Semiconductor manufacturing equipment

Abstract

To provide semiconductor manufacturing equipment capable of reducing a running cost in a wire bonding step.SOLUTION: Semiconductor manufacturing equipment comprises a plurality of bonding heads and a bonding head mounting part. The plurality of bonding heads joins a plurality of metal wires different in wire diameter from each other, respectively. The bonding head mounting part detachably holds one of the plurality of bonding heads. The bonding head mounting part automatically performs the attachment / detachment of the bonding head, on the basis of information on the wire diameter of the metal wire to be joined to a joining object.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to semiconductor manufacturing equipment. [Background technology]

[0002] A wire bonding apparatus, which is a type of semiconductor manufacturing apparatus, bonds a semiconductor element to a lead frame with a metal wire (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2005-353901 Summary of the Invention [Problem to be solved by the invention]

[0004] In the wire bonding process, bonding is required using metal wires with a wire diameter that corresponds to the product performance of the semiconductor device. Therefore, every time the wire diameter is changed, the bonding tool must be replaced with one that corresponds to the new wire diameter. Since the replacement work is done manually, running costs increase.

[0005] In order to solve the above-mentioned problems, the present disclosure provides a semiconductor manufacturing apparatus that can reduce the running costs in the wire bonding process. [Means for solving the problem]

[0006] A semiconductor manufacturing apparatus according to the present disclosure bonds metal wires to a bonding object in a semiconductor device to form electrical wiring in the semiconductor device. The semiconductor manufacturing apparatus includes multiple bonding heads and a bonding head attachment unit. The multiple bonding heads respectively bond multiple metal wires having different wire diameters. The bonding head attachment unit detachably holds one of the multiple bonding heads. The bonding head attachment unit automatically attaches and detaches the bonding head based on information about the wire diameter of the metal wire to be bonded to the bonding object. [Effects of the Invention]

[0007] According to the present disclosure, a semiconductor manufacturing apparatus is provided that reduces the running costs in a wire bonding process.

[0008] The objects, features, aspects, and advantages of the present disclosure will become more apparent from the following detailed description and the accompanying drawings. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a diagram showing a configuration of a semiconductor manufacturing apparatus according to a first embodiment. [Figure 2] FIG. 2 is a diagram showing the configuration of a bonding head according to the first embodiment. [Figure 3] FIG. 2 is a diagram showing the configuration of the tip of a bonding tool. [Figure 4] 1 is a flowchart showing an outline of a wire bonding method according to the first embodiment. [Figure 5] FIG. 1 is a diagram showing a part of the configuration of a wired semiconductor device. [Figure 6] 10A and 10B are diagrams illustrating a cutting operation of a metal wire. [Figure 7] 4 is a flowchart showing a method for automatically replacing a bonding head in the first embodiment. [Figure 8] FIG. 10 is a diagram showing the state of the bonding head and the bonding head mounting portion before replacement. [Figure 9] 3 is an enlarged view showing the configuration of a bonding head connection portion and a bonding head attachment portion. FIG. [Figure 10] 3 is an enlarged view showing the configuration of a bonding head connection portion and a bonding head attachment portion. FIG. [Figure 11] 10A and 10B are diagrams showing the driving state of the support columns of the bonding head mounting portion. [Figure 12] 10 is a flowchart showing a method for automatically adjusting the attachment state of a bonding head. [Figure 13] 10A and 10B are diagrams showing the driving state of the table of the bonding head mounting portion. [Figure 14] FIG. 10 is a diagram showing a configuration in which a bonding head and a bonding head mounting portion are fixed with fixing screws. [Figure 15] 10 is a diagram showing the configuration of a bonding head connection portion and a bonding head attachment portion in a first modification of the first embodiment. FIG. [Figure 16] FIG. 10 is a diagram showing a state in which the electromagnetic suction mechanism is switched off to open the bonding head connection portion. [Figure 17] 10 is a flowchart showing a method for automatically replacing a bonding head in a first modification of the first embodiment. [Figure 18] 10 is a diagram showing the configuration of a bonding head connection portion and a bonding head attachment portion in a second modification of the first embodiment. FIG. [Figure 19] FIG. 10 is a diagram showing a state in which the mechanical chuck is in the "open" position and the bonding head connection portion is released. [Figure 20] 10 is a flowchart showing a method for automatically replacing a bonding head in a second modification of the first embodiment. [Figure 21] FIG. 10 is a diagram showing a configuration of a semiconductor manufacturing apparatus according to a second embodiment. [Figure 22] FIG. 10 is a diagram showing a configuration of a bonding tool according to a second embodiment. [Figure 23] 10A and 10B are diagrams illustrating an example of a change in the tip shape of a bonding tool. [Figure 24]10A and 10B are diagrams illustrating an example of a change in the tip shape of a bonding tool. [Figure 25] 10 is a flowchart showing a method for changing the tip shape of a bonding tool in the second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] <First Embodiment> (Configuration of semiconductor manufacturing equipment) The semiconductor manufacturing apparatus in the first embodiment is a wire bonder that bonds a metal wire to a bonding object in a semiconductor device to form electrical wiring in the semiconductor device. The bonding object is, for example, a conductor such as an electrode or a lead frame provided on the surface of a semiconductor element that constitutes the semiconductor device.

[0011] FIG. 1 is a diagram showing the configuration of a semiconductor manufacturing apparatus 101 according to the first embodiment.

[0012] The semiconductor manufacturing apparatus 101 includes a plurality of bonding heads 1, a bonding head storage unit 2, a product information reading unit 3, a control unit 4, a bonding head mounting unit 5, a camera 6, and a calculation unit .

[0013] 2 is a diagram showing the configuration of the bonding head 1 in embodiment 1. The bonding head 1 includes a bonding head connection portion 11, a bonding tool 12, a metal wire 13, a wire guide 14, a clamper 15, and a cutter 16. Each bonding head 1 bonds the metal wire 13 to an object to be bonded (not shown).

[0014] The bonding head connection part 11 is provided on the upper part of the bonding head 1. The bonding head connection part 11 is held by the bonding head attachment part 5. As a result, the bonding head 1 is fixed to the bonding head attachment part 5.

[0015] FIG. 3 is a diagram showing the configuration of the tip 12A of the bonding tool 12. The bonding tool 12 has the tip 12A that presses the metal wire 13 against the object to be bonded. The tip 12A has a V-shaped groove that is formed to match the diameter of the metal wire 13. The metal wire 13 is placed along the groove. The bonding tool 12 applies ultrasonic waves while the metal wire 13 is pressed against the object to be bonded by the tip 12A. As a result, the metal wire 13 is bonded to the object to be bonded.

[0016] A metal wire 13 is attached to each bonding head 1. The wire diameter of the metal wire 13 varies depending on the bonding head 1. The metal wire 13 is made of, for example, gold, silver, copper, or aluminum. The semiconductor manufacturing apparatus 101 can bond metal wires 13 of various wire diameters to objects to be bonded by replacing each bonding head 1. In other words, the multiple bonding heads 1 have the function of bonding multiple metal wires 13 having different wire diameters to objects to be bonded, respectively.

[0017] The wire guide 14 guides the metal wire 13 to the tip 12A of the bonding tool 12. The metal wire 13 passes through the wire guide 14 and is arranged to cross the tip 12A of the bonding tool 12.

[0018] The clamper 15 grips and releases the metal wire 13 at predetermined timings according to the operation of the bonding tool 12. By the coordinated operation of the clamper 15 and the bonding tool 12, the metal wire 13 to be bonded to the bonding object is formed into a three-dimensional shape and wired.

[0019] The cutter 16 cuts the metal wire 13 after bonding.

[0020] As shown in FIG. 1, the bonding head storage section 2 stores at least one bonding head 1A out of the plurality of bonding heads 1 that is not held by the bonding head attachment section 5.

[0021] The bonding head storage unit 2 includes a plurality of bonding head mounting units 21. Each bonding head mounting unit 21 mounts and stores one bonding head 1A. Although not shown in FIG. 1, there is also an empty bonding head mounting unit 21 in which to store the bonding head 1B held by the bonding head attachment unit 5. Each bonding head mounting unit 21 is provided at a predetermined location within the semiconductor manufacturing equipment 101. Each bonding head mounting unit 21 includes a table 22 and a support 23.

[0022] The table 22 is movable in the X and Y directions (the horizontal and depth directions in FIG. 1). The table 22 is driven based on the results of a calculation unit 7, which will be described later, and automatically adjusts the mounting state of the bonding head 1.

[0023] The support 23 is provided on the upper surface of the table 22 and can be driven in the X direction (the horizontal direction in FIG. 1). The bonding head 1 is placed on the support 23 with the tip 12A of the bonding tool 12 not in contact with the table 22.

[0024] The product information reading unit 3 automatically reads product information. The product information is displayed, for example, using a two-dimensional code, a one-dimensional code, characters, symbols, etc. The product information is engraved, or displayed, for example, on the semiconductor device in process or on the carrier of the semiconductor device, but is not limited to these. The product information reading unit 3 includes, for example, an imaging element or an infrared reader. If the product information is displayed using characters or symbols, the product information reading unit 3 may have an OCR (Optical Character Recognition) function.

[0025] The control unit 4 analyzes the product information and acquires information on the wire diameter of the metal wire 13 to be bonded to the bonding object. Based on this information, the control unit 4 selects a specific bonding head 1C from among the multiple bonding heads 1. Then, the control unit 4 outputs a replacement instruction to the bonding head attachment unit 5.

[0026] The control unit 4 includes a processor (not shown) and a memory (not shown). The above functions of the control unit 4 are written in a program, and the functions of the control unit 4 are realized by the processor executing the program.

[0027] The bonding head mounting portion 5 detachably holds one bonding head 1B of the multiple bonding heads 1. The bonding head 1B held by the bonding head mounting portion 5 bonds a metal wire 13 to an object to be bonded, and the remaining bonding head 1A is stored in the bonding head storage portion 2.

[0028] The bonding head mounting portion 5 in the first embodiment has claws 51. The bonding head mounting portion 5 grips the bonding head connection portion 11 with the claws 51. Furthermore, the bonding head mounting portion 5 has a chuck 52 that holds the bonding head connection portion 11 by air suction. An air tube (not shown) is built into the bonding head mounting portion 5. The pressure in the space between the bonding head mounting portion 5 and the bonding head connection portion 11 is controlled by air suction through the air tube. This controls the opening and closing of the chuck 52, making it possible to attach and detach the bonding head 1B.

[0029] The bonding head mounting unit 5 automatically attaches and detaches the bonding head 1B to replace it, based on information about the wire diameter of the metal wire 13 to be bonded to the bonding object. The bonding head mounting unit 5 in the first embodiment attaches and detaches the bonding head 1B in accordance with an exchange instruction from the control unit 4. More specifically, the bonding head mounting unit 5 releases the already attached bonding head 1B and newly holds a specific bonding head 1C selected by the control unit 4. The bonding head mounting unit 5 is capable of moving three-dimensionally. The bonding head mounting unit 5 transports the bonding head 1B between the position where the wire bonding process is performed and a predetermined storage position in the bonding head storage unit 2.

[0030] The camera 6 captures an image of the joint where the metal wire 13 is joined.

[0031] The calculation unit 7 calculates the coordinates of the bonded portion based on an image of the bonded portion after bonding. The calculation unit 7 calculates the difference between the coordinates of the bonded portion where the metal wire 13 is actually bonded and the design coordinates that were previously determined as the position where the metal wire 13 should be bonded. The design coordinates can also be considered as coordinates that were previously intended. The calculation unit 7 includes a processor (not shown) and a memory (not shown). The calculation unit 7 may be integrated with the control unit 4.

[0032] (Wire bonding method) Fig. 4 is a flowchart showing an outline of the wire bonding method according to embodiment 1. Fig. 5 is a diagram showing a part of the configuration of semiconductor device 8 after wiring has been completed.

[0033] In step S11, the metal wire 13 is bonded to a bonding portion 84, which is an object to be bonded. Here, the bonding portion 84 corresponds to a surface to be bonded, such as an electrode provided on the surface of a semiconductor element 81. The semiconductor element 81 is fixed on a lead frame 82 with a bonding material 83. First, the position of the tip 12A of the bonding tool 12 is adjusted three-dimensionally so that it coincides with the bonding portion 84. With the metal wire 13 crossing the tip 12A pressed against the bonding portion 84, ultrasonic waves are applied from the bonding tool 12 to the bonding portion 84. As a result, the metal wire 13 is bonded to the bonding portion 84.

[0034] In step S12, the metal wire 13 is wired in a predetermined three-dimensional shape. For example, after bonding, the tip 12A of the bonding tool 12 moves to the next bonding portion 85 while repeating three-dimensional fine movements in accordance with the predetermined three-dimensional shape. This causes the metal wire 13 to be shaped into a three-dimensional wiring shape. Alternatively, the metal wire 13 after wiring may be hammered using a trajectory forming part (not shown) to shape the trajectory of the metal wire 13.

[0035] In step S13, the metal wire 13 is bonded to the bonding portion 85, which is the next bonding object. The bonding portion 85 is, for example, another electrode of the semiconductor element 81 or a conductor such as a lead frame 82. As in step S11, the tip 12A of the bonding tool 12 is moved to the bonding portion 85. Ultrasonic waves are applied while the metal wire 13 of the tip 12A is pressed against the bonding portion 85. If another metal wire 13 is to be bonded to another bonding portion, steps S12 and S13 are repeated.

[0036] In step S14, the metal wire 13 is cut. FIG. 6 is a diagram showing the cutting operation of the metal wire 13. After the metal wire 13 is bonded in step S13, the tip 12A of the bonding tool 12 is moved in the extension direction (direction of arrow 91) of the wiring formed in steps S12 and S13. After the movement is completed, the cutter 16 descends in the Z-axis direction (direction of arrow 92) and cuts the metal wire 13. This completes the wire bonding in the semiconductor device 8.

[0037] (Bonding head 1 automatic replacement method) In a typical wire bonding process for a semiconductor device 8, a plurality of metal wires 13 are wired by the above method. As shown in Fig. 3, the groove in the tip portion 12A where the metal wire 13 is placed is formed to match the wire diameter of the metal wire 13. Therefore, if a metal wire 13 of a certain wire diameter is used with a bonding tool 12 that is compatible with a wire diameter different from the metal wire 13, normal bonding cannot be achieved.

[0038] Therefore, the semiconductor manufacturing apparatus 101 in the first embodiment automatically replaces the bonding head 1B held by the bonding head attachment portion 5 with a bonding head 1C corresponding to the wire diameter of the metal wire 13 to be bonded to the bonding object.

[0039] Fig. 7 is a flowchart showing the automatic replacement method of the bonding head 1B in embodiment 1. Fig. 8 is a diagram showing the state of the bonding head 1B and the bonding head attachment part 5 before replacement.

[0040] In step S21, the product information reading unit 3 automatically reads the product information at a predetermined timing. The control unit 4 analyzes the product information and obtains information on the wire diameter of the metal wire 13 to be bonded to the semiconductor element 81. Based on this information, the control unit 4 determines whether or not the bonding head 1B held by the bonding head attachment unit 5 needs to be replaced. If replacement is necessary, the control unit 4 selects a specific bonding head 1C from the multiple bonding heads 1. Then, the control unit 4 outputs an instruction to the bonding head attachment unit 5 to replace the bonding head 1B.

[0041] In step S22, the bonding head mounting unit 5, in accordance with the replacement instruction from the control unit 4, moves the currently mounted bonding head 1B to the coordinates above a predetermined storage position in the bonding head storage unit 2. In other words, the bonding head mounting unit 5 moves to the coordinates above an empty bonding head mounting unit 21.

[0042] In step S23, the bonding head attachment unit 5 descends from its aerial coordinate to the storage position.

[0043] In step S24, the bonding head mounting unit 5 turns off the air suction of the chuck 52, releases the claws 51, and removes the bonding head 1B. FIG. 9 is an enlarged view showing the configuration of the bonding head connection unit 11 and the bonding head mounting unit 5. FIG. 9 shows the state in which the air suction of the chuck 52 is turned off. Because the air suction is turned off, the pressure in the space between the bonding head mounting unit 5 and the bonding head connection unit 11 increases, and the chuck 52 enters the "open" state. This completes the automatic removal of the bonding head 1B.

[0044] In step S25, the bonding head mounting unit 5 moves to the coordinates above the storage position of a specific bonding head 1C selected by the control unit 4 from among the multiple bonding heads 1 stored in the bonding head storage unit 2.

[0045] In step S26, the bonding head attachment section 5 descends from its aerial coordinates to the storage position of the specific bonding head 1C.

[0046] In step S27, the bonding head mounting portion 5 grips the bonding head connecting portion 11 with its claws 51 and turns on air suction to hold that particular bonding head 1C. FIG. 10 is an enlarged view showing the configuration of the bonding head connecting portion 11 and the bonding head mounting portion 5. FIG. 10 shows the state in which the air suction of the chuck 52 is turned on. Because air suction is turned on, the pressure in the space between the bonding head mounting portion 5 and the bonding head connecting portion 11 decreases, and the chuck 52 enters the "closed" state. This completes the automatic mounting of the bonding head 1C.

[0047] Thereafter, the support columns 23 of the bonding head mounting portion 21 are driven outward, releasing the mounted state of the bonding head 1C. Figure 11 is a diagram showing the driven state of the support columns 23 of the bonding head mounting portion 21.

[0048] The bonding head attachment unit 5 moves the bonding head 1C so that the bonding tool 12 is placed at a predetermined position where wire bonding is possible. This completes the automatic exchange of the bonding heads 1B and 1C.

[0049] (Method for automatically adjusting the mounting state of bonding head 1) To achieve highly accurate bonding, it is necessary to optimally attach the bonding head 1 to the bonding head attachment portion 5. The semiconductor manufacturing apparatus 101 in the first embodiment automatically adjusts the attachment state of the bonding head 1.

[0050] FIG. 12 is a flowchart showing a method for automatically adjusting the mounting state of the bonding head 1.

[0051] In step S31, the bonding head mounting unit 5 replaces the bonding head 1B with the bonding head 1A to be adjusted that is stored in the bonding head storage unit 2. During this automatic replacement operation, the table 22 of the bonding head mounting unit 21 on which the bonding head 1A to be adjusted is mounted is fixed at an arbitrary position, i.e., the position before adjustment.

[0052] In step S32, after the replacement, the bonding head 1A attached to the bonding head attachment portion 5 performs test bonding.

[0053] In step S33, the camera 6 captures an image of the bonded portion after the test bonding. The calculation unit 7 calculates the coordinates of the bonded portion based on the image captured by the camera 6. The calculation unit 7 calculates the difference between the coordinates of the bonded portion where the metal wire 13 is actually bonded and the design coordinates that were previously determined as the position where the metal wire 13 should be bonded.

[0054] In step S34, the bonding head attachment unit 5 returns the bonding head 1A to the original bonding head mounting unit 21.

[0055] In step S35, the bonding head mounting unit 21 drives the table 22 based on the difference calculated by the calculation unit 7. FIG. 13 is a diagram showing the driving state of the table 22 of the bonding head mounting unit 21. The table 22 is driven, for example, in the X and Y directions (the horizontal and depth directions in FIG. 13). This corrects the coordinates of the storage position, i.e., the exchange position, of the bonding head 1A. The table 22 maintains the corrected position.

[0056] This completes the automatic adjustment of the mounting state of the bonding head 1A. This automatic adjustment is performed, for example, every time the bonding head 1A stored in the bonding head storage unit 2 is removed from the bonding head mounting unit 21. For example, the automatic adjustment is performed every time maintenance such as repair or adjustment is performed on the bonding head 1A. The trigger condition for executing the automatic adjustment is whether or not the bonding head 1A has been removed from any of the bonding head mounting units 21. This determination is monitored, for example, by the value of a load sensor (load sensor) installed on the bonding head mounting unit 21.

[0057] To summarize the above, the semiconductor manufacturing apparatus 101 in the first embodiment bonds a metal wire 13 to a bonding object in the semiconductor device 8 to form electrical wiring in the semiconductor device 8. The semiconductor manufacturing apparatus 101 includes a plurality of bonding heads 1 and a bonding head attachment unit 5. The plurality of bonding heads 1 respectively bond a plurality of metal wires 13 having different wire diameters. The bonding head attachment unit 5 detachably holds one bonding head 1B of the plurality of bonding heads 1. The bonding head attachment unit 5 automatically attaches and detaches the bonding head 1B based on information about the wire diameter of the metal wire 13 to be bonded to the bonding object.

[0058] In such semiconductor manufacturing apparatus 101, the already installed bonding head 1B is automatically replaced with a bonding head 1C corresponding to the wire diameter of the metal wire 13 to be bonded to the bonding object, thereby reducing the running cost in the wire bonding process.

[0059] FIG. 14 is a diagram showing a configuration in which the bonding head 1D and the bonding head mounting portion 5D are fixed with fixing screws 51D. In this configuration, the relative positions of the bonding head 1D and the bonding head mounting portion 5D are adjusted with adjustment screws (not shown). Therefore, each time the bonding head 1D is replaced, the relative positions must be fine-tuned with the adjustment screws. If position adjustment becomes necessary after the bonding head 1D has been mounted, all of the fixing screws 51D are removed, and the relative positions are manually fine-tuned with the adjustment screws. Then, the bonding head 1D is mounted again on the bonding head mounting portion 5D.

[0060] The adjustment amount of the adjustment screw is determined intuitively by the operator based on the results of position confirmation. The position of the tip 12A of the bonding tool 12 is important to accurately bond the metal wire 13 to the desired position. In other words, adjusting the mounting position of the bonding head 1D is extremely important, so this manual adjustment work requires a high level of skill on the part of the operator. To ensure reproducibility of the mounting accuracy, it is necessary to use disposable fixing screws 51D and work using dedicated jigs.

[0061] According to the semiconductor manufacturing apparatus 101 of the first embodiment, the mounting position is automatically adjusted, so the adjustment result is not affected by the skill level of the operator, and the number of work steps is reduced. Since the fixing screws 51D are not used, the number of fixing screws 51D that are discarded is reduced. Furthermore, since the frequency of use of dedicated jigs is reduced, the wear rate of the object caused by using the jigs is reduced. As a result, the number of work steps is reduced, production loss is reduced, and product quality is improved.

[0062] (First Modification of First Embodiment) FIG. 15 is a diagram showing the configuration of the bonding head connecting portion 11 and the bonding head mounting portion 5 in the first modification of the first embodiment.

[0063] The bonding head attachment portion 5 includes an electromagnetic attraction mechanism 53. The electromagnetic attraction mechanism 53 holds the bonding head 1 by electromagnetic attraction.

[0064] The electromagnetic attraction mechanism 53 includes an electromagnetic coil 53A and a switch 53B. The switch 53B controls the ON / OFF of the current flowing through the electromagnetic coil 53A, thereby controlling the generation of a magnetic field in the electromagnetic coil 53A, and ultimately the ON / OFF of the electromagnetic attraction.

[0065] 15 shows the state in which the electromagnetic attraction mechanism 53 holds the bonding head connection part 11 with the switch 53B turned ON. When the switch 53B is ON, a magnetic field is generated around the electromagnetic coil 53A. As a result, the electromagnetic attraction mechanism 53 attracts the bonding head connection part 11. As a result, the bonding head 1 is fixed to the bonding head mounting part 5.

[0066] 16 is a diagram showing a state in which the electromagnetic attraction mechanism 53 has turned off the switch 53B and released the bonding head connection portion 11. When the switch 53B is off, no magnetic field is generated around the electromagnetic coil 53A. Therefore, the electromagnetic attraction mechanism 53 does not attract the bonding head connection portion 11. Therefore, the bonding head 1 is released from the bonding head attachment portion 5.

[0067] FIG. 17 is a flowchart showing a method for automatically replacing the bonding head 1B in the first modification of the first embodiment.

[0068] In step S41, the product information reading unit 3 automatically reads the product information at a predetermined timing. The control unit 4 analyzes the product information to obtain information on the wire diameter of the metal wire 13 to be bonded to the semiconductor element 81. If it is determined that the bonding head 1B needs to be replaced, the control unit 4 outputs an instruction to the bonding head attachment unit 5 to replace the bonding head 1B. This step S41 is the same as step S21.

[0069] In step S42, the bonding head mounting unit 5, in accordance with the replacement instruction from the control unit 4, moves the currently mounted bonding head 1B to coordinates above a predetermined storage position in the bonding head storage unit 2. This step S42 is similar to step S22.

[0070] In step S43, the bonding head attachment unit 5 descends from its aerial coordinate to the storage position. This step S43 is similar to step S23.

[0071] In step S44, the bonding head mounting unit 5 turns off the switch 53B of the electromagnetic adsorption mechanism 53 and removes the bonding head 1B. As shown in Fig. 16, when the switch 53B is OFF, the electromagnetic adsorption mechanism 53 does not adsorb the bonding head connecting unit 11. This completes the automatic removal of the bonding head 1B.

[0072] In step S45, the bonding head mounting unit 5 moves to the coordinates above the storage position of a specific bonding head 1C selected by the control unit 4 from among the multiple bonding heads 1 stored in the bonding head storage unit 2. This step S45 is similar to step S25.

[0073] In step S46, the bonding head attachment section 5 descends from its aerial coordinates to the storage position of the specific bonding head 1 C. This step S46 is similar to step S26.

[0074] In step S47, the bonding head mounting unit 5 holds the specific bonding head 1C by turning on the switch 53B of the electromagnetic suction mechanism 53. As shown in Fig. 15, when the switch 53B is on, the electromagnetic suction mechanism 53 attracts the bonding head connecting unit 11. This completes the automatic mounting of the bonding head 1C.

[0075] Other automatic exchange processes are the same as those in embodiment 1. This completes the automatic exchange of the bonding heads 1B and 1C.

[0076] (Modification 2 of Embodiment 1) FIG. 18 is a diagram showing the configuration of the bonding head connecting portion 11 and the bonding head mounting portion 5 in the second modification of the first embodiment.

[0077] The bonding head attachment portion 5 includes a mechanical chuck 54 that mechanically holds the bonding head 1. The bonding head 1 is attached and detached by opening and closing the mechanical chuck 54.

[0078] 18 shows the state in which the mechanical chuck 54 is in the "closed" position and holds the bonding head connection portion 11. When the mechanical chuck 54 is closed, the mechanical chuck 54 grips the bonding head connection portion 11. This fixes the bonding head 1 to the bonding head attachment portion 5.

[0079] 19 is a diagram showing a state in which the mechanical chuck 54 is in the "open" position and releases the bonding head connection portion 11. When the mechanical chuck 54 is open, the mechanical chuck 54 does not grip the bonding head connection portion 11. Therefore, the bonding head 1 is released from the bonding head attachment portion 5.

[0080] FIG. 20 is a flowchart showing a method for automatically replacing the bonding head 1B in the second modification of the first embodiment.

[0081] In step S51, the product information reading unit 3 automatically reads the product information at a predetermined timing. The control unit 4 analyzes the product information to obtain information on the wire diameter of the metal wire 13 to be bonded to the semiconductor element 81. If it is determined that the bonding head 1B needs to be replaced, the control unit 4 outputs an instruction to replace the bonding head 1B to the bonding head attachment unit 5. This step S51 is the same as step S21.

[0082] In step S52, the bonding head mounting unit 5, in accordance with the replacement instruction from the control unit 4, moves the currently mounted bonding head 1B to coordinates above a predetermined storage position in the bonding head storage unit 2. This step S52 is similar to step S22.

[0083] In step S53, the bonding head attachment unit 5 descends from its aerial coordinate to the storage position. This step S53 is similar to step S23.

[0084] In step S54, the bonding head mounting portion 5 opens the mechanical chuck 54 and removes the bonding head 1B. As shown in Fig. 19, when the mechanical chuck 54 is open, the mechanical chuck 54 does not grip the bonding head connecting portion 11. This completes the automatic removal of the bonding head 1B.

[0085] In step S55, the bonding head mounting unit 5 moves to the coordinates above the storage position of a specific bonding head 1C selected by the control unit 4 from among the multiple bonding heads 1 stored in the bonding head storage unit 2. This step S55 is similar to step S25.

[0086] In step S56, the bonding head attachment section 5 descends from its aerial coordinates to the storage position of the specific bonding head 1 C. This step S56 is similar to step S26.

[0087] In step S57, the bonding head attachment unit 5 closes the mechanical chuck 54 to hold the specific bonding head 1C. As shown in Fig. 18, when the mechanical chuck 54 is closed, the mechanical chuck 54 grips the bonding head connection unit 11. This completes the automatic attachment of the bonding head 1C.

[0088] Other automatic exchange processes are the same as those in embodiment 1. This completes the automatic exchange of the bonding heads 1B and 1C.

[0089] <Embodiment 2> 21 is a diagram showing the configuration of a semiconductor manufacturing apparatus 102 according to the second embodiment. The semiconductor manufacturing apparatus 102 is a wire bonder that bonds a metal wire 13 to a bonding object in a semiconductor device 8 to form electrical wiring in the semiconductor device 8. The bonding object is, for example, a conductor such as an electrode or a lead frame 82 provided on the surface of a semiconductor element 81 that constitutes the semiconductor device 8.

[0090] The semiconductor manufacturing equipment 102 includes a bonding head 10, a control unit 40, and a product information reading unit 30.

[0091] The bonding head 10 includes a bonding tool 17, a metal wire 13, a wire guide 14, a clamper 15, and a cutter 16. The configurations of the metal wire 13, the wire guide 14, the clamper 15, and the cutter 16 are the same as those in the first embodiment.

[0092] 22 is a diagram showing the configuration of bonding tool 17 in embodiment 2. Bonding tool 17 includes two gripping portions 17A, two plates 17B, a first spring 17C, a second spring 17D, a first switch 17E, and a second switch 17F.

[0093] The two gripping portions 17A are formed at the tip of the bonding tool 17. The metal wire 13 is gripped by the tips of the two gripping portions 17A. The bonding tool 17 presses the metal wire 13 gripped by the tips of the two gripping portions 17A against the semiconductor element 81 to bond it.

[0094] The two plates 17B are provided so as to sandwich the two gripping portions 17A from outside.

[0095] Both ends of first spring 17C and second spring 17D are connected to two plates 17B, respectively. In other words, first spring 17C and second spring 17D connect two gripping portions 17A via two plates 17B. Furthermore, first spring 17C and second spring 17D are electrically connected in parallel to form a parallel circuit.

[0096] The first spring 17C and the second spring 17D are made of a shape-memory alloy. The overall length of the shape-memorized second spring 17D is shorter than the overall length of the shape-memorized first spring 17C. In other words, when a predetermined current is passed through the first spring 17C and the second spring 17D, the overall length of the second spring 17D is shorter than the overall length of the first spring 17C.

[0097] The first switch 17E controls ON / OFF of the current flowing through the first spring 17C, and the second switch 17F controls ON / OFF of the current flowing through the second spring 17D.

[0098] The product information reading unit 30 automatically reads product information. The product information is displayed, for example, using a two-dimensional code, a one-dimensional code, characters, symbols, etc. The product information is engraved, i.e., displayed, for example, on the semiconductor device 8 in process or on the carrier of the semiconductor device 8, but is not limited to these. The product information reading unit 30 includes, for example, an imaging element, an infrared reader, etc. When the product information is displayed using characters or symbols, the product information reading unit 30 may have an OCR (Optical Character Recognition) function.

[0099] The control unit 40 analyzes the product information to obtain information about the wire diameter of the metal wire 13 to be joined to the joining target object. Based on this information, the control unit 40 controls the currents flowing through the first spring 17C and the second spring 17D. The first spring 17C and the second spring 17D, which are made of a shape memory alloy, are deformed by controlling the currents. In other words, the control unit 40 changes the distance between the two gripping portions 17A by controlling the currents flowing through the first spring 17C and the second spring 17D.

[0100] The control unit 40 includes a processor (not shown) and a memory (not shown). The above functions of the control unit 40 are written in a program, and the functions of the control unit 40 are realized by the processor executing the program.

[0101] As shown in Figure 22, when joining a thick metal wire 13, the control unit 40 turns off the first switch 17E and the second switch 17F. The current to the first spring 17C and the second spring 17D is cut off. In this state, the first spring 17C and the second spring 17D have normal spring characteristics, and the distance between the two gripping portions 17A is maximized. As a result, a distance corresponding to the thick metal wire 13 is obtained.

[0102] FIG. 23 is a diagram showing an example of a change in the tip shape of the bonding tool 17. When bonding a metal wire 13 of a medium diameter, the control unit 40 turns on the first switch 17E and turns off the second switch 17F. Current flows through the first spring 17C, and current to the second spring 17D is cut off. In this state, the first spring 17C deforms into a shape-memorized short shape. The elastic force caused by the deformation of the first spring 17C moves the two plates 17B toward each other. The spacing between the gripping portions 17A of the bonding tool 17 narrows. As a result, a spacing suitable for a metal wire 13 of a medium diameter is obtained.

[0103] FIG. 24 is a diagram showing an example of a change in the tip shape of the bonding tool 17. When bonding a metal wire 13 with a thin diameter, the control unit 40 turns on the second switch 17F and turns off the first switch 17E. Current flows through the second spring 17D, and current to the first spring 17C is cut off. In this state, the second spring 17D deforms into a shape-memorized short shape. The elastic force caused by the deformation of the second spring 17D moves the two plates 17B toward each other. The spacing between the gripping portions 17A of the bonding tool 17 narrows. The overall length of the shape-memorized second spring 17D is shorter than the overall length of the shape-memorized first spring 17C. Therefore, the spacing between the gripping portions 17A becomes even narrower than the spacing shown in FIG. 23. As a result, a spacing corresponding to the metal wire 13 with a thin diameter is obtained.

[0104] FIG. 25 is a flowchart showing a method for changing the tip shape of the bonding tool 17 in the second embodiment.

[0105] In step S61, the product information reading unit 30 automatically reads the product information at a predetermined timing. The control unit 40 analyzes the product information to obtain information on the wire diameter of the metal wire 13 to be bonded to the semiconductor element 81. Based on this information, the control unit 40 determines whether or not the tip shape of the bonding tool 17 needs to be changed. If the tip shape needs to be changed, the control unit 40 determines a current path in an electric circuit including the first spring 17C and the second spring 17D.

[0106] In step S62, the control unit 40 controls the first switch 17E or the second switch 17F.

[0107] In step S63, the distance between the two gripping portions 17A is changed by controlling the first switch 17E or the second switch 17F. This completes the change in the shape of the tip of the bonding tool 17.

[0108] In summary, the semiconductor manufacturing apparatus 102 in the second embodiment bonds the metal wire 13 to a bonding object in the semiconductor device 8 to form electrical wiring in the semiconductor device 8. The semiconductor manufacturing apparatus 102 includes a bonding tool 17, a spring (first spring 17C or second spring 17D), and a control unit 40. The bonding tool 17 includes two gripping portions 17A capable of gripping the metal wire 13. The bonding tool 17 bonds the metal wire 13 held at the tips of the two gripping portions 17A to the bonding object. The spring is made of a shape memory alloy. The spring connects the two gripping portions 17A. The control unit 40 changes the distance between the two gripping portions 17A by controlling the current flowing through the spring based on information about the wire diameter of the metal wire 13 to be bonded to the bonding object.

[0109] Such semiconductor manufacturing apparatus 102 improves product quality by preventing human error when changing the wire diameter of metal wire 13. In addition, the number of steps required for replacing bonding tool 17 is reduced, reducing production loss.

[0110] The configuration of semiconductor manufacturing apparatus 102 shown in embodiment 2 can also be applied to semiconductor manufacturing apparatus 101 shown in embodiment 1. For example, semiconductor manufacturing apparatus 101 of embodiment 1 first selects bonding head 1C that roughly corresponds to the wire diameter of metal wire 13 to be bonded to semiconductor element 81. Then, semiconductor manufacturing apparatus 101 adjusts the distance between two gripping portions 17A using the configuration shown in embodiment 2 so that the distance more accurately corresponds to the wire diameter of metal wire 13.

[0111] In the present disclosure, the embodiments can be freely combined, and the embodiments can be modified or omitted as appropriate.

[0112] Various aspects of the present disclosure are summarized below as appendices.

[0113] (Appendix 1) A semiconductor manufacturing apparatus for forming electrical wiring in a semiconductor device by joining a metal wire to a joining object in the semiconductor device, a plurality of bonding heads for respectively bonding a plurality of metal wires having different wire diameters; a bonding head attachment portion that detachably holds one of the plurality of bonding heads, The bonding head attachment unit automatically attaches and detaches the bonding head based on information about the wire diameter of the metal wire to be bonded to the bonding object.

[0114] (Appendix 2) 2. The semiconductor manufacturing apparatus of claim 1, further comprising a bonding head storage section that stores at least one bonding head among the plurality of bonding heads that is not held by the bonding head mounting section.

[0115] (Appendix 3) 3. The semiconductor manufacturing apparatus according to claim 1, wherein the bonding head mounting portion includes a chuck that holds the bonding head by air suction.

[0116] (Appendix 4) 3. The semiconductor manufacturing apparatus according to claim 1, wherein the bonding head mounting portion includes an electromagnetic attraction mechanism that holds the bonding head by electromagnetic attraction.

[0117] (Appendix 5) 3. The semiconductor manufacturing apparatus according to claim 1, wherein the bonding head mounting portion includes a mechanical chuck that mechanically holds the bonding head.

[0118] (Appendix 6) 6. The semiconductor manufacturing apparatus according to claim 1, further comprising a camera that photographs the bonded portion to which the metal wire is bonded.

[0119] (Appendix 7) a control unit that selects a specific bonding head from the plurality of bonding heads based on the information on the wire diameter of the metal wire to be bonded to the bonding object, the bonding head mounting unit releases the already mounted bonding head and newly holds the specific bonding head selected by the control unit, thereby performing the mounting and detachment; 7. The semiconductor manufacturing apparatus according to claim 1, wherein the specific bonding head presses the metal wire against the object to be bonded to bond the object.

[0120] (Appendix 8) A semiconductor manufacturing apparatus for forming electrical wiring in a semiconductor device by joining a metal wire to a joining object in the semiconductor device, a bonding tool including two gripping portions capable of gripping the metal wire, and bonding the metal wire held by the two gripping portions to the bonding object; a spring formed of a shape memory alloy and connecting the two gripping portions; a control unit that controls the current flowing through the spring based on information about the wire diameter of the metal wire to be joined to the object to be joined, thereby changing the distance between the two gripping parts. [Explanation of symbols]

[0121] 1 Bonding head, 1A to 1D Bonding head, 2 Bonding head storage section, 3 Product information reading section, 4 Control section, 5 Bonding head mounting section, 5D Bonding head mounting section, 6 Camera, 7 Calculation section, 8 Semiconductor device, 10 Bonding head, 11 Bonding head connection section, 12 Bonding tool, 12A Tip section, 13 Metal wire, 14 Wire guide, 15 Clamp, 16 Cutter, 17 Bonding tool, 17A Grip section, 17B Plate, 17C First spring, 17D Second spring, 17E First switch, 17F Second switch, 21 Bonding head mounting section, 22 Table, 23 Support, 30 Product information reading section, 40 Control section, 51 Claw, 51D Fixing screw, 52 Chuck, 53 Electromagnetic suction mechanism, 53A Electromagnetic coil, 53B Switch, 54 Mechanical chuck, 81 semiconductor element, 82 lead frame, 83 bonding material, 91 arrow, 92 arrow, 101 semiconductor manufacturing equipment, 102 semiconductor manufacturing equipment.

Claims

1. A semiconductor manufacturing apparatus for forming electrical wiring in a semiconductor device by joining a metal wire to a joining object in the semiconductor device, a plurality of bonding heads for respectively bonding a plurality of metal wires having different wire diameters; a bonding head attachment portion that detachably holds one of the plurality of bonding heads, The bonding head attachment unit automatically attaches and detaches the bonding head based on information about the wire diameter of the metal wire to be bonded to the bonding object.

2. 2. The semiconductor manufacturing apparatus according to claim 1, further comprising a bonding head storage section for storing at least one bonding head of the plurality of bonding heads that is not held by the bonding head attachment section.

3. 2. The semiconductor manufacturing apparatus according to claim 1, wherein said bonding head attachment portion includes a chuck that holds said bonding head by air suction.

4. 2. The semiconductor manufacturing apparatus according to claim 1, wherein said bonding head attachment portion includes an electromagnetic attraction mechanism that holds said bonding head by electromagnetic attraction.

5. 2. The semiconductor manufacturing apparatus according to claim 1, wherein the bonding head attachment portion includes a mechanical chuck that mechanically holds the bonding head.

6. The semiconductor manufacturing apparatus according to claim 1 , further comprising a camera for taking an image of the joint where the metal wire is joined.

7. a control unit that selects a specific bonding head from the plurality of bonding heads based on the information on the wire diameter of the metal wire to be bonded to the bonding object, the bonding head mounting unit releases the already mounted bonding head and newly holds the specific bonding head selected by the control unit, thereby performing the mounting and detachment; 2. The semiconductor manufacturing apparatus according to claim 1, wherein the specific bonding head presses the metal wire against the object to be bonded to bond the object.

8. A semiconductor manufacturing apparatus for forming electrical wiring in a semiconductor device by joining a metal wire to a joining object in the semiconductor device, a bonding tool including two gripping portions capable of gripping the metal wire, and bonding the metal wire gripped by the two gripping portions to the bonding object; a spring formed of a shape memory alloy and connecting the two gripping portions; a control unit that controls the current flowing through the spring based on information about the wire diameter of the metal wire to be joined to the object to be joined, thereby changing the distance between the two gripping parts.

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