heat sink

A flexible heat sink with conductive tiles and flexible joints addresses the issue of excessive heating in induction welding of thermoplastic composites, focusing heat on the weld joint and improving weld quality.

JP7757480B2Active Publication Date: 2025-10-21THE BOEING CO
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Patent Information

Application Number
JP2024137581
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2019-08-06
Filing Date
2024-08-19
Publication Date
2025-10-21
Estimated Expiration
2040-08-06

AI Technical Summary

Technical Problem

Induction welding of thermoplastic composites results in excessive heating beyond the weld joint due to the induction coil generating heat throughout the component, leading to inefficiencies and potential damage.

Method used

The use of a flexible heat sink composed of non-electrically and thermally conductive tiles connected by flexible joints or hinges, which is bent to conform to the surface and dissipates heat from the weld interface area while induction heating occurs.

Benefits of technology

Concentrates heating at the weld joint, reducing excessive heat in surrounding areas and enhancing the efficiency and integrity of the weld joint formation.

✦ Generated by Eureka AI based on patent content.

Smart Images

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Patent Text Reader

Abstract

To provide a system and method for induction welding TPC components that concentrates heat at a weld junction.SOLUTION: A method of induction welding a first thermoplastic composite TPC 12 to a second thermoplastic composite TPC 14 includes inductively heating a weld interface area between the first TPC 12 and the second TPC 14, and cooling a surface of the first TPC opposite to the weld interface area via a heat sink 20 by dissipating the heat on the surface of the first TPC 12 while the weld interface area is inductively heated.SELECTED DRAWING: Figure 1
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Description

[Technical Field]

[0001] This disclosure relates to induction welding, and more particularly to induction welding of thermoplastic composites using flexible heat sinks and / or cooling to reduce the temperature at the weld interface. [Background technology]

[0002] Induction welding can be used to fuse or join thermoplastic composite (TPC) parts together. TPC parts generally comprise a thermoplastic reinforced with a non-plastic material such as carbon fiber. TPC parts offer high damage tolerance, moisture and chemical resistance, and do not degrade in high temperature or wet conditions. Additionally, TPC parts can be remelted, offering benefits in repair and end-of-life recyclability and reduced handling and storage costs when compared to other alternatives.

[0003] Induction welding involves moving an induction coil along the weld seam of a TPC component. The induction coil induces eddy currents in inherently conductive carbon fibers located within the TPC component, generating heat and melting the thermoplastic material for the purpose of specifically melting the thermoplastic material at the weld interface. Compressing the TPC components together creates a fusion bond or weld joint. Induction welding produces a weld joint that is considered one solid piece, like two or more components becoming one part.

[0004] While induction welding is effective, the induction coil generates heat throughout the TPC component, not just at the weld joint. For example, increased heating occurs in portions of the TPC component that are closer to the induction coil than to the weld joint. Therefore, there is a need in the art for a system and method for induction welding TPC components that concentrates heating at the weld joint. Summary of the Invention

[0005] In one example, a method of induction welding a first thermoplastic composite (TPC) to a second thermoplastic composite (TPC) is presented, the method including inductively heating a weld interface area between the first TPC and the second TPC, and cooling a surface of the first TPC opposite the weld interface area while inductively heating the weld interface area.

[0006] In another example, a heat sink for use in induction welding is provided, comprising any number of electrically non-electrically and thermally conductive tiles and a mechanical hinge flexibly joining the tiles together in a single layer.

[0007] In another example, a method of removing heat from a surface of a first thermoplastic composite (TPC) being induction welded with a second thermoplastic composite (TPC) is presented, the method including bending a heat sink to conform to the surface of the first TPC while placing it over the weld interface area, applying induction heating to the weld interface area between the first and second TPCs, and removing heat from the surface of the first TPC via the heat sink.

[0008] The apparatus and methods of the present disclosure are also referred to in the following clauses, which should not be confused with the claims.

[0009] Clause 1. A method of induction welding a first thermoplastic composite (TPC) (12) to a second thermoplastic composite (TPC) (14), comprising: inductively heating a weld interface area (74) between the first TPC (12) and the second TPC (14); Inductively heating the weld interface area (74) while cooling a surface (43) of the first TPC (12) opposite the weld interface area (74); A method comprising:

[0010] Clause 2. The method of clause 1, further comprising bending the heat sink (20) during placement onto the surface (43) of the first TPC (12) opposite the weld interface area (74).

[0011] Clause 3. The method of clause 2, wherein cooling the surface (43) of the first TPC (12) includes dissipating heat on the surface (43) of the first TPC (12) via a heat sink (20).

[0012] Clause 4. The method of any one of clauses 1 or 2, wherein bending the heat sink (20) includes bending joints (42) between any number of thermally conductive and non-electrically conductive tiles (40).

[0013] Clause 5. The method of any one of clauses 1 to 4, further comprising cooling a surface of the second TPC (14) opposite the weld interface area (74) while inductively heating the weld interface area (74).

[0014] Clause 6. The method of clause 5, further comprising bending the second heat sink (78) during placement onto the surface of the second TPC (14) opposite the weld interface area (74).

[0015] Clause 7. The method of clause 6, wherein cooling the surface of the second TPC (14) includes dissipating heat on the surface of the second TPC (14) via a second heat sink (78).

[0016] Clause 8. The method of any one of clauses 1 to 7, wherein cooling the surface (43) of the first TPC (12) comprises actively cooling the surface (43) of the first TPC (12) with a coolant.

[0017] Clause 9. A heat sink (20) for use in induction welding, comprising: any number of electrically non-electrically and thermally conductive tiles (40); a mechanical hinge (47) that flexibly joins the tiles (40) together into a single layer; A heat sink (20) comprising:

[0018] Clause 10. The heat sink (20) of clause 9, wherein the mechanical hinge (47) includes a tab (65) pivotally disposed within a slot (67).

[0019] Clause 11. A heat sink (20) as described in clause 10, wherein the tile (40) includes a first tile (40A) having a side (68), and the tab (65) is disposed on the side (68) of the first tile (40A).

[0020] Clause 12. A heat sink (20) as described in clause 11, wherein the tile (40) includes a second tile (40B) having a side (68), and the slot (67) is disposed on the side (68) of the second tile (40B).

[0021] Clause 13. The heat sink (20) of any one of clauses 9 to 12, wherein the welding is induction welding.

[0022] Clause 14. The heat sink (20) of any one of clauses 9 to 13, wherein the mechanical hinge (47) comprises interlocking tiles.

[0023] Clause 15. The heat sink (20) of any one of clauses 9 to 14, wherein the first tile 40A and the second tile 40B can include three or more sides.

[0024] Clause 16. A method (80) of removing heat from a surface (43) of a first thermoplastic composite (TPC) (12) that is induction welded to a second thermoplastic composite (TPC) (14) at a weld interface area (74), comprising: bending the heat sink (20) during placement onto the weld interface area (74) so ​​as to conform to the surface (43) of the first TPC (12); applying induction heating to a weld interface area (74) between the first TPC and the second TPC; Dissipating heat from the surface (43) of the first TPC (12) through a heat sink (20); A method comprising:

[0025] Clause 17. The method of clause 16, wherein bending the heat sink (20) includes bending a joint (42) between the thermally conductive and non-electrically conductive tiles (40).

[0026] Clause 18. The method of clause 16 or 17, further comprising bending the second heat sink (78) during mounting to conform to a surface of the second TPC (14).

[0027] Clause 19. The method of clause 18, further comprising dissipating heat from a surface of the second TPC (14) via a second heat sink (78).

[0028] Clause 20. The method of any one of clauses 16 to 19, wherein bending the heat sink (20) includes conforming the heat sink (20) to a contoured surface (43) of the first TPC (12).

[0029] Clause 21. A heat sink for use in induction welding, comprising: any number of non-electrically and thermally conductive tiles; The joints that hold the tiles together flexibly, a fluid path formed through the heat sink for transferring a coolant; A heat sink comprising:

[0030] Clause 22. The heat sink of clause 21, wherein the fluid pathway comprises fluid channels formed in each of the tiles and at the junctions.

[0031] Clause 23. The heat sink of clause 22, wherein the fluid channels are connected together in series to form a fluid path through the heat sink.

[0032] Clause 24. The heat sink of clause 22 or 23, wherein the fluid channels of the individual tiles are parallel to one another.

[0033] Clause 25. The heat sink of any one of clauses 22 to 24, wherein the fluid channels of the tile extend from one side of the tile to the other opposite side of the tile.

[0034] Clause 26. The heat sink of any one of clauses 21 to 25, wherein the joints are disposed between the tiles.

[0035] Clause 27. The heat sink of any one of clauses 21 to 26, wherein the fluid path comprises a fluid channel formed in the junction.

[0036] Clause 28. The heat sink of any one of clauses 21 to 27, wherein the bond comprises a flexible adhesive.

[0037] Clause 29. The heat sink of clause 28, wherein the flexible adhesive comprises silicone.

[0038] Clause 30. The heat sink of any one of clauses 21 to 29, wherein the fluid channels have an elliptical cross section.

[0039] Article 31. If the tiles are approximately 25 mm 2 31. The heat sink of any one of clauses 21 to 30, having a thermal diffusivity greater than 1 / 2 s.

[0040] Clause 32. The heat sink of any one of clauses 21 to 31, further comprising a manifold connected to the fluid path.

[0041] Clause 33. Manufacturing a part of an aircraft using a heat sink according to any one of clauses 21 to 32.

[0042] Clause 34. A method of induction welding a first carbon fiber thermoplastic composite (TPC) to a second carbon fiber thermoplastic composite (TPC), comprising: forming a weld interface area between the first TPC and the second TPC; Bending a heat sink onto a surface of the first TPC; inductively heating the weld interface area with an induction coil located adjacent to a flexible heat sink; dissipating heat absorbed by the heat sink by transferring heat from the heat sink to a coolant that is pumped through the heat sink; A method comprising:

[0043] Clause 35. The method of clause 34, further comprising controlling the cooling rate of the weld interface by pumping a coolant at an elevated temperature through the heat sink.

[0044] Clause 36. The method of clause 35, wherein pumping the coolant at an elevated temperature includes heating the coolant to approximately 400 degrees Fahrenheit via heat absorption from the first TPC during induction heating of the weld interface area.

[0045] Clause 37. The method of any one of clauses 34 to 36, further comprising applying a consolidation pressure on the first TPC and the second TPC while inductively heating the weld interface area.

[0046] Clause 38. The method of any one of clauses 34 to 37, further comprising adjusting induction heating in real time based on sensor feedback.

[0047] Clause 39. The method of any one of clauses 34 to 38, further comprising welding the weld interface area along the weld line.

[0048] Clause 40. The method of any one of clauses 34 to 39, further comprising cooling a surface of the first TPC via a heat sink.

[0049] Clause 41. A system for induction welding a first thermoplastic composite (TPC) to a second thermoplastic composite (TPC) at a weld interface area, comprising: a heat sink disposed over the first TPC having any number of tiles flexibly joined together by joints and fluid pathways formed through the tiles and the joints for conducting a coolant; an induction coil configured to induction weld the first TPC to the second TPC and positioned adjacent to the heat sink; A system comprising:

[0050] Clause 42. The system of clause 41, further comprising a pump connected to the heat sink for pumping coolant through the heat sink.

[0051] Clause 43. The system of clause 41 or 42, further comprising a manifold connected to the heat sink and in fluid communication with the fluid path.

[0052] Clause 44. The system of any one of clauses 41 to 43, wherein the fluid path is parallel to the weld interface area.

[0053] Clause 45. Heat sinks for use in induction welding, comprising: A flexible backing and Any number of non-electrically and thermally conductive tiles arranged in a single layer on a flexible backing. A heat sink comprising:

[0054] Clause 46. The heat sink of clause 45, wherein the tiles are spaced apart on a flexible backing to form air gaps therebetween.

[0055] Clause 47. The heat sink of clause 46, further comprising a tube aligned with the cavity and having holes configured to communicate gas therethrough.

[0056] Clause 48. The heat sink of clause 47, wherein the tube is bonded to a flexible backing.

[0057] Clause 49. The heat sink of clause 48, wherein the tubes are positioned along longitudinal edges of the heat sink.

[0058] Clause 50. The heat sink of any one of clauses 45 to 49, wherein the flexible backing is constructed from woven fibers.

[0059] Clause 51. The heat sink of clause 50, wherein the woven fibers comprise fiberglass or oxide ceramic.

[0060] Clause 52. The heat sink of any one of clauses 45 to 51, wherein the flexible backing is infused with polytetrafluoroethylene.

[0061] Clause 53. A heat sink according to any one of clauses 45 to 52, wherein the tiles are spaced apart.

[0062] Clause 54. The heat sink of any one of clauses 45 to 53, wherein the tiles are attached to the flexible backing by an adhesive.

[0063] Clause 55. The heat sink of clause 54, wherein an adhesive is disposed between the tiles.

[0064] Clause 56. The heat sink of clause 54 or 55, wherein the adhesive is a silicone pressure sensitive adhesive.

[0065] Clause 57. The heat sink of any one of clauses 54 to 56, wherein the adhesive is selected from the group consisting of silicone, PTFE, polybenzimidazole (PBI), high performance polyamide (HPPA), polyamide (PI), polyamidimide (PAI), polyketone, polysulfone derivative-a, fluoropolymer, polyetherimide (PEI), polybutylene terephthalate (PBT), polyphenylene disulfide, syndiotactic polystyrene, and polycyclohexanedimethylterephthalate (PCT).

[0066] Clause 58. A heat sink according to any one of clauses 54 to 57 and a two-component heat-cured epoxy system comprising a liquid resin and a powdered hardener.

[0067] Clause 59. A method of induction welding a first carbon fiber thermoplastic composite (TPC) to a second carbon fiber thermoplastic composite (TPC), comprising: forming a weld interface area between the first TPC and the second TPC; placing a heat sink on a surface of the first TPC above the weld interface area; inductively heating the weld interface area; moving a gas through a heat sink; dissipating heat absorbed by the heat sink by transferring heat from the heat sink to the gas; A method comprising:

[0068] Clause 60. The method of clause 59, further comprising transferring the gas through the gaps between the tiles to the heat sink.

[0069] Clause 61. The method of clause 59 or 60, wherein placing a heat sink on the surface of the first TPC above the weld interface area includes bending the heat sink onto the surface.

[0070] Clause 62. A system for induction welding a first thermoplastic composite (TPC) to a second thermoplastic composite (TPC) at a weld interface area, comprising: a heat sink disposed on the first TPC, the heat sink including any number of tiles flexibly bonded together by a backing and an air gap disposed between the tiles; an induction coil configured to induction weld the first TPC to the second TPC and positioned adjacent to the heat sink; A system comprising:

[0071] Clause 63. The system of clause 62, further comprising a pressurized gas source connected to the heat sink for moving gas through the gap of the heat sink.

[0072] Clause 64. The system of clause 62 or 63, further comprising a heat sink holder disposed on the heat sink for applying a consolidation pressure on the heat sink during induction welding.

[0073] The above-described features, functions, and advantages can be realized alone in various aspects or combined in other aspects, details of which can be ascertained by reference to the following description and accompanying drawings.

[0074] The drawings described herein are for illustration purposes only and are not intended to limit the scope of the present disclosure. [Brief explanation of the drawings]

[0075] [Figure 1] 1 is a perspective view of a system for induction welding according to an exemplary embodiment. [Figure 1A] FIG. 10 is a perspective view of a variation of a system for induction welding according to an exemplary embodiment. [Figure 2] 2 is an enlarged portion of the heat sink indicated by arrows 2-2 in FIG. 1, according to an exemplary embodiment. [Figure 2A] 1 is a perspective view of a heat sink shown on an exemplary curved surface, according to an exemplary embodiment. [Figure 3] 3 is a perspective view of a heat sink manufacturing system used to manufacture the heat sink of FIG. 2, according to an exemplary embodiment. [Figure 4] 4 is an exemplary process flow diagram illustrating a method for manufacturing the heat sink of FIG. 2 using the heat sink manufacturing system of FIG. 3, according to an exemplary embodiment. [Figure 5] 1 is an exemplary perspective view of a portion of a heat sink having a mechanical hinge, according to an exemplary embodiment. [Figure 5A] 5A is a cross-section of a heat sink taken in the direction of arrows 5A-5A of FIG. 5, according to an exemplary embodiment. [Figure 6] 6 is an enlarged partial cross-sectional view of a layup of the system as viewed in the direction of arrows 6-6 of FIG. 1, according to an exemplary embodiment. [Figure 7] FIG. 1 is an exemplary process flow diagram illustrating an induction welding method, according to an exemplary embodiment. [Figure 8] 6 is an enlarged partial cross-sectional view of another layup of the system as viewed in the direction of arrows 6-6 of FIG. 1, according to an exemplary embodiment. [Figure 9] 6 is an enlarged partial cross-sectional view of another layup of the system as viewed in the direction of arrows 6-6 of FIG. 1, according to an exemplary embodiment. [Figure 10] 6 is an enlarged partial cross-sectional view of another layup of the system as viewed in the direction of arrows 6-6 of FIG. 1, according to an exemplary embodiment. [Figure 11] 6 is an enlarged partial cross-sectional view of another layup of the system as viewed in the direction of arrows 6-6 of FIG. 1, according to an exemplary embodiment. [Figure 12] 6 is an enlarged partial cross-sectional view of another layup of the system as viewed in the direction of arrows 6-6 of FIG. 1, according to an exemplary embodiment. [Figure 13] FIG. 1 illustrates an exemplary process flow diagram for induction welding according to an exemplary embodiment. [Figure 14] FIG. 10 is another exemplary process flow diagram for induction welding according to an exemplary embodiment. [Figure 15] 6 is an enlarged partial cross-sectional view of another layup of the system as viewed in the direction of arrows 6-6 of FIG. 1, according to an exemplary embodiment. [Figure 16] 6 is an enlarged partial cross-sectional view of another layup of the system as viewed in the direction of arrows 6-6 of FIG. 1, according to an exemplary embodiment. [Figure 17] FIG. 1 illustrates an exemplary process flow diagram for induction welding according to an exemplary embodiment. [Figure 18] FIG. 10 is another exemplary process flow diagram for induction welding according to an exemplary embodiment. [Figure 19] FIG. 10 is a perspective view of another example of a heat sink including liquid cooling, according to an exemplary embodiment. [Figure 20] 20 is an exemplary process flow diagram illustrating a method for manufacturing the heat sink including liquid cooling of FIG. 19 using the heat sink manufacturing system of FIG. 3, according to an exemplary embodiment. [Figure 21] FIG. 20 is a perspective view of a heat sink manufacturing system used to manufacture the heat sink with liquid cooling of FIG. 19, according to an exemplary embodiment. [Figure 22]6 is an enlarged cross-sectional view of another layup of the system as viewed in the direction of arrows 6-6 of FIG. 1 using a heat sink with liquid cooling, according to an exemplary embodiment. [Figure 23] FIG. 10 is a perspective view of another example of a heat sink including liquid cooling, according to an exemplary embodiment. [Figure 24] FIG. 10 is a perspective view of another example of a heat sink including liquid cooling, according to an exemplary embodiment. [Figure 25] FIG. 10 is a top view of another example of a heat sink used during induction welding, according to an exemplary embodiment. [Figure 26] 26 is a cross-sectional view of a heat sink taken in the direction of arrows 26-26 of FIG. 25, according to an exemplary embodiment. [Figure 27] 26 is a cross-sectional view of a variation of the heat sink shown in FIG. 25, according to an exemplary embodiment. [Figure 28] 26 is a schematic diagram of a system for induction welding using the heat sink shown in FIG. 25 according to an exemplary embodiment. [Figure 29] FIG. 26 is a schematic diagram of a system for induction welding using the heat sink shown in FIG. 25 according to another exemplary embodiment. [Figure 30] FIG. 1 is a flow diagram of an aircraft production and service method. [Figure 31] FIG. 1 is a block diagram of an aircraft. DETAILED DESCRIPTION OF THE INVENTION

[0076] The following description is merely exemplary in nature and is in no way intended to limit the disclosure, application, or uses.

[0077] Referring to FIG. 1 , a schematic diagram of a system 10 for induction welding a first thermoplastic composite (TPC) 12 to a second TPC 14 is shown. The system 10 may be used in the context of aircraft manufacturing and maintenance, as described below. For example, the system 10 may be used in the manufacture of aircraft components and subassemblies, including interior manufacturing, acoustic panels, aircraft systems integration, airframe manufacturing, and aircraft routine maintenance and maintenance. However, the system 10 may be used in a variety of other industries (automotive, construction, sporting goods, and general transportation, to name just a few). The first TPC 12 and the second TPC 14 are illustrated as flat sheets. However, it should be understood that the first TPC 12 and the second TPC 14 may be contoured, curved, or non-planar without departing from the scope of this disclosure, as described below in connection with FIG. 2 . Furthermore, the first TPC 12 and the second TPC 14 may be composed of various thermoplastics reinforced with various electrically conductive materials. In one example, the thermoplastic is selected from the group consisting of semi-crystalline thermoplastics and amorphous thermoplastics. Semi-crystalline thermoplastics can include polyphenylene sulfide (PPS), polyetheretherketone (PEEK), polyetherketoneketone (PEKK), and polyarylketone (PAEK). Amorphous thermoplastics can include polyetherimide (PEI). Semi-crystalline thermoplastics have a high consolidation temperature, which includes good mechanical properties compared to traditional thermoplastics. Amorphous thermoplastics include materials with good elongation, toughness, and impact resistance compared to traditional thermoplastics, and they gradually soften when heated. Semi-crystalline thermoplastics contain regions of tightly folded chains (crystallites) that are bonded together and exhibit a sharp melting point when heated, as the crystalline regions begin to melt. As a polymer approaches its melting point, the crystal lattice collapses, allowing the molecules to rotate and move freely. During slow cooling, semi-crystalline thermoplastics nucleate and grow crystalline domains, providing increased strength, stiffness, solvent resistance, and temperature stability compared to amorphous structures. If semi-crystalline thermoplastics are cooled too rapidly, they can form a non-crystalline structure.

[0078] In another example, the conductive material includes carbon fibers. The carbon fibers may be oriented within the thermoplastic in various configurations (not shown) that, in turn, affect the degree of heating during induction welding. For example, the carbon fibers may be oriented in a mesh pattern at 0 and 90 degrees, + / - 45 degrees, or + / - 60 degrees, to name just a few. The carbon fibers may be unidirectional or woven together. Each such configuration affects the degree of heating of the first TPC 12 and the second TPC 14 under a given magnetic field. While two TPC components are shown, it should be understood that any number of stacked TPC components may be used.

[0079] The system 10 generally includes a tooling base 16, an induction welder 18, and a heat sink 20. The tooling base 16 supports the first TPC 12 and the second TPC 14 thereon. In the example provided, the tooling base 16 is flat. However, it should be recognized that the tooling base 16 can have a variety of other shapes that support the first TPC 12 and the second TPC 14.

[0080] The induction welder 18 is configured to inductively heat the first TPC 12 and the second TPC 14 and may take various forms without departing from the scope of this disclosure. In the example provided, the induction welder 18 includes an induction coil 22 mounted on a robotic arm 24. The induction coil 22 may also be mounted on any other suitable robotic manipulator. In another embodiment, the induction coil 22 may be fixed, and the first TPC 12 and the second TPC 14 move relative to the induction coil 22. Thus, the induction coil 22 moves relative to the first TPC 12 and the second TPC 14, and the first TPC 12 and the second TPC 14 may move relative to the induction coil 22. In another example, both the induction coil 22 and the first TPC 12 and the second TPC 14 may move. The induction coil 22 generates a magnetic field 25, which induces an eddy current in the carbon fibers of the first TPC 12 and the second TPC 14. The robot arm 24 moves the induction coil 22 in a first direction 26A along the weld line 26. The weld line 26 is thus the area of ​​the first TPC 12 and the second TPC 14 that are welded together. The weld line 26 may be straight, curved, or have any other pattern. A first roller 28A and a second roller 28B are positioned adjacent to the induction coil 22. The first roller 28A is positioned in front 22A of the induction coil 22. The second roller 28B is positioned behind 22B of the induction coil 22. The first roller 28A and the second roller 28B apply a consolidation pressure on the first TPC 12 and the second TPC 14 during the induction welding process, as described below. In the example provided, the first roller 28A and the second roller 28B are connected to the induction coil 22; however, it should be understood that the first roller 28A and the second roller 28B may be separated without departing from the scope of the present disclosure. The first roller 28A and the second roller 28B may be hinged to allow movement over the contoured surface while maintaining a consolidation pressure on the first TPC 12. Additionally, consolidation pressure may be applied during or after induction welding as the induction coil 22 moves in the first direction 26A or the opposite direction. Additionally, other methods for applying consolidation pressure may be used, as described below with reference to FIG. 1A.

[0081] The induction welder 18 is in electrical communication with a controller 30. The controller 30 is operable to control the amount of current supplied to the induction coil 22, which in turn controls the strength of the magnetic field to heat the first TPC 12 and the second TPC 14. The controller 30 is also operable to control the movement of the robot arm 24 or the induction coil 22 relative to the weld seam 26. The controller 30 is a non-general electronic control device having a programmed digital computer or processor 32, memory or non-transitory computer-readable media 34 used to store control theory, software applications, instructions, computer code, data, look-up tables, and other data, and input / output ports 36. The non-transitory computer-readable media 34 includes any type of medium accessible by a computer, such as read-only memory (ROM), random-access memory (RAM), a hard disk drive, a compact disc (CD), a digital video disc (DVD), or any other type of memory. Wired, wireless, optical, or other communication links that transfer transitory electrical or other signals are excluded from "non-transitory" computer-readable media. Non-transitory computer-readable media include media that can store data permanently, such as rewritable optical disks or erasable memory devices, and media that can store data and later overwrite it. Computer code includes any type of program code, including source code, object code, and executable code. Processor 32 is configured to execute the code or instructions.

[0082] The system 10 may further include any number of sensors 38 in electronic communication with the controller 30. The sensors 38 are configured to detect or sense a condition of the first TPC 12 and / or the second TPC 14 during induction welding to provide real-time feedback to the controller 30. For example, the sensors 38 may be infrared temperature sensors configured to detect the temperature of the first TPC 12 and / or the second TPC 14. Alternatively, or additionally, the sensors 38 may be electromagnetic field sensors configured to detect the strength of the magnetic field 25 generated by the induction coil 22. The sensors 38 may be used by the controller 30 in feedback control of the movement of the induction coil 22, as described below.

[0083] FIG. 1A illustrates an alternative configuration of system 10 according to the principles of the present disclosure. The configuration illustrated in FIG. 1A is similar to that of FIG. 1, except that rollers 28A and 28B have been removed, and second TPC 14 is shown having an "L"-shaped cross-section. Other possible cross-sections for second TPC 14 and / or first TPC 12 include at least "J," "I," "T," "Z," and / or "hat"-shaped cross-sections. Consolidation pressure is supplied by bellows 39 positioned below second TPC 14 along weld line 26. Expansion of bellows 39 to apply consolidation pressure to second TPC 14 can be controlled by controller 30.

[0084] Returning to FIG. 1 , the heat sink 20 is configured to absorb and dissipate heat from the first TPC 12. The heat sink 20 is disposed between the first TPC 12 and the induction coil 22, as described below. FIG. 2 shows an enlarged portion of the heat sink 20 of FIG. 1. Referring to FIG. 2, the heat sink 20 includes any number of tiles 40 connected by joints 42. The joints 42 are disposed between the tiles 40. The tiles 40 are made from a non-electrically and thermally conductive material. Thus, when underneath the induction coil 22 (FIG. 1), the tiles 40 are not heated by the magnetic field 25, but absorb heat from the first TPC 12. In one example, the tiles 40 are approximately 25 mm 2diffusivity greater than about 70 mm / s, preferably 2 1 / sec. In this context, the term "about" is known to those skilled in the art. Alternatively, the term "about" may refer to a range of ±5 mm. 2 The term "about" may be interpreted as meaning ±10 W / mK / sec. In another example, the tile 40 has a thermal conductivity greater than about 75 W / mK, preferably greater than about 150 W / mK. In this context, the term "about" is known to those skilled in the art. Alternatively, the term "about" may be interpreted as meaning ±10 W / mK. In another example, the tile 40 has a specific heat capacity greater than about 500 J / K / kg, preferably greater than about 700 J / K / kg. In this context, the term "about" is known to those skilled in the art. Alternatively, the term "about" may be interpreted as meaning ±50 J / K / kg. In one example, the tile 40 is made of aluminum nitride. The aluminum nitride material matrix contains low residual carbon to ensure that the induction coil 22 does not bond with the carbon in the tile 40 and unintentionally heat the tile 40 during induction welding of the first TPC 12. In another example, the tile 40 is made of beryllium oxide. In another example, the tiles 40 are composed of cubic boron nitride (c-BN) or hexagonal boron nitride (h-BN).

[0085] The joints 42 flexibly hold the tiles 40 together and provide flexibility to the heat sink 20, thereby allowing the heat sink 20 to conform to the contours of the first TPC 12. For example, FIG. 2A shows the heat sink 20 on a contoured surface 43 of the first TPC 12. In the example shown, the contoured surface 43 is curved. The heat sink 20 pivots at the joints 42, maintaining contact between the tiles 40 and the contoured surface 43. The joints 42 can be comprised of either a flexible adhesive 45, as shown in FIGS. 2 and 2A, or a mechanical hinge 47, as shown in FIG. 5. Referring to FIG. 2, the flexible adhesive 45 provides flexibility to the heat sink 20 and does not melt while heating the tiles 40 during induction welding. A minimal amount of flexible adhesive 45 is preferably used to hold the tiles 40 together, thereby increasing the heat dissipation capability of the heat sink 20. Thus, in one example, the flexible adhesive 45 has a long-term degradation temperature in air of greater than about 570°F. In this context, the term "about" is known to those skilled in the art. Alternatively, the term "about" may be read to mean ±25 degrees Fahrenheit. In another example, the flexible adhesive 45 has an elongation between 120% and 670%. In another example, the flexible adhesive 45 has a tensile strength between 690 psi and 1035 psi. In another example, the flexible adhesive 45 has a tear strength (Type B) between 31 lb / in and 190 lb / in. Thus, in one example, the flexible adhesive 45 is comprised of a silicone. An example of a suitable silicone is 3145 RTV by Dow Corning. However, other silicones may be used.

[0086] The tiles 40 are arranged in a single layer in a parquet or geometric pattern. Accordingly, each of the tiles 40 defines a gap 44 therebetween, with the joints 42 disposed within the gaps 44. The tiles 40 are configured, sized, and shaped to help conform to the contours of the contoured surface 43 (FIG. 2A) of the first TPC 12. In one example, the gaps 44 have a width 49 between about 0.005 inches and about 0.1 inches, preferably about 0.040 inches. In this context, the term "about" is known to those skilled in the art. Alternatively, the term "about" may be read to mean ±0.005 inches. While the tiles 40 are illustrated as squares to maximize the surface area of ​​the tiles 40 relative to the joints 42, they may have a variety of other shapes without departing from the scope of this disclosure. For example, tiles 40 may have straight or curved edges and may have three or more sides to help conform to the contours and / or weld shapes of first TPC 12. Heat sink 20 is preferably sized to at least cover weld seam 26 (FIG. 1), or in this example, the entire first TPC 12 (FIG. 1).

[0087] FIG. 3 shows a heat sink manufacturing system 50 used to manufacture the heat sink 20 (FIG. 2). The heat sink manufacturing system 50 includes a base plate 52 supporting a substrate 54. In one example, the substrate 54 is double-sided tape attached to the base plate 52. In another example, the substrate 54 is glass cloth tape. In yet another example, the substrate 54 is Teflon-coated fiberglass sprayed with adhesive with a bottom layer of glass cloth. In this configuration, curing occurs on both sides of the substrate 54. A frame 56 having a fixture 58 is placed on the substrate 54. In one embodiment, the fixture 58 is composed of individual wires 59 woven together. The fixture 58 is sized to form the gap 44 (FIG. 2) in the heat sink 20. The frame 56 and fixture 58 are removed from the substrate 54.

[0088] FIG. 4 shows a flowchart of a method 60 for forming the heat sink 20 of FIG. 2 using the heat sink manufacturing system 50 of FIG. 3. The method 60 begins at block 60A, where the tiles 40 may be primed with a primer before being placed on a substrate 54. In one example, the primer is a silicone primer. At block 60B, the tiles 40 are arranged in a pattern within a jig 58. For example, the tiles 40 are placed on the substrate 54 between the jig 58. The substrate 54 holds the tiles 40 in place while the jig 58 spaces the tiles 40 apart. Thus, the pattern is defined by the jig 58. Once the tiles 40 are placed at block 60B, the frame 56 and jig 58 are removed at block 60C, leaving gaps 44 between the tiles 40.

[0089] Next, at block 60D, the tiles 40 are flexibly bonded together at joints 42. In the example provided, joints 42 are applied within gaps 44 between tiles 40. At block 60E, joints 42 are then preferably allowed to cure for a period of time. Once cured, the assembled heat sink 20 may be removed from the substrate 54 at block 60F.

[0090] FIG. 5 illustrates a portion of a heat sink 20 using an example mechanical hinge 47 that flexibly connects tiles 40. The mechanical hinge 47 includes tile interlocking 47A. A first tile 40A includes a tab 65 extending from any number of sides 66 of the first tile 40A. The tab 65 may be integrally formed with the first tile 40A or may be adhered to the first tile 40A. An adjacent second tile 40B includes a slot 67 disposed on any number of sides 68 of the second tile 40B. As noted above, it should be understood that the first tile 40A and the second tile 40B may have more than two sides without departing from the scope of this disclosure. Referring to FIG. 5A, the first tile 40A is connected to the second tile 40B by inserting the tab 65 into the slot 67. The tab 65 and slot 67 are configured to allow the first tile 40A to pivot relative to the second tile 40B. For example, a first tile 40A can pivot + / -θ relative to a second tile 40B. In one example, flexible adhesive 45 (FIG. 2) can be disposed within mechanical hinge 47. Tiles 40A, 40B can be disposed within a single layer to form a parquet pattern. Thus, by alternatingly connecting any number of first tiles 40A to any number of second tiles 40B, heat sink 20 can be manufactured to any size or shape.

[0091] Returning to FIG. 1 , the system 10 may further include a vacuum bag 70. The vacuum bag 70 is connected to a vacuum source 72. The vacuum source 72 is configured to apply a vacuum to the vacuum bag 70. The vacuum source 72 is preferably controlled by the controller 30. The first TPC 12, the second TPC 14, and the heat sink 20 are all disposed within the vacuum bag 70. By removing air from the vacuum bag 70, the flexible adhesive 45 at the joint 42 (FIG. 2) of the heat sink 20 can withstand higher temperatures than in an air / oxygen environment before degrading. Alternatively, the vacuum source 72 may be replaced with a pump (not shown) that fills the vacuum bag 70 with an inert gas, such as nitrogen. The inert gas displaces the air within the vacuum bag 70, allowing the flexible adhesive 45 at the joint 42 (FIG. 2) of the heat sink 20 to withstand higher temperatures than in an air / oxygen environment before degrading. The vacuum bag 70 is also configured to apply a consolidation pressure onto the first TPC 12 and the second TPC 14 via vacuum compression.

[0092] FIG. 6 shows a cross-sectional view of the layup illustrating the first TPC 12, the second TPC 14, the heat sink 20, and the vacuum bag 70 on the tooling base 16, including a side view of the induction coil 22. The first TPC 12 is placed on top of the second TPC 14. A weld interface area 74 is defined along the weld line 26 ( FIG. 1 ) between the first TPC 12 and the second TPC 14. The heat sink 20 is placed on top of the first TPC 12 between the induction coil 22 and the first TPC 12. The induction coil 22 is a distance “d” from the first TPC 12. In one example, the distance d is approximately 8 mm. The heat sink 20 has a thickness “t” that is less than the distance d. In one example, the thickness t is approximately 4 mm. In yet another example, the heat sink 20 is cooled before being placed on the first TPC 12. The first roller 28A and the second roller 28B apply a consolidation pressure through the vacuum bag 70 and the heat sink 20 onto the first TPC 12, compressing the first TPC 12 onto the second TPC 14. In one example, the first roller 28A and the second roller 28B maintain the induction coil 22 at a constant height above the first TPC 12.

[0093] During induction welding, the controller 30 (FIG. 1) commands current through the induction coil 22 to generate a magnetic field 25. The magnetic field 25 heats the carbon fibers in the first TPC 12 and the second TPC 14. A portion 76 of the first TPC 12 closer to the induction coil 22 heats more than the weld interface area 74. However, the heat sink 20 absorbs and dissipates the heat in the portion 76 of the first TPC 12. Thus, the heat generated by the induction welder 18 is concentrated in the weld interface area 74. When the thermoplastic material in the weld interface area 74 heats above the melting point or consolidation temperature of the material, the first roller 28A and the second roller 28B exert a consolidation pressure on the first TPC 12, merging the first TPC 12 with the second TPC 14 at the weld interface area 74, thereby forming a uniform molten bond upon cooling. In one example, the weld interface area 74 is heated to approximately 20 degrees above the consolidation temperature. The controller 30 then commands the robot arm 24 to move in a first direction 26A (FIG. 1) along the weld line 26 (FIG. 1) to weld a portion of the first TPC 12 to the second TPC 14. Feedback from the sensor 38 (FIG. 1) is used to command different currents to the induction coil 22, thus adjusting the amount of heating in real time. The heat sink 20 also allows the first TPC 12 to cool after induction welding at a rate that promotes crystallization of the semi-crystalline thermoplastic material in the weld interface area 74, thereby increasing the amount of crystallization of the semi-crystalline thermoplastic material. For example, during induction welding, the heat sink 20 absorbs heat from the tile 40. After induction welding, the heat absorbed by the tile 40 that is not dissipated into the atmosphere can be re-absorbed by the first TPC 12, cooling the first TPC 12 at a specific rate that increases the amount of crystallization. For example, the optimal cooling rate for PEEK is in the range of 0.2-20°F / min, which will result in a crystalline content of 25-35%. The rate of crystallization also depends on the specific annealing temperature, with the peak rate occurring approximately midway between the glass transition temperature (Tg) and the melting point (Tm).

[0094] With reference to FIG. 7 and with continued reference to FIGS. 1 and 6 , a flowchart of a method 80 for induction welding a first TPC 12 to a second TPC 14 using the system 10 is illustrated. The method 80 begins, at block 81, by aligning the first TPC 12 with the second TPC 14 to form a weld interface area 74. Next, at block 82, a heat sink 20 is placed on the first TPC 12. As described above, the heat sink 20 preferably covers at least the weld interface area 74 along the weld line 26. Because the heat sink 20 is flexible, it conforms to the surface contour of the first TPC 12, whether planar or non-planar, as shown in FIG. 2A . In the example presented, the first TPC 12, the second TPC 14, and the heat sink 20 are all placed within a vacuum bag 70. A vacuum may then be applied to the vacuum bag 70 by a vacuum source 72. The vacuum bag 70 applies a compaction force of up to 1 atmosphere onto the first TPC 12 and the second TPC 14. Alternatively, an inert gas may be pumped into the vacuum bag 70.

[0095] At block 83, the weld interface area 74 is inductively heated by the induction coil 22. At block 84, heat generated at the portion 76 closest to the induction coil 22 is absorbed and dissipated by the heat sink 20, causing the portion 76 to cool. At block 85, the first roller 28A and the second roller 28B exert a consolidation pressure on the first TPC 12, merging the first TPC 12 with the second TPC 14 at the interface area 74, thereby forming a uniform molten bond upon cooling. It should be understood that blocks 83, 84, and 85 can occur simultaneously. In another example, a bellows 39 ( FIG. 1A ) or other means exerts a consolidation pressure on the second TPC 14. At block 86, the weld interface area 74 is induction welded along the weld line 26 by moving the induction coil 22 along the weld line 26, welding the first TPC 12 portion to the second TPC 14. Alternatively, the weld interface area 74 may move relative to the induction coil 22. At block 87, feedback from the sensors 38 is used to adjust the induction welding process in real time. For example, the controller 30 can command different currents to the induction coil 22, thus adjusting the amount of heat in real time, command the velocity between the induction coil 22 and the weld interface area 74, etc.

[0096] 8 shows a cross-sectional view of the layup of first TPC 12, second TPC 14, heat sink 20, and vacuum bag 70 on tooling base 16, including a side view of induction coil 22. However, a second heat sink 78 is included. Second heat sink 78 is substantially similar to heat sink 20.

[0097] The first TPC 12 is positioned on top of the second TPC 14. The heat sink 20 is positioned on top of the first TPC 12 between the induction coil 22 and the first TPC 12. The second heat sink 78 is positioned between the tooling base 16 and the second TPC 14. In addition, the second heat sink 78 is positioned within the vacuum bag 70. During induction welding, as described above, it is desirable to concentrate heat in the weld interface area 74 and minimize heat in other areas of the first TPC 12 and the second TPC 14. However, heat is generated in the first TPC 12, the weld interface area 74, and the second TPC 14 during induction welding. The heat sink 20 absorbs and dissipates heat generated in a portion 76 of the first TPC 12. The second heat sink 78 absorbs and dissipates heat generated in a portion 88 of the second TPC 14 adjacent to the second heat sink 78. Thus, heat is concentrated along the weld interface area 74 rather than at the portion 76 of the first TPC 12 or the portion 88 of the second TPC 14 .

[0098] 9 shows an enlarged cross-sectional view of the system 10 illustrating another example of the layup of the first TPC 12, the second TPC 14, the heat sink 20, and the vacuum bag 70 on the tooling base 16. However, the tooling base 16 includes a cooling unit 89 embedded therein. Alternatively, the cooling unit 89 may be located on the surface of the tooling base 16 (not shown). The cooling unit 89 is connected to a coolant source 90. The cooling unit 89 includes piping within the tooling base 16, and the coolant source 90 may include a fluid heat exchanger and a pump (not shown). The coolant source 90 is in electrical communication with the controller 30 (FIG. 1).

[0099] The first TPC 12 is positioned on top of the second TPC 14. The heat sink 20 is positioned on top of the first TPC 12 between the induction coil 22 and the first TPC 12. The second TPC 14 is positioned adjacent to the cooling unit 89 within the tooling base 16. During induction welding, as described above, it is desirable for heat to be concentrated in the weld interface area 74. The cooling unit 89 acts as a heat exchanger for the portion 88 of the second TPC 14 adjacent to the cooling unit 89, reducing the heat in the second TPC 14 while the heat sink 20 absorbs and dissipates the heat from the first TPC 12. Thus, heat is concentrated along the weld interface area 74 rather than along the portion 76 of the first TPC 12 or the portion 88 of the second TPC 14.

[0100] 10 shows a cross-sectional view of the layup of first TPC 12, second TPC 14, heat sink 20, and second heat sink 78 on tooling base 16, including a side view of induction coil 22. However, vacuum bag 70 is replaced with first plate 91 and second plate 92.

[0101] The first TPC 12 is positioned on top of the second TPC 14. The heat sink 20 is positioned on top of the first TPC 12 between the induction coil 22 and the first TPC 12. The second heat sink 78 is adjacent to the second TPC 14. The first TPC 12, the second TPC 14, the heat sink 20, and the second heat sink 78 are all sandwiched between a first plate 91 and a second plate 92. The first plate 91 and the second plate 92 provide stability to the layup by preventing the first TPC 12, the second TPC 14, the heat sink 20, and the second heat sink 78 from moving relative to one another. The first roller 28A and the second roller 28B, as described above, contact the first plate 91 and provide consolidation pressure during induction welding.

[0102] FIG. 11 shows an enlarged, partial cross-sectional view of system 10 illustrating another example of the layup of first TPC 12, second TPC 14, and vacuum bag 70 on tooling base 16 without the use of a heat sink. However, induction welder 18 includes a cooling device 93. Cooling device 93 is positioned adjacent to induction coil 22 in first direction 26A ( FIG. 1 ). Cooling device 93 is connected to induction coil 22 by member 94 to fix the distance between induction coil 22 and cooling device 93. However, it should be understood that cooling device 93 may be separated without departing from the scope of this disclosure. Cooling device 93 includes any number of nozzles 96 configured to emit a coolant. Cooling device 93 is connected to a coolant source 98 and further to controller 30. In one example, the coolant used is CO gas. However, other coolants may be used. As noted above, a heat sink is not used in this example.

[0103] During induction welding, a cooling device 93 cools the first TPC 12 in front of the induction coil 22 by discharging a coolant onto the first TPC 12. In one example, the cooling device 93 is configured to cool the first TPC 12 to approximately -100°F. In this context, the term "about" is known to those skilled in the art. Alternatively, the term "about" may be read to mean ±25°F. Cooling the first TPC 12 creates a thermal gradient that maintains the temperature of the portion 76 of the first TPC 12 below the consolidation temperature during induction welding. The thermal gradient is the temperature difference from the portion 76 of the first TPC 12 adjacent to the induction coil 22 relative to the temperature of the weld interface area 74. The thermal gradient may be controlled by the number of nozzles 96, the coolant flow rate from the nozzles 96, the distance from the cooling device 93 to the induction coil 22, the strength of the magnetic field generated by the induction coil 22, as well as the thickness of the first TPC 12 and second TPC 14 and the orientation of the carbon fibers. Additionally, the amount of cooling and heating may be adjusted in real time by the controller 30 based on feedback received from sensors 38 (FIG. 1).

[0104] FIG. 12 shows a cross-sectional view of the layup of the first TPC 12, the second TPC 14, and the vacuum bag 70 on the tooling base 16 without a heat sink, including a side view of the induction coil 22. However, the induction welder 18 includes a second cooling device 100 and a second induction coil 102. Both the second cooling device 100 and the second induction coil 102 are positioned adjacent to the induction coil 22 in a direction opposite the first direction 26A ( FIG. 1 ). Thus, the second cooling device 100 and the second induction coil 102 are positioned on the opposite side from the cooling device 93. To fix the distance between the induction coil 22 and the second cooling device 100 and the second induction coil 102, the second cooling device 100 and the second induction coil 102 are connected to the induction coil 22 by a member 104. However, it should be understood that the second cooling device 100 and / or the second induction coil 102 may be separated without departing from the scope of the present disclosure. The second cooling device 100 includes any number of nozzles 106 configured to emit coolant. The second cooling device 100 is connected to a coolant source 98 and also to a controller 30. The second induction coil 102 is similar to the induction coil 22 and is controlled by the controller 30. As noted above, no heat sink is used in this example.

[0105] As described above, during induction welding, the cooling device 93 cools the first TPC 12 in front of the induction coil 22 by ejecting coolant onto the first TPC 12. As the induction welder 18 moves along the weld seam 26 (FIG. 1), the induction coil 22 melts the weld interface area 74, and the first TPC 12 merges with the second TPC 14 under consolidation pressure from the first roller 28A and the second roller 28B. To control the cooling of the weld interface area 74, the controller 30 uses the second cooling device 100 and the second induction coil 102 to heat and cool the merged weld interface area 74. The cooling rate at the weld interface area 74 is controlled by controlling the amount of cooling and heating in real time by the controller 30 based on feedback received from the sensor 38 (FIG. 1). The cooling rate can be controlled to maximize crystallization of the thermoplastic at the weld interface area 74, enhancing strength.

[0106] 1 and 11, a flowchart of a method 110 for induction welding a first TPC 12 to a second TPC 14 using a system 10 including a cooling device 93 is shown. The method 110 begins at block 112 by aligning the first TPC 12 with the second TPC 14 to form a weld interface area 74. In the example provided, the first TPC 12 and the second TPC 14 are all placed within a vacuum bag 70. A vacuum may then be applied to the vacuum bag 70 by a vacuum source 72. Alternatively, an inert gas may be pumped into the vacuum bag 70.

[0107] Next, in block 114, the first TPC 12 is cooled using the cooling device 93. In one example, the controller 30 sets a target temperature at the weld interface area 74 or portion 76. The controller 30 then monitors the actual temperature of the weld interface area 74 or portion 76 using the sensor 38 during cooling by the cooling device 93. The controller 30 then controls the amount of cooling provided by the cooling device 93 to match the actual temperature to the target temperature. The target temperature may be set using a lookup table or a given specific factor to reach a specific thermal gradient. For example, setting the target temperature may involve determining the position of the weld interface area 74 relative to the induction coil 22 and setting the target temperature based on the position of the weld interface area 74. Other factors may include the number of nozzles 96, the coolant flow rate from the nozzles 96, the distance from the cooling device 93 to the induction coil 22, the strength of the magnetic field generated by the induction coil 22, as well as the orientation of the first and second TPCs 12 and 14 and the carbon fibers, and the speed at which the induction coil 22 moves relative to the weld interface area 74, or the speed at which the weld interface area 74 moves relative to the induction coil 22, or both. In another example, the target temperature is set to approximately -100 degrees Fahrenheit. In this context, the term "about" is known to those skilled in the art. Alternatively, the term "about" may be read to mean ±25 degrees Fahrenheit.

[0108] At block 116, the weld interface area 74 is inductively heated by the induction coil 22. The thermal gradient created by first cooling the first TPC 12 allows the temperature of the weld interface area 74 to exceed the consolidation temperature while maintaining the temperature of the portion 76 closest to the induction coil 22 below the consolidation temperature.

[0109] At block 118, first roller 28A and second roller 28B apply consolidation pressure to first TPC 12, merging first TPC 12 with second TPC 14 at interface area 74, thereby forming a uniform molten bond upon cooling. In another example, bellows 39 ( FIG. 1A ) or other means applies consolidation pressure onto second TPC 14. At block 120, weld interface area 74 is induction welded along weld line 26 by moving induction coil 22 along weld line 26, welding the first TPC 12 portion to the second TPC 14. Alternatively, weld interface area 74 may move relative to induction coil 22. It should be understood that blocks 116, 118, and 120 can occur simultaneously. At block 122, feedback from sensors 38 is used to adjust the induction welding process in real time. For example, the controller 30 can command different currents to the induction coil 22 and thus adjust the amount of heat in real time, command the velocity between the induction coil 22 and the weld interface area 74, and the like.

[0110] 1 and 12, a flowchart of a method 130 for induction welding a first TPC 12 to a second TPC 14 using a system 10 including a cooling device 93, a second cooling device 100, and a second induction coil 102 is shown. The method 130 begins at block 132 by aligning the first TPC 12 with the second TPC 14 to form a weld interface area 74. In the example provided, the first TPC 12 and the second TPC 14 are all placed within a vacuum bag 70. A vacuum may then be applied to the vacuum bag 70 by a vacuum source 72. Alternatively, an inert gas may be pumped into the vacuum bag 70.

[0111] Next, in block 134, the first TPC 12 is cooled using the cooling device 93. In one example, a target temperature for the first TPC 12 at the weld interface area 74 or portion 76 is set by the controller 30. The controller 30 then monitors the actual temperature of the first TPC 12 at the weld interface area 74 or portion 76 using the sensor 38 during cooling by the cooling device 93. The controller 30 then controls the amount of cooling provided by the cooling device 93 to match the actual temperature to the target temperature. The target temperature may be set using a lookup table or a given specific factor to reach a specific thermal gradient. For example, setting the target temperature may involve determining the position of the weld interface area 74 relative to the induction coil 22 and setting the target temperature based on the position of the weld interface area 74. Other factors may include the number of nozzles 96, the coolant flow rate from the nozzles 96, the distance from the cooling device 93 to the induction coil 22, the strength of the magnetic field generated by the induction coil 22, as well as the thickness of the first TPC 12 and the second TPC 14, the orientation of the carbon fibers, and the velocity of the induction coil 22 relative to the weld interface area 74. In another example, the target temperature is set to approximately -100 degrees Fahrenheit. In this context, the term "about" is known to those skilled in the art. Alternatively, the term "about" may be read to mean ±25 degrees Fahrenheit.

[0112] At block 136, the weld interface area 74 is inductively heated by the induction coil 22. The thermal gradient created by first cooling the first TPC 12 allows the temperature of the weld interface area 74 to exceed the consolidation temperature while maintaining the temperature of the portion 76 closest to the induction coil 22 below the consolidation temperature.

[0113] At block 138, first roller 28A and second roller 28B apply consolidation pressure to first TPC 12, merging first TPC 12 with second TPC 14 at interface area 74, thereby forming a uniform molten bond upon cooling. In another example, bellows 39 ( FIG. 1A ) or other means applies consolidation pressure onto second TPC 14. At block 140, weld interface area 74 is induction welded along weld line 26 by moving induction coil 22 over weld line 26, welding the first TPC 12 portion to the second TPC 14. Alternatively, weld interface area 74 may move relative to induction coil 22. It should be understood that blocks 136, 138, and 140 can occur simultaneously. At block 142, feedback from sensors 38 is used to adjust the induction welding process in real time. For example, controller 30 can command different currents to induction coil 22, thus adjusting the amount of heating in real time, commanding the rate between induction coil 22 and weld interface area 74, etc. At block 144, second cooling device 100 and / or second induction coil 102 are used to control the cooling rate of weld interface area 74. By controlling the amount of cooling and heating in real time by controller 30 based on feedback received from sensors 38 (FIG. 1), the cooling rate at weld interface area 74 is controlled.

[0114] 15 shows a cross-sectional view of a layup of the first TPC 12, second TPC 14, and vacuum bag 70 on the tooling base 16 using a heat sink 20, including a side view of the induction coil 22 and cooling device 93. In this example, the cooling device 93 cools the heat sink 20 instead of directly cooling the first TPC 12. The cooling heat sink 20 increases the thermal gradient, allowing the heat sink 20 to remove more heat from the first TPC 12 during induction welding than would be possible without cooling. In another example (not shown), a second heat sink 78 may be used in addition to the heat sink 20.

[0115] 16 shows a cross-sectional view of a layup of the first TPC 12, second TPC 14, and vacuum bag 70 on the tooling base 16 using the heat sink 20, including a side view of the cooling device 93, the second cooling device 100, and the second induction coil 102. In this example, the second cooling device 100 cools the heat sink 20 instead of directly cooling the first TPC 12 after induction welding by the induction coil 22. Because the heat sink 20 is not electrically conductive, the second induction coil 102 operates as described above. In another example (not shown), a second heat sink 78 may be used in addition to the heat sink 20.

[0116] 1 and 15, there is shown a flowchart of a method 150 for induction welding a first TPC 12 to a second TPC 14 using a system 10 including a cooling device 93 and a heat sink 20. The method 150 begins at block 152 by aligning the first TPC 12 with the second TPC 14 to form a weld interface area 74.

[0117] Next, at block 154, the heat sink 20 is placed on the first TPC 12. As described above, the heat sink 20 preferably covers at least the weld interface area 74 along the weld line 26. Because the heat sink 20 is flexible, it conforms to the surface contours of the first TPC 12, whether planar or non-planar, as shown in FIG. 2A. In the example provided, the first TPC 12, the second TPC 14, and the heat sink 20 are all placed within a vacuum bag 70. A vacuum may then be applied to the vacuum bag 70 by a vacuum source 72. Alternatively, an inert gas may be pumped into the vacuum bag 70.

[0118] At block 156, the heat sink 20 is cooled using the cooling device 93. In one example, a target temperature for the heat sink 20 is set by the controller 30. The controller 30 then monitors the actual temperature of the heat sink 20 using the sensor 38 while the cooling device 93 is cooling. The controller 30 then controls the amount of cooling provided by the cooling device 93 to match the actual temperature to the target temperature. The target temperature may be set using a lookup table or specific factors to achieve a specific thermal gradient. For example, setting the target temperature may involve determining the position of the weld interface area 74 relative to the induction coil 22 and setting the target temperature based on the position of the weld interface area 74. Other factors may include the number of nozzles 96, the coolant flow rate from the nozzles 96, the distance from the cooling device 93 to the induction coil 22, the strength of the magnetic field generated by the induction coil 22, as well as the thickness of the first TPC 12 and the second TPC 14 and the orientation of the carbon fiber. In another example, the target temperature is set to approximately -100 degrees Fahrenheit. In this context, the term "about" is known to those skilled in the art. Alternatively, the term "about" can be read to mean ±25 degrees Fahrenheit.

[0119] At block 158, the weld interface area 74 is inductively heated by the induction coil 22. The cooled heat sink 20 at block 156 maintains the temperature of the portion 76 closest to the induction coil 22 below the consolidation temperature while allowing the temperature of the weld interface area 74 to exceed the consolidation temperature.

[0120] At block 160, first roller 28A and second roller 28B apply consolidation pressure to first TPC 12, merging first TPC 12 with second TPC 14 at interface area 74, thereby forming a uniform molten bond upon cooling. In another example, bellows 39 ( FIG. 1A ) or other means applies consolidation pressure onto second TPC 14. At block 162, weld interface area 74 is induction welded along weld line 26 by moving induction coil 22 along weld line 26, welding the first TPC 12 portion to the second TPC 14. Alternatively, weld interface area 74 may move relative to induction coil 22. It should be understood that blocks 158, 160, and 162 may occur simultaneously. At block 164, feedback from sensors 38 is used to adjust the induction welding process in real time. For example, the controller 30 can command different currents to the induction coil 22, thus adjusting the amount of heating in real time, commanding the velocity between the induction coil 22 and the weld interface area 74, etc. With reference to FIG. 18 and with continued reference to FIGS. 1 and 16, a flowchart is shown of a method 170 for induction welding a first TPC 12 to a second TPC 14 using a system 10 including a heat sink 20, a cooling device 93, a second cooling device 100, and a second induction coil 102. The method 170 begins at block 172 by aligning the first TPC 12 with the second TPC 14 to form the weld interface area 74.

[0121] Next, at block 174, the heat sink 20 is placed on the first TPC 12. As described above, the heat sink 20 preferably covers at least the weld interface area 74 along the weld line 26. Because the heat sink 20 is flexible, it conforms to the surface contours of the first TPC 12, whether planar or non-planar, as shown in FIG. 2A. In the example provided, the first TPC 12, the second TPC 14, and the heat sink 20 are all placed within a vacuum bag 70. A vacuum may then be applied to the vacuum bag 70 by a vacuum source 72. Alternatively, an inert gas may be pumped into the vacuum bag 70.

[0122] At block 176, the heat sink 20 is cooled using the cooling device 93. In one example, a target temperature for the heat sink 20 is set by the controller 30. The controller 30 then monitors the actual temperature of the heat sink 20 using the sensor 38 while the cooling device 93 is cooling. The controller 30 then controls the amount of cooling provided by the cooling device 93 to match the actual temperature to the target temperature. The target temperature may be set using a lookup table or given specific factors to achieve a specific thermal gradient. For example, setting the target temperature may involve determining the position of the weld interface area 74 relative to the induction coil 22 and setting the target temperature based on the position of the weld interface area 74. Other factors may include the number of nozzles 96, the coolant flow rate from the nozzles 96, the distance from the cooling device 93 to the induction coil 22, the strength of the magnetic field generated by the induction coil 22, as well as the thickness of the first TPC 12 and the second TPC 14, the orientation of the carbon fiber, and the speed at which the induction coil 22 moves relative to the weld interface area 74. In another example, the target temperature is set to about -100 degrees Fahrenheit. In this context, the term "about" is known to those skilled in the art. Alternatively, the term "about" can be read to mean ±25 degrees Fahrenheit.

[0123] At block 178, the weld interface area 74 is inductively heated by the induction coil 22. The cooled heat sink 20 at block 176 maintains the temperature of the portion 76 closest to the induction coil 22 below the consolidation temperature while allowing the temperature of the weld interface area 74 to exceed the consolidation temperature.

[0124] At block 179, first roller 28A and second roller 28B apply consolidation pressure to first TPC 12, merging first TPC 12 with second TPC 14 at interface area 74, thereby forming a uniform molten bond upon cooling. In another example, bellows 39 ( FIG. 1A ) or other means applies consolidation pressure onto second TPC 14. At block 180, weld interface area 74 is induction welded along weld line 26 by moving induction coil 22 along weld line 26, welding the first TPC 12 portion to the second TPC 14. Alternatively, weld interface area 74 may move relative to induction coil 22. It should be understood that blocks 178, 179, and 180 may occur simultaneously. At block 182, feedback from sensors 38 is used to adjust the induction welding process in real time. For example, controller 30 can command different currents to induction coil 22, thus adjusting the amount of heating in real time, commanding the rate between induction coil 22 and weld interface area 74, etc. At block 184, second cooling device 100 and / or second induction coil 102 are used to control the cooling rate of weld interface area 74. By controlling the amount of cooling and heating in real time by controller 30 based on feedback received from sensors 38 (FIG. 1), the cooling rate at weld interface area 74 is controlled.

[0125] FIG. 19 illustrates an alternative example of a heat sink 185 according to the principles of the present disclosure. The heat sink 185 is configured to absorb and dissipate heat from the first TPC 12 and / or the second TPC 14. The heat sink 185 includes any number of tiles 186 flexibly connected by joints 187. The joints 187 are disposed between the tiles 186. The tiles 186 are substantially similar to the tiles 40, and the joints 187 are substantially similar to the joints 42 of the heat sink 20 shown in FIG. 2. However, the heat sink 185 further includes any number of fluid channels 188 formed therethrough. The fluid channels 188 extend through each of the tiles 186 and each of the joints 187. Sets of fluid channels 188 between adjacent tiles 186 and joints 187 are connected in series to form multiple fluid paths 188A through the heat sink 185. The fluid paths 188A are preferably unidirectional and parallel to each other. However, the fluid paths 188A may have other configurations, such as being non-parallel or offset. In the example provided, each tile 186 includes three fluid channels 188, although it should be understood that any number of fluid channels 188 may be used. The fluid channels 188 are sized to transmit coolant fluid therethrough, as described below. In one example, the fluid channels 188 are approximately 0.042 inches in diameter. In another example, the fluid channels 188 are approximately 0.082 inches in diameter. In one embodiment, a manifold 189 connects to the heat sink 185. To provide a single connection port to the heat sink 185, the manifold 189 includes a port 190 that communicates with the fluid channels 188 via multiple inner channels (not shown).

[0126] Figure 20 shows a flowchart of a method 200 for forming a heat sink 185 using the heat sink manufacturing system 50 of Figure 3. The method 200 begins at block 202, where a fluid channel 188 is formed through each of the tiles 186. In one example, the fluid channels 188 are cut through the tiles 186 using ultrasonic machining (not shown).

[0127] At block 204, a plurality of rods 205, shown in FIG. 21, are inserted into the fluid channels 188. The rods 193 are coated with a separating material to aid in later removal of the rods 193. The rods 193 are sized to match the diameter of the fluid channels 188. Each of the rods 193 passes through a plurality of tiles 186 with aligned fluid channels 188. At block 206, the tiles 186 are arranged in a pattern. For example, the tiles 186 are placed on the base material 54 between jigs 58. The base material 54 holds the tiles 186 in place while the jigs 58 space the tiles 186 apart. Thus, the pattern is defined by the jigs 58. The tiles 186 may be primed with a primer before being placed on the base material 54. The tiles 186 are preferably arranged so that the fluid channels 188 are aligned with one another. It should be understood that blocks 204 and 206 may be performed in any order without departing from the scope of the present disclosure.

[0128] At block 208, the frame 56 and jig 58 are removed, thus leaving gaps 44 between the tiles 186. Next, at block 210, the tiles 40 are flexibly bonded together with a flexible adhesive 45. The flexible adhesive 45 is applied into the gaps 44 between the tiles 186. The rods 205 prevent the flexible adhesive 45 from entering the fluid channels 188 formed in the tiles 186. In addition, the flexible adhesive 45 flows around the rods 205, forming the fluid channels 188 through the joints 187. The flexible adhesive 45 is then preferably allowed to cure for a period of time. Once cured, at block 212, the rods 193 are removed from the fluid channels 188. The assembled heat sink 185 may then be removed from the substrate 54.

[0129] FIG. 22 shows an enlarged, partial cross-sectional view of the system 10 illustrating the layup of the first TPC 12, the second TPC 14, and the heat sink 185 on the tooling base 16. The first TPC 12 is positioned on top of the second TPC 14. The heat sink 185 is positioned on top of the first TPC 12 between the induction coil 22 and the first TPC 12. The first roller 28A and the second roller 28B apply a consolidation pressure on the first TPC 12 through the heat sink 185, compressing the first TPC 12 onto the second TPC 14. The fluid path 188A of the heat sink 185 is connected to a pump 220 that supplies coolant to the heat sink 185. The pump 220 is configured to pump a coolant, such as water or a hot transfer fluid, through the fluid path 188A of the heat sink 185. An example of a hot transfer fluid is Dynalene SF from Dynalene. In one example, pump 220 is connected to port 190 of manifold 189 (FIG. 19).

[0130] During induction welding, the controller 30 (FIG. 1) commands current through the induction coil 22 to generate a magnetic field 25. The magnetic field 25 heats the carbon fibers in the first TPC 12 and the second TPC 14. The portion 76 of the first TPC 12 that is closer to the induction coil 22 heats to a greater extent than the weld interface area 74. The coolant is pumped through the heat sink 185 by the pump 220. Heat generated in the first TPC 12 is absorbed by the heat sink 185 and dissipated into the coolant in the fluid path 188A. The coolant is pumped from the heat sink 185 and dissipates the heat in the first TPC 12.

[0131] Once the thermoplastic at the weld interface area 74 is heated above the melting point or consolidation temperature of the material, the first roller 28A and second roller 28B exert a consolidation pressure on the first TPC 12, causing it to merge with the second TPC 14 at the weld interface area 74, thereby forming a uniform molten bond upon cooling. In one example, the weld interface area 74 is heated approximately 20 degrees above the consolidation temperature.

[0132] Once heated, the coolant is pumped back through the heat sink 185 to control the cooling rate of the weld interface area 74. In one example, the coolant is circulated back through the heat sink 185 at a temperature of approximately 400 degrees Fahrenheit after induction welding to control the cooling rate of the weld interface area 74. The input temperature and flow rate of the coolant through the heat sink 185 are adjusted along with the power supplied to the induction coil 22 to control the cooling rate of the weld interface area 74.

[0133] Controller 30 then commands robot arm 24 to move in first direction 26A (FIG. 1) along weld line 26 (FIG. 1) to weld a portion of first TPC 12 to second TPC 14. Alternatively, weld interface area 74 is moved relative to induction coil 22. Feedback from sensor 38 (FIG. 1) is used to command different currents to induction coil 22, thus adjusting the amount of heating in real time.

[0134] 23 illustrates another example of a heat sink 250 according to the principles of the present disclosure. The heat sink 250 is similar to the heat sink 185 illustrated in FIG. 19, but the fluid channels 188 are disposed within the joints 187. Thus, the fluid channels 188 are disposed between the tiles 186 rather than through them. Because the tiles 186 are not cut, they can withstand greater compressive forces than those within the heat sink 185. The fluid channels 188 can withstand the consolidation pressure during induction welding without pinching and cutting the fluid channels 188.

[0135] FIG. 24 illustrates yet another example of a heat sink 300 according to the principles of the present disclosure. The heat sink 250 is similar to the heat sink 185 illustrated in FIG. 19 , except that the fluid channels 188 are elliptical. Additionally, only one fluid channel 188 is formed in each tile 186. The elliptical fluid channel 188 reduces pressure drop and reduces the possibility of restriction within the fluid channel 188 compared to the heat sink 185. Additionally, the elliptical fluid channel 188 increases heat transfer due to the increased surface area of ​​the fluid channel 188 compared to the heat sink 185. It should be understood that other shapes, including a square or star shape, may be used without departing from the scope of the present disclosure.

[0136] 25 shows a top view of a portion of another example heat sink 400 according to the principles of the present disclosure. The heat sink 400 includes any number of tiles 402 connected by a backing 404. The tiles 402 are formed from an electrically non-electrically and thermally conductive material and are similar to the tiles 40 of the heat sink 20 (FIG. 2), but are hexagonal rather than square. However, it should be understood that the tiles 402 may have any number of sides and shapes without departing from the scope of the present disclosure. The tiles 402 are held in place by the backing 404.

[0137] The backing 404 flexibly holds the tiles 402 together and provides flexibility to the heat sink 400, allowing it to conform to curved surfaces (not shown). The tiles 402 are arranged in a parquet or geometric pattern within a single layer. Each of the tiles 402 defines a gap 406 between them. The gaps 406 are free of material. In one example, the gaps 406 have a width 407 between about 0.005 inches and about 0.1 inches, preferably about 0.040 inches. In this context, the term "about" is known to those skilled in the art. Alternatively, the term "about" may be read to mean ±0.005 inches. The gaps 406 may use airflow to enhance cooling of the tiles 402, as described below. The backing 404 is preferably a mesh composed of alternatingly oriented fibers 408, only a portion of which is shown in FIG. 25. The fibers 408 are non-conductive and do not melt during induction welding. The fibers 408 may be composed of glass or oxide ceramic and may be embedded in silicone or other materials. In another example, the backing 404 is composed of a glass fiber cloth or mesh infused with polytetrafluoroethylene (PTFE).

[0138] In one example, the heat sink 400 includes a tube 410 disposed along a longitudinal edge 412 of the heat sink 400. In one example, the tube 410 is bonded to the backing 404. In another example, the tube 410 is constructed from PTFE. Additionally or alternatively, the tube 410 may be disposed along a portion of the heat sink 400, such as a lateral edge, rather than along the longitudinal edge 412. The tube 410 is connected to a source of pressurized gas 414. The source of pressurized gas 414 may include a fan, a pump, or a pressurized tank. The source of pressurized gas 414 transmits a gas, such as air or cold CO2, through the tube 410. The tube 410 includes a hole 416 disposed therethrough. The hole 416 is aligned with the gap 406 between the tiles 402. During induction welding, the gas is supplied by the source of pressurized gas 414 and transmitted through the tube 410 and the hole 416. The gas then passes through the gap 406 , absorbing and dissipating heat from the tiles 402 .

[0139] FIG. 26 shows a partial cross-sectional view of a heat sink 400. The tiles 402 are attached to the backing 404 by an adhesive 420. Because the backing 404 is flexible, the adhesive 420 does not need to be flexible. Examples of suitable adhesives include silicone, PTFE, polybenzimidazole (PBI), high-performance polyamide (HPPA), polyamide (PI), polyamidimide (PAI), polyketone, polysulfone derivative-a, fluoropolymer, polyetherimide (PEI), polybutylene terephthalate (PBT), polyphenylene sulfide, syndiotactic polystyrene, and polycyclohexanedimethylterephthalate (PCT). Another example of a suitable adhesive is a two-component, heat-cured epoxy system having a liquid resin and a powder hardener. For example, the adhesive can be EPOXYLITE® 5403 or EPOXYLITE® 5302 from Elantas PDG, Inc. In another example, adhesive 420 can be a silicone pressure sensitive adhesive. In another example, adhesive 420 is comprised of the same type of silicone used in joint 42 (FIG. 2) of heat sink 20. FIG. 27 shows a cross-sectional view of an alternative heat sink 450 in which tiles 402 are embedded within adhesive 420. In this example, void 406 is filled with adhesive 420.

[0140] 28 and 29 show partial cross-sectional views of a system 500 for induction welding a first TPC 12 to a second TPC 14 using a heat sink 400. The system 500 operates in a manner similar to the system 10 (FIG. 1) described above. In the example shown, the first TPC 12 and the second TPC 14 are bent, such that the first TPC 12 defines a bent contact surface 502. The first TPC 12 and the second TPC 14 are supported by a bent tooling base 504. During induction welding, consolidation pressure is applied through the bent tooling base 504 by a bellows 506. Alternatively, a pneumatic cylinder or a mechanical actuator such as a spring, strap, or lever may be used to apply the consolidation pressure.

[0141] The heat sink 400 is positioned on the first TPC 12 between the induction coil 22 and the second TPC 14. The backing 404 is curved to allow the tiles 402 to contact the curved contact surface 502. The contact between the tiles 402 and the curved contact surface 502 maximizes heat transfer. In another example (not shown), the backing 404 is infused with PTFE, which contacts the curved contact surface 502. The PTFE allows the backing 404 to act as an isolation membrane, preventing the heat sink 400 from adhering to the first TPC 12 during induction welding.

[0142] The heat sink 400 is held in place by a heat sink holder 508. Alternatively, or additionally, a vacuum bag 70 (FIG. 1) may be used to maintain the heat sink 400 in contact with the curved contact surface 502. In one example, shown in FIG. 28, a void 510 is formed opposite the weld interface area 74 only when the backing 404 is bent. In this example, airflow is not used to aid in cooling the tile 402, and the heat sink may only accommodate curved surfaces in two dimensions (i.e., x and y coordinates). In another example, shown in FIG. 29, a void 512 is also formed adjacent the curved contact surface 502 as the backing 404 is bent. In this example, airflow is used through the voids 510, 512 to aid in cooling the tile 402. Additionally, the heat sink 400 may accommodate curved surfaces in three dimensions (i.e., x, y, and z coordinates). Induction welding is performed in a manner similar to that described above with reference to FIG.

[0143] The above-described systems 10 and 500, heat sinks 20, 185, 250, 300, and 400, and methods 60, 80, 110, 130, 150, and 170 all operate to control the induction heating of the first TPC 12 and second TPC 14 and to localize the heating along the weld interface area 74. Thus, temperatures exceeding the consolidation temperature are avoided in the portion 76 of the first TPC 12 closest to the induction coil 22, as well as in the portion 88 of the second TPC 14.

[0144] Aspects of systems 10 and 500 and methods 60, 80, 110, 130, 150, and 170 may be used in the context of an aircraft manufacturing and service method 1000 shown in FIG. 30 and an aircraft 1002 shown in FIG. 31. During pre-production, the example method 1000 may include specification and design 1004 of the aircraft 1002 and material procurement 1006. During production, component and subassembly manufacturing 1008 and system integration 1010 of the aircraft 1002 occurs. The aircraft 1002 may then undergo certification and delivery 1012 and be placed into service 1014. While in operation by a customer, the aircraft 1002 is scheduled for routine maintenance and service 1016, which may include modification, reconfiguration, refurbishment, etc. Apparatus and methods embodied herein may be used at any suitable stage or stages of manufacturing and maintenance described in method 1000 (e.g., specification and design 1004, materials procurement 1006, component and subassembly manufacturing 1008, system integration 1010, certification and delivery 1012, operation 1014, maintenance and service 1016) and / or at any suitable component of aircraft 1002 (e.g., airframe 1018, systems 1020, interior 1022, propulsion system 1024, electrical system 1026, hydraulic system 1028, environmental system 1030).

[0145] Each process of the systems and methods described herein may be implemented or performed by a system integrator, a third party, and / or an operator (e.g., a customer). For purposes of this specification, a system integrator includes, but is not limited to, any number of aircraft manufacturers and major system subcontractors; a third party includes, but is not limited to, any number of vendors, subcontractors, and suppliers; and an operator may be an airline, leasing company, military organization, service organization, etc.

[0146] 31 , an aircraft 1002 produced by exemplary method 1000 may include an airframe 1018 with a number of systems 1020 and an interior 1022. Examples of systems 1020 include one or more of a propulsion system 1024, an electrical system 1026, a hydraulic system 1028, and an environmental system 1030. Any number of other systems may also be included. While an aerospace example is shown, the principles of the present disclosure may be applied to other industries, such as the automotive industry.

[0147] The systems and methods described above may be used during any one or more of the stages of example method 1000. For example, components or subassemblies corresponding to component and subassembly manufacturing 1008 may be fabricated or manufactured in a manner similar to components or subassemblies manufactured while the aircraft 1002 is in service. Also, one or more apparatus aspects, method aspects, or a combination thereof may be utilized during component and subassembly manufacturing 1008 and system integration 1010, such as by substantially streamlining the assembly of or reducing the cost of the aircraft 1002. Similarly, one or more of the apparatus aspects, method aspects, or a combination thereof may be utilized while the aircraft 1002 is in service, such as, without limitation, during maintenance and service 1016. For example, the techniques and systems described herein may be used for material procurement 1006, component and subassembly manufacturing 208, system integration 1010, service 1014, and / or maintenance and maintenance 1016, and / or may be used in the airframe 1018 and / or interior 1022. These techniques and systems may further be utilized in systems 1020, including, for example, propulsion system 1024, electrical system 1026, hydraulic system 1028, and / or environmental system 1030.

[0148] The description of the present disclosure is merely exemplary in nature, and variations that do not depart from the gist of the disclosure are intended to be within the scope of the disclosure. Such variations should not be considered a departure from the spirit and scope of the disclosure.

Claims

1. A heat sink (20) for use in welding, comprising: any number of electrically non-electrically and thermally conductive tiles (40); a mechanical hinge (47) that flexibly joins the tiles (40) together in a single layer; Equipped with the mechanical hinge (47) includes a tab (65) pivotally disposed within a slot (67); The tiles (40) include a first tile (40A) having a side (68), and the tab (65) is disposed on the side (68) of the first tile (40A); the tile (40) includes a second tile (40B) having a side (68), the slot (67) being disposed on the side (68) of the second tile (40B); The first tile (40A) is connected to the second tile (40B) by inserting the tab (65) into the slot (67); The tabs (65) and the slots (67) are configured to allow the first tile (40A) to pivot relative to the second tile (40B).

2. The first tile (40A) and the second tile (40B) each have four sides, said first tile (40A) having one said tab (65) on each of said four sides; said second tile (40B) having one said slot (67) on each of said four sides; the first tile (40A) and the second tile (40B) are arranged in a single layer; The heat sink (20) of claim 1, wherein the first tiles (40A) and the second tiles (40B) are arranged in an alternating pattern.

3. The heat sink (20) of claim 1, wherein the heat sink (20) has a thermal diffusivity greater than 25 mm 2 / sec.

4. A heat sink (20) as described in claim 1, wherein the tile (40) is made of aluminum nitride.

5. The heat sink (20) of any one of claims 1 to 4, wherein the welding is induction welding.

6. The heat sink (20) of any one of claims 1 to 5, wherein the mechanical hinge (47) comprises an interlocking of the tiles.

7. A heat sink (20) as described in claim 1, wherein the tiles are made of beryllium oxide.

Citation Information

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