Additional processing device, information processing device, additional processing method, and additional processing program

Abstract

We provide technology to improve the accuracy of layered processing using the DED (Directed Energy Deposition) method compared to conventional methods. [Solution] The additive machining device includes a control device, a laser head capable of additively machining the workpiece by supplying powder material to the workpiece and irradiating the workpiece with laser light, and a drive unit for driving the laser head. The control device controls the drive unit and the laser head to perform additive machining of the workpiece and, during at least a portion of the additive machining, to clean at least a portion of the powder material remaining on the workpiece.

Description

[Technical Field]

[0001] The present disclosure relates to an additive processing device, an information processing device, an additive processing method, and an additive processing program. [Background technology]

[0002] Japanese Patent Application Laid-Open Publication No. 2024-075483 (Patent Document 1) discloses an additive processing device that performs layer processing using a DED (Directed Energy Deposition) method. The DED additive processing device has a laser head. The laser head moves relative to the workpiece while ejecting powder material onto the workpiece and irradiating the workpiece with laser light. This melts the portion of the workpiece irradiated with the laser light. The powder material is supplied to the melted portion, where it melts and solidifies, and is then layered on the workpiece. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2024-075483 Summary of the Invention [Problem to be solved by the invention]

[0004] Some of the powder material dispensed onto the workpiece remains unmelted. When the powder material accumulates on the workpiece, it blocks the laser light during the subsequent layering process. As a result, the layers do not build up in the intended shape, reducing the accuracy of the layering process.

[0005] In view of the above, there is a need for a technology that can improve the accuracy of the DED lamination process compared to conventional methods. [Means for solving the problem]

[0006] In one example embodiment of the present disclosure, there is provided an additive machining apparatus including a control device, a laser head capable of performing additive machining of a workpiece by supplying powder material to the workpiece and irradiating the workpiece with laser light, and a drive unit for driving the laser head, and the control device controls the drive unit and the laser head to perform a process of additively machining the workpiece and a process of cleaning at least a portion of the powder material remaining on the workpiece during at least a portion of the execution of the additive machining process.

[0007] In one example of the present disclosure, the additive processing apparatus further includes a gas supply source for supplying compressed gas, and the cleaning process includes a process of discharging the compressed gas onto the workpiece.

[0008] In one example of the present disclosure, the cleaning process includes a process of discharging the compressed gas along a valley portion formed in the workpiece.

[0009] In one example of the present disclosure, the additive processing device further includes a spindle and a tool changer for selectively mounting one of a plurality of processing tools to the spindle, the plurality of processing tools including the laser head and a gas discharge tool for discharging the compressed gas.

[0010] In one example of the present disclosure, the gas discharge tool is a cutting tool having a first fluid passage formed therein, the spindle has a second passage connected to the first passage when the cutting tool is attached, and the gas supply is configured to deliver compressed gas to the first passage and the second passage.

[0011] In one example of the present disclosure, the control device starts the cleaning process based on the completion of lamination processing of a specified layer, and finishes the cleaning process before lamination processing of the next layer of the specified layer is started.

[0012] In one example of the present disclosure, the control device executes the cleaning process every time a predetermined number of layers have been stacked.

[0013] Another example of the present disclosure provides an information processing device capable of generating an additive machining program for a workpiece in an additive machining apparatus. The additive machining apparatus includes a laser head capable of supplying powder material to a workpiece and irradiating the workpiece with laser light to perform additive machining of the workpiece. The information processing device includes a control device. The control device executes a process of displaying a design screen for a drive path indicating a trajectory of an irradiation point of the laser light, and a process of generating an additive machining program including the drive path. The design screen is configured to accept settings for a drive path indicating a trajectory of a discharge point of compressed gas for a gas discharge tool capable of discharging compressed gas onto the workpiece.

[0014] In one example of the present disclosure, the control device further executes a process of acquiring a three-dimensional model representing a three-dimensional shape of a workpiece to be laminated, and the design screen is configured to accept designation of a location for a layer model obtained by dividing the three-dimensional model of the workpiece into layers. Based on the acceptance of the designation of a location for the displayed layer model, the control device executes a process of superimposing and displaying a valley portion connected to the location as a candidate for the drive path on the layer model.

[0015] In another example of the present disclosure, a method for additive processing of a workpiece performed by an additive processing device includes a step of additively processing the workpiece by a laser head supplying powder material to the workpiece and irradiating the workpiece with laser light, and a step of cleaning at least a portion of the powder material remaining on the workpiece during at least a portion of the additive processing step.

[0016] In another example of the present disclosure, there is provided an additive processing program executed by an additive processing apparatus. The additive processing apparatus includes a laser head capable of performing additive processing of a workpiece by supplying powder material to the workpiece and irradiating the workpiece with laser light, and a drive unit for driving the laser head. The additive processing program causes the additive processing apparatus to control the drive unit and the laser head to perform a process of additively processing a workpiece and a process of cleaning at least a portion of the powder material remaining on the workpiece during at least a portion of the execution of the additive processing.

[0017] The above and other objects, features, aspects and advantages of the present invention will become apparent from the following detailed description of the invention taken in conjunction with the accompanying drawings. [Brief explanation of the drawings]

[0018] [Figure 1] FIG. 1 is a diagram illustrating an example of a device configuration of an additional processing system. [Figure 2] FIG. 2 is a diagram illustrating an example of a device configuration of an additional processing device. [Figure 3] 1 shows a cross-sectional view of the laser head during additive processing. [Figure 4] 10A and 10B are diagrams showing the workpiece stacking process from a top view. [Figure 5] 5 is a cross-sectional view of the work taken along line VV in FIG. 4, showing a laminating process of the work. [Figure 6] 10A and 10B are diagrams showing the workpiece stacking process from a top view. [Figure 7] 7 is a cross-sectional view of the work taken along line VII-V in FIG. 6, showing a laminating process of the work. [Figure 8] FIG. 10 is a diagram illustrating an example of a design screen in a development tool. [Figure 9] FIG. 10 is a diagram for explaining a support function relating to setting of a driving path. [Figure 10] FIG. 2 is a diagram showing a coolant supply mechanism. [Figure 11]It is a schematic diagram showing an example of the hardware configuration of an information processing apparatus. [Figure 12] It is a diagram showing an example of a drive mechanism of an additional processing apparatus. [Figure 13] It is a flowchart showing the flow of an additional processing.

Mode for Carrying Out the Invention

[0019] Hereinafter, each embodiment according to the present invention will be described with reference to the drawings. In the following description, the same parts and components are denoted by the same reference numerals. Their names and functions are also the same. Therefore, detailed descriptions thereof will not be repeated. In addition, each embodiment and each modification described below may be selectively combined as appropriate.

[0020] <A. Additional Processing System 10> First, referring to FIG. 1, the apparatus configuration of the additional processing system 10 will be described. FIG. 1 is a diagram showing an example of the apparatus configuration of the additional processing system 10.

[0021] The additional processing system 10 includes one or more information processing apparatuses 100 and one or more additional processing apparatuses 200. In the example of FIG. 1, the additional processing system 10 is composed of one information processing apparatus 100 and one additional processing apparatus 200.

[0022] The information processing apparatus 100 is, for example, a desktop PC (Personal Computer), a notebook PC, a tablet terminal, or other computer having a communication function. The information processing apparatus 100 is configured to be communicable with the additional processing apparatus 200 via a network (for example, the Internet).

[0023] The additional processing apparatus 200 is a processing machine capable of performing additional processing (AM (Additive manufacturing) processing) of a workpiece. The additional processing apparatus 200 performs additional processing by supplying a powder material to the workpiece and irradiating the workpiece with a laser beam.

[0024] Note that the additive processing device 200 may be a processing machine capable of not only additive processing of a workpiece but also subtractive processing (SM (Subtractive manufacturing)) of the workpiece. Examples of the subtractive processing function include a milling function and a turning function.

[0025] The information processing device 100 includes a development tool for creating an additive processing program 222 in the additive processing device 200. The additive processing program 222 created by the development tool is transmitted to the additive processing device 200 via a network. The additive processing device 200 stores the additive processing program 222 in a storage device within the device itself. The additive processing device 200 executes layer processing of the workpiece according to the additive processing program 222 based on receiving an execution command for additive processing.

[0026] <B. Additive Processing Device 200> Next, referring to FIG. 2, the device configuration of the additive processing device 200 will be described. FIG. 2 is a diagram showing an example of the device configuration of the additive processing device 200.

[0027] The additive processing device 200 is, for example, a processing machine capable of both additive processing of a workpiece and subtractive processing of the workpiece. The subtractive processing function possessed by the additive processing device 200 includes, for example, at least one of a milling function and a turning function using a fixed tool. Note that the additive processing device 200 may be a device without a subtractive processing function.

[0028] The additive processing device 200 includes a machine bed 211. A swivel table 212 is provided on the machine bed 211. The swivel table 212 has a rotating table 213. The rotating table 213 is rotatably attached to the swivel table 212.

[0029] A holding mechanism 213A is clamped on the rotating table 213. The holding mechanism 213A is a fixing mechanism for holding the workpiece W to be processed. As an example, the holding mechanism 213A is a chuck.

[0030] The additional processing device 200 has, for example, two axes (a swivel axis and a rotation axis) that can be controlled regarding the rotation of the holding mechanism 213A clamped on the rotary table 213. The swivel axis is an axis parallel to the upper surface of the machine bed 211. The rotation axis is an axis perpendicular to the upper surface of the rotary table 212. The rotary table 213 is configured to be rotatable around the swivel axis and the rotation axis.

[0031] The additional processing device 200 also has a first slide mechanism 214. The first slide mechanism 214 is disposed on a machine column on the rear side of the machine bed 211. The first slide mechanism 214 is configured to be movable along a slide guide attached to the machine column.

[0032] The additional processing device 200 also has a second slide mechanism 215. The second slide mechanism 215 is configured to be movable along a slide guide attached to the first slide mechanism 214. The slide guide for the second slide mechanism 215 is provided on the first slide mechanism 214 so as to be perpendicular to the slide guide for the first slide mechanism 214. As a result, the second slide mechanism 215 is configured to be movable in a direction perpendicular to the movement direction of the first slide mechanism 214.

[0033] The additional processing device 200 also has a removal processing head 216. The removal processing head 216 is configured to be movable along a slide guide attached to the second slide mechanism 215. The slide guide for the removal processing head 216 is provided on the second slide mechanism 215 so as to be perpendicular to both the slide guide for the first slide mechanism 214 and the slide guide for the second slide mechanism 215. As a result, the removal processing head 216 is configured to be movable in a direction perpendicular to both the movement direction of the first slide mechanism 214 and the movement direction of the second slide mechanism 215.

[0034] The additional processing device 200 drives the removal processing head 216 to any position by controlling the driving of the first slide mechanism 214, the driving of the second slide mechanism 215, and the driving of the removal processing head 216. Each of the first slide mechanism 214, the second slide mechanism 215, and the removal processing head 216 is driven by, for example, a servo motor or the like.

[0035] The additive machining device 200 also has a magazine 218 that stores various units such as a tool 218A, and an automatic tool changer (ATC) 219. When not in use, the tool 218A is stored in the magazine 218. Upon receiving a tool change instruction, the automatic tool changer 219 pulls out the unit to be attached from the magazine 218 and attaches the unit to a spindle 224 provided in the removal machining head 216.

[0036] The additive processing device 200 further includes a laser head 231 for performing additive processing by the DED method. The laser head 231 supplies powder material to the workpiece W during additive processing, and irradiates the workpiece surface with laser light. The powder material may be metal powder, resin powder, or any other type of powder that can be melted by laser light.

[0037] The laser head 231 has a head body 232 and a laser nozzle 236. Powder material is supplied to the head body 232 via a cable CB. The laser nozzle 236 irradiates the workpiece with laser light and determines the irradiation area of ​​the workpiece with the laser light. The powder material supplied to the laser head 231 is ejected toward the workpiece W through the laser nozzle 236.

[0038] The laser head 231 is provided on the third slide mechanism 234. The third slide mechanism 234 is provided on the slide guide 233. Thereby, the third slide mechanism 234 is configured to be movable along the slide guide 233. During additive processing, the laser head 231 is driven to be positioned below the main shaft 224 and is attached to the main shaft 224. The laser head 231 attached to the main shaft 224 is driven to an arbitrary position in conjunction with the removal processing head 216.

[0039] <C. Mode of Additive Processing> Next, referring to FIG. 3, the mode of additive processing by the additive processing apparatus 200 will be described. FIG. 3 shows a cross-sectional view of the laser head 231 during additive processing.

[0040] The laser head 231 irradiates the surface of the workpiece W with the laser beam LS while moving on the workpiece W. As a result, the workpiece W melts at the irradiated portion of the laser beam LS, and a molten pool MP is formed on the surface of the workpiece W.

[0041] In parallel, the laser head 231 supplies the powder material PM to the molten pool MP. The powder material PM is guided to the molten pool MP by the gas GS discharged from the laser head 231. As a result, the powder material PM melts and liquefies in the molten pool MP. Thereafter, the molten pool MP solidifies, and a layer SL is formed on the workpiece W. The gas GS also functions as a shielding gas and prevents oxidation of the workpiece W, which is a laminate.

[0042] The additive processing apparatus 200 can shape workpieces W of various shapes by controlling the laser head 231 according to the above-described additive processing program 222 (see FIG. 1). Examples of the types of additive processing include laminating processing and coating processing. Laminating processing is a process of stacking layers SL on the workpiece W. Coating processing is a process of covering the surface of the workpiece W with the layer SL.

[0043] <D. Overview> During the layer processing, a part of the powder material PM ejected onto the workpiece W remains on the workpiece W without being melted by the laser beam LS. When the powder material PM accumulates on the workpiece W, the laser beam LS is blocked by the powder material PM during subsequent additional processing. As a result, the layers do not stack up in the intended shape, and the accuracy of the layer processing decreases.

[0044] Therefore, the additive processing apparatus 200 according to the embodiment executes a process of cleaning at least a part of the powder material PM remaining on the workpiece W during at least a part of the layer processing of the workpiece W. Thereby, the additive processing apparatus 200 can remove the powder material PM remaining on the workpiece W and can shape the workpiece W as specified in the additive processing program 222. As a result, the accuracy of the layer processing by the DED method can be improved more than before.

[0045] The cleaning process of the powder material PM also has the following advantages. Currently, the powder material PM remaining on the workpiece W is removed manually. Especially when the shape of the workpiece W is complex, the powder material PM tends to remain in concave portions and the like. Therefore, the removal of the powder material PM by manual work needs to be performed more frequently as the shape of the workpiece W becomes more complex. In order to remove the powder material PM manually, it is necessary to stop the additive processing each time. The additive processing apparatus 200 according to the embodiment executes the cleaning process during the layer processing, so there is no need to stop the additive processing. As a result, the time required for the layer processing of the workpiece W is significantly shortened.

[0046] <E. Driving mode of the main shaft 224> Next, referring to FIGS. 4 and 5, the driving mode of the main shaft 224 during the additive processing will be described. FIG. 4 is a top view showing the layer processing step of the workpiece W. FIG. 5 is a cross-sectional view of the workpiece W along the line V-V in FIG. 4, showing the layer processing step of the workpiece W. In the examples of FIGS. 4 and 5, the layer processing step of the workpiece W having the concave portion DP is shown.

[0047] Hereinafter, the direction of gravity will also be referred to as the "Z-axis direction." A direction on a horizontal plane perpendicular to the Z-axis direction will also be referred to as the "X-axis direction." A direction perpendicular to both the X-axis and Z-axis directions will be referred to as the "Y-axis direction."

[0048] In step S11, the additional processing device 200 mounts the laser head 231 on the spindle 224. Thereafter, the additional processing device 200 controls the drive units 330A, 300B (see FIG. 12) of the spindle 224 and the laser head 231 to form the layer SL2 of the workpiece W on the layer SL1.

[0049] In step S12, the additive processing device 200, with the laser head 231 attached to the spindle 224, forms a layer SL3 of the workpiece W on the layer SL2. The layer SL3 is a layer having a hollow shape. By forming the hollow layer SL3 on the layer SL2, a recess DP is formed in the workpiece W.

[0050] As described above, part of the powder material PM discharged onto the workpiece W during the lamination process is not melted by the laser light LS and remains on the workpiece W. In particular, the powder material PM is likely to remain in valley portions such as the recesses DP.

[0051] Next, in step S13, the additional processing device 200 removes the laser head 231 from the spindle 224 and attaches the gas discharge tool 241 to the spindle 224. The gas discharge tool 241 is stored in, for example, the above-mentioned magazine 218 (see FIG. 2). The gas discharge tool 241 and the laser head 231 are exchanged by the above-mentioned automatic tool changer 219.

[0052] The additive processing device 200 controls the gas discharge tool 241 to discharge a compressed gas AI to the powder material PM remaining on the workpiece W. The compressed gas AI is supplied from a gas supply source 264 (see FIG. 10 ), which will be described later. The compressed gas AI is, for example, a gas such as nitrogen or air. As the compressed gas AI is discharged, the powder material PM remaining on the workpiece W without being melted is blown away by the compressed gas AI.

[0053] Preferably, the additive processing device 200 discharges the compressed gas AI along valley portions formed in the workpiece W. A "valley portion" refers to a location where the powder material PM is more likely to accumulate than on a flat surface. As an example, the valley portion includes corner portions such as edge portions and rounded corner portions, and curved surface portions with depressions. Furthermore, "discharging the compressed gas AI along the valley portion" includes not only a mode in which the compressed gas AI is directly discharged onto the valley portion, but also a mode in which the compressed gas AI is indirectly discharged onto the valley portion from the wall surface connected to the valley portion by discharging the compressed gas AI onto the wall surface.

[0054] If the compressed gas AI is discharged to the center of the recess DP, the powder material PM may move to the edge of the recess DP and remain there. On the other hand, if the compressed gas AI is discharged to the valley part of the workpiece W, the powder material PM can be effectively scattered.

[0055] Next, in step S14, the additional processing device 200 removes the gas discharge tool 241 from the main shaft 224 and attaches the laser head 231 to the main shaft 224. Thereafter, the additional processing device 200 controls the drive units 330A and 330B (see FIG. 12) of the main shaft 224 and the laser head 231 to form a layer SL4 of the workpiece W.

[0056] As described above, the additive processing device 200 performs the cleaning process of the powder material PM during at least a part of the lamination process. As a result, the additive processing device 200 cleans the powder material PM that remains on the workpiece W without being melted.

[0057] The timing of the cleaning process is arbitrary. As an example, the additive processing device 200 starts the cleaning process of the powder material PM based on the completion of the lamination process of a predetermined layer, and finishes the cleaning process before the lamination process of the next layer of the predetermined layer is started.

[0058] Preferably, the additive processing device 200 performs the cleaning process each time the lamination processing of a predetermined number of layers is completed. The predetermined number is an integer greater than or equal to 1. If the predetermined number is 1, the additive processing device 200 performs the cleaning process after each lamination of one layer. If the predetermined number is 2, the additive processing device 200 performs the cleaning process after each lamination of two layers. This allows the additive processing device 200 to proceed with additive processing without being affected by the powder material PM remaining on the workpiece W. As a result, the accuracy of the lamination processing is further improved.

[0059] Although the above description has been given of an example in which a workpiece W having a recess DP is subjected to layer processing, the shape of the workpiece W for which cleaning of the powder material PM is effective is not limited to this. In other aspects, there are cases in which layer processing is performed on a base material having various valley portions such as steps, grooves, and curved surfaces. An example of such a case will be described with reference to FIGS. 6 and 7.

[0060] Fig. 6 is a diagram showing the lamination process for the base material PA from a top view. Fig. 7 is a diagram showing the lamination process for the workpiece W in a cross-sectional view of the workpiece W along line VII-VII in Fig. 6. The examples of Figs. 6 and 7 show the lamination process for the workpiece W having a step portion SP. The step portion SP is an example of a valley portion.

[0061] In step S21, the additional processing device 200 mounts the laser head 231 on the spindle 224. Thereafter, with the laser head 231 mounted on the spindle 224, the additional processing device 200 forms a layer SL11 on the base material PA.

[0062] As described above, part of the powder material PM discharged onto the workpiece W during the lamination process is not melted by the laser light LS and remains on the workpiece W. In particular, the powder material PM is likely to remain in valley portions such as step portions SP.

[0063] Next, in step S22, the additional processing device 200 removes the laser head 231 from the spindle 224 and attaches the gas discharge tool 241 to the spindle 224. The gas discharge tool 241 is stored, for example, in the above-mentioned magazine 218 (see FIG. 2). The gas discharge tool 241 and the laser head 231 are exchanged by the above-mentioned automatic tool changer 219.

[0064] Thereafter, the additional processing device 200 controls the gas discharge tool 241 to discharge the compressed gas AI toward the powder material PM remaining on the workpiece W. The compressed gas AI is supplied from a gas supply source 264 (see FIG. 10 ), which will be described later. Preferably, the additional processing device 200 discharges the compressed gas AI along the step portion SP of the workpiece W. As a result, the powder material PM remaining on the workpiece W without being melted is blown away by the compressed gas AI.

[0065] Next, in step S23, the additional processing device 200 removes the gas discharge tool 241 from the main shaft 224 and attaches the laser head 231 to the main shaft 224. Thereafter, the additional processing device 200 controls the drive units 330A and 330B (see FIG. 12) of the main shaft 224 and the laser head 231 to form a layer SL12 on the base material PA. The layer SL12 is formed, for example, at a location different from the layer SL11.

[0066] Next, in step S24, the additional processing device 200 removes the laser head 231 from the spindle 224 and attaches the gas discharge tool 241 to the spindle 224. The gas discharge tool 241 is stored, for example, in the above-mentioned magazine 218 (see FIG. 2). The gas discharge tool 241 and the laser head 231 are exchanged by the above-mentioned automatic tool changer 219.

[0067] Thereafter, the additional processing device 200 controls the gas discharge tool 241 to discharge the compressed gas AI toward the powder material PM remaining on the workpiece W. The compressed gas AI is supplied from a gas supply source 264 (see FIG. 10 ), which will be described later. Preferably, the additional processing device 200 discharges the compressed gas AI along the step portion SP of the workpiece W. As a result, the powder material PM remaining on the workpiece W without being melted is blown away by the compressed gas AI.

[0068] As described above, the additive processing device 200 performs the cleaning process of the powder material PM during at least a part of the lamination process. As a result, the additive processing device 200 cleans the powder material PM that remains on the workpiece W without being melted.

[0069] In the above description, an example has been described in which the cleaning process of the workpiece W is achieved by discharging the compressed gas AI onto the workpiece W, but the means for cleaning the workpiece W is not limited to this. As an example, the additional processing device 200 may tilt the swivel table 212 to drop the powder material PM remaining on the workpiece W. In this case, the additional processing device 200 controls the tilt angle formed by the swivel table 212 and the horizontal plane to a predetermined angle or more (for example, 45 degrees or more) when cleaning the powder material PM.

[0070] Furthermore, in the above description, an example has been described in which the laser head 231 is attached to the spindle 224 during lamination processing, but the laser head 231 does not necessarily have to be attached to the spindle 224. In other words, the additional processing device 200 does not necessarily have to include the spindle 224. In this case, the additional processing device 200 does not indirectly drive the laser head 231 via the spindle 224, but rather drives the laser head 231 directly.

[0071] Furthermore, in the above description, an example has been described in which the gas discharge tool 241 is attached to the spindle 224 during cleaning, but the gas discharge tool 241 does not necessarily have to be attached to the spindle 224. In other words, the additional processing device 200 does not necessarily have to include the spindle 224.

[0072] As an example, a gas ejection tool 241 may be provided in the processing chamber inside the additional processing apparatus 200. In this case, the gas ejection tool 241 may be configured to be drivable, or may be fixed to the wall surface or ceiling of the processing area. When the gas ejection tool 241 is fixed, the gas ejection port is configured to face in an arbitrary direction, and during cleaning, the ejection port is directed toward the powder material PM remaining on the workpiece W.

[0073] As another example, the gas ejection tool 241 may be provided outside the additional processing apparatus 200. In this case, the gas ejection tool 241 is provided, for example, on an autonomous mobile robot. The robot controls the gas ejection tool 241 to eject gas from the outside of the additional processing apparatus 200 toward the processing area during cleaning. Thereby, the powder material PM remaining on the workpiece W is removed.

[0074] <F. Development tool> Next, referring to FIGS. 8 and 9, a development tool for the additional processing program 222 will be described. FIG. 8 is a diagram showing an example of a design screen 30 in the development tool.

[0075] Examples of the development tool for the additional processing program 222 include, for example, CAM (Computer Aided Manufacturing). CAM is a tool for generating the additional processing program 222 required for processing by the additional processing apparatus 200 based on a three-dimensional model created by CAD (Computer-Aided Design).

[0076] The development tool generates a drive path for the spindle 224 based on a three-dimensional model 124 (see FIG. 11 ) described below that defines the shape of the workpiece W to be laminated. Note that the tools (e.g., laser head 231 and gas discharge tool 241) attached to the spindle 224 are interlocked with the spindle 224, and therefore the drive path of the spindle 224 is synonymous with the drive paths for various tools such as the laser head 231 and gas discharge tool 241. Examples of the drive path include the trajectory of the tip of the tool attached to the spindle 224, the trajectory of the irradiation point of the laser light irradiated from the laser head 231, and the trajectory of the discharge point of the gas discharged from the gas discharge tool 241.

[0077] The information processing device 100 divides the three-dimensional model 124 into layers based on reading the three-dimensional model 124 of the workpiece W. The design screen 30 accepts settings of the drive path of the spindle 224 for each of the divided layers.

[0078] More specifically, the design screen 30 has a display area 31 and a display area 35. The display area 31 is an area that accepts the setting of layer information of the workpiece W. In the display area 31, an expansion button 31A, layer information 31B, and drive path information 31C are displayed side by side.

[0079] The expand button 31A is associated with the workpiece layer information 31B. The layer information 31B specifies, for example, a layer number. When the expand button 31A is pressed, the drive path information 31C related to the corresponding layer number is expanded. When the expand button 31A is pressed again, the expanded state is restored.

[0080] The layer information 31B is information indicating the layer number of the workpiece W. The layer information 31B is associated with drive path information 31C corresponding to the layer number. The drive path information 31C includes, for example, the type of tool attached to the spindle 224 and the drive path of the tool. Examples of the tool include a laser head 231 and a gas discharge tool 241. In the example of FIG. 8, the laser head 231 is shown as "LASER" and the gas discharge tool 241 is shown as "AIR."

[0081] By operating the design screen 30, the designer can add layer information 31B to the display area 31 or delete layer information 31B from the display area 31. The designer can also add driving path information 31C to the layer information 31B or delete driving path information 31C associated with the layer information 31B. Furthermore, the designer can set the type of tool to be driven in the driving path information 31C. Examples of tools that can be set include a laser head 231 and a gas discharge tool 241. Furthermore, the designer can set the driving path of the tool in the driving path information 31C.

[0082] The method for setting the drive path will be further explained. First, the designer selects one of the drive path information 31C as the setting target. In the example of FIG. 8, the drive path information 32 associated with layer SL3 is selected. As a result, the information processing device 100 displays a layer model MD showing the shape of layer SL3 in the display area 35. The designer can check the shape of layer SL3 from any direction by clicking and moving the layer model MD displayed in the display area 35. In this way, the design screen 30 is configured to be able to display any layer model among the layer models divided into layers in the three-dimensional model 124 of the workpiece W.

[0083] The design screen 30 is configured to receive the setting of a driving path for the above-mentioned gas discharge tool 241. The driving path is set for the layer model MD displayed in the display area 35, for example.

[0084] The driving path may be set by any method. For example, the driving path may be input using a drawing function included in the design tool. By using the drawing function, the designer can draw the driving path in the layer SL3 in the layer model MD.

[0085] Preferably, the design screen 30 has a support function for setting a driving path. Fig. 9 is a diagram for explaining the support function for setting a driving path.

[0086] The design screen 30 is configured to accept the designation of a location for the displayed layer model MD. In step S21, the designer designates a location PE of the valley portion ED of the layer SL3. The valley portion ED corresponds to the recess DP described above (see FIGS. 4 and 5).

[0087] The designation of a location in the layer model MD can be realized by any method. As an example, the designation of a location in the layer model MD is realized by performing a selection operation such as clicking while the pointer PT is positioned on the layer model MD. Based on receiving the designation of a location PE in the displayed layer model MD, the information processing device 100 extracts a valley portion ED connected to the designated location PE. Then, the information processing device 100 displays the extracted valley portion ED superimposed on the layer model MD as a candidate for the driving path PS. The worker can edit the superimposed driving path PS. When a confirmation operation is performed, the information processing device 100 saves the driving path PS.

[0088] The set drive path PS is associated with the layer information 31B and then included in the additional machining program 222 for the workpiece W. In addition, the design screen 30 is configured to receive various settings such as the attitude of the gas discharge tool 241 during cleaning and the movement speed of the gas discharge tool 241.

[0089] In the design screen 30, not only the drive path of the gas ejection tool 241 but also the setting of the drive path of the laser head 231 is accepted. The method for setting the drive path of the laser head 231 is the same as that for setting the drive path of the gas ejection tool 241, so the description thereof will not be repeated.

[0090] The drive path set in the laser head 231 is included in the additional processing program 222 of the workpiece W after being associated with the layer information 31B. In addition, the design screen 30 is configured to accept various settings such as the posture (e.g., angle, etc.) of the laser head 231 during additional processing, the speed of the laser head 231 during additional processing, the irradiation command (e.g., ON / OFF command) of the laser light of the laser head 231 during additional processing, and the supply command (e.g., ON / OFF command) of the powder material PM of the laser head 231 during additional processing.

[0091] <G. Gas ejection tool 241> Next, referring to FIG. 10, an example of the gas ejection tool 241 will be described. FIG. 10 is a diagram showing a coolant supply mechanism.

[0092] The additive processing device 200 is, for example, a processing machine capable of additive processing of a workpiece and removal processing of the workpiece. The additive processing device 200 has a coolant ejection mechanism used during removal processing. In this example, the coolant ejection mechanism used during removal processing is applied to the gas ejection tool 241 during additive processing of the workpiece.

[0093] More specifically, the additive processing device 200 includes a control device 201, a spindle 224, a coolant tank 252, a motor driver 254, a motor 255, a pump 256, a valve 258, a gas supply source 264, and a valve 266.

[0094] For the convenience of explanation, the side of the pump 256 on the coolant flow path is also referred to as the "upstream side", and the side of the spindle 224 on the coolant flow path is also referred to as the "downstream side".

[0095] A main flow path F1 through which a fluid such as a coolant or gas flows is provided inside the additional processing device 200. One end of the main flow path F1 is connected to a coolant tank 252. The other end of the main flow path F1 is connected to a communication path L2 (second path) formed inside the main shaft 224. The communication path L2 passes through the inside of the main shaft 224 along the axial direction of the main shaft 224.

[0096] Various types of tools can be attached to the spindle 224. In the example of Fig. 10, a tool T having a fluid through passage L1 (first passage) formed therein is attached to the spindle 224. The tool T is an example of a gas discharge tool 241. The through passage L1 extends from the connection surface between the tool T and the spindle 224 to the tip of the tool T and penetrates the tool T along the axial direction of the spindle 224.

[0097] The discharge port of the through passage L1 formed in the tool T is not limited to being formed on the base end surface or the tip end surface of the tool T, and may be formed on, for example, a side portion of the tool T. Also, although the example of Fig. 10 shows the tool T having one discharge port, the tool T may have multiple discharge ports. The diameter of the discharge port of the tool T is, for example, 5 mm or less.

[0098] When the tool T is attached to the spindle 224, the through passage L1 is connected to a communication passage L2 inside the spindle 224. That is, one end of the communication passage L2 is connected to the through passage L1. The other end of the communication passage L2 can be connected to the main flow path F1.

[0099] The control device 201 controls various devices within the additive processing device 200. The device configuration of the control device 201 is arbitrary. The control device 201 may be configured as a single control unit or may be configured as multiple control units. As an example, the control device 201 includes at least one of a PLC (Programmable Logic Controller) and a CNC.

[0100] The pump 256 is provided in the main flow path F1 and pumps coolant from the coolant tank 252 to the main flow path F1. The rotation speed of the pump 256 is controlled by the control device 201. The coolant pumped by the pump 256 flows through the main flow path F1, the communication path L2, and the through path L1 in that order, and is discharged from the tip of the tool T onto the workpiece to be machined. The spindle 224 equipped with such a coolant discharge function is also called a coolant-through spindle.

[0101] More specifically, a motor 255 is connected to the pump 256. The motor 255 is driven by a motor driver 254. The motor driver 254 is composed of a control circuit, an inverter, and the like. The motor driver 254 receives a control signal from the control device 201 and outputs an alternating current having a frequency corresponding to the control signal to the motor 255. This changes the rotation speed of the motor 255, thereby controlling the flow rate of the coolant pumped to the main flow path F1.

[0102] The valve 258 is provided in the main flow path F1. The valve 258 is provided, for example, downstream of the pump 256 and upstream of the main shaft 224.

[0103] Valve 258 is configured to be switchable between at least two states, an open state and a closed state, in response to a control command from control device 201. The opening degree of valve 258 may be adjustable or may be constant.

[0104] When the valve 258 is closed, the flow of coolant from the coolant tank 252 to the spindle 224 is stopped. On the other hand, when the valve 258 is open, the coolant flows from the coolant tank 252 to the spindle 224. In this case, the coolant pumped by the pump 256 flows through the main flow path F1, the communication path L2, and the through path L1 in this order, and is discharged from the tip of the tool T onto the workpiece to be machined.

[0105] A branch flow path F2 branches off from the main flow path F1. The branch flow path F2 branches off from the main flow path F1 at a branch point P2. In other words, one end of the branch flow path F2 is connected to the main flow path F1. The other end of the branch flow path F2 is connected to a gas supply source 264. An example of the gas supply source 264 is a compressor. Compressed gas supplied from the gas supply source 264 flows into the branch flow path F2.

[0106] Valve 266 is provided in branch flow path F2 and adjusts the flow of compressed gas in branch flow path F2. The opening and closing of valve 266 is switched in response to a control command from control device 201. As an example, valve 266 is configured to be switchable between at least two states, an open state and a closed state, in response to a control command from control device 201. Typically, control device 201 sets the open / closed state of valve 266 to be different from the open / closed state of valve 258.

[0107] When the valve 266 is closed, the flow of compressed gas in the branch flow path F2 is stopped. On the other hand, when the valve 266 is open, compressed gas is supplied to the branch flow path F2 from the gas supply source 264. In this case, the compressed gas flows through the branch flow path F2, the main flow path F1, the communication path L2, and the through path L1 in this order, and is discharged from the tip of the tool T onto the workpiece W that is the target of additional processing.

[0108] In this way, in this example, the tool T attached to the main shaft 224 as a coolant-through spindle is used as the gas discharge tool 241. This eliminates the need to provide a separate cleaning mechanism for the cleaning process of the powder material PM described above with reference to FIGS.

[0109] The gas discharge tool 241 is not limited to the tool T shown in FIG. 10. As another example, the gas discharge tool 241 may be a tool having multiple blades. In this case, the additive processing device 200 generates a gas flow by rotating the spindle 224 with the tool attached. This causes the powder material PM on the workpiece W to fly.

[0110] <Hardware Configuration of Information Processing Apparatus 100> Next, referring to FIG. 11, the hardware configuration of information processing apparatus 100 will be described. FIG. 11 is a schematic diagram showing an example of the hardware configuration of information processing apparatus 100.

[0111] Information processing apparatus 100 includes a control device 101, a ROM (Read Only Memory) 102, a RAM (Random Access Memory) 103, a communication interface 104, a display interface 105, an input interface 107, and an auxiliary storage device 120. These components are connected to a bus 110.

[0112] Control device 101 is constituted by, for example, at least one integrated circuit. The integrated circuit can be constituted by, for example, at least one CPU (Central Processing Unit), at least one GPU (Graphics Processing Unit), at least one ASIC (Application Specific Integrated Circuit), at least one FPGA (Field Programmable Gate Array), or a combination thereof.

[0113] Control device 101 controls the operation of information processing apparatus 100 by executing various programs. Based on receiving execution instructions of various programs, control device 101 reads the program from auxiliary storage device 120 or ROM 102 into RAM 103. RAM 103 functions as a working memory and temporarily stores various data necessary for the execution of various programs.

[0114] A LAN (Local Area Network), an antenna, etc. are connected to communication interface 104. Information processing apparatus 100 exchanges data with external devices via communication interface 104. Examples of the external devices include the above-described additional processing apparatus 200 and servers.

[0115] A display 106 is connected to the display interface 105. The display interface 105 sends an image signal for displaying an image to the display 106 according to a command from the control device 101 or the like. The display 106 is, for example, a liquid crystal display, an organic EL (Electro Luminescence) display, or other display device. Note that the display 106 may be integrally configured with the information processing apparatus 100 or may be configured separately from the information processing apparatus 100.

[0116] An input device 108 is connected to the input interface 107. The input device 108 is, for example, a mouse, a keyboard, a touch panel, or other device capable of receiving a user operation. Note that the input device 108 may be integrally configured with the information processing apparatus 100 or may be configured separately from the information processing apparatus 100.

[0117] The auxiliary storage device 120 is, for example, a hard disk, a flash memory, an SSD (Solid State Drive), and other storage media. The auxiliary storage device 120 stores a development tool 122 for the additional processing program 222 (see FIG. 1), a three-dimensional model 124 showing the shape of the workpiece W to be additionally processed, and the like. These storage locations are not limited to the auxiliary storage device 120 and may be stored in a storage area of the control device 101 (for example, a cache memory), the ROM 102, the RAM 103, an external device, or the like.

[0118] <I. Drive Mechanism of the Additional Processing Apparatus 200> Next, referring to FIG. 12, the drive mechanism in the additional processing apparatus 200 will be described. FIG. 12 is a diagram showing an example of the drive mechanism of the additional processing apparatus 200.

[0119] 12, the additional processing apparatus 200 includes a control device 201, a swivel table 212, a rotary table 213, a main shaft 224, and drive units 310, 320, 330A, and 330B. The control device 201 controls the various devices in the additional processing apparatus 200 in accordance with the above-mentioned additional processing program 222.

[0120] The control device 201 may have any configuration. The control device 201 may be configured with a single control unit or multiple control units. As an example, the control device 201 includes at least one of a CNC (Computer Numerical Control) and a PLC (Programmable Logic Controller).

[0121] The driving unit 310 is a driving mechanism for driving and rotating the above-mentioned rotating table 212. The driving unit 310 may be configured with a single driving unit or multiple driving units. In the example of Fig. 12, the driving unit 310 is configured with a motor driver 311A ​​and a motor 312A.

[0122] The motor driver 311A ​​sequentially receives input of the target rotation angle or target rotation speed of the turntable 212 from the control device 201, and outputs a current corresponding to the target rotation angle or target rotation speed to the motor 312A. As a result, the motor 312A drives and turns the turntable 212 about a rotation axis centered in the X-axis direction. The motor 312A may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0123] The driving unit 320 is a driving mechanism for rotating the above-mentioned turntable 213. The driving unit 320 may be composed of a single driving unit or multiple driving units. In the example of Fig. 12, the driving unit 320 is composed of a motor driver 321C and a motor 322C.

[0124] The motor driver 321C sequentially receives input of the target rotation angle or target rotation speed of the turntable 213 from the control device 201, and outputs a current corresponding to the target rotation angle or target rotation speed to the motor 322C. This causes the motor 322C to rotate the turntable 213 around a rotation axis centered in the Z-axis direction. The motor 322C may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0125] The driving section 330A is a driving mechanism for moving the spindle 224. The above-mentioned laser head 231 and the above-mentioned gas discharge tool 241 are driven by being attached to the spindle 224. The driving section 330A may be configured with a single driving unit or may be configured with a plurality of driving units. In the example of Fig. 12, the driving section 330A is configured with motor drivers 331X to 331Z and motors 332X to 332Z.

[0126] The motor driver 331X sequentially receives input of target positions of the spindle 224 in the X-axis direction from the control device 201, and outputs a current corresponding to the target position to the motor 332X. This causes the motor 332X to drive the spindle 224 to any position in the X-axis direction. The motor 332X may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0127] The motor driver 331Y sequentially receives input of target positions of the spindle 224 in the Y-axis direction from the control device 201, and outputs a current corresponding to the target position to the motor 332Y. This causes the motor 332Y to drive the spindle 224 to any position in the Y-axis direction. The motor 332Y may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0128] The motor driver 331Z sequentially receives from the control device 201 the input of the target position of the main shaft 224 in the Z-axis direction, and outputs a current corresponding to the target position to the motor 332Z. Thereby, the motor 332Z moves the main shaft 224 to an arbitrary position in the Z-axis direction. The motor 332Z may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0129] The drive unit 330B is a drive mechanism for rotating the main shaft 224. The drive unit 330B may be composed of a single drive unit or a plurality of drive units. In the example of FIG. 12, the drive unit 330B is composed of motor drivers 331A, 331B and motors 332A, 332B.

[0130] The motor driver 331A sequentially receives from the control device 201 the input of the target rotation angle or the target rotation speed of the main shaft 224 centered on the X-axis direction, and outputs a current corresponding to the target rotation angle or the target rotation speed to the motor 332A. The motor 332A drives the main shaft 224 to pivot about the X-axis direction. The motor 332A may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0131] The motor driver 331B sequentially receives from the control device 201 the input of the target rotation angle or the target rotation speed of the main shaft 224 centered on the axial direction of the main shaft 224, and outputs a current corresponding to the target rotation angle or the target rotation speed to the motor 332B. The motor 332B rotates the main shaft 224 about the axial direction of the main shaft 224. The motor 332B may be an AC motor, a stepping motor, a servo motor, or any other type of motor.

[0132] <J. Control Flow of Additional Processing> Next, referring to FIG. 13, the control flow of the additional processing will be described. FIG. 13 is a flowchart showing the flow of the additional processing.

[0133] 13 is realized, for example, by the control device 201 of the additional processing device 200 executing the above-described additional processing program 222. In another aspect, some or all of the processing may be performed by circuit elements or other hardware.

[0134] In step S210, the control device 201 initializes a variable "N." The variable "N" is initialized to, for example, "1."

[0135] In step S212, the control device 201 controls the above-mentioned automatic tool changer 219 in accordance with the additional machining program 222 so as to mount the laser head 231 on the spindle 224.

[0136] In step S214, the control device 201 drives the laser head 231 in accordance with the drive path for the Nth layer of the laser head 231. In parallel, the control device 201 controls the laser head 231 to supply the powder material PM and irradiate the laser light LS. The drive path of the laser head 231 for the Nth layer is defined in the additive processing program 222. The Nth layer of the workpiece W is stacked by the additive processing process in step S214.

[0137] In step S222, the control device 201 controls the above-mentioned automatic tool changer 219 in accordance with the additive machining program 222 so as to mount the above-mentioned gas discharge tool 241 on the spindle 224.

[0138] In step S224, the control device 201 drives the gas discharge tool 241 according to the drive path of the Nth layer related to the gas discharge tool 241, and causes the gas discharge tool 241 to discharge compressed gas. The drive path of the gas discharge tool 241 in the Nth layer is defined in the additive machining program 222. By the cleaning process in step S224, the powder material PM remaining on the workpiece W is blown away.

[0139] In step S250, the control device 201 determines whether a predetermined termination condition is satisfied. As an example, the termination condition is satisfied when the variable "N" is equal to or greater than a predetermined value. The predetermined value is a natural number equal to or greater than 1. If the control device 201 determines that the predetermined termination condition is satisfied (YES in step S250), it terminates the processing shown in FIG. 13. If not (NO in step S250), the control device 201 switches control to step S252.

[0140] In step S252, the control device 201 increments the variable "N." That is, the control device 201 adds "1" to the variable "N." After that, the control device 201 returns the control to step S212.

[0141] In the example of Figure 13, an example has been described in which the processing of steps S212, S222, and S224 is executed for each layer, but the control device 201 may also execute the processing of steps S212, S222, and S224 each time a predetermined number of layers, two or more, are formed.

[0142] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The scope of the present invention is defined by the claims, not by the above description, and is intended to include all modifications within the meaning and scope of the claims. [Explanation of symbols]

[0143] 10 Additive machining system, 30 Design screen, 31 Display area, 31A Expand button, 31B Layer information, 31C Drive path information, 32 Drive path information, 35 Display area, 100 Information processing device, 101 Control device, 102 ROM, 103 RAM, 104 Communication interface, 105 Display interface, 106 Display, 107 Input interface, 108 Input device, 110 Bus, 120 Auxiliary storage device, 122 Development tool, 124 Three-dimensional model, 200 Additive machining device, 201 Control device, 211 Machine bed, 212 Turning table, 213 Rotating table, 213A Holding mechanism, 214 First slide mechanism, 215 Second slide mechanism, 216 Removal machining head, 218 Magazine, 218A Tool, 219 Automatic tool changer, 222 Additive machining program, 224 Spindle, 231 laser head, 232 head body, 233 slide guide, 234 third slide mechanism, 236 laser nozzle, 241 gas discharge tool, 252 coolant tank, 254 motor driver, 255 motor, 256 pump, 258 valve, 264 gas supply source, 266 valve, 310 drive unit, 311A ​​motor driver, 312A motor, 320 drive unit, 321C motor driver, 322C motor, 330A drive unit, 330B drive unit, 331A motor driver, 331B motor driver, 331X motor driver, 331Y motor driver, 331Z motor driver, 332A motor, 332B motor, 332X motor, 332Y motor, 332Z motor, AI compressed gas, CB cable, DP recess, ED Valley part, F1 main flow path, F2 branch flow path, GS gas, L1 through passage, L2 connecting passage, LS laser light, MD layer model, MP molten pool, P2 branch point, PE location, PM powder material, PS driving path, PT pointer, SL layer, SL1 layer, SL2 layer, SL3 layer, SL4 layer, SP step part, T tool, W workpiece.

Claims

1. An additive processing device, a control device; a laser head capable of performing layer processing of a workpiece by supplying powder material to the workpiece and irradiating the workpiece with laser light; The control device A process of controlling the laser head and laminating the workpiece; performing a process of cleaning at least a portion of the powder material remaining on the workpiece during at least a portion of the execution of the layering process; an additive processing device that performs the cleaning process every time the lamination process for one layer is completed;

2. the additive processing apparatus further comprising a gas supply source for supplying compressed gas; The additional processing apparatus according to claim 1 , wherein the cleaning process includes a process of discharging the compressed gas onto the workpiece.

3. The additional processing apparatus according to claim 2 , wherein the cleaning step includes a step of discharging the compressed gas along a valley portion formed in the workpiece.

4. The additional processing device further includes: The main axis and a tool changer for selectively mounting one of a plurality of machining tools to the spindle; The plurality of processing tools include: the laser head; and a gas discharge tool for discharging the compressed gas.

5. the gas discharge tool is a cutting tool having a first fluid passage formed therein; the spindle has a second passage that is connected to the first passage when the cutting tool is attached; The additive processing apparatus of claim 4 , wherein the gas supply is configured to deliver compressed gas to the first passageway and the second passageway.

6. 4. The additional processing device according to claim 1, wherein the control device starts the cleaning process based on completion of lamination processing of one layer, and finishes the cleaning process before lamination processing of the next layer is started.

7. A method for additionally machining a workpiece performed by an additional machining device, comprising: A step of laminating the workpiece by supplying powder material to the workpiece with a laser head and irradiating the workpiece with laser light; and cleaning at least a portion of the powder material remaining on the workpiece during at least a portion of the layering step; An additive manufacturing method, wherein the cleaning step is performed each time the lamination processing of one layer is completed by the lamination processing step.

8. An additional processing program executed by an additional processing device, The additional processing device is A laser head is provided that can perform layer processing of a workpiece by supplying powder material to the workpiece and irradiating the workpiece with laser light, The additional processing program is configured to: A process of controlling the laser head and laminating a workpiece; and performing a process of cleaning at least a portion of the powder material remaining on the workpiece during at least a portion of the execution of the layering process. an additive processing program that executes the cleaning process each time the lamination process completes lamination of one layer;

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