Optical sensor for measuring properties of consumable parts in semiconductor plasma processing chambers

JP7755817B2Active Publication Date: 2025-10-17TOKYO ELECTRON LTD
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Patent Information

Application Number
JP2024509373
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2021-08-17
Filing Date
2022-08-01
Publication Date
2025-10-17
Estimated Expiration
2042-08-01

AI Technical Summary

Technical Problem

Existing semiconductor processing chambers face challenges in monitoring the condition of consumable parts due to their exposure to harsh environments, leading to performance degradation and requiring costly, unreliable measurement systems that disrupt processing.

Method used

The use of optical sensors mounted on the processing chamber or wafer handling robots to detect optical signals from consumable parts, allowing for non-invasive, real-time monitoring of characteristics such as thickness and edge contour without interrupting the processing.

Benefits of technology

Enables accurate, low-cost monitoring of consumable parts with minimal impact on throughput, maintaining chamber performance by providing feedback for adjustments or replacements, and ensuring reliable measurements over extended periods.

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Abstract

The semiconductor processing system includes a processing chamber configured to perform a semiconductor manufacturing process on each of a plurality of wafers. The processing chamber includes at least one consumable part and a substrate handling module located near the processing chamber and in communication with the processing chamber through a wafer access port. The wafer handling module includes a wafer handling robot configured to transfer each of the wafers between the substrate handling module and the processing chamber through the wafer access port, and an optical diagnostic system including an optical sensor configured to detect an optical signal from the at least one consumable part. The controller is configured to cause the processing chamber to perform a semiconductor manufacturing process on each respective wafer and to cause the optical diagnostic system to detect the optical signal during times when the processing chamber is not performing a semiconductor manufacturing process on the wafer.
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Citation Information

Patent Citations

  • Apparatus for manufacturing semiconductor and method of manufacturing semiconductor-device

    JP2006196716A

  • Measurement system and measurement method

    JP2016100407A

  • Wear detection of consumable part in semiconductor manufacturing apparatus

    JP2017050535A

  • Edge ring or process kit for semiconductor process module

    JP2018032857A

  • Measurement device, measurement method and vacuum processing apparatus

    JP2021093394A