Immersion liquid exothermic device
The immersion-type liquid heat dissipation device with a Peltier element and insulating design enhances cooling efficiency by isolating temperature chambers and securely attaching fins, overcoming ambient temperature impacts.
Patent Information
- Application Number
- JP2024062953
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2024-03-12
- Filing Date
- 2024-04-09
- Publication Date
- 2025-10-30
- Estimated Expiration
- 2044-04-09
AI Technical Summary
Conventional liquid cooling systems for processors are easily affected by ambient temperature, leading to decreased cooling efficiency.
An immersion-type liquid heat dissipation device with a Peltier element and heat dissipation fins that cool the coolant inside a liquid storage box, using a positioning rail and insulating space to separate high- and low-temperature chambers, and secure attachment of liquid heat dissipation fins.
Improves cooling efficiency by preventing ambient temperature effects and maintaining effective heat dissipation through rapid coolant temperature control.
Smart Images

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Abstract
Description
[Technical Field]
[0001] The present invention relates to a liquid heat dissipation device in the field of processor heat dissipation technology, and more particularly to an immersion type liquid heat dissipation device that utilizes the cooling function of a Peltier element to improve the heat dissipation effect of a processor. [Background technology]
[0002] An example of a known liquid heat dissipation device is shown in U.S. Patent No. US20060185378A1 (Patent Document 1) and U.S. Patent No. US20130299139A1 (Patent Document 2), which comprises a liquid heat dissipation head attached to the surface of the processor, liquid heat dissipation fins for heat dissipation, and two liquid pipes connected to the liquid heat dissipation head and the liquid heat dissipation fins. A liquid pump circulates the liquid heat dissipation head and the liquid heat dissipation fins, and the working fluid passes through the liquid heat dissipation head, transporting the processor's thermal energy to the liquid heat dissipation fins for re-dissipation. This lowers the liquid temperature and then allows it to flow back into the liquid heat dissipation head, thereby dissipating heat through the circulation.
[0003] Another cooling liquid heat dissipation fin structure is disclosed in U.S. Pat. No. 1,774,192 B2 (Patent Document 3), which comprises a liquid input box, a liquid collection box, and a number of fin tubes. The liquid input box is divided into a high-temperature liquid chamber and a low-temperature liquid chamber by a partition plate. The high-temperature liquid inlet of the high-temperature liquid chamber is connected to the low-temperature liquid outlet of the low-temperature liquid chamber at the wall of the liquid input box. The high-temperature liquid inlet and the low-temperature liquid outlet are each connected to a liquid cooling head via liquid tubes. A number of fins are connected between the liquid input box and the liquid collection box, and the outside of the number of fins is connected to, for example, a fan. During operation, when the high-temperature liquid flows from the high-temperature liquid inlet to the liquid input box and the liquid collection box, and then from the liquid collection box to the liquid input box and the low-temperature liquid outlet, the fan blows air over the number of fins to cool and dissipate heat, thereby lowering the liquid temperature. [Prior art documents] [Patent documents]
[0004] [Patent Document 1] U.S. Patent No. US20060185378A1 [Patent Document 2] US20130299139A1 No. [Patent Document 3] U.S. Patent No. US11774192B2 Summary of the Invention [Problem to be solved by the invention]
[0005] The aforementioned conventional liquid cooling fan technology for dissipating heat from a working fluid is easily affected by ambient temperature. For example, if the room temperature or the internal temperature of the housing is too high, the cooling efficiency of the liquid cooling fins will decrease, directly affecting the cooling efficiency of the liquid cooling device. Therefore, to solve the drawback that the cooling efficiency of the conventional liquid cooling fan is easily affected by ambient temperature, this is a problem that the present invention actively aims to overcome. [Means for solving the problem]
[0006] The main objective of this invention is to provide an immersion type liquid heat dissipation device, in which a first liquid box at one end of the liquid heat dissipation fin is welded to the opening of the liquid storage box, and a second liquid box at the other end of the liquid heat dissipation fin and the heat dissipation fin are immersed in the cooling liquid inside the liquid storage box. A Peltier element and heat dissipation fins are installed on the outside of the liquid storage box to cool the cooling liquid inside the liquid storage box to a lower temperature, and the heat dissipation fins of the liquid heat dissipation fins are cooled by the cooling liquid.
[0007] Another object of the present invention is to provide an immersion type liquid heat dissipation device in which the liquid heat dissipation fins are securely mounted in the liquid storage box by using a positioning rail inside the liquid storage box and a fixing frame structure on both sides of the liquid heat dissipation fins.
[0008] Another object of the present invention is to provide an immersion type liquid heat dissipation device in which the internal structure of the first liquid box provided at one end of the liquid heat dissipation fin is improved to form an insulating space, separating the high-temperature liquid chamber from the low-temperature liquid chamber, which does not transfer heat to the inside of the first liquid box. [Effects of the Invention]
[0009] (i) The present invention achieves the effect of improving the cooling efficiency of a liquid-cooled heat dissipation device installed in a processor by rapidly cooling the working fluid circulating inside the heat dissipation tube assembly using a Peltier element and a coolant, thereby preventing the liquid heat dissipation fins from being affected by the ambient temperature.
[0010] (b) According to the present invention, the liquid heat dissipating fins can be securely attached to the liquid storage box.
[0011] (c) The insulating space inside the first liquid box of the present invention prevents the high-temperature liquid flowing through the high-temperature liquid chamber from transferring heat to the low-temperature liquid chamber, preventing the cooled low-temperature liquid from being heated by the high-temperature liquid in the high-temperature liquid chamber. [Brief explanation of the drawings]
[0012] [Figure 1] 1 is a perspective view showing a three-dimensional aspect of a first embodiment of an immersion type liquid heat dissipation device of the present invention; [Figure 2] 1 is a front exploded perspective view of a first embodiment of the immersion liquid heat dissipation device of the present invention; FIG. [Figure 3] 1 is an exploded rear perspective view of a first embodiment of the immersion liquid heat dissipation device of the present invention; FIG. [Figure 4] 3 is a perspective view showing a three-dimensional front view of the liquid storage box shown in FIG. 2. FIG. [Figure 5] FIG. 3 is an exploded perspective view of the liquid heat dissipating fin shown in FIG. 2. [Figure 6] FIG. 2 is a cross-sectional view of the immersion liquid heat dissipation device shown in FIG. [Figure 7] FIG. 2 is a front exploded perspective view of a second embodiment of the immersion type liquid heat dissipation device of the present invention; [Figure 8] FIG. 8 is a cross-sectional view of the immersion type liquid heat dissipation device shown in FIG. [Figure 9] FIG. 2 is an exploded perspective view of a liquid storage box of the immersion-type heat dissipation device of the present invention, in which a plurality of Peltier elements are provided on the rear wall thereof; [Figure 10] 1 is an exploded perspective view of an immersion-type liquid heat dissipation device according to the present invention, in which a Peltier element is provided on a wall around a liquid storage box. FIG. [Figure 11] FIG. 2 is an exploded perspective view of a liquid storage box of an immersion-type heat dissipation device according to the present invention, in which a plurality of Peltier elements are provided on the surface thereof; DETAILED DESCRIPTION OF THE INVENTION [Example]
[0013] As shown in Figure 1, the immersion type liquid heat dissipation device 100 of the present invention is composed of a liquid cooling head 200 and two liquid tubes 300. When applied to liquid heat dissipation devices for computers and servers, it can dissipate heat from the working fluid inside the liquid cooling head 200. Also, as shown in Figures 2 and 3, a preferred embodiment of the immersion type liquid heat dissipation device 100 of the present invention is shown. It comprises a liquid storage box 10, a Peltier element 20, heat dissipation fins 30, and liquid heat dissipation fins 40.
[0014] The liquid storage box 10 is a metal box body formed by pressing, preferably made of an aluminum alloy with excellent heat conductivity. This structure includes a side wall 11, a rear wall 12, a front opening 13, a liquid storage chamber 14 (shown in Figures 2 to 4), a liquid injection hole 15 at a predetermined location on the side wall 11 that connects to the liquid storage chamber 14, and bolts 16 that are tightened into the liquid injection hole 15. The liquid storage chamber 14 is prepared for the injection of a cooling liquid.
[0015] The Peltier element 20 is made of a semiconductor material that can convert between thermal energy and electrical energy, and is mounted on the surface of the rear wall 12 of the liquid storage box 10, with the cold surface 21 attached to the surface of the rear wall 12 of the liquid storage box 10. The rear wall 12 of the liquid storage box 10 may be provided with a groove 18, for example, and the Peltier element 20 may be inserted into the groove 18, with the cold surface 21 attached to the groove base 181 of the groove 18.
[0016] The heat dissipation fin 30 is made of a highly thermally conductive aluminum alloy and has a base 31 and a plurality of heat sinks 32. The heat dissipation fin 30 is fastened to the rear wall 12 of the liquid storage box 10 using screws or the like, and the base 31 is attached to the high-temperature side 22 of the Peltier element 20, thereby cooling the high-temperature side 22 of the Peltier element 20 and maintaining the low-temperature side 21 of the Peltier element 20 at a low temperature. The heat dissipation fin 30 may be provided with a fan 33, if necessary. The fan 33 is provided on either the left or right surface of the heat dissipation fin 30 and, when driven, blows air through the heat sink 32 of the heat dissipation fin 30 to dissipate heat.
[0017] 5 and 6, the liquid heat dissipation fin 40 includes a first liquid box 41 made of an aluminum alloy, a second liquid box 42, a heat dissipation tube 43, and a liquid pump 44 for transporting the liquid. The first liquid box 41 is divided into a high-temperature liquid chamber 411 and a low-temperature liquid chamber 412, and the box walls are connected to a high-temperature liquid inlet 413 of the high-temperature liquid chamber 411 and a cooling liquid outlet 414 of the low-temperature liquid chamber 412, respectively. The second liquid box 42 is a reflux chamber 421 with an open interior. The heat dissipation tube set 43 includes a plurality of first heat dissipation tubes 431 and a plurality of second heat dissipation tubes 432. One end of the first heat dissipation tubes 431 and one end of the second heat dissipation tubes 432 are connected to the high-temperature liquid chamber 411 and the low-temperature liquid chamber 412 of the first liquid box 41, respectively. The other ends of the first heat dissipation tube 431 and the second heat dissipation tube 432 are connected to the reflux chamber 421 of the second liquid box 42. The liquid pump 44 is a ready-made product that is directly connected to the high-temperature liquid chamber 411 or the low-temperature liquid chamber 412 of the first liquid box 41, thereby forming an integrated liquid heat dissipation fin with the liquid pump. When working fluid is injected into the liquid heat dissipation fin 40, the liquid pump 44 is driven to circulate the working fluid between the liquid heat dissipation fin 40 and the liquid heat dissipation head 200. However, the liquid pump 44 may not be installed in the first liquid box 41 of the liquid heat dissipation fin 40 of this invention, but may be installed in another position (for example, the aforementioned liquid tube 300) to circulate the working fluid between the liquid cooling head 200 and the liquid heat dissipation fin 40.
[0018] 2 and 6, when assembling this invention, the second liquid box 42 of the liquid heat dissipating fin 40 and the heat dissipation tube set 43 are inserted into the liquid storage chamber 14 through the front opening 13 of the liquid storage box 10, and the outer wall of the first liquid box 41 is sealed (for example, welded) to the front opening 13 of the liquid storage box 10. Then, coolant is poured into the liquid storage chamber 14 of the liquid storage box 10 through the liquid injection hole 15, so that the second liquid storage box 42 and the heat dissipation tube set 43 are completely immersed in the coolant in the liquid storage box 10.
[0019] 2 and 4, two rails 17 are preferably provided on each of the two inner walls of the liquid storage chamber 14 of the liquid storage box 10 of the present invention. Furthermore, a fixing frame 45 is provided on each side of the heat dissipation tube set 43. When the second liquid box 42 and the heat dissipation tube set 43 are assembled into the liquid storage box 10, each fixing frame 45 is confined between the two rails 17 inside the liquid storage box 10. This allows the longer heat dissipation tube set 43 to be stably fixed inside the liquid storage box 10 and completely immersed in the coolant inside the liquid storage box 10. This allows the longer heat dissipation tube set 43 to be stably attached inside the liquid storage box 10, preventing the heat dissipation tube set 43 from shaking and causing cracks or loosening at the welds between the first liquid box 41 and the front opening 13. In particular, the fixing frame 45 has straight plates 451 connected to both sides of the heat dissipation tube set 43 and a number of mounting protrusion plates 452 perpendicular to the straight plates 451. When installed, the fixing frame 452 is fixed between the two rails 17 inside the liquid storage box 10. Due to the structural design that provides the fitting portions 19 between the front surfaces 171 of the rails 17 and the front opening 13 of the liquid storage box 10, when assembling, the first liquid box 41 is inserted so that its end face abuts the front surface 171 of the rail, and then the first liquid box 41 and the front opening 13 are welded together, thereby achieving the effect of the first liquid box 41 being securely inserted into the front opening 13 of the liquid storage box 10.
[0020] 5 and 6, the first liquid box 41 of the liquid heat dissipation fin 40 is composed of a first box body 415 and a first box cover 416, and the second liquid box 42 is composed of a second box body 422 and a second box cover 423. The first box cover 416 and the second box cover 423 are connected to a plurality of heat dissipation tube insertion holes that connect the first box body 415 and the second box body 422, respectively. Thus, both ends of the first heat dissipation tube 431 and the second heat dissipation tube 422 are inserted into the heat dissipation tube insertion holes and welded, respectively. To prevent the thermal energy of the high-temperature liquid chamber 411 of the first liquid box 41 from being transferred to the low-temperature liquid chamber 412, the first box body 415 of this embodiment is provided with a high-temperature liquid spacer 417 and a low-temperature liquid spacer 418 that are parallel to each other, and an insulating space 419 is formed between the high-temperature liquid spacer 417 and the low-temperature liquid spacer 418. This makes it possible to prevent the high-temperature working fluid flowing in the high-temperature liquid chamber 411 from transferring heat to the low-temperature working fluid in the low-temperature liquid chamber 412 by utilizing the heat insulating space 419 .
[0021] 5 and 6, in a preferred embodiment of the heat dissipation tube set 43, a corrugated heat sink 433 is provided between the first heat dissipation tube 431 and the second heat dissipation tube 432 to improve heat dissipation efficiency. Alternatively, as shown in FIGS. 7 and 8, the heat sink 433 does not need to be provided between the first heat dissipation tube 431 and the second heat dissipation tube 432 of the heat dissipation tube set 43, and the working fluid in the first heat dissipation tube 431 and the second heat dissipation tube 432 alone can sufficiently achieve the effect of high-speed heat dissipation using only the coolant in the liquid storage box 10.
[0022] 9, in order to increase the cooling efficiency of the coolant, it is also possible to mount two or more Peltier elements 20 of the present invention, and recessed grooves 18 corresponding to the number of Peltier elements 20 are provided in the rear wall 12 of the liquid storage box 10. Furthermore, the Peltier elements 20 of the present invention are not limited to being provided on the outside of the rear wall 12 of the liquid storage box 10; as shown in FIGS. 10 and 11, one or more Peltier elements 20 can also be provided on the outside of the peripheral wall 11 of the liquid storage box 10, and the same number of recessed grooves 18 for providing the Peltier elements 20 can also be provided on the outside of the peripheral wall 11.
[0023] When the present invention is applied, by passing electricity through the thermoelectric material of the Peltier element 20, the cold surface 21 of the Peltier element 20 on the outside of the liquid storage box 10 absorbs heat, lowering the temperature of the cooling liquid inside the liquid storage box 10 to ice-cold temperature, causing the working fluid flowing through the heat dissipation tube set 43 to absorb the heat, quickly cooling the working fluid, which then flows back into the liquid cooling head 200 to cool the processor. In this invention, the temperature control of the cooling liquid inside the liquid storage box 10 depends on the current and voltage passing through the Peltier element 20, which prevents the ambient temperature from affecting the cooling efficiency of the liquid heat dissipation fins 40 and achieves the effect of improving the cooling efficiency of the immersion-type liquid heat dissipation device for processors. [Explanation of symbols]
[0024] 100 Immersive liquid heat dissipation device 200 Liquid Cooling Head 300 Liquid Tube 10 Liquid storage box 11 Side wall 12 Rear wall 13 Front opening 14 Liquid storage chamber 15 Liquid injection hole 16 volts 17 Rail 171 Front 18 Groove 181 Groove base 19 Fitting part 20 Peltier element 21 Low temperature surface 22 Hot Surface 30 Heat dissipation fin 31 Base 32 Heat sink 33 Fans 40 Liquid heat dissipation fin 41 First Liquid Box 411 High Temperature Liquid Chamber 412 Cryogenic Liquid Chamber 413 High temperature liquid inlet 414 Cryogenic liquid outlet 415 First Box Body 416 1st Box Cover 417 High Temperature Liquid Spacer 418 Cryogenic Liquid Spacer 419 Insulated Space 42 Second Liquid Box 421 Reflux Chamber 422 Box 2 423 2nd Box Cover 43 Heat dissipation tube assembly 431 First heat dissipation tube 432 Second heat dissipation tube 433 Heatsink 44 Liquid Pump 45 fixed frame 451 Honest Plate 452 Mounting protrusion plate
Claims
1. a liquid storage box having a liquid storage chamber into which a cooling liquid is poured, the liquid storage chamber being formed in a metal box body having a side wall, a rear wall, and a front opening; a Peltier element having a low-temperature surface attached to the outer surface of the rear wall or side wall of the liquid storage box, the Peltier element being provided on the outer surface of the rear wall or side wall of the liquid storage box; a heat dissipation fin for attaching a base portion to a high-temperature surface of the Peltier element; The cooling system includes a first liquid box, a second liquid box, and a heat dissipation tube set, the interior of the first liquid box being divided into a high-temperature liquid chamber and a low-temperature liquid chamber, the box walls respectively connecting to the high-temperature liquid inlet of the high-temperature liquid chamber and the cooling liquid outlet of the low-temperature liquid chamber, the interior of the second liquid box forming a reflux chamber, the heat dissipation tube set including a plurality of first heat dissipation tubes and a plurality of second heat dissipation tubes, one end of the first heat dissipation tubes and one end of the second heat dissipation tubes connecting to the high-temperature liquid chamber and the low-temperature liquid chamber of the first liquid box, respectively, and a liquid heat dissipation fin for connecting the other end of the second heat dissipation tube to the reflux chamber of the second liquid box; An immersion type liquid heat dissipation device, characterized in that the second liquid box of the liquid heat dissipation fin and the heat dissipation tube set are inserted into the liquid storage chamber through the front opening of the liquid storage box, and after the outer wall of the first liquid box is sealed to the front opening of the liquid storage box, the heat dissipation tube set is completely immersed in the cooling liquid in the liquid storage box.
2. 2. The immersion type liquid heat dissipation device according to claim 1, wherein two rails are provided on each of the two side walls of the liquid storage chamber of the liquid storage box, and a fixing frame is provided on each of the two sides of the heat dissipation tube set, and the fixing frame is limited between the two rails.
3. 3. The immersion type liquid heat dissipation device of claim 2, wherein the fixing frame has a straight plate connected to both sides of the heat dissipation tube set and a mounting protrusion plate arranged perpendicular to the straight plate, and the mounting protrusion plate is limited between the two rails.
4. 4. The immersion type liquid heat dissipation device according to claim 2, wherein an engaging portion is provided between the front surface of the rail and the front opening, and the first liquid box is inserted until the end face of the first liquid box contacts the front surface of the rail.
5. 5. The immersion type liquid heat dissipation device according to claim 4, wherein the first liquid box and the front opening of the liquid storage box are welded together.
6. 2. The immersion type liquid heat dissipation device according to claim 1, wherein a groove is provided on the rear wall or the side wall of the liquid storage box, the Peltier element is inserted into the groove, and the low temperature surface is attached to the groove base of the groove.
7. 7. The immersion type liquid heat dissipation device according to claim 6, wherein the Peltier elements are two or more, and the rear wall or the side wall of the liquid storage box is provided with the recessed grooves corresponding to the number of the Peltier elements.
8. The immersion type liquid heat dissipation device of claim 1, characterized in that the first liquid box is composed of a first box body and a first box cover, the second liquid box is composed of a second box body and a second box cover, the first box cover and the second box cover are connected by a plurality of heat dissipation tube insertion holes that connect the first box body and the second box body, and both ends of the first heat dissipation tube and the second heat dissipation tube are inserted into the heat dissipation tube insertion holes and welded.
9. 10. The immersion type liquid heat dissipation device of claim 8, wherein the inside of the first box body has a high-temperature liquid spacer and a low-temperature liquid spacer arranged parallel to each other, and an insulating space formed between the high-temperature liquid spacer and the low-temperature liquid spacer, and the high-temperature liquid spacer and the low-temperature liquid spacer partition the high-temperature liquid chamber and the low-temperature liquid chamber.
10. The immersion type liquid heat dissipation device according to claim 1 , wherein the heat dissipation tube set includes a heat sink between the first heat dissipation tube and the second heat dissipation tube.
11. 2. The immersion type liquid heat dissipation device according to claim 1, wherein the heat dissipation fins include a fan, the fan is mounted on one surface of the heat dissipation fins, and is driven to circulate air through the heat dissipation fins to dissipate heat.
12. 2. The immersion liquid heat dissipation device according to claim 1, wherein the liquid heat dissipation fins include a liquid pump, the liquid pump being installed in the high-temperature liquid chamber or the low-temperature liquid chamber of the first liquid box.
Citation Information
Patent Citations
Heat dissipation device with filtering function
CN114087892A
Cooling device and electronic equipment having the same
JP2007095902A
Water cooling radiator with built-in water pump
US11774192B2
Liquid-cooling heat dissipation assembly
US20060185378A1
Radiator with integrated pump for actively cooling electronic devices
US20130299139A1