Wiring sheet and sheet heater

Abstract

This wiring sheet comprises a pseudo-sheet structure (2) in which a plurality of electrically conductive linear bodies (21) are arranged at intervals, a pair of electrodes (4), and a first power supply portion (51) and a second power supply portion (52) respectively provided to the electrodes (4), the wiring sheet being such that all the conditions represented by expression (F1), expression (F2), and expression (F3) are satisfied, where N is the number of electrically conductive linear bodies (21), r is the resistance value of the electrically conductive linear bodies (21), R is the resistance value of the electrodes (4), and Rn is the resistance value of the electrode (4) between the n'th electrically conductive linear body (21) and the (n-1)'th electrically conductive linear body (21), counting from the first power supply portion (51) and second power supply portion (52) side. (F1): r / R≤300 (F2): Rn≤Rn-1 (In expression (F2), n is an integer equal to or greater than 2.) (F3): 0<R2-RN

Description

[Technical Field]

[0001] The present invention relates to a wiring sheet and a sheet heater. [Background technology]

[0002] A sheet-like conductive member (hereinafter also referred to as "conductive sheet") having a pseudo-sheet structure in which multiple conductive linear elements are arranged at intervals may be useful as a component for a variety of items, such as a heating element for a heating device, a heat-generating textile material, or a protective film for a display (shatter-resistant film). As an example of a sheet used as a heating element, Patent Document 1 describes a conductive sheet having a pseudo-sheet structure in which multiple linear elements extending in one direction are arranged at intervals. A pair of electrodes is provided on both ends of the multiple linear elements, thereby obtaining a wiring sheet that can be used as a heating element. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2017 / 086395 Summary of the Invention [Problem to be solved by the invention]

[0004] Metal foil or silver paste is typically used as the electrode for a wiring sheet. However, from the viewpoint of flexibility of the electrode portion of the wiring sheet, the use of metal wire or the like instead of metal foil or silver paste has been considered. On the other hand, when a thin electrode such as a metal wire is used as the electrode, the resistance value of the electrode becomes relatively large. As a result, the difference with the resistance value of the linear body, which is the heat-generating portion, becomes small, and the resistance value of the electrode, which should be negligible, becomes significant. As a result, it has been found that temperature unevenness can occur when a current is passed through a wiring sheet to generate heat.

[0005] An object of the present invention is to provide a wiring sheet and a sheet-like heater that can suppress temperature unevenness. [Means for solving the problem]

[0006] A wiring sheet according to one aspect of the present invention includes a pseudo sheet structure in which a plurality of conductive linear members are arranged at intervals, a pair of electrodes, and a first power supply portion and a second power supply portion provided on each of the electrodes, wherein the number of the conductive linear members is N, the resistance value of the conductive linear members is r, the resistance value of the electrodes is R, and the resistance value of the electrodes between the n-th conductive linear member and the (n-1)-th conductive linear member counting from the first power supply portion and the second power supply portion is R. n When the above formula is set, all of the conditions shown in the following formula (F1), formula (F2), and formula (F3) are satisfied. r / R≦300 (F1) R n ≦R n-1 (F2) (In the formula (F2), n is an integer of 2 or more.) 0 <R2-R N (F3)

[0007] In the wiring sheet according to one aspect of the present invention, the conductive linear elements are preferably spaced apart by 20 mm or less.

[0008] Preferably, the wiring sheet according to one aspect of the present invention further includes a substrate that supports the pseudo sheet structure.

[0009] A sheet-type heater according to one aspect of the present invention is characterized by including the wiring sheet according to the above-described aspect of the present invention.

[0010] According to the present invention, it is possible to provide a wiring sheet and a sheet-like heater that can suppress temperature unevenness. [Brief explanation of the drawings]

[0011] [Figure 1]1 is a schematic diagram showing a wiring sheet according to a first embodiment of the present invention. [Figure 2] FIG. 2 is a cross-sectional view showing the II-II cross section of FIG. [Figure 3] FIG. 4 is a schematic diagram showing a wiring sheet according to a second embodiment of the present invention. [Figure 4] 10 is a graph showing the relationship between power consumption and the number of the conductive linear body in an analysis of power consumption distribution. DETAILED DESCRIPTION OF THE INVENTION

[0012] [First embodiment] The present invention will be described below with reference to the drawings, taking an embodiment as an example. The present invention is not limited to the content of the embodiment. In the drawings, some parts are illustrated enlarged or reduced in size for ease of explanation.

[0013] (wiring sheet) As shown in Figures 1 and 2, the wiring sheet 100 according to this embodiment includes a substrate 1, a pseudo sheet structure 2, a resin layer 3, and a pair of electrodes 4. Specifically, the wiring sheet 100 includes the resin layer 3 laminated on the substrate 1, and the pseudo sheet structure 2 laminated on the resin layer 3. The pseudo sheet structure 2 includes a plurality of conductive linear members 21 arranged at intervals. One electrode 4 is provided with a first power supply portion 51, and the other electrode 4 is provided with a second power supply portion 52.

[0014] In this embodiment, the number of conductive linear bodies 21 is N, the resistance value of the conductive linear body 21 is r [Ω], the resistance value of the electrode 4 is R [Ω], and the resistance value of the electrode 4 between the n-th conductive linear body 21 and the (n-1)-th conductive linear body 21 counting from the first power supply part 51 and the second power supply part 52 side is R n When [Ω] is used, it is necessary to satisfy all of the conditions shown in the following formulas (F1), (F2) and (F3). Here, the "nth conductive linear body counting from the side of the first power supply portion 51 and the second power supply portion 52" refers to the conductive linear body 21 electrically connected to a pair of electrodes 4, and refers to the nth conductive linear body 21 when counted from the first power supply portion 51 and the second power supply portion 52 along the wiring of the wiring sheet 100.

[0015] In this embodiment, it is necessary to satisfy the condition shown in the following formula (F1). r / R≦300 (F1)

[0016] When the value of r / R exceeds 300, the resistance of conductive linear body 21, which is the heat-generating portion, is sufficiently greater than the resistance of electrode 4. Therefore, in wiring sheet 100, the resistance of electrode 4 can be almost ignored, and the problem of temperature unevenness is unlikely to occur in the first place. In contrast, as the value of r / R decreases, the problem of temperature unevenness becomes more likely to occur, and therefore the significance of using wiring sheet 100 according to this embodiment increases. The value of r / R may be equal to or less than 200, or may be equal to or less than 100. However, if the value of r / R is too small, the electrode 4 will also generate heat, so the value of r / R is preferably equal to or greater than 10.

[0017] In this embodiment, it is necessary to satisfy the condition shown in the following formula (F2). R n ≦R n-1 (F2)

[0018] If the condition shown in formula (F2) is not satisfied, the temperature unevenness cannot be suppressed. In formula (F2), n is an integer equal to or greater than 2. The upper limit of n is the number N of conductive linear bodies 21. The number N of conductive linear members 21 is preferably 3 or more, more preferably 5 or more, and even more preferably 10 or more. The greater the number of conductive linear members 21, the more likely temperature unevenness tends to occur. However, even when the number of conductive linear members 21 is large, temperature unevenness can be suppressed according to the wiring sheet 100 according to this embodiment. The upper limit of the number N of conductive linear members 21 is not particularly limited, but is, for example, 150.

[0019] In this embodiment, it is necessary to satisfy the condition shown in the following formula (F3). 0 <R2-R N (F3)

[0020] If the condition shown in formula (F3) is not satisfied, the temperature unevenness cannot be suppressed. In addition, from the viewpoint of further suppressing temperature unevenness, R2-R N The value of R2-R is preferably R / 4N or more, more preferably R / 2N or more, and even more preferably R / N or more. N The value of does not exceed the value of R, which is the resistance value of the electrode 4.

[0021] The inventors of the present invention believe that the reason why temperature unevenness can be suppressed when all of the conditions shown in formulas (F1), (F2), and (F3) are satisfied is as follows. That is, when the condition of formula (F1) is satisfied, the difference between the resistance of conductive linear body 21, which is the heat-generating portion, and the resistance of electrode 4 becomes small, and the resistance of electrode 4, which should normally be negligible, becomes non-negligible. As a result, when current is passed through wiring sheet 100 to generate heat, temperature unevenness may occur. The reason for this is that conductive linear body 21 located distal to first power supply part 51 and second power supply part 52 is significantly affected by the resistance of electrode 4 up to this conductive linear body 21. The inventors infer that, therefore, when current is passed through wiring sheet 100 to generate heat, the current flowing through this conductive linear body 21 becomes relatively small, resulting in a lower temperature compared to the other conductive linear bodies 21. On the other hand, when the conditions shown in the formulas (F2) and (F3) are satisfied, the resistance value R of the electrode 4 between the n-th conductive linear body 21 and the (n-1)-th conductive linear body 21 decreases as the distance from the first power supply part 51 and the second power supply part 52 increases. n The conductive linear body 21 located far from the first feeding part 51 and the second feeding part 52 is affected by the resistance of the electrode 4 up to the conductive linear body 21. n The inventors presume that this is how temperature unevenness can be suppressed.

[0022] The resistance value of the conductive linear body 21 and the resistance value of the electrode 4 can be set by any known method, and can be adjusted by changing the material, cross-sectional area, length, and the like, for example. 1, by increasing the cross-sectional area of ​​the electrode 4 with increasing distance from the first power feed part 51 and the second power feed part 52, the resistance value of the electrode 4 can be decreased with increasing distance from the first power feed part 51 and the second power feed part 52. Furthermore, the electrode may be made of a material whose electrical conductivity increases with increasing distance from the first power feed part 51 and the second power feed part 52.

[0023] (base material) Examples of the substrate 1 include synthetic resin film, paper, metal foil, nonwoven fabric, cloth, and glass film. The substrate 1 can directly or indirectly support the pseudo-sheet structure 2. The substrate 1 is preferably a flexible substrate. The flexible substrate may be a synthetic resin film, paper, nonwoven fabric, cloth, etc. Among these flexible substrates, a synthetic resin film, a nonwoven fabric, or a cloth is preferred, and a nonwoven fabric or a cloth is more preferred. Examples of synthetic resin films include polyethylene films, polypropylene films, polybutene films, polybutadiene films, polymethylpentene films, polyvinyl chloride films, vinyl chloride copolymer films, polyethylene terephthalate films, polyethylene naphthalate films, polybutylene terephthalate films, polyurethane films, ethylene-vinyl acetate copolymer films, ionomer resin films, ethylene-(meth)acrylic acid copolymer films, ethylene-(meth)acrylic acid ester copolymer films, polystyrene films, polycarbonate films, and polyimide films. Other flexible substrates include crosslinked films and laminated films of these. Examples of paper include fine paper, recycled paper, and kraft paper. Examples of nonwoven fabrics include spunbond nonwoven fabrics, needle-punched nonwoven fabrics, melt-blown nonwoven fabrics, and spunlace nonwoven fabrics. Examples of cloth include woven fabrics and knitted fabrics. The paper, nonwoven fabric, and cloth used as flexible substrates are not limited to these.

[0024] (pseudo seat structure) The pseudo sheet structure 2 has a structure in which a plurality of conductive linear members 21 are arranged at intervals from one another. The conductive linear members 21 are linear in a plan view of the wiring sheet 100. The pseudo sheet structure 2 has a structure in which a plurality of conductive linear members 21 are arranged in a direction intersecting the axial direction of the conductive linear members 21. The conductive linear members 21 may have a wave shape in a plan view of the wiring sheet 100. Specific examples of the wave shape include a sine wave, a circular wave, a rectangular wave, a triangular wave, and a sawtooth wave. If the pseudo sheet structure 2 has such a structure, breakage of the conductive linear members 21 can be suppressed when the wiring sheet 100 is stretched in the axial direction of the conductive linear members 21.

[0025] The volume resistivity of the conductive linear body 21 is 1.0×10 -9 Ω m or more 1.0×10 -3It is preferable that the resistance is Ω·m or less, and 1.0×10 -8 Ω m or more 1.0×10 -4 It is more preferable that the volume resistivity is Ω·m or less. When the volume resistivity of the conductive linear members 21 is in the above range, the surface resistance of the pseudo sheet structure 2 tends to decrease. The volume resistivity of the conductive linear body 21 is measured as follows. Silver paste is applied to both ends of the conductive linear body 21, and the resistance of a portion 40 mm long from the end is measured to determine the resistance value of the conductive linear body 21. Then, the cross-sectional area (unit: m 2 ) is multiplied by the resistance value, and the obtained value is divided by the measured length (0.04 m) to calculate the volume resistivity of the conductive linear body 21.

[0026] The cross-sectional shape of the conductive linear body 21 is not particularly limited and may be polygonal, flat, elliptical, circular, or the like, but is preferably elliptical or circular from the viewpoint of compatibility with the resin layer 3, etc. When the cross section of the conductive linear member 21 is circular, the thickness (diameter) D (see FIG. 2) of the conductive linear member 21 is preferably 5 μm or more and 75 μm or less. From the viewpoints of suppressing an increase in sheet resistance and improving heat generation efficiency and dielectric breakdown resistance when the wiring sheet 100 is used as a heating element, the diameter D of the conductive linear member 21 is more preferably 8 μm or more and 60 μm or less, and even more preferably 12 μm or more and 40 μm or less. When the cross section of the conductive linear body 21 is elliptical, it is preferable that the major axis is in the same range as the diameter D described above.

[0027] The diameter D of the conductive linear body 21 is determined by observing the conductive linear body 21 of the pseudo sheet structure 2 using a digital microscope, measuring the diameter of the conductive linear body 21 at five randomly selected locations, and taking the average value.

[0028] The interval L (see FIG. 2) between the conductive linear members 21 is preferably 20 mm or less, more preferably 0.5 mm or more and 15 mm or less, and even more preferably 1 mm or more and 10 mm or less. If the spacing between the conductive linear members 21 is within the above range, the conductive linear members are relatively densely packed, thereby improving the functionality of the wiring sheet 100, such as maintaining a low resistance of the pseudo-sheet structure and making the distribution of temperature rise uniform when the wiring sheet 100 is used as a heating element.

[0029] The distance L between the conductive linear members 21 is measured by observing the conductive linear members 21 of the pseudo sheet structure 2 visually or using a digital microscope, and measuring the distance between two adjacent conductive linear members 21. The interval between two adjacent conductive linear bodies 21 is the length along the direction in which the conductive linear bodies 21 are arranged, and is the length between opposing portions of the two conductive linear bodies 21 (see FIG. 2). When the conductive linear bodies 21 are arranged at uneven intervals, the interval L is the average value of the intervals between all adjacent conductive linear bodies 21.

[0030] The conductive linear body 21 is not particularly limited, but is preferably a linear body including a metal wire (hereinafter also referred to as a "metal wire linear body"). Metal wire has high thermal conductivity, high electrical conductivity, easy handling, and versatility, so when a metal wire linear body is used as the conductive linear body 21, the resistance value of the pseudo sheet structure 2 is reduced while the light transmittance is easily improved. Furthermore, when the wiring sheet 100 (pseudo sheet structure 2) is used as a heating element, rapid heat generation is easily achieved. Furthermore, as described above, it is easy to obtain linear bodies with a small diameter. The conductive linear body 21 may be a metal wire linear body, a linear body containing carbon nanotubes, or a linear body in which a conductive coating is applied to a thread.

[0031] The metal wire linear body may be a linear body made of a single metal wire, or may be a linear body made of a plurality of twisted metal wires. Examples of metal wires include wires containing metals such as copper, aluminum, tungsten, iron, molybdenum, nickel, titanium, silver, and gold, or alloys containing two or more metals (e.g., steels such as stainless steel and carbon steel, brass, phosphor bronze, zirconium-copper alloys, beryllium copper, iron-nickel, nichrome, nickel-titanium, Kanthal, Hastelloy, and rhenium-tungsten). The metal wires may be plated with tin, zinc, silver, nickel, chromium, nickel-chromium alloys, solder, or the like, or may be surface-coated with a carbon material or polymer, as described below. Wires containing one or more metals selected from tungsten, molybdenum, and alloys containing these metals are particularly preferred from the viewpoint of providing a conductive linear body 21 with low volume resistivity. The metal wire may be a metal wire coated with a carbon material. When the metal wire is coated with a carbon material, the metallic luster of the metal wire is reduced, making it easier to make the metal wire less noticeable. Furthermore, when the metal wire is coated with a carbon material, metal corrosion is also suppressed. Examples of carbon materials that can be used to coat the metal wire include amorphous carbon (such as carbon black, activated carbon, hard carbon, soft carbon, mesoporous carbon, and carbon fiber), graphite, fullerene, graphene, and carbon nanotubes.

[0032] A linear body containing carbon nanotubes can be obtained, for example, by drawing carbon nanotubes into a sheet from the end of a carbon nanotube forest (a growth body in which multiple carbon nanotubes are grown on a substrate so as to be aligned perpendicular to the substrate; sometimes referred to as an "array"), bundling the drawn carbon nanotube sheets, and then twisting the bundles of carbon nanotubes. In this production method, if no twist is applied during twisting, a ribbon-shaped linear body of carbon nanotubes is obtained, whereas if twist is applied, a thread-shaped linear body is obtained. A ribbon-shaped linear body of carbon nanotubes is a linear body in which the carbon nanotubes do not have a twisted structure. Alternatively, a linear body of carbon nanotubes can be obtained by spinning a dispersion of carbon nanotubes. The production of linear carbon nanotubes by spinning can be performed, for example, by the method disclosed in U.S. Patent Application Publication No. 2013 / 0251619 (JP Patent Publication No. 2012-126635). From the viewpoint of obtaining uniformity in the diameter of the carbon nanotube linear bodies, it is desirable to use thread-like carbon nanotube linear bodies, and from the viewpoint of obtaining highly pure carbon nanotube linear bodies, it is preferable to obtain thread-like carbon nanotube linear bodies by twisting a carbon nanotube sheet. The carbon nanotube linear body may be a linear body formed by weaving two or more carbon nanotube linear bodies together. Furthermore, the carbon nanotube linear body may be a linear body formed by combining carbon nanotubes with other conductive materials (hereinafter also referred to as a "composite linear body").

[0033] Examples of composite linear bodies include: (1) a composite linear body in which, in the process of obtaining a carbon nanotube linear body by drawing carbon nanotubes into a sheet form from the end of a carbon nanotube forest, bundling the drawn carbon nanotube sheet, and then twisting the carbon nanotube bundles, a metal element or a metal alloy is supported on the surface of the carbon nanotube forest, sheet, or bundle, or twisted linear body by vapor deposition, ion plating, sputtering, wet plating, or the like; (2) a composite linear body in which bundles of carbon nanotubes are twisted together with linear bodies of a metal element or a metal alloy, or a composite linear body; and (3) a composite linear body in which linear bodies of a metal element or a metal alloy, or a composite linear body, are braided with linear bodies of a carbon nanotube element or a composite linear body. In the composite linear body of (2), a metal may be supported on the carbon nanotubes when twisting the bundles of carbon nanotubes, as in the composite linear body of (1). Furthermore, the composite linear body of (3) is a composite linear body in which two linear bodies are woven together, but it may also be a composite linear body in which three or more carbon nanotube linear bodies, or linear bodies of a single metal or a metal alloy, or composite linear bodies are woven together, as long as it contains at least one linear body of a single metal or a metal alloy, or composite linear body. Examples of metals for the composite linear body include simple metals such as gold, silver, copper, iron, aluminum, nickel, chromium, tin, and zinc, as well as alloys containing at least one of these simple metals (such as copper-nickel-phosphorus alloys and copper-iron-phosphorus-zinc alloys).

[0034] The conductive linear body 21 may be a linear body in which a conductive coating is applied to a thread. Examples of the thread include threads spun from resins such as nylon and polyester. Examples of the conductive coating include coatings of metals, conductive polymers, carbon materials, etc. The conductive coating can be formed by plating or vapor deposition, etc. A linear body in which a conductive coating is applied to a thread can improve the conductivity of the linear body while maintaining the flexibility of the thread. In other words, it becomes easier to reduce the resistance of the pseudo sheet structure 2.

[0035] (resin layer) The resin layer 3 is a layer containing a resin. The resin layer 3 can directly or indirectly support the pseudo sheet structure 2. The resin layer 3 is also preferably a layer containing an adhesive. When the pseudo sheet structure 2 is formed on the resin layer 3, the adhesive makes it easy to attach the conductive linear members 21 to the resin layer 3.

[0036] Resin layer 3 may be a layer made of a dryable or hardenable resin. This provides resin layer 3 with sufficient hardness to protect pseudo sheet structure 2, and resin layer 3 also functions as a protective film. Furthermore, after hardening or drying, resin layer 3 has impact resistance and can suppress deformation of wiring sheet 100 due to impact.

[0037] The resin layer 3 is preferably curable with energy rays such as ultraviolet rays, visible energy rays, infrared rays, and electron beams, since it can be easily cured in a short time. Note that "energy ray curing" also includes heat curing by heating using energy rays.

[0038] The adhesive for the resin layer 3 may be a thermosetting adhesive that hardens when heated, a so-called heat seal type that bonds when heated, or an adhesive that becomes adhesive when moistened. However, for ease of application, it is preferable that the resin layer 3 be energy ray curable. Examples of energy ray curable resins include compounds having at least one polymerizable double bond in the molecule, and acrylate compounds having a (meth)acryloyl group are preferred.

[0039] Examples of the acrylate-based compound include (meth)acrylates containing a chain aliphatic skeleton (trimethylolpropane tri(meth)acrylate, tetramethylolmethane tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol monohydroxypenta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 1,4-butylene glycol di(meth)acrylate, and 1,6-hexanediol di(meth)acrylate. acrylates, etc.), alicyclic skeleton-containing (meth)acrylates (dicyclopentanyl di(meth)acrylate, dicyclopentadiene di(meth)acrylate, etc.), polyalkylene glycol (meth)acrylates (polyethylene glycol di(meth)acrylate, etc.), oligoester (meth)acrylates, urethane (meth)acrylate oligomers, epoxy-modified (meth)acrylates, polyether (meth)acrylates other than the above-mentioned polyalkylene glycol (meth)acrylates, and itaconic acid oligomers.

[0040] The weight average molecular weight (Mw) of the energy ray curable resin is preferably 100 to 30,000, and more preferably 300 to 10,000.

[0041] The adhesive composition may contain one or more types of energy ray-curable resins, and when two or more types are contained, the combination and ratio thereof can be selected arbitrarily. Furthermore, the adhesive composition may contain a thermoplastic resin described below, and the combination and ratio thereof can be selected arbitrarily.

[0042] The resin layer 3 may be a pressure-sensitive adhesive layer formed from a pressure-sensitive adhesive (pressure-sensitive adhesive). The pressure-sensitive adhesive of the pressure-sensitive adhesive layer is not particularly limited. Examples of pressure-sensitive adhesives include acrylic pressure-sensitive adhesives, urethane pressure-sensitive adhesives, rubber pressure-sensitive adhesives, polyester pressure-sensitive adhesives, silicone pressure-sensitive adhesives, and polyvinyl ether pressure-sensitive adhesives. Among these, the pressure-sensitive adhesive is preferably at least one selected from the group consisting of acrylic pressure-sensitive adhesives, urethane pressure-sensitive adhesives, and rubber pressure-sensitive adhesives, and is more preferably an acrylic pressure-sensitive adhesive.

[0043] Examples of acrylic adhesives include polymers containing structural units derived from alkyl (meth)acrylates having a linear alkyl group or a branched alkyl group (i.e., polymers obtained by polymerizing at least alkyl (meth)acrylates), acrylic polymers containing structural units derived from (meth)acrylates having a cyclic structure (i.e., polymers obtained by polymerizing at least (meth)acrylates having a cyclic structure), etc. Here, the term "(meth)acrylate" is used to refer to both "acrylate" and "methacrylate," and the same applies to other similar terms.

[0044] When the acrylic polymer is a copolymer, the form of the copolymerization is not particularly limited, and the acrylic copolymer may be any of a block copolymer, a random copolymer, or a graft copolymer.

[0045] When the acrylic polymer is a copolymer, the form of the copolymerization is not particularly limited, and the acrylic copolymer may be any of a block copolymer, a random copolymer, or a graft copolymer.

[0046] The acrylic copolymer may be crosslinked with a crosslinking agent. Examples of the crosslinking agent include known epoxy crosslinking agents, isocyanate crosslinking agents, aziridine crosslinking agents, and metal chelate crosslinking agents. When the acrylic copolymer is crosslinked, a functional group derived from the monomer component of the acrylic polymer, such as a hydroxyl group or a carboxyl group that reacts with these crosslinking agents, can be introduced into the acrylic copolymer.

[0047] When the resin layer 3 is formed from a pressure-sensitive adhesive, the resin layer 3 may further contain the above-mentioned energy ray-curable resin in addition to the pressure-sensitive adhesive. Furthermore, when an acrylic pressure-sensitive adhesive is used as the pressure-sensitive adhesive, a compound having both a functional group reactive with a functional group derived from a monomer component in an acrylic copolymer and an energy ray-polymerizable functional group in one molecule may be used as the energy ray-curable component. The reaction between the functional group of the compound and the functional group derived from the monomer component in the acrylic copolymer makes the side chain of the acrylic copolymer polymerizable by energy ray irradiation. Even when the pressure-sensitive adhesive is not an acrylic pressure-sensitive adhesive, a component whose side chain is energy ray-polymerizable may also be used as a polymer component other than the acrylic polymer.

[0048] The thermosetting resin used in the resin layer 3 is not particularly limited, and specific examples include epoxy resins, phenolic resins, melamine resins, urea resins, polyester resins, urethane resins, acrylic resins, benzoxazine resins, phenoxy resins, amine compounds, and acid anhydride compounds. These can be used alone or in combination of two or more. Among these, epoxy resins, phenolic resins, melamine resins, urea resins, amine compounds, and acid anhydride compounds are preferred because they are suitable for curing using an imidazole curing catalyst. In particular, epoxy resins, phenolic resins, mixtures thereof, or mixtures of epoxy resins with at least one selected from the group consisting of phenolic resins, melamine resins, urea resins, amine compounds, and acid anhydride compounds are preferred because they exhibit excellent curability.

[0049] The moisture-curable resin used in the resin layer 3 is not particularly limited, and examples thereof include urethane resins and modified silicone resins, which are resins that generate isocyanate groups when exposed to moisture.

[0050] When an energy ray curable resin or a thermosetting resin is used, it is preferable to use a photopolymerization initiator or a thermal polymerization initiator, etc. By using a photopolymerization initiator or a thermal polymerization initiator, etc., a crosslinked structure is formed, making it possible to more firmly protect the pseudo sheet structure 2.

[0051] Examples of the photopolymerization initiator include benzophenone, acetophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, benzoin methyl benzoate, benzoin dimethyl ketal, 2,4-diethylthioxanthone, 1-hydroxycyclohexyl phenyl ketone, benzyl diphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, 2-chloroanthraquinone, diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide, and bis(2,4,6-trimethylbenzoyl)-phenyl-phosphine oxide.

[0052] Examples of the thermal polymerization initiator include hydrogen peroxide, peroxodisulfates (ammonium peroxodisulfate, sodium peroxodisulfate, potassium peroxodisulfate, etc.), azo compounds (2,2'-azobis(2-amidinopropane) dihydrochloride, 4,4'-azobis(4-cyanovaleric acid), 2,2'-azobisisobutyronitrile, 2,2'-azobis(4-methoxy-2,4-dimethylvaleronitrile), etc.), and organic peroxides (benzoyl peroxide, lauroyl peroxide, peracetic acid, persuccinic acid, di-t-butyl peroxide, t-butyl hydroperoxide, cumene hydroperoxide, etc.).

[0053] These polymerization initiators can be used alone or in combination of two or more. When these polymerization initiators are used to form a crosslinked structure, the amount used is preferably 0.1 parts by mass or more and 100 parts by mass or less, more preferably 1 part by mass or more and 100 parts by mass or less, and particularly preferably 1 part by mass or more and 10 parts by mass or less, relative to 100 parts by mass of the energy ray-curable resin or the thermosetting resin.

[0054] The resin layer 3 may not be curable, and may be a layer made of, for example, a thermoplastic resin composition. The thermoplastic resin layer can be softened by adding a solvent to the thermoplastic resin composition. This makes it easier to attach the conductive linear members 21 to the resin layer 3 when forming the pseudo-sheet structure 2 on the resin layer 3. On the other hand, the thermoplastic resin layer can be dried and solidified by volatilizing the solvent in the thermoplastic resin composition.

[0055] Examples of the thermoplastic resin include polyethylene, polypropylene, polyvinyl chloride, polystyrene, polyvinyl acetate, polyurethane, polyether, polyethersulfone, polyimide, and acrylic resin. Examples of the solvent include alcohol-based solvents, ketone-based solvents, ester-based solvents, ether-based solvents, hydrocarbon-based solvents, alkyl halide-based solvents, and water.

[0056] The resin layer 3 may contain an inorganic filler. By containing an inorganic filler, the hardness of the cured resin layer 3 can be further improved. In addition, the thermal conductivity of the resin layer 3 is improved.

[0057] Examples of inorganic fillers include inorganic powders (such as silica, alumina, talc, calcium carbonate, titanium white, red iron oxide, silicon carbide, and boron nitride powders), beads obtained by spheroidizing inorganic powders, single-crystal fibers, and glass fibers. Among these, silica fillers and alumina fillers are preferred as inorganic fillers. One type of inorganic filler may be used alone, or two or more types may be used in combination.

[0058] The resin layer 3 may contain other components, such as well-known additives such as organic solvents, flame retardants, tackifiers, ultraviolet absorbers, antioxidants, preservatives, antifungal agents, plasticizers, antifoaming agents, and wettability adjusters.

[0059] The thickness of resin layer 3 is determined appropriately depending on the application of wiring sheet 100. For example, from the viewpoint of adhesiveness, the thickness of resin layer 3 is preferably 3 μm or more and 150 μm or less, and more preferably 5 μm or more and 100 μm or less.

[0060] (electrode) The electrodes 4 are used to supply current to the conductive linear body 21. The electrodes 4 can be formed using known electrode materials. Examples of electrode materials include conductive paste (such as silver paste), metal foil (such as copper foil), and metal wire. The electrodes 4 are disposed so as to be electrically connected to both ends of the conductive linear body 21. Examples of metals for the metal foil or metal wire include copper, aluminum, tungsten, iron, molybdenum, nickel, titanium, silver, gold, and the like, or alloys containing two or more metals (for example, steels such as stainless steel and carbon steel, brass, phosphor bronze, zirconium-copper alloys, beryllium copper, iron-nickel, nichrome, nickel-titanium, Kanthal, Hastelloy, and rhenium-tungsten). The metal foil or metal wire may also be plated with tin, zinc, silver, nickel, chromium, nickel-chromium alloys, solder, or the like. In particular, those containing one or more metals selected from copper and silver and alloys containing these are preferred from the viewpoint of low volume resistivity.

[0061] The width of the electrode 4 may be increased as it moves away from the first power supply part 51 and the second power supply part 52, as shown in FIG. In such a case, the average width of electrode 4 is preferably 100 mm or less, more preferably 10 mm or less, and even more preferably 100 μm or less, in a plan view of pseudo sheet structure 2. The narrower the width of electrode 4, the more likely temperature unevenness tends to occur, but even when electrode 4 is narrow, temperature unevenness can be suppressed according to wiring sheet 100 of this embodiment.

[0062] The ratio of the resistance values ​​of the electrode 4 to the pseudo sheet structure 2 (resistance value of electrode 4 / resistance value of pseudo sheet structure 2) is preferably 0.0001 or more and 0.3 or less, and more preferably 0.0005 or more and 0.1 or less. The ratio of the resistance values ​​of the electrode to the pseudo sheet structure 2 can be calculated by "resistance value of electrode 4 / resistance value of pseudo sheet structure 2." By keeping the ratio within this range, abnormal heat generation at the electrode portion is suppressed when the wiring sheet 100 is used as a heating element. When the pseudo sheet structure 2 is used as a sheet-type heater, only the pseudo sheet structure 2 generates heat, resulting in a sheet-type heater with good heat generation efficiency. The resistance values ​​of the electrode 4 and the pseudo sheet structure 2 can be measured using a tester. First, the resistance value of the electrode 4 is measured, and then the resistance value of the pseudo sheet structure 2 to which the electrode 4 is attached is measured. Then, the resistance values ​​of the electrode 4 and the pseudo sheet structure 2 are calculated by subtracting the measured value of the electrode 4 from the resistance value of the pseudo sheet structure 2 to which the electrode is attached.

[0063] (Power supply unit) First power supply portion 51 and second power supply portion 52 are portions that apply a voltage to wiring sheet 100. When electrode 4 is exposed and can be electrically connected, any portion of electrode 4 can be first power supply portion 51 or second power supply portion 52. Furthermore, a first power supply part 51 and a second power supply part 52 may be provided separately to facilitate connection of a power source (not shown) to the electrode 4. In this case, the first power supply part 51 and the second power supply part 52 may be made of the same material as the electrode 4. Furthermore, if the electrode 4 is covered with an insulating material to prevent short circuits, etc., the first power supply part 51 and the second power supply part 52 may be made of a portion of the insulating material that has been removed.

[0064] (Method of manufacturing wiring sheet) There are no particular limitations on the method for manufacturing interconnect sheet 100 according to this embodiment. Interconnect sheet 100 can be manufactured, for example, by the following steps. First, a composition for forming the resin layer 3 is applied to the substrate 1 to form a coating film. The coating film is then dried to create the resin layer 3. Next, conductive linear bodies 21 are arranged and placed on the resin layer 3 to form the pseudo-sheet structure 2. For example, with the resin layer 3 with the substrate 1 attached thereto placed on the outer circumferential surface of a drum member, the drum member is rotated while the conductive linear bodies 21 are spirally wound around the resin layer 3. The spirally wound bundle of conductive linear bodies 21 is then cut along the axial direction of the drum member. This forms the pseudo-sheet structure 2 and places it on the resin layer 3. The resin layer 3 with the substrate 1 on which the pseudo-sheet structure 2 is formed is then removed from the drum member to obtain a sheet-like conductive member. According to this method, for example, while rotating the drum member, the spacing L between adjacent conductive linear bodies 21 in the pseudo-sheet structure 2 can be easily adjusted by moving the feeding portion of the conductive linear bodies 21 in a direction parallel to the axis of the drum member. Next, the electrodes 4 are attached to both ends of the conductive linear members 21 in the pseudo-sheet structure 2 of the sheet-like conductive member, and then a first power supply portion 51 and a second power supply portion 52 are provided to produce the wiring sheet 100.

[0065] (Operation and effect of the first embodiment) According to this embodiment, the following effects can be achieved. (1) According to this embodiment, by satisfying the conditions shown in formulas (F2) and (F3), the cross-sectional area of ​​electrode 4 increases with increasing distance from first power supply portion 51 and second power supply portion 52. This makes it possible to suppress temperature unevenness in wiring sheet 100. (2) In this embodiment, the width of the electrode 4 is wider as it is farther away from the first power supply portion 51 and the second power supply portion 52, so the cross-sectional area of ​​the electrode 4 can be made larger as it is farther away from the first power supply portion 51 and the second power supply portion 52. (3) The wiring sheet 100 according to the present embodiment can suppress temperature unevenness, and therefore can be suitably used as a sheet heater.

[0066] [Second embodiment] Next, a second embodiment of the present invention will be described with reference to the drawings. 3, the wiring sheet 100A according to this embodiment includes a substrate 1, a pseudo sheet structure 2, a resin layer 3, and a pair of electrodes 4A. The pseudo sheet structure 2 has a plurality of conductive linear members 21 arranged at intervals. One electrode 4A is provided with a first power supply portion 51, and the other electrode 4A is provided with a second power supply portion 52. In this embodiment, since the components other than the electrode 4A are the same as those in the first embodiment, only the electrode 4A will be described, and the other components that are common to the previous description will be omitted.

[0067] As shown in FIG. 3, the electrode 4A according to this embodiment includes a plurality of metal wires. These metal wires have different lengths. The number of metal wires in the electrode 4A increases with increasing distance from the first power supply portion 51 and the second power supply portion 52, and the metal wires are electrically connected to each other at one electrode 4A and the other electrode 4A. In this case, the influence of contact resistance between the metal wires can be ignored. This allows the cross-sectional area of ​​the electrode 4A to increase with increasing distance from the first power supply portion 51 and the second power supply portion 52.

[0068] (Operation and effect of the second embodiment) According to this embodiment, in addition to the effects (1) and (3) of the first embodiment, the following effect (4) can be achieved. (4) In this embodiment, the number of metal wires constituting the electrode 4A increases as the distance from the first power supply portion 51 and the second power supply portion 52 increases, so the cross-sectional area of ​​the electrode 4A can be increased as the distance from the first power supply portion 51 and the second power supply portion 52 increases.

[0069] [Modification of the embodiment] The present invention is not limited to the above-described embodiment, and includes modifications and improvements within the scope of achieving the object of the present invention. For example, in the above-described embodiment, interconnect sheet 100 includes substrate 1, but is not limited to this. For example, interconnect sheet 100 does not necessarily have to include substrate 1. In such a case, interconnect sheet 100 can be used by being attached to an adherend by resin layer 3. In the above-described embodiment, wiring sheet 100 includes resin layer 3, but is not limited to this. For example, wiring sheet 100 may not include resin layer 3. In such a case, a knitted fabric may be used as substrate 1, and conductive linear members 21 may be woven into substrate 1 to form pseudo sheet structure 2.

[0070] [Confirmation of action and effect] According to this embodiment, in order to confirm that a wiring sheet capable of suppressing temperature unevenness can be obtained, the following analysis of power consumption distribution was carried out. In the analysis of the power consumption distribution, the wiring sheet according to this embodiment was applied to a ladder-type circuit diagram, and the power consumption distribution in this circuit was analyzed. In Example 1, the number N of the conductive linear bodies 21 is 30, the resistance value r of the conductive linear bodies 21 is 25070 [mΩ], the resistance value R of the electrode 4 is 148 [mΩ], the resistance value R2 of the electrode 4 between the second conductive linear body 21 and the first conductive linear body 21 counting from the first power supply part 51 and the second power supply part 52 side is 10.21 [mΩ], and the resistance value R of the electrode 4 between the 30th conductive linear body 21 and the 29th conductive linear body 21 counting from the first power supply part 51 and the second power supply part 52 side is 10.21 [mΩ]. 30The value of R3 to R 29 The value of R [mΩ] is calculated from the value of R2. 30 The voltage was gradually decreased at the same rate (approximately 0.36 mΩ between adjacent electrodes) until the value of Then, the power consumption distribution in the first to 30th conductive linear bodies 21 when a current was passed through the above circuit was analyzed. The conductive linear bodies 21 were assigned numbers, with the nth conductive linear body 21 being numbered n. The results are shown in Figure 4. The power consumption is a relative value when the current of the power supply unit is set to 1. Also, as Example 2, R2~R 30 The power consumption distribution was analyzed in the same manner as in Example 1, except that the values ​​of R2 to R 30 The values ​​of each are 10.21 mΩ. The results are shown in Figure 4. Furthermore, the maximum power consumption, minimum power consumption, and average power consumption were determined from the obtained power consumption distribution, and the power unevenness (unit: ±%) was calculated based on the following formula. (Power consumption unevenness) = [{(maximum power consumption) - (minimum power consumption)} / (average power consumption) / 2] x 100 The power unevenness in Example 1 was ±35%, which was found to be lower than the ±47% in Example 2. It is presumed that the smaller this power unevenness is, the more the temperature unevenness is suppressed. [Explanation of symbols]

[0071] 1...substrate, 2...pseudo sheet structure, 21...conductive linear body, 3...resin layer, 4, 4A...electrode, 51...first power supply portion, 52...second power supply portion, 100, 100A...wiring sheet.

Claims

1. The device comprises a pseudo-sheet structure in which a plurality of conductive linear bodies are arranged at intervals, a pair of electrodes, and a first power supply portion and a second power supply portion provided on each of the electrodes, The number of the conductive linear bodies is N, the resistance value of the conductive linear body is r, the resistance value of the electrode is R, and the resistance value of the electrode between the n-th conductive linear body and the (n-1)-th conductive linear body counting from the first power supply part and the second power supply part side is R. ｎ When the above formula (F1), the following formula (F2), and the following formula (F3) are satisfied, Wiring sheet. 10≦r / R≦300...(F1) R ｎ ≦R ｎ－１ ・・・(F2) (In the formula (F2), n is an integer of 2 or more.) 0<R ２ -R Ｎ ・・・(F3) (In the formula (F3), N is an integer of 3 or more.)

2. The wiring sheet according to claim 1 , The intervals between the conductive linear bodies are 20 mm or less. Wiring sheet.

3. The wiring sheet according to claim 1 or 2, Further, a substrate is provided to support the pseudo-sheet structure. Wiring sheet.

4. A wiring sheet comprising the wiring sheet according to any one of claims 1 to 3. Sheet heater.

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