Solid manufacturing apparatus and solid manufacturing method

Abstract

The present invention is provided with: a housing; an electromagnetic wave emission device for emitting microwaves or millimeter waves into the housing; an electromagnetic wave generation unit that is disposed in the housing and generates electromagnetic waves while, and a first substrate capable of coming into contact with at least a part of the workpiece serving as the raw material of the workpiece At least one of the housing and the first substrate includes a cooling part for cooling.

Description

[Technical Field]

[0001] Some aspects of the present invention relate to a manufacturing apparatus for manufacturing solids such as metals and ceramics from precursors such as workpieces, and a manufacturing method for manufacturing solids such as metals and ceramics. [Background technology]

[0002] Metal parts used in daily necessities, home appliances, machine tools, etc. are manufactured by further processing ingots and metal steel billets obtained by smelting ores, smelting intermediates, metal-containing industrial waste, scrap, and incineration ash from municipal waste. Similarly, ceramic parts used in daily necessities, home appliances, machine tools, etc. are manufactured through processes such as forming and firing pulverized raw materials, followed by processing. Both the manufacturing processes for metal parts and ceramic parts include at least a portion of a step that requires high temperatures, and since achieving high temperatures can require a lot of energy or time, there is a demand for improving the efficiency of the manufacturing processes. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-158790 [Patent Document 2] Japanese Patent Application Laid-Open No. 2017-145151 [Patent Document 3] Japanese Patent Application Laid-Open No. 2009-035776 [Patent Document 4] Japanese Patent Application Laid-Open No. 2013-216943 [Patent Document 5] Japanese Patent Application Laid-Open No. 2017-145151 [Patent Document 6] International Publication No. 2022 / 195989 [Patent Document 7] International Publication No. 2022 / 196681 Summary of the Invention [Problem to be solved by the invention]

[0004] An object of some aspects of the present invention is to provide a manufacturing apparatus and a manufacturing method that can efficiently manufacture solids, particularly solids of inorganic substances such as metals and ceramics. [Means for solving the problem]

[0005] A solid-state manufacturing apparatus according to some embodiments of the present invention is an apparatus for manufacturing a solid from a workpiece, and includes a housing, an electromagnetic wave emitting device for emitting microwaves or millimeter waves into the housing, and a first base disposed inside the housing and capable of contacting at least a portion of the workpiece while at least protruding into the housing. The solid-state manufacturing apparatus may include a cooling unit for cooling at least one of the housing and the first base.

[0006] The first substrate in the above-mentioned solid state manufacturing apparatus may typically be, for example, at least one of the pressurizing unit 20 and the heat insulating member 80 and microwave absorbing member 90 attached to the pressurizing unit 20 in the solid state manufacturing apparatus shown in FIG. 1 according to some embodiments of the present invention described below, or the stage 50 and the pedestal 135 in the solid state manufacturing apparatus also shown in FIG. 1, but is not limited to these.

[0007] The workpiece in the above-described solid manufacturing apparatus may typically be, for example, the workpiece 130 in the solid manufacturing apparatus shown in FIG. 1 according to some embodiments of the present invention described below, but is not limited to this.

[0008] The cooling section in the solid manufacturing apparatus described above may typically be, for example, the cooling section 1 in the solid manufacturing apparatus shown in FIG. 1 according to some embodiments of the present invention described below, but is not limited thereto.

[0009] Specific examples of the cooling unit include a cooling device equipped with an air jet that sends air or cooled air to at least one of the housing and the first base; a liquid-cooling type cooling device that has a cooling pipe that is in contact with the housing or the first base or is provided inside the housing or the first base and through which a cooling liquid such as water or alcohol passes, and passes the cooled liquid through the cooling pipe; and an electronic cooling mechanism that is in contact with the outside of the housing or the first base or is provided inside the housing or the first base and has a Peltier cooling element or the like.

[0010] In the above-described solid manufacturing apparatus, at least one of the housing and the first substrate has a cooling part, and therefore, for example, when microwaves or millimeter waves are emitted into the housing or the workpiece becomes hot, the following effects are achieved. (1) It is possible to suppress leakage of microwaves or millimeter waves emitted into the housing due to changes in the dimensions of the housing and the first base caused by thermal deformation or thermal expansion due to high temperatures. (2) When microwaves or millimeter waves are emitted into a housing, in cases where the first base is moved from a predetermined position to come into contact with at least a part or all of the workpiece and apply pressure, the first base is prevented from coming into contact with other members or parts due to thermal expansion, etc., when being moved, thereby reducing the risk of malfunction. (3) Even if the workpiece requires a high process temperature, a temperature equal to or higher than the heat-resistant temperature of the housing or the first base can be applied to the workpiece. (4) When a workpiece is processed using microwaves or millimeter waves to obtain a shaped object, by controlling the temperature of the first substrate using a cooling unit while at least a portion of the workpiece is in contact with the first substrate, it is possible to prevent deterioration in shaping accuracy due to thermal expansion of the workpiece or the shaped object, etc.

[0011] The solid manufacturing apparatus may further include a second substrate. The first substrate and the second substrate are preferably configured so that the distance between the first substrate and the second substrate can be changed.

[0012] This makes it possible to appropriately adjust the pressure applied to the workpiece by adjusting the distance between the first substrate and the second substrate.

[0013] In any of the solid manufacturing apparatuses described above, it is preferable that the cooling section is configured to cool the first substrate, and that the first substrate is configured to apply pressure to the workpiece.

[0014] This makes it possible to prevent the workpiece from becoming too hot due to microwaves or millimeter waves emitted inside the housing, and to prevent the first substrate from becoming too hot due to heat conduction from the workpiece to the first substrate, thereby ensuring the safety of users of the solid manufacturing apparatus.

[0015] Any of the above solid state manufacturing apparatuses may further include a third substrate. The third substrate is preferably configured to be disposed between at least one of the workpiece and the first substrate and an emission port for emitting microwaves or millimeter waves from the electromagnetic wave emitting device into the housing during at least a portion of the period during which the electromagnetic wave emitting device emits microwaves or millimeter waves into the housing.

[0016] The third substrate may typically be, for example, the enclosure 40 in the solid manufacturing apparatus shown in FIG. 1 according to some embodiments of the present invention described below, but is not limited to this.

[0017] For example, by providing the third substrate with an appropriate microwave or millimeter wave shielding function, it is possible to control the temperature of the workpiece or the first substrate so that it does not exceed a desired temperature.

[0018] Alternatively, by providing the third substrate with an appropriate microwave or millimeter wave shielding function, it is possible to appropriately adjust the balance between heat conduction from other members to the workpiece and direct heating of the workpiece.

[0019] Furthermore, for example, by providing the third base with an appropriate microwave or millimeter wave absorption function, the temperature of the workpiece can be raised to a temperature required for processing the workpiece.

[0020] Furthermore, for example, by creating an appropriate gap or space between the third substrate and the first substrate or workpiece, another material (hereinafter referred to as "processing auxiliary material") can be placed in the gap or space.

[0021] The processing auxiliary material is preferably disposed so as to cover at least a portion of the workpiece.

[0022] By creating an appropriate space or gap between the third substrate and the first substrate or workpiece, the position where the processing auxiliary material is placed can be determined with the required level of precision. The processing auxiliary material may be, for example, a molded object having a plate-like, concave, or convex shape, and the shape of the molded object may be matched to the space or gap formed between the third substrate and the first substrate or workpiece. Alternatively, the shape of the workpiece, third substrate, or first substrate may be matched to the shape of the molded object.

[0023] As the processing auxiliary material other than the molded product, for example, a processing auxiliary material in the form of particles, powder, liquid, or the like can be used.

[0024] The processing auxiliary material is preferably a material that increases in temperature by absorbing microwaves or millimeter waves and transmits the increased temperature to the workpiece.

[0025] Among these, it is preferable that, for example, microwaves or millimeter waves are emitted into the housing, and in the process of processing the workpiece until the workpiece is sintered or melted, the temperatures of the processing auxiliary material and the workpiece are reversed at a boundary temperature, and the temperature of the workpiece becomes higher than the temperature of the processing auxiliary material after the boundary temperature.

[0026] Alternatively, the microwaves or millimeter waves may be adjusted so that the temperatures of the processing aid material and the workpiece are reversed at the boundary temperature during the process of sintering or melting the workpiece during processing. For example, if the workpiece has a higher conductivity than the processing aid, and the processing aid has a higher dielectric constant than the workpiece, the processing aid material can be heated using the electric field component of the microwave at the start of processing the workpiece, and then heating can be switched to using the magnetic field component of the microwave, so that the temperatures of the processing aid material and the workpiece are reversed during the temperature change until the workpiece is sintered or melted.

[0027] Conversely, if the workpiece has a higher dielectric constant than the processing aid and the processing aid has a higher conductivity than the workpiece, the magnetic field component of the microwave can be used at the start of processing the workpiece, and the electric field component of the microwave can be used midway through, so that the temperature of the processing aid can be raised from a state in which it is initially higher than the workpiece during the time it takes for the workpiece to reach the processing temperature from the start of processing to a state in which it is higher than the processing aid.

[0028] The processing aid may be, for example, but is not limited to, the promoter 400 described below. The processing aid may be, for example, but is not limited to, a material similar to the promoter 400 described below.

[0029] In the solid manufacturing apparatus, it is preferable that at least one of the housing, the first base, and the second base is provided with a cooling unit.

[0030] This makes it possible to prevent the workpiece from becoming extremely hot, for example, when pressure is applied to the workpiece by the first substrate and the second substrate.

[0031] In any of the above solid manufacturing apparatuses, it is preferable that a third substrate, which is a member or a plurality of powders or a plurality of particles, is placed surrounding at least a portion of the workpiece during at least a portion of the period during which at least microwaves or millimeter waves are emitted into the housing.

[0032] The member, the plurality of powders, or the plurality of particles is preferably, for example, the processing aid described above.

[0033] In any of the solid manufacturing apparatuses described above, the first substrate is preferably configured to apply pressure to the workpiece.

[0034] With the above-described configuration of the solid manufacturing apparatus, pressure may be applied to the workpiece using the first substrate during at least part of the period during which microwaves or millimeter waves are emitted into the housing. This allows pressure to be applied to the workpiece, for example, during sintering or melting, making it possible to manufacture a solid having a denser structure from the workpiece.

[0035] Even during periods when microwaves or millimeter waves are not being emitted into the housing, pressure may be applied to the workpiece using the first base. As a result, for example, if the workpiece is an aggregate of powdery or particulate matter, the aggregate tends to crumble before sintering or melting and the shape is not uniform, but by applying pressure using the first base, the tendency to crumble can be reduced and the aggregate can be made to have a uniform shape.

[0036] When the workpiece is an aggregate of powdered or particulate matter, applying pressure to the aggregate using a first substrate reduces the tendency of the aggregate to crumble or keeps its shape more constant.This improves the reproducibility of the positional relationship and degree of contact between the workpiece and the processing aid when the processing aid described above is placed in contact with at least a portion of the workpiece, or when the processing aid is placed so as to cover at least a portion of the workpiece, making it easier to ensure the reproducibility of the properties, shape, or performance of the solid obtained from the workpiece.

[0037] In the above-described solid state manufacturing apparatus, it is preferable that the third substrate includes a first portion having a first transmittance for microwaves or millimeter waves and a second portion having a second transmittance for microwaves or millimeter waves, and that the first transmittance and the second transmittance are different from each other.

[0038] With this configuration, for example, it is possible to heat the workpiece to be processed while suppressing heating of the first base.

[0039] In any of the above third substrates, it is preferable that the first transmittance is higher than the second transmittance, and that the distance between the first portion and the workpiece is smaller than the distance between the second portion and the workpiece during at least a portion of the period during which at least microwaves or millimeter waves are emitted into the interior of the housing.

[0040] With this configuration, for example, microwaves or millimeter waves can be concentrated on the workpiece when heating the workpiece. Furthermore, for example, during at least a portion of the time period during which microwaves or millimeter waves are emitted into the housing, the second substrate or the first substrate can be prevented from becoming excessively hot. This makes it possible to prevent malfunction of the mechanical mechanism due to thermal deformation or thermal expansion of the second substrate or the first substrate when the second substrate or the first substrate is moved within the housing using the mechanical mechanism.

[0041] In any of the solid manufacturing apparatuses described above, it is preferable that the first substrate has a first portion and a second portion, and that the first portion absorbs microwaves or millimeter waves more than the second portion.

[0042] This makes it possible, for example, to heat the first base by emitting microwaves or millimeter waves into the housing while the first portion of the first base is in contact with the workpiece, and the heat from this heat can also heat the workpiece.

[0043] In any of the above solid state manufacturing apparatuses, it is preferable that a third portion be provided between the first portion and the second portion, and that the thermal conductivity of the third portion be lower than the thermal conductivity of at least one of the first portion and the second portion. In such a configuration, even if the first portion becomes hot due to microwaves or millimeter waves emitted into the housing, for example, the provision of a third portion between the first portion and the second portion, which has a thermal conductivity lower than that of the second portion, can suppress heat conduction from the first portion to the second portion.

[0044] For example, when the second part of the first base moves through a hole provided in the housing by a mechanical control unit, the third part suppresses the conduction of heat from the first part to the second part, thereby suppressing thermal deformation and thermal expansion of the second part and reducing the risk of obstruction to the movement of the second part.

[0045] In any of the above solid-state manufacturing apparatuses, it is preferable that the first portion of the first substrate is configured to be in contact with at least a portion of the workpiece during at least a portion of the period during which the electromagnetic wave emitting device emits microwaves or millimeter waves into the housing.

[0046] In such a configuration, for example, the first portion of the first base absorbs microwaves or millimeter waves, and the generated heat can be transferred to the workpiece, thereby improving the efficiency of processing the workpiece.

[0047] A solid manufacturing apparatus according to some embodiments of the present invention is an apparatus for manufacturing a solid from a workpiece, and includes a housing, an electromagnetic wave emitting device for emitting microwaves or millimeter waves into the housing, a stage arranged within the housing on which the workpiece that serves as the raw material for the solid is placed, and a solid receiving section that receives the solid when it is transferred from inside the housing to outside the housing, and is configured so that the solid is formed on the stage.

[0048] With this configuration, for example, even though the solids are hot after production, they can be safely removed from the housing. Furthermore, the solids transferred to the solid receiving section are cooled in the solid receiving section, allowing for safe operation of the device.

[0049] In the solid manufacturing apparatus described above, it is preferable that the solid can be delivered to the solid receiving section by moving the stage, or that the solid can be delivered to the solid receiving section by moving the stage in a direction in which the solid approaches the solid receiving section from inside the housing.

[0050] With this configuration, the solid produced from the solid production apparatus can be easily taken out of the housing.

[0051] In the above solid manufacturing apparatus, it is preferable that the solid receiving section has a first space therein and is configured by a frame member surrounding the first space, and the stage is configured to be movable inside the frame member.

[0052] In the solid manufacturing apparatus, the frame member is preferably attached below the housing.

[0053] In the solid-state manufacturing apparatus described above, it is preferable that the housing further has a protrusion protruding from a first surface inside the housing toward a second surface opposite the first surface, a second space is formed inside the protrusion, and the stage is configured to be movable in the second space. The protrusion may be, for example, but is not limited to, an enclosure 40 of some embodiments of the solid-state manufacturing apparatus according to the present invention, which will be described later.

[0054] In the above-mentioned solid manufacturing apparatus, it is preferable that the solid receiving section is connected to the housing directly or via another member, and is configured to be able to receive the solid by moving the stage through the first space.

[0055] In the above-mentioned solid manufacturing apparatus, it is preferable that the solid receiving portion and the protruding portion are configured so that the first space and the second space can be connected directly or via at least one member having a space therein.

[0056] In the above-mentioned solid manufacturing apparatus, it is preferable that the first space and the second space are configured to be connectable directly or via at least one member having a space therein during a first period which is at least a part of the period during which microwaves or millimeter waves are emitted into the housing.

[0057] In the solid manufacturing apparatus, the solid receiving section is preferably configured to be movable in a direction along the first surface or a direction intersecting the first surface.

[0058] A method for producing a solid according to some embodiments of the present invention is a method for producing a solid from a workpiece, comprising a first step and a second step, wherein the workpiece and a first member are placed inside a housing during at least a part of the first step, and the workpiece is sintered or melted during at least a part of the second step, the period during which the second step is carried out comprises at least a first period and a second period, microwaves or millimeter waves are emitted inside the housing during both the first period and the second period, at least a part of the workpiece is in contact with the first member, and the temperature of the first member is higher than the temperature of the workpiece, and during the second period the temperature of the first member is lower than the temperature of the workpiece.

[0059] With the above-described method for producing a solid, for example, heat conduction from the first member to the workpiece is relatively reduced in the second period compared to that in the first period, and the workpiece begins to absorb microwaves or millimeter waves spontaneously, allowing the workpiece to quickly reach a temperature at which it can absorb microwaves or millimeter waves, making it possible to sinter or melt the workpiece efficiently overall.

[0060] In the above-described method for producing a solid, it is preferable that the workpiece reaches a temperature at which the workpiece sinters or melts during at least a part of the second period.

[0061] In the above-described method for producing a solid, it is preferable that at least a portion of the workpiece is in contact with the second member during at least a part of the first period. In the above-described method for producing a solid, an example of a mode in which microwaves or millimeter waves are emitted into the housing when the first member is in contact with at least a portion of the workpiece and the second member is in contact with at least a portion of the workpiece includes, but is not limited to, a mode in which microwaves or millimeter waves are emitted when a microwave-absorbing member 90 and a promoter 400 are in contact with the workpiece 130 as shown in FIG. 11 (described later).

[0062] In any of the above-described methods for producing a solid, the first member is preferably a molded product, a particle aggregate, or a powder aggregate. Examples of molded products include a plate, a dish, a doughnut, and the like, and the shape can be appropriately selected depending on the shape of the workpiece. If the particle aggregate or powder aggregate does not have a stable shape as an aggregate, it can assume a shape corresponding to the shape of the workpiece. Therefore, for example, if the first member is endowed with a thermal conductivity function to the workpiece, it can efficiently transfer heat to the workpiece.

[0063] In the above-described method for producing a solid, it is preferable that the first member includes a first material and a second material, and that the microwave absorption efficiency of the first material is greater than the microwave absorption efficiency of the second material. In the above-described method for producing a solid, if the first member is made of only the first material, for example, the microwave absorption of the first member may become large, making it difficult for the workpiece to spontaneously absorb microwaves.

[0064] In the above-described method for producing a solid, the melting point of the second material is preferably higher than the melting point of the first material, which makes it possible to impart heat resistance to the first member, for example.

[0065] In the above-described method for producing a solid, the heat insulating property of the second material is preferably greater than the heat insulating property of the first material, thereby imparting heat insulating properties to the first member, for example.

[0066] In the above-described method for producing a solid, the workpiece is preferably an aggregate of powder or a compact of an aggregate of powder.

[0067] In the above-described method for producing a solid, the second member preferably includes a third material and a fourth material, and the microwave absorption efficiency of the third material is greater than the microwave absorption efficiency of the fourth material. Note that the first member may be, for example, at least one of microwave absorbing member 90 and promoter 400 in this embodiment according to some aspects of the present invention, but is not limited thereto.

[0068] In some embodiments of the present invention, a component (hereinafter referred to as a "process component") used in a process using electromagnetic waves such as microwaves or millimeter waves preferably contains a microwave-absorbing material that absorbs microwaves. The process component includes a first component and a second component. The process component is also called a promoter. By using the process component, for example, it can play a role in conducting heat to the workpiece at least in the initial stage of microwave processing of the workpiece. The microwave-absorbing material includes, for example, a carbon-containing material. Examples of carbon-containing materials include carbon black, amorphous carbon, graphite, silicon carbide, carbon resin, and metal carbide. Other examples of microwave-absorbing materials include metal particles, metal nitrides, metal oxides, and metal borides. A mixture of at least two of the above-mentioned materials may also be used.

[0069] Preferably, the process element further includes a heat insulating material. Examples of heat insulating materials include metal oxides and semi-metal oxides. Examples of metal and semi-metal oxides include aluminum oxide (Al2O3), silicon oxide (SiO2), magnesium oxide (MgO), zirconium oxide (ZrO2), and titanium oxide (TiO2). For example, the melting point of aluminum oxide (Al2O3) is 2072°C. The melting point of silicon oxide (SiO2) is 1710°C. The melting point of magnesium oxide (MgO) is 2852°C. The heat insulating material may be a compound or a mixture thereof.

[0070] The process element may include a refractory material having a higher melting point than the microwave absorbing material, such as carbon and a reducing material that reduces the silicon carbide workpiece.

[0071] The mass ratio of the microwave absorbing material to the heat insulating material in the process member is preferably selected so that the process member absorbs relatively more microwaves than the workpiece 130 in at least a part of the temperature range lower than the temperature range where the microwave absorption efficiency of the workpiece increases, and so that the workpiece absorbs relatively more microwaves than the process member in at least a part of the temperature range higher than the temperature range where the microwave absorption efficiency of the workpiece increases.

[0072] Alternatively, the mass ratio of the microwave absorbing material to the heat insulating material in the process member is preferably set so that the temperature of the process member is relatively higher than the temperature of the workpiece in at least a part of the temperature range up to the sintering or melting temperature of the workpiece, and so that the temperature of the workpiece is relatively higher than the temperature of the process member in at least a part of the temperature range after the sintering or melting temperature of the workpiece is reached.

[0073] The mass ratio of microwave absorbing material to insulating material in a typical process element is preferably 1:1, or the mass ratio of insulating material is greater than the mass ratio of microwave absorbing material. For example, the mass ratio of microwave absorbing material in a process element is 1% by mass or more, 2% by mass or more, or 5% by mass or more, and 70% by mass or less, 50% by mass or less, 40% by mass or less, 30% by mass or less, 20% by mass or less, or 10% by mass or less, and may be selected appropriately depending on the desired processing conditions.

[0074] It should be noted that the meanings of "microwave absorbing" in "microwave absorbing material" and "thermal insulating" in "thermal insulating material" do not necessarily refer to absolute microwave absorption and thermal insulating properties, respectively, and also include, for example, the microwave absorption of a microwave absorbing material being higher than the microwave absorption of a thermal insulating material. Also, the thermal insulating property of a thermal insulating material being higher than the thermal insulating property of a microwave absorbing material.

[0075] According to some embodiments of the present invention, a method for producing a solid from a workpiece includes a first step and a second step, wherein the first step comprises arranging the workpiece and a first member inside a housing, and the second step comprises sintering or melting the workpiece, and the second step is carried out in a first temperature range in which the temperature of the workpiece or the first member is equal to or higher than a first temperature and equal to or lower than a second temperature, and in a second temperature range in which the temperature of the workpiece or the first member is equal to or higher than a third temperature and equal to or lower than a fourth temperature, wherein microwaves or millimeter waves are emitted into the housing in the first and second temperature ranges, and the microwave absorption efficiency of the first member in the first temperature range is greater than that of the workpiece, and the microwave absorption efficiency of the workpiece in the second temperature range is greater than that of the first member. Note that in the above-described method for producing a solid, the temperature of the workpiece or the first member may change over time within the first temperature range or the second temperature range.

[0076] In the above-mentioned method for producing a solid, the second step preferably includes a first substep and a second substep, the first substep being carried out in a first temperature range, the second substep being carried out in a second temperature range, and the first substep being carried out before the second substep.

[0077] By the above-described method for producing a solid, for example, the workpiece quickly reaches a temperature at which it can absorb microwaves or millimeter waves, and then the workpiece itself absorbs the microwaves, making it possible to sinter or melt the workpiece efficiently overall.

[0078] In the above method for producing a solid, the third temperature is preferably higher than the second temperature.

[0079] In the above-described method for producing a solid, the second temperature range preferably includes a sintering temperature at which the workpiece is sintered or a melting temperature at which the workpiece is melted.

[0080] In the above-described method for producing a solid, the first temperature, the second temperature, the third temperature, and the fourth temperature are preferably the temperatures of the workpiece and the first member.

[0081] A method for manufacturing a metal product according to some embodiments of the present invention includes a first step and a second step, wherein raw materials for the metal product and a first member are placed inside a housing during at least a portion of the first step, and the raw materials are sintered or melted during at least a portion of the second step. The period during which the second step is carried out includes at least a first period and a second period, microwaves or millimeter waves are emitted inside the housing during both the first period and the second period, at least a portion of the raw materials are in contact with the first member, and the temperature of the first member is higher than that of the raw materials, and the temperature of the first member is lower than that of the raw materials during the second period. During at least a portion of the second period, the raw materials reach a temperature at which the workpiece sinters or melts. The metal product is, for example, a metal solid.

[0082] A method for producing a solid according to some embodiments of the present invention is a method for producing a solid from a workpiece, comprising a first step of placing the workpiece and a first member inside a housing, and a second step of sintering or melting the workpiece while at least a portion of the workpiece is in contact with the first member, wherein the period during which the second step is carried out includes at least a first period and a second period, microwaves or millimeter waves are emitted inside the housing during both the first period and the second period, and during the first period the temperature of the first member is higher than the temperature of the workpiece, and during the second period the temperature of the first member is lower than the temperature of the workpiece.

[0083] With the above-described method for producing a solid, for example, heat conduction from the first member to the workpiece is relatively reduced in the second period compared to that in the first period, and the workpiece begins to absorb microwaves or millimeter waves spontaneously, allowing the workpiece to quickly reach a temperature at which it can absorb microwaves or millimeter waves, making it possible to sinter or melt the workpiece efficiently overall.

[0084] In the above-described method for producing a solid, it is preferable that the workpiece reaches a temperature at which the workpiece sinters or melts during at least a part of the second period.

[0085] A solid manufacturing apparatus according to some embodiments of the present invention is a solid manufacturing apparatus for manufacturing a solid from a workpiece, and comprises a housing, an electromagnetic wave emitting device for emitting microwaves or millimeter waves into the interior of the housing, and a first substrate disposed inside the housing and capable of contacting at least a portion of the workpiece while at least protruding into the interior of the housing.

[0086] In the above-described solid-state manufacturing apparatus, for example, a configuration that enables temperature measurement at multiple locations in the solid-state manufacturing apparatus, particularly multiple locations inside the housing, is preferable. For example, the temperature may be measured at multiple locations on the inner wall of the housing or multiple locations on the first substrate. Furthermore, if the above-described solid-state manufacturing apparatus includes a second substrate, the configuration may be such that the temperature of multiple locations on the second substrate is measured. Also, a thermometer may be provided for each of at least two of the interior of the housing, the first substrate, and the second substrate. For example, if there is a difference in temperature measured at multiple locations, it is preferable to adjust at least one of the time for emitting microwaves or millimeter waves into the housing and the intensity of the microwaves or millimeter waves so that the difference falls within a predetermined range.

[0087] A solid manufacturing apparatus according to some embodiments of the present invention is a solid manufacturing apparatus for manufacturing a solid from a workpiece, and comprises a housing, an electromagnetic wave emitting device for emitting microwaves or millimeter waves into the housing, and a first substrate disposed inside the housing and capable of contacting at least a portion of the workpiece while at least protruding into the housing, at least a portion of the housing being composed of multiple layers.

[0088] In the solid manufacturing apparatus, at least one of the plurality of layers is preferably made of a metal material, and more preferably at least two of the plurality of layers are made of a metal material. At least one of the plurality of layers is preferably made of a heat insulating material.

[0089] According to some embodiments of the present invention, a solid-state manufacturing apparatus for manufacturing a solid from a workpiece includes a housing, an electromagnetic wave emitting device for emitting microwaves or millimeter waves into the housing, and a first base disposed inside the housing and capable of contacting at least a portion of the workpiece while at least protruding into the housing, and the apparatus includes a plurality of electromagnetic wave emitting devices for emitting microwaves or millimeter waves. This makes it less likely that the microwaves or millimeter waves will become out of phase with each other inside the housing, thereby reducing the risk of sparks or the like due to the generation of hot spots.

[0090] In the above-described solid state manufacturing apparatus, the multiple generators are preferably configured so that the phases of the microwaves or millimeter waves emitted by them do not coincide. Specifically, when the multiple generators are multiple microwave generators, the anisotropy of the cross-sectional shape of a waveguide corresponding to microwave generation by one of the multiple microwave generators may be made different from the anisotropy of the cross-sectional shape of a waveguide corresponding to the other microwave generators. Furthermore, the frequency of the microwaves or millimeter waves may be changed over time. Details will be described in the section describing the solid state manufacturing apparatus according to some aspects of the present invention.

[0091] A solid manufacturing apparatus according to some embodiments of the present invention is a solid manufacturing apparatus for manufacturing a solid from a workpiece, and comprises a housing, an electromagnetic wave emitting device for emitting microwaves or millimeter waves into the housing, and a first substrate disposed inside the housing and capable of contacting at least a portion of the workpiece while at least protruding into the housing, and may further comprise a function for applying pressure to or shaping the workpiece.

[0092] The solid manufacturing apparatus may be configured to apply pressure to or shape the workpiece inside the housing. The timing for applying pressure to or shaping the workpiece may be at least part of the period during which microwaves or millimeter waves are emitted into the housing, or may be after the workpiece has been sintered or melted to obtain a solid.

[0093] A solid-state manufacturing apparatus according to some embodiments of the present invention is an apparatus for manufacturing a solid from a workpiece, comprising a housing, an electromagnetic wave emitting device for emitting microwaves or millimeter waves into the housing, and a moving device for moving the workpiece into the housing. The moving device moves the workpiece, for example, using at least a portion of a moving path from outside the housing to inside the housing. The solid-state manufacturing apparatus is preferably configured to move the workpiece in a first direction from a point where it is introduced to reach the first point, and then move the workpiece in a direction intersecting the first direction to reach a second point. In the solid-state manufacturing apparatus, typically, the first direction is preferably a direction along the bottom of the housing, and the second direction is preferably a direction intersecting the bottom.

[0094] In some embodiments of the present invention, the member is a member used for sintering or melting a workpiece, wherein the member has a higher microwave absorption efficiency than the workpiece when the workpiece or member is at a first temperature range above a first temperature and below a second temperature, and the member has a higher microwave absorption efficiency than the workpiece when the workpiece or member is at a second temperature range above a third temperature and below a fourth temperature, and the member is used for sintering or melting the workpiece with at least a portion of the workpiece in contact with the member, and the third temperature is higher than the second temperature.

[0095] The above-described members (hereinafter referred to as "process members") can, for example, efficiently raise the temperature of the workpiece to a temperature range where microwaves can be easily absorbed, thereby achieving the effect of promoting the sintering or melting of the workpiece.

[0096] The above-mentioned member may be a powder or a molded product.

[0097] The process member preferably includes a microwave absorbing material that absorbs microwaves. This allows the process member to, for example, conduct heat to the workpiece at least in the initial stage of microwave processing of the workpiece. The microwave absorbing material includes, for example, a carbon-containing material. Examples of carbon-containing materials include carbon black, amorphous carbon, graphite, silicon carbide, carbon resin, and metal carbide. Examples of microwave absorbing materials include metal particles, metal nitrides, metal oxides, and metal borides. A mixture of at least two of the above-listed materials may also be used.

[0098] Preferably, the process element further includes a heat insulating material. Examples of heat insulating materials include metal oxides and semi-metal oxides. Examples of metal and semi-metal oxides include aluminum oxide (Al2O3), silicon oxide (SiO2), magnesium oxide (MgO), zirconium oxide (ZrO2), and titanium oxide (TiO2). For example, the melting point of aluminum oxide (Al2O3) is 2072°C. The melting point of silicon oxide (SiO2) is 1710°C. The melting point of magnesium oxide (MgO) is 2852°C. The heat insulating material may be a compound or a mixture thereof.

[0099] The process element may include a refractory material having a higher melting point than the microwave absorbing material, such as carbon and a reducing material that reduces the silicon carbide workpiece.

[0100] The mass ratio of the microwave absorbing material to the heat insulating material in the process member is preferably selected so that the process member absorbs relatively more microwaves than the workpiece 130 in at least a part of the temperature range lower than the temperature range where the microwave absorption efficiency of the workpiece increases, and so that the workpiece absorbs relatively more microwaves than the process member in at least a part of the temperature range higher than the temperature range where the microwave absorption efficiency of the workpiece increases.

[0101] Alternatively, the mass ratio of the microwave absorbing material to the heat insulating material in the process member is preferably set so that the temperature of the process member is relatively higher than the temperature of the workpiece in at least a part of the temperature range up to the sintering or melting temperature of the workpiece, and so that the temperature of the workpiece is relatively higher than the temperature of the process member in at least a part of the temperature range after the sintering or melting temperature of the workpiece is reached.

[0102] The mass ratio of microwave absorbing material to insulating material in a typical process element is preferably 1:1, or the mass ratio of insulating material is greater than the mass ratio of microwave absorbing material. For example, the mass ratio of microwave absorbing material in a process element is 1% by mass or more, 2% by mass or more, or 5% by mass or more, and 70% by mass or less, 50% by mass or less, 40% by mass or less, 30% by mass or less, 20% by mass or less, or 10% by mass or less, and may be selected appropriately depending on the desired processing conditions.

[0103] It should be noted that the meanings of "microwave absorbing" in "microwave absorbing material" and "thermal insulating" in "thermal insulating material" do not necessarily refer to absolute microwave absorbing and thermal insulating properties, respectively, and also include, for example, the microwave absorbing property of a microwave absorbing material being higher than the microwave absorbing property of a thermal insulating material. Also, the thermal insulating property of a thermal insulating material being higher than the thermal insulating property of a microwave absorbing material.

[0104] The details of the means for solving the above-mentioned problems will be further explained in the embodiments of the present invention described below. [Effects of the Invention]

[0105] According to some aspects of the present invention, for example, it is possible to provide a manufacturing apparatus capable of manufacturing a solid and a method for manufacturing a solid. [Brief explanation of the drawings]

[0106] [Figure 1]FIG. 1 is a schematic diagram of a solid manufacturing apparatus according to some aspects of the present invention. [Figure 2] FIG. 2 is a schematic diagram of a solid manufacturing apparatus according to some aspects of the present invention. [Figure 3] FIG. 3 is a schematic diagram of a solid manufacturing apparatus according to some aspects of the present invention. [Figure 4] FIG. 4 is a schematic diagram of a solid manufacturing apparatus according to some aspects of the present invention. [Figure 5] FIG. 5 is a schematic diagram of a solid manufacturing apparatus according to some aspects of the present invention. [Figure 6] FIG. 6 is a schematic diagram of a solid manufacturing apparatus according to some aspects of the present invention. [Figure 7] FIG. 7 is a schematic diagram of a solid manufacturing apparatus according to some aspects of the present invention. [Figure 8] FIG. 8 is a schematic diagram of a solid manufacturing apparatus according to some aspects of the present invention. [Figure 9] FIG. 9 is a schematic diagram of a solid manufacturing apparatus according to some aspects of the present invention. [Figure 10] FIG. 10 is a schematic diagram of a solid manufacturing apparatus according to some aspects of the present invention. [Figure 11] FIG. 11 is a schematic diagram of a solid manufacturing apparatus according to some aspects of the present invention. [Figure 12] FIG. 12 is a schematic diagram of a solid manufacturing apparatus according to some aspects of the present invention. [Figure 13] FIG. 13 is a schematic diagram of a solid manufacturing apparatus according to some aspects of the present invention. [Figure 14] FIG. 14 is a schematic diagram of a solid manufacturing apparatus according to some aspects of the present invention. [Figure 15] FIG. 15 is a schematic diagram of a solid manufacturing apparatus according to some aspects of the present invention. [Figure 16] FIG. 16 is a schematic diagram of a solid manufacturing apparatus according to some aspects of the present invention. [Figure 17] FIG. 17 is a schematic diagram of a solid manufacturing apparatus according to some aspects of the present invention. [Figure 18] FIG. 18 is a schematic diagram of a solid manufacturing apparatus according to some aspects of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0107] Hereinafter, embodiments according to several aspects of the present invention will be described with reference to Figures 1 to 18. However, the drawings are schematic, and actual dimensions etc. can be set appropriately according to the gist of the aspects.

[0108] A typical basic configuration of a solid manufacturing apparatus according to an embodiment of the present invention will be described.

[0109] As shown in FIG. 1, the solid manufacturing apparatus according to the embodiment includes a microwave heating chamber, which includes a housing 10, a cooling unit 1 for cooling the housing 10, a blower 15, a position sensor 16, a thermometer 19a, a thermometer 19b, a pressurizing unit 20, gas supply units 21 to 23 for supplying a plurality of types of gas, a microwave generator 30 for emitting microwaves into the housing 10, and a stage 50 for placing a workpiece 130 thereon.

[0110] The solid manufacturing apparatus according to the embodiment further includes a transport unit 300 for moving the workpiece 130 to the stage 50, a transport table 250 for transporting the workpiece 130 to the stage 50, a solid receiving unit 100 for receiving the solid obtained after processing the workpiece 130, a shaft 120 for moving the solid receiving unit 100 on the support table 51, a shaft connection unit 110 for connecting the solid receiving unit 100 and the shaft 120, a shaft drive unit 125 for driving the shaft 120, a load receiving unit 60 for receiving a load applied to the support table 51, and a base unit 55 for supporting the stage 50 and the load receiving unit 60.

[0111] The solid manufacturing apparatus includes a raw material supply stage 200. Before the workpiece 130 is moved from outside the housing 10 toward the stage 50 inside the housing 10, the workpiece 130 is placed on the raw material supply stage 200. The raw material supply stage 200 can be made of the same material as the stage 50 described below.

[0112] The transport table 250 can be used, for example, to move the workpiece 130 from the raw material supply stage 200 outside the housing 10 toward the stage 50 inside the housing 10 by the transport unit 300.

[0113] It is preferable that a space be provided between the transport table 250 in the solid manufacturing apparatus and the portion forming the bottom of the housing 10. This allows the workpiece 130 and the transport part 300 to move through the space toward the stage 50.

[0114] The solid manufacturing apparatus may include a stopper 11 that protrudes from the bottom of the housing 10, which is a surface portion facing the pressure unit 20, in the opposite direction to the pressure unit 20, i.e., toward the outside of the housing 10. The stopper 11 is configured, for example, to prevent the transport unit 300 from reaching above the shaft 120 when the transport unit 300 moves the workpiece 130 above the stage 50.

[0115] Typically, the housing 10 preferably comprises multiple layers, as shown in FIG. 18 . The solid-state manufacturing apparatus according to this embodiment is composed of three layers, layer 10a, layer 10b, and layer 10c, from the inside of the housing. Various alloys or pure metals can be used as materials for layers 10a and 10c. For example, steel, stainless steel, aluminum, etc. can be used. However, metals that allow microwave-induced current to easily flow are more likely to concentrate microwave energy on the workpiece 130. Therefore, metals or alloys with an electrical conductivity of 17.5% or more IACS% (volume resistivity of annealed standard soft copper), such as iron, are preferred. Furthermore, metals or alloys with an IACS% of 55% or more, such as aluminum, are preferred. In particular, metals or alloys with an IACS% of 75% or more, such as copper, are preferred. The material of layer 10a and the material of layer 10c may be different, but it is preferable that the material of layer 10a located on the inside of housing 10, i.e., inside the microwave heating chamber, has a higher electrical conductivity than the material of layer 10c on the outside, for example, when there are restrictions on manufacturing cost, dimensional accuracy, strength, etc.

[0116] The layer 10b is preferably made of a heat insulating material. The heat insulating material is preferably a material that can withstand a heat temperature of 400°C or higher, more preferably 500°C or higher. The material is preferably glass fiber or ceramic fiber. Examples of such materials include Miolex (registered trademark), Losnaboard (registered trademark), glass epoxy, Besthermo, BLA-GLA (registered trademark), Calhoun, and Hemisal (registered trademark).

[0117] The stage 50 on which the workpiece 130 is placed can be made of, for example, a metal such as stainless steel or aluminum, or a ceramic such as aluminum oxide or aluminum nitride. A pedestal 135 may be provided on the stage 50, and the workpiece 130 may be placed on the pedestal 135. For example, an opening may be provided in the bottom surface of the housing 10, and the stage 50 may pass through the opening in the housing 10 to move in and out of the housing 10.

[0118] The position sensor 16 detects the position of the workpiece 130 placed on the stage 50. The stage 50, for example, moves toward the pressure unit 20 until the position sensor 16 detects the workpiece 130. A non-contact type position sensor is preferably used as the position sensor 16 used in the solid-state manufacturing apparatus according to this embodiment. The reason for using such a non-contact type position sensor is that, for example, the temperature inside the housing 10 can become high, or it can be difficult to secure space inside the housing 10 due to the presence of many components, such as the pressure unit 20 and the enclosure 40 described below. Examples of non-contact type position sensors that can be used include linear transducer types using electromagnetic induction or magnetostriction, linear encoder types that obtain electrical output according to position, and optical sensor types that measure length using light such as laser light. Which type of position sensor is used can be selected appropriately depending on the desired measurement accuracy and the internal layout of the housing 10. However, since the solid-state manufacturing apparatus according to this embodiment requires high measurement accuracy, an optical sensor type, which has relatively high measurement accuracy among non-contact type position sensors, is used.

[0119] The pressurizing unit 20 applies pressure to the workpiece 130 placed on the stage 50. For example, a microwave absorbing member 90 having a higher microwave absorption performance than the pressurizing unit 20 and generating heat by absorbing microwaves can be attached to the pressurizing unit 20. In this case, it is preferable to place a heat insulating member 80 having a higher heat insulating performance than the microwave absorbing member 90 between the pressurizing unit 20 and the microwave absorbing member 90. This suppresses heat conduction to the pressurizing unit 20 even if the workpiece 130 or the microwave absorbing member 90 becomes hot due to microwave absorption, making it possible to reduce malfunctions and risks to the user when the pressurizing unit 20 is moved, for example.

[0120] The pressurizing unit 20 may apply pressure to the solid 140 obtained by processing such as sintering or melting. In this case, it is preferable to apply pressure when the solid 140 has heat and is at a temperature higher than a predetermined temperature before being cooled to the predetermined temperature. The pressure to be applied is, for example, 1 MPa or more, 100 MPa or more, or 200 MPa or more, and 2000 MPa or less, 1900 MPa or less, or 1800 MPa or less. By applying pressure, the obtained solid 140 can be further densified.

[0121] Furthermore, by applying the above-mentioned pressure by the pressure applying unit 20 in a state where a new workpiece 130 is placed above the solid 140 as shown in FIG. 7, it is possible to increase the bonding strength between the layers of the solid bonded body 141 produced from the solid 140 and the workpiece 130 as shown in FIG. 8.

[0122] The heat insulating member 80 provided in the pressure applying unit 20 preferably has a function of suppressing heat conduction to the pressure applying unit 20 even when, for example, the workpiece 130, the microwave absorbing member 90, or the inside of the housing 10 becomes hot. It is preferable to use a material for the heat insulating member 80 whose thermal conductivity is lower than that of the microwave absorbing member 90.

[0123] The material of the heat insulating member 80 is preferably an inorganic material containing, for example, 50% or more of aluminum oxide or silicon oxide, or may contain silicate such as calcium silicate.

[0124] The microwave absorbing member 90 provided in the pressure applying unit 20 comes into contact with the workpiece 130, for example, when the pressure applying unit 20 applies pressure to the workpiece 130. The material of the microwave absorbing member 90 is preferably selected so that, for example, in a first temperature range where the workpiece 130 or the microwave absorbing member 90 is at or above a first temperature and at or below a second temperature, the microwave absorption efficiency of the microwave absorbing member 90 is higher than that of the workpiece 130, and in a second temperature range where the workpiece 130 or the microwave absorbing member 90 is at or above a third temperature and at or below a fourth temperature, the microwave absorption efficiency of the workpiece 130 is higher than that of the microwave absorbing member 90. Note that the second temperature is preferably lower than the third temperature.

[0125] Preferred materials for the microwave absorbing member 90 include wide-gap semiconductors such as silicon carbide, oxygen-containing anion salts such as zinc oxide and lead zirconate titanate, conductive particles such as graphite and titanium, or metal powder or particles. It is even more preferred to use a molded product such as a plate obtained by mixing the above-mentioned materials with a material having a lower microwave absorption rate than the above-mentioned materials, such as an inorganic material such as alumina or silicon oxide, or cement, and then appropriately sintering or baking the mixture. This can, for example, impart higher mechanical strength to the microwave absorbing member 90. Alternatively, it can adjust the ratio of heat conduction from the microwave absorbing member 90 to direct heating of the workpiece 130 by microwaves during the heating process of the workpiece 130.

[0126] The raw material of the microwave absorbing member 90 may be formed or processed from a material or mixture similar to that of the promoter 400 described later.

[0127] It should be noted that the meanings of "thermal insulation" in "thermal insulation member" and "microwave absorption" in "microwave absorbing member" do not necessarily mean absolute thermal insulation and microwave absorption, respectively, and also include, for example, the meaning that, as a condition for manufacturing using the solid-state manufacturing apparatus according to this embodiment, the thermal insulation of the thermal insulation member 80 is relatively higher than the thermal insulation of the microwave absorbing member 90. Also, as a condition for manufacturing using the solid-state manufacturing apparatus according to this embodiment, the meaning includes the meaning that the microwave absorption efficiency of the microwave absorbing member 90 is relatively higher than the microwave absorption efficiency of the thermal insulation member 80.

[0128] 1 may include, for example, a plate jig 95 that attaches the microwave absorbing member 90 and the heat insulating member 80 to the pressurizing unit 20. The plate jig 95 may be configured to attach at least one of the microwave absorbing member 90 and the heat insulating member 80 to the pressurizing unit 20.

[0129] As shown in Fig. 13, the workpiece 130 may be processed using electromagnetic waves such as microwaves or millimeter waves in a state where an adhesion prevention plate 410 is placed between the workpiece 130 and the pressure unit 20. This makes it possible to prevent the workpiece 130 from adhering to the pressure unit 20. In particular, it is preferable to perform processing in a state where at least a portion of the workpiece 130 and at least a portion of the adhesion prevention plate 410 are in contact with each other. The material of the adhesion prevention plate 410 can be appropriately selected depending on the workpiece 130. When the workpiece 130 is made of a metal material, the adhesion prevention plate 410 is preferably, for example, a carbon plate.

[0130] The gas supply units 21 to 23 included in the solid manufacturing apparatus according to this embodiment are configured to be able to supply a plurality of types of gases into the housing 10, and are preferably configured to supply gases during at least a portion of the time that the workpiece 130 is being processed, such as sintered or melted. The plurality of types of gases may include, for example, inert gases such as neon (Ne), argon (Ar), and helium (He), neutral gases such as nitrogen (N), dry hydrogen (H), and ammonia (NH), hydrogen (H), carbon monoxide (CO), and hydrocarbon gases (CH, C, H, C, H). 10 In addition, oxidizing gases such as oxygen, ozone, nitrous oxide, nitric oxide, and nitrogen dioxide can also be used.

[0131] The microwave generator 30 may be an oscillator using an electron tube such as a magnetron, klystron, gyrotron, or traveling-wave tube; a solid-state oscillator that amplifies the natural vibration of a quartz crystal oscillator; or a semiconductor device made of a semiconductor material such as gallium nitride or gallium arsenide. Microwaves with frequencies ranging from approximately 300 MHz to approximately 300 GHz are used, with microwaves with frequencies ranging from 1 GHz to 10 GHz being preferred. Furthermore, it is preferable to vary the microwave frequency. This can prevent hot spots caused by microwave concentration inside the housing 10.

[0132] As in the solid state manufacturing apparatus shown in FIG. 1 according to this embodiment, multiple microwave generators 30 may be provided for one microwave heating chamber. This makes it possible, for example, to reduce the degree of localization of microwaves inside the housing 10. When multiple microwave generators are used as in the solid state manufacturing apparatus shown in FIG. 1, the generation of hot spots due to microwave concentration can be suppressed by ensuring that the anisotropic directions of the cross-sectional shapes of the waveguides 32 do not coincide among the multiple waveguides 32. Typically, the waveguides 32 corresponding to the multiple microwave generators 30 each have a rectangular cross-sectional shape, and it is preferable that the long side of the rectangular cross-sectional shape of one waveguide 32 intersects with the long side of the rectangular cross-sectional shape of the other waveguide 32.

[0133] A window 31 and a waveguide 32 are arranged between the microwave generator 30 and the inside of the housing 10, starting from the side closer to the inside of the housing 10. Microwaves emitted from the microwave generator 30 are emitted from the window 31 into the inside of the housing 10 via the waveguide 32. An example of a material for the window 31 is quartz glass.

[0134] The air blowing section 15 is, for example, an air curtain supplying machine, and by generating an air flow along the main surface of the window 31 on the inside side of the housing 10, it is possible to prevent dust, powder, and debris from the workpiece 130, etc. generated inside the housing 10 from adhering to the window 31.

[0135] The solid manufacturing apparatus may include an electromagnetic wave diffuser 12 provided inside the housing 10. For example, the electromagnetic wave diffuser 12 can rotate to prevent microwaves from concentrating in a certain location inside the housing 10. It can also prevent temperature variations depending on the location of the workpiece 130 and sparks from occurring inside the housing 10, for example.

[0136] The microwave sensor 35 provided in the solid state manufacturing apparatus according to this embodiment can measure at least one of magnetic field strength, electric field strength, and radio frequency strength. The microwave sensor 35 is preferably capable of simultaneously measuring at least two of magnetic field strength, electric field strength, and radio frequency strength, and is particularly preferably capable of simultaneously measuring all of magnetic field strength, electric field strength, and radio frequency strength.

[0137] It is preferable that thermometer 19a and thermometer 19b are radiation thermometers capable of measuring temperatures in the range of 500°C or higher. At least one of the multiple thermometers, i.e., thermometer 19a and thermometer 19b, is provided with a cooling device for cooling the lens of the radiation thermometer. It is preferable to use an air blower type cooling device.

[0138] The temperature is preferably measured at multiple locations within the housing 10. This makes it possible, for example, to prevent temperature differences from occurring depending on the position of the workpiece 130. In the solid manufacturing apparatus according to this embodiment, the thermometers 19a and 19b are arranged at multiple locations within the pressurizing unit 20, i.e., one thermometer is arranged closer to the center of the pressurizing unit 20 or the housing 10 than the other thermometer.

[0139] For example, the emission of microwaves into the housing 10 may be stopped for at least a portion of the period until the difference in temperature measured at the multiple positions disappears, or for at least a portion of the period until the difference in temperature measured at the multiple positions reaches a predetermined value. Alternatively, the microwave output may be set to a second output lower than the first output, which is the microwave output when processing the workpiece 130, for at least a portion of the period until the difference in temperature measured at the multiple positions disappears, or for at least a portion of the period until the difference in temperature measured at the multiple positions reaches a predetermined value. At least a portion of the setting or execution of processing conditions for the workpiece 130, such as microwave output, based on measurements by such a thermometer may be programmed and automated using a control device such as a computer.

[0140] In the solid state manufacturing apparatus according to this embodiment shown in FIG. 1, the cooling unit 1 is attached to the housing 10. However, for example, as shown in FIG. 10 or 13, the cooling unit 1 can also be attached to the pressurizing unit 20. Alternatively, as shown in FIG. 13 or 14, the cooling unit 1 can be attached to the stage 50 side. The cooling unit 1 may be attached to at least two of the housing 10, the pressurizing unit 20, and the stage 50. A typical example of the cooling unit 1 is a Peltier element. However, for example, a cooling unit in which piping is provided outside or inside the housing 10, the pressurizing unit 20, or the stage 50 and water, a refrigerant, air, or the like is circulated through the piping is particularly effective for large microwave heating chambers.

[0141] The enclosure 40 included in the solid manufacturing apparatus according to this embodiment is disposed within the housing 10 and surrounds the side of the workpiece 130 placed on the stage 50. For example, as shown in FIG. 3 , even if the workpiece 130 is deformed by applying pressure to it by the pressurizing unit 20 via the heat insulating member 80 and the microwave absorbing member 90, the enclosure 40 can suppress the deformation of the workpiece 130 by containing the deformation of the workpiece 130 within the range of the enclosure 40 at most.

[0142] 1, where the stage 50 has received the workpiece 130, to a second position where the pressurizing unit 20 processes the workpiece 130 by emitting microwaves into the housing 10 while applying pressure to the workpiece 130 via the heat insulating member 80 and the microwave absorbing member 90, as shown in Fig. 3. The enclosure 40 is positioned in a second direction intersecting the first direction from the workpiece 130 to the pressurizing unit 20. Typically, the enclosure 40 is positioned around the workpiece 130 when the pressurizing unit 20 applies pressure to the workpiece 130 via the heat insulating member 80 and the microwave absorbing member 90 as shown in Fig. 3.

[0143] This allows the enclosure 40 to attenuate at least a portion of the microwaves reflected inside the housing 10 or at least a portion of the microwaves emitted from the window 31 and traveling directly toward the workpiece 130 or the stage 50.

[0144] The material of the enclosure 40 may be a pure metal, an alloy, or a non-metallic inorganic material. Examples of pure metals include aluminum, copper, iron, and the like. Examples of alloys include stainless steel, nickel-chromium steel, chromium-molybdenum steel, manganese steel, manganese-chromium steel, chromium steel, carbon steel forgings, carbon-copper forgings, gray iron, spheroidal graphite cast iron, and blackheart malleable cast iron. Examples of non-metallic inorganic materials include aluminum oxide, alumina porcelain, sintered beryllium oxide, sintered zirconium oxide, sintered mullite, hot-pressed silicon nitride, reaction-sintered silicon nitride, fused quartz, hot-pressed titanium carbide, graphite, and the like.

[0145] Instead of the enclosure 40 made of a single material as shown in FIG. 1, enclosures 41 and 42 made of multiple materials as shown in FIG. 10 may be used. For example, the enclosure 42 is disposed on the side of the enclosure 41 facing the pressure unit 20. For example, in the solid manufacturing apparatus shown in FIG. 10, the material of the enclosure 41 may be a nonmetallic inorganic material, and the material of the enclosure 42 may be a material with high microwave absorption, such as the metal, alloy, or graphite described above. By forming the enclosure using multiple materials in this way, for example, it is possible to ensure the transmittance of microwaves to the workpiece 130 while also being able to withstand the pressure load applied by the pressure unit 20. Alternatively, for example, the enclosure 41 may be responsible for heating the workpiece 130 by thermal conduction, and the enclosure 42 may be responsible for a load-bearing function.

[0146] As shown in FIG. 11, microwaves may be irradiated onto the workpiece 130 while at least a portion of the promoter 400 is in contact with the workpiece 130.

[0147] The promoter 400 is preferably prepared so as to absorb microwaves relatively more in a temperature range lower than the temperature range where the microwave absorption efficiency of the workpiece 130 increases. This allows the promoter 400 to generate heat faster than the workpiece 130, shortening the time it takes for the workpiece 130 to reach a temperature range where the microwave absorption efficiency of the workpiece 130 is relatively higher than that of the promoter 400, thereby shortening the time required to process the workpiece 130. Furthermore, it is preferable to select a combination of the promoter 400 and the workpiece 130 so that the temperature of the workpiece 130 is higher than the temperature of the promoter 400 during at least a portion of the processing time, during which the workpiece 130 is in a temperature range after reaching the sintering or melting temperature.

[0148] The promoter 400 is preferably selected so that, for example, in a first temperature range in which the workpiece 130 or the promoter 400 is at or above a first temperature and at or below a second temperature, the microwave absorption efficiency of the promoter 400 is higher than that of the workpiece 130, and in a second temperature range in which the workpiece 130 or the promoter 400 is at or above a third temperature and at or below a fourth temperature, the microwave absorption efficiency of the workpiece 130 is higher than that of the promoter 400. It is preferable that the second temperature is lower than the third temperature.

[0149] The promoter 400 preferably includes, for example, a microwave absorbing material that absorbs microwaves, so that the promoter 400 can play a role in conducting heat to the workpiece 130, at least in the initial stage of microwave processing of the workpiece 130.

[0150] The microwave absorbing material includes, for example, a carbon-containing material. Examples of the carbon-containing material include carbon black, amorphous carbon, graphite, silicon carbide, carbon resin, and metal carbide. Other examples of the microwave absorbing material include metal particles, metal nitrides, metal oxides, and metal borides. The microwave absorbing material may be a mixture of at least two of the above-mentioned materials.

[0151] The promoter 400 preferably further includes a heat insulating material. Examples of heat insulating materials include metal oxides and semi-metal oxides. Examples of metal and semi-metal oxides include aluminum oxide (Al2O3), silicon oxide (SiO2), magnesium oxide (MgO), zirconium oxide (ZrO2), and titanium oxide (TiO2). For example, the melting point of aluminum oxide (Al2O3) is 2072°C. The melting point of silicon oxide (SiO2) is 1710°C. The melting point of magnesium oxide (MgO) is 2852°C. The heat insulating material may be a compound or a mixture of these.

[0152] The promoter 400 may include a high melting point material that has a higher melting point than the microwave absorbing material, for example, carbon and a reducing material that reduces the silicon carbide workpiece 130.

[0153] The mass ratio of the microwave absorbing material to the heat insulating material in the promoter 400 is preferably selected so that the promoter 400 absorbs relatively more microwaves than the workpiece 130 in at least a portion of the temperature range below the temperature range where the microwave absorption efficiency of the workpiece 130 increases, and so that the workpiece 130 absorbs relatively more microwaves than the promoter 400 in at least a portion of the temperature range above the temperature range where the microwave absorption efficiency of the workpiece 130 increases. Alternatively, the mass ratio of the microwave absorbing material to the heat insulating material in the promoter 400 is preferably set so that the temperature of the promoter 400 is relatively higher than the temperature of the workpiece 130 in at least a portion of the temperature range up to the sintering or melting temperature of the workpiece 130, and so that the temperature of the workpiece 130 is relatively higher than the promoter 400 in at least a portion of the temperature range after the sintering or melting temperature of the workpiece 130 is reached.

[0154] Typically, the mass ratio of microwave absorbing material to insulating material in promoter 400 is 1:1, or the mass ratio of insulating material is preferably greater than the mass ratio of microwave absorbing material. For example, the mass ratio of microwave absorbing material in promoter 400 is 1% by weight or more, 2% by weight or more, or 5% by weight or more, and 70% by weight or less, 50% by weight or less, 40% by weight or less, 30% by weight or less, 20% by weight or less, or 10% by weight or less, but may be selected appropriately depending on the desired processing conditions.

[0155] It should be noted that the meanings of "microwave absorbing" in "microwave absorbing material" and "thermal insulating" in "thermal insulating material" do not necessarily refer to absolute microwave absorbing and thermal insulating properties, respectively, and also include, for example, the microwave absorbing property of a microwave absorbing material being higher than the microwave absorbing property of a thermal insulating material. Also, the thermal insulating property of a thermal insulating material being higher than the thermal insulating property of a microwave absorbing material.

[0156] By radiating microwaves into the housing 10 with the promoter 400 disposed between the workpiece 130 and the enclosure 41, it is possible to more efficiently process the workpiece 130. The promoter 400 may also be disposed in a direction intersecting the direction from the workpiece 130 to the enclosure 41, i.e., in this embodiment, between the pressure unit 20 and the workpiece 130. The promoter 400 may be disposed at least either around the workpiece 130 or at a position opposite the workpiece 130 from the stage 50 on which the workpiece 130 is placed, and the workpiece 130 may be processed. However, as shown in FIG. 12 , processing may also be performed with the promoter 400 disposed only between the workpiece 130 and the enclosure 41 or 42.

[0157] As shown in Figure 11 or Figure 12, by performing processing such as sintering or melting using electromagnetic waves such as microwaves while at least a portion of the workpiece 130 is in contact with the promoter 400, it is possible to make the absorption efficiency of the microwave absorbing member 90 lower than when processing is performed without the promoter 400 in contact, for example.

[0158] 1 according to this embodiment includes a shaft and a bearing. The load receiving part 60 may be configured to adjust the distance of the stage 50 from the pressure unit 20.

[0159] After the solid or solid combination 141 is obtained from the workpiece 130 by microwave irradiation, the stage 50 moves the solid or solid combination 141 to the solid receiving unit 100, as shown in FIG. 8. The solid receiving unit 100 is located, for example, at the bottom of the casing 10 facing the pressurizing unit 20, on the outside opposite the pressurizing unit 20. As shown in FIG. 8, the solid receiving unit 100 has a function of receiving the solid combination 141, which is an object obtained through processing the workpiece 130 inside the casing 10. The solid receiving unit 100 has, for example, a frame having a space inside the frame. The stage 50 is movable within the space inside the frame of the solid receiving unit 100. The solid receiving unit 100 is configured, for example, so that the solid combination 141 moves together with the stage 50 from the inside of the casing 10 to the outside, and then stops the movement. In this stopped state, at least a part of the pedestal 135, which is disposed between the solid combination 141 and the support base 51, is in contact with at least a part of the support base 51. For example, the support base 51 is provided with an opening through which the stage 50 passes, and the pedestal 135 has a size that prevents it from passing through the opening.

[0160] When the solid combination 141 is in a stopped state, the shaft 120 connected via the shaft connection part 110 is driven by the shaft driving part 125, and the shaft 120 pushes the solid receiving part 100, so that, as shown in FIG. 9, the solid receiving part 100 moves in a direction intersecting the direction in which the stage 50 moves between the inside of the housing 10 and the support base 51, and the solid combination 141 is taken out of the solid manufacturing apparatus by the subsequent operation.

[0161] As a typical example, as shown in FIG. 9, the solid receiving portion 100 and the solid combination 141 may be positioned at least temporarily below the housing 10 and the transport table 250.

[0162] 1 to 17, the solid manufacturing apparatus according to this embodiment is configured such that the raw material conveying direction, in which the conveying unit 300 moves the workpiece 130 toward the stage 50, is aligned with the product conveying direction, in which the shaft driving unit can move the solid receiving unit 100 via the shaft 120. However, the raw material conveying direction and the product conveying direction may be configured to intersect, for example, typically be substantially perpendicular. By using such a configuration, it is possible to shorten the conveying distance of the raw material to the interior of the housing 10 or the conveying distance required to remove the product from the housing 10.

[0163] Examples of the workpiece 130 include a metal material, a ceramic material, a mixture of these, or a composition of these materials with additives added. The metal material or the ceramic material may be one type, or may contain two or more types, and can be selected appropriately depending on the target solid 140 obtained by processing, such as sintering or melting, of the workpiece 130 shown in FIG. 4.

[0164] The metal material may include, for example, an elemental metal or a metal compound such as an alloy of these. Examples of metal elements include iron (Fe), nickel (Ni), copper (Cu), gold (Au), silver (Ag), aluminum (Al), cobalt (Co), tungsten (W), titanium (Ti), chromium (Cr), molybdenum (Mo), beryllium (Be), magnesium (Mg), tin (Sn), cerium (Ce), lead (Pb), mercury (Hg), sodium (Na), bismuth (Bi), and gallium (Ga). The sintering temperature of iron (Fe) is, for example, 1200°C. The melting point of iron (Fe) is, for example, 1538°C. The sintering temperature of nickel (Ni) is, for example, 1200°C. The melting point of nickel (Ni) is, for example, 1495°C. The sintering temperature of copper (Cu) is, for example, 800°C. The melting point of copper (Cu) is 1085°C. The sintering temperature of gold (Au) is, for example, 800°C. The melting point of gold (Au) is 1064°C. The sintering temperature of silver (Ag) is, for example, 750°C. The melting point of silver (Ag) is 962°C. The sintering temperature of aluminum (Al) is, for example, 500°C. The melting point of aluminum (Al) is 660°C. The sintering temperature of cobalt (Co) is, for example, 1100°C. The melting point of cobalt (Co) is 1455°C.

[0165] Examples of the alloy include an alloy of a plurality of metal elements, an alloy of a metal element and a non-metal element, a metal oxide, a metal hydroxide, a metal chloride, a metal carbide, a metal boride, and a metal sulfide, and can be appropriately selected depending on the desired solid 140. Elements constituting the alloy may include, for example, silicon (Si), manganese (Mn), chromium (Cr), nickel (Ni), carbon (C), boron (B), copper (Cu), aluminum (Al), titanium (Ti), niobium (Nb), vanadium (V), zinc (Zn), antimony (Sb), palladium (Pd), lanthanum (La), gold (Au), potassium (K), cadmium (Cd), indium (In), molybdenum (Mo), and sulfur (S).

[0166] As the ceramic material, for example, oxide ceramics or non-oxide ceramics can be used. Specific ceramic materials that can be used include alumina (Al2O3), zirconia (ZrO2), barium titanate (BaTiO3), barium oxide (BaO), titanium oxide (TiO2), silicon oxide (SiO2), zinc oxide (ZnO2), neodymium oxide (Nd2O3), lead zirconate titanate (PZT), silicon nitride (Si3N4), silicon carbide (SiC), etc. These materials may be used alone or in combination of two or more.

[0167] The workpiece 130 may be particles. When the workpiece 130 is particles, the particle size of the workpiece 130 can be appropriately selected depending on the desired solid 140. For example, a molded product such as a powder compact of the above-mentioned material or a similar product can be used as the workpiece 130. This can reduce the degree of deformation during processing, for example.

[0168] When obtaining a green compact as the workpiece 130, for example, a pressure of 1 MPa or more, 100 MPa or more, or 200 MPa or more, 2000 MPa or less, 1900 MPa or less, or 1800 MPa or less may be applied to an aggregate of material particles or powder. By applying pressure, the resulting solid 140 tends to be dense. Examples of pressurizing methods include uniaxial molding, cold isostatic pressing (CIP) molding, hot isostatic pressing (HIP) molding, and roller pressing. Of course, various shapes, such as a sheet or plate, can be appropriately selected for the workpiece 130 depending on the desired solid 140.

[0169] It is preferable to combine the workpiece 130 and the microwave absorbing member so that the microwave absorption efficiency of the workpiece 130 is relatively higher than the microwave absorption efficiency of the microwave absorbing member 90 in at least a part of the temperature range.

[0170] 1 according to this embodiment may be configured to control, for example, at least one of the cooling unit 1, electromagnetic wave diffuser 12, blower 15, position sensor 16, thermometers 19a and 19b, pressurizer 20, gas suppliers 21 to 23, microwave generator 30, stage 50, load receiver 60, shaft driver 125, raw material supply stage 200, and transport unit 300. Furthermore, for example, the control unit 1000 may be configured so that at least two of the above-mentioned devices can operate in conjunction with each other.

[0171] As an example of such a case where two devices work together, the control unit 1000 may control the microwave generator 30 to emit microwaves into the housing 10 when the temperature difference between multiple temperature measurement points such as the thermometer 19a and the thermometer 19b falls within a predetermined range.

[0172] The control unit 1000 can also control the operation of moving at least one of the pressure unit 20 and the stage 50 so that the pressure unit 20 and the stage 50 approach each other as shown in FIG. 3 from a state in which the pressure unit 20 and the stage 50 are at a distance such that the workpiece 130 does not come into contact with the microwave absorbing member 90 attached to the pressure unit 20 as shown in FIG. 1, thereby bringing the workpiece 130 and the microwave absorbing member 90 into contact with each other.

[0173] The control unit 1000 may control at least one of the stage 50 and the pressure unit 20 to control the pressure value applied to the workpiece 130 when the workpiece 130 and the microwave absorbing member 90 are in contact with each other so that the pressure value is a predetermined value or within a predetermined range.

[0174] The control unit 1000 may control at least a part of a series of operations, such as increasing the distance between the pressurizing unit 20 and the stage 50 as shown in FIG. 4 after the solid 140 is obtained by sintering or melting by microwave irradiation inside the housing 10 as shown in FIG. 3, moving the workpiece 130 to be next subjected to microwave sintering on the conveying table 250 as shown in FIG. 5, and placing the next workpiece 130 above the solid 140 already obtained by microwave sintering as shown in FIG. 6.

[0175] As shown in FIG. 7, when a new workpiece 130 is placed on a solid 140 that has already been obtained by processing the workpiece 130 with microwaves and microwaves are emitted into the housing 10 to process the workpiece 130 by melting or sintering, the control unit 1000 may be configured to control at least one of the pressure unit 20 and the stage 50 to control the pressure applied to the workpiece 130 or the distance between the pressure unit 20 and the stage 50.

[0176] When removing a solid combination 141 formed by combining solids 140 obtained by processing such as sintering or melting the workpiece 130 by microwave irradiation from the solid manufacturing apparatus according to this embodiment, the control unit 1000 may move the stage 50 in the opposite direction to the pressurizing unit 20 so that at least a part of the solid combination 141 fits inside the solid receiving unit 100 as shown in FIG. 8, and further control at least a part of the operation of moving the solid receiving unit 100 via the shaft 120 by the shaft driving unit 125 in a direction intersecting the direction in which the pressurizing unit 20 is viewed from the stage 50 as shown in FIG. 9.

[0177] A computer can be used as the control unit 1000 exemplified above, and it is preferable that at least a part of the control by the control unit 1000 is stored in the control unit 1000 as a program and executed.

[0178] 14, a workpiece 800 that has not been subjected to pressure or that has not been molded can be used as the workpiece 130. The workpiece 800 may be, for example, an aggregate of powder that does not maintain its shape. In this case, it is preferable that the transport unit 301 has a structure that allows the workpiece 800 to be placed thereon, as shown in FIG.

[0179] As shown in Figure 15, the transport unit 301 may be moved to a position where the workpiece 800 faces the pressure unit 20 and the stage 50, and then the workpiece 800 may be slid from the location where it was placed on the transport unit 301 to be positioned above the stage 50, as shown in Figure 16.

[0180] 17 , the workpiece 800 may be placed between the pressurizing unit 20 and the stage 50, and pressure may be applied to the workpiece 800 to perform molding or form a powder compact. In this case, the period during which pressure is applied to the workpiece 800 may be at least a part of the period during which microwaves or millimeter waves are emitted into the housing 10, or may be before the period during which microwaves or millimeter waves are emitted into the housing 10.

[0181] Furthermore, in the configuration of the solid manufacturing apparatus shown in FIG. 17, after the processing of the workpiece 800 is completed and a solid is obtained, pressure can be applied to the solid using the pressurizing unit 20 or the like.

[0182] 14 to 17 is described for the case where a workpiece 800 is used that is not pressurized or molded, but a shapeless aggregate of powder placed in a metal or ceramic frame may be used instead of the workpiece 800. In this case, too, a solid body conforming to the shape of the frame can be obtained by the same operations as those of the solid body manufacturing apparatus shown in FIGS.

[0183] As described above, embodiments relating to several aspects of the present invention have been disclosed. However, the descriptions and drawings forming part of this disclosure should not be understood to limit the technical idea of ​​the present invention, and it should be understood that the present invention encompasses various embodiments not described herein. [Explanation of symbols]

[0184] 1 cooling unit, 10 housing, 11 stopper, 12 electromagnetic wave diffusion plate, 15 air blower, 16 position sensor, 19a thermometer, 19b thermometer, 20 pressurizing unit, 21 gas supply unit, 22 gas supply unit, 23 gas supply unit, 30 microwave generator, 31 window, 32 waveguide, 35 microwave sensor, 40 enclosure, 41 microwave transparent enclosure, 42 microwave absorbing enclosure, 50 stage, 51 support base, 60 Load receiving portion, 80, heat insulating member, 90, microwave absorbing member, 95, plate jig, 100, solid receiving portion, 110, shaft connection portion, 120, shaft, 125, shaft drive portion, 130, workpiece, 135, base, 140, solid (workpiece), 141, solid bond, 200, raw material supply stage, 250, transport table, 300, transport portion, 400, promoter, 410, adhesion prevention plate, 800, workpiece, 1000, control portion

Claims

1. A solid manufacturing apparatus for manufacturing a solid from a workpiece, The housing and an electromagnetic wave emitting device for emitting microwaves or millimeter waves inside the housing; a first base body disposed inside the housing and capable of contacting at least a portion of the workpiece while at least protruding into the housing; Equipped with the first substrate includes a microwave absorbing member; the microwave absorbing member is a mixture of a first material and a second material having a lower microwave absorption rate than the first material; Solid manufacturing equipment.

2. The solid manufacturing apparatus according to claim 1 , further comprising a cooling unit for cooling at least one of the housing and the first substrate.

3. Further comprising a second substrate, The first substrate and the second substrate are configured so that the distance between the first substrate and the second substrate can be changed. The solid manufacturing apparatus according to claim 1 .

4. the cooling unit is configured to cool the first base, the first substrate is configured to apply pressure to the workpiece; The solid manufacturing apparatus according to claim 2 .

5. Further, a third substrate is provided, the third base is configured to be disposed between at least one of the workpiece and the first base and an emission port of the electromagnetic wave emission device for emitting the microwaves or the millimeter waves into the housing during at least a part of a period during which the electromagnetic wave emission device emits the microwaves or the millimeter waves into the housing. The solid manufacturing apparatus according to claim 1 .

6. a cooling unit is provided in at least one of the housing, the first base, and the second base; The solid manufacturing apparatus according to claim 3 .

7. the third substrate is configured to be disposed between at least one of the workpiece and the first substrate and an inner surface of the housing during at least a part of a period during which the electromagnetic wave emitting device emits at least the microwaves or the millimeter waves into the housing. The solid manufacturing apparatus according to claim 5 .

8. 6. The solid manufacturing apparatus according to claim 5, wherein the third substrate holds a member, powder, or particles surrounding at least a portion of the workpiece during at least a portion of the period during which the microwaves or millimeter waves are emitted into the housing.

9. a window is provided between the housing and the electromagnetic wave emitting device; Further provided is a blower configured to generate an airflow along a main surface of the window on an inner side of the housing. The solid manufacturing apparatus according to claim 1 .

10. the third substrate includes a first portion having a first transmittance of the microwave or the millimeter wave and a second portion having a second transmittance of the microwave or the millimeter wave, the first transmittance and the second transmittance are different; The solid manufacturing apparatus according to claim 5 .

11. the first transmittance is higher than the second transmittance; a distance between the first portion and the workpiece is smaller than a distance between the second portion and the workpiece during at least a part of a period during which the microwaves or millimeter waves are emitted into the housing; The solid manufacturing apparatus according to claim 10.

12. the first substrate has a first portion and a second portion, the first portion has a higher efficiency of absorbing the microwaves or millimeter waves than the second portion; The solid manufacturing apparatus according to claim 1 .

13. a third portion between the first portion and the second portion; The thermal conductivity of the third portion is lower than the thermal conductivity of at least one of the first portion and the second portion. The solid manufacturing apparatus according to claim 12.

14. the first portion is configured to be in contact with at least a part of the workpiece during at least a part of a period during which the electromagnetic wave emitting device emits the microwaves or the millimeter waves into the housing; The solid manufacturing apparatus according to claim 12.

15. A solid manufacturing apparatus as described in claim 1, wherein the microwave absorbing member is a molded product of the mixture.

16. A solid manufacturing apparatus for manufacturing a solid from a workpiece, The housing and an electromagnetic wave emitting device for emitting microwaves or millimeter waves inside the housing; a stage on which a workpiece serving as the solid raw material is placed; Equipped with The workpiece is moved along a raw material conveying direction in which the workpiece is conveyed toward the stage disposed inside the housing, and the workpiece is disposed at a position inside the housing where the microwave or millimeter wave is irradiated; After the solid is produced from the workpiece by irradiating the microwave or millimeter wave, a product conveying direction for moving the solid is aligned with the raw material conveying direction. A solid manufacturing apparatus comprising: When the solid body is transferred from the inside of the housing to the outside of the housing by the movement of the stage, the solid body is transferred to a solid body receiving section that receives the solid body. Solid manufacturing equipment.

17. the solids receiving portion includes a frame member surrounding a first space; The stage is configured to be movable within the first space. The solid manufacturing apparatus according to claim 16.

18. The frame member is attached to the lower part of the housing. The solid manufacturing apparatus according to claim 17.

19. the housing has a protrusion protruding from a first surface inside the housing toward the first surface and a second surface opposite to the first surface, The stage is configured to be movable in a second space inside the protrusion. The solid manufacturing apparatus according to claim 16.

20. 17. The solid manufacturing apparatus according to claim 16, wherein the solid receiving portion is configured to be able to receive the solid by the stage moving the solid from inside the housing in a direction approaching the solid receiving portion.

21. the solid receiving portion includes a frame member surrounding a first space, and the solid receiving portion and the protruding portion are configured so that the first space and the second space can be connected directly or via at least one member having a space therein.

20. The solid manufacturing apparatus according to claim 19.

22. During a first period which is at least a part of a period during which the microwaves or millimeter waves are emitted into the housing, the first space and the second space are configured to be connectable directly or via at least one member having a space therein.

22. The solid manufacturing apparatus according to claim 21.

23. The solid receiving unit is configured to be movable in a direction along the first surface or a direction intersecting the first surface.

20. The solid manufacturing apparatus according to claim 19.

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