laser device

Abstract

A laser device comprising: a package (100) having a base (110) and a lens (130); and a laser oscillator (150) housed in the package (100). The base (110) has a first recessed portion (112) and a mounting surface (125) of a surface-mounting type. The laser oscillator (150) is housed in the first recessed portion (112). The lens (130) is joined to the base (110) and seals the first recessed portion (112). Laser light emitted from the laser oscillator (150) is further emitted to the outside of the package (100) through the lens (130).

Description

[Technical Field]

[0001] The present disclosure relates to a laser device. Place Regarding. [Background technology]

[0002] Japanese Patent Application Laid-Open No. 2022-021419 discloses a laser device in which a laser oscillator is housed in a package, and a collimator lens that converts laser light emitted from the laser device into parallel light. Summary of the Invention [Means for solving the problem]

[0003] In accordance with the present disclosure In one aspect The laser device a package having a substrate and a lens; a laser oscillator housed in the package; Equipped with The base has a first recess and First step and second recess and a surface mount type mounting surface, the laser oscillator is accommodated in the first recess, the lens is bonded to the substrate and seals the first recess; The laser beam emitted from the laser oscillator is irradiated to the outside of the package through the lens. 、 A part of the lens is located in the first step portion, the first step portion has a first side surface facing the lens in a first direction non-parallel to the optical axis direction of the lens, the first side surface has a gap between it and the lens, the second recess is connected to the gap, The second recess and the lens are adjacent to each other in a plan view. .

[0004] In accordance with the present disclosure Another aspect of the laser device is a package having a substrate and a lens; a laser oscillator housed in the package; Equipped with the base has a first recess and a surface-mount mounting surface; the laser oscillator is accommodated in the first recess, the lens is bonded to the substrate and seals the first recess; The laser beam emitted from the laser oscillator is irradiated to the outside of the package through the lens, The substrate is a first substrate having a through hole; a second base body made of metal and closing one opening of the through hole, the through hole having one opening closed in the second base constitutes the first recess, The laser oscillator is mounted on the second base. . [Brief explanation of the drawings]

[0005] [Figure 1] 1 is a perspective view showing a laser device and an optical component mounting package according to a first embodiment of the present disclosure. [Figure 2] FIG. 2 is an exploded perspective view showing the optical component mounting package of FIG. [Figure 3] FIG. 2 is a plan view showing the laser device of FIG. [Figure 4A] FIG. 2 is a cross-sectional view taken along line AA in FIG. [Figure 4B] FIG. 2 is a cross-sectional view taken along line BB in FIG. [Figure 4C] 1. FIG. 4 is a modified example of the cross-sectional view taken along line BB in FIG. [Figure 5] FIG. 4B is an enlarged view showing a detail of a portion C1 of FIG. 4A. [Figure 6A] FIG. 10 is a vertical cross-sectional view showing a laser device and an optical component mounting package according to a second embodiment. [Figure 6B] FIG. 6B is a first example of an enlarged view showing a portion C2 of FIG. 6A in detail. [Figure 6C] FIG. 6B is a second example of an enlarged view showing the portion C2 of FIG. 6A in detail. [Figure 7] FIG. 10 is a longitudinal sectional view showing a laser device and an optical component mounting package according to a third embodiment. [Figure 8] FIG. 10 is a perspective view showing a laser device and an optical component mounting package according to a fourth embodiment. [Figure 9] FIG. 9 is a cross-sectional view taken along line DD in FIG. 8. [Figure 10A] FIG. 10 is a perspective view showing a laser device and an optical component mounting package according to a fifth embodiment. [Figure 10B]FIG. 13 is a perspective view showing a laser device and an optical component mounting package according to a sixth embodiment. [Figure 11A] FIG. 13 is a perspective view showing a laser device and an optical component mounting package according to a seventh embodiment. [Figure 11B] FIG. 13 is a perspective view showing a laser device and an optical component mounting package according to an eighth embodiment. [Figure 12A] FIG. 13 is a longitudinal sectional view showing a laser device and an optical component mounting package according to a ninth embodiment. [Figure 12B] FIG. 12B is an enlarged view showing a detail of a portion C3 of FIG. 12A. [Figure 13A] FIG. 20 is a longitudinal cross-sectional view showing a laser device and an optical component mounting package according to a tenth embodiment. [Figure 13B] FIG. 13B is an enlarged view showing a detail of a portion C4 of FIG. 13A. DETAILED DESCRIPTION OF THE INVENTION

[0006] Hereinafter, each embodiment of the present disclosure will be described in detail with reference to the drawings.

[0007] (Embodiment 1) FIG. 1 is a perspective view showing a laser device and an optical component mounting package according to a first embodiment of the present disclosure. FIG. 2 is an exploded perspective view showing the optical component mounting package of FIG. 1. FIG. 3 is a plan view showing the laser device of FIG. 1. FIG. 4A is a cross-sectional view taken along line AA in FIG. 1. FIG. 4B is a cross-sectional view taken along line BB in FIG. 1. FIG. 4C is a modified example of the cross-sectional view taken along line BB in FIG. 1. FIG. 5 is an enlarged view showing a portion C1 of FIG. 4A in detail.

[0008] The laser device 1 according to the first embodiment of the present disclosure includes a package (corresponding to a package for mounting an optical component) 100 having a base 110 and a lens 130, and a laser oscillator (corresponding to an optical component) 150 housed in the package 100. The base 110 may have a first recess 112 and a surface-mount type mounting surface 125 (see FIG. 4A).

[0009] The base 110 may be block-shaped, having an upper surface 110a, a side surface 110b, and a lower surface 110c (see FIG. 1). The minimum width of the base 110 in the horizontal direction may be greater than its height. The minimum width refers to the smallest distance between two parallel vertical surfaces when the base 110 is sandwiched between the two surfaces.

[0010] The surface-mount type mounting surface 125 (see FIG. 4A) refers to a mounting surface that can be mounted in a portion of a module substrate (not shown) on which the laser device 1 is mounted, which does not have a through-hole. The surface-mount type mounting surface 125 may be configured without rod-shaped leads (specifically, rod-shaped conductors extending perpendicular to the mounting surface 125). The surface-mount type mounting surface 125 may have a mounting surface that faces the electrode pads of the module substrate. The mounting surface may be a surface that can be bonded to the electrode pads with solder or conductive paste. In the examples of FIGS. 1 to 5, the mounting surface 125 is a flat metal surface, but the mounting surface 125 may include small irregularities or electrode pads.

[0011] The mounting surface 125 of the surface mount type may be located on the opposite side of the base 110 from the first recess 112. In other words, when the surface where the first recess 112 opens is considered the upper surface, the mounting surface 125 may be located at the bottom of the base 110. With this configuration, when the laser device 1 is mounted on a module substrate (not shown), it is possible to irradiate laser light in a direction intersecting with the substrate surface of the module substrate. Note that the arrangement of the mounting surface 125 is not limited to the above example, and when the surface where the first recess 112 opens is considered the upper surface, the mounting surface 125 may be located at another position, such as the side or top of the base 110.

[0012] The laser oscillator 150 may be housed in the first recess 112. The lens 130 may be bonded to the base 110 and seal the first recess 112. Before the laser oscillator 150 is mounted, the base 110 and the lens 130 may be separated, and the lens 130 may be bonded to the base 110 to seal the first recess 112.

[0013] The opening of the first recess 112 may be rectangular in plan view, or may be square as shown in Fig. 3. Plan view means viewing from the opening side of the first recess 112. The opening of the first recess 112 may have various shapes in plan view, such as a polygonal shape, an elliptical shape, an oval shape, a circular shape, or a shape that is a combination of these.

[0014] The lens 130 may have the effect of reducing the spread of the laser light emitted from the laser oscillator 150. The lens 130 may be a collimator lens. The laser light emitted from the laser oscillator 150 may be irradiated to the outside of the package 100 via the lens 130.

[0015] The lens 130 exerts the above-described effect on the laser light, and may seal the first recess 112 by being bonded to the base 110. Sealing the first recess 112 reduces deterioration over time of the laser oscillator 150 and enables stable operation of the laser oscillator 150. Furthermore, because the lens 130 seals the first recess 112, the number of parts can be reduced compared to a configuration including a lens and a transparent sealing member.

[0016] As shown in FIG. 3 , in a plan view, the area of ​​the first region 11, which is the area occupied by the upper portion of the base 110 excluding the area where the lens 130 overlaps, may be larger than the area of ​​the lens 130. In FIG. 3 , the first region 11 is shaded. This configuration achieves the following effects. Specifically, when bonding the lens 130, the base 110 is fixed by a jig, and the lens 130 is held by a holder. Because the base 110 has a surface-mount mounting surface 125, a jig structure that fixes the base 110 from the side is easily applicable. Therefore, if the jig and the holder are close to each other, they will interfere with each other. However, by configuring the first region 11 to have a large area as described above, the holder that holds the lens 130 and the jig that fixes the base 110 can be separated horizontally (i.e., in a direction along the plane when viewed from above). This reduces the risk of interference between the jig and the holder. This allows for stable bonding of the lens 130. Furthermore, the large area of ​​the first region 11 allows components other than the lens, such as electrodes 121a to 121d (see FIG. 1), to be added to the first region 11 of the base 110.

[0017] 3, in a plan view, the first region 11 may surround the entire outer periphery of the lens 130. With this configuration, interference between the jig and the holder can be reduced when bonding the lens 130, and a more stable bonding process for the lens 130 can be achieved.

[0018] The lens 130 may have a side that can be grasped horizontally.

[0019] The lens 130 may have a main portion 132 including a curved surface through which the laser light passes, and a base portion 134 connected to the main portion 132. The main portion 132 and the base portion 134 may have the same composition and be integrally configured. The base portion 134 may have a curved surface or may be plate-shaped. In a planar view, the lens 130 may be located at the center of the first region 11, while the main portion 132 may be located offset from the center of the lens 130. Positioning the lens 130 at the center enables a more stable bonding process of the lens 130. The emission position of the laser light (i.e., the emission position from inside to outside the package 100) may be offset from the center of the base 110 in a planar view depending on the arrangement of the components in the first recess 112. However, by positioning the main portion 132 offset from the center of the lens 130, the main portion 132 of the lens 130 can be positioned to correspond to the offset of the emission position of the laser light.

[0020] The base 134 of the lens 130 may be rectangular in plan view, or square as shown in Figure 3. The base 134 may have various shapes in plan view, such as polygonal, elliptical, oval, circular, or a combination of these.

[0021] Furthermore, the lens 130 may be located at the center of the first region 11 in plan view, while the optical axis of the laser beam on the laser oscillator 150, the mirror 170, or the aperture may be located offset from the center of the first region 11 in plan view. Even if the optical axis of the laser beam on the laser oscillator 150, the mirror 170, or the aperture is located offset, the lens 130 can be bonded stably by being located at the center.

[0022] Here, A being located in the center of B may mean that the center of A and the center of B overlap. The center may mean the center of the plane figure when the object is viewed in a plane plus a margin of error. The above error may be 5% of the minimum width of the plane figure when the object is viewed in a plane. The minimum width may mean the smallest width when the plane figure is sandwiched between two parallel line segments.

[0023] The laser oscillator 150 may be a semiconductor laser. The optical axis of the laser oscillator 150 may be oriented horizontally (that is, along a plane when viewed from above).

[0024] A mirror (corresponding to an optical component) 170 that reflects the laser light emitted by the laser oscillator 150 in the vertical direction (i.e., the direction along the line of sight when viewed from above) may be mounted in the first recess 112 (see FIG. 4B). The mirror 170 may be a prism mirror. The laser light emitted from inside to outside the package 100 may be laser light reflected by the mirror 170.

[0025] The portion where the laser oscillator 150 is mounted may be called a first mounting portion 118a (see FIG. 4B), and the portion where the mirror 170 is mounted may be called a second mounting portion 118b (see FIG. 4B).

[0026] Between the first mounting portion 118a and the second mounting portion 118b, there may be a step 113 (see FIG. 4B) where the first mounting portion 118a is higher than the second mounting portion 118b. With this configuration, when the laser oscillator 150 is mounted on the first mounting portion 118a directly or via a bonding material, the laser light emitted from the laser oscillator 150 can be irradiated away from the lower end of the mirror 170. This reduces wasted laser light. Furthermore, compared to a configuration in which the laser oscillator 150 is mounted via a base such as a submount, heat dissipation from the laser oscillator 150 to the base 110 can be improved.

[0027] Second mounting portion 118b may include an inclined surface that is inclined relative to first mounting portion 118a, and mirror 170 may be mounted on this inclined surface. This configuration makes it easy to position mirror 170 when mounting mirror 170. Note that, as shown in Fig. 4C, second mounting portion 118b may include a horizontal surface, and mirror 171 having an inclined reflecting surface, such as a prism mirror, may be mounted on this horizontal surface.

[0028] The base 110 may have electrodes 115a-115e (see FIG. 3) in addition to the first mounting portion 118a and the second mounting portion 118b in the first recess 112. Any of the electrodes 115a-115e may be electrically connected to the laser oscillator 150 via a connecting member such as a bonding wire and may supply a driving current to the laser oscillator 150. Any of the electrodes 115a-115e may be equipped with a noise removal element (e.g., a Zener diode). Any of the electrodes 115a-115e may be equipped with an element (e.g., a photodiode (PD)) for monitoring the output power of the laser light. Any of the electrodes 115a-115e may be electrically connected to the above element and transmit a signal. Any of the electrodes 115a-115e in the first recess 112 may be electrically connected to the outer electrodes 121a-121d (see FIG. 1) via an internal conductor of the base 110.

[0029] The base 110 may have second step portions 114a, 114b (see FIGS. 3 and 4A) located in the first recess 112. The electrodes 115a-115e may be located on the second step portions 114a, 114b. With this configuration, when electrically connecting any of the electrodes 115a-115b to the laser oscillator 150, the heights of the electrodes to be connected can be made closer to each other, facilitating the connection.

[0030] In a plan view, the second step portions 114a and 114b may be located on either side of the laser oscillator 150 and the mirror 170. The second step portions 114a and 114b may be included in a first base 110A (see FIG. 4A) described later.

[0031] The base 110 may have a first step 123 (see FIG. 1) where a part of the lens 130 is located. The first step 123 has a side surface 123a facing the lens 130 in directions A2 and A3 (corresponding to the first direction, see FIG. 1) that are non-parallel to the optical axis A1 of the lens 130, and a gap 201 (see FIGS. 3 and 5) may be present between the lens 130 and the side surface 123a. The gap 201 may be large enough to allow adjustment of the position of the lens 130 in the horizontal direction when the lens 130 is bonded. With this configuration, when the lens 130 is bonded, the first step 123 allows rough alignment of the lens 130, and the gap 201 allows alignment of the optical axis A1 of the lens 130.

[0032] Gap 201 refers to the space located between side surface 123a of first step portion 123 and lens 130, and does not need to be occupied by air, and gap 201 may be filled with a bonding material.

[0033] In a plan view, the first step 123 may be annular and positioned along the outer periphery of the lens 130. This configuration can improve the sealing performance of the first recess 112 by the lens 130. Furthermore, the alignment and bonding processes of the lens 130 can be performed stably.

[0034] The base 110 may have second recesses 124a to 124d (see FIG. 1) that communicate with the gap 201. The second recesses 124a to 124d may be adjacent to the lens 130. The second recesses 124a to 124d may be configured to open upward from the base 110. In the example of FIG. 1, the number of second recesses 124a to 124d is four, but the number may be one or more. If there are two second recesses, the two second recesses 124a and 124c may be positioned opposite each other with the first recess 112 interposed therebetween. With this configuration, when bonding the lens 130, the holder for the lens 130 can be inserted into the second recesses 124a to 124d. Therefore, the lens 130 can be held from the side. When there is one second recess, the lens 130 may be held by suction. When there are two or more second recesses, the lens 130 can be held by suction or gripping. The presence of the second recesses 124a to 124d makes it possible to stably align the optical axis of the lens 130 when the lens 130 is cemented.

[0035] 5, the lens 130 and the base 110 may be bonded together via a bonding material 221. The lens 130 may be made of glass, and the bonding material 221 may be solder.

[0036] The lens 130 may have a metal film 136 at the portion where it is bonded to the base 110. The metal film 136 may be continuous in a ring shape around the entire periphery of the bonded portion, as shown in Fig. 3. The metal film 136 may be a thin film formed by a film forming apparatus.

[0037] The base 110 may have a metal film 116 at the portion where it is bonded to the lens 130. The metal film 116 may be continuous in a ring shape around the entire periphery of the bonded portion, as shown in Fig. 3. The metal film 116 may be metallized or a film in which metallization is plated.

[0038] The above-described configuration of the metal films 116, 136 and the bonding material 221 allows the lens 130 to achieve high sealing performance of the first recess 112.

[0039] Although not shown, the metal films 116, 136 may be positioned over the side surfaces of the first step portion 123 and the side surfaces of the lens 130, and the bonding material 221, which is solder, may be positioned over the gap 201. Furthermore, the bonding material 221 that bonds the lens 130 and the base 110 may be a resin (for example, a curable adhesive), and the lens 130 may be made of resin.

[0040] As shown in FIG. 2, the base 110 may include a first base 110A having a through-hole 119 and a second base 110B made of metal and blocking one opening of the through-hole 119. The through-hole 119, one opening of which is blocked in the second base 110B, may form a first recess 112. The laser oscillator 150 may be mounted on the second base 110B. The mirror 170 may be mounted on the second base 110B. The second base 110B may be made of copper. This configuration improves the heat dissipation of the laser oscillator 150. That is, when the laser oscillator 150 generates heat, the heat can be efficiently dissipated to a module substrate (not shown) via the second base 110B, which has high thermal conductivity, and a surface-mount mounting surface 125 (see FIG. 4A ) located opposite the laser oscillator 150.

[0041] 2, the second base 110B may have a convex portion 118 protruding into the first concave portion 112. The upper surface of the convex portion 118 may include a first mounting portion 118a on which the laser oscillator 150 is mounted and a second mounting portion 118b on which the mirror 170 is mounted. With this configuration, not only is high heat dissipation from the laser oscillator 150 achieved, but the optical path length from the laser oscillator 150 to the lens 130 is shortened. Therefore, the spread of the laser light when it reaches the lens 130 can be reduced.

[0042] The first substrate 110A is mainly made of an insulating material and may have one or both of a conductive film and an interlayer via (i.e., a conductor) on its surface or inside. The first substrate 110A may have a layered structure in which multiple insulating layers are stacked. The insulating material may be ceramic, glass, or resin. The conductive film and interlayer via may be a metallized conductor.

[0043] A conductive film 117 (see FIG. 4A) may be located on the bottom surface of the first base 110A (i.e., the surface facing the second base 110B). The conductive film 117 and the second base 110B may be bonded to each other via a bonding material 211 such as a brazing material.

[0044] (Embodiment 2) Fig. 6A is a longitudinal cross-sectional view showing a laser device and an optical component mounting package of embodiment 2. Fig. 6B is a first example of an enlarged view showing a detail of portion C2 of Fig. 6A. Fig. 6C is a second example of an enlarged view showing a detail of portion C2 of Fig. 6A. The laser device 1A and package (corresponding to an optical component mounting package) 100A of embodiment 2 differ in the configuration of the joint between the lens 130 and the base 110, but the other components may be the same as those of embodiment 1 or embodiments 3 to 8 described below.

[0045] The bonding material 221A bonding the lens 130 and the base 110 may be low-melting-point glass, as shown in FIGS. 6A to 6C. The laser device 1A of FIG. 6A may employ the following manufacturing process. First, the first base 110A and the second base 110B are bonded by brazing or the like. This process is referred to as the first bonding process. Next, the laser oscillator 150 and the mirror 170 are bonded to the first mounting portion 118a and the second mounting portion 118b by solder or the like. This process is referred to as the second bonding process. When elements such as a PD or a Zener diode are mounted, they are bonded in the second bonding process. After that, wiring is connected to the laser oscillator 150 and the like using a wire bonder or the like. Next, the lens 130 is bonded to the base 110. This process is referred to as the third bonding process. In such a manufacturing process, the bonding temperatures in each bonding step may be set in the following order: "bonding temperature in the first bonding step > bonding temperature in the second bonding step > bonding temperature in the third bonding step." By using low-melting-point glass as the bonding material 221A, the above-described setting of the bonding temperature can be easily achieved.

[0046] The lens 130 is made of glass, and the portion bonded to the base 110 may be the surface where the material of the lens 130 is exposed.

[0047] The base 110 may include an insulating material such as ceramic, and the portion bonded to the lens 130 may be the surface where the insulating material is exposed.

[0048] As shown in FIGS. 6B and 6C, the bonding material 221A may be positioned across two surfaces of the first step portion 123 (i.e., the lower surface 123e and the side surface 123a). Furthermore, the bonding material 221A may be positioned across the lower surface and the side surface of the edge of the lens 130. Furthermore, the bonding material 221A may be positioned between the base 110 and the lens 130. This configuration lengthens the path (also referred to as the "leak path") that breaks the seal of the first recess 112, thereby reducing the occurrence of seal leaks. As shown in FIG. 6B, the bonding material 221A may be in contact with the entire two surfaces, the lower surface 123e and the side surface 123a, of the first step portion 123 in at least one longitudinal cross section. Furthermore, the bonding material 221A may be in contact with the entire two surfaces, not only in one longitudinal cross section but also in any longitudinal cross section of the first step portion 123. This configuration further reduces the occurrence of seal leaks.

[0049] 6B and 6C, the bonding material 221A may have a concave meniscus (i.e., a curved surface) 222 between the base 110 and the lens 130. This configuration can improve the stress resistance of the bonding material 221A.

[0050] (Embodiment 3) 7 is a vertical cross-sectional view showing a laser device and an optical component mounting package according to embodiment 3. A laser device 1B and a package (corresponding to an optical component mounting package) 100B according to embodiment 3 differ in the configuration on the mounting surface 125 side, and other components may be the same as those of embodiments 1 and 2 or embodiments 4 to 11 described later.

[0051] Through hole 119 of first base 110A may have a shape as shown in Fig. 7 in a longitudinal section extending from one end of through hole 119 to the other. In this shape, of widths W1 to W3 of through hole 119, width W2 in the middle is smaller. Here, width W1 is the width of a portion close to one opening, width W3 is the width of a portion close to the other opening, and width W2 is the width of a portion located between the two portions.

[0052] The first base 110A has a first bottom surface 111A, and the second base 110B has a second bottom surface 111B, and the first bottom surface 111A and the second bottom surface 111B may be adjacent to each other. In the above-mentioned longitudinal cross section, the first base 110A may have two first bottom surfaces 111A, and the two first bottom surfaces 111A may be located on either side of the second bottom surface 111B. When viewed from below, the first bottom surface 111A may be a single continuous bottom surface and may surround the second bottom surface 111B.

[0053] The configuration of widths W1 to W3 and the configuration of first bottom surface 111A and second bottom surface 111B may be configured to appear not only in the above-mentioned one vertical cross section, but also in any vertical cross section from one end of through hole 119 to the other end.

[0054] According to this configuration, a portion of the first base 110A can be included in the mounting surface 125 of the surface mount type. The first base 110A includes a wiring conductor (i.e., a conductor film and an interlayer via), and the first bottom surface 111A may include an electrode 125a. The electrode 125a may be connected to the wiring conductor. This configuration enables the exchange of signals or power via the surface-mounted portion.

[0055] The second bottom surface 111B may be lower than the first bottom surface 111A. If the first bottom surface 111A includes the electrode 125a, the second bottom surface 111B may be lower than the bottom surface of the electrode 125a. With this configuration, when the first bottom surface 111A and the second bottom surface 111B are mounted on a module substrate (not shown), the second bottom surface 111B can be closer to the module substrate than the first bottom surface 111A. Therefore, when the first bottom surface 111A and the second bottom surface 111B are bonded to the module substrate, the thermal conductivity from the second base 110B to the module substrate is improved, and the heat dissipation of the laser oscillator 150 can be improved. That is, as a method of bonding to the module substrate, it is assumed that the first bottom surface 111A and the second bottom surface 111B are bonded to the module substrate (or electrode pads of the module substrate) via a bonding material such as solder or conductive paste. In this assumption, the difference in height between the second bottom surface 111B and the first bottom surface 111A allows the thickness of the bonding material on the second bottom surface 111B to be thin, thereby reducing the reduction in thermal conductivity caused by the bonding material. Therefore, the heat dissipation performance of the laser oscillator 150 by the second base 110B can be improved. Furthermore, the second bottom surface 111B may be higher than the first bottom surface 111A. In this case, for example, when a conductive adhesive containing a metal filler is used to bond an MCPCB (Metal Core Printed Circuit Board), mountability can be improved.

[0056] (Embodiment 4) Fig. 8 is a perspective view showing a laser device and an optical component mounting package of embodiment 4. Fig. 9 is a cross-sectional view taken along line DD in Fig. 8. A laser device 1C and a package (corresponding to an optical component mounting package) 100C of embodiment 4 differ in the configuration of an upper part of a base 110 and a part of a lens 130, and other components may be the same as those of embodiments 1 to 3 or embodiments 5 to 9 described later.

[0057] 8, the base 110 does not have to have the second recesses 124a to 124b (see FIG. 1) shown in Embodiment 1. With this configuration, the base 110 can be made thinner.

[0058] 9, the thickness T1 of at least the portion of the lens 130 located at the first step portion 123 may be greater than the height H1 of the first step portion 123. With this configuration, the lens 130 protrudes outward from the first step portion 123, and when the lens 130 is bonded, the protruding portion can be held by a holder.

[0059] (Embodiments 5 and 6) Fig. 10A is a perspective view showing a laser device and an optical component mounting package of embodiment 5. Fig. 10B is a perspective view showing a laser device and an optical component mounting package of embodiment 6. The laser devices 1D and 1E and packages (corresponding to optical component mounting packages) 100D and 100E of embodiments 5 and 6 differ in the configuration of the element in the first recess 112, and other components may be the same as those of embodiments 1 to 4 or embodiments 7 and 8 described below.

[0060] 10A, the laser oscillator 150 may be a two-system laser oscillator capable of emitting two laser beams. The optical axes of the two laser beams at the emission section of the laser oscillator 150 may be parallel and aligned horizontally.

[0061] The lens 130 may be a cylindrical lens, and the central axis of the cylindrical surface of the cylindrical lens may be positioned along the direction in which the optical axes of the two laser beams are aligned.

[0062] As shown in embodiment 6 in Fig. 10B, the PD 190 that monitors the power of the laser beam may be located on the opposite side of the mirror 170 across the laser oscillator 150. The PD 190 may be mounted on the second base 110B. The laser oscillator 150 may leak a portion of the laser beam on the side opposite to the laser beam emission side, and the above configuration makes it possible to more accurately monitor the power of the laser beam by detecting the leakage of the laser beam.

[0063] (Embodiments 7 and 8) Fig. 11A is a perspective view showing a laser device and an optical component mounting package of embodiment 7. Fig. 11B is a perspective view showing a laser device and an optical component mounting package of embodiment 8. The laser devices 1F, 1G and packages (corresponding to optical component mounting packages) 100F, 100G of embodiments 7 and 8 differ in the shape of the lens 130 and the shape of the joint between the base 110 and the lens 130, and other components may be the same as those of embodiments 1 to 6 or embodiments 9 and 10 described below.

[0064] As shown in embodiment 7 of Fig. 11A, lens 130 may be circular in plan view. Lens 130 may have a lens surface (specifically, a curved surface that acts to reduce the spread of laser light) positioned over the entire area in plan view. The lens surface may be spherical or aspherical.

[0065] 11B, the lens 130 may have a main portion 132 and a base portion 134, and the base portion 134 may be circular in plan view. The base portion 134 may be disk-shaped with side surfaces.

[0066] In the seventh and eighth embodiments, the first step portion 123 of the base 110 may have a circular shape corresponding to the planar shape of the lens 130 in a plan view.

[0067] In the seventh and eighth embodiments, the circular shape described above may be replaced with an elliptical or oblong shape.

[0068] (Embodiments 9 and 10) Fig. 12A is a longitudinal sectional view showing a laser device and an optical component mounting package of embodiment 9. Fig. 12B is an enlarged view showing a detail of portion C3 of Fig. 12A. Fig. 13A is a longitudinal sectional view showing a laser device and an optical component mounting package of embodiment 10. Fig. 13B is an enlarged view showing a detail of portion C4 of Fig. 13A. The laser devices 1H and 1I and packages (corresponding to optical component mounting packages) 100H and 100I of embodiments 9 and 10 differ in the configuration of the joint between the lens 130 and the base 110, but the other components may be the same as those of embodiments 1 to 8.

[0069] As shown in embodiment 9 of FIG. 12A and embodiment 10 of FIG. 13A, the base 110 may not have the first step 123 (see FIG. 1) shown in embodiment 1. The lens 130 may be bonded to the upper surface 110a of the base 110. The bonded portion between the lens 130 and the base 110 may be annular in plan view and may surround the opening of the first recess 112. By omitting the first step 123, the base 110 can be made thinner.

[0070] 12B, in the ninth embodiment, the bonding material 221 may be solder or a conductive paste. The lens 130 may have a metal film 136 at a portion where the lens 130 is bonded to the base 110. The base 110 may have a metal film 116 at a portion where the lens 130 is bonded to the base 110.

[0071] 13B, in the tenth embodiment, the bonding material 221A may be low-melting-point glass. The lens 130 may be glass, and the portion bonded to the base 110 may be the surface of the lens 130 where the material is exposed. The base 110 may include an insulating material such as ceramic, and the portion bonded to the lens 130 may be the surface where the insulating material is exposed. The bonding material 221A may be positioned across the lower surface and side surfaces of the edge of the lens 130.

[0072] In the above-described configurations of the ninth and tenth embodiments, the lens 130 can also achieve high sealing performance of the first recess 112.

[0073] In the tenth embodiment, the bonding material 221A may have a concave meniscus (i.e., a curved surface) 222 between the base 110 and the lens 130. This configuration can improve the stress resistance of the bonding material 221A.

[0074] The above describes the embodiments of the present disclosure. However, the laser device and the optical component mounting package of the present disclosure are not limited to the above embodiments. The structures shown in the embodiments can be modified as appropriate without departing from the spirit of the invention.

[0075] An embodiment of the present disclosure will be described below. The laser device (1) is a package having a substrate and a lens; a laser oscillator housed in the package; Equipped with the base has a first recess and a surface-mount mounting surface; the laser oscillator is accommodated in the first recess, the lens is bonded to the substrate and seals the first recess; The laser beam emitted from the laser oscillator is irradiated to the outside of the package through the lens.

[0076] (2) The laser device of (1) above is In a plan view, the area of ​​a first region, which is the region occupied by the upper part of the base body excluding the region overlapped by the lens, is larger than the area of ​​the lens.

[0077] (3) The laser device of (2) above is In a plan view, the first region surrounds the entire outer periphery of the lens.

[0078] (4) The laser device of (2) or (3) above, the lens has a main portion including a curved surface through which the laser light passes and a base portion connected to the main portion, the lens is located at the center of the first region in a plan view, In a plan view, the main portion is positioned offset from the center of the lens.

[0079] (5) Any of the laser devices (2) to (4) above, the lens is located at the center of the first region in a plan view, The laser oscillator is positioned offset from the center of the first region in a plan view.

[0080] (6) Any of the laser devices (1) to (5) above, the base further has a first step portion in which a portion of the lens is located; the first step portion has a first side surface facing the lens in a first direction non-parallel to the optical axis direction of the lens, There is a gap between the first side and the lens.

[0081] (7) The laser device of (6) above is In a plan view, the first step portion is annular and is located along the outer periphery of the lens.

[0082] (8) The laser device of (6) or (7) above, a bonding material that bonds the lens and the base, The bonding material is positioned across the gap from a portion of the lower surface of the lens.

[0083] (9) Any of the laser devices (6) to (8) above, the base has a second recess communicating with the gap, The second recess and the lens are adjacent to each other in a plan view.

[0084] (10) Any of the laser devices (1) to (9) above, a bonding material that bonds the lens and the base, The bonding material is a low-melting glass.

[0085] (11) Any of the laser devices (1) to (9) above, a bonding material that bonds the lens and the base, the bonding material is solder, The lens has a metal film at a portion where it is bonded to the base.

[0086] (12) Any of the laser devices (1) to (11) above, The substrate is a first substrate having a through hole; a second base body made of metal and closing one opening of the through hole, the through hole having one opening closed in the second base constitutes the first recess, The laser oscillator is mounted on the second base.

[0087] (13) The laser device of (12) above, The second substrate is a protrusion protruding into the first recess; a first mounting portion located on an upper surface of the convex portion and on which the laser oscillator is mounted; a second mounting portion on an upper surface of the convex portion, the second mounting portion having a mirror mounted thereon; It has.

[0088] (14) The laser device of (13) above, The second base has a step between the first mounting portion and the second mounting portion, where the first mounting portion is higher than the second mounting portion.

[0089] (15) The laser device according to (13) or (14) above, the second mounting portion includes an inclined surface inclined relative to the first mounting portion, The mirror is mounted on the inclined surface.

[0090] (16) Any of the laser devices (13) to (15) above, The first base has a second step portion located in the first recess and an electrode located on the second step portion.

[0091] (17) Any of the laser devices (12) to (16) above, the first substrate has a first bottom surface; the second substrate has a second bottom surface; the first bottom surface and the second bottom surface are adjacent to each other, The second bottom surface is lower than the first bottom surface.

[0092] (18) Any of the laser devices (1) to (17) above, The mounting surface is located on the opposite side to the first recess.

[0093] In one embodiment, (19) the optical component mounting package includes: A substrate and a lens are provided, the base includes a first recess and a surface-mount mounting surface, and has a mounting portion for an optical component within the first recess; The lens can seal the first recess by being bonded to the base. [Industrial Applicability]

[0094] The present disclosure relates to a laser device. Place Available. [Explanation of symbols]

[0095] 1, 1A-1I Laser device 11 First area 100 package (package for mounting optical components) 110 Base 110A 1st base 110B 2nd base 111A 1st bottom 111B 2nd bottom 112 First recess 113 Steps 114a, 114b 2nd stage section 115a~115e Electrode 116 Metal Film 117 Conductor Film 118 Convex 118a 1st loading section 118b 2nd loading section 119 Through Hole 121a~121d Electrode 123 First Stage 123a side 125 Mounting surface 130 Lens 132 Main Section 134 Base A1 Optical axis A2, A3 1st direction 150 Laser Oscillator 170 Mirror 190PD 201 Gap 211, 221, 221A Bonding material 222 Meniscus T1 Thickness H1 Height W1~W3 width

Claims

1. a package having a substrate and a lens; a laser oscillator housed in the package; Equipped with the base body has a first recess, a first step, a second recess, and a surface mount mounting surface; the laser oscillator is accommodated in the first recess; the lens is bonded to the substrate and seals the first recess; The laser beam emitted from the laser oscillator is irradiated to the outside of the package through the lens, A part of the lens is located in the first step portion, the first step portion has a first side surface facing the lens in a first direction non-parallel to the optical axis direction of the lens, the first side surface has a gap between it and the lens, the second recess is connected to the gap, The laser device, wherein the second recess and the lens are adjacent to each other in a plan view.

2. In a plan view, an area of ​​a first region, which is an area occupied by the upper part of the base body and which excludes an area where the lens overlaps, is larger than an area of ​​the lens.

2. The laser device according to claim 1.

3. The first region surrounds the entire outer periphery of the lens in a plan view.

3. The laser device according to claim 2.

4. the lens has a main portion including a curved surface through which the laser light passes and a base portion connected to the main portion, the lens is located at the center of the first region in a plan view, The main portion is positioned offset from the center of the lens in a plan view.

4. The laser device according to claim 3.

5. the lens is located at the center of the first region in a plan view, The laser oscillator is positioned offset from the center of the first region in a plan view.

4. The laser device according to claim 3.

6. In a plan view, the first step portion is annular and is located along the outer periphery of the lens.

2. The laser device according to claim 1.

7. a bonding material that bonds the lens and the base, The bonding material is positioned across the gap from a part of the lower surface of the lens.

2. The laser device according to claim 1.

8. a bonding material that bonds the lens and the base, The bonding material is a low-melting point glass.

2. The laser device according to claim 1.

9. a bonding material that bonds the lens and the base, the bonding material is solder, the lens has a metal film at a portion where it is bonded to the base; 2. The laser device according to claim 1.

10. A package having a substrate and a lens; a laser oscillator housed in the package; Equipped with the base has a first recess and a surface mount type mounting surface, the laser oscillator is accommodated in the first recess; the lens is bonded to the substrate and seals the first recess; The laser beam emitted from the laser oscillator is irradiated to the outside of the package through the lens, The substrate is a first substrate having a through hole; a second base body made of metal and closing one opening of the through hole, the through hole having one opening closed in the second base constitutes the first recess, The laser oscillator is mounted on the second substrate.

11. The lens has a main portion including a curved surface through which the laser light passes, and a base portion connected to the main portion, When the region occupied by the upper part of the base body in plan view, excluding the region where the lens overlaps, is called a first region, the lens is located at the center of the first region in a plan view, The main portion is positioned offset from the center of the lens in a plan view. The laser device according to claim 10.

12. A bonding material is provided to bond the lens and the base, the bonding material is positioned across a gap between a part of the lower surface of the lens and a side surface of the first step portion of the base body; The laser device according to claim 10.

13. The second substrate is a protrusion protruding into the first recess; a first mounting portion located on an upper surface of the convex portion and on which the laser oscillator is mounted; a second mounting portion located on an upper surface of the convex portion and having a mirror mounted thereon; having The laser device according to claim 10.

14. the second base has a step between the first mounting portion and the second mounting portion, the first mounting portion being higher than the second mounting portion; 14. The laser device according to claim 13.

15. the second mounting portion includes an inclined surface inclined relative to the first mounting portion, The mirror is mounted on the inclined surface.

14. The laser device according to claim 13.

16. the first substrate has a second step portion located in the first recess and an electrode located on the second step portion; 14. The laser device according to claim 13.

17. the first substrate has a first bottom surface; the second substrate has a second bottom surface; the first bottom surface and the second bottom surface are adjacent to each other, The second bottom surface is lower than the first bottom surface. The laser device according to claim 10.

18. the mounting surface is located on the opposite side to the first recess.

2. The laser device according to claim 1.

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