Electronic Components Unit

Abstract

To provide an electronic component unit capable of securing proper reliability.SOLUTION: An electronic component unit 1 includes: a substrate 10 formed in a plate shape; an electronic component 20 electrically connected to a mounting surface 11 of the substrate 10 via a solder part; a substrate holding unit 41 for holding the substrate 10; and a holder 40 including an electronic component holding unit 43 for holding the electronic component 20. The electronic component holding unit 43 includes a plurality of cantilever supporting beam units 43a that are each formed in a cantilever shape from the substrate holding unit 41 and hold and elastically support the electronic component 20 in directions D1 and D2 along the mounting surface 11.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to an electronic component unit. [Background technology]

[0002] For example, Patent Document 1 discloses a rotation sensor in which a permanent magnet, a Hall IC, and a circuit board carrying electronic components for controlling the Hall IC are housed in a metal case. In this rotation sensor, the metal case is cylindrical, and the circuit board is fixed in the metal case by a holder so that the central plane of the circuit board in the thickness direction is positioned to pass through the center of the cylindrical metal case. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2002-221529 Summary of the Invention [Problem to be solved by the invention]

[0004] However, the rotation sensor described in Patent Document 1 has room for further improvement in terms of ensuring the reliability of the connection between the Hall IC and the substrate, for example, when expansion or contraction occurs due to temperature changes caused by heat generation.

[0005] The present invention has been made in view of the above circumstances, and has an object to provide an electronic component unit that can ensure appropriate reliability. [Means for solving the problem]

[0006] In order to achieve the above-mentioned object, the electronic component unit of the present invention comprises a substrate formed in a plate shape, electronic components electrically connected to the mounting surface of the substrate via solder portions, a substrate holding portion for holding the substrate, and a holder including electronic component holding portions for holding the electronic components, wherein the electronic component holding portions are each formed in a cantilevered shape from the substrate holding portion and include a plurality of cantilever support beam portions that clamp and elastically support the electronic components in a direction along the mounting surface. [Effects of the Invention]

[0007] The electronic component unit according to the present invention has an effect of ensuring appropriate reliability. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view illustrating a schematic configuration of an electronic component unit according to an embodiment. [Figure 2] FIG. 2 is an exploded perspective view illustrating a schematic configuration of the electronic component unit according to the embodiment. [Figure 3] FIG. 3 is a front view of a holder included in the electronic component unit according to the embodiment. [Figure 4] FIG. 4 is a partial cross-sectional perspective view including an electric wire holding portion of a holder provided in the electronic component unit according to the embodiment. [Figure 5] FIG. 5 is a partial perspective view including an electronic component holding portion of a holder included in the electronic component unit according to the embodiment. [Figure 6] FIG. 6 is a partial perspective view including an electronic component holding portion of a holder included in the electronic component unit according to the embodiment. [Figure 7] FIG. 7 is a partial cross-sectional perspective view including an electronic component holding portion of a holder included in the electronic component unit according to the embodiment. [Figure 8] FIG. 8 is a partial cross-sectional perspective view including an electronic component holding portion of a holder included in the electronic component unit according to the embodiment. [Figure 9] FIG. 9 is a partial perspective view including an electric wire holding portion of a holder provided in an electronic component unit according to a modified example. [Figure 10] FIG. 10 is a partial cross-sectional perspective view including an electric wire holding portion of a holder provided in an electronic component unit according to a modified example. [Figure 11] FIG. 11 is a partial cross-sectional perspective view including an electric wire holding portion of a holder provided in an electronic component unit according to a modified example. [Figure 12] FIG. 12 is a partial perspective view including an electric wire holding portion of a holder provided in an electronic component unit according to a modified example. [Figure 13] FIG. 13 is a partial perspective view including an electric wire holding groove of a holder provided in an electronic component unit according to a modified example. [Figure 14] FIG. 14 is a partial perspective view including an electric wire holding groove of a holder provided in an electronic component unit according to a modified example. [Figure 15] FIG. 15 is a partial front view including an electric wire holding groove of a holder provided in an electronic component unit according to a modified example. [Figure 16] FIG. 16 is a partial front view including an electric wire holding groove of a holder provided in an electronic component unit according to a modified example. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to these embodiments. Furthermore, the components in the following embodiments include those that are easily replaceable by those skilled in the art, or those that are substantially the same.

[0010] [Embodiment] The electronic component unit 1 according to this embodiment, shown in FIGS. 1 and 2, is typically mounted on a vehicle and constitutes a unit that realizes various functions. As an example, the electronic component unit 1 constitutes a rotation sensor for detecting the rotation speed of a rotating shaft of a rotating electric machine, such as a motor / generator, mounted on the vehicle. The electronic component unit 1 of this embodiment is configured such that an electronic component 20, electrically connected to a substrate 10, is held together with the substrate 10 in a holder 40, and an electronic component holding portion 43 is added to the holder 40 to properly hold the electronic component 20. With this configuration, the electronic component unit 1 can properly ensure the reliability of the connection between the substrate 10 and the electronic component 20, even if the holder 40 expands or contracts due to temperature changes caused by heat generation. The configuration of the electronic component unit 1 will be described in detail below with reference to the accompanying drawings.

[0011] 1, 2, and 3, the electronic component unit 1 includes a substrate 10, an electronic component 20, an electric wire 30, and a holder 40. The electronic component unit 1 of this embodiment is configured to hold the end of the electric wire 30 in the holder 40 together with the substrate 10 and the electronic component 20, and is unitized.

[0012] The substrate 10 constitutes an electronic circuit board formed in a plate shape. Electronic components 20 and electric wires 30 are electrically connected to the substrate 10. As an example, the substrate 10 is constituted by a flexible printed circuit (FPC), which is a flexible, plate-like planar circuit body. In this case, the substrate 10 is constituted by laminating, for example, a flexible base film, a conductor layer (printed circuit body), a reinforcing protective film, and the like. The electronic components 20 are mounted on a mounting surface 11 that constitutes the main surface of the substrate 10, and an electronic circuit that electrically connects these components is constituted.

[0013] The substrate 10 of this embodiment is formed in a generally arc-shaped plate (generally fan-shaped) overall. The substrate 10 includes a boss insertion hole 12 and through holes 13 and 14. The boss insertion hole 12 and the through holes 13 and 14 are formed to penetrate the substrate 10 along a normal direction DN of the mounting surface 11. This normal direction DN of the mounting surface 11 is a direction along the normal to the mounting surface 11, and typically corresponds to the thickness direction of the substrate 10, which is formed in a plate shape. In other words, the boss insertion hole 12 and the through holes 13 and 14 penetrate the substrate 10 along the thickness direction.

[0014] The boss insertion hole 12 is a hole for holding a board, through which the boss portion 41b of the holder 40 is inserted and held by the boss portion 41b. Three boss insertion holes 12 are provided, one at each end and one at the center of the arc-shaped board 10. The through holes 13 are holes for mounting electronic components, through which the lead terminals 22 of the electronic components 20 are inserted and electrically connected via solder portions 16. Nine through holes 13 are provided, three on each of the protruding portions 15 formed to protrude radially outward from the boss insertion hole 12. The through holes 14 are holes for mounting electric wires, through which the core wires 31 of the electric wires 30 are inserted and electrically connected via solder portions 17. Five through holes 14 are provided between the boss insertion hole 12 located in the center of the board 10 and the boss insertion hole 12 located at one end of the board 10.

[0015] The electronic components 20 are electrically connected and mounted on the mounting surface 11 of the substrate 10 via solder portions 16, and are elements that perform various functions. For example, the electronic components 20 are configured as components of a rotation sensor, such as Hall ICs (magnetic sensors) that detect magnetic fields that change with the rotation of the rotating shaft of a rotating electrical machine. Here, a total of three electronic components 20 are provided, each having a lead terminal 22 protruding from a main body 21 formed in a substantially rectangular box shape. Three lead terminals 22 are provided in each electronic component 20. The lead terminals 22 of the electronic components 20 are inserted one by one into each through hole 13 along the normal direction DN, and the inserted ends are electrically connected to the circuit body of the substrate 10 by soldering via the solder portions 16. This electrically connects the lead terminals 22 of the electronic components 20 to the substrate 10.

[0016] The electric wires 30 are wiring materials that are electrically connected to and mounted on the mounting surface 11 of the substrate 10 via solder portions 17. The electric wires 30 are, for example, insulated electric wires in which a core wire 31, which is a bundle of conductive metal wires, is covered with an insulating covering portion 32 having insulating properties. Here, a total of five electric wires 30 are provided, and the insulating covering portion 32 is stripped off from the end connected to the substrate 10, so that the end of the core wire 31 is exposed from the insulating covering portion 32. The exposed ends of the core wires 31 of the electric wires 30 are inserted into the through holes 14 one by one along the normal direction DN, and the inserted ends of the core wires 31 are electrically connected to the circuit body of the substrate 10 by soldering via the solder portions 17. The electric wires 30 are also electrically connected to a sensor calculation unit such as an ECU (Electronic Control Unit) via a connector (not shown) or the like provided at the other end of the electric wires 30. As a result, the electric wire 30 electrically connects the substrate 10 on which the electronic component 20 is mounted as described above to the sensor calculation unit.

[0017] The holder 40 holds the board 10, the electronic components 20, and the electric wires 30. Specifically, the holder 40 includes a board holding portion 41, an electric wire holding portion 42, and an electronic component holding portion 43, which are integrally formed from an insulating resin material.

[0018] The substrate holding portion 41 is a portion of the holder 40 that holds the substrate 10. The substrate holding portion 41 includes a main body portion 41a and a boss portion 41b. The main body portion 41a constitutes a base portion of the holder 40. The main body portion 41a is formed in a shape and size corresponding to the substrate 10 and is positioned opposite the substrate 10 along the normal direction DN. In this embodiment, the main body portion 41a is formed in a generally arc-shaped plate (generally fan-shaped) shape overall to correspond to the shape of the substrate 10. The boss portion 41b is a portion that is inserted into the boss insertion hole portion 12 of the substrate 10 and holds the substrate 10. Three boss portions 41b are provided, one at each end and one at the center of the arc-shaped main body portion 41a, to correspond to the boss insertion hole portion 12. Each boss portion 41b is formed to protrude from the main body portion 41a along the normal direction DN toward the side where the substrate 10 is located. Each boss portion 41b is formed by three flexible pieces coming together to form a generally cylindrical shape as a whole. Each boss portion 41b has a stepped shape at its base end and a holding claw at its tip end. In the board holding portion 41, the boss portions 41b are inserted one by one into the boss insertion holes 12 of the board 10, and the board 10 is sandwiched and held between the stepped shape of the boss portion 41b and the holding claw. In the board holding portion 41 configured as described above, with the board 10 held by the boss portions 41b, a gap is created between the board 10 and the main body portion 41a along the normal direction DN.

[0019] The electric wire holding portion 42 is a portion of the holder 40 that holds the end of the electric wire 30. As shown in FIGS. 1, 2, 3, and 4, the electric wire holding portion 42 is configured to include an electric wire insertion and bundling portion 42a. The electric wire 30 is inserted through the electric wire insertion and bundling portion 42a, and the electric wire 30 is bound and fixed by a bundling band 42b. The electric wire insertion and bundling portion 42a is provided between a boss portion 41b located in the center of the main body portion 41a of the board holding portion 41 and a boss portion 41b located at one end of the main body portion 41a. The electric wire insertion and bundling portion 42a is formed to protrude from the main body portion 41a of the board holding portion 41 toward the side where the board 10 is located along the normal direction DN (in other words, the side from which the boss portion 41b protrudes). The electric wire insertion and bundling portion 42a is formed in a substantially elongated cylindrical shape, and has an electric wire insertion hole 42c formed therein. The wire insertion hole 42c is formed by penetrating the wire insertion and bundling portion 42a along the normal direction DN. The wire insertion hole 42c can hold the wire 30 in a state in which the wire 30 is inserted therethrough along the normal direction DN. A plurality of wire insertion holes 42c are provided according to the number of wires 30, and five wire insertion holes 42c are formed side by side along the arc shape of the main body portion 41a in this example. In the wire holding portion 42 configured as described above, the end of the wire 30 on the connection side with the board 10 (the end on the side where the core wire 31 is exposed) is inserted into and held in the wire insertion hole 42c, and is also folded back along the normal direction DN on the side opposite to the board 10. In this state, a cable tie 42b is wound around the outer peripheral surface of the wire insertion and bundling portion 42a of the wire holding portion 42, whereby the wire 30 is bound and fixed by the cable tie 42b.

[0020] The electronic component holding portion 43 is a portion of the holder 40 that holds the electronic components 20. A plurality of electronic component holding portions 43 are provided according to the number of electronic components 20. In this embodiment, three electronic component holding portions 43 are formed side by side at intervals along the arc shape of the main body portion 41a. In this embodiment, a total of three electronic component holding portions 43 are provided in the holder 40, one at each position facing each of the protruding portions 15 of the substrate 10 in the normal direction DN (portions located radially outward of the boss insertion hole portions 12 on the substrate 10, where each through hole 13 is formed). Note that the three electronic component holding portions 43 have substantially the same configuration, and therefore will be described in common below.

[0021] 1, 2, 3, 5, and 6, the electronic component holding portion 43 is configured to include a plurality of cantilever support beams 43a, which elastically support the main body 21 of the electronic component 20. Each of the cantilever support beams 43a is formed in a cantilevered shape from the main body 41a of the board holding portion 41, and is a portion that sandwiches and elastically supports the main body 21 of the electronic component 20 in the direction along the mounting surface 11.

[0022] More specifically, the multiple cantilever support beams 43a include a pair of first cantilever support beams 43aa and a pair of second cantilever support beams 43ab. The pair of first cantilever support beams 43aa are positioned opposite each other across the main body 21 of the electronic component 20 in a first direction D1 along the mounting surface 11, and sandwich and elastically support the main body 21 in the first direction D1 (see particularly FIGS. 3, 5, 6, etc.). On the other hand, the pair of second cantilever support beams 43ab are positioned opposite each other across the main body 21 of the electronic component 20 in a second direction D2 that intersects with the first direction D1 along the mounting surface 11, and sandwich and elastically support the main body 21 in the second direction D2 (see also FIGS. 3, 5, 6, etc.).

[0023] Here, the first direction D1 and the second direction D2 are both directions along the mounting surface 11 and are typically directions perpendicular to the normal direction DN of the mounting surface 11. The first direction D1 typically corresponds to a direction perpendicular to a tangent to an arc at a position on the main body 41a where the electronic component holding portion 43 is arranged. On the other hand, the second direction D2 typically corresponds to a direction along a tangent to an arc at a position on the main body 41a where the electronic component holding portion 43 is arranged.

[0024] The pair of first cantilever support beams 43aa are positioned opposite each other with a gap in the first direction D1, extend in opposite directions along the second direction D2, and are supported by the main body 41a. That is, one of the first cantilever support beams 43aa has a base end, which is an end on one side in the second direction D2, supported by the main body 41a via the base end support portion 43b and the like, and a tip end, which is an end on the other side in the second direction D2, that is a free end. The other of the first cantilever support beams 43aa has a base end, which is an end on the other side in the second direction D2, supported by the main body 41a via the base end support portion 43c and the like, and a tip end, which is an end on one side in the second direction D2, that is a free end. As a result, both of the pair of first cantilever support beams 43aa are supported in a cantilevered manner by the main body 41a of the substrate holding unit 41 so as to be elastically deformable along the first direction D1.

[0025] The pair of second cantilever support beam portions 43ab are positioned opposite to each other with a gap in the second direction D2, extend in opposite directions along the first direction D1, and are supported by the main body portion 41a. That is, one second cantilever support beam portion 43ab has a base end portion, which is an end portion on one side in the first direction D1, supported by the main body portion 41a via the base end support portion 43b, etc., and a tip portion, which is an end portion on the other side in the first direction D1, which is a free end. In this case, the tip portion of the one second cantilever support beam portion 43ab is positioned with a gap between it and one first cantilever support beam portion 43aa in the first direction D1, and the entire second cantilever support beam portion 43ab is positioned with a gap between the tip end of the other first cantilever support beam portion 43aa and the base end support portion 43b in the second direction D2. The other second cantilever support beam 43ab has a base end, which is the end on the other side in the first direction D1, supported by the main body 41a via the base end support portion 43c, the extension portion 43d, etc., and a tip end, which is the end on one side in the first direction D1, which is a free end. In this case, the tip end of the other second cantilever support beam 43ab is positioned with a gap between it and the other first cantilever support beam 43aa in the first direction D1, and the entire second cantilever support beam 43ab is positioned with a gap between it and the base end support portion 43c in the second direction D2. As a result, both of the pair of second cantilever support beams 43ab are supported in a cantilevered manner by the main body 41a of the substrate holder 41 so as to be elastically deformable along the second direction D2.

[0026] The electronic component holding portion 43 has a space surrounded on all four sides by the pair of first cantilever support beams 43aa and the pair of second cantilever support beams 43ab formed as described above, which functions as a holding space 43e for holding the main body 21 of the electronic component 20. The electronic component 20 is assembled by press-fitting the main body 21 into this holding space 43e along the normal direction DN. The electronic component holding portion 43 configured as described above resiliently supports the main body 21 of the electronic component 20 assembled in this holding space 43e by sandwiching it between the pair of first cantilever support beams 43aa and the pair of second cantilever support beams 43ab.

[0027] 5, 6, 7, and 8, each of the cantilever support beams 43a (first cantilever support beam 43aa, second cantilever support beam 43ab) of this embodiment has a support protrusion 43f. The support protrusion 43f is formed to protrude from each cantilever support beam 43a toward the retention space 43e, and is a portion that supports the main body 21 of the electronic component 20 between itself and the board 10 in the normal direction DN of the mounting surface 11. In each of the pair of first cantilever support beams 43aa, the support protrusion 43f protrudes from each first cantilever support beam 43aa toward the retention space 43e along the first direction D1 and extends along the second direction D2. Furthermore, in the pair of second cantilever support beams 43ab, the support protrusions 43f are formed so as to protrude from each second cantilever support beam 43ab toward the holding space 43e in the second direction D2 and extend along the first direction D1. With this configuration, before the lead terminals 22 of the electronic component 20 are soldered to the substrate 10, the electronic component holding portion 43 can properly support the main body 21 of the electronic component 20 assembled in the holding space 43e between the electronic component 20 and the substrate 10 using the support protrusions 43f.

[0028] In the electronic component unit 1 configured as described above, the end of the electric wire 30 on the side where the core wire 31 is exposed is inserted into the electric wire insertion hole 42c of the electric wire holding portion 42 and folded back toward the outer peripheral surface of the electric wire insertion and bundling portion 42a, and the end of the electric wire 30 is bound and fixed with the binding band 42b. This allows the electronic component unit 1 to hold the end of the electric wire 30 in the electric wire holding portion 42 in the holder 40. Furthermore, in the electronic component unit 1, the main body 21 of the electronic component 20 is press-fitted into the holding space 43e of the electronic component holding portion 43 along the normal direction DN, whereby the main body 21 is sandwiched and elastically supported by the multiple cantilever support beams 43a, here a pair of first cantilever support beams 43aa and a pair of second cantilever support beams 43ab. This allows the electronic component unit 1 to hold the main body 21 of the electronic component 20 in the electronic component holding portion 43 in the holder 40.

[0029] In this state, the electronic component unit 1 is mounted on the holder 40 with the board 10 in a positional relationship in which the core wires 31 of the electric wires 30 held by the electric wire holding portions 42 are inserted into the through holes 14, the lead terminals 22 of the electronic components 20 held by the electronic component holding portions 43 are inserted into the through holes 13, and the boss portions 41b of the board holding portions 41 are inserted into the boss insertion holes 12. This allows the electronic component unit 1 to hold the board 10 on the board holding portions 41 in the holder 40. In this state, the electronic component unit 1 can be positioned such that the lead terminals 22 of the electronic components 20 are positioned in an appropriate positional relationship with respect to the board 10 during soldering, as the main body portions 21 of the electronic components 20 mounted in the holding spaces 43e are supported by the support protrusions 43f formed on the cantilever support beams 43a.

[0030] In the electronic component unit 1, the lead terminals 22 inserted into the through holes 13 and the ends of the core wires 31 of the electric wires 30 inserted into the through holes 14 are soldered to the board 10. As a result, in the electronic component unit 1, the lead terminals 22 of the electronic components 20 and the board 10 are electrically connected via the solder portions 16, and the core wires 31 of the electric wires 30 and the board 10 are electrically connected via the solder portions 17.

[0031] In the electronic component unit 1 configured in this manner, the electric wires 30 are bound and fixed by the cable ties 42b in the electric wire holding portion 42 of the holder 40, which makes it possible to reduce the stress load acting on the solder portion 17 between the core wire 31 of the electric wire 30 and the board 10. This allows the electronic component unit 1 to properly ensure the reliability of the solder portion 17, and makes it possible to prevent, for example, the electric wires 30 from coming loose.

[0032] The electronic component unit 1 configured as described above expands and contracts in various parts in response to temperature changes due to heat generation, for example, from the rotating electrical machine that is the object of rotation speed detection. In this case, due to the difference in thermal expansion coefficients between the substrate 10 and the holder 40, the amount of expansion and contraction of the holder 40 tends to be relatively large and the amount of expansion and contraction of the substrate 10 tends to be relatively small. In other words, when the electronic component unit 1 expands and contracts in response to temperature changes, the amount of deformation differs between the substrate 10 and the holder 40, which causes relative displacement between the substrate 10 and the holder 40.

[0033] At this time, in the electronic component unit 1, the board 10 is positioned and held by the boss portion 41b of the board holding portion 41 of the holder 40, while the electronic component 20 is elastically supported and held by the multiple cantilever support beams 43a of the electronic component holding portion 43 of the holder 40. Therefore, in the electronic component unit 1, each cantilever support beam 43a supporting the electronic component 20 elastically deforms in response to relative displacement between the board 10 and the holder 40, so that even if the board 10 and the holder 40 are displaced relative to each other, the electronic component 20 held on the holder 40 side can be made to follow the board 10 side. As a result, the electronic component unit 1 can prevent the position of the lead terminal 22 of the electronic component 20 from being displaced relative to the position of the through hole 13 of the board 10, and can reduce the stress load acting on the solder portion 16 between the lead terminal 22 and the board 10.

[0034] In the electronic component unit 1 described above, the substrate 10 is held by the substrate holding portion 41 of the holder 40, and the electronic component 20 is elastically supported and held by the electronic component holding portion 43 of the holder 40 via the multiple cantilever support beams 43a. With this configuration, even if expansion and contraction occurs in various parts of the electronic component unit 1 due to temperature changes caused by heat generation or the like, the cantilever support beams 43a supporting the electronic component 20 can elastically deform in response to relative displacement between the substrate 10 and the holder 40. As a result, even if the substrate 10 and the holder 40 are relatively displaced in response to temperature changes due to differences in thermal expansion coefficients, the electronic component unit 1 can cause the electronic component 20 held on the holder 40 side to follow the substrate 10 side. As a result, the electronic component unit 1 can prevent the position of the lead terminal 22 of the electronic component 20 from being displaced relative to the position of the through hole 13 of the substrate 10, thereby reducing the stress load acting on the solder portion 16 between the lead terminal 22 and the substrate 10 and, for example, preventing the occurrence of solder cracks, etc.

[0035] As described above, the electronic component unit 1 can ensure appropriate reliability even when expansion and contraction occur in various parts due to temperature changes caused by heat generation or the like.

[0036] More specifically, the electronic component unit 1 described above includes a pair of first cantilever support beams 43aa and a pair of second cantilever support beams 43ab as the multiple cantilever support beams 43a. The electronic component unit 1 sandwiches and elastically supports the electronic component 20 between the pair of first cantilever support beams 43aa in a first direction D1 along the mounting surface 11, and sandwiches and elastically supports the electronic component 20 between the pair of second cantilever support beams 43ab in a second direction D2 along the mounting surface 11. With this configuration, the electronic component unit 1 can sandwich and elastically support the electronic component 20 in the first direction D1 and the second direction D2 along the mounting surface 11, in which the amount of relative displacement between the board 10 and the holder 40 due to temperature changes tends to become relatively large. As a result, even if the substrate 10 and holder 40 are displaced relative to each other in a direction along the mounting surface 11 due to a temperature change, the electronic component unit 1 can cause the electronic component 20 held on the holder 40 side to move toward the substrate 10 in the first direction D1 and the second direction D2. This allows the electronic component unit 1 to reduce the stress load acting on the solder portion 16 between the lead terminal 22 and the substrate 10 as described above, thereby ensuring appropriate reliability.

[0037] Furthermore, the electronic component unit 1 described above has support protrusions 43f on each cantilever support beam 43a (first cantilever support beam 43aa, second cantilever support beam 43ab). This configuration allows the electronic component 20 held by the electronic component holder 43 to be positioned in a proper positional relationship with respect to the substrate 10 before the lead terminals 22 of the electronic component 20 are soldered to the substrate 10. As a result, the electronic component unit 1 can position the electronic component 20 at a position where it can be properly soldered to the substrate 10 without using a positioning jig or the like, and then actually solder the electronic component 20 to the substrate 10. This allows the electronic component unit 1 to improve assembly workability and ensure the proper reliability as described above.

[0038] In the electronic component unit 1 described above, the electronic component holding portion 43 is provided adjacent to the radially outer side of the boss portion 41b, where relative displacement itself is relatively unlikely to occur between the board 10 and the holder 40. Therefore, in the electronic component unit 1, the solder portion 16 that connects the electronic component 20 held by the electronic component holding portion 43 to the board 10 can be provided near the boss portion 41b, where relative displacement between the board 10 and the holder 40 is relatively unlikely to occur. In this respect, the electronic component unit 1 can reduce the stress load acting on the solder portion 16, and ensure appropriate reliability.

[0039] The electronic component unit according to the embodiment of the present invention described above is not limited to the above embodiment, and various modifications are possible within the scope of the claims.

[0040] In the above description, the electronic component unit 1 has been described as constituting a rotation sensor, but is not limited to this. In the above description, the electronic component 20 has been described as being constituted by a Hall IC constituting a rotation sensor, but is not limited to this. The electronic component 20 may be any component that can be mounted on the substrate 10, such as a capacitor, a relay, a resistor, a transistor, a fuse, a connector, an IPS (Intelligent Power Switch), or an electronic control unit including a microcomputer.

[0041] In the above description, the substrate 10 has been described as being made up of a flexible printed circuit board, but this is not limiting. The substrate 10 may also be made up of a more rigid so-called printed circuit board (PCB).

[0042] In the above description, the substrate 10 and the holder 40 are described as being formed in a generally arcuate plate shape (generally sector-shaped) as a whole, but are not limited to this and may be formed in, for example, a generally rectangular plate shape.

[0043] In the above description, the cantilever support beam portion 43a (first cantilever support beam portion 43aa, second cantilever support beam portion 43ab) has been described as having the support protrusion portion 43f, but this is not limiting.

[0044] In the above description, the electric wire holding portion 42 has been described as having a structure using the binding band 42b, but the present invention is not limited to this.

[0045] An electronic component unit 201 according to a modified example shown in Figures 9, 10, and 11 differs from the above-described electronic component unit 1 in that the holder 40 has an electric wire holding portion 242 instead of the electric wire holding portion 42. Other configurations of the electronic component unit 201 are substantially the same as those of the above-described electronic component unit 1. In the following, common reference numerals are used to designate components that are the same as those in the above-described embodiment, and redundant explanations of common configurations, actions, and effects will be omitted as much as possible (the same applies hereinafter).

[0046] Similar to the electric wire holding portion 42, the electric wire holding portion 242 is a portion of the holder 40 that holds the end of the electric wire 30. Unlike the electric wire holding portion 42, the electric wire holding portion 242 of this modified example is configured not to use the cable tie 42b. Also, unlike the electric wire holding portion 42, the electric wire holding portion 242 of this modified example is configured to hold the electric wire 30 without folding it back along the normal direction DN. That is, the direction in which the electric wire 30 is routed from the substrate 10 in the electronic component unit 201 is different from that in the electronic component unit 1 described above.

[0047] Specifically, the electric wire holding portion 242 includes an electric wire insertion portion 242a, an electric wire receiving portion 242b, a fixing pin 242c, and a pin receiving portion 242d.

[0048] The electric wire insertion portion 242a is a portion through which the electric wire 30 is inserted. The electric wire insertion portion 242a is formed in a substantially rectangular pillar shape facing the board 10 along the normal direction DN, and has an electric wire insertion hole 242e formed therein (see also FIG. 12 described later). The electric wire insertion hole 242e is formed by penetrating the electric wire insertion portion 242a along the normal direction DN. The electric wire insertion hole 242e can hold the electric wire 30 in a state in which the electric wire 30 is inserted therein along the normal direction DN. A plurality of electric wire insertion holes 242e are provided according to the number of electric wires 30, and here, five electric wire insertion holes 242e are formed side by side in a direction intersecting the normal direction DN. The electric wire insertion hole 242e is formed at a position facing the through hole 14 along the normal direction DN.

[0049] The wire receiving portion 242b is a portion that extends along the electric wire 30 and receives the electric wire 30. The wire receiving portion 242b is provided continuously from the electric wire insertion portion 242a on the side opposite to the board 10, and is formed to extend in a direction slightly inclined with respect to the normal direction DN. Like the wire insertion holes 242e, a plurality of wire receiving portions 242b are provided according to the number of electric wires 30, and here, five of them are formed side by side along a direction intersecting the normal direction DN (see also FIG. 12 described later). The inner peripheral surface of each wire receiving portion 242b is formed substantially in a gutter shape continuous with the wire insertion hole 242e, and this inner peripheral surface abuts against the electric wire 30 and serves as a surface that receives the electric wire 30.

[0050] The fixing pin 242c is a portion located opposite the wire receiving portion 242b with the wire 30 sandwiched therebetween. The fixing pin 242c has a substantially cylindrical shape and is configured as a separate body from the wire insertion portion 242a, the wire receiving portion 242b, the pin receiving portion 242d, etc. The fixing pin 242c is formed so that the central portion has a relatively large diameter and both end portions have relatively small diameters, and the central portion abuts against the wire 30 with both end portions supported by the pin receiving portions 242d.

[0051] The pin receiving portion 242d is a portion that receives the fixing pin 242c on the side opposite to the electric wire 30 side of the fixing pin 242c. The pin receiving portions 242d are provided in pairs with a gap between them along a direction intersecting the normal direction DN (the direction in which the electric wire insertion holes 242e are aligned). Each pin receiving portion 242d has a substantially semicircular trough shape and is configured integrally with the electric wire insertion portion 242a, the electric wire receiving portion 242b, etc. Each pin receiving portion 242d is formed so that the inner peripheral surface faces the electric wire insertion portion 242a side (in other words, the board 10 side), and the inner peripheral surface abuts against both ends of the fixing pin 242c and serves as a surface that receives the fixing pin 242c.

[0052] In the wire holding portion 242 configured as described above, an end of the wire 30 on the side connected to the board 10 (an end on the side where the core wire 31 is exposed) is inserted into the wire insertion hole 242e and held therein, and the fixing pin 242c is subsequently fitted between the wire 30 and the pin receiving portion 242d. As a result, in a state where the fixing pin 242c is inserted between the wire 30 and the pin receiving portion 242d, the wire holding portion 242 sandwiches and supports and fixes the wire 30 between the fixing pin 242c and the wire receiving portion 242b. In a state where the fixing pin 242c is inserted between the wire 30 and the pin receiving portion 242d, the wire holding portion 242 sandwiches and supports and fixes the wire 30 between the fixing pin 242c and the wire receiving portion 242b so that the wire 30 is slightly bent toward the wire receiving portion 242b and aligned with the wire receiving portion 242b. In this state, the wire holding portion 242 is in a state in which the fixing pin 242c is pressed toward the pin receiving portion 242d by the restoring force of the wire 30, and the fixing pin 242c is held within the pin receiving portion 242d so that it does not fall out from between the wire 30 and the pin receiving portion 242d.

[0053] In the electronic component unit 201 according to the modified example described above, the wire receiving portion 242b, the fixing pin 242c, and the pin receiving portion 242d cooperate to clamp and support the electric wire 30 connected to the board 10 via the solder portion 17 in the electric wire holding portion 242. This allows the electronic component unit 201 to support and fix the electric wire 30 without using a bundling member such as a cable tie 42b. As a result, similar to the electronic component unit 1, the electronic component unit 201 can reduce the stress load acting on the solder portion 17 between the core wire 31 of the electric wire 30 and the board 10. This allows the electronic component unit 201 to appropriately ensure the reliability of the solder portion 17 and, for example, prevent the electric wire 30 from coming loose.

[0054] 12, for example, fixing pin 242c can be integrally molded with electric wire receiving portion 242b and pin receiving portion 242d via connecting portion 242f, and then inserted between electric wire 30 and pin receiving portion 242d with connecting portion 242f cut. This allows electronic component unit 201 to be molded and manufactured collectively with other portions of holder 40, rather than as a separate part from holder 40 like cable tie 42b, etc., and therefore, for example, it is possible to suppress an increase in manufacturing costs.

[0055] Furthermore, the electronic component units 1, 201 described above may be shaped so that the electric wires 30 are fitted into the electric wire holding portions 42, 242 of the holder 40 and held therein.

[0056] An electronic component unit 301 according to a modified example shown in FIGS. 13 and 14 differs from the above-described electronic component units 1 and 201 in that the holder 40 is configured to include a plurality of electric wire holding grooves 344 .

[0057] The electric wire holding groove 344 may be formed in the electric wire holding portion 42, 242 in the holder 40, or may be provided in place of the electric wire holding portion 42, 242. Here, as an example, the electric wire holding groove 344 will be described as being formed in the end surface of the main body portion 41a of the board holding portion 41 in the holder 40.

[0058] A plurality of electric wire holding grooves 344 are provided according to the number of electric wires 30, and here, five of them are formed side by side along a direction intersecting with the normal direction DN. Each of the plurality of electric wire holding grooves 344 is formed in a groove shape along the normal direction DN on the end surface of the main body 41a, and is a portion into which the electric wire 30 is fitted and held. The electric wire holding grooves 344 have a substantially circular cross section that matches the outer shape of the electric wire 30, and the electric wire 30 is fitted into the inner peripheral surface side along the normal direction DN to hold the electric wire 30.

[0059] In this modified example, the wire holding groove portions 344 are arranged in a row, with one located in the center formed alone, two located at one end formed as a pair, and two located at the other end formed as another pair.

[0060] At both ends, a pair of adjacent electric wire holding grooves 344 each have a common electric wire insertion opening 344a for the pair. The electric wires 30 are fitted into the pair of adjacent electric wire holding grooves 344 through this common electric wire insertion opening 344a.

[0061] 15 and 16 , the pair of adjacent electric wire holding grooves 344 are formed such that, when an electric wire 30 is held in one electric wire holding groove 344, a gap G1 between the electric wire 30 held in the one electric wire holding groove 344 and the other electric wire holding groove 344 is narrower than the outer diameter R1 of the electric wire 30 held in the other electric wire holding groove 344. Here, the gap G1 between the electric wire 30 and the other electric wire holding groove 344 corresponds to the width of the introduction opening of the electric wire 30 into the other electric wire holding groove 344.

[0062] In the electronic component unit 301 configured as described above, after an electric wire 30 is inserted and held in one of a pair of adjacent electric wire holding grooves 344 via the electric wire insertion opening 344a, when an attempt is made to insert the electric wire 30 into the other electric wire holding groove 344 via the common electric wire insertion opening 344a, the electric wire 30 comes into contact with the electric wire 30 held in one of the electric wire holding grooves 344 at the gap (inlet) G1 to the other electric wire holding groove 344 (see FIG. 15, etc.).

[0063] In this state, when the electric wires 30 are further pushed into the other electric wire holding groove 344 of the electronic component unit 301, the pushed electric wires 30 elastically deform the insulating coating portions 32 (see FIG. 1 etc.) of the electric wires 30, widening the gap (inlet) G1 and being pushed into the other electric wire holding groove 344. Then, when the electric wires 30 are finally fitted into and held in the other electric wire holding groove 344 of the electronic component unit 301, the elastically deformed insulating coating portions 32 return to their original shape and the gap G1 returns to a state where it is narrower than the outer diameter R1 of the electric wires 30.

[0064] As a result, in the electronic component unit 301 according to the modified example described above, when the electric wires 30 are fitted into and held in the pair of adjacent electric wire holding grooves 344, if the electric wires 30 held in each electric wire holding groove 344 try to move in a direction to come out of the electric wire holding groove 344, the electric wires 30 held in one electric wire holding groove 344 and the electric wires 30 held in the other electric wire holding groove 344 come into contact with each other. This allows the electronic component unit 301 to prevent the electric wires 30 held in each electric wire holding groove 344 from coming out of the electric wire holding groove 344. In other words, when the electric wires 30 are fitted into and held in the pair of adjacent electric wire holding grooves 344, one electric wire 30 can function as a stopper to prevent the other electric wire 30 from coming out. This allows the electronic component unit 301 to properly ensure the reliability of the solder portion 17 and, for example, to prevent the electric wire 30 from coming loose. Furthermore, the electronic component unit 301 can hold the electric wire 30 in the holder 40 without using, for example, a cable tie 42b or the like, and therefore, for example, can prevent an increase in manufacturing costs.

[0065] The electronic component unit according to this embodiment may be configured by appropriately combining the components of the embodiment and the modified examples described above. Also, as a reference example, the components of the modified examples described above may be applied independently of the embodiment described above. [Explanation of symbols]

[0066] 1, 201, 301 Electronic component unit 10 Substrate 11 Mounting surface 12 Boss insertion hole 13, 14 through holes 15 Protruding shape part 16, 17 Solder part 20 Electronic Components 21 Main body 22 Lead terminal 30 Electric wire 31 Core Wire 32 Insulation coating 40 Holder 41 Board holding part 41a Main body 41b boss part 42, 242 Wire holding part 42a Wire insertion and binding section 42b Cable ties 42c, 242e Wire insertion hole 43 Electronic component holder 43a Cantilever support beam 43aa First cantilever support beam 43ab Second cantilever support beam 43b, 43c Proximal support part 43d extension 43e Holding space 43f Support protrusion 242a Wire insertion part 242b Wire receiving part 242c fixing pin 242d Pin receiving part 242f Joint 344 Wire holding groove 344a Wire insertion opening D1 1st direction D2 2nd direction DN Normal Direction G1 Gap R1 outer diameter

Claims

1. a substrate formed in a plate shape; an electronic component electrically connected to the mounting surface of the substrate via a solder portion; a holder including a substrate holding portion that holds the substrate and an electronic component holding portion that holds the electronic component, the electronic component holding portion includes a plurality of cantilever support beam portions each formed in a cantilever shape from the board holding portion and configured to sandwich and elastically support the electronic component in a direction along the mounting surface, the plurality of cantilever support beam portions include a pair of first cantilever support beam portions that are positioned opposite each other across the electronic component in a first direction along the mounting surface and that sandwich and elastically support the electronic component in the first direction, and a pair of second cantilever support beam portions that are positioned opposite each other across the electronic component in a second direction intersecting the first direction along the mounting surface and that sandwich and elastically support the electronic component in the second direction, the pair of first cantilever support beam portions extend in opposite directions to each other along the second direction and are supported by the substrate holding portion; one of the pair of first cantilever support beam portions has a base end portion, which is an end portion on one side in the second direction, supported by the substrate holding portion via a first base end support portion, and a tip end portion, which is an end portion on the other side in the second direction, which is a free end, and is supported in a cantilevered manner relative to the substrate holding portion so as to be elastically deformable along the first direction; the other of the pair of first cantilever support beam portions has a base end portion, which is an end portion on the other side in the second direction, supported by the substrate holding portion via a second base end support portion, and a tip end portion, which is an end portion on the one side in the second direction, which is a free end, and is supported in a cantilevered manner relative to the substrate holding portion so as to be elastically deformable along the first direction; the pair of second cantilever support beam portions extend in opposite directions to each other along the first direction and are supported by the substrate holding portion; one of the pair of second cantilever support beam portions has a base end which is an end on one side in the first direction supported by the substrate holding portion via the first base end support portion, and a tip end which is an end on the other side in the first direction which is a free end, the tip end being positioned at a distance from one of the first cantilever support beam portions in the first direction, and the entire second cantilever support beam portion being positioned at a distance from the tip end of the other first cantilever support beam portion and the first base end support portion in the second direction, and is supported in a cantilevered manner relative to the substrate holding portion so as to be elastically deformable along the second direction, the other of the pair of second cantilever support beam portions has a base end which is the end on the other side in the first direction supported by the substrate holding portion via the second base end support portion, and a tip end which is the end on the one side in the first direction which is a free end, the tip end being positioned at a distance from the other of the first cantilever support beam portions in the first direction, and the entire second cantilever support beam portion being positioned at a distance from the tip end of the one of the first cantilever support beam portions and the second base end support portion in the second direction, and is supported in a cantilevered manner relative to the substrate holding portion so as to be elastically deformable along the second direction, The electronic component is press-fitted into a holding space surrounded on all four sides by the pair of first cantilever support beam portions and the pair of second cantilever support beam portions along a normal direction of the mounting surface, and is sandwiched and elastically supported by the pair of first cantilever support beam portions and the pair of second cantilever support beam portions. Electronic component unit.

2. the cantilever support beam portion has a support protrusion portion that supports the electronic component between the cantilever support beam portion and the substrate in a normal direction of the mounting surface; The electronic component unit according to claim 1 .

3. an electric wire electrically connected to the mounting surface of the board via a solder portion; the holder includes a wire holding portion that holds the wire, The electric wire holding portion includes an electric wire receiving portion extending along the electric wire, a fixing pin positioned opposite the electric wire receiving portion with the electric wire sandwiched therebetween, and a pin receiving portion that receives the fixing pin on the side opposite to the electric wire side of the fixing pin, and with the fixing pin inserted between the electric wire and the pin receiving portion, the electric wire is sandwiched and supported and fixed by the fixing pin and the electric wire receiving portion. The electronic component unit according to claim 1 or 2.

4. The fixing pin is integrally molded with the electric wire receiving portion and the pin receiving portion via a connecting portion, and then inserted between the electric wire and the pin receiving portion with the connecting portion cut off. The electronic component unit according to claim 3 .

5. an electric wire electrically connected to the mounting surface of the board via a solder portion; The holder includes a plurality of electric wire holding grooves each formed in a groove shape and adapted to fit and hold the electric wire, In a pair of adjacent electric wire holding grooves, when the electric wire is held in one of the electric wire holding grooves, a gap between the electric wire held in the one electric wire holding groove and the other electric wire holding groove is narrower than an outer diameter of the electric wire held in the other electric wire holding groove. The electronic component unit according to any one of claims 1 to 4.

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