Wiring board, package for mounting electronic components using wiring board, and electronic module

Abstract

A wiring board according to an embodiment of the present disclosure comprises: a first insulation layer; a second insulation layer; a signal line; and a first ground conductor line. The first insulation layer has a first upper surface and a first lower surface. The second insulation layer is positioned on the first insulation layer and has a second upper surface, a second lower surface, and one or more first opening parts that open in the second upper surface. The signal line is positioned on the second upper surface. The first ground conductor line is positioned on the second upper surface but apart from the signal line by a first gap, and extends along the signal line. In a plan view, at least one of the first opening parts is positioned between the signal line and the first ground conductor line, and is in contact with the first ground conductor line.

Description

[Technical Field]

[0001] The present disclosure relates to a wiring board, an electronic component mounting package using the wiring board, and an electronic module. [Background technology]

[0002] In recent years, wireless communication devices and optical communication devices have been required to operate at higher frequencies in order to transmit faster and larger volumes of information. Among these, wiring boards with a coplanar structure using a single signal line are known as a structure for transmitting single-ended signals (see Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-181542 Summary of the Invention

[0004] A wiring board according to an embodiment of the present disclosure includes a first insulating layer, a second insulating layer, a signal line, and a first ground conductor line. The first insulating layer has a first upper surface and a first lower surface. The second insulating layer is located on the first insulating layer and has a second upper surface, a second lower surface, and one or more first openings in the second upper surface. The signal line is located on the second upper surface. The first ground conductor line is located on the second upper surface at a first interval from the signal line and extends along the signal line. In a plan view, at least one first opening is located between the signal line and the first ground conductor line and is in contact with the first ground conductor line.

[0005] An electronic component mounting package according to an embodiment of the present disclosure includes the wiring board configured as described above, a substrate, and a frame body joined to the upper surface of the substrate.

[0006] An electronic module according to one embodiment of the present disclosure includes an electronic component mounting package having the above-described configuration, an electronic component located on the upper surface of the substrate and electrically connected to the wiring board, and a lid located on a frame body and covering the interior of the electronic component mounting package. [Brief explanation of the drawings]

[0007] [Figure 1] 1 is a perspective view of a wiring board, an electronic component mounting package, and an electronic module according to a first embodiment of the present disclosure. [Figure 2] 2 is an enlarged view of a main part A of the wiring board shown in FIG. [Figure 3] 2 is a plan view of a main part A of the wiring board shown in FIG. [Figure 4] 4 is a cross-sectional view of a main part A of the wiring board shown in FIG. 3 taken along the line X1-X1. [Figure 5] FIG. 10 is a plan view of a main part A of a wiring board according to a second embodiment of the present disclosure. [Figure 6] 6 is a cross-sectional view of a main part A of the wiring board shown in FIG. 5 along X2-X2. [Figure 7] 1 is a schematic perspective view of an electronic component mounting package according to a first embodiment to which an external substrate is connected, and an electronic module. [Figure 8] 8 is a planar perspective view of a main part B of the wiring board shown in FIG. 7. [Figure 9A] FIG. 2 is a plan view of an external substrate. [Figure 9B] FIG. 2 is a plan view of the external substrate as seen from the rear surface. [Figure 9C] 9 is a cross-sectional view of a main part B of the wiring board shown in FIG. 8 taken along the line Y1-Y1. DETAILED DESCRIPTION OF THE INVENTION

[0008] <Wiring board configuration> Hereinafter, several exemplary embodiments of the present disclosure will be described with reference to the drawings. Note that for a wiring board, an electronic component mounting package using the wiring board, and an electronic module, either direction may be considered to be up or down. However, for convenience, a Cartesian coordinate system xyz is defined, with the positive side of the z direction being considered to be up. Hereinafter, the direction in which a signal line extends refers to, for example, the x direction in the drawings. A direction perpendicular to the direction in which a signal line extends refers to, for example, the y direction in the drawings. In addition, in this disclosure, a planar view is a concept that includes a planar perspective view.

[0009] First Embodiment 1 to 4, a wiring board 101a according to a first embodiment of the present disclosure will be described. The wiring board 101a includes at least a first insulating layer 1, a second insulating layer 2, a signal line 53, and a first ground conductor line 51. The wiring board 101a may further include a second ground conductor line 52, a third insulating layer 3, and a ground conductor layer 6. An external board 8, such as a flexible printed circuit (FPC), may be connected to the wiring board 101a.

[0010] 4, the first insulating layer 1 has a first upper surface 11 and a first lower surface 12. Examples of materials that can be used for the first insulating layer 1 include ceramic materials such as aluminum oxide sintered body, mullite sintered body, silicon carbide sintered body, aluminum nitride sintered body, and silicon nitride sintered body, and dielectric materials such as glass ceramic materials. Furthermore, the first insulating layer 1 may be configured by laminating a plurality of insulating layers. The first insulating layer 1 is, for example, rectangular in plan view, with dimensions of 4 mm×4 mm to 50 mm×50 mm and a thickness of 0.5 mm to 10 mm.

[0011] As shown in FIG. 4, the second insulating layer 2 has a second upper surface 21, a second lower surface 22, and one or more first openings 211 that open into the second upper surface 21. The second insulating layer 2 is located on the first insulating layer 1. The material of the second insulating layer 2 may be the same as or different from the material of the first insulating layer 1, and for example, the same material as the first insulating layer 1 described above can be used. The second insulating layer 2 may have a structure in which multiple insulating layers are stacked. The second insulating layer 2 has a rectangular shape in a plan view, for example, with dimensions of 4 mm × 4 mm to 50 mm × 50 mm, and a thickness of 0.5 mm to 10 mm.

[0012] As shown in FIGS. 2 to 4 , the signal line 53 is located on the second upper surface 21 of the second insulating layer 2 and extends in the x-direction in this embodiment. Hereinafter, the direction in which the signal line extends is referred to as the x-direction, and the direction perpendicular to the direction in which the signal line extends is referred to as the y-direction. Examples of materials for the signal line 53 include metal materials such as gold, silver, copper, nickel, tungsten, molybdenum, and manganese. The signal line 53 may be formed by sintering a metal paste on the second upper surface 21, or by using a thin-film formation technique such as vapor deposition or sputtering. The surface of the signal line 53 may be plated with a metal such as nickel or gold. The signal line 53 has a width of 0.05 mm to 2 mm and a length of 1.5 mm to 25 mm, for example. The signal line 53 has a thickness of 0.01 mm to 0.1 mm, for example. The width, length, and thickness of the signal line 53 referred to here may refer to the dimensions in the y, x, and z directions, respectively, of the signal line 53. The widths, lengths, and thicknesses of the first ground conductor line 51, the second ground conductor line 52, and the third ground conductor line 83, which will be described later, can also be defined in a similar manner.

[0013] As shown in FIGS. 2 to 4 , the first ground conductor line 51 is located on the second upper surface 21 of the second insulating layer 2 at a first distance L1 from the signal line 53 in the y direction and extends along the signal line 53. In this embodiment, the first ground conductor line 51 extends parallel to the signal line 53 in the x direction. The material of the first ground conductor line 51 may be the same as or different from the material of the signal line 53, and may be, for example, the same material as the material of the signal line 53 described above. The first ground conductor line 51 may be formed by the same method as the signal line 53 described above. The first ground conductor line 51 has a width of 0.05 mm to 2 mm and a length of 1.5 mm to 25 mm, for example. The thickness of the first ground conductor line 51 is 0.01 mm to 0.1 mm, for example. The first distance L1 is 0.1 mm to 1 mm, for example. When the wiring board 101a includes the first ground conductor line 51 and the signal line 53, the wiring board 101a may have a GSG structure, that is, a single-ended signal wiring.

[0014] As described above, the second insulating layer 2 has first openings 211 that open on the second upper surface 21. As shown in FIG. 3 , at least one first opening 211 is located between the signal line 53 and the first ground conductor line 51 in plan view, and is in contact with the first ground conductor line 51. The first openings 211 are filled with air or a dielectric material such as a resin material or a glass material, and have a lower dielectric constant than the first insulating layer 1 and the second insulating layer 2.

[0015] The first opening 211 is in contact with the first ground conductor line 51, so that the first opening 211 can be made as large as possible. When a lead terminal or a third ground conductor line 83 of an external substrate 8 such as an FPC (Flat Panel Printed Circuit), which will be described later, is joined to the first ground conductor line 51 using a joining material F, excess joining material F can escape into the first opening 211. Therefore, compared to when the first opening 211 is not in contact with the first ground conductor line 51, the amount of joining material F can be increased, thereby improving the joining strength with the lead terminal or the external substrate 8. The joining material F may be any material that electrically connects the lead terminal or the external substrate 8 to the first ground conductor line 51, such as solder.

[0016] Therefore, when the second insulating layer 2 has the first opening 211 that contacts the first ground conductor line 51, it is possible to reduce the second insulating layer 2 with a high dielectric constant that is located between the signal line 53 and the first ground conductor line 51 in a plan view, thereby reducing the decrease in impedance in the signal line 53. Therefore, by using the wiring board 101a, it is possible to provide an electronic component mounting package and an electronic module that can reduce loss in high-frequency signal transmission.

[0017] Furthermore, when the wiring board 101a is miniaturized, the first interval L1 becomes narrower, and the impedance value is likely to decrease. However, since the first opening 211 is in contact with the first ground conductor line 51, the first opening 211 can be made as large as possible, thereby achieving both a reduction in the decrease in impedance and a miniaturization of the wiring board 101a.

[0018] The first opening 211 may be positioned at a second distance L2 from the signal line 53 in the y direction. In this case, it is possible to reduce the possibility that the signal line 53 will be damaged due to misalignment during punching when the first opening 211 is formed in the second insulating layer 2 by mechanical punching using a metal pin or the like. The dimension of the second distance L2 is, for example, 0.01 mm to 0.5 mm.

[0019] Next, the shape of the first opening 211 will be described. As shown in FIG. 4, the first opening 211 may penetrate from the second upper surface 21 to the second lower surface 22. That is, the first opening 211 may penetrate the second insulating layer 2. Alternatively, as shown in FIG. 3, the first opening 211 may be, for example, an oval-shaped portion including a first arc-shaped portion 211b, a second arc-shaped portion 211c, and a first linear portion 211a in a plan view. In this case, the first opening 211 has a width of 0.1 mm to 1 mm and a dimension (depth) in the z direction of 0.5 mm to 10 mm. Depending on the shape of the first opening 211, the width and depth of the first opening 211 may not be constant. In this case, it is sufficient that the maximum width and maximum depth of the first opening 211 are the above-mentioned values. When the depth is constant as in this embodiment, it becomes easy to manufacture the ceramic green sheets that become the first insulating layer 1 and the second insulating layer 2 by stacking them. In addition, the first opening 211 may have an elliptical shape, a square shape, or a rectangular shape with rounded corners in a plan view. The first opening 211 may extend to the end (end surface) of the second insulating layer 2. In other words, the first opening 211 may have a shape in which the end (end surface) of the second insulating layer 2 is cut out.

[0020] In this embodiment, as shown in FIGS. 2 and 3, a third insulating layer 3 may be located on the second insulating layer 2. The material of the third insulating layer 3 may be the same as or different from the material of the first insulating layer 1. For example, the same material as the first insulating layer 1 described above may be used. In this case, in plan view, the first opening 211 may be located at a sixth distance L211 from the third insulating layer 3 in the x-direction. The sixth distance L211 is, for example, 0.01 mm to 0.5 mm. When the first opening 211 is located at the sixth distance L211 from the third insulating layer 3, it is possible to easily adjust the impedance value, for example, when connecting the signal transmission line 82 or the lead terminal of the external substrate 8 shown in FIG. 9A (FIG. 9B) to the signal line 53.

[0021] 3 and 4, the first opening 211 may have a first recess 211d located on the inner circumferential surface of the first opening 211 and in contact with the first ground conductor line 51. When the first opening 211 has the first recess 211d, the first ground conductor line 51 may have a first ground conductor film 511 located on the inner circumferential surface of the first recess 211d and continuous with the first ground conductor line 51. That is, the first recess 211d and the first ground conductor film 511 may form a so-called castellation. In this case, the ground potential can be strengthened and the electric field coupling can be enhanced, thereby reducing the possibility of crosstalk or resonance occurring when the electric field distribution during high-frequency signal transmission is wider than desired. In this embodiment, the first recess 211d has a semi-elliptical shape in a plan view. However, the shape of the first recess 211d is not limited thereto and may be a square or a rectangle with rounded corners.

[0022] As shown in FIG. 4 , the second insulating layer 2 may be exposed on the inner circumferential surface of the first opening 211, excluding the first recess 211d. That is, a conductor such as the first ground conductor film 511 may not be provided on the inner circumferential surface of the first opening 211, excluding the first recess 211d. This reduces the impedance between the signal line 53 and the first ground conductor line 51, thereby reducing signal loss. Furthermore, when the signal line 53 is provided on the second insulating layer 2 by screen printing or the like, if a portion of the signal line 53 is misaligned and positioned on a part of the inner circumferential surface of the first opening 211, the possibility of a short circuit can be reduced. In this embodiment, the inner circumferential surface of the first opening 211 refers to a surface perpendicular to the y-direction.

[0023] In plan view, the first opening 211 may have a plurality of first recesses 211d spaced apart at a fifth interval L5 in the x-direction, and the fifth interval L5 may be equal to or less than ½ of the wavelength λ of the signal transmitted through the signal line 53. Such a configuration can effectively improve the signal transmission characteristics. Furthermore, if the fifth interval L5 is equal to or less than ¼ of the wavelength λ of the signal transmitted through the signal line 53, the ground potential is further strengthened, and the signal transmission characteristics can be effectively improved.

[0024] When the first opening 211 has a plurality of first recesses 211d, the shapes of the plurality of first recesses 211d may be the same or different. When the shapes of the plurality of first recesses 211d are the same as each other, as in the present embodiment, the same metal pins can be used when forming the first recesses 211d by mechanical punching or the like using metal pins, which facilitates the manufacture of the wiring substrate 101a. When the shapes of the plurality of first recesses 211d are different from each other, the degree of freedom in manufacturing is improved, which makes it possible to effectively strengthen the ground potential in places on the signal line 53 where the impedance value may be reduced.

[0025] As described above, the first opening 211 may be an oval-shaped portion including the first arc-shaped portion 211b, the second arc-shaped portion 211c, and the first linear portion 211a in a plan view. In this case, at least one of the first recesses 211d may be located between the first arc-shaped portion 211b and the first linear portion 211a and / or between the second arc-shaped portion 211c and the first linear portion 211a. With this configuration, for example, even when the wiring substrate 101a is miniaturized, the number of first recesses 211d can be increased while maintaining the fifth interval L5. As a result, the ground potential is further strengthened, reducing the possibility of crosstalk and resonance occurring when the electric field distribution during high-frequency signal transmission widens beyond the desired range.

[0026] Next, the size and positional relationship of the first ground conductor line 51, the signal line 53, and the first opening 211 will be described.

[0027] 3, in the y direction, the second interval L2 may be equal to or less than the width W211 of the first opening 211. In this case, the first opening 211 can be made as large as possible while reducing the possibility of the signal line 53 being damaged due to misalignment during punching. As a result, the possibility of a decrease in the impedance value can be reduced, and the possibility of signal loss in the signal line 53 can be reduced. Furthermore, in the y direction, the first interval L1 may be equal to or greater than the width W53 of the signal line 53. In this case, the width W53 of the signal line 53 can be reduced, thereby reducing the decrease in impedance value when a lead terminal or an external substrate 8 is connected.

[0028] In the y direction, the width W53 of the signal line 53 may be equal to or smaller than the width W211 of the first opening 211. Furthermore, in the y direction, the width W211 of the first opening 211 may be greater than the width W53 of the signal line 53 but smaller than the width W51 of the first ground conductor line 51. Note that, in cases where miniaturization of the wiring substrate 101a is not required, the width W51 of the first ground conductor line 51 may be smaller than the width W211 of the first opening 211 but greater than the width W53 of the signal line 53. With this configuration, even when the first gap L1 is large, the first opening 211 located between the first ground conductor line 51 and the signal line 53 in plan view can be made as large as possible. In other words, the second insulating layer 2 with a high dielectric constant located between the first ground conductor line 51 and the signal line 53 in plan view can be reduced as much as possible, thereby effectively reducing the decrease in impedance.

[0029] In this embodiment, the wiring board 101a may further include the second ground conductor line 52 and the ground conductor layer 6, as described above.

[0030] As shown in FIGS. 2 to 4 , the second ground conductor line 52 is located on the second upper surface 21 of the second insulating layer 2 at a third distance L3 in the y direction from the signal line 53 and extends along the signal line 53. The material of the second ground conductor line 52 may be the same as or different from the material of the signal line 53, and may be, for example, the same material as the material of the signal line 53 described above. The second ground conductor line 52 may also be formed by the same method as the signal line 53 described above. The second ground conductor line 52 has a width of 0.05 mm to 2 mm and a length of 1.5 mm to 25 mm, for example. The second ground conductor line 52 has a thickness of 0.01 mm to 0.1 mm, for example.

[0031] When the wiring board 101a includes the second ground conductor line 52, it is possible to reduce loss in signal transmission that occurs when bends (curved portions) are provided in wiring such as the signal line 53 and the first ground conductor line 51. It is also possible to reduce the possibility of crosstalk or resonance occurring when the electric field distribution during transmission of a high-frequency signal is wider than the desired range.

[0032] The ground conductor layer 6 is located between the first insulating layer 1 and the second insulating layer 2. The material of the ground conductor layer 6 is, for example, a metal material such as tungsten, molybdenum, or manganese, and the surface may be nickel-plated or gold-plated. In this embodiment, as shown in FIG. 4, the ground conductor layer 6 is located exposed on the lower surface of the first opening 211. When the wiring board 101a includes the ground conductor layer 6, the electric field coupling can be strengthened, thereby reducing the possibility of crosstalk or resonance occurring when the electric field distribution during transmission of a high-frequency signal spreads beyond a desired range.

[0033] The ground conductor layer 6 may be electrically connected to the first ground conductor line 51 by the above-mentioned first ground conductor film 511. In this case, the electric field coupling can be further strengthened, effectively reducing the possibility of crosstalk or resonance occurring when the electric field distribution during transmission of a high-frequency signal spreads beyond a desired range.

[0034] Although not shown, in this embodiment, an insulating film made of ceramic (e.g., an alumina coating) or resin may be located on a portion of the first ground conductor line 51, the second ground conductor line 52, and the signal line 53. The insulating film may be provided on the first ground conductor line 51 and the signal line 53 by screen printing. Alternatively, the insulating film may be located only on the signal line 53. This configuration can reduce the possibility of short-circuiting between the first ground conductor line 51, the second ground conductor line 52, and the signal line 53.

[0035] As shown in FIG. 7, an external substrate 8 may be connected to an electronic component mounting package 100 including a wiring substrate 101a. FIG. 7 is a see-through view of the portion of the wiring substrate 101a where the external substrate 8 is located. The external substrate 8 includes an insulating substrate 81, a signal transmission line 82, and a third ground conductor line 83. As shown in FIGS. 9A and 9B, the third ground conductor line 83 and the signal transmission line 82 are located on the insulating substrate 81, i.e., on the top and bottom surfaces of the insulating substrate 81. More specifically, as shown in FIG. 9C, the third ground conductor line 83 is located between the top and bottom surfaces of the insulating substrate 81, and the third ground conductor lines 83 located on the top and bottom surfaces are electrically connected by a connecting conductor 84. Like the third ground conductor line 83, the signal transmission line 82 is located on either side of the upper and lower surfaces of the insulating substrate 81, and the signal transmission lines 82 located on the upper and lower surfaces are electrically connected by a connecting conductor 84. The signal transmission line 82 of the external substrate 8 is connected to the signal line 53 of the wiring substrate 101a via a bonding member F. Similarly, the third ground conductor line 83 is connected to the first ground conductor line 51 and the second ground conductor line 52 of the wiring substrate 101a via a bonding member F.

[0036] 8, in a plan view, the third ground conductor line 83 is positioned so as to overlap at least a portion of the first recess 211d. In this case, when the third ground conductor line 83 of an external substrate 8 such as a lead terminal or an FPC is joined to the first ground conductor line 51 using the joining material F, excess joining material F can escape into the first recess 211d. As a result, the joining strength with the lead terminal or the external substrate 8 can be further improved.

[0037] Furthermore, lead terminals may be connected to the wiring substrate 101a instead of the external substrate 8. In this case, the lead terminals can be connected to the signal line 53, the first ground conductor line 51, and the second ground conductor line 52 via bonding members F, respectively.

[0038] Second Embodiment Next, a wiring substrate 101b according to a second embodiment of the present disclosure will be described with reference to Figures 5 and 6. Note that, in the following, only the configuration of the second embodiment that differs from the configuration of the first embodiment will be described, and the other configurations will be assigned the same reference numerals as in the first embodiment and will not be described.

[0039] The wiring board 101b according to the second embodiment differs from the first embodiment in that the second insulating layer 2 further has a second opening 212. 5 and 6, the second insulating layer 2 further has one or more second openings 212 that open on the second upper surface 21. At least one second opening 212 is located between the signal line 53 and the second ground conductor line 52 in plan view, and is in contact with the second ground conductor line 52. The second opening 212 is filled with air or a dielectric material such as a resin material or a glass material, and has a lower dielectric constant than the first insulating layer 1 and the second insulating layer 2.

[0040] Therefore, when the second insulating layer 2 has the second opening 212 in contact with the second ground conductor line 52, it is possible to achieve the same effect as when it has the first opening 211 in contact with the first ground conductor line 51. Therefore, by using the wiring board 101b, it is possible to provide an electronic component mounting package and an electronic module that can reduce loss in high-frequency signal transmission.

[0041] The second opening 212 may be positioned at a fourth distance L4 from the signal line 53 in the y direction. In this case, when the second opening 212 is formed in the second insulating layer 2 by mechanical punching using a metal pin or the like, the possibility of the signal line 53 being damaged due to misalignment during the punching process can be reduced. The dimension of the fourth distance L4 is, for example, 0.05 mm to 0.5 mm, and may be the same as or different from the second distance L2. When the fourth distance L4 and the second distance L2 are the same, the thicknesses of the second insulating layer 2 positioned on either side of the signal line 53 in the y direction are the same, making it easier to adjust the impedance value.

[0042] As shown in FIG. 6 , the second opening 212 may penetrate from the second upper surface 21 to the second lower surface 22. That is, the second opening 212 may penetrate the second insulating layer 2. The second opening 212 may have the same shape as the first opening 211. In this case, the width is 0.1 mm to 1 mm, and the dimension (depth) in the z direction is 0.5 mm to 10 mm. Note that, like the first opening 211, the width and depth of the second opening 212 do not have to be constant throughout the entire second opening 212. The second opening 212 may extend to the end (end surface) of the second insulating layer 2. That is, the second opening 212 may have a shape in which the end (end surface) of the second insulating layer 2 is cut out.

[0043] The second opening 212 may have an elliptical, square, or rectangular shape with rounded corners in a plan view. The second opening 212 does not necessarily have to have the same shape or size as the first opening 211. In this embodiment, the second opening 212 has a shape positioned symmetrically on either side of the signal line 53, but the shape, position, and size of the second opening 212 are not limited thereto. That is, the sizes of the first opening 211 and the second opening 212 may be different, and the second opening 212 can be appropriately provided at a position where a reduction in impedance is required. When the widths of the first opening 211 and the second opening 212 in the y direction and the x direction are the same as in this embodiment, the impedance values ​​can be made equal on both sides of the signal line 53, making it easier to adjust the impedance value.

[0044] As shown in FIGS. 5 and 6 , the second opening 212 may have a second recess 212d, similar to the first recess 211d of the first opening 211. When the second opening 212 has the second recess 212d, the second ground conductor line 52 may have a second ground conductor film 521 located continuously with the second ground conductor line 52 on the inner circumferential surface of the second recess 212d. In this case, the same effect as when the first opening 211 has the first recess 211d can be achieved. In this embodiment, the second recess 212d has a semi-elliptical shape in plan view, but may also have a square shape or a rectangular shape with rounded corners. The shape of the second recess 212d may be the same as or different from the first recess 211d described above.

[0045] In plan view, the second opening 212 may have a plurality of second recesses 212d spaced apart at a seventh interval L7 in the x direction, and the seventh interval L7 may be equal to or less than half the wavelength λ of the signal transmitted through the signal line 53. With this configuration, it is possible to achieve the same effect as when the first recesses 211d are spaced apart at a fifth interval L5.

[0046] When second opening 212 has an oval shape including an arc-shaped portion and a linear portion in a plan view, at least one of second recesses 212d may be located between the arc-shaped portion and the linear portion. For example, when wiring substrate 101b is miniaturized, the same effect as when first opening 211 has a plurality of first recesses 211d can be achieved.

[0047] In addition to the above, the size and positional relationship of the second ground conductor line 52, the signal line 53, and the second opening 212 may be similar to that of the first ground conductor line 51, the signal line 53, and the first opening 211. This provides the same effects as those of the first ground conductor line 51, the signal line 53, and the first opening 211. The first interval L1 described above can be read as the third interval L3, and the second interval L2 as the fourth interval L4.

[0048] <Method of manufacturing wiring board> Here, a method for manufacturing the wiring substrate 101a according to the first embodiment of the present disclosure will be described. Note that the method for manufacturing the wiring substrate 101a according to the embodiment of the present disclosure is not limited to the following embodiment, and may be manufactured using, for example, a 3D printer.

[0049] (1) First, multiple green sheets are formed. Specifically, a ceramic powder such as boron nitride, aluminum nitride, silicon nitride, silicon carbide, or beryllium oxide is mixed with an organic binder, a plasticizer, or a solvent to obtain a mixture, and the mixture is then layered to produce multiple green sheets. Next, the multiple green sheets are processed using a mold or other tool to prepare multiple green sheets each having the outer shape of the first insulating layer 1 and the second insulating layer 2 in a planar view. Furthermore, when forming a wiring board 101a having a third insulating layer 3, a green sheet having the outer shape of the third insulating layer 3 is also prepared. Next, a first opening 211 is formed in the green sheet that will become the second insulating layer 2 using a mold or laser. When forming a wiring board 101a having a first recess 211d, the first recess 211d is formed in the green sheet that will become the second insulating layer 2, similar to the first opening 211. When the second insulating layer 2 has the second opening 212 as in the second embodiment, the second opening 212 can be formed in the same manner as the first opening 211.

[0050] (2) A high-melting-point metal powder such as tungsten or molybdenum is prepared, and an organic binder, plasticizer, or solvent is added to and mixed with this powder to prepare a metal paste. The metal paste is then printed in a predetermined pattern on multiple green sheets formed to the contours of the first insulating layer 1, the second insulating layer 2, and the third insulating layer 3, respectively, to form the signal line 53, the first ground conductor line 51, and the second ground conductor line 52. The metal paste may contain glass or ceramics to enhance the bonding strength with each insulating layer. The first ground conductor film 511 can be formed by printing the metal paste in the first recess 211d created in the previous step.

[0051] (3) Next, a method for producing the ground conductor layer 6 will be described. If the ground conductor layer 6 is a metallized layer made of a high-melting-point metal such as tungsten, molybdenum, or manganese, it can be formed as follows. That is, first, a metal paste is prepared by kneading a powder of the high-melting-point metal with an organic solvent and a binder until the mixture is thoroughly mixed. The metal paste is then printed by screen printing or another method on a predetermined portion of the ceramic green sheet that will become the second lower surface 22 of the second insulating layer 2 or the first upper surface 11 of the first insulating layer 1.

[0052] (4) A green sheet laminate is formed by stacking the green sheets formed to the respective contours of the first insulating layer 1 and the second insulating layer 2 so that their outer edges coincide with the outer edge of the ground conductor layer 6. After forming the green sheet laminate, a metal paste may be printed in a predetermined pattern to form the first ground conductor line 51, the second ground conductor line 52, the signal line 53, and other wiring.

[0053] (5) The green sheet laminate is fired to sinter the plurality of green sheets, thereby obtaining wiring substrate 101a.

[0054] <Configuration of electronic component mounting package> 1, in this embodiment, electronic component mounting package 100 includes wiring substrate 101a, substrate 102, and frame 103. Frame 103 is bonded to the upper surface of substrate 102, and wiring substrate 101a is fixed to frame 103. Alternatively, wiring substrate 101a may be bonded to the upper surface of substrate 102.

[0055] The substrate 102 has an upper surface. For example, the substrate 102 has a rectangular shape in plan view, with dimensions of 10 mm × 10 mm to 50 mm × 50 mm and a thickness of 0.5 mm to 20 mm. Examples of materials for the substrate 102 include metal materials such as copper, iron, tungsten, molybdenum, nickel, and cobalt, as well as alloys containing these metal materials. In this case, the substrate 102 may be a single metal plate or a laminate of multiple metal plates. Furthermore, when the substrate 102 is made of any of the above metal materials, a plating layer of nickel, gold, or the like may be formed on the surface of the substrate 102 by electroplating or electroless plating to reduce oxidation corrosion. Furthermore, the substrate 102 may be made of an insulating material, such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, a silicon nitride sintered body, or a ceramic material such as glass ceramics.

[0056] The frame 103 is located on the upper surface of the substrate 102 and protects the electronic components 104 located therein in a planar view. That is, the frame 103 is located so as to surround the electronic components 104 in a planar view. As shown in FIG. 1 , in this embodiment, the frame 103 is not located on one side of the outer edge of the upper surface of the substrate 102. That is, the outer edge of the upper surface of the substrate 102 is surrounded by the frame 103 and the wiring substrate 101a. That is, the frame 103 and the wiring substrate 101a are located so as to surround the electronic components 104. In this manner, the frame 103 does not have to surround the entire outer edge of the upper surface of the substrate 102. Furthermore, in this embodiment, the frame 103 is located along the outer edge of the upper surface of the substrate 102, but the frame 103 may be located inside the outer edge of the upper surface of the substrate 102.

[0057] The material of the frame 103 may be, for example, a metal material such as copper, iron, tungsten, molybdenum, nickel, or cobalt, or an alloy containing these metal materials. The material of the frame 103 may also be an insulating material, such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, a silicon nitride sintered body, or a ceramic material such as glass ceramics.

[0058] The frame 103 can be joined to the substrate 102 via a brazing material or the like. The brazing material may be, for example, silver, copper, gold, aluminum, or magnesium, and may contain additives such as nickel, cadmium, or phosphorus.

[0059] <Electronic module configuration> 1, the electronic module 10 includes an electronic component mounting package 100, an electronic component 104, and a lid 106. The electronic module 10 may also include a seal ring 105.

[0060] The electronic component 104 may be a component that processes signals, such as converting an optical signal to an electrical signal or an electrical signal to an optical signal. The electronic component 104 is located on the upper surface of the substrate 102 and is housed in the electronic component mounting package 100. Examples of the electronic component 104 include optical semiconductor elements such as semiconductor lasers (LDs) or photodiodes (PDs), semiconductor integrated circuit elements, and sensor elements such as optical sensors. The electronic component 104 can be formed from a semiconductor material such as gallium arsenide or gallium nitride.

[0061] Lid 106 is positioned on frame 103 to cover the interior of electronic component mounting package 100 and, together with frame 103, protects electronic component 104. Lid 106 is, for example, rectangular in plan view, measuring 10 mm × 10 mm to 50 mm × 50 mm and 0.5 mm to 2 mm in thickness. Examples of materials for lid 106 include metal materials such as iron, copper, nickel, chromium, cobalt, molybdenum, and tungsten, as well as alloys made up of a combination of these metal materials. The metal member that constitutes lid 106 can be produced by subjecting an ingot of such a metal material to metalworking methods such as rolling and punching.

[0062] The seal ring 105 functions to join the lid 106 and the frame 103. The seal ring 105 is located on the frame 103 and surrounds the electronic component 104 in a plan view. Examples of materials for the seal ring 105 include metal materials such as iron, copper, silver, nickel, chromium, cobalt, molybdenum, and tungsten, as well as alloys made by combining a plurality of these metal materials. Note that if the seal ring 105 is not provided on the frame 103, the lid 106 may be joined via a joining material such as solder, brazing material, glass, or a resin adhesive.

[0063] The present disclosure is not limited to the above-described embodiments and examples, and various modifications are possible within the scope of the gist of the present disclosure. Furthermore, the various combinations of the characteristic features in this embodiment are not limited to the examples of the above-described embodiment, and combinations of the characteristic features with each other are also possible. [Industrial Applicability]

[0064] The present disclosure can be used as a wiring board, an electronic component mounting package using the wiring board, and an electronic module. [Explanation of symbols]

[0065] 1 First insulating layer 11 1st top surface 12 1st bottom surface 2 Second insulating layer 21 2nd top surface 211 First Opening 211a 1st straight section 211b First arc-shaped portion 211c Second arc-shaped part 211d First recess W211 Width of first opening 212 Second Opening 212d Second recess W212 Width of second opening 22 2nd bottom surface 23 Notch 3 Third insulating layer 51 First ground conductor line 511 First ground conductor film W51 Width of first ground conductor line 52 Second ground conductor line 521 Second ground conductor film W52 Width of second ground conductor line 53 Signal Line W53 Signal line width 6 Ground conductor layer 8 External Board 81 Insulating substrate 82 Signal Transmission Line 83 Third ground conductor line 84 Connecting conductor L1 1st interval L2 Second interval L3 Third interval L4 4th interval L5 Fifth interval L211 6th interval L7 7th interval F. Joint material 10 Electronic Module 100 Electronic component mounting package 101a~b Wiring board 102 Circuit Board 103 Frame 104 Electronic Components 105 Seal ring 106 Lid

Claims

1. a first insulating layer having a first upper surface and a first lower surface; a second insulating layer located on the first insulating layer and having a second upper surface, a second lower surface, and one or more first openings having openings in the second upper surface; a signal line located on the second top surface; a first ground conductor line on the second top surface, the first ground conductor line being spaced a first distance from the signal line and extending along the signal line; a wiring board, wherein, in a plan view, at least one of the first openings is located between the signal line and the first ground conductor line and away from an end of the second insulating layer, and is in contact with the first ground conductor line.

2. The wiring board according to claim 1 , wherein the first opening is positioned with a second gap between it and the signal line.

3. a second ground conductor line on the second top surface, the second ground conductor line being spaced a third distance from the signal line and extending along the signal line; 2. The wiring board according to claim 1, wherein the second ground conductor line is located on the opposite side of the signal line from the first ground conductor line.

4. the second insulating layer further has one or more second openings having openings in the second top surface; 4. The wiring board according to claim 3, wherein, in a plan view, at least one of the second openings is located between the signal line and the second ground conductor line and is in contact with the second ground conductor line.

5. The wiring board according to claim 4 , wherein the second opening is positioned at a fourth interval from the signal line.

6. the first opening has a first recess located on an inner circumferential surface of the first opening and in contact with the first ground conductor line; the first recess is located away from an end of the second insulating layer; 2. The wiring board according to claim 1, further comprising a first ground conductor film located on an inner peripheral surface of the first recess and continuous with the first ground conductor line.

7. The first opening has a first recess located on an inner peripheral surface of the first opening and in contact with the first ground conductor line; a first ground conductor film located on an inner peripheral surface of the first recess and continuous with the first ground conductor line; In a plan view, the first opening has a plurality of the first recesses positioned at intervals, 2. The wiring board according to claim 1, wherein the interval is equal to or less than half the wavelength λ of a signal transmitted through the signal line.

8. The first opening has a first recess located on an inner peripheral surface of the first opening and in contact with the first ground conductor line; a first ground conductor film located on an inner peripheral surface of the first recess and continuous with the first ground conductor line; In a plan view, the first opening has an elliptical portion including an arc-shaped portion and a linear portion, The wiring board according to claim 1 , wherein the first recess is located between the arc-shaped portion and the linear portion in a plan view.

9. The wiring board according to claim 2 , wherein the second interval is equal to or less than a length of the first opening in a direction perpendicular to the direction in which the signal line extends.

10. The wiring board according to claim 1 , wherein the first interval is equal to or greater than the length of the signal line in a direction perpendicular to the direction in which the signal line extends.

11. The wiring board according to claim 1 , wherein the length of the signal line in a direction perpendicular to the direction in which the signal line extends is equal to or less than the length of the first opening.

12. 2. The wiring board according to claim 1, wherein a length of the first opening in a direction perpendicular to an extension direction of the signal line is greater than a length of the signal line and is smaller than a length of the first ground conductor line.

13. a ground conductor layer between the first insulating layer and the second insulating layer; The wiring board according to claim 4 , wherein the ground conductor layer is exposed at a lower surface of the first opening and / or a lower surface of the second opening.

14. A substrate; a frame body joined to an upper surface of the substrate; An electronic component mounting package comprising: the wiring board according to any one of claims 1 to 13 fixed to the frame.

15. A substrate; a frame body joined to an upper surface of the substrate; and the wiring board according to any one of claims 6 to 8 fixed to the frame body, an external substrate connected to the signal line and the first ground conductor line and having a third ground conductor line; In a plan view, the third ground conductor line is positioned so as to overlap at least a portion of the first recess.

16. The electronic component mounting package according to claim 14; an electronic component located on the upper surface of the substrate and electrically connected to the wiring substrate of the electronic component mounting package; and a lid positioned on the frame and covering the inside of the electronic component mounting package.

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