Test tray for semiconductor devices and test apparatus using the test tray

Abstract

To provide a test tray which allows a relatively large number of semiconductor devices to be mounted thereon for the size thereof.SOLUTION: A test apparatus for semiconductor devices according to an embodiment of the present invention comprises: a test board provided with a preparation surface for preparing a test tray having a semiconductor device mounted in an insert thereon, and configured to test the semiconductor device mounted in the insert; and a pressing unit located facing the preparation surface and configured to press the insert of the test tray prepared on the preparation surface toward the test board.SELECTED DRAWING: Figure 11

Description

[Technical Field]

[0001] The present invention relates to a test tray for semiconductor devices and a test apparatus in which the test tray is used. [Background technology]

[0002] Semiconductor devices that have gone through the production process undergo a predetermined test and are graded before being released to the market. The grade is achieved by mounting the semiconductor device on a test device that evaluates the performance of the semiconductor device and conducting the test.

[0003] Tests vary depending on the type of semiconductor device, and test results are classified as A / B / C / D, or as good / bad / retest, or in other various ways.

[0004] In order to quickly test a large number of semiconductor devices, a handler apparatus or the like was used for testing the semiconductor devices. At this time, in order to test a large number of semiconductor devices at the same time, the semiconductor devices were handled by the handler in a state where multiple devices were stacked on a tray.

[0005] Such a tray is generally a straight plate and includes a plurality of rows and / or columns, and a plurality of devices are arranged in each row or column of the tray.

[0006] On the other hand, devices with terminals located on the side of the semiconductor device, such as dual in-line memory modules (DIMMs), are arranged horizontally on a tray, where the bottom of the tray and the side of the semiconductor device are parallel or on the same plane.

[0007] However, semiconductor devices such as DIMMs generally have a shape in which the length is much longer than the height of the sides, and because of this shape characteristic, semiconductor devices such as DIMMs have a wide footprint when laid on their side, which limits the number of semiconductor devices that can be stacked while maintaining the size of the tray. [Prior art document] [Patent documents] [Patent Document 1] JP 2015-062036 A Summary of the Invention [Problem to be solved by the invention]

[0008] An object of the present invention is to provide a test tray that can load a large number of semiconductor devices relative to the size of the tray.

[0009] Another problem to be solved by the present invention is to provide a test device that can perform a mounting test using such a test tray.

[0010] The objects of the present invention are not limited to the objects mentioned above, and other objects not mentioned will be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0011] To solve the above problem, one embodiment of the present invention provides a test tray on which semiconductor devices are mounted, which includes a plurality of inserts on which the semiconductor devices are mounted, and a frame that supports each of the inserts in an arrangement corresponding to the sockets of a test apparatus, and has a length along a first axis and a width along a second axis.

[0012] The insert includes a mounting block on which the semiconductor device is mounted so that an angle is formed between a plane defined by the first axis and the second axis and a side surface of the semiconductor device, and a push portion that moves the semiconductor device in a push direction away from the mounting block.

[0013] The pushing unit includes a reciprocating member that is formed to be able to advance and retreat on the mounting block and that is advanced to move the semiconductor device in the pushing direction, and a pressure direction changing unit that is movable between a standby position and a pressure position along an axis that intersects the pushing direction on the mounting block and that moves from the standby position to the pressure position in response to an external force to move the reciprocating member in the pushing direction.

[0014] The pressure direction changing unit includes a movable member that moves between the standby position and the pressure position, and a slider that is connected to the movable member and pushes the advancing / retreating member using the force applied by the movable member.

[0015] The movable member includes a guide slit formed along an axis located between an axis along which the movable member moves and an axis along which the reciprocating member advances and retreats.

[0016] The slider has one end connected to the reciprocating member and the other end slidable on the guide slit.

[0017] The pressure direction changing unit further includes an elastic member that provides a restoring force so that the movable member is positioned at the standby position in the absence of an external force.

[0018] When the movable member is positioned at the standby position, one end is exposed to the outside of the mounting block, and when the one end is pressed toward the other end by an external force, the movable member moves to the pressing position.

[0019] The mounting block includes a guide hole or a guide pin extending parallel to the moving direction of the movable member so as to interact with components of an external pressure device when the pressure device applies pressure to the movable member.

[0020] The mounting block includes an insert alignment hole or an insert alignment pin extending parallel to the pushing direction to interact with the test device.

[0021] The push portion includes a push alignment hole or a push alignment pin extending parallel to the pushing direction so that the push portion can be further aligned with the socket after the test device and the mounting block are aligned by the insert alignment hole or the insert alignment pin.

[0022] When the semiconductor device is mounted on the mounting block so that the side of the semiconductor device is positioned in front of the front surface of the mounting block, the length from the side of the semiconductor device to the rear end of the mounting block is shorter than the height of the side of the semiconductor device.

[0023] To solve the above problem, one embodiment of the present invention provides a testing apparatus for semiconductor devices, which includes a test board having a preparation surface on which a test tray with the semiconductor device attached to an insert is prepared, and which performs tests on the semiconductor device attached to the insert, and a pressure unit positioned facing the preparation surface and which presses the insert of the test tray prepared on the preparation surface toward the test board.

[0024] The test board includes an insert guide block that supports the insert of the test tray prepared on the preparation surface, and a socket that is positioned on the insert guide block and has a connection surface through which an axis that intersects the pressure direction of the pressure unit passes, and is electrically connected to terminals on the side of the semiconductor device that is in close contact with the connection surface, and exchanges signals for testing with the semiconductor device.

[0025] The insert guide block is positioned adjacent to the socket and includes an insert alignment hole or an insert alignment pin extending parallel to the direction in which the insert is pushed so as to interact with the insert when the insert is pushed in a direction intersecting the pressure direction.

[0026] The socket includes a push alignment hole or a push alignment pin extending parallel to the direction in which the insert is pushed so that the semiconductor device is further aligned with respect to the connection surface after the insert is aligned by the insert alignment hole or the insert alignment pin.

[0027] The push alignment hole or the push alignment pin has a smaller diameter than the insert alignment hole or the insert alignment pin.

[0028] The insert alignment pin protrudes from the push alignment pin.

[0029] The insert guide block includes a preparation alignment hole or a preparation alignment pin extending parallel to the direction in which the test tray approaches the preparation surface so as to interact with the insert during the process in which the test tray is prepared on the preparation surface.

[0030] The pressure applying portion includes a guide hole or a guide pin extending parallel to the pressure applying direction so as to interact with the insert.

[0031] The thickness of the insert guide block in a direction perpendicular to the coupling surface is shorter than the height of the side surface of the semiconductor device.

[0032] Other details of the invention are included in the detailed description and drawings. [Effects of the Invention]

[0033] According to the embodiment of the present invention, at least the following effects are obtained.

[0034] By maximizing the number of semiconductor devices that can be loaded on one tray, the time required to test a large number of semiconductor devices can be effectively reduced.

[0035] The effects of the present invention are not limited to the above-mentioned examples, and a wider variety of effects are included within the present specification. [Brief explanation of the drawings]

[0036] [Figure 1] 1 is a block diagram of an example of a test system in which a test device according to an embodiment of the present invention can be used; [Figure 2] 1 illustrates a test board and test tray according to one embodiment of the present invention. [Figure 3] 1 is a plan view of a test tray according to an embodiment of the present invention; [Figure 4] FIG. 2 is a plan view of a test board according to an embodiment of the present invention. [Figure 5] 1 shows an insert according to one embodiment of the present invention. [Figure 6] 1 shows a state in which a semiconductor device is mounted on an insert according to an embodiment of the present invention. [Figure 7] 1 illustrates an insert guide block according to one embodiment of the present invention. [Figure 8] 1 is a front view of a portion of a pressure unit according to an embodiment of the present invention; [Figure 9] 10 is a view illustrating a state in which a pressing part, an insert, and an insert guide block according to an embodiment of the present invention are aligned along the Z axis. [Figure 10] 10 is a view illustrating a state in which a pressure unit, an insert, and an insert guide block according to an embodiment of the present invention are aligned along the Z axis, at a different angle from FIG. 9 . [Figure 11] 10 is a view illustrating a state in which a primary push body according to an embodiment of the present invention is in contact with a mounting block. [Figure 12]10 is a view illustrating a state in which a secondary pushing body presses a movable member according to an embodiment of the present invention. [Figure 13] 10 is a diagram comparing the height of a side surface of a semiconductor device with the length of an insert and a socket in a state where they are closely attached to each other according to an embodiment of the present invention; DETAILED DESCRIPTION OF THE INVENTION

[0037] The advantages and features of the present invention, as well as methods for achieving them, will become apparent from the following detailed description of the embodiments in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, and may be embodied in various different forms. The embodiments are provided solely to complete the disclosure of the present invention and to fully convey the scope of the invention to those skilled in the art. The present invention is defined by the scope of the claims.

[0038] Furthermore, the embodiments described herein are described with reference to cross-sectional views and / or schematic diagrams that are ideal examples of the present invention. Therefore, the shapes of the illustrative views may be modified due to manufacturing techniques and / or tolerances. Furthermore, the components in the drawings shown in the present invention may be slightly enlarged or reduced in size for the convenience of explanation. The same reference numerals refer to the same components throughout the specification.

[0039] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described with reference to the drawings illustrating a test tray for semiconductor devices according to an embodiment of the present invention and a test apparatus using the test tray.

[0040] Fig. 1 is a block diagram of an example of a test system in which a test device according to an embodiment of the present invention can be used. As shown in Fig. 1, a test device 200 according to an embodiment of the present invention can be used with a handler H. In the example of Fig. 1, multiple test devices 200 are included in the system, but the number of test devices 200 can be varied according to the needs of the user.

[0041] The handler H is a unit responsible for transporting and sorting semiconductor devices. The handler H can transport semiconductor devices from a user tray to a test tray to be tested by the test equipment 200. The handler H can also transport semiconductor devices that have completed testing in the test equipment 200 from the test tray to a user tray for external transport.

[0042] The transfer T is a unit that transports test trays between the handler H and the test device 200. The transfer T can collect test trays that have been tested in each test device 200 and transfer them to the handler H. The transfer T can also transfer test trays waiting in the handler H to each test device 200.

[0043] The test apparatus 200 can provide a necessary test environment by adjusting the temperature or implementing an interface for interacting with the semiconductor devices as needed. The semiconductor devices can be loaded on a test tray and subjected to necessary tests within the test apparatus 200.

[0044] Such a test device 200 can be configured to include a device for performing a test and a pressure device.

[0045] Hereinafter, the device for performing the test is referred to as a test board. The test board is electrically connected to each semiconductor device loaded on the test tray, and can exchange signals for testing.

[0046] Hereinafter, the pressure device will be referred to as the pressure unit. The pressure unit is a device for tightly contacting the inserts of the test trays prepared on the test board with the sockets of the test board.

[0047] A test device and a test tray according to an embodiment of the present invention will be described in detail below with reference to Figures 2 to 4. Figure 2 shows a test board and a test tray according to an embodiment of the present invention. Figure 3 is a plan view of the test tray according to an embodiment of the present invention. Figure 4 is a plan view of the test board according to an embodiment of the present invention.

[0048] 2, the test tray 100 transferred into the testing device 200 (see FIG. 1) by a transporting device such as a transfer T (see FIG. 1) can be aligned coaxially with the test board 210. In this state, when the test tray 100 and the test board 210 approach each other along the same axis, the test tray 100 and the test board 210 can be brought into close contact with each other.

[0049] Hereinafter, when the test tray 100 and the test board 210 are in contact with each other with their central axes aligned coaxially, it is referred to as the test tray 100 being prepared on the test board 210. In addition, the top surface of the test board 210 (see FIG. 2) that comes into contact with the prepared test tray 100 is referred to as the prepared surface.

[0050] 2 illustrates an example in which the test tray 100 and the test board 210 are aligned based on the Z axis, but the present invention is not limited to such an example. Therefore, the test tray 100 may be aligned based on the X axis or the Y axis depending on the installation direction of the test board 210.

[0051] For the sake of convenience, the following description will be made assuming that the X axis is the length direction, the Y axis is the width direction, and the Z axis is the height direction. However, the relationship between these directions and axes may be changed when the invention is actually installed.

[0052] 2 and 3, the test tray 100 may have a shape similar to a rectangular parallelepiped with a large bottom surface and a small height. The test tray 100 may include a frame 120 and a plurality of inserts 110.

[0053] The frame 120 can form a frame for the test tray 100. Such a frame 120 can have a length along the X axis (or first axis), a width along the Y axis (or second axis), and a height along the Z axis (or third axis). The frame 120 can sometimes be referred to as a tray frame, to distinguish it from the mounting frame 114 described below.

[0054] The frame 120 may have a plurality of insert mounting grooves 121 formed therein, into which the inserts 110 can be mounted. The insert mounting grooves 121 may be formed to penetrate the frame 120 to correspond to the shape of the bottom surface of the insert 110. Although FIG. 3 illustrates an example in which a plurality of insert mounting grooves 121 form one row and multiple rows of the insert mounting grooves 121 are formed in the frame 120, the arrangement and number of the insert mounting grooves 121 may be variously changed depending on the use of the present invention.

[0055] More specifically, the shape of the insert mounting groove 121 is a shape that protrudes partially from the shape of the bottom surface of the insert 110. The protruding portion can provide extra space when the insert 110 is attached to or detached from the insert mounting groove 121. In addition, the insert mounting groove 121 can be slightly larger than the insert 110 so that the insert 110 placed therein can move (swing) slightly.

[0056] The arrangement of the insert mounting grooves 121 on the frame 120 can correspond to the arrangement of the sockets on the test board 210. The inserts 110 mounted in the insert mounting grooves 121 can face the corresponding sockets on the test board 210 when the test tray 100 is prepared on the test board 210.

[0057] The insert 110 may be mounted in the insert mounting groove 121 to mount a semiconductor device therein. The insert 110 may be mounted in the insert mounting groove 121 so as to be movable within the insert mounting groove 121. The method for movably mounting the insert 110 in the insert mounting groove 121 may be implemented by various conventional methods.

[0058] The detailed structure of the insert will be described later with reference to FIGS.

[0059] 4, the test board 210 is a board fixed in a chamber for testing. The test board 210 may include a computing unit for testing semiconductor devices electrically connected via sockets. With the sockets and semiconductor devices electrically connected, the test board 210 can exchange test signals with the semiconductor devices via the sockets.

[0060] The test board 210 may have insert guide blocks 211 formed at positions corresponding to the insert mounting grooves 121. The insert guide blocks 211 may support the corresponding inserts 110 of the test tray 100.

[0061] The preparation surface of the test board 210 is the surface (upper surface) on which the plurality of insert guide blocks 211 are located. The test tray 100 can be seated on the upper surface of the test board 210 in a prepared state.

[0062] An insert 110 according to an embodiment of the present invention will be described below with reference to Figures 5 and 6. Figure 5 shows the insert according to an embodiment of the present invention, while Figure 6 shows a state in which a semiconductor device is mounted in the insert according to an embodiment of the present invention.

[0063] As shown in FIGS. 5-6, the insert 110 may include a mounting block 111 and a push portion 113 .

[0064] The mounting block 111 can mount the semiconductor device D such that the semiconductor device D is angled with respect to the XY plane (the plane defined by the first and second axes). For example, the semiconductor device D is perpendicular to the XY plane when mounted on the mounting block 111. Furthermore, when mounted on the mounting block 111, the side of the semiconductor device D is exposed to the outside of the insert 110, and a direction intersecting the direction of the external force acting on the insert 110 for the pushing operation can be seen.

[0065] 5 and 6, the mounting block 111 may have a mounting frame 114 at a lower front end thereof. The mounting frame 114 may be configured to be movable along the X-axis relative to the other portion of the mounting block 111 (hereinafter, the mounting block body).

[0066] A groove into which the lower end of the semiconductor device D is mounted may be recessed and formed in the upper end of the mounting frame 114. When the semiconductor device D is mounted in the groove, terminals located on the side of the semiconductor device D may be exposed forward.

[0067] The push unit 113 may be configured to move the semiconductor device D forward. The direction in which the push unit 113 moves the semiconductor device D is referred to as the push direction, and based on FIGS. 5 and 6, the push direction is the direction in which the value on the X axis decreases.

[0068] More specifically, the pushing unit 113 can advance the semiconductor device D and / or the mounting frame 114 along the pushing direction relative to the mounting block body. The pushing unit 113 can include an advancing / retracting member 1131 and a pressure direction changing unit 1132.

[0069] The advancing / retracting member 1131 may form a part of the front surface of the mounting block body. The advancing / retracting member 1131 may support the side surface of the semiconductor device D that faces the mounting block body. In addition, the front surface of the advancing / retracting member 1131 may have a shape that is not completely obstructed by the side surface of the semiconductor device D.

[0070] The advancing / retracting member 1131 is formed to be able to advance and retreat relative to the mounting block body, and can advance to push the semiconductor device D and / or the mounting frame 114 forward. At this time, the front end of the mounting block body can be configured to advance and retreat together with the advance and retreat of the advancing / retracting member 1131, separately from other parts.

[0071] The pressure direction changing unit 1132 can be moved between the standby position and the pressure position by the pressure unit 220 (see FIG. 8). An axis connecting the standby position and the pressure position can intersect with the pushing direction. More specifically, the axis connecting the standby position and the pressure position can be perpendicular to the pushing direction. As an example, the axis connecting the standby position and the pressure position can be parallel to the Z axis.

[0072] The pressure direction changing unit 1132 can change the vertical external force applied by the pressure unit 220 into a horizontal force, thereby moving the advancing / retreating member 1131 in the pushing direction. The pressure direction changing unit 1132 allows the pressure direction applied by the pressure unit 220 and the pushing direction by the advancing / retreating member 1131 to intersect with each other.

[0073] Guide holes 1111 may be formed on both ends of the upper surface of the mounting block 111 along the Y axis. The guide holes 1111 may be formed through the mounting block 111 along the Z axis parallel to the pressure direction of the pressure unit 220.

[0074] An insert alignment hole 1112 formed through the mounting block 111 in a direction parallel to the pushing direction may be positioned in the mounting block 111 adjacent to the mounting frame 114. The insert alignment hole 1112 may be formed so that the insert 110 moves along the pushing direction and is aligned with the insert guide block 211 (see FIG. 7).

[0075] Although not shown, a preparation alignment hole (not shown) for aligning with the insert guide block 211 during the process of seating on the preparation surface may be formed through the bottom surface of the mounting block 111. The preparation alignment hole may be formed through the bottom surface of the mounting block 111 in a direction parallel to the direction in which the test tray 100 approaches the preparation surface. For example, the preparation alignment hole may extend in a direction parallel to the Z axis.

[0076] The insert 110 can be moved within the insert mounting groove 121 and its position can be adjusted while being aligned by the guide hole 1111, the insert alignment hole 1112 and / or the preliminary alignment hole.

[0077] Although not shown, a push alignment hole (not shown) extending along the push direction may be formed through the advancing / retracting member 1131. The diameter of the push alignment hole is smaller than the diameter of the insert alignment hole 1112.

[0078] The push alignment holes are components for additionally aligning the semiconductor device D and / or the advancing / retracting member 1131 with respect to the socket after the insert 110 has been aligned by the insert alignment holes 1112.

[0079] The push alignment holes may be formed on the retractable member 1131 in a portion that is not blocked by the semiconductor device D. Alternatively, if the semiconductor device D has a perforated portion, the push alignment holes may be formed on the retractable member 1131 in a position that is exposed through the perforated portion of the semiconductor device D.

[0080] Meanwhile, the advancing / retracting member 1131 may be swingably mounted on the front surface of the mounting block 111 so that its position can be adjusted by the push alignment holes. Alternatively, the semiconductor device D may be slightly movable in the Z-axis and Y-axis directions while mounted on the mounting frame 114, and may be aligned and moved by a member interacting with the push alignment holes.

[0081] In the above example, the insert 110 is formed with the guide holes 1111, the insert alignment holes 1112, the push alignment holes, and the pre-alignment holes, but the present invention is not necessarily limited to such an embodiment.

[0082] For example, the insert 110 may include a guide pin (described below) instead of the guide hole 1111. In this case, a device including the guide pin may include the guide hole 1111 instead to interact with the insert 110.

[0083] Additionally, the insert 110 may include an insert alignment pin, which will be described later, instead of the insert alignment hole 1112. In this case, a device including the insert alignment pin may include the insert alignment hole 1112 instead to interact with the insert 110.

[0084] Alternatively, the insert 110 may include a push alignment pin (described below) instead of the push alignment hole. In this case, a device including the push alignment pin may include a push alignment hole instead to interact with the insert 110.

[0085] Alternatively, the insert 110 may include a preparatory alignment pin, which will be described later, instead of the preparatory alignment hole. In this case, a device including the preparatory alignment pin may include the preparatory alignment hole instead to interact with the insert 110.

[0086] An insert guide block according to an embodiment of the present invention will be described below with reference to Fig. 7. Fig. 7 shows an insert guide block according to an embodiment of the present invention.

[0087] A socket 213 may be located on the rear surface of the insert guide block 211. The socket 213 may have the same or similar shape as the side surface of the semiconductor device D so as to come into contact with the side surface of the semiconductor device D. The socket 213 may also include various members that can be electrically connected to terminals on the side surface of the semiconductor device D. For example, the socket 213 may include pogo pins. Exemplarily, the socket 213 is a flat member on which pogo pins that are connected to the terminals of the semiconductor device D are arranged.

[0088] Hereinafter, the surface of the socket 213 to which the side of the semiconductor device D is in close contact will be referred to as the coupling surface. The coupling surface may be located at a position on which an axis intersecting the pressure direction of the pressure unit 220 (see FIG. 8) passes. For example, the coupling surface is a plane perpendicular to the pushing direction. Members electrically connected to terminals in the socket 213 may be located at positions on the coupling surface corresponding to the terminals of the semiconductor device D.

[0089] The insert guide block 211 may include a stiffener 2110 to prevent the socket 213 from being damaged by an external force from the push portion 113. The stiffener 2110 may be provided as a block located in front of the socket 213 and supporting the front surface of the socket 213.

[0090] The stiffener 2110 may function as a stiffener added to supplement the strength and rigidity of the socket 213. Even if an external force is applied to the rear surface of the socket 213 by the push part 113, the support of the stiffener 2110 may prevent the socket 213 from bending beyond a certain degree.

[0091] The support base 2120 can provide a support surface on which the insert 110 rests. The socket 213 and stiffener 2110 support the front of the semiconductor device D, and the support base 2120 can support the bottom of the mounting block 111.

[0092] A seating groove 2122 for seating the mounting frame 114 may be formed on the upper surface of the support base 2120 behind the socket 213. The width of the seating groove 2122 in the Y-axis direction may correspond to the width of the mounting frame 114 in the Y-axis direction.

[0093] The length of the seating groove 2122 in the X-axis direction can be set taking into consideration the state in which the mounting frame 114 is moved backward to the maximum extent and the state in which it is moved forward to the maximum extent. When the test tray 100 is seated on the test board 210, the mounting frame 114 can initially be positioned at the rear end of the seating groove 2122. Thereafter, when the mounting frame 114 moves forward to the maximum extent in the push direction, the mounting frame 114 can be positioned at the front end of the seating groove 2122.

[0094] The inner walls that define the depth of the seating groove 2122 can support both sides of the advancing and retreating mounting frame 114. This can minimize the shaking of the mounting frame 114 during the advancing and retreating process.

[0095] The insert alignment pin 2112 is a fin that protrudes rearward from the stiffener 2110 to interact with the insert alignment hole 1112. The insert alignment pin 2112 may protrude rearward from the stiffener 2110 along an axis parallel to the pushing direction. The diameter and protruding length of the insert alignment pin 2112 may correspond to the diameter and depth of the insert alignment hole 1112.

[0096] The insert alignment pin 2112 is inserted into the insert alignment hole 1112 formed at the front end of the mounting block 111, which advances in response to the operation of the push part 113, and can guide the advancement of the mounting block 111. More specifically, the insert alignment hole 1112 is formed at the front end of the mounting block body, which advances and retreats together with the advancing and retreating member 1131, and when it advances, the insert alignment pin 2112 can be inserted therein.

[0097] Although not shown, the socket 213 and / or stiffener 2110 may be formed with push alignment pins (not shown) for additionally aligning the semiconductor device D after the insert 110 has been aligned by the insert alignment pins 2112. The push alignment pins may protrude rearward from the socket 213 and / or stiffener 2110 along an axis parallel to the pushing direction.

[0098] The diameter and protrusion depth of the push alignment pin may correspond to the diameter and depth of the push alignment hole. More specifically, the push alignment pin may be shorter in length than the insert alignment pin 2112 and may protrude less rearward from the connection surface than the insert alignment pin 2112. In addition, the push alignment pin may be smaller in diameter than the insert alignment pin 2112.

[0099] As a result, as the insert 110 advances, its position is primarily aligned by the insert alignment pin 2112 and the insert alignment hole 1112, and then the position of the semiconductor device D relative to the connection surface can be precisely adjusted by the push alignment pin.

[0100] Preliminary alignment pins 2124 protruding upward along the Z-axis may be disposed on both ends of the seating groove 2122 on the support base 2120. The preliminary alignment pins 2124 may be inserted into preliminary alignment holes of the insert 110 seated in the insert guide block 211 to align the position of the insert 110. The interaction between the preliminary alignment pins 2124 and the preliminary alignment holes allows the insert 110 to be seated at an appropriate position on the insert guide block 211.

[0101] Hereinafter, the pressure unit 220 according to an embodiment of the present invention will be described with reference to Fig. 8. Fig. 8 is a front view of a portion of the pressure unit according to an embodiment of the present invention.

[0102] The pressure unit 220 may press the insert 110 toward the socket 213. As shown in FIG. 8, the pressure unit 220 according to an embodiment of the present invention may include a pressure plate 221, a primary push body 222, and a secondary push body 223.

[0103] The pressure plate 221 is a plate that can be raised and lowered along the Z axis by an external drive unit. The external drive unit can be implemented in various forms, such as an actuator or a motor. Exemplarily, the pressure plate 221 can have the same or similar length and width as the test tray 100.

[0104] The pressure plate 221 can be arranged to face the preparation surface of the test board 210. For example, the pressure plate 221 can be installed in a chamber in which the test board 210 is placed so as to face the test board 210.

[0105] A plurality of the primary push bodies 222 and secondary push bodies 223 may be installed on the bottom surface of the pressure plate 221. On the pressure plate 221, each of the primary push bodies 222 and secondary push bodies 223 may be installed at a position corresponding to each of the inserts 110 on the test tray 100.

[0106] The primary pushing body 222 may be formed to be retractable from the secondary pushing body 223. The primary pushing body 222 may be in primary contact with the insert 110 and align the insert 110 with respect to the pressing part 220.

[0107] For this alignment, the primary pushing body 222 may include guide pins 2221 extending downward along the Z-axis from both ends. The guide pins 2221 may be inserted into the guide holes 1111 (see FIGS. 5 and 6) as the pressure plate 221 descends. To this end, the diameter and length of the guide pins 2221 may be formed to correspond to the diameter and depth of the guide holes 1111. The position of the insert 110 on the insert mounting groove 121 may be aligned as the guide pins 2221 are inserted.

[0108] The secondary pushing body 223 is located between the pressure plate 221 and the primary pushing body 222 and can pressurize the insert 110 after the primary pushing body 222 comes into contact with the insert 110 .

[0109] After contacting the insert 110, the primary push body 222 may be accommodated inside the secondary push body 223 as the pressure plate 221 continues to descend. After the primary push body 222 is accommodated to the maximum extent, the secondary push body 223 may press the insert 110 downward.

[0110] Meanwhile, a contact prevention recess 2222 may be formed in the front center of the primary push body 222, and a movable member passage groove 2223 (see FIGS. 11 and 12) may be formed in the rear center of the primary push body 222. This will be described later with reference to FIGS.

[0111] Hereinafter, a state in which the pressure unit, insert, and insert guide block according to an embodiment of the present invention are aligned will be described with reference to Figures 9 and 10. Figure 9 illustrates a state in which the pressure unit, insert, and insert guide block according to an embodiment of the present invention are aligned along the Z axis. Figure 10 illustrates a state in which the pressure unit, insert, and insert guide block according to an embodiment of the present invention are aligned along the Z axis, viewed from a different angle than in Figure 9.

[0112] As shown in FIGS. 9 and 10, the insert 110 of the test tray 100 moved into the test device 200 can be positioned between the primary push body 222 and the insert guide block 211.

[0113] First, the insert 110 is primarily positioned by the preliminary alignment pin 2124 in the process of being seated in the insert guide block 211, and is secondarily positioned by the guide pin 2221 as the primary push body 222 descends.

[0114] More specifically, the diameter of the guide pin 2221 is smaller than that of the preliminary alignment pin 2124. Therefore, after the insert 110 is roughly positioned in the process of being seated on the preliminary alignment pin 2124, the position can be further precisely adjusted by the guide pin 2221.

[0115] At this time, some of the inserts 110 included in the test tray 100 have the preparatory alignment pins 2124 not fully inserted inside, but are positioned on the preparatory alignment pins 2124. These inserts 110 are then lowered by the force of the primary push body 222 pressing the mounting block 111, so that the preparatory alignment pins 2124 can be fully inserted inside the preparatory alignment holes.

[0116] Hereinafter, the pressure direction changing action of the push unit according to an embodiment of the present invention will be described in detail with reference to Figures 11 and 12. Figure 11 is a view illustrating a state in which the primary push body according to an embodiment of the present invention contacts the mounting block. In contrast, Figure 12 is a view illustrating a state in which the secondary push body according to an embodiment of the present invention presses the movable member.

[0117] The first push body 222 is in a protruding state in which it is protruded to the maximum from the second push body 223 in the state of FIG. 11, and in a housed state in which it is housed to the maximum within the second push body 223 in the state of FIG.

[0118] An accommodating space 2231 capable of accommodating the accommodated first push body 222 may be formed inside the second push body 223. Although not shown, an elastic member that maintains the first push body 222 in a protruding state in the absence of external force may be disposed inside the accommodating space 2231. Exemplarily, the elastic member is a coil spring.

[0119] After contacting the mounting block 111 , the first pushing body 222 is pressed by the pressing plate 221 to overcome the elastic force of the elastic member and be inserted into the receiving space 2231 .

[0120] The first push body 222 may be formed so as to be in contact with the entire upper surface of the mounting block 111 and not to be in contact with the semiconductor device D and the movable member 1132a.

[0121] For this purpose, a contact prevention recess 2222 may be formed in front of the first push body 222 to prevent contact between the first push body 222 and the semiconductor device D when the first push body 222 is in contact with the mounting block 111.

[0122] The contact prevention recess 2222 may be formed by recessing the surface of the first push body 222 so as to prevent the semiconductor device D and the first push body 222 from coming into contact with each other when the first push body 222 is in both the protruding state and the retracted state.

[0123] A movable member passing groove 2223 that prevents contact between the movable member 1132a and the first push body 222 may be formed behind the first push body 222. This prevents the movable member 1132a from being pressed by the first push body 222 even when the movable member 1132a is positioned at the standby position.

[0124] As described above, if the insert 110 is not fully inserted into the pre-alignment pin 2124, the insert 110 can be fully seated first by the first pushing body 222. During this process, the movable member 1132a can be positioned inside the movable member passage groove 2223 after the insert 110 is fully seated and before it comes into contact with the second pushing body 223.

[0125] Therefore, according to one embodiment of the present invention, the movable member 1132a is prevented from being pressed and the semiconductor device D is prevented from being advanced when the insert 110 is not completely seated on the support base 2120.

[0126] 11 and 12, the pressure direction changing unit 1132 will be described in detail. The pressure direction changing unit 1132 may further include a movable member 1132a, a slider 1132b, and an elastic member (not shown).

[0127] The movable member 1132a can move up and down between a standby position shown in Fig. 11 and a pressing position shown in Fig. 12. At the standby position, the upper end of the movable member 1132a can be exposed to the outside of the mounting block 111. The exposed portion of the movable member 1132a can be pressed by the second pushing body 223 and move toward the inside of the mounting block 111 as shown in Fig. 12. While the movable member 1132a is pressed by the second pushing body 223, the first pushing body 222 can be housed inside the second pushing body 223.

[0128] A through-hole may be formed in the mounting block 111 in a direction parallel to the Z-axis so that the movable member 1132a can be moved between the standby position and the pressure position. The depth of the through-hole is equal to or greater than the height of the movable member 1132a so that the movable member 1132a can be completely accommodated therein.

[0129] The movable member 1132a may include a guide slit 1132c formed along an axis located between the axis along which the movable member 1132a moves and the axis along which the advancing and retracting member 1131 moves. In this case, the axis located between the axis along which the movable member 1132a moves and the axis along which the advancing and retracting member 1131 moves (hereinafter, referred to as the slit axis) may refer to the following axis.

[0130] The slit axis has an angle with respect to the bottom surface of the support base 1120 and / or the mounting block 111 that is smaller than the angle of the axis along which the movable member 1132a moves (axis parallel to the pressure direction), and larger than the angle of the axis along which the advancing and retreating member 1131 moves (axis parallel to the push direction).

[0131] For example, the axis parallel to the pressure direction may be perpendicular to the bottom surface of the support base 1120 or the mounting block 111. Also, the axis parallel to the push direction may have an angle of 0 degrees with respect to the bottom surface of the support base 1120 or the mounting block 111. In this case, the slit axis may have an angle of about 45 degrees with respect to the bottom surface of the support base 1120 or the mounting block 111.

[0132] The slider 1132b is slidably coupled to the movable member 1132a and can redirect the pressure of the pressure unit 220 in a pushing direction and transmit it to the advancing / retracting member 1131. More specifically, one end of the slider 1132b is connected to the rear end of the advancing / retracting member 1131, and the other end can slide on the guide slit 1132c along the slit axis.

[0133] When the guide slit 1132c is raised and lowered by the raising and lowering of the movable member 1132a, the slider 1132b receives a force from the inner wall of the movable member 1132a that forms the guide slit 1132c, and can move forward or backward. In other words, the change in position of the other end of the slider 1132b within the guide slit 1132c due to the raising and lowering of the movable member 1132a can result in the slider 1132b moving forward or backward.

[0134] When the movable member 1132a is in the pressure position, the slider 1132b can be positioned at the upper end of the guide slit 1132c. In this state, the slider 1132b can move forward relative to the mounting block 111 to the maximum extent.

[0135] On the other hand, when the movable member 1132a is in the standby position, the slider 1132b can be positioned at the lower end of the guide slit 1132c. In this state, the slider 1132b can be retracted into the mounting block 111 to the maximum extent.

[0136] As the position of the slider 1132b changes inside the guide slit 1132c, the rear end of the reciprocating member 1131 connected to the slider 1132b can move together with the slider 1132b.

[0137] The front end of the advancing / retracting member 1131 can advance and come into contact with the semiconductor device D and / or the mounting frame 114. The advancing / retracting member 1131 continues to move even after coming into contact with the semiconductor device D and / or the mounting frame 114, thereby moving the semiconductor device D toward the socket 213.

[0138] Although not shown, the pressure direction changing unit 1132 may include an elastic member that provides a restoring force to maintain the movable member 1132a in the standby position when no external force is applied. The elastic member is disposed inside the through-hole of the mounting block 111 and can elastically support the movable member 1132a upward. For example, the elastic member may be a coil spring.

[0139] According to one embodiment of the present invention, when the pressure plate 221 rises and the pressure on the movable member 1132a is released, the movable member 1132a is returned to its standby position by the elastic member, thereby returning the advancing / retreating member 1131 to its initial position, and the semiconductor device D and the socket 213 can be separated.

[0140] The length of the insert and socket in a state where they are in close contact with each other according to an embodiment of the present invention will be described below with reference to Figure 13. Figure 13 is a diagram comparing the height of the side of a semiconductor device with the length of the insert and socket in a state where they are in close contact with each other according to an embodiment of the present invention.

[0141] As shown in Figure 13, when the insert 110 and the socket 213 are in close contact with each other, the length (L) of the portion of the axis perpendicular to the side surface (or connecting surface) of the semiconductor device D that passes through the insert 110 and the insert guide block 211 is shorter than the height (H) of the side surface of the semiconductor device D.

[0142] In other words, the total thickness of the semiconductor device D, the insert guide block 211, and the mounting block 111 is shorter than the height (H) of the side surface of the semiconductor device D.

[0143] This allows for a greater number of semiconductor devices D to be mounted and positioned on inserts 110 than would be possible with a horizontal placement of semiconductor devices D on a preparation surface, according to one embodiment of the present invention.

[0144] In the above description, among the alignment functions using holes and fins, holes and fins that align objects before other holes and fins can be loosely coupled so that there is a small gap between them when they are coupled together.

[0145] That is, when the hole and fin align the object in the first order, there may be a slight gap between the hole and the pin when the fin is placed inside the hole. This gap is provided in consideration of the hole and pin aligning the object in the second order. Due to this gap, when the fin is inserted into the hole aligning the object in the second order, the fin aligning the object in the first order may also move due to additional alignment inside the hole.

[0146] Those skilled in the art will understand that the present invention can be embodied in other specific forms without changing the technical spirit or essential features thereof. Therefore, the above-described embodiments should be understood to be merely illustrative in all respects and not limiting. The scope of the present invention is defined by the claims below rather than the above detailed description, and all modifications and variations derived from the meaning and scope of the claims and their equivalents should be construed as being within the scope of the present invention. [Explanation of symbols]

[0147] D. Semiconductor devices H Handler T Transfer 100 test trays 110 Insert 111 Mounting Block 1111 Guide Hall 1112 Insert alignment hole 113 Push section 1131 Moving member 1132 Pressure direction change part 1132a Movable member 1132b slider 1132c Guide slit 114 Mounting frame 120 frames 121 Insert mounting groove 200 Test Equipment 210 Test Board 211 Insert guide block 2110 Stiffner 2112 Insert Alignment Pin 2120 Support Base 2122 Safety Ditch 2124 Preparation Alignment Pin 213 Socket 220 Pressure section 221 Pressure Plate 222 Primary Push Body 2221 Guide pin 2222 Contact prevention recess 2223 Movable part passage groove 223 Secondary Push Body 2231 Containment Space

Claims

1. A test apparatus for a plate-shaped semiconductor device having terminals on one side, a test board that supports a test tray with the semiconductor devices mounted on inserts in a support direction and performs tests on the semiconductor devices mounted on the inserts; and a pressure unit that presses the push portion of the insert of the test tray supported by the test board in a pressure direction toward the test board along the support direction, and the test board supports the test tray in the pressure direction; The test board an insert guide block having a support base that seats and supports the insert with the one side surface of the semiconductor device facing a push direction that intersects with the pressure application direction; and a socket positioned on the insert guide block, having a connection surface facing the pushing direction, electrically connected to the terminal on the one side of the semiconductor device that has been moved in the pushing direction by the pushing part that has been pressed in the pressing direction by the pressing part and brought into close contact with the connection surface, and exchanging signals for testing with the semiconductor device.

2. The insert guide block is 2. The test apparatus for semiconductor devices according to claim 1, further comprising: an insert alignment hole and an insert alignment pin positioned adjacent to the socket and extending parallel to the pushing direction, wherein the insert interacts with the other of the insert alignment hole and the insert alignment pin provided on the insert as the insert is pushed in the pushing direction, so that the insert alignment pin is inserted into the insert alignment hole.

3. The socket is 3. The test apparatus for semiconductor devices according to claim 2, further comprising a push alignment hole or a push alignment pin extending parallel to the push direction so that the semiconductor device is further aligned with the connection surface after the insert is aligned by the insert alignment hole or the insert alignment pin.

4. 4. The test apparatus for semiconductor devices according to claim 3, wherein the diameter of the push alignment hole or the push alignment pin is smaller than that of the insert alignment hole or the insert alignment pin.

5. 4. The test apparatus for semiconductor devices according to claim 3, wherein the insert alignment pins protrude from the push alignment pins.

6. The insert guide block is 2. A test apparatus for semiconductor devices as described in claim 1, comprising one of a preparatory alignment hole and a preparatory alignment pin extending parallel to the pressure direction, wherein the preparatory alignment pin is inserted into the preparatory alignment hole by interacting with the other of the preparatory alignment hole and the preparatory alignment pin provided in the insert.

7. The pressure applying unit is 2. A test apparatus for a semiconductor device as described in claim 1, comprising one of a guide hole and a guide pin extending parallel to the pressure direction, wherein the guide pin is inserted into the guide hole by interacting with the other of the guide hole and the guide pin provided in the insert.

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