Resin composition, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and printed wiring board

Abstract

This resin composition comprises a maleimide compound (A) and a phosphorus-containing compound (B). The maleimide compound (A) comprises a first maleimide compound (A1) that has an alkyl group having 6 or more carbon atoms and / or an alkylene group having 6 or more carbon atoms. The phosphorus-containing compound (B) comprises a phosphorus-containing compound (B1) that has a structure represented by formula (b1). [In formula (b1): s represents an integer of 1-10; Z represents an arylene group or an ester bond represented by formula (b1.1); R1 to R3 independently represent a hydrogen atom or a monovalent organic group; and each * represents a bond.]

Description

[Technical Field]

[0001] The present disclosure generally relates to a resin composition, a prepreg, a resin-coated film, a resin-coated metal foil, a metal-clad laminate, and a printed wiring board. More specifically, the present disclosure relates to a resin composition containing a maleimide compound, and a prepreg, a resin-coated film, a resin-coated metal foil, a metal-clad laminate, and a printed wiring board using the resin composition. [Background technology]

[0002] Patent Document 1 discloses a resin film for producing a highly multilayer printed wiring board. This resin film contains a compound having a maleimide group, a divalent group having at least two imide bonds, and a saturated or unsaturated divalent hydrocarbon group.

[0003] Patent Document 1 discloses that flame retardancy can be improved by adding an inorganic filler to the resin film, but Patent Document 1 does not consider warpage of a substrate using the resin film. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-131243 Summary of the Invention

[0005] An object of the present disclosure is to provide a resin composition, a prepreg, a resin-coated film, a resin-coated metal foil, a metal-clad laminate, and a printed wiring board that can be used to produce a substrate that achieves both reduced warping and improved flame resistance.

[0006] A resin composition according to one embodiment of the present disclosure contains a maleimide compound (A) and a phosphorus-containing compound (B). The maleimide compound (A) contains a first maleimide compound (A1) having an alkyl group having 6 or more carbon atoms and / or an alkylene group having 6 or more carbon atoms. The phosphorus-containing compound (B) contains a phosphorus-containing compound (B1) having a structure represented by the following formula (b1):

[0007] [ka]

[0008] (In formula (b1), s represents an integer of 1 to 10, Z represents an arylene group or an ester bond represented by formula (b1.1), and R 1 ~R 3 each independently represents a hydrogen atom or a monovalent organic group, and * represents a bond.

[0009] A prepreg according to one aspect of the present disclosure includes a substrate and a resin layer impregnated into the substrate and including the resin composition or a semi-cured product of the resin composition.

[0010] A resin-coated film according to one embodiment of the present disclosure includes a resin layer containing the resin composition or a semi-cured product of the resin composition, and a support film that supports the resin layer.

[0011] A resin-coated metal foil according to one embodiment of the present disclosure includes a resin layer containing the resin composition or a semi-cured product of the resin composition, and a metal foil adhered to the resin layer.

[0012] A metal-clad laminate according to one embodiment of the present disclosure comprises an insulating layer including a cured product of the resin composition or a cured product of the prepreg, and a metal layer adhered to the insulating layer.

[0013] A printed wiring board according to one aspect of the present disclosure includes an insulating layer including a cured product of the resin composition or a cured product of the prepreg, and conductor wiring formed on the insulating layer. [Brief explanation of the drawings]

[0014] [Figure 1] FIG. 1 is a schematic cross-sectional view showing a prepreg according to one embodiment of the present disclosure. [Figure 2] FIG. 2 is a schematic plan view showing a base material used in the prepreg. [Figure 3] 3A and 3B are schematic cross-sectional views showing a resin-coated film (without a protective film) according to an embodiment of the present disclosure, respectively. [Figure 4] FIG. 4 is a schematic cross-sectional view showing a resin-coated metal foil according to one embodiment of the present disclosure. [Figure 5] FIG. 5 is a schematic cross-sectional view showing a metal-clad laminate according to one embodiment of the present disclosure. [Figure 6] 6A and 6B are schematic cross-sectional views showing a printed wiring board (without interlayer connections) according to an embodiment of the present disclosure. [Figure 7] 7A to 7G are schematic cross-sectional views showing a series of steps in the semi-additive method. [Figure 8] Fig. 8A is a schematic cross-sectional view showing a state in which no resin smear remains between the inner layer circuit and the plating after the semi-additive process is performed, and Fig. 8B is a schematic cross-sectional view showing a state in which a resin smear remains between the inner layer circuit and the plating after the semi-additive process is performed. [Figure 9] FIG. 9 is a schematic cross-sectional view showing a semiconductor package according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0015] 1. Overview The resin composition according to this embodiment can be used as a substrate material, which is not particularly limited, but includes, for example, a prepreg 1, a resin-coated film 2, a resin-coated metal foil 3, a metal-clad laminate 4, and a printed wiring board 5 (see FIGS. 1 to 6B).

[0016] The present inventors have found that there is a correlation between the warpage of a substrate and its loss tangent (tanδ). In short, they have found that increasing the loss tangent (tanδ) of a substrate can reduce the warpage of the substrate. The present inventors have furthered their research and development and identified a material that is effective in increasing the loss tangent (tanδ) of a substrate.

[0017] That is, the resin composition according to this embodiment contains a maleimide compound (A) and a phosphorus-containing compound (B).

[0018] The maleimide compound (A) contains a first maleimide compound (A1) having an alkyl group having 6 or more carbon atoms and / or an alkylene group having 6 or more carbon atoms. Since the first maleimide compound (A1) has a long chain of C6 or more, it is easy to increase the loss tangent (tan δ) of the substrate.

[0019] On the other hand, the phosphorus-containing compound (B) includes a phosphorus-containing compound (B1) having a structure represented by the following formula (b1). Since the phosphorus-containing compound (B1) contains phosphorus, it can function as a flame retardant. Flame retardants are classified into reactive flame retardants and additive flame retardants. Reactive flame retardants are flame retardants that chemically bond with other components through a chemical reaction. On the other hand, additive flame retardants are flame retardants other than reactive flame retardants. That is, additive flame retardants are flame retardants that are simply added but do not chemically bond with other components. The phosphorus-containing compound (B1) is a type of reactive flame retardant because it has an ethenylbenzyl group. That is, the phosphorus-containing compound (B1) can react with the first maleimide compound (A1) via the ethenylbenzyl group. Therefore, even if the first maleimide compound (A1) has a long chain of C6 or more, a decrease in crosslink density can be suppressed. Moreover, since the phosphorus-containing compound (B1) contains phosphorus, it is halogen-free and can also improve the flame resistance of the substrate.

[0020] [ka]

[0021] (In formula (b1), s represents an integer of 1 to 10, Z represents an arylene group or an ester bond represented by formula (b1.1), and R 1 ~R 3 each independently represents a hydrogen atom or a monovalent organic group, and * represents a bond.

[0022] Therefore, the resin composition according to this embodiment makes it possible to manufacture a substrate that achieves both reduced warpage and improved flame resistance.

[0023] 2.Details The resin composition according to this embodiment will be described in detail below. Furthermore, the prepreg 1, resin-coated film 2, resin-coated metal foil 3, metal-clad laminate 4, printed wiring board 5, and semiconductor package 100 according to this embodiment will be described in detail with reference to the drawings. For convenience of explanation, arrows indicating the mutually orthogonal X, Y, and Z directions are shown in some of the drawings, but these arrows do not actually represent any physical objects.

[0024] (1) Resin composition The resin composition according to the present embodiment contains a maleimide compound (A) and a phosphorus-containing compound (B). Preferably, the resin composition further contains a non-hydrogenated and / or hydrogenated styrene copolymer (C). Preferably, the resin composition further contains a resin component (D). The resin component (D) is a resin component excluding the maleimide compound (A), the phosphorus-containing compound (B), and the styrene copolymer (C). Preferably, the resin composition further contains an inorganic filler (E). The resin composition may further contain other components (F). The maleimide compound (A) and the phosphorus-containing compound (B) are essential components, while the styrene copolymer (C), the resin component (D), the inorganic filler (E), and the other components (F) are optional components. The components of the resin composition will be described below.

[0025] <Maleimide compound (A)> The maleimide compound (A) includes a first maleimide compound (A1). The first maleimide compound (A1) has an alkyl group having 6 or more carbon atoms and / or an alkylene group having 6 or more carbon atoms. That is, the first maleimide compound (A1) has at least one of an alkyl group having 6 or more carbon atoms and an alkylene group having 6 or more carbon atoms. The upper limit of the number of carbon atoms in the alkyl group is not particularly limited, but is, for example, 100. The upper limit of the number of carbon atoms in the alkylene group is not particularly limited, but is, for example, 100. As such, the first maleimide compound (A1) has a long chain of 6 or more carbon atoms, which makes it easy to increase the loss tangent (tan δ) of the substrate.

[0026] Here, the loss tangent (tan δ) is also called the loss coefficient and is expressed as tan δ=E" / E', where E" is the loss modulus and E' is the storage modulus. The loss tangent (tan δ) of the substrate can be measured using a dynamic viscoelasticity measuring device.

[0027] Preferably, the maleimide compound (A) includes at least one selected from the group consisting of a third maleimide compound (A3) represented by the following formula (a3), a fourth maleimide compound (A4) represented by the following formula (a4), and a fifth maleimide compound (A5) represented by the following formula (a5). By including such a maleimide compound (A) in the resin composition, the loss tangent (tan δ) of the substrate can be increased.

[0028] [ka]

[0029] (In formula (a3), n represents an integer of 1 to 10.)

[0030] [ka]

[0031] (In formula (a4), n represents an integer of 1 to 10.)

[0032] [ka]

[0033] Preferably, the maleimide group equivalent of the first maleimide compound (A1) is 400 g / eq or more. This further reduces warpage of the substrate. The upper limit of the maleimide group equivalent is preferably 3000 g / eq or less, more preferably 2000 g / eq or less. The maleimide group equivalent is a value obtained by dividing the molecular weight of the maleimide compound (A) by the number of maleimide groups contained in the maleimide compound (A). In other words, the maleimide group equivalent is the molecular weight per maleimide group.

[0034] Preferably, the maleimide compound (A) further contains a second maleimide compound (A2) having a maleimide group equivalent weight of less than 400 g / eq. This allows the glass transition temperature (Tg) of the substrate to be increased. By increasing the Tg of the substrate, cracks are less likely to occur in the substrate, improving the reliability of interlayer connections. That is, even when stress such as a thermal shock test is applied to a substrate such as a multilayer printed wiring board, cracks are less likely to occur in the substrate, thereby suppressing increases in the resistance values ​​of via holes and through holes and improving the reliability of interlayer connections. In particular, in recent years, with the increasing density and miniaturization of wiring, via holes and through holes are also becoming smaller in diameter, so increasing the Tg of the substrate is effective. The lower limit of the maleimide group equivalent weight of the second maleimide compound (A2) is preferably 150 g / eq or more, more preferably 200 g / eq or more.

[0035] The second maleimide compound (A2) is not particularly limited, but includes, for example, a sixth maleimide compound (A6) represented by the following formula (a6): The sixth maleimide compound (A6) is 3,3'-dimethyl-5,5'-diethyl-4,4'-diphenylmethane bismaleimide.

[0036] [ka]

[0037] When the maleimide compound (A) further contains a second maleimide compound (A2), the content of the second maleimide compound (A2) is preferably 10% by mass or more and 65% by mass or less based on the total mass of the maleimide compound (A).

[0038] Preferably, the content of the maleimide compound (A) is 20 parts by mass or more and 50 parts by mass or less per 100 parts by mass of the total of the maleimide compound (A), the styrene-based copolymer (C), and the resin component (D). This can further reduce warpage of the substrate. In this case, the resin composition does not necessarily contain the styrene-based copolymer (C) or the resin component (D).

[0039] <Phosphorus-containing compound (B)> The phosphorus-containing compound (B) includes a phosphorus-containing compound (B1) having a structure represented by the following formula (b1): As described above, the phosphorus-containing compound (B1) contains phosphorus and has an ethenylbenzyl group, and is therefore a type of reactive flame retardant.

[0040] Furthermore, since the phosphorus-containing compound (B1) contains phosphorus, it can also improve the flame resistance (particularly self-extinguishing property) of the substrate. That is, the phosphorus-containing compound (B1) can impart flame resistance to the substrate by forming an oxygen-blocking layer from the phosphoric acid layer produced by thermal decomposition and by forming a carbon coating on the resin surface through dehydration, thereby blocking oxygen and heat.

[0041] Furthermore, the cured product of the resin composition according to this embodiment may come into contact with various chemicals during the production of printed wiring boards, but is stable against these chemicals. Specifically, the phosphorus-containing compound (B1) is a reactive flame retardant, not an additive flame retardant, and is therefore incorporated into the resin skeleton containing the first maleimide compound (A1). That is, the phosphorus-containing compound (B1) forms a bond with the resin skeleton and can become part of the resin skeleton. This prevents phosphorus from leaching out from the cured product even when the cured product of the resin composition comes into contact with various chemicals. In this way, the chemical resistance of the cured product can be improved. Therefore, since phosphorus is retained in the cured product, the flame resistance of the substrate can be maintained by this phosphorus.

[0042] [ka]

[0043] (In formula (b1), s represents an integer of 1 to 10, Z represents an arylene group or an ester bond represented by formula (b1.1), and R 1 ~R 3 each independently represents a hydrogen atom or a monovalent organic group, and * represents a bond.

[0044] The monovalent organic group is not particularly limited, but examples thereof include alkyl groups, etc. The alkyl group is not particularly limited, but examples thereof include methyl groups, etc.

[0045] The structure represented by formula (b1) is preferably a structure represented by the following formula (b2.1) or (b2.2), which can further improve chemical resistance.

[0046] [ka]

[0047] (In formula (b2.1) and formula (b2.2), * indicates a bond.)

[0048] The phosphorus-containing compound (B1) preferably further has a structure represented by the following formula (b3.1) or (b3.2), which can further improve chemical resistance.

[0049] [ka]

[0050] (In formula (b3.1) and formula (b3.2), * indicates a bond.)

[0051] Preferably, the phosphorus-containing compound (B1) has both a structure represented by formula (b2.1) or (b2.2) and a structure represented by formula (b3.1) or (b3.2). For example, the phosphorus-containing compound (B1) preferably includes a phosphorus-containing compound (B4) represented by the following formula (b4). The phosphorus-containing compound (B4) is diphenyl-2-methacryloyloxyethyl phosphate.

[0052] [ka]

[0053] The phosphorus content of the phosphorus-containing compound (B) is preferably 7% by mass or more based on the total mass of the phosphorus-containing compound (B). This can further improve flame resistance. The upper limit of the phosphorus content of the phosphorus-containing compound (B) is not particularly limited, but is, for example, 10% by mass or less.

[0054] The content of the phosphorus-containing compound (B) is preferably 10% by mass or more and 60% by mass or less, more preferably 20% by mass or more and 60% by mass or less, and even more preferably 30% by mass or more and 55% by mass or less, based on the total mass of the maleimide compound (A) and the phosphorus-containing compound (B).

[0055] <Styrene-based copolymer (C)> Preferably, the resin composition further contains a non-hydrogenated product and / or a hydrogenated product of the styrene copolymer (C).

[0056] The styrene copolymer (C) has at least one structure derived from a styrene compound and / or a styrene derivative. The styrene compound and / or the styrene derivative is not particularly limited, but examples thereof include styrene, α-methylstyrene, p-methylstyrene, compounds in which a portion of the hydrogen atoms in the aromatic rings thereof are substituted with alkyl groups, and polymers thereof. The styrene copolymer (C) may further have a structure derived from a conjugated diene compound.

[0057] A non-hydrogenated styrene copolymer (C) refers to a substance that is not hydrogenated. A hydrogenated styrene copolymer (C) refers to a substance that has been hydrogenated. Preferably, the weight-average molecular weight of the styrene copolymer (C) is 10,000 or more and 150,000 or less. When such a styrene copolymer (C) is contained in the resin composition, warpage of the substrate can be further reduced. When the weight-average molecular weight of the styrene copolymer (C) is 10,000 or more, a decrease in desmear resistance can be suppressed. A method for evaluating desmear resistance is explained in the Examples section below. On the other hand, when the weight-average molecular weight of the styrene copolymer (C) is 150,000 or less, a decrease in flame resistance can be suppressed.

[0058] Preferably, the styrene copolymer (C) comprises at least one selected from the group consisting of methylstyrene (ethylene / butylene) methylstyrene copolymer, methylstyrene (ethylene-ethylene / propylene) methylstyrene copolymer, styrene-isoprene copolymer, styrene-isoprene styrene copolymer, styrene (ethylene / butylene) styrene copolymer, styrene (ethylene-ethylene / propylene) styrene copolymer, and hydrogenated products thereof. By including such a styrene copolymer (C) in the resin composition, warpage of the substrate can be further reduced.

[0059] When the resin composition further contains a styrene copolymer (C), the content of the styrene copolymer (C) is preferably 15% by mass or more and 35% by mass or less, based on the total mass of the maleimide compound (A), the phosphorus-containing compound (B), and the styrene copolymer (C).

[0060] When the resin composition further contains a styrene copolymer (C), the content of the styrene copolymer (C) is preferably 10 to 40 parts by mass per 100 parts by mass of the total of the maleimide compound (A), the styrene copolymer (C), and the resin component (D). This can further reduce warpage of the substrate. In this case, the resin composition does not necessarily contain the resin component (D).

[0061] <Resin component (D)> Preferably, the resin composition further contains a resin component (D). The resin component (D) refers to a resin component other than the maleimide compound (A), the phosphorus-containing compound (B), and the styrene copolymer (C).

[0062] Preferably, resin component (D) contains at least one selected from the group consisting of epoxy compounds, phenolic compounds, polyphenylene ether compounds, modified polyphenylene ether compounds having reactive unsaturated groups, benzoxazine compounds, radically polymerizable compounds having polymerizable unsaturated groups, cyanate ester compounds, and amine compounds. This can impart properties specific to each resin component (D) to the resin composition. For example, it can improve desmear resistance and electrical properties.

[0063] An epoxy compound is a compound having at least one (preferably two or more) epoxy group in its molecule. Specific examples of epoxy compounds include, but are not limited to, naphthalene-type epoxy resins, biphenyl-type epoxy resins, dicyclopentadiene-type epoxy resins, and mesogenic skeleton epoxy resins. A mesogenic skeleton epoxy resin is an epoxy resin having at least one mesogenic group in its molecule. A mesogenic group is a rigid structure and is the smallest unit structure capable of forming a liquid crystal structure. Specific examples of mesogenic groups include, but are not limited to, a biphenyl structure and a phenylbenzoate structure.

[0064] Preferably, the epoxy equivalent of the epoxy compound is 200 g / eq or more and 350 g / eq or less. This allows the glass transition temperature (Tg) of the substrate to be increased. As described above, increasing the Tg of the substrate makes it less likely for cracks to occur in the substrate, and can improve the reliability of interlayer connections.

[0065] The phenol compound is a compound obtained by polymerizing a phenol and formaldehyde with an acidic or basic catalyst. The phenol compound is not particularly limited, but examples thereof include phenol novolak.

[0066] When the resin composition further contains a resin component (D), the content of the resin component (D) is preferably 1 part by mass or more and 40 parts by mass or less, more preferably 5 parts by mass or more and 30 parts by mass or less, relative to 100 parts by mass in total of the maleimide compound (A), the phosphorus-containing compound (B), and the styrene copolymer (C). In this case, the resin composition does not necessarily contain the styrene copolymer (C).

[0067] <Inorganic filler (E)> Preferably, the resin composition further contains an inorganic filler (E), which can reduce the linear expansion coefficient of the substrate.

[0068] Preferably, the inorganic filler (E) contains at least one selected from the group consisting of metal oxides, metal hydroxides, talc, aluminum borate, barium sulfate, calcium carbonate, and zinc molybdate. Examples of metal oxides include, but are not limited to, silica, alumina, titanium oxide, and mica. Examples of metal hydroxides include, but are not limited to, aluminum hydroxide and magnesium hydroxide.

[0069] Preferably, the inorganic filler (E) is surface-treated with a surface treatment agent. This improves wettability with the maleimide compound (A), the phosphorus-containing compound (B), the styrene copolymer (C), and the resin component (D), thereby improving the dispersibility of the inorganic filler (E). Examples of the surface treatment agent include, but are not limited to, silane coupling agents, titanate coupling agents, fatty acids, and surfactants. Preferably, the silane coupling agent has at least one functional group selected from the group consisting of vinyl groups, epoxy groups, styryl groups, methacrylic groups, acrylic groups, amino groups, isocyanurate groups, ureido groups, mercapto groups, isocyanate groups, and acid anhydride groups.

[0070] The inorganic filler (E) is preferably spherical in shape, which can improve the fluidity of the resin composition during molding.

[0071] The inorganic filler (E) has an average particle size of preferably 0.01 μm or more and 50 μm or less, more preferably 0.05 μm or more and 20 μm or less. The average particle size means the particle size at 50% of the cumulative value in the particle size distribution determined by a laser diffraction / scattering method.

[0072] When the resin composition further contains an inorganic filler (E), the content of the inorganic filler (E) is preferably 20 to 200 parts by mass, and more preferably 50 to 150 parts by mass, per 100 parts by mass of the total of the maleimide compound (A), the phosphorus-containing compound (B), the styrene copolymer (C), and the resin component (D). In this case, the resin composition does not necessarily contain the styrene copolymer (C) and the resin component (D).

[0073] <Other (F)> The resin composition may further contain other components (F). The other components (F) are not particularly limited, but examples thereof include catalytic curing agents, crosslinking agents, reaction initiators, resin modifiers, antifoaming agents, heat stabilizers, antistatic agents, UV absorbers, dyes, pigments, lubricants, dispersants such as wetting and dispersing agents, and leveling agents. Examples of catalytic curing agents include imidazole compounds such as 2-ethyl-4-methylimidazole. Examples of reaction initiators include organic peroxides such as α,α'-di(t-butylperoxy)diisopropylbenzene. The content of the other components (F) is not particularly limited as long as it does not impair the effects of this embodiment.

[0074] <Form> The form of the resin composition is not particularly limited. The resin composition may be liquid or solid. The liquid form includes a varnish. A varnish can be prepared by stirring and mixing the resin composition with a solvent. The solvent is not particularly limited, but examples thereof include toluene, methyl ethyl ketone, cyclohexanone, and propylene glycol monomethyl ether acetate.

[0075] (2) Prepreg FIG. 1 shows a prepreg 1 according to this embodiment. The prepreg 1 is generally in the form of a sheet or film. That is, the prepreg 1 extends in the X and Y directions. The prepreg 1 is used as a material for a metal-clad laminate 4, a material for a printed wiring board 5, and for multi-layering (build-up method) printed wiring boards 5. The prepreg 1 hardens into a cured product when heated or irradiated with light (ultraviolet light). The cured product of the prepreg 1 can form the insulating layer 40 of the metal-clad laminate 4 and the insulating layer 50 of the printed wiring board 5 (see FIGS. 5 to 6B).

[0076] The prepreg 1 includes a substrate 11 and a resin layer 10 containing a resin composition or a semi-cured product of the resin composition impregnated into the substrate 11. One prepreg 1 includes at least one substrate 11.

[0077] The substrate 11 is not particularly limited, but examples thereof include woven fabric and nonwoven fabric.

[0078] The woven fabric is not particularly limited, but examples thereof include glass cloth, aramid cloth, and polyester cloth.

[0079] The nonwoven fabric is not particularly limited, but examples thereof include glass nonwoven fabric, aramid nonwoven fabric, polyester nonwoven fabric, pulp paper, and linter paper.

[0080] The glass fibers constituting the glass cloth and glass nonwoven fabric are not particularly limited, but examples thereof include Q glass, NE glass, E glass, S glass, T glass, L glass, and L2 glass.

[0081] The thickness of the substrate 11 is preferably 5 μm or more and 300 μm or less, and more preferably 10 μm or more and 200 μm or less.

[0082] The surface of the substrate 11 may be surface-treated with a silane coupling agent. The silane coupling agent is not particularly limited, but examples thereof include silane coupling agents having at least one functional group selected from the group consisting of a vinyl group, an epoxy group, a styryl group, a methacryl group, an acrylic group, an amino group, an isocyanurate group, a ureido group, a mercapto group, an isocyanate group, and an acid anhydride group.

[0083] An example of the substrate 11 is shown in Figure 2. The substrate 11 is a woven fabric made of warp threads 111 and weft threads 112. The direction of the warp threads 111 (X direction) and the direction of the weft threads 112 (Y direction) are perpendicular to each other. The substrate 11 extends in the X direction and the Y direction. A bias direction BD is a direction that intersects with the direction of the warp threads 111 (X direction). The angle formed between the bias direction BD and the direction of the warp threads 111 (X direction) is θ (for example, 45°).

[0084] The resin layer 10 is divided into a case where it contains a resin composition (first case) and a case where it contains a semi-cured product of the resin composition (second case).

[0085] In the first case, the resin layer 10 is formed as follows. That is, the base material 11 is impregnated with a varnish of a resin composition, and then the solvent is volatilized to form the resin layer 10. The resin layer 10 is formed from an unreacted resin composition (dried product). Here, the unreacted state includes a state in which no reaction has occurred and a state in which almost no reaction has occurred. The resin layer 10 changes from an unreacted state to a cured state by being heated.

[0086] On the other hand, in the second case, the resin composition is in a semi-cured state. Here, the semi-cured state refers to a state in an intermediate stage (B stage) of the curing reaction. The intermediate stage is a stage between the varnish state stage (A stage) and the cured state stage (C stage). In the second case, the resin layer 10 is formed as follows. That is, after impregnating the base material 11 with a varnish of the resin composition, the base material 11 is heated to volatilize the solvent and the curing reaction of the resin composition is allowed to proceed to the intermediate stage, thereby forming the resin layer 10. This resin layer 10 is formed from a resin composition in a semi-cured state (semi-cured product).

[0087] As described above, the progress of the curing reaction of the resin layer 10 may differ depending on the resin composition used.

[0088] The thickness of the prepreg 1 (thickness in the Z direction) is not particularly limited, but is, for example, 10 μm or more and 120 μm or less, which can realize a thinner board.

[0089] As described above, the resin layer 10 of the prepreg 1 according to this embodiment is formed from the above-mentioned resin composition, so it is possible to manufacture a substrate that achieves both reduced warpage and improved flame resistance.

[0090] (3) Resin-coated film 3A shows a resin-coated film 2 according to this embodiment. The resin-coated film 2 is in the form of a film or sheet as a whole. The resin-coated film 2 comprises a resin layer 20 containing a resin composition or a semi-cured product of a resin composition, and a support film 21 that supports the resin layer 20. The resin-coated film 2 is used for multi-layering printed wiring boards 5 (build-up method), etc.

[0091] When heated or irradiated with light (ultraviolet light), the resin layer 20 hardens to form the insulating layer 40 of the metal-clad laminate 4 and the insulating layer 50 of the printed wiring board 5 (see FIGS. 5 to 6B). The resin layer 20 is similar to the resin layer 10 of the prepreg 1, except that it is not impregnated into the base material 11.

[0092] The thickness of the resin layer 20 is not particularly limited, but is, for example, 10 μm or more and 120 μm or less, which can make the substrate thinner.

[0093] The support film 21 supports the resin layer 20. This makes the resin layer 20 easier to handle. The support film 21 can be peeled off from the resin layer 20 as needed. Preferably, the resin layer 20 is cured to form the insulating layer 40, and then the support film 21 is peeled off from the insulating layer 40. The same applies when forming the insulating layer 50 from the resin layer 20.

[0094] The support film 21 is, for example, an electrically insulating film, but is not particularly limited thereto. Specific examples of the support film 21 include polyethylene terephthalate (PET) film, polyimide film, polyester film, polyparabanic acid film, polyether ether ketone film, polyphenylene sulfide film, aramid film, polycarbonate film, and polyarylate film. The support film 21 is not limited to these films.

[0095] In FIG. 3A, one surface of the resin layer 20 is covered with a support film 21. However, as shown in FIG. 3B, one surface of the resin layer 20 may be covered with a support film 21, and the other surface of the resin layer 20 may be covered with a protective film 22. Like the support film 21, the protective film 22 can also be peeled off from the resin layer 20 as needed. By covering both surfaces of the resin layer 20 in this way, the resin layer 20 becomes even easier to handle. Furthermore, adhesion of foreign matter to the resin layer 20 can be suppressed.

[0096] The protective film 22 is, for example, an electrically insulating film, but is not limited thereto. Specific examples of the protective film 22 include a polyethylene terephthalate (PET) film, a polyolefin film, a polyester film, and a polymethylpentene film. The protective film 22 is not limited to these films.

[0097] As described above, the resin layer 20 of the resin-coated film 2 according to this embodiment is formed from the above-mentioned resin composition, making it possible to manufacture a substrate that achieves both reduced warping and improved flame resistance.

[0098] (4) Resin-coated metal foil Fig. 4 shows a resin-coated metal foil 3 according to this embodiment. The resin-coated metal foil 3 is in the form of a film or sheet as a whole. The resin-coated metal foil 3 comprises a resin layer 30 containing a resin composition or a semi-cured product of the resin composition, and a metal foil 31 adhered to the resin layer 30. The resin-coated metal foil 3 is used for multi-layering printed wiring boards 5 (build-up method), etc.

[0099] When heated or irradiated with light (ultraviolet light), the resin layer 30 hardens to form the insulating layer 40 of the metal-clad laminate 4 and the insulating layer 50 of the printed wiring board (see FIGS. 5 to 6B). The resin layer 30 is similar to the resin layer 10 of the prepreg 1, except that it is not impregnated into the base material 11.

[0100] The thickness of the resin layer 30 is not particularly limited, but is, for example, 10 μm or more and 120 μm or less, which can make the substrate thinner.

[0101] The metal foil 31 is adhered to the resin layer 30. Specific examples of the metal foil 31 include, but are not limited to, copper foil, aluminum foil, and nickel foil. The metal foil 31 can be etched away to form conductive wiring 51 in a subtractive method or the like (see FIG. 6A, etc.).

[0102] The thickness of the metal foil 31 is not particularly limited, but is preferably, for example, 0.2 μm or more and 35 μm or less.

[0103] When the metal foil 31 is an ultra-thin metal foil, from the viewpoint of improving handleability, the metal foil 31 is preferably part of an ultra-thin metal foil with a carrier. The ultra-thin metal foil with a carrier comprises the metal foil 31 (ultra-thin metal foil), a release layer, and a carrier. In this case, the thickness of the metal foil 31 is, for example, 10 μm or less. The release layer is a layer that temporarily bonds the metal foil 31 and the carrier. If necessary, the metal foil 31 is peeled off from the release layer or the carrier. The carrier is a support that supports the metal foil 31. Specific examples of the carrier include copper foil and aluminum foil. The thickness of the carrier is thicker than the thickness of the metal foil 31.

[0104] As described above, the resin layer 30 of the resin-coated metal foil 3 according to this embodiment is formed from the above-mentioned resin composition, making it possible to manufacture a substrate that achieves both reduced warping and improved flame resistance.

[0105] (5)Metal-clad laminate 5 shows a metal-clad laminate 4 according to this embodiment. The metal-clad laminate 4 includes an insulating layer 40 and a metal layer 41 bonded to the insulating layer 40. The insulating layer 40 includes a cured product of a resin composition or a cured product of a prepreg 1. The metal-clad laminate 4 is used as a material for a printed wiring board 5, etc.

[0106] In FIG. 5, one insulating layer 40 has one substrate 42, but one insulating layer 40 may have two or more substrates 42.

[0107] The thickness of the insulating layer 40 is not particularly limited, but is, for example, 10 μm or more and 120 μm or less, which can make the substrate thinner.

[0108] In Fig. 5, the metal layer 41 is bonded to both sides of the insulating layer 40, but it may be bonded to only one side. A metal-clad laminate 4 in which the metal layer 41 is bonded to both sides of the insulating layer 40 is a double-sided metal-clad laminate. A metal-clad laminate 4 in which the metal layer 41 is bonded to only one side of the insulating layer 40 is a single-sided metal-clad laminate.

[0109] The metal layer 41 is not particularly limited, but examples thereof include metal foil etc. The metal foil is not particularly limited, but examples thereof include copper foil, aluminum foil, and nickel foil etc.

[0110] The thickness of the metal layer 41 is not particularly limited, but is, for example, 0.2 μm or more and 35 μm or less. When the metal layer 41 is an ultra-thin metal foil, from the viewpoint of improving handling, the metal layer 41 is preferably a part of an ultra-thin metal foil with a carrier. The ultra-thin metal foil with a carrier is as described above.

[0111] As described above, the insulating layer 40 of the metal-clad laminate 4 according to this embodiment is formed from the resin composition described above, making it possible to manufacture a substrate that achieves both reduced warping and improved flame resistance.

[0112] (6) Printed wiring board 6A and 6B show a printed wiring board 5 according to this embodiment. The printed wiring board 5 includes an insulating layer 50 and conductor wiring 51 formed on the insulating layer 50. The insulating layer 50 includes a cured product of a resin composition or a cured product of a prepreg 1.

[0113] The printed wiring board 5 shown in FIG. 6A has one insulating layer 50. In FIG. 6A, one insulating layer 50 has one substrate 52, but one insulating layer 50 may have two or more substrates 52. On the other hand, the printed wiring board 5 shown in FIG. 6B has multiple (specifically, three) insulating layers 50. That is, the three insulating layers 50 are a first insulating layer 510, a second insulating layer 520, and a third insulating layer 530. These insulating layers 50 are stacked and bonded in order in the thickness direction. In FIG. 6B, each of the first insulating layer 510, the second insulating layer 520, and the third insulating layer 530 may not have a substrate 52 or may have one or more substrates 52. In this way, the insulating layer 50 is similar to the insulating layer 40 of the metal-clad laminate 4 described above.

[0114] 6A, the conductor wiring 51 is formed on both sides of the insulating layer 50. The conductor wiring 51 may be formed on only one side of the insulating layer 50.

[0115] On the other hand, in the printed wiring board shown in FIG. 6B , the conductor wiring 51 includes an inner layer circuit 511 and an outer layer circuit 512. The inner layer circuit 511 is located between two insulating layers 50. That is, the inner layer circuit 511 is located between the first insulating layer 510 and the second insulating layer 520, and between the second insulating layer 520 and the third insulating layer 530. The outer layer circuit 512 is located outside the insulating layers 50. That is, the outer layer circuit 512 is formed on the surfaces of the first insulating layer 510 and the third insulating layer 530. The printed wiring board 5 shown in FIG. 6B further includes a via hole 8 and a blind via hole 9. The via hole 8 and the blind via hole 9 electrically connect the inner layer circuit 511 and the outer layer circuit 512. That is, the via hole 8 and the blind via hole 9 provide interlayer connection between the inner layer circuit 511 and the outer layer circuit 512.

[0116] The method for forming the conductor wiring 51 is not particularly limited, but examples thereof include a subtractive method and a semi-additive method (SAP: Semi-Additive Process).

[0117] Here, SAP that can be used to form blind via hole 9 will be described with reference to FIGS. 7A to 7G.

[0118] FIG. 7A shows an insulating layer 50 having an inner layer circuit 511 therein and a major surface 501 on the exterior.

[0119] First, as shown in FIG. 7B, the insulating layer 50 is drilled to form non-through holes 90. The drilling can be performed by laser processing. Specific examples of the laser L include a CO2 laser and a UV-YAG laser. The non-through holes 90 are opened on the main surface 501 side of the insulating layer 50. The bottom surfaces 91 of the non-through holes 90 are the surfaces of the inner layer circuits 511. Resin smears 59 are generated during drilling, and these resin smears 59 adhere to the surface of the inner layer circuits 511, which are the bottom surfaces 91 of the non-through holes 90.

[0120] 7C, a desmearing process is performed to remove the resin smear 59. At this time, the main surface 501 of the insulating layer 50 and the inner side surfaces 92 and bottom surfaces 91 of the non-through holes 90 are roughened, and the resin smear 59 is removed from the bottom surfaces 91 and inner side surfaces 92 of the non-through holes 90.

[0121] Next, as shown in FIG. 7D, electroless plating is performed on the main surface 501 of the insulating layer 50, and the bottom surfaces 91 and inner side surfaces 92 of the non-through holes 90 to form an electroless plated layer 61 that will become the seed layer 60.

[0122] 7E, plating resist 53 is formed on main surface 501 of insulating layer 50. Plating resist 53 is formed on main surface 501 of insulating layer 50 in areas where outer layer circuits 512 are not to be formed.

[0123] Next, as shown in FIG. 7F, electrolytic plating is performed to fill the areas not masked by plating resist 53 with plating 62.

[0124] 7G, plating resist 53 is removed, and seed layer 60 interposed between plating resist 53 and main surface 501 of insulating layer 50 is removed by etching. In this manner, blind via holes 9 are formed that electrically connect inner layer circuits 511 and outer layer circuits 512. In particular, blind via holes 9 are also called filled vias because they are filled with plating 62.

[0125] In this embodiment, the insulating layer 50 contains a phosphorus-containing compound (B1), which is a type of reactive flame retardant. As shown in FIG. 8A, after SAP is performed, a filled via without a resin smear 59 can be formed between the inner layer circuit 511 and the electroless plating layer 61. It is even more effective if the insulating layer 50 contains a resin component (D). This eliminates poor conductivity due to the resin smear 59 and improves conductivity reliability. Note that "without a resin smear 59" does not only mean that no resin smear 59 remains, but also that a very small amount remains, so as to have little effect on conductivity reliability.

[0126] In contrast, when an additive flame retardant is contained in the insulating layer 50 instead of the phosphorus-containing compound (B1), Figure 8B As shown in Fig. 1, after SAP is performed, there is a risk that a filled via with a resin smear 59 remaining between the inner layer circuit 511 and the electroless plating layer 61. This resin smear 59 remains and cannot be completely removed even by the desmear treatment.

[0127] (7) Semiconductor Package FIG. 9 shows a semiconductor package 100 according to this embodiment. The semiconductor package 100 includes a printed wiring board 5 and a semiconductor chip 7 mounted on the printed wiring board 5. In this case, the printed wiring board 5 is also called a package substrate, a module substrate, or an interposer. The printed wiring board 5 has at least one insulating layer 50. The insulating layer 50 has at least one base material 52. The insulating layer 50 does not necessarily have to have the base material 52.

[0128] The insulating layer 50 has conductive wiring 51. The conductive wiring 51 includes a pad 513. The pad 513 is formed on the surface of the insulating layer 50.

[0129] There are no particular limitations on the semiconductor chip 7. The semiconductor chip 7 has bumps 70. The bumps 70 are bonded to the pads 513. This electrically connects the semiconductor chip 7 and the printed wiring board 5.

[0130] An underfill resin layer 500 is formed between the semiconductor chip 7 and the printed wiring board 5. The underfill resin layer 500 is formed by filling the gap between the semiconductor chip 7 and the printed wiring board 5 with an underfill liquid sealing material and curing it.

[0131] As described above, the semiconductor package 100 according to this embodiment includes the above-described printed wiring board 5, and therefore it is possible to achieve both reduced warpage and improved flame resistance. [Example]

[0132] The present disclosure will be specifically described below with reference to examples, but the present disclosure is not limited to the examples.

[0133] (1) Resin composition The raw materials for the resin composition are as follows:

[0134] <Maleimide compound (A)> <First maleimide compound (A1)> A fifth maleimide compound (A5) represented by formula (a5), Designer Molecules Inc. (DMI), trade name "BMI-689", maleimide group equivalent weight 345 g / eq A fourth maleimide compound (A4) represented by formula (a4), Designer Molecules Inc. (DMI), trade name "BMI-1500", maleimide group equivalent weight 750 g / eq A third maleimide compound (A3) represented by formula (a3), available from Designer Molecules Inc. (DMI) under the trade name "BMI-3000," with a maleimide group equivalent weight of 1500 g / eq. <Second maleimide compound (A2)> A sixth maleimide compound (A6) represented by formula (a6), manufactured by Daiwa Chemical Industry Co., Ltd., under the trade name "BMI-5100," with an equivalent weight of maleimide groups of 221 g / eq.

[0135] <Phosphorus-containing compound (B)> <Phosphorus-containing compounds (B1)> Reactive flame retardant, Sanko Co., Ltd., product name "SD-5", phosphorus content 9.3% by mass <<Phosphorus-containing compound (B4)>> Reactive flame retardant, diphenyl-2-methacryloyloxyethyl phosphate, Daihachi Chemical Industry Co., Ltd., trade name "MR-260" (represented by formula (b4)), phosphorus content 8.0% by mass <Phosphorus-containing epoxy resin> Nippon Steel Chemical & Material Co., Ltd., product name "YDFR-290EK75", phosphorus content 1.8% by mass <Phosphorus-containing phenolic resin> ·DIC Corporation, product name "HPC-9080P", phosphorus content 8% by mass, hydroxyl equivalent 249g / eq.

[0136] <Styrene-based copolymer (C)> Hydrogenated styrene (ethylene / butylene) styrene copolymer, hydrogenated styrene-based thermoplastic elastomer (SEBS), Asahi Kasei Corporation, product name "Tuftec (registered trademark) H1051" (weight average molecular weight 71,000) Hydrogenated methylstyrene (ethylene / butylene) methylstyrene copolymer, hydrogenated styrenic thermoplastic elastomer (SEBS), Kuraray Co., Ltd., product name "Septon (registered trademark) V9827" (weight average molecular weight 92,000).

[0137] <Resin component (D)> Epoxy compounds Naphthalene-type epoxy resin, DIC Corporation, product name "HP-9500" (epoxy equivalent weight 230g / eq) Biphenyl-type epoxy resin, Nippon Kayaku Co., Ltd., product name "NC-3000-H" (epoxy equivalent weight 280-300g / eq) <Phenol compounds> Phenol novolac, DIC Corporation, product name "TD-2090" (hydroxyl equivalent: 105g / eq).

[0138] <Inorganic filler (E)> Fused silica, Admatechs Co., Ltd., product name "SC2050-MTX", average particle size 0.5 μm.

[0139] <Other (F)> 2-Ethyl-4-methylimidazole, Shikoku Chemicals Corporation, "2E4MZ" α,α'-Di(t-butylperoxy)diisopropylbenzene, NOF Corporation, "Perbutyl P".

[0140] A varnish of a resin composition was prepared by blending the maleimide compound (A), phosphorus-containing compound (B), styrene copolymer (C), resin component (D), inorganic filler (E), and other components (F) in the amounts shown in Tables 1 to 3, and stirring and mixing the mixture with an appropriate solvent to homogenize it. Note that in some comparative examples, it was not possible to prepare a varnish.

[0141] (2) Prepreg The varnish was impregnated into glass cloth (Nitto Boseki Co., Ltd., #2116 type, WEA116E, E glass, thickness 0.1 mm), and then heated and dried at 100 to 160°C for about 2 to 8 minutes to produce a prepreg.

[0142] (3)Metal-clad laminate Two sheets of the above prepreg were stacked, and 12 μm thick copper foil was placed on both sides. The laminate was heated and pressed at 220°C for 2 hours at a pressure of 3 MPa to produce a double-sided copper-clad laminate (double-sided metal-clad laminate) with a thickness of approximately 0.2 mm. This was used as an evaluation board for the following tests.

[0143] (4) Examination (4.1)Flame resistance Test pieces measuring 125 mm in length and 12.5 mm in width were cut out from the evaluation board. These test pieces were then subjected to a flame test (vertical flame test) 10 times in accordance with Underwriters Laboratories' "Test for Flammability of Plastic Materials - UL94." Specifically, the flame test was performed twice on each of the five test pieces. The total duration of the flames during the flame test was calculated, and the flame resistance was evaluated according to the following criteria.

[0144] "V-0": Total time is 5 seconds or less "V-1": Total time is over 5 seconds "Combustion": Combustion continues and burns to the end.

[0145] (4.2) Desmear resistance The desmear resistance was evaluated by calculating the amount of desmear etching (amount of weight loss) as follows: The smaller the amount of desmear etching, the better the desmear resistance.

[0146] The desmear etching amount was calculated by the following formulas (8) and (9).

[0147] M2 (mg) = M0 (mg) - M1 (mg) (8) Desmear etching amount (mg / cm 2 )=M2(mg) / S a (cm 2 )···(9) M0: initial mass of the sample (mg) M1: Mass of the sample after desmearing (mg) M2: Mass loss (mg) S a : surface area of ​​sample (cm 2 ) Specifically, the desmear etching amount was calculated through the following steps.

[0148] (4.2.1) Sample preparation A sample was prepared by removing the metal foil from an evaluation substrate measuring 10 cm x 10 cm.

[0149] (4.2.2) Initial drying, cooling and measurement of initial mass The sample was dried in a thermostatic oven at 130°C for 30 minutes, and then cooled in a dry desiccator at room temperature for 120 minutes or more.Then, the initial mass M0 (mg) of the sample was measured using an electronic balance.

[0150] (4.2.3) Swelling After the initial mass measurement, the sample was immersed in a swelling solution (500 ml / L "Swelling Dip Securigant P" manufactured by Atotech Japan, 3 g / L aqueous sodium hydroxide solution) at 60°C for 5 minutes.

[0151] (4.2.4) Micro-etching The swollen sample was immersed in an oxidizing agent (580 ml / L of "Concentrate Compact CP" manufactured by Atotech Japan, 40 g / L of aqueous sodium hydroxide solution) at 80° C. for 10 minutes.

[0152] (4.2.5) Neutralization After microetching, the sample was immersed in a neutralizing solution (70 ml / L of "Reduction Solution Securigant P500" manufactured by Atotech Japan, 50 ml / L of sulfuric acid (98%)) at 40°C for 5 minutes.

[0153] (4.2.6) Drying, cooling and measuring the mass after treatment The neutralized sample was washed with water and dried in a dryer. The sample was then dried in a thermostatic oven at 130°C for 30 minutes, and then cooled in a dry desiccator at room temperature for 120 minutes or more. The mass M1 (mg) of the sample after desmearing was then measured using an electronic balance.

[0154] (4.3) Glass transition temperature (Tg) First, the copper foil on both sides of the evaluation substrate was removed by etching to obtain an unclad plate. Next, the glass transition temperature (Tg) of the unclad plate was measured using a Seiko Instruments Inc. viscoelasticity spectrometer "DMS100." Dynamic mechanical analysis (DMA) was performed using a bending module at a frequency of 10 Hz. The temperature at which the loss tangent (tanδ) reached a maximum when the temperature was increased from room temperature to 320°C at a heating rate of 5°C / min was defined as the glass transition temperature (Tg).

[0155] (4.4) Loss tangent (tanδ) The unclad plate was cut into 5 mm wide strips in a direction tilted 45° from the warp direction (bias direction) of the substrate to prepare 25 mm long specimens. Dynamic mechanical analysis (DMA) was performed on these specimens using a dynamic viscoelasticity measuring device (SII Nano Technology Inc., model "DMS6100") under the following conditions: a chucking distance of 10 mm, a heating rate of 5°C / min, a frequency of 10 Hz, and tension mode. The loss tangent (tanδ) was calculated as the minimum value between 100 and 200°C.

[0156] (4.5) Package warpage First, a semiconductor package (PKG) was manufactured to measure the amount of package warpage (see Figure 9). Specifically, unnecessary copper foil on one side of an evaluation board (12 mm x 12 mm) was removed by etching to form conductive wiring (pads), and the copper foil on the other side of the evaluation board was completely removed by etching. A semiconductor chip measuring 10 mm x 10 mm x 0.1 mm thick was also prepared. The semiconductor chip had bumps.

[0157] Then, the bumps of the semiconductor chip were bonded to the pads of the evaluation substrate, and the gap between the evaluation substrate and the semiconductor chip was filled with a liquid underfill sealant (Panasonic Corporation, product name "CV5300AM") and allowed to harden. In this way, a simple semiconductor package was manufactured for measuring the amount of package warpage.

[0158] Next, the warpage of the above semiconductor package was measured based on the shadow moire measurement theory using a warpage measurement device (AKROMETRIX, model "THERMOIRE PS200"). Specifically, the amount of package warpage was measured as follows. The above semiconductor package was heated twice. The first time, it was heated from 30°C (starting temperature) to 260°C, and then cooled to 30°C (finishing temperature). The second time, it was similarly heated from 30°C (starting temperature) to 260°C, and then cooled to 30°C (finishing temperature). The warpage amounts at the starting and ending temperatures for the second time were almost the same. Therefore, the amount of warpage at 30°C for the second time was taken as the amount of package warpage.

[0159] [Table 1]

[0160] [Table 2]

[0161] [Table 3] [Explanation of symbols]

[0162] 1 Prepreg 10 Resin layer 11 Base material 2 Resin-coated film 20 Resin layer 21 Support film 3 Resin-coated metal foil 30 resin layer 31 Metal foil 4 Metal-clad laminate 40 insulating layer 41 Metal layer 5. Printed wiring board 50 insulating layer 51 Conductor wiring

Claims

1. A composition comprising a maleimide compound (A) and a phosphorus-containing compound (B), the maleimide compound (A) includes a first maleimide compound (A1) having an alkyl group having 6 or more carbon atoms and / or an alkylene group having 6 or more carbon atoms, The phosphorus-containing compound (B) includes a phosphorus-containing compound (B1) having both a structure represented by the following formula (b1) and a structure represented by the following formula (b3.1) or (b3.2): Resin composition. 【Chemical 1】 (In formula (b1), s represents an integer of 1 to 10, Z represents an arylene group, and R １ ~R ３ each independently represents a hydrogen atom or a monovalent organic group, and * represents a bond. 【Chemistry 2】 (In formula (b3.1) and formula (b3.2), * indicates a bond.)

2. The phosphorus content of the phosphorus-containing compound (B) is 7 mass% or more based on the total mass of the phosphorus-containing compound (B). The resin composition according to claim 1.

3. The phosphorus-containing compound (B1) further has a structure represented by the following formula (b2.1): The resin composition according to claim 1 or 2. 【Chemistry 3】 (In formula (b2.1), * indicates a bond.)

4. the maleimide group equivalent weight of the first maleimide compound (A1) is 400 g / eq or more; The resin composition according to any one of claims 1 to 3.

5. The maleimide compound (A) further contains a second maleimide compound (A2) having a maleimide group equivalent weight of less than 400 g / eq. The resin composition according to any one of claims 1 to 4.

6. The maleimide compound (A) includes at least one selected from the group consisting of a third maleimide compound (A3) represented by the following formula (a3), a fourth maleimide compound (A4) represented by the following formula (a4), and a fifth maleimide compound (A5) represented by the following formula (a5): The resin composition according to any one of claims 1 to 5. 【Chemistry 4】 (In formula (a3), n represents an integer of 1 to 10.) 【Chemistry 5】 (In formula (a4), n represents an integer of 1 to 10.) 【Chemistry 6】

7. Further containing a non-hydrogenated product and / or a hydrogenated product of a styrene-based copolymer (C), The styrene copolymer (C) has a weight average molecular weight of 10,000 or more and 150,000 or less. The resin composition according to any one of claims 1 to 6.

8. The styrene copolymer (C) contains at least one selected from the group consisting of methylstyrene (ethylene / butylene) methylstyrene copolymer, methylstyrene (ethylene-ethylene / propylene) methylstyrene copolymer, styrene-isoprene copolymer, styrene-isoprene-styrene copolymer, styrene (ethylene / butylene) styrene copolymer, styrene (ethylene-ethylene / propylene) styrene copolymer, and hydrogenated products thereof. The resin composition according to claim 7.

9. Further containing a resin component (D), The resin component (D) contains at least one selected from the group consisting of epoxy compounds, phenol compounds, polyphenylene ether compounds, modified polyphenylene ether compounds having a reactive unsaturated group, benzoxazine compounds, radical polymerizable compounds having a polymerizable unsaturated group, cyanate ester compounds, and amine compounds. The resin composition according to claim 7 or 8.

10. per 100 parts by mass of the total of the maleimide compound (A), the styrene-based copolymer (C), and the resin component (D), the content of the maleimide compound (A) is 20 parts by mass or more and 50 parts by mass or less, The content of the styrene copolymer (C) is 10 parts by mass or more and 40 parts by mass or less. The resin composition according to claim 9.

11. A substrate and a resin layer impregnated in the substrate and containing the resin composition according to any one of claims 1 to 10 or a semi-cured product of the resin composition. Prepreg.

12. A resin layer comprising the resin composition according to any one of claims 1 to 10 or a semi-cured product of the resin composition, and a support film supporting the resin layer. Resin-coated film.

13. A resin layer comprising the resin composition according to any one of claims 1 to 10 or a semi-cured product of the resin composition, and a metal foil adhered to the resin layer. Metal foil with resin.

14. An insulating layer comprising a cured product of the resin composition according to any one of claims 1 to 10 or a cured product of the prepreg according to claim 11, and a metal layer adhered to the insulating layer. Metal-clad laminate.

15. An insulating layer comprising a cured product of the resin composition according to any one of claims 1 to 10 or a cured product of the prepreg according to claim 11, and conductor wiring formed on the insulating layer. Printed wiring board.

Images