test relative to the weight before the test). Even when conducting such a heat release test using the insulation board 30 of this embodiment, gas generated during combustion of the foam insulation material 20 is generated between the foam insulation material 20 and the metal layer 11 of the insulation board facing material 10. If the amount of this gas is large, the insulation board 30 may expand. If the insulation board 30 expands and deforms during the heat release test, it may come into contact with the spark igniter, resulting in an undesirable evaluation or making measurement impossible. Therefore, even if the insulation board 30 is flame-retardant or non-combustible, its expansion during the heat release test may make measurement impossible, potentially preventing it from meeting the requirements for non-combustible certification.

[0060] In contrast, in this embodiment, gas generated from the foam insulation 20 during the heat generation test can be released to the outside of the insulation board 30 through the through holes 14. As a result, gas generated by combustion of the foam insulation 20 is prevented from accumulating between the foam insulation 20 and the metal layer 11 of the insulation board facing material 10, and expansion of the insulation board 30 can be suppressed. This makes it possible to avoid a situation where the expansion of the insulation board 30 during the heat generation test makes measurement impossible, and ensures that the heat generation test can be carried out reliably.

[0061] Furthermore, in this embodiment, the insulation board surface material 10 has a plurality of through holes 14 that penetrate the metal layer 11 and the resin film 12 in the thickness direction. This eliminates the need to provide a separate member, for example, to suppress expansion of the insulation board 30. This makes it possible to use existing members and a simple configuration to suppress expansion of the insulation board 30 due to gases generated from the foam insulation material 20 during combustion.

[0062] Furthermore, according to this embodiment, the diameter d1 of each through hole 14 is 0.2 mm or more and 0.8 mm or less. This allows gas generated from the foam insulation material 20 during combustion to escape to the outside of the insulation board 30 through the through holes 14. This also prevents the material of the foam insulation material 20 from leaking from the through holes 14 during manufacturing of the insulation board 30. Furthermore, the pitch P1 between the through holes 14 is 35 mm or more and 50 mm or less. This prevents heat from being easily transferred to the foam insulation material 20 during heat generation tests, preventing the insulation board 30 from failing to meet the required performance. This also allows gas generated from the foam insulation material 20 during combustion to escape to the outside of the insulation board 30 through the through holes 14 in the metal layer 11.

[0063] (Second embodiment) Next, a second embodiment will be described with reference to Figures 5 to 9. Figures 5 to 9 are diagrams showing the second embodiment. The second embodiment shown in Figures 5 to 9 differs mainly in that grooves 16 penetrating the resin film 12 are formed instead of the through holes 14, but other configurations are substantially the same as those of the first embodiment described above. In Figures 5 to 9, the same parts as those in the first embodiment shown in Figures 1 to 4 are designated by the same reference numerals, and detailed description thereof will be omitted.

[0064] As shown in Figures 5 and 6, the insulating board surface material 10 according to this embodiment includes a metal layer 11 and a resin film 12 bonded to the metal layer 11. The resin film 12 includes a plurality of grooves 16. Each of the plurality of grooves 16 penetrates the resin film 12 in the thickness direction. None of the plurality of grooves 16 is formed in the metal layer 11. Furthermore, each of the plurality of grooves 16 penetrates the adhesive layer 13 in the thickness direction, but this is not a limitation, and the adhesive layer 13 does not necessarily need to have any grooves 16 formed therein. The plurality of grooves 16 are arranged spaced apart from one another in the surface direction. The planar shape of each groove 16 is linear, but is not limited to this and may be, for example, a broken line, a curved line, a wavy line, or the like.

[0065] The length L1 of each groove 16 may be 1.0 mm or more, and preferably 5.0 mm or more. The length L1 of each groove 16 may be 30.0 mm or less, and preferably 20.0 mm or less. The length L1 of each groove 16 refers to the length measured along the longitudinal direction of each groove 16 from one longitudinal end of each groove 16 to the other longitudinal end of each groove 16.

[0066] The width W1 of each groove 16 may be 0.01 mm or more, and preferably 0.05 mm or more. The width W1 of each groove 16 may be 1.0 mm or less, and preferably 0.5 mm or less. The width W1 of each groove 16 refers to the length perpendicular to the longitudinal direction of each groove 16, and is the distance measured at the widest point.

[0067] The pitch P2 between the grooves 16 may be 0.1 mm or more, and preferably 0.5 mm or more. The pitch P2 between the grooves 16 may be 5.0 mm or less, and preferably 2.0 mm or less. The pitch P2 between the grooves 16 is the distance between adjacent grooves 16, and is the distance measured at the point where the grooves 16 are closest to each other.

[0068] As shown in Figure 5, the multiple grooves 16 are arranged parallel to one another in a plan view. The multiple grooves 16 are arranged in a portion of the insulation board surface material 10 (the central region in Figure 5), but not in other regions (the left and right regions in Figure 5). This allows gas generated by combustion of the foam insulation material 20 to escape from the desired portion when combustion occurs in the insulation board 30.

[0069] However, the grooves 16 may be arranged parallel to one another and at equal intervals across the entire area of ​​the insulation board surface material 10 (see FIG. 8(a)). The grooves 16 may also be arranged so that their centers are arranged in a lattice pattern (see FIG. 8(b)). Alternatively, the grooves 16 may be arranged so that their centers are arranged in a staggered pattern (see FIG. 8(c)).

[0070] As shown in Figure 6, the thickness T4 of the insulation board facing material 10 is 55 µm or less, and preferably 45 µm or less. By setting the thickness T4 of the insulation board facing material 10 to 55 µm or less, the rigidity of the insulation board facing material 10 is not excessively high, and in the event of combustion, the metal layer 11 can be easily broken by the pressure of gas generated by the combustion of the foam insulation material 20. This prevents gas generated by the combustion of the foam insulation material 20 from accumulating between the foam insulation material 20 and the insulation board facing material 10. There is no particular lower limit for the thickness T4 of the insulation board facing material 10, but it may be 6 µm or more, and preferably 15 µm or more.

[0071] In this embodiment, the thickness T1 of the metal layer 11 can be, for example, 1 μm or more, and preferably 5 μm or more. The thickness T1 of the metal layer 11 can be, for example, 20 μm or less, and preferably 10 μm or less. The thickness T3 of the resin film 12 can be, for example, 5 μm or more, and preferably 10 μm or more. The thickness T3 of the resin film 12 can be, for example, 50 μm or less, and preferably 40 μm or less.

[0072] In addition, the configurations of the metal layer 11, adhesive layer 13 and resin film 12 can be the same as those in the first embodiment.

[0073] The tensile strength of the insulation board facing material 10 according to this embodiment may be 20 N / 15 mm or more and 40 N / 15 mm or less. By setting the tensile strength of the insulation board facing material 10 within this range, the metal layer 11 can be easily broken by the pressure of gas generated by the combustion of the foam insulation material 20 in the event of combustion. This prevents gas generated by the combustion of the foam insulation material 20 from accumulating between the foam insulation material 20 and the insulation board facing material 10.

[0074] The puncture strength of the insulation board facing material 10 according to this embodiment may be 5.0 N / φ1 mm or more and 7.0 N / φ1 mm or less. By setting the puncture strength of the insulation board facing material 10 within this range, the metal layer 11 can be easily broken by the pressure of gas generated by the combustion of the foam insulation material 20 in the event of combustion. This prevents gas generated by the combustion of the foam insulation material 20 from accumulating between the foam insulation material 20 and the insulation board facing material 10.

[0075] Next, the configuration of the heat insulating board according to this embodiment will be described with reference to FIG.

[0076] As shown in Figure 7, the insulation board 30 of this embodiment comprises a foam insulation material 20 having a first surface 20a and a second surface 20b, and an insulation board facing material 10 arranged on at least the second surface 20b side of the foam insulation material 20. Of these, the insulation board facing material 10 is the same as that shown in Figures 5 and 6. The insulation board facing material 10 needs to be arranged on at least one of the first surface 20a and the second surface 20b of the insulation board 30, and may, for example, be arranged on both the first surface 20a and the second surface 20b of the insulation board 30.

[0077] In this embodiment, the insulation board 30 has the insulation board surface material 10 described above, so that the insulation board 30 can be prevented from expanding due to gas generated from the foam insulation material 20 during combustion.

[0078] In addition, the structure of the heat insulating board 30 can be the same as that of the first embodiment.

[0079] Next, a method for manufacturing the insulation board surface material 10 and the insulation board 30 according to this embodiment will be described with reference to FIGS. 9(a) to 9(c).

[0080] First, as shown in FIG. 9(a), a laminate 10A including a metal layer 11 and a resin film 12 bonded to the metal layer 11 is prepared.

[0081] Next, as shown in FIG. 9(b), grooves 16 are formed in the resin film 12 of the laminate 10A. On the other hand, the grooves 16 are not formed in the metal layer 11. The method for forming the grooves 16 in the resin film 12 is not particularly limited, and examples thereof include methods such as laser processing. The grooves 16 may be formed in the resin film 12 before laminating the metal layer 11 and the resin film 12, or may be formed in the resin film 12 after laminating the metal layer 11 and the resin film 12. Of these, it is preferable to form the grooves 16 in the resin film 12 after laminating the metal layer 11 and the resin film 12, because this is easy to process. In this manner, the insulation board surface material 10 is obtained.

[0082] Next, as shown in Figure 9(c), raw materials for the foam insulation material 20 are dispensed onto the surface of the insulation board facing material 10 facing the resin film 12, and the raw materials are foamed and cured to form the foam insulation material 20. The foam insulation material 20 is bonded to the resin film 12 by the self-adhesive strength of the foam insulation material 20 itself. The insulation board facing material 10 and the foam insulation material 20 are then cut to a predetermined size to obtain an insulation board 30 having the insulation board facing material 10 and the foam insulation material 20 integrated with the insulation board facing material 10.

[0083] Next, the operation of this embodiment having the above configuration will be described.

[0084] In the case of the above-described insulation board 30, when combustion occurs, gas generated by the combustion of the foam insulation material 20 may accumulate between the foam insulation material 20 and the insulation board facing material 10. If the amount of this gas is large, there is a concern that the insulation board 30 may swell.

[0085] In contrast, in the present embodiment, the insulation board facing material 10 is integrated with the foam insulation material 20, and has the function of allowing gas emitted from the foam insulation material 20 to pass through when the foam insulation material 20 and the insulation board facing material 10 are heated to a high temperature (a temperature of 150°C or higher). More specifically, the insulation board facing material 10 has multiple grooves 16 that penetrate the resin film 12 in the thickness direction. These multiple grooves 16 are not formed in the metal layer 11. As a result, gas generated from the foam insulation material 20 during combustion enters the grooves 16 and then presses the metal layer 11 outward. This gas pressure causes the metal layer 11 to break (see line Tr in Figure 7), allowing the gas to escape from the broken portion to the outside of the insulation board 30.

[0086] That is, because the grooves 16 penetrate the resin film 12 in the thickness direction, the gas generated from the foam insulation material 20 during combustion presses against the metal layer 11 from inside the grooves 16, rupturing the metal layer 11. This allows the gas generated from the foam insulation material 20 to escape to the outside of the insulation board 30. As a result, gas generated by combustion of the foam insulation material 20 is prevented from accumulating between the foam insulation material 20 and the insulation board facing material 10, and expansion of the insulation board 30 can be suppressed.

[0087] Furthermore, the heat insulating board 30 according to this embodiment satisfies the requirements for obtaining non-combustible certification in a heat generation test using a cone calorimeter in accordance with ISO5660-1 2002.

[0088] Furthermore, according to this embodiment, the thickness T4 of the insulation board facing material 10 is 55 μm or less, which prevents the insulation board facing material 10 from becoming excessively rigid, and allows the metal layer 11 to be smoothly broken by the gas generated from the foam insulation material 20 during combustion.

[0089] (Third embodiment) Next, a third embodiment will be described with reference to Figures 10 to 13. Figures 10 to 13 are views showing the third embodiment. The third embodiment shown in Figures 10 to 13 differs mainly in that the through-holes 14 and grooves 16 are not formed, but other configurations are substantially the same as the first and second embodiments described above. In Figures 10 to 13, parts that are the same as those in the first embodiment shown in Figures 1 to 4 and the second embodiment shown in Figures 5 to 9 are designated by the same reference numerals, and detailed description thereof will be omitted.

[0090] 10 and 11, the insulating board facing material 10 according to this embodiment includes a metal layer 11 and a resin film 12 bonded to the metal layer 11. In this embodiment, the insulating board facing material 10 does not have the above-described through holes 14 and grooves 16 formed therein.

[0091] The tensile strength of the insulation board facing material 10 according to this embodiment is 20 N / 15 mm or more, preferably 30 N / 15 mm or more. The tensile strength of the insulation board facing material 10 is 40 N / 15 mm or less, preferably 39 N / 15 mm or less. By setting the tensile strength of the insulation board facing material 10 within the above range, the metal layer 11 and the resin film 12 can be easily broken by the pressure of gas generated by combustion of the foam insulation material 20 in the event of combustion. This prevents gas generated by combustion of the foam insulation material 20 from accumulating between the foam insulation material 20 and the insulation board facing material 10.

[0092] The puncture strength of the insulation board facing material 10 according to this embodiment is 5 N / φ1 mm or more, preferably 5.5 N / φ1 mm or more. The puncture strength of the insulation board facing material 10 is 7 N / φ1 mm or less, preferably 6.5 N / φ1 mm or less. By setting the puncture strength of the insulation board facing material 10 within the above range, the metal layer 11 and the resin film 12 can be easily broken by the pressure of gas generated by the combustion of the foam insulation material 20 in the event of combustion. This prevents gas generated by the combustion of the foam insulation material 20 from accumulating between the foam insulation material 20 and the insulation board facing material 10.

[0093] In this embodiment, the thickness T4 of the insulation board facing material 10 is 50 μm or less, and preferably 40 μm or less. By setting the thickness T4 of the insulation board facing material 10 to 50 μm or less, the rigidity of the insulation board facing material 10 is not excessively high, and in the event of combustion, the metal layer 11 and the resin film 12 can be easily broken by the pressure of gas generated by combustion of the foam insulation material 20. This prevents gas generated by combustion of the foam insulation material 20 from accumulating between the foam insulation material 20 and the insulation board facing material 10. There is no particular lower limit for the thickness T4 of the insulation board facing material 10, but it may be 6 μm or more, and preferably 15 μm or more.

[0094] In this embodiment, the thickness T1 of the metal layer 11 can be, for example, 1 μm or more, and preferably 5 μm or more. The thickness T1 of the metal layer 11 can be, for example, 20 μm or less, and preferably 10 μm or less. The thickness T3 of the resin film 12 can be, for example, 5 μm or more, and preferably 10 μm or more. The thickness T3 of the resin film 12 can be, for example, 50 μm or less, and preferably 40 μm or less. By setting the thickness T1 of the metal layer 11 and the thickness T3 of the resin film 12 within the above ranges, the metal layer 11 and the resin film 12 can be easily ruptured by the pressure of gas generated by combustion of the foam insulation material 20 in the event of combustion. This prevents gas generated by combustion of the foam insulation material 20 from accumulating between the foam insulation material 20 and the insulation board surface material 10.

[0095] In addition, the configurations of the metal layer 11, adhesive layer 13 and resin film 12 can be the same as those in the first embodiment.

[0096] Next, the configuration of the heat insulating board according to this embodiment will be described with reference to FIG.

[0097] As shown in Figure 12, the insulation board 30 of this embodiment comprises a foam insulation material 20 having a first surface 20a and a second surface 20b, and an insulation board facing material 10 arranged on at least the second surface 20b side of the foam insulation material 20. Of these, the insulation board facing material 10 is the same as that shown in Figures 10 and 11. The insulation board facing material 10 needs to be arranged on at least one of the first surface 20a and the second surface 20b of the insulation board 30, and may, for example, be arranged on both the first surface 20a and the second surface 20b of the insulation board 30.

[0098] In this embodiment, the insulation board 30 has the insulation board surface material 10 described above, so that the insulation board 30 can be prevented from expanding due to gas generated from the foam insulation material 20 during combustion.

[0099] In addition, the structure of the heat insulating board 30 can be the same as that of the first embodiment.

[0100] Next, a method for manufacturing an insulating board 30 using the insulating board surface material 10 according to this embodiment will be described with reference to FIGS. 13(a) and 13(b).

[0101] First, as shown in FIG. 13(a), a surface material 10 for a heat insulating board, which includes a metal layer 11 and a resin film 12 adhered to the metal layer 11, is prepared.

[0102] Next, as shown in Figure 13(b), raw materials for foam insulation material 20 are dispensed onto the surface of the insulation board facing material 10 facing the resin film 12, and the raw materials are foamed and cured to form the foam insulation material 20. The foam insulation material 20 is bonded to the resin film 12 by the self-adhesive strength of the foam insulation material 20 itself. The insulation board facing material 10 and the foam insulation material 20 are then cut to a predetermined size to obtain an insulation board 30 having the insulation board facing material 10 and the foam insulation material 20 integrated with the insulation board facing material 10.

[0103] Next, the operation of this embodiment having the above-described configuration will be described.

[0104] In the case of the above-described insulation board 30, when combustion occurs, gas generated by the combustion of the foam insulation material 20 may accumulate between the foam insulation material 20 and the insulation board facing material 10. If the amount of this gas is large, there is a concern that the insulation board 30 may swell.

[0105] In contrast, in the present embodiment, the insulating board facing material 10 is integrated with the foam insulation material 20, and has the function of allowing gas emitted from the foam insulation material 20 to pass through when the foam insulation material 20 and the insulating board facing material 10 are heated to a high temperature (above 150°C). More specifically, the insulating board facing material 10 has a tensile strength of 20 N / 15 mm or more and 40 N / 15 mm or less, and a puncture strength of 5 N / φ1 mm or more and 7 N / φ1 mm or less. As a result, the insulating board facing material 10 breaks due to the pressure of the gas generated from the foam insulation material 20 during combustion (see line Tr in Figure 12), allowing the gas to escape from the broken part to the outside of the insulating board 30.

[0106] That is, because the tensile strength of the insulating board facing material 10 is 20 N / 15 mm or more and 40 N / 15 mm or less, and the puncture strength of the insulating board facing material 10 is 5 N / φ1 mm or more and 7 N / φ1 mm or less, gas generated from the foam insulation material 20 during combustion presses against the insulating board facing material 10, breaking it. This allows the gas generated from the foam insulation material 20 to escape to the outside of the insulating board 30. As a result, gas generated by combustion of the foam insulation material 20 is prevented from accumulating between the foam insulation material 20 and the insulating board facing material 10, and expansion of the insulating board 30 can be suppressed.

[0107] Furthermore, the heat insulating board 30 according to this embodiment satisfies the requirements for obtaining non-combustible certification in a heat generation test using a cone calorimeter in accordance with ISO5660-1 2002.

[0108] [Example] Next, a specific example of this embodiment will be described.

[0109] Example 1 A surface material for an insulating board having the configuration shown in Figures 1 and 2 was produced. In this case, a resin film made of a 12 μm-thick PET film and a metal layer made of a 6 μm-thick aluminum foil were bonded together using an adhesive by dry lamination. Next, a hot needle was used to form multiple through-holes with a diameter of 0.8 mm at a pitch of 35 mm to obtain a surface material for an insulating board. The multiple through-holes were arranged in a staggered pattern in plan view. Next, a foam insulating material was formed on the surface of the insulating board facing the resin film, thereby obtaining an insulating board having the configuration shown in Figure 3. At this time, the foam insulating material hardly leaked from the through-holes.

[0110] Example 2 A surface material for a heat insulating board and a heat insulating board were produced in the same manner as in Example 1, except that the diameter of the through holes was set to 0.4 mm.

[0111] Example 3 A surface material for a heat insulating board and a heat insulating board were produced in the same manner as in Example 1, except that the diameter of the through holes was set to 0.6 mm.

[0112] Example 4 A surface material for a heat insulating board and a heat insulating board were produced in the same manner as in Example 1, except that a nylon film having a thickness of 15 μm was used as the resin film and the diameter of the through holes was set to 0.4 mm.

[0113] Example 5 An insulation board surface material with the configuration shown in Figures 5 and 6 was produced. In this case, a resin film made of PET film with a thickness of 12 μm and a metal layer made of aluminum foil with a thickness of 6 μm were dry laminated using an adhesive. Next, multiple 10.0 mm long grooves were formed in the resin film with a pitch of 1.0 mm using a laser processing method, resulting in an insulation board surface material. Next, a foam insulation material was formed on the surface of the insulation board surface material facing the resin film, resulting in an insulation board with the configuration shown in Figure 7.

[0114] Example 6 A surface material for a heat insulating board and a heat insulating board were produced in the same manner as in Example 5, except that a PET film having a thickness of 38 μm was used as the resin film.

[0115] Example 7 An insulation board surface material having the structure shown in Figures 10 and 11 was produced. In this case, a resin film (PET film) with a thickness of 12 μm and a metal layer (aluminum foil with a thickness of 6 μm) were dry laminated together using an adhesive to obtain the insulation board surface material. Next, a foam insulation material was formed on the surface of the insulation board surface material facing the resin film, thereby obtaining an insulation board with the structure shown in Figure 12.

[0116] Example 8 A surface material for a heat insulating board and a heat insulating board were produced in the same manner as in Example 7, except that an aluminum foil having a thickness of 9 μm was used as the metal layer.

[0117] Example 9 A surface material for a heat insulating board and a heat insulating board were produced in the same manner as in Example 7, except that an aluminum foil having a thickness of 12 μm was used as the metal layer.

[0118] (Comparative Example 1) A 50 μm thick polyethylene resin film and a 20 μm thick aluminum foil metal layer were dry laminated together using an adhesive to obtain a surface material for an insulating board. No through holes or grooves were formed in this surface material for an insulating board. Next, a foam insulating material was formed on the surface of the insulating board surface material facing the resin film to obtain an insulating board.

[0119] (Comparative Example 2) Instead of resin film, 120 g / m 2 A surface material for a heat insulating board and a heat insulating board were produced in the same manner as in Comparative Example 1, except that kraft paper of the above type was used.

[0120] (Comparative Example 3) A surface material for a heat insulating board and a heat insulating board were produced in the same manner as in Comparative Example 1, except that a 12 μm thick PET film was used as the resin film and a 35 μm thick aluminum foil was used as the metal layer.

[0121] Comparative Example 4 A surface material for a heat insulating board and a heat insulating board were produced in the same manner as in Comparative Example 1, except that a 12 μm thick PET film was used as the resin film and a 40 μm thick aluminum foil was used as the metal layer.

[0122] (Comparative Example 5) A surface material for a heat insulating board and a heat insulating board were produced in the same manner as in Comparative Example 1, except that a 50 μm thick PET film was used as the resin film and a 6 μm thick aluminum foil was used as the metal layer.

[0123] (Comparative Example 6) A surface material for a heat insulating board and a heat insulating board were produced in the same manner as in Example 5, except that a PET film having a thickness of 50 μm was used as the resin film.

[0124] [evaluation] (tensile strength) The tensile strength of the insulation board surface material was measured in both the resin flow direction (MD) and the perpendicular direction (TD) of the resin film. The tensile strength was determined in accordance with JIS K 7161-1:2014. The pulling speed was 300 mm / min. The measuring device used was an Instron 5565 (manufactured by Instron Japan).

[0125] (Puncture strength) The puncture strength of the surface material for insulation boards was measured. The puncture strength was determined in accordance with JIS Z 1707 General Rules for Food Packaging Plastic Films, 7.4, Puncture Strength Test. Specifically, the test piece was fixed in place and a semicircular needle with a diameter of 1.0 mm and a tip radius of 0.5 mm was pierced into the center at a speed of 50±5 mm per minute, and the maximum stress until the needle penetrated was measured to obtain the puncture strength of the surface material. The measurement device used was a Tensilon universal material testing machine, RTF series / RTG series.

[0126] (Cone calorimeter test) The heat-generating test for the heat insulating board was carried out using a cone calorimeter in accordance with ISO5660-1 2002, and the results were judged according to the following criteria: The device used for the heat-generating test was a cone calorimeter C-3 manufactured by Toyo Seiki Seisakusho.

[0127] (Judgment criteria) (1) Total calorific value is 8MJ / m 2 Is less than or equal to (2) There are no cracks or holes that penetrate to the back surface and are harmful to fire safety. (3) The heat generation rate is 200 kW / m for 10 seconds or more. 2 Not to exceed If all of the above (1)-(3) were satisfied for 5 minutes after the start of heating, the sample was judged as "flame retardant." If all of the above (1)-(3) were satisfied for 10 minutes after the start of heating, the sample was judged as "semi-nonflammable." If all of the above (1)-(3) were satisfied for 20 minutes after the start of heating, the sample was judged as "nonflammable." The results are shown in Tables 1 and 2 below.

[0128] [Table 1]

[0129] [Table 2]

[0130] As shown in Tables 1 and 2, the insulating boards of Examples 1-9 did not experience expansion of the insulating board surface material due to gas from the foam insulation. The insulating board of Comparative Example 1 had its metal layer expand during the cone calorimeter test and come into contact with the sensor, so the test was discontinued. The insulating board of Comparative Example 2-6 had its insulating board surface material expand due to gas from the foam insulation. Furthermore, the insulating board of Comparative Example 2-6 was not judged to be "non-combustible" in the cone calorimeter test.

[0131] It is also possible to combine the multiple components disclosed in the above-described embodiments and modifications as needed, or to delete some of the components disclosed in the above-described embodiments and modifications. [Explanation of symbols]

[0132] 10. Surface material for insulation boards 11 Metal layer 12 Resin film 13 Adhesive layer 14 Through holes 16 groove 20. Foam insulation 30 Insulation board

Claims

1. A surface material for an insulation board, a metal layer; a resin film adhered to the metal layer, The insulation board is made of a foam insulation material and has a function of allowing gas emitted from the foam insulation material to pass through when the foam insulation material and the insulation board surface material are heated to a temperature of 150°C or higher. The surface material for heat insulating board has a tensile strength of 20N / 15mm or more and 40N / 15mm or less, and a puncture strength of 5N / φ1mm or more and 7N / φ1mm or less.

2. 2. The surface material for an insulating board according to claim 1, wherein the surface material has a plurality of through holes that penetrate the metal layer and the resin film in the thickness direction, the diameter of each through hole being 0.2 mm or more and 0.8 mm or less, the pitch between the respective through holes being 35 mm or more and 50 mm or less, and the puncture strength of the surface material for an insulating board in the part where no through holes are present is 10 N / φ1 mm or less.

3. 2. The surface material for an insulating board according to claim 1, wherein the surface material for an insulating board has a thickness of 55 μm or less, and the surface material for an insulating board has a plurality of grooves penetrating the resin film in the thickness direction, and each groove is not formed in the metal layer.

4. 4. The surface material for an insulating board according to claim 1, wherein the surface of the resin film that comes into contact with the foam insulating material has a wettability of 40 dyn or more.

5. A surface material for an insulating board according to any one of claims 1 to 4, and a foam insulation material integrated with the insulation board surface material, The foam insulation material is a foam containing polyisocyanurate as a main component, An insulating board that is non-flammable according to the ISO5660-1 2002 test method.

Images