Electronic Components

Abstract

To provide an electronic component capable of securing a creepage distance between electrode terminals.SOLUTION: An electronic component includes a structure in which an upper surface part having a predetermined thickness of a plan view rectangular shape; a housing part of a resistance element that is formed at a center of an upper surface part lower surface side; and a first projection part 3, a second projection part 4, and a third projection part 5, that extend to a vertical direction from the upper surface part lower surface side to a vertical direction, and function as leg parts. In each of a space between the first and third projection parts on the upper surface part lower surface side, and a space between the second and third projection parts, a long creepage distance between the electrode terminals formed on the projection parts 3 and 4 is ensured by a predetermined depth convex part formed so as to be the other side surface side via the housing part from one side surface side of a lower side short side direction.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to high voltage electronic components. [Background technology]

[0002] For example, divider products used as resistors for voltage divider circuits in automotive BMS, etc., are usually composed of multiple high-precision thin-film and thick-film resistors. On the other hand, molded dividers realize voltage divider resistors composed of multiple chip resistors in a single package, which reduces the mounting area and enables the creation of higher-precision voltage divider resistors.

[0003] As described above, mold dividers enable voltage division in a single package, and depending on the specifications, high voltages of 500 V or more, or even 1000 V or more, may be applied between the electrodes, so insulation properties must be taken into consideration.

[0004] For example, Patent Document 1 discloses a configuration in which an electrical element is mounted inside an insulating molded body in a high-voltage electrical device that functions as a voltage divider, and lead terminals are connected to the left and right sides of the molded body, and ribs are provided on at least a portion of the surface of the molded body between these lead terminals to increase the surface area and improve voltage performance. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Special Publication No. 2018-522423 DISCLOSURE OF THE INVENTION [Problem to be solved by the invention]

[0006] A ribbed molded body such as the electrical device described in Patent Document 1, i.e., providing multiple continuous shallow ribs on the side and back surfaces of the mold, can ensure the apparent creepage distance between electrode terminals, but the distance between the ribs becomes short. Therefore, for example, depending on the degree of contamination in the environment in which the electrical device is installed, the distance along the surface of the ribs may not be considered as the creepage distance, which could limit the environments in which the electrical device can be used.

[0007] Furthermore, providing multiple thin, continuous ribs not only narrows the rib spacing but also complicates the structure, which can lead to molding defects such as chipping of the mold, and makes it easier for foreign objects to get caught between the ribs, making it difficult to check for these defects, resulting in a problem of reduced production efficiency.

[0008] The present invention has been made in view of the above-mentioned problems, and its object is to provide an electronic component such as a thick film mold divider that can ensure a creepage distance between electrode terminals while avoiding a complex structure. [Means for solving the problem]

[0009] As one means for achieving this object and solving the above-mentioned problems, for example, the following configuration is provided. That is, the electronic component of the present invention comprises an upper surface portion made of a rectangular, plate-shaped exterior material in a planar view; an accommodation portion made of exterior material and arranged approximately in the center of the underside of the upper surface portion, in which a resistive element is embedded; a first protrusion made of exterior material, erected at one longitudinal end of the underside of the upper surface portion, having a predetermined height vertically from the underside, and having a first electrode terminal arranged thereon; a second protrusion made of exterior material, erected at the other longitudinal end of the underside of the upper surface portion, having a predetermined height vertically from the underside, and having a second electrode terminal arranged thereon; and a third protrusion made of exterior material, erected at a position on the underside of the upper surface portion so as to be sandwiched a predetermined distance from each of the first protrusion and the second protrusion, and having a predetermined height vertically from the underside, wherein the first protrusion, the second protrusion, and the third protrusion are each formed so as to have a constant width in the longitudinal direction and extend from one side to the other side in the short direction of the underside.

[0010] For example, the longitudinal width of the third protrusion is wider than the distance between the first protrusion and the third protrusion and the distance between the second protrusion and the third protrusion. For example, the vertical height of the third protrusion is greater than the vertical heights of the first protrusion and the second protrusion. Furthermore, for example, between the first protrusion and the third protrusion and between the second protrusion and the third protrusion, the vertical depth of the region adjacent to the housing portion on both end faces in the short direction of the lower surface is deeper than the vertical depth of the housing portion. Furthermore, for example, the region does not penetrate vertically from the upper surface side to the lower surface side. For example, the upper surface has an area in which the first electrode terminal and the second electrode terminal are hidden by the upper surface when viewed in a plane. For example, the first electrode terminal and the second electrode terminal are each drawn out to the outside through the exterior material from a position that is three-quarters or more of the height of the first protrusion and the second protrusion in the vertical direction. Furthermore, for example, the first electrode terminal and the second electrode terminal are each drawn out such that predetermined regions on both sides in the short direction are narrower than other regions at the drawn-out portion. Furthermore, for example, the number of the third protrusion is one. For example, the number of the third protrusions is two or more. Furthermore, for example, the exterior material is made of an insulating resin molded member. Furthermore, for example, the electronic component is a high-voltage thick-film molded divider having the first electrode terminal, the second electrode terminal, and a third electrode terminal disposed on the second protrusion. [Effects of the Invention]

[0011] According to the present invention, it is possible to effectively ensure the creepage distance between electrode terminals of electronic components such as thick film mold dividers and improve mass productivity. [Brief explanation of the drawings]

[0012] [Figure 1] Figure 1(a) is a top perspective view of a thick film mold divider according to a first embodiment, seen from a position where the first electrode terminal can be seen, Figure 1(b) is a top perspective view of a thick film mold divider according to a first embodiment, seen from a position where the second electrode terminal and the third electrode terminal can be seen, and Figure 1(c) is a perspective view of a thick film mold divider seen from the bottom side. [Figure 2] Figure 2(a) is a top view of the thick film mold divider of Figure 1(a) seen from above in the Z-axis direction, Figure 2(b) is a bottom view seen from below in the Z-axis direction, Figure 2(c) is a side view seen from the Y-direction, Figure 2(d) is an end view seen from the X-axis direction with the first electrode terminal on the front side, and Figure 2(e) is an end view seen from the X-axis direction with the second electrode terminal and the third electrode terminal on the front side. [Figure 3] 1(a) is a cross-sectional view of the thick film mold divider according to the first embodiment taken along the line AA' in the Y-axis direction. FIG. [Figure 4] Figure 4(a) is a perspective view of the thick film mold divider of the second embodiment seen from the bottom side, Figure 4(b) is a bottom view seen from below in the Z-axis direction, and Figure 4(c) is a side view seen from the Y direction. [Figure 5] Figure 5(a) is a perspective view of the thick film mold divider of the third embodiment seen from the bottom side, Figure 5(b) is a bottom view seen from below in the Z-axis direction, and Figure 5(c) is a side view seen from the Y direction. [Figure 6] 6(a) to 6(d) are perspective views of the bottom surface side of a thick film mold divider according to Example 1 of the fourth embodiment. [Figure 7] 7(a) to 7(d) are perspective views of the bottom surface side of a thick film mold divider according to Example 2 of the fourth embodiment. [Figure 8] 8(a) to 8(d) are perspective views of the bottom surface side of a thick film mold divider according to Example 3 of the fourth embodiment. [Figure 9] 9(a) to 9(d) are perspective views of the bottom surface side of a thick film mold divider according to Example 4 of the fourth embodiment. [Figure 10]Figure 10(a) is an external perspective view of a thick film mold divider according to Example 1 of the fifth embodiment, Figure 10(b) is a plan view, Figure 10(c) is a side view, and Figures 10(d) and (e) are right end view and left end view, respectively. [Figure 11] FIG. 11(a) is an external perspective view of a thick film mold divider according to Example 2 of the fifth embodiment, FIG. 11(b) is a plan view, and FIG. 11(c) is a side view. [Figure 12] Figure 12(a) is a bottom perspective view of a thick film mold divider relating to Example 1 of the sixth embodiment, Figure 12(b) is a bottom view, Figure 12(c) is a side view seen from the Y direction, and Figure 12(d) is a cross-sectional view when cut in the Y-axis direction along the arrow EE' line in Figure 12(a). [Figure 13] Figures 13(a) and (b) are external perspective views of the thick film mold divider according to Example 2 of the sixth embodiment, viewed from different positions on the bottom side, Figure 13(c) is a side view, and Figures 13(d) and (e) are cross-sectional views taken along the lines FF' and GG' in Figures 13(a) and (b), respectively. [Figure 14] Figure 14(a) is a bottom perspective view of a thick film mold divider relating to Example 3 of the sixth embodiment, Figure 14(b) is a bottom view, Figure 14(c) is a side view seen from the Y direction, and Figure 14(d) is a cross-sectional view when cut in the Y-axis direction along the arrow KK' line in Figure 14(a). DETAILED DESCRIPTION OF THE INVENTION

[0013] Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the following embodiment, a thick film mold divider will be described as a representative example of an electronic component, but the resistive element contained in the mold is not limited to a thick film divider, and a varistor element, a capacitor element, or the like can also be used in addition to the resistive element.

[0014] <First embodiment> 1(a) to 1(c) show the appearance of a thick-film mold divider (hereinafter simply referred to as a mold divider) according to a first embodiment of the present invention, with Fig. 1(a) being a perspective view of the top side (also referred to as the front side) when viewed from a position where the first electrode terminal 6, which is the lead terminal of the mold divider 1, can be seen, Fig. 1(b) being a perspective view of the top side when viewed from a position where the second electrode terminal 7a and the third electrode terminal 7b can be seen, and Fig. 1(c) being a perspective view of the mold divider 1 when viewed from the bottom side.

[0015] Figure 2(a) is a top view of the mold divider 1 shown in Figure 1(a) when viewed from above in the Z-axis direction, Figure 2(b) is a bottom view of the mold divider 1 when viewed from below in the Z-axis direction, Figure 2(c) is a side view of the mold divider 1 when viewed from the Y-axis direction, Figure 2(d) is an end view of the mold divider 1 when viewed from the X-axis direction with the first electrode terminal 6 on the front side (also referred to as the right end view as appropriate), and Figure 2(e) is an end view of the mold divider 1 when viewed from the X-axis direction with the second electrode terminal 7a and the third electrode terminal 7b on the front side (also referred to as the left end view as appropriate).

[0016] The side view of the mold divider 1 seen from the opposite side in the Y direction is the same as FIG. 2(c), and therefore is not shown here.

[0017] As shown in Figure 1(a) etc. and Figures 2(a) and (c) etc., the mold divider 1 is rectangular in plan view and has a structure formed of an upper surface portion 2 having a predetermined thickness in the Z-axis direction, and a first protrusion portion 3, a second protrusion portion 4 and a third protrusion portion 5 extending vertically (in the Z-axis direction) from the lower surface side 2b of the upper surface portion 2 and functioning as legs when mounted on a circuit board.

[0018] The upper surface side 2a of the upper surface portion 2 is flat to facilitate suction and holding by a suction nozzle when mounting the mold divider 1 on a circuit board. The upper surface portion 2 and the first to third protrusions 3 to 5 are made of an insulating mold material (molded resin body) that is an exterior member.

[0019] The lower surface side 2b of the upper surface portion 2 is provided with a housing portion 9 that houses a molded and sealed resistive element 8 (for example, a thick film divider, a thin film divider, a thick film / thin film chip resistor, etc.) shown by dashed lines in Figures 2(b) and 2(c), etc. By incorporating the resistive element 8, the molded divider 1 functions as a voltage dividing resistor.

[0020] A first electrode terminal 6 having, for example, an overall U-shaped cross section in the X-axis direction is formed on the first protrusion 3. The first electrode terminal 6 is a lead frame, one end 26 of which is connected to one terminal of the resistor element 8, and the other end of which is bent and disposed so as to extend in the Z-axis direction along the end face of the first protrusion 3 in the X-axis direction and reach the bottom of the first protrusion 3.

[0021] For example, a second electrode terminal 7a and a third electrode terminal 7b, each having a generally U-shaped cross section in the X-axis direction, are formed in parallel in the Y-axis direction on the second protrusion 4. The second electrode terminal 7a and the third electrode terminal 7b are lead frames, and one end 27 of each is connected to the other terminal of the resistor element 8, and the other end of each is bent and arranged to extend in the Z-axis direction along the end face of the second protrusion 4 in the X-axis direction and reach the bottom of the second protrusion 4.

[0022] In the embodiment of the present invention, a thick film mold divider is used as an example and explained, so it has three electrode terminals: a ground terminal, a voltage detection terminal, and a high voltage terminal, but the number of electrode terminals can also be two depending on the type of internal element.

[0023] The length of the third protrusion 5 in the Z-axis direction is set to be longer by the thickness of the electrode terminal than the lengths of the first protrusion 3 and the second protrusion 4 in the Z-axis direction. In other words, by making the lengths of the first protrusion 3 and the second protrusion 4 in the Z-axis direction with the ends of the electrode terminals formed on their bottoms equal to the length of the third protrusion 5 in the Z-axis direction, stability can be ensured when the mold divider 1 is mounted, etc.

[0024] Alternatively, by setting the third protrusion 5 to be slightly longer than the Z-axis lengths of the first protrusion 3 and the second protrusion 4 in a state where the ends of the electrode terminals are formed at the bottom, the flexural strength during the mounting of the mold divider 1 or the like can be improved.

[0025] In the mold divider 1, the third protrusion 5 is provided at a position separated from each of the first protrusion 3 and the second protrusion 4 by a predetermined distance in the X-axis direction. More specifically, as shown in Fig. 2(c), the first protrusion 3 and the third protrusion 5 are separated by L1, and the second protrusion 4 and the third protrusion 5 are separated by L1. If the thickness of the third protrusion 5 in the X-axis direction is L2, then the relationship L1 < L2 holds.

[0026] By having the above-described structure, a creepage distance, which is the minimum distance along the surface of the main body portion of the mold divider 1, can be ensured between the first electrode terminal 6 and the second electrode terminal 7a and the third electrode terminal 7b, which are formed separately from each other in the X-axis direction (longitudinal direction) via the main body portion of the mold divider 1. Particularly, in order for the mold divider 1 to exhibit predetermined electrical performance when a high voltage is applied between the electrode terminals, it is important to ensure a sufficient creepage distance between the electrode terminals.

[0027] That is, by providing one third protrusion 5 between the first protrusion 3 and the second protrusion 4 in the mold divider 1, compared with the case of providing a plurality of continuous shallow ribs as in the prior art, after ensuring a wider interval between the protrusions by a deep recess in the vertical direction, a sufficient creepage distance between the electrode terminals can be ensured. As a result, a creepage distance considering the contamination state of the mounting environment of the mold divider 1 can be ensured, and for example, the insulation under the degree of contamination defined in the International Electrotechnical Commission (IEC) 60664-1 can be satisfied.

[0028] Furthermore, by making the thickness L2 of the third protrusion 5 in the X-axis direction larger than the distance L1 from each of the first protrusion 3 and the second protrusion 4, the moldability is improved compared to the conventional example in which multiple continuous ribs are provided, and the mechanical strength of the mold divider 1 in the X-axis direction can be improved. Also, the occurrence of foreign matter getting caught between the protrusions can be suppressed, and even if foreign matter gets caught, it is easy to find it during inspection, etc. Therefore, the mass productivity of the mold divider is improved.

[0029] In addition, in situations where mold dividers come into contact with each other, such as in a parts feeder or bulk packaging, the third protrusion 5 of a mold divider can be prevented from being pinched between the first protrusion 3 and the third protrusion 5 of another mold divider, or between the second protrusion 4 and the third protrusion 5.

[0030] Next, we will explain the housing portion 9 that mold-seals the resistance element 8 and is provided on the lower surface side 2b of the upper surface portion 2 of the mold divider 1. Figure 3 is a cross-sectional view of the mold divider 1 when cut in the Y-axis direction along the line AA' in Figure 1(a).

[0031] As shown in Fig. 3, the width W2 in the Y-axis direction of the storage section 9 provided on the lower surface side 2b of the upper surface section 2 of the mold divider 1 is shorter than the width W1 in the Y-axis direction (short side direction) of the upper surface section 2. As a result, as shown in Fig. 1(c), Fig. 3, etc., in the area from the lower surface side 2b of the upper surface section 2 to the storage section 9, a step equivalent to the thickness in the Z-axis direction of the storage section 9 (D1 in Fig. 3) is formed on both sides of the mold divider 1 in the short side direction.

[0032] In the mold divider 1, as shown in FIG. 3, when the upper surface 8a of the resistor element 8 mold-sealed in the accommodating portion 9 is aligned to a position in contact with the lower surface side 2b of the upper surface portion 2, the thickness D1 of the accommodating portion 9 can be made slightly thicker than the thickness D2 of the resistor element 8, and the width W2 of the accommodating portion 9 can be made slightly larger than the width W3 of the resistor element 8.

[0033] This configuration makes it possible to make as thin as possible the thickness of the insulating molding material that covers the bottom surface 8b in the Z-axis direction and both side surfaces 8c, 8d in the X-axis direction of the resistor element 8 inside the housing portion 9. This allows deeper recesses to be formed around the periphery of the housing portion 9 between the first protrusion 3 and the third protrusion 5 and between the second protrusion 4 and the third protrusion 5, ensuring a longer creepage distance between the electrode terminals.

[0034] Furthermore, by providing the above-mentioned step in the area from the lower surface 2b of the upper surface portion 2 to the storage portion 9, the mechanical strength of the mold divider 1 can be ensured compared to the conventional structure in which ribs provided on both side surfaces and the bottom surface of the component body penetrate those both side surfaces and the bottom surface in the short direction.

[0035] The mold divider 1 having the above configuration improves mold releasability (moldability) compared to conventional methods, prevents foreign matter from getting caught between the protrusions, and facilitates shape inspection using images, etc. at the time of shipping, making it less likely for defective products to be released. Furthermore, because the amount of mold material used is reduced, air entrapment during molding is less likely to occur and the formation of large voids inside the protrusions is suppressed, resulting in improved insulation and voltage resistance characteristics of the mold divider.

[0036] Furthermore, in the recesses formed vertically between the protrusions 3 to 5, the areas located on both side surfaces of the mold divider 1 in the short direction (shaded areas 11a to 11d in FIG. 2(b)) are configured not to penetrate the upper surface portion 2 from the upper surface side 2a to the lower surface side 2b (Z-axis direction), so the area of ​​the upper surface side 2a of the upper surface portion 2 can be made large, preventing the molding material from becoming thin in those areas. Therefore, when the mold divider 1 is mounted on a substrate using a mounter or the like, it becomes easier to suction and hold it with a suction nozzle, and deterioration of the strength of those areas can be prevented.

[0037] The mold divider 1 is configured so that when the area when the top surface portion 2 is viewed in a plane (called the upper region) is compared with the area when the first protrusion portion 3 to the third protrusion portion 5, etc. excluding the top surface portion 2 are viewed in a plane (called the lower region), the area of ​​the upper region is larger than the area of ​​the lower region.

[0038] As a result, the first electrode terminal 6, the second electrode terminal 7a, and the third electrode terminal 7b formed on both longitudinal end faces of the mold divider 1 are located in positions hidden in the upper region as shown in Fig. 1(a) when the mold divider 1 is viewed from above, and do not protrude from both longitudinal end faces of the mold divider 1. This ensures a creepage distance between the electrode terminals via the upper surface portion 2.

[0039] As the mold material for the mold divider 1, for example, a liquid crystal polymer (LCP) which is a thermoplastic resin, a polyamide material, an epoxy resin which is a thermosetting resin, or the like is used.

[0040] When taking into consideration the tracking resistance of resins, thermosetting resins generally have higher tracking resistance than thermoplastic resins, so by using thermosetting resins as the molding material for the mold divider, the creepage distance can be set shorter than when using thermoplastic resins.

[0041] Next, we will explain the electrode terminals of the mold divider 1. The first electrode terminal 6, the second electrode terminal 7a, and the third electrode terminal 7b are made of a highly conductive material such as copper that has good solderability.

[0042] 2(d), recesses are formed in the first electrode terminal 6 at portions thereof near the upper surface 2. Similarly, recesses are formed in the second electrode terminal 7a and the third electrode terminal 7b at portions thereof near the upper surface 2, as shown by dashed circles C1 and C2 in FIG.

[0043] By forming such recesses, a longer creepage distance can be ensured between the first electrode terminal 6 and the second electrode terminal 7a, and between the first electrode terminal 6 and the third electrode terminal 7b along the longitudinal side of the mold divider 1.

[0044] The portions indicated by B1, B2, C1, and C2 correspond to the portions where the electrode terminals (lead frames) are pressed down by the mold die in the mold divider manufacturing process, that is, the boundary portions between the mold member and the lead frames.

[0045] Therefore, by forming a recess in the electrode terminal as described above and configuring the lead frame so that the width of the lead frame differs between the portion covered by the mold and the portion soldered, and by separating the area where the frame width dimension can be finely adjusted for the mold die from the area where the frame width dimension affects board mounting, it becomes easier to manufacture the mold divider and it becomes possible to design a die that does not affect mounting performance.

[0046] The first electrode terminal 6 extends in the X-axis direction along the lower surface side 2b of the upper surface portion 2 on the side connected to the resistive element 8 housed in the housing portion 9, and is drawn out to the outside at the point where it reaches the end face of the first protrusion portion 3 in the X-axis direction.

[0047] For example, as shown in FIG. 2(d), when the height of the position where the first electrode terminal 6 is pulled out (the height from the bottom surface of the mold divider 1 to the lower surface side 2b) is H2 and the height of the mold divider 1 in the Z-axis direction is H1, the first electrode terminal 6 is pulled out to the outside of the first protrusion 3 from a position that satisfies the relationship H2≧(2 / 3)H1, preferably H2≧(3 / 4)H1.

[0048] The second electrode terminal 7 a and the third electrode terminal 7 b are also drawn out to the outside of the second protruding portion 4 from the same drawn-out position as the first electrode terminal 6 .

[0049] By specifying the pull-out position of the electrode terminal as described above, the electrode terminal can alleviate thermal stress when the mold divider 1 is used under high voltage, compared to a configuration in which the electrode terminal is pulled out from approximately the center of the Z-axis direction of the protrusion, for example.

[0050] <Second embodiment> 4(a) to 4(c) show the appearance of a thick film mold divider 10 according to a second embodiment of the present invention. Fig. 4(a) is a perspective view of the mold divider 10 as seen from the bottom side, Fig. 4(b) is a bottom view of the mold divider 10 as seen from below in the Z-axis direction, and Fig. 4(c) is a side view of the mold divider 10 as seen from the Y-direction.

[0051] In the second embodiment and other embodiments, the same components as those of the mold divider 1 according to the first embodiment shown in Fig. 1 etc. are denoted by the same reference numerals, and their description will be omitted. Also, the top view, right end view, and left end view of the mold divider 10 are the same as Figs. 2(a), (d), and (e), respectively, and therefore will not be shown.

[0052] The mold divider 10 according to the second embodiment has a configuration in which two protrusions (third protrusion 5a and fourth protrusion 5b) are provided between the first protrusion 3 and the second protrusion 4. In this embodiment, as shown in Fig. 4(c), the first protrusion 3 and the third protrusion 5a, the second protrusion 4 and the fourth protrusion 5b, and the third protrusion 5a and the fourth protrusion 5b are each spaced apart at an equal interval (L3).

[0053] If the spacing between these protrusions is not equal, the desired creepage distance can be secured while maintaining processability and moldability by setting L3 to 0.5 mm or more, preferably 1 mm or more, in relation to the length of the mold divider 10 in the longitudinal direction (X-axis direction).

[0054] In this way, by arranging the third protrusion 5a and the fourth protrusion 5b between the first protrusion 3 on which the first electrode terminal 6 is formed and the second protrusion 4 on which the second electrode terminal 7a and the third electrode terminal 7b are formed, a longer creepage distance can be ensured between the electrode terminal 6 and the electrode terminals 7a and 7b.

[0055] <Third embodiment> 5(a) to 5(c) show the appearance of a thick film mold divider 20 according to a third embodiment of the present invention. Fig. 5(a) is a perspective view of the mold divider 20 as seen from the bottom side, Fig. 5(b) is a bottom view of the mold divider 20 as seen from below in the Z-axis direction, and Fig. 5(c) is a side view of the mold divider 20 as seen from the Y-direction.

[0056] The top view, right end view, and left end view of the mold divider 20 are the same as FIGS. 2(a), (d), and (e), respectively, and therefore will not be shown.

[0057] The mold divider 20 has a configuration in which two protrusions (third protrusion 5c and fourth protrusion 5d) are provided between the first protrusion 3 and the second protrusion 4, but is characterized in that the recess 12 between the third protrusion 5c and the fourth protrusion 5d is formed to be shallower in depth in the Z-axis direction than the recess between the third protrusion 5a and the fourth protrusion 5b in the mold divider 10 of the second embodiment.

[0058] In this way, by forming recess 12 that is shallow in the Z-axis direction between third protrusion 5c and fourth protrusion 5d, a longer creepage distance can be ensured between electrode terminal 6 and electrode terminals 7a, 7b. In addition, when mounting mold divider 20 on a circuit board, if third and fourth protrusions 5c, 5d are fixed to the circuit board using adhesive, excess adhesive can be contained in recess 12, enabling secure and strong fixation to the board.

[0059] <Fourth embodiment> 6 to 9 are external perspective views of thick film mold dividers according to a fourth embodiment of the present invention. Fig. 6 is an external perspective view of a mold divider 30 according to Example 1 of the fourth embodiment, Fig. 7 is an external perspective view of a mold divider 40 according to Example 2, Fig. 8 is an external perspective view of a mold divider 50 according to Example 3, and Fig. 9 is an external perspective view of a mold divider 60 according to Example 4, all viewed from the bottom side.

[0060] Fig. 6(a) is a perspective view of the mold divider 30 according to Example 1 as seen from the bottom side, Fig. 6(b) is a bottom view of the mold divider 30 as seen from below in the Z-axis direction, and Figs. 6(c) and 6(d) are right and left end views, respectively, of the mold divider 30. The side view of the mold divider 30 is the same as Fig. 2(c), and therefore is not shown.

[0061] The mold divider 30 according to Example 1 shown in Figure 6(a) etc. has a configuration in which the second electrode terminal 7a and the third electrode terminal 7b shown by dashed lines are arranged on two protrusions 4a and 4b, respectively, which are separated by a recess 15 formed along the center line in the X-axis direction.

[0062] That is, in Example 1, due to the presence of recess 15, second electrode terminal 7a is formed corresponding to protrusion 4a, and third electrode terminal 7b is formed corresponding to protrusion 4b. Recess 15 has a depth that extends from lower surface 2b of upper surface 2 to the bottom surfaces of protrusions 4a, 4b, leaving housing portion 9. The deeper recess 15 is, the better the effects described below become, but it may also be set to a depth that extends from lower surface 2b of upper surface 2 to a position partway along the way to the bottom surfaces of protrusions 4a, 4b.

[0063] Fig. 7(a) is a perspective view of the mold divider 40 according to Example 2 as seen from the bottom side, Fig. 7(b) is a bottom view of the mold divider 40 as seen from below in the Z-axis direction, and Figs. 7(c) and 7(d) are right and left end views, respectively, of the mold divider 40. The side view of the mold divider 40 is the same as Fig. 2(c), and therefore is not shown.

[0064] The mold divider 40 according to Example 2 shown in FIG. 7(a) and the like has a configuration in which, similar to Example 1, the second electrode terminal 7a and the third electrode terminal 7b are formed on the protrusions 4a and 4b divided into two by the recess 15, respectively, and further, the first electrode terminal 6 is formed on the two protrusions 3a and 3b divided by the recess 17 formed along the center line in the X-axis direction.

[0065] In the case of Example 2, the first electrode terminal 6 is formed so as to straddle the two protrusions 3a, 3b as shown by the wavy line in Fig. 7. The recess 17 has a depth that extends from the lower surface 2b of the upper surface 2 to the bottom surfaces of the protrusions 3a, 3b, leaving the accommodation portion 9. The deeper the recess 17, the better the effects described below will be, but it may also be set to a depth that extends from the lower surface 2b of the upper surface 2 to a position partway along the way to the bottom surfaces of the protrusions 3a, 3b.

[0066] By dividing the protrusions into two by the recesses 15 and 17 as in Examples 1 and 2, when the mold divider generates heat due to the application of voltage, it is possible to absorb the thermal contraction and thermal expansion of the molding material that constitutes those protrusions. Also, because the amount of molding material required to form the protrusions is reduced, air entrapment during molding is less likely to occur and the formation of large voids inside the protrusions is suppressed, resulting in improved insulation and voltage resistance of the mold divider.

[0067] In addition, the recess 15 formed between the second electrode terminal 7a and the third electrode terminal 7b can prevent electrical short circuits between these electrode terminals. Furthermore, in the case of Example 2, the protrusion on which the first electrode terminal 6 is formed and the protrusion on which the second electrode terminal 7a and the third electrode terminal 7b are formed are both separated via the recess, so that the mold divider as a whole is balanced in the X-axis and Y-axis directions, and a stable mounting state on the circuit board can be maintained.

[0068] On the other hand, from the viewpoint of preventing a short circuit between the second electrode terminal 7a and the third electrode terminal 7b adjacent to each other in parallel, instead of the recess 15 as in the above-mentioned Examples 1 and 2, a shallow groove 18 may be formed between these terminals as in the mold divider 50 according to Example 3 shown in Figure 8(a) etc., or a narrow groove 19 may be formed that extends from the lower surface side 2b of the upper surface portion 2 to the bottom surface portion of the protrusion as in the mold divider 60 according to Example 4 shown in Figure 9(a) etc.

[0069] 8(a) is a perspective view of the mold divider 50 according to Example 3 as seen from the bottom side, Fig. 8(b) is a bottom view of the mold divider 50 as seen from below in the Z-axis direction, and Figs. 8(c) and 8(d) are right and left end views, respectively, of the mold divider 50. The side view of the mold divider 50 is the same as Fig. 2(c), and therefore is not shown.

[0070] Fig. 9(a) is a perspective view of the mold divider 60 according to Example 4 as seen from the bottom side, Fig. 9(b) is a bottom view of the mold divider 60 as seen from below in the Z-axis direction, and Figs. 9(c) and 9(d) are right and left end views, respectively, of the mold divider 60. The side view of the mold divider 60 is the same as Fig. 2(c), and therefore is not shown.

[0071] Since the mold divider incorporates a resistive element 8 in the accommodation section 9, when a voltage is applied and heat is generated, the molded member undergoes repeated thermal contraction and expansion. However, by forming recesses and grooves as shown in Figures 6 to 9 in the protrusions at one or both longitudinal ends of the mold divider, as in the fourth embodiment, it is possible to ensure a larger space to absorb thermal expansion in addition to the space between the protrusions, compared to when recesses and grooves are not formed.

[0072] <Fifth embodiment> Figure 10(a) is an external perspective view of a thick film mold divider 70 relating to Example 1 of the fifth embodiment of the present invention, Figure 10(b) is a plan view of the mold divider 70, Figure 10(c) is a side view, Figure 10(d) is a right end view of the mold divider 70 as viewed from the X-axis direction with the first electrode terminal 6 at the front, and Figure 10(e) is a left end view as viewed with the second and third electrode terminals 7a and 7b at the front.

[0073] 11(a) is a perspective view of the appearance of a thick film mold divider 80 according to Example 2 of the fifth embodiment of the present invention, FIG. 11(b) is a plan view, and FIG. 11(c) is a side view. The right and left end views of the mold divider 80 are the same as FIGS. 2(d) and 2(e), and therefore are not shown.

[0074] The mold divider may deform in such a way that the entire component warps in a bow shape around the center of the upper surface due to repeated thermal contraction and expansion of the molded member. Therefore, the mold divider 70 according to Example 1 shown in Figures 10(a) to 10(e) has a thicker wall thickness t in the Z-axis direction of the upper surface 22 than the upper surface portions of the other embodiments described above. This reinforces the upper surface of the mold divider and simultaneously ensures a longer creepage distance between the electrode terminal 6 and the electrode terminals 7a and 7b. In this case, it is preferable that the width W4 by which the wall thickness t is increased in the Y-axis direction be wider than the widths W5 and W6 at the extended positions of the electrode terminals 6, 7a, and 7b.

[0075] In the mold divider 80 according to the second embodiment shown in Figures 11(a) to (c), shallow recesses 21 and 23 extending in the Y-axis direction (short side direction) are formed on the upper side of the top surface portion 24 near both ends in the X-axis direction.

[0076] As a result, in mold divider 80, in addition to the space formed between first protrusion 3 and third protrusion 5 and the space formed between second protrusion 4 and third protrusion 5, the space formed by recesses 21 and 23 formed in top surface 24 functions as a space that absorbs thermal expansion of mold divider 80. As a result, the directions of deformation due to thermal contraction and thermal expansion differ by 90 degrees between top surface 24 of the mold and the lower part of the mold having accommodation section 9 and first protrusion 3, second protrusion 4, and third protrusion 5, so deformation such as bow warping of the entire mold divider 80 due to heat generation can be suppressed.

[0077] Furthermore, by forming the recesses 21 and 23 in the upper surface portion 24, a longer creepage distance can be ensured on the upper surface of the mold divider 80 between the electrode terminal 6 and the electrode terminals 7a and 7b.

[0078] <Sixth embodiment> In order to ensure the creepage distance between electrode terminals in a thick-film mold divider, it is necessary to form unevenness (undulations) on the outer surface of the molded body, but if the thickness of the mold material varies depending on the area, mechanical strength becomes an issue.

[0079] Taking the mold divider shown in Fig. 2(b) as an example, the recesses between the protrusions 3 to 5 (particularly the shaded areas 11a to 11d) have a thin mold material, so it is expected that these areas will have poor strength. Therefore, it is important to have a structure that balances ensuring creepage distance and component strength.

[0080] Fig. 12(a) is a perspective view of a mold divider 90 according to Example 1 of the thick film mold divider of the sixth embodiment, showing the appearance of the mold divider 90 as seen from the bottom side. Fig. 12(b) is a bottom view, Fig. 12(c) is a side view of the mold divider 90 as seen from the Y direction, and Fig. 12(d) is a cross-sectional view taken along the line EE' in Fig. 12(a) in the Y-axis direction.

[0081] The top view, right end view, and left end view of the mold divider 90 are the same as those in FIGS. 2(a), (d), and (e), respectively, and therefore will not be shown.

[0082] In the mold divider 90 of Example 1, in the recesses between the first protrusion 3 and the third protrusion 5, and between the second protrusion 4 and the third protrusion 5, both end portions in the Y-axis direction of the accommodating portion 29 that accommodates the resistive element 8 (indicated by dashed circles E1 and E2 in the figure) are formed in a stepped shape, as shown in Figure 12(d).

[0083] This makes it possible to balance the securing of creepage distance and the strength of the component in the mold divider 90 according to the first embodiment.

[0084] 13(a) and (b) are perspective views of the mold divider 100 according to Example 2 of the thick film mold divider of the sixth embodiment, as viewed from the bottom side. Fig. 13(a) shows the appearance as viewed from a position where the entire first electrode terminal 6 can be seen, and Fig. 13(b) shows the appearance as viewed from a position where the second electrode terminal 7a and the third electrode terminal 7b can be seen.

[0085] Figure 13(c) is a side view of the mold divider 100 seen from the Y direction, Figure 13(d) is a cross-sectional view of the mold divider when cut in the Y-axis direction along the arrow FF' line in Figures 13(a) and (b), and Figure 13(e) is a cross-sectional view of the mold divider when cut in the Y-axis direction along the arrow GG' line in Figures 13(a) and (b).

[0086] The top view, bottom view, right end view and left end view of the mold divider 100 are the same as FIGS. 2(a), (b), (d) and (e), respectively, and therefore will not be shown.

[0087] In the mold divider 100 according to the second embodiment, a first wall-like portion (indicated by a wavy ellipse J1) is formed at one end in the Y-axis direction of the accommodation portion 39a that accommodates the resistance element 8 in the recess between the second protrusion 4 and the third protrusion 5, as shown in Fig. 13(d). Also, a second wall-like portion (indicated by a wavy ellipse J2) is formed at the other end in the Y-axis direction of the accommodation portion 39b that accommodates the resistance element 8 in the recess between the first protrusion 3 and the third protrusion 5, as shown in Fig. 13(e).

[0088] In other words, when the mold divider 100 is viewed in a plane, these first wall-shaped portions and second wall-shaped portions are arranged at opposite ends (diagonally opposite positions) of the recess that is parallel to the Y-axis direction between the protrusions.

[0089] 13(d) and (e), in the mold divider 100, the height H4 of the first wall-like portion in the Y-axis direction and the height H4 of the second wall-like portion in the Y-axis direction are formed higher than the height H3 of the accommodation portions 39a and 39b in the Y-axis direction, but if the first wall-like portion and the second wall-like portion are formed higher, it becomes difficult to ensure the creepage distance. For this reason, one wall-like portion is formed on one side surface of the mold divider 100 and one wall-like portion is formed on the other side surface.

[0090] With the first wall portion and second wall portion arranged as described above, the mold divider 100 can also achieve a balance between ensuring the creepage distance and the strength of the component.

[0091] Fig. 14(a) is a perspective view of a mold divider 110 according to Example 3 of the thick film mold divider of the sixth embodiment, showing the appearance of the mold divider 110 as seen from the bottom side. Fig. 14(b) is a bottom view, Fig. 14(c) is a side view of the mold divider 110 as seen from the Y direction, and Fig. 14(d) is a cross-sectional view of the mold divider 110 cut in the Y-axis direction along the line KK' of Fig. 14(a).

[0092] The top view, right end view, and left end view of the mold divider 110 are the same as those in FIGS. 2(a), (d), and (e), respectively, and therefore will not be shown.

[0093] As shown in Figures 14(a) and (c), in the mold divider 110 of Example 3, inclined portions M1 and M2 are formed at both ends in the Y-axis direction of the accommodating portions 49a and 49b that accommodate the resistive element 8 in the recess between the first protrusion 3 and the third protrusion 5, and in the recess between the second protrusion 4 and the third protrusion 5.

[0094] Even in the mold divider 110 having such inclined portions M1 and M2, it is possible to achieve a balance between ensuring the creepage distance and the strength of the component.

[0095] The above-described embodiments are provided to facilitate understanding of the present invention, but are not intended to limit the present invention, and may be modified as appropriate within the scope of the present invention. Furthermore, the components of the present invention may be selected arbitrarily, and the present invention also includes inventions having selected configurations. [Explanation of symbols]

[0096] 1,10,20,30,40,50,60,70,80,90,100,110 Thick film mold divider 2,22,24 Top part 2a Upper side of the upper surface 2b Underside of the upper surface 3 First protrusion 4 Second protrusion 5,5c Third protrusion 5d Fourth protrusion 6 First electrode terminal 7a Second electrode terminal 7b Third electrode terminal 8 Resistive elements 9,29,39a,39b,49a,49b storage section 12,15,17,21,23 recesses 18,19 groove M1, M2 inclined section

Claims

1. An upper surface portion made of a rectangular, plate-shaped exterior material in a plan view; a housing portion disposed at approximately the center of the lower surface side of the upper surface portion and made of an exterior material in which the resistance element is embedded; a first protrusion made of an exterior material, which is erected on one longitudinal end of a lower surface of the upper surface portion, has a predetermined height in the vertical direction from the lower surface side, and on which a first electrode terminal is disposed; a second protrusion made of an exterior material, which is erected on the other longitudinal end of the lower surface of the upper surface portion, has a predetermined height in the vertical direction from the lower surface side, and on which a second electrode terminal is disposed; a third protrusion made of an exterior material, which is erected on the lower surface side of the upper surface portion at a position sandwiched between the first protrusion and the second protrusion and spaced a predetermined distance from each other, and which has a predetermined height in the vertical direction from the lower surface side; Equipped with An electronic component characterized in that the first protrusion, the second protrusion, and the third protrusion are each formed so as to have a constant width in the longitudinal direction and extend from one side surface to the other side surface in the short direction of the undersurface.

2. 2. The electronic component according to claim 1, wherein the width of the third protrusion in the longitudinal direction is greater than the distance between the first protrusion and the third protrusion and the distance between the second protrusion and the third protrusion.

3. 2. The electronic component according to claim 1, wherein the height of the third protrusion in the vertical direction is greater than the heights of the first protrusion and the second protrusion in the vertical direction.

4. 4. An electronic component according to claim 1, wherein the vertical depth of the region adjacent to the accommodating portion on both end faces of the lower surface in the short direction between the first protrusion and the third protrusion, and between the second protrusion and the third protrusion, is deeper than the vertical depth of the accommodating portion.

5. 5. The electronic component according to claim 4, wherein the region does not penetrate vertically from the upper surface side to the lower surface side of the upper surface portion but remains.

6. 2. The electronic component according to claim 1, wherein the top surface portion has an area such that the first electrode terminal and the second electrode terminal are hidden by the top surface portion in a plan view.

7. 2. The electronic component according to claim 1, wherein the first electrode terminal and the second electrode terminal are extended to the outside through the exterior material from positions that are three-quarters or more of the height of the first protrusion and the second protrusion, respectively, in the vertical direction.

8. 8. The electronic component according to claim 7, wherein the first electrode terminal and the second electrode terminal each have predetermined regions on both sides in the short-side direction of the drawn-out portion that are narrower than other regions.

9. 9. The electronic component according to claim 1, wherein the number of the third protrusions is one.

10. 9. The electronic component according to claim 1, wherein the number of the third protrusions is two or more.

11. 11. The electronic component according to claim 1, wherein the exterior material is made of an insulating resin molded material.

12. The electronic component according to any one of claims 1 to 11, wherein the electronic component is a thick film mold divider for high voltage having the first electrode terminal, the second electrode terminal, and a third electrode terminal disposed on the second protrusion.

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