Jumper Chip Components

Abstract

To suppress a value of resistance.SOLUTION: A jumper chip component 1 is mounted on a printed circuit board. The jumper chip component 1 comprises a base body 2, a conductor 3, and an end-face electrode 4. The base body 2 has an electrical insulation property. On a lower surface 22, of the base body 2, facing the printed circuit board, the conductor 3 is formed from a first end 221 to a second end 222 facing the first end 221. The end-face electrode 4 is formed at least on a lateral surface 23 of the base body 2 such that it is electrically connected to the conductor 3. A surface 12, of the jumper chip component 1, facing the printed circuit board is a flat surface.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates generally to jumper chip assemblies, and more particularly to jumper chip assemblies mounted on printed circuit boards. [Background technology]

[0002] Patent Document 1 describes a jumper chip (component). This jumper chip includes an insulating substrate, a conductor formed on the upper surface of the insulating substrate, and a protective film that covers the conductor except for its two end regions. The jumper chip also includes a pair of upper electrodes that are formed to cover the end regions of the conductor that are not covered by the protective film, with portions of the electrodes resting on the protective film. Patent Document 1 describes that the provision of upper electrodes made of a material containing palladium prevents the conductor from being sulfurized even if a sulfurizing atmosphere penetrates from the boundary between the protective film and the plating. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2007-188971 Summary of the Invention [Problem to be solved by the invention]

[0004] Meanwhile, it is desirable to further reduce the resistance value of jumper chip components so that they can be easily mounted even in current paths through which large currents flow.

[0005] The present disclosure has been made in view of the above circumstances, and aims to provide a jumper chip component that can suppress the resistance value. [Means for solving the problem]

[0007] This disclosure OneA jumper chip component according to this embodiment is mounted on a printed circuit board. The jumper chip component comprises a base, a conductor, an edge electrode, and a step-forming electrode. The base is electrically insulating. The conductor is formed on the lower surface of the base facing the printed circuit board, from a first end to a second end opposite the first end. The edge electrode is formed on at least a side surface of the base so as to be electrically connected to the conductor. The step-forming electrode is a pair of electrodes respectively covering a region on the first end side and a region on the second end side of the lower surface of the conductor; The jumper chip component has a recessed portion recessed toward the conductor in the center of the surface facing the printed circuit board. The recessed portion is formed by the step. The width of the recess is determined by the width of each of the pair of electrodes. [Effects of the Invention]

[0008] According to the present disclosure, there is an advantage that it is possible to suppress the resistance value. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic cross-sectional perspective view of a jumper chip component according to a first embodiment. [Figure 2] 2A and 2B are plan views of a first and a second example of use of the jumper chip component, respectively. [Figure 3] 3A, 3B, and 3C are plan views of a third, fourth, and fifth use examples of the jumper chip component, respectively. [Figure 4] FIG. 4 is a schematic cross-sectional perspective view of a jumper chip component according to the second embodiment. [Figure 5] FIG. 5 is a plan view of an example of use of the jumper chip component. DETAILED DESCRIPTION OF THE INVENTION

[0010] (Embodiment 1) The jumper chip component 1 according to this embodiment will be described below with reference to Figures 1 to 3C. The drawings in this embodiment and in the second embodiment described below are all schematic drawings, and the ratios of the sizes and thicknesses of the components in the drawings do not necessarily reflect the actual dimensional ratios.

[0011] (1) Overview First, an overview of the jumper chip component 1 according to this embodiment will be described.

[0012] The jumper chip component 1 according to this embodiment is mounted on a printed circuit board 100 (see FIGS. 2A to 3C). The jumper chip component 1 is configured to be bondable to a conductor pattern P0 (land) formed on the printed circuit board 100. The printed circuit board 100 referred to here is a printed wiring board in which conductor wiring (conductor pattern P0) is provided on the surface and inside of a plate-shaped insulating substrate 101 formed from an insulator. Various electronic components such as chip components and lead components other than the jumper chip component 1 can be mounted on the printed circuit board 100. The various electronic components and conductor pattern P0 mounted on the printed circuit board 100 can form power-related electric circuits such as a power supply circuit or a drive circuit for a motor, or signal-related electric circuits such as a control circuit. The jumper chip component 1 is bonded to the conductor pattern P0 formed on the insulating substrate 101 by, for example, solder (see solder fillets 102 in FIGS. 2A to 3C).

[0013] As shown in Figure 1, the jumper chip component 1 comprises a base 2, a conductor 3, and an end surface electrode 4. The base 2 is electrically insulating. The conductor 3 is formed on the bottom surface 22 of the base 2 facing the printed circuit board 100, from a first end 221 to a second end 222 facing the first end 221. The end surface electrode 4 is formed on at least a side surface 23 of the base 2 so as to be electrically connected to the conductor 3. One surface 12 of the jumper chip component 1 facing the printed circuit board 100 is flat.

[0014] Here, when the conductor is provided on the upper surface of the base rather than the lower surface, as in the jumper chip of Patent Document 1, the current passes through the end surface electrodes and then through the upper conductor. In contrast, the conductor 3 of this embodiment is formed on the lower surface 22 of the base 2, extending from the first end 221 to the second end 222. Therefore, the overall current path of the jumper chip component 1 is likely to be shortened by the length of the end surface electrodes 4. As a result, the jumper chip component 1 has the advantage of being able to reduce resistance. Therefore, the jumper chip component 1 is easily mounted in current paths through which large currents flow, such as in automotive motor wiring. In particular, the flat surface 12 of the jumper chip component 1 allows for a low profile relative to the printed circuit board 100.

[0015] (2)Details Next, the jumper chip component 1 according to this embodiment will be described in detail with reference to FIGS. 1 to 3C.

[0016] (2.1) Overall structure FIG. 1 shows a schematic cross-sectional perspective view of a jumper chip component 1 according to this embodiment.

[0017] In the following description, as an example, three mutually perpendicular axes, the X-axis, Y-axis, and Z-axis, are set as shown in Figure 1. Here, the axis along the length of the long jumper chip component 1 is referred to as the "X-axis," and the axis along the thickness direction is referred to as the "Y-axis." The axis along the width direction of the jumper chip component 1 is referred to as the "Z-axis." In the following description, the direction along the Y-axis is simply referred to as the "vertical direction," and the positive side of the Y-axis is sometimes referred to as the "upward direction" and the negative side of the Y-axis is sometimes referred to as the "downward direction."

[0018] The X-axis, Y-axis, and Z-axis are all imaginary axes, and the arrows indicating "X," "Y," and "Z" in the drawings are merely shown for the purpose of explanation and do not have any physical substance. Furthermore, these directions are not shown with the intention of limiting the direction in which the jumper chip component 1 is used.

[0019] The jumper chip component 1 is configured to be bondable to a conductor pattern P0 (land) formed on a printed circuit board 100. The jumper chip component 1 is a flat chip-shaped component overall. One surface 12 (back surface) of the jumper chip component 1 that faces the printed circuit board 100 is a flat surface. In this embodiment, one surface 12 of the jumper chip component 1 corresponds to the lower surface of a third plating layer M3, which will be described later.

[0020] The jumper chip component 1 includes a base 2, a conductor 3, an end surface electrode 4, a first plating layer M1, an upper surface electrode 6, a protective film 7, a second plating layer M2, and a third plating layer M3. In Figures 1 to 3C, the surface of the protective film 7 is indicated by dot hatching.

[0021] The base 2 has electrical insulation properties. The base 2 is, for example, a ceramic substrate. The base 2 is a rectangular plate-like body that is flat in the Y-axis direction and elongated in the X-axis direction. In other words, the thickness direction of the base 2 is parallel to the Y-axis. The base 2 has an upper surface 21 (first surface) and a lower surface 22 (second surface). The upper surface 21 and the lower surface 22 are surfaces parallel to the XZ plane.

[0022] The lower surface 22 of the base 2 is the surface that faces the printed circuit board 100 when the jumper chip component 1 is mounted on the printed circuit board 100. In other words, the lower surface 22 faces the printed circuit board 100. However, in this embodiment, the lower surface 22 faces the printed circuit board 100 with the conductor 3 and the first to third plating layers M1 to M3 interposed therebetween.

[0023] The base 2 also has side surfaces 23 parallel to the YZ plane. The side surfaces 23 include a first side surface 231 on the negative side of the X axis and a second side surface 232 on the positive side of the X axis.

[0024] As described below, the top surface 21, bottom surface 22, first side surface 231, and second side surface 232 are covered by the conductor 3 (bottom surface electrode), top surface electrode 6, end surface electrode 4, protective film 7, and first to third plating layers M1 to M3, and are therefore not exposed to the outside. On the other hand, both side surfaces of the base 2 in the Z-axis direction are exposed to the outside without being covered by these electrodes, plating, etc. However, both side surfaces of the base 2 in the Z-axis direction may also be covered by electrodes, plating, etc.

[0025] The conductor 3 (lower surface electrode) is in the form of a rectangular sheet and is provided directly on the lower surface 22 of the base 2. The conductor 3 can be formed thinly by, for example, printing and firing a conductive paste whose main component is silver or the like. The conductor 3 may also be formed by applying and hardening a resin silver paste. The conductor 3 is formed on the lower surface 22 of the base 2, extending from a first end 221 (the end on the negative side of the X-axis) to a second end 222 (the end on the positive side of the X-axis) opposite the first end 221. As an example, the conductor 3 has approximately the same shape and area as the lower surface 22 when viewed along the Y-axis. In short, in FIG. 1 , the conductor 3 is formed so as to substantially cover the entire lower surface 22 of the base 2, extending from the left end to the right end of the lower surface 22.

[0026] The top electrode 6 is formed on at least a portion of the top surface 21 of the base 2, opposite the bottom surface 22. In this embodiment, the top electrode 6 includes a pair of electrodes 6A and 6B. Each of the electrodes 6A and 6B has a rectangular strip shape that is elongated in the Z-axis direction. The electrodes 6A and 6B are provided directly on the top surface 21 of the base 2 so as to cover the end and end of the top surface 21 of the base 2 on the negative side and positive side of the X-axis, respectively.

[0027] The top electrode 6 can be formed thinly by printing and baking a conductive paste whose main component is, for example, silver. The top electrode 6 may also be formed by applying and curing a resin silver paste. The material of the top electrode 6 may be the same as the material of the conductor 3.

[0028] In this embodiment, current flows predominantly through the conductor 3 (lower surface electrode), and the upper surface electrode 6 is less likely to become a current path than the conductor 3. However, the provision of the upper surface electrode 6 makes the jumper chip component 1 more resistant to stress after mounting on the printed circuit board 100. The provision of the upper surface electrode 6 also improves the adhesive strength of the first to third plating layers M1 to M3 to the conductor 3. It also contributes to reducing the resistance value of the jumper chip component 1 as a whole.

[0029] The end electrode 4 is formed at least on the side surface 23 of the base 2 so as to be electrically connected to the conductor 3. In this embodiment, the end electrode 4 is provided directly on the side surface 23 of the base 2 so as to be electrically connected to the conductor 3 and the top electrode 6.

[0030] Specifically, the end surface electrode 4 includes a pair of electrodes 4A and 4B. Each of the electrodes 4A and 4B is elongated in the Z-axis direction.

[0031] Each of the electrodes 4A and 4B has a substantially U-shaped cross section taken along the XY plane. Each of the electrodes 4A and 4B has an upper portion 41 facing the corresponding one of the electrodes 6A and 6B. Each of the electrodes 4A and 4B also has a central portion 42 facing the corresponding one of the first side surface 231 and the second side surface 232 of the base 2. Each of the electrodes 4A and 4B also has a lower portion 43 facing the corresponding one of the edge on the negative side of the X axis and the edge on the positive side of the X axis of the conductor 3. Each of the electrodes 4A and 4B has a substantially U-shaped cross section, with the upper portion 41, central portion 42, and lower portion 43 integrally formed. The electrode 4A is disposed so as to surround the edge on the negative side of the X axis of the electrode 6A, the first side surface 231 of the base 2, and the edge on the negative side of the X axis of the conductor 3. Electrode 4B is disposed so as to surround the edge of electrode 6B on the positive side of the X axis, second side surface 232 of base 2, and the edge of conductor 3 on the positive side of the X axis.

[0032] The end surface electrodes 4 can be formed thinly by printing and baking a conductive paste whose main component is, for example, silver. The end surface electrodes 4 may also be formed by applying and curing a resin silver paste. The material of the end surface electrodes 4 may be the same as the material of the conductor 3.

[0033] In this embodiment, the current flows predominantly through the conductor 3, and the end surface electrodes 4 are less likely to become a current path than the conductor 3. However, the provision of the end surface electrodes 4 makes the jumper chip component 1 more resistant to stress after mounting on the printed circuit board 100. The provision of the end surface electrodes 4 also improves the adhesive strength of the first to third plating layers M1 to M3 to the conductor 3. This also contributes to a reduction in the resistance value of the jumper chip component 1 as a whole.

[0034] The protective film 7 covers at least a portion of the upper surface 21 of the base 2 opposite the lower surface 22. In this embodiment, the protective film 7 is provided directly on the upper surface 21 of the base 2 so as to cover the area of ​​the upper surface 21 of the base 2 excluding the end portions on the positive side and the negative side of the X axis. In other words, the protective film 7 is provided on the upper surface 21 of the base 2 so as to be sandwiched between and in contact with the electrodes 6A, 6B provided on the upper surface 21 of the base 2. The protective film 7 may be provided on the upper surface 21 of the base 2 so as to partially cover and overlap the electrodes 6A, 6B. The protective film 7 is formed from, for example, an epoxy resin or the like.

[0035] The provision of the protective film 7 makes it easier to determine the front and back sides of the jumper chip component 1, for example, during the mounting process of the jumper chip component 1. This contributes to improving productivity. The determination of the front and back sides here includes not only a determination of the front and back sides made by a person's visual inspection, but also an automatic determination of the front and back sides made by identifying an appearance image obtained by capturing an image of the jumper chip component 1 using a production management system.

[0036] Incidentally, in the mounting process of the jumper chip component 1, when the jumper chip component 1 is picked up by the tip nozzle of the chip mounter and mounted on the printed circuit board 100, the tip nozzle may be worn out by repeatedly hitting the upper surface of the jumper chip component 1. By providing the protective film 7, wear on the tip nozzle can be suppressed.

[0037] The first plating layer M1 contains Cu (copper) and is conductive. The first plating layer M1 is a thin film layer. The first plating layer M1 corresponds to the copper plating layer 5 and covers at least a portion of the conductor 3. In this embodiment, the first plating layer M1 is formed so as to generally cover the surfaces of the electrodes 6A and 6B, the surfaces of the electrodes 4A and 4B, and the surface of the conductor 3. However, the first plating layer M1 is formed so as not to cover the protective film 7.

[0038] The first plating layer M1 may contain Cu as a main component and other components, such as a copper alloy. The first plating layer M1 may also contain Au (gold) or Ag (silver) instead of Cu, such as a silver alloy. That is, the first plating layer M1 may be a gold plating layer or a silver plating layer.

[0039] In this embodiment, the provision of the first plating layer M1 allows the thickness in the Y-axis direction of the portion that forms the current path together with the conductor 3 to be increased, which contributes to reducing the resistance value of the jumper chip component 1.

[0040] The second plating layer M2 contains Ni (nickel) and is electrically conductive. The second plating layer M2 is a thin film layer. The second plating layer M2 corresponds to a nickel plating layer and covers at least a portion of the first plating layer M1 (here, substantially the entire outer surface of the first plating layer M1). The second plating layer M2 is provided directly on the outer surface of the first plating layer M1. The second plating layer M2 may contain other components, with Ni as the main component.

[0041] The third plating layer M3 contains Sn (tin) and is conductive. The third plating layer M3 is a thin film layer. The third plating layer M3 corresponds to a tin plating layer and covers at least a portion of the second plating layer M2 (here, substantially the entire outer surface of the second plating layer M2). The third plating layer M3 is provided directly on the outer surface of the second plating layer M2. The second plating layer M2 is primarily composed of Ni and may contain other components.

[0042] The jumper chip component 1 configured as described above is manufactured by forming, for example, the conductor 3, the top electrode 6, the end electrode 4, the protective film 7, the first plating layer M1, the second plating layer M2, and the third plating layer M3 in this order on the base 2. However, the formation procedure is not limited to this order.

[0043] The jumper chip component 1 configured as described above can suppress the resistance to, for example, 1 mΩ or less.

[0044] When the conductor is provided on the top surface of the base instead of the bottom surface, as in the jumper chip of Patent Document 1, the current passes through the end surface electrodes and then through the conductor on the top surface. In other words, in the case of jumper chip component 1 of this embodiment, the current flows upward through one of electrodes 4A and 4B of end surface electrode 4, passes through the conductor provided on the top surface of the base, and then flows downward through the other of electrodes 4A and 4B, which tends to make the current path longer by the amount of current flowing up and down through electrodes 4A and 4B.

[0045] On the other hand, the conductor 3 of this embodiment is formed on the underside 22 of the base 2, from the first end 221 to the second end 222. Therefore, the current path of the jumper chip component 1 as a whole tends to be shorter by the length of the end surface electrode 4. As a result, the jumper chip component 1 has the advantage of being able to suppress the resistance value. By suppressing the resistance value, heat generation due to Joule heat can be suppressed even when a large current is applied, allowing more current to flow. Therefore, the jumper chip component 1 is easy to mount even in a current path through which a large current flows, such as in an automotive motor wiring.

[0046] Furthermore, since one surface 12 of the jumper chip component 1 is a flat surface, the height of the jumper chip component 1 relative to the printed circuit board 100 can be reduced.

[0047] The resistance value can be further reduced by increasing the thickness of the copper plating layer 5 (first plating layer M1). From the viewpoints of the allowable current amount, plating thickness, and formation costs, the thickness of the copper plating layer 5 is preferably in the range of, for example, 10 μm to 50 μm.

[0048] (2.2) Usage example An example of how the jumper chip component 1 can be used will be described below with reference to Figures 2A to 3C. The printed circuit board 100 shown in Figures 2A to 3C has a thickness along the Y-axis. The printed circuit board 100 has a conductor pattern P0 to which the jumper chip component 1 can be joined.

[0049] More specifically, the printed circuit board 100 is, for example, a single-sided printed wiring board having an insulating substrate 101 (base material) and a conductor pattern P0 (printed wiring). However, the printed circuit board 100 may also be a double-sided printed wiring board.

[0050] The insulating substrate 101 has electrical insulation properties and is, for example, a glass epoxy substrate.

[0051] The conductor pattern P0 is formed on one side (the positive side of the Y axis) of the insulating substrate 101. The conductor pattern P0 can electrically connect multiple electronic components (circuit components) mounted on the printed circuit board 100, and can form a circuit together with the multiple electronic components.

[0052] The material of the conductive pattern P0 is assumed to be copper (copper foil), but may also be aluminum, stainless steel, etc. The thickness of the conductive pattern P0 is assumed to be, for example, 18 μm or more and 100 μm or less, but is not particularly limited. The printed circuit board 100 is obtained by processing the copper foil of a metal-clad laminate into the desired conductive pattern P0 by a photoetching method. The conductive pattern P0 may be partially covered with a resist layer.

[0053] In this embodiment, the jumper chip component 1 is surface-mounted by soldering onto the conductor pattern P0 formed on the printed circuit board 100. Specifically, both ends of the third plating layer M3 in the X-axis direction are joined onto the conductor pattern P0 by soldering, with at least a portion of one surface 12 (rear surface) facing the surface of the conductor pattern P0. The number of jumper chip components 1 mounted on one printed circuit board 100 is not particularly limited.

[0054] The jumper chip component 1 may be mounted on the conductive pattern P0 by a component mounting machine (chip mounter) in the same way as other mounting components (circuit components, etc.), or may be mounted by hand using tweezers or the like.

[0055] <1st usage example> Fig. 2A shows a first example of use of the jumper chip component 1. In Fig. 2A, a first conductor pattern P1 is shown as the conductor pattern P0.

[0056] The first conductor pattern P1 is formed so that its electrical path is along the X-axis. The width of the jumper chip component 1 is approximately equal to the width of the first conductor pattern P1. The jumper chip component 1 is placed on the first conductor pattern P1 so that its longitudinal direction is along the electrical path (direction of the X-axis) of the first conductor pattern P1. The jumper chip component 1 is solder-bonded at both ends in its longitudinal direction so that one surface 12 (back surface) is in approximate surface contact with the surface of the first conductor pattern P1 (see solder fillets 102).

[0057] <Second usage example> Fig. 2B shows a second example of use of the jumper chip component 1. In Fig. 2B, a second conductor pattern P2 is shown as the conductor pattern P0.

[0058] The second conductor pattern P2 is formed so that its electrical path is along the X-axis. The width of the jumper chip component 1 is smaller than that of the second conductor pattern P2. The jumper chip component 1 is disposed in the center in the width direction of the second conductor pattern P2 so that its longitudinal direction is along the electrical path (direction of the X-axis) of the second conductor pattern P2. The jumper chip component 1 is solder-bonded at both ends in the longitudinal direction such that one surface 12 (back surface) thereof is in general surface contact with the surface of the second conductor pattern P2 (see solder fillets 102).

[0059] <3rd usage example> Fig. 3A shows a third example of use of the jumper chip component 1. In Fig. 3A, a third conductive pattern P3 and a fourth conductive pattern P4 are shown as the conductive pattern P0.

[0060] The third conductor pattern P3 and the fourth conductive pattern P4 are formed so that their electric paths are aligned along the X-axis and so that their opposing ends are spaced apart by a predetermined gap W1. The widths of the third conductor pattern P3 and the fourth conductive pattern P4 are approximately equal. The width of the jumper chip component 1 is approximately equal to the widths of the third conductor pattern P3 and the fourth conductive pattern P4.

[0061] The jumper chip component 1 is arranged so that its longitudinal direction is along the electric paths (direction of the X-axis) of the third conductor pattern P3 and the fourth conductive pattern P4 and so as to straddle the gap W1. Both ends of the jumper chip component 1 in the longitudinal direction are solder-joined to the opposing ends of the third conductor pattern P3 and the fourth conductive pattern P4 (see solder fillets 102).

[0062] As a result, the third conductive pattern P3 and the fourth conductive pattern P4 are electrically connected to each other by the jumper chip component 1.

[0063] <4th usage example> Fig. 3B shows a fourth example of use of the jumper chip component 1. In Fig. 3B, a fifth conductive pattern P5 and a sixth conductive pattern P6 are shown as the conductive pattern P0.

[0064] The fifth conductor pattern P5 and the sixth conductive pattern P6 are formed so that their electric paths are aligned along the X-axis, and their opposing ends are spaced a predetermined gap W1 apart. The fifth conductor pattern P5 and the sixth conductive pattern P6 have approximately the same width. The width of the jumper chip component 1 is smaller than the widths of the fifth conductor pattern P5 and the sixth conductive pattern P6.

[0065] The jumper chip component 1 is disposed at the center in the width direction of these conductive patterns P0 so that its longitudinal direction is along the electric paths (direction of the X-axis) of the fifth conductive pattern P5 and the sixth conductive pattern P6 and so as to straddle the gap W1. Both longitudinal ends of the jumper chip component 1 are solder-joined to the opposing ends of the fifth conductive pattern P5 and the sixth conductive pattern P6 (see solder fillets 102).

[0066] As a result, the fifth conductive pattern P5 and the sixth conductive pattern P6 are electrically connected to each other by the jumper chip component 1.

[0067] <5th usage example> Fig. 3C shows a fifth example of use of the jumper chip component 1. In Fig. 3C, a seventh conductive pattern P7 and an eighth conductive pattern P8 are shown as the conductive pattern P0.

[0068] The seventh conductor pattern P7 and the eighth conductive pattern P8 are formed so that their electric paths are aligned along the Z-axis and so that their opposing ends are spaced apart by a predetermined gap W2. The seventh conductor pattern P7 and the eighth conductive pattern P8 have approximately the same width. The length of the jumper chip component 1 in the longitudinal direction (the direction of the X-axis) is smaller than the widths of the seventh conductor pattern P7 and the eighth conductive pattern P8.

[0069] The jumper chip component 1 is disposed in the center of the seventh and eighth conductive patterns P7 and P8 in the width direction so that its longitudinal direction intersects (here, perpendicular to) the direction of the electric paths of these conductive patterns P7 and P8 (the direction of the Z axis) and so as to straddle a gap W2. The gap W2 is smaller than the gap W1 in the third and fourth use examples, for example. The jumper chip component 1 has both longitudinal ends and both width ends solder-bonded to the opposing ends of the seventh and eighth conductive patterns P7 and P8 (see solder fillets 102).

[0070] As a result, the seventh conductive pattern P7 and the eighth conductive pattern P8 are electrically connected to each other by the jumper chip component 1.

[0071] In this fifth use example, not only the conductor 3 but also the end electrode 4 can contribute to the current path, so that heat generation due to Joule heat can be further suppressed even when a large current is applied.

[0072] (Embodiment 2) A jumper chip component 1A according to this embodiment will be described below with reference to Figures 4 and 5. Regarding the jumper chip component 1A, components that are substantially the same as those of the jumper chip component 1 of embodiment 1 will be given the same reference numerals, and descriptions thereof may be omitted as appropriate.

[0073] The jumper chip component 1A according to this embodiment is mounted on a printed circuit board 100 (see FIG. 5). As shown in FIG. 4, the jumper chip component 1A comprises a base 2, a conductor 3, an end surface electrode 4, and a step-forming electrode 8. As shown in FIG. 4, the jumper chip component 1A further comprises a first plating layer M1 (copper plating layer 5), an upper surface electrode 6, a protective film 7, a second plating layer M2, and a third plating layer M3.

[0074] The base 2 is electrically insulating. The conductor 3 is formed on the lower surface 22 of the base 2 facing the printed circuit board 100, from a first end 221 to a second end 222 facing the first end 221. The end surface electrode 4 is formed on at least the side surface 23 of the base 2 so as to be electrically connected to the conductor 3. The step-forming electrode 8 is an electrode for forming the step Y1. A recess X1 recessed toward the conductor 3 is provided in the central portion 120 of one surface 12 of the jumper chip component 1A facing the printed circuit board 100. The recess X1 is formed by the step Y1.

[0075] In short, the jumper chip component 1A is different from the jumper chip component 1 of the first embodiment in that it includes a step-forming electrode 8, which forms a recess X1 in the center 120 of one surface 12.

[0076] The step-forming electrode 8 will be described in more detail below.

[0077] The step-forming electrode 8 is disposed below the lower surface 22 of the base 2 (on the negative side of the Y-axis). The step-forming electrode 8 is provided on the lower surface of the conductor 3 and covers at least a portion of the lower surface of the conductor 3. In this embodiment, the step-forming electrode 8 includes a pair of electrodes 8A and 8B. Each of the electrodes 8A and 8B is in the shape of a rectangular strip that is elongated in the Z-axis direction. The electrodes 8A and 8B are provided directly on the lower surface of the conductor 3 so as to cover the end and end of the lower surface of the conductor 3 on the negative side and positive side of the X-axis, respectively.

[0078] The step-forming electrode 8 can be formed thinly by printing and firing a conductive paste mainly composed of silver or the like. The step-forming electrode 8 may also be formed by applying and curing a resin silver paste. The material of the step-forming electrode 8 may be the same as the material of the conductor 3. In the example of FIG. 4, the thickness of the step-forming electrode 8 is greater than the thickness of the conductor 3, but this is not limited thereto and the step-forming electrode 8 may be equal to or less than the thickness of the conductor 3. By adjusting the thickness of the step-forming electrode 8, the depth of the recess X1 can be adjusted. Furthermore, by adjusting the width of the step-forming electrode 8, the horizontal width D1 of the recess X1 can be adjusted. The thickness of the step-forming electrode 8 is, for example, approximately 15 μm.

[0079] In this embodiment, electrode 4A of end surface electrode 4 is arranged to surround the edge on the negative side of the X axis of electrode 6A, the first side surface 231 of base 2, the edge on the negative side of the X axis of conductor 3, and the edge on the negative side of the X axis of electrode 8A. Similarly, electrode 4B of end surface electrode 4 is arranged to surround the edge on the positive side of the X axis of electrode 6B, the second side surface 232 of base 2, the edge on the positive side of the X axis of conductor 3, and the edge on the positive side of the X axis of electrode 8B. The thickness (dimension in the Y-axis direction) of the lower portion 43 of each of electrodes 4A and 4B is, for example, approximately 10 μm.

[0080] In this embodiment, the first plating layer M1 (copper plating layer 5) is formed so as to generally cover the surfaces of the electrodes 6A and 6B, the surfaces of the electrodes 4A and 4B, the surfaces of the electrodes 8A and 8B, and a portion of the surface of the conductor 3 (exposed from the step-forming electrode 8).

[0081] Therefore, when plating is performed to form the first plating layer M1 with the step-forming electrode 8 formed on the conductor 3, a recess will be formed in the center of the first plating layer M1 in the X-axis direction, depending on the step Y1 caused by the step-forming electrode 8. Similarly, a recess will be formed in the center of the second plating layer M2 and the third plating layer M3 formed on the first plating layer M1 in the X-axis direction, depending on the step Y1 caused by the step-forming electrode 8. That is, a recess X1 recessed toward the conductor 3 will be formed in the center 120 of one surface 12 of the jumper chip component 1A.

[0082] In this embodiment, as in the first embodiment, the conductor 3 is formed on the underside 22 of the base 2 from the first end 221 to the second end 222. Therefore, the current path of the jumper chip component 1A as a whole tends to be shortened by the length of the end surface electrodes 4. As a result, the jumper chip component 1A has the advantage of being able to suppress the resistance value. By suppressing the resistance value, heat generation due to Joule heat can be suppressed even when a large current is applied, allowing more current to flow. Therefore, the jumper chip component 1A is easy to mount even in a current path through which a large current flows, such as in an automotive motor wiring.

[0083] Furthermore, since a recess X1 is provided on one surface 12 of the jumper chip component 1A, if there is wiring between the lands (conductor patterns P0), the possibility of the wiring coming into contact with the jumper chip component 1A and causing a short circuit is reduced.

[0084] <Usage example> Fig. 5 shows an example of use of the jumper chip component 1 A. In Fig. 5, a ninth conductive pattern P9, a tenth conductive pattern P10, and an eleventh conductive pattern P11 are shown as the conductive pattern P0.

[0085] The ninth conductor pattern P9 and the tenth conductive pattern P10 are formed so that their electric paths are aligned along the X-axis, and their opposing ends are spaced a predetermined gap W3 apart. The ninth conductor pattern P9 and the tenth conductive pattern P10 have approximately the same width. The width of the jumper chip component 1A is smaller than the widths of the ninth conductor pattern P9 and the tenth conductive pattern P10.

[0086] The eleventh conductive pattern P11 is formed in the gap W3 so that its electrical path is aligned with the Z axis. The width W4 of the eleventh conductive pattern P11 is smaller than the gap W3. In particular, the width W4 of the eleventh conductive pattern P11 is smaller than the lateral width D1 of the recess X1 on the one surface 12 of the jumper chip component 1A.

[0087] The jumper chip component 1A is disposed at the center in the width direction of these conductive patterns P0 so that its longitudinal direction is along the electric paths (direction of the X-axis) of the ninth conductive pattern P9 and the tenth conductive pattern P10 and so as to straddle the gap W3. Both longitudinal ends of the jumper chip component 1A are solder-joined to the opposing ends of the ninth conductive pattern P9 and the tenth conductive pattern P10 (see solder fillets 102).

[0088] As a result, the ninth conductor pattern P9 and the tenth conductive pattern P10 are electrically connected to each other by the jumper chip component 1A. Furthermore, at this time, the recess X1 on one surface 12 of the jumper chip component 1A makes it easy for the jumper chip component 1A to avoid contact with the eleventh conductive pattern P11. This reduces the possibility of the jumper chip component 1A coming into contact with the eleventh conductive pattern P11 and causing a short circuit.

[0089] The jumper chip component 1A may be mounted on the printed circuit board 100 as in the first to fifth use examples described in the first embodiment.

[0090] (Variation) The above-described first and second embodiments are merely examples of various embodiments of the present disclosure. The above-described first and second embodiments can be modified in various ways depending on the design, etc., as long as the object of the present disclosure can be achieved. Below, modified examples of the above-described first and second embodiments are listed. The modified examples described below can be applied in appropriate combinations.

[0091] In the first and second embodiments, the jumper chip components 1, 1A are plate-shaped and elongated in one direction (X-axis). However, the shape of the jumper chip components 1, 1A is not particularly limited, and may be, for example, a square plate-shaped when viewed along the thickness direction (Y-axis).

[0092] In the first and second embodiments, the jumper chip components 1 and 1A are provided with the first to third plating layers M1 to M3, but these plating layers are not essential components for the jumper chip components 1 and 1A. At least one of the first to third plating layers M1 to M3 may be omitted.

[0093] In the first to fifth use examples of the first embodiment and the use example of the second embodiment, the case where the number of jumper chip components 1, 1A is one has been described. A plurality of jumper chip components 1 (or a plurality of jumper chip components 1A) may be collectively arranged on the conductor pattern P0. For example, in the first use example, two or more jumper chip components 1 may be closely arranged side by side along the electrical path of the first conductor pattern P1.

[0094] Furthermore, one or more jumper chip components 1 and one or more jumper chip components 1A may be mounted on one printed circuit board 100 in a mixed manner.

[0095] In the first and second embodiments, it is assumed that the conductor 3, the end electrode 4, and the top electrode 6 are formed at different times on the base 2. However, at least two of the conductor 3, the end electrode 4, and the top electrode 6 may be formed at the same time on the base 2. Specifically, for example, the conductor 3 and the end electrode 4 may be formed collectively using the same material and with the same thickness.

[0096] (summary) As described above, the jumper chip component (1) according to the first aspect is mounted on a printed circuit board (100). The jumper chip component (1) comprises a base (2), a conductor (3), and an end surface electrode (4). The base (2) is electrically insulating. The conductor (3) is formed on the lower surface (22) of the base (2) facing the printed circuit board (100), from a first end (221) to a second end (222) facing the first end (221). The end surface electrode (4) is formed on at least the side surface (23) of the base (2) so as to be electrically connected to the conductor (3). One surface (12) of the jumper chip component (1) facing the printed circuit board (100) is flat.

[0097] According to this embodiment, the conductor 3 is formed on the underside 22 of the base 2 from the first end 221 to the second end 222, which tends to shorten the current path in the jumper chip component 1. As a result, the jumper chip component 1 has the advantage of being able to suppress the resistance value. In particular, since the one surface 12 of the jumper chip component 1 is flat, the jumper chip component 1 can be made lower in height relative to the printed circuit board 100.

[0098] A jumper chip component (1A) according to a second aspect is mounted on a printed circuit board (100). The jumper chip component (1A) comprises a base (2), a conductor (3), an edge electrode (4), and a step-forming electrode (8). The base (2) is electrically insulating. The conductor (3) is formed on the lower surface (22) of the base (2) facing the printed circuit board (100), from a first end (221) to a second end (222) facing the first end (221). The edge electrode (4) is formed on at least a side surface (23) of the base (2) so as to be electrically connected to the conductor (3). The step-forming electrode (8) is an electrode for forming a step (Y1). The jumper chip component 1A has a central portion 120 of one surface 12 facing the printed circuit board 100, which is provided with a recess X1 recessed toward the conductor 3. The recess X1 is formed by a step Y1.

[0099] According to this embodiment, the conductor 3 is formed on the underside 22 of the base 2 from the first end 221 to the second end 222, which tends to shorten the current path in the jumper chip component 1A. As a result, the jumper chip component 1A has the advantage of being able to suppress the resistance value. In particular, the provision of the recessed portion X1 reduces the possibility of a short circuit caused by contact between the jumper chip component 1A and wiring, for example, between the lands.

[0100] The jumper chip component (1, 1A) according to the third aspect is the jumper chip component (1, 1A) of the first or second aspect, further comprising a copper plating layer (5) covering at least a part of the conductor (3).

[0101] According to this embodiment, the resistance value of the jumper chip component (1, 1A) can be further reduced.

[0102] The jumper chip component (1, 1A) according to the fourth aspect is any one of the first to third aspects, and further comprises an upper surface electrode (6) formed on at least a portion of the upper surface (21) of the base (2) opposite the lower surface (22).

[0103] According to this embodiment, the device becomes resistant to stress after being mounted on the printed circuit board (100).

[0104] The jumper chip component (1, 1A) according to the fifth aspect is any one of the first to fourth aspects, and further comprises a protective film (7) that covers at least a portion of the upper surface (21) of the base (2) opposite the lower surface (22).

[0105] According to this embodiment, it becomes easier to determine the front and back of the jumper chip components (1, 1A), which contributes to improving productivity.

[0106] The configurations according to the third to fifth aspects are not essential for the jumper chip component (1) according to the first aspect or the jumper chip component (1A) according to the second aspect, and can be omitted as appropriate. [Explanation of symbols]

[0107] 1,1A jumper chip parts 12 one side 120 Central part 2 Base 21 Top side 22 Bottom side 221 1st end 222 2nd end 23 Side 3 Conductors 4 Edge electrode 43 Lower 5 Copper plating layer 6 Top electrode 7 Protective film 8 Step-forming electrode 100 Printed Circuit Boards X1 recess Y1 step

Claims

1. A jumper chip component mounted on a printed circuit board, an electrically insulating substrate; a conductor formed on a lower surface of the base facing the printed circuit board, the conductor extending from a first end to a second end opposite the first end; an end surface electrode formed on at least a side surface of the base body so as to be electrically connected to the conductor; a step-forming electrode including a pair of electrodes covering a region on the first end side and a region on the second end side of the lower surface of the conductor, respectively, for forming a step between each of the pair of electrodes and the conductor; Equipped with a recess recessed toward the conductor is provided in the center of one surface of the jumper chip component facing the printed circuit board; the recess is formed by the step, The width of the recess is defined by the width of each of the pair of electrodes. Jumper chip parts.

2. Further comprising a copper plating layer covering at least a portion of the conductor. The jumper chip component according to claim 1 .

3. The substrate further comprises an upper surface electrode formed on at least a portion of an upper surface opposite to the lower surface.

3. The jumper chip part according to claim 1 or 2.

4. The substrate further comprises a protective film covering at least a portion of an upper surface opposite to the lower surface. The jumper chip part according to any one of claims 1 to 3.

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