Film forming apparatus, substrate transfer apparatus, substrate transfer method, and electronic device manufacturing method

Abstract

To provide a technology capable of coping with enlargement of a substrate.SOLUTION: A film deposition apparatus includes a film deposition chamber for depositing a film onto a substrate, first transportation means for transporting the substrate, and second transportation means 40 for transporting the substrate received from the first transportation means on a first position P1 to a second position P2 or a position P3. The second transportation means 40 transports the substrate so that a direction of the substrate agrees with a direction when deposition takes place, at the second position, by rotation in the state of supporting a base W.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a film forming apparatus, a substrate transport apparatus, a substrate transport method, and a method for manufacturing an electronic device. [Background technology]

[0002] An apparatus for transporting a substrate to a film-forming chamber and forming a film on the substrate is known as manufacturing equipment for organic EL displays, etc. As an example, Patent Document 1 discloses a cluster-type film-forming apparatus in which a substrate is transported from a common transport chamber to multiple film-forming chambers by an articulated robot. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2019-192898 Summary of the Invention [Problem to be solved by the invention]

[0004] As substrates become larger, the distance they must be transported increases. A single articulated robot that transports substrates may not be able to handle the increased distances due to factors such as the increased load capacity required of the robot.

[0005] The present invention provides a technique that can accommodate larger substrates. [Means for solving the problem]

[0006] According to one aspect of the present invention, a film formation chamber for forming a film on a substrate; This robot has three degrees of freedom: rotation around a vertical axis, vertical displacement, and radial displacement. a first transport means for transporting a substrate; a second transport means for transporting the substrate received from the first transport means at the first position to a second position; the second transport means rotates the substrate while supporting it, thereby transporting the substrate so that the substrate is oriented in the same direction as when film formation is performed at the second position; A film forming apparatus characterized by the above features is provided. [Effects of the Invention]

[0007] According to the present invention, it is possible to provide a technique that can accommodate larger substrates. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. [Figure 2] 1A and 1B are a plan view and a side view, respectively, of a transport unit in the delivery chamber. [Figure 3] 1A and 1B are a plan view and a side view, respectively, of the transfer unit of the rotating chamber. [Figure 4] FIG. 2 is a plan view showing an outline of a slide-type transport unit. [Figure 5] FIG. 5 is a cross-sectional view of the transport unit of FIG. 4. [Figure 6] 10(A) to 10(C) are explanatory diagrams of the substrate transfer operation. [Figure 7] 10(A) to 10(C) are explanatory diagrams of the substrate transfer operation. [Figure 8] 10(A) to 10(C) are explanatory diagrams of the substrate transfer operation. [Figure 9] 10(A) to 10(C) are explanatory diagrams of the substrate transfer operation. [Figure 10] (A) to (F) are diagrams illustrating the movement of the evaporation source. [Figure 11] 10A and 10B are explanatory diagrams of the mask transport operation to the mask table. [Figure 12] 10A and 10B are explanatory diagrams of the mask transport operation to the mask table. [Figure 13] 10A and 10B are explanatory diagrams of the substrate transport operation and alignment operation. [Figure 14] 1A and 1B are explanatory diagrams of a film forming operation on a substrate. [Figure 15]1A to 1C are explanatory diagrams showing an example of the operation of the entire film forming apparatus. [Figure 16] 1A to 1C are explanatory diagrams showing an example of the operation of the entire film forming apparatus. [Figure 17] 1A to 1C are explanatory diagrams showing an example of the operation of the entire film forming apparatus. [Figure 18] 1A and 1B are explanatory diagrams showing an example of the operation of the entire film forming apparatus. [Figure 19] FIG. 10 is a plan view of a film forming apparatus according to another embodiment. [Figure 20] FIG. 20 is a side view of the film formation chamber of the film formation apparatus of FIG. [Figure 21] (A) to (C) are explanatory diagrams of another evaporation source and its moving unit. [Figure 22] FIG. 10 is an explanatory diagram of another example of the configuration of the holding unit. [Figure 23] (A) is an overall view of an organic EL display device, and (B) is a diagram showing the cross-sectional structure of one pixel. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the scope of the invention claimed. Although multiple features are described in the embodiments, not all of these multiple features are necessarily essential to the invention, and multiple features may be combined arbitrarily. Furthermore, in the accompanying drawings, the same reference numerals are used to designate the same or similar components, and redundant explanations will be omitted.

[0010] First Embodiment <Configuration example of film formation equipment> (Overview of the film deposition equipment) FIG. 1 is a layout diagram of a film forming apparatus 1. In each diagram, arrow Z indicates the vertical direction (the direction of gravity), and arrows X and Y indicate horizontal directions that are orthogonal to each other. Arrow θ indicates the direction of rotation around the Z axis. In addition, for elements shown multiple times in a diagram, only the most representative element may be labeled.

[0011] The film forming apparatus 1 is an apparatus for forming a film on a substrate W. A mask M can be used to form a thin film of a vapor deposition material in a predetermined pattern on the substrate W. The material of the substrate W can be selected appropriately from glass, resin, metal, etc., and typically, a substrate in which a resin layer such as polyimide is formed on glass is used. In this embodiment, the substrate W is rectangular. The vapor deposition material is an organic material or an inorganic material (metal, metal oxide, etc.). The film forming apparatus 1 is applicable to manufacturing apparatuses for manufacturing electronic devices such as display devices (such as flat panel displays), thin-film solar cells, and organic photoelectric conversion elements (organic thin-film imaging elements), as well as optical components, and is particularly applicable to manufacturing apparatuses for manufacturing organic EL panels.

[0012] A film forming apparatus 1 constituting an electronic device manufacturing line is configured to pick up a substrate W flowing along a transfer line L of the entire manufacturing line, perform a predetermined process such as film formation, and then return the substrate W to the transfer line L. A plurality of such film forming apparatuses 1 can be arranged along the transfer line L in an electronic device manufacturing line.

[0013] The film formation apparatus 1 has a configuration in which a delivery chamber 2, a rotation chamber 4, and a film formation chamber 3 are arranged in the Y direction, and substrates W are transported and processed in this order. In detail, when a transfer unit 20 in the delivery chamber 2 receives a substrate W from a line transfer chamber L1 that is provided on a transfer line L and through which substrates W are sequentially transported, the substrate W is transported to the film formation chamber 3 via the rotation chamber 4 and subjected to film formation processing. In addition, the control device 103 includes a processor such as a CPU, a storage device such as a semiconductor memory or a hard disk, and an input / output interface, and controls the film formation system 1.

[0014] (Delivery room) The delivery chamber 2 not only delivers the substrates W and masks M between the line transport chamber L1 and the rotation chamber 4, but also distributes the substrates W and masks M to the film formation chambers 3 located beyond the rotation chamber 4. Therefore, the delivery chamber 2 can also be called a sorting chamber. The delivery chamber 2 is kept airtight by a wall 29.

[0015] A transfer unit 20 is provided in the transfer chamber 2. FIGS. 2A and 2B are a plan view and a side view, respectively, of the transfer unit 20. The transfer unit 20 is a double-arm robot. The transfer unit 20 includes a substrate transfer section 21, which is composed of an arm 21a, an arm 21b, and a hand 21c, and which transfers a substrate W; and a mask transfer section 22, which is composed of an arm 22a, an arm 22b, and a hand 22c, and which transfers a mask M. The substrate transfer section 21 and the mask transfer section 22 can rotate about the Z axis by rotating a drive shaft 20b of the base section 20a in the θ direction, and can be raised and lowered by moving pivot shafts 21d and 22d up and down. The hands 21c and 22c are fork-shaped and are used to place the substrate M and the mask M, respectively. A stocker 104 for storing the mask M is provided adjacent to the transfer chamber 2. The transport unit 20 uses the mask transport part 22 to transport the mask M stored in the stocker 104 to the rotation chamber 4 and transport the mask M received from the rotation chamber 4 to the stocker 104 .

[0016] In this embodiment, the substrate transport unit 21 is configured so that the hand 21c can move in the radial direction (the radial direction of a cylindrical coordinate system when the drive shaft 20b is the axial direction) using the arms 21a and 21b. Also, the mask transport unit 22 is configured so that the hand 22c can move in the radial direction using the arms 22a and 22b. Therefore, including the rotation of the drive shaft 20b and the elevation change of the rotary shaft 21d, the transport unit 20 is a cylindrical coordinate type robot with three degrees of freedom: rotation around a vertical axis, vertical displacement, and radial displacement. However, the configuration of the transport unit 20 can be modified as appropriate.

[0017] (Rotating room) The rotation chamber 4 receives the substrate W from the transport unit 20 in the delivery chamber 2, transports the substrate W while changing its orientation, and delivers it to a transport unit 5A or 5B, which will be described later. In this embodiment, two rotation chambers 4 are provided side by side in the X direction, and the transport unit 20 in the delivery chamber 2 distributes the substrate W to these rotation chambers 4. The rotation chamber 4 is surrounded by a wall 49 and can be kept airtight.

[0018] See FIGS. 1, 3A, and 3B. FIGS. 3A and 3B are a plan view and a side view, respectively, of the transport unit 40. The transport unit 40 is provided in the rotation chamber 4 and transports the substrate W by rotating while supporting the substrate W. The transport unit 40 includes a base 41, two substrate support members 42 that support the substrate W, and a mask support member 43 that supports the mask M. The substrate support members 42 and the mask support member 43 rotate about the Z axis by rotating a drive shaft 41a of the base 41 in the θ direction, and move up and down by moving the drive shaft 41a up and down. That is, the transport unit 40 has a mechanism with two degrees of freedom: rotation about a vertical axis and vertical displacement. The substrate support members 42 include a pair of frame members 42a supported by the mask support members 43 and a plurality of receiving claws 42b extending from the frame members 42a to support the substrate W from below. The pair of frame members 42a are provided spaced apart so that the receiving claws 42b support the vicinity of both short sides of the substrate W, thereby making it possible to avoid interference with the frame members 42a when the hand 21c of the transport unit 20 places the substrate W on the receiving claws 42b. The mask support portion 43 is composed of two long plate-shaped members on which the mask M can be placed.

[0019] Furthermore, as will be described in detail later, in this embodiment, when the transport unit 40 receives the substrate W from the transport unit 20 at position P1 (position P4), it rotates while supporting the substrate W to transport it to position P2 (position P5) or position P3 (position P6). This allows the substrate W received at position P1 to be transported while changing its orientation.

[0020] (Film forming chamber) Referring again to Figure 1, the film formation chamber 3 forms a film on a substrate W carried in by transport units 5A and 5B, which will be described later. In this embodiment, two film formation chambers 3 are provided side by side in the X direction, and each film formation chamber 3 is connected to one of two rotation chambers 4. The film formation chamber 3 is surrounded by a wall 39 and can be kept airtight.

[0021] In this embodiment, two mask stages 31 are disposed in each of the two film formation chambers 3. A total of four mask stages 31 define deposition positions JA to JD where deposition processes are performed. The two film formation chambers 3 have the same structure. Each film formation chamber 3 is provided with a deposition source 8 and a moving unit 9 that moves the deposition source 8. The specific structures and operations of the deposition source 8 and the moving unit 9 will be described later.

[0022] (Sliding transport unit) 1, the film formation apparatus 1 includes two transport units 5A and 5B arranged from the rotation chamber 4 to the film formation chamber 3. The transport unit 5A includes a holding unit 6A and a moving unit 7A (sliding unit) that translates the holding unit 6A in the Y direction. The transport unit 5B has the same structure as the transport unit 5A and includes a holding unit 6B and a moving unit 7B that translates the holding unit 6B in the Y direction.

[0023] Fig. 4 is a plan view showing an overview of transport units 5A and 5B, and Fig. 5 shows a cross-sectional view of transport unit 5A (moving unit 7A and holding unit 6A). Transport units 5A and 5B are units that move holding units 6A and 6B independently back and forth in the Y direction in a horizontal position at a position higher than transport unit 40, and are arranged side by side in the X direction. Note that Fig. 5 shows the structure of transport unit 5A (moving unit 7A and holding unit 6A) as a representative, but holding units 6A and 6B have the same structure, and moving units 7A and 7B also have the same structure.

[0024] The moving units 7A and 7B of this embodiment are mechanisms that move the holding units 6A and 6B by magnetic force, and in particular, are mechanisms that levitate and move by magnetic force. The moving units 7A and 7B each include a pair of guide members 70 that define the movement trajectories of the holding units 6A and 6B in the Y direction. Each guide member 70 has a C-shaped cross section and is a rail member that extends in the Y direction. The pair of guide members 70 are spaced apart from each other in the X direction.

[0025] Each guide member 70 includes a large number of pairs of magnetic elements 71 spaced apart in the Z direction. The large number of pairs of magnetic elements 71 are arranged at equal pitches in the Y direction. At least one of the pair of magnetic elements 71 is an electromagnet, and the other is an electromagnet or a permanent magnet.

[0026] The holding units 6A and 6B are carriers for transporting substrates W and masks M. Each of the holding units 6A and 6B includes a main body member 60 that is rectangular in plan view. Each end of the main body member 60 in the X direction is inserted into a corresponding guide member 70. A permanent magnet 61 with a yoke (not shown) is fixed to the upper and lower surfaces of each end of the main body member 60 in the X direction. A plurality of upper and lower permanent magnets 61 are provided on the main body member 60 in the Y direction. The permanent magnets 61 face magnetic elements 71 of the guide member 70. A levitation force can be generated in the holding units 6A and 6B by the repulsive force between the permanent magnets 61 and the magnetic elements 71. By sequentially switching the magnetic elements 71 that generate magnetic force among the many magnetic elements (electromagnets) 71 provided in the Y direction, a moving force in the Y direction can be generated in the holding units 6A and 6B by the attractive force between the permanent magnets 61 and the magnetic elements 71.

[0027] In this embodiment, the moving units 7A and 7B are magnetic levitation transport mechanisms, but they may be other transport mechanisms capable of moving the holding units 6A and 6B, such as a roller transport mechanism, a belt transport mechanism, or a rack-and-pinion mechanism.

[0028] A scale 72 extending in the Y direction is disposed on the guide member 70, and a sensor 64 that reads the scale 72 is provided on the main body member 60. The detection results of the sensor 64 make it possible to identify the positions of the holding units 6A and 6B in the Y direction.

[0029] The holding units 6A and 6B each include a holding portion 62 that holds the substrate W. In this embodiment, the holding portion 62 is an electrostatic chuck that attracts the substrate W by electrostatic force, and the holding portion 62 includes a plurality of electrodes 62a arranged on the lower surfaces of the holding units 6A and 6B. The holding units 6A and 6B also each include a holding portion 63 that holds the mask M. The holding portion 63 is, for example, a magnetic chuck that attracts the mask M by magnetic force, and is located outside the holding portion 62 in the X direction. The holding portion 63 may also be a clamping mechanism that mechanically clamps the mask M.

[0030] <Example of film formation equipment operation> (Transfer of substrate from delivery chamber to rotation chamber) 6(A) to 6(C) are plan views illustrating the transfer operation of the substrate W from the transfer chamber 2 to the rotation chamber 4, and FIGS. 7(A) to 7(C) are views viewed from the arrow A in FIGS. 6(A) to 6(C). FIGS. 6(A) and 7(A) show a state in which the transport unit 20 in the transfer chamber 2 receives the substrate W in the line transport chamber L1, and then rotates around the Z axis while pulling the hand 21c toward the center of rotation with the arms 21a and 21b, and faces the rotation chamber 4. At this time, the transport unit 40 in the rotation chamber 4 waits by moving the substrate support part 42 to a position corresponding to position P1 so that it can receive the substrate W at position P1. From this state, the substrate W is transported to position P1 by the substrate transport part 21 (FIGS. 6(B) and 7(B)). At this time, in the Z direction, the support position of the substrate W by the hand 21c of the substrate transport section 21 is located above the support position of the substrate by the receiving claws 42b of the substrate support section 42. Then, from this state, the rotation shaft 21d of the transport unit 20 descends, and the substrate W supported by the hand 21c is transferred to the substrate support section 42 (FIGS. 6(C) and 7(C)).

[0031] Although the transfer of the substrate W has been described above, the transfer of the mask M is also performed in a similar manner. In this case, the transport unit 20 transports the mask M using the mask transport section 22 instead of the substrate transport section 21, and the transport unit 40 receives the mask M using the mask support section 43 instead of the substrate support section 42.

[0032] (Transfer of substrate from rotation chamber to deposition chamber) 8(A) to 8(B) and 9(A) to 9(C) are plan and side views illustrating the operation of transferring the substrate W from the rotation chamber 4 to the film formation chamber 3. When the transport unit 20 in the rotation chamber 4 receives the substrate W from the transport unit 20 at position P1 (FIG. 6(C)), the transport unit 20 rotates around the Z axis by the drive shaft 41a and transports the substrate W to position P2 (FIGS. 8(A) and 9(A)). At this time, the transport unit 5A moves the holding unit 6A to position P2 and waits there so that the substrate W can be received at position P2. Also, at this time, in the Z direction, the support position of the substrate W by the receiving claws 42b of the substrate support portion 42 is located below the support position of the substrate W by the holding unit 6A. From this state, the transport unit 40 moves the drive shaft 41a of the base portion 41 upward to bring the substrate W supported by the substrate support portion 42 into contact with the holding portion 62 of the holding unit 6A (FIG. 9(B)). The holding unit 6A electrostatically attracts and holds the substrate W. Once the substrate W is held by the holding unit 6A, the transport unit 40 moves the drive shaft 41a downward to separate the substrate support portion 42 from the substrate W (FIG. 9(C)). Thereafter, the transport unit 5A translates the holding unit 6A to the deposition position JA in the film formation chamber 3 (FIG. 8(B)).

[0033] Although an example of operation using the transport unit 5A has been described here, the same operation is performed when the transport unit 5B is used. In this case, the transport unit 40 transports the substrate W received from the transport unit 20 to position P3 instead of position P2.

[0034] (Structure and operation of evaporation source and transfer unit) 10(A) to 10(F) are diagrams illustrating the structure and operation of the vapor deposition source 8 and the moving unit 9 in the film formation chamber 3. The vapor deposition source 8 includes a crucible that contains the raw material of the vapor deposition substance, a heater that heats the crucible, and the like, and heats the raw material to emit the vapor of the vapor deposition substance upward from an opening 8a (see FIG. 10(A) and the like).

[0035] The moving unit 9 includes an actuator 90, a pair of movable rails 94, and a pair of fixed rails 95. The actuator 90 includes a drive source 93, an arm member 91, and an arm member 92. One end of the arm member 91 is connected to the drive source 93 and is rotated by the drive source 93. The other end of the arm member 91 is rotatably connected to one end of the arm member 92, and the other end of the arm member 92 is rotatably connected to the bottom of the deposition source 8.

[0036] The pair of movable rails 94 guides the movement of the vapor deposition source 8 in the Y direction. Each movable rail 94 extends in the Y direction, and the pair of movable rails 94 are spaced apart from each other in the X direction. The pair of fixed rails 95 guides the movement of the pair of movable rails 94 in the X direction. Each fixed rail 95 is fixed so as to be immovable, and extends in the Y direction. The pair of fixed rails 95 are spaced apart from each other in the Y direction.

[0037] By driving the actuator 90, the deposition source 8 slides in the Y direction below the deposition position JA (below the mask table 31), then slides from the deposition position JA side to the deposition position JB side, and further slides in the Y direction below the deposition position JB (below the mask table 31). Specifically, when the arm members 91 and 92 are rotated by driving the actuator 90 from the position shown in FIG. 10(A), the deposition source 8 passes below the deposition position JA in the Y direction guided by the pair of movable rails 94 as shown in FIG. 10(B). When the arm members 91 and 92 are rotated in the opposite direction by driving the actuator 90 from this state, the deposition source 8 passes below the deposition position JA in the Y direction as shown in FIG. 10(C) and returns to the position shown in FIG. 10(A).

[0038] When the arm members 91 and 92 are further rotated by driving the actuator 90, the vapor deposition source 8 and the pair of movable rails 94 move in the X direction toward the vapor deposition position JB, guided by the pair of fixed rails 95. When the arm members 91 and 92 are further rotated from the position shown in Figure 10(D) by driving the actuator 90, the vapor deposition source 8 passes below the vapor deposition position JB in the Y direction, guided by the pair of movable rails 94, as shown in Figure 10(E). When the arm members 91 and 92 are rotated in the opposite direction by driving the actuator 90 from this state, the vapor deposition source 8 passes below the vapor deposition position JB in the Y direction, as shown in Figure 10(F), and returns to the position shown in Figure 10(D).

[0039] In this manner, in this embodiment, by moving one vapor deposition source 8, the vapor deposition source 8 can be shared by two vapor deposition positions, ie, the vapor deposition position JA and the vapor deposition position JB.

[0040] (Alignment operation and film formation operation) Next, the operation of placing the mask M on the mask stage 31, the operation of aligning the mask M with the substrate W, and the subsequent film formation operation will be described with reference to FIGS. 11(A) to 14(B).

[0041] First, the operation of mounting the mask M on the mask stage 31 will be described. Figures 11(A) to 12(B) show the operation of mounting the mask M on the mask stage 31 at the deposition position JA. From the state shown in Figure 11(A), the holding unit 6A holding the mask M is moved onto the mask stage 31 by the moving unit 7A. When the mask M reaches a predetermined position on the mask stage 31 as shown in Figure 12(A), the magnetic force of the magnetic element 71 of the moving unit 7A is adjusted to reduce the levitation amount of the holding unit 6A, and the holding of the mask M by the holding unit 6A is released, as shown in Figure 12(B). This causes the mask M to be mounted on the mask stage 31.

[0042] Next, the alignment operation and film formation operation will be described. FIG. 13(A) shows a state in which the holding unit 6A holding the substrate W is being moved by the moving unit 7A to the deposition position JA. When the substrate W reaches above the mask M, the substrate W and the mask M are aligned in the XY plane. In the alignment, as shown in FIG. 13(B), the camera 32 captures images of the alignment marks on the substrate W and the mask M, respectively, and calculates the amount of misalignment between the substrate W and the mask M from the captured images. The position of the substrate W is then adjusted to reduce the calculated amount of misalignment. In this embodiment, the position of the substrate W is adjusted by adjusting the magnetic force of the magnetic elements 71 of the moving unit 7A. By adjusting the magnetic forces of the magnetic elements 71 spaced apart in the X and Y directions, the position of the holding unit 6A can be displaced in the X, Y, and θ directions, thereby displacing the position of the substrate W held by the holding unit 6A in the X, Y, and θ directions. For example, by strengthening the magnetic force of the magnetic element 71 provided on one of the pair of guide members 70, the holding unit 6A and the substrate W can be displaced toward one of the guide members 70 by the attraction of the magnetic force (or toward the other guide member 70 by the repulsion of the magnetic force).

[0043] The imaging by the camera 32 and the alignment of the substrate W and the mask M by adjusting the magnetic force of the magnetic element 71 may be repeated until the amount of misalignment between them falls within an allowable range. Once the alignment is complete, as shown in FIG. 14(A), the magnetic force of the magnetic element 71 of the moving unit 7A is adjusted to lower the levitation amount of the holding unit 6A, and the substrate W is placed on the mask M. The holding of the substrate W by the holding unit 6A is not released. Next, the film formation operation is performed. As shown in FIG. 14(B), the evaporation source 8 is moved and the evaporation material is released from the evaporation source 8 onto the substrate W. A film of the evaporation material that has passed through the mask M is formed on the substrate W. During film formation, the substrate W remains held by the holding unit 6A.

[0044] (Example of the overall operation of the film forming device) 15(A) to 18(B) are diagrams for explaining an example of operation when film formation is performed continuously on multiple substrates W in the film formation apparatus 1. The operation of each apparatus in the state shown in each figure follows, for example, the example of operation shown in FIGS. 6(A) to 14(B). It is assumed here that a mask M has already been loaded onto the mask stage 31 at each deposition position JA to JD at the start of operation. In addition, hereinafter, the two film formation chambers 3 will be distinguished by being referred to as film formation chamber 3L and film formation chamber 3R, and the two rotation chambers 4 will be distinguished by being referred to as rotation chamber 4L and rotation chamber 4R. The same applies to these components.

[0045] As shown in FIG. 15(A), the transport unit 20 receives the first substrate W that has been transported into the line transport chamber L1.

[0046] 15(B), the transport unit 20 transports the received substrate W to position P1 in the rotation chamber 4L. At this time, the transport unit 40L in the rotation chamber 4L waits at position P1 by rotating the substrate support part 42L to a position where it can receive the substrate W until the transport unit 20 transports the substrate W to position P1. Then, when the substrate W has been transported to position P1 by the transport unit 20, the transport unit 40L receives the substrate W from the transport unit 20.

[0047] 15(C), the transport unit 40 moves the substrate W received at position P1 to position P2. The transport unit 40L delivers the substrate W to the holding unit 6AL at position P2. In parallel with these operations, the transport unit 20 receives the second substrate W that has been transported to the line transport chamber L1.

[0048] 16(A), the transport unit 20 transports the received substrate W to position P4 in the rotation chamber 4R. At this time, the transport unit 40R in the rotation chamber 4R rotates and moves the substrate support portion 42R to a position where it can receive the substrate W at position P4, and waits until the transport unit 20 transports the substrate W to position P1. Then, when the substrate W is transported to position P4 by the transport unit 20, the transport unit 40R receives the substrate W from the transport unit 20. In parallel with these operations, the transport unit 5AL moves the substrate W held by the holding unit 6AL from position P2 to the deposition position JA. Then, the substrate W and the mask M are aligned.

[0049] As shown in FIG. 16B, the transport unit 20 transports the third substrate W to position P1 in the rotation chamber 4L. Specifically, the transport unit 20 moves the substrate transport section 21 from the state shown in FIG. 16A to the line transport chamber L1 to receive the third substrate W and transport the received substrate W to position P1. The transport unit 20 then transfers the substrate W to the transport unit 40L, which is waiting at position P1 and ready to receive the substrate W. In parallel with these operations, in the film formation chamber 3L, a film is formed on the substrate W at deposition position JA using the deposition source 8. The transport unit 40R in the rotation chamber 4R transports the substrate W received at position P4 to position P5. When the substrate W is transferred from the transport unit 40R to the holding unit 6AR at position P5, the transport unit 5AR moves the substrate W held by the holding unit 6AR from position P5 to deposition position JC. The substrate W and the mask M are then aligned.

[0050] As shown in FIG. 16(C), the transport unit 20 transports the fourth substrate W to position P4 in the rotation chamber 4R. Specifically, the transport unit 20 moves the substrate transport section 21 from the state shown in FIG. 16(B) to the line transport chamber L1 to receive the fourth substrate W and transport the received substrate W to position P4. The transport unit 20 then transfers the substrate W to the transport unit 40R, which is waiting at position P4 and ready to receive the substrate W. In parallel with these operations, film formation continues on the substrate W at deposition position JA in the film formation chamber 3L using the deposition source 8L. The transport unit 40L in the rotation chamber 4L transports the substrate W received at position P1 to position P3. After the substrate W is transferred from the transport unit 40L to the holding unit 6BL at position P3, the transport unit 5BL moves the substrate W held by the holding unit 6BL from position P2 to deposition position JB. The substrate W and the mask M are then aligned. Furthermore, in the film formation chamber 3R, a film is formed on the substrate W located at the deposition position JC by the deposition source 8R.

[0051] As shown in FIG. 17A, the transport unit 20 transports the fifth substrate W to position P1 in the rotation chamber 4L. Specifically, the transport unit 20 moves the substrate transport section 21 from the state shown in FIG. 16C to the line transport chamber L1 to receive the fifth substrate W and transport the received substrate W to position P1. The transport unit 20 then hands over the substrate W to the transport unit 40L, which is waiting at position P1 and ready to receive the substrate W. In parallel with these operations, in the film formation chamber 3L, the evaporation source 8L, which has completed film formation on the substrate W at evaporation position JA, moves in the X direction to form a film on the substrate W at evaporation position JB. The transport unit 5AL also moves the holding unit 6AL, which holds the substrate W on which film formation has been completed, to the rotation chamber 4L. In the film formation chamber 3R, film formation continues using the evaporation source 8R. The transport unit 40R in the rotation chamber 4R transports the substrate W received at position P4 to position P6. Then, when the substrate W is transferred from the transport unit 40R to the holding unit 6BR at position P6, the transport unit 5BR moves the substrate W held by the holding unit 6BR from position P6 to the deposition position JD. Thereafter, alignment of the substrate W and the mask M is performed.

[0052] As shown in FIG. 17(B), the transport unit 20 receives the sixth substrate W in the line transport chamber L1. Concurrently with this operation, the transport unit 5AL moves the holding unit 6AL holding the first substrate W on which film formation has been completed to position P2 in the rotation chamber 4L. The transport unit 40L then receives the first substrate W from the holding unit 6AL using the substrate support 42 other than the substrate support 42L supporting the fifth substrate W. In addition, in the film formation chamber 3R, the deposition source 8R, which has completed film formation on the substrate W at deposition position JC, moves in the X direction to form a film on the substrate W at deposition position JD. The transport unit 5AR also moves the holding unit 6AR holding the substrate W on which film formation has been completed to the rotation chamber 4R.

[0053] As shown in FIG. 17(C), the transport unit 20 transports the sixth substrate W to position P4 in the rotation chamber 4R and hands over the substrate W to the transport unit 40R, which is waiting at position P3 in a state where it can receive the substrate W. Concurrently with this operation, in the film formation chamber 3L, the evaporation source 8L forms a film on the substrate W at evaporation position JB. Also, in the rotation chamber 4L, the transport unit 40L transports the fifth substrate W to position P2. That is, the fifth substrate W is transported from position P1 to position P2 via position P3. At position P2, the substrate W is handed over from the transport unit 40L to the holding unit 6AL. Also, in the film formation chamber 3R, the evaporation source 8R forms a film on the substrate W at evaporation position JD.

[0054] 18(A), the transport unit 20 receives the first substrate W on which film formation has been completed from the transport unit 40L. In parallel with this operation, the transport unit 5AR moves the holding unit 6AR holding the second substrate W on which film formation has been completed to position P5 in the rotation chamber 4R. Then, the transport unit 40R receives the first substrate W from the holding unit 6AR by the substrate support part 42 other than the substrate support part 42L supporting the sixth substrate W. Furthermore, film formation by the evaporation source 8L on the substrate W at evaporation position JB in the film formation chamber 3L and film formation by the evaporation source 8R on the substrate W at evaporation position JD in the film formation chamber 3R continue.

[0055] As shown in Figure 18(B), the transport unit 20 transfers the first substrate W after film formation to the line transport chamber L1. That is, after film formation is completed, the transport unit 40R transports the sixth substrate W to position P5 in the rotation chamber 4R. That is, the sixth substrate W is transported from position P4 to position P5 via position P6. At position P5, the substrate W is transferred from the transport unit 40R to the holding unit 6AR. Furthermore, film formation by the evaporation source 8L on the substrate W at evaporation position JB in the film formation chamber 3L and film formation by the evaporation source 8R on the substrate W at evaporation position JD in the film formation chamber 3R are continuously performed.

[0056] The film forming apparatus 1 can sequentially form films on a plurality of substrates W by repeating the above-described procedure of loading the substrate W, forming a film on the loaded substrate W, and unloading the substrate W after the film formation.

[0057] According to this embodiment, in the film formation apparatus 1, the substrate W or mask M is transported from the line transfer chamber L1 to the deposition positions JA to JD by a combination of the transfer unit 20, the transfer unit 40, and the transfer units 5A and 5B. Furthermore, the transfer unit 20 and the transfer unit 40 transport the substrate W or mask M until the transfer units 5A and 5B receive them. This allows the substrate W to be transported over a longer distance while shortening the transport distance of each transfer unit compared to when a single transfer mechanism such as an articulated robot is used for this section. When transporting a large substrate W, this allows for a long transport distance while preventing the transfer units from becoming larger due to increased rigidity. Therefore, a film formation apparatus 1 that can accommodate larger substrates W can be provided.

[0058] In particular, in this embodiment, the transport unit 40 rotates while supporting the substrate W received from the transport unit 20, thereby transporting the substrate W to the transfer position for the substrate W to the transport units 5A and 5B so that the substrate W is oriented in the direction in which film formation will be performed. Therefore, the transport unit 20 does not need to adjust the orientation of the substrate W to match the orientation of the substrate W in the film formation chamber 3. This simplifies the configuration of the transport unit 20. Furthermore, in this embodiment, the transport unit 20 is configured with a robot having three degrees of freedom, which allows for a reduced degree of freedom of the transport mechanism compared to a case in which an articulated robot with four or more degrees of freedom is used. By adopting a mechanism with fewer degrees of freedom, the support rigidity of the substrate W and mask M is higher than that of a robot with more degrees of freedom when compared at the same size, making it easier to accommodate larger substrates W.

[0059] Furthermore, in this embodiment, the transport unit 40 is a transport mechanism with two degrees of freedom. Therefore, by combining the transport unit 20 and the transport unit 40, which are mechanisms with a relatively low degree of freedom, it is possible to transport the substrate W farther while also adjusting the orientation of the substrate W, making it easier to accommodate larger substrates W than when a single transport mechanism is used to transport the substrate W while adjusting the orientation of the substrate W.

[0060] Furthermore, since the orientation of the substrate W is adjusted by the transport unit 40, the transport units 5A and 5B only need to translate the substrate W to the deposition positions JA to JD without adjusting the orientation of the substrate W. This allows the configuration of the transport units 5A and 5B to be simplified.

[0061] In this embodiment, the transport unit 40 rotates to transport the substrate W so that the orientation of the substrate W is the same between position P2, where the substrate W is transported to deposition position JA, and position P3, where the substrate W is transported to deposition position JB. Therefore, by sliding the substrate W at position P2 or P3 using the transport units 5A and 5B, two substrates W are positioned at deposition positions JA and JB, which are spaced apart in the X direction, in the film formation chamber 3. Therefore, films can be formed on the substrates W at the two film formation positions by the deposition source 8, which can move (scan) in the Y direction while depositing a film on the substrate W. Furthermore, for example, by aligning the substrate W at deposition position JB while the deposition source 8 is depositing a film on the substrate W at deposition position JA, film formation can be performed on the substrate W at deposition position JB promptly after film formation on the substrate W at deposition position JA is completed. This improves the efficiency of the film formation process.

[0062] Second Embodiment In the first embodiment, the transport unit 40 transports the substrate W from position P1 to position P2 or position P3, and then the transport units 5A and 5B transport the substrate W to deposition positions JA and JB. However, the transport units 5A and 5B may not be provided. That is, the deposition position may be position P2 or position P3. Figures 19 and 20 are a plan view of a film formation apparatus 201 and a side view of a film formation chamber 203, showing one example of such a configuration. Hereinafter, the same components as those in the first embodiment will be assigned the same reference numerals, and description thereof will be omitted.

[0063] In this embodiment, a film formation chamber 203, in which a film is formed on a substrate W, is provided with a transport unit 240 that transports the substrate W by rotating while supporting the substrate W. The transport unit 240 is provided in an upper region of the internal space of the film formation chamber 203. The transport unit 240 includes a base 241 supported by a wall 239 that defines the upper surface of the film formation chamber 203, two substrate support parts 242 that support the substrate W, and two mask support parts 243 that support the mask M. The substrate support parts 242 and the mask support parts 243 rotate about the Z axis by rotating a drive shaft 241a of the base 241 in the θ direction, and move up and down by moving the drive shaft 241a up and down. In this embodiment, the substrate support parts 242 and the mask support parts 243 transport the substrate W and the mask M while holding them on their lower sides, respectively. For example, the substrate support portion 242 may be an electrostatic chuck that adheres by electrostatic force, and the mask support portion 243 may support the mask M by magnetic force.

[0064] Further, in the film formation chamber 203, below the transfer unit 240, a substrate support part 250 that supports the substrate W and a mask support part 251 that supports the mask M are provided. For these configurations, known techniques can be applied as appropriate, and for example, the edges of the substrate W or mask M may be supported by receiving claws, clamps, or the like. Furthermore, the substrate support part 250 and the mask support part 251 may be configured to be able to move relatively in the horizontal direction to perform alignment between the substrate W and the mask M.

[0065] In the film formation chamber 203, below the substrate support part 250 and the mask support part 251, a vapor deposition source 8 for forming a film on the substrate W is provided.

[0066] The following describes the transport operation of the substrate W in the film formation apparatus 201. When the transport unit 20 receives the substrate W in the line transport chamber L1, it transports the substrate W to position P21 in the film formation chamber 203. The transport unit 20 then hands over the substrate W to the transport unit 240, which is waiting at position P21 in a state where it can receive the substrate W. For example, the transfer is performed by the transport unit 20 moving its rotation shaft 21d upward to lift the substrate W, or the transport unit 240 moving its drive shaft 241a downward to lower the substrate support part 242, or both.

[0067] The transport unit 240 that has received the substrate W rotates about the Z axis to transport the substrate W from position P21 to position P22 (FIG. 20). Thereafter, the transport unit 240 moves its drive shaft 241a downward to lower the substrate support part 242, thereby transferring the substrate W to the substrate support part 250.

[0068] As described above, in this embodiment, the substrate W can be transported to the film formation position in the film formation chamber 203 by the transport unit 20 and the transport unit 240 while adjusting the orientation of the substrate W. Even in this embodiment, the transport distance of each transport unit can be shortened and the substrate W can be transported over a longer distance than when transporting this section using a single transport mechanism such as an articulated robot. When transporting a large substrate W, a long transport distance can be achieved and the size of each transport unit can be prevented from increasing due to increased rigidity. Therefore, a film formation apparatus 1 that can accommodate larger substrates W can be provided.

[0069] Third Embodiment In the first embodiment, the deposition source 8 is configured to be movable in both the X and Y directions, but it may be configured to be movable only in the X direction. Figures 21(A) to 21(C) show an example of this, illustrating the configuration at deposition positions JA and JB. A similar configuration can also be adopted at deposition positions JC and JD.

[0070] The deposition source 8', which replaces the deposition source 8, has a shape that is elongated in the Y direction, and the openings 8a' that release the deposition material have a length that corresponds to the length of the deposition positions JA and JB in the Y direction. The moving unit 9', which replaces the moving unit 9, has a pair of fixed rails 96. Each fixed rail 96 extends in the X direction, and the pair of fixed rails 96 are spaced apart from each other in the Y direction. The moving unit 9' has an actuator (not shown) that corresponds to the actuator 90.

[0071] As shown in Fig. 21(A), the deposition source 8' has a standby position between deposition positions JA and JB, and when forming a film on the substrate W at deposition position JA, it traverses deposition position JA in the X direction as shown in Fig. 21(B). When forming a film on the substrate W at deposition position JB, it traverses deposition position JB in the X direction as shown in Fig. 21(C). According to this embodiment, the mechanism of the moving unit 9' can be made relatively simple.

[0072] <Fourth embodiment> In the first embodiment, the holder 62 that holds the substrate W is configured as an electrostatic chuck, but other suction methods may also be used. Fig. 22 shows an example of such a holder 62, showing the underside of the holder 62. A plurality of suction pads 65 are provided on the underside of the holder 62. The suction pads 65 are, for example, adhesive members that hold the substrate W by adhesive force. Alternatively, the suction pads 65 are vacuum pads.

[0073] <Electronic device manufacturing method> Next, an example of a method for manufacturing an electronic device will be described. Below, as an example of an electronic device, the configuration of an organic EL display device and a manufacturing method thereof will be illustrated. In this example, a plurality of film forming apparatuses 1 illustrated in FIG. 1 are provided on a manufacturing line.

[0074] First, the organic EL display device to be manufactured will be described. Fig. 23(A) is an overall view of an organic EL display device 50, and Fig. 23(B) is a diagram showing the cross-sectional structure of one pixel.

[0075] 23(A), a plurality of pixels 52, each including a plurality of light-emitting elements, are arranged in a matrix in a display region 51 of an organic EL display device 50. As will be described in detail later, each of the light-emitting elements has a structure including an organic layer sandwiched between a pair of electrodes.

[0076] The term "pixel" as used herein refers to the smallest unit capable of displaying a desired color in the display region 51. In the case of a color organic EL display device, a pixel 52 is configured by a combination of multiple sub-pixels, each of which is a first light-emitting element 52R, a second light-emitting element 52G, and a third light-emitting element 52B, each of which emits light differently from one another. The pixel 52 is often configured by a combination of three types of sub-pixels: a red (R) light-emitting element, a green (G) light-emitting element, and a blue (B) light-emitting element, but is not limited to this. The pixel 52 may include at least one type of sub-pixel, preferably two or more types of sub-pixels, and more preferably three or more types of sub-pixels. The sub-pixels that make up the pixel 52 may be a combination of four types of sub-pixels: a red (R) light-emitting element, a green (G) light-emitting element, a blue (B) light-emitting element, and a yellow (Y) light-emitting element, for example.

[0077] Figure 23(B) is a partial cross-sectional schematic diagram taken along line AB in Figure 23(A). A pixel 52 has, on a substrate 53, multiple sub-pixels each composed of an organic EL element including a first electrode (anode) 54, a hole transport layer 55, one of a red layer 56R, a green layer 56G, and a blue layer 56B, an electron transport layer 57, and a second electrode (cathode) 58. Of these, the hole transport layer 55, the red layer 56R, the green layer 56G, the blue layer 56B, and the electron transport layer 57 correspond to organic layers. The red layer 56R, the green layer 56G, and the blue layer 56B are formed in patterns corresponding to light-emitting elements (sometimes referred to as organic EL elements) that emit red, green, and blue light, respectively.

[0078] 23B , the hole transport layer 55 may be formed as a common layer across the plurality of sub-pixel regions, and the red layer 56R, the green layer 56G, and the blue layer 56B may be formed separately for each sub-pixel region on the hole transport layer 55. The electron transport layer 57 and the second electrode 58 may be formed separately for each sub-pixel region on the hole transport layer 55. The electron transport layer 57 and the second electrode 58 may be formed as a common layer across the plurality of sub-pixel regions on the hole transport layer 55.

[0079] In order to prevent short circuits between adjacent first electrodes 54, an insulating layer 59 is provided between the first electrodes 54. Furthermore, since the organic EL layer deteriorates due to moisture and oxygen, a protective layer 60 is provided to protect the organic EL element from moisture and oxygen.

[0080] 23(B), the hole transport layer 55 and the electron transport layer 57 are shown as a single layer, but they may be formed of multiple layers including a hole blocking layer and an electron blocking layer depending on the structure of the organic EL display element. Furthermore, a hole injection layer having an energy band structure that can smoothly inject holes from the first electrode 54 to the hole transport layer 55 may be formed between the first electrode 54 and the hole transport layer 55. Similarly, an electron injection layer may be formed between the second electrode 58 and the electron transport layer 57.

[0081] Each of the red layer 56R, green layer 56G, and blue layer 56B may be formed of a single light-emitting layer or may be formed by laminating multiple layers. For example, the red layer 56R may be formed of two layers, with the upper layer being a red light-emitting layer and the lower layer being a hole-transporting layer or an electron-blocking layer. Alternatively, the lower layer may be a red light-emitting layer and the upper layer being an electron-transporting layer or a hole-blocking layer. By providing a layer below or above the light-emitting layer in this manner, the light-emitting position in the light-emitting layer can be adjusted, and the optical path length can be adjusted, thereby improving the color purity of the light-emitting element.

[0082] Although the example of the red layer 56R is shown here, a similar structure may be adopted for the green layer 56G or the blue layer 56B. The number of layers may be two or more. Furthermore, layers of different materials may be stacked, such as a light-emitting layer and an electron-blocking layer, or layers of the same material may be stacked, such as two or more light-emitting layers.

[0083] Next, an example of a method for manufacturing an organic EL display device will be specifically described. Here, it is assumed that the red layer 56R is made up of two layers, a lower layer 56R1 and an upper layer 56R2, and the green layer 56G and the blue layer 56B are made up of a single light-emitting layer.

[0084] First, a substrate 53 is prepared on which a circuit (not shown) for driving the organic EL display device and a first electrode 54 are formed. The material of the substrate 53 is not particularly limited, and it can be made of glass, plastic, metal, etc. In this embodiment, a substrate in which a polyimide film is laminated on a glass substrate is used as the substrate 53.

[0085] A resin layer such as acrylic or polyimide is coated by bar coating or spin coating on the substrate 53 on which the first electrode 54 is formed, and the resin layer is patterned by lithography so as to form an opening in the area where the first electrode 54 is formed, thereby forming an insulating layer 59. This opening corresponds to the light-emitting region from which the light-emitting element actually emits light. In this embodiment, the large substrate is processed up to the formation of the insulating layer 59, and after the insulating layer 59 is formed, a dividing step is carried out to divide the substrate 53.

[0086] The substrate 53 with the patterned insulating layer 59 is carried into the first film forming apparatus 1, and a hole transport layer 55 is formed as a common layer on the first electrodes 54 in the display area. The hole transport layer 55 is formed using a mask in which an opening is formed for each display area 51 that will ultimately become the panel portion of each organic EL display device.

[0087] Next, the substrate 53 on which the hole transport layer 55 has been formed is carried into the second film formation apparatus 1. The substrate 53 and a mask are aligned, and the substrate is placed on the mask. A red layer 56R is formed on the hole transport layer 55 in the portion of the substrate 53 where the red-emitting elements are to be arranged (the region where the red subpixels are to be formed). The mask used in the second film formation chamber is a high-definition mask with openings formed only in the regions that will become the red subpixels among the regions on the substrate 53 that will become the subpixels of the organic EL display device. As a result, the red layer 56R including the red light-emitting layer is formed only in the regions that will become the red subpixels among the regions on the substrate 53 that will become the red subpixels. In other words, the red layer 56R is selectively formed in the regions that will become the red subpixels, but not in the regions that will become the blue or green subpixels among the regions on the substrate 53 that will become the subpixels.

[0088] Similar to the formation of the red layer 56R, the green layer 56G is formed in the third film formation apparatus 1, and then the blue layer 56B is formed in the fourth film formation apparatus 1. After the formation of the red layer 56R, green layer 56G, and blue layer 56B is completed, the electron transport layer 57 is formed over the entire display area 51 in the fifth film formation apparatus 1. The electron transport layer 57 is formed as a layer common to the three color layers 56R, 56G, and 56B.

[0089] The substrate on which the layers up to the electron transport layer 57 have been formed is moved to the sixth film formation apparatus 1, where the second electrode 58 is formed. In this embodiment, the first to sixth film formation apparatuses 1 form each layer by vacuum deposition. However, the present invention is not limited to this, and for example, the second electrode 58 in the sixth film formation apparatus 1 may be formed by sputtering. Thereafter, the substrate on which the layers up to the second electrode 58 have been formed is moved to a sealing apparatus, and the protective layer 60 is formed by plasma CVD (sealing step), thereby completing the organic EL display device 50. Note that although the protective layer 60 is formed by the CVD method here, the method is not limited thereto, and the protective layer 60 may also be formed by the ALD method or the inkjet method. [Explanation of symbols]

[0090] 1: film forming apparatus, 3: film forming chamber, 20: transfer unit, 40: transfer unit, W: substrate, M: mask

Claims

1. a film formation chamber for forming a film on a substrate; a first transfer means for transferring a substrate, which is a robot having three degrees of freedom: rotation around a vertical axis, vertical displacement, and radial displacement; a second transport means for transporting the substrate received from the first transport means at the first position to a second position; the second transport means rotates while supporting the substrate, thereby transporting the substrate so that the substrate is oriented in the same direction as when a film is formed at the second position; A film forming apparatus characterized by:

2. 2. The film forming apparatus according to claim 1, a substrate support portion that supports a substrate; a third transport means configured to slide and transport the substrate support in a first direction from the second position to a third position in the film formation chamber where film formation is performed; A film forming apparatus characterized by:

3. 3. The film forming apparatus according to claim 2, the substrate support portion has an electrostatic chuck that attracts the substrate by electrostatic force; A film forming apparatus characterized by:

4. 3. The film forming apparatus according to claim 2, the substrate support portion has a suction pad that suctions the substrate; A film forming apparatus characterized by:

5. 5. The film forming apparatus according to claim 2, the third transport means includes a sliding unit that slides the substrate support unit in the first direction by magnetic force; A film forming apparatus characterized by:

6. 5. The film forming apparatus according to claim 2, the third transport means includes a slide unit that slides the substrate support unit levitated by magnetic force; A film forming apparatus characterized by:

7. 3. The film forming apparatus according to claim 2, the second transport means transports the substrate to a fourth position different from the second position by rotating the substrate while supporting it so that the orientation of the substrate at the fourth position is the same as the orientation of the substrate at the second position; A film forming apparatus characterized by:

8. The film forming apparatus according to claim 7, a fourth transport means configured to slide and transport the substrate in the first direction from the fourth position to a fifth position in the film formation chamber where film formation is performed; A film forming apparatus characterized by:

9. 9. The film forming apparatus according to claim 8, the third position and the fifth position are spaced apart in a second direction intersecting the first direction, the film forming apparatus further includes an evaporation source that moves in the first direction and the second direction; A film forming apparatus characterized by:

10. 2. The film forming apparatus according to claim 1, In the film formation chamber, a film is formed on a substrate through a mask. A film forming apparatus characterized by:

11. The film forming apparatus according to claim 10, the first transport means transports the mask to the first position; the second conveying means conveys the mask from the first position to the second position; A film forming apparatus characterized by:

12. 12. The film forming apparatus according to claim 1, the second position is a position where a film is formed on a substrate in the film formation chamber; A film forming apparatus characterized by:

13. 13. The film forming apparatus according to claim 1, the second conveying means has a mechanism with two degrees of freedom: rotation around a vertical axis and vertical displacement; A film forming apparatus characterized by:

14. A first conveying means for conveying a substrate, which is a robot having three degrees of freedom: rotation around a vertical axis, vertical displacement, and radial displacement; a second transport means for transporting the substrate received from the first transport means at the first position to a second position; the second transport means rotates while supporting the substrate, thereby transporting the substrate at the second position so that the substrate is oriented in a film formation chamber to which the substrate is to be transported. A substrate transport device characterized by:

15. A first transport step of transporting a substrate using a robot with three degrees of freedom: rotation around a vertical axis, vertical displacement, and radial displacement; a second transfer step of transferring the substrate transferred in the first transfer step, which is received at the first position, to a second position; In the second transport step, the substrate is transported at the second position by rotating the substrate while being supported, so that the substrate is oriented in a direction that will be used when film formation is performed. A substrate transport method comprising:

16. a transport step of transporting a substrate by the substrate transport method according to claim 15; a film forming step of forming a film on the substrate transported by the transport step, 1. A method for manufacturing an electronic device comprising the steps of:

Images